A headphone module

Abstract

The embodiment of the present invention discloses an earphone module, including a shell and a sound conduction component arranged in the shell, the sound conduction component includes a speaker unit, a moving iron unit and a microphone unit arranged in the same plane, and the three are electrically connected through a flexible circuit board. Among them, the shell includes a speaker sound channel and a moving iron sound channel, the speaker sound channel is formed as a channel extending tortuously with one end facing the speaker unit and the other end facing the outside of the shell to filter the high-frequency signal transmitted by the speaker unit, and the moving iron sound channel is formed as a through hole with a position corresponding to the moving iron unit to conduct the high-frequency signal transmitted by the moving iron unit to the outside. Therefore, the technical solution of the embodiment of the present invention can achieve physical frequency division through the setting of the sound channel, thereby optimizing the listening experience.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of microphones, and in particular to an earphone module. Background Art

[0002] Traditional earphones are mostly single-unit earphones, and the single dynamic unit in the unit earphone cannot effectively take into account the performance of low frequency and mid-high frequency, and can no longer meet the audience's demand for sound quality. Therefore, multi-unit earphones are gradually becoming popular. In the prior art, multi-unit earphones are mainly dual dynamic unit earphones, but their structure is complex and the integration is poor, so they are difficult to assemble, and they require additional acoustic design, which leads to high costs. Summary of the invention

[0003] In view of this, an embodiment of the present invention provides an earphone module with good integration, compact structure and simple process.

[0004] The earphone module of the embodiment of the present invention comprises:

[0005] a housing; and

[0006] A sound conduction component is arranged inside the housing, the sound conduction component includes a speaker unit, a moving iron unit and a microphone unit, the speaker unit, the moving iron unit and the microphone unit are arranged on the same plane and are electrically connected to each other through a flexible circuit board;

[0007] Wherein, the housing includes a speaker sound channel and a moving iron sound channel;

[0008] The speaker sound channel is formed as a channel extending in a zigzag manner with one end facing the speaker unit and the other end facing the outside of the housing, so as to filter the high-frequency signal transmitted by the speaker unit;

[0009] The moving iron acoustic channel is formed as a through hole located corresponding to the moving iron unit to conduct the high frequency signal transmitted by the moving iron unit to the outside.

[0010] Optionally, the speaker unit is formed as a rectangular block;

[0011] The moving iron unit and the microphone unit are arranged on both sides of the speaker unit.

[0012] Optionally, the speaker unit and the microphone unit have a certain angle in the horizontal direction.

[0013] Optionally, the flexible circuit board is formed into a bent shape to surround the speaker unit.

[0014] Optionally, the flexible circuit board has first fixing parts on both sides of the moving iron unit and on both sides of the microphone unit.

[0015] Optionally, the earphone module includes a bracket, the bracket has a second fixing portion corresponding to the first fixing portion, and the first fixing portion and the second fixing portion are combined and configured to fix the position of the flexible circuit board.

[0016] Optionally, the flexible circuit board includes a supporting portion, and the supporting portion is configured to support the moving iron unit and the microphone unit.

[0017] Optionally, the bracket has a mounting hole for mounting the sound conduction component.

[0018] Optionally, the plane on which the sound conduction component is arranged is flush with a side of the bracket having the mounting hole.

[0019] Optionally, a side of the shell having the speaker sound channel and the moving iron sound channel is opposite to a side of the bracket having the mounting hole.

[0020] The earphone module of the embodiment of the present invention includes a shell and an acoustic conduction component arranged in the shell, and the acoustic conduction component includes a speaker unit, a moving iron unit and a microphone unit arranged in the same plane, and the three are electrically connected through a flexible circuit board. Among them, the shell includes a speaker sound channel and a moving iron sound channel. The speaker sound channel is formed as a channel that extends tortuously with one end facing the speaker unit and the other end facing the outside of the shell to filter the high-frequency signal transmitted by the speaker unit. The moving iron sound channel is formed as a through hole whose position corresponds to the moving iron unit to conduct the high-frequency signal transmitted by the moving iron unit to the outside. Therefore, the technical solution of the embodiment of the present invention can achieve physical frequency division through the setting of the sound channel, thereby optimizing the listening experience, meeting the user's demand for earphone sound quality, and can simplify the assembly process of the earphone and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other objects, features and advantages of the embodiments of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0022] Figure 1 is a schematic diagram of the three-dimensional structure of an earphone module according to an embodiment of the present invention;

[0023] Figure 2 is an exploded schematic diagram of an earphone module according to an embodiment of the present invention;

[0024] Figure 3 are a top view and a bottom view of the internal structure of the earphone module according to an embodiment of the present invention;

[0025] Figure 4 is a cross-sectional view of the earphone module along the AA plane according to an embodiment of the present invention;

[0026] Figure 5 is a cross-sectional view of the earphone module along the BB plane according to an embodiment of the present invention;

[0027] Figure 6 is an exploded schematic diagram of a sound conduction component of an earphone module according to an embodiment of the present invention;

[0028] Figure 7 is a schematic diagram of a flexible circuit board of an earphone module according to an embodiment of the present invention;

[0029] Figure 8 is a schematic diagram of a bracket of an earphone module according to an embodiment of the present invention from another perspective;

[0030] Description of reference numerals:

[0031] 1-housing; 11-speaker sound channel; 12-moving iron sound channel; 2-sound conduction component; 21-speaker unit; 22-moving iron unit; 23-microphone unit; 3-flexible circuit board; 31-first fixing part; 32-supporting part; 33-cantilever; 4-bracket; 41-second fixing part; 42-mounting hole;

[0032] Plane where the sound conduction components are located -I. DETAILED DESCRIPTION

[0033] The present invention is described below based on embodiments, but the present invention is not limited to these embodiments. In the detailed description of the present invention below, some specific details are described in detail. It is possible for a person skilled in the art to fully understand the present invention without the description of these details. In order to avoid confusing the essence of the present invention, known methods, processes, flows, components and circuits are not described in detail.

[0034] In addition, persons of ordinary skill in the art will appreciate that the drawings provided herein are for illustration purposes and are not necessarily drawn to scale.

[0035] Unless the context clearly requires otherwise, the words "include", "comprising" and similar words throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, the meaning is "including but not limited to".

[0036] In the description of the present invention, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0037] Unless otherwise clearly defined and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0039] Figure 1 It is a schematic diagram of the three-dimensional structure of the earphone module according to an embodiment of the present invention. Figure 2 Schematic diagram of an exploded view of an earphone module according to an embodiment of the present invention. Figure 3 1 is a top view and a bottom view of the internal structure of the earphone module according to an embodiment of the present invention. Figure 1 , Figure 2 as well as Figure 3 As shown, the earphone module includes a housing 1 and an acoustic conduction component 2. The acoustic conduction component 2 is arranged inside the housing 1, and includes a speaker unit 21, a moving iron unit 22, and a microphone unit 23, which are arranged on the same plane I and are electrically connected to each other through a flexible circuit board 3. That is to say, in order to realize the integration of the earphone module, arranging the acoustic conduction component 2 on the same plane I can realize a simple and compact structure and reduce unnecessary support structures.

[0040] In this embodiment, the housing 1 is formed in a circular shape, the speaker unit 21 is formed in a rectangular block shape, and the moving iron unit 22 and the microphone unit 23 are arranged on both sides of the speaker unit 21, that is, arranged in the gap between the speaker unit 21 and the housing 1. Among them, the speaker unit 21 formed in a rectangular shape can achieve the same performance as a larger circular speaker when an optimized diaphragm such as a composite material diaphragm is used. Therefore, in this embodiment, the rectangular speaker unit 21 can ensure a better sound propagation effect while having a smaller volume, thereby improving the compactness of the internal structure of the earphone module and realizing the integration of the sound conduction component 2.

[0041] Further, the microphone unit 23 is configured to collect the ambient noise signal inside the earphone, and the speaker unit 21 is configured to play the anti-phase signal of the noise signal according to the noise signal to realize the noise reduction function of the earphone module. In the traditional design, the microphone unit 23 and the speaker unit 21 often adopt a structure perpendicular to each other, so it is necessary to design the sound output channel of the microphone unit 23 separately, resulting in the complexity of the earphone module structure. In the present embodiment, the speaker unit 21 and the microphone unit 23 are located in the same plane I and are placed parallel to each other. While realizing the noise reduction effect, the earphone module structure is simpler and the production difficulty can be reduced. Optionally, the speaker unit 21 and the microphone unit 23 can have other positional relationships, for example, having a certain angle in the horizontal direction, and the same noise reduction effect can also be achieved.

[0042] Figure 4 It is a cross-sectional view of the earphone module along the AA plane according to an embodiment of the present invention. Figure 5 FIG. 2 is a cross-sectional view of the earphone module along the BB plane according to an embodiment of the present invention. Figure 4 as well as Figure 5 As shown, the housing 1 includes a speaker sound channel 11 and a moving iron sound channel 12. The speaker sound channel 11 is formed as a channel extending in a zigzag manner with one end toward the speaker unit 21 and the other end toward the outside of the housing 1, and the moving iron sound channel 12 is formed as a through hole corresponding to the moving iron unit 22. Both the speaker sound channel 11 and the moving iron sound channel 12 can achieve the effect of physical frequency division.

[0043] In this embodiment, the speaker unit 21 is used as a medium and low frequency unit, and the speaker sound channel 11 is formed as a channel extending inside the housing 1, and two bends occur in the process from the speaker unit 21 to the outside of the housing 1. Among them, the diameter of the speaker sound channel 11 is small, and the narrow and tortuous structure can filter out the high-frequency components in the sound signal. This function is realized by the Helmholtz resonance principle, which refers to a phenomenon in which air resonates in a cavity, that is, by setting parameters such as the diameter and length of the resonance cavity to adjust the resonance wavelength in the cavity, thereby forming a sound absorption effect and filtering out sound signals of specific wavelengths. Compared with the method of using circuit elements for frequency division, this method can reduce the phase distortion caused by problems such as the properties of the components in the circuit, and further optimize the sense of hearing. That is to say, in this embodiment, the speaker sound channel 11 is formed into a resonance cavity corresponding to the resonance wavelength by setting a specific shape, thereby filtering out the high-frequency signal in the sound signal and realizing physical frequency division. Optionally, the resonance cavity formed by the speaker sound channel 11 can be adjusted to adapt to the performance requirements of the headphone module.

[0044] In this embodiment, the moving iron unit 22 serves as a high-frequency unit, and the moving iron sound channel 12 is formed as a straight-extending through hole corresponding to the moving iron unit 22. Moreover, the moving iron sound channel 12 has a large diameter, which can enable the high-frequency sound signal to propagate outward with minimal loss, thereby protecting the high-frequency signal.

[0045] The design of the sound channel enables the earphone module to have an effective acoustic structure, so it can be directly applied to the earphone, which can simplify the assembly process of the earphone, improve the efficiency and yield of the earphone assembly, and enable the user to avoid other acoustic designs on the earphone shell in the subsequent production process, so as to avoid the leakage of sound signals in the sound cavity of the earphone shell. In this embodiment, the shell 1 is divided into an upper shell and a lower shell, wherein the upper shell has a speaker sound channel 11 and a moving iron sound channel 12, forming an integrated sound cavity, and the lower shell has a sealing effect. Optionally, the lower shell can be formed into a plate with a vent, and a sealing mesh is attached to the inside to achieve a sealing effect.

[0046] Furthermore, the earphone module also includes a bracket 4. The bracket 4 has a mounting hole 42 for mounting the sound conduction component 2. The plane I on which the sound conduction component 2 is arranged is flush with the side of the bracket 4 having the mounting hole 42. In addition, the side of the housing 1 having the speaker sound channel 11 and the moving iron sound channel 12 is opposite to the side of the bracket 4 having the mounting hole 42. That is to say, the sound conduction component 2 is arranged in the mounting hole 42 and faces the housing 1 having the speaker sound channel 11 and the moving iron sound channel 12. It should be understood that the propagation of sound has a direction, so the sound signal of the sound conduction component 2 is propagated toward the side it faces. When the sound conduction component 2 faces the side of the housing 1 having the speaker sound channel 11 and the moving iron sound channel 12 and is exposed from the mounting hole 42, the speaker sound channel 11 and the moving iron sound channel 12 can receive the sound signal propagated by them to the maximum extent, thereby ensuring the propagation effect of the sound signal. In addition, the plane I on which the sound conduction component 2 is arranged is parallel to a side of the bracket 4 having the mounting hole 42, so that the sound conduction component 2 is not blocked by the bracket 4, and the sound signal can be directly transmitted outward from the mounting hole 42 without loss due to collision, thereby making the earphone module have better sound quality.

[0047] In this embodiment, the housing 1 has an upper shell and a lower shell, the bracket 4 is located between the upper shell and the lower shell, and a mounting hole 42 is provided on a side facing the upper shell. The bracket 4 can be directly connected to the upper shell and the lower shell of the housing 1 by setting corresponding structures at the edges. The sound conduction component 2 can be fixed in the mounting hole 42 by silicone. In other words, the bracket 4 and the housing 1 produce a sealing effect through the corresponding structure at the edge to prevent the sound signal from leaking from the edge of the housing 1. The sound conduction component 2 produces a sealing effect with the bracket 4 through the silicone seal, so that the sound is completely transmitted to the upper shell of the housing 1. Optionally, the connection method between the bracket 4 and the housing 1 can be changed, and the bracket 4 can also have other structures, for example, it is formed as a support plate located inside the housing 1, and is fixed to the inner wall of the housing 1 using materials such as silicone to achieve a sealing effect. Optionally, the sound conduction component 2 can also be fixed in the mounting hole 42 by other materials that can achieve a sealing effect, and this application is not limited here.

[0048] Figure 6 Schematic diagram of an explosion of the sound conduction component of the earphone module according to an embodiment of the present invention. Figure 7 FIG. 1 is a schematic diagram of a flexible circuit board of an earphone module according to an embodiment of the present invention. Figure 6 as well as Figure 7 As shown, the flexible circuit board 3 is formed into a bent shape to surround the speaker unit 21. The flexible circuit board 3 has first fixing portions 31 on both sides of the moving iron unit 22 and both sides of the microphone unit 23.

[0049] Figure 8 FIG. 2 is a schematic diagram of a bracket of an earphone module according to an embodiment of the present invention from another perspective. Figure 8 As shown, the bracket 4 has a second fixing portion 41 corresponding to the first fixing portion 31 , and the first fixing portion 31 and the second fixing portion 41 are combined to fix the position of the flexible circuit board 3 .

[0050] Furthermore, the flexible circuit board 3 includes a supporting portion 32, which is configured to support the moving iron unit 22 and the microphone unit 23. Since sound is generated by vibration, the speaker unit 21 will generate certain vibrations when transmitting sound signals, which may cause the moving iron unit 22 and the microphone unit 23 to vibrate together, thereby affecting the effect of sound signal transmission. The base material of the flexible circuit board 3 has a good bending degree and can produce a certain elastic deformation. Therefore, the supporting portion 32 for supporting the moving iron unit 22 and the microphone unit 23 is set at the position corresponding to the flexible circuit board 3, so that the two can be elastically suspended in the housing 1, so as to avoid the vibration of the speaker unit 21 from affecting the moving iron unit 22 and the microphone unit 23, thereby effectively improving the reliability of the product and the life of the components.

[0051] That is, the flexible circuit board 3 is fixed to the bracket 4 at the first fixing portion 31 through the second fixing portion 41, and the supporting portion 32 located between the two first fixing portions 31 is approximately in a free state, supporting the moving iron unit 22 and the microphone unit 23 to offset the vibration caused by the speaker unit 21. Optionally, this suspension structure can be implemented by other structures, for example, fixing the moving iron unit 22 and the microphone unit 23 to the bracket 4 by a soft rubber with a certain elasticity can also have the effect of offsetting vibration, and this application is not limited here.

[0052] Further, the flexible circuit board 3 also includes a cantilever 33, and the cantilever 33 is located between the first fixed portion 31 and the supporting portion 32, so that the supporting portion 32 forms a suspension effect. In this embodiment, the four cantilevers 33 are all formed into a zigzag shape similar to a wave. When the moving iron unit 22 and the microphone unit 23 vibrate, a telescopic deformation can be generated between the first fixed portion 31 and the supporting portion 32, thereby achieving a shock-absorbing effect and enhancing the reliability of the system. Optionally, the shape of the cantilever 33 can be changed, for example, a diamond-shaped connection structure can also generate a telescopic deformation during vibration. The four cantilevers 33 can also be formed into different shapes from each other. For example, the cantilevers 33 on both sides of the moving iron unit 22 and the cantilevers 33 on both sides of the microphone unit 23 can adopt an asymmetric structure, which can also achieve the effect of reducing vibration.

[0053] In summary, the earphone module can be used as a product alone, or can be used inside an earphone product as an earphone component and electrically connected to other components, or can be used in other electronic devices.

[0054] The embodiment of the present invention discloses an earphone module, including a shell and a sound conduction component arranged in the shell, the sound conduction component includes a speaker unit, a moving iron unit and a microphone unit arranged in the same plane, and the three are electrically connected through a flexible circuit board. Among them, the shell includes a speaker sound channel and a moving iron sound channel, the speaker sound channel is formed as a channel extending tortuously with one end facing the speaker unit and the other end facing the outside of the shell to filter the high-frequency signal transmitted by the speaker unit, and the moving iron sound channel is formed as a through hole with a position corresponding to the moving iron unit to conduct the high-frequency signal transmitted by the moving iron unit to the outside. Therefore, the technical solution of the embodiment of the present invention can achieve physical frequency division through the setting of the sound channel, thereby optimizing the listening experience.

[0055] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An earphone module, characterized in that: include: Housing (1); as well as A sound conduction component (2) is arranged inside the housing (1), the sound conduction component (2) comprising a speaker unit (21), a moving iron unit (22) and a microphone unit (23), the speaker unit (21), the moving iron unit (22) and the microphone unit (23) being arranged on the same plane and electrically connected to each other via a flexible circuit board (3); Wherein, the housing (1) comprises a speaker sound channel (11) and a moving iron sound channel (12); The speaker sound channel (11) is formed as a channel extending in a zigzag manner with one end facing the speaker unit (21) and the other end facing the outside of the housing (1), so as to filter high-frequency signals transmitted by the speaker unit (21); The moving iron sound channel (12) is formed as a through hole whose position corresponds to the moving iron unit (22) so as to conduct the high-frequency signal transmitted by the moving iron unit (22) outwardly; The speaker sound channel (11) comprises a first section, a second section and a third section in sequence in the extension direction, the first section extends parallel to the third section and is connected through the second section, the first section is perpendicular to the second section and one end of the first section faces the speaker unit (21), and the first section, the second section and the third section form a resonance cavity for filtering high-frequency signals; The moving iron sound channel (12) extends in a straight line with one end facing the moving iron unit (22), and the diameter of the moving iron sound channel (12) is greater than the diameter of the speaker sound channel (11).

2. The earphone module according to claim 1, characterized in that: The speaker unit (21) is formed as a rectangular block; The moving iron unit (22) and the microphone unit (23) are arranged on both sides of the speaker unit (21).

3. The earphone module according to claim 1, characterized in that: The loudspeaker unit (21) and the microphone unit (23) have a certain angle in the horizontal direction.

4. The earphone module according to claim 2, characterized in that: The flexible circuit board (3) is formed into a bent shape to surround the speaker unit (21).

5. The earphone module according to claim 4, characterized in that: The flexible circuit board (3) has first fixing parts (31) on both sides of the moving iron unit (22) and on both sides of the microphone unit (23).

6. The earphone module according to claim 5, characterized in that: The earphone module comprises a bracket (4), wherein the bracket (4) has a second fixing portion (41) corresponding to the first fixing portion (31), and the first fixing portion (31) and the second fixing portion (41) are combined and configured to fix the position of the flexible circuit board (3).

7. The earphone module according to claim 6, characterized in that: The flexible circuit board (3) comprises a supporting portion (32), and the supporting portion (32) is configured to support the moving iron unit (22) and the microphone unit (23).

8. The earphone module according to claim 6, characterized in that: The bracket (4) has a mounting hole (42) for mounting the sound conducting component (2).

9. The earphone module according to claim 8, characterized in that: The plane on which the sound conducting component (2) is arranged is flush with a side of the bracket (4) having the mounting hole (42).

10. The earphone module according to claim 8, characterized in that: The housing (1) has a side having the speaker sound channel (11) and the moving iron sound channel (12) opposite to a side of the bracket (4) having the mounting hole (42).

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