Antenna and electronic device including the same

Abstract

According to various embodiments, an electronic device may include: a shell, including a side member, the side member including a conductive member and a non-conductive member coupled to the conductive member; and at least one antenna structure, which is arranged in the internal space of the shell and includes: a base, which is arranged to face the side member; and at least one antenna element, which is arranged on the base so that a beam pattern is formed through the non-conductive member in the direction facing the side member, wherein: when the side member is observed from the outside, the boundary area between the conductive member and the non-conductive member is arranged in an area that does not overlap with the base; in the boundary area, the conductive member includes at least one recess formed to at least partially accommodate the non-conductive member; and the at least one recess includes two or more step portions, and when the side member is observed from the outside, the two or more step portions gradually become higher or lower as the step portion moves away from the base to the left or right.

Description

Technical Field

[0001] Various embodiments provide an antenna and an electronic device including the antenna. Background Art

[0002] With the advancement of wireless communication technology, communication electronic devices have become ubiquitous in daily life, exponentially increasing content consumption. Consequently, network capacity constraints may be reaching their limit. Following the commercialization of 4th-generation (4G) communication systems, to meet the growing demand for wireless data traffic, communication systems (e.g., 5th-generation (5G), pre-5G communication systems, or New Radio (NR)) are being developed that transmit and / or receive signals using high-frequency (e.g., millimeter wave (mmWave)) frequency bands (e.g., 3 gigahertz (GHz) to 300 GHz bands). Summary of the Invention

[0003] Technical issues

[0004] In accordance with next-generation wireless communication technology, an efficient mounting structure and a new antenna corresponding thereto are being developed that enable the use of frequencies substantially in the range of 3 GHz to 100 GHz for transmitting and / or receiving wireless signals, overcome high free space loss according to frequency characteristics, and increase the gain of the antenna. The antenna may include an antenna structure in the form of an array, in which a varying number of antenna elements (e.g., conductive patches or conductive patterns) are arranged at predetermined intervals. Such antenna elements may be arranged in the interior space of an electronic device so as to form a beam pattern in one direction. For example, the antenna structure may be arranged in the interior space of an electronic device so as to form a beam pattern toward the direction facing at least a portion of the front surface, rear surface, and / or side surface of the antenna structure.

[0005] An electronic device may include a conductive member (e.g., a metal member) disposed within at least a portion of a housing (e.g., a housing structure) to enhance rigidity and create an aesthetically pleasing appearance, and a non-conductive member (e.g., a polymer or injection molding material) coupled to the conductive member. Such a housing may be formed as a single unit by inserting and injecting the non-conductive member into the conductive member or by structurally coupling the non-conductive and conductive members.

[0006] However, when such a conductive member is disposed near the antenna structure, the antenna's radiation performance may deteriorate and its radiation sensitivity may decrease. In addition, the coupled portions of the conductive and non-conductive members may separate or become misaligned due to external impact, thereby reducing product reliability.

[0007] Solution

[0008] Various embodiments may provide an antenna and an electronic device including the antenna.

[0009] Various embodiments may provide an antenna that can prevent degradation of antenna radiation performance through a structural change of a housing, and an electronic device including the same.

[0010] Various embodiments may provide an antenna that can prevent damage to a case due to external impact and prevent degradation of antenna performance, and an electronic device including the same.

[0011] According to various embodiments, an electronic device may include: a shell, including a side member, the side member including a conductive member and a non-conductive member coupled to the conductive member; and at least one antenna structure, arranged in the internal space of the shell and including a base and at least one antenna element, the base being arranged to face the side member, and the at least one antenna element being arranged on the base and having a beam pattern formed through the non-conductive member, wherein: when the side member is observed from the outside, the boundary area between the conductive member and the non-conductive member is arranged in an area that does not overlap with the base; in the boundary area, the conductive member includes at least one recess formed to at least partially accommodate the non-conductive member; and the at least one recess includes two or more step portions, and when the side member is observed from the outside, the two or more step portions gradually become higher or lower as the step portion moves away from the base to the left or right.

[0012] Various aspects and features of the present invention are defined in the appended claims. Combinations of features from the dependent claims may be combined with features of the independent claims as appropriate, and not only as explicitly set out in the claims.

[0013] In addition, one or more selected features of any one embodiment described in the present disclosure may be combined with one or more selected features of any other embodiment described herein, as long as the optional combination of features at least partially alleviates one or more technical problems discussed in the present disclosure, or at least partially alleviates technical problems that can be identified by those skilled in the art from the present disclosure, and further as long as the specific combination or arrangement of the embodiment features so formed is not understood by those skilled in the art to be incompatible.

[0014] Where possible, two or more physically distinct components in any described example embodiment of the present disclosure may optionally be integrated into a single component, so long as the single component formed thereby performs the same functionality. Conversely, where appropriate, a single component in any embodiment described in the present disclosure may optionally be implemented as two or more distinct components to achieve the same functionality.

[0015] Certain embodiments of the present invention are intended to at least partially solve, mitigate or eliminate at least one of the problems and / or disadvantages associated with the prior art. Certain embodiments are intended to provide at least one of the advantages described below.

[0016] Beneficial effects of the present invention

[0017] The electronic device according to the exemplary embodiment may prevent a phenomenon in which a non-conductive member is separated from a conductive member of the case due to an external impact through a structural change of the case, and may help improve radiation performance of an antenna while maintaining rigidity. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] For a more complete understanding of the present disclosure and its advantages, reference is now made to the following description taken in conjunction with the accompanying drawings, wherein like reference numerals represent like parts:

[0019] Figure 1 is a block diagram illustrating an electronic device in a network environment according to various embodiments;

[0020] Figure 2 is a block diagram illustrating an electronic device for supporting traditional network communication and 5G network communication according to an embodiment of the present disclosure;

[0021] Figure 3a is a perspective view showing a front surface of a mobile electronic device according to an embodiment of the present disclosure;

[0022] Figure 3b This is a diagram showing an embodiment of the present disclosure. Figure 3a a perspective view of a rear surface of an electronic device;

[0023] Figure 3c This is a diagram showing an embodiment of the present disclosure. Figure 3a An exploded perspective view of an electronic device;

[0024] Figure 4a According to one embodiment of the present disclosure, Figure 2 Shown and referenced in Figure 2 An embodiment of the structure of the third antenna module described;

[0025] Figure 4b According to the embodiment of the present disclosure Figure 4a A sectional view taken along line Y-Y';

[0026] Figure 5 is a perspective view of an antenna structure according to various embodiments;

[0027] Figure 6a is an exploded perspective view showing a state in which a supporting bracket is applied to an antenna structure according to various embodiments;

[0028] Figure 6b is an assembled perspective view showing a state in which a supporting bracket is applied to an antenna structure according to various embodiments;

[0029] Figure 7 According to various embodiments, Figure 3b A partial cross-sectional view of the electronic device taken along line AA';

[0030] Figure 8 It is along Figure 3b A cross-sectional view showing a partial configuration of an electronic device according to various embodiments, taken along line BB';

[0031] Figure 9 shows the arrangement relationship of antenna structures in electronic devices according to various embodiments;

[0032] Figure 10a and Figure 10b is a view showing a comparison between radiation areas of antenna structures before and after forming a recess according to various embodiments;

[0033] Figure 11 is a partial perspective view showing a state where an electronic device is provided with an antenna structure according to various embodiments;

[0034] Figure 12a According to various embodiments Figure 11 A partial cross-sectional view of the electronic device taken along line CC';

[0035] Figure 12b According to various embodiments, Figure 11 A partial cross-sectional view of the side member taken along line DD';

[0036] Figure 12c shows a side member of an electronic device showing a state where a non-conductive member is coupled to a conductive member according to various embodiments;

[0037] Figure 13 shows a partial configuration of a side member having a plurality of through-holes formed therethrough according to various embodiments; and

[0038] Figure 14a is a graph showing a comparison of performances of antenna structures according to the number of through holes in a first frequency band and a second frequency band according to various embodiments, and Figure 14b is a graph showing a comparison of performances of antenna structures according to the number of through holes in a first frequency band and a second frequency band according to various embodiments. DETAILED DESCRIPTION

[0039] Figure 1is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0040] Reference Figure 1 In the network environment 100, the electronic device 101 can communicate with the electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or can communicate with the electronic device 104 or the server 108 via a second network 199 (e.g., a long-range wireless communication network). Depending on the embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. Depending on the embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented as embedded in the display device 160 (eg, a display).

[0041] The processor 120 may run software (e.g., program 140) to control at least one other component of the electronic device 101 connected to the processor 120 (e.g., hardware component or software component), and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculations, the processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the commands or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. Depending on the embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent of or integrated with the main processor 121. Additionally or alternatively, the auxiliary processor 123 may be configured to consume less power than the main processor 121 or be specifically configured for a designated function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121 .

[0042] When the main processor 121 is in an inactive state (e.g., a sleep state), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101 (not the main processor 121), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) together with the main processor 121. Depending on the embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) that is functionally related to the auxiliary processor 123.

[0043] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0044] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0045] The input device 150 may receive commands or data to be used by other components of the electronic device 101 (eg, the processor 120) from outside the electronic device 101 (eg, a user). The input device 150 may include, for example, a microphone, a mouse, or a keyboard.

[0046] The sound output device 155 can output sound signals to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or records, and the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0047] The display device 160 can visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. Depending on the embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit adapted to measure the strength of the force caused by the touch (e.g., a pressure sensor).

[0048] The audio module 170 can convert sound into an electrical signal, and vice versa. Depending on the embodiment, the audio module 170 can obtain sound via the input device 150, or output sound via the sound output device 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0049] The sensor module 176 can detect the operating state of the electronic device 101 (e.g., power or temperature) or the environmental state outside the electronic device 101 (e.g., the state of the user), and then generate an electrical signal or data value corresponding to the detected state. Depending on the embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0050] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). Depending on the embodiment, the interface 177 may include, for example, a High-Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

[0051] The connection end 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102). Depending on the embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0052] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0053] The camera module 180 may capture still images or moving images. Depending on the embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0054] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0055] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0056] The communication module 190 can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and support direct (e.g., wired) communication or wireless communication. Depending on the embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a Wide Area Network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separated from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0057] Antenna module 197 can transmit or receive signals or power to or from the outside of electronic device 101 (e.g., an external electronic device). Depending on the embodiment, antenna module 197 may include one or more antennas, and thus, for example, communication module 190 (e.g., wireless communication module 192) may select at least one antenna suitable for the communication scheme used in the communication network (such as first network 198 or second network 199). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna.

[0058] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0059] According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type than the electronic device 101. According to an embodiment, all or some operations to be executed on the electronic device 101 may be executed on one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or execute another function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial response to the request, either by further processing the result or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0060] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to embodiments of the present disclosure, the electronic device is not limited to those described above.

[0061] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various changes, equivalents, or alternative forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to a term may include one or more things, unless the relevant context clearly indicates otherwise. As used herein, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B or C" may include all possible combinations of items listed together with the corresponding phrase in the multiple phrases. As used herein, terms such as "first" and "second" or "first" and "second" may be used to simply distinguish a corresponding component from another component and do not limit the components in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “coupled with another element (e.g., a second element)”, “coupled to another element (e.g., a second element)”, “connected with another element (e.g., a second element)”, or “connected to another element (e.g., a second element)”, with or without the terms “operably” or “communicatively” being used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0062] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or portion of the single integrated component. For example, depending on an embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0063] The various embodiments described herein can be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function in accordance with the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0064] Depending on the embodiment, the methods according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be published in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be published (e.g., downloaded or uploaded) online via an app store (e.g., Play Store™), or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smartphones). If published online, at least a portion of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium (e.g., a memory on a manufacturer's server, an app store's server, or a forwarding server).

[0065] According to various embodiments, each of the above-mentioned components (e.g., a module or program) may include a single entity or multiple entities. According to various embodiments, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding one of the multiple components performed the one or more functions before integration. According to various embodiments, the operations performed by a module, program, or another component may be performed sequentially, in parallel, repeatedly, or in a heuristic manner, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0066] Figure 2 An electronic device 101 is shown in a network environment 200 including multiple cellular networks according to an embodiment of the present disclosure.

[0067] Reference Figure 2 The electronic device 101 includes a first communication processor 212, a second communication processor 214, a first RFIC 222, a second RFIC 224, a third RFIC 226, a fourth RFIC 228, a first radio frequency front end (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244, an antenna 248, a processor 120, and a memory 130. The second network 199 includes a first cellular network 292 and a second cellular network 294. The electronic device 101 may also include a reference Figure 1 The second network 199 may further include at least one of the components described above. The first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and the second RFFE 234 may form at least part of the wireless communication module 192. The fourth RFIC 228 may be omitted or included as part of the third RFIC 226.

[0068] The first communication processor 212 can establish a communication channel for a frequency band to be used for wireless communication with the first cellular network 292 and support legacy network communication via the established communication channel. The first cellular network can be a legacy network including a second generation (2G), 3G, 4G, or Long Term Evolution (LTE) network. The second communication processor 214 can establish a communication channel corresponding to a specified frequency band (e.g., approximately 6 GHz to approximately 60 GHz) among the frequency bands to be used for wireless communication with the second cellular network 294 and support 5G network communication via the established communication channel. The second cellular network 294 can be a 5G network defined by the 3G Partnership Project (3GPP). The first communication processor 212 or the second communication processor 214 can establish a communication channel corresponding to another specified frequency band (e.g., approximately 6 GHz or less) among the frequency bands to be used for wireless communication with the second cellular network 294 and support 5G network communication via the established communication channel. The first communication processor 212 and the second communication processor 214 can be implemented as a single chip or a single package. The first communication processor 212 or the second communication processor 214 may be formed as a single chip or a single package with the processor 120 , the auxiliary processor 123 , or the communication module 190 .

[0069] When transmitting, the first RFIC 222 may convert the baseband signal generated by the first communication processor 212 into a radio frequency (RF) signal of approximately 700 MHz to approximately 3 GHz used in the first cellular network 292 (e.g., a legacy network). When receiving, the RF signal may be obtained from the first cellular network 292 via the first antenna module 242 and pre-processed by the first RFFE 232. The first RFIC 222 may convert the pre-processed RF signal into a baseband signal for processing by the first communication processor 212.

[0070] During transmission, the second RFIC 224 may convert baseband signals generated by the first communication processor 212 or the second communication processor 214 into RF signals in the Sub-6 frequency band (e.g., 6 GHz or less) to be used in the second cellular network 294 (e.g., a 5G network) (hereinafter referred to as 5G Sub-6 RF signals). During reception, 5G Sub-6 RF signals may be obtained from the second cellular network 294 (e.g., a 5G network) via the second antenna module 244 and pre-processed by the second RFFE 234. The second RFIC 224 may convert the pre-processed 5G Sub-6 RF signals into baseband signals for processing by the corresponding communication processor, either the first communication processor 212 or the second communication processor 214.

[0071] The third RFIC 226 may convert the baseband signal generated by the second communication processor 214 into an RF signal in the 5G Above 6 frequency band (e.g., approximately 6 GHz to approximately 60 GHz) to be used in the second cellular network 294 (e.g., a 5G network) (hereinafter referred to as a 5G Above 6 RF signal). Upon reception, the 5G Above 6 RF signal may be obtained from the second cellular network 294 via the antenna 248 and pre-processed by the third RFFE 236. The third RFIC 226 may convert the pre-processed 5G Above 6 RF signal into a baseband signal for processing by the second communication processor 214. The third RFFE 236 may be formed as part of the third RFIC 226.

[0072] The electronic device 101 may include a fourth RFIC 228, either separate from or as part of the third RFIC 226. In this case, the fourth RFIC 228 may convert the baseband signal generated by the second communication processor 214 into an RF signal in an intermediate frequency band (e.g., approximately 9 GHz to approximately 11 GHz) (hereinafter referred to as an intermediate frequency (IF) signal) and transmit the IF signal to the third RFIC 226. The third RFIC 226 may convert the IF signal into a 5G Above 6 RF signal. Upon reception, the 5G Above 6 RF signal may be received from the second cellular network 294 via the antenna 248 and converted into an IF signal by the third RFIC 226. The fourth RFIC 228 may convert the IF signal into a baseband signal for processing by the second communication processor 214.

[0073] The first RFIC 222 and the second RFIC 224 can be implemented as at least part of a single package or a single chip. The first RFFE 232 and the second RFFE 234 can be implemented as at least part of a single package or a single chip. At least one of the first antenna module 242 and the second antenna module 244 can be omitted or combined with another antenna module to process RF signals of corresponding multiple frequency bands.

[0074] The third RFIC 226 and antenna 248 can be provided on the same substrate to form the third antenna module 246. For example, the wireless communication module 192 or the processor 120 can be provided on a first substrate (e.g., a main printed circuit board (PCB)). The third RFIC 226 is provided in a localized area (e.g., the lower surface) of the first substrate and a separate second substrate (e.g., a sub-PCB), and the antenna 248 is provided in another localized area (e.g., the upper surface) of the first substrate and the separate second substrate, thereby forming the third antenna module 246. By providing the third RFIC 226 and antenna 248 on the same substrate, the length of the transmission line between them can be reduced. This can reduce transmission line losses (e.g., attenuation) of signals in the high-frequency bands (e.g., approximately 6 GHz to approximately 60 GHz) used in 5G network communications. Consequently, the electronic device 101 can improve the quality or speed of communications with the second cellular network 294.

[0075] The antenna 248 can be formed as an antenna array including multiple antenna elements that can be used for beamforming. In this case, the third RFIC 226 can include multiple phase shifters 238 corresponding to the multiple antenna elements as part of the third RFFE 236. During transmission, each of the multiple phase shifters 238 can shift the phase of a 5G Above 6 RF signal transmitted via the corresponding antenna element to an external device (e.g., a base station of a 5G network) outside the electronic device 101. During reception, each of the multiple phase shifters 238 can shift the phase of the 5G Above 6 RF signal received from the external device via the corresponding antenna element to the same phase, or substantially the same phase. This enables transmission or reception between the electronic device 101 and the external device through beamforming.

[0076] The second cellular network 294 can operate independently of the first cellular network 292 (e.g., a legacy network) (e.g., standalone networking (SA)), or can operate in combination with the first cellular network 292 (e.g., non-standalone networking (NSA)). For example, a 5G network may only have an access network (e.g., a 5G radio access network (RAN) or a next-generation (NG) RAN) and not a next-generation core network (NGC). After accessing the access network of the 5G network, the electronic device 101 can access an external network (e.g., the Internet) under the control of the core network of the legacy network (e.g., an evolved packet core (EPC)). LTE protocol information for communicating with the legacy network or new radio (NR) protocol information for communicating with the 5G network can be stored in the memory 130 for access by the processor 120, the first communication processor 212, or the second communication processor 214.

[0077] Figure 3aA perspective view showing a front surface of a mobile electronic device 300 according to an embodiment is shown.

[0078] Figure 3b Shown Shown Figure 3a 3 is a perspective view of the rear surface of the mobile electronic device 300 shown in FIG.

[0079] Reference Figure 3a and Figure 3b Mobile electronic device 300 may include a housing 310, wherein housing 310 includes a first surface (or front surface) 310A, a second surface (or rear surface) 310B, and side surfaces 310C surrounding the space between first and second surfaces 310A, 310B. Housing 310 may refer to a structure forming a portion of first, second, and side surfaces 310C. First surface 310A may be formed by a front panel 302, at least a portion of which is substantially transparent (e.g., a glass panel or polymer panel coated with various coatings). Second surface 310B may be formed by a substantially opaque rear panel 311. Rear panel 311 may be formed, for example, from coated or tinted glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or any combination thereof. Side surfaces 310C may be formed from a side frame structure (or "side member") 318, which is bonded to front panel 302 and rear panel 311 and comprises metal and / or polymer. The rear panel 311 and the side frame structure 318 may be integrally formed and may be the same material (eg, a metal material such as aluminum).

[0080] The front panel 302 may include two first regions 310D, respectively arranged at its long edges, that curve and extend seamlessly from the first surface 310A toward the rear panel 311. Similarly, the rear panel 311 may include two second regions 310E, respectively arranged at its long edges, that curve and extend seamlessly from the second surface 310B toward the front panel 302. The front panel 302 (or rear panel 311) may include only one of the first regions 310D (or second regions 310E). Either the first region 310D or the second region 310E may be partially omitted. When viewed from the side of the mobile electronic device 300, the side frame structure 318 may have a first thickness (or width) on the side not including the first region 310D or the second region 310E, and may have a second thickness, which is less than the first thickness, on the other side including the first region 310D or the second region 310E.

[0081] The mobile electronic device 300 may include at least one of the following: a display 301, audio modules 303, 307, and 314, sensor modules 304, 316, and 319, camera modules 305, 312, and 313, a key input device 317, a light emitting device, and connector holes 308 and 309. The mobile electronic device 300 may omit at least one of the above components (for example, the key input device 317 or the light emitting device), or may further include other components.

[0082] For example, the display 301 may be exposed through a majority of the front panel 302. At least a portion of the display 301 may be exposed through the front panel 302 forming the first area 310D of the first surface 310A and the side surface 310C. The outline (i.e., edges and corners) of the display 301 may have substantially the same shape as the outline of the front panel 302. The spacing between the outline of the display 301 and the outline of the front panel 302 may be substantially constant, thereby expanding the exposed area of ​​the display 301.

[0083] A recess or opening may be formed in a portion of the display area of ​​display 301 to accommodate at least one of audio module 314, sensor module 304, camera module 305, and a light-emitting device. At least one of audio module 314, sensor module 304, camera module 305, fingerprint sensor 316, and a light-emitting element may be disposed on the backside of the display area of ​​display 301. Display 301 may be combined with or adjacent to a touch sensing circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer for detecting a stylus. At least a portion of sensor modules 304 and 319 and / or at least a portion of key input device 317 may be disposed in first area 310D and / or second area 310E. Audio modules 303, 307, and 314 may correspond to microphone hole 303 and speaker holes 307 and 314, respectively. Microphone hole 303 may contain a microphone for acquiring external sound, and in this case, may contain multiple microphones for detecting the direction of the sound. The speaker holes 307 and 314 may be classified as an external speaker hole 307 and a call receiver hole 314. The microphone hole 303 and the speaker holes 307 and 314 may be implemented as a single hole, or a speaker (eg, a piezoelectric speaker) may be provided without the speaker holes 307 and 314.

[0084] Sensor modules 304, 316, and 319 can generate electrical signals or data corresponding to the internal operating state of the mobile electronic device 300 or external environmental conditions. Sensor modules 304, 316, and 319 may include a first sensor module 304 (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on the first surface 310A of the housing 310, and / or a third sensor module 319 (e.g., a heart rate monitor (HRM) sensor) and / or a fourth sensor module 316 (e.g., a fingerprint sensor) disposed on the second surface 310B of the housing 310. The fingerprint sensor may be disposed on both the second surface 310B and the first surface 310A (e.g., the display 301) of the housing 310. The electronic device 300 may also include at least one of the following sensors: a gesture sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0085] The camera modules 305, 312, and 313 may include a first camera device 305 disposed on a first surface 310A of the electronic device 300, and a second camera device 312 and / or a flash 313 disposed on a second surface 310B. The camera module 305 or the camera module 312 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 313 may include, for example, a light-emitting diode or a xenon lamp. Two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one side of the electronic device 300.

[0086] The key input device 317 may be arranged on the side surface 310C of the housing 310. The mobile electronic device 300 may not include some or all of the key input devices 317 described above, and the key input devices 317 not included may be implemented in another form such as soft keys on the display 301. The key input device 317 may include a sensor module 316 arranged on the second surface 310B of the housing 310.

[0087] A light emitting device may be disposed on the first surface 310A of the housing 310. For example, the light emitting device may provide status information of the electronic device 300 in an optical form. The light emitting device may provide a light source associated with the operation of the camera module 305. The light emitting device may include, for example, a light emitting diode (LED), an IR LED, or a xenon lamp.

[0088] The connector holes 308 and 309 may include a first connector hole 308 and / or a second connector hole 309, wherein the first connector hole 308 is suitable for a connector for sending power and / or data to an external electronic device and receiving power and / or data from an external electronic device (e.g., a USB connector), and the second connector hole 309 is suitable for a connector for sending audio signals to an external electronic device and receiving audio signals from an external electronic device (e.g., a headphone jack).

[0089] Some of the camera modules 305 and 312, some of the sensor modules 304 and 319, or indicators may be arranged to be exposed through the display 301. For example, the camera modules 305, sensor modules 304, or indicators may be arranged in the interior space of the electronic device 300 so as to be in contact with the external environment through an opening punched through the front plate 302 of the display 301. In another embodiment, some of the sensor modules 304 may be arranged to perform their functions in the interior space of the electronic device without being visually exposed through the front plate 302. In this case, for example, the area of ​​the display 301 facing the sensor modules may not require a punched opening.

[0090] Figure 3c Shown Shown Figure 3a An exploded perspective view of a mobile electronic device 300 is shown in FIG.

[0091] Reference Figure 3c , the mobile electronic device 300 may include a side frame structure 310, a first support member 3211 (e.g., a bracket), a front panel 302, a display 301, an electromagnetic induction panel, a PCB 340, a battery 350, a second support member 360 (e.g., a rear cover), an antenna 370, and a rear panel 311. The mobile electronic device 300 may omit at least one of the above components (e.g., the first support member 3211 or the second support member 360), or may further include another component. Some components of the electronic device 300 may be different from those of the mobile electronic device 300. Figure 3a or Figure 3b Components of the mobile electronic device 300 shown in FIG. 1 are the same or similar, and thus, description thereof is omitted below.

[0092] The first support member 3211 is arranged inside the mobile electronic device 300 and can be connected to the side frame structure 320 or integrated with the side frame structure 320. The first support member 3211 can be formed of, for example, a metal material and / or a non-metallic (e.g., polymer) material. The first support member 3211 can be combined with the display 301 on one side and can also be combined with the PCB 340 on the other side. A processor, memory, and / or interface can be mounted on the PCB 340. The processor can include, for example, one or more of a CPU, an AP, a GPU, an ISP, a sensor hub processor, or a CP.

[0093] The memory may include, for example, volatile memory or non-volatile memory.

[0094] The interface may include, for example, a High-Definition Multimedia Interface (HDMI), a USB interface, a Secure Digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the mobile electronic device 300 to an external electronic device and may include a USB connector, an SD card / MultiMediaCard (MMC) connector, or an audio connector.

[0095] The battery 350 is a device for supplying power to at least one component of the mobile electronic device 300 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be arranged on substantially the same plane as the PCB 340. The battery 350 may be integrally arranged within the mobile electronic device 300 and may be detachably arranged from the mobile electronic device 300.

[0096] Antenna 370 may be positioned between rear panel 311 and battery 350. Antenna 370 may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. Antenna 370 may perform short-range communication with external devices or transmit and receive power required for wireless charging. The antenna structure may be formed by a portion of side frame structure 320 and / or first support member 3211, or a combination of side frame structure 320 and first support member 3211.

[0097] Figure 4a A reference according to an embodiment of the present disclosure is shown. Figure 2 The structure of the third antenna module is described. Figure 4a (a) is a perspective view showing the third antenna module 246 viewed from one side, Figure 4a (b) is a perspective view showing the third antenna module 246 viewed from the other side, Figure 4a (c) shows the Figure 4a FIG. 2 is a cross-sectional view of the third antenna module 246 taken along line XX′ in FIG.

[0098] Reference Figure 4a , the third antenna module 246 includes a printed circuit board 410, an antenna array 430, an RFIC 452, and a PMIC 454. The third antenna module 246 further includes a shielding member 490. At least one of the above components may be omitted, or at least two of the components may be integrally formed.

[0099] The printed circuit board 410 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers. The printed circuit board 410 may provide electrical connections between the printed circuit board 410 and / or various electronic components disposed externally using wiring and conductive paths formed in the conductive layers.

[0100] Antenna array 430 includes multiple antenna elements 432, 434, 436, or 438 configured to form a directional beam. Antenna elements 432, 434, 436, or 438 may be formed on a first surface of printed circuit board 410. Antenna array 430 may be formed within printed circuit board 410. Antenna array 430 may include multiple antenna arrays of the same or different shapes or types (e.g., dipole antenna arrays and / or patch antenna arrays).

[0101] RFIC 452 may be disposed on a second surface of printed circuit board 410, opposite to the first surface, spaced apart from the antenna array. RFIC 452 is configured to process signals of a selected frequency band transmitted / received via antenna array 430. When transmitting, RFIC 452 may convert a baseband signal received from a communication processor into an RF signal of a specified frequency band. When receiving, RFIC 452 may convert an RF signal received via antenna array 430 into a baseband signal and transmit the baseband signal to the communication processor.

[0102] When transmitting, RFIC 452 may up-convert an IF signal (e.g., approximately 9 GHz to approximately 11 GHz) received from an intermediate frequency integrated circuit (IFIC) into an RF signal of a selected frequency band. When receiving, RFIC 452 may down-convert an RF signal received by antenna array 430, convert the RF signal into an IF signal, and transmit the IF signal to the IFIC.

[0103] The PMIC 454 may be provided in another local area (eg, the second surface) of the printed circuit board 410, spaced apart from the antenna array 430. The PMIC 454 may receive a voltage from the main PCB to provide power required by the RFIC 452 on the antenna module.

[0104] The shielding member 490 may be provided at a portion (eg, the second surface) of the printed circuit board 410, thereby electromagnetically shielding at least one of the RFIC 452 or the PMIC 454. The shielding member 490 may include a shield case.

[0105] Alternatively, the third antenna module 246 can be electrically connected to another printed circuit board (e.g., a main circuit board) via a module interface. The module interface can include a connection member, a coaxial cable connector, a board-to-board connector, an interposer, or a flexible printed circuit board (FPCB). The RFIC 452 and / or PMIC 454 of the antenna module can be electrically connected to the printed circuit board via the connection member.

[0106] Figure 4b This is a diagram showing an embodiment of the present disclosure. Figure 4a FIG. 4 is a cross-sectional view of the third antenna module 246 taken along line YY′ in FIG. 4A . The printed circuit board 410 of the illustrated embodiment may include an antenna layer 411 and a network layer 413 .

[0107] Reference Figure 4b The antenna layer 411 includes at least one dielectric layer 437 - 1 and an antenna element 436 and / or a feed portion 425 formed on or within an outer surface of the dielectric layer. The feed portion 425 may include a feed point 427 and / or a feed line 429 .

[0108] The network layer 413 includes at least one dielectric layer 437 - 2 , at least one ground layer 433 formed on or inside an outer surface of the dielectric layer, at least one conductive path 435 , a transmission line 423 and / or a feed line 429 .

[0109] Figure 4a (c) RFIC 452 can be electrically connected to network layer 413 via first solder bump 440-1 and second solder bump 440-2. Alternatively, various connection structures (e.g., solder or ball grid array (BGA)) can be used instead of solder bumps. RFIC 452 can be electrically connected to antenna element 436 via first solder bump 440-1, transmission line 423, and feed section 425. RFIC 452 can also be electrically connected to ground layer 433 via second solder bump 440-2 and conductive path 435. RFIC 452 can also be electrically connected to the module interface described above via feed line 429.

[0110] Figure 5 is a perspective view of an antenna structure 500 according to various embodiments.

[0111] Figure 5 The antenna structure 500 may be at least partially similar to Figure 2The third antenna module 246 may include another embodiment of the antenna structure.

[0112] Reference Figure 5 The antenna structure 500 may include a printed circuit board 590 and an array antenna AR1 disposed on the printed circuit board 590. Depending on the embodiment, the array antenna AR1 may include a plurality of conductive patches 510, 520, 530, and 540 arranged at predetermined intervals on a substrate 590 (e.g., a flexible printed circuit board (FPCB) and / or a printed circuit board (PCB)). Depending on the embodiment, the plurality of conductive patches 510, 520, 530, and 540 may be formed on the substrate 590. Depending on the embodiment, the substrate 590 may include a first surface 591 facing a first direction (① direction) and a second surface 592 facing a direction opposite to the first surface 591 (② direction). Depending on the embodiment, a wireless communication circuit 595 may be disposed on the second surface 592 of the substrate 590. In another embodiment, the wireless communication circuit 595 may be electrically connected to the substrate 590 via a separate electrical connection member (e.g., an FPCB and / or FRC; or a flexible printed circuit board (FPCB)-type RF cable) within an internal space of the electronic device, the internal space being spaced apart from the substrate 590. According to an embodiment, the plurality of conductive patches 510, 520, 530, and 540 may be electrically connected to the wireless communication circuit 595. According to an embodiment, the wireless communication circuit 595 may be configured to transmit and / or receive radio frequencies in the range of approximately 3 GHz to 100 GHz through the array antenna AR1.

[0113] According to various embodiments, the plurality of conductive patches 510, 520, 530, and 540 may include a first conductive patch 510, a second conductive patch 520, a third conductive patch 530, and a fourth conductive patch 540, which are arranged at predetermined intervals on a first surface 591 of a substrate 590 or in an area of ​​the substrate adjacent to the first surface 591. The conductive patches 510, 520, 530, and 540 may have substantially the same configuration. The antenna structure 500 according to the exemplary embodiment illustrates and describes an array antenna AR1 including four conductive patches 510, 520, 530, and 540, but is not limited thereto. For example, the antenna structure 500 may include one, two, or five or more conductive patches as the array antenna AR1. In another embodiment, the antenna structure may be replaced by a plurality of conductive patterns (e.g., dipole antenna radiators) arranged on the substrate 590, or may further include a plurality of conductive patterns. In this case, the conductive pattern may be arranged so that the beam pattern direction of the conductive pattern is formed in a direction (e.g., a vertical direction) different from the beam pattern direction of the conductive patches 510, 520, 530, and 540. Although not shown, the antenna structure 500 may further include a protective member (e.g., a polyurethane resin) as a protective means provided around the wireless communication circuit 595 on the second surface 592 of the substrate 590, and / or a conductive coating material (e.g., an EMI coating material) as an EMI shielding means applied to the outer surface of the protective member to shield noise.

[0114] Figure 6a is an exploded perspective view illustrating a state in which a supporting bracket 550 is applied to an antenna structure 500 according to various embodiments. Figure 6b is an assembled perspective view illustrating a state in which a support bracket 550 is applied to the antenna structure 500 according to various embodiments.

[0115] Reference Figure 6a and Figure 6b , electronic devices (e.g., Figure 3a The electronic device 300 may include a support bracket 550 made of a conductive material as a support device at least partially fixed to the antenna structure 500. According to an embodiment, the support bracket 550 may be fixed to a housing (eg, Figure 3a The first supporting member (eg, Figure 7 support member 3211) and / or a conductive member (eg, Figure 7 According to an embodiment, the support bracket 550 may be connected to the side member (eg, Figure 7 The conductive member (eg, Figure 7The support bracket 550 is in physical contact with the conductive member 321 of the antenna structure 500 to help enhance the rigidity of the antenna structure 500. According to an embodiment, the support bracket 550 may be formed of a metal member such as SUS, Cu, or Al, and thus may be used as a heat sink for effectively transferring high-temperature heat emitted from the antenna structure 500 to the outside.

[0116] According to various embodiments, the support bracket 550 may include a first support portion 551 at least partially facing the base 590 (e.g., facing the side of the base 590), and a second support portion 552 extending from the first support portion 551 and bent to face another portion of the base 590 (e.g., the second surface 592 of the base). According to an embodiment, the support bracket 550 may include one or more extension portions 5511 and 5512 extending from both ends of the first support portion 551 to be fixed to the side member (e.g., Figure 7 The first support member (eg, Figure 7 support member 3211) and / or a conductive member (eg, Figure 7 At least a portion of the conductive member 321 of the support bracket 550). According to an embodiment, one or more extensions 5511 and 5512 may be formed to extend in opposite directions of the support bracket 550, respectively. In another embodiment, one or more extensions 5511 and 5512 may extend from the second support portion 552. Therefore, the antenna structure 500 may be supported by the first support portion 551 and the second support portion 552 of the support bracket 550, and fixed to the side member (for example, the side member) by a fastening member (such as a screw) as a fastening means through the one or more extensions 5511 and 5512. Figure 7 The first support member (eg, Figure 7 support member 3211) and / or a conductive member (eg, Figure 7 at least a portion of the conductive member 321 ).

[0117] Figure 7 According to various embodiments, Figure 3b A partial cross-sectional view of the electronic device 300 taken along line AA′.

[0118] Reference Figure 7The electronic device 300 may include a housing 310 (e.g., a housing structure) including a front cover 302 (e.g., a first cover, a first plate, a front plate, or a transparent cover) facing a first direction (-Z-axis direction), a rear cover 311 (e.g., a second cover, a second plate, or a rear plate) facing a direction opposite to the front cover 302 (the Z-axis direction), and a side member 320 surrounding a space 3001 between the front cover 302 and the rear cover 311. According to an embodiment, the side member 320 may include a conductive member 321 (e.g., a metal member) at least partially disposed and a non-conductive member 322 (e.g., a polymer) coupled to the conductive member 321 (e.g., a first non-conductive member). In another embodiment, the non-conductive member 322 may be replaced by a space or another dielectric material. In an embodiment, the non-conductive member 322 may be insert-injected into the conductive member 321. In another embodiment, the non-conductive member 322 may be structurally coupled to the conductive member 321. According to an embodiment, the side member 320 may include a support member 3211 (e.g., Figure 3c The first support member 3211 (e.g., the second non-conductive member) serves as a supporting device extending from the side member 320 to at least a portion of the internal space 3001. According to an embodiment, the support member 3211 may extend from the side member 320 to the internal space 3001, or may be formed by structural coupling with the side member 320. According to an embodiment, the support member 3211 may extend from the conductive member 321. According to an embodiment, the support member 3211 may support at least a portion of the antenna structure 500 provided in the internal space 3001. According to an embodiment, the support member 3211 may be provided to support at least a portion of the display 301 as a display device. According to an embodiment, the display 301 may be provided to be visible from the outside through at least a portion of the front cover 302. According to an embodiment, the display 301 may include a flexible display.

[0119] According to various embodiments, the antenna structure 500 may be disposed in the inner space 3001 of the electronic device 300 in a direction perpendicular to the front cover 302 by the support bracket 550. According to an embodiment, the antenna structure 500 may be installed so that the conductive patch (e.g., Figure 5 The array antenna AR1 of the conductive patches 510, 520, 530 and 540 of the electronic device 300 faces the side member 320. For example, the antenna structure 500 may be arranged so that the first surface 591 of the substrate 590 faces the side member 320, so that the array antenna AR1 can form a beam pattern in the direction (for example, ① direction) facing the side member 320 of the electronic device 300. According to an embodiment, the array antenna AR1 may form a beam pattern in the direction (for example, ① direction) facing the side member 320 through the non-conductive member 322 of the side member 320. According to an embodiment, the electronic device 300 may include a device substrate 340 (for example, Figure 3cAccording to an embodiment, although not shown, the antenna structure 500 may be electrically connected to the device substrate 340 through an electrical connector (eg, an FPCB connector) as an electrical connection means.

[0120] Figure 8 It is along Figure 3b A cross-sectional view taken along line BB′ illustrates a partial configuration of an electronic device according to various embodiments.

[0121] In the example shown, the rear cover is viewed from above (e.g. Figure 7 Back cover 311) Figure 8 , only the conductive member 321 is observed, and the non-conductive member 322 is substantially hidden, although the non-conductive member is given a reference numeral for comparison between the areas of the non-conductive member and the conductive member 321. The non-conductive member 322 may be a non-conductive member made of a polymer and may be coupled to the conductive member 321.

[0122] Reference Figure 8The side member 320 may include a non-conductive member 322 (e.g., a polymer) disposed in an area that radiates the beam pattern formed by the antenna structure 500. Depending on the embodiment, the non-conductive member 322 may be inserted and injected into the surrounding conductive member 321. Depending on the embodiment, a boundary region between the non-conductive member 322 and the conductive member 321 may be disposed near the antenna structure 500. Depending on the embodiment, after the conductive member 321 and the non-conductive member 322 are coupled to each other, the boundary region may have a coupling structure that prevents the conductive and non-conductive members from separating from each other even under external impact. Depending on the embodiment, when the side member 320 is viewed from the outside, the boundary region may be disposed at least at a location that does not overlap with the antenna structure 500. For example, the conductive member 321 may include a recessed portion 3221 formed concavely in a direction away from the base 590 in the boundary region with the non-conductive member 322, and including one or more stepped portions 3221a, 3221b, and 3221c. According to an embodiment, the non-conductive member 322 can be filled into the recess 3221 by insertion injection and thus formed as part of the side member 320 of the electronic device 300. In another embodiment, in addition to the array antenna AR1, the base 590 may also have at least one other electrical component mounted thereon, and in this case, the length of the base 590 may become longer. For example, when at least one electrical component is further mounted on the base 590, the recess 3221 formed by one or more steps 3221a, 3221b, and 3221c in the boundary region between the conductive member 321 and the non-conductive member 322 does not overlap with the array antenna AR1 and may gradually become higher or lower as the recess moves to the left or right away from the array antenna AR1. In this case, when the side member is viewed from the outside, the recess 3221 does not overlap with the array antenna AR1, but may at least partially overlap with the base 590. According to various embodiments, when the side member 320 is viewed from the outside, the recess 3221 may include a plurality of stepped portions 3221a, 3221b, and 3221c formed to gradually become higher or lower as the stepped portion moves away from the base 590 in the left-right direction of the antenna structure 500. According to embodiments, the plurality of stepped portions 3221a, 3221b, and 3221c may be formed along the direction toward the rear cover (e.g., Figure 7The recess 3221 may be formed such that the angle θ formed by a first imaginary line L1 connecting the first, second, and third step portions 3221a, 3221b, 3221c and extending perpendicularly from both ends of the base 590 (e.g., the shorter side 593) in the outward direction of the side member 320 ranges from approximately 30° to 60°. In another embodiment, four or more stepped portions may be formed. According to an embodiment, when the side member 320 is viewed from the outside, the antenna structure 500 can smoothly form a beam pattern through the recess 3221, which includes a plurality of stepped portions 3221a, 3221b, and 3221c extending at different heights in the left-right direction of the base 590. In addition, since the side member 320 has an extended contact area with the non-conductive member 322 through the plurality of stepped portions 3221a, 3221b, and 3221c, the side member can provide enhanced bonding force during insertion and injection, thereby contributing to enhanced rigidity.

[0123] Figure 9 The arrangement relationship of the antenna structure 500 in the electronic device according to various embodiments is shown.

[0124] Figure 9 The electronic device 900 may be at least partially similar to Figure 1 electronic device 101 or Figure 3a The electronic device 300 may also include other embodiments of the electronic device.

[0125] Reference Figure 9 , the electronic device 900 (eg, Figure 7 The electronic device 300 may include a side member 910 (eg, Figure 7 According to an embodiment, the side member 910 may include a first side 911 having a first length, a second side 912 extending from the first side 911 in a vertical direction and having a second length shorter than the first length, a third side 913 extending from the second side 912 in parallel with the first side 911 and having the first length, and a fourth side 914 extending from the third side 913 to have the second length and connected to the first side.

[0126] According to various embodiments, the electronic device 900 may include a pair of antenna structures 500 and 500-1 arranged in an internal space thereof. According to an embodiment, each of the pair of antenna structures 500 and 500-1 may have a Figure 5The antenna structure 500 is substantially the same as the structure of FIG. Figure 8 As shown, each of the pair of antenna structures 500 and 500-1 may have a substantially identical arrangement to that of the non-conductive member 322 coupled to the recess 3221 formed in the conductive member 321. Depending on the embodiment, when an external impact is applied, the rigidity of the side member 910 may be weakened due to the partial arrangement of the non-conductive member 322, or the side member may be permanently deformed (e.g., twisted). Therefore, the pair of antenna structures 500 and 500-1 may have an arrangement that minimizes deformation of the side member 910. For example, one antenna structure 500 of the pair of antenna structures 500 and 500-1 may be positioned at a first point adjacent to the first side 911. Depending on the embodiment, the other antenna structure 500-1 may be positioned at a second point on the third side 913 that is diagonally symmetrical to the first point. In another embodiment, the pair of antenna structures 500 and 500-1 may be positioned at diagonally symmetrical points on the second side 912 and the opposing fourth side 914, respectively. In another embodiment, when the electronic device 900 includes two or more antenna structures, the antenna structures may be disposed at points on the first side 911 , the second side 912 , the third side 913 , and the fourth side 914 , which are diagonally symmetrical to each other.

[0127] Figure 10a and Figure 10b A comparison between the radiation areas of the antenna structure 500 before and after forming the recess 3221 according to various embodiments is shown.

[0128] Reference Figure 10a and Figure 10b , it can be seen that the Figure 10a Compared to the case of the antenna structure 500, the radiation area formed by the antenna structure 500 extends more outward from the antenna structure 500, and in the case of the recess 3221 for receiving the non-conductive member 322 Figure 10b In this case, the radiation area is further increased, which may indicate that the radiation performance of the antenna structure 500 is improved.

[0129] Figure 11 is a partial perspective view illustrating a state where an electronic device is provided with an antenna structure 500 according to various embodiments. Figure 12a According to various embodiments, Figure 11 A partial cross-sectional view of the electronic device 300 taken along line CC'.

[0130] In the description Figure 11 and Figure 12a , the same reference numerals are assigned to the same components of the electronic device 300 including the above-described antenna structure 500 and the side member 320 , and a detailed description thereof may be omitted.

[0131] In the example shown, the rear cover is viewed from above (e.g. Figure 7 Back cover 311) Figure 11 , only the conductive member 321 is observed, while the non-conductive member 322 is substantially hidden, although the non-conductive member is given a reference numeral for comparison between the areas of the non-conductive member and the conductive member 321 .

[0132] Reference Figure 11 and Figure 12a , the side member 320 may include a conductive member 321 and a first non-conductive member 322 (eg, an injection molding material) (eg, Figure 8 The first non-conductive member 322 is coupled to the conductive member 321 and is disposed in an area of ​​the substrate 590 facing the antenna structure 500 .

[0133] According to various embodiments, the side member 320 may include at least one through-hole 3222 formed in at least a portion of the area facing the front cover 302 and arranged so that the first non-conductive member 322 extends. According to embodiments, the first non-conductive member 322 may be exposed to the outer surface of the side member 320 through the at least one through-hole 3222. According to embodiments, the at least one through-hole 3222 may be arranged to at least partially face the space between the display 301 and the conductive member 321. Thus, the beam pattern generated by the antenna structure 500 may be radiated through the at least one through-hole 3222. According to embodiments, the number of at least one through-hole 3222 may be determined by at least one conductive connection portion 3223, which serves as a connecting means connected to intersect with the at least one through-hole 3222. For example, as shown in the figure, when one conductive connection portion 3223 is formed, the at least one through-hole 3222 may include two through-holes 3222. In another embodiment, when the two conductive connection portions 3223 are spaced apart at a predetermined interval, the at least one through-hole 3222 may include three through-holes 3222. In an embodiment, one through hole 3222 may be formed without the conductive connection portion 3223 .

[0134] According to various embodiments, the total length M1 including the via 3222 (e.g., the first injection region filling the via) may be formed to be shorter than the total length M2 of the first nonconductive member 322 including the recess 3221. In another embodiment, the total length M1 of the via 3222 (e.g., the first injection region filling the via) may be formed to be the same as or longer than the total length M2 of the first nonconductive member 322 including the recess 3221, depending on the beam shape and / or radiation direction of the beam pattern passing through the via.

[0135] According to various embodiments, at least one through-hole 3222 may include one or more flanges 3222a and 3222b as supporting means, the one or more flanges 3222a and 3222b extending at least partially from the edge of the through-hole 3222 toward the center of the through-hole 3222. According to embodiments, the one or more flanges 3222a and 3222b may be formed to have a thickness equal to or less than that of the conductive member 321. According to embodiments, the one or more flanges 3222a and 3222b may extend from the edges of the through-hole facing each other toward the center of the through-hole. The one or more flanges 3222a and 3222b may strengthen the coupling force of the first non-conductive member 322 inserted into the through-hole 3222 and may help strengthen the rigidity of the side member 320.

[0136] According to various embodiments, the side member 320 may include a second non-conductive member 3211 (eg, Figure 3c The second non-conductive member 3211 may be formed of a different material than the first non-conductive member 322. In some embodiments, the first non-conductive member 322 may be formed of a dielectric material with a low dielectric constant that can help improve the radiation performance of the antenna structure 500, and the second non-conductive member 3211 may be formed of a reinforced synthetic resin material to enhance rigidity. In another embodiment, the second non-conductive member 3211 may be formed of the same material as the first non-conductive member 322. In this case, when the first non-conductive member 322 is inserted and injected into the conductive member 321, the second non-conductive member 3211 may be formed together.

[0137] Figure 12b According to various embodiments, Figure 11 FIG. 1 is a partial cross-sectional view of the side member 320 taken along line DD′.

[0138] Reference Figure 12b , the side member 320 may include a first non-conductive member 322 inserted and injected into the conductive member 321. According to an embodiment, the conductive member 321 may include a recess 3221 including a plurality of stepped portions (eg, Figure 8 The conductive member 321 may include a plurality of stepped portions 3221a, 3221b, and 3221c. According to an embodiment, the conductive member 321 may have at least one insertion groove 3224 formed around the recess 3221 as an inwardly recessed recess structure. According to an embodiment, the at least one insertion groove 3224 may receive the first non-conductive member 322 to expand the contact surface, thereby helping to enhance the rigidity of the side member 320.

[0139] Figure 12cA side member 320 of the electronic device 300 showing a state in which the non-conductive member 322 - 1 or 322 - 2 is coupled to the conductive member 321 is illustrated according to various embodiments.

[0140] Reference Figure 12c , the electronic device 300 may include a conductive member 321 and one or more non-conductive members 322-1 and 322-2 inserted, injected into, or coupled to the conductive member 321. According to an embodiment, the one or more non-conductive members 322-1 and 322-2 may include a first non-conductive member 322-1 disposed around the antenna structure 500 and a second non-conductive member 322-2 disposed in another area. According to an embodiment, the first non-conductive member 322-1 and the second non-conductive member 322-2 may be formed of different materials or the same material. According to an embodiment, the one or more non-conductive members 322-1 and 322-2 may be arranged to have different injection amounts for each area according to the radiation direction of the antenna structure 500. For example, as shown in the figure, when the back cover (e.g., Figure 7 When forming a beam pattern in a direction facing the rear cover 311 of the antenna structure 500 or the side member 320, the antenna structure 500 may be configured such that an injection amount of the rear surface or the side surface is greater than an injection amount of other regions.

[0141] Figure 13 A partial configuration of a side member having a plurality of through-holes formed therethrough is shown according to various embodiments.

[0142] Reference Figure 13 , the side member 320 may include at least one through hole 3222. According to an embodiment, the number of the at least one through hole 3222 may be determined by at least one conductive connection portion 3223 interlaced with the through hole 3222. For example, as shown in the figure, four through holes 3222 may be formed by three conductive connection portions 3223a, 3223b, and 3223c spaced apart from each other by a predetermined interval.

[0143] Figure 14a is a graph showing a comparison of performances of antenna structures according to the number of through holes in a first frequency band and a second frequency band according to various embodiments, and Figure 14b is a graph showing a comparison of performances of antenna structures according to the number of through holes in a first frequency band and a second frequency band according to various embodiments.

[0144] Figure 14a is a graph showing cumulative distribution function (CDF) characteristics of the antenna structure 500 according to the number of through holes 3222 in the n261 band (approximately 28 GHz band) as the first frequency band, and Figure 14bis a graph showing CDF characteristics of the antenna structure 500 according to the number of through holes 3222 in the n260 band (approximately 39 GHz band) which is a second frequency band higher than the first frequency band.

[0145] Reference Figure 14a and 14b As shown in Table 1 below, in the CDF 0.2 segment (S1 segment and S4 segment), the CDF 0.5 segment (S2 segment and S5 segment), and the CDF 0.8 segment (S3 segment and S6 segment), in the case of having two through holes 3222 formed by one conductive connecting portion 3223 (for example, Figure 11 In the case of (hole + RIB1), the gain is improved more than in the case of no through-holes (default) or the case of four through-holes 3222 formed by three conductive connections 3223a, 3223b, and 3223c (hole + RIB3). This indicates that when through-holes 3222 are present, the fewer through-holes there are, the better the performance of the antenna structure.

[0146]

Table 1

[0147]

[0148] According to various embodiments, an electronic device (e.g., Figure 7 The electronic device 300 may include: a side member (eg, Figure 7 The side member 320) of the housing (eg, Figure 7 310 of the housing), the side member includes a conductive member (eg, Figure 7 321) and a non-conductive member coupled to the conductive member (eg, Figure 7 and disposed in the interior space of the housing and including a base (eg, Figure 7 substrate 590) and at least one antenna element (e.g., Figure 7 At least one antenna structure (eg, Figure 7 The antenna structure 500 is provided in such a manner that the substrate is disposed facing the side member, and at least one antenna element is disposed on the substrate and includes a beam pattern formed through the non-conductive member in a direction facing the side member, wherein: when the side member is viewed from the outside, a boundary region between the conductive member and the non-conductive member is disposed in a region that does not overlap with the substrate; and in the boundary region, the conductive member includes at least one recess (e.g., Figure 8 and at least one recess includes two or more steps (eg, Figure 83221a, 3221b and 3221c), when the side member is viewed from the outside, the two or more step portions gradually become higher or lower as the step portions move away from the base to the left or right.

[0149] According to various embodiments, the housing may include a first cover (e.g., Figure 7 a front cover 302 facing in a direction opposite to the first cover (eg, Figure 7 The back cover 311) and the inner space between the first cover and the second cover (eg, Figure 7 The side member may include an inner space 3001 of the base, and when the side member is viewed from the outside, the two or more stepped portions may be formed to gradually become higher as the stepped portion moves leftward or rightward away from the base and becomes closer to the second cover.

[0150] According to various embodiments, an electronic device may include a wireless communication circuit (e.g., Figure 7 The wireless communication circuit 595 is disposed in the internal space and is configured to send and / or receive wireless signals in the range of approximately 3 GHz to 100 GHz through at least one antenna element.

[0151] According to various embodiments, wireless communications circuitry may be mounted on a substrate.

[0152] According to various embodiments, at least one recess may be formed such that a line extending from a first virtual line (eg, Figure 8 ) and a second virtual line (eg, Figure 8 The angle formed by the second virtual line L2) is in the range of about 30° to 60°, the first virtual line is formed by two or more step portions, and the second virtual line is formed perpendicularly from the end of the base in the outward direction of the side member.

[0153] According to various embodiments, the side member may further include at least one through hole (e.g., Figure 11 The non-conductive member is configured to extend through the at least one through hole.

[0154] According to various embodiments, the non-conductive member may be exposed to the outer surface of the side member through the at least one through-hole.

[0155] According to various embodiments, the total length of at least one through-hole (eg Figure 11 The total length M1 of the through-hole in the embodiment may be formed to be shorter than, equal to, or longer than the total length of the non-conductive member (eg, Figure 11 The total length M2 of the non-conductive components in the ).

[0156] According to various embodiments, at least a portion of the beam pattern may be formed to pass through at least one through-hole.

[0157] According to various embodiments, the number of at least one through-hole can be increased by connecting at least one conductive connection portion (eg, Figure 11 is determined by the conductive connection portion 3223).

[0158] According to various embodiments, the at least one electrically conductive connection may integrally extend from the electrically conductive member.

[0159] According to various embodiments, the electronic device may include at least one flange (eg Figure 11 A flange 3222a) extends at least partially from an edge of at least one through hole in a center direction of the through hole.

[0160] According to various embodiments, the at least one flange may be formed to have a thickness equal to or smaller than a thickness of the conductive member.

[0161] According to various embodiments, at least one through hole may be provided at a position facing the substrate.

[0162] According to various embodiments, at least one through-hole may be formed to have a length equal to or longer than a length of the substrate.

[0163] According to various embodiments, the side member may include another non-conductive member (e.g., Figure 12a second non-conductive member 3211).

[0164] According to various embodiments, the other non-conductive member may be formed of the same material as the non-conductive member or a different material.

[0165] According to various embodiments, the non-conductive member may be formed of a polymer having a lower dielectric constant than that of another non-conductive member.

[0166] According to various embodiments, the side members (e.g. Figure 9 The side member 910 may include a first side having a first length (eg, Figure 9 ), a second side (eg, a first side 911 extending in a vertical direction from the first side and having a second length shorter than the first length) Figure 9 a second side 912 of the first side), a third side extending from the second side parallel to the first side and having a first length (eg, Figure 9 and a fourth side (eg, a third side 913) extending from the third side to have a second length and connected to the first side. Figure 9 914 ), and the at least one antenna structure may include a first antenna structure disposed at a first point adjacent to the first side (eg, Figure 9 a first antenna structure 500) and a second antenna structure (eg, Figure 9second antenna structure 500 - 1 ).

[0167] According to various embodiments, the electronic device may further include a display (eg, Figure 7 A display 301 is provided in the interior space so as to be at least partially visible from the outside through the first cover.

[0168] Example 1 of the present disclosure may be a device having a housing (e.g., Figure 7 The housing 310 includes a side member (eg, Figure 7 320 ), which includes a conductive member (eg, Figure 7 321) and a non-conductive member coupled to the conductive member (eg, Figure 7 and disposed in the interior space of the housing and including a base (eg, Figure 7 substrate 590) and at least one antenna element (e.g., Figure 7 At least one antenna structure (eg, Figure 7 The antenna structure 500 is provided in such a manner that the substrate is disposed facing the side member, and at least one antenna element is disposed on the substrate and includes a beam pattern formed through the non-conductive member in a direction facing the side member, wherein: when the side member is viewed from the outside, a boundary region between the conductive member and the non-conductive member is disposed in a region that does not overlap with the substrate; and in the boundary region, the conductive member includes at least one recess (e.g., Figure 8 and at least one recess includes two or more steps (eg, Figure 8 3221a, 3221b and 3221c), when the side member is viewed from the outside, the two or more step portions gradually become higher or lower as the step portions move away from the base to the left or right.

[0169] Example 2 can be a device according to Example 1 or any other example described herein, wherein the housing includes a first cover; a second cover facing in a direction opposite to the first cover; and a side member surrounding an internal space between the first cover and the second cover, and wherein when the side member is viewed from the outside, two or more step portions are formed to gradually become higher as the step portion moves away from the base to the left or right and becomes closer to the second cover.

[0170] Example 3 can be a device according to Example 1 or Example 2 or any other example described herein, wherein the device also includes a wireless communication circuit that is disposed in the internal space and is configured to send and / or receive wireless signals in the range of approximately 3 GHz to 100 GHz through at least one antenna element.

[0171] Example 4 may be an apparatus according to any of Examples 1 to 3 or any other example described herein, wherein the wireless communication circuit is mounted on a substrate.

[0172] Example 5 can be a device according to any one of Examples 1 to 4 or any other example described herein, wherein at least one recess is formed so that an angle formed by a first virtual line and a second virtual line has a range of approximately 30° to 60°, the first virtual line is formed by two or more step portions, and the second virtual line is formed vertically from the end of the base in an outward direction of the side member.

[0173] Example 6 can be an apparatus according to any one of Examples 1 to 5 or any other example described herein, wherein the side member further includes at least one through hole formed in at least a portion of the area facing the first cover, and the non-conductive member is configured to extend through the at least one through hole.

[0174] Example 7 may be the apparatus of any of Examples 1 to 6 or any other example described herein, wherein a total length of the at least one through-hole is formed to be shorter than, equal to, or longer than a total length of the non-conductive member.

[0175] Example 8 may be the apparatus of any of Examples 1 to 7 or any other example described herein, wherein at least a portion of the beam pattern is formed through at least one through-hole.

[0176] Example 9 may be the apparatus of any of Examples 1 to 8 or any other example described herein, wherein the number of the at least one through-hole is determined by at least one conductive connection connected to be interleaved with the through-holes.

[0177] Example 10 can be a device according to any of Examples 1 to 9 or any other example described herein, wherein the device also includes at least one flange that extends at least partially from an edge of at least one through hole in a center direction of the through hole.

[0178] Example 11 can be the apparatus of any of Examples 1 to 10 or any other example described herein, wherein at least one flange is formed to have a thickness equal to or less than a thickness of the conductive member.

[0179] Example 12 can be the apparatus of any of Examples 1 to 11 or any other example described herein, wherein the at least one through-hole is disposed at a position facing the substrate.

[0180] Example 13 can be the apparatus of any of Examples 1 to 12 or any other example described herein, wherein at least one through-hole is formed to have a length equal to or longer than a length of the substrate.

[0181] Example 14 can be the apparatus of any of Examples 1 to 13 or any other example described herein, wherein the side member includes another non-conductive member extending at least partially into the interior space.

[0182] Example 15 can be an apparatus according to any one of Examples 1 to 14 or any other example described herein, wherein the side member includes a first side having a first length, a second side extending from the first side in a vertical direction and having a second length shorter than the first length, a third side extending from the second side parallel to the first side and having the first length, and a fourth side extending from the third side, having the second length and connected to the first side, and wherein at least one antenna structure includes a first antenna structure and a second antenna structure, the first antenna structure is arranged at a first point adjacent to the first side, and the second antenna structure is arranged at a second point adjacent to the third side and diagonally symmetrical to the first point.

[0183] The scope of protection is defined by the accompanying independent claims. Additional features are specified by the accompanying dependent claims. Example embodiments can be implemented comprising one or more features of any claim taken collectively and individually in any and all arranged combinations.

[0184] The examples described in the present disclosure include non-limiting example embodiments of components corresponding to one or more features specified by the appended independent claims, and these features (or their corresponding components) may contribute individually or in combination to improving one or more technical problems that can be inferred from the present disclosure by those skilled in the art.

[0185] Furthermore, one or more selected components of any one example described in this disclosure may be combined with one or more selected components of any other one or more examples described in this disclosure, or optionally may be combined with features of the appended independent claims to form another alternative example.

[0186] Additional example embodiments may be implemented including one or more components of any of the embodiments described herein employed together and separately in any and all arrangements and combinations. Additional example embodiments may also be implemented by combining the features of one or more of the appended claims with one or more selected components of any of the example embodiments described herein.

[0187] In forming such additional example embodiments, some components of any example embodiment described in the present disclosure may be omitted. One or more components that may be omitted are those components that a person skilled in the art will directly and clearly recognize as not essential to the functionality of the present technology based on the technical problems discernible from the present disclosure. A person skilled in the art will recognize that replacing or removing such omitted components does not require modifying other components or features of another optional example to compensate for the changes. Therefore, according to the present technology, additional example embodiments may be included even if a selected combination of features and / or components is not specifically set forth in the present disclosure.

[0188] Where possible, two or more physically distinct components in any described example embodiment of the present disclosure may be optionally integrated into a single component, so long as the single component formed thereby performs the same functionality. Conversely, where appropriate, a single component in any described example embodiment of the present disclosure may be optionally implemented as two or more distinct components to achieve the same functionality.

Claims

1. An electronic device comprising: a housing including a side member including a conductive member and a non-conductive member coupled to the conductive member; as well as at least one antenna structure disposed in the interior space of the housing and comprising a base and at least one antenna element, the base being disposed facing the side member, and the at least one antenna element being disposed on the base and comprising a beam pattern formed through the non-conductive member in a direction facing the side member, wherein, when the side member is viewed from the outside, a boundary region between the conductive member and the non-conductive member is provided in a region that does not overlap with the base, wherein, in the boundary region, the conductive member includes at least one recess, the at least one recess being formed concavely in a direction away from the base and being formed to at least partially receive the non-conductive member, and The at least one recess includes two or more stepped portions, and when the side member is viewed from the outside, the two or more stepped portions gradually become higher or lower as the two or more stepped portions move leftward or rightward away from the base.

2. The electronic device according to claim 1, wherein the housing comprises: a first cover; a second cover facing in a direction opposite to the first cover; and the side members surrounding the inner space between the first cover and the second cover, and When the side member is viewed from the outside, the two or more step portions are formed to gradually become higher as the two or more step portions move leftward or rightward away from the base and become closer to the second cover.

3. The electronic device according to claim 1, further comprising: A wireless communication circuit is disposed in the internal space and is configured to transmit and / or receive wireless signals within a range of 3 GHz to 100 GHz through the at least one antenna element.

4. The electronic device according to claim 3, wherein: The wireless communication circuit is mounted on the substrate.

5. The electronic device according to claim 1, wherein The at least one recess is formed so that an angle formed by a first virtual line formed by the two or more step portions and a second virtual line is formed perpendicularly from an end portion of the base in an outward direction of the side member is in a range of 30° to 60°. The electronic device according to claim 1 , wherein: The side member further includes at least one through-hole formed in at least a portion of a region facing the first cover, and the non-conductive member is provided to extend through the at least one through-hole.

7. The electronic device according to claim 6, wherein: A total length of the at least one through hole is formed to be shorter or longer than a total length of the non-conductive member.

8. The electronic device according to claim 6, wherein: At least a portion of the beam pattern is formed to pass through the at least one through-hole.

9. The electronic device according to claim 6, wherein: The number of the at least one through hole is determined by at least one conductive connection portion connected to be interlaced with the through hole.

10. The electronic device according to claim 6, further comprising: At least one flange at least partially extends from an edge of the at least one through hole in a center direction of the through hole. The electronic device according to claim 10 , wherein: The at least one flange is formed to have a thickness equal to or smaller than a thickness of the conductive member.

12. The electronic device according to claim 6, wherein: The at least one through hole is provided at a position facing the substrate.

13. The electronic device according to claim 12, wherein: The at least one through hole is formed to have a length equal to or longer than a length of the substrate.

14. The electronic device according to claim 1, wherein The side member includes another non-conductive member extending at least partially into the interior space.

15. The electronic device according to claim 1, wherein The side member includes a first side having a first length, a second side extending in a vertical direction from the first side and having a second length shorter than the first length, a third side extending from the second side parallel to the first side and having the first length, and a fourth side extending from the third side to have the second length and connected to the first side, and The at least one antenna structure includes: a first antenna structure and a second antenna structure, the first antenna structure is arranged at a first point adjacent to the first side, and the second antenna structure is arranged at a second point adjacent to the third side and diagonally symmetrical to the first point.

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