Display device and manufacturing apparatus therefor
By designing inspection areas and using specific mask structures in the display device, the problem of difficult identification of the alignment of the encapsulated organic layer, the second electrode, and the protective layer edges is solved, thereby improving the controllability of the manufacturing process and the ability to identify defects.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SAMSUNG DISPLAY CO LTD
- Filing Date
- 2021-08-19
- Publication Date
- 2026-05-29
AI Technical Summary
In the manufacturing process of existing display devices, it is difficult to effectively distinguish and inspect whether the edges of the encapsulation organic layer, the second electrode, and the protective layer are properly aligned, making it difficult to identify manufacturing defects.
By designing an inspection area in the display device, utilizing a mask structure with concave and convex areas, the edges of the encapsulated organic layer, the second electrode, and the protective layer are set in the non-display area, aligning them with each other in a specific direction, and ensuring the distinguishability of the edge positions through different deposition processes, the material deposition is controlled by using masks with different thicknesses and shapes.
This enables reliable alignment and inspection of the edges of the encapsulated organic layer, the second electrode, and the protective layer, improving the controllability of the manufacturing process and the ability to identify defects, and reducing the occurrence of manufacturing defects.
Smart Images
Figure CN114078939B_ABST
Abstract
Description
Technical Field
[0001] The inventive concept herein relates to a display device and its manufacturing apparatus, and more specifically, to a display device having an inspection area and manufacturing apparatus including a mask capable of providing a display device including the inspection area. Background Technology
[0002] Various display devices have been developed for multimedia devices such as televisions, mobile phones, tablets, navigation units, or game consoles. An example of a display device is a light-emitting display. Typically, light-emitting elements are located in each pixel of a light-emitting display.
[0003] The light-emitting display device includes a conductive pattern and multiple insulating layers. The conductive pattern can be disposed between the multiple insulating layers. Two or more insulating layers can be stacked sequentially. Summary of the Invention
[0004] An embodiment of the inventive concept provides a display device that includes an inspection area with an insulating layer.
[0005] Embodiments of the inventive concept also provide manufacturing equipment that includes a mask capable of providing a display device including an inspection area.
[0006] According to an embodiment of the inventive concept, the display device includes: a substrate layer, which includes a display area and a non-display area disposed outside the display area on a plane; a first electrode disposed on the display area; a light-emitting layer disposed on the first electrode; a second electrode stacked with the display area and the non-display area and disposed on the light-emitting layer; a protective layer stacked with the display area and the non-display area and disposed on the second electrode; and a thin-film encapsulation layer stacked with the display area and the non-display area, disposed on the protective layer, and including an encapsulating organic layer. The non-display area includes a first area and a second area. In the first area, the edge of the encapsulating organic layer is spaced apart from the edge of the second electrode by a first distance, and the edge of the encapsulating organic layer is spaced apart from the edge of the protective layer by a second distance. In the second area, the edge of the encapsulating organic layer is disposed between the edge of the second electrode and the edge of the protective layer. In the second area, the edge of the encapsulating organic layer is spaced apart from the edge of the second electrode by a third distance, and the edge of the encapsulating organic layer is spaced apart from the edge of the protective layer by a fourth distance. The third distance is greater than the first distance, and the fourth distance is greater than the second distance.
[0007] In embodiments of the inventive concept, the edges of the encapsulated organic layer may be substantially linear in the first and second regions.
[0008] In embodiments of the inventive concept, the edge of the protective layer may include a recessed area in the second region that faces the display area. The edge of the second electrode may include a convex area in the second region that faces the edge of the substrate layer.
[0009] In embodiments of the inventive concept, the recessed area at the edge of the protective layer may have a maximum width of less than or equal to about 200 μm in the second region, and the convex area at the edge of the second electrode may have a maximum width of less than or equal to about 200 μm in the second region.
[0010] In an embodiment of the inventive concept, in the first region, the edge of the protective layer may be configured to be closest to the edge of the substrate layer among the edges of the second electrode, the protective layer, and the encapsulated organic layer, and in the first region, the edge of the encapsulated organic layer may be configured to be furthest from the edge of the substrate layer among the edges of the second electrode, the protective layer, and the encapsulated organic layer.
[0011] In embodiments of the inventive concept, the thin-film encapsulation layer may further include a first encapsulation inorganic layer and a second encapsulation inorganic layer, and the encapsulation organic layer may be disposed between the first encapsulation inorganic layer and the second encapsulation inorganic layer in the thickness direction of the substrate layer.
[0012] In embodiments of the inventive concept, the edges of the first encapsulated inorganic layer and the second encapsulated inorganic layer can be substantially linear in the first and second regions.
[0013] In embodiments of the inventive concept, each of the edges of the first encapsulated inorganic layer and the second encapsulated inorganic layer may be closer to the edge of the substrate layer than the edge of the encapsulated organic layer in the first and second regions.
[0014] In embodiments of the inventive concept, the protective layer may include organic materials.
[0015] In an embodiment of the inventive concept, the display device includes: a substrate layer, which includes a display area and a non-display area disposed outside the display area in a plane; a first electrode disposed on the display area; a light-emitting layer configured to correspond to the first electrode; a second electrode superimposed on the display area and the non-display area and disposed on the light-emitting layer; a protective layer superimposed on the display area and the non-display area and disposed on the second electrode; and a thin-film encapsulation layer superimposed on the display area and the non-display area, and including a first encapsulation inorganic layer, an encapsulation organic layer disposed on the first encapsulation inorganic layer, and a second encapsulation inorganic layer disposed on the encapsulation organic layer. In the non-display area, the edge of the protective layer includes a recessed area recessed toward the display area, and the edge of the second electrode includes a protruding area protruding toward the edge of the substrate layer. The recessed area and the protruding area are aligned with each other in a first direction, and in the first direction, the edge of the encapsulation organic layer is disposed between the edge of the recessed area of the protective layer and the edge of the protruding area of the second electrode.
[0016] In embodiments of the inventive concept, the manufacturing apparatus includes: a first mask configured to deposit a first material on each of a cell region of a working substrate; and a second mask configured to deposit a second material on each of the cell regions of the working substrate. The first mask includes a first mask sheet comprising first and second elements, the first and second elements defining a plurality of first deposition openings corresponding to the cell regions. The second mask includes a second mask sheet comprising third and fourth elements, the third and fourth elements defining a plurality of second deposition openings corresponding to the cell regions. The first and third elements extend in a first direction, and the second and fourth elements extend in a second direction intersecting the first direction. In a plane, recesses are disposed in at least each of the first elements or in at least each of the second elements. In a plane, convex regions are disposed at locations corresponding to the recesses in at least each of the third elements or in at least each of the fourth elements.
[0017] In embodiments of the inventive concept, the first mask may further include a first frame coupled to the first mask sheet, and the second mask may further include a second frame coupled to the second mask sheet.
[0018] In embodiments of the inventive concept, the first mask and the first frame may comprise the same material as each other.
[0019] In embodiments of the inventive concept, at least the first element or at least the second element may include a first region having a first thickness and a second region having a second thickness less than the first thickness.
[0020] In an embodiment of the inventive concept, the recessed area may be located on the side of the first region opposite to the second region.
[0021] In embodiments of the inventive concept, each of the first elements may have a length greater than that of each of the second elements.
[0022] In embodiments of the inventive concept, each of the plurality of first deposition openings may have a first surface area, and each of the plurality of second deposition openings may have a second surface area different from the first surface area.
[0023] In embodiments of the inventive concept, the first material may include a metallic material, and the second material may include an organic material.
[0024] In embodiments of the inventive concept, the manufacturing apparatus may further include a third mask configured to deposit a third material on each cell region of a working substrate. The third mask may include fifth and sixth elements, and the fifth and sixth elements may define a plurality of third deposition openings corresponding to the cell regions.
[0025] In an embodiment of the inventive concept, each of the fifth elements may have a uniform width, and each of the sixth elements may have a uniform width.
[0026] According to an embodiment of the inventive concept, a display device includes: a substrate layer, which includes a display area and a non-display area disposed outside the display area in a plane; electrodes stacked with the display area and the non-display area; a protective layer stacked with the display area and the non-display area and disposed on the electrodes; and a thin-film encapsulation layer stacked with the display area and the non-display area, and including a first encapsulation inorganic layer, a second encapsulation inorganic layer, and an encapsulation organic layer disposed between the first encapsulation inorganic layer and the second encapsulation inorganic layer in the thickness direction of the display device. The display device includes a first region and a second region. In the first region and the second region, the edges of the first encapsulation inorganic layer and the second encapsulation inorganic layer are disposed between the edge of the substrate layer and the edge of the encapsulation organic layer in a first direction intersecting the thickness direction. In the first region, the edge of the electrode is disposed between the edge of the protective layer and the edge of the encapsulation organic layer in a first direction. In the second region, the edge of the encapsulation organic layer is disposed between the edge of the electrode and the edge of the protective layer in a first direction. Attached Figure Description
[0027] The above and other features of the inventive concept will be more fully understood by describing in detail the exemplary embodiments of the inventive concept with reference to the accompanying drawings.
[0028] Figure 1 This is a perspective view of a display device according to an embodiment of the inventive concept.
[0029] Figure 2 Embodiments based on the inventive concept Figure 1 A cross-sectional view of the display device.
[0030] Figure 3 Embodiments based on the inventive concept Figure 1 A cross-sectional view of the display device.
[0031] Figure 4A This illustrates an embodiment based on the inventive concept. Figure 1 A plan view of a portion of the display device.
[0032] Figure 4B Embodiments based on the inventive concept Figure 4A A cross-sectional view of a portion of the display device.
[0033] Figure 4C Embodiments based on the inventive concept Figure 4A A cross-sectional view of a portion of the display device.
[0034] Figure 5This is a view showing a manufacturing apparatus according to an embodiment of the inventive concept.
[0035] Figure 6 It is an exploded perspective view of a mask according to an embodiment of the inventive concept.
[0036] Figure 7A and Figure 7B The diagram shows a plan view of a first mask and a second mask according to an embodiment of the inventive concept.
[0037] Figure 8A This is an enlarged plan view showing a portion of a first mask according to an embodiment of the inventive concept.
[0038] Figure 8B This illustrates an embodiment based on the inventive concept. Figure 8A A cross-sectional view of a portion of the first mask.
[0039] Figure 9A This is an enlarged plan view showing a portion of a second mask according to an embodiment of the inventive concept.
[0040] Figure 9B This illustrates an embodiment based on the inventive concept. Figure 9A A cross-sectional view of a portion of the second mask. Detailed Implementation
[0041] Embodiments of the inventive concept will now be described more fully with reference to the accompanying drawings. Throughout this application, the same reference numerals may refer to the same elements.
[0042] It will be understood that when an element, such as a region, layer, or portion, is referred to as being “on” another element, that element may be directly on the other element, or there may be an intermediate element present.
[0043] Additionally, the thickness, scale, and dimensions of components may be exaggerated in the accompanying drawings for clarity. For ease of description, spatially relative terms such as "below," "down," "above," and "above" may be used to describe the relationship between elements and / or features shown in the drawings and other elements and / or features. Terms may be relative concepts and are described based on the directions indicated in the drawings.
[0044] The meaning of “includes” or “contains” specifies a nature, region, fixed quantity, step, process, element and / or component, but does not exclude other natures, regions, fixed quantities, steps, processes, elements and / or components.
[0045] Figure 1 This is a perspective view showing a display device according to an embodiment of the inventive concept. Figure 2 This illustrates an embodiment based on the inventive concept. Figure 1A cross-sectional view of the display device. Figure 3 This illustrates an embodiment based on the inventive concept. Figure 1 A cross-sectional view of the display device. Figure 2 The cross-section corresponding to pixel PX is shown. Figure 3 It shows along Figure 1 The cross section taken by line I-I'.
[0046] like Figure 1 As shown, on a plane defined by a first direction axis DR1 and a second direction axis DR2 intersecting the first direction axis DR1, the display device DD includes a display area DA and a non-display area NDA disposed outside the display area DA. The thickness direction of the display device DD is indicated by a third direction axis DR3 intersecting the first direction axis DR1 and the second direction axis DR2. The front surface (or top surface) and rear surface (or bottom surface) of each component are distinguished by the third direction axis DR3. However, the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 can be relative concepts and can be converted relative to each other. In the following, the first direction to the third direction are directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3, respectively, and represented by the same reference numerals as the first direction axis, the second direction axis, and the third direction axis.
[0047] The display device DD according to this embodiment can be a planar rigid display device. However, the inventive concept is not limited thereto. For example, the display device DD according to an embodiment of the inventive concept can be a flexible display device. The display device DD according to an embodiment of the inventive concept can be used in large-sized electronic devices such as televisions or monitors, as well as small-to-medium-sized electronic devices such as mobile phones, tablet computers, or navigation units for vehicles, game consoles, and smartwatches.
[0048] like Figure 1 As shown, multiple pixels PX can be set in the display area DA. Pixels PX are not set in the non-display area NDA.
[0049] Figure 2 A cross-section corresponding to a portion of pixel PX is shown. Pixel PX may include a display element and driving circuitry that allows the display element to operate. The display element may be a light-emitting element and includes a light-emitting diode. The driving circuitry may include multiple transistors and at least one capacitor. Figure 2 An organic light-emitting diode (OLED) as a light-emitting element and a transistor (TR) as a driving circuit are illustrated exemplarily.
[0050] The display device DD includes a substrate layer SUB, a circuit element layer DP-CL, a display element layer DP-OLED, and an upper insulating layer TFL. The substrate layer SUB may include a synthetic resin layer. The synthetic resin layer is disposed on a support substrate used in manufacturing the display device DD. Subsequently, conductive layers, insulating layers, etc., are disposed on the synthetic resin layer. When the support substrate is removed, the synthetic resin layer corresponds to the substrate layer SUB.
[0051] The circuit element layer DP-CL includes at least one inorganic layer, at least one organic layer, and circuit elements. The circuit element layer DP-CL may include a first insulating layer 10, a second insulating layer 20, a third insulating layer 30, and a buffer layer BFL serving as the inorganic layer. Each of the first insulating layer 10 and the second insulating layer 20 may include an inorganic layer, and the third insulating layer 30 may include an organic layer.
[0052] A semiconductor pattern is disposed on the buffer layer BFL. The semiconductor pattern may include silicon semiconductor. The semiconductor pattern may include polycrystalline silicon. However, the inventive concept is not limited thereto. For example, the semiconductor pattern may include amorphous silicon or metal oxide semiconductor.
[0053] Semiconductor patterns have different electrical properties depending on whether they are doped. A semiconductor pattern may include a first region and a second region different from the first region. The first region may be doped with n-type or p-type dopant. A p-type transistor includes a doped region doped with p-type dopant.
[0054] The first region has a higher conductivity than the second region and is essentially used as an electrode or signal line. The second region essentially corresponds to the active region (or channel) of a transistor. In other words, one part of the semiconductor pattern can be the active region (or channel) of a transistor, another part can be the source (or input electrode region) or drain (or output electrode region) of a transistor, and yet another part can be a connecting signal line (or connecting electrode).
[0055] like Figure 2 As shown, the source ES1, active region EA1, and drain ED1 of transistor TR are configured using a semiconductor pattern. Transistor TR can be connected to the organic light-emitting diode (OLED) through different conductive structures. For example, the driving circuit may include multiple transistors, and another transistor may be directly connected to the OLED.
[0056] The control electrode EG1 is disposed on the first insulating layer 10 and stacked with the active region EA1. The second insulating layer 20 covers the control electrode EG1.
[0057] The display element layer DP-OLED is disposed on the third insulating layer 30. The display element layer DP-OLED may include a pixel defining layer PDL and an organic light-emitting diode OLED. The pixel defining layer PDL may include an organic material. A first electrode AE is disposed on the third insulating layer 30. An opening OP is defined in the pixel defining layer PDL. The opening OP of the pixel defining layer PDL exposes at least a portion of the first electrode AE.
[0058] The exposed portion of the first electrode AE can be referred to as the light-emitting region PXA. The non-light-emitting region NPXA can be positioned adjacent to the light-emitting region PXA. A hole control layer HCL can be jointly disposed on both the light-emitting region PXA and the non-light-emitting region NPXA, for example, on both. The hole control layer HCL includes a hole transport layer. The hole control layer HCL may also include a hole injection layer. Common layers such as the hole control layer HCL can be jointly disposed on multiple pixels PX (see reference). Figure 1 )middle.
[0059] A light-emitting layer (EML) is disposed on a hole control layer (HCL). The EML can be disposed in the region corresponding to the opening (OP). In this embodiment of the inventive concept, the EML can be divided and disposed in each of a plurality of pixels (PX). The EML can include organic and / or inorganic materials. Although a patterned EML is exemplarily shown in this embodiment, the EMLs can be disposed together in a plurality of pixels (PX) (see reference). Figure 1 In this case, the EML (Emitting Material Layer) can produce white or blue light.
[0060] The electronic control layer (ECL) is disposed on the emissive layer (EML). The ECL can be disposed on multiple pixels (PX) (see reference). Figure 1 The electronic control layer (ECL) includes an electron transport layer. The ECL may also include an electron injection layer.
[0061] The second electrode CE is disposed on the electronic control layer ECL. The second electrode CE is disposed on multiple pixels PX (see reference). Figure 1 )middle.
[0062] An upper insulating layer (TFL) is disposed on the second electrode (CE). The upper insulating layer (TFL) may include a protective layer (CPL) and a thin-film encapsulation layer (TFE). The protective layer (CPL) directly covers the second electrode (CE) and protects the second electrode (CE) in subsequent processes. The protective layer (CPL) may include an organic material.
[0063] Thin-film encapsulation layers (TFE) are co-located in multiple pixel PXs (see reference). Figure 1The thin-film encapsulation layer (TFE) comprises multiple insulating layers. The TFE protects the organic light-emitting diode (OLED) from moisture and foreign substances.
[0064] exist Figure 3 In the above, because the circuit element layer DP-CL and the display element layer DP-OLED disposed in the display area DA have the same characteristics as the reference... Figure 2 The described structures are identical, therefore their detailed descriptions will be omitted. Figure 3 As shown in the image.
[0065] although Figure 3 Only a cross-section on one side of the second direction DR2 is shown, but a cross-section on the other side of the second direction DR2 can be shown in conjunction with... Figure 3 The cross-section is symmetrical. Here, symmetry refers to the symmetry of the comparative relationship of the edges described below, rather than a mathematical feature of symmetry. In the following text, when comparing one edge with another, it will be understood that the edge closer to the display area DA is positioned on the inside, and the edge farther from the display area DA is positioned on the outside.
[0066] The buffer layer BFL, the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30 are superimposed on the display area DA and the non-display area NDA of the substrate layer SUB. The edge of the substrate layer SUB is located at the outermost position. An example is shown of the edge of the buffer layer BFL aligned with the edge of the substrate layer SUB. An example is shown of the aligned edges of the first insulating layer 10 and the second insulating layer 20. The edge of the third insulating layer 30 may be located at the innermost position among the aforementioned edges. The edge of the pixel defining layer PDL may be located at a further inner position. The edge of the pixel defining layer PDL is superimposed on the non-display area NDA.
[0067] The dam-shaped DMP can be disposed on the outer edge of the third insulating layer 30. The dam-shaped DMP can have a multi-layer structure. The lower DM1 can be disposed using the same process as the third insulating layer 30, and the upper DM2 can be disposed using the same process as the pixel defining layer PDL. In the process of forming the encapsulation organic layer OL, which will be described later, the dam-shaped DMP restricts the liquefied organic material to prevent diffusion to the outside.
[0068] The thin-film encapsulation layer TFE may include a first encapsulation inorganic layer IOL1, an encapsulation organic layer OL, and a second encapsulation inorganic layer IOL2 stacked sequentially. In other words, the encapsulation organic layer OL may be disposed between the first encapsulation inorganic layer IOL1 and the second encapsulation inorganic layer IOL2 in the thickness direction (e.g., DR3) of the display device DD. Compared to the edge of the encapsulation organic layer OL, the edges of each of the first encapsulation inorganic layer IOL1 and the second encapsulation inorganic layer IOL2 may be further disposed on the outer side. The first encapsulation inorganic layer IOL1 and the second encapsulation inorganic layer IOL2 may be stacked with a dam portion DMP. Compared to the edges of each of the first insulating layer 10 and the second insulating layer 20, the edges of each of the first encapsulation inorganic layer IOL1 and the second encapsulation inorganic layer IOL2 may be further disposed on the inner side.
[0069] Reference Figure 3 The encapsulated organic layer OL, the second electrode CE, and the protective layer CPL are stacked with the display area DA and the non-display area NDA. (Refer to...) Figure 3 In the predetermined area BB, it can be seen that the edges of the encapsulating organic layer OL, the second electrode CE, and the protective layer CPL are misaligned and instead set adjacent to each other. This means that the edges of the encapsulating organic layer OL, the second electrode CE, and the protective layer CPL are almost indistinguishable to the naked eye. The second electrode CE and the protective layer CPL can be set by a deposition method, and the encapsulating organic layer OL can be set by an inkjet method. Because the edges are almost indistinguishable, it may be difficult to distinguish (e.g., identify) manufacturing defects. The distinguishable inspection area of the display device DD according to an embodiment of the inventive concept will be described in detail below.
[0070] Figure 4A This illustrates an embodiment based on the inventive concept. Figure 1 A plan view of a portion AA of the display device. Figure 4B It is along the embodiments of the inventive concept. Figure 4A A sectional view taken from line II-II' of a portion of the display device AA. Figure 4C It is along the embodiments of the inventive concept. Figure 4A A sectional view taken from line III-III' of a portion of the display device AA.
[0071] In the first direction DR1, the non-display area NDA may include a first area R1 and a second area R2. In the first area R1, the edges of the encapsulating organic layer OL, the second electrode CE, and the protective layer CPL are arranged to be relatively more adjacent to each other. In the second area R2, the edges of the encapsulating organic layer OL, the second electrode CE, and the protective layer CPL are arranged to be relatively more distant from each other. By distinguishing the edges of the encapsulating organic layer OL, the second electrode CE, and the protective layer CPL, it can be determined whether the layers are appropriately set according to the design values. The second area R2 corresponds to the aforementioned inspection area.
[0072] Reference Figure 4A and Figure 4B In the first region R1, the edges of the encapsulating organic layer OL, the second electrode CE, and the protective layer CPL are arranged to be adjacent to each other. Exemplarily, the edge of the protective layer CPL is located at the outermost of the aforementioned edges, and the edge of the encapsulating organic layer OL is located at the innermost of the aforementioned edges. In other words, the edge of the protective layer CPL is closest to the edge SUB-E of the substrate layer SUB, and the edge of the encapsulating organic layer OL is furthest from the edge SUB-E of the substrate layer SUB. Here, in the first region R1, the edge of the encapsulating organic layer OL is spaced apart from the edge of the second electrode CE by a first distance D1, and the edge of the encapsulating organic layer OL is spaced apart from the edge of the protective layer CPL by a second distance D2. In other words, in the first region R1, the edge of the second electrode CE is located between the edge of the protective layer CPL and the edge of the encapsulating organic layer OL in the second direction DR2.
[0073] Reference Figure 4A and Figure 4C In the second region R2, the edges of the encapsulating organic layer OL, the second electrode CE, and the protective layer CPL are positioned relatively far apart from each other. Of these three edges, the edge of the second electrode CE is located at the outermost edge, and the edge of the protective layer CPL is located at the innermost edge. In other words, of the three edges, the edge of the second electrode CE is closest to the edge SUB-E of the substrate layer SUB, and the edge of the protective layer CPL is furthest from the edge SUB-E of the substrate layer SUB. In the second region R2, the edge of the encapsulating organic layer OL is positioned between the edge of the second electrode CE and the edge of the protective layer CPL. Here, in the second region R2, the distance between the edge of the encapsulating organic layer OL and the edge of the second electrode CE is greater than a third distance D3 of the first distance D1, and the distance between the edge of the encapsulating organic layer OL and the edge of the protective layer CPL is greater than a fourth distance D4 of the second distance D2. In other words, in the second region R2, the edge of the encapsulating organic layer OL can be positioned between the edge of the second electrode CE and the edge of the protective layer CPL in the second direction DR2.
[0074] Because in such Figure 4AThe edges of the second electrode CE and the protective layer CPL on the plane shown are not linear, thus creating a third distance D3 different from the first distance D1 and a fourth distance D4 different from the second distance D2. However, the edge of the encapsulated organic layer OL is substantially linear in the first region R1 and the second region R2. In the first region R1 and the second region R2, the edge of the encapsulated organic layer OL is parallel to the first direction DR1. In the first region R1 and the second region R2, the edges of each of the first encapsulated inorganic layers IOL1 and IOL2 can be substantially linear and are positioned closer to the edge SUB-E of the substrate layer SUB than the edge of the encapsulated organic layer OL. In other words, in the first region R1 and the second region R2, the edges of the first encapsulated inorganic layers IOL1 and IOL2 can be positioned on the second direction DR2 between the edge SUB-E of the substrate layer SUB and the edge of the encapsulated organic layer OL.
[0075] In the second region R2, the edge of the protective layer CPL may include a recessed area CPL-C facing the display area DA, and the edge of the second electrode CE may include a convex area CE-C protruding towards the edge SUB-E of the substrate layer SUB. Through the aforementioned inspection area, the edge of the encapsulated organic layer OL can be inspected with the naked eye. In the second region R2, it can be determined whether the edge of the encapsulated organic layer OL is properly positioned between the edge of the protective layer CPL and the edge of the second electrode CE, and the encapsulated organic layer OL, established by the inkjet process, can be evaluated to determine whether it is positioned within the tolerance range.
[0076] Here, since the convex region CE-C is located within the second electrode CE, the noise shielding area of the second electrode CE is not reduced. (Refer to...) Figure 3 Although the signal lines, which are located on the same layer as the transistor TR, are situated in the non-display area NDA, noise caused by signals generated from these signal lines can be prevented. Since the recessed area CPL-C is situated within the protective layer CPL, which serves as the organic layer, the recessed area CPL-C can be adequately sealed by the first package inorganic layer IOL1. Figure 3 In this process, a first encapsulating inorganic layer IOL1 is extensively deposited to cover the dam section DMP. In embodiments of the invention, even if the first encapsulating inorganic layer IOL1 is deposited more... Figure 3 The slightly narrower design shown in the diagram does not cause any adverse effects caused by the recessed CPL-C when the protective layer CPL is sealed by the first encapsulation inorganic layer IOL1.
[0077] Although the width of the convex region CE-C at the edge of the second electrode CE in the first direction DR1 is narrower than the width of the concave region CPL-C at the edge of the protective layer CPL in the first direction DR1, the inventive concept is not limited thereto. For example, the opposite may be possible, or the width of the convex region CE-C at the edge of the second electrode CE in the first direction DR1 may be the same as the width of the concave region CPL-C at the edge of the protective layer CPL in the first direction DR1. In embodiments of the inventive concept, the maximum width of the concave region CPL-C at the edge of the protective layer CPL in the first direction DR1 may be less than or equal to about 200 μm, and the maximum width of the convex region CE-C at the edge of the second electrode CE in the first direction DR1 may be less than or equal to about 200 μm. In embodiments of the inventive concept, the maximum depth of the concave region CPL-C at the edge of the protective layer CPL in the second direction DR2 may be less than or equal to about 200 μm, and the maximum depth of the convex region CE-C at the edge of the second electrode CE in the second direction DR2 may be less than or equal to about 200 μm.
[0078] Reference Figure 4A Although the recessed region CPL-C at the edge of the protective layer CPL and the linear region at the edge of the protective layer CPL are continuous in the first direction DR1, the inventive concept is not limited thereto. For example, a boundary region may be provided between the recessed region CPL-C at the edge of the protective layer CPL and the linear region at the edge of the protective layer CPL. The boundary region may include a sloping edge or a curved edge. Similarly, a boundary region may be provided between the convex region CE-C at the edge of the second electrode CE and the linear region at the edge of the second electrode CE.
[0079] Figure 5 This is a view showing a manufacturing apparatus according to an embodiment of the inventive concept. Figure 6 It is an exploded perspective view of a mask according to an embodiment of the inventive concept. Figure 7A and Figure 7B The diagram shows a plan view of a first mask and a second mask according to an embodiment of the inventive concept.
[0080] Figure 5 A deposition apparatus FA is shown as an example of a manufacturing device. The deposition apparatus FA can be used to form a reference. Figures 1 to 3 The described display device DD has an insulating or conductive layer (conductive pattern). The deposition apparatus FA includes a deposition chamber CB, a fixing component CM, a deposition source DS disposed inside the deposition chamber CB, and a mask MSK disposed inside the deposition chamber CB. Manufacturing equipment according to embodiments of the inventive concept may include... Figure 5 The manufacturing equipment may include multiple deposition devices (FAs). Additional mechanical devices may also be included to enable in-line systems.
[0081] The deposition chamber CB can be set to a vacuum for deposition conditions. The deposition chamber CB may include a bottom surface, a top surface, and sidewalls. The bottom surface of the deposition chamber CB may be substantially parallel to the surface defined by the first direction axis DR1 and the second direction axis DR2. The normal direction of the bottom surface of the deposition chamber CB indicates the third direction axis DR3. As discussed above, the first to third directions may be directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3, respectively, and represented by the same reference numerals as those used for the first, second, and third direction axes. Hereinafter, the expression "in a plane" refers to a surface substantially parallel to the surface defined by the first direction axis DR1 and the second direction axis DR2.
[0082] A fixing component CM is disposed inside the deposition chamber CB and above the deposition source DS to fix the mask MSK. The fixing component CM can be mounted on the top surface of the deposition chamber CB. The fixing component CM may include a clamp or robotic arm for holding the mask MSK.
[0083] The fixing component CM may include a main body and a magnet attached to the main body. The main body may include a plate serving as a base structure for fixing the mask MSK. However, the inventive concept is not limited thereto. The magnet may be disposed inside or outside the main body. The magnet can fix the mask MSK by using magnetic force.
[0084] The deposition source DS can evaporate deposition materials such as organic, inorganic, or metallic materials to be ejected as deposition vapor. The deposition vapor passes through the mask MSK and is deposited on the working substrate WS in a predetermined pattern.
[0085] The mask MSK is disposed inside the deposition chamber CB and above the deposition source DS to support the working substrate WS. The mask MSK includes multiple deposition openings M-OP. The working substrate WS includes multiple cell regions UA corresponding to the multiple deposition openings M-OP. When the manufacturing process is complete, each of the multiple cell regions UA is ultimately configured as a reference. Figures 1 to 3 The described display device DD.
[0086] The working substrate WS may include a glass substrate or a plastic substrate. The working substrate WS may include a synthetic resin layer disposed on the substrate. The substrate may be removed in the latter part of the process for manufacturing the display device DD, and the synthetic resin layer may correspond to... Figure 2 The substrate layer SUB in the middle.
[0087] Reference Figure 5 and Figure 6The mask MSK may include a frame FM defining an opening F-OP and a mask sheet MS attached to the frame FM. The mask sheet MS may be attached to (e.g., welded to) the frame to overlap with the opening F-OP. The mask sheet MS may include a first element E1 and a second element E2 defining a plurality of deposition openings M-OP. In embodiments of the inventive concept, the first element E1, as a longitudinal element, is longer than the second element E2, as a transverse element. However, the inventive concept is not limited thereto.
[0088] The first element E1 and the second element E2 can intersect and be integrated with each other. In embodiments of the inventive concept, the first element E1 can both extend in the first direction DR1, and the second element E2 can both extend in the second direction DR2. The frame FM and the mask MS can comprise the same material, for example, Invar alloy. Since the frame FM and the mask MS have the same coefficient of thermal expansion, deformation of the mask MSK during the deposition process can be reduced. However, the inventive concept is not limited to the material of each of the frame FM and the mask MS. In embodiments of the inventive concept, the frame FM can be omitted. The shape of the mask MS can be maintained by increasing the thickness of the outer elements of the mask MS.
[0089] Multiple masks can be used to create a reference. Figures 1 to 3 The described display device DD. Although shown is for illustrating the basic shape of the mask MSK. Figure 6 However, all multiple masks can be combined with Figure 6 The mask (MSK) differs from the one used in the study. For example, a mask may include deposition openings with different surface areas. Additionally, a mask may include deposition openings with different shapes.
[0090] Reference Figure 7A The description includes a first mask MSK1 and a second mask MSK2 with deposition openings M-OP1 and M-OP2 of different shapes. Deposition openings M-OP1 and M-OP2 can correspond to cell regions UA. The first mask MSK1 can be used to provide a reference. Figures 4A to 4C The second electrode CE and the second mask MSK2 described can be used to provide a reference. Figures 4A to 4C The protective layer CPL is described. Although in this embodiment the first mask MSK1 is described as being used to deposit a metallic material as a first material and the second mask MSK2 is described as being used to deposit an organic material as a second material, the inventive concept is not limited thereto.
[0091] The first mask MS1 includes a first element E1-1 and a second element E2-1, and the second mask MS2 includes a first element E1-2 and a second element E2-2. In the following description, for ease of description, the first element E1-2 and the second element E2-2 of the second mask MS2 will be described as the third element and the fourth element, respectively. Each of the deposition openings M-OP1 of the first mask MSK1 may have a different surface area than each of the deposition openings M-OP2 of the second mask MSK2. The surface area difference causes a difference in surface area between the edge of the protective layer CPL and the edge of the second electrode CE. Figure 4A The distance shown. When each of the deposition openings M-OP1 of the first mask MSK1 has a first surface area, each of the deposition openings M-OP2 of the second mask MSK2 may have a second surface area that is slightly larger than the first surface area.
[0092] like Figure 7A As shown, the concave region CCA is defined in the first element E1-1, and the convex region CVA is defined in the third element E1-2. The concave region CCA and the convex region CVA are positioned at corresponding locations. When the first mask MS1 and the second mask MS2 are aligned with each other, the concave region CCA and the convex region CVA are aligned on the same line. When the concave region CCA and the convex region CVA are aligned on one line, the concave region CCA and the convex region CVA positioned on the other line are also aligned.
[0093] When using the first mask MSK1 in Figure 5 In the deposition equipment FA, when depositing metallic material on the working substrate WS, the convex region CE-C of the second electrode CE is configured to correspond to the concave region CCA of the first element E1-1. When depositing organic material on the working substrate WS in a different deposition equipment FA using the second mask MSK2, the concave region CPL-C of the protective layer CPL is configured to correspond to the convex region CVA of the third element E1-2.
[0094] Despite Figure 4A The first mask MSK1 and the second mask MSK2 shown are described as being used to provide a second region R2 in a region extending along the first direction DR1. However, in order to provide a second region R2 in a region extending along the second direction DR2, a concave region CCA and a convex region CVA can be provided for the second element E2-1 of the first mask MS1 and the fourth element E2-2 of the second mask MS2, respectively.
[0095] like Figure 7B As shown, multiple concave regions CCA can be disposed in each of the deposition openings M-OP1, and multiple convex regions CVA can be disposed in each of the deposition openings M-OP2. Here, two concave regions CCA and two convex regions CVA are shown as an example.
[0096] In addition, Figure 6 The mask MSK, which includes the first element E1 and the second element E2 of the linear type, can be used to provide a reference. Figures 4A to 4C The first encapsulation inorganic layer IOL1 and / or the second encapsulation inorganic layer IOL2 are described. Since each of the first encapsulation inorganic layer IOL1 and / or the second encapsulation inorganic layer IOL2 does not include an inspection area, recessed or raised areas are not necessary in the mask MSK used to provide the first encapsulation inorganic layer IOL1 and the second encapsulation inorganic layer IOL2. In other words, each of the first element E1 and the second element E2 can have a uniform width.
[0097] Figure 8A This is an enlarged plan view showing a portion of a first mask according to an embodiment of the inventive concept. Figure 8B This illustrates an embodiment based on the inventive concept. Figure 8A A cross-sectional view of a portion of the first mask. Figure 8B It shows along Figure 8A The cross section taken by line IV-IV'. Figure 9A This is an enlarged plan view showing a portion of a second mask according to an embodiment of the inventive concept. Figure 9B This illustrates an embodiment based on the inventive concept. Figure 9A A cross-sectional view of a portion of the second mask. Figure 9B It shows along Figure 9A The cross section taken by line V-V'.
[0098] like Figure 8A and Figure 8B As shown, the first element E1-1 of the first mask MSK1 may include a first region E1-1A and a second region E1-1B with different thicknesses. The first region E1-1A may have a first thickness, and the second region E1-1B may have a second thickness less than the first thickness. A recessed region CCA is disposed on the side of the first region E1-1A opposite to the second region E1-1B. The edge defining the recessed region CCA includes a curved region in the plane.
[0099] like Figure 9A and Figure 9B As shown, the third element E1-2 of the second mask MSK2 may include a first region E1-2A and a second region E1-2B with different thicknesses. The first region E1-2A may have a first thickness, and the second region E1-2B may have a second thickness less than the first thickness. A convex region CVA is disposed in the first region E1-2A. The edge defining the convex region CVA includes a curved region in a plane. The curved region can be obtained by processing a metal sheet using a laser.
[0100] Since each of the first mask MSK1 and the second mask MSK2 includes a second region E1-1B or E1-2B, the contact area between the working substrate WS and each of the first mask MSK1 and the second mask MSK2 can be reduced. (Refer to...) Figure 5 A portion of each of the first mask MSK1 and the second mask MSK2 may be spaced apart from the working substrate WS, rather than the entire mask contacting the working substrate WS. As the contact area between the mask and the working substrate WS decreases, the thermal deformation of the mask can be reduced.
[0101] According to embodiments of the inventive concept, each of the second element E2-1 of the first mask MSK1 and the fourth element E2-2 of the second mask MSK2 may include regions with different thicknesses. In other words, at least one of the longitudinal and transverse elements of each of the first mask MSK1 and the second mask MSK2 may have regions with different thicknesses. In embodiments of the inventive concept, the longitudinal and transverse elements of each of the first mask MSK1 and the second mask MSK2 may have the same thickness as each other.
[0102] According to an embodiment of the inventive concept, the deposition apparatus FA may include a third mask configured to deposit a third material on each of the cell regions UA of the working substrate WS. The third mask may include fifth and sixth elements that may define a plurality of third deposition openings corresponding to the cell regions UA. Each of the fifth elements may have a uniform width, and each of the sixth elements may have a uniform width.
[0103] As described above, the edges of the stacked structure in the inspection area can be examined to determine whether defects in the encapsulated organic layer OL have occurred by using naked-eye inspection.
[0104] Because the convex region CE-C is located within the second electrode CE, the noise shielding area of the second electrode CE is not reduced. Therefore, noise caused by signals generated from the display panel can be prevented.
[0105] In addition, since the recessed area CPL-C is disposed in the protective layer CPL, which serves as the organic layer, the recessed area CPL-C can be fully sealed by the first encapsulation inorganic layer IOL1.
[0106] Although the inventive concept has been shown and described with reference to exemplary embodiments thereof, it will be apparent to those skilled in the art that various modifications in form and detail may be made therein without departing from the spirit and scope of the inventive concept as set forth in the appended claims.
Claims
1. A display device, the display device comprising: The substrate layer, in a plane, includes a display area and a non-display area disposed outside the display area; The first electrode is disposed on the display area; A light-emitting layer is disposed on the first electrode; The second electrode is stacked with the display area and the non-display area and disposed on the light-emitting layer; A protective layer is superimposed on the display area and the non-display area and disposed on the second electrode; as well as A thin-film encapsulation layer, stacked on top of the display area and the non-display area, is disposed on the protective layer and includes an encapsulation organic layer. The non-display area includes a first area and a second area. In the first region, the edge of the encapsulated organic layer is spaced apart from the edge of the second electrode by a first distance, and the edge of the encapsulated organic layer is spaced apart from the edge of the protective layer by a second distance. In the second region, the edge of the encapsulating organic layer is disposed between the edge of the second electrode and the edge of the protective layer. In the second region, the edge of the encapsulated organic layer is spaced a third distance from the edge of the second electrode, and the edge of the encapsulated organic layer is spaced a fourth distance from the edge of the protective layer. The third distance is greater than the first distance, and The fourth distance is greater than the second distance.
2. The display device as claimed in claim 1, wherein, In both the first and second regions, the edges of the encapsulated organic layer are linear.
3. The display device as claimed in claim 1, wherein, The edge of the protective layer includes a recessed area in the second region that faces the display area, and The edge of the second electrode in the second region includes a convex region that protrudes toward the edge of the substrate layer.
4. The display device as claimed in claim 3, wherein, The recessed area at the edge of the protective layer has a maximum width of less than or equal to 200 μm in the second region, and The convex region of the edge of the second electrode has a maximum width of less than or equal to 200 μm in the second region.
5. The display device as claimed in claim 1, wherein, In the first region, the edge of the protective layer is configured to be closest to the edge of the substrate layer among the edges of the second electrode, the protective layer, and the encapsulating organic layer. In the first region, the edge of the encapsulated organic layer is configured to be the furthest from the edge of the substrate layer among the edges of the second electrode, the protective layer, and the encapsulated organic layer.
6. The display device as claimed in claim 1, wherein, The thin-film encapsulation layer further includes a first encapsulation inorganic layer and a second encapsulation inorganic layer, and the encapsulation organic layer is disposed between the first encapsulation inorganic layer and the second encapsulation inorganic layer in the thickness direction of the substrate layer.
7. The display device as claimed in claim 6, wherein, The edges of the first and second encapsulated inorganic layers are linear in the first and second regions, respectively.
8. The display device as claimed in claim 6, wherein, Each of the edges of the first encapsulated inorganic layer and the second encapsulated inorganic layer is closer to the edge of the substrate layer in the first region and the second region than the edge of the encapsulated organic layer.
9. The display device as claimed in claim 1, wherein, The protective layer comprises organic materials.
10. A display device, the display device comprising: The substrate layer, in a plane, includes a display area and a non-display area disposed outside the display area; The first electrode is disposed on the display area; The light-emitting layer is configured to correspond to the first electrode; The second electrode is stacked with the display area and the non-display area and disposed on the light-emitting layer; A protective layer is superimposed on the display area and the non-display area and disposed on the second electrode; as well as A thin-film encapsulation layer, stacked with the display area and the non-display area, includes a first encapsulation inorganic layer, an encapsulation organic layer disposed on the first encapsulation inorganic layer, and a second encapsulation inorganic layer disposed on the encapsulation organic layer. In the non-display area, the edge of the protective layer includes a recessed area that faces the display area, and the edge of the second electrode includes a convex area that faces the edge of the substrate layer. The recessed area and the convex area are aligned with each other in a first direction, and in the first direction, the edge of the encapsulating organic layer is disposed between the edge of the recessed area of the edge of the protective layer and the edge of the convex area of the edge of the second electrode.
11. A manufacturing apparatus, the manufacturing apparatus comprising: A first mask is configured to deposit a first material on each of the cell regions of the working substrate; as well as A second mask is configured to deposit a second material on each of the cell regions of the working substrate. The first mask includes a first mask sheet comprising a first element and a second element, wherein the first element and the second element define a plurality of first deposition openings corresponding to the cell region. The second mask includes a second mask sheet comprising a third element and a fourth element, wherein the third element and the fourth element define a plurality of second deposition openings corresponding to the cell region. The first element and the third element both extend in a first direction, and the second element and the fourth element both extend in a second direction intersecting the first direction. On the plane, recesses are provided in at least each of the first elements or in at least each of the second elements, and On the plane, convex regions are disposed at positions corresponding to the concave regions in at least each of the third elements or in at least each of the fourth elements.
12. The manufacturing equipment as claimed in claim 11, wherein, The first mask also includes a first frame attached to the first mask sheet, and The second mask also includes a second frame attached to the second mask sheet.
13. The manufacturing equipment as claimed in claim 12, wherein, The first mask and the first frame are made of the same material.
14. The manufacturing equipment as claimed in claim 11, wherein, At least the first element or at least the second element includes a first region having a first thickness and a second region having a second thickness less than the first thickness.
15. The manufacturing equipment as claimed in claim 14, wherein, The recessed area is located on the side of the first area opposite to the second area.
16. The manufacturing equipment as claimed in claim 11, wherein, Each of the first elements has a length greater than that of each of the second elements.
17. The manufacturing equipment as claimed in claim 11, wherein, Each of the plurality of first deposition openings has a first surface area, and each of the plurality of second deposition openings has a second surface area different from the first surface area.
18. The manufacturing equipment as claimed in claim 11, wherein, The first material includes metallic materials, and the second material includes organic materials.
19. The manufacturing apparatus of claim 11, further comprising a third mask configured to deposit a third material on each of the cell regions of the working substrate. in, The third mask includes a fifth element and a sixth element, and the fifth element and the sixth element define a plurality of third deposition openings corresponding to the cell region.
20. The manufacturing equipment as claimed in claim 19, wherein, Each of the fifth elements has a uniform width, and each of the sixth elements has a uniform width.