Packaging structure and method for forming packaging structure

Abstract

This invention relates to encapsulation structures and methods for forming encapsulation structures. This disclosure provides an encapsulation structure comprising: a substrate; a device disposed on the substrate; a cover disposed above and spaced apart from the device; and a first metal component disposed between the device and the cover, wherein the first metal component contacts the device and the cover. This disclosure also provides a method for forming the encapsulation structure.

Description

TECHNICAL FIELD

[0001] Embodiments of the present invention relate to packaging structures and methods of forming packaging structures. BACKGROUND

[0002] Semiconductor devices are typically encapsulated using a molding material and can then be mounted on a substrate of a circuit system including, for example, a printed circuit board (PCB). After encapsulating the semiconductor device, some parameters related to the semiconductor device inside the molding material are difficult to control. Conventional manufacturing methods fail to accurately control the parameters because these methods inevitably accumulate deviations or tolerances of components in the packaging structure. The derived parameters are often incorrect or not precise enough.

[0003] Therefore, there is a constant need to modify the packaging structure and the manufacturing method for controlling the parameters inside the packaging structure. SUMMARY

[0004] According to embodiments of the present invention, a packaging structure includes a substrate, a device placed on the substrate, a cap placed over the substrate and spaced apart from the device, and a first metal component placed between the device and the cap, wherein the first metal component contacts the device and the cap.

[0005] According to embodiments of the present invention, a packaging structure includes a substrate, a first device placed on the substrate, a second device placed on the first device, a cap placed over the substrate and spaced apart from the first device and the second device, and a first metal component placed between the first device and the cap, wherein the first metal component contacts the cap.

[0006] According to embodiments of the present invention, a method includes providing a substrate and a device placed on the substrate, placing a first metal component on the device, placing a cap over the substrate and the device to contact the first metal component, and deriving a distance based on a first height of the first metal component. BRIEF DESCRIPTION OF DRAWINGS

[0007] The aspects of the disclosure, both as to organization and method of operation, can best be understood by reference to the following detailed description, taken in conjunction with the accompanying drawings in which like reference numerals refer to like parts, and in which: Figure One Aspects of the present disclosure are best understood from the following detailed description taken in conjunction with the accompanying drawings. It is emphasized that, according to the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features can be arbitrarily increased or decreased for clarity of discussion.

[0008] Figures 1 to 4 FIG. 1 is a schematic cross-sectional side view showing different packaging structures according to various embodiments of the present disclosure.

[0009] Figure 5 FIG. 2 is a schematic cross-sectional side view showing different packaging structures according to some embodiments of the present disclosure.Figure 4 a top view of a package structure in

[0010] Figures 6 to 17 are schematic cross-sectional side views showing different package structures according to various embodiments of the disclosure.

[0011] Figure 18 are schematic cross-sectional side views showing different package structures according to various embodiments of the disclosure. Figure 17 a top view of a package structure in

[0012] Figures 19 to 24 are schematic cross-sectional side views showing different package structures according to various embodiments of the disclosure.

[0013] Figure 25 is a flowchart illustrating a method of manufacturing a package structure in Figure 1

[0014] Figures 26A to 26D are schematic cross-sectional side views showing successive fabrication stages of a package structure in Figure 1

[0015] Figure 27 is a flowchart illustrating a method of manufacturing a package structure in Figure 4

[0016] Figures 28A to 28D are schematic cross-sectional side views showing successive fabrication stages of a package structure in Figure 4

[0017] Figure 29 is a flowchart illustrating a method of manufacturing a package structure in Figure 8

[0018] Figures 30A to 30E are schematic cross-sectional side views showing successive fabrication stages of a package structure in Figure 8

[0019] Figure 31 is a flowchart illustrating a method of manufacturing a package structure in Figure 9

[0020] Figures 32A to 32E are schematic cross-sectional side views showing successive fabrication stages of a package structure in Figure 9 DETAILED DESCRIPTION

[0021] ​​​​​​​​The following disclosure provides many different embodiments, or examples, for implementing different characteristics of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, in the following description, a first feature forms over or on a second feature can include embodiments in which the first feature is formed directly on the second feature and can also include embodiments in which additional features can be formed between the first and second features such that the first and second features are not in direct contact. In some embodiments, the present disclosure can repeat use of reference numerals in various instances in the specification and / or drawings. This repetition of reference numerals is for the purpose of simplifying the present disclosure and does not itself dictate a relationship between the various embodiments and / or configurations discussed.

[0022] Also for ease of explanation, spatially relative terms such as "below," "lower," "bottom," "above," "upper," and the like, can be used herein for describing an element's or feature's relationship to another element or feature as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in some embodiments in which the device can be oriented in different directions (rotated by 90 degrees or at other orientations) and the spatially relative descriptors used herein can be interpreted accordingly.

[0023] Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Moreover, as used herein, the terms "substantially," "about," or "approximately" generally mean values or ranges within 10% of a value or range given, or within 5% of a value or range given, or within 1% of a value or range given. Alternatively, the terms "substantially," "about," or "approximately" mean within an acceptable standard error of the mean when considered in light of the number of tests performed and the statistical significance of the test results. Those skilled in the art will appreciate that the values of the present disclosure can vary depending on the specific technical requirements and / or testing methodologies employed. All numerical ranges expressed in the disclosure herein, whether discrete or continuous, encompass every value from the lower limit to the upper limit of that range, including and / or excluding specific integer values within the range, unless the context clearly indicates otherwise. All such ranges are intended to be inherently disclosed herein. All references are incorporated herein by reference.

[0024] For some devices that are surrounded by a molding material to form a package structure, it is necessary to leave a space between the device and the molding material. For example, an optical device including a lens module needs a gap in order to accommodate a proper focal length from the lens to an image sensor such as a CMOS image sensor (CIS) or a charge-coupled device (CCD).

[0025] Controlling the gap size (e.g., gap width or gap volume) between the inside of a package structure is important. For example, in some applications, it is necessary to precisely control the gap size for considerations such as air flow resistance or heat dissipation of a device inside the package structure. In some embodiments, the gap size affects the flexibility of a device when the device is subjected to external impact or mechanical force. Thus, the gap size is generally related to the durability of a device, particularly an optical device, inside the package structure. In particular, the gap size is critical to the performance of such an optical device.

[0026] However, it is difficult to measure the gap size once a device is packaged. Moreover, it is not easy to precisely control the gap size. For a package structure using an epoxy or a ceramic as a molding material, the gap size is controlled by the dimensions (e.g., thickness or height) of the device and the molding material. Although the gap size can be determined directly by observing the difference between the dimensions of the device and a portion of the molding material, it is difficult to obtain the precision of the gap size.

[0027] Figure 1 is a schematic cross-sectional side view showing a package structure P10 according to some embodiments of the present disclosure. The package structure P10 includes a molding member 100 and a device 110 inside the molding member 100. In some embodiments, the molding member 100 is made of, but not limited to, an epoxy or a ceramic such as a low temperature co-fired (LTCC) ceramic or a high temperature co-fired (HTCC) ceramic.

[0028] In some embodiments, the device 110 includes an active component or a passive component, such as but not limited to a complementary metal-oxide-semiconductor (CMOS), a micro-electro-mechanical system (MEMS), a stack of CMOS and MEMS, a resistor, a capacitor, an inductor, an image sensor, a motion sensor, a microphone, a speaker, a motion stabilizer, and the like.

[0029] In some embodiments, the molded component 100 includes a base 102, a sidewall 104, and a cover 106. A device 110 is placed on the base 102 and is surrounded by the sidewall 104. In some embodiments, the device 110 has a top surface SI facing the cover 106 and a bottom surface S2 facing the base 102. In some embodiments, the bottom surface S2 contacts the base 102. In some embodiments, a plurality of electrical conductors (not shown) are placed on or within the base 102 to provide electrical connections to the device 110. In some embodiments, the cover 106 is placed over the base 102 and away from the device 110 and the cover 106 is bonded to the base 102 by the sidewall 104.

[0030] Still referring to Figure 1 In some embodiments, the base 102, the sidewall 104, and the cover 106 are separable, such that the molded component 100 can be divided into multiple parts. In such embodiments, a sealant (not shown) is placed at the junctions between the base 102 and the sidewall 104 and between the sidewall 104 and the cover 106. In other embodiments, the base 102, the sidewall 104, and the cover 106 are monolithic, such that the molded component 100 is a single-piece structure that encloses the device 110.

[0031] In some embodiments, the device 110 has a thickness Dl. In some embodiments, the sidewall 104 has a height D2. In some embodiments, the height D2 is substantially greater than the thickness Dl. In such embodiments, the cover 106 is spaced apart from the device 110 by a gap 120. In some embodiments, the distance between the top surface SI of the device 110 and an interior surface II of the cover 106 facing the top surface SI is defined as a gap width G1. In some embodiments, the gap width G1 is between about 5 micrometers (pm) and about 500 pm.

[0032] Still referring to Figure 1In some embodiments, a first metallic component 130A is placed between the device 110 and the lid 106. The first metallic component 130A is placed on the device 110 and contacts both the device 110 and the lid 106. In some embodiments, the first metallic component 130A contacts the top surface SI and the inner surface II. In some embodiments, the first metallic component 130A can be separate from the device 110 and the lid 106. In some embodiments, the first metallic component 130A can have any suitable configuration. For example, the first metallic component 130A can be a wire, a post, a rod, a bump, a post stack, or a bump stack. In some embodiments, the width of the first metallic component 130A decreases towards the lid 106 when the first metallic component 130A is attached to the device 110. In some embodiments, the first metallic component 130A tapers from the device 110 towards the lid 106. In some embodiments, the first metallic component 130A has a first height HI, where the gap width Gl is substantially equal to the first height HI, i.e., Gl = HI.

[0033] Figure 2 is a schematic cross-sectional side view showing a package structure Pll according to some embodiments of the present disclosure. The package structure Pll is similar to the package structure P10 in Figure 1 except that the package structure Pll further includes a first interconnect structure 140 embedded in the lid 106. The first interconnect structure 140 can be, for example, a leadframe. In some embodiments, the surface of the first interconnect structure 140 is coplanar with the inner surface II of the lid 106. In some embodiments, the first metallic component 130A is placed on the first interconnect structure 140 within the lid 106. In such embodiments, the first metallic component 130A is pressed against the device 110 and contacts both the first interconnect structure 140 and the device 110. In some embodiments, the width of the first metallic component 130A decreases towards the device 110 when the first metallic component 130A is attached to the lid 106. In some embodiments, the first metallic component 130A tapers from the first interconnect structure 140 towards the device 110.

[0034] Figure 3 is a schematic cross-sectional side view showing a package structure P12 according to some embodiments of the present disclosure. The package structure P12 is similar to the package structure Pll in Figure 1The package structure P10 in FIG. 1 1 is similar to the package structure P10 in FIG. 1 0, except that the package structure P12 further includes a second interconnect structure 150 mounted on the interior surface I1 of the cap 106. In some embodiments, the second interconnect structure 150 protrudes from the interior surface I1 of the cap 106. The second interconnect structure 150 can be, for example, a pin or an electrode. In some embodiments, the first metal component 130A is placed on the second interconnect structure 150 on the cap 106. In such embodiments, the first metal component 130A is pressed against the device 1 10 and contacts both the second interconnect structure 150 and the device 1 10. In some embodiments, the second interconnect structure 150 has a thickness E1, and the gap width G1 is substantially equal to the sum of the first height H1 and the thickness E1, i.e., G1 = H1 + E1.

[0035] Figure 4 FIG. 1 1 is a schematic cross-sectional side view showing a package structure P13 in accordance with some embodiments of the present disclosure. The package structure P13 is similar to the package structure P10 in FIG. 1 0, except that the package structure P13 further includes a second metal component 130B. In some embodiments, the second height H2 of the second metal component 130B is different from the first height H1 of the first metal component 130A. For example, the second height H2 is substantially greater than the first height H1. In such embodiments, the first metal component 130A placed on the device 1 10 does not contact the cap 106. In some embodiments, the second metal component 130B is in a different configuration than the first metal component 130A. For example, the first metal component 130A is a stud and the second metal component 130B is a wire, as shown in FIG. 1 1. In other embodiments, the second metal component 130B is in the same configuration as the first metal component 130A. For example, the first metal component 130A is a stud and the second metal component 130B is a stud stack. In some embodiments, the second metal component 130B stands upright on the device 1 10. Figure 1 Figure 4

[0036] ​​In some embodiments, a second metal component 130B is disposed between the device 110 and the cover 106. The second metal component 130B is placed on the device 110 and contacts both the device 110 and the cover 106. In some embodiments, the second metal component 130B contacts the top surface S1 and the inner surface I1. In some embodiments, the second metal component 130B is separable from both the device 110 and the cover 106. In some embodiments, the gap width G1 is substantially equal to the second height H2, i.e., G1 = H2. In some embodiments, the distance between the top surface of the first metal component 130A and the inner surface I1 of the cover 106 facing the device 110 is defined as the gap width G2. In some embodiments, the second height H2 is equal to the sum of the gap width G2 and the first height H1. In such embodiments, the gap width G2 is substantially equal to the difference between the second height H2 and the first height H1, i.e., G2 = H2 – H1.

[0037] Figure 5 According to some embodiments disclosed herein Figure 4 The image shows a top perspective view of the encapsulation structure P13. A first metal component 130A and a second metal component 130B are positioned between the device 110 and the cover 106, but are concealed beneath the cover 106 in the top view. In some embodiments, the first metal component 130A and the second metal component 130B may be located on any portion of the device 110. In some embodiments, the first metal component 130A is positioned on the central portion of the device 110, and the second metal component 130B is positioned on the peripheral portion of the device 110. In some embodiments, the cross-sections of the first metal component 130A and the second metal component 130B may be of various shapes, such as circular, triangular, rectangular, square, or similar.

[0038] Figure 6 This is a schematic cross-sectional side view illustrating a package structure P14 according to some embodiments of the present disclosure. Package structure P14 is similar to... Figure 4 The encapsulation structure P13, in addition to the encapsulation structure P14, further includes a first interconnect structure 140. In some embodiments, a second metal component 130B is placed on the first interconnect structure 140 within the cover 106, while the first metal component 130A is placed on the device 110. In such embodiments, the second metal component 130B presses against the device 110 and contacts both the first interconnect structure 140 and the device 110.

[0039] Figure 7 This is a schematic cross-sectional side view illustrating a package structure P15 according to some embodiments of the present disclosure. Package structure P15 is similar to... Figure 4The package structure P13 in FIG. 1C is similar to the package structure P12 in FIG. 1B, except that the package structure P13 further includes a second interconnect structure 150. In some embodiments, the second metal component 130B is placed on the second interconnect structure 150 on the lid 106, and the first metal component 130A is placed on the device 110. In such embodiments, the second metal component 130B is pressed against the device 110 and contacts both the second interconnect structure 150 and the device 110. In some embodiments, the sum of the thickness E1 and the second height H2 is equal to the sum of the gap width G2 and the first height H1. In such embodiments, the gap width G2 is substantially equal to the sum of the thickness E1 and the second height H2 minus the first height H1, i.e., G2 = E1 + H2 - H1.

[0040] Figure 8 FIG. 1D is a schematic cross-sectional side view showing a package structure P16 in accordance with some embodiments of the present disclosure. The package structure P16 is similar to the package structure P14 in FIG. 1C, except that the package structure P16 includes a plurality of first interconnect structures 140 embedded in the lid 106. In some embodiments, the first metal component 130A and the second metal component 130B are placed on one of the first interconnect structures 140 within the lid 106, respectively. In such embodiments, the first metal component 130A attached to the lid 106 does not contact the device 110. In some embodiments, a distance between a top surface of the first metal component 130A and a top surface S1 of the device 110 is defined as a gap width G3. In some embodiments, the second height H2 is equal to the sum of the gap width G3 and the first height H1. In such embodiments, the gap width G3 is substantially equal to a difference between the second height H2 and the first height H1, i.e., G3 = H2 - H1. Figure 6

[0041] Figure 9 FIG. 1E is a schematic cross-sectional side view showing a package structure P17 in accordance with some embodiments of the present disclosure. The package structure P17 is similar to the package structure P15 in FIG. 1C, except that the package structure P17 includes a plurality of second interconnect structures 150 mounted on the inner surface I1 of the lid 106. In some embodiments, the first metal component 130A and the second metal component 130B are placed on one of the second interconnect structures 150 on the lid 106, respectively. In such embodiments, the first metal component 130A attached to the lid 106 does not contact the device 110. In some embodiments, the gap width G3 is substantially equal to a difference between the second height H2 and the first height H1, i.e., G3 = H2 - H1. Figure 7

[0042] Figure 10 FIG. 1F is a schematic cross-sectional side view showing a package structure P18 in accordance with some embodiments of the present disclosure. The package structure P18 is similar to the package structure P17 in FIG. 1E, except that the package structure P18 includes a plurality of second interconnect structures 150 mounted on the inner surface I1 of the lid 106. In some embodiments, the first metal component 130A and the second metal component 130B are placed on one of the second interconnect structures 150 on the lid 106, respectively. In such embodiments, the first metal component 130A attached to the lid 106 does not contact the device 110. In some embodiments, the gap width G3 is substantially equal to a difference between the second height H2 and the first height H1, i.e., G3 = H2 - H1. Figure 4 ​​The encapsulation structure P13, except for encapsulation structure P18, includes an adjacent first metal component 130A placed on device 110 and an adjacent second metal component 130B placed between device 110 and cover 106. In some embodiments, all second metal components 130B contact both device 110 and cover 106.

[0043] The arrangement of the first metal component 130A and the second metal component 130B is not limited. In some embodiments, all first metal components 130A are placed on the central region of the device 110 and all second metal components 130B are placed on the peripheral region of the device 110, such as... Figure 10 As shown in the illustration. In other embodiments, the first metal component 130A and the second metal component 130B are arranged alternately. In some embodiments, a filler material 160 is placed between the proximal first metal components 130A and between the proximal second metal components 130B. In some embodiments, the filler material 160 may be placed to surround the first metal component 130A or the second metal component 130B in any of the encapsulation structures P10 to P18. In some embodiments, the filler material 160 is made of, but is not limited to, a polymer such as epoxy resin or an inorganic compound such as silica, or a combination of polymers and inorganic compounds. In some embodiments, the filler material 160 may reinforce the attachment of the first metal components 130A and the second metal components 130B to the device 110.

[0044] Figure 11 This is a schematic cross-sectional side view illustrating a package structure P20 according to some embodiments of the present disclosure. The package structure P20 includes a molded component 200, a first device 210, and a second device 212, wherein the first device 210 and the second device 212 are inside the molded component 200. In some embodiments, the molded component 200 is made of the same material as the molded component 100. In some embodiments, the first device 210 and the second device 212 include electrical components similar to those in device 110. In some embodiments, the molded component 200 includes a base 202, a sidewall 204, and a cover 206. The first device 210 is placed on the base 202, and the second device 212 is placed on the first device 210.

[0045] In some embodiments, the second device 212 has a top surface F1 facing the cover 206 and the first device 210 has a bottom surface F2 facing the base 202. In some embodiments, the bottom surface F2 contacts the base 202. In some embodiments, a plurality of electrical conductors (not shown) are placed on or within the base 202 to provide electrical connections to the first device 210 and the second device 212. In some embodiments, the cover 206 is placed above the base 202 and away from the first device 210 and the second device 212. The cover 206 is joined with the base 202 by the sidewall 204, where both the first device 210 and the second device 212 are surrounded by the sidewall 204.

[0046] Still referring to Figure 11 In some embodiments, the base 202, the sidewall 204, and the cover 206 are separable, such that the molded part 200 can be divided into multiple parts. In such embodiments, a sealant (not shown) is placed at the junction between the base 202 and the sidewall 204 and between the sidewall 204 and the cover 206. In other embodiments, the base 202, the sidewall 204, and the cover 206 are monolithic, such that the molded part 200 is a single piece structure that encloses the first device 210 and the second device 212.

[0047] In some embodiments, the first device 110 has a first thickness T1, the second device 212 has a second thickness T2, and the sidewall 204 has a height T3, where the height T3 is substantially greater than the sum of the first thickness T1 and the second thickness T2. In such embodiments, the cover 206 is spaced apart from the second device 212 by a gap 220. In some embodiments, the distance between the top surface F1 of the second device 212 and an interior surface I2 of the cover 206 facing the top surface F1 is defined as a gap width C1. In some embodiments, the gap width C1 is between about 5 pm and about 500 pm.

[0048] Still referring to Figure 11 In some embodiments, a first metal component 230A is placed between the second device 212 and the cover 206. The first metal component 230A is placed on the second device 212 and contacts both the second device 212 and the cover 206. In some embodiments, the first metal component 230A can be separable from the second device 212 and the cover 206. In some embodiments, the first metal component 230A can have any convenient configuration. For example, the first metal component 230A can be a wire, a post, a rod, a bump, a post stack, or a bump stack. In some embodiments, the width of the first metal component 230A decreases toward the cover 206 when the first metal component 230A is attached to the second device 212. In some embodiments, the first metal component 230A has a first height L1, where the gap width C1 is substantially equal to the first height L1, i.e., C1 = L1.

[0049] Figure 12 is a schematic cross-sectional side view showing a package structure P21 in accordance with some embodiments of the present disclosure. Package structure P21 is similar to package structure P20 in Figure 11 , except that package structure P21 further includes a first interconnect structure 240 embedded in lid 206. First interconnect structure 240 can be, for example, a lead frame. In some embodiments, a surface of first interconnect structure 240 is coplanar with interior surface I2 of lid 206. In some embodiments, first metal component 230A is placed on first interconnect structure 240 within lid 206. In such embodiments, first metal component 230A is pressed against second device 212 and contacts both first interconnect structure 240 and second device 212. In some embodiments, a width of first metal component 230A decreases toward second device 212 when first metal component 230A is attached to lid 206.

[0050] Figure 13 is a schematic cross-sectional side view showing a package structure P22 in accordance with some embodiments of the present disclosure. Package structure P13 is similar to package structure P20 in Figure 11 , except that package structure P22 further includes a second interconnect structure 250 mounted on interior surface I2 of lid 206. Second interconnect structure 250 can be, for example, a pin or an electrode. In some embodiments, first metal component 230A is placed on second interconnect structure 250 on lid 206. In such embodiments, first metal component 230A is pressed against second device 212 and contacts both second interconnect structure 250 and second device 212. In some embodiments, second interconnect structure 250 has a controlled thickness E2 and gap width CI is substantially equal to a sum of first height LI and thickness E2, i.e., CI = LI + E2.

[0051] Figure 14 and 15 is a schematic cross-sectional side view showing package structures P23 and P24 in accordance with some embodiments of the present disclosure. Package structures P23, P24 are similar to package structure P20 in Figure 11 , except that first metal component 230A is placed on first device 210. In some embodiments, first metal component 230A contacts both first device 210 and lid 206. In such embodiments, first metal component 230A is a bump stack, as shown in Figure 14 . In some embodiments, first metal component 230A is a wire, as shown in Figure 15The first metal component 230A is a stud and the second metal component 230B is a stud stack, as shown in FIG. 2B. In some embodiments, the second metal component 230B is in a different configuration than the first metal component 230A. As shown in FIG. 2C, the first metal component 230A is a stud and the second metal component 230B is a wire, in some embodiments, the second metal component 230B is placed between the first device 210 and the lid 206. The second metal component 230B is placed on the first device 210 and contacts both the first device 210 and the lid 206. In some embodiments, the second metal component 230B can be separate from the first device 210 and the lid 206. In some embodiments, a second height L2 of the second metal component 230B is different from a first height LI of the first metal component 230A. For example, the second height L2 is substantially greater than the first height LI, as shown in FIG. 2D. In such embodiments, the first metal component 230A placed on the second device 212 does not contact the lid 206. In some embodiments, a distance between a top surface of the first metal component 230A and an inner surface I2 of the lid 206 facing the second device 212 is defined as a gap width C2. In some embodiments, the second height L2 is equal to a sum of the gap width C2, the first height LI, and a second thickness T2. In such embodiments, the gap width C2 is substantially equal to the second height L2 minus the first height LI and minus the second thickness T2, i.e., C2 = L2 - LI - T2.

[0052] Figure 16 and 17 are schematic cross-sectional side views showing package structures P25 and P26 according to some embodiments of the present disclosure. The package structures P25, P26 are similar to the package structure P20 in Figure 11 , except that the package structure P25 or the package structure P26 further includes a second metal component 230B. In some embodiments, the second metal component 230B is in the same configuration as the first metal component 230A. As shown in Figure 16 , the first metal component 230A is a stud and the second metal component 230B is a stud stack. In other embodiments, the second metal component 230B is in a different configuration than the first metal component 230A. As shown in Figure 17 , the first metal component 230A is a stud and the second metal component 230B is a wire. In some embodiments, the second metal component 230B is placed between the first device 210 and the lid 206. The second metal component 230B is placed on the first device 210 and contacts both the first device 210 and the lid 206. In some embodiments, the second metal component 230B can be separate from the first device 210 and the lid 206. In some embodiments, a second height L2 of the second metal component 230B is different from a first height LI of the first metal component 230A. For example, the second height L2 is substantially greater than the first height LI, as shown in Figure 16 , the first metal component 230A is a stud and the second metal component 230B is a stud stack. In other embodiments, the second metal component 230B is in a different configuration than the first metal component 230A. As shown in

[0053] Figure 18 are schematic cross-sectional side views showing package structures P25 and P26 according to some embodiments of the present disclosure. The package structures P25, P26 are similar to the package structure P20 in Figure 17is a top perspective view of a package structure P26. The first metal component 230A is placed between the second device 212 and the lid 206 and the second metal component 230B is placed between the first device 210 and the lid 206. The first device 210, the second device 212, and the first metal component 230A and the second metal component 230B are obscured in the top view underneath the lid 206. In some embodiments, the first metal component 230A and the second metal component 230B can be located on any portion of the device 110. In some embodiments, the first metal component 230A is placed on a central portion of the second device 212 and the second metal component 230B is placed on a peripheral portion of the first device 210. In some embodiments, the top cross-section of the first metal component 230A and the second metal component 230B can be various shapes, such as circular, triangular, rectangular, square, or the like, respectively.

[0054] Figure 19 is a schematic cross-sectional side view showing a package structure P27 according to some embodiments of the present disclosure. The package structure P27 is similar to the package structure P26 in Figure 17 , except that the package structure P27 further includes a first interconnect structure 240. In some embodiments, the second metal component 230B is placed on the first interconnect structure 240 within the lid 206 and the first metal component 230A is placed on the second device 212. In such embodiments, the second metal component 230B is pressed against the first device 210 and contacts both the first interconnect structure 240 and the first device 210.

[0055] Figure 20 is a schematic cross-sectional side view of a package structure P28 according to some embodiments of the present disclosure. The package structure P28 is similar to the package structure P26 in Figure 17 , except that the package structure P28 further includes a second interconnect structure 250. In some embodiments, the second metal component 230B is placed on the second interconnect structure 250 on the lid 206 and the first metal component 230A is placed on the second device 212. In such embodiments, the second metal component 230B is pressed against the first device 210 and contacts both the second interconnect structure 250 and the first device 210. In some embodiments, the sum of the thickness E2 and the second height L2 is equal to the sum of the gap width C2, the first height LI, and the second thickness T2. In such embodiments, the gap width C2 is substantially equal to the sum of the thickness E2 and the second height L2 minus the first height LI and minus the second thickness T2, i.e., C2 = E2 + L2 - LI - T2.

[0056] Figure 21 is a schematic cross-sectional side view showing a package structure P29 according to some embodiments of the present disclosure. The package structure P29 is similar to the package structure P27 in Figure 19The encapsulation structure P27, except for encapsulation structure P29, includes a plurality of first interconnect structures 240 embedded in the cover 206. In some embodiments, a first metal component 230A and a second metal component 230B are respectively placed on one of the first interconnect structures 240 within the cover 206. In such embodiments, the first metal component 230A attached to the cover 206 does not contact the second device 212. In some embodiments, the distance between the top surface of the first metal component 230A and the top surface F1 of the second device 212 is defined as the gap width C3. In some embodiments, the second height L2 is equal to the sum of the gap width C3 and the first height L1. In such embodiments, the gap width C3 is substantially equal to the difference between the second height L2 and the first height L1, i.e., C3 = L2 – L1.

[0057] Figure 22 This is a schematic cross-sectional side view illustrating a package structure P30 according to some embodiments of the present disclosure. The package structure P30 is similar to... Figure 20 The encapsulation structure P28, except that encapsulation structure P30 includes a plurality of second interconnect structures 250 mounted on the inner surface I2 of the cover 206. In some embodiments, a first metal component 230A and a second metal component 230B are respectively placed on one of the second interconnect structures 250 on the cover 206. In such embodiments, the first metal component 230A attached to the cover 206 does not contact the second device 212. In some embodiments, the gap width C3 is substantially equal to the difference between the second height L2 and the first height L1, i.e., C3 = L2 – L1.

[0058] Figure 23 This is a schematic cross-sectional side view illustrating a package structure P31 according to some embodiments of the present disclosure. Package structure P31 is similar to... Figure 17In the encapsulation structure P26, except that the first metal component 230A in the encapsulation structure P31 is a wire connecting the first device 210 and the second device 212. In some embodiments, one end of the first metal component 230A is placed on the first device 210 and the other end of the first metal component 230A is placed on the second device 212. In some embodiments, the first metal component 230A is U-shaped. In such embodiments, the first height L1 refers to the distance between the topmost and bottommost portions of the first metal component 230A. In some embodiments, the distance between the top surface of the first metal component 230A and the inner surface I2 of the cover 206 facing the second device 212 is defined as the gap width C2. In some embodiments, the first metal component 230A is spaced apart from the cover 206 by the gap width C2. In some embodiments, the second height L2 is equal to the sum of the gap width C2 and the first height L1. In such embodiments, the gap width C2 is substantially equal to the second height L2 minus the first height L1, that is, C2 = L2 – L1.

[0059] Figure 24 This is a schematic cross-sectional side view illustrating a package structure P32 according to some embodiments of the present disclosure. Package structure P32 is similar to... Figure 23 The encapsulation structure P31 includes a filler material 260 placed on the first metal component 230A. In some embodiments, the filler material 260 may be made of the same material as the filler material 160. In some embodiments, the filler material 260 is placed between the first metal component 230A and the second device 212. In other embodiments, the filler material 260 may be placed between the first metal component 230A and the first device 210. In some embodiments, the filler material 260 may reinforce the attachment of the first metal component 230A to the first device 210 or the second device 212.

[0060] Figure 25 This is a flowchart illustrating a method 200 for manufacturing a packaging structure according to some embodiments of the present disclosure. Figures 26A to 26D This is a diagram illustrating some embodiments according to the present disclosure. Figure 1 A schematic cross-sectional side view of the continuous fabrication stage of the packaging structure P10 in the diagram.

[0061] In operation S201, a substrate 102 is provided and the device 110 is placed on the substrate 102, such as Figure 26A As shown in the figure. In some embodiments, the substrate 102 is made of, but not limited to, epoxy resin or ceramic. In some embodiments, the device 110 includes active or passive components, such as, but not limited to, CMOS, MEMS, stacks of CMOS and MEMS, resistors, capacitors, inductors, image sensors, motion sensors, microphones, speakers, motion stabilizers, etc.

[0062] In operation S203, the first metal component 130A is placed on the device 110, as shown in Figure 26B some embodiments. In some embodiments, the method of placing the first metal component 130A on the device 110 includes, but is not limited to, wire bonding. In some embodiments, the first metal component 130A is placed by placing a stud on the device 110, elongating a wire from the stud, bonding the wire to the device 110, and cutting the wire to remove the wire from the stud. Thus, the stud remains on the device 110. In some embodiments, the first metal component 130A can have any suitable configuration. For example, the first metal component 130A can be a wire, a stud, a rod, a bump, a stud stack, or a bump stack. In some embodiments, the first metal component 130A can be located on any portion of the device 110. In some embodiments, the first metal component 130A is placed on a central portion of the device 110.

[0063] In operation S205, the cap 106 is provided in conjunction with the sidewall 104, as shown in Figure 26C some embodiments. In some embodiments, the cap 106 is separable from the sidewall 104 and a sealant (not shown) is placed at the junction between the cap 106 and the sidewall 104. In some embodiments, the cap 106 and the sidewall 104 are made of the same material as the substrate 102.

[0064] In operation S207, the cap 106 is attached to the substrate 102 via the sidewall 104, as shown in Figure 26D some embodiments. In some embodiments, a sealant is placed at the junction between the sidewall 104 and the substrate 102 and the cap 106 is bonded to the substrate 102. In some embodiments, the cap 106 is placed over the substrate 102, the device 110, and the first metal component 130A. In some embodiments, the cap 106 contacts the first metal component 130A placed on the device 110. Thus, the package structure P10 in Figure 1 some embodiments is substantially formed. In some embodiments, the height of the sidewall 104 is substantially greater than the thickness of the device 110, such that the cap 106 is spaced apart from the device 110 by the gap 120. In some embodiments, when the first metal component 130A is used, direct control of the gap 120 is achieved based on the tolerance of the first metal component 130A. In some embodiments, the distance between the top surface of the device 110 and the inner surface of the cap 106 facing the device 110 is defined as the gap width G1. In some embodiments, the gap width G1 is derived based on the height of the first metal component 130A. In some embodiments, placing the cap 106 controls the magnitude of the gap width G1.

[0065] Figure 27is a flowchart illustrating a method 300 of fabricating a package structure according to some embodiments of the present disclosure. Figures 28A to 28D is a schematic cross-sectional side view illustrating a continuous fabrication phase of a package structure P13 according to some embodiments of the present disclosure. Figure 4 is a schematic cross-sectional side view illustrating a continuous fabrication phase of a package structure P13 according to some embodiments of the present disclosure.

[0066] In operation S301, a substrate 102 is provided and a device 110 is placed on the substrate 102, as shown in Figure 28A .

[0067] In operation S303, a first metal component 130A and a second metal component 130B are placed on the device 110, as shown in Figure 28B . In some embodiments, the method of placing the first metal component 130A and the second metal component 130B on the device 110 includes, but is not limited to, wire bonding. In some embodiments, the first metal component 130A is placed by placing a stud on the device 110, elongating a wire from the stud, bonding the wire to the device 110, and cutting the wire to remove the wire from the stud. Thus, the stud remains on the device 110. In some embodiments, the second metal component 130B is placed by placing a bond pad on the device 110 and attaching a wire to the device 110 perpendicularly through the bond pad. In some embodiments, the first metal component 130A and the second metal component 130B can have any suitable configuration as long as the height of the second metal component 130B is substantially greater than the height of the first metal component 130A. For example, the first metal component 130A can be a stud, a rod, or a bump and the second metal component 130B can be a wire, a stud stack, or a bump stack. In some embodiments, the first metal component 130A and the second metal component 130B can be located on any portion of the device 110. In some embodiments, the first metal component 130A is placed on a central portion of the device 110 and the second metal component 130B is placed on a peripheral portion of the device 110.

[0068] In operation S305, a cap 106 is provided in conjunction with the sidewall 104, as shown in Figure 28C .

[0069] In operation S307, the cap 106 is attached to the substrate 102 via the sidewall 104, as shown in Figure 28D . In some embodiments, the cap 106 is placed over the substrate 102, the device 110, the first metal component 130A, and the second metal component 130B. In some embodiments, the cap 106 contacts the second metal component 130B but does not contact the first metal component 130A. Thus, a package structure P13 is formed, as shown in Figure 4gap 120. In some embodiments, the distance between the top surface of the device 110 and the interior surface of the lid 106 facing the device 110 defines a gap width G1. In some embodiments, the gap width G1 is derived based on the height of the second metal component 130B. In some embodiments, the distance between the top surface of the first metal component 130A and the interior surface of the lid 106 facing the device 110 defines a gap width G2. In some embodiments, the height of the second metal component 130B is equal to the sum of the gap width G2 and the height of the first metal component 130A. In such embodiments, the gap width G2 is substantially equal to the difference between the height of the first metal component 130A and the height of the second metal component 130B.

[0070] Figure 29 is a flowchart illustrating a method 400 of fabricating a package structure in accordance with some embodiments of the present disclosure. Figures 30A to 30E is a flowchart illustrating a method 400 of fabricating a package structure in accordance with some embodiments of the present disclosure. Figure 8 is a schematic cross-sectional side view of a successive fabrication stage of a package structure P16 in accordance with some embodiments of the present disclosure.

[0071] In operation S401, a substrate 102 is provided in combination with a sidewall 104, as shown in Figure 30A In some embodiments, the substrate 102 and the sidewall 104 are a unitary structure. For example, a central portion of a molding material is removed by a drilling process, such that only the substrate and the sidewall of the molding material remain.

[0072] In operation S403, a device 110 is placed on the substrate 102, as shown in Figure 30B In some embodiments, the device 110 is surrounded by the sidewall 104.

[0073] In operation S405, a lid 106 is provided embedded with a plurality of first interconnect structures 140, as shown in Figure 30C In some embodiments, the first interconnect structures 140 can be, for example, a lead frame. In some embodiments, a polishing process or a grinding process is used to expose the surface of the first interconnect structures facing away from the lid 106, such that the surface of the first interconnect structures is coplanar with the surface of the lid 106.

[0074] In operation S407, a first metal component 130A and a second metal component 130B are placed on one of the first interconnect structures 140, respectively, as shown in Figure 30DThe second metal component 130B is shown in FIG. 1B. In some embodiments, the height of the second metal component 130B is substantially greater than the height of the first metal component 130A. In some embodiments, the second metal component 130B is in a different configuration than the first metal component 130A. For example, the first metal component 130A is a post and the second metal component 130B is a wire, as shown in FIG. 1C. Figure 30D In other embodiments, the second metal component 130B is in the same configuration as the first metal component 130A. For example, the first metal component 130A is a post and the second metal component 130B is a post stack, as shown in FIG. 1D.

[0075] In operation S409, the lid 106 is attached to the base 102 via the sidewall 104, as shown in FIG. 1G. Figure 30E In some embodiments, the sealant is placed at the junction between the sidewall 104 and the lid 106 and the lid 106 is engaged with the base 102. In some embodiments, the lid 106 is attached in a manner that the first metal component 130A and the second metal component 130B are configured with the device 110. In some embodiments, the second metal component 130B placed on the first interconnect structure 140 is pressed against the device 110 and the first metal component 130A placed on the first interconnect structure 140 does not contact the device 110. Thus, a package structure P16 in FIG. 1H is formed. Figure 8 In some embodiments, the lid 106 is spaced apart from the device 110 by the gap 120. In some embodiments, when the second metal component 130B is used, direct control of the gap 120 is achieved based on the tolerance of the second metal component 130B. In some embodiments, the distance between the top surface of the device 110 and the inner surface of the lid 106 facing the device 110 is defined as a gap width G1. In some embodiments, the gap width G1 is derived based on the height of the second metal component 130B. In some embodiments, the distance between the top surface of the first metal component 130A and the top surface of the device 110 is defined as a gap width G3. In some embodiments, the height of the second metal component 130B is equal to the sum of the gap width G3 and the height of the first metal component 130A. In such embodiments, the gap width G3 is substantially equal to the difference between the height of the first metal component 130A and the height of the second metal component 130B.

[0076] Figure 31 is a flowchart illustrating a method 500 of fabricating a package structure, according to some embodiments of the present disclosure. Figures 32A to 32E is a flowchart illustrating a method 500 of fabricating a package structure, according to some embodiments of the present disclosure. Figure 9 is a schematic cross-sectional view of a successive fabrication stage of a package structure P17 in FIG. 1I, according to some embodiments of the present disclosure.

[0077] In operation S501, the base 102 is provided in combination with the sidewall 104, as shown in FIG. 1J. Figure 32A In operation S501, the base 102 is provided in combination with the sidewall 104, as shown in FIG. 1J.

[0078] In operation S503, the device 110 is placed on the substrate 102, such as... Figure 32B As shown in the image.

[0079] In operation S505, a cover 106 is provided on which multiple second interconnect structures 150 are placed, such as Figure 32C As shown in the figure. In some embodiments, the second interconnect structure 150 may be, for example, a pin or an electrode. In some embodiments, forming the second interconnect structure 150 may include at least a deposition process, a photolithography process, and an etching process.

[0080] In operation S507, the first metal component 130A and the second metal component 130B are respectively placed on one of the second interconnect structure 150, such as... Figure 32D As shown in the figure. In some embodiments, the height of the second metal component 130B is substantially greater than the height of the first metal component 130A.

[0081] In operation S509, the cover 106 is attached to the base 102 via the sidewall 104, as follows: Figure 32E As shown in the diagram. In some embodiments, the cover 106 is attached in a manner that the first metal component 130A and the second metal component 130B are configured together with the device 110. In some embodiments, the second metal component 130B, placed on the second interconnect structure 150, presses against the device 110 while the first metal component 130A, placed on the second interconnect structure 150, does not contact the device 110. Thus, generally forming Figure 9 The encapsulation structure P17 is included. In some embodiments, the cover 106 is spaced apart from the device 110 by a gap 120.

[0082] The present disclosure is directed to various package structures having metal components disposed therein and methods of fabricating the package structures. In a package structure, the standard deviation or tolerance of the dimensions (e.g., height or thickness) of a molding material is generally very large, for example, greater than 50 pm. When certain parameters (e.g., device-to-lid gap width) inside a package structure need to be sufficiently precise, it is difficult to precisely control and obtain the parameters because the built-in standard deviation or tolerance of the dimensions of the molding material is generally unavoidable. The present disclosure provides various package structures that enable control of the gap width inside a package structure. The gap between the top surface of a device and the inner surface of a lid facing the device is controlled by incorporating one or more metal components, such as a post or bump, between the device and the lid. Since the standard deviation of the height of the post or bump is significantly smaller than the standard deviation of the molding material, the variation in the gap width can be reduced when the gap width is directly referenced to the height of the metal component. At this time, the tolerance related to the dimensions of the molding material and the device does not have to be considered and the statistical tolerance accumulation can be reduced. Thus, the device-to-lid gap can be controlled by the metal component and the gap width can be determined by the height of the metal component with greater precision. In addition, the metal component can be used not only for hermetic package structures but also for package structures having openings partially exposing a device therein.

[0083] One aspect of the present disclosure provides a package structure. The package structure includes a substrate; a device disposed on the substrate; a lid disposed over the substrate and the device and spaced apart from the device; and a first metal component disposed between the device and the lid, wherein the first metal component contacts the device and the lid.

[0084] In some embodiments, a distance between a top surface of the device and an inner surface of the lid facing the top surface of the device is between about 5 um and about 500 um.

[0085] In some embodiments, the first metal component is a wire, a post, a rod, a bump, a post stack, or a bump stack.

[0086] In some embodiments, the package structure further includes a second metal component disposed between the device and the lid.

[0087] In some embodiments, the first metal component is in the same or different configuration as the second metal component.

[0088] In some embodiments, a height of the second metal component is different from a height of the first metal component.

[0089] In some embodiments, the first metal component and the second metal component are disposed on the device.

[0090] In some embodiments, the second metal component is separate from the lid.

[0091] In some embodiments, the first metal component and the second metal component are disposed on an interconnect structure on or in the lid.

[0092] In some embodiments, the second metal component is separate from the device.

[0093] In some embodiments, the package structure further includes a fill material surrounding the first metal component or the second metal component.

[0094] Another aspect of the disclosure provides a package structure. The package structure includes a substrate, a first device disposed on the substrate, a second device disposed on the first device, a lid disposed over the substrate and spaced apart from the first device and the second device, and a first metal component disposed between the first device and the lid, wherein the first metal component contacts the lid.

[0095] In some embodiments, the first metal component is disposed on the first device.

[0096] In some embodiments, the first metal component is disposed on the second device.

[0097] In some embodiments, the package structure further includes a second metal component disposed between the second device and the lid.

[0098] In some embodiments, the second metal component is disposed on the second device and separate from the lid.

[0099] In some embodiments, the second metal component is disposed on the lid and separate from the second device.

[0100] In some embodiments, a width of the first device is substantially greater than a width of the second device.

[0101] Another aspect of the disclosure provides a method. The method includes providing a substrate and a device disposed on the substrate, disposing a first metal component on the device, disposing a lid over the substrate and the device to contact the first metal component, and deriving the distance based on a first height of the first metal component.

[0102] In some embodiments, the disposing the lid includes controlling a distance between a top surface of the device and an interior surface facing the top surface of the device.

[0103] The foregoing overview of the features of several embodiments enables a person of ordinary skill in the art to better understand aspects of the present disclosure. The person of ordinary skill in the art will readily understand that they can readily employ the present disclosure as a basis for designing or modifying other operations and structures for carrying out the same purposes and / or achieving the same advantages of the embodiments introduced herein. The person of ordinary skill in the art will also recognize from the disclosure a large number of noncritical and / or equivalent changes, alternatives and modifications they can make. None, therefore, of the appended claims is intended to be limited to the exact design details that have been described in this specification.

[0104] Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. Accordingly, the appended claims as

[0105] KEY

[0106] 100: molded part

[0107] 102: base

[0108] 104: sidewall

[0109] 106: lid

[0110] 110: device / first device

[0111] 120: gap

[0112] 130A: first metal component

[0113] 130B: second metal component

[0114] 140: first interconnect structure

[0115] 150: second interconnect structure

[0116] 160: fill material

[0117] 200: molding part / method

[0118] 202: base

[0119] 204: sidewall

[0120] 206: lid

[0121] 210: first device

[0122] 212: second device

[0123] 220: gap

[0124] 230A: first metal component

[0125] 230B: second metal component

[0126] 240: first interconnect structure

[0127] 250: second interconnect structure

[0128] 300: method

[0129] 500: method

[0130] C1: gap width

[0131] C2: gap width

[0132] C3: gap width

[0133] D1: thickness

[0134] D2: height

[0135] E1: thickness

[0136] E2: thickness

[0137] F1: top surface

[0138] F2: bottom surface

[0139] G1: gap width

[0140] G2: gap width

[0141] G3: gap width

[0142] H1: height / first height

[0143] H2: second height

[0144] I1: interior surface

[0145] I2: interior surface

[0146] L1: first height

[0147] L2: second height

[0148] P10: package structure

[0149] P11: package structure

[0150] P12: package structure

[0151] P13: Packaging structure

[0152] P14: Packaging structure

[0153] P15: Packaging structure

[0154] P16: Packaging structure

[0155] P17: Packaging structure

[0156] P18: Packaging structure

[0157] P20: Packaging structure

[0158] P21: Packaging structure

[0159] P22: Packaging structure

[0160] P23: Packaging structure

[0161] P24: Packaging structure

[0162] P25: Packaging structure

[0163] P26: Packaging structure

[0164] P27: Packaging structure

[0165] P28: Packaging structure

[0166] P29: Packaging structure

[0167] P30: Packaging structure

[0168] P31: Packaging structure

[0169] P32: Packaging structure

[0170] S1: Top surface

[0171] S2: Bottom surface

[0172] S201: Operation

[0173] S203: Operation

[0174] S205: Operation

[0175] S207: Operation

[0176] S301: Operation

[0177] S303: Operation

[0178] S305: Operation

[0179] S307: Operation

[0180] S401: Operation

[0181] S403: Operation

[0182] S405: Operation

[0183] S407: Operation

[0184] S411: Operation

[0185] S501: Operation

[0186] S503: Operation

[0187] S505: Operation

[0188] S507: Operation

[0189] S511: Operation

[0190] T1: First thickness

[0191] T2: Second thickness

[0192] T3: Height

Claims

1. A package structure comprising: a substrate; a device placed on the substrate and having a top surface; a cap placed over the substrate and the device and spaced apart from the device, having an inner surface facing the top surface; a first metal component placed between the device and the cap and not surrounded by a fill material, wherein an upper surface of the first metal component is separated from the inner surface of the cap and a lower surface of the first metal component contacts the top surface of the device; and a second metal component placed between the device and the cap, wherein the second metal component contacts the inner surface of the cap and the top surface of the device.

2. The package structure of claim 1, wherein a distance between the top surface of the device and the inner surface of the cap facing the top surface of the device is between 5 μm and 500 μm.

3. The package structure of claim 1, wherein the first metal component is a wire, a stud, a post, a bump, a stud stack, or a bump stack.

4. The package structure of claim 1, wherein the second metal component is not surrounded by the fill material.

5. The package structure of claim 1, wherein the first metal component is in the same or different configuration as the second metal component.

6. The package structure of claim 1, wherein a height of the second metal component is different from a height of the first metal component.

7. The package structure of claim 1, wherein the first metal component and the second metal component are placed on the device.

8. The package structure of claim 1, wherein a width of the substrate is the same as a width of the cap.

9. The package structure of claim 4, wherein the first metal component and the second metal component are placed on an interconnect structure on or in the cap.

10. The package structure of claim 1, wherein the second metal component extends vertically between the device and the cap.

11. The package structure of claim 1, wherein the second metal component is surrounded by the fill material.

12. A package structure comprising: a substrate; a first device placed on the substrate; a second device placed on the first device; a cap placed over the substrate and spaced apart from the first device and the second device; a first metal component placed between the first device and the cap and not surrounded by a fill material, wherein the first metal component contacts the cap and the first device and extends vertically between the cap and the first device; and a second metal component placed on the second device and separated from the cap.

13. The package structure of claim 12, wherein the first metal component is placed on the first device.

14. The package structure of claim 12, wherein a height of the first metal component is equal to a sum of a thickness of the second device and a gap between the second device and the cap. ​ ​ 15. The package structure of claim 12, wherein a width of the second metal component decreases toward the cap.

16. The package structure of claim 12, wherein the second metal component is configured as a bump and the first metal component is configured as a wire.

17. The package structure of claim 12, wherein the second metal component is configured as a bump and the first metal component is configured as a bump stack.

18. The package structure of claim 12, wherein a width of the first device is greater than a width of the second device.

19. A method of forming a package structure, comprising: providing a substrate and a device placed on the substrate; placing a first metal component on the device, wherein the first metal component is not surrounded by a fill material; placing a second metal component over the device and adjacent to the first metal component; placing a cap over the substrate and the device, wherein an upper surface of the first metal component is spaced apart from an interior surface of the cap, a lower surface of the first metal component contacts a top surface of the device, and the second metal component contacts the interior surface of the cap and the top surface of the device; and deriving a distance based on a first height of the second metal component.

20. The method of claim 19, wherein the placing the cap includes controlling a distance between the top surface of the device and the interior surface facing the top surface of the device.

Images