Disk device

Abstract

An embodiment provides a disk device capable of improving durability against thermal stress. The disk device involved in one embodiment includes a recording medium, a first magnetic head, a first wiring member, a flexible printed wiring board, and wiring. The first wiring member is electrically connected to the first magnetic head. The flexible printed wiring board has a surface, a first fixing portion fixed to a first component, and a second fixing portion fixed to a second component, and is electrically connected to the first magnetic head via the first wiring member. The wiring is arranged on the flexible printed wiring board, extends along the surface, and extends between the first fixing portion and the second fixing portion in a direction intersecting at an angle greater than 45° and less than 90° relative to the direction in which an imaginary line extends, and the imaginary line is an imaginary line connecting the first fixing portion and the second fixing portion with the shortest distance along the surface.

Description

[0001] This application claims the priority of Japanese Patent Application No. 2020-156775 (filing date: September 17, 2020) as a basic application, and the entire contents of the basic application are incorporated herein by reference. Technical Field

[0002] An embodiment of the present invention relates to a disk device. Background Art

[0003] A disk device such as a hard disk drive (HDD) has a magnetic disk and a magnetic head for reading and writing information on the magnetic disk. A control circuit for controlling the HDD and the magnetic head are electrically connected via, for example, a printed circuit board (PCB), a flexible printed circuit board (FPC), and a flexure.

[0004] The FPC is fixed to various components such as a rotary actuator for moving a magnetic head and electronic components mounted on the FPC. Therefore, when the FPC is thermally contracted or thermally expanded, thermal stress may be generated in the FPC. Summary of the invention

[0005] Embodiments of the present invention provide a disk device capable of improving durability against thermal stress.

[0006] A disk device according to one embodiment comprises a disk-shaped recording medium, a first magnetic head, a first wiring member, a flexible printed wiring board, and wiring. The recording medium has a recording layer. The first magnetic head is configured to read and write information on the recording medium. The first wiring member is electrically connected to the first magnetic head. The flexible printed wiring board has a surface, a first fixing portion fixed to a first component, and a second fixing portion fixed to a second component, and is electrically connected to the first magnetic head via the first wiring member. The wiring is arranged on the flexible printed wiring board, extends along the surface, and extends between the first fixing portion and the second fixing portion in a direction intersecting at an angle greater than 45° and less than 90° relative to the direction in which an imaginary line extends, and the imaginary line is an imaginary line connecting the first fixing portion and the second fixing portion with the shortest distance along the surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 This is an exemplary perspective view schematically showing a hard disk drive (HDD) according to one embodiment.

[0008] Figure 2 It is an illustrative diagram schematically showing a flexible printed wiring board (FPC) and a flexible member according to an embodiment.

[0009] Figure 3It is an exemplary plan view schematically showing an end portion of an FPC and a flexure according to an embodiment.

[0010] Figure 4 It is an exemplary plan view schematically showing a part of the FPC according to the embodiment. DETAILED DESCRIPTION

[0011] Below, refer to Figure 1 to Figure 4 An embodiment is described. In addition, in this specification, the constituent elements and the description of the elements involved in the embodiment are sometimes recorded in multiple expressions. The constituent elements and their descriptions are examples and are not limited by the expressions in this specification. The constituent elements may also be identified by names different from the names in this specification. In addition, the constituent elements may also be described by expressions different from the expressions in this specification.

[0012] Figure 1 1 is an illustrative perspective view schematically showing a hard disk drive (HDD) 10 according to one embodiment. The HDD 10 is an example of a disk device. The disk device is not limited to the HDD 10, and may be another disk device such as a hybrid hard disk drive.

[0013] like Figure 1 As shown, HDD 10 has a frame 11, a plurality of magnetic disks 12, a spindle motor 13, a clamp spring 14, a plurality of magnetic heads 15, an actuator assembly 16, a support shaft 17, a voice coil motor (VCM) 18, a ramp loading mechanism 19, a printed circuit board (PCB) 21, and a flexible printed wiring board (FPC) 22. The magnetic disk 12 is an example of a recording medium. The plurality of magnetic heads 15 are an example of a first magnetic head and a second magnetic head.

[0014] The frame 11 has a bottom wall 11a formed in a plate shape and a side wall 11b protruding from the bottom wall 11a. The frame 11 also has a cover mounted on the side wall 11b to cover the inside of the frame 11. The frame 11 at least partially accommodates the magnetic disk 12, the spindle motor 13, the clamp spring 14, the magnetic head 15, the actuator assembly 16, the support shaft 17, the VCM 18, the ramp loading mechanism 19 and the FPC 22.

[0015] The magnetic disk 12 is, for example, a disk having a magnetic recording layer provided on at least one of the upper surface and the lower surface. The diameter of the magnetic disk 12 is, for example, 3.5 inches, but the invention is not limited to this example.

[0016] The spindle motor 13 supports and rotates the plurality of magnetic disks 12 stacked at intervals, and the clamp spring 14 holds the plurality of magnetic disks 12 on a hub of the spindle motor 13 .

[0017] The magnetic head 15 records and reproduces information on the recording layer of the magnetic disk 12. In other words, the magnetic head 15 reads and writes information on the magnetic disk 12. The magnetic head 15 is supported by an actuator assembly 16.

[0018] The support shaft 17 is arranged at a position away from the magnetic disk 12, and supports the actuator assembly 16 in a rotatable manner. The VCM 18 rotates the actuator assembly 16 and arranges it at a desired position. When the magnetic head 15 is moved to the outermost periphery of the magnetic disk 12 by the rotation of the actuator assembly 16 realized based on the VCM 18, the ramp loading mechanism 19 keeps the magnetic head 15 at the unloading position away from the magnetic disk 12.

[0019] The actuator assembly 16 has an actuator block 31, a plurality of arms 32, and a plurality of head suspension assemblies 33. The head suspension assemblies 33 may also be referred to as a head gimbal assembly (HGA).

[0020] The actuator block 31 is rotatably supported on the support shaft 17 via a bearing, for example. The plurality of arms 32 protrude from the actuator block 31 in a direction substantially orthogonal to the support shaft 17. In addition, the actuator assembly 16 may be divided, and the plurality of arms 32 may protrude from each of the plurality of actuator blocks 31.

[0021] The plurality of arms 32 are arranged at intervals in the direction in which the support shaft 17 extends. Each of the arms 32 is formed in a plate shape that can enter between adjacent magnetic disks 12. The plurality of arms 32 extend substantially in parallel.

[0022] The actuator block 31 and the plurality of arms 32 are integrally formed of, for example, aluminum. In addition, the materials of the actuator block 31 and the arms 32 are not limited to this example.

[0023] The voice coil of the VCM 18 is provided on a protrusion protruding from the actuator block 31 in the opposite direction to the arm 32. The VCM 18 includes a pair of yokes, a voice coil disposed between the yokes, and a magnet provided on the yokes.

[0024] The head gimbal assembly 33 is mounted on the front end portion of the corresponding arm 32, and protrudes from the arm 32. Thus, a plurality of head gimbal assemblies 33 are arranged at intervals in the direction in which the support shaft 17 extends.

[0025] Figure 2 2 is an illustrative diagram schematically showing the FPC 22 and the flexure 43 of the present embodiment. The plurality of head gimbal assemblies 33 each have Figure 1 The base plate 41 and the load beam 42 are shown Figure 2 The flexure 43 is shown. The flexure 43 is an example of the first wiring member and the second wiring member. Further, the magnetic head 15 is mounted on the head gimbal assembly 33.

[0026] The base plate 41 and the load beam 42 are made of, for example, stainless steel. The materials of the base plate 41 and the load beam 42 are not limited to this example. The base plate 41 is formed in a plate shape and is attached to the front end of the arm 32. The load beam 42 is formed in a plate shape that is thinner than the base plate 41. The load beam 42 is attached to the front end of the base plate 41 and protrudes from the base plate 41.

[0027] like Figure 2 As shown in FIG. 1 , the flexure 43 is formed in an elongated strip shape. The shape of the flexure 43 is not limited to this example. The flexure 43 is a laminated plate having a metal plate (lining layer) such as stainless steel, an insulating layer formed on the metal plate, a conductive layer forming a plurality of wirings (wiring patterns) formed on the insulating layer, and a protective layer (insulating layer) covering the conductive layer.

[0028] The flexure 43 is mounted on the base plate 41 and the load beam 42. One end of the flexure 43 has a gimbal portion (elastic support portion) which is located on the load beam 42 and can be displaced. The magnetic head 15 is mounted on the gimbal portion. Thus, the flexure 43 and the magnetic head 15 are electrically connected.

[0029] A plurality of pads 45 are provided at the other end of the flexure 43. Furthermore, a plurality of wirings 46 for connecting the plurality of pads 45 to the read element, the write element, the heater, or other components of the magnetic head 15 are provided on the flexure 43.

[0030] like Figure 1 As shown, the above-mentioned VCM 18, actuator block 31 and multiple arms 32 form a rotary actuator 49 for moving the magnetic head 15 to a desired position. In addition, the rotary actuator 49 is not limited to this example. For example, the rotary actuator 49 can omit at least one of the VCM 18, actuator block 31 and arm 32, or can have other components. The rotary actuator 49 is an example of the first component.

[0031] The rotary actuator 49 is driven by, for example, the VCM 18 to rotate about the support shaft 17. The rotary actuator 49 moves the head gimbal assembly 33 attached to the arm 32 and the magnetic head 15 attached to the head gimbal assembly 33 by rotating.

[0032] The PCB 21 is mounted on the bottom wall 11a outside the frame 11. Figure 2 As shown, a control circuit 21 a for controlling the spindle motor 13 , the magnetic head 15 , and the VCM 18 is provided on the PCB 21 .

[0033] The control circuit 21a, for example, has a read-write channel (RWC) for controlling the reading and writing of information performed by the magnetic head 15, a hard disk controller (HDC) for controlling communication with a host computer, a processor for controlling the entirety of the HDD 10, and a servo combination (servo combo) IC (SVC) for controlling the spindle motor 13 and the VCM 18. In addition, the control circuit 21a is not limited to this example. The control circuit 21a is electrically connected to the magnetic head 15 and the VCM 18 via the FPC 22.

[0034] The FPC 22 has, for example, an insulating layer such as a base film, a conductor layer provided on the insulating layer, and an insulating protective layer covering the conductor layer. The FPC 22 is, for example, a double-sided FPC in which a conductor layer and a protective layer are provided on both sides of the insulating layer, or a multi-layer FPC in which a plurality of conductor layers and insulating layers are stacked. In addition, the FPC 22 is not limited to this example.

[0035] A plurality of flexible members 43 are connected to one end 22a of the FPC 22. The other end 22b of the FPC 22 is electrically connected to the PCB 21 via, for example, a connector provided on the bottom wall 11a of the frame 11. In the FPC 22, a middle portion 22c between the end 22a and the end 22b extends in a belt shape and can bend along with the rotation of the rotary actuator 49.

[0036] Figure 3 2 is an illustrative top view schematically showing the end portion 22a of the FPC 22 and the flexible member 43 of the present embodiment. The FPC 22 has a first surface 51, a second surface 52, and a plurality of pads 53. The first surface 51 is an example of a surface. The first surface 51 is formed, for example, by a protective layer on one side. The second surface 52 is provided on the opposite side of the first surface and is formed, for example, by a protective layer on the other side. The second surface 52 is, for example, facing the actuator block 31 of the rotary actuator 49.

[0037] The pads 53 are provided on the first surface 51 at the end 22a of the FPC 22, for example. The pads 53 are connected to the pads 45 of the flexure 43, for example, by a conductive adhesive or solder. Thus, the flexures 43 are connected at the end 22a, and the FPC 22 is electrically connected to the magnetic head 15 via the flexures 43.

[0038] The end portion 22a of the FPC 22 also has a first mounting portion 61, a second mounting portion 62, a first installation portion 63, and a second installation portion 64. The first mounting portion 61 is an example of a first fixing portion and a fixing portion. The second mounting portion 62 is an example of a third fixing portion. The first installation portion 63 is an example of a second fixing portion. In addition, the first installation portion 63 may also be an example of a first fixing portion, and the second installation portion 64 may also be an example of a second fixing portion.

[0039] The first mounting portion 61 and the second mounting portion 62 are portions of the end portion 22a of the FPC 22 that are fixed to the rotary actuator 49. Figure 3 The two electrodes are arranged to be separated from each other in the first direction D1.

[0040] The first direction D1 is a direction along the first surface 51. The direction along the first surface 51 is a direction substantially parallel to the first surface 51. In the present embodiment, the first direction D1 is a direction substantially parallel to the direction in which the support shaft 17 extends.

[0041] The first mounting portion 61 is provided near one edge 22d of the FPC 22 in the first direction D1. In other words, the first mounting portion 61 is provided at one end of the FPC 22 in the first direction D1.

[0042] The second mounting portion 62 is provided near the other end edge 22e of the FPC 22 in the first direction D1. In other words, the second mounting portion 62 is provided at the other end of the FPC 22 in the first direction D1.

[0043] A hole 61a is provided in the first mounting portion 61. Furthermore, a hole 62a is provided in the second mounting portion 62. The holes 61a and 62a penetrate the FPC 22 and open in the first surface 51 and the second surface 52, respectively.

[0044] The first mounting portion 61 is fixed to the actuator block 31 of the rotary actuator 49, for example, by a first screw 67. For example, the first screw 67 is inserted through a hole 61a into a screw hole provided in the actuator block 31. Thus, the first mounting portion 61 is screwed to the actuator block 31. In addition, the first mounting portion 61 is not limited to the first screw 67, and may be fixed to the actuator block 31 by a pin, solder, adhesive, or other means.

[0045] The second mounting portion 62 is fixed to the actuator block 31, for example, by the second screw 68. For example, the second screw 68 is inserted into a screw hole provided in the actuator block 31 through the hole 62a. Thus, the second mounting portion 62 is screwed to the actuator block 31. In addition, the second mounting portion 62 is not limited to the second screw 68, and may be fixed to the actuator block 31 by a pin, solder, adhesive, or other means.

[0046] The FPC 22 is equipped with a first mounting component 71 and a second mounting component 72. The first mounting component 71 is an example of a second component. In addition, the first mounting component 71 may also be an example of a first component, and the second mounting component 72 may also be an example of a second component. The first mounting portion 63 and the second mounting portion 64 are portions of the end portion 22a of the FPC 22 to which the first mounting component 71 and the second mounting component 72 are fixed.

[0047] The first mounting component 71 includes a first preamplifier 75 and a first underfill 76. The first mounting component 71 is not limited to the first preamplifier 75, and may include other electronic components such as an IC or a sensor.

[0048] The first preamplifier 75 is formed in a substantially rectangular plate shape and is mounted on the first surface 51 of the FPC 22. For example, the electrodes of the first preamplifier 75 are connected to pads provided on the first surface 51 by a conductive adhesive or solder. Thus, the first preamplifier 75 is electrically connected to the magnetic head 15 through the FPC 22 and the flexure 43.

[0049] Next, the magnetic head 15 and the flexure 43 electrically connected to the first preamplifier 75 are sometimes as follows. Figure 2 Thus, they are referred to as the magnetic head 15A and the flexure 43A. The magnetic head 15A is at least one of the plurality of magnetic heads 15 and is an example of a first magnetic head. The flexure 43A is at least one of the plurality of flexures 43 and is an example of a first wiring member.

[0050] The first preamplifier 75 is electrically connected to the control circuit 21a of the PCB 21 via the FPC 22. Furthermore, the first preamplifier 75 is electrically connected to the magnetic head 15A via the FPC 22 and the flexure 43A.

[0051] The first preamplifier 75 amplifies the write signal output from the RWC of the control circuit 21a and transmits it to the magnetic head 15A. Based on the write signal, the magnetic head 15A writes information to the magnetic disk 12. In this way, the first preamplifier 75 outputs the write signal corresponding to the information that the magnetic head 15A is going to write to the magnetic disk 12 to the magnetic head 15A through the FPC 22 and the flexible member 43A.

[0052] The first preamplifier 75 amplifies the read signal output from the magnetic head 15A and transmits it to the RWC of the control circuit 21a. In other words, the first preamplifier 75 receives a read signal corresponding to the information read from the magnetic head 15A from the magnetic head 15A via the FPC 22 and the flexure 43A.

[0053] like Figure 3 As shown, the first underfill 76 fixes the first preamplifier 75 to the first surface 51 of the FPC 22. The first mounting member 71 is fixed to the first mounting portion 63 by the first underfill 76.

[0054] For example, the first underfill material 76 is attached to the edge 75a of the first preamplifier 75 and to the first surface 51. Alternatively, a portion of the first underfill material 76 may be interposed between the first preamplifier 75 and the first surface 51.

[0055] The edge 75 a is an edge of the first preamplifier 75 in the direction along the first surface 51 . In the present embodiment, the first underfill 76 is attached to the entire circumference of the edge 75 a . Therefore, the first underfill 76 surrounds the first preamplifier 75 .

[0056] The second mounting component 72 includes a second preamplifier 77 and a second underfill 78. In addition, the second mounting component 72 is not limited to the second preamplifier 77, and may include other electronic components such as an IC and a sensor.

[0057] The second preamplifier 77 is formed in a substantially rectangular plate shape and is mounted on the first surface 51 of the FPC 22. For example, the electrodes of the second preamplifier 77 are connected to pads provided on the first surface 51 by means of a conductive adhesive or solder. Thus, the second preamplifier 77 is electrically connected to the magnetic head 15 via the FPC 22 and the flexure 43.

[0058] Next, the magnetic head 15 and the flexure 43 electrically connected to the second preamplifier 77 are sometimes as follows. Figure 2 The magnetic head 15B and the flexure 43B are referred to as such. The magnetic head 15B is at least one of the plurality of magnetic heads 15 and is an example of a second magnetic head. The flexure 43B is at least one of the plurality of flexures 43 and is an example of a second wiring member.

[0059] The second preamplifier 77 is electrically connected to the control circuit 21a of the PCB 21 via the FPC 22. Furthermore, the second preamplifier 77 is electrically connected to the magnetic head 15B via the FPC 22 and the flexure 43B.

[0060] The second preamplifier 77 amplifies the write signal output from the RWC of the control circuit 21a and transmits it to the magnetic head 15B. Based on the write signal, the magnetic head 15B writes information to the magnetic disk 12. In this way, the second preamplifier 77 outputs the write signal corresponding to the information that the magnetic head 15B is going to write to the magnetic disk 12 to the magnetic head 15B through the FPC22 and the flexible member 43B.

[0061] The second preamplifier 77 amplifies the read signal output from the magnetic head 15B and transmits it to the RWC of the control circuit 21a. In other words, the second preamplifier 77 receives a read signal corresponding to the information read from the magnetic head 15B from the magnetic head 15B via the FPC 22 and the flexure 43B.

[0062] like Figure 3 As shown, the second underfill 78 fixes the second preamplifier 77 to the first surface 51 of the FPC 22. The second mounting member 72 is fixed to the second mounting portion 64 by the second underfill 78.

[0063] For example, the second underfill material 78 is attached to the edge 77a of the second preamplifier 77 and to the first surface 51. In addition, a part of the second underfill material 78 may be interposed between the second preamplifier 77 and the first surface 51.

[0064] The edge 77 a is an edge of the second preamplifier 77 in the direction along the first surface 51 . In the present embodiment, the second underfill 78 is attached to the entire circumference of the edge 77 a . Therefore, the second underfill 78 surrounds the second preamplifier 77 .

[0065] The first underfill 76 and the second underfill 78 may be connected to each other via the third underfill 79. In this case, the first underfill 76 has a mountain-shaped cross section (fillet) near the edge 75a of the first preamplifier 75, and the thickness in the second direction D2 increases as it approaches the edge 75a. In addition, the second underfill 78 has a fillet near the edge 77a of the second preamplifier 77, and the thickness in the second direction D2 increases as it approaches the edge 77a.

[0066] The second direction D2 is a direction intersecting the first surface 51. In the present embodiment, the second direction D2 is a direction perpendicular to the first surface 51. Therefore, the second direction D2 is perpendicular to the first direction D1.

[0067] The third bottom filler 79 is continuous with the first bottom filler 76 and the second bottom filler 78. The third bottom filler 79 does not form a flange and extends substantially flat. The thickness of the third bottom filler 79 in the second direction D2 is smaller than the maximum thickness of the first bottom filler 76 in the second direction D2, and is smaller than the maximum thickness of the second bottom filler 78 in the second direction D2. In addition, the third bottom filler 79 may be omitted.

[0068] The first mounting portion 63 and the second mounting portion 64 are located between the first mounting portion 61 and the second mounting portion 62. The first mounting portion 61, the second mounting portion 62, the first mounting portion 63, and the second mounting portion 64 are arranged at intervals from each other in the first direction D1. The first mounting portion 63 is closer to the first mounting portion 61 than the second mounting portion 64. In addition, the arrangement of the first mounting portion 61, the second mounting portion 62, the first mounting portion 63, and the second mounting portion 64 is not limited to this example.

[0069] Figure 4 2 is an illustrative top view schematically showing a portion of the FPC 22 of this embodiment. Figure 4 As shown in FIG. 1 , a conductor pattern 80 is provided on the FPC 22. The conductor pattern 80 is provided on, for example, a conductor layer of the FPC 22 and is covered with a protective layer.

[0070] The conductor pattern 80 is made of a conductor such as copper. The conductor pattern 80 includes a first wiring 81, a second wiring 82, a third wiring 83, a fourth wiring 84, a fifth wiring 85, a sixth wiring 86, a first via 91, a second via 92, a third via 93, and a fourth via 94. The first wiring 81 and the fourth wiring 84 are each an example of a wiring.

[0071] The first wiring 81 to the sixth wiring 86 extend on the insulating layer of the FPC 22. Therefore, the first wiring 81 to the sixth wiring 86 extend along the first surface 51. In addition, the first wiring 81 to the sixth wiring 86 may be provided on mutually different surfaces in the insulating layer. The first wiring 81 to the sixth wiring 86 each have at least one of a portion extending in a straight line and a portion extending in a curved line.

[0072] The first via hole 91 to the fourth via hole 94 are, for example, plated through holes. In addition, the first via hole 91 to the fourth via hole 94 may also be other via holes. The first via hole 91 to the fourth via hole 94 are, for example, conductors formed on the inner surface of a hole penetrating at least one insulating layer of the FPC 22. The first via hole 91 to the fourth via hole 94 connect, for example, a wiring provided in one layer of the FPC 22 to a wiring provided in another layer.

[0073] The first wiring 81 extends from, for example, a pad 81a connected to an electrode of the first preamplifier 75. The pad 81a is provided on the first surface 51 and is covered by the first preamplifier 75 in the second direction D2. The first wiring 81 is not limited to this example, and may be connected to other pads or vias.

[0074] In the FPC 22, the first wiring 81 extends from the area AC1 covered by the first preamplifier 75 through the area AC2 covered by the first bottom filler 76 to the area AO outside the first preamplifier 75 and the first bottom filler 76. The area AO is a portion of the FPC 22 that is located outside the first mounting component 71 and the second mounting component 72 in the direction along the first surface 51.

[0075] A portion of the first wiring 81 extends in a region AB1 between the first mounting portion 61 and the first mounting portion 63. The region AB1 is also a region between the first mounting portion 61 and the first underfill 76, and is included in the region AO.

[0076] The first wiring 81 extends in the region AB1 in a direction intersecting the direction in which the imaginary line LV1 extends at an angle θ1 greater than 45° and less than 90°. In other words, the angle between the direction in which the imaginary line LV1 extends and the direction in which the first wiring 81 extends in the region AB1 is angle θ1. The direction in which the first wiring 81 extends includes a direction along the first wiring 81 and its extension line and the opposite direction thereof. The direction in which the imaginary line LV1 extends includes a direction along the imaginary line LV1 and its extension line and the opposite direction thereof.

[0077] The imaginary line LV1 is an imaginary line connecting the first mounting portion 61 and the first attachment portion 63 at the shortest distance along the first surface 51. The imaginary line LV1 is also an imaginary line connecting the first mounting portion 61 and the first underfill 76 at the shortest distance along the first surface 51.

[0078] For example, the imaginary line LV1 is obtained as follows. First, a circle C tangent to the first bottom filler 76 is drawn with the center axis Ax of the hole 61a of the first mounting portion 61 as the center. When multiple circles can be drawn, the circle C is the smallest circle among the multiple circles. The imaginary line LV1 is obtained by connecting the tangent point of the circle C and the first bottom filler 76 and the center axis Ax. In addition, the imaginary line LV1 is not limited to this example.

[0079] The first assembly portion 61 and the first mounting portion 63 are fixed to other components, thereby constraining the thermal contraction and thermal expansion of the FPC 22. Therefore, when the FPC 22 thermally contracts and thermally expands, thermal stress is generated in the area AB1 between the first assembly portion 61 and the first mounting portion 63. The direction in which the imaginary line LV1 extends is the direction in which the thermal stress acts most strongly, and can also be called the principal stress direction.

[0080] The first wiring 81 may be bent at at least one position. In other words, the direction in which the first wiring 81 extends may also change. However, any portion of the first wiring 81 in the region AB1 extends in a direction that intersects the direction in which the imaginary line LV1 extends at an angle θ1 greater than 45° and less than 90°.

[0081] exist Figure 4 In the example, the first wiring 81 intersects the imaginary line LV1 in the area AB1 at an angle θ1 greater than 45° and less than 90°. However, if the direction in which the imaginary line LV1 extends intersects the direction in which the first wiring 81 extends in the area AB1 at an angle θ1, the first wiring 81 and the imaginary line LV1 do not need to intersect.

[0082] For example, when the pad 81a is arranged closer to the pad 53 than the first mounting portion 61, the first wiring 81 does not intersect the imaginary line LV1. However, the direction in which the imaginary line LV1 extends intersects the direction in which the first wiring 81 extends in the area AB1 at an angle θ1. Figure 4 When the first surface 51 is viewed from above, the extension line of the first wiring 81 and the extension line of the virtual line LV1 intersect at an angle θ1.

[0083] The second wiring 82 extends from the first via 91. The second wiring 82 is not limited to this example, and may be connected to other pads or vias. In addition, the first via 91 may be connected to other wirings.

[0084] For example, the second wiring 82 is one of the differential wirings. The other of the differential wirings extends, for example, in the second direction D2 so as to overlap with the second wiring 82. In addition, the second wiring 82 is not limited to this example.

[0085] The first via hole 91 is located between the first mounting portion 61 and the first preamplifier 75 in the direction in which the imaginary line LV1 extends. The first via hole 91 is covered in the second direction D2 by the first underfill 76. In other words, the first via hole 91 is arranged in the region AC2 in the FPC 22.

[0086] The second wiring 82 is covered by the first underfill 76 in the second direction D2 between the first mounting portion 61 and the first preamplifier 75. In addition, the portion of the second wiring 82 not located between the first mounting portion 61 and the first preamplifier 75 may not be covered by the first underfill 76.

[0087] The second wiring 82 extends between the first mounting portion 61 and the first preamplifier 75, for example, along the first underfill 76. According to another embodiment, the second wiring 82 extends between the first mounting portion 61 and the first preamplifier 75 along the edge 75a of the first preamplifier 75.

[0088] The third wiring 83 extends from the second via 92. The third wiring 83 is not limited to this example, and may be connected to other pads or vias. The second via 92 may be connected to other wirings.

[0089] For example, the third wiring 83 is one of the differential wirings. The other of the differential wirings extends, for example, in the second direction D2 so as to overlap with the third wiring 83. In addition, the third wiring 83 is not limited to this example.

[0090] The second via hole 92 is located between the first mounting portion 61 and the geometric center CN1 of the first preamplifier 75 in the direction in which the imaginary line LV1 extends. The second via hole 92 is covered by the first preamplifier 75 in the second direction D2. In other words, the second via hole 92 is arranged in the region AC1 of the FPC 22.

[0091] The third wiring 83 is covered by the first preamplifier 75 in the second direction D2 between the first mounting portion 61 and the geometric center CN1 of the first preamplifier 75. In addition, the portion of the third wiring 83 that is not located between the first mounting portion 61 and the geometric center CN1 of the first preamplifier 75 may not be covered by the first preamplifier 75.

[0092] The fourth wiring 84 extends from, for example, a pad 84a connected to an electrode of the first preamplifier 75. The pad 84a is provided on the first surface 51 and is covered by the first preamplifier 75 in the second direction D2. The fourth wiring 84 is not limited to this example, and may be connected to other pads or vias.

[0093] The fourth wiring 84 extends from the area AC1 through the area AC2 to the area AO in the FPC 22. In the area AO, a portion of the fourth wiring 84 extends in the area AB2 between the first mounting portion 63 and the second mounting portion 64. The area AB2 is also a region between the first bottom filler 76 and the second bottom filler 78, and is included in the area AO. The area AB2 may also be covered by the third bottom filler 79 in the second direction D2.

[0094] When the first underfill 76 and the second underfill 78 are connected via the third underfill 79, the boundary between the first underfill 76 and the second underfill 78 can be determined, for example, based on the above-mentioned flange. As described above, in the flange, the thickness of the first underfill 76 in the second direction D2 increases as it approaches the edge 75a of the first preamplifier 75. Therefore, the position where the thickness of the first underfill 76 decreases as it moves away from the edge 75a begins to become substantially constant is the boundary of the first underfill 76. Similarly, the position where the thickness of the second underfill 78 decreases as it moves away from the edge 77a begins to become substantially constant is the boundary of the second underfill 78.

[0095] The fourth wiring 84 extends in the region AB2 in a direction intersecting the direction in which the imaginary line LV2 extends at an angle θ2 greater than 45° and less than 90°. In other words, the angle between the direction in which the imaginary line LV2 extends and the direction in which the fourth wiring 84 extends in the region AB2 is angle θ2. The direction in which the fourth wiring 84 extends includes a direction along the fourth wiring 84 and its extension line and the opposite direction thereof. The direction in which the imaginary line LV2 extends includes a direction along the imaginary line LV2 and its extension line and the opposite direction thereof.

[0096] Virtual line LV2 is a virtual line connecting first mounting portion 63 and second mounting portion 64 at the shortest distance along first surface 51. Virtual line LV2 is also a virtual line connecting first underfill 76 and second underfill 78 at the shortest distance along first surface 51.

[0097] The first mounting portion 63 and the second mounting portion 64 are fixed to other components, thereby constraining the thermal contraction and thermal expansion of the FPC 22. Therefore, when the FPC 22 thermally contracts and thermally expands, thermal stress is generated in the area AB2 between the first mounting portion 63 and the second mounting portion 64. The direction in which the imaginary line LV2 extends is the direction in which the thermal stress acts more strongly, and can also be called the principal stress direction.

[0098] The fourth wiring 84 may be bent at at least one position. In other words, the direction in which the fourth wiring 84 extends may also change. However, any portion of the fourth wiring 84 in the region AB2 extends in a direction that intersects the direction in which the imaginary line LV2 extends at an angle θ2 greater than 45° and less than 90°.

[0099] exist Figure 4 In the example, the fourth wiring 84 intersects the imaginary line LV2 in the area AB2 at an angle θ2 greater than 45° and less than 90°. However, if the direction in which the imaginary line LV2 extends intersects the direction in which the fourth wiring 84 extends in the area AB2 at an angle θ2, the fourth wiring 84 and the imaginary line LV2 do not need to intersect.

[0100] For example, at pad 84a Figure 4 In the case where the fourth wiring 84 is arranged closer to the pad 53, Figure 4 However, the direction in which the imaginary line LV2 extends intersects the direction in which the fourth wiring 84 extends in the region AB2 at an angle θ2. Figure 4 When the first surface 51 is viewed from above, the extension line of the fourth wiring 84 and the extension line of the virtual line LV2 intersect at an angle θ2.

[0101] The fifth wiring 85 extends from the third via 93. The fifth wiring 85 is not limited to this example, and may be connected to other pads or vias. The third via 93 may be connected to other wirings.

[0102] For example, the fifth wiring 85 is one of the differential wirings. The other of the differential wirings extends, for example, in the second direction D2 so as to overlap with the fifth wiring 85. The fifth wiring 85 is not limited to this example.

[0103] The third via hole 93 is located between the first preamplifier 75 and the second preamplifier 77 in the direction in which the imaginary line LV2 extends. The third via hole 93 is covered by the first bottom filler 76 in the second direction D2. In other words, the third via hole 93 is arranged in the area AC2 in the FPC 22. In addition, the third via hole 93 may also be covered by the second bottom filler 78.

[0104] The fifth wiring 85 is covered by the first underfill 76 in the second direction D2 between the first preamplifier 75 and the second preamplifier 77. In addition, the fifth wiring 85 may be covered by the second underfill 78. The portion of the fifth wiring 85 that is not located between the first preamplifier 75 and the second preamplifier 77 may not be covered by the first underfill 76 and the second underfill 78.

[0105] The sixth wiring 86 extends from the fourth via 94. The sixth wiring 86 is not limited to this example, and may be connected to other pads or vias. The fourth via 94 may also be connected to other wirings.

[0106] For example, the sixth wiring 86 is one of the differential wirings. The other of the differential wirings extends, for example, in the second direction D2 so as to overlap with the sixth wiring 86. The sixth wiring 86 is not limited to this example.

[0107] The fourth via hole 94 is located between the geometric center CN1 of the first preamplifier 75 and the geometric center CN2 of the second preamplifier 77 in the direction in which the imaginary line LV2 extends. The fourth via hole 94 is covered by the first preamplifier 75 in the second direction D2. In other words, the fourth via hole 94 is arranged in the area AC1 in the FPC 22. In addition, the fourth via hole 94 may also be covered by the second preamplifier 77.

[0108] The sixth wiring 86 is covered by the first preamplifier 75 in the second direction D2 between the geometric center CN1 of the first preamplifier 75 and the geometric center CN2 of the second preamplifier 77. In addition, the sixth wiring 86 may be covered by the second preamplifier 77. The portion of the sixth wiring 86 that is not located between the geometric center CN1 of the first preamplifier 75 and the geometric center CN2 of the second preamplifier 77 may not be covered by the first preamplifier 75 and the second preamplifier 77.

[0109] The width of the first wiring 81 to the sixth wiring 86 is, for example, 35 μm or less. For example, when the first wiring 81 to the sixth wiring 86 are provided on one side of the insulating layer of the FPC 22, the width is, for example, 30 μm. In this case, the distance between the wirings is set to be 30 μm or more. In addition, when the first wiring 81 to the sixth wiring 86 are provided on the other side of the insulating layer of the FPC 22, the width is, for example, 35 μm. In this case, the distance between the wirings is set to be 35 μm or more.

[0110] The first wiring 81 may be thicker than 35 μm outside the region AB1 between the first mounting portion 61 and the first mounting portion 63. The fourth wiring 84 may be thicker than 35 μm outside the region AB2 between the first mounting portion 63 and the second mounting portion 64. The widths of the first wiring 81 to the sixth wiring 86 are not limited to the above examples, and may be thicker than 35 μm.

[0111] In the HDD 10 according to the above-described embodiment, the FPC 22 includes the first surface 51, the first mounting portion 61 fixed to the rotary actuator 49, and the first mounting portion 63 fixed to the first mounting member 71. The first wiring 81 provided in the FPC 22 extends along the first surface 51, and in the region AB1 between the first mounting portion 61 and the first mounting portion 63, extends in a direction intersecting at an angle θ1 greater than 45° and less than 90° with respect to the direction in which the imaginary line LV1 extends, the imaginary line LV1 being an imaginary line connecting the first mounting portion 61 and the first mounting portion 63 with the shortest distance along the first surface 51. When the FPC 22 is thermally contracted and thermally expanded, thermal stress is generated in the region AB1 between the first mounting portion 61 and the first mounting portion 63 in the direction in which the imaginary line LV1 extends. In the present embodiment, the first wiring 81 extends in a direction intersecting at an angle θ1 greater than 45° and less than 90° with respect to the direction in which the imaginary line LV1 extends. Therefore, compared with the case where the first wiring 81 extends parallel to the imaginary line LV1, the cross-sectional area of ​​the first wiring 81 perpendicular to the direction in which the imaginary line LV1 extends becomes larger. As a result, the HDD 10 of the present embodiment can improve the durability of the first wiring 81 against thermal stress. For example, the HDD 10 can suppress the first wiring 81 from being damaged due to thermal stress, and further, can suppress malfunction of the HDD 10.

[0112] The first mounting portion 61 is a portion of the FPC 22 that is fixed to the rotary actuator 49. The first mounting component 71 includes a first preamplifier 75 and a first bottom filler 76 that fixes the first preamplifier 75 to the FPC 22. That is, the first mounting portion 63 is a portion of the FPC 22 that is fixed to the first preamplifier 75 through the first bottom filler 76. The first preamplifier 75 generates heat during the operation of the HDD 10. Therefore, thermal stress along the imaginary line LV1 is easily generated near the first mounting portion 63 of the FPC 22. However, in the present embodiment, the first wiring 81 extends in a direction that intersects at an angle θ1 greater than 45° and less than 90° relative to the direction in which the imaginary line LV1 extends. Therefore, the HDD 10 of the present embodiment can improve the durability of the first wiring 81 against thermal stress.

[0113] The FPC 22 has a second mounting portion 62 fixed to the rotary actuator 49. Therefore, the FPC 22 is fixed to the rotary actuator 49 at least at two locations. The first mounting portion 63 is located between the first mounting portion 61 and the second mounting portion 62. Therefore, for example, the first wiring 81 connected to the first preamplifier 75 is easily arranged in the area AB1 between the first mounting portion 61 and the first mounting portion 63. However, the first wiring 81 extends in a direction intersecting at an angle θ1 greater than 45° and less than 90° with respect to the direction extending the imaginary line LV1, so that the durability against thermal stress can be improved.

[0114] The FPC 22 includes a first surface 51, a first mounting portion 63 fixed to a first mounting member 71, and a second mounting portion 64 fixed to a second mounting member 72. The fourth wiring 84 provided in the FPC 22 extends along the first surface 51, and in a region AB2 between the first mounting portion 63 and the second mounting portion 64, extends in a direction intersecting at an angle θ2 greater than 45° and less than 90° with respect to the direction in which the imaginary line LV2 extends, the imaginary line LV2 being an imaginary line connecting the first mounting portion 63 and the second mounting portion 64 with the shortest distance along the first surface 51. When the FPC 22 is thermally contracted and thermally expanded, thermal stress is generated in the region AB2 between the first mounting portion 63 and the second mounting portion 64 in the direction in which the imaginary line LV2 extends. In the present embodiment, the fourth wiring 84 extends in a direction intersecting at an angle θ2 greater than 45° and less than 90° with respect to the direction in which the imaginary line LV2 extends. Therefore, compared with the case where the fourth wiring 84 extends parallel to the imaginary line LV2, the cross-sectional area of ​​the fourth wiring 84 perpendicular to the direction in which the imaginary line LV2 extends becomes larger. As a result, the HDD 10 of the present embodiment can improve the durability of the fourth wiring 84 against thermal stress. For example, the HDD 10 can suppress the fourth wiring 84 from being damaged due to thermal stress, and further, it can suppress malfunction of the HDD 10.

[0115] The second mounting member 72 includes a second preamplifier 77 and a second bottom filler 78 that fixes the second preamplifier 77 to the FPC 22. That is, the second mounting portion 64 is a portion of the FPC 22 that is fixed to the second preamplifier 77 through the second bottom filler 78. The first preamplifier 75 and the second preamplifier 77 generate heat during the operation of the HDD 10. Therefore, thermal stress along the imaginary line LV2 is easily generated near the first mounting portion 63 and the second mounting portion 64 of the FPC 22. However, in the present embodiment, the fourth wiring 84 extends in a direction that intersects at an angle θ2 greater than 45° and less than 90° relative to the direction in which the imaginary line LV2 extends. Therefore, the HDD 10 of the present embodiment can improve the durability of the fourth wiring 84 against thermal stress.

[0116] The width of the first wiring 81 between the first mounting portion 61 and the first mounting portion 63 is 35 μm or less. In addition, the width of the fourth wiring 84 between the first mounting portion 63 and the second mounting portion 64 is 35 μm or less. In this way, by setting the first wiring 81 and the fourth wiring 84 to be thin, the layout design of the conductor pattern 80 and the components in the FPC 22 becomes easy. On the other hand, the thinner the width of the first wiring 81 and the fourth wiring 84, the easier it is for the first wiring 81 and the fourth wiring 84 to be damaged by thermal stress. However, in the present embodiment, the first wiring 81 can improve the durability against thermal stress by extending in a direction intersecting at an angle θ1 greater than 45° and less than 90° with respect to the direction extending the imaginary line LV1. In addition, in the present embodiment, the fourth wiring 84 can improve the durability against thermal stress by extending in a direction intersecting at an angle θ2 greater than 45° and less than 90° with respect to the direction extending the imaginary line LV2.

[0117] The FPC 22 has a first mounting portion 61 fixed to the rotary actuator 49. The first underfill 76 fixes the first preamplifier 75 to the FPC 22. The conductor pattern 80 provided on the FPC 22 has at least one of a first wiring 81, a second wiring 82, a third wiring 83, a first via 91, and a second via 92. The first wiring 81 extends in a direction intersecting at an angle θ1 greater than 45° and less than 90° with respect to a direction in which an imaginary line LV1 extends in an area AB1 between the first mounting portion 61 and the first underfill 76. The imaginary line LV1 is an imaginary line connecting the first mounting portion 61 and the first underfill 76 with the shortest distance along the first surface 51. Thus, the HDD 10 of the present embodiment can improve the durability of the first wiring 81 against thermal stress. The second wiring 82 and the first via 91 are covered by the first underfill 76 in the second direction D2 intersecting the first surface 51. In the FPC 22, the area AC2 covered by the first bottom filler 76 is maintained by the first bottom filler 76, so that thermal contraction and thermal expansion can be reduced. Therefore, the HDD 10 of the present embodiment can improve the durability of the second wiring 82 and the first via 91 against thermal stress. The third wiring 83 and the second via 92 are covered by the first preamplifier 75 in the second direction D2. In the FPC 22, the area AC1 covered by the first preamplifier 75 is surrounded by the first bottom filler 76, so that thermal contraction and thermal expansion can be reduced. Therefore, the HDD 10 of the present embodiment can improve the durability of the third wiring 83 and the second via 92 against thermal stress.

[0118] The first underfill 76 fixes the first preamplifier 75 to the FPC 22. The second underfill 78 fixes the second preamplifier 77 to the FPC 22. The conductor pattern 80 provided on the FPC 22 has at least one of the fourth wiring 84, the fifth wiring 85, the sixth wiring 86, the third via 93, and the fourth via 94. The fourth wiring 84 extends in a direction intersecting at an angle θ2 greater than 45° and less than 90° with respect to the direction in which the imaginary line LV2 extends in the area AB2 between the first underfill 76 and the second underfill 78. The imaginary line LV2 is an imaginary line connecting the first underfill 76 and the second underfill 78 with the shortest distance along the first surface 51. Thus, the HDD 10 of the present embodiment can improve the durability of the fourth wiring 84 against thermal stress. The fifth wiring 85 and the third via 93 are covered by the first underfill 76 or the second underfill 78 in the second direction D2. In FPC22, the portion covered by the bottom filler is held by the bottom filler, so that thermal contraction and thermal expansion can be reduced. Therefore, the HDD10 of this embodiment can improve the durability of the fifth wiring 85 and the third via 93 against thermal stress. The sixth wiring 86 and the fourth via 94 are covered by the first preamplifier 75 or the second preamplifier 77 in the second direction. In FPC22, the portion covered by the preamplifier is surrounded by the bottom filler, so that thermal contraction and thermal expansion can be reduced. Therefore, the HDD10 of this embodiment can improve the durability of the sixth wiring 86 and the fourth via 94 against thermal stress.

[0119] For example, due to the increase in the capacity of the HDD 10, the number of the magnetic heads 15 and the number of the terminals of the magnetic heads 15 will increase, and the number of the pads 53 and the number of the wirings in the FPC 22 will also increase. In addition, due to the expansion of the function of the preamplifier, the first preamplifier 75 and the second preamplifier 77 will become larger. For example, due to these reasons, as in the present embodiment, the first preamplifier 75 and the second preamplifier 77 are sometimes arranged near the first mounting portion 61 and the second mounting portion 62. In addition, sometimes the first preamplifier 75 and the second preamplifier 77 are arranged close to each other. Various wirings extend from the first preamplifier 75, but due to the increase in the number of wirings, the layout of the wirings is limited. Therefore, sometimes wirings such as the first wiring 81 pass through the area AB1 between the first mounting portion 61 and the first mounting portion 63 where thermal stress is generated. In addition, sometimes wirings such as the fourth wiring 84 pass through the area AB2 between the first mounting portion 63 and the second mounting portion 64 where thermal stress is generated. In this embodiment, the durability of the first wiring 81 and the fourth wiring 84 against thermal stress is improved by setting the extending directions of the first wiring 81 and the fourth wiring 84. Therefore, the HDD 10 of this embodiment can improve the durability of the first wiring 81 and the fourth wiring 84 against thermal stress without significantly changing the design of the HDD 10 such as the wiring layout.

[0120] The first to fourth vias 91 to 94 are arranged near the first preamplifier 75, for example, in order to make the second wiring 82, the third wiring 83, the fifth wiring 85, and the sixth wiring 86 differential wiring. Generally, the portion where the via is connected to the wiring may be damaged by thermal stress. However, in the present embodiment, the first via 91 and the third via 93 are covered by the first bottom filler 76, and the second via 92 and the fourth via 94 are covered by the first preamplifier 75, so that the durability of the first to fourth vias 91 to 94 against thermal stress is improved. Therefore, the HDD 10 of the present embodiment can improve the durability of the first to fourth vias 91 to 94 against thermal stress without significantly changing the design of the HDD 10 such as the layout of the wiring.

[0121] According to at least one embodiment described above, a flexible printed wiring board has a surface, a first fixing portion fixed to a first component, and a second fixing portion fixed to a second component. The wiring provided on the flexible printed wiring board extends along the surface, and extends between the first fixing portion and the second fixing portion in a direction intersecting at an angle greater than 45° and less than 90° relative to the direction in which an imaginary line extends, and the imaginary line is an imaginary line connecting the first fixing portion and the second fixing portion with the shortest distance along the surface. When the flexible printed wiring board shrinks and expands thermally, thermal stress is generated between the first fixing portion and the second fixing portion in the direction in which the imaginary line extends. In this embodiment, the wiring extends in a direction intersecting at an angle greater than 45° and less than 90° relative to the direction in which the imaginary line extends. Therefore, compared with the case in which the wiring extends in parallel with the imaginary line, the cross-sectional area of ​​the wiring orthogonal to the direction in which the imaginary line extends becomes larger. As a result, the disk device of this embodiment can improve the durability of the wiring against thermal stress.

[0122] Several embodiments of the present invention have been described, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the scope of the purpose of the invention. These embodiments and their variations are included in the scope and purpose of the invention, and are included in the invention described in the claims and their equivalents.

Claims

1. A disk device comprising: a disc-shaped recording medium having a recording layer; a first magnetic head configured to read and write information on the recording medium; a first wiring member electrically connected to the first magnetic head; A flexible printed wiring board having a surface, a first fixing portion fixed to a first component, a second fixing portion fixed to a second component, and a third fixing portion fixed to a component different from the second component, electrically connected to the first magnetic head via the first wiring member, the second fixing portion being located between the first fixing portion and the third fixing portion; a first wiring provided on the flexible printed wiring board, extending along the surface, and extending between the first fixing portion and the second fixing portion in a direction intersecting at an angle greater than 45° and less than 90° with respect to a direction in which an imaginary line extends, the imaginary line being an imaginary line connecting the first fixing portion and the second fixing portion with the shortest distance along the surface; and The second wiring is arranged on the flexible printed wiring board, extends along the surface, and extends between the second fixing portion and the third fixing portion in a direction intersecting at an angle greater than 45° and less than 90° relative to the direction of an imaginary line connecting the second fixing portion and the third fixing portion with the shortest distance along the surface.

2. The disk device according to claim 1, The first component includes a rotary actuator, and the rotary actuator moves the first magnetic head by rotating. The second component has a preamplifier and a bottom filling member. The preamplifier is mounted on the flexible printed wiring board. A write signal corresponding to the information that the first magnetic head wants to write to the recording medium is output to the first magnetic head through the flexible printed wiring board and the first wiring member. A read signal corresponding to the information read from the recording medium by the first magnetic head is input from the first magnetic head. The bottom filling member fixes the preamplifier to the flexible printed wiring board.

3. The disk device according to claim 1, The third fixing portion is fixed to the first member.

4. The disk device according to claim 1, Also available: a second magnetic head configured to read and write information on the recording medium; and a second wiring member electrically connected to the second magnetic head and the flexible printed wiring board, The first component comprises a first preamplifier and a first bottom filler, the first preamplifier is mounted on the flexible printed wiring board, a write signal corresponding to information to be written by the first magnetic head to the recording medium is output to the first magnetic head through the flexible printed wiring board and the first wiring member, a read signal corresponding to information read from the recording medium by the first magnetic head is input from the first magnetic head, and the first bottom filler fixes the first preamplifier to the flexible printed wiring board, The second component has a second preamplifier and a second bottom filling member. The second preamplifier is mounted on the flexible printed wiring board. A write signal corresponding to the information that the second magnetic head wants to write to the recording medium is output to the second magnetic head through the flexible printed wiring board and the second wiring member. A read signal corresponding to the information read from the recording medium by the second magnetic head is input from the second magnetic head. The second bottom filling member fixes the second preamplifier to the flexible printed wiring board.

5. The disk device according to any one of claims 1 to 4, Between the first fixing portion and the second fixing portion, the width of the first wiring is 35 μm or less.

6. A disk device comprising: a disc-shaped recording medium having a recording layer; a first magnetic head configured to read and write information on the recording medium; a rotary actuator that moves the first magnetic head by rotating; a first wiring member electrically connected to the first magnetic head; a flexible printed wiring board having a surface and a fixing portion fixed to the rotary actuator, and electrically connected to the first magnetic head via the first wiring member; a preamplifier mounted on the flexible printed wiring board, outputting a write signal corresponding to information to be written by the first magnetic head to the recording medium to the first magnetic head through the flexible printed wiring board and the first wiring member, and inputting a read signal corresponding to information read by the first magnetic head from the recording medium from the first magnetic head; an underfill that secures the preamplifier to the flexible printed wiring board; as well as a conductor pattern provided on the flexible printed wiring board, comprising at least one of a first wiring, a second wiring, a third wiring, a first via hole, and a second via hole, The first wiring extends along the surface, and extends between the fixing portion and the bottom filler in a direction intersecting at an angle greater than 45° and less than 90° with respect to a direction in which an imaginary line extends, the imaginary line being an imaginary line connecting the fixing portion and the bottom filler with the shortest distance along the surface, The second wiring extends along the surface and is covered by the underfill material in a direction intersecting the surface between the fixing portion and the preamplifier. The third wiring extends along the surface and is covered by the preamplifier in a direction intersecting the surface between the fixing portion and the geometric center of the preamplifier. The first via hole is located between the fixing portion and the preamplifier in the direction in which the imaginary line extends, and is covered by the bottom filler in the direction intersecting the surface. The second via hole is located between the fixing portion and the geometric center of the preamplifier in the direction in which the imaginary line extends, and is covered by the preamplifier in the direction intersecting the surface.

7. A disk device comprising: a disc-shaped recording medium having a recording layer; a first magnetic head configured to read and write information on the recording medium; a first wiring member electrically connected to the first magnetic head; a second magnetic head configured to read and write information on the recording medium; a second wiring member electrically connected to the second magnetic head; A flexible printed wiring board having a surface, electrically connected to the first magnetic head via the first wiring member, and electrically connected to the second magnetic head via the second wiring member; a first preamplifier mounted on the flexible printed wiring board, outputting a write signal corresponding to information to be written by the first magnetic head to the recording medium to the first magnetic head through the flexible printed wiring board and the first wiring member, and inputting a read signal corresponding to information read by the first magnetic head from the recording medium from the first magnetic head; a first bottom filler that fixes the first preamplifier to the flexible printed wiring board; a second preamplifier mounted on the flexible printed wiring board, outputting a write signal corresponding to information to be written by the second magnetic head to the recording medium to the second magnetic head through the flexible printed wiring board and the second wiring member, and inputting a read signal corresponding to information read by the second magnetic head from the recording medium from the second magnetic head; a second underfill material that fixes the second preamplifier to the flexible printed wiring board; and a conductor pattern provided on the flexible printed wiring board, having at least one of a fourth wiring, a fifth wiring, a sixth wiring, a third via hole, and a fourth via hole, The fourth wiring extends along the surface, and extends between the first bottom filler and the second bottom filler in a direction intersecting at an angle greater than 45° and less than 90° with respect to a direction in which an imaginary line extends, the imaginary line being an imaginary line connecting the first bottom filler and the second bottom filler with a shortest distance along the surface, The fifth wiring extends along the surface and is covered by the first underfill material or the second underfill material in a direction intersecting the surface between the first preamplifier and the second preamplifier. The sixth wiring extends along the surface, between the geometric center of the first preamplifier and the geometric center of the second preamplifier, and is covered by the first preamplifier or the second preamplifier in a direction intersecting the surface. The third via hole is located between the first preamplifier and the second preamplifier in the direction in which the imaginary line extends, and is covered by the first bottom filler or the second bottom filler in the direction intersecting the surface. The fourth via hole is located between the geometric center of the first preamplifier and the geometric center of the second preamplifier in the direction in which the imaginary line extends, and is covered by the first preamplifier or the second preamplifier in the direction intersecting the surface.

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