Bonding structure and display device

Abstract

The present invention discloses a bonding structure and a display device, the bonding structure comprising: a first substrate, a plurality of first electrodes arranged at intervals are arranged on one side of the first substrate; a second substrate, a plurality of second electrodes are arranged on the side of the second substrate opposite to the first electrodes, and each second electrode is arranged at intervals through an insulating layer, and a plurality of first grooves are arranged on the insulating layer; a conductive adhesive layer, the conductive adhesive layer is at least filled between the opposite first and second electrodes, between the first substrate and the insulating layer, and filled in the first grooves. The contact area between the conductive adhesive layer and the insulating layer is increased, thereby increasing the adhesion between the conductive adhesive layer and the insulating layer; the movement of the conductive adhesive layer is limited by the first groove, thereby improving the stability and reliability of the connection between the first substrate and the second substrate.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic products, and in particular relates to a bonding structure and a display device. Background Art

[0002] With the advancement of technology, digital display devices such as smart phones and tablet computers have been widely used, among which the display screen is an indispensable interpersonal communication interface in these display devices. OLED (Organic Light Emitting Diode) display panels have the advantages of self-luminescence, energy saving and consumption reduction, bendability, good flexibility, etc., and the display device that realizes display does not require a backlight source, has the characteristics of fast response speed and good display effect, and has attracted the attention of users and is widely used in terminal products such as smart phones and tablet computers.

[0003] The bonding process realizes the electrical connection between the array substrate and the FPC (flexible printed circuit) through ACF (anisotropic conductive adhesive). However, due to the limitations of the existing bonding structure, problems such as falling off and peeling off are prone to occur between the array substrate and the ACF.

[0004] Therefore, a new bonding structure and display device are urgently needed. Summary of the invention

[0005] An embodiment of the present invention provides a bonding structure and a display device. On the one hand, a plurality of first grooves are provided on the insulating layer so that the conductive adhesive layer is filled in the first grooves, thereby increasing the contact area between the conductive adhesive layer and the insulating layer, thereby increasing the adhesion between the conductive adhesive layer and the insulating layer, and improving the stability and reliability of the connection between the first substrate and the second substrate.

[0006] On the one hand, an embodiment of the present invention provides a bonding structure, including: a first substrate, on one side of which a plurality of first electrodes are provided at intervals; a second substrate, on a side of the second substrate opposite to the first electrodes, a plurality of second electrodes are provided, and each of the second electrodes is spaced apart by an insulating layer, and at least one first groove is provided on the insulating layer; and a conductive adhesive layer, the conductive adhesive layer is at least filled between the first and second electrodes opposite to each other, between the first substrate and the insulating layer, and filled in the first groove.

[0007] According to one aspect of the present invention, in a plane parallel to the plane where the second substrate is located, a cross-sectional area of ​​an end of the first groove close to the second substrate is larger than a cross-sectional area of ​​an end of the first groove away from the second substrate.

[0008] According to one aspect of the present invention, at least two first grooves are arranged on the insulating layer between two adjacent second electrodes.

[0009] According to one aspect of the present invention, a second groove is provided on the surface of the first electrode facing the second substrate, and the second groove is filled with the conductive adhesive layer; and / or a third groove is provided on the surface of the second electrode facing the first substrate, and the third groove is filled with the conductive adhesive layer.

[0010] According to one aspect of the present invention, when a second groove is provided on the surface of the first electrode facing the second substrate, the cross-sectional area of ​​the second groove gradually decreases in the direction from the first substrate to the second substrate; or, when a third groove is provided on the surface of the second electrode facing the first substrate, the cross-sectional area of ​​the third groove gradually increases in the direction from the first substrate to the second substrate.

[0011] According to one aspect of the present invention, when a third groove is provided on the surface of the second electrode facing the first substrate, the second groove and the third groove are arranged opposite to each other, and the cross-sectional areas of the second groove and the third groove on the opposite sides are equal.

[0012] According to one aspect of the present invention, the first groove, the second groove and the third groove are all trapezoidal grooves; preferably, the trapezoidal groove is an isosceles trapezoidal groove.

[0013] According to one aspect of the present invention, one of the first electrode and the second electrode relative to each other is provided with a fourth groove, and the other of the first electrode and the second electrode matches the fourth groove to be snapped into the fourth groove.

[0014] According to one aspect of the present invention, a plurality of conductive wires are disposed in the insulating layer, each conductive wire is electrically connected to the second electrode, and an orthographic projection of the conductive wire on the second substrate does not overlap with an orthographic projection of the first groove on the second substrate.

[0015] According to one aspect of the present invention, in a direction parallel to the plane where the second substrate is located, a width of the first groove is 5 μm to 30 μm.

[0016] Another aspect of an embodiment of the present invention provides a display device, comprising the bonding structure of any one of the above embodiments.

[0017] Compared with the prior art, the bonding structure provided in the embodiment of the present invention includes a first substrate, a first electrode, a second substrate, a second electrode, an insulating layer and a conductive adhesive layer. The conductive adhesive layer is used to bond and fix the first substrate and the second substrate, and realize the electrical connection between the first electrode and the second electrode. In this embodiment, on the one hand, by providing a plurality of first grooves on the insulating layer so that the conductive adhesive layer is filled in the first grooves, the contact area between the conductive adhesive layer and the insulating layer is increased, thereby increasing the adhesion between the conductive adhesive layer and the insulating layer, effectively preventing the conductive adhesive layer from detaching from the first grooves, and improving the stability and reliability of the connection between the first substrate and the second substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments of the present invention are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 It is a structural schematic diagram of a bonding structure provided by an embodiment of the present invention;

[0020] Figure 2 is a structural schematic diagram of another bonding structure provided by an embodiment of the present invention;

[0021] Figure 3 is a structural schematic diagram of another bonding structure provided by an embodiment of the present invention;

[0022] Figure 4 It is a structural schematic diagram of another bonding structure provided by an embodiment of the present invention.

[0023] In the attached figure:

[0024] 1-first substrate; 2-first electrode; 3-second substrate; 4-second electrode; 5-insulating layer; 6-conductive adhesive layer; 61-conductive particles; 7-conducting wire; K1-first groove; K2-second groove; K3-third groove; K4-fourth groove. DETAILED DESCRIPTION

[0025] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by illustrating examples of the present invention.

[0026] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0027] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0028] It is obvious to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention. Therefore, the present invention is intended to cover modifications and variations of the present invention that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of the present invention can be combined with each other without contradiction.

[0029] The embodiment of the present invention provides a bonding structure and a display device, which will be described below in conjunction with the accompanying drawings. Figures 1 to 4 Various embodiments of the bonding structure and the display device are described.

[0030] See also Figure 1 , Figure 1: is a structural schematic diagram of a bonding structure provided by an embodiment of the present invention. The embodiment of the present invention provides a bonding structure, comprising: a first substrate 1, a plurality of first electrodes 2 arranged at intervals are provided on one side of the first substrate 1; a second substrate 3, a plurality of second electrodes 4 are provided on the side of the second substrate 3 opposite to the first electrodes 2, and each second electrode 4 is arranged at intervals by an insulating layer 5, and a plurality of first grooves K1 are provided on the insulating layer 5; a conductive adhesive layer 6, the conductive adhesive layer 6 is at least filled between the opposite first electrodes 2 and the second electrodes 4, between the first substrate 1 and the insulating layer 5, and filled in the first grooves K1.

[0031] The bonding structure provided in the embodiment of the present invention includes a first substrate 1, a first electrode 2, a second substrate 3, a second electrode 4, an insulating layer 5 and a conductive adhesive layer 6. The conductive adhesive layer 6 is used to bond and fix the first substrate 1 and the second substrate 3, and realize the electrical connection between the first electrode 2 and the second electrode 4. In this embodiment, on the one hand, by providing a plurality of first grooves K1 on the insulating layer 5 so that the conductive adhesive layer 6 is filled in the first grooves K1, the contact area between the conductive adhesive layer 6 and the insulating layer 5 is increased, thereby increasing the adhesion between the conductive adhesive layer 6 and the insulating layer 5, effectively preventing the conductive adhesive layer 6 from detaching from the first grooves K1, and improving the stability and reliability of the connection between the first substrate 1 and the second substrate 3.

[0032] The first groove K1 can be formed by etching, side engraving and other processes without special limitation.

[0033] In this embodiment, since the adjacent first electrodes 2 and the adjacent second electrodes 4 are usually insulated from each other, in order to avoid signal interference between the adjacent first electrodes 2 and the adjacent second electrodes 4, conductive particles 61 can be set in the conductive adhesive layer 6 to achieve electrical connection between the relative first electrodes 2 and the second electrodes 4, and the conductive particles 61 between the relative first electrodes 2 and the second electrodes 4 are pressed to achieve conduction, that is, the conductive adhesive layer 6 between the adjacent first electrodes 2 and the adjacent second electrodes 4 is insulated. Specifically, the conductive adhesive layer 6 is ACF (Anisotropic Conductive Film, anisotropic conductive film), and the conductive particles 61 are used to connect the electrodes between the first substrate 1 and the second substrate 3 to make them conductive, while avoiding short circuit between the adjacent two electrodes, so as to achieve the purpose of conducting only in the direction perpendicular to the plane where the first substrate 1 is located. The types of conductive particles 61 are mainly metal powders and metals coated on the surface of polymer plastic balls. Commonly used metal powders are Ni (nickel), Au (gold), gold plated on nickel, silver and tin alloys, etc.

[0034] Optionally, the first substrate 1 is an FPC (Flexible Printed Circuit) with an IC control chip. The FPC can be made of materials such as polyimide or polyester film. The second substrate 3 can be a base substrate of a display device. The base substrate can be a hard substrate, such as a glass substrate; it can also be a flexible substrate, and its material can be polyimide, polystyrene, polyethylene terephthalate, polyparaxylene, polyethersulfone or polyethylene naphthalate. The base substrate is mainly used to support the device arranged thereon. The base substrate can be a single-layer base substrate to save costs, and a double-layer base substrate can be used to improve the water and oxygen barrier performance.

[0035] It should be noted that the insulating layer 5 disposed on the second substrate 3 may be made of inorganic materials such as silicon nitride, silicon oxide or silicon oxynitride, and is specifically used to achieve insulation between adjacent second electrodes 4 and insulation between the second electrodes 4 and other wires 7 .

[0036] In order to further improve the stability and reliability of the connection between the first substrate 1 and the second substrate 3, in some optional embodiments, in a plane parallel to the plane where the second substrate 3 is located, the cross-sectional area of ​​the first groove K1 at one end close to the second substrate 3 is larger than the cross-sectional area of ​​the first groove K1 at one end away from the second substrate 3.

[0037] In this embodiment, the cross-sectional area of ​​the first groove K1 at one end close to the second substrate 3 is set to be larger than the cross-sectional area of ​​the first groove K1 at one end away from the second substrate 3, that is, the first groove K1 is set to a structure with a larger bottom surface and a smaller top surface and a side surface that is at least partially inclined, so as to limit the movement of the conductive adhesive layer 6 through the side surface of the first groove K1, effectively preventing the conductive adhesive layer 6 from detaching from the first groove K1, and further improving the stability and reliability of the connection between the first substrate 1 and the second substrate 3.

[0038] In order to further improve the stability and reliability of the connection between the first substrate 1 and the second substrate 3 , in some optional embodiments, at least two first grooves K1 are provided on the insulating layer 5 between two adjacent second electrodes 4 .

[0039] It can be understood that, the more the number of first grooves K1 provided on the insulating layer 5 between two adjacent second electrodes 4 is, the greater the adhesive force between the conductive adhesive layer 6 and the first groove K1 is, that is, the conductive adhesive layer 6 is less likely to be separated from the insulating layer 5 of the first substrate 1, but if the number of first grooves K1 is too large, the insulating effect of the insulating layer 5 may be affected. Optionally, two first grooves K1 are provided on the insulating layer 5 between two adjacent second electrodes 4.

[0040] See also Figure 2In order to improve the connection effect between the relative first electrode 2 and the second electrode 4 and avoid the problem that the conductive adhesive layer 6 provided on the relative first electrode 2 and the second electrode 4 falls off after long-term use, thereby affecting the signal transmission between the relative first electrode 2 and the second electrode 4, in some optional embodiments, a second groove K2 is provided on the surface of the first electrode 2 facing the second substrate 3, and the second groove K2 is filled with the conductive adhesive layer 6; and / or a third groove K3 is provided on the surface of the second electrode 4 facing the first substrate 1, and the third groove K3 is filled with the conductive adhesive layer 6.

[0041] It should be noted that since the second groove K2 and the third groove K3 can be filled with the conductive adhesive layer 6, the contact area between the conductive adhesive layer 6 and the first electrode 2 and the second electrode 4 is effectively increased, thereby improving the adhesion between the conductive adhesive layer 6 and the first electrode 2 and the second electrode 4.

[0042] Optionally, when a second groove K2 is provided on the surface of the first electrode 2 on the side facing the second substrate 3, the cross-sectional area of ​​the second groove K2 gradually decreases in the direction from the first substrate 1 to the second substrate 3; or, when a third groove K3 is provided on the surface of the second electrode 4 on the side facing the first substrate 1, the cross-sectional area of ​​the third groove K3 gradually increases in the direction from the first substrate 1 to the second substrate 3.

[0043] It can be understood that, in the direction from the first substrate 1 to the second substrate 3, the cross-sectional area of ​​the second groove K2 gradually decreases, and the cross-sectional area of ​​the third groove K3 gradually increases. The second groove K2 and the third groove K3 can prevent the conductive adhesive layer 6 in the second groove K2 and the third groove K3 from detaching, thereby further improving the reliability of bonding between the first electrode 2 and the second electrode 4.

[0044] It should be noted that when the first groove K1 is not provided on the insulating layer 5, a second groove K2 may be provided on the surface of the first electrode 2 facing the second substrate 3, and / or a third groove K3 may be provided on the surface of the second electrode 4 facing the first substrate 1, that is, the second groove K2 and the third groove K3 may be provided at the same time, or the second groove K2 or the third groove K3 may be provided separately, without special limitation. In some optional embodiments, when the third groove K3 is provided on the surface of the second electrode 4 facing the first substrate 1, the second groove K2 and the third groove K3 are provided opposite to each other, and the cross-sectional areas of the opposite sides of the second groove K2 and the third groove K3 are equal.

[0045] It can be understood that the second groove K2 and the third groove K3 are arranged opposite to each other, and the cross-sectional areas of the second groove K2 and the third groove K3 on the opposite side are equal, which can improve the symmetry of the adhesion between the conductive adhesive layer 6 and the first electrode 2 and the second electrode 4, and avoid excessive force on one electrode causing the conductive adhesive layer 6 to detach. Optionally, the second groove K2 and the third groove K3 have the same shape and size to improve symmetry and ensure uniform force.

[0046] In some optional embodiments, the first groove K1, the second groove K2, and the third groove K3 are all trapezoidal grooves; it can be understood that the hypotenuse of the trapezoid can not only increase the connection area with the conductive adhesive layer 6, but also play a role in preventing the conductive adhesive layer 6 from escaping from the first groove K1, the second groove K2, and the third groove K3. In order to further improve the symmetry of the blocking effect of the first groove K1, the second groove K2, and the third groove K3 on the conductive adhesive layer 6 and ensure that the conductive adhesive layer 6 is subjected to uniform force, the trapezoidal groove is optionally an isosceles trapezoidal groove.

[0047] See also Figure 3 In order to improve the reliability and stability of the connection between the first electrode 2 and the second electrode 4, in some optional embodiments, one of the relative first electrode 2 and the second electrode 4 is provided with a fourth groove K4, and the other of the first electrode 2 and the second electrode 4 matches the fourth groove K4 to be snapped into the fourth groove K4.

[0048] It should be noted that, by providing the fourth groove K4, the first electrode 2 and the second electrode 4 that are opposite to each other can be mutually engaged. For example, when the second electrode 4 is provided with the fourth groove K4, the shape of the first electrode 2 that is opposite to the second electrode 4 matches the fourth groove K4, and can be engaged and engaged in the fourth groove K4. The movement of the first electrode 2 is limited by the fourth groove K4, so as to improve the reliability of the connection between the first electrode 2 and the second electrode 4 that are opposite to each other. Specifically, the fourth groove K4 is provided in a regular trapezoidal shape, and the first electrode 2 is provided in a matching inverted trapezoidal shape. The respective sides of the fourth groove K4 and the first electrode 2 are mutually engaged, so as to limit the movement of the first electrode 2 and the second electrode 4 in a direction perpendicular to the plane where the second substrate 3 is located, and further improve the reliability of the connection between the first substrate 1 and the second substrate 3. Of course, the fourth groove K4 can also be provided on the first electrode 2, without special limitation.

[0049] When the first groove K1 is not provided on the insulating layer 5 , the fourth groove K4 may be provided on one of the first electrode 2 and the second electrode 4 without any special limitation. The fourth groove K4 is provided to improve the reliability of the connection between the first substrate 1 and the second substrate 3 .

[0050] See also Figure 4In order to achieve signal transmission and transmit the signal of the second electrode 4 to other components of the display device, in some optional embodiments, a plurality of wires 7 are arranged in the insulating layer 5, each wire 7 is electrically connected to the second electrode 4 respectively, and the orthographic projection of the wire 7 on the second substrate 3 and the orthographic projection of the first groove K1 on the second substrate 3 do not overlap.

[0051] It should be noted that, since the insulating layer 5 is required to separate and insulate the wire 7 from the second electrode 4 not connected to it, in order to avoid signal interference between the signal transmitted by the wire 7 and the second electrode 4 or the first electrode 2 not connected to it, the orthographic projection of the wire 7 on the second substrate 3 and the orthographic projection of the first groove K1 on the second substrate 3 do not overlap, that is, the opening position of the first groove K1 on the insulating layer 5 needs to avoid the wire 7 to avoid exposing the wire 7.

[0052] In some optional embodiments, the width of the first groove K1 is 5 μm to 30 μm in a direction parallel to the plane where the second substrate 3 is located. It is understandable that the width of the first groove K1 should not be too small, otherwise the effect of increasing the adhesion between the conductive adhesive layer 6 is not obvious, and it should not be too large, otherwise it may affect the insulation effect of the insulating layer 5. Optionally, the width of the first groove K1 is 15 μm.

[0053] The embodiment of the present invention further provides a display device, including the bonding structure in any of the above embodiments. Therefore, the display device provided by the embodiment of the present invention has the technical effect of the technical solution of the bonding structure in any of the above embodiments, and the explanation of the structure and terminology that are the same or corresponding to the above embodiments will not be repeated here. The bonding structure provided by the embodiment of the present invention can be a mobile phone, or any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop displays, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, medical equipment, industrial control equipment, touch interactive terminals, etc., and the embodiment of the present invention does not specifically limit this.

[0054] The above is only a specific implementation of the present invention. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present invention is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be covered within the protection scope of the present invention.

[0055] It should also be noted that the exemplary embodiments mentioned in the present invention describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiments, or in a different order from the embodiments, or several steps can be performed simultaneously.

Claims

1. A bonding structure, characterized in that: include: A first substrate, with a plurality of first electrodes spaced apart from each other provided on one side of the first substrate; a second substrate, a plurality of second electrodes being arranged on a side of the second substrate opposite to the first electrode, and each of the second electrodes being spaced apart by an insulating layer, the insulating layer being provided with at least one first groove, and in a plane parallel to a plane where the second substrate is located, a cross-sectional area of ​​the first groove at an end close to the second substrate is larger than a cross-sectional area of ​​the first groove at an end away from the second substrate; A conductive adhesive layer is filled at least between the first electrode and the second electrode, between the first substrate and the insulating layer, and in the first groove.

2. The bonding structure according to claim 1, characterized in that: A second groove is provided on a surface of the first electrode facing the second substrate, the cross-sectional area of ​​the second groove gradually decreases in a direction from the first substrate to the second substrate, and the second groove is filled with the conductive adhesive layer; and / or, A third groove is arranged on a surface of the second electrode facing the first substrate. The cross-sectional area of ​​the third groove gradually increases in a direction from the first substrate to the second substrate. The third groove is filled with the conductive adhesive layer.

3. The bonding structure according to claim 2, characterized in that: When a second groove is provided on a surface of the first electrode facing the second substrate, a cross-sectional area of ​​the second groove gradually decreases in a direction from the first substrate to the second substrate; or, When a third groove is provided on a surface of the second electrode facing the first substrate, a cross-sectional area of ​​the third groove gradually increases in a direction from the first substrate to the second substrate.

4. The bonding structure according to claim 2, characterized in that: When a third groove is arranged on a surface of the second electrode facing the first substrate, the second groove and the third groove are arranged opposite to each other, and the cross-sectional areas of the opposite sides of the second groove and the third groove are equal.

5. The bonding structure according to claim 4, characterized in that: The first groove, the second groove and the third groove are all trapezoidal grooves.

6. The bonding structure according to claim 5, characterized in that: The trapezoidal groove is an isosceles trapezoidal groove.

7. The bonding structure according to claim 1, characterized in that: One of the first electrode and the second electrode opposite to each other is provided with a fourth groove, and the other of the first electrode and the second electrode matches with the fourth groove to be snapped into the fourth groove.

8. The bonding structure according to claim 1, characterized in that: A plurality of conductive wires are arranged in the insulating layer, each conductive wire is electrically connected to the second electrode respectively, and the orthographic projection of the conductive wire on the second substrate does not overlap with the orthographic projection of the first groove on the second substrate.

9. The bonding structure according to claim 1, characterized in that: In a direction parallel to the plane where the second substrate is located, the maximum width of the first groove is 5 μm to 30 μm.

10. A display device, characterized in that: The invention comprises the bonding structure as claimed in any one of claims 1 to 9.

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