Conveying device, conveying system and end effector

Abstract

The present invention provides a transport device, a transport system, and an end effector, which aims to reduce the overall space of a system including the transport device, the transport device being a transport device for simultaneously or separately transporting a wafer and a consumable having a circular outer shape, the consumable being capable of being disposed in a wafer processing module, the outer diameter of the consumable being larger than the outer diameter of the wafer, the end effector being configured to simultaneously or separately place the wafer and the consumable, the robot arm being configured to move the end effector, and the control device being configured to control the robot arm so that, in the case of transporting the consumable, the consumable is placed on the end effector in such a manner that the center of gravity of the consumable coincides with a first position, and, in the case of transporting the wafer, the wafer is placed on the end effector in such a manner that the center of gravity of the wafer coincides with a second position between the first position and the front end of the end effector.

Description

Technical Field

[0001] This invention relates to various aspects and embodiments of the invention, specifically to a conveying device, conveying system, and end effector. Background Technology

[0002] For example, Patent Document 1 discloses a transport device that transports not only wafers but also consumables within the processing apparatus. This allows for the exchange of consumables without opening the chamber atmosphere of the processing apparatus, thus shortening the downtime of the processing apparatus operating at low pressure.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-96149 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] The present invention provides a transport device, a transport system, and an end effector that can reduce the overall space required for the system, including the transport device.

[0008] Methods for solving problems

[0009] One aspect of the present invention is a transport apparatus for simultaneously or separately transporting a wafer and a consumable having a circular shape, comprising an end effector, a robotic arm, and a control device. The consumable can be disposed within a wafer processing module, and the outer diameter of the consumable is larger than the outer diameter of the wafer. The end effector is configured to simultaneously or separately load the wafer and the consumable. The robotic arm is configured to move the end effector. When transporting the consumable, the control device controls the robotic arm such that the consumable is loaded onto the end effector with its center of gravity aligned with a first position. Furthermore, when transporting the wafer, the control device controls the robotic arm such that the wafer is loaded onto the end effector with its center of gravity aligned with a second position between the first position and the front end of the end effector.

[0010] The effects of the invention

[0011] According to various aspects and embodiments of the present invention, it is possible to reduce the overall space required for the system, including the transport device. Attached Figure Description

[0012] Figure 1 This is a top view showing an example of a processing system in one implementation.

[0013] Figure 2This is a schematic cross-sectional view representing an example of a processing module.

[0014] Figure 3 This is a diagram representing an example of a graying module.

[0015] Figure 4 This is a top view showing an example of the end effector in the first embodiment.

[0016] Figure 5 This is a side view showing an example of the end effector in the first embodiment.

[0017] Figure 6 This is a plan view illustrating an example of the positional relationship between the wafer and the edge ring when the end effector is placed within a vacuum transport module.

[0018] Figure 7 This is a top view showing an example of an end effector during wafer transport in the first embodiment.

[0019] Figure 8 This is a side view showing an example of an end effector during wafer transport in the first embodiment.

[0020] Figure 9 This is a diagram illustrating an example of the positional relationship between the end effector and the ashing module when the wafer is transported into the ashing module in a comparative example.

[0021] Figure 10 This is a diagram illustrating an example of the positional relationship between the end effector and the ashing module when the wafer is transported into the ashing module in this embodiment.

[0022] Figure 11 This is a top view showing an example of an end effector during the transport of the edge ring in the first embodiment.

[0023] Figure 12 This is a side view showing an example of an end effector during the transport of the edge ring in the first embodiment.

[0024] Figure 13 This is a flowchart illustrating an example of the transportation method in the first embodiment.

[0025] Figure 14 This is a plan view illustrating an example of the positional relationship between the wafer and the edge ring when the end effector is mounted within the atmospheric transport module.

[0026] Figure 15 This is a side view showing another example of the end effector in the second embodiment.

[0027] Figure 16This is a side view illustrating an example of an end effector in the second embodiment, where both the wafer and the edge ring are being transported simultaneously.

[0028] Figure 17 This is a plan view illustrating an example of the positional relationship between the wafer and the edge ring in the second embodiment, where the wafer and the edge ring are transported simultaneously. Detailed Implementation

[0029] Hereinafter, embodiments of the transport device, transport system, and end effector will be described in detail based on the accompanying drawings. However, the disclosed transport device, transport system, and end effector are not limited to the embodiments described below.

[0030] Incidentally, when transporting wafers and consumables, the wafers and consumables are placed on the end effector at a predetermined position where their center of gravity is located at the front end of the robotic arm. When the consumable is a ring-shaped component larger than the wafer, such as a side ring, if the consumable is placed close to the front end of the end effector, it may fall off as the end effector moves. Therefore, the consumable needs to be placed away from the front end of the end effector. Thus, the consumable is placed on the end effector with its center of gravity positioned away from the front end of the end effector.

[0031] On the other hand, when transporting wafers smaller than consumables, if the wafer is mounted on the end effector in such a way that the center of gravity of the consumable is at the same position as the center of gravity of the wafer during transport, the tip of the end effector will protrude from the area below the wafer. If the portion of the end effector protruding from the area below the wafer is large, the end effector will become an obstacle when transporting the wafer into a device that cannot guarantee space to accommodate the consumable, making it difficult to transport the wafer to a predetermined position within the device.

[0032] To ensure that the end effector can move the wafer to a predetermined location within the device without obstruction, it is also considered to expand the space within the device where space for consumables cannot be guaranteed. However, in this case, the space required for such a device increases, and the overall space required for the system increases.

[0033] Therefore, the present invention provides a technique that can reduce the overall space required for a system, including the transport device.

[0034] (First Implementation)

[0035] [Structure of Processing System 1]

[0036] Figure 1 This is a top view illustrating an example of the structure of a processing system 1 according to one embodiment. Figure 1 In the diagram, for ease of explanation, a portion of the internal structural elements of the device are shown in perspective. The processing system 1 includes a main body 10 and a control device 100 of the main body 10.

[0037] The main body 10 of the device includes a vacuum conveying module 11, multiple processing modules 12, multiple ashing modules 13, multiple load locking modules 14, and an atmospheric conveying module 15. Multiple processing modules 12 are connected to the side wall of the vacuum conveying module 11 via gate valves G1. The processing module 12 is an example of a processing device. Additionally, in... Figure 1 In this example, eight processing modules 12 are connected to the vacuum transport module 11. The number of processing modules 12 connected to the vacuum transport module 11 can be seven or fewer, or nine or more. Each processing module 12 is an example of a first wafer processing module.

[0038] Each processing module 12 performs etching and film deposition processes on the wafer W, which is the object of processing. Figure 2 This is a schematic cross-sectional view showing an example of the processing module 12. The processing module 12 includes a chamber 120, an RF (Radio Frequency) power supply unit 123, a gas supply unit 124, and an exhaust system 125.

[0039] An opening is formed in the side wall of chamber 120, which is opened and closed by gate valve G1. Chamber 120 has a support portion 121 and an upper spray head assembly portion 122. The support portion 121 is disposed in the lower region of the processing space 120S within chamber 120. The upper spray head assembly portion 122 is disposed above the support portion 121 and functions as part of the top plate of chamber 120.

[0040] The support portion 121 is configured to support the wafer W in the processing space 120S. In this embodiment, the support portion 121 includes a side ring ER, an electrostatic chuck 121a, and a lower electrode 121b. The electrostatic chuck 121a is disposed on the lower electrode 121b and is configured to support the wafer W on its upper surface. In this embodiment, the electrostatic chuck 121a is circular in shape. The electrostatic chuck 121a is an example of a consumable. The side ring ER is formed in a ring shape and is disposed on the upper surface of the peripheral portion of the lower electrode 121b. The side ring ER is configured to surround the electrostatic chuck 121a and the wafer W on the upper surface of the peripheral portion of the lower electrode 121b. In this embodiment, the side ring ER is circular in shape. The side ring ER is an example of a consumable and is an example of a ring-shaped component.

[0041] The upper spray head assembly 122 is configured to supply one or more types of gas from the gas supply unit 124 into the processing space 120S. A cover member 122d is detachably provided on the lower surface of the upper spray head assembly 122. In this embodiment, the cover member 122d is circular in shape. The cover member 122d is an example of a consumable. In this embodiment, the upper spray head assembly 122 has a gas inlet 122a and a gas diffusion chamber 122b. A plurality of gas outlets 122c are formed in the upper spray head assembly 122, and the gas diffusion chamber 122b is in fluid communication with the processing space 120S via the plurality of gas outlets 122c. In this embodiment, the upper spray head assembly 122 is configured to supply one or more types of gas into the processing space 120S from the gas inlet 122a via the gas diffusion chamber 122b and the plurality of gas outlets 122c.

[0042] The gas supply unit 124 includes a gas source 124a and a flow controller 124b. The gas source 124a is a supply source for processing gases such as etching gas or film-forming gas. The flow controller 124b can include, for example, a mass flow controller or a pressure-controlled flow controller. In addition, the gas supply unit 124 may also include one or more flow modulation devices that modulate or pulse the flow rate of one or more processing gases.

[0043] The RF power supply unit 123 is configured to supply one or more RF powers to the lower electrode 121b, the upper spray head assembly 122, or both the lower electrode 121b and the upper spray head assembly 122. In this embodiment, the RF power supply unit 123 includes two RF generation units 123a and 123b, and two matching units 123c and 123d. In this embodiment, the RF power supply unit 123 is configured to supply first RF power from the RF generation unit 123a to the lower electrode 121b via the matching unit 123c. The RF spectrum includes a portion of the electromagnetic spectrum in the range of 3 Hz to 3000 GHz. For electronic material processes such as semiconductor processes, the frequency of the RF spectrum used for plasma generation is preferably in the range of 100 kHz to 3 GHz, more preferably in the range of 200 kHz to 150 MHz. For example, the frequency of the first RF power is in the range of 27 MHz to 100 MHz.

[0044] Furthermore, in this embodiment, the RF power supply unit 123 is configured to supply second RF power from the RF generation unit 123b to the lower electrode 121b via the matching unit 123d. For example, the frequency of the second RF power may be in the range of 400 kHz to 13.56 MHz. Alternatively, the RF power supply unit 123 may replace the RF generation unit 123b and have a DC (Direct Current) pulse generation unit.

[0045] Furthermore, although the illustrations are omitted, other embodiments are considered here. For example, in the alternative embodiment, the RF power supply unit 123 may be configured such that the RF generating unit supplies first RF power to the lower electrode 121b, and other RF generating units supply second RF power to the lower electrode 121b. Furthermore, it may be configured such that other RF generating units supply third RF power to the upper spray head assembly 122. Moreover, in other alternative embodiments, a DC voltage may be applied to the upper spray head assembly 122. Furthermore, in various embodiments, the amplitude of one or more RF powers (i.e., first RF power, second RF power, etc.) may be pulsed or modulated. Amplitude modulation may also include pulsed amplitude modulation of the RF power between an on / off state or between multiple different on / off states. Furthermore, the phase matching of the RF powers can be controlled; the phase matching of the amplitude modulation of multiple RF powers can be synchronized or asynchronous.

[0046] The exhaust system 125 is connected, for example, to an exhaust port 120e located at the bottom of the chamber 120. The exhaust system 125 may also include a vacuum pump such as a pressure valve, a turbomolecular pump, a roughing pump, or a combination thereof.

[0047] return Figure 1 Continuing the explanation, multiple ashing modules 13 are connected to other sidewalls of the vacuum transport module 11 via gate valves G2. Each ashing module 13 is an example of a second wafer processing module. The ashing module 13 removes the mask remaining on the wafer W after processing by the processing module 12 by ashing. Within the ashing module 13, for example... Figure 3 As shown, a mounting stage 130 for mounting wafer W is provided. The center of gravity of the mounting stage 130 is position P0. When wafer W is transported into the graying module 13, wafer W is mounted on the mounting stage 130 such that the center of gravity of wafer W is positioned at position P0 of the mounting stage 130. Furthermore, in Figure 1 In the example, the vacuum transport module 11 is connected to two ashing modules 13, and the number of ashing modules 13 connected to the vacuum transport module 11 can be one or more.

[0048] On the other sidewalls of the vacuum transport module 11, multiple load locking modules 14 are connected via gate valves G3. Figure 1 In this example, two load locking modules 14 are connected to the vacuum transport module 11, and the number of load locking modules 14 connected to the vacuum transport module 11 can be one or more. Furthermore, at least one of the two load locking modules 14 can accommodate the wafer W and the edge ring ER.

[0049] A transport robot 20a is configured within the vacuum transport module 11. The transport robot 20a has an end effector 21a and a robotic arm 22a. The end effector 21a holds a wafer W and an edge ring ER. The robotic arm 22a moves the end effector 21a. The transport robot 20a moves within the vacuum transport module 11 along a guide rail 110 disposed within the vacuum transport module 11, transporting the wafer W between the processing module 12, the ashing module 13, and the load locking module 14. Alternatively, the transport robot 20a may be fixed in a predetermined position within the vacuum transport module 11 without moving within it. The transport robot 20a is an example of a transport device and a vacuum transport robot. The vacuum transport module 11 maintains a pressure atmosphere below atmospheric pressure.

[0050] A vacuum transport module 11 is connected to one side wall of each load locking module 14 via a gate valve G3, and an atmospheric transport module 15 is connected to the other side wall via a gate valve G4. When a wafer W is transported from the atmospheric transport module 15 into the load locking module 14 via the gate valve G4, the gate valve G4 closes, and the pressure inside the load locking module 14 drops from atmospheric pressure to a predetermined pressure. Then, the gate valve G3 opens, and the wafer W inside the load locking module 14 is transported out by the transport robot 20a into the vacuum transport module 11.

[0051] Furthermore, when the pressure inside the load locking module 14 is below atmospheric pressure, the transport robot 20a transports the wafer W from the vacuum transport module 11 into the load locking module 14 via gate valve G3, and then gate valve G3 closes. Then, the pressure inside the load locking module 14 rises to atmospheric pressure. Then, gate valve G4 opens, and the wafer W inside the load locking module 14 is transported out into the atmospheric transport module 15. The same process applies to the transport of the edge ring ER.

[0052] On the side wall of the atmospheric transport module 15 opposite to the side wall of the module 15 where the gate valve G4 is located, a plurality of loading ports 16 are provided. A container such as a FOUP (Front Opening Unified Pod) capable of accommodating multiple wafers W is connected to each loading port 16. Additionally, an alignment module for changing the orientation of the wafers W may also be provided in the atmospheric transport module 15. Furthermore, a container capable of accommodating the edge ring ER is connected to any one of the plurality of loading ports 16.

[0053] Within the atmospheric transport module 15, a transport robot 20b is installed. The transport robot 20b has an end effector 21b and a robotic arm 22b. The transport robot 20b is an example of an atmospheric transport robot, and the end effector 21b is an example of an additional end effector. The pressure within the atmospheric transport module 15 is atmospheric pressure. The transport robot 20b moves along guide rail 150 within the atmospheric transport module 15, transporting wafers W and edge rings ER between the load locking module 14 and the container connected to the loading port 16. Alternatively, the transport robot 20b may be fixed in a predetermined position within the atmospheric transport module 15 and not move within the atmospheric transport module 15. At the upper part of the atmospheric transport module 15, an FFU (Functional Filter Unit) or similar device is installed, supplying air after particle removal into the atmospheric transport module 15 from above, forming a downward flow within the atmospheric transport module 15. Furthermore, in this embodiment, the atmosphere inside the atmosphere transport module 15 is at atmospheric pressure. Alternatively, the pressure inside the atmosphere transport module 15 can also be controlled as positive pressure. This helps to suppress the intrusion of particles and other contaminants from the outside into the atmosphere transport module 15.

[0054] The control device 100 includes a memory, a processor, and an input / output interface. The memory stores data and programs, such as technical processing schemes. Examples of memory types include RAM (Random Access Memory), ROM (Read-Only Memory), HDD (Hard Disk Drive), and SSD (Solid State Drive). The processor executes programs read from the memory and, based on the data such as technical processing schemes stored in the memory, controls various parts of the main unit 10 via the input / output interface. The processor may be a CPU (Central Processing Unit) or a DSP (Digital Signal Processor).

[0055] [Details of the end effector 21a]

[0056] Figure 4 This is a plan view showing an example of the end effector 21a in the first embodiment. Figure 4 The example shown is an end effector 21a of a transport robot 20a, and an end effector 21b of a transport robot 20b has the same structure. The end effector 21a includes a main body 210 having an upper surface, a plurality of first holding portions 211a-211c disposed on the upper surface of the main body 210, and a plurality of second holding portions 212a-212c disposed on the upper surface of the main body 210. The first holding portions 211a-211c are formed, for example, of elastic materials such as rubber, and hold the edge ring ER. The second holding portions 212a-212c are formed, for example, of elastic materials such as rubber, and hold the wafer W. The plurality of first holding portions 211a-211c are examples of consumable support pads. The plurality of second holding portions 212a-212c are examples of wafer support pads.

[0057] The main body 210 has regions R1, R2, and R3. Regions R1 and R2 are derived from... Figure 4 The directions D shown are mutually repetitive. First holding portions 211a and 212a are disposed in region R1, first holding portions 211b and 212b are disposed in region R2, and first holding portions 211c and 212c are disposed in region R3. Region R1 is an example of a first front-end region, region R2 is an example of a second front-end region, and region R3 is an example of a rear-end region. Distance d is an example of a first direction. First holding portion 211a is an example of a first consumable support pad, first holding portion 211b is an example of a second consumable support pad, and first holding portion 211c is an example of a third consumable support pad. Furthermore, second holding portion 212a is an example of a first wafer support pad, second holding portion 212b is an example of a second wafer support pad, and second holding portion 212c is an example of a third wafer support pad.

[0058] In addition, the first holding part 211a-211c and the second holding part 212a-212c of the transport robot 20b installed in the atmospheric transport module 15 can also be vacuum pads that are held by adsorption of air by the components.

[0059] Figure 5 This is a side view showing an example of the end effector 21a in the first embodiment. Figure 5The example shown is of an end effector 21a on a transport robot 20a, and the end effector 21b on a transport robot 20b may also have the same structure. The height of the first holding portions 211a to 211c from the upper surface of the main body 210 is h2, and the height of the second holding portions 212a to 212c from the upper surface of the main body 210 is h1. In this embodiment, h1 is higher than h2. h1 is an example of a first height, and h2 is an example of a second height.

[0060] In the case of transporting the edge ring ER, reaction byproducts (so-called deposits) sometimes adhere to the transported edge ring ER. Therefore, in the case of transporting the edge ring ER with deposits, there is a possibility that the deposits adhering to the edge ring ER become particles and fall onto the first holding parts 211a to 211c and the end effector 21a, etc.

[0061] When the wafer W is held in the first holding portions 211a-211c with particles attached thereto, there is a possibility that the wafer W may be contaminated by particles that fall into the first holding portion 211. In contrast, in this embodiment, the wafer W is not held in the first holding portions 211a-211c of the holding edge ring ER, thus suppressing contamination of the wafer W.

[0062] Furthermore, when the height h1 of the second holding portions 212a-212c is equal to or lower than the height h2 of the first holding portions 211a-211c, there is a possibility that particles that have fallen from the edge ring ER onto the first holding portions 211a-211c and the end effector 21a may re-attach to the wafer W during transport. In contrast, in this embodiment, the height h1 of the second holding portions 212a-212c holding the wafer W is higher than the height h2 of the first holding portions 211a-211c holding the edge ring ER, thus preventing particles on the first holding portions 211a-211c and the end effector 21a from re-attaching to the wafer W.

[0063] Figure 6 This is a top view showing a first example of the positional relationship between the wafer W and the edge ring ER when the end effector 21a is placed within the vacuum transport module 11. When the edge ring ER is placed on the end effector 21a, the position of the edge ring ER's shape, for example, becomes... Figure 6 Like circle C1. The center of gravity of circle C1 is position P1. That is, when the edge ring ER is mounted on the end effector 21a, the edge ring ER is mounted on the end effector 21a in such a way that the center of gravity of the edge ring ER is position P1. Position P1 is an example of a first position.

[0064] When the wafer W is mounted on the end effector 21a, the position of the wafer W's shape, for example, becomes Figure 6Like circle C2. The center of gravity of circle C2 is position P2. That is, when the wafer W is mounted on the end effector 21a, the wafer W is mounted on the end effector 21a in such a way that the center of gravity of the wafer W is position P2. Position P2 is an example of a second position. Furthermore, as Figure 6 As illustrated, a portion of the wafer W protrudes from the front end of the end effector 21a by the same amount as a portion of the side ring ER protrudes from the front end of the end effector 21a.

[0065] In this embodiment, the distance d1 from the front end of the end effector 21a to position P1 is longer than the distance d2 from the front end of the end effector 21a to position P2. That is, when transporting the edge ring ER, the edge ring ER is mounted on the end effector 21a in such a way that the center of gravity of the edge ring ER is aligned with position P1. Furthermore, in the case of the wafer W, the wafer W is mounted on the end effector 21a in such a way that the center of gravity of the wafer W is aligned with position P2 between position P1 and the front end of the end effector 21a.

[0066] Furthermore, in the case of transporting chip W, chip W is, for example, as Figure 7 and Figure 8 It is mounted on the end effector 21a as shown. Figure 7 This is a top view showing an example of the end effector 21a during wafer W transport in the first embodiment. Figure 8 This is a side view showing an example of the end effector 21a during wafer W transport in the first embodiment. For example, as shown below... Figure 7 As shown, the width of the end effector 21a is smaller than the outer shape of the wafer W. Furthermore, when transporting the wafer W, the wafer W is mounted on the end effector 21a such that the end of the wafer W in the width direction is located outside the region of the end effector 21a. Figure 7 In the example, the wafer W is mounted on the end effector 21a such that the end of the wafer W protrudes from the region of the end effector 21a by an amount corresponding to the distance d3 in the width direction of the end effector 21a.

[0067] Furthermore, when transporting the wafer W, the wafer W is placed on the end effector 21a such that its end portion, in a direction intersecting the width direction of the end effector 21a, is located outside the region of the end effector 21a. That is, the wafer W is placed on the end effector 21a such that a portion of the wafer W protrudes from the front end of the end effector 21a. Figure 7 In the example, in the direction intersecting the width direction of the end effector 21a (e.g.) Figure 7 In the vertical direction, the wafer W is placed on the end effector 21a with the end of the wafer W being a distance d4 from the front end of the end effector 21a.

[0068] Here, as a comparative example, we consider the case where the wafer W is placed on the end effector 21a in a manner where the center of gravity of the wafer W coincides with position P1, which is the same as the position of the center of gravity of the edge ring ER when it is placed on the end effector 21a. In this case, for example, as... Figure 9 As shown, the tip 210e of the end effector 21a collides with the side wall of the ashing module 13, making it difficult to transport the wafer W into the ashing module 13 in a manner that aligns the center of gravity of the wafer W with the center position P0 of the stage 130. Besides the ashing module 13, in containers such as the load locking module 14 that only hold the wafer W, the tip 210e of the end effector 21a also becomes an obstacle, making it difficult to transport the wafer W to a predetermined position within the container. Furthermore, when using the end effector 21b of the transport robot 20b to transport the wafer W into the FOUP, the tip 210e of the end effector 21b also becomes an obstacle, making it difficult to transport the wafer W to a predetermined position within the FOUP.

[0069] In contrast, in this embodiment, the wafer W is placed on the end effector 21a such that, compared to position P1, which is the position of the center of gravity of the edge ring ER when it is being transported, the position of the center of gravity of the wafer W is position P2 between position P1 and the front end of the end effector 21a. Thus, for example, as... Figure 10 As shown, the wafer W can be transported into the ashing module 13 in a manner that aligns the center of gravity of the wafer W with the position P0, which serves as the center of gravity of the stage 130. Furthermore, in addition to the ashing module 13, the wafer W can also be transported to a predetermined position within containers such as the load locking module 14 and the FOUP, which only contain the wafer W. Moreover, in this embodiment, when the wafer W is transported into the FOUP using the end effector 21b of the transport robot 20b, it is also possible to transport the wafer W to a predetermined position within the FOUP.

[0070] Additionally, in the case of transporting the edge loop ER, the edge loop ER is, for example, Figure 11 and Figure 12 It is mounted on the end effector 21a as shown. Figure 11 This is a top view showing an example of the end effector 21a in the first embodiment when transporting the edge ring ER. Figure 12 This is a side view showing an example of the end effector 21a during the transport of the edge ring ER in the first embodiment. For example, in Figure 11 and Figure 12 In the example, the transport robot 20a has an end effector 21a, and the transport robot 20b has an end effector 21b, which is the same. For example, Figure 11 and Figure 12As shown, with the edge ring ER mounted on the end effector 21a, a portion of the edge ring ER protrudes from the front end of the end effector 21a. In this embodiment, since the edge ring ER is a ring-shaped component, it is difficult to mount it on the front end of the processing module 12. Therefore, in this embodiment, the edge ring ER is mounted on the end effector 21a at a position P1 further from the front end of the end effector 21a than at a position P2, which is the position of the center of gravity of the wafer W when transporting the wafer W. As a result, the end effector 21a can stably transport the edge ring ER.

[0071] [Shipping Method]

[0072] Figure 13 This is a flowchart illustrating an example of the transportation method in the first embodiment. Figure 13 The processing illustrated in the flowchart is achieved by, for example, controlling various parts of the main body 10 through the control device 100.

[0073] First, the control device 100 determines whether to transport the edge ring ER (S10). If the edge ring ER is to be transported (S10: Yes), the control device 100 places the edge ring ER on the end effector 21a in a manner that aligns the center of gravity of the edge ring ER with position P1 (S11). For example, the control device 100 controls the robotic arm 22a of the transport robot 20a in a manner that aligns the center of gravity of the edge ring ER with position P1 and places the edge ring ER on the end effector 21a. Step S11 is an example of process a). Then, the control device 100 performs the processing shown in step S14.

[0074] On the other hand, if the edge ring ER is not being transported (S10: No), the control device 100 determines whether to transport the wafer W (S12). If the wafer W is not being transported (S12: No), the control device 100 executes the process shown in step S14.

[0075] On the other hand, when transporting the wafer W (S12: Yes), the control device 100 places the wafer W on the end effector 21a in a manner that aligns the center of gravity of the wafer W with position P2 (S13). For example, the control device 100 controls the robotic arm 22a of the transport robot 20a so that the wafer W is placed on the end effector 21a with its center of gravity aligned with position P2. Step S13 is an example of process b).

[0076] Furthermore, the control device 100 determines whether the processing of a predetermined number of wafers W has been completed (S14). If the processing of a predetermined number of wafers W has not been completed (S14: No), the processing shown in step S10 is executed again. On the other hand, if the processing of a predetermined number of wafers W has been completed (S14: Yes), the transport method shown in this flowchart ends.

[0077] Furthermore, the above embodiments mainly describe the case where the wafer W and the edge ring ER are mounted in the end effector 21a, but the technology of the present invention is not limited to this, and the wafer W and the edge ring ER are also mounted in the end effector 21b. Figure 14 This is a plan view illustrating an example of the positional relationship between the wafer W and the edge ring ER when the end effector 21b is mounted within the atmospheric transport module 15. When the edge ring ER is mounted on the end effector 21b, the position of the edge ring ER's shape is, for example, as shown below. Figure 14 As shown in circle C3. The center of gravity of circle C3 is position P3. That is, when the edge ring ER is mounted on the end effector 21b, the edge ring ER is mounted on the end effector 21b with the center of gravity of the edge ring ER at position P3. Position P3 is an example of a third position.

[0078] When the wafer W is mounted on the end effector 21b, the position of the wafer W's shape is, for example, as shown in the figure. Figure 14 As shown in circle C4. The center of gravity of circle C4 is position P4. That is, when the wafer W is mounted on the end effector 21b, the wafer W is mounted on the end effector 21b with the center of gravity of the wafer W at position P4. Position P4 is an example of a fourth position.

[0079] Furthermore, the distance d5 from the front end of the end effector 21b to position P3 is longer than the distance d6 from the front end of the end effector 21b to position P4. That is, when transporting the edge ring ER, the edge ring ER is mounted on the end effector 21b in such a way that the center of gravity of the edge ring ER is aligned with position P3. Furthermore, when transporting the wafer W, the wafer W is mounted on the end effector 21b in such a way that the center of gravity of the wafer W is aligned with position P4 between position P3 and the front end of the end effector 21b.

[0080] The above describes the implementation method. As described above, the transport robot 20 in this embodiment transports a wafer W and a side ring ER, which is an example of a consumable with a circular shape. The transport robot 20 includes an end effector 21, a robotic arm 22, and a control device 100. The side ring ER can be configured within the processing module 12, and the outer diameter of the side ring ER is larger than the outer diameter of the wafer W. The end effector 21 is configured to hold the wafer W and the side ring ER. The robotic arm 22 is configured to move the end effector 21. When transporting the side ring ER, the control device 100 controls the robotic arm 22 so that the side ring ER is placed on the end effector 21 with its center of gravity aligned with position P1. Furthermore, when transporting the wafer W, the control device 100 controls the robotic arm 22 so that the wafer W is placed on the end effector 21 with its center of gravity aligned with position P1 and position P2 between the front end of the end effector 21. Therefore, the wafer W can be transported into the ashing module 13, which does not have space to accommodate the edge ring ER, and the ashing module 13 can be miniaturized. As a result, the overall space of the processing system 1 can be reduced.

[0081] Furthermore, in the above-described embodiment, the width of the end effector 21 is smaller than the external dimensions of the wafer W. Additionally, when transporting the wafer W, the wafer W is mounted on the end effector 21 in such a way that a portion of the wafer W protrudes from the front end of the end effector 21. Therefore, the end effector 21 can transport the wafer W into the ashing module 13, etc., which does not have space to accommodate the edge ring ER.

[0082] Furthermore, in the above-described embodiment, when transporting the edge ring ER, the edge ring ER is mounted on the end effector 21 in such a way that a portion of the edge ring ER protrudes from the front end of the end effector 21. This reduces the depth of the processing module 12 that carries the edge ring ER.

[0083] Furthermore, in the above-described embodiment, the portion of the wafer W protruding from the front end of the end effector 21 by the same amount as the portion of the edge ring ER protruding from the front end of the end effector 21.

[0084] Furthermore, in the above-described embodiment, the edge ring ER, as an example of a consumable, is a ring-shaped component. The end effector 21 includes a main body 210 having an upper surface, and a plurality of first holding portions 211a-211c and second holding portions 212a-212c disposed on the upper surface of the main body 210. The height h1 of the second holding portions 212a-212c from the upper surface of the main body 210 is higher than the height h2 of the first holding portions 211a-211c from the upper surface of the main body 210. This prevents particles adhering to the first holding portions 211a-211c and the end effector 21 from re-attaching to the wafer W.

[0085] Furthermore, the processing system 1 in the above-described embodiment includes a vacuum transport module 11, at least one processing module 12, at least one ashing module 13, and a transport robot 20a. The processing module 12 and the ashing module 13 are connected to the vacuum transport module 11. The transport robot 20a is disposed within the vacuum transport module 11 and transports the wafer W and a side ring ER, an example of a consumable with a circular shape, under a vacuum atmosphere. The side ring ER can be disposed within at least one processing module 12. The outer diameter of the side ring ER is larger than the outer diameter of the wafer W. The transport robot 20a includes an end effector 21a configured to hold the wafer W and the side ring ER. The end effector 21a is configured such that the side ring ER is placed on the end effector 21a with its center of gravity aligned with position P1. Furthermore, the end effector 21a is configured such that the wafer W is placed on the end effector 21a with its center of gravity aligned with position P1 and position P2 between the front end 210e of the end effector 21a. Therefore, the wafer W can be transported into the ashing module 13, which does not have space to accommodate the edge ring ER, and the ashing module 13 can be miniaturized. As a result, the overall space of the processing system 1 can be reduced.

[0086] Furthermore, in the above embodiment, the edge ring ER is a ring-shaped component. The end effector 21a includes a main body 210, a plurality of first holding portions 211a-211c and second holding portions 212a-212c. The main body 210 includes an upper surface having regions R1, R2 and R3. Regions R1 and R2 are mutually repeated when viewed from a distance d. The second holding portion 212a is disposed in region R1, the second holding portion 212b is disposed in region R2, and the second holding portion 212c is disposed in region R3. The height of the second holding portions 212a-212c is h1. A first holding portion 211a is disposed within region R1 between the second holding portion 212a and the front end 210e of the end effector 21a. A first holding portion 211b is disposed within region R2 between the second holding portion 212b and the front end 210e of the end effector 21a. A first holding portion 211c is disposed within region R3 between the second holding portion 212c and the rear end of the end effector 21a. The height of the first holding portions 211a to 211c is h2, which is lower than h1. This prevents particles adhering to the first holding portions 211a to 211c and the end effector 21a from re-attaching to the wafer W.

[0087] Furthermore, the processing system 1 of the above-described embodiment also includes at least one load locking module 14, an atmospheric transport module 15, and a transport robot 20b. The load locking module 14 is connected to the vacuum transport module 11, and the atmospheric transport module 15 is connected to the load locking module 14. The transport robot 20b is disposed within the atmospheric transport module 15 and transports the wafer W and the edge ring ER, an example of a consumable, under atmospheric pressure. The transport robot 20b includes an end effector 21b configured to hold the wafer W and the edge ring ER. The end effector 21b is configured such that the edge ring ER is placed on the end effector 21b with its center of gravity aligned with position P3. Furthermore, the end effector 21b is configured such that the wafer W is placed on the end effector 21b with its center of gravity aligned with position P3 and position P4 between the front end of the end effector 21b. Thus, the wafer W can be transported into containers such as FOUPs that do not have space to accommodate the edge ring ER.

[0088] Furthermore, in the above-described embodiment, the end effector 21a carries a wafer W and a side ring ER, which is an example of a consumable with a circular shape. The outer diameter of the side ring ER is larger than the outer diameter of the wafer W. The end effector 21a includes a main body 210, a plurality of first holding portions 211a-211c, and second holding portions 212a-212c. The main body 210 includes an upper surface having regions R1, R2, and R3. Regions R1 and R2 are mutually repeated when viewed from a distance d. The second holding portion 212a is disposed in region R1, the second holding portion 212b is disposed in region R2, and the second holding portion 212c is disposed in region R3. The height of the second holding portions 212a-212c is h1. The first holding part 211a is disposed in region R1 between the second holding part 212a and the front end 210e of the end effector 21a. The first holding part 211b is disposed in region R2 between the second holding part 212b and the front end 210e of the end effector 21a. The first holding part 211c is disposed in region R3 between the second holding part 212c and the rear end of the end effector 21a. The height h1 of the second holding parts 212a to 212c is different from the height h2 of the first holding parts 211a to 211c. The end effector 21a is configured such that, when transporting the edge ring ER, the center of gravity position P1 of the edge ring ER is aligned with that of the end effector 21a. Furthermore, when transporting the wafer W, the wafer W is configured such that the center of gravity position P1 of the wafer W is aligned with the position P2 between the front end 210e of the end effector 21a and the end effector 21a. Therefore, it is possible to suppress the re-attachment of particles that are attached to the first holding portions 211a to 211c and the end effector 21a to the wafer W.

[0089] Furthermore, in the above embodiment, the edge ring ER is a ring-shaped component, and the height h1 of the second holding portions 212a-212c is higher than the height h2 of the first holding portions 211a-211c. This prevents particles adhering to the first holding portions 211a-211c and the end effector 21a from re-attaching to the wafer W.

[0090] (Second Implementation)

[0091] In the first embodiment, transport robots 20a and 20b transport a wafer W and a side ring ER, which is an example of a consumable, respectively. In contrast, transport robots 20a and 20b of this embodiment can transport both the wafer W and the side ring ER simultaneously. Hereinafter, the differences from the first embodiment will be described.

[0092] Figure 15 This is a side view showing another example of the end effector 21a in the second embodiment. Figure 15 In this example, the end effector 21a of the transport robot 20a is shown, but the end effector 21b of the transport robot 20b also has the same structure. In this embodiment, the height h1 of the second holding portions 212a to 212c from the upper surface of the main body 210 is, for example, as shown in the figure. Figure 15 As shown, the height h2 of the first holding portions 211a to 211c from the upper surface of the main body 210 is lower than that of the first holding portions 211a to 211c. Therefore, for example, it is possible to... Figure 16 As shown, non-annular (hollow) consumables such as the cover member 122d of the chamber 120 and the electrostatic chuck 121a are simultaneously placed on the end effector 21a without interfering with each other. In addition, the end effector 21a in this embodiment can also transport annular consumables such as the edge ring ER and the wafer W at the same time.

[0093] Furthermore, in this embodiment, the end effector 21a, for example, Figure 17 As shown, the first holding portions 211a and 211b supporting the consumable are positioned outside the circle C2, which indicates the shape of the wafer W. This allows the end effector 21a to simultaneously hold both the wafer W and the consumable without interfering with the wafer W.

[0094] [other]

[0095] Furthermore, the technology disclosed in this application is not limited to the above-described embodiments, but can be modified in various ways within its scope.

[0096] For example, in the above embodiments, the consumable is circular in shape, but the technology of the present invention is not limited to this. The consumable can also be rectangular, polygonal, partially arc-shaped, or other shapes other than circular.

[0097] Furthermore, the embodiments disclosed herein should be considered illustrative in all respects and not restrictive. In fact, the above-described embodiments can be implemented in various ways. Moreover, the above-described embodiments can be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

[0098] Explanation of reference numerals in the attached figures

[0099] ER side ring

[0100] W chip

[0101] 1. Processing System

[0102] 100 Control device

[0103] 11 Vacuum transport module

[0104] 12 Processing Modules

[0105] 120 chambers

[0106] 121 Support section

[0107] 121a Electrostatic Chuck

[0108] 121b Lower electrode

[0109] 122 Upper spray head collection section

[0110] 123 RF Power Supply Department

[0111] 124 Gas Supply Department

[0112] 125 Exhaust System

[0113] 13 Ashing Module

[0114] 130 mounting platform

[0115] 14 Load Lockout Module

[0116] 15 Atmospheric Transport Module

[0117] 16 Loading ports

[0118] 20 Delivery robots

[0119] 21. End effector

[0120] 211 First Maintenance Department

[0121] 212 Second Maintenance Section

[0122] 22. Robotic arm.

Claims

1. A transport device for simultaneously or separately transporting a wafer and a consumable having a circular shape, the consumable being configurable within a wafer processing module, the outer diameter of the consumable being larger than the outer diameter of the wafer, the transport device characterized in that it comprises: An end effector configured to simultaneously or separately mount the wafer and the consumable; A robotic arm configured to move the end effector; and A control device configured to control the robotic arm. The control device is configured as follows: When transporting the consumable, the robotic arm is controlled so that the consumable is placed on the end effector with its center of gravity aligned with a first position. When transporting the wafer, the robotic arm is controlled such that the wafer is placed on the end effector in a manner that aligns the wafer's center of gravity with a second position between the first position and the tip of the end effector. When transporting the wafer, the wafer is mounted on the end effector in such a way that a portion of the wafer protrudes from the front end of the end effector. In the case of transporting the consumable, the consumable is mounted on the end effector in such a manner that a portion of the consumable protrudes from the front end of the end effector. The portion of the wafer protruding from the front end of the end effector is the same size as the portion of the consumable protruding from the front end of the end effector.

2. The conveying device as claimed in claim 1, characterized in that: The width of the end effector is smaller than the outer diameter of the wafer.

3. The conveying device as described in claim 1 or 2, characterized in that: The consumable is a ring-shaped component. The end effector includes: A main body with an upper surface; Multiple wafer support pads disposed on the upper surface of the body; and Multiple consumable support pads are disposed on the upper surface of the main body. The height of the wafer support pad from the upper surface of the body is greater than the height of the consumable support pad from the upper surface of the body.

4. The conveying device as described in claim 1 or 2, characterized in that: The consumables are a cover or electrostatic suction cup located at the bottom of the spray head. The end effector includes: A main body with an upper surface; Multiple wafer support pads disposed on the upper surface of the body; and Multiple consumable support pads are disposed on the upper surface of the main body. The height of the wafer support pad from the upper surface of the body is lower than the height of the consumable support pad from the upper surface of the body.

5. A transportation system, characterized in that, include: Vacuum transport module; At least one first wafer processing module is connected to the vacuum transport module; At least one second wafer processing module connected to the vacuum transport module; and A vacuum transport robot, configured within the vacuum transport module, is used to simultaneously or separately transport wafers and circular consumables under a vacuum atmosphere. The consumables can be configured within at least one of the first wafer processing modules. The outer diameter of the consumables is larger than the outer diameter of the wafer. The vacuum transport robot includes an end effector configured to simultaneously or separately load the wafers and the consumables. The end effector loads the consumables onto itself such that the center of gravity of the consumables aligns with a first position, and loads the wafers onto the end effector such that the center of gravity of the wafers aligns with a second position between the first position and the tip of the end effector. When transporting the wafer, the wafer is mounted on the end effector in such a way that a portion of the wafer protrudes from the front end of the end effector. In the case of transporting the consumable, the consumable is mounted on the end effector in such a manner that a portion of the consumable protrudes from the front end of the end effector. The portion of the wafer protruding from the front end of the end effector is the same size as the portion of the consumable protruding from the front end of the end effector.

6. The transport system as described in claim 5, characterized in that: The consumable is a ring-shaped component. The end effector includes: A main body having an upper surface having a first front end region, a second front end region, and a rear end region, wherein the first front end region and the second front end region are mutually repeated when viewed from a first direction; A first wafer support pad having a first height is disposed in the first front-end region; A second wafer support pad having the first height is disposed in the second front-end region; A third wafer support pad having the first height is disposed in the rear end region; A first consumable support pad having a second height lower than the first height is disposed between the first wafer support pad and the front end of the end effector in the first front end region. A second consumable support pad having the second height is disposed between the second wafer support pad and the front end of the end effector within the second front end region; and A third consumable support pad having the second height is disposed in the rear end region between the third wafer support pad and the rear end of the end effector.

7. The transport system as described in claim 5, characterized in that: The consumables are a cover or electrostatic suction cup located at the bottom of the spray head. The end effector includes: A main body having an upper surface having a first front end region, a second front end region, and a rear end region, wherein the first front end region and the second front end region are mutually repeated when viewed from a first direction; A first wafer support pad having a first height is disposed in the first front-end region; A second wafer support pad having the first height is disposed in the second front-end region; A third wafer support pad having the first height is disposed in the rear end region; A first consumable support pad having a second height that is higher than the first height is disposed between the first wafer support pad and the front end of the end effector in the first front end region. A second consumable support pad having the second height is disposed between the second wafer support pad and the front end of the end effector within the second front end region; and A third consumable support pad having the second height is disposed in the rear end region between the third wafer support pad and the rear end of the end effector.

8. The transport system according to any one of claims 5 to 7, characterized in that, include: At least one load locking module is connected to the vacuum delivery module; An atmospheric transport module connected to at least one load locking module; and An atmospheric transport robot, configured within the atmospheric transport module, is used to transport the wafer and the consumable simultaneously or separately under atmospheric pressure. The atmospheric transport robot includes an additional end effector configured to simultaneously or separately carry the wafer and the consumable. The additional end effector places the consumable on the additional end effector such that the center of gravity of the consumable is aligned with a third position, and places the wafer on the additional end effector such that the center of gravity of the wafer is aligned with a fourth position between the third position and the front end of the additional end effector.

9. An end effector for simultaneously or separately placing a wafer and a consumable having a circular shape, the outer diameter of the consumable being larger than the outer diameter of the wafer, the end effector being characterized in that it is configured to include: A main body having an upper surface having a first front end region, a second front end region, and a rear end region, wherein the first front end region and the second front end region are mutually repeated when viewed from a first direction; A first wafer support pad having a first height is disposed in the first front-end region; A second wafer support pad having the first height is disposed in the second front-end region; A third wafer support pad having the first height is disposed in the rear end region; A first consumable support pad having a second height different from the first height is disposed between the first wafer support pad and the front end of the end effector in the first front end region; A second consumable support pad having the second height is disposed between the second wafer support pad and the front end of the end effector in the second front end region; and A third consumable support pad having the second height is disposed in the rear end region between the third wafer support pad and the rear end of the end effector. When transporting the consumable, the consumable is placed on the end effector in such a way that its center of gravity is aligned with a first position. When transporting the wafer, the wafer is placed on the end effector in such a way that its center of gravity is aligned with a second position between the first position and the front end of the end effector. When transporting the wafer, the wafer is mounted on the end effector in such a way that a portion of the wafer protrudes from the front end of the end effector. In the case of transporting the consumable, the consumable is mounted on the end effector in such a manner that a portion of the consumable protrudes from the front end of the end effector. The portion of the wafer protruding from the front end of the end effector is the same size as the portion of the consumable protruding from the front end of the end effector.

10. The end effector as claimed in claim 9, characterized in that: The consumable is a ring-shaped component. The first height is higher than the second height.

11. The end effector as claimed in claim 9, characterized in that: The consumables are a cover or electrostatic suction cup located at the bottom of the spray head. The first height is lower than the second height.

Images