Chip bonding equipment

Abstract

The present application discloses a chip bonding device for bonding chips. The chip bonding device includes: a main workbench and a loading and swinging plate module, a dispensing module, a carrier conveying module, a flipping module and an attaching module installed on the main workbench, wherein the loading and swinging plate module is used to place the chip base at a predetermined loading position, position and detect the chip base, and place the positioned and detected chip base in a transfer tray, the dispensing module is used to position and detect the height of the placed chip base, and perform a dispensing operation on the chip base, and transfer the chip base after dispensing to the flipping module, the flipping module is used to flip the chip base, the carrier conveying module is used to transfer the carrier with the chip installed to the attaching module and transfer the carrier without the chip base attached to the next bonding device, and the attaching module is used to attach the flipped chip base to the chip on the carrier.

Description

Technical Field

[0001] The present application relates to the field of chip attachment technology, and in particular to a chip attachment device. Background Art

[0002] With the continuous advancement of science and technology and the continuous development of intelligence, intelligent manufacturing is an inevitable trend. Among them, chip manufacturing is also developing in the direction of science and technology, intelligence and high-end. The development of chips will inevitably place higher and higher requirements on the chip attachment process. At present, before chip attachment, the chip and its carrier need to be cleaned, and then the cleaned carrier is manually placed on the workbench of the attachment machine or placed on the loading station of the attachment machine through a carrier box. However, during the carrier transfer process, the cleaned chip is easily contaminated again, and manual tray placement is required after transfer. The uncertainty of manual operation can easily lead to product defects, reduce the production qualification rate, and cause product scrapping or rework, all of which increase the production cost of the enterprise.

[0003] Furthermore, some chip manufacturers use integrated equipment for assembly and production. However, these integrated equipment have complex motion structures, high equipment costs, and lack of force control and low placement precision, which can easily damage products and lead to high chip defect rates after bonding. Furthermore, most existing chip bonding equipment in the industry uses a single cleaning machine to feed only one bonding machine. This single-machine supply model not only reduces production efficiency but also increases the cost of splicing production lines.

[0004] Therefore, providing a chip bonding device with high qualification rate, low cost, high productivity, high precision and controllable bonding force has become an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of this application is to provide a chip bonding device, aiming to solve the problems of low pass rate, high cost and low production efficiency of existing chip bonding, and to achieve chip bonding with high pass rate, low cost, high productivity, high precision and controllable bonding force.

[0006] A chip bonding device for bonding chips. The chip bonding device includes: a main workbench and a loading and swinging plate module, a dispensing module, a carrier conveying module, a flipping module, and an attaching module installed on the main workbench, wherein the loading and swinging plate module is used to place the chip base at a predetermined loading position, position and detect the chip base, and place the positioned and detected chip base in a transfer tray; the dispensing module is used to position and detect the height of the placed chip base, perform dispensing on the chip base, and transfer the glued chip base to the flipping module; the flipping module is used to flip the chip base; the carrier conveying module is used to transfer the carrier with the chip installed to the attaching module and transfer the carrier without the chip base attached to the next bonding device; the attaching module is used to attach the flipped chip base to the chip on the carrier.

[0007] In an exemplary embodiment, the loading and swinging plate module includes a loading assembly, a loading and transporting assembly, a swinging plate assembly, and a loading and transfer assembly, wherein the loading assembly is used to provide the chip base, the loading and transporting assembly is used to transport the chip base out of the loading assembly, the swinging plate assembly is used to place the chip base in sequence to the loading and transfer assembly, and the loading and transfer assembly is used to transfer the chip base to the dispensing module.

[0008] In an exemplary embodiment, the loading assembly includes a plurality of loading trays, a loading basket, and a plurality of loading basket support shafts, wherein the plurality of loading trays are used to place the chip base, the plurality of loading trays are located inside the loading basket and are distributed in sequence along the height direction of the loading basket, the two unclosed sides of the loading basket are arranged opposite to each other and face the loading conveying assembly, and the plurality of loading basket support shafts are used to support the loading basket and carry the loading basket to move along the axial direction of the loading basket support shaft.

[0009] In an exemplary embodiment, the loading and conveying assembly includes a loading and conveying workbench shaft and a loading and conveying workbench, wherein the loading and conveying workbench is slidingly connected to the loading and conveying workbench shaft and moves along the axial direction of the loading and conveying workbench shaft, and the height of the loading and conveying workbench is between the bottom surface of the loading basket and the loading tray adjacent to the bottom surface of the loading basket, and the loading and conveying workbench is used to transport the loading tray out of the loading basket.

[0010] In an exemplary embodiment, the wobble plate assembly includes a wobble plate support, a wobble plate shaft, a wobble plate connecting piece, a picking rod control element and a picking rod, wherein the wobble plate support is located on both sides of the loading and transporting workbench axis and is fixedly connected to the main workbench, the wobble plate shaft is fixed on the side of the wobble plate support away from the main workbench, spans the loading and transporting workbench axis and is perpendicular to the loading and transporting workbench axis, the wobble plate connecting piece is located on the side of the wobble plate axis away from the wobble plate support and is slidably connected to the wobble plate shaft, the picking rod control element is fixed on the side of the wobble plate connecting piece facing the loading assembly, one end of the picking rod is located in the picking rod control element and is slidably connected to the picking rod control element, the picking rod is perpendicular to the wobble plate shaft, and the axial direction of the picking rod is toward the main workbench, the wobble plate connecting piece moves along the axial direction of the wobble plate shaft, and the picking rod control element is used to control the picking rod to move toward or away from the main workbench and pick up the chip base and correct the chip base.

[0011] In an exemplary embodiment, the loading transfer assembly includes a transfer tray shaft, a transfer tray connector and a transfer tray, wherein the transfer tray shaft is parallel to the loading and handling workbench shaft and is located on the inner side of the swing plate support, the transfer tray shaft is fixedly connected to the main workbench, the transfer tray connector is located on the side of the transfer tray shaft facing away from the main workbench and is slidingly connected to the transfer tray shaft, the transfer tray is located on the side of the transfer tray connector facing away from the transfer tray shaft, the transfer tray connector moves along the axial direction of the transfer tray shaft, and the transfer tray is used to hold the chip base.

[0012] In an exemplary embodiment, the loading and swinging plate module also includes a loading positioning camera assembly and a loading correction camera assembly, wherein the loading positioning camera assembly is located between the loading and transporting workbench axis and the swing plate axis, and is used to take pictures and position the chip base on the loading tray, and the loading correction camera assembly is located between the loading and transporting workbench axis and the transfer tray axis and below the picking rod, and the loading correction camera assembly is used to detect whether the chip base meets the predetermined requirements and take pictures and calibrate it, and the picking rod corrects the chip base and places it into the transfer tray.

[0013] In an exemplary embodiment, the dispensing module includes a dispensing component, a first pushing component, a second pushing component and a dispensing workbench component, wherein the first pushing component and the second pushing component are arranged side by side and relative to the dispensing component, and the dispensing workbench component is located between the dispensing component and the first pushing component. The first pushing component is used to push the transfer tray to the dispensing workbench assembly, the dispensing component is used to perform dispensing operations on the chip base on the transfer tray, and the second pushing component is used to push the transfer tray after dispensing to the flip module.

[0014] In an exemplary embodiment, the dispensing assembly includes a dispensing spindle, a first dispensing spindle, a second dispensing spindle, a first dispensing arm, a first dispensing head, a third dispensing spindle, a fourth dispensing spindle, a second dispensing arm, and a second dispensing head, wherein the dispensing spindle and the swing plate spindle are in the same straight line and are fixedly connected to the total workbench, the dispensing spindle is located on the side of the transfer tray axis away from the loading and handling workbench axis, the first dispensing spindle is located on the side of the dispensing spindle away from the total workbench and is slidably connected to the dispensing spindle, and the first dispensing spindle is perpendicular to the dispensing spindle And moves along the axial direction of the dispensing main shaft, the second dispensing shaft is located on the side of the first dispensing shaft away from the dispensing main shaft and is slidably connected to the first dispensing shaft, the second dispensing shaft is perpendicular to the first dispensing shaft and the axial direction of the second dispensing shaft is toward the total workbench, the second dispensing shaft can move along the axial direction of the first dispensing shaft, one end of the first dispensing arm is perpendicular to the second dispensing shaft and slidably connected, and the other end is close to the first pushing assembly, the first dispensing arm can move along the axial direction of the second dispensing shaft, the first dispensing head is fixed The first dispensing arm is fixed at one end away from the second dispensing axis, and the first dispensing head is used to perform dispensing operation on the front half of the chip base on the transfer tray. The third dispensing axis is located on the side of the dispensing spindle away from the total workbench and is slidably connected to the dispensing spindle. The third dispensing axis is located on the side of the first dispensing axis away from the wobble plate assembly and is parallel to the first dispensing axis. The third dispensing axis moves along the axial direction of the dispensing spindle. The fourth dispensing axis is located on the side of the third dispensing axis away from the dispensing spindle and slides with the third dispensing axis. The fourth dispensing axis is perpendicular to the third dispensing axis and the axial direction of the fourth dispensing axis is toward the total workbench. The fourth dispensing axis can move along the axial direction of the third dispensing axis. One end of the second dispensing arm is perpendicular to the fourth dispensing axis and is slidably connected. The other end of the second dispensing arm is close to the second pushing assembly. The second dispensing arm can move along the axial direction of the fourth dispensing axis. The second dispensing head is fixed to the end of the second dispensing arm away from the fourth dispensing axis. The second dispensing head is used to perform dispensing operations on the rear half of the chip base on the transfer tray.

[0015] In an exemplary embodiment, the dispensing workbench assembly includes a dispensing workbench support, a first dispensing workbench and a second dispensing workbench, wherein the dispensing workbench support is fixedly connected to the main workbench, the first dispensing workbench and the second dispensing workbench are located on the side of the dispensing workbench support away from the main workbench, the first dispensing workbench is located below the first dispensing head, and the second dispensing workbench is located below the second dispensing head, and the first dispensing workbench and the second dispensing workbench are both used to support and fix the transfer tray.

[0016] In an exemplary embodiment, the first pushing assembly includes a first pushing spindle, a first pushing connecting piece, a first pushing lifting shaft and a first digging arm, wherein the first pushing spindle is opposite to and parallel to the glue dispensing spindle, the first pushing connecting piece is located on the side of the first pushing spindle facing the glue dispensing assembly and is slidably connected to the glue dispensing assembly, the first pushing connecting piece moves along the axial direction of the first pushing spindle, one end of the first pushing lifting shaft is slidably connected to the first pushing connecting piece, the end of the first pushing lifting shaft facing away from the first pushing connecting piece is fixedly connected to the first digging arm, the first digging arm is perpendicular to the first pushing spindle and extends toward the direction of the glue dispensing assembly, the first digging arm is slidably connected to the first pushing connecting piece, and the sliding direction is consistent with the axial direction of the first pushing lifting shaft. The first digging arm is used to push the transfer tray to the first glue dispensing workbench.

[0017] In an exemplary embodiment, the second pushing assembly includes a second pushing spindle, a second pushing connecting piece, a second pushing lifting shaft and a second diverter arm, wherein the second pushing spindle is arranged opposite and parallel to the dispensing spindle, the second pushing connecting piece is arranged on a side of the second pushing spindle facing the dispensing assembly and is slidably connected to the dispensing assembly, the second pushing connecting piece moves along the axial direction of the second pushing spindle, one end of the second pushing lifting shaft is slidably connected to the second pushing connecting piece, and the end of the second pushing lifting shaft facing away from the second pushing connecting piece is fixedly connected to the second diverter arm, the second diverter arm is perpendicular to the second pushing spindle and extends toward the direction of the dispensing assembly, the second diverter arm is slidably connected to the second pushing connecting piece, and the sliding direction is consistent with the axial direction of the second pushing lifting shaft, and the second diverter arm is used to push the transfer tray to the second dispensing workbench, and push the transfer tray that completes the dispensing of the second half of the chip base to the flip module. In an exemplary embodiment, the carrier conveying module includes an input assembly line, a lifting assembly line, a lifting assembly line shaft, an output assembly line and a bottom conveying assembly line. The input assembly line, the lifting assembly line, the output assembly line and the bottom conveying assembly line are parallel to the first pushing spindle. The lifting assembly line shaft is fixedly connected to the total workbench and is perpendicular to the lifting assembly line. The lifting assembly line is slidably connected to the lifting assembly line shaft and can move along the axial direction of the lifting assembly line shaft. The lifting assembly line and the output assembly line are located on both sides of the attachment module. The input assembly line The water line is located at the end of the lifting line away from the attachment module, the end of the input line away from the lifting line is connected to the cleaning machine or the upper-level chip bonding equipment, the end of the output line away from the attachment module is connected to the dryer or the next-level chip bonding equipment, the output line also has a lifting function, the bottom conveying line is located between the output line and the main workbench, the bottom conveying line includes a carrier input end and a carrier output end, the carrier input end is close to the lifting line, and the carrier output end is close to the output line.

[0018] In an exemplary embodiment, the carrier conveying module also includes two material baffles, a carrier sensor and a carrier pushing rod, wherein the two material baffles are respectively installed at the two ends of the input assembly line close to and away from the lifting assembly line, and are used to control the conveying volume and conveying speed of the carrier, the carrier sensor is arranged on the lifting assembly line, and is used to sense whether the carrier leaves the lifting assembly line, and the carrier pushing rod is used to push the carrier to the attachment module.

[0019] In an exemplary embodiment, the flip module includes a flip table assembly and a flip assembly, wherein the flip table assembly is used to receive the transfer tray transmitted from the second material diverter arm, and the flip assembly is used to flip the chip base on the transfer tray.

[0020] In an exemplary embodiment, the flip table assembly includes a first flip axis, a second flip axis, a flip table connector and a flip table, wherein the first flip axis is located on a side of the second dispensing worktable away from the first dispensing worktable and is fixedly connected to the main worktable, the second flip axis is located on a side of the first flip axis away from the main worktable and is perpendicular to the first flip axis, the second flip axis is slidably connected to the first flip axis and moves along the axial direction of the first flip axis, the flip table connector is located on a side of the second flip axis away from the first flip axis and is parallel to the first flip axis, the flip table connector is slidably connected to the second flip axis and moves along the axial direction of the second flip axis, the flip table connector is used to support and fix the flip table, the height of the flip table from the main worktable is consistent with the height of the second dispensing worktable from the main worktable, and the flip table is used to support and fix the transfer tray.

[0021] In an exemplary embodiment, the flip assembly includes a flip assembly support, a flip assembly connector, a flip assembly positioning camera, a flip spindle, a flip spindle connector, a rotating member, a suction rod and a suction head, wherein the flip assembly support is fixedly connected to the total workbench, the end of the flip assembly support facing away from the total workbench is fixedly connected to the flip assembly connector, the flip assembly positioning camera is located on the side of the flip assembly connector facing the flip workbench assembly, the flip spindle is fixed on one side of the flip assembly support and its axial direction is parallel to the height direction of the flip assembly support, and the flip The rotating spindle connecting piece is sleeved on the circumferential side of the flip spindle and is slidably connected to the flip spindle, the flip spindle connecting piece moves along the axial direction of the flip spindle, one end of the rotating piece is fixedly connected to the flip spindle connecting piece, one end of the suction rod is fixedly connected to the end of the rotating piece away from the flip spindle connecting piece, the axial direction of the suction rod is toward the flip workbench assembly, the rotating piece rotates along the tangential direction of the suction rod with the suction rod, the suction head is fixed on the end of the suction rod away from the rotating piece, and the suction head is used to suck the chip base on the transfer tray.

[0022] In an exemplary embodiment, the attaching module includes an attaching component and an attaching workbench component, wherein the attaching component is used to correct, detect the chip base and attach the chip base to the carrier, and the attaching workbench component is used to receive the carrier transferred from the lifting line and transport the carrier to the output line.

[0023] In an exemplary embodiment, the attachment assembly includes an attachment assembly support, an attachment spindle, an attachment head connector, an attachment head, and an attachment correction camera. The attachment assembly support is fixedly connected to the total workbench. The attachment spindle is located on the side of the attachment assembly support facing the flip assembly and the flip workbench assembly, and is fixedly connected to the attachment assembly support. The attachment head connector is located on the side of the attachment spindle away from the attachment assembly support and is slidably connected to the attachment spindle. The attachment head connector is along the axial direction of the attachment spindle. The attaching head is located on the side of the attaching head connecting piece away from the attaching spindle and is fixedly connected to the attaching head connecting piece. The attaching head is used to absorb the chip base and correct the chip base after absorption. The attaching correction camera is located between the flipping workbench assembly and the attaching workbench and below the attaching head. The attaching correction camera is used to detect whether the flipped chip base meets the predetermined requirements. The attaching head also includes a force controller module, which is used to control the attaching force of the attaching head.

[0024] In an exemplary embodiment, the attachment workbench assembly includes a first attachment axis, a second attachment axis, an attachment workbench, an attachment positioning camera connector and an attachment positioning camera, wherein the first attachment axis is fixedly connected to the main workbench and is parallel to the lifting line axis, the second attachment axis spans the first attachment axis and is perpendicular to and slidably connected to the first attachment axis, the second attachment axis moves along the axial direction of the first attachment axis, the attachment workbench spans the second attachment axis and is perpendicular to and slidably connected to the second attachment axis, the attachment workbench moves along the axial direction of the second attachment axis, the attachment workbench is used to support and fix the carrier transported from the lifting line, one end of the attachment positioning camera connector is located on the side of the attachment component support away from the main workbench and above the first attachment axis, the end of the attachment camera connector away from the attachment component support extends toward the lifting line, the extended end of the attachment camera connector is fixed with the attachment positioning camera, and the attachment positioning camera is used to take pictures of the chip on the carrier.

[0025] In an exemplary embodiment, the chip bonding equipment also includes a recycling line and a recycling workbench. The recycling line is located on the inner side of the dispensing workbench support and below the first dispensing workbench. The recycling line is fixedly connected to the main workbench. The recycling workbench is located between the recycling line and the first flip axis. The recycling workbench is used to receive the transfer tray and transport the transfer tray to the recycling line. The recycling line is used to transport the transfer tray to the feed port of the dispensing module.

[0026] In summary, the chip bonding equipment of the present application does not require manual participation in the chip bonding process and transports the carrier with the chip attached to the flip module through the carrier conveying module, thereby avoiding secondary pollution caused by manual transfer operations, improving the product qualification rate and reducing production costs. In addition, the loading and panning module positions and corrects the chip base through the loading positioning camera assembly and the loading correction camera assembly, the dispensing module positions the chip base through the dispensing positioning camera and performs height detection on the chip base through the laser position sensor, and the flip module detects and positions the chip base through the flip assembly positioning camera, the attachment correction camera and the attachment positioning camera, thereby improving the accuracy of chip bonding and the product qualification rate. In addition, multiple chip bonding equipment are connected in series with a cleaning machine and a drying machine to improve the efficiency of the production process. The attachment head is also provided with the force controller module to ensure that the attachment force is moderate during the attachment process, avoiding damage to the product due to inadequate attachment or excessive attachment force, further improving the product qualification rate. The chip bonding equipment of the present application is also provided with a recycling line to realize the recycling of the transfer tray. Therefore, the chip bonding equipment of the present application realizes a chip bonding process with high qualification rate, low cost, high productivity, high precision and controllable bonding force. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 This is a schematic diagram of the arrangement of modules of the chip bonding equipment disclosed in the embodiment of this application;

[0029] Figure 2 This is a structural diagram of a loading assembly of a loading and swinging plate module of a chip bonding device disclosed in an embodiment of the present application;

[0030] Figure 3This is a structural diagram of a swing plate assembly of a loading swing plate module of a chip bonding device disclosed in an embodiment of the present application;

[0031] Figure 4 This is a schematic structural diagram of a dispensing component of a dispensing module of a chip bonding device disclosed in an embodiment of the present application;

[0032] Figure 5 This is a structural schematic diagram of the first pushing component of the dispensing module of the chip bonding equipment disclosed in an embodiment of the present application;

[0033] Figure 6 This is a structural schematic diagram of the second pushing component of the dispensing module of the chip bonding equipment disclosed in an embodiment of the present application;

[0034] Figure 7 This is a structural diagram of a dispensing workbench assembly of a dispensing module of a chip bonding device disclosed in an embodiment of the present application;

[0035] Figure 8 This is a structural schematic diagram of the bottom conveying line of the carrier conveying module of the chip bonding equipment disclosed in an embodiment of the present application;

[0036] Figure 9 This is a structural schematic diagram of a flip table assembly of a flip module of a chip bonding device disclosed in an embodiment of the present application;

[0037] Figure 10 This is a schematic structural diagram of a flip assembly of a flip module of a chip bonding device disclosed in an embodiment of the present application;

[0038] Figure 11 A schematic structural diagram of a flip assembly positioning camera of a flip module of a chip bonding device disclosed in an embodiment of the present application;

[0039] Figure 12 This is a schematic structural diagram of the attachment assembly of the flip module of the chip bonding equipment disclosed in an embodiment of the present application;

[0040] Figure 13 This is a structural diagram of the attaching workbench assembly of the flip module of the chip bonding equipment disclosed in an embodiment of the present application;

[0041] Figure 14 This is a structural diagram of the attachment and positioning camera assembly of the flip module of the chip bonding equipment disclosed in an embodiment of the present application;

[0042] Figure 15 This is a flow diagram of the chip base and carrier of the chip bonding equipment disclosed in an embodiment of the present application. DETAILED DESCRIPTION

[0043] To facilitate understanding of the present application, a more comprehensive description of the present application will be provided below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0044] The following descriptions of the embodiments are with reference to the attached diagrams to illustrate specific embodiments that the present application can be used to implement. The serial numbers of the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in the present application include direct and indirect connections (couplings) unless otherwise specified. The directional terms mentioned in the present application, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0045] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be internal communication between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances. It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the drawings are used to distinguish different objects, rather than to describe a specific order.

[0046] In addition, the terms "include", "may include", "include", or "may include" used in this application indicate the existence of the corresponding functions, operations, elements, etc. disclosed, and do not limit one or more other functions, operations, elements, etc. In addition, the terms "include" or "include" indicate the existence of the corresponding features, numbers, steps, operations, elements, components, or combinations thereof disclosed in the specification, and do not exclude the existence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof, and are intended to cover non-exclusive inclusions. In addition, when describing the embodiments of the present application, "may" is used to indicate "one or more embodiments of the present application". And, the term "exemplary" is intended to refer to an example or illustration.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0048] In the existing technology, before chip attachment, the chip and its carrier need to be cleaned, and then the cleaned carrier is manually placed on the workbench of the attachment machine or placed on the loading station of the attachment machine through a carrier box. However, during the carrier transfer process, the cleaned chips are easily contaminated again, and manual plate placement is required after transfer. The uncertainty of manual work can easily lead to defective products, reduce the production qualification rate, and cause product scrapping or rework, all of which increase the production cost of the enterprise. In addition, some chip manufacturers use integrated equipment for assembly and production, but the motion structure of these integrated equipment is complex, the equipment cost is high, and there is a lack of force control and low mounting accuracy, which makes it easy to damage the product, resulting in a high defective rate after chip bonding. Moreover, in the existing chip bonding equipment in the industry, most of the cleaning machines only serve one bonding machine. This single machine supply method not only has low production efficiency, but also has high production line splicing costs.

[0049] This application aims to provide a chip attachment solution that addresses the aforementioned challenges. This solution can address the low yield and high production costs associated with existing manual chip attachment processes, further improve chip attachment accuracy and production process efficiency, and enable control of attachment force during the chip attachment process. Details of the proposed chip attachment machine and process will be described in subsequent examples.

[0050] See also Figure 1 , Figure 1 This is a schematic diagram of the arrangement of modules of a chip bonding device disclosed in an embodiment of the present application, such as Figure 1As shown, the present application provides a chip bonding device 100 for bonding chips. In the embodiment of the present application, the chip bonding device 100 may include at least: a main workbench 10, a loading and swinging plate module 20, a dispensing module 30, a carrier conveying module 40, a flipping module 50, and a bonding module 60. The total workbench 10 is used to support the loading and swinging plate module 20, the dispensing module 30, the carrier conveying module 40, the flipping module 50 and the attaching module 60, wherein the loading and swinging plate module 20 is used to place the chip base at a predetermined loading position, position and detect the chip base, and place the positioned and detected chip base in a transfer tray, the dispensing module 30 is used to position and detect the height of the placed chip base, and perform dispensing on the chip base, and transfer the chip base after dispensing to the flipping module 50, the flipping module 50 is used to flip the chip base, the carrier conveying module 40 is used to transfer the carrier with the chip installed to the attaching module 60 and transfer the carrier without the chip base attached to the next bonding device, and the attaching module 60 is used to bond the flipped chip base to the chip on the carrier.

[0051] In an embodiment of the present application, a plurality of the chip bonding devices are connected in series with a cleaning machine and a drying machine, that is, the carrier conveying module 40 receives the carrier from the chip bonding device or cleaning machine of the previous level, and transfers the carrier to the attachment module 60, and the carrier conveying module 40 also transfers the bonded carrier to the dryer or transfers the carrier to the chip bonding device of the next level.

[0052] In summary, the chip bonding device 100 of the present application does not require manual participation in the chip bonding process and transports the carrier with the chip attached to the attachment module 60 through the carrier conveying module 40, thereby avoiding secondary pollution caused by manual transportation, improving the product qualification rate and reducing production costs. The loading and panning module 20 uses a high-precision camera to locate and correct the chip base, the dispensing module 30 uses a high-precision camera to locate the chip base and uses a laser position sensor to detect the height of the chip base, and the attachment module 60 uses a high-precision camera to detect and locate the chip base, thereby improving the accuracy of chip bonding and the qualification rate of the product. Multiple chip bonding devices 100 are connected in series with a cleaning machine and a drying machine to improve the efficiency of the production process. The attachment module 60 is also provided with a force controller to ensure that the bonding force is moderate during the bonding process, avoiding damage to the product due to inadequate bonding or excessive bonding force, further improving the qualification rate of the product. Therefore, the chip bonding apparatus 100 of the present application realizes a chip bonding process with high qualification rate, low cost, high productivity, high precision and controllable bonding force.

[0053] Please also refer to Figure 2 and Figure 3 , Figure 2 This is a structural diagram of the loading assembly of the loading plate module of the chip bonding equipment disclosed in the embodiment of the present application. Figure 3 This is a schematic structural diagram of the wobble plate assembly of the loading wobble plate module of the chip bonding equipment disclosed in the embodiment of the present application. In the embodiment of the present application, the main workbench 10 is composed of two flat plates, which are used to support the loading wobble plate module 20, the glue dispensing module 30, the carrier conveying module 40, the flip module 50 and the attachment module 60. The loading wobble plate module 20 includes a loading assembly 21, a loading conveying assembly 22, a wobble plate assembly 23 and a loading transfer assembly 24. Among them, the loading assembly 21 is used to provide the chip base, the loading conveying assembly 22 is used to transport the chip base out of the loading assembly 21, the wobble plate assembly 23 is used to place the chip base in sequence to the loading transfer assembly 24, and the loading transfer assembly 24 is used to transfer the chip base to the glue dispensing module 30.

[0054] In the embodiment of the present application, the loading assembly 21 includes a plurality of loading trays 211, a loading basket 212, and a plurality of loading basket support shafts 213. The plurality of loading trays 211 are used to place a plurality of chip bases. The plurality of loading trays 211 are all located inside the loading basket 212 and are sequentially distributed along the height direction of the loading basket 212. The distance between adjacent loading baskets 212 is consistent. The loading basket 212 is a rectangular box-shaped structure with two unclosed sides. The two unclosed sides are arranged opposite to each other and face the loading and transporting assembly 22. The plurality of loading basket support shafts 213 are used to support the loading basket 212 and carry the loading basket 212 to move along the axial direction of the loading basket support shaft 213.

[0055] In the embodiment of the present application, the loading and transporting assembly 22 includes a loading and transporting workbench shaft 221 and a loading and transporting workbench 222 . In which, the axial direction of the loading and conveying workbench shaft 221 and the two unclosed surfaces of the loading basket 212 are in the same straight line, and the loading and conveying workbench 222 is installed on the loading and conveying workbench shaft 221. The loading and conveying workbench 222 is slidably connected to the loading and conveying workbench shaft 221 and can move along the axial direction of the loading and conveying workbench shaft 221. The loading and conveying workbench 222 should be higher than the bottom surface of the loading basket 212 in the height direction and lower than the loading tray 211 closest to the bottom surface of the loading basket 212 (that is, the lowest loading tray 211 in the loading basket 212), that is, the height of the loading and conveying workbench 222 is between the bottom surface of the loading basket 212 and the loading tray 211 adjacent to the bottom surface of the loading basket 212, and the loading and conveying workbench 222 is used to transport the loading tray 211 out of the loading basket 212.

[0056] In the embodiment of the present application, the loading basket 212 is placed on the loading basket support shaft 213. The loading basket 212 contains a plurality of loading trays 211 distributed sequentially along its height. The distance between adjacent loading trays 211 is equal, and a plurality of chip bases are placed on the loading trays 211. The loading and transporting workbench 222 moves along the loading and transporting workbench shaft 221 toward the unsealed surface of the loading basket 212 and stops moving after the loading and transporting workbench 222 completely enters the loading basket 212. At this time, the loading and transporting workbench 222 is higher than the bottom surface of the loading basket 212 and lower than the loading tray 211 closest to the bottom surface of the loading basket 212 (i.e., the loading tray 211 on the lowest layer within the loading basket 212). The loading basket support shaft 213 carries the loading basket 212 and moves toward the main workbench 10 through a screw drive. After the loading and transporting workbench 222 completely supports the loading tray 211 at the bottom of the loading basket 212, the loading basket support shaft 213 stops moving. That is, the moving distance is greater than the distance between the loading and transporting workbench 222 and the loading tray 211 at the bottom of the loading basket 212, and is smaller than the distance between adjacent loading baskets 212. The loading and transporting workbench 222 supports the loading tray 211 and moves along the loading and transporting workbench shaft 221 away from the loading assembly 21.

[0057] In the embodiment of the present application, the wobble plate assembly 23 includes a wobble plate support 231 , a wobble plate shaft 232 , a wobble plate connector 233 , a pickup rod control element 234 and a pickup rod 235 . Among them, the wobble plate support 231 is located on both sides of the loading and transporting workbench shaft 221 and is fixedly connected to the main workbench 10, the wobble plate shaft 232 is fixed on the side of the wobble plate support 231 away from the main workbench 10, and spans the loading and transporting workbench shaft 221 and is perpendicular to the loading and transporting workbench shaft 221, the wobble plate connecting member 233 is located on the side of the wobble plate shaft 232 away from the wobble plate support 231 and is slidably connected to the wobble plate shaft 232, the wobble plate connecting member 233 can move along the axial direction of the wobble plate shaft 232, and the picking rod control element 234 is fixed on the side of the wobble plate connecting member 233 facing the loading assembly 21, and the picking rod control element 234 is used to control the picking rod 235 to pick up the chip base. One end of the picking rod 235 is located in the picking rod control element 234 and is slidably connected to the picking rod control element 234. The picking rod 235 is perpendicular to the swing plate shaft 232, and the axial direction of the picking rod 235 is toward the main workbench 10. The picking rod 235 is used to absorb the chip base and can move toward or away from the main workbench 10 and correct the chip base.

[0058] In the embodiment of the present application, the loading transfer assembly 24 includes a transfer tray shaft 241, a transfer tray connector 242, and a transfer tray 243. The transfer tray shaft 241 is parallel to the loading and transporting workbench shaft 221 and is located on the inner side of the swing plate support 231. The transfer tray shaft 241 is fixedly connected to the main workbench 10. The transfer tray connector 242 is located on the side of the transfer tray shaft 241 facing away from the main workbench 10 and is slidably connected to the transfer tray shaft 241. The transfer tray connector 242 can move along the axial direction of the transfer tray shaft 241. The transfer tray 243 is located on the side of the transfer tray connector 242 facing away from the transfer tray shaft 241 and is used to hold the chip base.

[0059] In the embodiment of the present application, the loading and swinging plate module 20 also includes a loading and positioning camera assembly (not shown) and a loading and correction camera assembly (not shown). The loading and positioning camera assembly is located between the loading and transporting workbench shaft 221 and the swinging plate shaft 232, and is used to take pictures and position the chip bases on the loading tray 211, so as to obtain the placement of each chip base, so that the pick-up rod 235 can accurately pick up each chip base. The loading and correction camera assembly is located between the loading and transporting workbench shaft 221 and the transfer tray shaft 241, and is located below the pick-up rod 235. The loading and correction camera assembly is used to detect whether the chip base is qualified and take pictures for calibration.

[0060] In the embodiment of the present application, the loading and transporting workbench 222 supports the loading tray 211 and moves along the loading and transporting workbench axis 221 in a direction away from the loading assembly 21. The loading and transporting workbench 222 is located in a straight line with the loading correction camera assembly and the transfer tray connector 242. The loading positioning camera assembly takes pictures of the chip bases to obtain the placement status of each chip base. The swing plate connector 233 moves along the axial direction of the swing plate axis 232 to directly above the loading and transporting workbench 222. The pick rod control component 234 controls the pick rod 235 to downwardly absorb a single chip base. The pick rod 235 then returns a predetermined distance and moves directly above the loading correction camera assembly. After the loading correction camera assembly detects that the chip base is qualified, the pick rod 235 moves above the transfer tray 243. The pick rod control component 234 controls the pick rod 235 to move downward and release the chip base. In this way, the placement of one chip base is completed, and the above steps are repeated until the transfer tray 243 is full of chip bases. The transfer tray 243 moves along the transfer tray axis 241 in the direction away from the swing plate assembly 23, and the transfer tray connector 242 transports the transfer tray 243 to the dispensing module 30.

[0061] Please also refer to Figures 4 to 7 , Figure 4 This is a structural diagram of the dispensing component of the dispensing module of the chip bonding equipment disclosed in the embodiment of the present application. Figure 5 This is a structural diagram of the first pusher assembly of the dispensing module of the chip bonding equipment disclosed in the embodiment of the present application. Figure 6 This is a structural diagram of the second pusher assembly of the dispensing module of the chip bonding equipment disclosed in the embodiment of the present application. Figure 7 This is a schematic structural diagram of the dispensing workbench of the dispensing module of the chip bonding equipment disclosed in an embodiment of the present application.

[0062] In the embodiment of the present application, the dispensing module 30 includes a dispensing assembly 31, a first pushing assembly 32, a second pushing assembly 33, and a dispensing table assembly 34. The first pushing assembly 32 and the second pushing assembly 33 are arranged side by side and relative to the dispensing assembly 31, and the dispensing table assembly 34 is located between the dispensing assembly 31 and the first pushing assembly 32. The first pushing assembly 32 is used to push the transfer tray 243 to the dispensing table assembly 34, the dispensing assembly 31 is used to perform dispensing on the chip base on the transfer tray 243, and the second pushing assembly 33 is used to push the transfer tray 243 after dispensing to the flip module 50.

[0063] like Figure 4As shown, in the embodiment of the present application, the dispensing assembly 31 includes a dispensing spindle 311, a first dispensing shaft 312, a second dispensing shaft 313, a first dispensing arm 314, a first dispensing head 315, a third dispensing shaft 316, a fourth dispensing shaft 317, a second dispensing arm 318 and a second dispensing head 319. Among them, the dispensing spindle 311 and the swing plate shaft 232 are on the same straight line and are fixedly connected to the total workbench 10. The dispensing spindle 311 is located on the side of the transfer tray shaft 241 away from the loading and handling workbench shaft 221. The first dispensing spindle 312 is located on the side of the dispensing spindle 311 away from the total workbench 10 and is slidingly connected to the dispensing spindle 311. The first dispensing spindle 312 can be perpendicular to the dispensing spindle 311 and can move along the axial direction of the dispensing spindle 311. The second dispensing spindle 313 is located on the side of the first dispensing spindle 312 away from the dispensing spindle 311 and is slidingly connected to the first dispensing spindle 312. The second dispensing spindle 313 is perpendicular to the first dispensing spindle 312 and the axial direction of the second dispensing spindle 313 is toward the total workbench 10. The second dispensing spindle 313 can move along the axial direction of the first dispensing spindle 312. One end of the first dispensing arm 314 is perpendicular to and slidably connected to the second dispensing shaft 313, and the other end thereof is close to the first pusher assembly 32. The first dispensing arm 314 can move along the axial direction of the second dispensing shaft 313. The first dispensing head 315 is fixed to the end of the first dispensing arm 314 away from the second dispensing shaft 313. The first dispensing head 315 is used to perform dispensing operations on the front half of the chip base on the transfer tray 243. The third dispensing shaft 316 is located on the side of the dispensing spindle 311 away from the main workbench 10 and is slidably connected to the dispensing spindle 311. The third dispensing shaft 316 is located on the side of the first dispensing shaft 312 away from the wobble plate assembly 23 and is parallel to the first dispensing shaft 312. The third dispensing shaft 316 can move along the axial direction of the dispensing spindle 311. The fourth dispensing axis 317 is located on the side of the third dispensing axis 316 away from the dispensing main axis 311 and is slidably connected to the third dispensing axis 316. The fourth dispensing axis 317 is perpendicular to the third dispensing axis 316 and the axial direction of the fourth dispensing axis 317 is toward the main workbench 10. The fourth dispensing axis 317 can move along the axial direction of the third dispensing axis 316. One end of the second dispensing arm 318 is perpendicular to and slidably connected to the fourth dispensing axis 317, and the other end is close to the second pusher assembly 33. The second dispensing arm 318 can move along the axial direction of the fourth dispensing axis 317. The second dispensing head 319 is fixed to the end of the second dispensing arm 318 away from the fourth dispensing axis 317. The second dispensing head 319 is used to perform dispensing operations on the rear half of the chip base on the transfer tray 243.The first dispensing arm 314 and the second dispensing arm 318 are both provided with a dispensing positioning camera (not shown) and a laser position sensor (not shown). The dispensing positioning camera is used to take pictures and locate the chip base on the transfer tray 243 to obtain the position information of each chip base, so that the first dispensing head 315 and the second dispensing head 319 can accurately perform dispensing operations on each chip base. The laser position sensor is used to detect the height of each chip base to avoid dispensing failure due to the height difference of the chip base.

[0064] like Figure 5 As shown, in the embodiment of the present application, the first pushing assembly 32 is arranged opposite to the first dispensing shaft 312, and the first pushing assembly 32 includes a first pushing spindle 321, a first pushing connecting piece 322, a first pushing lifting shaft 323 and a first dispensing arm 324. When the fixing plate 320 is in the closed position, the fixing plate 320 is in the closed position, and the fixing plate 320 is in the closed position. When the fixing plate 320 is in the closed position, the fixing plate 320 is in the closed position, and the fixing plate 320 is in the closed position.

[0065] like Figure 6As shown, in the embodiment of the present application, the second pushing assembly 33 is arranged opposite to the third dispensing shaft 316, and the second pushing assembly 33 includes a second pushing spindle 331, a second pushing connecting piece 332, a second pushing lifting shaft 333 and a second dispensing arm 334. Among them, the second pushing spindle 331 is arranged opposite to and parallel to the dispensing spindle 311, the second pushing connecting piece 332 is arranged on the side of the second pushing spindle 331 facing the dispensing assembly 31 and is slidably connected to the dispensing assembly 31, the second pushing connecting piece 332 can move along the axial direction of the second pushing spindle 331, one end of the second pushing lifting shaft 333 is slidably connected to the second pushing connecting piece 332, and the end of the second pushing lifting shaft 333 facing away from the second pushing connecting piece 332 is fixedly connected to the second digging arm 334, the second digging arm 334 is perpendicular to the second pushing spindle 332 and extends toward the direction of the dispensing assembly 31, the second digging arm 334 is slidably connected to the second pushing connecting piece 332, and the sliding direction is consistent with the axial direction of the second pushing lifting shaft 333. The second material dispensing arm 334 is used to push the transfer tray 243 to the second dispensing workbench 343 , and push the transfer tray 243 on which the dispensing of the rear half of the chip base is completed to the flip module 50 .

[0066] like Figure 7 As shown, in the embodiment of the present application, the dispensing table assembly 34 is arranged between the dispensing assembly 31 and the first pushing assembly 32 and the second pushing assembly 33, and the dispensing table assembly 34 includes a dispensing table support 341, a first dispensing table 342 and a second dispensing table 343. Among them, the dispensing table support 341 is fixedly connected to the total workbench 10, the first dispensing table 342 and the second dispensing table 343 are located on the side of the dispensing table support 341 away from the total workbench 10, the first dispensing table 342 is located below the first dispensing head 315, and the second dispensing table 343 is located below the second dispensing head 319. The first dispensing table 342 and the second dispensing table 343 are both used to support and fix the transfer tray 243. The dispensing module 30 should also include a feed port (not shown), which is located between the transfer tray shaft 241 and the dispensing workbench assembly 34 and is in a straight line with the dispensing workbench assembly 34.

[0067] In an embodiment of the present application, the transfer tray connector 242 transports the transfer tray 243 to the feed port of the dispensing module 30, and the feed port supports the transfer tray 243 and rises to be flush with the first dispensing workbench 342, and the first material dispensing arm 324 moves to the side of the transfer tray 243 close to the transfer tray axis 241 through the first pushing spindle 321 and the first pushing lifting shaft 323 and aligns with the transfer tray 243, and the first material dispensing arm 324 clamps and pushes the transfer tray 243 onto the first dispensing workbench 342, and the first material dispensing arm 324 releases the transfer tray 243, and the dispensing positioning camera on the first dispensing arm 314 takes a picture of the chip base and the laser position sensor performs height detection on the chip base to obtain the position and height information of the chip base, and the first dispensing head 315 performs dispensing operation on the front half of the chip base on the transfer tray 243. After the gluing operation of the chip base in the first half is completed, the second material dispensing arm 334 moves to the side of the transfer tray 243 close to the feed port through the second material pushing spindle 331 and the second material pushing lifting shaft 333 and aligns with the transfer tray 243. The second material dispensing arm 334 clamps and pushes the transfer tray 243 onto the second gluing workbench 343. The second material dispensing arm 334 releases the transfer tray 243. The gluing positioning camera on the second gluing arm 318 takes a picture of the chip base and the laser position sensor performs height detection on the chip base to obtain the position and height information of the chip base. The second gluing head 319 performs gluing operation on the second half of the chip base on the transfer tray 243. After the chip base glue operation in the second half is completed, the second material dispensing arm 334 slides to the side of the transfer tray 243 close to the first dispensing workbench 342 and aligns with the transfer tray 243. The second material dispensing arm 334 clamps and pushes the transfer tray 243 to the flip module 50.

[0068] Please look back Figure 1 Shown and referenced Figure 8 , Figure 8This is a schematic diagram of the bottom conveying line of the carrier conveying module of the chip bonding equipment disclosed in an embodiment of the present application. In this embodiment of the present application, the carrier conveying module 40 is arranged on the side of the first pusher assembly 32 and the second pusher assembly 33 facing away from the dispensing assembly 31. The carrier conveying module 40 includes an input line 41, a lifting line 42, a lifting line shaft 43, an output line 44, and a bottom conveying line 45. Among them, the input assembly line 41, the lifting assembly line 42, the output assembly line 44 and the bottom conveying assembly line 45 are parallel to the first pushing spindle 321, the lifting assembly line shaft 43 is fixedly connected to the total workbench 10 and is perpendicular to the lifting assembly line 42, the lifting assembly line 42 is slidably connected to the lifting assembly line shaft 43 and can move along the axial direction of the lifting assembly line shaft 43, the lifting assembly line 42 and the output assembly line 44 are located on both sides of the attachment module 60, the input assembly line 41 is located at one end of the lifting assembly line 42 away from the attachment module 60, and the input assembly line 41 is away from the lifting assembly line One end of the water line 42 is connected to the cleaning machine or the chip bonding equipment of the previous level, and the end of the output line 44 away from the attachment module 60 is connected to the drying machine or the chip bonding equipment of the next level. The output line 44 also has a lifting function to facilitate receiving the carriers with chip bases attached and the carriers without chip bases attached. The bottom conveying line 45 is located between the output line 44 and the main workbench 10. The bottom conveying line 45 includes a carrier input end 451 and a carrier output end 452. The carrier input end 451 is close to the lifting line 42, and the carrier output end 452 is close to the output line 44. The carrier conveying module 40 should also include two baffles 411, a carrier sensor (not shown), and a carrier push rod (not shown). Among them, the two material baffles 411 are respectively installed at the two ends of the input assembly line 41 close to and far away from the lifting assembly line 42, and are used to control the conveying amount and conveying speed of the carrier. The carrier sensor is set on the lifting assembly line 42, and is used to sense whether the carrier leaves the lifting assembly line 42. The carrier pushing rod is used to push the carrier to the attachment module 60.

[0069] In the embodiment of the present application, the lifting line 42 moves along the axial direction of the lifting line axis 43 and is flush with the input line 41. The input line 41 transports the carrier delivered from the cleaning machine or the previous chip bonding equipment to the lifting line 42. The carrier carries a number of chips. The baffle plate 411 is raised and lowered according to the bonding situation, thereby controlling the delivery volume and delivery speed of the carrier. The lifting line 42 transports the carrier to the bonding module 60. When the carrier sensor senses that the carrier has left the lifting line 42, the carrier push rod pushes the carrier to the bonding module 60. The output line 44 transports the attached carrier to the dryer. The lifting line 42 moves along the axial direction of the lifting line axis 43 and is flush with the bottom conveying line 45. The lifting line 42 conveys the carrier to the bottom conveying line 45. The output line 44 is flush with the bottom conveying line 45 and conveys the carrier to the next-level chip bonding equipment.

[0070] Please also refer to Figures 9 to 14 , Figure 9 This is a structural diagram of the flip table assembly of the flip module of the chip bonding equipment disclosed in the embodiment of the present application. Figure 10 This is a structural diagram of a flip assembly of a flip module of a chip bonding device disclosed in an embodiment of the present application. Figure 11 This is a structural diagram of a flip assembly positioning camera of a flip module of a chip bonding device disclosed in an embodiment of the present application. Figure 12 This is a structural diagram of the attachment component of the flip module of the chip bonding equipment disclosed in the embodiment of the present application. Figure 13 This is a structural diagram of the attaching workbench assembly of the flip module of the chip bonding equipment disclosed in the embodiment of the present application. Figure 14 This is a structural diagram of the attachment and positioning camera assembly of the flip module of the chip bonding equipment disclosed in an embodiment of the present application.

[0071] like Figure 9 and Figure 10 As shown, in the embodiment of the present application, the flip module 50 includes a flip table assembly 51 and a flip assembly 52. The flip table assembly 51 is used to receive the transfer tray 243 transmitted from the second material diverter arm 334, and the flip assembly 52 is used to flip the chip base on the transfer tray 243.

[0072] In the embodiment of the present application, the flip table assembly 51 includes a first flip axis 511, a second flip axis 512, a flip table connector 513, and a flip table 514. The first flip axis 511 is fixedly connected to the main workbench 10, and the axial direction of the first flip axis 511 is aligned with the first dispensing table 342 and the second dispensing table 343. The first flip axis 511 is located on the side of the second dispensing table 343 facing away from the first dispensing table 342, that is, the first flip axis 511 and the second dispensing table 343 are located on opposite sides of the first dispensing table 342, respectively. The second flip axis 512 is located on the side of the first flip axis 511 away from the total workbench 10 and is perpendicular to the first flip axis 511. The second flip axis 512 is slidably connected to the first flip axis 511 and can move along the axial direction of the first flip axis 511. The flip workbench connector 513 is located on the side of the second flip axis 512 away from the first flip axis 511 and is parallel to the first flip axis 511. The flip workbench connector 513 is slidably connected to the second flip axis 512 and can move along the axial direction of the second flip axis 512. One end of the flip workbench connector 513 extends toward the direction of the second glue dispensing workbench 343. The protruding end of the flip workbench connector 513 is used to support and fix the flip workbench 514. The height of the flip workbench 514 from the total workbench 10 is consistent with the height of the second glue dispensing workbench 343 from the total workbench 10. The flip workbench 514 is used to support and fix the transfer tray 243.

[0073] In an embodiment of the present application, the flipping workbench 514 is moved to the same straight line as the first dispensing workbench 342 and the second dispensing workbench 343 through the first flipping axis 511 and the second flipping axis 512, and is close to the second dispensing workbench 343. The second material dispensing arm 334 pushes the transfer tray 243 to the flipping workbench 514. The flipping workbench 514 fixes the transfer tray 243 and moves the flipping assembly 52 to the bottom through the first flipping axis 511 and the second flipping axis 512.

[0074] like Figure 10 and Figure 11As shown, in an embodiment of the present application, the flipping assembly 52 is located on the side of the second dispensing arm 318 away from the first dispensing arm 314, and the flipping assembly 52 includes a flipping assembly support 521, a flipping assembly connector 522, a flipping assembly positioning camera 523, a flipping spindle 524, a flipping spindle connector 525, a rotating member 526, a suction rod 527 and a suction head 528. Among them, the flip assembly support 521 is fixedly connected to the total workbench 10, and the end of the flip assembly support 521 facing away from the total workbench 10 is fixedly connected to the flip assembly connector 522. The flip assembly positioning camera 523 is located on the side of the flip assembly connector 522 facing the flip workbench assembly 51. The flip spindle 524 is fixed on one side of the flip assembly support 521 and its axial direction is parallel to the height direction of the flip assembly support 521. The flip spindle connector 525 is sleeved on the circumferential side of the flip spindle 524 and is slidably connected to the flip spindle 524. The flip spindle connector 525 can move along the axial direction of the flip spindle 524. One end of the rotating member 526 is fixedly connected to the flip spindle connecting member 525, and one end of the suction rod 527 is fixedly connected to the end of the rotating member 526 away from the flip spindle connecting member 525. The axial direction of the suction rod 527 is toward the flip workbench assembly 51. The rotating member 526 can rotate along the tangential direction of the suction rod 527 with the suction rod 527. The suction head 528 is fixed to the end of the suction rod 527 away from the rotating member 526. The suction head 528 is used to suck the chip base on the transfer tray 243.

[0075] In the application embodiment, the flip workbench 514 holds the transfer tray 243 and moves to the bottom of the flip component positioning camera 523 through the first flip axis 511 and the second flip axis 512. The flip component positioning camera 523 takes a picture of the transfer tray 243 to obtain the position information of each chip base placed in the transfer tray 243. The first flip axis 511 and the second flip axis 512 are used to make the single chip base directly under the suction head 528. The flip spindle connector 525 moves toward the direction of the suction head 528 facing the transfer tray 243, so that the suction head 528 maintains a predetermined gap with the chip base, and the suction head 528 sucks the chip base. Seat, then the flip spindle connector 525 moves toward the direction of the suction head 528 away from the transfer tray 243, and the moving distance satisfies that the chip base will not contact the transfer tray 243 during rotation, and the rotating member 526 rotates 180 degrees with the suction rod 527 and the suction head 528, that is, the end of the chip base where the glue is dispensed faces the transfer tray 243, and the flip spindle connector 525 moves toward the direction of the suction head 528 facing the transfer tray 243, so that the suction head 528 maintains a predetermined gap with the chip base, and then the suction head 528 releases the chip base, thus completing the rotation of a single chip base, and repeating the above steps to complete the flipping of each chip base.

[0076] like Figure 12 and Figure 13 As shown, in this embodiment of the present application, the attachment module 60 includes an attachment assembly 61 and an attachment workbench assembly 62. The attachment assembly 61 is used to correct and inspect the chip base and attach the chip base to the carrier, and the attachment workbench assembly 62 is used to receive the carrier transferred from the lifting line 42 and transport the carrier to the output line 44.

[0077] In the embodiment of the present application, the attachment assembly 61 includes an attachment assembly support 611 , an attachment spindle 612 , an attachment head connector 613 , and an attachment head 614 . Among them, the attachment component support 611 is fixedly connected to the total workbench 10, the attachment spindle 612 is located on the side of the attachment component support 611 facing the flip component 51 and the flip workbench assembly 52, the attachment spindle 612 is fixedly connected to the attachment component support 611, the attachment head connector 613 is located on the side of the attachment spindle 612 away from the attachment component support 611 and is slidably connected to the attachment spindle 612, the attachment head connector 613 can move along the axial direction of the attachment spindle 612, the attachment head 614 is located on the side of the attachment head connector 613 away from the attachment spindle 612 and is fixedly connected to the attachment head connector 613, the attachment head 614 can be extended and retracted in the direction facing the total workbench 10, and the attachment head 614 is used to absorb the chip base and correct the chip base after absorption. The attachment assembly 61 also includes an attachment correction camera (not shown). The attachment correction camera is located between the flip table assembly 51 and the attachment table assembly 62, and the distance between the attachment correction camera and the main table 10 is less than the distance between the attachment head 614 and the main table 10. The attachment correction camera is used to take pictures of the chip base to facilitate detection of whether the chip base is qualified. The attachment head 614 also includes a force controller module (not shown), which is mainly used to control the attachment force of the attachment head 614.

[0078] Specifically, in the embodiment of the present application, the suction head 528 completes the flipping of each chip base on the transfer tray 243, and the transfer tray 243 is moved to the bottom of the attachment head 614 through the first flip axis 511 and the second flip axis 512. The attachment head 614 absorbs the chip base on the transfer tray 243 and moves to the top of the attachment correction camera. The attachment correction camera takes a picture of the chip base. If the inspection is qualified, the attachment head 614 will move the chip base along the axial direction of the attachment spindle 612 to the attachment workbench assembly 62. If the inspection is unqualified, the attachment head 614 will throw the unqualified chip base into the throwing box (not shown).

[0079] like Figure 13 and Figure 14As shown, in the embodiment of the present application, the attachment workbench assembly 62 is located between the lifting assembly line 42 and the output assembly line 44, and the attachment workbench assembly 62 includes a first attachment axis 621, a second attachment axis 622, an attachment workbench 623, an attachment positioning camera connector 624, and an attachment positioning camera 625. The first attachment axis 621 is fixedly connected to the main workbench 10 and is parallel to the lifting assembly line axis 43, the second attachment axis 622 spans the first attachment axis 621 and is perpendicular to the first attachment axis 621 and is slidably connected, the second attachment axis 622 can move along the axial direction of the first attachment axis 621, the attachment workbench 623 spans the second attachment axis 622 and is perpendicular to the second attachment axis 622 and is slidably connected, the attachment workbench 623 can move along the axial direction of the second attachment axis 622, and the attachment workbench 623 is parallel to the first attachment axis 621. The attachment workbench 623 is used to support and fix the carrier transported from the lifting assembly line 42. One end of the attachment positioning camera connector 624 is located on the side of the attachment component support 611 away from the main workbench 10, and is located above the first attachment axis 621. The attachment camera connector 624 extends toward the lifting assembly line 42 at one end away from the attachment component support 611. The extension end of the attachment camera connector 624 is fixed with the attachment positioning camera 625. The attachment positioning camera 625 is used to take pictures of the chips on the carrier to obtain the position information of each chip.

[0080] In an embodiment of the present application, the lifting line 42 moves along the axial direction of the lifting line axis 43 and is flush with the attachment workbench 623. The attachment workbench 623 is close to the lifting line 42 through the first attachment axis 621 and the second attachment axis 622. The attachment workbench 623 and the lifting line 42 are located on the same straight line. The carrier pushing rod pushes the carrier on the lifting assembly line 42 to the attaching workbench 623, and the attaching workbench 623 moves to the bottom of the attaching positioning camera 625 through the first attaching axis 621 and the second attaching axis 622. The attaching positioning camera 625 takes a picture of the carrier to obtain the position information of each chip on the carrier. The attaching head 614 moves the chip base to the top of the attaching workbench 623 and aligns it with the position of the chip. The attaching head 614 moves in the direction facing the attaching workbench 623 and attaches the chip base to the chip. During the attaching process, the force controller module monitors and controls the attaching force in real time, thereby completing the attachment of the chip base to the chip. Repeat the above steps to complete the attachment of each chip on the carrier.

[0081] In an embodiment of the present application, the attachment workbench 623 is moved closer to the output assembly line 44 through the first attachment axis 621 and the second attachment axis 622. The attachment workbench 623 and the output assembly line 44 are on the same straight line and flush. The attachment workbench 623 releases the fixation of the carrier and transports the carrier to the output assembly line 44. The output assembly line 44 transports the carrier to the dryer.

[0082] Please also refer to Figure 7 In the embodiment of the present application, the chip bonding equipment 100 further includes a recycling line 70 and a recycling workbench (not shown). The recycling line 70 is located on the inner side of the dispensing workbench support 341 and below the first dispensing workbench 342. The recycling line 70 is fixedly connected to the main workbench 10, and the recycling workbench is located between the recycling line 70 and the first flip axis 511. The recycling workbench is used to receive the transfer tray 243 and transport the transfer tray 243 to the recycling line 70. The recycling line 70 is used to transport the transfer tray 243 to the feed port.

[0083] In the embodiment of the present application, after the attaching head 614 absorbs all the chip bases on the transfer tray 243, the flipping workbench 514 moves closer to the recovery assembly line 70 through the first flipping axis 511 and the second flipping axis 512, and moves to directly above the recovery workbench, the recovery workbench lifts up and fixes the transfer tray 243, the flipping workbench 514 moves away from the recovery assembly line 70 through the first flipping axis 511 and the second flipping axis 512, the recovery workbench is flush with the recovery assembly line 70 downward, and transports the transfer tray 243 to the recovery assembly line 70, the recovery assembly line 70 transports the transfer tray 243 to the feed port, the feed port transports the transfer tray 243 to the transfer tray connector 242, the transfer tray connector 242 moves toward the swing plate assembly 23 along the axial direction of the transfer tray axis 241, and the transfer tray 243 waits for the next round of chip base placement. In this way, the recycling of the transfer tray 243 is completed.

[0084] Please also refer to Figure 15 , Figure 15This is a schematic diagram of the flow of chip bases and carriers in the chip bonding equipment disclosed in an embodiment of the present application. In this embodiment of the present application, the flow of the chip bases is, in order, the loading tray 211, the loading and transporting workbench 222, the transfer tray connector 242, the feed port, the first dispensing workbench 342, the second dispensing workbench 343, the flipping workbench 514, and the attaching workbench 623. The flow of the carrier is, in order, the cleaning machine or the previous chip bonding equipment, the input assembly line 41, the lifting assembly line 42, the attaching workbench 623, the output assembly line 44 or the bottom conveying assembly line 45, and the dryer or the next chip bonding equipment.

[0085] In summary, the chip bonding equipment 100 of the present application does not require manual participation in the chip bonding process and transports the carrier with the chip attached to the flip module 50 through the carrier conveying module 40, avoiding secondary contamination caused by manual transfer operations, improving product qualification and reducing production costs. In addition, the loading and panning module 20 uses the loading positioning camera assembly and the loading correction camera assembly to position and correct the chip base. The dispensing module 30 uses the dispensing positioning camera to position the chip base and uses the laser position sensor to detect the chip base height. The flip module 50 uses the flip assembly positioning camera 523, the attachment correction camera, and the attachment positioning camera 625 to detect and position the chip base, thereby improving the accuracy of chip bonding and the product qualification rate. In addition, multiple chip bonding equipment are connected in series with a cleaning machine and a drying machine to improve the efficiency of the production process. The attachment head 614 is also equipped with the force controller module to ensure that the attachment force is moderate during the attachment process, avoiding damage to the product due to inadequate attachment or excessive attachment force, further improving the product qualification rate. The chip bonding apparatus 100 of the present application is also provided with a recycling line 70, which enables the recycling of the transfer tray 243. Therefore, the chip bonding apparatus 100 of the present application achieves a chip bonding process with high pass rate, low cost, high productivity, high precision, and controllable bonding force.

[0086] It should be understood that the application of this application is not limited to the above examples. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the scope of protection of the claims appended to this application. Those skilled in the art will understand that implementing all or part of the processes of the above embodiments and making equivalent changes in accordance with the claims of this invention still fall within the scope of the invention.

Claims

1. A chip bonding device, characterized in that: include: A total workbench and a loading and swinging plate module, a dispensing module, a carrier conveying module, a flipping module and an attaching module installed on the total workbench, wherein the loading and swinging plate module is used to place the chip base at a predetermined loading position, position and detect the chip base, and place the positioned and detected chip base in a transfer tray; the dispensing module is used to position and detect the height of the placed chip base, and perform a dispensing operation on the chip base, and transfer the chip base after dispensing to the flipping module; the flipping module is used to flip the chip base; the carrier conveying module is used to transfer the carrier with the chip installed to the attaching module and transfer the carrier without the chip base attached to the next attaching device; the attaching module is used to attach the flipped chip base to the chip on the carrier; The carrier conveying module includes an input assembly line, a lifting assembly line, a lifting assembly line shaft, an output assembly line and a bottom conveying assembly line, the lifting assembly line shaft is fixedly connected to the total workbench and is perpendicular to the lifting assembly line, the lifting assembly line is slidably connected to the lifting assembly line shaft and can move along the axial direction of the lifting assembly line shaft, the lifting assembly line and the output assembly line are located on both sides of the attachment module, the input assembly line is located at the end of the lifting assembly line away from the attachment module, the end of the input assembly line away from the lifting assembly line is connected to the cleaning machine or the upper-level chip bonding equipment, the end of the output assembly line away from the attachment module is connected to the drying machine or the next-level chip bonding equipment, the output assembly line also has a lifting function, the bottom conveying assembly line is located between the output assembly line and the total workbench, the bottom conveying assembly line includes a carrier input end and a carrier output end, the carrier input end is close to the lifting assembly line, and the carrier output end is close to the output assembly line.

2. The chip bonding equipment according to claim 1, wherein: The loading and swinging plate module includes a loading component, a loading and transporting component, a swinging plate component and a loading and transfer component, wherein the loading component is used to provide the chip base, the loading and transporting component is used to transport the chip base out of the loading component, the swinging plate component is used to place the chip base in sequence to the loading and transfer component, and the loading and transfer component is used to transfer the chip base to the dispensing module.

3. The chip bonding equipment according to claim 2, wherein: The loading assembly includes multiple loading trays, a loading basket and multiple loading basket support shafts, wherein the multiple loading trays are used to place the chip base, the multiple loading trays are located inside the loading basket and are distributed in sequence along the height direction of the loading basket, the two unclosed sides of the loading basket are arranged opposite to each other and face the loading conveying assembly, and the multiple loading basket support shafts are used to support the loading basket and move the loading basket along the axial direction of the loading basket support shaft.

4. The chip bonding equipment according to claim 3, wherein: The loading and conveying assembly includes a loading and conveying workbench shaft and a loading and conveying workbench, wherein the loading and conveying workbench is slidably connected to the loading and conveying workbench shaft and moves along the axial direction of the loading and conveying workbench shaft, and the height of the loading and conveying workbench is between the bottom surface of the loading basket and the loading tray adjacent to the bottom surface of the loading basket, and the loading and conveying workbench is used to transport the loading tray out of the loading basket.

5. The chip bonding equipment according to claim 4, wherein: The cam assembly comprises a swing plate support, a swing plate shaft, a swing plate connecting piece, a picking rod control element and a picking rod, wherein the swing plate support is located on both sides of the loading and transporting workbench axis and is fixedly connected to the main workbench, the swing plate shaft is fixed on the side of the swing plate support away from the main workbench, spans the loading and transporting workbench axis and is perpendicular to the loading and transporting workbench axis, the swing plate connecting piece is located on the side of the swing plate shaft away from the swing plate support and is slidably connected to the swing plate shaft, the picking rod control element is fixed on the side of the swing plate connecting piece facing the loading assembly, one end of the picking rod is located in the picking rod control element and is slidably connected to the picking rod control element, the picking rod is perpendicular to the swing plate shaft, and the axial direction of the picking rod is toward the main workbench, the swing plate connecting piece moves along the axial direction of the swing plate shaft, and the picking rod control element is used to control the picking rod to move toward or away from the main workbench and pick up the chip base and correct the chip base.

6. The chip bonding equipment according to claim 5, wherein: The loading transfer assembly includes a transfer tray shaft, a transfer tray connector and a transfer tray, wherein the transfer tray shaft is parallel to the loading and handling workbench shaft and is located on the inner side of the swing plate support, the transfer tray shaft is fixedly connected to the main workbench, the transfer tray connector is located on the side of the transfer tray shaft facing away from the main workbench and is slidingly connected to the transfer tray shaft, the transfer tray is located on the side of the transfer tray connector facing away from the transfer tray shaft, the transfer tray connector moves along the axial direction of the transfer tray shaft, and the transfer tray is used to hold the chip base.

7. The chip bonding equipment according to claim 6, wherein: The loading and swinging plate module also includes a loading positioning camera assembly and a loading correction camera assembly, wherein the loading positioning camera assembly is located between the loading and transporting workbench axis and the swing plate axis, and is used to take pictures and position the chip base on the loading tray; the loading correction camera assembly is located between the loading and transporting workbench axis and the transfer tray axis and below the picking rod; the loading correction camera assembly is used to detect whether the chip base meets the predetermined requirements and take pictures for calibration; the picking rod corrects the chip base and places it into the transfer tray.

8. The chip bonding equipment according to claim 6, wherein: The dispensing module includes a dispensing component, a first pushing component, a second pushing component and a dispensing workbench component, wherein the first pushing component and the second pushing component are arranged side by side and relative to the dispensing component, and the dispensing workbench component is located between the dispensing component and the first pushing component. The first pushing component is used to push the transfer tray to the dispensing workbench component, and the dispensing component is used to perform dispensing operations on the chip base on the transfer tray. The second pushing component is used to push the transfer tray after dispensing to the flip module.

9. The chip bonding equipment according to claim 8, wherein: The dispensing assembly includes a dispensing spindle, a first dispensing spindle, a second dispensing spindle, a first dispensing arm, a first dispensing head, a third dispensing spindle, a fourth dispensing spindle, a second dispensing arm and a second dispensing head, wherein the dispensing spindle and the swing plate spindle are in the same straight line and are fixedly connected to the total workbench, the dispensing spindle is located on the side of the transfer tray axis away from the loading and handling workbench axis, the first dispensing spindle is located on the side of the dispensing spindle away from the total workbench and is slidably connected to the dispensing spindle, the first dispensing spindle is perpendicular to the dispensing spindle and along the dispensing spindle The first dispensing shaft is located on the side of the first dispensing shaft away from the dispensing main shaft and is slidably connected to the first dispensing shaft. The second dispensing shaft is perpendicular to the first dispensing shaft and the axial direction of the second dispensing shaft is toward the total workbench. The second dispensing shaft can move along the axial direction of the first dispensing shaft. One end of the first dispensing arm is perpendicular to the second dispensing shaft and is slidably connected, and the other end is close to the first pushing assembly. The first dispensing arm can move along the axial direction of the second dispensing shaft. The first dispensing head is fixed to the first dispensing shaft. One end of the dispensing arm is away from the second dispensing shaft, and the first dispensing head is used to perform dispensing operation on the front half of the chip base on the transfer tray. The third dispensing shaft is located on the side of the dispensing spindle away from the total workbench and is slidably connected to the dispensing spindle. The third dispensing shaft is located on the side of the first dispensing shaft away from the wobble plate assembly and is parallel to the first dispensing shaft. The third dispensing shaft moves along the axial direction of the dispensing spindle. The fourth dispensing shaft is located on the side of the third dispensing shaft away from the dispensing spindle and is slidably connected to the third dispensing shaft. The fourth dispensing axis is perpendicular to the third dispensing axis and the axial direction of the fourth dispensing axis is toward the total workbench. The fourth dispensing axis can move along the axial direction of the third dispensing axis. One end of the second dispensing arm is perpendicular to and slidably connected to the fourth dispensing axis, and the other end thereof is close to the second pushing assembly. The second dispensing arm can move along the axial direction of the fourth dispensing axis. The second dispensing head is fixed to the end of the second dispensing arm away from the fourth dispensing axis. The second dispensing head is used to perform dispensing operations on the rear half of the chip base on the transfer tray.

10. The chip bonding equipment according to claim 9, wherein: The dispensing workbench assembly includes a dispensing workbench support, a first dispensing workbench and a second dispensing workbench, wherein the dispensing workbench support is fixedly connected to the main workbench, the first dispensing workbench and the second dispensing workbench are located on the side of the dispensing workbench support away from the main workbench, the first dispensing workbench is located below the first dispensing head, and the second dispensing workbench is located below the second dispensing head, and the first dispensing workbench and the second dispensing workbench are both used to support and fix the transfer tray.

11. The chip bonding equipment according to claim 10, wherein: The first pushing assembly includes a first pushing spindle, a first pushing connecting piece, a first pushing lifting shaft and a first digging arm, wherein the first pushing spindle is arranged opposite to and parallel to the glue dispensing spindle, the first pushing connecting piece is located on the side of the first pushing spindle facing the glue dispensing assembly and is slidably connected to the glue dispensing assembly, the first pushing connecting piece moves along the axial direction of the first pushing spindle, one end of the first pushing lifting shaft is slidably connected to the first pushing connecting piece, and the end of the first pushing lifting shaft facing away from the first pushing connecting piece is fixedly connected to the first digging arm, the first digging arm is perpendicular to the first pushing spindle and extends toward the direction of the glue dispensing assembly, the first digging arm is slidably connected to the first pushing connecting piece, and the sliding direction is consistent with the axial direction of the first pushing lifting shaft, and the first digging arm is used to push the transfer tray to the first glue dispensing workbench.

12. The chip bonding equipment according to claim 11, wherein: The cam is connected to the second dispensing shaft by a movable frame, and the movable frame is connected to the second dispensing shaft by a movable frame.

13. The chip bonding equipment according to claim 12, wherein: The carrier conveying module also includes two material baffles, a carrier sensor and a carrier pushing rod, wherein the two material baffles are respectively installed at the two ends of the input assembly line close to and away from the lifting assembly line, and are used to control the conveying volume and conveying speed of the carrier; the carrier sensor is set on the lifting assembly line, and is used to sense whether the carrier leaves the lifting assembly line; the carrier pushing rod is used to push the carrier to the attachment module.

14. The chip bonding equipment according to claim 12, wherein: The flip module includes a flip table assembly and a flip assembly, wherein the flip table assembly is used to receive the transfer tray transmitted from the second material diverter arm, and the flip assembly is used to flip the chip base on the transfer tray.

15. The chip bonding equipment according to claim 14, wherein: The flip table assembly includes a first flip axis, a second flip axis, a flip table connector and a flip table, wherein the first flip axis is located on a side of the second glue dispensing worktable away from the first glue dispensing worktable and is fixedly connected to the total worktable, the second flip axis is located on a side of the first flip axis away from the total worktable and is perpendicular to the first flip axis, the second flip axis is slidably connected to the first flip axis and moves along the axial direction of the first flip axis, the flip table connector is located on a side of the second flip axis away from the first flip axis and is parallel to the first flip axis, the flip table connector is slidably connected to the second flip axis and moves along the axial direction of the second flip axis, the flip table connector is used to support and fix the flip table, the height of the flip table from the total worktable is consistent with the height of the second glue dispensing worktable from the total worktable, and the flip table is used to support and fix the transfer tray.

16. The chip bonding equipment according to claim 15, wherein: The flip assembly includes a flip assembly support, a flip assembly connector, a flip assembly positioning camera, a flip spindle, a flip spindle connector, a rotating member, a suction rod and a suction head, wherein the flip assembly support is fixedly connected to the total workbench, the end of the flip assembly support facing away from the total workbench is fixedly connected to the flip assembly connector, the flip assembly positioning camera is located on the side of the flip assembly connector facing the flip workbench assembly, the flip spindle is fixed on one side of the flip assembly support and its axial direction is parallel to the height direction of the flip assembly support, the flip spindle connector The part is sleeved on the circumferential side of the flip spindle and is slidably connected to the flip spindle, the flip spindle connecting part moves along the axial direction of the flip spindle, one end of the rotating part is fixedly connected to the flip spindle connecting part, one end of the suction rod is fixedly connected to the end of the rotating part away from the flip spindle connecting part, the axial direction of the suction rod is toward the flip workbench assembly, the rotating part rotates along the tangential direction of the suction rod with the suction rod, the suction head is fixed on the end of the suction rod away from the rotating part, and the suction head is used to suck the chip base on the transfer tray.

17. The chip bonding equipment according to claim 13, wherein: The attaching module includes an attaching component and an attaching workbench component, wherein the attaching component is used to correct and detect the chip base and attach the chip base to the carrier, and the attaching workbench component is used to receive the carrier transmitted from the lifting line and transport the carrier to the output line.

18. The chip bonding equipment according to claim 17, wherein: The attaching assembly includes an attaching assembly support, an attaching spindle, an attaching head connector, an attaching head, and an attaching correction camera. The attaching assembly support is fixedly connected to the total workbench. The attaching spindle is located on the side of the attaching assembly support facing the flip assembly and the flip workbench assembly, and is fixedly connected to the attaching assembly support. The attaching head connector is located on the side of the attaching spindle away from the attaching assembly support and is slidably connected to the attaching spindle. The attaching head connector moves along the axial direction of the attaching spindle. The attaching head is located on the side of the attaching head connecting part away from the attaching spindle and is fixedly connected to the attaching head connecting part. The attaching head is used to absorb the chip base and correct the chip base after absorption. The attaching correction camera is located between the flipping workbench assembly and the attaching workbench and below the attaching head. The attaching correction camera is used to detect whether the flipped chip base meets the predetermined requirements. The attaching head also includes a force controller module, which is used to control the attaching force of the attaching head.

19. The chip bonding equipment according to claim 18, wherein: The attachment workbench assembly includes a first attachment axis, a second attachment axis, an attachment workbench, an attachment positioning camera connector and an attachment positioning camera, wherein the first attachment axis is fixedly connected to the total workbench and is parallel to the lifting line axis, the second attachment axis spans the first attachment axis and is perpendicular to and slidably connected to the first attachment axis, the second attachment axis moves along the axial direction of the first attachment axis, the attachment workbench spans the second attachment axis and is perpendicular to and slidably connected to the second attachment axis, the attachment workbench moves along the axial direction of the second attachment axis, the attachment workbench is used to support and fix the carrier transported from the lifting line, one end of the attachment positioning camera connector is located on the side of the attachment component support away from the total workbench and above the first attachment axis, the end of the attachment camera connector away from the attachment component support extends toward the lifting line, the extended end of the attachment camera connector is fixed with the attachment positioning camera, and the attachment positioning camera is used to photograph and position the chip on the carrier.

20. The chip bonding equipment according to claim 15, wherein: The chip bonding equipment also includes a recycling line and a recycling workbench. The recycling line is located on the inner side of the dispensing workbench support and below the first dispensing workbench. The recycling line is fixedly connected to the main workbench. The recycling workbench is located between the recycling line and the first flip axis. The recycling workbench is used to receive the transfer tray and transport the transfer tray to the recycling line. The recycling line is used to transport the transfer tray to the feed port of the dispensing module.

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