Robot for simultaneous substrate transfer

Abstract

An example substrate processing system can include a transfer region housing defining a transfer region fluidically coupled to a plurality of processing regions. A sidewall of the transfer region housing can define a sealable access for providing and receiving substrates. The system can include a transfer apparatus having a central hub including a shaft extending distally through the transfer region housing into the transfer region. The transfer apparatus can include a lateral translation apparatus coupled to an outer surface of the transfer region housing and configured to provide at least one direction of lateral movement of the shaft. The system can also include a terminal actuator coupled to the shaft within the transfer region. The terminal actuator can include a plurality of arms equal in number to a number of substrate supports in the plurality of substrate supports in the transfer region.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to U.S. Provisional Patent Application No. 62 / 873,480, filed July 12, 2019, the entire contents of which are incorporated herein by reference for all purposes.

[0003] This technology relates to the following applications, all filed simultaneously on July 12, 2019, entitled: “ROBOTFOR SIMULTANEOUS SUBSTRATE TRANSFER” (US Provisional Application No. 62 / 873,400), “ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER” (US Provisional Application No. 62 / 873,432), “ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER” (US Provisional Application No. 62 / 873,458), “MULTI-LIDSTRUCTURE FOR SEMICONDUCTOR PROCESSING SYSTEMS” (US Provisional Application No. 62 / 873,518), and “HIGH-DENSITY SUBSTRATE PROCESSING SYSTEMS”. ANDMETHODS (High-density substrate processing system and method) (U.S. Provisional Application No. 62 / 873,503). Each of these applications is incorporated herein by reference in its entirety for all purposes. Technical Field

[0004] This technology relates to semiconductor processing and equipment. More specifically, this technology relates to substrate handling systems. Background Technology

[0005] Semiconductor processing systems typically utilize clustering tools to integrate multiple processing chambers together. This configuration can facilitate the execution of several sequential processing operations without removing the substrate from a controlled processing environment, or it can allow similar processing to be performed simultaneously on multiple substrates in varying chambers. These chambers may include, for example, degassing chambers, pretreatment chambers, transfer chambers, chemical vapor deposition chambers, physical vapor deposition chambers, etching chambers, metering chambers, and other chambers. The combination of chambers in the clustering tool, along with the operating conditions and parameters for running these chambers, is selected to fabricate specific structures using specific process formulations and flows.

[0006] Cluster tools typically process many substrates by successively passing the substrates through a series of chambers and process operations. The process recipes and sequence are typically programmed into a microprocessor controller that will direct, control, and monitor the processing of each substrate through the cluster tool. Once an entire wafer cassette has been successfully processed through the cluster tool, the cassette can be passed to another cluster tool or stand-alone tool, such as a chemical mechanical polisher, for further processing.

[0007] Robots are typically used to transport wafers through the various processing and holding chambers. The amount of time required for each process and handling operation directly impacts the amount of substrates processed per unit of time. The amount of substrate processing in a cluster tool can be directly related to the speed of the substrate handling robot located in the transfer chamber. As processing chamber configurations continue to evolve, conventional wafer transport systems can be inadequate.

[0008] Accordingly, there is a need for improved systems and methods that can be used to efficiently direct substrates in a cluster tool environment. These needs and other needs are satisfied by the present technology. SUMMARY

[0009] An example substrate processing system can include a transfer region housing defining a transfer region fluidly coupled to a plurality of processing regions. A sidewall of the transfer region housing can define a sealable access port for providing and receiving substrates. A plurality of substrate supports can be disposed within the transfer region. The system can include a transfer apparatus having a central hub including a shaft extending distally through the transfer region housing into the transfer region. The transfer apparatus can include a lateral translation apparatus coupled to an outer surface of the transfer region housing. The lateral translation apparatus can be configured to provide at least one direction of lateral movement of the shaft. The system can also include a terminal actuator coupled to the shaft at a distal end of the shaft within the transfer region. The terminal actuator can include a plurality of arms, the number of arms equaling the number of substrate supports in the plurality of substrate supports.

[0010] In some embodiments, the plurality of substrate supports can include at least four substrate supports. The transfer apparatus can include a first drive coupled with the shaft and configured to rotate the shaft about a central axis through the shaft. The first drive can include a frameless motor extending about the shaft. The transfer apparatus can include a second drive coupled with the shaft and configured to provide vertical translation of the shaft. The first drive can be contained within a housing coupled with the guide, the second drive can guide the housing along the guide, and the guide can vertically translate the first drive and the shaft. The lateral translation apparatus can include a first platform translatable in a first lateral direction, and the central hub is coupled with the first platform. The lateral translation apparatus can include a second platform translatable in a second lateral direction, and the second platform can be vertically aligned with and coupled with the first platform. The second lateral direction can be orthogonal to the first lateral direction. The transfer apparatus can include a bellows through which the shaft extends. The bellows can be fixedly coupled with a base plate of the transfer apparatus at a first end. The bellows can be sized to provide lateral translation of the shaft within a volume of the bellows.

[0011] Some embodiments of the present technology can encompass a transfer apparatus including a base plate defining a central aperture. The apparatus can include a shaft having a distal end that extends at least partially through the central aperture of the base plate. The apparatus can include a lateral translation apparatus coupled with the base plate. The lateral translation apparatus can be configured to provide lateral movement of the shaft in at least one direction within the central aperture of the base plate. The apparatus can include a bellows coupled with the base plate and axially aligned with the central aperture of the base plate. The shaft can extend at least partially through the bellows. The apparatus can include a first drive coupled with the shaft and configured to rotate the shaft about a central axis of the shaft.

[0012] In some embodiments, the transfer apparatus can include a support coupled with the lateral translation apparatus. The support can include one or more guides extending vertically along a surface of the support facing the shaft. The shaft can be at least partially contained within a housing, and the housing can be movably coupled with the guides of the support. A first end of the bellows can be coupled with the base plate, and a second end of the bellows can be coupled with the housing. The apparatus can include a second drive coupled with a base of the support. The second drive can be configured to vertically drive the housing along the guides of the support, providing vertical translation of the shaft. The second drive can be laterally offset from the first drive. The second drive can be axially aligned with the first drive. The lateral translation apparatus can include a first platform coupled with the base plate and translatable in a first lateral direction. The bellows can extend at least partially through the first platform. The lateral translation apparatus can include a second platform translatable in a second lateral direction perpendicular to the first lateral direction. The second platform can be vertically aligned with and coupled with the first platform. The bellows can extend at least partially through the second platform.

[0013] Some embodiments of the present technology can encompass a substrate processing system. The system can include a transfer region housing defining a transfer region fluidically coupled to a plurality of processing regions. A sidewall of the transfer region housing can define a sealable access for providing and receiving a substrate. A base of the transfer region housing can define an aperture. The system can include a plurality of substrate supports disposed within the transfer region. The system can include a transfer apparatus disposed within the transfer region. The transfer apparatus can include a base plate defining a central aperture. The base plate can be coupled to an exterior of the base of the transfer region housing. The central aperture of the base plate can extend through the base of the transfer region housing about the aperture. The transfer apparatus can include a shaft, a distal end of the shaft can extend at least partially through the central aperture of the base plate. The transfer apparatus can also include a lateral translation apparatus coupled to the base plate. The lateral translation apparatus can be configured to provide at least one direction of lateral movement of the shaft within the central aperture of the base plate. The transfer apparatus can include a bellows coupled to the base plate and axially aligned with the central aperture of the base plate. The shaft can extend at least partially through the bellows. The transfer apparatus can also include a terminal effector coupled to the shaft at the distal end of the shaft within the transfer region. The terminal effector can include a plurality of arms configured to support a substrate.

[0014] The present technology can provide many benefits over conventional systems and techniques. For example, in addition to rotational movement for substrate transfer, a transfer system can provide lateral transfer capability. Moreover, according to some embodiments of the present technology, a transfer system can utilize configurations to accommodate or limit bending, rotation, and other moments. These and other embodiments, along with many of their advantages and features, are described in more detail in conjunction with the following description and attached figures. BRIEF DESCRIPTION OF DRAWINGS

[0015] A further understanding of the nature and advantages of the disclosed technology can be realized by reference to the remaining portions of the specification and the attached drawings.

[0016] Figure 1A A schematic top plan view of one embodiment of an exemplary processing tool, in accordance with some embodiments of the present technology, is illustrated.

[0017] Figure 1B A schematic partial cross-sectional view of one embodiment of an exemplary processing system, in accordance with some embodiments of the present technology, is illustrated.

[0018] Figure 2 A schematic isometric view of a transfer portion of an exemplary substrate processing system, in accordance with some embodiments of the present technology, is illustrated.

[0019] Figure 3 A schematic isometric view of an exemplary transfer apparatus, in accordance with some embodiments of the present technology, is illustrated.

[0020] Figure 4 A schematic cross-sectional view of an exemplary transfer apparatus is shown in accordance with some embodiments of the present technology.

[0021] Figure 5 A schematic isometric view of an exemplary transfer apparatus is shown in accordance with some embodiments of the present technology.

[0022] Figure 6 A schematic cross-sectional front view of a transfer portion of an exemplary substrate processing system is shown in accordance with some embodiments of the present technology.

[0023] Some of the drawings are included as schematics. It should be understood that the drawings are for illustrative purposes only and are not drawn to scale. Unless otherwise specifically indicated, the drawings are not intended to be to scale or proportion. Furthermore, the drawings are provided with the intent that they be used as simple memory aids in illustrating examples offered in connection with the discussion of the technology and that the various elements shown in the drawings should not be construed as being to scale or proportion.

[0024] In the drawings, like reference numerals can be used to denote similar components throughout the several views. Additionally, various components of the same type can be distinguished from one another by a letter following the reference numeral. If only the first reference numeral is used to denote a component, the description is applicable to all instances of that component undergoing foreclosure, regardless of the letter. DETAILED DESCRIPTION

[0025] Substrate processing can include time-intensive operations for adding, removing, or otherwise modifying material on a wafer or semiconductor substrate. Efficient movement of substrates can reduce queue time and increase substrate throughput. To improve the number of substrates processed in a cluster tool, additional chambers can be incorporated onto a mainframe. While it is possible to continuously increase the number of transfer robots and processing chambers by lengthening the tool, as the footprint of the cluster tool expands, this can be spatially inefficient. Accordingly, the present technology can include cluster tools with an increased number of processing chambers within a defined footprint. To accommodate the limited footprint with respect to transfer robots, the present technology can increase the number of processing chambers laterally outward from the robot. For example, some conventional cluster tools can include one or two processing chambers positioned around a portion of a centrally located transfer robot to maximize the number of radial chambers around the robot. The present technology can expand this concept by incorporating additional chambers laterally outward as another row or set of chambers. For example, the present technology can be applied with cluster tools including three, four, five, six, or more processing chambers available at each of one or more robot access locations.

[0026] However, with the addition of additional process locations, it can no longer be feasible to access these locations from a central robot without additional transfer functionality at each location. Some conventional techniques can include wafer carriers, where the substrate is held on the wafer carrier during transfer. However, wafer carriers can cause thermal non-uniformity and particle contamination on the substrate. The present technology overcomes these issues by incorporating a transfer section that is aligned perpendicular to the processing chamber area and a carousel or transfer device that can operate in concert with the central robot to access the additional wafer locations. In some embodiments, the present technology can not use conventional wafer carriers and can transfer a particular wafer from one substrate support to a different substrate support within the transfer area. Although the remainder of the disclosure will customarily identify a particular configuration for which the present structure and method can be used, such as a four location transfer area, it will be readily understood that the system and method are equally applicable to any number of configurations and devices that can benefit from the transfer functionality explained. Thus, the present technology should not be considered limited to use with any particular configuration. Furthermore, although an exemplary tool system will be described to provide a basis for the present technology, it is to be understood that the present technology can be incorporated with any number of semiconductor processing chambers and tools that can benefit from some or all of the operations and systems to be described.

[0027] Figure 1A A top view of one embodiment of a substrate processing tool or processing system 100 according to some embodiments of the present technology is shown. In the figure, a set of front opening unified pods 102 provide substrates of various sizes that are received and placed by robotic arms 104a and 104b in load locks or low pressure holding areas 106 in chamber systems or quad sections 109a-c, each of which can be a substrate processing system having a transfer area fluidly coupled to a plurality of processing areas 108. Although a quad system is shown, it is to be understood that platforms incorporating single chamber, dual chamber, and other multi-chamber systems are equally encompassed by the present technology. A second robotic arm 110 housed in a transfer chamber 112 can be used to transfer substrate wafers from the holding areas 106 to the quad sections 109 and back, and the second robotic arm 110 can be housed in a transfer chamber, each of the quad sections or processing systems can be connected with the transfer chamber. Each substrate processing area 108 can be outfitted to perform a number of substrate processing operations, including any number of deposition processes, including cyclic layer deposition, atomic layer deposition, chemical vapor deposition, physical vapor deposition, as well as etching, precleaning, annealing, plasma processes, degassing, orientation, and other substrate processes.

[0028] Each quad 109 can include a transfer region that can receive a substrate from and transfer a substrate to the second robot 110. The transfer region of the chamber system can be aligned with a transfer chamber having the second robot 110. In some embodiments, the transfer region can be for the robot to pass laterally in and out of. In subsequent operations, components of the transfer section can translate the substrate vertically into the upper processing regions 108. Similarly, the transfer region can also operate to rotate the substrate between positions within each transfer region. The substrate processing regions 108 can include any number of system components for depositing, annealing, curing, and / or etching a film of material on a substrate or wafer. In one configuration, two sets of processing regions, such as the processing regions in quads 109a and 109b, can be used to deposit material on a substrate, and a third set of processing chambers, such as the processing chambers or regions in quad 109c, can be used to cure, anneal, or process the deposited film. In another configuration, all three sets of chambers, such as all twelve chambers shown, can be configured to both deposit and / or cure a film on a substrate.

[0029] As shown, the second robot 110 can include two arms for simultaneously delivering and / or retrieving multiple substrates. For example, each quad 109 can include two access ports 107 along a surface of the housing of the transfer region, which can be laterally aligned with the second robot. The access ports can be defined along a surface adjacent to the transfer chamber 112. In some embodiments, as illustrated, a first access port can be aligned with a first substrate support of the plurality of substrate supports of the quad. Further, a second access port can be aligned with a second substrate support of the plurality of substrate supports of the quad. In some embodiments, the first substrate support can be adjacent to the second substrate support, and the two substrate supports can define a first column of substrate supports. As shown in the illustrated configuration, a second column of substrate supports can be positioned behind the first column of substrate supports, which are laterally outward from the transfer chamber 112. The two arms of the second robot 110 can be spaced apart to allow both arms to simultaneously access the quad or chamber system to transfer one or two substrates to or from the substrate supports within the transfer region.

[0030] Any one or more of the described transfer areas may be combined with additional chambers separate from the manufacturing systems shown in different embodiments. It should be understood that processing system 100 also takes into account additional configurations for chambers used for material film deposition, etching, annealing, and curing. Furthermore, any number of other processing systems can be utilized with this technology, which can be combined with any of the transfer systems for performing specific operations such as substrate movement. In some embodiments, processing systems (such as the described holding and transfer areas) that can provide access to multiple processing chamber regions while maintaining a vacuum environment in each section allow operations to be performed in multiple chambers while maintaining a specific vacuum environment between separate processes.

[0031] Figure 1B A schematic cross-sectional front view of one embodiment of an exemplary processing tool (such as a passage chamber system) according to some embodiments of the present technology is shown. Figure 1B A cross-sectional view through any two adjacent processing regions 108 in any of the four sections 109 can be shown. The front view may show the configuration or fluid coupling of one or more processing regions 108 with the transfer region 120. For example, a continuous transfer region 120 may be defined by a transfer region housing 125. The housing may define an open internal space in which multiple substrate supports 130 may be arranged. For example, as... Figure 1A As shown, an exemplary processing system may include four or more substrate supports 130 distributed within a housing around a transfer area. As illustrated, the substrate supports may be bases, although many other configurations may also be used. In some embodiments, the bases may be vertically translatable between the transfer area 120 and a processing area covering the transfer area. The substrate supports may be vertically translatable along a path between a first position and a second position within the chamber system along a central axis of the substrate support. Thus, in some embodiments, each substrate support 130 may be axially aligned with a processing area 108 defined by one or more chamber components.

[0032] An open transport area provides the ability of a transport device 135, such as a disc conveyor belt, to engage between various substrate supports and to move substrates, such as rotatably. The transport device 135 can rotate about a central axis. This allows substrates to be positioned for processing within any of the processing areas 108 within the processing system. The transport device 135 may include one or more end effectors that can engage the substrate from above, below, or with the outer edge of the substrate to move about the substrate support. The transport device can receive substrates from a transport chamber robot (e.g., the second robotic arm 110 described previously). The transport device can then rotate the substrate to replace the substrate support to facilitate the transport of additional substrates.

[0033] Once positioned and awaiting processing, the transfer apparatus can position the end effector or arm between the substrate supports, which can allow the substrate supports to be lifted over the transfer apparatus 135 and deliver the substrates into the processing regions 108, which can be vertically offset from the transfer region. For example, and as shown, the substrate support 130a can deliver a substrate into the processing region 108a, while the substrate support 130b can deliver a substrate into the processing region 108b. This can occur with the other two substrate supports and processing regions, as well as additional substrate supports and processing regions in embodiments including additional processing regions. In such a configuration, when operatively engaged to process a substrate, such as at the second position, the substrate supports can at least partially bound the processing regions 108 from below, and the processing regions 108 can be axially aligned with the associated substrate support. The processing regions can be bounded from above by the faceplate 140, as well as other cover stack components. In some embodiments, each processing region can have a respective cover stack component, although in some embodiments, components can house multiple processing regions 108. Based on this configuration, in some embodiments, each processing region 108 can be fluidly coupled with the transfer region, while being fluidly isolated from above from each other processing region within the chamber system or four-part.

[0034] In some embodiments, the faceplate 140 can be operable as an electrode of the system to generate a localized plasma within the processing regions 108. As shown, each processing region can utilize or incorporate a separate faceplate. For example, a faceplate 140a can be included to bound the processing region 108a from above, and a faceplate 140b can be included to bound the processing region 108b from above. In some embodiments, the substrate supports can be operable as a counter electrode for generating a capacitively coupled plasma between the faceplate and the substrate support. Depending on the spatial geometry, the pump liner 145 can at least partially radially or laterally bound the processing regions 108. Likewise, a separate pump liner can be used for each processing region. For example, a pump liner 145a can at least partially radially bound the processing region 108a, while a pump liner 145b can at least partially radially bound the processing region 108b. In embodiments, a baffle 150 can be located between the cover 155 and the faceplate 140, and likewise can include separate baffles to facilitate fluid distribution within each processing region. For example, a baffle 150a can be included to distribute to the processing region 108a, and a baffle 150b can be included to distribute to the processing region 108b.

[0035] The lid 155 can be a separate component for each processing region, or can include one or more common aspects. In some embodiments, such as shown, the lid 155 can be a single component that defines a plurality of apertures 160 for fluid delivery to the individual processing regions. For example, the lid 155 can define a first aperture 160a for fluid delivery to the processing region 108a, and the lid 155 can define a second aperture 160b for fluid delivery to the processing region 108b. When additional apertures are included, additional processing regions within each section can define additional apertures. In some embodiments, each four-section 109 that can hold more or less than four substrates, or a multi-processing region section, can include one or more remote plasma units 165 for delivering plasma effluent into the processing chamber. In some embodiments, a separate plasma unit can be incorporated for each chamber processing region, although in some embodiments, fewer remote plasma units can be used. For example, as shown, a single remote plasma unit 165 can be used for multiple chambers, such as two, three, four, or more chambers, up to all of the chambers for a particular four-section. In embodiments of the present technology, a conduit can extend from the remote plasma unit 165 to each aperture 160 for delivering plasma effluent for processing or cleaning.

[0036] As noted, the processing system 100, or more specifically, the four-section or chamber system in conjunction with the processing system 100 or other processing systems, can include a transfer section positioned below the processing chamber regions shown. Figure 2 A schematic isometric view of a transfer section of an exemplary chamber system 200 is shown, in accordance with some embodiments of the present technology. Figure 2 Other aspects or variations of the transfer region 120 described above can be shown, and can include any of the components or features described. The system shown can include a transfer region housing 205 that defines a transfer region in which a plurality of components can be included. The transfer region can additionally be defined at least in part from above by a processing chamber or processing region that is fluidically coupled to the transfer region, such as Figure 1AThe transfer region housing 205 can be positioned within the processing chamber region 108 as shown in the four-part 109. The sidewalls of the transfer region housing can define one or more access locations 207 through which substrates can be delivered and retrieved, such as by the second robot 110 as described above. The access locations 207 can be slit valves or other sealable access locations, which in some embodiments include doors or other sealing mechanisms to provide a gas-tight environment within the transfer region housing 205. Although two such access locations 207 are shown, it should be understood that in some embodiments only a single access location 207 can be included, as well as access locations on multiple sides of the transfer region housing. It should also be understood that the transfer portion shown can be sized to accommodate any substrate size, including 200mm, 300mm, 450mm, or larger or smaller substrates, including substrates featuring any number of geometries or shapes.

[0037] Within the transfer region housing 205 can be a plurality of substrate supports 210 positioned about the transfer region space. Although four substrate supports are shown, it should be understood that embodiments of the present technology similarly contemplate any number of substrate supports. For example, more than or about three, four, five, six, eight, or more substrate supports 210 can be accommodated in the transfer region according to embodiments of the present technology. The second robot 110 can deliver substrates to one or both of the substrate supports 210a or 210b through the access 207. Similarly, the second robot 110 can retrieve substrates from these locations. Lift pins 212 can protrude from the substrate supports 210 and can allow the robot to access beneath the substrate. In some embodiments, the lift pins can be fixed to the substrate supports, or fixed to locations beneath which the substrate supports can be recessed, or the lift pins can additionally be raised or lowered by the substrate supports. The substrate supports 210 can be vertically translatable and in some embodiments can extend to a processing chamber region of a substrate processing system, such as the processing chamber region 108 positioned above the transfer region housing 205.

[0038] The transfer region housing 205 can provide access 215 for an alignment system, which can include an aligner that can extend through a hole of the transfer region housing, as shown, and can operate with a laser, camera, or other monitoring device that protrudes or transmits through an adjacent hole, and can determine whether a substrate being translated is properly aligned. The transfer region housing 205 can also include a transfer device 220, which can operate in a variety of ways to position substrates and move substrates between various substrate supports. In one example, the transfer device 220 can move substrates on substrate supports 210a and 210b to substrate supports 210c and 210d, which can allow additional substrates to be transferred into the transfer chamber. Additional transfer operations can include rotating substrates between substrate supports for additional processing in a covered processing region.

[0039] The transfer device 220 can include a central hub 225, which can include one or more shafts that extend into the transfer chamber. Coupled with the shafts can be an end effector 235. The end effector 235 can include a plurality of arms 237 that extend radially or laterally outward from the central hub. Although shown as a central body from which the arms extend, the end effector can additionally include individual arms, each of which is coupled with a shaft or central hub in various embodiments. Any number of arms can be included in embodiments of the present technology. In some embodiments, the plurality of arms 237 can be similar or equal in number to the number of substrate supports 210 included in the chamber. Thus, as shown, for four substrate supports, the transfer device 220 can include four arms that extend from the end effector. The arms can feature any number of shapes and profiles, such as straight profiles or arched profiles, as well as include any number of distal profiles, including hooks, loops, forks, or other designs for supporting and / or providing access to substrates, such as for alignment or engagement.

[0040] The end effector 235 or components or portions of the end effector can be used to contact a substrate during transfer or movement. These components, as well as the end effector, can be made of or include a variety of materials, including conductive and / or insulating materials. In some embodiments, the materials can be coated or plated to withstand contact with precursors or other chemicals that can enter the transfer chamber from an overlying processing chamber.

[0041] Further, materials can be provided or selected to withstand other environmental characteristics, such as temperature. In some embodiments, the substrate support can be used to heat a substrate disposed on the support. The substrate support can be configured to increase the surface or substrate temperature to greater than or about 100 °C, greater than or about 200 °C, greater than or about 300 °C, greater than or about 400 °C, greater than or about 500 °C, greater than or about 600 °C, greater than or about 700 °C, greater than or about 800 °C, or higher. In operation, any of these temperatures can be maintained, and thus components of the transfer apparatus 220 can be exposed to any of these specified or encompassed temperatures. Accordingly, in some embodiments, any of the materials can be selected to accommodate these temperature ranges, and can include materials such as ceramics and metals that are characterized by relatively low coefficients of thermal expansion or other beneficial characteristics.

[0042] The component coupling can also be adapted to operate in high temperature and / or corrosive environments. For example, where each of the terminal actuator and the terminal portion is ceramic, the coupling can include press fit components, snap fit components, or other components that can not include other materials (such as bolts) that can expand and contract with temperature and can cause cracking of the ceramic. In some embodiments, the terminal portion can be continuous with the terminal actuator, and can be integrally formed with the terminal actuator. Any number of other materials that can facilitate operation during operation or resistance and are similarly encompassed by the present technology can be used.

[0043] The transfer apparatus 220 can include a number of components and configurations that can facilitate movement of the terminal actuator in a number of directions, which can facilitate rotational movement and vertical movement or lateral movement in one or more ways with the drive system components to which the terminal actuator can be coupled. Figure 3 A schematic isometric view of an exemplary transfer apparatus 300 according to some embodiments of the present technology is shown, although it should be understood that any other configuration that provides for the rotational, vertical, and / or lateral movement mentioned is similarly encompassed by the present technology.

[0044] The transfer apparatus 300 can include a base plate 305 that can be coupled in one or more ways with the transfer chamber housing, and can operate in embodiments of the present technology as a central hub 225 having various components coupled or associated with the base plate. For example, the base plate 305 can be coupled with the exterior of the transfer region housing 205 (e.g., with the flange 307) or the exterior of the base plate as previously shown. A portion of the base plate 305 can extend through or at least partially in the base of the transfer chamber housing, for example through a hole defined in the transfer region housing, and in some embodiments can be located in the center of the transfer region housing.

[0045] Shaft 310 can extend through base plate 305 into the transfer region space and can support an end effector, as previously described. The end effector can be coupled with a distal end of shaft 310 that extends into the transfer region. In some embodiments, base plate 305 can be the only component coupled with the transfer region housing, and other components of transfer apparatus 300 can have limited or no contact with the transfer chamber housing. Base plate 305 can define a hole 308 through which shaft 310 can extend. In some embodiments, hole 308 can be at least partially aligned with a hole through the transfer region housing, and hole 308 can be sized to accommodate an amount of lateral movement of shaft 310, as will be further described below.

[0046] Lateral translation apparatus 315 can be coupled with base plate 305, which can be coupled on a surface opposite a surface coupled with the transfer region housing. In some embodiments, lateral translation apparatus 315 can include a plurality of components that provide movement in one or more directions along a plane orthogonal to a central axis through shaft 310, and can allow lateral movement of the shaft within the central hole of the base plate. Lateral translation apparatus 315 can include a first stage 320, a portion of which can be coupled with base plate 305. First stage 320 can include a plurality of components, as will be described below, and can include one or more guides that can be driven by a motor to move components coupled with the stage in a first direction perpendicular to a central axis through shaft 310.

[0047] In some embodiments, lateral translation apparatus 315 can also include a second stage 325, a portion of which can be coupled with first stage 320. Second stage 325 can include components similar to first stage 320, and in some embodiments, first stage 320 and second stage 325 can be similar or identical. The stages can be offset in one or more ways to facilitate additional translation capabilities. For example, in some embodiments, second stage 325 can provide movement of components in a second direction perpendicular to a central axis through shaft 310. The second direction can also be offset from the first direction, and in some embodiments, the second direction can be orthogonal to the first direction within a plane orthogonal to the central axis through shaft 310. Thus, lateral translation apparatus 315 can provide at least one direction of lateral movement of components of transfer apparatus 300, including shaft 310 and an end effector coupled with the shaft 310. Aspects of the lateral translation apparatus will be further discussed below. Lateral movement of shaft 310 can provide increased control over a substrate within a processing chamber, and can allow for correction of a position of the substrate for delivery to a substrate support to ensure precision and limit damage to the substrate due to misalignment.

[0048] The support structure 330 can be coupled with the lateral translation apparatus 315, which in some embodiments can extend from the lateral translation apparatus 315. The shaft 310 can extend through the lateral translation apparatus 315 at a distal end that extends into a transfer region housing or other chamber. A proximal end of the shaft 310 can be coupled in one or more ways with one or more drive systems for moving the shaft 310 and the coupled end effector. Figure 3 One embodiment of a first drive 335 configured to produce rotational movement of the shaft 310 is shown. The first drive 335 can be any number of drives or motors that produce rotation of the shaft 310 about a central axis of the shaft 310. As shown, one embodiment can include a motor that extends around the shaft 310 and is concentric with the shaft. The motor can be any type of motor and can be coupled with the shaft in a variety of ways to rotate the shaft. As one non-limiting example, a frameless motor can extend around the shaft and a rotor can be magnetically coupled with the shaft or can incorporate a plurality of bearings that are coupled with the shaft. Any other type of drive system can be used, such as a belt drive system, a gear drive system, or other system configured to rotate the shaft.

[0049] In some embodiments, the housing 340 can extend around one or more components and can extend at least partially around the shaft. In some embodiments, the first drive 335 can be contained within the housing 340, although additional embodiments can include aspects of the first drive 335 that are external to the housing, as will be further described below. In some embodiments, the housing 340 can be coupled with the support structure 330, where the transfer apparatus 300 provides vertical movement in addition to rotational movement and / or lateral movement of the shaft 310. In some embodiments, the support structure 330 can include one or more guides 345, such as linear guides or rails, along which the housing 340 can be driven. Attached to the housing 340 can be one or more carriages or bearings that allow the housing to translate along the guides 345 and are movably coupled with the guides 345. This can allow the housing and shaft to translate vertically and can then allow vertical movement of the end effector to facilitate engagement and disengagement of a substrate between the transfer apparatus and a substrate support. A second drive 350 can be coupled with the housing 340 and / or the shaft 310, which can include any number of motors or materials to drive the shaft and / or other components along the linear guides on the support structure 330. As shown, in some embodiments the first and second drives can be vertically aligned with the shaft to limit moment during operation. For example, as shown, the second drive 350 can be mounted centrally on a base of the support structure 330 and in line with the shaft and the first drive. This can reduce or limit any rotational or bending moment on the transfer device and associated components, such as the shaft 310. Figure 3

[0050] ​Figure 4 A schematic cross-sectional view through an exemplary transfer apparatus 300 according to some embodiments of the present technology is shown, which can illustrate additional components of the system. The cross-sectional view can illustrate exemplary couplings between components, as well as one example of alignment of components of the transfer apparatus 300. For example, the figure illustrates alignment of the second drive 350 with the shaft 310 and concentric alignment of the first drive 335 with the shaft 310.

[0051] In some embodiments, the transfer region into which the shaft 310 can extend can be under vacuum conditions. Some embodiments of the present technology can maintain each drive component outside of the vacuum environment. To accommodate both different ambient pressures and movement of the shaft, a bellows 355 and a seal 360 can also be incorporated within the system. The bellows 355 can extend around the shaft, and the shaft 310 can extend at least partially through the bellows at a distal end before entering the transfer region. The bellows 355 can be axially aligned with a hole through the base plate 305, through which the shaft 310 can extend. The bellows 355 can be coupled with a surface of the base plate 305, such as at a second surface opposite the first surface, which can be coupled with the transfer region housing through a surface of the bellows 355. The bellows 355 can be fixedly coupled with the base plate 305 at a first end 357 of the bellows. A second end 359 of the bellows can be coupled, including fixedly coupled with the housing 340. The seal 360 can be a lip seal or other sealing device, which can extend around the shaft 310 and abut the bellows to create a pressure differential, where for example, the distal end of the shaft 310 through the bellows can be maintained at the pressure of the transfer region environment, while other illustrated components of the transfer apparatus 300 can be maintained at a higher pressure. This configuration can also facilitate cooling of the base plate 305, as well as the housing 340 and components included therein, which can limit the effects of temperature on the components. For example, a jacket, including a fluid cooling jacket, can extend around any of these components to limit the temperature of the components during processing operations. Additional cooling can similarly be used and is encompassed by the present technology.

[0052] The bellows 355 can accommodate vertical translation of the shaft 310 by flexing as the housing moves. In addition, the bellows 355 can be specifically configured to accommodate lateral movement of the shaft 310. As previously discussed, a lateral translation device 315 can be coupled with the base plate 305. As shown, the first stage 320 of the lateral translation device 315 can also include linear guides or rails along which the stage can move. For example, the rails of the first stage 320 can be coupled with the base plate 305, and the first stage 320 can be driven along these rails in a first direction (e.g., orthogonal to the plane of the illustrated cross-section). A motor can be coupled with the first stage to drive the stage along the rails. Similarly, a second stage 325 can be coupled with the first stage 320, and can be rotated, for example, 90 degrees, from the first stage 320 to provide lateral movement in the same plane but orthogonal to the first stage 320. A second motor (e.g., motor 327) can drive the second stage along rails that can be coupled with the first stage. A support structure 330 can be coupled with the second stage, and thus operation of the first and / or second stages can move each associated component that can be coupled with the structure or with other components coupled with the structure. Thus, movement of either stage will indirectly move the shaft laterally within the hole through the base plate 305.

[0053] In some embodiments, the movement of the housing can also move the shaft laterally within the bellows 355, and at least partially move aspects of the bellows. As shown, both the first stage 320 and the second stage 325 can define holes through which the bellows 355 can extend. As previously discussed, the bellows 355 can be coupled with the base plate 305 at a first end 357 of the bellows, which can not move during operation of the first and / or second stages. However, a second end 359 of the bellows 355 that can be coupled with the housing 340 can move as the structure and associated components including the housing 340 move with the first and second stages. Thus, the second end 359 of the bellows 355 can be laterally deflected and become vertically offset from the first end 357. The shaft 310 can remain aligned with the center of the second end 359 of the bellows 355, as these components can move together. However, during these movements, the shaft 310 can move toward the inner radial edge of the first end 357 of the bellows 355, as the position of the first end 357 can remain fixed during lateral movement. Thus, in some embodiments, the size of the diameter of the bellows 355 at the first end 357 can be configured to accommodate lateral movement of the shaft 310 and the second end of the bellows 355 to ensure that the shaft 310 can not contact the bellows 355. The diameter of the bellows 355 can remain constant along the length of the bellows, or can expand from the second end 359 toward the first end 357 to accommodate the movement and limit or prevent contact between the shaft 310 and the sidewalls or ends of the bellows.

[0054] Further, in Figure 4 Further details of the second drive 350 are shown in FIG. 35, which can be coupled in one or more ways to components. For example, the second drive 350 can include a ball screw motor, or any other motor that provides vertical linear translation of a component coupled to a shaft of the motor. As shown, the second drive 350 can be coupled to a base of the support structure 330, and can be coupled through the housing 340 to the shaft 310, such as with a ball nut or other transmission that allows rotation of the drive shaft or screw, while the nut and associated components, such as the housing and shaft, remain rotationally fixed upon vertical translation. Thus, the transmission apparatus 300 can provide one or more movements of the shaft 310, including a plurality of movements, which can include one or more of the following: rotational movement with the first drive 335, vertical movement with the second drive 350, and lateral movement with the lateral translation apparatus 315.

[0055] Other configurations of the transmission apparatus are contemplated by the present technology, which can not include axial alignment of the first and second drives as described above. Figure 5 A schematic isometric view of an exemplary transmission apparatus 400 is shown, according to some embodiments of the present technology. The transmission apparatus 400 can be similar in one or more ways to the transmission apparatus 300, and can include any of the previously described components, materials, or configurations, even if not explicitly shown in the figure, and can further illustrate some aspects of the transmission apparatus 300 as described above.

[0056] For example, the transmission apparatus 400 can include a base plate 405, which can be coupled to a transmission area housing, as previously described. The base plate 405 can define a central aperture, or general aperture, through which a shaft 410 can extend. As previously described, a terminal actuator can be coupled to a distal end of the shaft 410. The shaft 410 can also extend through a bellows 455, which can extend through an aperture through a lateral translation apparatus 415. The lateral translation apparatus can include one or more platforms having components that allow lateral movement of the shaft, which can be indirectly coupled to the lateral translation apparatus. In some embodiments, the lateral translation apparatus 415 can include a first platform 420 that provides lateral movement in a first linear direction, which can be driven by a motor 422. Further, in some embodiments, the lateral translation apparatus 415 can include a second platform 425 that provides lateral movement in a second linear direction that is in the same plane as the first linear direction, and orthogonal to the first linear direction. In some embodiments, the second platform 425 can be driven by a motor 427.

[0057] Coupled to the lateral translation apparatus 415 can be a support structure 430, which can include guides along which the housing 440 and shaft 410 can vertically translate, as previously discussed. Figure 5Embodiments are shown in which the first drive 435 can not extend around the shaft 410, and can be positioned outside of the housing 440. The first drive 435 can still be coupled with the shaft 410 through the housing 440 to provide rotational movement of the shaft 410, although different motors, such as servo motors or other motors, can be included to provide rotational capability for rotation of the shaft 410. In some embodiments, a second drive 450 can also be included to provide vertical translation capability as previously described. However, in some embodiments, the second drive 450 can be laterally offset from the first drive 435 as well as vertically offset. The second drive 450 can be coupled with the housing 440 or a bearing of the housing 440 to allow the housing 440 to translate along the guide of the structure 430. In some embodiments as shown, the second drive 450 can not be coupled with the shaft 410, although the shaft 410 can still be vertically translated with the second drive 450 of the housing 440 moving therewith. Thus, the present technology can be adapted to a variety of configurations to provide multiple movements of the shaft and associated end effector, which can allow for rotation as well as vertical and / or lateral movement of a substrate within a transfer region of a processing system.

[0058] Figure 6 A schematic cross-sectional elevation view of an exemplary transfer region of a substrate processing system 500 is shown in accordance with some embodiments of the present technology. Figure 6 An interleaved lift pin configuration is shown as previously described, and can be included in any of the transfer chambers or substrate processing systems described previously. For example, any of the lift pins previously described can include interleaved height lift pins as shown. The substrate processing system 500 can include any of the components, configurations, and characteristics of any of the previously described embodiments, and similarly, any of the previously described systems can include the lift pin configuration shown. The system 500 can include a plurality of substrates 501 on sets of lift pins 505 positioned within a chamber, respectively, which can also include a transfer apparatus 520, which can include features of any of the previously described transfer apparatuses, including arms 535 extending from the transfer apparatus. Further, the transfer apparatus 520 can include a shaft 522 to which the end effector having the arms 535 can be coupled. The shaft 522 can also extend through a bore of a base of a transfer region housing, and to any of the transfer apparatus drive systems discussed above or otherwise encompassed by the present technology, including for example the drive systems of the transfer apparatus 300 and the transfer apparatus 400.

[0059] Lift pins 505 can be sets of pins extending from the substrate supports 510 to provide accessibility for transporting or retrieving substrates 501, and each set can include any number of pins to accommodate a substrate. As shown, the lift pin sets 505 are staggered at four different heights, which can allow for individual transport and removal of substrates. For example, lift pins 505a can extend a first vertical length above the substrate supports. Lift pins 505b can extend a second vertical length above the substrate supports 510b shown in cross-section, and they can hide the substrate supports from which lift pins 505a can extend, although the substrate supports can be in line. As shown, the second vertical length can be less than the first vertical length.

[0060] Furthermore, lift pins 505c can extend a third vertical length from the substrate supports 510c, and the third vertical length can be less than the second vertical length. Finally, lift pins 505d can extend a fourth vertical length from the associated substrate supports, which can be hidden by and in line with the substrate supports 510c. The fourth vertical length can be less than the third vertical length. By staggering the heights of the lift pin sets, individual adjustments can be made to each substrate prior to transporting or retrieving the substrates. For example, substrate 501a can be accessible above substrate 501b, substrate 501b can be accessible above substrate 501c, and substrate 501c can be accessible above substrate 501d when disposed on the associated lift pins.

[0061] The present technology includes substrate processing systems that can accommodate additional substrate supports that can not be accessible by a centrally located transfer robot, as previously described. By incorporating a transfer apparatus according to embodiments of the present technology, multiple substrate supports can be utilized and accessed during substrate processing. When the transfer apparatus includes a drive system as described above, lateral translation can be provided in addition to rotational and vertical translation. Furthermore, the transfer apparatus configurations according to some embodiments of the present technology can align components in one or more ways to limit moment during operation of the system, which can provide additional control to fine tune movement of substrates during transfer within the transfer region of the processing system.

[0062] In the foregoing description, for purposes of explanation, numerous specific details are set forth in order to provide an understanding of various embodiments of the present technology. It will be apparent, however, to one skilled in the art that certain embodiments can be practiced without some or all of these details.

[0063] Having disclosed several embodiments, those skilled in the art will recognize, in light of the disclosure herein, that many changes can be made within the spirit and scope of the embodiments. Also, it will be appreciated that many of the known alternatives, modifications, and equivalents have been deliberately omitted in order to avoid unnecessarily obscuring the disclosure. Accordingly, the above description should not be taken as limiting the scope of the technology. Additionally, methods or processes can be described as sequential or step-by-step, but it is to be understood that the operations can be performed concurrently, or in different order than as listed.

[0064] Where a range of values is provided, it is understood that each intervening value, to the minimum resolvable between the upper and lower limits of that range, is also specifically disclosed. Any narrower range or value encompassed within the above-described range is also contemplated. These smaller ranges and values are to be construed as included in the broader range or value, unless otherwise explicitly indicated. Unless otherwise stated, all measurements, values, ranges, and other specifications are at least believed to be the most accurate available, but are appreciably approximate, unless otherwise expressly stated.

[0065] As used in this document and the appended claims, the singular forms "a," "an," and "the" include plural references unless the context clearly dictates otherwise. Thus, for example, reference to "a substrate" includes a plurality of such substrates, and reference to "the arm" includes reference to one or more arms and equivalents thereof known to those skilled in the art, and so forth.

[0066] Also, the use of the terms "comprise(s)," "comprising," "contain(s)," "containing," "include(s)," and "including," when used in this specification and in the following claims, are intended to be open-ended, and not limit the claimed technology to items recited as the only possible

[0067] "comprising," "contain(s)," "containing," "include(s)," and "including," when used in this specification and in the following claims, are intended to be open-ended, and not limit the claimed technology to items recited as the only possible

Claims

1. A substrate processing system comprising: a transfer region housing defining a transfer region fluidically coupled with a plurality of processing regions, wherein sidewalls of the transfer region housing define sealable access ports for providing and receiving substrates; a plurality of substrate supports disposed within the transfer region; and a transfer apparatus comprising: a central hub comprising a shaft extending distally through the transfer region housing into the transfer region, a lateral translation apparatus coupled with an outer surface of the transfer region housing, the lateral translation apparatus configured to provide at least one direction of lateral movement of the shaft, and a terminal actuator coupled with the shaft at the distal end of the shaft within the transfer region, the terminal actuator comprising a plurality of arms having an arm quantity equal to a substrate support quantity of the plurality of substrate supports.

2. The substrate processing system of claim 1, further comprising a first drive coupled with the shaft and configured to rotate the shaft about a central axis through the shaft, wherein the first drive comprises a frameless motor extending about the shaft.

3. The substrate processing system of claim 2, further comprising a second drive coupled with the shaft and configured to provide vertical translation of the shaft, wherein the first drive is contained within a housing coupled with a guide, the second drive guides the housing along the guide, and the guide vertically translates the first drive and the shaft.

4. The substrate processing system of claim 1, wherein the lateral translation apparatus comprises a first platform translatable in a first lateral direction, and wherein the central hub is coupled with the first platform.

5. The substrate processing system of claim 4, wherein the lateral translation apparatus comprises a second platform translatable in a second lateral direction, wherein the second platform is vertically aligned with and coupled with the first platform, and wherein the second lateral direction is orthogonal to the first lateral direction. a bellows through which the shaft extends, wherein the bellows is fixedly coupled at a first end with a base plate of the transfer apparatus, and wherein the bellows is sized to provide lateral translation of the shaft within a volume of the bellows.

6. The substrate processing system of claim 1, further comprising:

7. A transfer apparatus comprising: a base plate defining a central aperture; a shaft having a distal end extending at least partially through the central aperture of the base plate; a lateral translation apparatus coupled with the base plate, the lateral translation apparatus configured to provide at least one direction of lateral movement of the shaft within the central aperture of the base plate; a bellows coupled with the base plate and axially aligned with the central aperture of the base plate, wherein the shaft extends at least partially through the bellows; a first drive coupled with the shaft and configured to rotate the shaft about a central axis of the shaft; and a second drive coupled with the shaft and configured to provide vertical translation of the shaft. ​ a support coupled with the lateral translation device, wherein the support includes one or more guides extending perpendicularly along a surface of the support facing the shaft.

8. The transfer apparatus of claim 7, wherein the shaft is at least partially contained within a housing, wherein the housing is movably coupled with the guides of the support.

9. The transfer apparatus of claim 8, wherein a first end of the bellows is coupled with the base plate, and wherein a second end of the bellows is coupled with the housing.

10. The transfer apparatus of claim 8, further comprising a second drive coupled with a base of the support, wherein the second drive is configured to drive the housing perpendicularly along the guides of the support, providing perpendicular translation of the shaft.

11. The transfer apparatus of claim 10, wherein the second drive is laterally offset from the first drive, and wherein the second drive is axially aligned with the first drive.

12. The transfer apparatus of claim 7, wherein the lateral translation device includes a first platform coupled with the base plate and translatable in a first lateral direction, and wherein the bellows at least partially extends through the first platform.

13. The transfer apparatus of claim 12, wherein the lateral translation device includes a second platform translatable in a second lateral direction perpendicular to the first lateral direction, and wherein the second platform is perpendicularly aligned with and coupled with the first platform, and wherein the bellows at least partially extends through the second platform.

14. A substrate processing system, comprising: a transfer region housing defining a transfer region fluidically coupled with a plurality of processing regions, wherein a sidewall of the transfer region housing defines a sealable access port for providing and receiving substrates, and wherein a base of the transfer region housing defines an aperture; a plurality of substrate supports disposed within the transfer region; and a transfer apparatus comprising: a base plate defining a central aperture, wherein the base plate is coupled with an exterior of the base of the transfer region housing, and wherein the central aperture of the base plate extends through the base of the transfer region housing about the aperture; a shaft having a distal end at least partially extending through the central aperture of the base plate; a lateral translation device coupled with the base plate, the lateral translation device configured to provide lateral movement of the shaft in at least one direction within the central aperture of the base plate; a bellows coupled with the base plate and axially aligned with the central aperture of the base plate, wherein the shaft at least partially extends through the bellows; and an end effector coupled with the shaft at the distal end of the shaft within the transfer region, the end effector comprising a plurality of arms configured to support a substrate. ​

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