Flexible display module, preparation method thereof and display device

Abstract

The application discloses a flexible display module, a preparation method thereof and a display device. The preparation method comprises the following steps: forming a flexible substrate on one side of a substrate, wherein the flexible substrate has an opening penetrating along the thickness direction of the substrate, and the orthographic projection of the opening in the thickness direction of the substrate is sawtooth-shaped; sequentially laminating a thin film transistor layer, a flat layer, an anode layer and a pixel definition layer on the side of the flexible substrate away from the substrate; forming a barrier in the opening; sequentially laminating an organic light-emitting layer and a common layer on the side of the anode layer away from the substrate; packaging by using a thin film packaging layer, wherein the surface of the thin film packaging layer away from the substrate is lower than the surface of the barrier away from the substrate; and peeling off the substrate to form the flexible display module. The preparation method of the flexible display module provided by the embodiment of the application makes the barrier in the opening of the flexible substrate, and the flexible display module is obtained by peeling off the substrate, and the edge of the orthographic projection of the corresponding prepared flexible display module in the thickness direction of the flexible substrate is sawtooth-shaped.

Description

TECHNICAL FIELD

[0001] The present application generally relates to the field of display technology, and in particular to a flexible display module, a preparation method thereof and a display device. BACKGROUND

[0002] Active-matrix Organic light-emitting diode (AMOLED) display devices have rapidly developed in the display field due to their advantages of high color gamut, high response speed, thinness, flexibility, etc. Large-scale has gradually become one of the development directions of display devices. Due to the complex pixel structure of AMOLED, the yield of large-size AMOLED display devices is exponentially reduced compared to small-size display devices.

[0003] At present, a flexible OLED splicing module is used to form a large-size splicing screen. In the prior art, when a splicing module is formed by a laser cutting process, due to the large laser power, problems such as large ablation area, notch burr, wide notch size, etc. can occur, and only straight line boundaries can be cut. Moreover, the laser cutting alignment precision is low, resulting in a large splicing gap between the splicing modules. SUMMARY

[0004] In view of the above-mentioned defects or shortcomings in the prior art, it is desirable to provide a flexible display module, a preparation method thereof and a display device.

[0005] In a first aspect, an embodiment of the present application provides a flexible display module, comprising: a flexible substrate, in a direction away from the flexible substrate, one side of the flexible substrate is sequentially stacked with a thin film transistor layer, a planarization layer, an anode layer, a pixel definition layer, an organic light-emitting layer, a common layer and a thin film encapsulation layer, the pixel definition layer has a pixel opening for exposing the anode layer, and the organic light-emitting layer is arranged in the pixel opening.

[0006] An edge of a normal projection of the flexible display module in a thickness direction of the flexible substrate is sawtooth-shaped.

[0007] Further, a first metal layer is embedded on a side of the flexible substrate away from the thin film transistor layer.

[0008] A second metal layer is arranged on a side of the flexible substrate close to the thin film transistor layer, and the second metal layer is connected to the first metal layer through a first via hole penetrating the flexible substrate.

[0009] An insulating layer is arranged on a side of the second metal layer away from the flexible substrate, and a gate electrode of a thin film transistor in the thin film transistor layer is connected to the second metal layer through a second via hole penetrating the insulating layer.

[0010] In a second aspect, the embodiments of the present application provide a method for manufacturing a flexible display module, comprising:

[0011] forming a flexible substrate on one side of a substrate, the flexible substrate having an opening penetrating in a thickness direction of the substrate, a normal projection of the opening in the thickness direction of the substrate being sawtooth-shaped;

[0012] stacking a thin film transistor layer, a planar layer, an anode layer and a pixel defining layer in sequence on a side of the flexible substrate facing away from the substrate;

[0013] forming a barrier in the opening;

[0014] stacking an organic light emitting layer and a common layer in sequence on a side of the pixel defining layer facing away from the substrate, the organic light emitting layer being connected to the anode layer through a pixel opening of the pixel defining layer;

[0015] adopting a thin film encapsulation layer for encapsulation, a surface of the thin film encapsulation layer facing away from the substrate being lower than a surface of the barrier facing away from the substrate;

[0016] peeling off the substrate to form a flexible display module.

[0017] Further, the forming of the flexible substrate comprises:

[0018] forming an initial film layer on one side of the substrate;

[0019] adopting a one-time patterning process to process the initial film layer to obtain the flexible substrate, the flexible substrate having an opening corresponding to a position of the barrier to be formed.

[0020] Further, the forming of the barrier comprises:

[0021] applying a negative photoresist on a side of the pixel defining layer facing away from the substrate, and performing exposure, development and etching processes on the negative photoresist to form the barrier in the opening, the barrier gradually narrowing in a direction close to the substrate.

[0022] Further, before the forming of the flexible substrate, the method further comprises: forming a first metal layer on a side of the flexible substrate close to the substrate, the flexible substrate having a first via exposing the first metal layer;

[0023] After the forming of the flexible substrate, the method further comprises: forming a second metal layer on a side of the flexible substrate facing away from the substrate, the second metal layer being connected to the first metal layer through the first via;

[0024] An insulating layer is formed on a side of the second metal layer facing away from the substrate, the insulating layer having a second via hole exposing the second metal layer, the gate of the thin film transistor layer being connected to the second metal layer through the second via hole.

[0025] Further, the insulating layer, the planar layer and the pixel defining layer have a normal projection in the thickness direction of the substrate falling within a normal projection of the flexible substrate in the thickness direction of the substrate.

[0026] The common layer extends along the side of the insulating layer, the planar layer and the pixel defining layer to a side of the flexible substrate facing away from the substrate.

[0027] Further, forming the organic light emitting layer comprises:

[0028] An organic light emitting layer is formed in a pixel opening of the pixel defining layer exposing the anode layer, the thickness of the organic light emitting layer in a direction perpendicular to the substrate being greater than the thickness of the pixel defining layer in the direction perpendicular to the substrate.

[0029] Further, before forming the flexible substrate, the preparation method further comprises: forming a release layer on a side of the substrate close to the flexible substrate.

[0030] The releasing the substrate comprises: releasing the substrate by releasing the release layer.

[0031] In a third aspect, an embodiment of the present application provides a display device, comprising at least two flexible display modules as described above, and adjacent two of the flexible display modules are seamlessly spliced.

[0032] The technical solution provided by the embodiment of the present application can have the following beneficial effects:

[0033] The preparation method of the flexible display module provided by the embodiment of the present application uses a backplane process (spin coating, photolithography, etching, etc.) to design a flexible substrate with an opening on the substrate, make a barrier on the opening, and obtain a flexible display module by releasing the substrate. Since the normal projection of the opening in the thickness direction of the substrate is zigzag, the edge of the normal projection of the corresponding flexible display module in the thickness direction of the flexible substrate is zigzag. A plurality of flexible display modules can be seamlessly spliced to form a display device, and the display device can adopt an HDR (High-Dynamic Range) arrangement, effectively improving the display quality. BRIEF DESCRIPTION OF DRAWINGS

[0034] Other features, objects and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments, made with reference to the accompanying drawings:

[0035] Figure 1 A process flow chart of the preparation method of the flexible display module provided by the embodiment of the present application is shown in the figure.

[0036] Figures 2 to 9 A process flow chart of the preparation method of the flexible display module provided by the embodiment of the present application is shown in the figure.

[0037] Figure 10 A process flow chart of the preparation method of the flexible display module provided by the embodiment of the present application is shown in the figure.

[0038] Figure 11 A process flow chart of the preparation method of the flexible display module provided by the embodiment of the present application is shown in the figure. DETAILED DESCRIPTION

[0039] The present application will be further described below in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, but not to limit the present application. In addition, it should be noted that only the parts related to the present application are shown in the drawings for the convenience of description.

[0040] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and embodiments.

[0041] As shown in the figure, the preparation method of the flexible display module provided by the embodiment of the present application includes the following steps: Figure 1

[0042] S103, forming a flexible substrate on one side of the substrate, the flexible substrate having an opening penetrating in the thickness direction of the substrate, the orthographic projection of the opening in the thickness direction of the substrate being sawtooth-shaped;

[0043] S105, sequentially laminating a thin film transistor layer, a flat layer, an anode layer and a pixel definition layer on the side of the flexible substrate away from the substrate;

[0044] S107, forming a barrier in the opening;

[0045] S109, sequentially laminating an organic light-emitting layer and a common layer on the side of the pixel definition layer away from the substrate, the organic light-emitting layer being connected to the anode layer through the pixel opening of the pixel definition layer;

[0046] S111, packaging by using a thin film packaging layer, the surface of the thin film packaging layer away from the substrate being lower than the surface of the barrier away from the substrate;

[0047] S113, peeling off the substrate to form a flexible display module.

[0048] ​The embodiment provides a preparation method of a flexible display module. A flexible substrate is formed on a substrate. A thin film transistor layer, a planar layer, an anode layer, a pixel definition layer, an organic light-emitting layer, a common layer and a thin film encapsulation layer are prepared on the flexible substrate. The thin film transistor layer comprises a plurality of thin film transistors. The common layer comprises at least one of an electron transport layer and a cathode layer.

[0049] The preparation method first forms a barrier wall. After stripping the substrate and the flexible substrate, the flexible display module comprising the flexible substrate, the thin film transistor layer, the planar layer, the anode layer, the pixel definition layer, the organic light-emitting layer, the common layer and the thin film encapsulation layer can be obtained. Since the orthogonal projection of the opening in the thickness direction of the substrate is zigzag, the edge of the orthogonal projection of the flexible display module in the thickness direction of the flexible substrate is zigzag after the substrate is stripped. Thus, the problems of large-area burning, notch burr and wide notch caused by the laser cutting process can be effectively overcome.

[0050] Since the edge of the orthogonal projection of the flexible display module in the thickness direction of the flexible substrate is zigzag, the flexible display module comprises a plurality of sub-pixel units, such as red sub-pixels, blue sub-pixels and green sub-pixels. Preferably, the plurality of sub-pixel units are arranged in a diamond shape (i.e., a diamond arrangement), a triangular shape or a pearl arrangement.

[0051] Next, the preparation method of the flexible display module will be described in detail. Figures 2 to 9 The preparation method of the flexible display module will be described in detail.

[0052] A substrate 10 is provided. A flexible substrate 13 is formed on one side of the substrate 10 through step S103.

[0053] Referring to Figure 2 Before step S103, a stripping layer 11 is formed on the side of the substrate 10 close to the flexible substrate 13. The substrate 10 can be a glass substrate, a plastic substrate or other rigid substrate with supporting performance.

[0054] Referring to Figure 3 Before the flexible substrate 13 is formed, a first metal layer 12 is formed on the side of the stripping layer 11 away from the substrate 10 (i.e., the side of the flexible substrate 13 close to the substrate 10) by using a one-time patterning process;

[0055] Then, step S103 is implemented. Referring to Figure 4 The flexible substrate 13 is formed, specifically including:

[0056] An initial film layer covering the first metal layer 12 is formed on the side of the stripping layer 11 away from the substrate 10;

[0057] The initial film layer is processed by a one-time patterning process to obtain a flexible substrate 13, the flexible substrate 13 has an opening 131 corresponding to the position of the to-be-formed barrier wall 14, and the flexible substrate 13 also has a first via hole 132 exposing the first metal layer 12.

[0058] In this embodiment, the first metal layer 12 and the second metal layer 15 can be a titanium (Ti) film layer or a titanium / aluminum / titanium (Ti / Al / Ti) composite film layer, or a composite film layer of one or more of Al, molybdenum (Mo), aluminum niobium alloy (AlNb), silver (Ag), and copper (Cu).

[0059] The initial film layer can be a polyimide (PI) film layer or a polyimide / silicon oxide / polyimide (PI / SiO / PI) composite film layer.

[0060] Referring to Figure 5 The second metal layer 15 is formed on the side of the flexible substrate 13 away from the substrate 10 by a one-time patterning process, and the second metal layer 15 is connected to the first metal layer 12 through the first via hole.

[0061] It can be understood that the patterning process in each embodiment of the present application includes the processes of coating photoresist, masking, exposure, development, etching, and stripping of remaining photoresist.

[0062] The flexible display module prepared by the preparation method provided in this embodiment can be used as a splicing unit of a splicing screen, and the sub-pixel units in the flexible display module are not arranged in a standard RGB arrangement, but can be arranged in a diamond arrangement (i.e., a diamond arrangement), a triangular arrangement, or a pearl arrangement, etc. Before forming the thin film transistor, the first metal layer 12 is formed on the side of the flexible substrate 13 close to the substrate 10, and the second metal layer 15 is formed on the side of the flexible substrate 13 away from the substrate 10, the first metal layer 12 serves as a bottom metal layer, and the second metal layer 15 serves as a transition layer and is connected to the gate of the thin film transistor of the subsequently formed thin film transistor layer 17, so that the gate of the thin film transistor can be powered through the first metal layer and the second metal layer.

[0063] Next, referring to Figure 6An insulating layer 16 is formed on the side of the second metal layer 15 facing away from the substrate 10. The insulating layer 16 has a second via hole exposing the second metal layer 15. A thin film transistor layer 17, a planar layer 18, an anode layer 19, and a pixel definition layer 20 are sequentially formed on the side of the insulating layer 16 facing away from the substrate 10. The planar layer 18 has a third via hole exposing the drain electrode of the thin film transistor. The pixel definition layer 20 has an opening 131 and a pixel opening 201 exposing the anode layer 19. The thin film transistor in each sub-pixel unit includes a gate, a source electrode, and a source / drain electrode. The gate of the thin film transistor in each sub-pixel unit is connected to the second metal layer 15 via the second via hole, and the drain electrode of the thin film transistor in each sub-pixel unit is connected to the anode layer 19 via the third via hole penetrating the planar layer 18.

[0064] The insulating layer 16 and the planar layer 18 may be silicon oxide (SiO) films, silicon oxynitride (SiON) films or silicon nitride (SiN) films; and the anode layer 19 may be an indium tin oxide (ITO) film.

[0065] Reference Figure 7 , forming the retaining wall 14, including: coating a negative photoresist, such as SU8 negative photoresist, SOC5004U negative photoresist or CFOC negative photoresist, on the side of the pixel defining layer 20 facing away from the substrate 10, exposing, developing and etching the negative photoresist to form the retaining wall 14 in the opening 131, and gradually narrowing the retaining wall 14 in the direction close to the substrate 10, and the surface of the retaining wall facing away from the substrate is higher than the surface of the subsequently formed thin film encapsulation layer 23 facing away from the substrate.

[0066] Reference Figure 8 , forming an organic light-emitting layer 21 and a common layer 22, including: forming the organic light-emitting layer 21 in the pixel opening 201 in the opening 131 of the pixel defining layer 20 exposing the anode layer 19, wherein the thickness of the organic light-emitting layer 21 in a direction perpendicular to the substrate 10 is greater than the thickness of the pixel defining layer 20 in a direction perpendicular to the substrate 10;

[0067] A common layer 22 is formed on the side of the organic light-emitting layer 21 facing away from the substrate 10 by an evaporation process, and the common layer 22 includes at least one of an electron transport layer and a cathode layer;

[0068] A thin film encapsulation layer 23 is formed on the side of the common layer 22 facing away from the substrate through coating and vapor deposition processes. The thin film encapsulation layer 23 can be a single thin film or an inorganic / organic / inorganic laminated film layer.

[0069] Since the surface of the retaining wall facing away from the substrate is higher than the surface of the thin film encapsulation layer 23 facing away from the substrate, and the retaining wall gradually narrows in the direction close to the substrate 10, the common layer and the thin film encapsulation layer 23 are automatically disconnected at the retaining wall;

[0070] Reference Figure 9The laser stripping process is used to heat the part where the retaining wall 14 is located, and the stripping layer 11 is stripped off, so that the substrate 10 is stripped off, thereby obtaining a flexible display module including the flexible substrate 13, the thin film transistor layer 17, the flat layer 18, the anode layer 19, the pixel defining layer 20, the organic light-emitting layer 21, the common layer 22, and the thin film encapsulation layer 23.

[0071] In this embodiment, after the pixel defining layer 20 is formed, a one-time patterning process is used to etch away edges of the insulating layer 16, the flat layer 18, and the pixel defining layer 20 close to the opening 131, the insulating layer 16, the flat layer 18, and the pixel defining layer 20 are orthographic projections in the thickness direction of the substrate 10 and fall within the orthographic projection of the flexible substrate 13 in the thickness direction of the substrate 10, and the insulating layer 16, the flat layer 18, and the pixel defining layer 20 expose the edge region 133 of the flexible substrate 13 close to the opening 131;

[0072] When the common layer is evaporated, the common layer 22 naturally breaks at the retaining wall, extends along the side of the insulating layer 16, the flat layer 18, and the pixel defining layer 20 to the side of the flexible substrate 13 away from the substrate 10, that is, the common layer 22 covers the edge region 133 of the flexible substrate 13 close to the opening 131, and plays a certain protective role for the insulating layer 16, the flat layer 18, and the pixel defining layer 20;

[0073] When the thin film encapsulation layer 23 is formed, the thin film encapsulation layer 23 naturally breaks at the retaining wall, and covers the upper side of the stripping layer 11, thereby forming a good protective effect on the flexible display module prepared by the preparation method.

[0074] The preparation method of the flexible display module provided in the above embodiment utilizes a backplane process (spin coating, photolithography, etching, etc.) to design a flexible substrate with an opening on a substrate, make a retaining wall in the opening, and obtain a flexible display module by stripping the substrate. Since the orthographic projection of the opening in the thickness direction of the substrate is zigzag, the edge of the orthographic projection of the corresponding flexible display module in the thickness direction of the flexible substrate is zigzag.

[0075] Based on the above preparation method, the embodiment of the present application further provides a flexible display module which can be used for seamless splicing to form a display device.

[0076] Reference Figure 10 The flexible display module provided in the embodiment includes a flexible substrate 13, and in a direction away from the flexible substrate, the flexible substrate is sequentially stacked with a thin film transistor layer 17, a flat layer 18, an anode layer 19, a pixel defining layer 20, an organic light-emitting layer 21, a common layer 22, and a thin film encapsulation layer 23. The pixel defining layer 20 has a pixel opening for exposing the anode layer, and the organic light-emitting layer 21 is arranged in the pixel opening.

[0077] The edge of the normal projection of the flexible display module in the thickness direction of the flexible substrate is jagged.

[0078] The sub-pixel units in the flexible display module are not in standard RGB arrangement, but can be in diamond arrangement (i.e., diamond arrangement), triangular arrangement or pearl arrangement, etc. Due to the jagged edge of the normal projection of the flexible display module in the thickness direction of the flexible substrate, problems such as large-area burning, notch burr, etc. are avoided, and the flexible display module as a splicing unit can be seamlessly spliced between adjacent flexible display modules.

[0079] Further, the first metal layer 12 is embedded on the side of the flexible substrate away from the thin film transistor layer;

[0080] The second metal layer 15 is provided on the side of the flexible substrate 13 close to the thin film transistor layer 17, and the second metal layer is connected with the first metal layer through the first via hole penetrating the flexible substrate;

[0081] The second metal layer 15 is provided with an insulating layer 16 on the side away from the flexible substrate 13, and the gate of the thin film transistor in the thin film transistor layer 17 is connected with the second metal layer through the second via hole penetrating the insulating layer 16.

[0082] Due to the fact that the sub-pixel units in the flexible display module are not in standard RGB arrangement, the first metal layer connects external electrical signals, and the second metal layer as a transition layer is connected with the gate of the thin film transistor, so that the external electrical signals are transmitted to the gate of the thin film transistor through the first metal layer and the second metal layer.

[0083] The embodiment of the present application also provides a display device comprising at least two flexible display modules as described above, and the adjacent two flexible display modules are seamlessly spliced.

[0084] Reference Figure 11 The flexible display module prepared by the preparation method provided by the embodiment of the present application comprises sub-pixel units in diamond arrangement, the edge 24 of which in the normal projection in the thickness direction of the flexible substrate is jagged, which effectively overcomes the problems of large-area burning, notch burr, and wide cutting path of the edge of the flexible display module cut by the laser process in the prior art. The display device can be seamlessly spliced by a plurality of flexible display modules as described above, and the display device can adopt HDR (High-Dynamic Range, high dynamic range image) arrangement, thereby effectively improving the display quality.

[0085] Of course, the sub-pixel units in the flexible display module can also be in other non-standard RGB arrangement, such as triangular arrangement or pearl arrangement, and the display device can be seamlessly spliced by a plurality of flexible display modules.

[0086] In the description of the application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the application and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0087] The application uses first, second, etc. to describe various information, but these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, the first information can also be referred to as the second information without departing from the scope of the application, and similarly, the second information can also be referred to as the first information.

[0088] The above description is only the preferred embodiment of the application and the explanation of the applied technical principles. Those skilled in the art should understand that the scope of the application involved in the application is not limited to the technical solutions formed by the specific combination of the above technical features, and should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept. For example, the above features are replaced with the technical features disclosed in the application (but not limited to) having similar functions to form technical solutions.

Claims

1. A method for preparing a flexible display module, characterized in that: The flexible display module includes: a flexible substrate, wherein a thin film transistor layer, a planar layer, an anode layer, a pixel defining layer, an organic light emitting layer, a common layer, and a thin film encapsulation layer are sequentially stacked on one side of the flexible substrate in a direction away from the flexible substrate, the pixel defining layer having a pixel opening for exposing the anode layer, and the organic light emitting layer is disposed in the pixel opening; The edge of the orthographic projection of the flexible display module in the thickness direction of the flexible substrate is serrated; A first metal layer is embedded in the side of the flexible substrate facing away from the thin film transistor layer; A second metal layer is provided on a side of the flexible substrate close to the thin film transistor layer, and the second metal layer is connected to the first metal layer through a first via hole penetrating the flexible substrate; An insulating layer is provided on a side of the second metal layer facing away from the flexible substrate, and a gate of the thin film transistor in the thin film transistor layer is connected to the second metal layer via a second via hole penetrating the insulating layer; The method for preparing the flexible display module includes: forming a flexible base on one side of the substrate, the flexible base having an opening penetrating along the thickness direction of the substrate, wherein the orthographic projection of the opening in the thickness direction of the substrate is sawtooth-shaped; forming a thin film transistor layer, a planarization layer, an anode layer and a pixel definition layer on a side of the flexible substrate facing away from the base plate; forming a retaining wall within the opening; An organic light-emitting layer and a common layer are sequentially stacked on a side of the pixel defining layer facing away from the substrate, wherein the organic light-emitting layer is connected to the anode layer through a pixel opening of the pixel defining layer; A thin film encapsulation layer is used for encapsulation, wherein a surface of the thin film encapsulation layer facing away from the substrate is lower than a surface of the retaining wall facing away from the substrate; peeling off the substrate to form a flexible display module; Before forming the flexible substrate, the preparation method further includes: forming a first metal layer on a side of the flexible substrate close to the substrate, the flexible substrate having a first via hole exposing the first metal layer; After forming the flexible substrate, the preparation method further includes: forming a second metal layer on a side of the flexible substrate facing away from the base plate, wherein the second metal layer is connected to the first metal layer through the first via hole; An insulating layer is formed on a side of the second metal layer facing away from the substrate. The insulating layer has a second via hole exposing the second metal layer. The gate of the thin film transistor layer is connected to the second metal layer through the second via hole.

2. The method for preparing a flexible display module according to claim 1, wherein: Forming the flexible substrate includes: forming an initial film layer on one side of the substrate; The initial film layer is processed by a single patterning process to obtain a flexible substrate having openings corresponding to positions of retaining walls to be formed.

3. The method for preparing a flexible display module according to claim 1, wherein: Forming the retaining wall comprises: A negative photoresist is coated on the side of the pixel defining layer facing away from the substrate, and the negative photoresist is exposed, developed and etched to form the retaining wall in the opening. The retaining wall gradually narrows in a direction close to the substrate.

4. The method for preparing a flexible display module according to claim 1, wherein: The orthographic projections of the insulating layer, the planar layer, and the pixel defining layer in the thickness direction of the substrate fall within the orthographic projection of the flexible base in the thickness direction of the substrate; The common layer extends along the side surfaces of the insulating layer, the planar layer, and the pixel defining layer to a side of the flexible base facing away from the substrate.

5. The method for preparing a flexible display module according to claim 1, wherein: Forming the organic light-emitting layer includes: An organic light emitting layer is formed in the pixel opening where the anode layer is exposed in the pixel defining layer. The thickness of the organic light emitting layer in a direction perpendicular to the thickness of the substrate is greater than the thickness of the pixel defining layer in the direction perpendicular to the thickness of the substrate.

6. The method for preparing a flexible display module according to any one of claims 1 to 5, characterized in that: Before forming the flexible substrate, the preparation method further includes: forming a peeling layer on a side of the substrate close to the flexible substrate; The peeling off the substrate includes peeling off the substrate by peeling off the peeling layer.

7. A display device, characterized in that: The flexible display module comprises at least two flexible display modules prepared according to the method for preparing a flexible display module according to any one of claims 1 to 6, wherein two adjacent flexible display modules are seamlessly spliced.

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