Light emitting device, method for manufacturing the same, planar light source, liquid crystal display device

Abstract

The objective of this invention is to provide a method for manufacturing a light-emitting device with less uneven light distribution color. The method includes the following steps: preparing a first component having a base, a plurality of phosphor frames located on the base, and a light-transmitting member disposed between adjacent phosphor frames; arranging a light-emitting element having a light-emitting surface and an electrode forming surface opposite to the light-emitting surface inside the phosphor frames with the light-emitting surface facing the base; and cutting the light-transmitting member.

Description

Technical Field

[0001] This disclosure relates to light-emitting devices and their manufacturing methods, planar light sources, and liquid crystal display devices. Background Technology

[0002] Light-emitting devices incorporating phosphors are known. Such devices are manufactured, for example, by a method comprising the steps of: a phosphor mask preparation step, in which a phosphor mask to which a phosphor mask is attached is prepared at a spacing equal to the arrangement spacing of the circuit boards of a composite substrate; a flip-chip mounting step, in which multiple semiconductor light-emitting elements are flip-chip mounted on the composite substrate; an overlap step, in which the composite substrate with the semiconductor light-emitting elements mounted is overlapped with the phosphor mask; and a monolithic step, in which the composite substrate, together with the phosphor mask, is cut to obtain the semiconductor light-emitting device. In such light-emitting devices, uneven light distribution color sometimes occurs, and therefore it is desirable to improve this unevenness.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2013-118210 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] The purpose of this disclosure is to provide a method for manufacturing a light-emitting device with less uneven light distribution color.

[0008] Methods for solving problems

[0009] An embodiment of this disclosure relates to a method for manufacturing a light-emitting device, comprising the following steps: a step of preparing a first component having a base, a plurality of phosphor frames located on the base, and a light-transmitting member disposed between adjacent phosphor frames; a step of disposing a light-emitting element having a light-emitting surface and an electrode forming surface opposite to the light-emitting surface on the inner side of the phosphor frames such that the light-emitting surface faces the base side; and a step of cutting the light-transmitting member.

[0010] The effects of the invention

[0011] According to one embodiment of the present disclosure, a method for manufacturing a light-emitting device with less uneven light distribution color can be provided. Attached Figure Description

[0012] Figure 1 A cross-sectional view of the light-emitting device according to the first embodiment is shown as an example.

[0013] Figure 2A bottom view (view from bottom) of the light-emitting device according to the first embodiment is shown as an example.

[0014] Figure 3 This is a schematic diagram (1) showing a state of the manufacturing process of the light-emitting device according to the first embodiment.

[0015] Figure 4 This is a schematic diagram (2) showing a state of the manufacturing process of the light-emitting device according to the first embodiment.

[0016] Figure 5 This is a schematic diagram (3) showing a state of the manufacturing process of the light-emitting device according to the first embodiment.

[0017] Figure 6 This is a schematic diagram (4) showing a state of the manufacturing process of the light-emitting device according to the first embodiment.

[0018] Figure 7 This is a schematic diagram (5) showing a state of the manufacturing process of the light-emitting device according to the first embodiment.

[0019] Figure 8 This is a schematic diagram (6) showing a state of the manufacturing process of the light-emitting device according to the first embodiment.

[0020] Figure 9 This is a schematic diagram (section 7) showing a state of the manufacturing process of the light-emitting device according to the first embodiment.

[0021] Figure 10 This is a schematic diagram (8) showing a state of the manufacturing process of the light-emitting device according to the first embodiment.

[0022] Figure 11 This is a schematic diagram (9) showing a state of the manufacturing process of the light-emitting device according to the first embodiment.

[0023] Figure 12 This is a schematic diagram (10) showing a state of the manufacturing process of the light-emitting device according to the first embodiment.

[0024] Figure 13 This is a schematic diagram (11) showing a state of the manufacturing process of the light-emitting device according to the first embodiment.

[0025] Figure 14 This is a schematic diagram (12) showing a state of the manufacturing process of the light-emitting device according to the first embodiment.

[0026] Figure 15 A cross-sectional view of a light-emitting device according to a variation of the first embodiment is shown.

[0027] Figure 16 The following is a bottom view (view) of the light-emitting device according to a variation of the first embodiment 1.

[0028] Figure 17 This is a bottom view of the upper mold according to a variation of the first embodiment, Example 1.

[0029] Figure 18 This is a cross-sectional view of the upper mold involved in a variation of the first embodiment, Example 1.

[0030] Figure 19 A cross-sectional view of a light-emitting device according to a variation of the first embodiment, shown in Example 2.

[0031] Figure 20 The following is a bottom view (view) of the light-emitting device according to a variation 2 of the first embodiment.

[0032] Figure 21 This is a bottom view of the upper mold involved in a variation of the first embodiment, Example 2.

[0033] Figure 22 This is a cross-sectional view of the upper mold involved in a variation of the first embodiment, Example 2.

[0034] Figure 23 A cross-sectional view of a light-emitting device according to a variation of the first embodiment, Example 3, is shown.

[0035] Figure 24 A cross-sectional view of a light-emitting device according to a variation of the first embodiment, Example 4, is shown.

[0036] Figure 25 A cross-sectional view of a light-emitting device according to a variation of the first embodiment, Example 5, is shown.

[0037] Figure 26 A cross-sectional view of a light-emitting device according to a variation of the first embodiment, Example 6, is shown.

[0038] Figure 27 A cross-sectional view of the light-emitting device according to the second embodiment is shown as an example.

[0039] Figure 28 The following is a bottom view (view from bottom) of the light-emitting device according to the second embodiment.

[0040] Figure 29 This is a schematic diagram (1) showing a state of the manufacturing process of the light-emitting device according to the second embodiment.

[0041] Figure 30 This is a schematic diagram (2) illustrating a state of the manufacturing process of the light-emitting device according to the second embodiment.

[0042] Figure 31This is a schematic diagram (3) showing a state of the manufacturing process of the light-emitting device according to the second embodiment.

[0043] Figure 32 This is a schematic diagram (4) showing a state of the manufacturing process of the light-emitting device according to the second embodiment.

[0044] Figure 33 This is a schematic diagram (5) showing a state of the manufacturing process of the light-emitting device according to the second embodiment.

[0045] Figure 34 This is a schematic diagram (6) showing a state of the manufacturing process of the light-emitting device according to the second embodiment.

[0046] Figure 35 This is a schematic diagram (7) showing a state of the manufacturing process of the light-emitting device according to the second embodiment.

[0047] Figure 36 This is a schematic diagram (1) illustrating a state of the manufacturing process of the light-emitting device according to the third embodiment.

[0048] Figure 37 This is a schematic diagram (2) illustrating a state of the manufacturing process of the light-emitting device according to the third embodiment.

[0049] Figure 38 This is a schematic diagram (3) illustrating a state of the manufacturing process of the light-emitting device according to the third embodiment.

[0050] Figure 39 This is a schematic diagram (4) showing a state of the manufacturing process of the light-emitting device according to the third embodiment.

[0051] Figure 40 This is a schematic diagram (5) showing a state of the manufacturing process of the light-emitting device according to the third embodiment.

[0052] Figure 41 A schematic plan view (1) of the planar light source according to the fourth embodiment is shown as an example.

[0053] Figure 42 A schematic plan view (2) of the planar light source according to the fourth embodiment is shown as an example.

[0054] Figure 43 A partial cross-sectional view (1) is shown to illustrate a specific example of a planar light source having multiple light-emitting devices arranged in a matrix on a wiring board.

[0055] Figure 44 A partial cross-sectional view (2) is shown to illustrate a specific example of a planar light source having multiple light-emitting devices arranged in a matrix on a wiring board.

[0056] Figure 45 A partial cross-sectional view (3) is shown to illustrate a specific example of a planar light source having multiple light-emitting devices arranged in a matrix on a wiring board.

[0057] Figure 46 This is a partial cross-sectional view showing a specific example of a light-emitting module having multiple light-emitting devices arranged in a matrix.

[0058] Figure 47 A configuration diagram of a liquid crystal display device according to the fifth embodiment is shown. Detailed Implementation

[0059] Hereinafter, specific embodiments will be described with reference to the accompanying drawings. Furthermore, in the following description, terms indicating specific directions or positions (e.g., "upper," "lower," and other terms including these terms) are used as needed; however, the use of these terms is to facilitate understanding of the invention with reference to the accompanying drawings, and their meaning does not limit the technical scope of the invention. Additionally, portions of the same symbol shown in multiple figures represent the same or equivalent parts or components.

[0060] Furthermore, the term "parallel" in this disclosure, unless otherwise specified, includes situations where two straight lines, edges, or surfaces are within a range of approximately 0° ± 5°. Additionally, the term "perpendicular" or "orthogonal" in this disclosure, unless otherwise specified, includes situations where two straight lines, edges, or surfaces are within a range of approximately 90° ± 5°.

[0061] Furthermore, the embodiments shown below exemplify light-emitting devices and the like, which are used to embody the technical concept of the present invention, and are not intended to limit the present invention. Additionally, the dimensions, materials, shapes, and relative arrangements of the constituent components described below are not intended to limit the scope of the present invention unless specifically stated otherwise; they are merely illustrative. Furthermore, the content described in one embodiment can be applied to other embodiments and variations. Additionally, the size and positional relationships of the components shown in the drawings are sometimes exaggerated to clarify the explanation. Furthermore, to avoid making the drawings overly complex, sometimes schematic diagrams with some elements omitted are used, or end views showing only the cross-section are used as cross-sectional views.

[0062] <First Embodiment>

[0063] (Light-emitting device 10)

[0064] Figure 1 A cross-sectional view of the light-emitting device according to the first embodiment is shown as an example. Figure 2 A bottom view (reverse view) of the light-emitting device according to the first embodiment is shown as an example. Additionally, Figure 1 express Figure 2 The cross section on line AA.

[0065] like Figure 1 and Figure 2 As shown, the light-emitting device 10 has a base 11, a phosphor frame 12, a light-transmitting member 13, and a light-emitting element 14. The light-emitting device 10 may further have an adhesive member 15 and a light-reflecting member 16. The light-emitting device 10 is, for example, generally cubic or generally cuboid in shape. The top, bottom, and side shapes of the light-emitting device 10 are, for example, quadrilaterals such as squares or rectangles.

[0066] Base 11, for example, is the first main surface 11a ( Figure 1 (middle, below) and the second main face 11b ( Figure 1 The phosphor frame 12 is a plate-shaped member with a square or rectangular or other quadrilateral shape (located in the middle and above). The phosphor frame 12 is a frame-shaped member that protrudes downward from the first main surface 11a of the base 11. The phosphor frame 12 has an inner surface 12a, an outer surface 12b, and an end surface 12c.

[0067] When only the base 11 and the portion of the phosphor frame 12 are viewed from the bottom, the phosphor frame 12 appears to be, for example, frontal rim shaped. However, in the bottom view, the phosphor frame 12 may not be frontal rim shaped but rather annular. That is, the opening of the phosphor frame 12 in the bottom view may be a polygonal shape such as a rectangle or a circle.

[0068] Furthermore, the term "bottom view" refers to viewing the object from the normal direction of the first principal surface 11a of the base 11. In this bottom view, the first principal surface 11a of the base 11 includes a central portion 11c surrounded by a phosphor frame 12 and an end portion 11d located outside the phosphor frame 12. In other words, the phosphor frame 12 is located more inwardly than the end portion 11d of the first principal surface 11a of the base 11.

[0069] The light-transmitting member 13 covers the central portion 11c of the first main surface 11a of the base 11, as well as the inner surface 12a and end surface 12c of the phosphor frame 12. Furthermore, the light-transmitting member 13 covers the end portion 11d of the first main surface 11a of the base 11 and the outer surface 12b of the phosphor frame 12, forming part of the side surface of the light-emitting device 10. A recess 13a surrounded by the phosphor frame 12 is provided through the light-transmitting member 13. The light-transmitting member 13 covering the central portion 11c of the first main surface 11a of the base 11 becomes the bottom surface of the recess 13a, and the light-transmitting member 13 covering the inner surface 12a of the phosphor frame 12 becomes the inner surface of the recess 13a.

[0070] The light-emitting element 14 includes a light-emitting surface 14a, an electrode forming surface 14b opposite to the light-emitting surface 14a, and a side surface 14c. A pair of electrodes 14t are provided on the electrode forming surface 14b of the light-emitting element 14. The light-emitting element 14 is disposed within a recess 13a located in a region surrounded by a phosphor frame 12. Specifically, the light-emitting element 14 is disposed within the recess 13a with its light-emitting surface 14a facing the bottom surface of the recess 13a. For example, the light-emitting element 14 is disposed within the recess 13a such that the electrodes 14t protrude downwards from the recess 13a. Furthermore, in this application, for ease of understanding of the invention, the surface opposite to the electrode forming surface 14b is referred to as the "light-emitting surface." It is beyond doubt that light from the light-emitting element 14 is emitted not only from the "light-emitting surface" but also from the side surface 14c of the light-emitting element 14.

[0071] An adhesive member 15 is disposed between the light-emitting surface 14a and side surface 14c of the light-emitting element 14 and the bottom surface and inner surface of the recess 13a. The light-transmitting member 13 indirectly covers the light-emitting surface 14a and side surface 14c of the light-emitting element 14 via the adhesive member 15. However, the adhesive member 15 may not be provided; in this case, the light-emitting surface 14a and side surface 14c of the light-emitting element 14 come into contact with the bottom surface and inner surface of the recess 13a. That is, in this case, the light-transmitting member 13 directly covers the light-emitting surface 14a and side surface 14c of the light-emitting element 14. Furthermore, the light-transmitting member 13 covering the central portion 11c of the first main surface 11a of the base 11 and the light-transmitting member 13 covering the inner surface 12a of the phosphor frame 12 can be provided as needed and are not essential.

[0072] The light-reflective member 16 is required to cover the area of ​​the electrode forming surface 14b of the light-emitting element 14 other than the area where the electrode 14t is provided, and is covered by the adhesive member 15 and the light-transmitting member 13 located around the electrode forming surface 14b. In this case, the lower surface of the light-emitting device 10 is formed by the lower surface of the light-reflective member 16 and the lower surface of the electrode 14t.

[0073] The end face 12c of the phosphor frame 12 is isolated from the light-reflective member 16, and a light-transmitting member 13 is disposed in the isolated area. The side surface of the light-reflective member 16, together with the side surface of the base 11 and the side surface of the light-transmitting member 13, constitutes part of the side surface of the light-emitting device 10. For example, the side surface of the light-reflective member 16, the side surface of the base 11, and the side surface of the light-transmitting member 13 are the same surface.

[0074] The outer surface 12b of the phosphor frame 12 has protrusions 17 that protrude toward the side of the light-emitting device 10. In this embodiment, when viewed from the bottom surface, two protrusions 17 are provided at each of the four corners of the phosphor frame 12. When viewed from the bottom surface, each protrusion 17 is arranged along the extension line of the end face 12c of the phosphor frame 12, and a portion of it protrudes from the side of the light-emitting device 10. That is, in each protrusion 17, when viewed from the side, the longitudinal end face of the protrusion 17 is exposed entirely in the height direction of the side of the light-emitting device 10. In this embodiment, the base 11, the phosphor frame 12, and the protrusions 17 are integrated. That is, in this embodiment, the base 11, the phosphor frame 12, and the protrusions 17 are made of the same material.

[0075] In the light-emitting device 10, the light-transmitting member 13 covers the outer surface 12b of the phosphor frame 12, thereby improving the weather resistance of the phosphor. In addition, the presence of the end 11d of the first main surface 11a of the base 11 improves the tightness between the light-transmitting member 13 and the base 11 and the phosphor frame 12.

[0076] The elements constituting the light-emitting device 10 will be described in detail below.

[0077] (Base 11, Phosphor Frame 12, Projection 17)

[0078] The base 11, phosphor frame 12, and protrusion 17 are made of materials that absorb light from the light-emitting element 14 and convert it into light of different wavelengths, and include a phosphor. The materials of the base 11, phosphor frame 12, and protrusion 17 can include a base material such as a light-transmitting resin, glass, or ceramic. The phosphor, as the wavelength conversion material, can be a material formed from a single crystal of a phosphor. As the base material, for example, thermosetting resins such as silicone resin, silicone-modified resin, epoxy resin, and phenolic resin, thermoplastic resins such as polycarbonate resin, acrylic resin, methylpentene resin, and polynorbornene resin, or alumina can be used. In particular, silicone resins with excellent lightfastness and heat resistance are suitable.

[0079] The phosphor can be any phosphor known in the field. For example, examples of phosphors that can be excited by blue or ultraviolet light-emitting elements include cerium-activated yttrium / aluminum / garnet phosphors (YAG:Ce); cerium-activated argon / aluminum / garnet phosphors (LAG:Ce); nitrogen-containing calcium aluminosilicate phosphors (CaO-Al2O3-SiO2) activated by europium and / or chromium; europium-activated silicate phosphors ((Sr,Ba)2SiO4); nitride-based phosphors such as βSiAlON phosphors, CASN-based phosphors, and SCASN-based phosphors; KSF-based phosphors (K2SiF6:Mn); sulfide-based phosphors; and quantum dot phosphors.

[0080] By combining these phosphors with light-emitting elements capable of emitting ultraviolet and visible light (blue to green light), it is possible to manufacture light-emitting devices of various colors (e.g., white light-emitting devices). One or more phosphors can be used. When using multiple phosphors, they can be mixed to form a single layer, or layers containing each phosphor can be stacked. Furthermore, the materials of the base 11, phosphor frame 12, and protrusion 17 can contain various fillers for purposes such as adjusting viscosity and promoting light scattering.

[0081] (Translucent component 13)

[0082] The light-transmitting member 13 can be made of a light-transmitting resin material. Preferably, the resin material is a thermosetting resin, such as silicone resin, silicone-modified resin, epoxy resin, or phenolic resin, as the main component. The transmittance of the light-transmitting member 13 relative to light from the light-emitting element 14 is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. The film thickness of the light-transmitting member 13 is preferably thinner than the thickness of the light-emitting element 14. Specifically, the film thickness of the light-transmitting member 13 is preferably 0.01 mm to 0.15 mm, more preferably 0.01 mm to 0.1 mm, and even more preferably 0.01 mm to 0.05 mm.

[0083] (Light-emitting element 14)

[0084] A typical example of a light-emitting element 14 is an LED (Light Emitting Diode). The light-emitting element 14, for example, includes a substrate such as sapphire or gallium nitride, and a semiconductor stack. The semiconductor stack includes an n-type semiconductor layer and a p-type semiconductor layer, an active layer sandwiched between them, and electrodes 14t electrically connected to the n-type and p-type semiconductor layers. The semiconductor stack may include a nitride-based semiconductor (In) capable of emitting light in the ultraviolet to visible region. X Al Y Ga 1-X-Y N, 0≤X, 0≤Y, X+Y≤1).

[0085] The semiconductor stack can have at least one light-emitting layer capable of emitting light in the ultraviolet to visible region, as described above. For example, the semiconductor stack can include a light-emitting layer emitting a single color or wavelength between an n-type semiconductor layer and a p-type semiconductor layer. Furthermore, the light-emitting layer can be a structure with a single active layer, such as a double heterojunction or a single quantum well heterostructure (SQW), or a structure with a cluster of active layers, such as a multiple quantum well heterostructure (MQW). In addition, the semiconductor stack can also include multiple light-emitting layers.

[0086] For example, a semiconductor stack can be a structure containing multiple light-emitting layers between an n-type semiconductor layer and a p-type semiconductor layer, or it can be a structure that repeatedly includes an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer in sequence. The multiple light-emitting layers can include active layers with different emission colors or wavelengths, or they can include active layers with the same emission color or wavelength.

[0087] Furthermore, the term "same emission color" is used to refer to a range of colors that are considered to be the same, for example, with a deviation of about a few nanometers in the dominant wavelength. The combination of emission colors or wavelengths can be appropriately selected. For example, in the case of a semiconductor stack containing two active layers, combinations of emission colors can include blue light with blue light, green light with green light, red light with red light, ultraviolet light with ultraviolet light, blue light with green light, blue light with red light, or green light with red light, etc.

[0088] The shape of the bottom surface of the light-emitting element 14 is typically rectangular. The length of one side of the rectangle of the light-emitting element 14 is, for example, 1000 μm or less. The vertical and horizontal dimensions of the rectangle of the light-emitting element 14 can be 500 μm or less. Light-emitting elements with vertical and horizontal dimensions of 500 μm or less are readily available. Alternatively, the vertical and horizontal dimensions of the rectangle of the light-emitting element 14 can be 200 μm or less. If the length of one side of the rectangle of the light-emitting element 14 is short, it is advantageous for high-resolution image display and local dimming operations when applied to the backlight unit of a liquid crystal display device.

[0089] In particular, for light-emitting elements with dimensions of 250 μm or less in both the longitudinal and transverse directions, the area on the top surface is smaller than that on the sides, resulting in a relatively larger amount of light emitted from the sides of the light-emitting element. Therefore, it is easy to obtain batwing-shaped light distribution characteristics. Here, the term "batwing-shaped light distribution characteristics" broadly refers to the light distribution characteristics defined by setting the optical axis perpendicular to the top surface of the light-emitting element to 0°, and specifying a light intensity distribution with high luminous intensity in the direction of the angle with the largest absolute value compared to 0°.

[0090] (Adhesive component 15)

[0091] As the adhesive component 15, a light-transmitting adhesive can be used. Examples of light-transmitting adhesives include resin materials with thermosetting resins such as silicone resin, silicone-modified resin, epoxy resin, and phenolic resin as the main component. For example, the light-transmitting adhesive preferably has a transmittance of 70% or more, more preferably 80% or more, and even more preferably 90% or more, relative to the light from the light-emitting element 14.

[0092] (Light-reflecting component 16)

[0093] The light-reflective member 16 is a member capable of reflecting light from the light-emitting element 14. For example, a resin material containing a light-scattering agent can be used. The reflectivity of the light-reflective member 16 relative to light from the light-emitting element 14 is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more.

[0094] The light-reflective component 16 is preferably made from a resin material whose main component is a thermosetting resin such as silicone resin, silicone-modified resin, epoxy resin, or phenolic resin. As a light-scattering agent (sometimes called a filler) contained in the resin material, a white substance can be used, for example. Specifically, titanium oxide, silicon oxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite, etc., are suitable as light-scattering agents. The light-scattering agent can be, for example, granular, fibrous, or sheet-like.

[0095] (Manufacturing method of light-emitting device 10)

[0096] Figures 3 to 14 This is a schematic diagram illustrating one state of the manufacturing process of the light-emitting device according to the first embodiment. First, as... Figures 3-9 As shown, a first component 110 is prepared, the first component 110 having: a base 11, a plurality of phosphor frames 12 located on the base 11, and a light-transmitting component 13 disposed between adjacent phosphor frames 12.

[0097] Specifically, firstly, such as Figure 3 As shown, a semi-cured laminate 100 is prepared, on which a light-transmitting member 13 is laminated on a phosphor layer 12S. The laminate 100 can be formed, for example, by placing a film-shaped light-transmitting member 13, formed of a semi-cured light-transmitting resin, onto a film-shaped phosphor layer 12S containing a phosphor in a semi-cured light-transmitting resin, and pressing the light-transmitting member 13 onto the phosphor layer 12S side. Alternatively, the laminate 100 can be formed by spray coating or the like onto a film-shaped phosphor layer 12S containing a phosphor in a semi-cured light-transmitting resin. Alternatively, a semi-cured laminate 100 on which a light-transmitting member 13 is laminated on a phosphor layer 12S can be purchased in advance. Furthermore, the upper and lower surfaces of the laminate 100 are flat surfaces without protrusions or recesses.

[0098] Next, prepare Figure 4 and Figure 5 The upper mold 900 shown Figure 6 The lower mold 910 is shown. Figure 4 This is a view of the upper mold 900 from the convex side (the side opposite to the lower mold 910). Figure 5 for Figure 4 A cross-sectional view along the BB line. Additionally, in Figure 4 In the diagram, the symbol 10, represented by a dashed line, indicates a portion corresponding to a light-emitting device 10.

[0099] like Figure 4 As shown, on the surface of the upper mold 900 opposite the lower mold 910, square-shaped protrusions 901 forming recesses 13a are arranged in rows and columns at predetermined intervals. Furthermore, rectangular protrusions 902, separated from the protrusions 901 and with their long sides approximately equal to one side of each protrusion 901, are arranged between adjacent protrusions 901 in the vertical and horizontal directions. Additionally, square protrusions 903, separated from the protrusions 901 and with each side approximately equal to the short side of each protrusion 902, are arranged between adjacent protrusions 901 in the diagonal direction. In other words, protrusions 903 are arranged separated from protrusions 902 by being located between adjacent protrusions 902. The surface of the lower mold 910 opposite the upper mold 900 is a flat surface without any protrusions or recesses.

[0100] Using upper mold 900 and lower mold 910, a laminated body 100 is formed. Specifically, as follows: Figure 6 As shown, the laminate 100 is arranged on the lower mold 910, and then as... Figure 7 As shown, by pressing with the upper mold 900, the laminate 100 is deformed to form a first component 110 having a base 11, a phosphor frame 12, and a light-transmitting component 13. Figure 7 In the process, the remaining phosphor frame 12 is extruded around the upper mold 900 and the lower mold 910. Then, the phosphor frame 12 and the light-transmitting component 13 are cured.

[0101] Figure 8 and Figure 9 This indicates the cured first component 110 taken out from the upper mold 900 and the lower mold 910. Figure 8 This is a plan view (top view). Figure 9 This is a cross-sectional view. For example... Figure 8 and Figure 9 As shown, the first component 110 has a base 11, a plurality of phosphor frames 12 located on the base 11, and light-transmitting components 13 disposed between adjacent phosphor frames 12. That is, the portion pressed by the protrusions 901, 902, and 903 of the upper mold 900 becomes the light-transmitting component 13 covering the base 11, and the remaining portion becomes the light-transmitting component 13 covering the phosphor frames 12. Furthermore, the base 11 is preferably thin. This is because, if the following description is used… Figure 12 The process shown involves cutting and monolithizing the substrate 11, exposing the cross-section of the substrate 11 to the side of the light-emitting device 10. However, when the area of ​​the cross-section is small, the weather resistance of the phosphor is improved.

[0102] Next, as Figure 10 As shown, light-emitting elements 14, each having a light-emitting surface 14a, an electrode forming surface 14b opposite to the light-emitting surface 14a, and a side surface 14c, are prepared according to the number of phosphor frames 12. Furthermore, the light-emitting surfaces 14a of the light-emitting elements 14 are arranged inside each phosphor frame 12 with the light-emitting surface 14a facing the base 11. The light-emitting elements 14 are arranged inside the phosphor frame 12, for example, via an adhesive member 15 coated within the phosphor frame 12. The adhesive member 15 can be coated, for example, by pouring in a light-transmitting liquid material (e.g., resin). By curing the adhesive member 15, the light-emitting surface 14a and side surface 14c of the light-emitting element 14 can be bonded to the bottom and inner surfaces of the light-transmitting member 13 located within the phosphor frame 12. The light-emitting elements 14 are preferably arranged such that the electrodes 14t protrude from the end face 12c of the phosphor frame 12.

[0103] Next, as Figure 11 As shown, a light-reflective member 16 is disposed on the electrode forming surface 14b side of the light-emitting element 14. Specifically, a light-reflective member 16 is formed on the top surface of the light-transmitting member 13, the electrode forming surface 14b of the light-emitting element 14, and the side surface of the electrode 14t of the light-emitting element 14, exposing the front end surface of the electrode 14t of the light-emitting element 14. The light-reflective member 16 can be disposed on the electrode forming surface 14b side of the light-emitting element 14 by embedding the electrode 14t in the electrode forming surface 14b, and the light-reflective member can be removed until the front end surface of the electrode 14t is exposed. The light-reflective member 16 can be formed, for example, by compression molding, injection molding, coating, etc., using a mold. The removal of the light-reflective member 16 on the electrode 14t can be achieved, for example, by mechanical grinding using a grinding machine, sandblasting, etc.

[0104] Next, as Figure 12 As shown, by cutting off the base 11, the light-transmitting member 13, and the light-reflecting member 16 located between adjacent phosphor frames 12, a result is obtained. Figure 14 The multiple light-emitting devices 10 shown are cut off in such a way that the light-transmitting members 13 covering the outer surface 12b of each phosphor frame 12 remain. That is, the phosphor frame 12 is not cut off, but the light-transmitting members 13 covering the outer surface 12b of the phosphor frame 12 must be cut off.

[0105] The base 11, the light-transmitting member 13, and the light-reflecting member 16 located between adjacent phosphor frames 12, for example, Figure 12 As shown, a scraper 950 of a specified width can be used to cut. By using the scraper 950 to cut, the base 11, the light-transmitting member 13, and the light-reflecting member 16, which are of a similar width to the scraper 950, are removed. In the case of cutting, as... Figure 12In this way, it can be cut in one cut or in two or more cuts. In the case of cutting in two cuts, the first cut can be used to cut from the side of the light-reflective member 16, forming a groove that does not reach the lower end of the base 11. The second cut can then cut deeper into the groove formed by the first cut, thus cutting it off completely. For example, the light-reflective member 16 can be cut off with the first cut, and the base 11 can be cut off with the second cut.

[0106] Furthermore, when cutting in three stages, the first cut can be made from the light-reflective member 16 side to form a groove that does not reach the lower end of the base 11. The second cut can be made to further cut the groove formed in the first cut, creating a groove deeper than the one formed in the first cut. The third cut can further deepen the groove formed in the second cut, thus achieving a complete cut. The same applies even when cutting in four or more stages.

[0107] In addition, such as Figure 13 As shown, the adjacent phosphor frames 12 can be cut at two different locations using a scraper 960, which is narrower than the scraper 950. In this case, the cut can be made in one go or in multiple cuts. Furthermore, when making multiple cuts, the cuts can be made simultaneously or at different times. Moreover, when cutting, the cut can begin from the light-reflecting member 16 side or from the base 11 side of the first member 110.

[0108] exist Figure 12 In this case, the width W1 between the opposing outer surfaces of adjacent phosphor frames 12 is, for example, about 0.2 to 0.3 mm. For example, a scraper 950 with a width W2 of 0.15 mm can be used. For example, if the width W1 is 0.25 mm and the width W2 is 0.15 mm, and the light-transmitting member 13 on the outer surface of the covered phosphor frame 12 is cut evenly, the width W3 becomes 0.05 mm. Furthermore, a wider scraper can also be used, making the width W3 about 0.01 mm.

[0109] When the side of the light-emitting device is formed by cutting the phosphor layer in half, there is a concern that the width of the phosphor layer forming the side of the light-emitting device may differ on the left and right sides due to misalignment of the cutting position. In this case, the light path length through the phosphor layer differs on the left and right sides of the light-emitting device, thus raising concerns about uneven light distribution color.

[0110] In contrast, in the manufacturing method of the light-emitting device 10, in the process of forming multiple light-emitting devices 10 by monolithization (see... Figure 12 , Figure 13 In this process, the phosphor frame 12 is not cut off, but the light-transmitting member 13 covering the outer surface 12b of the phosphor frame 12 must be cut off. Therefore, assuming that even if the cutting position is offset, only the width of the light-transmitting member 13 forming the side of the light-emitting device 10 is different on the left and right sides, the width of the phosphor frame 12 on the left and right sides is equal. As a result, the light path length of the light passing through the phosphor frame 12 becomes approximately the same on the left and right sides of the light-emitting device 10, thereby suppressing uneven light distribution color.

[0111] In addition, the light-reflective member 16 included in the light-emitting device 10 is located only below the light-emitting device and is not covered by the outer surface of the light-transmitting member 13, thus improving the extraction of light from the light-emitting element 14.

[0112] Furthermore, in the light-emitting device 10, the light-transmitting member 13 covers the outer surface 12b of the phosphor frame 12, thereby improving the weather resistance of the phosphor. In addition, due to the presence of the end 11d of the first main surface 11a of the base 11, the tightness of the light-transmitting member 13 with the base 11 and the phosphor frame 12 can be improved.

[0113] <Modifications of the First Embodiment>

[0114] In a variation of the first embodiment, an example of a light-emitting device with a structure different from that of the first embodiment is shown. Furthermore, in variations of the first embodiment, descriptions of components that are the same as those in the already described embodiments are sometimes omitted.

[0115] Figure 15 A cross-sectional view of a light-emitting device according to a variation of the first embodiment is shown. Figure 16 A bottom view (view from bottom) of the light-emitting device according to a variation 1 of the first embodiment is shown. Additionally, Figure 15 express Figure 16 The cross section on the CC line.

[0116] like Figure 15 and Figure 16 As shown, the light-emitting device 10A, like the light-emitting device 10, has a protrusion 17 on the outer surface 12b of the phosphor frame 12 that protrudes towards the side of the light-emitting device 10A. However, unlike the light-emitting device 10, in the light-emitting device 10A, one protrusion 17 is provided at approximately the center of each of the four sides constituting the outer surface 12b of the phosphor frame 12 when viewed from the bottom. In other words, one protrusion 17 is provided at the midpoint of each adjacent corner of the rectangle of the phosphor frame 12 when viewed from the bottom. Moreover, in the side view, the longitudinal end face of each protrusion 17 is exposed in the height direction of the side of the light-emitting device 10.

[0117] Thus, the light-emitting device 10 has eight protrusions 17, while the light-emitting device 10A has four protrusions 17. If the protrusions 17 protrude from the sides of the light-emitting device, there is a concern that the phosphor particles contained within the protrusions 17 may be exposed from the sides, thus reducing the weather resistance of the phosphor particles. Therefore, it is preferable that the protrusions 17 protrude less from the sides of the light-emitting device. That is, the light-emitting device 10A, which has fewer protrusions 17 protruding less from the sides than the light-emitting device 10, exhibits superior weather resistance of the phosphor particles compared to the light-emitting device 10.

[0118] In order to Figure 16 The position forms a protrusion 17, for example, using Figure 17 and Figure 18 The upper mold 900A shown is sufficient. Figure 17 This is a view of the upper mold 900A from the convex side (the side opposite to the lower mold 910). Figure 18 for Figure 17 A cross-sectional view of the DD line.

[0119] like Figure 17 As shown, on the surface of the upper mold 900A opposite to the lower mold, square-shaped protrusions 901A forming recesses 13a are arranged in rows and columns at predetermined intervals. Furthermore, cross-shaped protrusions 902A, separated from each other in a diagonally adjacent manner, are arranged in rows and columns at predetermined intervals. Around each protrusion 901A, four adjacent gap portions 905A of protrusions 902A are arranged, and protrusions 17 are formed at the locations of these gap portions 905A. For example, when viewed from the bottom surface, the gap portions 905A are arranged such that they cross the line connecting the centers of the respective protrusions 901A.

[0120] Figure 19 A cross-sectional view of a light-emitting device according to a variation of the first embodiment, shown in Example 2. Figure 20 A bottom view (view from bottom) of the light-emitting device according to a variation 2 of the first embodiment is shown. Additionally, Figure 19 express Figure 20 The cross section on the EE line.

[0121] like Figure 19 and Figure 20 As shown, the light-emitting device 10B differs from the light-emitting devices 10 and 10A in that it does not have a protrusion 17 on the outer side 12b of the phosphor frame 12 that protrudes toward the side of the light-emitting device 10B.

[0122] Thus, the light-emitting device 10 has eight protrusions 17, the light-emitting device 10A has four protrusions 17, and the light-emitting device 10B has no protrusions 17. As mentioned above, if the protrusions 17 protrude from the side of the light-emitting device, there is a concern that the phosphor particles contained in the protrusions 17 may be exposed from the side of the light-emitting device, which could reduce the weather resistance of the phosphor particles. Therefore, it is preferable that the protrusions 17 protrude from the side of the light-emitting device in a smaller area. In the light-emitting device 10B, the component containing the phosphor particles is not exposed in the height direction of the side of the light-emitting device 10B as a whole, so the weather resistance of the phosphor particles is superior to that of the light-emitting device 10A.

[0123] To prevent the protrusion 17 from protruding from the side of the light-emitting device 10, for example, simply by using Figure 21 and Figure 22 The upper mold 900B shown is sufficient. Figure 21 This is a view of the upper mold 900B from the convex side (the side opposite to the lower mold 910). Figure 22 for Figure 21 A cross-sectional view of the FF line. (See diagram below.) Figure 21 As shown, on the surface of the upper mold 900B opposite to the lower mold 910, square-shaped protrusions 901B forming recesses 13a are arranged in rows and columns at predetermined intervals. Furthermore, grid-shaped protrusions 902B are arranged to surround and separate each protrusion 901B. The protrusions 902B are formed continuously without any recessed portions, therefore no protrusions 17 are formed that protrude from the side of the light-emitting device 10.

[0124] Figure 23 A cross-sectional view of a light-emitting device according to a variation of the first embodiment, Example 3, is shown. Figure 23 As shown, the light-emitting device 10C does not have a light-transmitting member 13 disposed on the end face 12c of the phosphor frame 12. The point at which the end face 12c of the phosphor frame 12 contacts the light-reflecting member 16 is consistent with the light-emitting device 10 (see reference). Figure 1 The main differences are (etc.).

[0125] like Figure 1 As shown, if a light-transmitting member 13 exists between the end face 12c of the phosphor frame 12 and the light-reflecting member 16, the adhesion between the end face 12c of the phosphor frame 12 and the light-reflecting member 16 is improved. Furthermore, as... Figure 23 As shown, a structure can be formed where the end face 12c of the phosphor frame 12 is not provided with the light-transmitting member 13, and the end face 12c of the phosphor frame 12 is in contact with the light-reflecting member 16. Therefore, since all the light from the light-emitting element passes through the phosphor frame, uneven light distribution can be suppressed.

[0126] Figure 24A cross-sectional view of a light-emitting device according to a variation 4 of the first embodiment is shown. Figure 24 As shown, the light-emitting device 10D has a roughly trapezoidal shape in the cross-sectional shape of the wall portion of the phosphor frame 12, which becomes narrower as it moves downward from the first main surface 11a of the base 11. This is different from the light-emitting device 10 (see reference 10), where the cross-sectional shape of the wall portion of the phosphor frame 12 is rectangular. Figure 1 The main differences are as follows. However, the cross-sectional shape of the wall of the phosphor frame 12 does not need to be a perfect trapezoid; for example, the corners can be slightly rounded, or the end face 12c can be curved.

[0127] To make the cross-sectional shape of the wall portion of the phosphor frame 12 approximately trapezoidal, it is sufficient to make the shape of the recess in the upper mold forming the wall portion of the phosphor frame 12 approximately trapezoidal. If the cross-sectional shape of the wall portion of the phosphor frame 12 is made approximately trapezoidal, then from... Figure 7 Until Figure 9 In the process, the first component 110 is easily pulled out from the upper mold 900.

[0128] Figure 25 A cross-sectional view of a light-emitting device according to a variation 5 of the first embodiment is shown. Figure 25 As shown, the light-emitting device 10E is located on the side opposite to the side of the base 11 where the phosphor frame 12 is disposed, namely the second main surface 11b. Figure 25 At the point where the light-reflecting layer 18 is disposed on the upper part of the light-emitting device 10 (see reference 10), the light-reflecting layer 18 is disposed on the upper part of the light-reflecting device 10. Figure 1 The main differences are (etc.). For example, being able to Figure 11 and Figure 12 Between processes, there is a process of disposing of a light-reflecting layer 18 on the second main surface 11b of the base 11. By disposing of the light-reflecting layer 18 on the second main surface 11b of the base 11, it is possible to suppress light rising upwards from the light-emitting element 14 and increase the extraction of light to the sides. As the light-reflecting layer 18, for example, the same material exemplified as the light-reflective member 16 can be used. The light-reflecting layer 18 can be formed, for example, by compression molding, injection molding, coating, etc.

[0129] Figure 26 A cross-sectional view of a light-emitting device according to a variation of the first embodiment, Example 6, is shown. Figure 26 As shown, the light-emitting device 10F differs from the light-emitting device 10 (see reference 10) in that the adhesive member 15 is replaced by two types of adhesive members (first adhesive member 15A and second adhesive member 15B). Figure 1 The main differences are (etc.). Figure 26 In this structure, the adhesive component is a two-layer structure consisting of a first adhesive component 15A and a second adhesive component 15B.

[0130] The first adhesive member 15A covers the light-emitting surface 14a of the light-emitting element 14 and is stretched over a portion of the upper side of the side surface 14c of the light-emitting element 14. The second adhesive member 15B covers a portion of the lower side of the side surface 14c of the light-emitting element 14.

[0131] To provide the first adhesive member 15A and the second adhesive member 15B, for example, in Figure 10 In the process, a small amount of the first adhesive member 15A is coated inside the phosphor frame 12 to assemble the light-emitting element 14. The first adhesive member 15A covers a portion of the light-emitting surface 14a and the side surface 14c of the light-emitting element 14. If the first adhesive member 15A is cured, the light-emitting surface 14a and a portion of the side surface 14c of the light-emitting element 14 are bonded to the surrounding light-transmitting member 13 through the first adhesive member 15A. Then, a second adhesive member 15B is injected into the gap between the side surface 14c of the light-emitting element 14 and the light-transmitting member 13, and then cured, bonding the side surface 14c of the light-emitting element 14 to the surrounding light-transmitting member 13 through the second adhesive member 15B.

[0132] When using only one adhesive member 15 to bond the light-emitting element 14, if there is too much adhesive member 15, a force is required to press the light-emitting element 14 in. Furthermore, there is a concern that the adhesive member 15 may overflow. By using a first adhesive member 15A and a second adhesive member 15B to bond in two separate steps, this problem can be eliminated.

[0133] The materials of the first adhesive member 15A and the second adhesive member 15B can be the same or different. When the materials of the first adhesive member 15A and the second adhesive member 15B are different, for example, a light-reflective adhesive can be used as the first adhesive member 15A, and a light-transmitting adhesive can be used as the second adhesive member 15B. In this case, it is possible to suppress light rising upwards from the light-emitting element 14 and increase light extraction to the sides.

[0134] <Second Embodiment>

[0135] In the second embodiment, an example of a light-emitting device with a structure and manufacturing method different from that of the first embodiment is shown. Furthermore, in the second embodiment, descriptions of the same components as those in the already described embodiments are sometimes omitted.

[0136] (Light-emitting device 10G)

[0137] Figure 27 A cross-sectional view of the light-emitting device according to the second embodiment is shown as an example. Figure 28 A bottom view (view from bottom) of the light-emitting device according to the second embodiment is shown as an example. Additionally, Figure 27 express Figure 28 The cross section of the GG line.

[0138] like Figure 27 and Figure 28 As shown, at the point where the light-emitting device 10G separates from the base 11G and the phosphor frame 12, the light-emitting device 10 (see reference) Figure 1 The main differences are (etc.).

[0139] In the light-emitting device 10G, the phosphor frame 12 is attached to the first main surface 11a of the base 11G. The base 11G and the phosphor frame 12 can be directly attached, or attached via an adhesive layer. The base 11G is, for example, a plate-like member with a square or rectangular quadrilateral shape for the first main surface 11a and the second main surface 11b. The base 11G includes at least one phosphor layer, a light-transmitting layer, or a light-reflecting layer. When the base 11G is a phosphor layer, the material of the base 11G can be the same as or different from the material of the phosphor frame 12.

[0140] Similar to the light-emitting device 10, the phosphor frame 12 is located on the inner side compared to the end 11d of the first main surface 11a of the base 11G. Also similar to the light-emitting device 10, when only the base 11G and a portion of the bottom surface of the phosphor frame 12 are considered, the phosphor frame 12 is, for example, rim-shaped or annular. The light-transmitting member 13 does not need to completely cover the outer surface 12b of the phosphor frame 12; it may only cover the end 11d side of the outer surface 12b of the phosphor frame 12.

[0141] exist Figure 27 and Figure 28 In this example, the light-transmitting member 13 is only disposed at the end 11d of the first main surface 11a of the covered base 11G and a portion of the outer surface 12b of the phosphor frame 12. However, compared with Figure 1 Similarly, in the light-emitting device 10 shown, the light-transmitting member 13 may further cover the central portion 11c of the base 11G, and the inner surface 12a and end face 12c of the phosphor frame 12. Alternatively, with... Figure 23 Similarly, in the light-emitting device 10C shown, the light-transmitting member 13 may further cover the central portion 11c of the base 11G and the inner surface 12a of the phosphor frame 12.

[0142] (Manufacturing method of 10G light-emitting device)

[0143] Figures 29-35 This is a schematic diagram illustrating one state of the manufacturing process of the light-emitting device according to the second embodiment. Additionally, Figures 32-35 express Figure 31 The cross section on the HH line.

[0144] First, such as Figures 29-32As shown, a first component 110G is prepared, the first component 110G having: a base 11G, a plurality of phosphor frames 12 located on the base 11G, and a light-transmitting component 13 disposed between adjacent phosphor frames 12.

[0145] Specifically, firstly, such as Figure 29 As shown, rectangular phosphor layers 12G are arranged longitudinally and transversely at predetermined intervals, and a composite component 100G is prepared having a light-transmitting member 13 in contact with the side surfaces of the phosphor layers 12G. The light-transmitting member 13 is arranged to fill the space between the side surfaces of adjacent phosphor layers 12G, and is also arranged to cover the side surfaces of the outermost phosphor layers 12G. The phosphor layers 12G and the light-transmitting member 13 have the same thickness.

[0146] Next, as Figure 30 As shown, a rectangular opening penetrating each phosphor layer 12G is formed to create a phosphor frame 12. Thus, a composite component 100G with a light-transmitting member 13 disposed on the outer surface of the phosphor frame 12 is formed. The rectangular opening can, for example, be formed by pressing. Alternatively, the planar shape of the phosphor layer 12G can be circular; in this case, a circular opening is formed to create an annular phosphor frame 12.

[0147] Next, as Figure 31 As shown, a plate-shaped base 11G larger than the composite member 100G is prepared. The composite member 100G is then bonded to the first main surface 11a of the base 11G to fabricate the first member 110G. The cross-sectional shape of the first member 110G is as follows: Figure 32 That is, phosphor frames 12 are arranged longitudinally and transversely at predetermined intervals on the first main surface 11a of the base 11G, and light-transmitting members 13 are arranged between the outer surfaces of adjacent phosphor frames 12. In addition, the bonding of the composite member 100G to the base 11G can be performed directly or indirectly through an adhesive.

[0148] Next, as Figure 33As shown, light-emitting elements 14, each having a light-emitting surface 14a, an electrode forming surface 14b opposite to the light-emitting surface 14a, and a side surface 14c, are prepared according to the number of phosphor frames 12. Furthermore, the light-emitting surface 14a of the light-emitting element 14 is positioned inside each phosphor frame 12 with the base 11G facing it. The light-emitting element 14 is positioned inside the phosphor frame 12, for example, by means of an adhesive member 15 coated within the phosphor frame 12. The adhesive member 15 can be applied, for example, by pouring in a liquid material. By curing the adhesive member 15, the light-emitting surface 14a and side surface 14c of the light-emitting element 14 can be bonded to the first main surface 11a of the base 11G located within the phosphor frame 12 and the inner side surface of the phosphor frame 12. The light-emitting element 14 is preferably positioned such that the electrode 14t protrudes from the end face 12c of the phosphor frame 12.

[0149] Next, as Figure 34 As shown, a light-reflective member 16 is disposed on the electrode forming surface 14b side of the light-emitting element 14. Specifically, a light-reflective member 16 is formed on the top surface of the light-transmitting member 13, the electrode forming surface 14b of the light-emitting element 14, and the side surface of the electrode 14t of the light-emitting element 14, exposing the front end surface of the electrode 14t of the light-emitting element 14. The light-reflective member 16 can be disposed on the electrode forming surface 14b side of the light-emitting element 14 by embedding the electrode 14t in the electrode forming surface 14b, and the light-reflective member can be removed until the front end surface of the electrode 14t is exposed. The light-reflective member 16 can be formed, for example, by compression molding, injection molding, coating, etc., using a mold. The removal of the light-reflective member 16 on the electrode 14t can be achieved, for example, by mechanical grinding using a grinding machine, sandblasting, etc.

[0150] Next, as Figure 35 As shown, the base 11G, the light-transmitting member 13, and the light-reflecting member 16 located between adjacent phosphor frames 12 are cut to form... Figure 27 and Figure 28 The light-emitting device 10G shown is cut off in such a way that the light-transmitting members 13 covering the outer surfaces 12b of each phosphor frame 12 remain. That is, the phosphor frames 12 are not cut off, but the light-transmitting members 13 located between the outer surfaces 12b of the phosphor frames 12 must be cut off. The base 11G, the light-transmitting members 13, and the light-reflecting members 16 located between adjacent phosphor frames 12 can, for example, be as follows: Figure 35 As shown, using a scraper 950 of the specified width, it can be cut in one cut, or it can be combined with... Figure 13 Similarly, a scraper 960, which is narrower than scraper 950, is used to cut the material in two cuts.

[0151] <Third Embodiment>

[0152] In the third embodiment, an example is shown where a light-emitting device with the same structure as in the first embodiment is manufactured using a different manufacturing method than that in the first embodiment. Furthermore, in the third embodiment, descriptions of components that are the same as those in the already described embodiments are sometimes omitted.

[0153] Figures 36-40 This is a schematic diagram illustrating one state of the manufacturing process of the light-emitting device according to the third embodiment. First, as... Figure 36 As shown, a light-reflective component 16 in an uncured state is prepared. In addition, a plurality of light-emitting elements 14 are prepared, each having a light-emitting surface 14a, an electrode forming surface 14b opposite to the light-emitting surface 14a, and a side surface 14c.

[0154] Next, as Figure 37 As shown, the light-emitting elements 14 are arranged longitudinally and transversely at predetermined intervals with their electrode forming surfaces 14b facing the light-reflecting member 16. Each light-emitting element 14 is pressed against the light-reflecting member 16 to embed the electrode 14t in the light-reflecting member 16. That is, the light-reflecting member 16 is disposed on the electrode forming surface 14b of the light-emitting element 14. Then, the light-reflecting member 16 is cured.

[0155] Next, as Figure 38 As shown, a first component 110 is prepared, which includes a base 11, a plurality of phosphor frames 12 located on the base 11, and light-transmitting members 13 disposed between adjacent phosphor frames 12. Furthermore, after applying the adhesive member 15 to the light-emitting surface 14a of the light-emitting element 14, the light-transmitting members 13 of the first component 110 are oriented towards the light-emitting element 14, and each recess 13a is positioned with the light-emitting element 14. For the method of manufacturing the first component 110, refer to... Figures 3-9 An explanation was provided.

[0156] Next, as Figure 39 As shown, the first member 110 is covered on the light-reflective member 16 with the light-emitting surface 14a facing the base 11 and the light-emitting element 14 disposed inside the phosphor frame 12. Furthermore, the first member 110 is pressed against the light-reflective member 16 to cure the adhesive member 15, thereby fixing the light-emitting element 14 in each recess 13a by means of the adhesive member 15.

[0157] Next, as Figure 40 As shown, the base 11, the light-transmitting member 13, and the light-reflecting member 16 located between adjacent phosphor frames 12 are cut to obtain... Figure 1 and Figure 2The light-emitting device 10 is shown. The cutting is performed in such a way that the light-transmitting members 13 covering the outer surfaces 12b of each phosphor frame 12 remain. That is, the phosphor frames 12 are not cut off; only the light-transmitting members 13 located between the outer surfaces 12b of the phosphor frames 12 must be cut off. For example, the base 11, light-transmitting members 13, and light-reflecting members 16 located between adjacent phosphor frames 12 can be, for example, as... Figure 40 As shown, using a scraper 950 of the specified width, a single cut is made to cut, which can be combined with... Figure 13 Similarly, a scraper 960, which is narrower than scraper 950, is used to cut the material in two cuts.

[0158] <Fourth Embodiment>

[0159] In the fourth embodiment, an example of a planar light source configured with multiple light-emitting devices is shown. Furthermore, in the fourth embodiment, descriptions of the same components as in the already described embodiments are sometimes omitted.

[0160] Figure 41 A schematic plan view (1) of the planar light source according to the fourth embodiment is shown as an example. Figure 42 A schematic plan view (2) of the planar light source according to the fourth embodiment is shown as an example. Figure 41 The planar light source 200 shown has a plurality of light-emitting devices 10 arranged in a row on the wiring board 210. Figure 42 The planar light source 200A shown has multiple light-emitting devices 10 arranged in a matrix on the wiring board 210.

[0161] In the planar light sources 200 and 200A, the spacing between the multiple light-emitting devices 10 is ( Figure 41 The P values ​​are preferably the same, but can be different. The spacing of the light-emitting devices 10 can be appropriately adjusted according to the size, brightness, etc. of the light-emitting devices. For example, the spacing of the light-emitting devices 10 can be in the range of 5mm to 100mm, and is preferably in the range of 8mm to 50mm.

[0162] The following is a reference. Figures 43-46 One side shows a specific example of a planar light source. Figure 43 A partial cross-sectional view (1) is shown to illustrate a specific example of a planar light source having multiple light-emitting devices arranged in a matrix on a wiring board.

[0163] Figure 43 The planar light source 300 shown includes a light-emitting device 10, a wiring substrate 310, and a separating member 320. Alternatively, any of the light-emitting devices 10A to 10G can be used instead of the light-emitting device 10. The wiring substrate 310 has an insulating substrate 311 and wiring 312 disposed on the substrate 311, and may have an insulating resin 313 covering a portion of the wiring 312 as needed.

[0164] The separating member 320 and the light-emitting devices 10 of the wiring substrate 310 are disposed on the same side. The separating member 320 includes a top 321 arranged in a grid pattern when viewed from above, wall portions 322 surrounding each light-emitting device 10 when viewed from above, and a bottom 323 connected to the lower end of the wall portions 322, having a region surrounding multiple light-emitting devices 10. For example, the wall portions 322 of the separating member 320 are stretched from the top 321 toward the wiring substrate 310 side, and in a cross-sectional view, the width of the region surrounded by the opposing wall portions 322 becomes narrower toward the wiring substrate 310 side. The light-emitting devices 10 are disposed in a through hole provided approximately in the center of the bottom 323. The separating member 320 is preferably a light-reflective member.

[0165] The area (i.e., region and space) enclosed by the wall portion 322 is defined as one partition 300C, and the partition member 320 has multiple partitions 300C. In this embodiment, one partition 300C is provided with one light-emitting device 10. However, one partition 300C may be provided with two or more light-emitting devices 10. In this case, for example, one partition 300C may be provided with three light-emitting devices 10 of red, green and blue. Alternatively, one partition 300C may be provided with two light-emitting devices 10 of daylight color and bulb color.

[0166] In this way, by arranging a separating member 320 having a wall portion 322 and a bottom portion 323 surrounding each light-emitting device 10 on the wiring board 310, light from the light-emitting device 10 can be reflected by the wall portion 322 and the bottom portion 323, thereby improving the light extraction efficiency. In addition, it is possible to suppress brightness unevenness in each separation 300C, and further suppress brightness unevenness in the units of the group of separation 300C.

[0167] The planar light source 300 may have an optical component 330 above the top 321 of the separating member 320. The optical component 330 may include at least one selected from the group consisting of a light diffuser 331, prism sheets (first prism sheet 332 and second prism sheet 333), and a polarizer 334. Due to having the optical component 330, the planar light source 300 can improve the uniformity of light.

[0168] The planar light source 300 has an optical component 330 disposed above the top 321 of the separating member 320, and a liquid crystal panel disposed thereon, enabling it to be used as a light source for a directly downward type backlight. The stacking order of the components in the optical component 330 can be arbitrarily set. In addition, the optical component 330 may not be in contact with the top 321 of the separating member 320.

[0169] (Light diffusion plate 331)

[0170] The light diffuser plate 331 is in contact with the top 321 of the separating member 320 and is disposed above the light-emitting device 10. The light diffuser plate 331 is preferably a flat plate-shaped member, but its surface may be provided with irregularities. The light diffuser plate 331 is preferably disposed substantially parallel to the wiring substrate 310.

[0171] The light diffuser plate 331 can be made of materials that absorb less visible light, such as polycarbonate resin, polystyrene resin, acrylic resin, or polyethylene resin. To diffuse the incident light, the light diffuser plate 331 can have irregularities on its surface, or materials with different refractive indices can be dispersed within it. The irregularities can be, for example, set to a size of 0.01 mm to 0.1 mm. Materials with different refractive indices can be selected from, for example, polycarbonate resin or acrylic resin.

[0172] The thickness and degree of light diffusion of the light diffusion plate 331 can be appropriately set, and it can be used as a commercially available component such as a light diffusion sheet or diffusion film. For example, the thickness of the light diffusion plate 331 can be set to 1 mm to 2 mm.

[0173] (First prism 332 and second prism 333)

[0174] The first prism sheet 332 and the second prism sheet 333 have a shape on their surfaces in which multiple prisms extending in a predetermined direction are arranged. For example, the first prism sheet 332 allows for two-dimensional viewing of the plane of the sheet along the X direction and the Y direction perpendicular to the X direction, and has multiple prisms extending in the Y direction, while the second prism sheet 333 can have multiple prisms extending in the X direction. The first prism sheet 332 and the second prism sheet 333 can refract light incident from various directions in a direction toward the display panel opposite the planar light source 300. As a result, the light emitted from the emitting surface of the planar light source 300 is mainly emitted in a direction perpendicular to the surface, which can improve the brightness of the planar light source 300 when viewed from the front.

[0175] (Polarizing film 334)

[0176] The polarizer 334, for example, can selectively transmit light with a polarization direction consistent with that of a polarizer disposed on the backlight side of a display panel such as a liquid crystal display panel, and reflect light polarized in a direction perpendicular to that polarization direction toward the first prism sheet 332 and the second prism sheet 333. A portion of the polarized light returning from the polarizer 334 is reflected again by the first prism sheet 332, the second prism sheet 333, and the light diffuser 331. At this time, the polarization direction changes, for example, it is converted to the polarization direction of the polarizer having the liquid crystal display panel, and then incident on the polarizer 334 again and exits onto the display panel. Thus, the polarization direction of the light emitted from the planar light source 300 can be aligned, and light with a polarization direction that is effective for improving the brightness of the display panel can be emitted with high efficiency. The polarizer 334, the first prism sheet 332, the second prism sheet 333, etc., can be commercially available products used as optical components for backlights.

[0177] For example, the planar light source 300 can be fabricated by mounting a separating member 320 and a light-emitting device 10 on a wiring board 310, and mounting an optical member 330 on the separating member 320 as needed.

[0178] Figure 44 A partial cross-sectional view (2) is shown to illustrate a specific example of a planar light source having multiple light-emitting devices arranged in a matrix on a wiring board.

[0179] Figure 44 The planar light source 400 shown includes: a light-emitting device 10, a wiring board 410 on which the light-emitting device 10 is disposed, a light guide plate 420 for guiding light emitted from the light-emitting device 10, a light-reflective resin member 430 located above the light-emitting device 10, and a light-reflective adhesive member 440 located below the light-emitting device 10. Alternatively, any of the light-emitting devices 10A to 10G can be used instead of the light-emitting device 10.

[0180] The wiring substrate 410 has an insulating substrate 411 and wiring 412 disposed on the substrate 411, and may have an insulating resin 413 covering a portion of the wiring 412 as needed. A light reflective sheet 480, an adhesive member 440, and a light guide plate 420 are sequentially stacked on the substrate 411 of the wiring substrate 410. A bonding member 490 penetrates the substrate 411, the light reflective sheet 480, and the adhesive member 440 of the wiring substrate 410, and electrically connects the electrodes of the light-emitting device 10 to the wiring 412.

[0181] The light guide plate 420 has a first main surface 420a and a second main surface 420b opposite to the first main surface 420a. The first main surface 420a of the light guide plate 420 is in contact with the adhesive member 440. The second main surface 420b side of the light guide plate 420 is the light-emitting surface of the planar light source 400.

[0182] The light guide plate 420 is provided with through holes 420x extending from the first main surface 420a to the second main surface 420b. For example, when viewed from above, the through holes 420x are arranged in a grid pattern, and the planar light source 400 is divided into multiple light-emitting regions 400C arranged in a two-dimensional manner through the grid-like through holes 420x. A resin 425, such as silicone resin, containing a light-diffusing material, is disposed in the through holes 420x. Alternatively, instead of the through holes 420x extending from the first main surface 420a to the second main surface 420b, the light guide plate 420 may have grid-like grooves opening towards the second main surface 420b.

[0183] Each light-emitting region 400C is provided with a through hole 450, such as a circle, extending from the first main surface 420a to the second main surface 420b, and a light-emitting device 10 is disposed within the through hole 450. Furthermore, a light-transmitting member 470 covering the top and side surfaces of the light-emitting device 10 is disposed within the through hole 450. The top surface of the light-transmitting member 470 is, for example, on the same plane as the second main surface 420b of the light guide plate 420. On the second main surface 420b side of the light-emitting device 10, a resin member 430 is disposed at a position overlapping with the light-emitting device 10 when viewed from above. Specifically, the resin member 430 is disposed within the through hole 450 on the light-transmitting member 470 covering the light-emitting device 10. The resin member 430 can be disposed by extending from the light-transmitting member 470 onto the second main surface 420b of the light guide plate 420.

[0184] A portion of the light emitted from the light-emitting device 10 propagates into the light guide plate 420 and incident on the resin member 430. The resin member 430 is, for example, a light-reflective material such as a resin material with dispersed light-reflective fillers, thus enabling a portion of the light emitted from the light-emitting device 10 to be reflected to the first main surface 420a side of the light guide plate 420. That is, by arranging the resin member 430 above the light-emitting device 10, light emitted above the light-emitting device 10 can be moderately transmitted while being diffused downwards and laterally. As a result, the brightness on the second main surface 420b of the light guide plate 420, directly above the light-emitting device 10, can be suppressed from being extremely high compared to other areas.

[0185] For example, the planar light source 400 can be manufactured by placing a light guide plate 420 on a wiring substrate 410, placing a light-emitting device 10 in a through hole 450 of the light guide plate 420, arranging a light-transmitting member 470 covering the light-emitting device 10 in the through hole 450, and arranging a resin member 430 on the light-transmitting member 470.

[0186] Figure 45 A partial cross-sectional view (3) is shown to illustrate a specific example of a planar light source having multiple light-emitting devices arranged in a matrix on a wiring board.

[0187] Figure 45 The planar light source 500 shown includes a light-emitting device 10, a wiring board 510 on which the light-emitting device 10 is disposed, a light guide plate 520 for guiding the light emitted from the light-emitting device 10, and a light-reflective member 540 located below the light guide plate 520. Alternatively, any of the light-emitting devices 10A to 10G can be used instead of the light-emitting device 10.

[0188] The wiring substrate 510 has an insulating substrate 511 and wiring 512 disposed on the substrate 511, and may have an insulating resin 513 covering a portion of the wiring 512 as needed. A wiring 530 electrically connected to the electrodes of the light-emitting device 10 is disposed on the substrate 511 of the wiring substrate 510 via an adhesive layer 580. A through-hole 570 penetrates the adhesive layer 580 and the substrate 511 of the wiring substrate 510, electrically connecting the wiring 530 and the wiring 512. The periphery of the through-hole 570 is protected by a protective member 590.

[0189] The light guide plate 520 has a first main surface 520a and a second main surface 520b opposite to the first main surface 520a. The first main surface 520a may have a concave-convex structure. The first main surface 520a of the light guide plate 520 is in contact with the member 540. The second main surface 520b side of the light guide plate 520 is the light-emitting surface of the planar light source 500. The planar light source 500 is divided into multiple light-emitting regions 500C.

[0190] In the light guide plate 520, each light-emitting area 500C has a recess 560 that opens toward the second main surface 520b. The recess 560 may be, for example, an inverted cone, an inverted rectangular cone, an inverted hexagonal pyramid, or an inverted frustum of a cone or an inverted frustum of a polygon, or a recess that opens toward the second main surface 520b. The recess 560 is positioned to overlap with the light-emitting device 10 disposed on the wiring substrate 510 when viewed from above. Preferably, the center of the recess 560 is aligned with the optical axis of the light-emitting device 10 when viewed from above.

[0191] The component 540 reflects the light emitted from the light-emitting device 10. One component 540 may be provided relative to the entire planar light source 500. That is, the component 540 may be continuously arranged across adjacent light-emitting areas 500C.

[0192] A portion of the light emitted from the light-emitting device 10 propagates into the light guide plate 520 and is incident on the recess 560. The recess 560, at the interface between the light guide plate 520 and a material with a different refractive index (e.g., air), reflects the light incident on the light-emitting device 10 to the side. That is, by arranging the recess 560 above the light-emitting device 10, light emitted above the light-emitting device 10 can be moderately transmitted while being diffused downwards and laterally. As a result, the brightness directly above the light-emitting device 10 on the second main surface 520b of the light guide plate 520 can be suppressed from being extremely high compared to other areas. Furthermore, a light-reflective component (e.g., a reflective film of metal or white resin) can be disposed within the recess 560.

[0193] For example, the planar light source 500 can be manufactured by placing the light-emitting device 10 on the light guide plate 520, configuring the component 540 covering the first main surface 520a of the light guide plate 520, and then attaching it to the wiring substrate 510.

[0194] Figures 43-45 The example illustrates a planar light source having multiple light-emitting devices arranged in a matrix on a wiring board. Figure 46 The example illustrates a light-emitting module having multiple light-emitting devices arranged in a matrix. Furthermore, in this application, among light sources having multiple light-emitting devices arranged in a matrix, the case with a wiring board is referred to as a planar light source, and the case without a wiring board is referred to as a light-emitting module. Moreover, by arranging multiple light-emitting modules one-dimensionally or two-dimensionally on a single wiring board, a planar light source can be realized.

[0195] Figure 46 This is a partial cross-sectional view showing a specific example of a light-emitting module having multiple light-emitting devices arranged in a matrix.

[0196] Figure 46 The illustrated light-emitting module 600 includes: a light-emitting device 10, a light guide plate 620 for guiding light emitted from the light-emitting device 10, a light-reflective resin member 630 located above the light-emitting device 10, and a light-reflective adhesive member 640 located below the light-emitting device 10. Alternatively, any of the light-emitting devices 10A to 10G can be used instead of the light-emitting device 10.

[0197] The light guide plate 620 has a first main surface 620a and a second main surface 620b opposite to the first main surface 620a. The first main surface 620a of the light guide plate 620 is in contact with the adhesive member 640. The second main surface 620b of the light guide plate 620 is the light-emitting surface of the light-emitting module 600.

[0198] The light-emitting module 600 is divided into multiple light-emitting regions 600C. In the light guide plate 620, each light-emitting region 600C is provided with a first recess 650 opening towards the first main surface 620a and a second recess 660 opening towards the second main surface 620b. The first recess 650 and the second recess 660 are positioned to overlap when viewed from above. Preferably, the overlapping positions of the first recess 650 and the second recess 660 when viewed from above are located at their respective centers. When viewed from above, the size of the second recess 660 can be larger than the size of the first recess 650.

[0199] Light-emitting devices 10 are disposed in each of the first recesses 650 on the side of the first main surface 620a of the light guide plate 620. A light-transmitting member 670 covering the light-emitting device 10 may be disposed in the first recess 650. When the light-transmitting member 670 covering the light source is disposed in the first recess 650, the adhesive member 640 may cover part or all of the light-transmitting member 670.

[0200] Each of the second recesses 660 of the light guide plate 620 located on the side of the second main surface 620b is equipped with a resin member 630. For example, the second recess 660 may have an upper recess 661 located on the side of the planar portion near the second main surface 620b in cross-section, and a lower recess 662 located on the side of the first main surface 620a closer to the upper recess 661, with a different inclination angle than the side of the upper recess 661 in cross-section. In this case, the resin member 630 may be disposed in the lower recess 662, for example.

[0201] The adhesive member 640 reflects the light emitted from the light-emitting device 10. In this embodiment, as an example, the adhesive member 640 includes a base 641 and a continuous wall portion 642 surrounding the base 641. The base 641 is a portion of the planar portion disposed around the first recess 650 in the first main surface 620a of the light guide plate 620. The wall portion 642 is a portion of the concave portion disposed around the planar portion in the first main surface 620a of the light guide plate 620.

[0202] The wall portion 642, for example, rises from the first main surface 620a side of the light guide plate 620 toward the second main surface 620b side. The wall portion 642 has an inclined surface 643 that surrounds the light-emitting device 10 when viewed from above. An adhesive member 640 may be provided only once relative to the entire light-emitting module 600. That is, the adhesive member 640 may be continuously arranged across adjacent light-emitting areas 600C.

[0203] The light guide plate 620 may have a curved surface portion 620c, either entirely or partially curved, in its cross-sectional view. The curved surface portion 620c, for example, is disposed in a region extending from near the first recess 650 of each light-emitting region 600C of the first main surface 620a to its periphery. By configuring the adhesive member 640 on the first main surface 620a, light incident at a shallow angle relative to the first main surface 620a is reflected in the curved surface portion 620c to the second main surface 620b side, thereby improving light extraction efficiency.

[0204] A portion of the light emitted from the light-emitting device 10 propagates into the light guide plate 620 and incident on the resin member 630. The resin member 630 is, for example, a light-reflective material such as a resin material with dispersed light-reflective fillers, thus enabling a portion of the light emitted from the light-emitting device 10 to be reflected to the first main surface 620a side of the light guide plate 620. That is, by arranging the resin member 630 above the light-emitting device 10, light emitted above the light-emitting device 10 can be moderately transmitted while being diffused downwards and laterally. As a result, the brightness of the area directly above the light-emitting device 10 on the second main surface 620b of the light guide plate 620, which is extremely high compared to other areas, can be suppressed.

[0205] For example, the light-emitting module 600 can be manufactured by placing the light-emitting device 10 on the light guide plate 620, providing an adhesive member 640 covering the first main surface 620a of the light guide plate 620, and disposing a resin member 630 in the second recess 660 of the second main surface of the light guide plate 620.

[0206] In addition, Figures 44-46 In the planar light source or light-emitting module shown, the material used as the light guide plate can include thermoplastic resins such as acrylic resins, polycarbonate resins, cyclic polyolefin resins, polyethylene terephthalate resins, and polyester resins, as well as thermosetting resins such as epoxy resins and silicone resins, and light-transmitting materials such as glass. Furthermore, the light-reflective component can be a light-reflective material such as a resin material with dispersed light-reflective fillers. Examples of base materials for the resin materials constituting the light-reflective components include silicone resins, phenolic resins, epoxy resins, BT resins, and polyphthalamide (PPA). As the light-reflective filler, metal particles, or particles of inorganic or organic materials with a higher refractive index than the base material, can be used.

[0207] <Fifth Embodiment>

[0208] In the fifth embodiment, an example of a liquid crystal display device (LCD) using a planar light source 300 as the backlight source is shown. Furthermore, in the fifth embodiment, descriptions of the same components as in the previously described embodiments are sometimes omitted.

[0209] Figure 47A configuration diagram of the liquid crystal display device according to the fifth embodiment is shown as an example. Figure 47 As shown, the liquid crystal display device 1000 includes, from top to bottom, a liquid crystal panel 720, an optical sheet 710, and a surface light source 300. Furthermore, the optical components 330 of the surface light source 300 may include a DBEF (reflective polarizer), a BEF (brightness enhancer), a color filter, etc.

[0210] The liquid crystal display device 1000 is a so-called directly-below type liquid crystal display device in which a planar light source 300 is stacked below the liquid crystal panel 720. The liquid crystal display device 1000 illuminates the liquid crystal panel 720 with light emitted from the planar light source 300.

[0211] Generally, in downward-facing liquid crystal display devices, due to the close proximity of the liquid crystal panel and the surface light source, there are concerns that uneven color and brightness of the surface light source may negatively impact the overall color and brightness uniformity of the liquid crystal display device. Therefore, for downward-facing liquid crystal display devices, a surface light source with minimal color and brightness unevenness is desirable. By using a surface light source 300 in the liquid crystal display device 1000, it is possible to reduce the thickness of the surface light source 300 to less than 5mm, 3mm, or 1mm, while simultaneously suppressing peripheral darkening and reducing brightness and color unevenness.

[0212] Thus, the planar light source 300 is suitable for use as the backlight of the liquid crystal display device 1000. Alternatively, the planar light source 400, planar light source 500, light-emitting module 600, or a planar light source including multiple light-emitting modules 600 can be used as the backlight of the liquid crystal display device 1000 instead of the planar light source 300.

[0213] However, it is not limited to this; the planar light source 300 and the like can also be used as backlights for televisions, tablets, smartphones, smartwatches, head-up displays, digital signage, bulletin boards, etc. In addition, the planar light source 300 and the like can also be used as lighting sources, as well as emergency lights, linear lighting, or various other lighting applications, and for vehicle dashboards, etc.

[0214] The preferred embodiments have been described in detail above, but are not limited to the above embodiments. Various modifications and substitutions can be made to the above embodiments without departing from the scope of the claims.

[0215] Explanation of symbols

[0216] 10, 10A~10G Light-emitting devices

[0217] 11, 11G base

[0218] 11a First Main Face

[0219] 11b Second Main Face

[0220] 11c Central Department

[0221] 11d end

[0222] 12 Fluorescent frames

[0223] 12a Inner surface

[0224] 12b Outer surface

[0225] 12c end face

[0226] 12G, 12S fluorophores

[0227] 13 Translucent components

[0228] 13a recess

[0229] 14 Light-emitting elements

[0230] 14a Light-emitting surface

[0231] 14b Electrode forming surface

[0232] 14c Side View

[0233] 14t electrode

[0234] 15 Adhesive components

[0235] 15A First Adhesive Component

[0236] 15B Second Adhesive Component

[0237] 16 Light-reflecting components

[0238] 17 convex part

[0239] 18 Light-reflecting layer

[0240] 100-layer stack

[0241] 110, 110G Component 1

[0242] 100G composite components

[0243] 200, 200A, 300, 400, 500 planar light sources

[0244] 210, 310, 410, 510 wiring boards

[0245] 300C distinction

[0246] 311, 411, 511 substrates

[0247] 312, 412, 512, 530 wiring

[0248] 313, 413, 513 insulating resins

[0249] 320 Distinguishing Components

[0250] 321 Top

[0251] 322 Wall section

[0252] 323 Bottom

[0253] 330 Optical Components

[0254] 331 Light Diffuser Plate

[0255] 332 First Prism Lens

[0256] 333 Second Prism Lens

[0257] 334 polarizing film

[0258] 400C, 500C, 600C luminous areas

[0259] 420, 520, 620 light guide plates

[0260] 420a, 520a, 620a 1st main surface

[0261] 420b, 520b, 620b Second Main Face

[0262] 420x, 450 through holes

[0263] 425 resin

[0264] 430 and 630 resin components

[0265] 440 and 640 adhesive components

[0266] 470 and 670 light-transmitting components

[0267] 480 light reflective sheet

[0268] 490 Jointing Components

[0269] 540 components

[0270] 560 recess

[0271] 570 through hole

[0272] 580 adhesive layer

[0273] 590 Protective components

[0274] 600 LED Module

[0275] 620c curved section

[0276] 650 1st recess

[0277] 660 2nd recess

[0278] 641 Base

[0279] 642 Wall section

[0280] 643 Inclined Surface

[0281] 710 Optical Film

[0282] 720 LCD panel

[0283] 900, 900A, 900B Upper Mold

[0284] 901, 901A, 901B, 902, 902A, 902B, 903 convex part

[0285] 905A gap section

[0286] 910 Lower mold

[0287] 950, 960 scrapers

[0288] 1000 LCD display device

Claims

1. A method for manufacturing a light-emitting device, comprising the following steps: a process of preparing a first member having a base; a plurality of phosphor frames on the base, the plurality of phosphor frames including a first phosphor frame and a second phosphor frame adjacent to the first phosphor frame; And a light-transmitting component, a portion of which is disposed between the first phosphor frame and the second phosphor frame; A first light-emitting element is disposed in a first phosphor frame, and a second light-emitting element is disposed in a second phosphor frame, wherein: Each of the first and second light-emitting elements has a light-emitting surface and an electrode forming surface opposite to the light-emitting surface. Each of the first and second light-emitting elements includes an electrode located on its electrode forming surface, and Each of the first and second light-emitting elements is arranged such that its light-emitting surface faces the base; as well as The process of cutting off the portion of the light-transmitting component disposed between the first phosphor frame and the second phosphor frame.

2. The method for manufacturing the light-emitting device according to claim 1, After the step of placing the first light-emitting element and the second light-emitting element inside the first phosphor frame and the second phosphor frame, the following steps are included: A light-reflective component is disposed on the electrode forming surface side of the light-emitting element.

3. The method for manufacturing the light-emitting device according to claim 1, comprising the following steps: A light-reflective member is disposed on the electrode forming surface side of the first and second light-emitting elements to cover the electrodes located on the electrode forming surface. After the process of configuring the light-reflective component, the first component is covered on the light-reflective component in such a way that the light-emitting surface faces the base side and the light-emitting element is configured inside the phosphor frame.

4. The method for manufacturing the light-emitting device according to claim 2, The process of configuring the light-reflective component includes the following steps: configuring the light-reflective component on the electrode forming surface side of the light-emitting element in such a way as to cover the electrode provided on the electrode forming surface, and removing the light-reflective component until the electrode is exposed.

5. The method for manufacturing the light-emitting device according to any one of claims 1 to 4, The process of preparing the first component includes the following steps: preparing a laminate on which the light-transmitting component is stacked on a phosphor layer, and deforming the laminate to form the first component having the base containing the phosphor and the phosphor frame.

6. The method for manufacturing the light-emitting device according to any one of claims 1 to 4, The process of preparing the first component includes the following steps: attaching the composite component, on which the light-transmitting component is disposed on the outer side of the phosphor frame, to the base.

7. The method for manufacturing the light-emitting device according to claim 6, The base comprises at least one of a phosphor layer, a light-transmitting layer, or a light-reflecting layer.

8. A method for manufacturing a light-emitting device according to any one of claims 1 to 4, comprising the following steps: A light-reflecting layer is disposed on the surface opposite to the side of the phosphor frame disposed on the base.

9. A light-emitting device, comprising: Base; A phosphor frame located on the inner side compared to the lower end of the base; A light-emitting element disposed in a region surrounded by the phosphor frame, wherein the light-emitting element has a light-emitting surface and an electrode forming surface having a pair of electrodes on the opposite side of the light-emitting surface; A light-transmitting member covering the lower end of the base and the outer surface of the phosphor frame; as well as A light-reflective member covers the area of ​​the electrode forming surface other than the area where the electrode is formed, and the light-transmitting member located around the electrode forming surface, wherein: The lower part of the phosphor frame facing the light-reflecting component is spaced apart from the upper part of the light-reflecting component; and The light-transmitting component is positioned between the lower part of the phosphor frame and the upper part of the light-reflecting component.

10. The light-emitting device according to claim 9, The base contains a phosphor and is integrally framed with the phosphor.

11. The light-emitting device according to claim 9, The base is a phosphor layer, a light-transmitting layer, or a light-reflecting layer. The phosphor frame is attached to the underside of the base.

12. The light-emitting device according to any one of claims 9 to 11, A light-reflective component is disposed on the top of the base.

13. The light-emitting device according to any one of claims 9 to 11, The outer surface of the phosphor frame has a protrusion, which is integral with the phosphor frame and the base.

14. A planar light source, which is formed by arranging the light-emitting devices according to any one of claims 9 to 13 in one or two dimensions.

15. A liquid crystal display device that uses the planar light source of claim 14 as a backlight source.

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