Resin molding device and method for manufacturing resin molded product

Abstract

The present application relates to a resin molding device and a method for manufacturing a resin molded product. The resin molding device (D) comprises: a resin supply mechanism (2A) including a nozzle (23b) for discharging liquid resin (R) toward a supply object (F); a resin recovery unit (2B) having a resin receiving member (26) for receiving the liquid resin (R) dripping from the nozzle (23b) and a moving mechanism (29) for moving the resin receiving member (26) located below the nozzle (23b) to follow the movement of the nozzle (23b); a molding die (M) including an upper die and a lower die (LM) opposite to the upper die; a clamping mechanism (35) for clamping the molding die (M) in a state where the supply object (F) is arranged between the upper die and the lower die (LM); and a control unit (5) for controlling at least the operation of the resin supply mechanism (2A) and the resin recovery unit (2B).

Description

Technical Field

[0001] The present invention relates to a resin molding device and a method for manufacturing a resin molded product. Background Art

[0002] Substrates with semiconductor chips mounted thereon are usually sealed with resin and used as electronic components. Conventionally, as resin molding devices for sealing substrates with resin, there are known devices having a resin supply mechanism having a nozzle for discharging liquid resin toward the substrate as a supply object (for example, see Japanese Patent Publication Nos. 2007-111862 and 2012-126075).

[0003] Japanese Patent Application Publication No. 2007-111862 discloses the following technology: a liquid resin is supplied to a substrate in a state where a nozzle is arranged in a vacuum chamber, and after the nozzle is moved above the vacuum chamber, a liquid drop container is used to receive the liquid resin dropped from the front end of the nozzle. In addition, Japanese Patent Application Publication No. 2007-111862 discloses the following technology: before the liquid resin is supplied to the substrate again, the liquid resin is discharged from the nozzle to the drop container multiple times to prevent the mixing of air.

[0004] Japanese Patent Application Publication No. 2012-126075 discloses the following technology: the resin supply mechanism is configured to be able to replace a syringe (Syringe) including a nozzle, and from the replacement of the syringe to the start of use, the poor quality liquid resin near the front end of the nozzle is discarded into a discard cup that is rotated by a rotating mechanism so as to be located below the nozzle. In addition, Japanese Patent Application Publication No. 2012-126075 discloses the following technology: after supplying liquid resin to a substrate, the nozzle is moved up and down to make the liquid resin fall onto the substrate, thereby performing a wire breaking action.

[0005] However, after the liquid resin is supplied to the substrate, the resin molding device described in Japanese Patent Publication No. 2007-111862 moves the nozzle upward from the vacuum chamber, and the liquid resin dripping from the nozzle falls and adheres to the substrate, so the resin supply state of the substrate may be deviated. After the liquid resin is supplied to the substrate, the resin forming device described in Japanese Patent Publication No. 2012-126075 moves the nozzle up and down to make the liquid resin dripping from the nozzle fall on the substrate. Therefore, when the amount of liquid dripped from the nozzle is different from the designed value, the resin supply state of the substrate may be deviated. Summary of the invention

[0006] Problems to be solved by the invention

[0007] Therefore, there is a demand for a resin molding apparatus and a method for producing a resin molded product that can supply liquid resin to a supply target object with high accuracy.

[0008] Solutions for solving problems

[0009] The characteristic structure of the resin molding device of the present invention is as follows: the resin molding device comprises: a resin supply mechanism, including a nozzle for discharging liquid resin toward a supply object; a resin recovery unit, including a resin receiving member for receiving the liquid resin dripping from the nozzle and a moving mechanism for moving the resin receiving member located below the nozzle to follow the movement of the nozzle; a molding mold, including an upper mold and a lower mold opposite to the upper mold; a clamping mechanism for clamping the molding mold in a state where the supply object is arranged between the upper mold and the lower mold; and a control unit, which controls at least the operation of the resin supply mechanism and the resin recovery unit.

[0010] The manufacturing method of the resin molded product of the present invention is characterized in the following aspects: the manufacturing method of the resin molded product is a manufacturing method of the resin molded product using the above-mentioned resin molding device, including: a resin supplying step, using the resin supplying mechanism to supply the liquid resin to the supply object; a resin recovery step, after supplying the liquid resin to the supply object in the resin supplying step, using the resin recovery unit to recover the liquid resin dripping from the nozzle; and a resin molding step, using the liquid resin supplied in the resin supplying step to perform resin molding.

[0011] Effects of the Invention

[0012] According to the present invention, it is possible to provide a resin molding apparatus and a method for manufacturing a resin molded product that can supply liquid resin to a supply target object with high accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram showing a resin molding device.

[0014] Figure 2 It is a schematic diagram showing the mold clamping mechanism.

[0015] Figure 3 It is a plan view schematically showing the resin recovery unit.

[0016] Figure 4 It is a side view schematically showing the resin recovery unit.

[0017] Figure 5 This is a side view schematically showing the liquid shutoff operation of the nozzle.

[0018] Figure 6 This is a control flow chart related to resin supply.

[0019] Description of Reference Numerals

[0020] 2A: Resin supply mechanism; 2B: Resin recovery unit; 5: Control unit; 22: Sensing sensor; 23b: Nozzle; 26: Resin receiving cup (resin receiving member); 27: Arm; 28: Rotating mechanism; 29: Moving mechanism; 29a: Forward and backward moving mechanism; 29c: Cylinder; 30: Position sensor; 35: Mold clamping mechanism; D: Resin molding device; F: Release film (supply object); LM: Lower mold; M: Molding mold; Mо: Servomotor (motor); Pa1: Center position (first position); Pa2: Nozzle retreat position (second position); Pb: Cup retreat position (retreat position); R: Liquid resin; UM: Upper mold. DETAILED DESCRIPTION

[0021] Hereinafter, embodiments of the resin molding device and the method for manufacturing a resin molded product of the present invention will be described based on the accompanying drawings. Figure 1 As shown in FIG. 1 , a resin molding device D including a resin supply module 2 will be described. However, the present invention is not limited to the following embodiments, and various modifications can be made without departing from the gist of the invention.

[0022] [Device configuration]

[0023] Substrates or the like on which semiconductor chips are mounted are used as electronic components by resin sealing. As a technique for resin sealing a molding object, a compression method (compression molding), a transfer method, and the like can be cited. As one of the compression methods, there can be cited a resin sealing method in which, after liquid resin is supplied to a release film, a release film is placed on a lower mold of a molding mold, and the molding object is immersed in the liquid resin on the release film to perform resin molding. The resin molding device D in the present embodiment adopts a compression method, and the resin supply module 2 is a device for supplying liquid resin to a molding mold, a substrate (an example of a supply object), or a release film F (an example of a supply object). In the following, the supply object to which a liquid resin R composed of a liquid resin is to be supplied is set as a release film F, a substrate S carrying a semiconductor chip (hereinafter sometimes referred to as a "chip") is set as an example of a molding object, the direction of gravity is set as down, and the direction opposite to the direction of gravity is set as up, and thus the explanation is given. It should be noted that, Figure 1 The Z direction shown is the up-down direction.

[0024] exist Figure 1, a schematic diagram of a resin molding device D is shown. The resin molding device D in this embodiment comprises: a release film cutting module 1, a resin supply module 2, a plurality of (two in this embodiment) compression molding modules 3, a conveying module 4, a control unit 5, and a notification unit 6. The release film cutting module 1, the resin supply module 2, the plurality of compression molding modules 3, and the conveying module 4 can be independently attached or detached. It should be noted that the compression molding module 3 in this embodiment is composed of two, but can also be composed of one or more than three.

[0025] The release film cutting module 1 cuts and separates a release film F which is circular in plan view from a long film. The release film cutting module 1 includes a roll film 14, a film gripper 15, and a film loading mechanism 16. The film gripper 15 holds the end of the roll film 14 and pulls out the roll film 14. The film loading mechanism 16 cuts and separates a release film F which is circular in plan view from the roll film 14 using a cutter (not shown).

[0026] The resin supply module 2 includes: a resin supply mechanism 2A for supplying liquid resin R for resin molding to a resin supply region on the release film F; and a resin recovery unit 2B for recovering the liquid resin R in a manner that does not drip onto the release film F after the liquid resin R is supplied onto the release film F by the resin supply mechanism 2A. Here, the liquid resin R refers to a resin that is liquid at normal temperature (room temperature). The liquid resin that becomes liquid at normal temperature may be a thermoplastic resin or a thermosetting resin.

[0027] Thermosetting resin is a resin that is liquid at room temperature, decreases in viscosity when heated, and polymerizes and cures to become a cured resin when further heated. The liquid resin R in this embodiment is preferably a thermosetting resin with a high viscosity that does not flow rapidly at room temperature.

[0028] The resin supply mechanism 2A includes a work table 20 on which the release film F delivered from the release film cutting module 1 is placed, a discharge mechanism 21 for discharging liquid resin R onto the release film F, and a weight sensor 25. The release film F delivered from the release film cutting module 1 is held on the upper surface of the work table 20 by suction by a suction mechanism (not shown).

[0029] The discharge mechanism 21 includes a dispenser unit 21a equipped with a cartridge 23 and a clamping mechanism 21b that fastens the front end portion of a nozzle 23b of the cartridge 23. The dispenser unit 21a includes a pressing member (not shown) for extruding liquid resin R in a syringe 23a containing liquid resin R described later, and the pressing member is moved downward to supply a certain amount of liquid resin R to the release film F via the cartridge 23.

[0030] The glue dispenser unit 21a equipped with the box 23 is configured to be able to move arbitrarily on the XY plane (horizontal direction) which serves as the loading surface of the release film F. In addition, the glue dispenser unit 21a is configured to be able to move in the Z direction (up and down direction). The clamping mechanism 21b uses a pair of clamping members to clamp the front end portion of the nozzle 23b to block the nozzle 23b. It should be noted that the workbench 20 can also be configured to be able to move arbitrarily on the XY plane in addition to the glue dispenser unit 21a, or instead of the glue dispenser unit 21a. In addition, the driving source of the glue dispenser unit 21a is not particularly limited. For example, an electric motor such as a servo motor Mо can be used, and the clamping mechanism 21b can work by the fluid pressure of air or the like supplied to the cylinder (not shown).

[0031] The cartridge 23 includes a syringe 23a containing liquid resin R and a nozzle 23b for discharging the liquid resin R. A plurality of cartridges 23 (six in this embodiment) are previously contained in the resin containing portion 11. The dispenser unit 21a is configured to automatically replace the cartridge 23 with a different cartridge 23 when the liquid resin R filled in the cartridge 23 is exhausted.

[0032] The weight sensor 25 measures the weight of the liquid resin R supplied to the release film F and the weight of the resin receiving cup 26 described later. The weight sensor 25 is a known load sensor that measures the supplied or recovered liquid resin R based on the difference between the weight of the release film F after resin supply or the resin receiving cup 26 after resin recovery and the weight of the release film F before resin supply or the resin receiving cup 26 before resin recovery.

[0033] The resin loader 12 is configured to be movable on rails in the X direction between the release film cutting module 1 , the resin supply module 2 , and each compression molding module 3 .

[0034] In addition, the resin loader 12 is configured to be movable on a track in the Y direction in the resin supply module 2 and each compression molding module 3. The resin loader 12 can transport the release film F cut by the release film cutting module 1 to the resin supply module 2, hold the release film F supplied with liquid resin R by the resin supply mechanism 2A in the resin supply module 2, and transfer it to the compression molding module 3. In addition, the resin loader 12 is provided with a post-processing mechanism 13. The post-processing mechanism 13 can remove the used release film F from the compression molding module 3 and discard the used release film F to a discarding section (not shown) located in the release film cutting module 1.

[0035] The resin recovery unit 2B includes: a resin receiving cup 26 (an example of a resin receiving member) for receiving the liquid resin R dripping from the nozzle 23b; an arm 27 for holding the resin receiving cup 26; a rotating mechanism 28 for rotating the arm 27 on the XY plane; and a moving mechanism 29 (forward and backward moving mechanism 29a) for moving the resin receiving cup 26 located below the nozzle 23b to follow the movement of the nozzle 23b. The resin recovery unit 2B is supported by the housing of the resin supply module 2. The details of the resin recovery unit 2B will be described later.

[0036] The compression molding module 3 includes at least a molding die M and a mold clamping mechanism 35 for clamping the molding die M. The compression molding module 3 will be described in detail later.

[0037] The conveying module 4 conveys the pre-resin-sealed substrate Sa (pre-molding substrate) on which the chip before resin sealing is mounted, and conveys the substrate Sb (resin molded product) after resin sealing. The conveying module 4 includes: a substrate loader 41; a first accommodating portion 43 for storing the pre-resin-sealed substrate Sa; a second accommodating portion 44 for storing the substrate Sb after resin sealing; and a robot arm 45. The robot arm 45 can transfer the pre-resin-sealed substrate Sa to the substrate loader 41 in the conveying module 4. In addition, the robot arm 45 can receive the resin-sealed substrate Sb conveyed from the substrate loader 41. The substrate loader 41 moves in the X direction and the Y direction in the conveying module 4 and each compression molding module 3.

[0038] The conveying module 4 also includes an inspection mechanism (not shown). The inspection mechanism inspects the chip existence area in the substrate S (substrate Sa before resin sealing) which is the molding object in the compression molding module 3. The inspection mechanism checks whether the chip actually exists in the existence area of ​​the chip to be inspected by scanning with a laser displacement meter, and stores the places where the chip exists and the places where the chip does not exist. It should be noted that the inspection mechanism can also use a visible light camera to photograph the substrate S, and inspect the chip existence area in the substrate S based on the photographed image.

[0039] The control unit 5 is a software for controlling the operation of the resin molding device D, including a program stored in a hardware such as a HDD (Hard Disk Drive) or a memory, and is executed by a processor including an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), a CPU (Central Processing Unit), or other hardware of a computer. That is, the control unit 5 has a program for executing Figure 6 The notifying unit 6 notifies the operation of the resin molding device D and is composed of a display, an alarm lamp, etc. provided on the front surface of the conveying module 4. In particular, the notifying unit 6 in this embodiment can notify the malfunction of the resin recovery unit 2B. In this embodiment, as an example of the control form of the control unit 5 and the notification form of the notifying unit 6, the situation related to the operation of the resin supply module 2 will be described later.

[0040] like Figure 2 As shown, the compression molding module 3 in this embodiment is composed of a press frame (Press frame) formed by integrating a lower fixed platen 31 and an upper fixed platen 33 through a plate-like member 32. A movable platen 34 is provided between the lower fixed platen 31 and the upper fixed platen 33. The movable platen 34 can move up and down along the plate-like member 32. On the lower fixed platen 31, there is provided: a mold clamping mechanism 35, which is composed of a ball screw or the like as a device for moving the movable platen 34 up and down. The mold clamping mechanism 35 can close the molding mold M by moving the movable platen 34 upward, and open the molding mold M by moving the movable platen 34 downward. The driving source of the mold clamping mechanism 35 is not particularly limited, and for example, an electric motor such as a servo motor (not shown) can be used.

[0041] The upper mold UM and the lower mold LM as the molding mold M are arranged opposite to each other, and both are composed of molds and the like. An upper mold holder (holder) 39 including an upper heater 37 is arranged on the lower surface of the upper fixed plate 33, and the upper mold UM is installed below the upper mold holder 39. An upper mold substrate setting portion (not shown) for arranging the substrate S is provided in the upper mold UM, and a substrate S with chips and the like mounted thereon is installed on the lower surface of the upper mold UM. A lower mold holder 38 including a lower heater 36 is arranged on the upper surface of the movable platen 34, and a lower mold LM is provided above the lower mold holder 38. By holding a release film F sucked by a suction mechanism (not shown) in the lower mold cavity MC, the resin supply mechanism 2A supplies the liquid resin R applied on the release film F to the lower mold cavity MC. By clamping the molding mold M by the clamping mechanism 35 and heating the lower mold LM by the lower heater 36, the liquid resin R in the lower mold cavity MC is melted and solidified. That is, with the resin-sealed pre-substrate Sa and the release film F as the supply object arranged between the upper mold UM and the lower mold LM, the mold clamping mechanism 35 is used to clamp the molding mold M to perform resin sealing. As a result, the chips mounted on the resin-sealed pre-substrate Sa (pre-molding substrate) are resin-sealed in the lower mold cavity MC to form a resin-sealed substrate Sb (resin molded product). Figure 1 The description will be given with one side of the molding die M in the Y direction being referred to as the front (FRONT), and one side of the substrate loader 41 in the Y direction being referred to as the back (BACK).

[0042] exist Figure 3 to Figure 5 , a schematic diagram of the resin supply mechanism 2A and the resin recovery unit 2B is shown. As described above, the resin recovery unit 2B has a resin receiving cup 26, an arm 27, a rotating mechanism 28, and a moving mechanism 29. In addition, the resin recovery unit 2B has: a sensing sensor 22 for sensing the presence or absence of the nozzle 23b when the resin receiving cup 26 is moving due to the operation of the moving mechanism 29; and position sensors 30a, 30b for sensing the position of the arm 27.

[0043] like Figure 3-4 As shown, the resin receiving cup 26 is formed of a semi-transparent cup with a bottom, and a resin containing space having a bottom area larger than the outer diameter of the box 23 when viewed from above is formed inside. The arm 27 is composed of a long plate-shaped member, and has a rotating mechanism 28 at one end, and supports the resin receiving cup 26 at the other end. When the resin supply mechanism 2A supplies liquid resin R to the release film F, the arm 27 is located at the cup retreat position Pb (an example of the retreat position) outside the resin supply area of ​​the release film F, and by operating the rotating mechanism 28, the arm 27 can be rotated and moved between the cup retreat position Pb and the nozzle retreat position Pa2. As described later, the length of the arm 27 is set to a length that the arm 27 can move in the resin supply area by the forward and backward moving mechanism 29a to follow the movement of the nozzle 23b after the resin supply is completed. In the present embodiment, the resin supply area is circular when viewed from above, and the nozzle 23b moves in a straight line from the center of the circle to the outside of the circle after the resin supply is completed. Therefore, the length of the arm 27 is the length of the resin receiving cup 26 supported at its other end, which moves due to the forward and backward moving mechanism 29a and reaches the center of the resin supply area.

[0044] The rotating mechanism 28 is configured to rotate the arm 27 around the rotating shaft 28a by a driving source such as an electric motor or an air cylinder (not shown), and the rotating shaft 28a is fixed to one end of the arm 27. The sensing sensor 22 is provided at the other end of the arm 27 near the resin receiving cup 26, and is configured by a known laser sensor or the like that senses the nozzle 23b by irradiation of laser. That is, the sensing sensor 22 can sense whether the resin receiving cup 26 is located below the nozzle 23b.

[0045] The moving mechanism 29 has a cylinder 29c, including a forward and backward moving mechanism 29a, which uses the fluid pressure of air (an example of a fluid) supplied into the cylinder 29c from the forward and backward directions to move the arm 27 straight forward and backward. The forward and backward moving mechanism 29a moves the resin receiving cup 26 located below the nozzle 23b to follow the movement of the nozzle 23b. The forward and backward moving mechanism 29a in this embodiment moves the arm 27 straight along the Y direction within the range of a central position Pa1 (an example of a first position in the resin supply area) where the resin receiving cup 26 is located below the nozzle 23b where the resin supply is completed, and a nozzle retreat position Pa2 (an example of a second position outside the resin supply area) where the resin receiving cup 26 is located below the nozzle 23b that has retreated to the resin supply area of ​​the release film F. That is, the resin receiving cup 26 is configured to be rotatable and movable between the nozzle retreat position Pa2 and the cup retreat position Pb (retreat position) on the XY plane, and is configured to be able to move straightly between the central position Pa1 and the nozzle retreat position Pa2 following the movement of the nozzle 23b. The position sensors 30a and 30b are composed of well-known photoelectric sensors, etc., and send a signal if the arm 27 is sensed, and stop sending the signal if the arm 27 is not sensed. The position sensors 30a and 30b in this embodiment are respectively arranged at the moving start end of the arm 27 when the resin receiving cup 26 is located at the central position Pa1 and the moving end end of the arm 27 when the resin receiving cup 26 is located at the nozzle retreat position Pa2.

[0046] exist Figure 4 , a schematic side view of the resin recovery unit 2B is shown when the resin receiving cup 26 is located at the central position Pa1. Figure 4 As shown, the moving mechanism 29 further includes a vertical moving mechanism 29b that uses fluid pressure such as air to move the arm 27 vertically.

[0047] exist Figure 5 , a schematic side view (upper part) and a top view (lower part) showing the shut-off operation of the nozzle 23b are shown. Figure 5 As shown in the upper center figure, the front end portion of the nozzle 23b that has completed supplying the resin to the resin supply area of ​​the release film F is blocked by the clamping mechanism 21b. At this time, at the front end of the nozzle 23b, the liquid resin R sometimes becomes a wire drawing state or a block state and remains. Therefore, when the resin supply mechanism 2A finishes supplying the liquid resin R to the release film F, the rotating mechanism 28 and the moving mechanism 29 are used to move the resin receiving cup 26 to the bottom of the nozzle 23b, and the residual liquid of the nozzle 23b is recovered into the resin receiving cup 26. Here, the residual liquid of the nozzle 23b refers to the unnecessary liquid resin R dripping from the front end of the nozzle 23b that has completed the resin supply.

[0048] Then, if Figure 5As shown in the right figure, the driving force of the servo motor Mо of the resin supply mechanism 2A is used to move the nozzle 23b to the nozzle retreat position Pa2 that is retreated outside the resin supply area of ​​the release film F, and the fluid pressure of the air supplied to the cylinder 29c of the forward and backward moving mechanism 29a is used to move the resin receiving cup 26 located below the nozzle 23b to follow the movement of the nozzle 23b. At this time, the control unit 5 adjusts the fluid pressure of the air supplied to the cylinder 29c based on the difference in sensing time between the movement start of the arm 27 sensed by the position sensor 30a on one side and the movement end of the arm 27 sensed by the position sensor 30b on the other side (movement time of the arm 27), so that the pre-calculated movement speed of the resin receiving cup 26 and the movement speed of the nozzle 23b become the same speed (also refer to Figure 3 ). That is, the control unit 5 adjusts the fluid pressure of the air supplied to the cylinder 29c so that the moving speed of the arm 27 calculated based on the detection results of each position sensor 30a, 30b and the moving speed of the nozzle 23b become equal. Specifically, the time T taken to move the nozzle 23b from the central position Pa1 to the nozzle retreat position Pa2 is calculated, and the air is adjusted according to the time T so that the arm 27 moves from the central position Pa1 to the nozzle retreat position Pa2. As described above, the movement of the arm 27 from the central position Pa1 to the nozzle retreat position Pa2 is sensed by the two sensors 30a, 30b.

[0049] In this manner, the resin receiving cup 26 receiving the liquid resin R is moved by the front-rear moving mechanism 29a to follow the movement of the nozzle 23b while being positioned below the nozzle 23b.

[0050] By utilizing the forward and backward moving mechanism 29a, after the resin supply by the resin supply mechanism 2A is completed, the residual liquid of the nozzle 23b can be received by the resin receiving cup 26 while the nozzle 23b is retreated from the resin supply area. As a result, the residual liquid of the nozzle 23b will not fall onto the release film F, and a good resin supply state is achieved. In addition, after the nozzle 23b is blocked by the clamping mechanism 21b, the residual liquid of the nozzle 23b can be received by the resin receiving cup 26 by the forward and backward moving mechanism 29a while the nozzle 23b is retreated from the resin supply area on the release film F, thereby eliminating the wire drawing state of the nozzle 23b and recovering the residual liquid, which is efficient. Moreover, even in a state where the clamping mechanism 21b is not provided and the liquid resin R flows out, the liquid resin R can be recovered by the resin receiving cup 26 to prevent the liquid resin R from falling into the resin supply area.

[0051] [Method for producing resin molded article]

[0052] Main Use Figure 6 A method for producing a resin molded article will be described.

[0053] First, if Figure 1 As shown, the resin-sealed front substrate Sa delivered from the first accommodating portion 43 by the robot 45 is placed on the substrate loader 41. At this time, the inspection mechanism preliminarily inspects the existence area of ​​chips, etc. in the substrate S (resin-sealed front substrate Sa) as the molding object. The control unit 5 calculates (or sets) the target supply amount and target supply position (resin supply track) of the liquid resin R in the resin supply area of ​​the release film F based on at least the size of the substrate S as the molding object and the existence area of ​​the chips, etc. in the substrate S. In addition, the release film F delivered from the release film cutting module 1 is adsorbed and held on the upper surface of the workbench 20 by the suction mechanism, thereby supplying the release film F as the supply object to the resin supply mechanism 2A (#61). Next, based on the calculated target supply amount and target supply position, the control unit 5 moves the dispenser unit 21a equipped with the box 23 of the resin supply mechanism 2A, and supplies the liquid resin R from the nozzle 23b to the release film F (#62, resin supply step).

[0054] Next, after the nozzle 23b (dispenser unit 21a) reaches the end along the resin supply track, the control unit 5 moves the nozzle 23b to the upper side of the center position Pa1. Then, the clamping mechanism 21b is operated to block the nozzle 23b (see Figure 5 ), and then, the dispensing machine unit 21a (nozzle 23b) is moved up and down to cut off the liquid resin R. Then, the control unit 5 determines whether the supply amount of liquid resin R on the release film F measured by the weight sensor 25 has reached the target supply amount, that is, whether the resin supply has ended (#63). When the supply amount of liquid resin R on the release film F has not reached the target supply amount (No in #63), the control unit 5 operates the clamping mechanism 21b and opens the nozzle 23b, so that the resin supply mechanism 2A supplies the liquid resin R of the difference between the target supply amount and the supply amount of liquid resin R on the release film F (that is, the insufficient part of the resin supply amount) to the central part of the resin supply area on the release film F (#62). On the other hand, when the supply amount of liquid resin R on the release film F has reached the target supply amount (Yes in #63), the control unit 5 ends the resin supply.

[0055] Immediately after the resin supply is completed, the control unit 5 operates the rotating mechanism 28 to rotate the arm 27 equipped with the resin receiving cup 26 from the cup retreat position Pb (retreat position) to the nozzle retreat position Pa2 (second position), and then operates the forward and backward moving mechanism 29a to move the arm 27 equipped with the resin receiving cup 26 directly from the nozzle retreat position Pa2 to the central position Pa1 below the nozzle 23b (#64, refer to Figure 5At this time, the control unit 5 operates the dispensing unit 21a or the vertical movement mechanism 29b as needed to adjust the height of the nozzle 23b or the arm 27 in a manner that the resin receiving cup 26 does not collide with the nozzle 23b. When the result of the sensing sensor 22 sensing the nozzle 23b is that the resin receiving cup 26 is not located below the nozzle 23b, the notification unit 6 notifies the resin recovery unit 2B of the malfunction.

[0056] Next, the control unit 5 operates the forward and backward moving mechanism 29a, so that the arm 27 equipped with the resin receiving cup 26 located below the nozzle 23b follows the movement of the nozzle 23b based on the driving force of the servo motor M0 of the resin supply mechanism 2A, and moves directly from the central position Pa1 (inside the resin supply area) to the nozzle retreat position Pa2 (outside the resin supply area) (#65, resin recovery step, refer to Figure 5 During the movement, the control unit 5 calculates the moving speed of the resin receiving cup 26 based on the difference in sensing time between the moving start of the arm 27 sensed by the position sensor 30a on one side and the moving end of the arm 27 sensed by the position sensor 30b on the other side, and pre-adjusts the fluid pressure of the air supplied to the cylinder 29c (refer to Figure 3 ) so that the moving speed becomes equal to the moving speed of the nozzle 23b, so that the resin receiving cup 26 moves following the movement of the nozzle 23b. Thus, when the nozzle 23b moves, the residual liquid of the nozzle 23b is prevented from further accidentally dripping onto the release film F. Assuming that when the front-rear moving mechanism 29a is working, when the moving speed of the resin receiving cup 26 is not within the prescribed range, the notification unit 6 notifies the malfunction of the resin recovery unit 2B. In addition, as a result of the sensing of the sensing sensor 22, when the resin receiving cup 26 is not located below the nozzle 23b, the notification unit 6 notifies the malfunction of the resin recovery unit 2B. After the nozzle 23b reaches the nozzle retraction position Pa2, the control unit 5 uses the rotating mechanism 28 to rotate the arm 27 equipped with the resin receiving cup 26 to the cup retraction position Pb (#66). Specifically, the control unit 5 operates the rotation mechanism 28 to rotationally move the arm 27 to which the resin receiving cup 26 is attached from the nozzle retreat position Pa2 (second position) to the cup retreat position Pb (retreat position).

[0057] Then, if Figure 1-2 As shown, the control unit 5 first supplies the pre-resin-sealed substrate Sa to the upper mold UM by the substrate loader 41, and then holds the release film F supplied with the liquid resin R in the resin loader 12 and transfers it to the compression molding module 3 to supply it to the lower mold LM.

[0058] That is, the substrate Sa before resin sealing is arranged in the upper mold UM, and the release film F is arranged in the lower mold LM. Then, the upper mold UM and the lower mold LM are clamped by the clamping mechanism 35, and the substrate Sb after resin sealing is subjected to resin molding (#67, resin molding step). After the resin molding is completed, the substrate Sb after resin sealing is transported from the compression molding module 3 to the transport module 4 by the substrate loader 41, and the robot 45 receives the substrate Sb after resin sealing from the substrate loader 41 and stores it in the second storage section 44 (refer to Figure 1 The control unit 5 determines whether to continue supplying the liquid resin R on the release film F, and executes control from #61 to #67 when the resin supply is continued (YES in #68), and terminates when the resin supply is not continued (NO in #68).

[0059] [Another embodiment]

[0060] In the following, for easy understanding, the same terms and reference numerals are used for the same components as those in the above-mentioned embodiment.

[0061] <1> In the above-mentioned embodiment, the resin receiving member is constituted by the resin receiving cup 26 having a bottom and a cylindrical shape, but as long as it is a member for receiving the residual liquid of the nozzle 23b, it may also be constituted by a plate-like member, etc., without particular limitation. In addition, the resin receiving cup 26 may be set in an inclined posture, or a dripping prevention flange may be provided at the lower part of the resin receiving cup 26, so that the residual liquid of the nozzle 23b in the broken wire state does not adhere to the side of the resin receiving cup 26.

[0062] <2> In the above embodiment, the resin supply mechanism 2A and the resin recovery unit 2B are configured by different drives, but they can also be driven integrally by the driving force of, for example, an electric motor. In this case, from the perspective of compactness of the device, it is preferred that the resin receiving cup 26 is arranged adjacent to the discharge mechanism 21.

[0063] <3> In the above-mentioned embodiment, the resin receiving cup 26 at the cup retreat position Pb is arranged at the rear side and the rotating shaft 28a is arranged at the front side, but the resin receiving cup 26 at the cup retreat position Pb may be arranged at the front side and the rotating shaft 28a may be arranged at the rear side. In this case, by operating the rotating mechanism 28, the resin receiving cup 26 can be moved from the cup retreat position Pb (retreat position) to the central position Pa1 (first position) at one time, and the moving operation of the arm 27 can be simplified.

[0064] <4> In the above-mentioned embodiment, after the resin supply is completed, the resin receiving cup 26 is arranged below the nozzle 23b, and the front-back moving mechanism 29a follows the movement of the nozzle 23b after the resin supply is completed, so that the arm 27 equipped with the resin receiving cup 26 moves straightly in the Y direction. However, the resin receiving cup 26 may be arranged below the nozzle 23b at the moment when the resin is cut in the middle of the resin supply, so that the resin receiving cup 26 moves following the nozzle 23b. For example, in the case of discontinuously supplying resin to the release film F, the arm 27 equipped with the resin receiving cup 26 may be moved following the movement of the nozzle 23b when the dispenser unit 21a (nozzle 23b) moves to the next resin supply position. In addition, in the case where a plurality of coating lines exist in parallel on the release film F, the front-back moving mechanism 29a may also move the arm 27 equipped with the resin receiving cup 26 straightly in the Y direction from the end point of one coating line to the starting point of the next coating line.

[0065] <5> The up-and-down moving mechanism 29b in this embodiment can also follow the up-and-down movement of the dispensing machine unit 21a (nozzle 23b), that is, the arm 27 equipped with the resin receiving cup 26 is moved up and down in a state where the distance between the nozzle 23b and the resin receiving cup 26 is constant. If the distance between the nozzle 23b and the resin receiving cup 26 is maintained constant by the up-and-down moving mechanism 29b, when the nozzle 23b is moved up and down to cut off the liquid, it is possible to reliably prevent the liquid resin R from scattering to the outside of the resin receiving cup 26 and dripping onto the release film F.

[0066] <6> In the above-mentioned embodiment, the discharge mechanism 21 of the resin supply mechanism 2A is oriented in the longitudinal direction (Z direction), but the discharge mechanism 21 of the resin supply mechanism 2A may be oriented in the lateral direction (Y direction).

[0067] <7> If Figure 3 As shown, the moving mechanism (forward and backward moving mechanism 29a) in the above-mentioned embodiment moves the resin receiving member (resin receiving cup 26) straight between a first position (central position Pa1) in the resin supply area and a second position (nozzle retreat position Pa2) outside the resin supply area. However, the first position can be any position as long as it is in the resin supply area, and similarly, the second position can be any position as long as it is outside the resin supply area. In addition, the forward and backward moving mechanism 29a can also be an arc movement or a serpentine movement following the nozzle 23b instead of straight movement.

[0068] <8> In the above embodiment, the release film cutting module 1 and the resin supply module 2 are provided separately to form a two-module structure. However, a release film cutting mechanism may be provided inside the resin supply module 2 to form a single module structure.

[0069] <9> The substrate S in the above-mentioned embodiment may be in any shape such as a circular shape or a rectangular shape. The size of the substrate S is not particularly limited, and a large-sized substrate (for example, a substrate with a diameter of 300 mm, a square of 300 mm, etc.) is more preferred, in which the supply range of the liquid resin R is wide and the moving distance of the discharge mechanism 21 of the resin supply mechanism 2A is increased.

[0070] <10> In the above embodiment, the die-down compression method is described, but the die-up compression method may be used, and the molding object such as the substrate may be set as the supply object to which the resin is supplied in the resin supply mechanism 2A. In addition, the mold release film F may be omitted and the molding mold M may be set as the supply object to which the resin is supplied in the resin supply mechanism 2A.

[0071] [Overview of the above embodiment]

[0072] Hereinafter, the outline of the resin molding device D, the method for manufacturing a resin molded product, and the method for supplying a resin material described in the above-mentioned embodiment will be described.

[0073] (1) The characteristic structure of the resin molding device D is as follows: the resin molding device D comprises: a resin supply mechanism 2A, including a nozzle 23b for discharging liquid resin R toward a supply object (release film F); a resin recovery unit 2B, including a resin receiving member (resin receiving cup 26) for receiving the liquid resin R dripping from the nozzle 23b and a moving mechanism 29 (forward and backward moving mechanism 29a) for moving the resin receiving member located below the nozzle 23b to follow the movement of the nozzle 23b; a molding mold M, including an upper mold UM and a lower mold LM opposite to the upper mold UM; a clamping mechanism 35 for clamping the molding mold M in a state where the supply object is arranged between the upper mold UM and the lower mold LM; and a control unit 5 for controlling at least the operation of the resin supply mechanism 2A and the resin recovery unit 2B.

[0074] The higher the viscosity of the liquid resin R, the longer the wire drawing state of the nozzle 23b is maintained after the resin supply mechanism 2A stops supplying the resin, so the residual liquid of the nozzle 23b falls onto the release film F, and the state (resin supply amount and resin supply position) of supplying the resin to the release film F is deviated. In this configuration, the resin receiving cup 26 receiving the liquid resin R is located below the nozzle 23b, and the front-rear moving mechanism 29a is used to move the resin receiving cup 26 to follow the movement of the nozzle 23b.

[0075] By using the forward and backward moving mechanism 29a, after the resin supply mechanism 2A stops supplying resin, the nozzle 23b can be retracted from the resin supply area while receiving the residual liquid of the nozzle 23b with the resin receiving cup 26. As a result, the residual liquid of the nozzle 23b does not fall onto the release film F, and a good resin supply state is achieved. In this way, a resin molding device D that can supply liquid resin R to a supply object with high accuracy can be provided.

[0076] (2) Alternatively, the resin recovery unit 2B may further include an arm 27 for holding a resin receiving member (resin receiving cup 26); the resin supply mechanism 2A may include a motor (servo motor Mо), the nozzle 23b may be moved by the driving force of the motor, the moving mechanism (forward and backward moving mechanism 29a) may include a cylinder 29c, and the arm 27 may be moved by the fluid pressure of the fluid supplied into the cylinder 29c, thereby moving the resin receiving member.

[0077] If the arm 27 holding the resin receiving cup 26 is moved by the fluid pressure supplied to the cylinder 29c as in this configuration, it becomes a drive different from the servo motor M0 of the resin supply mechanism 2A, so the resin recovery unit 2B can be assembled later. In addition, if it is a drive form based on fluid pressure, the resin recovery unit 2B can be constructed at a low cost.

[0078] (3) Alternatively, the resin recovery unit 2B further includes a rotating mechanism 28 for rotating the arm 27, and a moving mechanism (forward and backward moving mechanism 29a) causes the resin receiving member (resin receiving cup 26) to move directly between a first position (central position Pa1) within the resin supply area and a second position (nozzle retreat position Pa2) outside the resin supply area, and the rotating mechanism 28 rotates the arm 27 to move the resin receiving member between the retreat position (cup retreat position Pb) and the first position or the second position.

[0079] If the resin receiving cup 26 is moved to the central position Pa1, the nozzle retreat position Pa2 or the cup retreat position Pb by operating the rotating mechanism 28 and the front-back moving mechanism 29a as in this configuration, the resin receiving cup 26 located at the cup retreat position Pb can be quickly located below the nozzle 23b in the resin supply area (central position Pa1) after the resin supply is completed by the resin supply mechanism 2A. As a result, the residual liquid of the nozzle 23b can be reliably recovered.

[0080] (4) Alternatively, the resin recovery unit 2B further has at least two position sensors 30a, 30b respectively arranged at the moving starting end and the moving terminal end of the arm 27, and the control unit 5 adjusts the fluid pressure so that the moving speed of the resin receiving component (resin receiving cup 26) calculated based on the detection results of each position sensor 30a, 30b becomes the same speed as the moving speed of the nozzle 23b.

[0081] When the retreat speed of the nozzle 23b to the outside of the resin supply area is constant, if the fluid pressure is adjusted as in the present configuration so that the moving speed of the resin receiving cup 26 calculated based on the detection results of the position sensors 30a and 30b becomes the same as the moving speed of the nozzle 23b, the state of the resin receiving cup 26 being below the nozzle 23b can be well maintained in a simple control form.

[0082] (5) The resin recovery unit 2B may further include a sensing sensor 22 for sensing the nozzle 23b, and the sensing sensor 22 may sense the nozzle 23b when the resin receiving member (resin receiving cup 26) is moving.

[0083] As in this configuration, when the sensing sensor 22 senses the nozzle 23b while the forward and backward moving mechanism 29a is operating, the resin receiving cup 26 can reliably receive the residual liquid of the nozzle 23b.

[0084] (6) The method for manufacturing a resin molded product using the above-mentioned resin molding device is characterized in that the method for manufacturing a resin molded product includes: a resin supplying step, using a resin supplying mechanism 2A to supply liquid resin R to a supply object (release film F); a resin recovery step, after supplying the liquid resin R to the supply object in the resin supplying step, using a resin recovery unit 2B to recover the liquid resin R dripping from the nozzle 23b; and a resin molding step, using the liquid resin R supplied in the resin supplying step to perform resin molding.

[0085] In this method, the residual liquid of the nozzle 23b is recovered in the resin recovery step, so the residual liquid of the nozzle 23b does not fall onto the release film F, and the state of supplying the resin to the release film F (resin supply amount and resin supply position) becomes good. In this way, a method for manufacturing a resin molded product that can supply liquid resin R to a supply target object with high accuracy can be provided.

[0086] Industrial Applicability

[0087] The present invention can be used for a resin molding device and a method for manufacturing a resin molded product.

Claims

1. A resin molding device, wherein: have: A resin supply mechanism including a nozzle for discharging liquid resin toward a resin supply area of ​​a supply object; a resin recovery unit having a resin receiving member for receiving the liquid resin dripping from the nozzle and a moving mechanism for moving the resin receiving member located below the nozzle to follow the movement of the nozzle; A molding die, comprising an upper die and a lower die opposite to the upper die; a mold clamping mechanism for clamping the molding die in a state where the supply object is arranged between the upper die and the lower die; and a control unit for controlling at least the operation of the resin supply mechanism and the resin recovery unit, Immediately after the supply of the liquid resin to the supply object is completed, the resin recovery unit moves the resin receiving member from outside the resin supply area to below the nozzle at a first position within the resin supply area, and while preventing the liquid resin from falling from the nozzle to the resin supply area, the resin receiving member follows the movement of the nozzle and moves to a second position outside the resin supply area.

2. The resin molding device according to claim 1, wherein: The resin recovery unit further includes an arm for holding the resin receiving member. The resin supply mechanism includes a motor, and the nozzle is moved by the driving force of the motor. The moving mechanism includes a cylinder, and the arm is moved by fluid pressure of a fluid supplied into the cylinder, thereby moving the resin receiving member from the first position to the second position.

3. The resin molding device according to claim 2, wherein: The resin recovery unit further includes a rotating mechanism for rotating the arm. The moving mechanism moves the resin receiving member straightly between the first position within the resin supply area and the second position outside the resin supply area. The rotating mechanism rotates the arm to move the resin receiving member between a retracted position and the first position or the second position.

4. The resin molding device according to claim 2 or 3, wherein: The resin recovery unit further comprises at least two position sensors respectively arranged at the moving start end and the moving end end of the arm. The control unit adjusts the fluid pressure so that a moving speed of the resin receiving member calculated based on the detection results of each of the position sensors and a moving speed of the nozzle become equal.

5. The resin molding device according to claim 1, wherein: The resin recovery unit further includes a sensing sensor for sensing the nozzle. The sensing sensor senses the nozzle while the resin receiving member is moving.

6. A method for manufacturing a resin molded product, using the resin molding device according to any one of claims 1 to 5, the method for manufacturing a resin molded product comprising: a resin supplying step of supplying the liquid resin to a resin supplying area of ​​the supply object using the resin supplying mechanism; a resin recovery step, wherein after the liquid resin is supplied to the supply object in the resin supply step, the resin recovery unit moves the resin receiving member from outside the resin supply area to below the nozzle at the first position in the resin supply area, and in a state where the liquid resin dripping from the nozzle is prevented from falling from the nozzle to the resin supply area by recovering the liquid resin dripping from the nozzle to the resin receiving member, the resin receiving member is moved to a second position outside the resin supply area following the movement of the nozzle; and The resin molding step is to perform resin molding using the liquid resin supplied in the resin supplying step.

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