Display device

Abstract

Disclosed is a display device including an organic light emitting display panel including a thin film encapsulation layer; a first conductive layer directly on the thin film encapsulation layer; a second conductive layer on the thin film encapsulation layer, the second conductive layer being on a layer other than the first conductive layer; at least one inorganic layer on the thin film encapsulation layer and having a density of about 2.05 g / cm 3 to about 2.4 g / cm 3 ; an organic layer on the at least one inorganic layer; and a window facing the organic light emitting display panel, the first conductive layer, the at least one inorganic layer, and the organic layer being between the window and the organic light emitting display panel. In the display device according to an embodiment of the disclosure, generation of bubbles can be inhibited or reduced.

Description

[0001] This application is a divisional application of the patent application "Display device" with the application number 201710505747.6 and the filing date of 28 June 2017. TECHNICAL FIELD

[0002] One or more aspects of embodiments of the present disclosure herein relate to a display device, and more particularly, to a display device including a high-density inorganic layer. BACKGROUND

[0003] Various display devices that can be used in multimedia devices such as televisions, mobile phones, tablet computers, navigation devices, and game consoles are being developed. The display devices generally include a keyboard or a mouse as an input unit. In addition, in recent years, the display devices can include a touch panel as an input unit.

[0004] The display devices undergo a reliability evaluation in harsh conditions before being released to the market. Only the products that pass the reliability evaluation are then sold to consumers. SUMMARY

[0005] One or more aspects of embodiments of the present disclosure relate to a display device that exhibits improved reliability in harsh conditions.

[0006] Embodiments of the inventive concept provide a display device including an organic light emitting display panel, a window, a first conductive layer, a second conductive layer, at least one inorganic layer, and an organic layer. The organic light emitting display panel can include a base layer, a circuit layer on the base layer, a light emitting element layer on the circuit layer, and a thin film encapsulation layer on the light emitting element layer. The first conductive layer can be directly on the thin film encapsulation layer, and the second conductive layer can be on the thin film encapsulation layer, wherein the second conductive layer can be on a layer other than the first conductive layer. The at least one inorganic layer can be on the thin film encapsulation layer and can have a density of about 2.05 g / cm 3 to about 2.4 g / cm 3 The organic layer can be on the at least one inorganic layer. The window can face the organic light emitting display panel, and the first conductive layer, the at least one inorganic layer, and the organic layer are between the window and the organic light emitting display panel.

[0007] In an embodiment, the at least one inorganic layer can include a silicon nitride layer having a density of about 2.05 g / cm 3 to about 2.4 g / cm 3

[0008] In an embodiment, the thin film encapsulation layer can include a plurality of inorganic thin films, and at least one organic thin film between the plurality of inorganic thin films. ​

[0009] In an embodiment, the at least one inorganic layer can include a first inorganic layer between the first conductive layer and the second conductive layer, and a second inorganic layer on the first conductive layer and the second conductive layer.

[0010] In an embodiment, the at least one inorganic layer can be between the first conductive layer and the second conductive layer, and the organic layer can be directly on the second conductive layer.

[0011] In an embodiment, the display apparatus can further include an organic adhesive layer configured to couple the window to the organic light emitting display panel.

[0012] In an embodiment, the at least one inorganic layer can be directly on the second conductive layer, and the display apparatus can further include an intermediate insulating layer between the first conductive layer and the second conductive layer.

[0013] In an embodiment, the organic layer can include an organic adhesive layer configured to couple the window to the organic light emitting display panel.

[0014] In an embodiment, the display apparatus can further include a polarizing film between the at least one inorganic layer and the window.

[0015] In an embodiment, the first conductive layer can include a bridge portion, and the second conductive layer can include a connection portion crossing the bridge portion, respectively, a first touch sensor portion connecting adjacent first touch sensor portions, respectively, and a second touch sensor portion connecting adjacent touch sensor portions, respectively, by the bridge portion.

[0016] In an embodiment, the light emitting element layer can include an emission area and a non-emission area adjacent to the emission area, and each of the first touch sensor portion and the second touch sensor portion can have a mesh pattern and can overlap the non-emission area.

[0017] In an embodiment, the first conductive layer can include a connection portion, a first touch sensor portion connecting adjacent first touch sensor portions, respectively, and a second touch sensor portion spaced apart from the first touch sensor portion. The second conductive layer can include a bridge portion connecting adjacent second touch sensor portions, respectively, and crossing the connection portion, respectively.

[0018] In an embodiment, the first conductive layer can include a first connection portion and a first touch sensor portion connecting adjacent first touch sensor portions, respectively. The second conductive layer can include a second connection portion crossing the first connection portion, respectively, and a second touch sensor portion connecting adjacent second touch sensor portions, respectively, by the second connection portion.

[0019] In an embodiment, there can be a phase difference of about 180° between the first reflected light reflected by the first conductive layer and the second reflected light reflected by the second conductive layer.

[0020] In an embodiment, the at least one inorganic layer can include a first inorganic layer between the first conductive layer and the second conductive layer, and a second inorganic layer on the first conductive layer and the second conductive layer.

[0021] In an embodiment, the window can include a plastic film. The organic layer can include an organic adhesive layer in contact with the window.

[0022] In an embodiment of the inventive concept, a display device can include an organic light emitting display panel, a touch sensing unit, an organic adhesive layer, and a window. The organic light emitting display panel can include a base layer, a circuit layer on the base layer, a light emitting element layer on the circuit layer, and an encapsulation layer on the light emitting element layer. The touch sensing unit can be directly on the thin film encapsulation layer, and the organic adhesive layer can be on the touch sensing unit. The window can face the organic light emitting display panel, and the touch sensing unit and the organic adhesive layer can be between the window and the organic light emitting display panel.

[0023] The touch sensing unit can include a conductive pattern directly on the thin film encapsulation layer, and an insulating layer covering the conductive pattern. The insulating layer can include an inorganic layer having a density of about 2.05 g / cm 3 to about 2.4 g / cm 3 .

[0024] In an embodiment of the inventive concept, a display device can include a display panel including a first inorganic layer, a first conductive pattern directly on the first inorganic layer, a first insulating layer covering the first conductive pattern, a second conductive pattern directly on the first insulating layer, a second insulating layer covering the second conductive pattern, an organic adhesive layer on the second insulating layer, and a window facing the display panel, the organic adhesive layer being between the window and the display panel. At least one of the first insulating layer and the second insulating layer can include an inorganic layer having a density of about 2.05 g / cm 3 to about 2.4 g / cm 3 .

[0025] In an embodiment of the inventive concept, the inorganic layer included in at least one of the first insulating layer and the second insulating layer can include a silicon nitride layer. BRIEF DESCRIPTION OF DRAWINGS

[0026] The accompanying drawings, which are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification, illustrate embodiments of the inventive concept and together with the description serve to explain the inventive concept. In the drawings:

[0027] Figure 1A is a perspective view illustrating a first operation mode of a display apparatus according to an embodiment of the inventive concept;

[0028] Figure 1B is a perspective view illustrating a second operation mode of a display apparatus according to an embodiment of the inventive concept;

[0029] Figure 1C is a perspective view illustrating a third operation mode of a display apparatus according to an embodiment of the inventive concept;

[0030] Figure 2 is a cross-sectional view of a display apparatus according to an embodiment of the inventive concept;

[0031] Figure 3A and Figure 3B is a perspective view of a display apparatus according to an embodiment of the inventive concept;

[0032] Figure 4A is a cross-sectional view of a display module according to an embodiment of the inventive concept;

[0033] Figure 4B is a plan view of an organic light emitting display panel according to an embodiment of the inventive concept;

[0034] Figure 4C is an equivalent circuit diagram of a pixel according to an embodiment of the inventive concept;

[0035] Figure 4D and Figure 4E is a partial cross-sectional view of an organic light emitting display panel according to an embodiment of the inventive concept;

[0036] Figures 5A to 5C is a cross-sectional view of a thin film encapsulation layer according to one or more embodiments of the inventive concept;

[0037] Figure 6A is a cross-sectional view of a touch sensing unit according to an embodiment of the inventive concept;

[0038] Figures 6B to 6E is a plan view of a touch sensing unit according to one or more embodiments of the inventive concept;

[0039] Figure 7A is Figure 6E a partial enlarged view of a region AA of

[0040] Figure 7B is Figure 7A a partial cross-sectional view of

[0041] Figure 7C is Figure 6B a partial cross-sectional view of

[0042] Figure 8Ais a cross-sectional view showing a bubble defect occurring in a display device;

[0043] Figure 8B is a photograph showing a bubble defect occurring in a display device;

[0044] Figure 9 is a graph showing a bubble defect according to layer density;

[0045] Figure 10A is a cross-sectional view of a display device according to an embodiment of the inventive concept;

[0046] Figure 10B is an enlarged cross-sectional view of a display device according to an embodiment of the inventive concept; and

[0047] Figure 11 is a cross-sectional view of a display device according to an embodiment of the inventive concept. DETAILED DESCRIPTION

[0048] Hereinafter, embodiments of the inventive concept will be described with reference to the accompanying drawings. In this specification, it will be understood that when a component (or area, layer, part) is referred to as being "on" another component, it can be directly on the other component or an intervening component can also be present. It will be understood that when a component (or area, layer, part) is referred to as being "connected to" or "coupled to" another component, it can be directly connected to or coupled to the other component, or intervening components can also be present.

[0049] Like reference numerals refer to like elements throughout. Additionally, in the drawings, the thickness, proportions and dimensions of components can be exaggerated for clarity. The term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "one of", "selected from", when preceding a list of elements (e.g., "one of A, B, or C"), modify the entire list of elements and do not require that the selected element be exclusive of the others. Furthermore, use of "may" when describing embodiments of the present invention indicates that one or more embodiments of the present invention can include, can not include, optionally include, and / or optionally not include a corresponding feature. In addition, the term "comprising" is used herein to mean the inclusion from the listed items but not those or similar items not listed.

[0050] It will be understood that, although the terms "first" and "second" are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one component from another. For example, an element referred to as a "first element" in one embodiment can be referred to as a "second element" in another embodiment without departing from the scope of the appended claims. Singular forms of terms can include plural forms unless otherwise explicitly stated.

[0051] Also, the terms "below," "under," "above," "on," and the like, as used in the description, can refer to an orientation of one or more components in the drawing figures. As such, the terms "below," "under," "above," "on," and the like, can be relative terms that describe the position of a component in the drawing figures, but the position of the component is not limited thereto.

[0052] It will also be understood that the terms "comprises" or "comprising" can be used to describe a quantitative, a qualitative, a fixed, a step, an operation, an element, a component, or a combination thereof, but not exclude the presence of other quantitative, a qualitative, a fixed, a step, an operation, an element, a component, or a combination thereof.

[0053] Figure 1A is a perspective view illustrating a first operation mode of a display apparatus DD according to an embodiment of the inventive concept. Figure 1B is a perspective view illustrating a second operation mode of a display apparatus DD according to an embodiment of the inventive concept. Figure 1C is a perspective view illustrating a third operation mode of a display apparatus DD according to an embodiment of the inventive concept.

[0054] As Figure 1A As shown in FIG. 1A, in the first operation mode, a display surface IS displaying an image IM is parallel to a surface defined by a first direction axis DR1 and a second direction axis DR2. A direction orthogonal to the display surface IS, i.e., a thickness direction of the display apparatus DD, is denoted by a third direction axis DR3. A front surface (or a top surface) and a rear surface (or a bottom surface) of the display apparatus DD are arranged along the third direction axis DR3. However, the directions denoted by the first to third direction axes DR1, DR2, and DR3 can be relative concepts, and are not limited to the first to third direction axes shown in the drawing figures. Hereinafter, for convenience of explanation, the first to third directions as used herein can be denoted by the first to third direction axes DR1, DR2, and DR3, respectively, or designated by the same reference numerals.

[0055] Figures 1A to 1C A foldable display apparatus is shown as an example of the flexible display apparatus DD. In some embodiments, the display apparatus DD can be a rollable or bendable display apparatus, but is not specifically limited thereto. Although the flexible display apparatus is shown in the current embodiment, embodiments of the inventive concept are not limited thereto. The display apparatus DD according to the current embodiment can be a flat rigid display apparatus. The flexible display apparatus DD according to embodiments of the inventive concept can be used in large-sized electronic devices such as televisions and monitors, and small- and medium-sized electronic devices such as mobile phones, tablet PCs, car navigation systems, game consoles, and smartwatches.

[0056] As Figure 1AAs shown, the display surface IS of the flexible display device DD can include multiple regions. The flexible display device DD includes a display region DD-DA for displaying an image IM and a non-display region DD-NDA adjacent to the display region DD-DA. The non-display region DD-NDA can be a region where no image is displayed. Figure 1A An example of a vase as an image IM is shown. For example, the display area DD-DA can have a rectangular shape. The non-display area DD-NDA can surround the display area DD-DA. However, embodiments of the inventive concept are not limited to this. For example, the display area DD-DA and the non-display area DD-NDA can have various shapes and positions related to each other.

[0057] like Figures 1A to 1C As shown, the display device DD may include multiple regions defined according to the operating mode. The display device DD may include a curved region BA that bends along the bending axis BX, a first non-curved region NBA1 that does not bend, and a second non-curved region NBA2 that does not bend. Figure 1B As shown, the display device DD can be bent inwards, such that the display surface IS of the first non-bent region NBA1 and the display surface IS of the second non-bent region NBA2 face each other. Figure 1C As shown, the display device DD can also be bent outwards, exposing the display surface IS to the outside.

[0058] In embodiments of the inventive concept, the display device DD may include multiple curved regions BA. Furthermore, the curved regions BA can be defined on the display device DD according to user operations. For example, the curved regions BA may be arranged parallel to the first direction axis DR1 or may extend diagonally. The area of ​​the curved regions BA may not be fixed, but may be determined based on the radius of curvature of the curved regions. In embodiments of the inventive concept, the display device DD may have only repeating... Figure 1A and 1B The shape of the operation mode.

[0059] Figure 2 This is a cross-sectional view of a display device DD according to an embodiment of the inventive concept. Figure 2 A cross section defined by the second directional axis DR2 and the third directional axis DR3 is shown.

[0060] like Figure 2As shown in FIG. 1, the display apparatus DD includes a protective film PM, a display module DM, an optical member LM, a window WM, a first adhesive member AM1, a second adhesive member AM2, and a third adhesive member AM3. The display module DM is disposed between the protective film PM and the optical member LM. The optical member LM is disposed between the display module DM and the window WM. The first adhesive member AM1 is bonded to the display module DM and the protective film PM, the second adhesive member AM2 is bonded to the display module DM and the optical member LM, and the third adhesive member AM3 is bonded to the optical member LM and the window WM.

[0061] The protective film PM protects the display module DM. The protective film PM provides a first outer surface OS-L exposed to the outside and an adhesive surface (opposite to the first outer surface OS-L) adhered to the first adhesive member AM1. The protective film PM can prevent or reduce penetration of moisture from the outside into the display module DM and can absorb external impact.

[0062] The protective film PM can include a plastic film as a base layer. The protective film PM can include at least one selected from polyether sulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), poly(arylene ether sulfone), and combinations thereof.

[0063] The material for forming the protective film PM is not limited to a plastic resin. For example, the protective film PM can include an organic / inorganic composite material. In some embodiments, the protective film PM can include a porous organic layer and an inorganic material filled into pores of the organic layer. The protective film PM can further include a functional layer disposed (e.g., arranged) on the plastic film. The functional layer can include a resin layer. The functional layer can be formed by coating. In embodiments of the inventive concept, the protective film PM can be omitted.

[0064] The window WM can protect the display module DM from external impact and can provide an input surface for a user. The window WM includes a second outer surface OS-U exposed to the outside and an adhesive surface (opposite to the second outer surface OS-U) adhered to the third adhesive member AM3. Figures 1A to 1C The display surface IS shown in FIG. 1 can be the second outer surface OS-U.

[0065] The window WM can include a plastic film. In some embodiments, the window WM can include a multi-layer structure. For example, the window WM can have a multi-layer structure including two or more selected from a glass substrate, a plastic film, and a plastic substrate. The window WM can further include a bezel pattern. The multi-layer structure can be formed by a continuous process (e.g., a continuous deposition process) or an adhesive process using an adhesive layer.

[0066] An optical component LM can reduce the reflectivity of external light (e.g., reduce the reflection of external light). The optical component LM may include a polarizing film. The optical component LM may include a retardation film. In embodiments of the inventive concept, the optical component LM may be omitted.

[0067] The display module DM may include an organic light-emitting display panel DP and a touch sensing unit TS. The touch sensing unit TS may be directly disposed on the organic light-emitting display panel DP. In this specification, the term "component A1 is directly disposed on component B1" means that component A1 and component B1 are formed by a continuous process (e.g., a continuous deposition process). In other words, no adhesive layer is placed between component A1 and component B1.

[0068] Organic light-emitting display panels (DPs) can generate images corresponding to input image data (see example...). Figure 1A (Referring to the reference numeral IM in the accompanying drawings). An organic light-emitting display panel DP may include a first display panel surface BS1-L and a second display panel surface BS1-U facing each other in the thickness direction DR3. Although an example of an organic light-emitting display panel DP has been described in the present embodiment, embodiments of the inventive concept are not limited to the display panel described above.

[0069] The touch sensing unit TS can be configured to acquire coordinate information of external input. In some embodiments, the touch sensing unit TS can sense external input capacitively (e.g., the touch sensing unit TS can use capacitance for sensing).

[0070] The display module DM according to embodiments of the inventive concept may further include an anti-reflective layer. The anti-reflective layer may include a color filter or a stacked structure of conductive / insulating / conductive layers. The anti-reflective layer may absorb externally incident light, cancel-interference with externally incident light, or polarize externally incident light to reduce the reflectivity of external light. In some embodiments, the anti-reflective layer may perform the function of an optical component LM.

[0071] Each of the first adhesive component AM1, the second adhesive component AM2, and the third adhesive component AM3 can be an organic adhesive layer such as an optically transparent adhesive film (OCA), an optically transparent resin (OCR), and / or a pressure-sensitive adhesive film (PSA). The organic adhesive layer can include adhesive materials such as polyurethane, polyacrylic acid, polyester, epoxy, and / or polyvinyl acetate. Thus, the organic adhesive layer can correspond to one of a plurality of organic layers. As described below, the organic adhesive layer can cause the formation of bubbles.

[0072] The display device DD may also include a frame structure that supports the functional layers to maintain... Figures 1A to 1CThe frame structure can include a connection structure or a hinge structure.

[0073] Figure 3A and Figure 3B is a perspective view of a display device DD-1 according to an embodiment of the inventive concept. Figure 3A is shown in an unfolded state, Figure 3B is shown in a curved state.

[0074] The display device DD-1 can include one curved area BA and one non-curved area NBA. For example, the curved area BA can be disposed in a non-display area DD-NDA of the display device DD-1. However, in an embodiment of the inventive concept, the position of the curved area BA of the display device DD-1 can be changed.

[0075] Unlike the display device DD of Figures 1A to 1C , the display device DD-1 according to an embodiment of the inventive concept can have a fixed shape under which it can operate. For example, the display device DD-1 can operate in a curved state as shown in Figure 3B . The display device DD-1 can be fixed to a frame in a curved state, which can be incorporated into a housing of an electronic device.

[0076] The display device DD-1 according to an embodiment of the inventive concept can have a structure identical (or substantially identical) to that of the display device DD of Figure 2 . However, the non-curved area NBA and the curved area BA of the display device DD-1 can have different layer structures from each other. For example, the non-curved area NBA of the display device DD-1 can have a cross-sectional structure identical to that of the display device DD of Figure 2 , while the curved area BA of the display device DD-1 can have a cross-sectional structure different from that of the display device DD of Figure 2 . The optical member LM and the window WM of the display device DD-1 can not be disposed in the curved area BA. For example, the optical member LM and the window WM can be disposed only in the non-curved area NBA of the display device DD-1. In addition, the second adhesive member AM2 and the third adhesive member AM3 can not be disposed in the curved area BA of the display device DD-1.

[0077] Figure 4A is a cross-sectional view of a display module DM according to an embodiment of the inventive concept. Figure 4B is a plan view of an organic light emitting display panel DP according to an embodiment of the inventive concept. Figure 4C is an equivalent circuit diagram of a pixel PX according to an embodiment of the inventive concept. Figure 4D and Figure 4Eis a partial cross-sectional view of an organic light emitting display panel DP according to an embodiment of the inventive concept.

[0078] As Figure 4A As shown in FIG. 1A, the organic light emitting display panel DP includes a substrate layer SUB, a circuit layer DP-CL disposed on the substrate layer SUB, an organic light emitting element layer DP-OLED, and a thin film encapsulation layer TFE. The substrate layer SUB can include at least one plastic film. In some embodiments, the substrate layer SUB can include a plastic substrate, a glass substrate, a metal substrate, and / or an organic / inorganic composite substrate as a flexible substrate.

[0079] The circuit layer DP-CL can include a plurality of insulating layers, a plurality of conductive layers, and / or a semiconductor layer. The plurality of conductive layers of the circuit layer DP-CL can constitute signal lines or a control circuit of a pixel. The organic light emitting element layer DP-OLED can include an organic light emitting diode. The thin film encapsulation layer TFE can encapsulate the organic light emitting element layer DP-OLED. The thin film encapsulation layer TFE can include at least two inorganic thin films and at least one organic thin film between the at least two inorganic thin films. The inorganic thin films can protect the organic light emitting element layer DP-OLED from moisture / oxygen, and the organic thin film can protect the organic light emitting element layer DP-OLED from foreign substances such as dust particles.

[0080] A touch sensing unit TS can be disposed directly on the thin film encapsulation layer TFE. The touch sensing unit TS can include a touch sensor and a touch signal line. The touch sensor and the touch signal line can each independently have a single-layer or a multi-layer structure.

[0081] The touch sensor and the touch signal line can each independently include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and / or indium tin zinc oxide (ITZO), PEDOT, metal nanowires, and / or graphene. In some embodiments, the touch sensor and the touch signal line can each independently include a metal layer formed of, for example, molybdenum, silver, titanium, copper, aluminum, and / or an alloy thereof. The touch sensor and the touch signal line can each independently have the same single-layer structure, or can have different layer structures from each other. A more detailed description of the touch sensing unit TS will be provided later.

[0082] As Figure 4AAs shown in FIG. 1, the organic light emitting display panel DP can include a display area DA and a non-display area NDA in a plane. The display area DA and the non-display area NDA of the organic light emitting display panel DP can correspond to the display area DD-DA and the non-display area DD-NDA of the display device DD, respectively. However, embodiments of the present application are not limited to the display area DA and the non-display area NDA of the organic light emitting display panel DP corresponding to the display area DD-DA and the non-display area DD-NDA of the display device DD, respectively. For example, the display area DA and the non-display area NDA of the organic light emitting display panel DP can be changed according to the structure / design of the organic light emitting display panel DP.

[0083] As shown in FIG. 1, the organic light emitting display panel DP can include a display area DA and a non-display area NDA in a plane. The display area DA and the non-display area NDA of the organic light emitting display panel DP can correspond to the display area DD-DA and the non-display area DD-NDA of the display device DD, respectively. However, embodiments of the present application are not limited to the display area DA and the non-display area NDA of the organic light emitting display panel DP corresponding to the display area DD-DA and the non-display area DD-NDA of the display device DD, respectively. For example, the display area DA and the non-display area NDA of the organic light emitting display panel DP can be changed according to the structure / design of the organic light emitting display panel DP. Figure 4B As shown in FIG. 1, the organic light emitting display panel DP can include a display area DA and a non-display area NDA in a plane. The display area DA and the non-display area NDA of the organic light emitting display panel DP can correspond to the display area DD-DA and the non-display area DD-NDA of the display device DD, respectively. However, embodiments of the present application are not limited to the display area DA and the non-display area NDA of the organic light emitting display panel DP corresponding to the display area DD-DA and the non-display area DD-NDA of the display device DD, respectively. For example, the display area DA and the non-display area NDA of the organic light emitting display panel DP can be changed according to the structure / design of the organic light emitting display panel DP.

[0084] The plurality of signal lines SGL can include gate lines GL, data lines DL, power lines PL, and control signal lines CSL. The gate lines GL can be connected to respective ones of the plurality of pixels PX, respectively, and the data lines DL can be connected to respective ones of the plurality of pixels PX, respectively. The power lines PL can be connected to the plurality of pixels PX. A gate driving circuit DCV to which the gate lines GL are connected can be disposed (e.g., arranged) on one side of the non-display area NDA. The control signal lines CSL can provide a control signal to the gate driving circuit DCV.

[0085] A portion of the gate lines GL, the data lines DL, the power lines PL, and the control signal lines CSL can be disposed on the same layer, and other portions can be disposed on different layers from each other. Each of the gate lines GL, the data lines DL, the power lines PL, and the control signal lines CSL can include a signal line unit and a signal pad unit connected to an end portion of the signal line unit. The control pad unit CSL-P, the data pad unit DL-P, and the power pad unit PL-P are shown as examples of the signal pad unit. In some embodiments, a gate pad unit can also be overlapped with the gate driving circuit DCV and can be connected to the gate driving circuit DCV.

[0086] Figure 4C An example of a pixel PX connected to one gate line GL, one data line DL, and one power line PL is shown. However, embodiments of the inventive concept are not limited to the configuration of the pixel PX shown in the drawings. For example, the pixel PX can vary in configuration.

[0087] A pixel PX includes an organic light-emitting diode (OLED) as a display device. The OLED can be a top-emitting diode or a bottom-emitting diode. The pixel PX includes a first transistor TFT1 (e.g., a switching transistor), a second transistor TFT2 (e.g., a driving transistor), and a capacitor CAP as circuit units for driving the OLED.

[0088] The first transistor TFT1 outputs a data signal applied to the data line DL in response to a scan signal applied to the gate line GL. The capacitor CAP is charged with a voltage corresponding to the data signal received from the first transistor TFT1.

[0089] The second transistor TFT2 is connected to the organic light-emitting diode (OLED). The second transistor TFT2 controls the driving current flowing through the OLED in accordance with the amount of charge stored in the capacitor CAP. The OLED emits light during the on-time period of the second transistor TFT2.

[0090] Figure 4D Is with Figure 4C A cross-sectional view of the portion corresponding to the first transistor TFT1 and capacitor CAP in the equivalent circuit. Figure 4E Is with Figure 4C A cross-sectional view of the equivalent circuit of the second transistor TFT2 and the corresponding part of the organic light-emitting diode OLED.

[0091] like Figure 4D and Figure 4E As shown, the circuit layer DP-CL is disposed on the base layer SUB. The semiconductor pattern AL1 of the first transistor TFT1 (hereinafter referred to as the first semiconductor pattern) and the semiconductor pattern AL2 of the second transistor TFT2 (hereinafter referred to as the second semiconductor pattern) can be disposed on the base layer SUB. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 can be the same or different, and both can be independently selected from amorphous silicon, polycrystalline silicon, and metal oxide semiconductors.

[0092] In some embodiments, a functional layer may also be disposed on one surface of the base layer SUB. The functional layer may include at least one selected from a barrier layer and a buffer layer. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 may both be disposed independently on the barrier layer and / or the buffer layer.

[0093] A first insulating layer 12 covering the first semiconductor pattern AL1 and the second semiconductor pattern AL2 is disposed on the base layer SUB. The first insulating layer 12 includes an organic layer and / or an inorganic layer. For example, the first insulating layer 12 may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer and / or a silicon oxide layer.

[0094] The control electrode GE1 of the first transistor TFT1 (hereinafter, referred to as a first control electrode) and the control electrode GE2 of the second transistor TFT2 (hereinafter, referred to as a second control electrode) can each be independently provided on the first insulating layer 12. The first electrode E1 of the capacitor CAP is provided on the first insulating layer 12. The first control electrode GE1, the second control electrode GE2, and the first electrode E1 can each be independently manufactured by the same photolithography process as that of the gate lines GL (shown in FIG. 1B). For example, the first electrode E1 can be formed of the same material as the gate lines GL, the first electrode E1 can have the same layer structure as the gate lines GL, and the first electrode E1 can be provided on the same layer as the gate lines GL. Figure 4C The first control electrode GE1, the second control electrode GE2, and the first electrode E1 can each be independently manufactured by the same photolithography process as that of the gate lines GL (shown in FIG. 1B). For example, the first electrode E1 can be formed of the same material as the gate lines GL, the first electrode E1 can have the same layer structure as the gate lines GL, and the first electrode E1 can be provided on the same layer as the gate lines GL.

[0095] The second insulating layer 14, which covers the first control electrode GE1 and the second control electrode GE2, and the first electrode E1, is provided on the first insulating layer 12. The second insulating layer 14 includes an organic layer and / or an inorganic layer. For example, the second insulating layer 14 can include a plurality of inorganic thin films. The plurality of inorganic thin films can include a silicon nitride layer and / or a silicon oxide layer.

[0096] The data lines DL (shown in FIG. 1B) can be provided on the second insulating layer 14. The input electrode SE1 of the first transistor TFT1 (hereinafter, referred to as a first input electrode) and the output electrode DE1 of the first transistor TFT1 (hereinafter, referred to as a first output electrode) can be provided on the second insulating layer 14. The input electrode SE2 of the second transistor TFT2 (hereinafter, referred to as a second input electrode) and the output electrode DE2 of the second transistor TFT2 (hereinafter, referred to as a second output electrode) can be provided on the second insulating layer 14. The first input electrode SE1 branches from a corresponding data line of the data lines DL. The power lines PL (shown in FIG. 1B) can be provided on the same layer as the data lines DL. The second input electrode SE2 can branch from the power lines PL. Figure 4C The data lines DL (shown in FIG. 1B) can be provided on the second insulating layer 14. The input electrode SE1 of the first transistor TFT1 (hereinafter, referred to as a first input electrode) and the output electrode DE1 of the first transistor TFT1 (hereinafter, referred to as a first output electrode) can be provided on the second insulating layer 14. The input electrode SE2 of the second transistor TFT2 (hereinafter, referred to as a second input electrode) and the output electrode DE2 of the second transistor TFT2 (hereinafter, referred to as a second output electrode) can be provided on the second insulating layer 14. The first input electrode SE1 branches from a corresponding data line of the data lines DL. The power lines PL (shown in FIG. 1B) can be provided on the same layer as the data lines DL. The second input electrode SE2 can branch from the power lines PL. Figure 4C The data lines DL (shown in FIG. 1B) can be provided on the second insulating layer 14. The input electrode SE1 of the first transistor TFT1 (hereinafter, referred to as a first input electrode) and the output electrode DE1 of the first transistor TFT1 (hereinafter, referred to as a first output electrode) can be provided on the second insulating layer 14. The input electrode SE2 of the second transistor TFT2 (hereinafter, referred to as a second input electrode) and the output electrode DE2 of the second transistor TFT2 (hereinafter, referred to as a second output electrode) can be provided on the second insulating layer 14. The first input electrode SE1 branches from a corresponding data line of the data lines DL. The power lines PL (shown in FIG. 1B) can be provided on the same layer as the data lines DL. The second input electrode SE2 can branch from the power lines PL.

[0097] The second electrode E2 of the capacitor CAP can be provided on the second insulating layer 14. The second electrode E2 can be manufactured by the same photolithography process as that of each of the data lines DL and the power lines PL. For example, the second electrode E2 can be formed of the same material as each of the data lines DL and the power lines PL, have the same structure, and be provided on the same layer.

[0098] The first input electrode SE1 and the first output electrode DE1 are connected to the first semiconductor pattern AL1 through the first and second through-holes CH1 and CH2 passing through the first and second insulating layers 12 and 14. The first output electrode DE1 can be electrically connected (e.g., electrically bonded) to the first electrode E1. For example, the first output electrode DE1 can be connected to the first electrode E1 through a through-hole (not shown) passing through the second insulating layer 14. The second input electrode SE2 and the second output electrode DE2 are connected to the second semiconductor pattern AL2 through the third and fourth through-holes CH3 and CH4 passing through the first and second insulating layers 12 and 14. According to another embodiment of the inventive concept, each of the first and second transistors TFT1 and TFT2 can be formed to have a bottom-gate structure.

[0099] A third insulating layer 16 covering the first input electrode SE1, the first output electrode DE1, the second input electrode SE2, and the second output electrode DE2 can be disposed on the second insulating layer 14. The third insulating layer 16 includes an organic layer and / or an inorganic layer. For example, the third insulating layer 16 can include an organic material that provides a substantially planar surface.

[0100] In some embodiments, one of the first, second, and third insulating layers 12, 14, and 16 can be omitted depending on the circuit structure of the pixel. Each of the second and third insulating layers 14 and 16 can be an interlayer dielectric layer. The interlayer dielectric layer can be disposed between a lower conductive pattern and an upper conductive pattern to insulate the conductive patterns from each other.

[0101] As shown in FIGS. 1A and 1B, a light emitting element layer DP-OLED is disposed on the third insulating layer 16. In some embodiments, a pixel definition layer PXL and an organic light emitting diode OLED are disposed on the third insulating layer 16. For example, an anode AE of the organic light emitting diode OLED can be disposed on the third insulating layer 16. The anode AE is connected to the second output electrode DE2 through a fifth through-hole CH5 passing through the third insulating layer 16. An opening OP is defined in the pixel definition layer PXL. The opening OP of the pixel definition layer PXL exposes at least a portion of the anode AE. Figure 4D Figure 4E As shown in FIGS. 1A and 1B, a light emitting element layer DP-OLED is disposed on the third insulating layer 16. In some embodiments, a pixel definition layer PXL and an organic light emitting diode OLED are disposed on the third insulating layer 16. For example, an anode AE of the organic light emitting diode OLED can be disposed on the third insulating layer 16. The anode AE is connected to the second output electrode DE2 through a fifth through-hole CH5 passing through the third insulating layer 16. An opening OP is defined in the pixel definition layer PXL. The opening OP of the pixel definition layer PXL exposes at least a portion of the anode AE.

[0102] The light emitting element layer DP-OLED can include an emission region PXA and a non-emission region NPXA adjacent to the emission region PXA. For example, the non-emission region NPXA can surround the emission region PXA. In the present embodiment, the emission region PXA is defined to correspond to the anode AE. However, embodiments of the inventive concept are not limited to the above-described emission region PXA. In some embodiments, any region from which light is emitted can be defined as the emission region PXA. In some embodiments, the emission region PXA can be defined to correspond to the portion of the anode AE exposed by the opening OP. ​

[0103] A hole control layer (HCL) can be commonly defined (e.g., arranged) in the emission region PXA and the non-emission region NPXA. In some embodiments, a common layer such as the hole control layer HCL can be commonly disposed in multiple pixel PXA. Figure 4B (as shown in the image).

[0104] The organic light-emitting layer (EML) is disposed on the hole control layer (HCL). The EML can be disposed only in the region corresponding to the opening (OP). For example, the EML can be separate from each of the multiple pixels (PX).

[0105] An electronic control layer (ECL) is disposed on an organic light-emitting layer (EML). A cathode (CE) is disposed on the electronic control layer (ECL). In some embodiments, the cathode (CE) is commonly disposed on multiple pixels (PX) (e.g., above).

[0106] While a patterned organic light-emitting layer (EML) is shown as an example in the current embodiment (e.g., a separate EML for each pixel PX), the EML can also be commonly disposed on multiple pixels PX. In some embodiments, the EML can emit white light. Additionally, the EML can have a multi-layered structure.

[0107] In the current embodiment, the thin-film encapsulation layer TFE directly covers the cathode CE. In some embodiments, a cover layer covering the cathode CE may also be provided, and the thin-film encapsulation layer TFE may directly cover this cover layer.

[0108] Figures 5A to 5C This is a cross-sectional view of the thin film encapsulation layers TFE1, TFE2, and TFE3 according to one or more embodiments of the inventive concept. Referring below... Figures 5A to 5C The thin film encapsulation layers TFE1, TFE2 and TFE3 according to embodiments of the inventive concept are described.

[0109] like Figure 5A As shown, the thin film encapsulation layer TFE1 may include n inorganic thin films (e.g., the range of inorganic thin films from IOL1 to IOLn may be included), while the first inorganic thin film IOL1 contacts the cathode CE (the cathode CE is, for example, in... Figure 4D (As shown in the figure). The first inorganic thin film IOL1 can be defined as the lower inorganic thin film, and the remaining portion of the inorganic thin film can be defined as the upper inorganic thin film.

[0110] The thin film encapsulation layer TFE1 includes n-1 organic thin films OL1 to OLn-1. Here, the n-1 organic thin films OL1 to OLn-1 and the n inorganic thin films IOL1 to IOLn can be alternately disposed with respect to each other. Each of the n-1 organic thin films OL1 to OLn-1 can have a thickness greater than a thickness of each of the n inorganic thin films IOL1 to IOLn.

[0111] Each of the n inorganic thin films IOL1 to IOLn can have a single layer structure formed of one material or a multi-layer structure formed of different materials from each other, respectively. Each of the n-1 organic thin films OL1 to OLn-1 can be formed by depositing an organic monomer. The organic monomer can be, for example, an acryl-based monomer. In an embodiment of the inventive concept, the thin film encapsulation layer TFE1 can further include an nth organic thin film (for example, when the thin film encapsulation layer TFE1 further includes an nth organic thin film, the total number of organic thin films can be equal to the total number of inorganic thin films).

[0112] Referring now to Figure 5B and Figure 5C , the inorganic thin films of each of the thin film encapsulation layers TFE2 and TFE3 can be formed of the same material as each other or different materials from each other, and have the same thickness as each other or different thicknesses from each other. The organic thin films of each of the thin film encapsulation layers TFE2 and TFE3 can be formed of the same organic material as each other or different organic materials from each other, and have the same thickness as each other or different thicknesses from each other.

[0113] As shown in Figure 5B , the thin film encapsulation layer TFE2 can include a first inorganic thin film IOL1, a first organic thin film OL1, a second inorganic thin film IOL2, a second organic thin film OL2, and a third inorganic thin film IOL3, which are sequentially stacked.

[0114] The first inorganic thin film IOL1 can have a two-layer structure. The first sub-layer S1 of the first inorganic thin film IOL1 can be a lithium fluoride layer, and the second sub-layer S2 can be an aluminum oxide layer. The first organic thin film OL1 can be a first organic monomer layer, the second inorganic thin film IOL2 can be a first silicon nitride layer, the second organic thin film OL2 can be a second organic monomer layer, and the third inorganic thin film IOL3 can be a second silicon nitride layer.

[0115] As shown in Figure 5CAs shown in FIG. 1, the thin film encapsulation layer TFE3 can include a first inorganic thin film IOL10, a first organic thin film OL1, and a second inorganic thin film IOL20, which are sequentially stacked (or laminated). The first inorganic thin film IOL10 can have a two-layer structure. The first sub-layer S10 can be a lithium fluoride layer, and the second sub-layer S20 can be a silicon oxide layer. The first organic thin film OL1 can be an organic monomer, and the second inorganic thin film IOL20 can have a two-layer structure. The second inorganic thin film IOL20 can include a first sub-layer S100 and a second sub-layer S200, which are deposited under different deposition environments from each other. The first sub-layer S100 can be deposited under a lower power condition, and the second sub-layer S200 can be deposited under a high power condition. Each of the first sub-layer S100 and the second sub-layer S200 can be a silicon nitride layer.

[0116] Figure 6A is a cross-sectional view of a touch sensing unit TS according to an embodiment of the inventive concept. Figures 6B to 6E are plan views of a touch sensing unit TS according to an embodiment of the inventive concept at different stages (operations / steps) during a manufacturing process.

[0117] As Figure 6A As shown in FIG. 1, the touch sensing unit TS includes a first conductive layer TS-CL1, a first insulating layer TS-IL1 (hereinafter, referred to as a first touch insulating layer), a second conductive layer TS-CL2, and a second insulating layer TS-IL2 (hereinafter, referred to as a second touch insulating layer). The first conductive layer TS-CL1 can be disposed directly on the thin film encapsulation layer TFE. For example, a plastic film, a glass substrate, and / or a plastic substrate can not be disposed between the first conductive layer TS-CL1 and the thin film encapsulation layer TFE.

[0118] Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 can have a single-layer structure or a multi-layer structure in which a plurality of layers are stacked along a third direction axis DR3. The conductive layer having the multi-layer structure can include a transparent conductive layer and at least two metal layers. The conductive layer having the multi-layer structure can include metal layers formed of different metals from each other. The transparent conductive layer can include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and / or indium tin zinc oxide (ITZO), PEDOT, metal nanowires, and / or graphene. The metal layers can be formed of molybdenum, silver, titanium, copper, aluminum, and / or alloys thereof.

[0119] Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 can include a plurality of patterns. Hereinafter, a structure in which the first conductive layer TS-CL1 includes a first conductive pattern and the second conductive layer TS-CL2 includes a second conductive pattern will be described. Each of the first conductive pattern and the second conductive pattern can include a touch electrode and a touch signal line.

[0120] Each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may be formed of inorganic and / or organic materials. Inorganic materials may include at least one oxide such as titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and / or hafnium oxide. Organic materials may include at least one selected from acrylic resins, methacrylic resins, polyisoprene resins, vinyl resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyimide resins, polyamide resins, and perylene resins.

[0121] Each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may have a single-layer or multi-layer structure. Each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may include at least one of an inorganic layer and an organic layer. Both the inorganic layer and the organic layer may be formed independently by chemical vapor deposition.

[0122] In the current embodiment, at least one of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 comprises having a content of approximately 2.05 g / cm³. 3 Up to approximately 2.4 g / cm³ 3 At least one inorganic layer of a certain density. This embodiment will be described in more detail later.

[0123] In some embodiments, the first touch insulating layer TS-IL1 insulates the first conductive layer TS-CL1 and the second conductive layer TS-CL2 from each other, but embodiments of the inventive concept are not limited thereto. The first touch insulating layer TS-IL1 can be formed in any suitable shape according to the shape of the first conductive pattern and the second conductive pattern. In some embodiments, the first touch insulating layer TS-IL1 may completely cover the thin film encapsulation layer TFE or may include multiple insulating patterns. Multiple insulating patterns may be sufficient to connect with the first connection portion CP1 and / or the second connection portion CP2 (in, for example...) Figures 6B to 6E (As shown in the image) Overlay.

[0124] While a two-layer touch sensing unit is shown as an example in the current embodiment, embodiments of the inventive concept are not limited thereto. A single-layer touch sensing unit may include a conductive layer and an insulating layer covering the conductive layer. The conductive layer may include a touch sensor and touch signal lines connected to the touch sensor. The single-layer touch sensing unit may acquire coordinate information in a self-covering (e.g., self-capacitance) manner.

[0125] like Figure 6BAs shown in FIG. 1, the touch sensing unit TS can include first touch electrodes TE1-1 to TE1-3, first touch signal lines SL1-1 to SL1-3 connected to the first touch electrodes TE1-1 to TE1-3, second touch electrodes TE2-1 to TE2-3, and second touch signal lines SL2-1 to SL2-3 connected to the second touch electrodes TE2-1 to TE2-3. The touch sensing unit TS including three first touch electrodes TE1-1 to TE1-3 and three first touch signal lines SL1-1 to SL1-3 is shown as an example.

[0126] Each of the first touch electrodes TE1-1 to TE1-3 can have a mesh shape (e.g., a mesh pattern) defining a plurality of touch openings. Each of the first touch electrodes TE1-1 to TE1-3 includes a plurality of first touch sensor portions SP1 and a plurality of first connection portions CP1. The first touch sensor portions SP1 are arranged in a first direction DR1. Each of the first connection portions CP1 connects two of the first touch sensor portions SP1 adjacent to each other in the first direction DR1. In some embodiments, each of the first touch signal lines SL1-1 to SL1-3 can also have a mesh shape (e.g., a mesh pattern).

[0127] The second touch electrodes TE2-1 to TE2-3 can be insulated from the first touch electrodes TE1-1 to TE1-3 and can cross the first touch electrodes TE1-1 to TE1-3. Each of the second touch electrodes TE2-1 to TE2-3 can have a mesh shape (e.g., a mesh pattern) defining a plurality of touch openings. Each of the second touch electrodes TE2-1 to TE2-3 includes a plurality of second touch sensor portions SP2 and a plurality of second connection portions CP2. The second touch sensor portions SP2 are arranged in a second direction DR2. Each of the second connection portions CP2 connects two of the second touch sensor portions SP2 adjacent to each other in the second direction DR2. Each of the second touch signal lines SL2-1 to SL2-3 can also have a mesh shape (e.g., a mesh pattern).

[0128] The first touch electrodes TE1-1 to TE1-3 and the second touch electrodes TE2-1 to TE2-3 can be capacitively coupled to each other. Capacitors can be disposed between respective first touch sensor portions SP1 and second touch sensor portions SP2 as a touch detection signal is applied to the first touch electrodes TE1-1 to TE1-3.

[0129] The plurality of first touch sensor portions SP1, the plurality of first connection portions CP1, and a portion of the first touch signal lines SL1-1 to SL1-3, and the plurality of second touch sensor portions SP2, the plurality of second connection portions CP2, and a portion of the second touch signal lines SL2-1 to SL2-3 can be formed by patterning the first conductive layer TS-CL1 of Figure 6A , while other portions (e.g., remaining portions of the aforementioned elements) can be formed by patterning the second conductive layer TS-CL2 of Figure 6A .

[0130] To electrically connect (e.g., electrically join) conductive patterns disposed on different layers from each other, a contact hole can be defined through the first touch insulating layer TS-IL1 of Figure 6A . Hereinafter, the touch sensing unit TS according to embodiments of the inventive concept will be described with reference to Figures 6C to 6E .

[0131] Referring to Figure 6C , a first conductive pattern can be disposed on the thin film encapsulation layer TFE. The first conductive pattern can include a bridge pattern (or bridge portion) CP2. The bridge pattern CP2 can be disposed directly on the thin film encapsulation layer TFE. The thin film encapsulation layer TFE covering the display area DA will be described as an example. The bridge pattern CP2 can correspond to the second connection portion CP2 of Figure 6B .

[0132] As shown in Figure 6D , a first touch insulating layer TS-IL1 covering the bridge pattern CP2 can then be disposed on the thin film encapsulation layer TFE. A contact hole CH partially exposing the bridge pattern CP2 is defined in the first touch insulating layer TS-IL1. The contact hole CH can be formed by a photolithography process.

[0133] As shown in Figure 6E , a second conductive pattern can then be disposed on the first touch insulating layer TS-IL1. The second conductive pattern can include the plurality of first touch sensor portions SP1, the plurality of first connection portions CP1, the first touch signal lines SL1-1 to SL1-3, the plurality of second touch sensor portions SP2, and the second touch signal lines SL2-1 to SL2-3. In some embodiments, a second touch insulating layer TS-IL2 covering the second conductive pattern is disposed on the first touch insulating layer TS-IL1.

[0134] In embodiments of the inventive concept, the first conductive pattern may include first touch electrodes TE1-1 to TE1-3 and first touch signal lines SL1-1 to SL1-3. The second conductive pattern may include second touch electrodes TE2-1 to TE2-3 and second touch signal lines SL2-1 to SL2-3. In some embodiments, the contact hole CH may not be defined in the first touch insulating layer TS-IL1.

[0135] Furthermore, in embodiments of the inventive concept, the first conductive pattern and the second conductive pattern can be interchanged. For example, the second conductive pattern may include a bridging pattern CP2.

[0136] Figure 7A yes Figure 6E A magnified view of region AA. Figure 7B yes Figure 7A (A partial sectional view taken along II-II') Figure 7C yes Figure 6B A partial sectional view (taken along I-I'). Referring to the following text... Figures 7A to 7C The display module DM is described in more detail.

[0137] like Figure 7A As shown, the first touch sensor unit SP1 is superimposed on the non-emitting region NPXA. The first touch sensor unit SP1 includes a plurality of first vertical portions SP1-C extending in a first direction DR1 and a plurality of first horizontal portions SP1-L extending in a second direction DR2. The plurality of first vertical portions SP1-C and the plurality of first horizontal portions SP1-L can be defined as grid lines (e.g., they can have a grid pattern). The grid lines can have a linewidth of several micrometers.

[0138] Multiple first vertical portions SP1-C and multiple first horizontal portions SP1-L can be connected to each other to define multiple openings TS-OP. For example, the first touch sensor portion SP1 can have a grid shape (e.g., a grid pattern) including multiple touch openings TS-OP. Although a structure is shown in which touch openings TS-OP correspond to emission areas PXA (in a one-to-one relationship), embodiments of the inventive concept are not limited thereto. One touch opening TS-OP can correspond to two or more emission areas PXA.

[0139] Each of the first connecting part CP1, the first touch signal lines SL1-1 to SL1-3, the second touch sensor part SP2, the second connecting part CP2, and the second touch signal lines SL2-1 to SL2-3 may include a horizontal portion and a vertical portion.

[0140] like Figure 7B and Figure 7CAs shown in FIG. 1, the second connection portion CP2 can be provided directly on the thin film encapsulation layer TFE. The first touch insulating layer TS-IL1 covering the second connection portion CP2 can also be provided directly on the thin film encapsulation layer TFE (or part of the first touch insulating layer TS-IL1 can be provided directly on the thin film encapsulation layer TFE). The first touch insulating layer TS-IL1 at least overlaps the display area DA. The first touch sensor portion SP1, the second touch sensor portion SP2, and the first connection portion CP1 can be provided directly on the first touch insulating layer TS-IL1.

[0141] The second touch sensor portion SP2 overlaps the non-emission area NPXA. The second touch insulating layer TS-IL2 (or part thereof) can be provided directly on the first touch insulating layer TS-IL1 to cover the first touch sensor portion SP1, the second touch sensor portion SP2, and the first connection portion CP1. The second touch insulating layer TS-IL2 at least overlaps the display area DA.

[0142] In Figure 7B and Figure 7C , the first touch sensor portion SP1, the first connection portion CP1, the second touch sensor portion SP2, and the second connection portion CP2 are shown as examples each having a three-layer structure. For example, each of the first touch sensor portion SP1, the first connection portion CP1, the second touch sensor portion SP2, and the second connection portion CP2 can have a three-layer structure of titanium / aluminum / titanium.

[0143] Figure 8A is a cross-sectional view showing that a bubble defect occurs in the display device DD. Figure 8B is a photograph showing that a bubble defect occurs in the display device DD. Figure 9 is a graph showing bubble defects according to layer density.

[0144] A reliability evaluation was performed on a display device identical (or substantially identical) to the display device DD with Figure 2 under severe conditions. The reliability evaluation was performed at a temperature of about 80 degrees Celsius to about 90 degrees Celsius and a humidity of about 80% to about 90%.

[0145] As shown in Figure 8A and Figure 8B , the bubbles were gathered on the interface between the window WM and the third adhesive member AM3. The bubbles were investigated and it was determined that most of the bubbles were formed of nitrogen and / or hydrogen. For example, nitrogen and hydrogen can account for about 80% to about 90% of the bubbles. Bubbles containing very small amounts of carbon dioxide, carbon monoxide, and / or methane were also analyzed.

[0146] Samples were fabricated according to Experimental Examples 1 to 8 to evaluate the reliability of the display device under harsh conditions. The experimental results are shown in Table 1 below. In Table 1, "X" indicates no layer or bubbles, and "O" indicates the presence of a layer or bubbles.

[0147] Table 1

[0148] First conductive layer First touch insulating layer (inorganic layer) Second conductive layer Second touch insulating layer (organic layer) Bubble generation Experimental Example 1 X X X X X Experimental Example 2 O O O O O Experimental Example 3 O O O X O Experimental Example 4 O O X X O Experimental Example 5 O X X X X Experimental Example 6 X O X X O Experimental Example 7 X O X X X Experimental Example 8 X X X O X

[0149] Use and Figure 2 The display devices shown are substantially similar to those used to perform experimental examples 1 to 6. However, the touch sensing unit (e.g., Figure 6A The reference numerals TS in the accompanying drawings are structurally different from each other. In Experimental Example 1, the touch sensing unit TS is omitted. In Experimental Examples 3 to 6, a portion of the first touch insulating layer (e.g., an inorganic layer), the first conductive layer, the second conductive layer, and the second touch insulating layer (e.g., an organic layer) is omitted.

[0150] In Experimental Example 7, a glass substrate with a single inorganic layer was used instead of the display module (e.g., Figure 2 (Referring to the reference numeral DM in the attached diagram). In Experimental Example 8, a glass substrate with a single organic layer was used instead of the display module DM.

[0151] In Experimental Examples 1 to 8, a 1.90 g / cm³ material was formed using plasma-enhanced chemical vapor deposition (PECVD). 3 A silicon nitride layer is used as the first touch insulating layer (inorganic layer), and an acrylic organic layer formed by a slot coating method is used as the second touch insulating layer (organic layer).

[0152] Given the bubble formation in Experimental Examples 2 to 4 and Experimental Example 6, it is assumed that bubble formation is related to the inorganic layer without being constrained by any specific theory. However, when comparing Experimental Example 6 (bubble formation) with Experimental Example 7 (bubble not formation) (both Experimental Example 6 and Experimental Example 7 have the same layer composition for the first conductive layer, the first touch insulating layer, the second conductive layer, and the second touch insulating layer), it can be seen that bubble formation does not depend on a single condition such as the inorganic layer, but is also related to the thin film encapsulation layer (e.g., in Experimental Example 7, no thin film encapsulation layer was formed).

[0153] Based on the amount of bubbles generated in Experimental Examples 2 to 4 and Experimental Example 6, without being constrained by any specific theory, it is assumed that the bubbles are not introduced from the outside, but are generated through a reaction between seeds (e.g., bubble seeds) and organic materials. It is assumed that the seeds are generated when an inorganic layer is formed on the film encapsulation layer. The organic material may be included in the second touch insulating layer or the second adhesive member (e.g., Figure 2(see attached reference numeral AM2) or a third adhesive component (e.g., Figure 2 In the attached icon (AM3).

[0154] Additional experiments were performed on the samples according to Experimental Examples 2 and 3. The samples according to Experimental Examples 2 and 3 had substantially the same structure, except that no organic layer was formed in Experimental Example 3. Bubble formation time was measured using the samples according to Experimental Examples 2 and 3 (four samples for each experimental example).

[0155] Table 2

[0156] 24 (hours) 120 (hours) 168 (hours) 264 (hours) 336 (hours) 500 (hours) Experimental Example 3 0 / 4 3 / 4 4 / 4 4 / 4 4 / 4 4 / 4 Experimental Example 2 3 / 4 4 / 4 4 / 4 4 / 4 4 / 4 4 / 4

[0157] Reliability assessments were performed on each of the four samples according to Experimental Example 2 and each of the four samples according to Experimental Example 3. While no bubbles were generated in any of the samples in Experimental Example 3 after 24 hours, bubbles were generated in three of the four samples in Experimental Example 2 after 24 hours.

[0158] Based on the experimental results shown in Table 2 above, without being constrained by any specific theory, it is assumed that the organic layer leads to or at least increases the generation of bubbles. For example, it is assumed that the seeds will react with the organic layer.

[0159] Additional experiments were performed on the samples from Experimental Examples 9 and 10. The bubble formation time was measured using samples from Experimental Examples 9 and 10 (five samples for each example). The results are shown in Table 3 below.

[0160] Table 3

[0161] 24 (hours) 48 (hours) 72 (hours) 196 (hours) 360 (hours) 500 (hours) Experimental Example 9 0 / 5 0 / 5 1 / 5 1 / 5 2 / 5 2 / 5 Experimental Example 10 0 / 5 1 / 5 1 / 5 2 / 5 2 / 5 2 / 5

[0162] Each sample in Experimental Examples 9 and 10 has the same (or substantially the same) structure as the sample in Experimental Example 2 (e.g., with...). Figure 2 The display devices shown have the same structure. In the sample of Experimental Example 9, an optically clear adhesive (OCA) manufactured by 3M Purification Inc. was used as the second adhesive component AM2 and the third adhesive component AM3. In the sample of Experimental Example 10, an optically clear adhesive (OCA) manufactured by TMS was used as the second adhesive component AM2 and the third adhesive component AM3. The OCAs from the above manufacturers have different compositions from each other.

[0163] Based on the experimental results shown in Table 3 above, the bubble formation time varies depending on the composition of the adhesive component. Furthermore, it can be seen that the amount of bubbles generated after the same amount of time also varies depending on the composition of the adhesive component.

[0164] Samples in which the density of the inorganic layer was varied were manufactured to evaluate reliability. Here, in addition to the variation in the density of the inorganic layer for each sample, samples having a structure identical to (or substantially identical to) the structure of Experimental Example 2 were manufactured.

[0165] The silicon nitride layer can be formed by a chemical vapor deposition process using a mixed gas of silane (SiH4), nitrogen (N2), hydrogen (H2), and ammonia (NH3). The flow rate of each of the silane (SiH4) and the hydrogen (H2) affects the density of the resulting silicon nitride layer. In addition, variations in the power and pressure within the deposition chamber affect the density of the silicon nitride layer. In forming the above-described samples, in addition to adjusting the flow rate of the silane (SiH4) to form inorganic layers having different densities according to the samples, factors believed to have an influence on the composition of the resulting layer were identically maintained in the samples.

[0166] Figure 9 The bar graph shown in FIG. 6 represents the generation of bubble defects depending on the density of the layer. In samples in which the silicon nitride layer has a layer density of about 2.05 g / cm 3 or more, it appears that no bubbles are generated in the display device.

[0167] Without being bound by any particular theory, it is believed that because the seeds generated when forming the silicon nitride layer are sealed by the high-density silicon nitride layer, no reaction occurs between the seeds and the organic material, and thus no bubbles are generated in samples having a silicon nitride layer density of about 2.05 g / cm 3 or more.

[0168] In contrast, in a display device including an inorganic layer having a layer density of about 2.05 g / cm 3 or less, the seeds pass through the low-density inorganic layer to reach the second touch insulating layer TS-IL2 and the organic adhesive layer (e.g., the reference numerals AM2 and AM3 of FIG. 6). In this case, it is believed that the seeds react with the second touch insulating layer TS-IL2 and the organic adhesive layers AM2 and AM3 to generate bubbles. Figure 2

[0169] When bubbles are generated in the second touch insulating layer TS-IL2, the bubbles pass through the second adhesive member AM2, the optical member LM, and the third adhesive member AM3, and then gather at the interface between the window WM and the third adhesive member AM3. In addition, when bubbles are generated in the second adhesive member AM2 and the third adhesive member AM3, the bubbles also gather at the interface between the window WM and the third adhesive member AM3.

[0170] As the density of the inorganic layer gradually increases, the flexibility of the layer gradually decreases. Thus, the inorganic layer can have a density of about 2.4 g / cm 3 ​or less. When the inorganic layer has a density within the range, generation of cracks in the inorganic layer due to stress applied from the outside can be prevented or reduced.

[0171] In the current embodiment, at least one of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 (as described with reference to, for example, Figure 6A the layers described) can include at least one inorganic layer having a density of about 2.05 g / cm 3 to about 2.45 g / cm 3 Here, generation of the bubbles described above can be suppressed or reduced, and the occurrence of cracks in the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 can be prevented or reduced.

[0172] In an embodiment of the inventive concept, each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 can include a silicon nitride layer having the density described above.

[0173] In an embodiment of the inventive concept, the first touch insulating layer TS-IL1 can include a silicon nitride layer having the density described above. Here, the second touch insulating layer TS-IL2 can be an organic layer. When an inorganic layer having a density less than the density described above is formed, bubbles can be generated during formation of the second touch insulating layer TS-IL2. In order to prevent or reduce the possibility of generating bubbles and to improve flexibility, the second touch insulating layer TS-IL2 can be an organic layer.

[0174] In an embodiment of the inventive concept, the second touch insulating layer TS-IL2 can include a silicon nitride layer having the density described above. When the second touch insulating layer TS-IL2 has a multi-layer structure, the silicon nitride layer having the density described above can be the uppermost layer. Here, the first touch insulating layer TS-IL1 can include an organic layer and / or an inorganic layer.

[0175] Figure 10A is a cross-sectional view of a display apparatus DD-2 according to an embodiment of the inventive concept. Figure 10B is a magnified cross-sectional view of a display module DM-1 of the display apparatus DD-2 according to an embodiment of the inventive concept. Figure 11 is a cross-sectional view of a display apparatus DD-3 according to an embodiment of the inventive concept. Hereinafter, detailed descriptions of constituent elements identical to those described with reference to Figures 1A to 9 will not be provided.

[0176] As Figure 10A and Figure 10BAs shown in the middle, the display device DD-2 includes a protective film PM, a display module DM-1, a touch panel TSP, a window WM, a first adhesive member AM1, a second adhesive member AM2, and a third adhesive member AM3. The display module DM-1 can include an organic light emitting display panel DP and an anti-reflection layer RPL. The anti-reflection layer RPL can be disposed directly on the organic light emitting display panel DP.

[0177] The anti-reflection layer RPL can include conductive layers RPL-ML1 and RPL-ML2 stacked with the display area DA and the non-display area NDA, respectively, and insulating layers RPL-IL1 and RPL-IL2 stacked with the display area DA and the non-display area NDA, respectively. Although the anti-reflection layer RPL including two conductive layers RPL-ML1 and RPL-ML2 and two insulating layers RPL-IL1 and RPL-IL2 is shown as an example, embodiments of the present disclosure are not limited thereto.

[0178] The conductive layers RPL-ML1 and RPL-ML2 and the insulating layers RPL-IL1 and RPL-IL2 can be alternately laminated. However, embodiments of the present inventive concept are not limited to the lamination order. The first conductive layer RPL-ML1 can include a metal having an absorption rate of about 30% or more. The first conductive layer RPL-ML1 can be formed of a material having a refractive index of about 1.5 to about 7 and an absorption coefficient k of about 1.5 to about 7. The first conductive layer RPL-ML1 can be formed of at least one selected from chromium (Cr), molybdenum (Mo), tungsten (W), titanium (Ti), nickel (Ni), cobalt (Co), copper oxide (CuO), titanium nitride (TiN x ), and nickel sulfide (NiS). The first conductive layer RPL-ML1 can be a metal layer formed of one of the above-described materials. In some embodiments, the second conductive layer RPL-ML2 can also include the above-described metal.

[0179] Each of the first and second insulating layers RPL-IL1 and RPL-IL2 can be formed of at least one selected from silicon dioxide (SiO2), titanium dioxide (TiO2), lithium fluoride (LiF), calcium fluoride (CaF2), magnesium fluoride (MgF2), silicon nitride (SiNx), tantalum oxide (Ta2O5), niobium oxide (Nb2O5), silicon carbon nitride (SiCN), molybdenum oxide (MoO x ), iron oxide (FeO x ), and chromium oxide (CrO xone of the structures shown in FIGS. 1A to 1C is selected. Light OL incident from the outside is partially reflected by the first conductive layer RPL-ML1 (hereinafter, light reflected by the first conductive layer RPL-ML1 is referred to as first reflected light RL1) and the second conductive layer RPL-ML2 (hereinafter, light reflected by the second conductive layer RPL-ML2 is referred to as second reflected light RL2).

[0180] The first insulating layer RPL-IL1 can adjust the phase of light passing through the first insulating layer RPL-IL1 so that there is a phase difference of approximately 180° between the first reflected light RL1 and the second reflected light RL2. Accordingly, the first reflected light RL1 and the second reflected light RL2 can be canceled out.

[0181] The thickness and material of each of the first conductive layer RPL-ML1, the second conductive layer RPL-ML2, the first insulating layer RPL-IL1, and the second insulating layer RPL-IL2 can be selected to satisfy (or be suitable for) the condition for destructive interference between the first reflected light RL1 and the second reflected light RL2. However, embodiments of the inventive concept are not specifically limited thereto. In some embodiments, the anti-reflection layer RPL can further include a black matrix BM.

[0182] To prevent or reduce the possibility of air bubbles being generated during the formation of the anti-reflection layer RPL, at least one of the first insulating layer RPL-IL1 and the second insulating layer RPL-IL2 can include an inorganic layer having a density of approximately 2.05 g / cm 3 to approximately 2.4 g / cm 3 . For example, each of the first insulating layer RPL-IL1 and the second insulating layer RPL-IL2 can include a silicon nitride layer having the above-described density.

[0183] As shown in FIG. 1A, the display device DD-1 includes a protective film PM, a display module DM-1, a window WM, a first adhesive member AM1, and a second adhesive member AM2. The display module DM-1 can include an organic light emitting display panel DP, a touch sensing unit TS, and an anti-reflection layer RPL. The touch sensing unit TS can be disposed directly on the organic light emitting display panel DP, and the anti-reflection layer RPL can be disposed directly on the touch sensing unit TS. Figure 11 The touch sensing unit TS can have the same structure as that described with reference to

[0184] Figures 1A to 9 The anti-reflection layer RPL can have the same structure as that described with reference to Figure 10A and Figure 10B .

[0185] As described above, the inorganic layer having a density of approximately 2.05 g / cm 3 to approximately 2.4 g / cm 3 ​The inorganic layer of the density can seal the seeds, which otherwise can cause the generation of bubbles. For example, the seeds can be sealed adjacent to the film encapsulation layer.

[0186] The inorganic layer can prevent or reduce the seeds from approaching the organic layer. Thus, the reaction between the seeds and the organic layer can be prevented or reduced, and the generation of bubbles can be inhibited or reduced. Accordingly, the delamination between the organic adhesive member and the window can be reduced.

[0187] As used herein, the term "use" and variations thereof can be considered synonymous with the term "utilize" and variations thereof.

[0188] In addition, the terms "substantially," "approximately," and similar terms are used as terms of approximation and not as terms of degree, unless otherwise indicated, and are meant to account for the inherent deviations in measured or calculated values that would be recognized by those of ordinary skill in the art.

[0189] In addition, any numerical range recited herein is intended to include all sub-ranges of the same entire number of increments, whole or fractional. For example, a range of 1.0 to 10.0 is intended to include all sub-ranges, for example, 2.4 to 7.6, 3.5 to 9.9, etc., each of which is a separate and independent numerical range encompassed within the range of 1.0 to 10.0. Any maximum numerical limitation recited herein is intended to include all lower numerical limitations subsumed therein and any minimum numerical limitation recited in this specification is intended to include all higher numerical limitations subsumed therein. Accordingly, Applicant reserves the right to amend this specification, including the claims, to expressly recite any sub-range subsumed in the ranges expressly recited in this specification.

[0190] While example embodiments of the inventive concept have been described herein, it will be apparent to those skilled in the art that various modifications and changes can be made within the inventive concept without departing from the scope thereof. Accordingly, the disclosure is intended to cover all modifications and changes as fall within the scope of the inventive concept, as claimed in the appended claims, and their equivalents.

Claims

1. A display device, the display device comprising: An organic light-emitting display panel includes a base layer, a circuit layer on the base layer, a light-emitting element layer on the circuit layer, and a thin film encapsulation layer on the light-emitting element layer; A conductive layer is located on the thin film encapsulation layer; At least one inorganic layer is located on the film encapsulation layer and comprises a content of 2.05 g / cm³. 3 Up to 2.4 g / cm 3 A silicon nitride layer of high density; An organic adhesive layer is located on the at least one inorganic layer; as well as The window is located on the organic adhesive layer and faces the organic light-emitting display panel.

2. The display device according to claim 1, wherein, The organic adhesive layer does not form bubbles, and the bubbles contain nitrogen and / or hydrogen.

3. The display device according to claim 1, wherein, The at least one inorganic layer contacts the conductive layer.

4. The display device according to claim 1, wherein, The thin film encapsulation layer includes: Multiple inorganic thin films; and At least one organic film is located between the plurality of inorganic films.

5. The display device according to claim 1, further comprising an organic layer, the organic layer being located between the at least one inorganic layer and the organic adhesive layer.

6. The display device according to claim 1, wherein, The conductive layer includes a touch sensor with a grid shape.

7. The display device according to claim 6, wherein, The touch sensor has a single-layer structure.

8. The display device according to claim 6, wherein, The touch sensor has a multi-layer structure.

9. The display device according to claim 1, wherein, The conductive layer includes: A first conductive layer is located on the thin film encapsulation layer; and The second conductive layer is located on the thin film encapsulation layer and is located in a different layer than the first conductive layer.

10. The display device according to claim 9, wherein, There is a 180° phase difference between the first reflected light reflected by the first conductive layer and the second reflected light reflected by the second conductive layer.

11. The display device according to claim 1, further comprising a polarizing film located between the organic adhesive layer and the at least one inorganic layer.

12. A display device, the display device comprising: An organic light-emitting display panel includes a base layer, a circuit layer on the base layer, a light-emitting element layer on the circuit layer, and a thin film encapsulation layer on the light-emitting element layer; The window faces the organic light-emitting display panel; Multiple inorganic layers are located between the thin film encapsulation layer and the window; as well as The conductive layer contacts at least one of the plurality of inorganic layers. Each of the plurality of inorganic layers comprises having a content of 2.05 g / cm³. 3 Up to 2.4 g / cm 3 A silicon nitride layer with a certain density.

13. The display device according to claim 12, wherein, The plurality of inorganic layers include: A first inorganic layer is located between the thin film encapsulation layer and the conductive layer; and A second inorganic layer covers the conductive layer.

14. The display device according to claim 12, wherein, The conductive layer includes: A first conductive layer is located on the thin film encapsulation layer; and The second conductive layer is located on the thin film encapsulation layer and is located in a different layer than the first conductive layer.

15. The display device according to claim 14, wherein, The plurality of inorganic layers include: A first inorganic layer is located between the first conductive layer and the second conductive layer; and A second inorganic layer covers the second conductive layer.

16. The display device according to claim 15, wherein, The plurality of inorganic layers further includes a third inorganic layer, which is located between the first conductive layer and the thin film encapsulation layer.

17. The display device according to claim 12, the display device further comprising an organic adhesive layer, the organic adhesive layer being located between the uppermost layer of the plurality of inorganic layers and the window.

18. The display device according to claim 17, wherein, The organic adhesive layer does not form bubbles, and the bubbles contain nitrogen and / or hydrogen.

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