Chuck assembly of wafer cleaning apparatus and wafer cleaning apparatus

Abstract

This invention discloses a chuck assembly for a wafer cleaning equipment and the wafer cleaning equipment itself. The chuck assembly includes a lifting mechanism, a chuck base, a chuck ring, and a driver. The chuck base carries the wafer, and the lifting mechanism moves the wafer supported on the chuck base up and down. The chuck ring is fixedly disposed below the chuck base, and the driver drives the chuck base to rotate relative to the chuck ring. The lifting mechanism includes a ejector pin, a rotating part, and a detection element. The rotating part is rotatably connected to the chuck ring and can slide relative to the chuck base. When the chuck base rotates, it drives the rotating part to rotate. The ejector pin passes through the chuck base, and the rotating part contacts the ejector pin. During the rotation of the rotating part, it drives the ejector pin to rise and fall. When the ejector pin rises to a preset position, the rotating part triggers the detection element. This solution can solve the problem of poor reliability in wafer cleaning equipment.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning technology, and more particularly to a chuck assembly for a wafer cleaning device and the wafer cleaning device itself. Background Technology

[0002] With the rapid development of technology, electronic products such as smartphones and tablets have become indispensable in modern life. These electronic products contain many semiconductor chips, and the main material for manufacturing semiconductor chips is wafers.

[0003] Multiple cleaning processes are required during chip manufacturing. The wafers to be cleaned are fed into the process chamber of the wafer cleaning equipment via a robotic arm and then transferred to a lifting mechanism within the chamber. The lifting mechanism descends to transfer the wafer onto a chuck. After cleaning is complete, the lifting mechanism lifts the wafer, creating a safe gripping space between the wafer and the chuck for the robotic arm. The robotic arm then picks up the wafer and transports it out of the wafer cleaning equipment.

[0004] However, due to the complex transmission structure of the lifting mechanism, when a component in the lifting mechanism fails, the wafer may not be lifted high enough, which may cause the robot arm to fail to grasp the wafer or even cause the wafer to break, resulting in poor reliability of the wafer cleaning equipment. Summary of the Invention

[0005] This invention discloses a chuck assembly for a wafer cleaning equipment and the wafer cleaning equipment itself, in order to solve the problem of poor reliability of wafer cleaning equipment.

[0006] To solve the above problems, the present invention adopts the following technical solution:

[0007] A chuck assembly for a wafer cleaning apparatus includes a lifting mechanism, a chuck base, a chuck ring, and a driver. The chuck base carries a wafer, the lifting mechanism moves the wafer supported on the chuck base up and down, the chuck ring is fixedly disposed below the chuck base, and the driver drives the chuck base to rotate relative to the chuck ring.

[0008] The lifting mechanism includes a pin, a rotating part, and a detection element;

[0009] The rotating part is rotatably connected to the chuck ring, and the rotating part can slide relative to the chuck base. When the chuck base rotates, it can drive the rotating part to rotate.

[0010] The ejector pin is inserted into the chuck base. The rotating part is in contact with the ejector pin. During the rotation of the rotating part, the ejector pin can be driven to rise and fall. When the ejector pin rises to a preset position, the rotating part triggers the detection element.

[0011] A wafer cleaning apparatus includes the aforementioned chuck assembly.

[0012] The technical solution adopted in this invention can achieve the following beneficial effects:

[0013] In the chuck assembly disclosed in this invention, the rotating part drives the ejector pin to rise and fall during rotation. When the ejector pin rises to a preset position, the rotating part triggers a detection element. In this solution, the ejector pin rises to the preset position, and the rotating part triggers the detection element. Therefore, when the detection element outputs a trigger signal, it can be determined that the ejector pin has moved into position, thereby improving the safety and reliability of the robot arm in grasping the wafer and improving the reliability of the wafer cleaning equipment. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0015] Figure 1 This is a schematic diagram of the chuck assembly disclosed in an embodiment of the present invention;

[0016] Figure 2 This is a schematic diagram of the lifting mechanism in the chuck assembly disclosed in an embodiment of the present invention when it is raised;

[0017] Figure 3 This is a schematic diagram of the rotating part of the lifting mechanism in the chuck assembly disclosed in an embodiment of the present invention;

[0018] Figure 4 This is a schematic diagram of the lifting mechanism in the chuck assembly disclosed in an embodiment of the present invention when it is not raised.

[0019] Explanation of reference numerals in the attached figures:

[0020] 100-Lifting mechanism, 110-Ejector pin, 120-Rotating part, 121-Main body, 1211-Slide groove, 122-Lifting extension, 1221-First support protrusion, 1221a-First mounting hole, 123-Trigger extension, 1231-Second support protrusion, 1231a-Second mounting hole, 124-Second bearing, 125-Third bearing, 126-First mounting shaft, 127-Second mounting shaft, 130-Detection element, 200-Chuck base, 210-Positioning element, 220-First bearing, 300-Chuck ring, 400-Driver, 410-Drive shaft, 420-Housing, 500-Wafer. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0022] The technical solutions disclosed in the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0023] like Figures 1-4 As shown in the figure, an embodiment of the present invention discloses a chuck assembly for a wafer cleaning apparatus. The chuck assembly includes a lifting mechanism 100, a chuck base 200, a chuck ring 300, and a driver 400. The chuck base 200 is used to support a wafer 500. The lifting mechanism 100 is used to move the wafer 500 supported on the chuck base 200 up and down. The chuck ring 300 is fixedly disposed below the chuck base 200. The driver 400 is used to drive the chuck base 200 to rotate relative to the chuck ring 300.

[0024] The lifting mechanism 100 includes a lifting pin 110, a rotating part 120, and a detection element 130. The rotating part 120 is rotatably connected to the chuck ring 300, and the rotating part 120 can slide relative to the chuck base 200. When the chuck base 200 rotates, it can drive the rotating part 120 to rotate.

[0025] The ejector pin 110 is inserted into the chuck base 200, allowing its tip to extend above or retract below the top surface of the chuck base 200. The rotating part 120 contacts the ejector pin 110, and its rotation causes the ejector pin 110 to rise and fall. Therefore, the ejector pin 110 can lift the wafer 500 from or transfer it onto the chuck base 200. When the ejector pin 110 rises to a preset position, the rotating part 120 triggers the detection element 130.

[0026] In the embodiments disclosed in this application, the rotating part 120 drives the ejector pin 110 to rise and fall during rotation. When the ejector pin 110 rises to a preset position, the rotating part 120 triggers the detection element 130. In this scheme, when the ejector pin 110 rises to the preset position, the rotating part 120 triggers the detection element 130. At this time, the detection element 130 outputs a trigger signal, thereby determining that the ejector pin 110 has moved into position, thus improving the safety and reliability of the robot arm gripping the wafer 500 and enhancing the reliability of the wafer cleaning equipment.

[0027] In another alternative embodiment, the rotating part 120 may include a main body 121, which is rotatably connected to the chuck ring 300. A groove 1211 may be provided on the main body 121. A positioning member 210 may be provided on the chuck base 200, which may be located within the groove 1211 and slide in engagement with it. When the chuck base 200 rotates, the positioning member 210 abuts against the side wall of the groove 1211, causing the rotating part 120 to rotate.

[0028] During the rotation of the chuck base 200, the positioning member 210 moves tangentially and contacts the side wall of the slide groove 1211. The positioning member 210 slides along the side wall of the slide groove 1211, driving the rotating part 120 to rotate. In this design, the slide groove 1211 is an open structure, making the assembly and disassembly of the slide groove 1211 and the positioning member 210 simple.

[0029] Furthermore, a first bearing 220 can be sleeved on the outside of the positioning member 210, and the first bearing 220 can contact the side wall of the slide groove 1211. In this design, the outer ring of the first bearing 220 makes rolling contact with the side wall of the slide groove 1211, so the outer ring of the first bearing 220 can roll relative to the slide groove 1211, thereby preventing wear between the positioning member 210 and the slide groove 1211, and thus improving the service life of the positioning member 210 and the rotating part 120.

[0030] This application discloses a specific structure of a rotating part 120. Of course, the rotating part 120 can also have other structures, which are not limited herein. Specifically, the rotating part 120 may further include a lifting extension 122 and a trigger extension 123. The lifting extension 122 and the trigger extension 123 may be located on opposite sides of the main body 121. The lifting extension 122 and the trigger extension 123 may both extend along the side away from the main body 121. The end of the lifting extension 122 away from the main body 121 is in contact with the ejector pin 110, and the end of the trigger extension 123 away from the main body 121 may be disposed opposite to the detection element 130.

[0031] In this design, the lifting extension 122 and the trigger extension 123 are located on both sides of the main body 121. Therefore, when the rotating part 120 rotates, the lifting extension 122 rises and the trigger extension 123 falls, which makes the detection element 130 and the ejector pin 110 located far apart, making it less likely to interfere, thereby improving the safety and reliability of the lifting mechanism 100.

[0032] Furthermore, the lifting extension 122 and the trigger extension 123 can be symmetrically distributed along the rotation center of the rotating part 120. This design makes the structure of the rotating part 120 more compact.

[0033] In another alternative embodiment, the end of the lifting extension 122 away from the main body 121 can be a first end, and the first end can be provided with a second bearing 124, which can roll contact with the ejector pin 110. In this solution, the outer ring of the second bearing 124 rolls contact with the ejector pin 110, thus reducing the wear of the ejector pin 110 and improving its service life.

[0034] Furthermore, two first support protrusions 1221 can be extended from the side of the first end facing the ejector pin 110, and each first support protrusion 1221 is provided with a first mounting hole 1221a. The first mounting holes 1221a of the two first support protrusions 1221 can be arranged opposite each other.

[0035] The first mounting shaft 126 is inserted into the first mounting hole 1221a, and the second bearing 124 is fitted onto the outside of the first mounting shaft 126. The second bearing 124 is located between the two first support protrusions 1221.

[0036] In this design, the two first support protrusions 1221 can protect the second bearing 124 and also facilitate the installation of the second bearing 124.

[0037] In another alternative embodiment, the end of the trigger extension 123 opposite to the main body 121 is designated as the second end. The second end may be provided with a third bearing 125, which can contact the detection element 130 to trigger it. In this configuration, the outer ring of the third bearing 125 makes rolling contact with the detection element 130, thus reducing wear on the detection element 130 and improving its service life.

[0038] Furthermore, two opposing second support protrusions 1231 extend from the second end toward the side of the detection element 130. Each second support protrusion 1231 may have a second mounting hole 1231a, and the second mounting holes 1231a of the two second support protrusions 1231 are opposite to each other.

[0039] The second mounting shaft 127 is inserted into the second mounting hole 1231a, and the third bearing 125 can be fitted onto the second mounting shaft 127. The third bearing 125 can be located between the two second support protrusions 1231.

[0040] In this design, the two second support protrusions 1231 can protect the third bearing 125 and also facilitate the installation of the third bearing 125.

[0041] In another alternative embodiment, the detection element 130 can be a microswitch. In this approach, the microswitch has a simple structure and high sensitivity. Of course, the detection element 130 can also be other types of switches, which are not limited herein.

[0042] In the above embodiments, the chuck assembly may further include a driver 400, which may include a drive shaft 410 and a housing 420. The housing 420 may be disposed around the drive shaft 410. The drive shaft 410 is connected to the chuck base 200, and the drive shaft 410 drives the chuck base 200 to rotate. The housing 420 may be located below the chuck ring 300.

[0043] To facilitate the installation of the detection switch, in another alternative embodiment, the detection element 130 can be disposed on the housing 420. In this solution, the detection element 130 can be directly mounted on the housing 420, thus eliminating the need for additional components to fix the detection element 130, thereby simplifying the structure of the chuck assembly. Alternatively, the detection element 130 can be mounted on the end cover of the driver 400.

[0044] Based on the chuck assembly of any of the above embodiments of this application, this application also discloses a wafer cleaning device, which has the chuck assembly of any of the above embodiments.

[0045] The above embodiments of the present invention focus on describing the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be described in detail here.

[0046] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A chuck assembly for a wafer cleaning apparatus, the chuck assembly comprising: The chuck assembly includes a lifting mechanism (100), a chuck base (200), a chuck ring (300), and a driver (400). The chuck base (200) is used to support a wafer (500). The lifting mechanism (100) is used to move the wafer (500) supported on the chuck base (200) up and down. The chuck ring (300) is fixedly disposed below the chuck base (200). The driver (400) is used to drive the chuck base (200) to rotate relative to the chuck ring (300). The lifting mechanism (100) includes a pin (110), a rotating part (120), and a detection element (130). The rotating part (120) is rotatably connected to the chuck ring (300), and the rotating part (120) and the chuck base (200) can slide relative to each other. When the chuck base (200) rotates, it can drive the rotating part (120) to rotate. The ejector pin (110) is inserted into the chuck base (200). The rotating part (120) is in contact with the ejector pin (110). During the rotation of the rotating part (120), the ejector pin (110) can be driven to rise and fall. When the rotating part (120) drives the ejector pin (110) to rise to a preset position, the rotating part (120) triggers the detection element (130). The rotating part (120) includes a main body (121), a lifting extension (122), and a trigger extension (123). The main body (121) is rotatably connected to the chuck ring (300). The lifting extension (122) and the trigger extension (123) are located on opposite sides of the main body (121). Both the lifting extension (122) and the trigger extension (123) extend along the side away from the main body (121). The end of the lifting extension (122) away from the main body (121) is in contact with the ejector pin (110). The end of the trigger extension (123) away from the main body (121) is opposite to the detection element (130).

2. The chuck assembly of claim 1, wherein The main body (121) is provided with a sliding groove (1211), and the chuck base (200) is provided with a positioning member (210). The positioning member (210) is located in the sliding groove (1211), and the positioning member (210) slides in cooperation with the sliding groove (1211). When the chuck base (200) rotates, the positioning member (210) abuts against the side wall of the sliding groove (1211), causing the rotating part (120) to rotate.

3. The chuck assembly according to claim 2, characterized in that, The positioning member (210) is fitted with a first bearing (220), which is in contact with the side wall of the slide groove (1211).

4. The chuck assembly according to claim 1, characterized in that, The lifting extension (122) and the trigger extension (123) are symmetrically distributed along the rotation center of the rotating part (120).

5. The chuck assembly according to claim 1, characterized in that, The lifting extension (122) is a first end away from the main body (121), and a second bearing (124) is provided at the first end. The second bearing (124) is in rolling contact with the ejector pin (110).

6. The chuck assembly according to claim 5, characterized in that, The first end extends toward the side of the ejector pin (110) and has two opposing first support protrusions (1221). Each first support protrusion (1221) has a first mounting hole (1221a). The first mounting holes (1221a) of the two first support protrusions (1221) are opposite to each other. The first mounting shaft (126) is inserted into the first mounting hole (1221a), and the second bearing (124) is fitted onto the outside of the first mounting shaft (126). The second bearing (124) is located between the two first support protrusions (1221).

7. The chuck assembly according to claim 1, characterized in that, The trigger extension (123) is located at a second end away from the main body (121). The second end is provided with a third bearing (125). The third bearing (125) can contact the detection element (130) to trigger the detection element (130).

8. The chuck assembly according to claim 7, characterized in that, The second end extends toward the side of the detection element (130) and has two opposing second support protrusions (1231). Each second support protrusion (1231) has a second mounting hole (1231a). The second mounting holes (1231a) of the two second support protrusions (1231) are opposite to each other. The second mounting shaft (127) is inserted into the second mounting hole (1231a), and the third bearing (125) is fitted outside the second mounting shaft (127). The third bearing (125) is located between the two second support protrusions (1231).

9. The chuck assembly according to claim 1, characterized in that, The detection element (130) is a micro switch.

10. The chuck assembly according to claim 1, characterized in that, The driver (400) includes a drive shaft (410) and a housing (420), the housing (420) being disposed around the drive shaft (410), the drive shaft (410) being connected to the chuck base (200), the housing (420) being located below the chuck ring (300), and the detection element (130) being disposed on the housing (420).

11. A wafer cleaning device, characterized in that, The chuck assembly includes any one of claims 1 to 10.

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