Light emitting unit

Abstract

A light-emitting unit comprises: a light-emitting diode, a light conversion layer and a color filter layer. The light conversion layer is arranged on the light-emitting diode. The color filter layer covers the side wall of the light conversion layer.

Description

Technical Field

[0001] The invention relates to a light-emitting unit, and in particular to a light-emitting unit with a side wall of a color filter layer covering a light conversion layer. Background Art

[0002] Light-emitting diodes (LEDs) are widely used in various electronic devices (such as display devices). The existing light-emitting diodes of light-emitting units combined with light conversion structures and / or light filtering structures may cause light leakage from the sides of the light-emitting diodes, reduce the color purity of the light emitted by the light-emitting units, and affect the display quality. Therefore, how to solve the above problems has become an important issue. Summary of the invention

[0003] Some embodiments of the present invention provide a light-emitting unit, comprising a light-emitting diode, a light-conversion layer and a color filter layer. The light-conversion layer is disposed on the light-emitting diode. The color filter layer covers the side wall of the light-conversion layer.

[0004] In an embodiment of the present invention, the light-emitting unit further includes a protection layer located between the color filter layer and the light conversion layer.

[0005] In an embodiment of the present invention, the light emitting unit further includes a protection layer located outside the color filter layer.

[0006] In one embodiment of the present invention, the light conversion layer covers the sidewall of the light emitting diode.

[0007] In one embodiment of the present invention, the color filter layer covers the sidewall of the light emitting diode.

[0008] In an embodiment of the present invention, the light emitting unit further includes a light shielding layer covering the side wall of the light emitting diode.

[0009] In an embodiment of the present invention, the light emitting unit further includes a reflective layer surrounding the side wall of the light conversion layer.

[0010] In one embodiment of the present invention, the width of the light emitting diode is greater than the width of the light conversion layer.

[0011] In one embodiment of the present invention, the width of the color filter layer is greater than the width of the light conversion layer.

[0012] In an embodiment of the present invention, the light emitting unit further includes a reflective layer disposed on the light emitting diode and contacting the upper surface of the light emitting diode.

[0013] In order to make the above and other purposes, features and advantages of the present invention more obvious and understandable, some embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The various aspects of the present invention can be fully understood from the following detailed description in conjunction with the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, various features are not drawn to scale and are only used for illustration. In fact, the size of the components may be arbitrarily enlarged or reduced to clearly show the features of the present invention.

[0015] Figure 1 A cross-sectional schematic diagram showing a light emitting unit according to some embodiments of the present invention.

[0016] Figure 2 Schematic cross-sectional views of light-emitting units according to other embodiments of the present invention are shown.

[0017] Figure 3 Schematic cross-sectional views of a plurality of light-emitting units according to other embodiments of the present invention are shown.

[0018] Figure 4 Schematic cross-sectional views of light-emitting units according to other embodiments of the present invention are shown.

[0019] Figure 5 Schematic cross-sectional views of light-emitting units according to other embodiments of the present invention are shown.

[0020] Figure 6 Schematic cross-sectional views of light-emitting units according to other embodiments of the present invention are shown.

[0021] Figure 7 Schematic top views of a plurality of light emitting units according to other embodiments of the present invention are shown.

[0022] Figure 8 Display edge Figure 7 A schematic cross-sectional view of line AA is shown.

[0023] Fig. 9 Schematic cross-sectional views of a plurality of light-emitting units according to other embodiments of the present invention are shown.

[0024] Fig.10 Schematic cross-sectional views of a plurality of light-emitting units according to other embodiments of the present invention are shown.

[0025] Fig.11 Schematic top views of a plurality of light emitting units according to other embodiments of the present invention are shown.

[0026] Explanation of symbols:

[0027] 100A, 100B, 100C, 100D, 100E,

[0028] 100F, 100G, 100H, 100I, 100J: Light-emitting unit

[0029] 110: Light Emitting Diode

[0030] 112: first semiconductor layer

[0031] 114: Second semiconductor layer

[0032] 116: Insulation layer

[0033] 120: Light conversion layer

[0034] 121, 131, 141: side wall

[0035] 122, 132, 142: upper surface

[0036] 143: Bottom surface

[0037] 130: Color filter layer

[0038] 140: Protective layer

[0039] 145: Protective layer

[0040] 150, 152: Reflection layer

[0041] 155: Notch

[0042] 160: Conductive pad

[0043] 170: Light shielding layer

[0044] AA:Line

[0045] CC: Cutting Line

[0046] S1: Sidewall

[0047] W1, W2, W3: Width

[0048] Z1, Z2: thickness DETAILED DESCRIPTION

[0049] The present invention can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that in order to make it easier for readers to understand and the drawings are concise, the multiple drawings in the present invention only depict a portion of the light-emitting unit, and the specific components in the drawings are not drawn according to the actual scale. In addition, the number and size of each component in the figure are only for illustration and are not intended to limit the scope of the present invention. In addition, similar and / or corresponding reference numerals may be used in different embodiments, which is only for the purpose of simply and clearly describing some embodiments, and does not represent any correlation between the different embodiments and / or structures discussed.

[0050] Certain words are used throughout the specification and the claims that follow to refer to specific components. It should be understood by those skilled in the art that electronic equipment manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but different names. In the following specification and claims, the words "include", "contain", "have" and the like are open-ended words, and therefore should be interpreted as "including but not limited to..." Therefore, when the terms "include", "contain" and / or "have" are used in the description of the present invention, they specify the existence of corresponding features, areas, steps, operations and / or components, but do not exclude the existence of one or more corresponding features, areas, steps, operations and / or components.

[0051] In addition, relative terms such as "below" or "bottom" and "above" or "top" may be used in the embodiments to describe the relative relationship of one component of the diagram to another component. It is understood that if the device of the diagram is turned upside down, the component described on the "below" side will become the component on the "above" side.

[0052] When a corresponding component (such as a film layer or region) is referred to as being "on another component", it can be directly on the other component, or other components can exist between the two. On the other hand, when a component is referred to as being "directly on another component", there is no component between the two. In addition, when a component is referred to as being "on another component", the two have a top-down relationship in the top view direction, and the component can be above or below the other component, and this top-down relationship depends on the orientation of the device.

[0053] The terms "approximately," "equal," "equal" or "same," "substantially" or "approximately" are generally interpreted as within 20% of a given value or range, or within 10%, 5%, 3%, 2%, 1% or 0.5% of a given value or range.

[0054] It is understood that although the terms "first", "second", etc. may be used herein to describe various components, layers and / or parts, these components, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, layers and / or parts. Therefore, a first component, layer and / or part discussed below may be referred to as a second component, layer and / or part without departing from the teachings of some embodiments of the present invention. In addition, for the sake of brevity, the terms "first", "second", etc. may not be used in the specification to distinguish different components. Without violating the scope defined by the attached claims, the first component and / or second component recorded in the claims may be interpreted as any component that meets the description in the specification.

[0055] In the present invention, the thickness, length and width can be measured by an optical microscope, and the thickness can be measured by a cross-sectional image in an electron microscope, but it is not limited to this. In addition, any two values ​​or directions used for comparison may have a certain error. If the first value is equal to the second value, it implies that there may be an error of about 10% between the first value and the second value; if the first direction is perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

[0056] It should be noted that the technical solutions provided in the following different embodiments can be replaced, combined or mixed with each other to form another embodiment without violating the spirit of the present invention.

[0057] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present invention, and should not be interpreted in an idealized or overly formal manner unless specifically defined herein.

[0058] Figure 1 A cross-sectional schematic diagram of a light emitting unit 100A according to some embodiments of the present invention is shown. Figure 1As shown, a light-emitting unit 100A includes a light-emitting diode 110, a light conversion layer 120 and a color filter layer 130. The light conversion layer 120 is disposed on the light-emitting diode 110, and the color filter layer 130 covers the sidewall 121 of the light conversion layer 120. The light-emitting diode 110 (LED) may include, for example, a sub-millimeter light-emitting diode (mini LED), a micro-light-emitting diode (microLED) or a quantum dot light-emitting diode (quantum dot; QD, which may be, for example, QLED, QDLED), fluorescence, phosphor or other suitable materials, and the materials may be arranged and combined in any way, but are not limited thereto. In other embodiments, the light-emitting diode 110 may also include an organic light-emitting diode (OLED). In this embodiment, the light-emitting diode 110 may include a semiconductor layer 112, a semiconductor layer 114 and an insulating layer 116, but are not limited thereto. In this embodiment, the semiconductor layer 112 and / or the semiconductor layer 114 may include gallium nitride (GaN) and other suitable materials, but are not limited thereto. In some embodiments, the semiconductor layer 112 and the semiconductor layer 114 may include different types of semiconductor materials. For example, the semiconductor layer 112 may include a p-type semiconductor layer, and the semiconductor layer 114 may include an n-type semiconductor layer, but not limited thereto. In other embodiments, the semiconductor layer 112 may include an n-type semiconductor layer, and the semiconductor layer 114 may include a p-type semiconductor layer. In some embodiments, the light emitting diode 110 may emit blue light, but not limited thereto. In other embodiments, the light emitting diode 110 may emit UV light or other suitable wavelengths of light. In some embodiments, the insulating layer 116 may be disposed or formed on the sidewalls of the semiconductor layer 112 and / or the semiconductor layer 114 to reduce the probability of the semiconductor layer 112 and / or the semiconductor layer 114 being damaged or being invaded by water and oxygen and thus affecting the performance, but not limited thereto. The insulating layer 116 may electrically insulate the light emitting diode 110 from other conductive layers (such as the reflective layer 150 to be mentioned later), and reduce the probability of a short circuit between other conductive layers (such as the reflective layer 150) and the light emitting diode 110 and thus affecting the performance of the light emitting diode 110.

[0059] In some embodiments, a light conversion layer 120 may be disposed on the light emitting diode 110 to convert the light (e.g., blue light or UV light) emitted by the light emitting diode 110 into green light, red light, or any other color light. For example, the material of the light conversion layer 120 may include quantum dots (QD), fluorescent materials, or any other light conversion materials, or a combination of the foregoing. It should be understood that in some embodiments, the light conversion layer 120 may be replaced by other transparent materials (e.g., transparent insulating materials), but is not limited thereto. In addition, a color filter layer 130 may be selectively disposed on the light conversion layer 120, and the color filter layer 130 may be used to filter part of the color light that is not converted by the light conversion layer 120, reduce the probability of such unconverted color light being emitted, and improve the color purity of the light emitted by the light emitting unit. In some embodiments, the color filter layer 130 may cover the sidewall 121 of the light conversion layer 120. For example, the color filter layer 130 may cover the upper surface 122 and / or the side wall 121 of the light conversion layer 120, and the side wall 121 is connected to the upper surface 122. When the color filter layer 130 covers the side wall 121 of the light conversion layer 120, the unconverted color light emitted from the side wall 121 of the light conversion layer 120 and observed by the user can be reduced, so as to improve the color purity of the light and improve the display quality of the light emitting unit 100A.

[0060] In some embodiments, the light conversion layer 120 is, for example, in contact with the light-emitting diode 110, but is not limited thereto. In some embodiments, the color filter layer 130 is, for example, in contact with the light conversion layer 120, but is not limited thereto. In some embodiments, the light conversion layer 120 is, for example, disposed between the color filter layer 130 and the light-emitting diode 110. In some embodiments, the width W1 of the light-emitting diode 110 may be greater than the width W2 of the light conversion layer 120, but is not limited thereto. In other words, in the top-view direction Z, part of the light-emitting diode 110 may overlap with the light conversion layer 120, and another part of the light-emitting diode 110 may not overlap with the light conversion layer 120. In some embodiments, the width W3 of the color filter layer 130 may be greater than the width W2 of the light conversion layer 120 and / or the width W1 of the light-emitting diode 110, but is not limited thereto. In other embodiments, the width W1 may be substantially equal to the width W2 and / or the width W3, but is not limited thereto. It should be noted that the width W1 , the width W2 and the width W3 are, for example, respectively the maximum width of the layer (or component) measured in the X-axis direction, and the X-axis direction is, for example, substantially perpendicular to the top-view direction Z.

[0061] In some embodiments, a reflective layer 150 may be selectively disposed on the side wall S1 of the light emitting diode 110. Since the light emitted by the light emitting diode 110 is emitted in all directions, the reflective layer 150 may be disposed on the side wall S1 of the light emitting diode 110 to reflect the light emitted from the side wall S1 of the light emitting diode 110 to the light conversion layer 120, thereby improving the light conversion efficiency or reducing the probability of unconverted color light being emitted through the side wall S1 of the light emitting diode 110, so as to reduce the impact on the color purity of the light emitted by the light emitting unit. In some embodiments, the material of the reflective layer 150 may include metal, alloy, or other non-metallic material with a reflective effect (such as white paint or white ink) or a combination thereof, but is not limited thereto. In some embodiments, an insulating layer 116 is disposed between the side wall S1 of the light emitting diode 110 and the reflective layer 150. In some embodiments, the insulating layer 116 may be located between the semiconductor layer 112 (and / or the semiconductor layer 114 ) and the reflective layer 150 to reduce the possibility of the semiconductor layer 112 (and / or the semiconductor layer 114 ) and the reflective layer 150 contacting and forming a short circuit, thereby damaging the light-emitting diode 110 .

[0062] In some embodiments, the light emitting unit 100A may include a plurality of conductive pads 160, and the light emitting diode 110 may be electrically connected to the driving circuit through the conductive pads 160 to transmit signals to control the operation of the light emitting diode 110. In some embodiments, the electronic device may have a plurality of light emitting units 100A, and through the configuration of the light emitting diodes 110, the light conversion layer 120 and / or the color filter layer 130 in these light emitting units 100A, different light emitting units 100A may emit light of different colors. Figure 2 The cross-sectional schematic diagram of the light emitting unit 100B according to some other embodiments of the present invention is shown. It should be noted that the light emitting unit 100B shown in this embodiment may include Figure 1 The light emitting unit 100B in this embodiment has the same or similar parts as the light emitting unit 100A shown in FIG. These parts will be represented by the same or similar reference numerals and will not be described in detail below. For example, the light emitting unit 100B includes a light emitting diode 110, a light conversion layer 120 and a color filter layer 130. Figure 1The light emitting unit 100A shown is different in that the light emitting unit further includes a protective layer 140, and the protective layer 140 is located between the light conversion layer 120 and the color filter layer 130. For example, the protective layer 140 can cover the sidewalls 121 and the upper surface 122 of the light conversion layer 120. In some embodiments, the light emitting unit further includes a protective layer 145 located on the outer side of the color filter layer 130 (for example, including the sidewalls 131 and / or the upper surface 132). In some embodiments, the protective layer 140 and / or the protective layer 145, for example, include a transparent material, an insulating material, or a combination thereof. For example, the material of the protective layer 140 and / or the protective layer 145 includes silicon oxide, silicon nitride, any other suitable material, or a combination thereof. The materials of the protective layer 140 and / or the protective layer 145 can be the same or different. The protective layer 140 and / or the protective layer 145 can include a single layer or a composite layer. Through the provision of the protective layer 140, the probability of the light conversion layer 120 being damaged or being invaded by water and oxygen can be reduced. In addition, through the provision of the protective layer 145, the probability of the color filter layer 130 being damaged or being invaded by water and oxygen can also be reduced. In some embodiments, the thickness Z1 of the protective layer 140 can be the same as or different from the thickness Z2 of the protective layer 145. The thickness Z1 is, for example, the maximum thickness of the protective layer 140 located on the upper surface 122 of the light conversion layer 120 in the top-view direction Z, and the thickness Z2 is, for example, the maximum thickness of the protective layer 145 located on the upper surface 132 of the color filter layer 130. It should be understood that although the protective layer 140 and the protective layer 145 are depicted at the same time in this embodiment, those skilled in the art can omit either the protective layer 140 or the protective layer 145 as needed.

[0063] Figure 3 The cross-sectional schematic diagrams of a plurality of light emitting units 100C according to some other embodiments of the present invention are shown. It should be noted that the light emitting unit 100C shown in this embodiment may include Figure 2The same or similar parts of the light-emitting unit 100B shown. The multiple parts will be represented by the same or similar reference numerals and will not be repeated below. For example, multiple light-emitting units 100C may respectively include light-emitting diodes 110 and corresponding light conversion layers 120 and / or color filter layers 130. These light-emitting units 100C may respectively include protective layers 140, protective layers 145 and / or reflective layers 150, but are not limited to this. In some embodiments, the protective layers 140, protective layers 145 and / or reflective layers 150 of these light-emitting units 100C may, for example, be connected to each other, but are not limited to this. In other words, the protective layers 140, protective layers 145 and / or reflective layers 150 of these light-emitting units 100C may, for example, continuously extend to different light-emitting diodes 110, but are not limited to this. The above design can simplify the production of the protective layers 140, protective layers 145 and / or reflective layers 150. In other embodiments (not shown), the protective layer 140, the protective layer 145 and / or the reflective layer 150 of these light-emitting units 100C may be separated from each other, but the present invention is not limited thereto. In other embodiments (not shown), the protective layer 140, the protective layer 145 and / or the reflective layer 150 of these light-emitting units 100C may be partially separated and partially connected.

[0064] Figure 4 The cross-sectional schematic diagram of the light emitting unit 100D according to some other embodiments of the present invention is shown. It should be noted that the light emitting unit 100D shown in this embodiment may include Figure 1 The light emitting unit 100D includes the same or similar parts as the light emitting unit 100A shown in the figure. The multiple parts will be represented by the same or similar reference numerals and will not be repeated below. For example, the light emitting unit 100D includes a light emitting diode 110, a light conversion layer 120 and a color filter layer 130. The light emitting unit 100D in this embodiment is the same as Figure 1 The light emitting unit 100A shown is different in that the reflective layer 150 disposed on the side wall S1 of the light emitting diode 110 is replaced with a light shielding layer 170, but the present invention is not limited thereto. In other words, the light emitting unit 100D further includes a light shielding layer 170, which covers the side wall S1 of the light emitting diode 110. For example, the light shielding layer 170 may include black ink, black paint, black photoresist, other light shielding materials, or a combination thereof, but the present invention is not limited thereto. By disposing the light shielding layer 170, the light interference (cross-talk) between different light emitting diodes 110 can be reduced.

[0065] Figure 5 The cross-sectional schematic diagram of the light emitting unit 100E according to some other embodiments of the present invention is shown. It should be noted that the light emitting unit 100E shown in this embodiment may include Figure 1The light emitting unit 100E in this embodiment has the same or similar parts as the light emitting unit 100A shown in FIG. These parts are indicated by the same or similar reference numerals and will not be described in detail below. For example, the light emitting unit 100E includes a light emitting diode 110, a light conversion layer 120, and a color filter layer 130. Figure 1 The light emitting unit 100A shown is different in that the color filter layer 130 of the light emitting unit 100E can be disposed on the side wall S1 of the light emitting diode 110, and the color filter layer 130 can cover the side wall S1 of the light emitting diode 110. In other words, the light emitting unit 100E replaces the reflective layer 150 of the light emitting unit 100A with the color filter layer 130, for example. In some embodiments, the color filter layer 130 on the light conversion layer 120 and the color filter layer 130 on the side wall S1 of the light emitting diode 110 can be selectively formed through the same or different process steps. In some embodiments, the color filter layer 130 on the light conversion layer 120 and the color filter layer 130 on the side wall S1 of the light emitting diode 110 can selectively use the same or different materials. By disposing the color filter layer 130 on the sidewall S1 of the LED 110 , the probability of the unconverted colored light (eg, blue light) emitted through the sidewall S1 of the LED 110 being emitted can be reduced, thereby improving the color purity of the LED 110 .

[0066] Figure 6 The cross-sectional schematic diagram of the light emitting unit 100F according to some other embodiments of the present invention is shown. It should be noted that the light emitting unit 100F shown in this embodiment may include Figure 2The same or similar parts as those of the light emitting unit 100B shown in the figure. These parts will be represented by the same or similar reference numerals and will not be repeated below. For example, the light emitting unit 100F includes a light emitting diode 110, a light conversion layer 120, a color filter layer 130, a protective layer 140 and a protective layer 145. In some embodiments, the light conversion layer 120 (and / or the color filter layer 130) covers the side wall S1 of the light emitting diode 110. In the present embodiment, the light conversion layer 120, the color filter layer 130, the protective layer 140 and / or the protective layer 145 may selectively extend to or cover the side wall S1 of the light emitting diode 110. In some embodiments (not shown), the protective layer 140 and / or the protective layer 145 may have curved edges. For example (not shown), the corners of the upper surface 142 and / or the side wall 141 of the protective layer 140 may have curved edges, but are not limited thereto. Alternatively, the bottom surface 143 of the protective layer 140 and / or the corners of the sidewall 141 may have curved edges, but are not limited thereto. In other embodiments (not shown), the top surface (not shown) and / or the corners of the sidewall (not shown) of the protective layer 145 may have curved edges. Alternatively, the bottom surface (not shown) and / or the corners of the sidewall (not shown) of the protective layer 145 may have curved edges. In other embodiments, those skilled in the art may omit either the protective layer 140 or the protective layer 145 as desired. In some embodiments, the protective layer 140 may be in contact with or not in contact with the protective layer 145. In some embodiments, the protective layer 140 and / or the protective layer 145 may be in contact with or not in contact with the insulating layer 116, for example.

[0067] Figure 7 A schematic top view of a light emitting unit 100G according to some other embodiments of the present invention is shown. Figure 8 Display edge Figure 7 It should be noted that the light emitting unit 100G shown in this embodiment may include Figure 2 The light emitting unit 100G includes the same or similar parts as the light emitting unit 100B shown in the figure. The multiple parts will be represented by the same or similar reference numerals and will not be repeated below. For example, the multiple light emitting units 100G respectively include a light emitting diode 110 and a corresponding light conversion layer 120 and / or a color filter layer 130. In addition, the light emitting unit 100G also includes a protective layer 145 and a reflective layer 150. Figure 8As shown, the light-emitting unit 100G may further include a reflective layer 152, and the reflective layer 152 may be disposed on the light-emitting diode 110. In some embodiments, the reflective layer 152 may selectively contact the upper surface 111 of the light-emitting diode 110. In some embodiments, the reflective layer 152 may cover the sidewall 121 of the light-conversion layer 120, and further extend to a portion of the upper surface 122 of the light-conversion layer 120, but is not limited thereto. In some embodiments, the reflective layer 152 may contact the reflective layer 150. In some embodiments, the reflective layer 152 may partially overlap the light-conversion layer 120 in the top-view direction Z. In some embodiments, a portion of the reflective layer 152 may be located between the light-conversion layer 120 and the color filter layer 130. In some embodiments, the reflective layer 152 may be disposed continuously or discontinuously on different light-emitting diodes 110. By disposing the reflective layer 152, light that is not converted by the light-conversion layer 120 may be reflected to the light-conversion layer 120, thereby improving the light conversion efficiency. In addition, the reflective layer 152 can be disposed to position different light emitting diodes 110 during the manufacturing process, thereby reducing the probability of the light emitting diodes 110 being offset. In some embodiments, the protective layer 145 can be disposed on the color filter layer 130 and / or the reflective layer 152. In some embodiments, the protective layer 145 can extend to the sidewall 131 of the color filter layer 130 and / or a portion of the reflective layer 152.

[0068] refer to Figure 7 and Figure 8 In some embodiments, the light emitting unit 100G further includes a reflective layer 152. The reflective layer 152 may surround the sidewall 121 of the light conversion layer 120 (eg, Figure 8 In some embodiments, the reflective layer 152 may have a notch 155, and the notch 155 may be a thinner region in the reflective layer 152. Figure 7 In the top view direction Z, the notch 155 may be located between two adjacent light emitting diodes 110, but is not limited thereto. Figure 7 , in the top view direction Z, the shapes of different notches 155 can be the same or different. In some embodiments, by forming notches 155 on the reflective layer 152, it is convenient to separate different light-emitting units 100G (and / or 110 light-emitting diodes 110) later. In some embodiments, in the top view direction Z, the reflective layer 152 can be, for example, in a grid shape, but is not limited thereto. In other embodiments (not shown), Figure 7 The notch 155 may be replaced by an opening (penetrating the reflective layer 152 ) to facilitate the subsequent separation of different light emitting units 100G (and / or light emitting diodes 110 ), but the present invention is not limited thereto.

[0069] Fig. 9The cross-sectional schematic diagrams of the light emitting unit 100H according to some other embodiments of the present invention are shown. It should be noted that the light emitting unit 100H shown in this embodiment may include Figure 8 The same or similar parts of the light-emitting unit 100G shown. These parts will be represented by the same or similar reference numerals and will not be repeated below. For example, the light-emitting unit 100H includes a light-emitting diode 110 and a corresponding light conversion layer 120 and a color filter layer 130. In addition, the light-emitting unit 100H includes a reflective layer 150 and a reflective layer 152. In some embodiments, the protective layer 140 may be disposed between the light conversion layer 120 and the color filter layer 130. In some embodiments, the sidewall 141 of the protective layer 140, the sidewall 121 of the light conversion layer 120 and / or the sidewall 131 of the color filter layer 130 may be roughly aligned, but are not limited to this. In some embodiments, in the top-down direction Z, the areas of the protective layer 140, the light conversion layer 120 and / or the color filter layer 130 may be selectively the same or different, but are not limited to this. In some embodiments, in the X-axis direction, the width of the protective layer 140 and the width of the light conversion layer 120 (not shown, refer to Figure 1 The width W2) and / or the width of the color filter layer 130 (not shown, refer to Figure 1 The width W3) can be the same or different, but is not limited thereto. The width W3) can be, for example, the maximum width of the layer in the X-axis direction. In some embodiments, the top of the protective layer 140 and the top of the reflective layer 152 can be, for example, substantially aligned, but is not limited thereto. In some embodiments (not shown), the top of the protective layer 140 can protrude from the top of the reflective layer 152.

[0070] Fig.10 The cross-sectional schematic diagrams of the light emitting unit 100I according to some other embodiments of the present invention are shown. It should be noted that the light emitting unit 100I shown in this embodiment may include Fig. 9 The same or similar parts of the light-emitting unit 100H shown in the figure. These parts will be represented by the same or similar reference numerals and will not be repeated below. For example, the light-emitting unit 100I includes a light-emitting diode 110 and a corresponding light conversion layer 120 and a color filter layer 130. In addition, the light-emitting unit 100I includes a protective layer 140, a reflective layer 150 and / or a reflective layer 152. In the present embodiment, the color filter layer 130 may extend onto a portion of the reflective layer 152. In some embodiments, from the top view direction Z, the color filter layer 130 may at least partially overlap with the reflective layer 152.

[0071] Fig.11 Schematic diagrams of top views of light emitting units 100J according to other embodiments of the present invention are shown. It should be noted that the light emitting unit 100J shown in this embodiment may include Fig. 9The same or similar parts of the light emitting unit 100H shown in the figure are represented by the same or similar reference numerals and will not be repeated below. For example, the light emitting unit 100J includes a light emitting diode 110 and a corresponding light conversion layer 120 and a color filter layer 130. In addition, the light emitting unit 100J includes a protective layer 140, a reflective layer 150 and / or a reflective layer 152. In some embodiments, the protective layer 140 is disposed on the light conversion layer 120 and is located between the light conversion layer 120 and the color filter layer 130. Fig.11 As shown, the protective layer 140 may, for example, extend continuously to different light-emitting diodes 110, but is not limited thereto. In some embodiments, the reflective layer 152 is disposed on the protective layer 140, and the color filter layer 130 is disposed on the reflective layer 152 and the protective layer 140. In some embodiments, the protective layer 140 may be located between the reflective layer 152 and the reflective layer 150. In some embodiments, the protective layer 140 may contact a portion of the light-emitting diodes 110, and the protective layer 140 may, for example, be continuously disposed on different light-emitting diodes 110.

[0072] In summary, the embodiments of the present invention provide a light-emitting unit having a color filter layer disposed on the side wall of the light conversion layer. This improves the color purity of the light emitted by the light-emitting unit to improve the display quality. In addition, the light-emitting unit may have a protective layer to reduce the probability of water and oxygen invading the light-emitting unit and improve the reliability or performance of the light-emitting unit. In addition, a reflective layer, a light-shielding layer and / or a color filter layer may be disposed on the side wall of the light-emitting diode to improve the color purity of the light emitted by the light-emitting unit.

[0073] Although the embodiments of the present invention and their advantages have been disclosed as above, it should be understood that any person skilled in the art may make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any person skilled in the art can understand from the disclosure of the present invention that the processes, machines, manufacturing, material compositions, devices, methods and steps currently or developed in the future can be used according to the present invention as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of the present invention includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps, and the features between the embodiments can be arbitrarily mixed and matched for use as long as they do not violate the spirit of the invention or conflict with each other. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present invention also includes the combination of each claim and embodiment.

Claims

1. A light emitting unit, comprising: a light emitting diode; A light conversion layer is disposed on the light emitting diode; a color filter layer covering the sidewall of the light conversion layer; a first reflective layer disposed on the sidewall of the light emitting diode; and A second reflection layer is disposed on the first reflection layer and covers the side wall of the light conversion layer and extends to a portion of the upper surface of the light conversion layer. 2 . The light-emitting unit as claimed in claim 1 , further comprising a protective layer located between the color filter layer and the light conversion layer. 3 . The light-emitting unit as claimed in claim 1 , further comprising a protection layer located outside the color filter layer.

4. The light emitting unit according to claim 1, characterized in that: The light conversion layer covers the side wall of the light emitting diode.

5. The light emitting unit according to claim 1, characterized in that: The color filter layer covers the side wall of the light emitting diode. The light-emitting unit as claimed in claim 1 , further comprising a light-shielding layer covering the side wall of the light-emitting diode.

7. The light emitting unit according to claim 1, characterized in that: The width of the light emitting diode is greater than the width of the light conversion layer.

8. The light emitting unit according to claim 1, characterized in that: The width of the color filter layer is greater than the width of the light conversion layer.

9. The light emitting unit according to claim 1, characterized in that: The second reflective layer is disposed on the light emitting diode and contacts the upper surface of the light emitting diode.

Images