WAFER CHUCK, ARRANGEMENT AND METHOD FOR OPERATING AN ARRANGEMENT

Abstract

A wafer chuck is described, comprising: a plate and a further plate, wherein the plate includes a mounting surface for attaching a wafer, the further plate is arranged spaced apart from the plate on a side of the plate opposite the mounting surface, a gap is arranged between the plate and the further plate, and the plate and the further plate are transparent. Furthermore, an arrangement with a wafer chuck and a method for operating an arrangement are described.