Optical Sensor, Fingerprint Recognition Module and Electronic Device
By adopting the optical path guidance structure of multiple optical filtering through holes in the optical fingerprint recognition technology, filtering part of the bands of the target optical signal, the problem of low security in the prior art is solved and higher fingerprint recognition security is achieved.
Patent Information
- Application Number
- CN202111250351.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-10-26
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2041-10-26
AI Technical Summary
The existing optical fingerprint recognition technology has low security problems and is vulnerable to attacks from fake fingers, which limits its promotion and application.
An optical sensor including a photosensitive sensor array and an optical path guidance structure is adopted. The optical path guidance structure is provided with a plurality of optical filtering through holes, and the size of the optical filtering through holes is micron-level and/or nano-level, and is used to filter part of the band of the target optical signal and improve the security of fingerprint recognition.
The spectral information of the optical signal through the target band is different from the spectral information of the return signal, and the specific band of the optical signal through the target band is not known to the outside world, making it difficult to forge it, which improves the security of optical fingerprint recognition.
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Figure CN114092982B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of optical fingerprint recognition technology. Specifically, it relates to an optical sensor, a fingerprint recognition module, and an electronic device. Background Art
[0002] With the advent of the full-screen era of electronic devices, fingerprint unlocking and payment application methods have gradually become popular, which has increased the application demand for optical fingerprint recognition. However, due to the problem of low security in optical fingerprint recognition, it is extremely vulnerable to attacks by fake fingers such as fingerprint stickers, ink fingerprints, and 3D silicone fingers. Therefore, to a certain extent, it also restricts the popularization and application of optical fingerprint recognition. Summary of the Invention
[0003] The purpose of this application is to provide an optical sensor, a fingerprint recognition module, and an electronic device to solve the problem of low security in the existing optical fingerprint recognition technology.
[0004] In a first aspect, the optical sensor provided by an embodiment of this application includes a photosensitive sensor array and an optical path guiding structure;
[0005] The optical path guiding structure includes a filter layer provided with a plurality of filter through-holes, the size of the filter through-holes is in the micron and / or nanometer range, and the optical path guiding structure is disposed above the photosensitive sensor array;
[0006] The target optical signal is incident on the optical path guiding structure. After the plurality of filter through-holes filter out some wavelength bands of the target optical signal, it is received by the photosensitive sensor array.
[0007] The optical sensor provided by an embodiment of this application includes a photosensitive sensor array and an optical path guiding structure. The optical path guiding structure includes a filter layer provided with a plurality of filter through-holes, and the size of the filter through-holes is in the micron and / or nanometer range. The optical path guiding structure is disposed above the photosensitive sensor array. Thus, based on the characteristic that the plurality of filter through-holes will filter out some wavelength bands of the complex optical signal, when the fingerprint recognition module applying this optical sensor is working, among the return signals formed by the optical signal incident on the finger, the target optical signal (belonging to the complex optical signal) corresponding to the position of the filter layer is incident on the optical path guiding structure, and then the plurality of filter through-holes will filter out some wavelength bands of the target optical signal, and the remaining unfiltered target wavelength band optical signal is then received by the photosensitive sensor array for fingerprint anti-counterfeiting recognition. Since the spectral information of the target wavelength band optical signal is different from the spectral information of the return signal formed by the optical signal incident on the finger, and the specific wavelength band of the target wavelength band optical signal is not known to the outside world, it is difficult to forge. Therefore, subsequent fingerprint anti-counterfeiting recognition through the target wavelength band optical signal can improve the security of optical fingerprint recognition.
[0008] In combination with the first aspect, the embodiments of the present application further provide a first alternative implementation manner of the first aspect, where multiple light filtering through-holes have at least two hole type structures.
[0009] In the above implementation manner, multiple light filtering through-holes have at least two hole type structures, which can meet the diverse selection requirements for the setting manner of the light filtering through-holes.
[0010] In combination with the first aspect, the embodiments of the present application further provide a second alternative implementation manner of the first aspect, where multiple light filtering through-holes form multiple groups of light filtering through-hole groups, and in at least one group of light filtering through-hole groups, each of the multiple light filtering through-holes included in each group of light filtering through-hole groups has the same hole type structure, and / or in at least one group of light filtering through-hole groups, each of the multiple light filtering through-holes included in each group of light filtering through-hole groups has different hole type structures.
[0011] In the above implementation manner, multiple light filtering through-holes form multiple groups of light filtering through-hole groups, and in at least one group of light filtering through-hole groups, each of the multiple light filtering through-holes included in each group of light filtering through-hole groups has the same hole type structure, and / or in at least one group of light filtering through-hole groups, each of the multiple light filtering through-holes included in each group of light filtering through-hole groups has different hole type structures. On the one hand, it can meet the diverse selection requirements for the setting manner of the light filtering through-holes. On the other hand, when the fingerprint recognition module applying this optical sensor is working, finally, multiple groups of target band light signals corresponding one-to-one to the multiple groups of light filtering through-hole groups will be obtained, and can be simultaneously applied to fingerprint anti-counterfeiting recognition, thereby further improving the security of optical fingerprint recognition.
[0012] In combination with the second alternative implementation manner of the first aspect, the embodiments of the present application further provide a third alternative implementation manner of the first aspect, where multiple light filtering through-holes form multiple groups of light filtering through-hole groups, and there are different hole type structures between at least two groups of light filtering through-hole groups.
[0013] In the above implementation manner, multiple light filtering through-holes form multiple groups of light filtering through-hole groups, and there are different hole type structures between at least two groups of light filtering through-hole groups. Then, when the fingerprint recognition module applying this optical sensor is working, finally, at least two groups of target band light signals with different bands corresponding one-to-one to at least two groups of light filtering through-hole groups will be obtained, and can be simultaneously applied to fingerprint anti-counterfeiting recognition, thereby further improving the security of optical fingerprint recognition.
[0014] In combination with the third alternative implementation manner of the first aspect, the embodiments of the present application further provide a fourth alternative implementation manner of the first aspect, where between any two groups of light filtering through-hole groups among multiple groups of light filtering through-hole groups, there are different hole type structures.
[0015] In the above embodiments, among the multiple groups of filter through-holes, there are different hole-type structures between any two groups of filter through-holes. Then, when the fingerprint recognition module using this optical sensor is working, ultimately, more groups of target band optical signals with different bands will be obtained and can be simultaneously applied to fingerprint anti-counterfeiting recognition, thereby further improving the security of optical fingerprint recognition.
[0016] Combined with any one of the first to fourth optional embodiments of the first aspect, the embodiments of the present application further provide a fifth optional embodiment of the first aspect, where the hole-type structure includes shape, size, and / or position arrangement mode.
[0017] Combined with the fifth optional embodiment of the first aspect, the embodiments of the present application further provide a sixth optional embodiment of the first aspect. A plurality of filter through-holes form multiple groups of filter through-holes. The position arrangement mode of the multiple filter through-holes included in each group of filter through-holes in at least one group of filter through-holes is arranged in an array manner.
[0018] Since the photosensitive surface of the photosensitive sensor is usually rectangular, therefore, in the multiple groups of filter through-holes, the position arrangement mode of the multiple filter through-holes included in each group of filter through-holes in at least one group of filter through-holes is arranged in an array manner, which can increase the matching degree between each group of filter through-holes in this at least one group of filter through-holes and the corresponding photosensitive sensor.
[0019] Combined with the fifth optional embodiment of the first aspect, the embodiments of the present application further provide a seventh optional embodiment of the first aspect. A plurality of filter through-holes form multiple groups of filter through-holes. The position arrangement mode of the multiple groups of filter through-holes is arranged in an array manner.
[0020] In an optical sensor, a plurality of photosensitive sensors are usually arranged in an array manner, that is, set as a photosensitive sensor array. Therefore, on the filter layer, the position arrangement mode of the multiple groups of filter through-holes being arranged in an array manner can increase the matching degree between the multiple groups of filter through-holes and the photosensitive sensor array, and at the same time, reduce the design and manufacturing complexity of the multiple groups of filter through-holes, thereby improving the manufacturing efficiency of the filter layer.
[0021] Combined with the fifth optional embodiment of the first aspect, the embodiments of the present application further provide an eighth optional embodiment of the first aspect. A plurality of filter through-holes form multiple groups of filter through-holes. The position arrangement mode of the multiple filter through-holes included in each group of filter through-holes in at least one group of filter through-holes is: a first filter through-hole is arranged at the middle position of the filter through-hole group, and a plurality of second filter through-holes are arranged around the first filter through-hole.
[0022] Combined with the eighth optional implementation manner of the first aspect, the embodiments of the present application further provide a ninth optional implementation manner of the first aspect, where the size of the first light filtering through-hole is larger than the size of the second light filtering through-hole.
[0023] Combined with the fifth optional implementation manner of the first aspect, the embodiments of the present application further provide a tenth optional implementation manner of the first aspect, where the shapes of the multiple light filtering through-holes include at least one of a circle, a triangle, a square, a parallelogram, a rhombus, a regular pentagon, and a regular hexagon.
[0024] Combined with the first aspect, or any one of the first to fourth optional implementation manners of the first aspect, the embodiments of the present application further provide an eleventh optional implementation manner of the first aspect, where the multiple light filtering through-holes form multiple groups of light filtering through-hole groups, and one group of light filtering through-hole groups corresponds to at least one photosensitive sensor in the photosensitive sensor array.
[0025] In the above implementation manner, the multiple light filtering through-holes form multiple groups of light filtering through-hole groups, and one group of light filtering through-hole groups corresponds to at least one photosensitive sensor in the photosensitive sensor array. In this way, it can be ensured that after the partial wavelength band of the target optical signal is filtered by the multiple light filtering through-holes included in this group of light filtering through-hole groups, the remaining unfiltered target wavelength band optical signal can be received by at least one photosensitive sensor, thereby further improving the security of optical fingerprint recognition.
[0026] Combined with the first aspect, or any one of the above optional implementation manners of the first aspect, the embodiments of the present application further provide a twelfth optional implementation manner of the first aspect, where the material of the light filtering layer is silicon.
[0027] Combined with the first aspect, or any one of the above optional implementation manners of the first aspect, the embodiments of the present application further provide a thirteenth optional implementation manner of the first aspect, where the optical path guiding structure further includes a focusing unit array disposed above the photosensitive sensor array, and at least one light shielding layer disposed between the photosensitive sensor array and the focusing unit array;
[0028] The light filtering layer is disposed above the focusing unit array;
[0029] Or, the light filtering layer is disposed between the focusing unit array and at least one light shielding layer;
[0030] Or, the light filtering layer is disposed between the photosensitive sensor array and at least one light shielding layer;
[0031] Or, the optical path guiding structure includes multiple light shielding layers, and the light filtering layer is disposed between any two of the multiple light shielding layers.
[0032] In the above implementation manner, the light filtering layer can have multiple setting manners. Therefore, it can meet the diversified design and manufacturing requirements of optical sensors.
[0033] Combined with the first aspect, or any of the above optional implementation manners of the first aspect, the embodiments of the present application further provide a fourteenth optional implementation manner of the first aspect. After filtering a partial wavelength band of the target optical signal through a plurality of filter through-holes, the target wavelength band optical signal received by the photosensitive sensor array is used for fingerprint anti-counterfeiting identification.
[0034] In a second aspect, the fingerprint recognition module provided by the embodiments of the present application includes an optical component and the optical sensor provided by the first aspect, or any of the optional implementation manners of the first aspect;
[0035] The optical component is disposed above the optical sensor.
[0036] The fingerprint recognition module provided by the embodiments of the present application has the same beneficial effects as the optical sensor provided by the first aspect, or any of the optional implementation manners of the first aspect, and will not be elaborated herein.
[0037] Combined with the second aspect, the embodiments of the present application further provide a first optional implementation manner of the second aspect. The optical component includes an imaging lens or an optical film layer.
[0038] In a third aspect, the embodiments of the present application further provide another fingerprint recognition module, including an optical component, an optical sensor, and a filter layer disposed between the optical component and the optical sensor. A plurality of filter through-holes are provided on the filter layer, and the size of the filter through-holes is in the micron scale and / or the nanometer scale;
[0039] After the target optical signal is incident from the optical component to the filter layer, a partial wavelength band of the target optical signal is filtered through a plurality of filter through-holes, and then received by the optical sensor.
[0040] The fingerprint recognition module provided by the embodiments of the present application includes an optical component, an optical sensor, and a filter layer disposed between the optical component and the optical sensor. A plurality of filter through-holes are provided on the filter layer, and the size of the filter through-holes is in the micron scale and / or the nanometer scale. Thus, based on the characteristic that a plurality of filter through-holes filter the optical signals of partial wavelength bands in the composite optical signal, when the fingerprint recognition module works, in the return signal formed by the optical signal incident on the finger, the target optical signal (belonging to the composite optical signal) corresponding to the position of the filter layer is incident on the optical path guiding structure, and then a partial wavelength band of the target optical signal is filtered through a plurality of filter through-holes, and the remaining unfiltered target wavelength band optical signal is received by the optical sensor for fingerprint anti-counterfeiting identification. Since the spectral information of the target wavelength band optical signal is different from the spectral information of the return signal formed by the optical signal incident on the finger, and the specific wavelength band of the target wavelength band optical signal is not known to the outside world, it is difficult to forge. Therefore, subsequent fingerprint anti-counterfeiting identification through the target wavelength band optical signal can improve the security of optical fingerprint recognition.
[0041] In combination with the third aspect, the embodiments of the present application further provide a first alternative implementation manner of the third aspect, where multiple light filtering through holes have at least two hole type structures.
[0042] In combination with the third aspect, the embodiments of the present application further provide a second alternative implementation manner of the third aspect, where multiple light filtering through holes form multiple groups of light filtering through hole groups, and in at least one group of light filtering through hole groups, each group of light filtering through holes included therein has the same hole type structure, and / or in at least one group of light filtering through hole groups, each group of light filtering through holes included therein has different hole type structures.
[0043] In combination with the second alternative implementation manner of the third aspect, the embodiments of the present application further provide a third alternative implementation manner of the third aspect, where multiple light filtering through holes form multiple groups of light filtering through hole groups, and there are different hole type structures between at least two groups of light filtering through hole groups.
[0044] In combination with any one of the first to third alternative implementation manners of the third aspect, the embodiments of the present application further provide a fourth alternative implementation manner of the third aspect, where the hole type structure includes shape, size, and / or position arrangement manner.
[0045] In combination with the fourth alternative implementation manner of the third aspect, the embodiments of the present application further provide a fifth alternative implementation manner of the third aspect, where multiple light filtering through holes form multiple groups of light filtering through hole groups, and in at least one group of light filtering through hole groups, the position arrangement manner of each group of light filtering through holes included therein is arranged in an array manner.
[0046] In combination with the fourth alternative implementation manner of the third aspect, the embodiments of the present application further provide a sixth alternative implementation manner of the third aspect, where multiple light filtering through holes form multiple groups of light filtering through hole groups, and the position arrangement manner of the multiple groups of light filtering through hole groups is arranged in an array manner.
[0047] In combination with the fourth alternative implementation manner of the third aspect, the embodiments of the present application further provide a seventh alternative implementation manner of the third aspect, where multiple light filtering through holes form multiple groups of light filtering through hole groups, and in at least one group of light filtering through hole groups, the position arrangement manner of each group of light filtering through holes included therein is: a first light filtering through hole is arranged at the middle position of the light filtering through hole group, and multiple second light filtering through holes are arranged around the first light filtering through hole.
[0048] In combination with the fourth alternative implementation manner of the third aspect, the embodiments of the present application further provide an eighth alternative implementation manner of the third aspect, where the shapes of the multiple light filtering through holes include at least one of a circle, a triangle, a square, a parallelogram, a rhombus, a regular pentagon, and a regular hexagon.
[0049] Combined with the third aspect, or any one of the first to third alternative embodiments of the third aspect, the embodiments of the present application further provide a ninth alternative embodiment of the third aspect, where multiple filter through-holes form multiple groups of filter through-hole groups, and one group of filter through-hole groups corresponds to at least one photosensitive sensor in the photosensitive sensor array included in the optical sensor.
[0050] Fourth aspect, the electronic device provided by the embodiments of the present application includes a display screen and a fingerprint recognition module disposed below the display screen;
[0051] The fingerprint recognition module includes an optical component and the optical sensor provided by the first aspect, or any one of the alternative embodiments of the first aspect, or the fingerprint recognition module is the fingerprint recognition module provided by the second aspect, the first alternative embodiment of the second aspect, the third aspect, or any one of the alternative embodiments of the third aspect.
[0052] The electronic device provided by the embodiments of the present application has the same beneficial effects as the optical sensor provided by the first aspect, or any one of the alternative embodiments of the first aspect, and the fingerprint recognition module provided by the second aspect, the first alternative embodiment of the second aspect, the third aspect, or any one of the alternative embodiments of the third aspect, which will not be elaborated here. Description of the Drawings
[0053] To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.
[0054] Figure 1 It is a schematic diagram of an application scenario of an existing fingerprint recognition module.
[0055] Figure 2 It is a schematic diagram of an application scenario of an optical sensor provided by the embodiments of the present application.
[0056] Figure 3 It is a schematic diagram of the structure of a photosensitive sensor array provided by the embodiments of the present application.
[0057] Figure 4 It is a schematic diagram of the structure of the first filter layer provided by the embodiments of the present application.
[0058] Figure 5 It is a schematic diagram of another application scenario of an optical sensor provided by the embodiments of the present application.
[0059] Figure 6Schematic diagram of the structure of the second filter layer provided by the embodiments of the present application.
[0060] Figure 7 Schematic diagram of the structure of the third filter layer provided by the embodiments of the present application.
[0061] Figure 8 Schematic diagram of the structure of the fourth filter layer provided by the embodiments of the present application.
[0062] Figure 9 Schematic diagram of the structure of the fifth filter layer provided by the embodiments of the present application.
[0063] Figure 10 Schematic diagram of the spectral information of an optical signal in a target wavelength band provided by the embodiments of the present application.
[0064] Figure 11 Schematic diagram of the structure of the sixth filter layer provided by the embodiments of the present application.
[0065] Figure 12 Schematic diagram of the structure of the seventh filter layer provided by the embodiments of the present application.
[0066] Figure 13 Schematic diagram of the structure of the eighth filter layer provided by the embodiments of the present application.
[0067] Figure 14 Schematic diagram of the first setting method of the filter layer provided by the embodiments of the present application.
[0068] Figure 15 Schematic diagram of the second setting method of the filter layer provided by the embodiments of the present application.
[0069] Figure 16 Schematic diagram of the third setting method of the filter layer provided by the embodiments of the present application.
[0070] Figure 17 Schematic diagram of the fourth setting method of the filter layer provided by the embodiments of the present application.
[0071] Figure 18 Schematic diagram of an application scenario of a fingerprint recognition module provided by the embodiments of the present application.
[0072] Figure 19 Schematic diagram of another application scenario of a fingerprint recognition module provided by the embodiments of the present application. Detailed implementation manners
[0073] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be described below in conjunction with the accompanying drawings in the embodiments of this application. In addition, it should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0074] Biometric technologies have been widely applied to various terminal devices or electronic devices. Biometric identification technologies include, but are not limited to, fingerprint recognition, palmprint recognition, vein recognition, iris recognition, face recognition, liveness recognition, anti-counterfeiting recognition, etc. Among them, fingerprint recognition usually includes optical fingerprint recognition, capacitive fingerprint recognition, and ultrasonic fingerprint recognition.
[0075] With the rise of the full-screen technology, the fingerprint recognition module can be set in a partial area or the entire area under the display screen, so as to form an under-display optical fingerprint recognition. Or, part or all of the optical fingerprint recognition module can be integrated into the display screen of the electronic device, so as to form an in-display optical fingerprint recognition. Among them, the display screen can be an organic light-emitting diode (OLED) display screen, a micro-light-emitting diode (Micro-LED) display screen, or a liquid crystal display (LCD), etc.
[0076] In addition, the fingerprint recognition method usually includes steps such as fingerprint image acquisition, preprocessing, feature extraction, and feature matching. Some or all of the above steps can be implemented by traditional computer vision (CV) algorithms or by deep learning algorithms based on artificial intelligence (AI). And fingerprint recognition technology can be applied to portable or mobile terminals such as smart phones, tablets, and gaming devices, as well as other electronic devices such as electronic databases, fingerprint locks, automobiles, and bank automated teller machines (ATMs) for fingerprint unlocking, fingerprint payment, fingerprint attendance, identity authentication, etc.
[0077] In the prior art, an electronic device 100 with a fingerprint recognition function usually includes a fingerprint recognition module 110 and a display screen 120. Take Figure 1Taking the electronic device 100 shown as an example, among which, the fingerprint recognition module 110 belongs to a non-ultra-thin module (for example, a lens module), and is disposed below the display screen 120. The fingerprint recognition module 110 includes a traditional optical sensor 111 and an imaging lens 112 disposed above the optical sensor 111. The optical sensor 111 includes a photosensitive sensor array 1111 and an optical path guiding structure 1112, and the optical path guiding structure 1112 is disposed above the photosensitive sensor array 1111.
[0078] When a user needs to perform fingerprint recognition through the electronic device 100, the finger is placed against the position corresponding to the fingerprint recognition module 110 above the display screen 120. After the optical signal emitted by the display screen 120 is incident on the finger, the reflected light formed by reflection on the finger surface and the scattered light (transmitted light) formed by scattering inside the finger will jointly serve as the return signal. Since the ridges and valleys of the fingerprint have different reflection capabilities for the optical signal, the return signal from the fingerprint ridge and the return signal from the fingerprint valley have different light intensities. After the return signal penetrates the display screen 120, it is then imaged through the imaging lens 112 (here, it can be understood as magnification processing of the fingerprint image, and the magnification factor is less than 1), and is guided to the photosensitive sensor array 1111 through the optical path guiding structure 1112, received by the photosensitive sensor array 1111, and then a fingerprint image for fingerprint recognition is obtained based on the return signal received by the photosensitive sensor array 1111 to complete fingerprint recognition.
[0079] Although the existing optical fingerprint recognition technology can meet the fingerprint recognition requirements, when it is attacked by fake fingers such as fingerprint stickers, ink fingerprints, and 3D silicone fingers, it does not have a defense function, so there is a problem of low security.
[0080] Please refer to Figure 2 , to solve the problem of low security of the optical fingerprint recognition technology in the existing technology, the present application provides an optical sensor 211, including a photosensitive sensor array 2111 and an optical path guiding structure 2112.
[0081] Please combine Figure 3 and Figure 4, in the embodiments of the present application, the photosensitive sensor array 2111 may be composed of a plurality of photosensitive sensors 21111 arranged in an array, and the photosensitive sensor 21111 may be a photodiode (PD). The optical path guiding structure 2112 includes a filter layer 21121 provided with a plurality of filter through holes 211211, and the size of the filter through holes 211211 is in the micron and / or nanometer range. Here, the size can be understood as the aperture of the filter through hole 211211 or the length of one side of the filter through hole 211211, etc., and the aperture can be the diameter of the circumscribed circle or inscribed circle of the filter through hole 211211. The optical path guiding structure 2112 is disposed above the photosensitive sensor array 2111. The plurality of filter through holes 211211 may be provided at corresponding positions above the edge region of the photosensitive sensor array 2111, or may be discretely distributed at corresponding positions above the entire region of the photosensitive sensor array 2111.
[0082] The optical sensor 211 provided by the embodiments of the present application is generally applied to the fingerprint recognition module 210, and the fingerprint recognition module 210 further needs to include an optical component 212, and the optical component 212 is disposed above the optical sensor 211. Among them, the optical component 212 may be an optical film layer or an imaging lens. If the optical component 212 is an optical film layer, the fingerprint recognition module 210 belongs to an ultra-thin module, specifically as Figure 2 shown. If the optical component 212 is an imaging lens, the fingerprint recognition module 210 belongs to a non-ultra-thin module, specifically as Figure 5 shown.
[0083] After applying the fingerprint recognition module 210 to the electronic device 200, when the user needs to perform fingerprint recognition through the electronic device 200, the finger is attached to the upper part of the display screen 220 in the electronic device 200 and at the position corresponding to the fingerprint recognition module 210. After the light signal emitted by the display screen 220 is incident on the finger, the reflected light formed by reflection on the finger surface and the scattered light (transmitted light) formed by scattering inside the finger will jointly serve as the return signal. Among them, the target light signal (belonging to a composite color light signal) corresponding to the position of the filter layer 21121 in the return signal, after penetrating the display screen 220, first undergoes imaging processing through the optical component 212, and then is incident on the optical path guiding structure 2112. After that, the optical path guiding structure 2112 filters out some bands of the target light signal through the plurality of filter through holes 211211, and the remaining unfiltered target band light signal is then received by the photosensitive sensor array 2111 for fingerprint anti-counterfeiting recognition. Since the spectral information of the target band light signal is different from the spectral information of the return signal formed by the light signal incident on the finger, and the specific band of the target band light signal is not known to the outside world, it is difficult to forge. Therefore, subsequent fingerprint anti-counterfeiting recognition through the target band light signal can improve the security of optical fingerprint recognition.
[0084] In the embodiments of the present application, multiple light filtering through-holes 211211 may have at least two hole type structures, so as to meet the diverse selection requirements for the setting modes of the light filtering through-holes. Among them, the hole type structures may include shapes, sizes, and / or position arrangement modes.
[0085] For example, some of the multiple light filtering through-holes 211211 included are rectangular through-holes with a size of 50nm * 50nm and are arranged in a rectangular array, while some other light filtering through-holes 211211 are rectangular through-holes with a size of 100nm * 100nm and are arranged in a rectangular array.
[0086] For another example, some of the multiple light filtering through-holes 211211 included are rectangular through-holes with a size of 50nm * 50nm and are arranged in a circular array, while some other light filtering through-holes 211211 are circular through-holes with a size of 100nm and are arranged in a rectangular array.
[0087] In addition, it should be noted that in the embodiments of the present application, the manufacturing material of the light filtering layer 21121 may be silicon, and when the thickness of the light filtering layer 21121 is determined, which specific wavelength band of the composite light signal can pass through the multiple light filtering through-holes 211211 without being filtered can be determined by the shapes, sizes, and / or position arrangement modes of the multiple light filtering through-holes 211211. Among them, the shapes of the multiple light filtering through-holes 211211 may include at least one of a circle, a triangle, a square, a parallelogram, a rhombus, a regular pentagon, and a regular hexagon.
[0088] Based on the above description, in order to further improve the security of optical fingerprint recognition while meeting the diverse selection requirements for the setting modes of the light filtering through-holes 211211, in the embodiments of the present application, multiple light filtering through-holes 211211 may form multiple groups of light filtering through-hole groups 211212. In at least one group of light filtering through-hole groups 211212, each group of light filtering through-hole groups 211212 includes multiple light filtering through-holes 211211 with the same hole type structure, and / or in at least one group of light filtering through-hole groups 211212, each group of light filtering through-hole groups 211212 includes multiple light filtering through-holes 2112112 with different hole type structures.
[0089] Please refer to Figure 6 For the case where in at least one group of light filtering through-hole groups 211212 among multiple groups of light filtering through-hole groups 211212, each group of light filtering through-hole groups 211212 includes multiple light filtering through-holes 211211 with the same hole type structure. Exemplarily, multiple light filtering through-holes 211211 may form four groups of light filtering through-hole groups 211212, and each group of light filtering through-hole groups 211212 includes multiple light filtering through-holes 211211 with the same hole type structure.
[0090] Please combine with Figure 7 Figure 7 , for the case where, among multiple groups of light filtering through-hole groups 211212, each of the multiple light filtering through-holes 211211 included in at least one group of light filtering through-hole groups 211212 has a different hole shape structure. Exemplarily, the multiple light filtering through-holes 211211 can form four groups of light filtering through-hole groups 211212, and each of the multiple light filtering through-holes 211211 included in each group of light filtering through-hole groups 211212 has a different hole shape structure.
[0091] Please combine with Figure 8 Figure 8 , for the case where, among multiple groups of light filtering through-hole groups 211212, each of the multiple light filtering through-holes 211211 included in at least one group of light filtering through-hole groups 211212 has the same hole shape structure, and each of the multiple light filtering through-holes 211211 included in at least one group of light filtering through-hole groups 211212 has a different hole shape structure. Exemplarily, the multiple light filtering through-holes 211211 can form four groups of light filtering through-hole groups 211212, where two groups of light filtering through-hole groups 211212 each include multiple light filtering through-holes 211211 with the same hole shape structure ( Figure 8 the two groups of light filtering through-hole groups 211212 on the left in Figure 8 ), and the other two groups of light filtering through-hole groups 211212 each include multiple light filtering through-holes 211211 with different hole shape structures (
[0092] Through the above settings, on the one hand, it can meet the diverse selection requirements for the setting methods of the light filtering through-holes 211211. On the other hand, when the fingerprint recognition module 210 of the optical sensor 211 works, finally, multiple groups of target band optical signals corresponding one-to-one to the multiple groups of light filtering through-hole groups 211212 will be obtained, and they can be simultaneously applied to fingerprint anti-counterfeiting recognition, thereby further improving the security of optical fingerprint recognition.
[0093] However, when setting multiple light filtering through-holes 211211 according to the above setting method, although the multiple groups of target band optical signals that can be obtained may be of the same band, for example, Figure 6 or Figure 7 the setting method shown. Therefore, to further improve the security of optical fingerprint recognition, in the embodiments of the present application, among the multiple groups of light filtering through-hole groups 211212 formed by the multiple light filtering through-holes 211211, at least two groups of light filtering through-hole groups 211212 have different hole shape structures, for example, Figure 8The setting method shown. Then, when the fingerprint recognition module 210 applying the optical sensor 211 is working, finally, at least two groups of target band optical signals corresponding to at least two groups of filter through holes 211212 can be obtained, and can be simultaneously applied to fingerprint anti-counterfeiting recognition, thereby further improving the security of optical fingerprint recognition.
[0094] According to the above idea, in the embodiment of the present application, different hole type structures can also be set between any two groups of filter through holes 211212 among multiple groups of filter through holes 211212. Then, when the fingerprint recognition module 210 applying the optical sensor 211 is working, finally, more groups of target band optical signals can be obtained, and can be simultaneously applied to fingerprint anti-counterfeiting recognition, thereby further improving the security of optical fingerprint recognition.
[0095] Please combine Figure 9 , for example, 9 groups of filter through holes 211212 composed of multiple filter through holes 211211, and any two groups of filter through holes 211212 have different hole type structures. Then, after the fingerprint recognition module 210 is applied to the electronic device 200, when the user performs fingerprint recognition through the electronic device 200, finally, 9 groups of target band optical signals can be obtained, and can be simultaneously applied to fingerprint anti-counterfeiting recognition. For example, spectral information restoration is performed on these 9 groups of target band optical signals at the same time to obtain 9 pieces of spectral information, specifically as Figure 10 shown, and then the 9 pieces of spectral information are respectively compared with their corresponding standard spectral information. If the comparison results are all consistent, the anti-counterfeiting authentication result is passed, otherwise it is not passed, thereby further improving the security of optical fingerprint recognition. In addition, it can be understood that in the embodiment of the present application, for a certain group of filter through holes 211212, its corresponding standard spectral information can be obtained during the fingerprint recognition experiment using a normal real finger at the design stage of the fingerprint recognition module 210, and the embodiment of the present application will not elaborate on this.
[0096] Regarding the intra-group position arrangement method of multiple groups of filter through holes 211212, in the embodiment of the present application, as an optional implementation method, the position arrangement method of multiple filter through holes 211211 included in each group of filter through holes 211212 in at least one group of filter through holes 211212 can be set to be arranged in an array manner, for example, a rectangular array manner (specifically as Figure 5 , or Figures 6 - 9 shown), a circular array manner, a trapezoidal array manner and other regular array manners, or other irregular array manners.
[0097] Since the photosensitive surface of the photosensitive sensor 21111 is usually rectangular, among multiple groups of filter through-hole groups 211212, in at least one group of filter through-hole groups 211212, the positional arrangement of multiple filter through-holes 211211 included in each group of filter through-hole groups 211212 is in an array arrangement, which can increase the matching degree between each group of filter through-hole groups 211212 and the corresponding photosensitive sensor 21111 in this at least one group of filter through-hole groups 211212. Then, according to this idea, in the embodiment of the present application, preferably, the positional arrangement of multiple filter through-holes 211211 included in each group of filter through-hole groups among multiple groups of filter through-hole groups is set to be in an array arrangement.
[0098] Please combine Figure 11 and Figure 12 For the in-group positional arrangement of multiple groups of filter through-hole groups 211212, in the embodiment of the present application, as another optional implementation manner, the positional arrangement of multiple filter through-holes 211211 included in each group of filter through-hole groups in at least one group of filter through-hole groups 211212 among multiple groups of filter through-hole groups 211212 can also be set as follows: a first filter through-hole 2112111 is arranged at the middle position of the filter through-hole group 211212, and multiple second filter through-holes 2112112 are arranged around the first filter through-hole 2112111, where the size of the first filter through-hole 2112111 is larger than that of the second filter through-hole 2112112, so as to ensure that more target optical signals can be received at the middle position of each group of filter through-hole groups 211212.
[0099] For the inter-group positional arrangement of multiple groups of filter through-hole groups 211212, in the embodiment of the present application, as an optional implementation manner, the positional arrangement of multiple groups of filter through-hole groups can be set to be in an array arrangement. For example, a rectangular array arrangement (specifically as shown in Figures 6 - 9 , or Figure 11 and Figure 12 ), a circular array arrangement, a trapezoidal array arrangement, and other regular array arrangements, or other irregular array arrangements.
[0100] Since in the optical sensor 211, multiple photosensitive sensors 21111 are usually arranged in an array, that is, set as a photosensitive sensor array 2111, therefore, on the filter layer 21121, the positional arrangement of multiple groups of filter through-hole groups 211212 in an array arrangement can increase the matching degree between multiple groups of filter through-hole groups 211212 and the photosensitive sensor array 2111, and at the same time, reduce the design and manufacturing complexity of multiple groups of filter through-hole groups 211212, thereby improving the manufacturing efficiency of the filter layer 21121.
[0101] Regarding the positional relationship between the filter layer 21121 and the photosensitive sensor array 2111, in the embodiments of the present application, the filter layer 21121 can be set to correspond to only a partial area on the photosensitive sensor array 2111 (specifically as shown in Figure 3 and in combination with Figure 4 , Figures 6 - 8 , Figure 11 or Figure 12 ), or the filter layer 21121 can be set to correspond to the entire photosensitive sensor array 2111 (in combination with Figure 3 and Figure 13 ).
[0102] When the filter layer 21121 only corresponds to a partial area on the photosensitive sensor array 2111, this partial area is the anti-counterfeiting authentication area, and the other areas on the photosensitive sensor array 2111 except the anti-counterfeiting authentication area are used as the fingerprint recognition area. In addition, in this case, the filter layer 21121 can be directly disposed in the optical path guiding structure 2112 without a carrier, or can be disposed in the optical path guiding structure 2112 with a transparent layer as the carrier, where the manufacturing material of the transparent layer can be glass, polyimide, etc.
[0103] When the filter layer 21121 corresponds to the entire photosensitive sensor array 2111, at least one set of filter through holes 211211 provided on the filter layer 21121 does not completely cover the photosensitive sensor array 2111, but only covers a partial area on the photosensitive sensor array 2111, and this partial area is the anti-counterfeiting authentication area, and the other areas on the photosensitive sensor array 2111 except the anti-counterfeiting authentication area are used as the fingerprint recognition area, specifically as shown in Figure 3 as well. In addition, in this case, the area on the filter layer 21121 where the filter through holes 211211 are not provided can be used as an infrared filter layer (IR-Cut Filter, IRCF).
[0104] In addition, in the embodiments of the present application, in each of the multiple sets of filter through hole groups 211212, each set of filter through hole groups 211212 corresponds to at least one photosensitive sensor 21111 in the photosensitive sensor array 2111. In this way, it can be ensured that after filtering a partial wavelength band of the target optical signal through any one set of filter through hole groups 211212, the remaining unfiltered target wavelength band optical signal can be received by at least one photosensitive sensor 21111, thereby further improving the security of optical fingerprint recognition.
[0105] Based on the above design principles, when the shapes, sizes, and positional arrangements of multiple light-filtering through-holes 211211 in a certain group of light-filtering through-hole groups 211212 are determined, the number of light-filtering through-holes 211211 in this group of light-filtering through-hole groups 211212 can be set according to the photosensitive area of a photosensitive sensor 21111 in the photosensitive sensor array 2111.
[0106] Taking the fingerprint recognition module 210 as an example of an ultra-thin module, the photosensitive area of a photosensitive sensor 21111 in the photosensitive sensor array 2111 is usually 2.9 * 2.9 um 2 , on this basis, if multiple light-filtering through-holes 211211 included in a certain group of light-filtering through-hole groups 211212 are rectangular through-holes with a size of 100 nm * 100 nm and are arranged in a rectangular array, then the number of light-filtering through-holes 211211 in this group of light-filtering through-hole groups 211212 can be in the numerical range (1 * 1, 29 * 29). Specifically, the distance between any two light-filtering through-holes 211211 in this group of light-filtering through-hole groups 211212 also needs to be considered.
[0107] Taking the fingerprint recognition module 210 as an example of a non-ultra-thin module, the photosensitive area of a photosensitive sensor 21111 in the photosensitive sensor array 2111 is usually 30 * 30 um 2 ~40 * 40 um 2 , on this basis, if multiple light-filtering through-holes 211211 included in a certain group of light-filtering through-hole groups 211212 are rectangular through-holes with a size of 100 nm * 100 nm and are arranged in a rectangular array, then the number of light-filtering through-holes 211211 in this group of light-filtering through-hole groups 211212 can be within the numerical range (300 * 300, 400 * 400). Specifically, the distance between any two light-filtering through-holes 211211 in this group of light-filtering through-hole groups 211212 also needs to be considered.
[0108] Furthermore, please refer to Figures 14 - 17 , in the embodiments of the present application, for the optical path guiding structure 2112, it may include a focusing unit array 21122 disposed above the photosensitive sensor array 2111, and at least one light-shielding layer 21123 disposed between the photosensitive sensor array 2111 and the focusing unit array 21122. Among them, the focusing unit array 21122 may be composed of focusing units such as microlenses, diffraction rings, or small hole structures arranged in an array. The embodiments of the present application will not elaborate on this.
[0109] Based on the above structure of the optical path guiding structure 2112, the light-filtering layer 21121 has at least the following four setting methods. Therefore, it can meet the diverse design and manufacturing requirements of the optical sensor 211.
[0110] (1) The filter layer 21121 is disposed above the focusing unit array 21122, specifically as shown in Figure 14 shown;
[0111] (2) The filter layer 21121 is disposed between the focusing unit array 21122 and at least one light-shielding layer 21123, specifically as shown in Figure 15 shown;
[0112] (3) The filter layer 21121 is disposed between the photosensitive sensor array 2111 and at least one light-shielding layer 21123, specifically as shown in Figure 16 shown;
[0113] (4) The optical path guiding structure 2112 includes multiple light-shielding layers 21123, and the filter layer 21121 is disposed between any two of the multiple light-shielding layers 21123, specifically as shown in Figure 17 shown.
[0114] In addition, it can be understood that in the embodiments of the present application, the foregoing fingerprint recognition module 210 is a solution in which the filter layer 21121 is disposed inside the optical sensor 211. However, in actual implementation, the filter layer 21121 can also be independent of the optical sensor 211, that is, disposed outside the optical sensor 211. Based on this, please refer to Figure 18 and Figure 19 , in addition to the foregoing fingerprint recognition module 210, the embodiments of the present application also provide a fingerprint recognition module 310.
[0115] The fingerprint recognition module 310 includes an optical component 311, an optical sensor 312, and a filter layer 313 disposed between the optical component 311 and the optical sensor 312. A plurality of filter through-holes are provided on the filter layer 313, and the size of the filter through-holes is in the micron and / or nanometer range. Here, the size can be understood as the aperture of the filter through-hole or the length of one side of the filter through-hole, etc., and the aperture can be the diameter of the circumscribed circle or the inscribed circle of the filter through-hole. After the target optical signal is incident from the optical component 311 to the filter layer 313, the target optical signal is filtered for some wavelength bands by the plurality of filter through-holes and then received by the optical sensor 312.
[0116] In the embodiments of the present application, the optical component 311 can be an optical film layer or an imaging lens. If the optical component 311 is an optical film layer, the fingerprint recognition module 310 belongs to an ultra-thin module, specifically as shown in Figure 18 shown. If the optical component 311 is an imaging lens, the fingerprint recognition module 310 belongs to a non-ultra-thin module, specifically as shown in Figure 19 shown.
[0117] In addition, it should be noted that in the embodiments of the present application, the optical sensor 312 may include a photosensitive sensor array 3121 and an optical path guiding structure 3122, and the optical path guiding structure 3122 is disposed above the photosensitive sensor array 3121. On this basis, it should also be noted that in the embodiments of the present application, the filter layer 313 may correspond to only a partial area on the photosensitive sensor array 3121, or may correspond to the entire photosensitive sensor array 3121.
[0118] In the case where the filter layer 313 corresponds to only a partial area on the photosensitive sensor array 3121, this partial area is the anti-counterfeiting authentication area, and the other areas on the photosensitive sensor array 3121 except the anti-counterfeiting authentication area are used as the fingerprint recognition area. In addition, in this case, the filter layer 313 may be directly disposed between the optical component 311 and the optical sensor 312 without a carrier, or may be disposed between the optical component 311 and the optical sensor 312 with a transparent layer as a carrier, where the manufacturing material of the transparent layer may be glass, polyimide, etc.
[0119] In the case where the filter layer 313 corresponds to the entire photosensitive sensor array 3121, at least one set of filter through holes provided on the filter layer 313 does not completely cover the photosensitive sensor array 3121, but only covers a partial area on the photosensitive sensor array 3121, and this partial area is the anti-counterfeiting authentication area, and the other areas on the photosensitive sensor array 3121 except the anti-counterfeiting authentication area are used as the fingerprint recognition area. In addition, in this case, the area on the filter layer 313 where no filter through holes are provided may be used as the IRCF.
[0120] After the fingerprint recognition module 310 is applied to the electronic device 300, when the user needs to perform fingerprint recognition through the electronic device 300, the finger is placed against the upper part of the display screen 320 in the electronic device 300 and at the position corresponding to the fingerprint recognition module 310. After the light signal emitted by the display screen 320 is incident on the finger, the reflected light formed by reflection on the finger surface and the scattered light (transmitted light) formed by scattering inside the finger will jointly serve as the return signal. Among the return signals, the target optical signal (belonging to the composite optical signal) corresponding to the position of the filter layer 313, after penetrating the display screen 320, first undergoes imaging processing through the optical component 311, and then the partial wavelength bands of the target optical signal are filtered through multiple filter through-holes. The remaining target wavelength band optical signal that has not been filtered is then incident on the optical path guiding structure 3122 and is guided by the optical path guiding structure 3122 to the photosensitive sensor array 3121. Finally, it is received by the photosensitive sensor array 3121 for fingerprint anti-counterfeiting recognition. Since the spectral information of the target wavelength band optical signal is different from the spectral information of the return signal formed by the optical signal incident on the finger, and the specific wavelength bands of the target wavelength band optical signal are not known to the outside world, it is difficult to forge. Therefore, subsequent fingerprint anti-counterfeiting recognition through the target wavelength band optical signal can improve the security of optical fingerprint recognition.
[0121] In some embodiments of the embodiments of the present application, the multiple filter through-holes have at least two hole-shaped structures.
[0122] In some embodiments of the embodiments of the present application, the multiple filter through-holes form multiple groups of filter through-hole groups. In at least one group of filter through-hole groups, each of the multiple filter through-holes included in each group of filter through-hole groups has the same hole-shaped structure, and / or in at least one group of filter through-hole groups, each of the multiple filter through-holes included in each group of filter through-hole groups has different hole-shaped structures.
[0123] In some embodiments of the embodiments of the present application, the multiple filter through-holes form multiple groups of filter through-hole groups, and there are different hole-shaped structures between at least two groups of filter through-hole groups.
[0124] In some embodiments of the embodiments of the present application, among the multiple groups of filter through-hole groups, there are different hole-shaped structures between any two groups of filter through-hole groups.
[0125] In some embodiments of the embodiments of the present application, the hole-shaped structure includes shape, size, and / or position arrangement manner.
[0126] In some embodiments of the embodiments of the present application, the multiple filter through-holes form multiple groups of filter through-hole groups. In at least one group of filter through-hole groups, the position arrangement manner of each of the multiple filter through-holes included in each group of filter through-hole groups is arranged in an array manner.
[0127] In some embodiments of the embodiments of the present application, multiple light filtering through-holes form multiple groups of light filtering through-hole groups, and the positional arrangement of the multiple groups of light filtering through-hole groups is an array arrangement.
[0128] In some embodiments of the embodiments of the present application, multiple light filtering through-holes form multiple groups of light filtering through-hole groups. The positional arrangement of the multiple light filtering through-holes included in each group of light filtering through-hole groups in at least one group of light filtering through-hole groups is as follows: a first light filtering through-hole is provided at the middle position of the light filtering through-hole group, and multiple second light filtering through-holes are provided around the first light filtering through-hole.
[0129] In some embodiments of the embodiments of the present application, the size of the first light filtering through-hole is larger than the size of the second light filtering through-hole.
[0130] In some embodiments of the embodiments of the present application, the shapes of the multiple light filtering through-holes include at least one of a circle, a triangle, a square, a parallelogram, a rhombus, a regular pentagon, and a regular hexagon.
[0131] In some embodiments of the embodiments of the present application, multiple light filtering through-holes form multiple groups of light filtering through-hole groups. One group of light filtering through-hole groups corresponds to at least one photosensitive sensor in the photosensitive sensor array included in the optical sensor.
[0132] In some embodiments of the embodiments of the present application, the material of the light filtering layer is silicon.
[0133] In some embodiments of the embodiments of the present application, the target light signal is filtered by multiple light filtering through-holes for some wavelength bands, and the target wavelength band light signal received by the optical sensor is used for fingerprint anti-counterfeiting identification.
[0134] Regarding Figure 18 and Figure 19 In the fingerprint recognition module 310 shown, for the specific structure and setting manner of the light filtering layer 313, reference may be made to the specific structure and setting manner of the light filtering layer 21121 in the foregoing fingerprint recognition module 210, and the embodiments of the present application will not elaborate thereon.
[0135] Finally, the embodiments of the present application further provide an electronic device, including a display screen and a fingerprint recognition module disposed below the display screen. Among them, the fingerprint recognition module may include the foregoing optical component 212 and optical sensor 211, that is, the fingerprint recognition module may be the foregoing fingerprint recognition module 210. Of course, the fingerprint recognition module may also be the foregoing fingerprint recognition module 310.
[0136] It should be noted that in the embodiments of the present application, the electronic device may be a portable mobile computing device such as a smart phone, a tablet computer, a game device, etc., or may also be other devices such as an electronic database, a fingerprint lock, a vehicle, an ATM, etc. The embodiments of the present application do not make specific limitations thereto.
[0137] In addition, it should be noted that in the embodiments of the present application, the display screen may be a display device having a self-luminous display unit. For example, an OLED display screen, a Micro-LED display screen, or an LCD. The embodiments of the present application do not specifically limit this either.
[0138] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "connection" and "setting" should be understood in a broad sense. For example, it may be a mechanical fixed connection, a detachable connection, or an integral connection, and it may be an electrical connection or a communication connection in terms of electricity. Among them, the communication connection may be a wired communication connection or a wireless communication connection. In addition, it may be directly connected, or indirectly connected through an intermediate medium, and may also be the communication inside two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to specific situations. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.
[0139] The above are only some embodiments of the present application and are not used to limit the present application. For those skilled in the art, the present application may have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. An optical sensor, characterized in that, It includes a photosensitive sensor array and an optical path guiding structure; The optical path guiding structure includes a filter layer provided with a plurality of filter through-holes, the size of the filter through-holes being in the micrometer and / or nanometer range, and the optical path guiding structure is disposed above the photosensitive sensor array; The target optical signal is incident on the optical path guiding structure, and after a partial wavelength band of the target optical signal is filtered by the plurality of filter through-holes, it is received by the photosensitive sensor array; After a partial wavelength band of the target optical signal is filtered by the plurality of filter through-holes, the target wavelength band optical signal received by the photosensitive sensor array is used for fingerprint anti-counterfeiting identification; the wavelength band of the target optical signal that is not filtered is determined by the shape and / or positional arrangement of the plurality of filter through-holes; The filter layer is provided to correspond to the entire photosensitive sensor array, and at least one set of filter through-holes provided on the filter layer does not completely cover the photosensitive sensor array, and only the partial area covering the photosensitive sensor array is the anti-counterfeiting authentication area, and the other area of the photosensitive sensor array except the anti-counterfeiting authentication area is the fingerprint recognition area, and the area where no filter through-holes are provided on the filter layer is the infrared filter layer; The plurality of filter through-holes form multiple groups of filter through-hole groups, and the positional arrangement of the multiple filter through-holes included in each group of filter through-hole groups in at least one group of filter through-hole groups is: a first filter through-hole is provided at the middle position of the filter through-hole group, and a plurality of second filter through-holes are provided around the first filter through-hole; the size of the first filter through-hole is larger than the size of the second filter through-hole.
2. The optical sensor according to claim 1, wherein The plurality of filter through-holes have at least two hole type structures.
3. The optical sensor according to claim 1, characterized in that The plurality of filter through-holes form multiple groups of filter through-hole groups, and the multiple filter through-holes included in each group of filter through-hole groups in at least one group of filter through-hole groups have the same hole type structure, and / or the multiple filter through-holes included in each group of filter through-hole groups in at least one group of filter through-hole groups have different hole type structures.
4. The optical sensor according to claim 3, characterized in that, The plurality of filter through-holes form multiple groups of filter through-hole groups, and there are different hole type structures between at least two groups of filter through-hole groups.
5. The optical sensor according to claim 4, wherein Among the multiple groups of filter through-hole groups, there are different hole type structures between any two groups of filter through-hole groups.
6. The optical sensor according to any one of claims 2 to 5, characterized in that, The hole type structure includes shape, size and / or positional arrangement.
7. The optical sensor according to claim 6, wherein, The plurality of filter through-holes form multiple groups of filter through-hole groups, and the positional arrangement of the multiple filter through-holes included in each group of filter through-hole groups in at least one group of filter through-hole groups is arranged in an array manner.
8. The optical sensor according to claim 6, characterized in that, The plurality of filter through-holes form multiple groups of filter through-hole groups, and the positional arrangement of the multiple groups of filter through-hole groups is arranged in an array manner.
9. The optical sensor according to claim 6, wherein, The shape of the plurality of filter through-holes includes at least one of a circle, a triangle, a square, a parallelogram, a rhombus, a regular pentagon and a regular hexagon.
10. The optical sensor according to any one of claims 1 to 5, characterized in that, The plurality of filter through-holes form multiple groups of filter through-hole groups, and one group of filter through-hole groups corresponds to at least one photosensitive sensor in the photosensitive sensor array.
11. The optical sensor according to any one of claims 1 to 5 and 7 to 9, characterized in that, The material of the filter layer is silicon.
12. The optical sensor according to any one of claims 1 to 5 and 7 to 9, characterized in that, The optical path guiding structure further includes a focusing unit array disposed above the photosensitive sensor array, and at least one light-shielding layer disposed between the photosensitive sensor array and the focusing unit array; The filter layer is disposed above the focusing unit array; or, the filter layer is disposed between the focusing unit array and the at least one light-shielding layer; or, the filter layer is disposed between the photosensitive sensor array and the at least one light-shielding layer; or, the optical path guiding structure includes multiple light-shielding layers, and the filter layer is disposed between any two of the multiple light-shielding layers.
13. A fingerprint recognition module, characterized in that, Comprising an optical component and the optical sensor according to any one of claims 1 to 12; The optical component is disposed above the optical sensor.
14. The fingerprint recognition module according to claim 13, wherein The optical component includes an imaging lens or an optical film layer.
15. A fingerprint recognition module, characterized in that, Comprising an optical component, an optical sensor, and a filter layer disposed between the optical component and the optical sensor, wherein a plurality of filter through-holes are provided on the filter layer, and the size of the filter through-holes is in the micron scale and / or the nanometer scale; the optical sensor includes a photosensitive sensor array; After the target optical signal is incident from the optical component to the filter layer, the partial wavelength band of the target optical signal is filtered by the plurality of filter through-holes and then received by the optical sensor; After the partial wavelength band of the target optical signal is filtered by the plurality of filter through-holes, the target wavelength band optical signal received by the photosensitive sensor array is used for fingerprint anti-counterfeiting identification; the wavelength band of the target optical signal that is not filtered is determined by the shape and / or the positional arrangement of the plurality of filter through-holes; The filter layer is set to correspond to the entire photosensitive sensor array, and at least one group of filter through-holes provided on the filter layer does not completely cover the photosensitive sensor array, and only the partial area on the photosensitive sensor array covered is the anti-counterfeiting authentication area, and the other areas on the photosensitive sensor array except the anti-counterfeiting authentication area are the fingerprint recognition areas, and the area on the filter layer where no filter through-holes are provided is the infrared filter layer; The plurality of filter through-holes form multiple groups of filter through-hole groups, and the positional arrangement of the multiple filter through-holes included in each group of filter through-hole groups in at least one group of the filter through-hole groups is: a first filter through-hole is provided at the middle position of the filter through-hole group, and a plurality of second filter through-holes are provided around the first filter through-hole; the size of the first filter through-hole is larger than the size of the second filter through-hole.
16. The fingerprint recognition module according to claim 15, wherein The plurality of filter through-holes have at least two hole-shaped structures.
17. The fingerprint recognition module according to claim 15, characterized in that, The plurality of filter through-holes form multiple groups of filter through-hole groups, and each group of filter through-hole groups included in at least one group of the filter through-hole groups has the same hole-shaped structure, and / or each group of filter through-hole groups included in at least one group of the filter through-hole groups has different hole-shaped structures.
18. The fingerprint recognition module according to claim 17, wherein The plurality of filter through-holes form multiple groups of filter through-hole groups, and there are different hole-shaped structures between at least two groups of the filter through-hole groups.
19. The fingerprint recognition module according to any one of claims 16 to 18, characterized in that, The hole-shaped structure includes shape, size and / or positional arrangement.
20. The fingerprint recognition module according to claim 19, wherein, The plurality of filter through-holes form multiple groups of filter through-hole groups, and the positional arrangement of the multiple filter through-holes included in each group of filter through-hole groups in at least one group of the filter through-hole groups is arranged in an array manner.
21. The fingerprint recognition module according to claim 19, wherein, The plurality of filter through-holes form multiple groups of filter through-hole groups, and the positional arrangement of the multiple groups of filter through-hole groups is arranged in an array manner.
22. The fingerprint recognition module according to claim 19, wherein, The multiple light filtering through holes form multiple groups of light filtering through hole groups. The arrangement of the multiple light filtering through holes included in each group of at least one group of the light filtering through hole groups is as follows: a first light filtering through hole is disposed at the middle position of the light filtering through hole group, and multiple second light filtering through holes are disposed around the first light filtering through hole.
23. The fingerprint recognition module according to claim 19, wherein The shapes of the multiple light filtering through holes include at least one of a circle, a triangle, a square, a parallelogram, a rhombus, a regular pentagon, and a regular hexagon.
24. The fingerprint recognition module according to any one of claims 15 to 18, characterized in that, The multiple light filtering through holes form multiple groups of light filtering through hole groups. One group of light filtering through hole groups corresponds to at least one photosensitive sensor in the photosensitive sensor array included in the optical sensor.
25. An electronic device, characterized in that, The electronic device includes a display screen and a fingerprint recognition module disposed below the display screen; The fingerprint recognition module includes an optical component and the optical sensor according to any one of claims 1 to 12, or the fingerprint recognition module is the fingerprint recognition module according to any one of claims 13 to 24.
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