A process fault handling method and a semiconductor process apparatus

Abstract

The embodiment of the present application provides a process fault processing method and a semiconductor process equipment, the method comprises the following steps: when a process task is executed, it is determined whether a target chamber module which has occurred a fault is a serial module or a parallel module; if the target chamber module is the serial module, transmission path information of an associated wafer which needs to pass through the target chamber module is adjusted, and a new scheduling action sequence is generated according to the adjusted transmission path information; if the target chamber module is the parallel module, a stranded wafer which is stranded in the target chamber module is transmitted to another parallel module corresponding to the target chamber module, and a new scheduling action sequence is generated for the stranded wafer; and the process task is continuously executed according to the newly generated scheduling action sequence. According to the embodiment of the present application, the automation process of the Job abnormality processing is realized through the scheduling optimization, so that the automation level of the equipment can be improved, and the complexity of the manual processing of the fault abnormality can be reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a process fault handling method and a semiconductor process equipment. Background Technology

[0002] When semiconductor process equipment performs a process task, if a process failure occurs, the job is terminated, its subsequent actions are cleared, and the job itself is deleted by the system. This results in wafer delays, incomplete process tasks, and other consequences, requiring manual intervention and recovery. This approach reduces the automation level of semiconductor process equipment and significantly decreases its production efficiency. Summary of the Invention

[0003] In view of the above problems, embodiments of the present invention are proposed to provide a process fault handling method and a corresponding semiconductor process equipment to overcome or at least partially solve the above problems.

[0004] To address the aforementioned problems, this invention discloses a process fault handling method applied to semiconductor process equipment. The semiconductor process equipment includes multiple chamber modules for performing process tasks on wafers, and these chamber modules are divided into serial modules and parallel modules. The method includes:

[0005] When executing the process task, determine whether the target chamber module that failed is a serial module or a parallel module;

[0006] If the target chamber module is a serial module, the transmission path information of the associated wafers that need to pass through the target chamber module is adjusted, and a new scheduling action sequence is generated based on the adjusted transmission path information.

[0007] If the target chamber module is a parallel module, the wafers held in the target chamber module are transferred to another parallel module corresponding to the target chamber module, and a new scheduling action sequence is generated for the held wafers.

[0008] The process task continues to be executed according to the newly generated sequence of scheduling actions.

[0009] Optionally, the adjustment requires the transmission path information of the associated wafer of the target chamber module, including:

[0010] Determine the current transmission location of the associated wafer;

[0011] The transmission path information of the associated wafer is adjusted according to the current transmission location.

[0012] Optionally, each of the chamber modules has a corresponding step number in the transmission path corresponding to each wafer, and determining the current transmission position of the associated wafer includes:

[0013] Obtain the current step number information of the associated wafer;

[0014] The current transmission position of the associated wafer is determined based on the current step number information.

[0015] Optionally, adjusting the transmission path information of the associated wafer based on the current transmission location includes:

[0016] If the current transmission position is the starting position of the associated wafer, then the information of the associated wafer is deleted from the process task, and the calling status of the associated wafer is set to an uncallable state; the information of the associated wafer includes the transmission path information of the associated wafer.

[0017] Optionally, the semiconductor process equipment includes a wafer cassette, and adjusting the transport path information of the associated wafer according to the current transport position includes:

[0018] If the current transmission location is before the target chamber module, the information of the associated wafer is deleted from the process task, and the calling status of the associated wafer is set to an uncallable state; the information of the associated wafer includes the transmission path information of the associated wafer;

[0019] Create a transmission path to transfer the associated wafer from the current transmission location to the wafer cassette, and obtain the adjusted transmission path information.

[0020] Optionally, adjusting the transmission path information of the associated wafer based on the current transmission location includes:

[0021] If the current transmission position is after the target chamber module, the transmission path information of the associated wafer will not be adjusted.

[0022] Optionally, it also includes:

[0023] If the target chamber module is a parallel module, and the robotic arm associated with the target chamber module and the other parallel module corresponding to the target chamber module satisfy the condition of transferring the stranded wafer from the target chamber module to the other parallel module corresponding to the target chamber module, then the execution of the process task is paused.

[0024] Optionally, it also includes:

[0025] If the target chamber module is a parallel module, the information of the stranded wafer is deleted from the process task, and the calling status of the stranded wafer is set to an uncallable state; the information of the stranded wafer includes the transmission path information of the stranded wafer;

[0026] Record deletion information.

[0027] Optionally, the step of transferring the stranded wafer in the target chamber module to another parallel module corresponding to the target chamber module, and generating a new scheduling action sequence for the stranded wafer, includes:

[0028] After the stranded wafer is transferred to the other parallel module for process processing, the information of the stranded wafer is added back to the process task according to the deletion information;

[0029] Set the call status of the stranded wafer to a callable state;

[0030] A new sequence of scheduling actions is generated for the stranded wafer.

[0031] This invention also discloses a semiconductor process apparatus, including multiple chamber modules for performing process tasks on wafers, wherein the multiple chamber modules are divided into serial modules and parallel modules, and the semiconductor process apparatus further includes:

[0032] The controller, when executing the process task, determines whether the faulty target chamber module is a serial module or a parallel module; if the target chamber module is a serial module, it adjusts the transmission path information of the associated wafers that need to pass through the target chamber module, and generates a new scheduling action sequence based on the adjusted transmission path information; if the target chamber module is a parallel module, it transfers the stranded wafers in the target chamber module to another parallel module corresponding to the target chamber module, and generates a new scheduling action sequence for the stranded wafers; the process task continues to be executed according to the newly generated scheduling action sequence.

[0033] Optionally, the controller is configured to determine the current transmission position of the associated wafer and adjust the transmission path information of the associated wafer according to the current transmission position.

[0034] Optionally, each of the chamber modules has a corresponding step number in the transmission path corresponding to each wafer, and the controller is used to obtain the current step number information of the associated wafer; and determine the current transmission position of the associated wafer based on the current step number information.

[0035] Optionally, the controller is configured to, if the current transmission position is the starting position of the associated wafer, delete the information of the associated wafer from the process task and set the calling status of the associated wafer to an uncallable state; the information of the associated wafer includes the transmission path information of the associated wafer.

[0036] Optionally, the semiconductor process equipment includes a wafer cassette, and the controller is configured to, if the current transmission position is before the target chamber module, delete the information of the associated wafer from the process task and set the call status of the associated wafer to an uncallable state; the information of the associated wafer includes the transmission path information of the associated wafer; create a transmission path to transmit the associated wafer from the current transmission position to the wafer cassette, and obtain the adjusted transmission path information.

[0037] Optionally, the controller is configured not to adjust the transmission path information of the associated wafer if the current transmission position is after the target chamber module.

[0038] Optionally, the controller is further configured to pause the execution of the process task if the target chamber module is a parallel module, and the robotic arm associated with the target chamber module and the other parallel module corresponding to the target chamber module satisfy the condition of transferring the stranded wafer from the target chamber module to the other parallel module corresponding to the target chamber module.

[0039] Optionally, the controller is further configured to, if the target chamber module is a parallel module, delete the information of the stranded wafer from the process task and set the calling status of the stranded wafer to an uncallable state; the information of the stranded wafer includes the transmission path information of the stranded wafer; and record deletion information.

[0040] Optionally, the controller is further configured to transfer the stranded wafer to the other parallel module for process processing, and then, based on the deletion information, re-add the information of the stranded wafer to the process task; set the calling status of the stranded wafer to a callable state; and generate a new scheduling action sequence for the stranded wafer.

[0041] The embodiments of the present invention have the following advantages:

[0042] In this embodiment of the invention, if a serial module malfunctions during the execution of a process task, the task can continue to be executed without terminating it by adjusting the transmission path information of the associated wafer. If a parallel module malfunctions, the stranded wafer can be transferred to another parallel module for reprocessing before the process task continues. This method provides a way to recover from process task anomalies without terminating the process task if a serial module malfunctions; and ensures that stranded wafers can be promptly transferred to another parallel module for reprocessing if a parallel module malfunctions, reducing the risk of wafer scrap. The above fault handling methods are automatically completed by the semiconductor process equipment, improving the automation level of the equipment and reducing the complexity of manual fault handling. Attached Figure Description

[0043] Figure 1 This is a schematic diagram of the process flow of a semiconductor process equipment;

[0044] Figure 2 This is a schematic diagram of a PVD device.

[0045] Figure 3 This is a flowchart of the steps of a process fault handling method according to an embodiment of the present invention;

[0046] Figure 4 This is a flowchart of another process fault handling method according to an embodiment of the present invention;

[0047] Figure 5 This is a flowchart of a process fault handling method according to an embodiment of the present invention;

[0048] Figure 6 This is a structural block diagram of a semiconductor process equipment according to an embodiment of the present invention. Detailed Implementation

[0049] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art are within the scope of protection of the present invention.

[0050] In the semiconductor industry, a Job (process task) refers to a complete wafer fabrication plan automatically executed by user-defined semiconductor process equipment. A Job contains one or more Sequences (process paths). Each Sequence includes the wafer's transport route and the process recipes to be executed by the wafer through each process chamber module. By binding Sequences to slots in a Foup, the user ultimately achieves the goal of having the wafer complete the process according to the associated Sequences.

[0051] Reference Figure 1 The diagram shows a process flow diagram of a semiconductor manufacturing equipment. In actual semiconductor manufacturing, for a typical PVD (Physical Vapor Deposition) machine, processing a wafer requires nearly 20 scheduling transfers, entering four different process chamber modules sequentially, before the process can be completed. During process task execution, the equipment frequently triggers process alarms due to hardware failures or unmet process environment conditions, rendering the process chamber modules unusable and affecting job execution. The complexity of the semiconductor manufacturing equipment's process flow and scheduling makes manual handling of process task anomalies time-consuming, labor-intensive, and risky, involving the possibility of over-processing or omissions. Therefore, rapid and accurate job anomaly handling is essential.

[0052] The process chamber modules that the Wafer defined in the Sequence will pass through are divided into two categories in the scheduling: serial modules and parallel modules.

[0053] A serial module indicates that a certain type of process / transfer can only be completed in a single module specified in the Sequence, while a parallel module indicates that a certain type of process / transfer can be completed in any one of the multiple modules specified in the Sequence. (See reference...) Figure 2 The diagram shows a structural schematic of a PVD device. The Sequence defined in this device can be as follows:

[0054] LP1->LA / LB->ChC / ChD->ChE->ChA->Ch1 / Ch6->Ch2 / Ch5->ChB->LA / LB->LP1

[0055] In the above sequence, the two LP1s represent the wafer's origin module and destination module, respectively (generally following the principle that the destination and origin positions remain consistent, LP2 or LP3 can also be used). This sequence includes 9 steps, among which Step 1 (LA / LB), Step 2 (ChC / ChD), Step 5 (Ch1 / Ch6), Step 6 (Ch2 / Ch5), and Step 8 (LA / LB) all contain parallel modules, meaning that the number of modules contained in the same Step is greater than 1. Taking Step 2 as an example, the wafer can be transferred to ChC or ChD for processing, meaning that the effect of the wafer completing the process in ChC and ChD is the same. The modules in Step 3 (ChE), Step 4 (ChA), and Step 7 (ChB) are serial modules, meaning that the total number of modules contained in the same Step is equal to 1. For the wafer to complete this process, it must go through the above serial modules.

[0056] If a process chamber module malfunctions during Job execution, the scheduler will determine whether it is a serial or parallel module based on the total number of process chamber modules in the Step containing that module in the Sequence (if the total number is 1, it means there is only one module in that Step, which is a serial module; if the number is greater than 1, it means there are multiple modules in that Step, and all process chamber modules in that Step are parallel modules). Different alarm messages will be issued accordingly, with different handling strategies. Users can choose the appropriate alarm strategy for Job exception handling based on their specific needs.

[0057] In existing technologies, when a serial module experiences a process failure, the Job execution is terminated. The termination process is irreversible; once terminated, all subsequent actions are cleared, and the Job itself is deleted by the system. This results in wafer retention, incomplete processes, and other issues requiring user intervention and manual recovery. This manual handling reduces the automation level and production efficiency of the equipment. Similarly, when a parallel module experiences a process failure, the wafer remains trapped within the process chamber module. If the faulty module is in a high-temperature environment, prolonged retention may damage the wafer, rendering it unusable. Furthermore, because the wafer is within the Job, its position is locked and cannot be manually moved, hindering Job recovery operations.

[0058] Based on this, the present invention aims to provide a process fault handling method and a corresponding semiconductor process equipment to overcome or at least partially solve the above problems.

[0059] One of the core concepts of this invention is that, during the execution of a process task, if a serial module fails, the process task can continue to be executed by adjusting the transmission path information of the associated wafer without terminating the process task; if a parallel module fails, the stranded wafer can be transferred to another parallel module for reprocessing before the process task continues. This method provides a way to recover from process task anomalies without terminating the process task when a serial module fails; and ensures that stranded wafers can be promptly transferred to another parallel module for reprocessing when a parallel module fails, reducing the risk of wafer scrap. The above fault handling methods are automatically completed by the semiconductor process equipment, which can improve the automation level of the equipment and reduce the complexity of manually handling fault anomalies.

[0060] Reference Figure 3 This diagram illustrates a flowchart of a process fault handling method according to an embodiment of the present invention. The method is applied to semiconductor process equipment, which includes multiple chamber modules for performing process tasks on wafers. These chamber modules are divided into serial modules and parallel modules. Specifically, the method may include the following steps:

[0061] Step 301: When executing the process task, determine whether the target chamber module that failed is a serial module or a parallel module.

[0062] In this embodiment of the invention, the semiconductor process equipment includes chamber modules. These chamber modules may include processing chambers, transfer chambers, and loadlock chambers, etc. During the execution of a process task, if a process failure occurs, the target chamber module where the failure occurred can be identified, and it can be determined whether the target chamber module is a serial module or a parallel module. A serial module refers to the modules that the wafer being processed must traverse to complete the processing according to the process path defined by the process task. For example, if the wafer being processed must pass through chamber module one and chamber module two to complete the process, then chamber module one and chamber module two are serial modules. A parallel module refers to the modules that the wafer being processed may traverse to complete the processing according to the process path defined by the process task. For example, if the wafer being processed must pass through chamber module three or chamber module four to complete the process, then chamber module three and chamber module four are optional parallel modules.

[0063] Step 302: If the target chamber module is a serial module, adjust the transmission path information of the associated wafer that needs to pass through the target chamber module, and generate a new scheduling action sequence based on the adjusted transmission path information.

[0064] If the target chamber module that malfunctions is a serial module, the affected associated wafers that must undergo process processing through that target chamber module can be identified, and the transmission path information for those associated wafers can be adjusted. After adjusting the transmission path information for the associated wafers, a new sequence of scheduling actions can be generated for the process task.

[0065] Step 303: If the target chamber module is a parallel module, the stranded wafer in the target chamber module is transferred to another parallel module corresponding to the target chamber module, and a new scheduling action sequence is generated for the stranded wafer.

[0066] If the target chamber module that malfunctions is a parallel module, the stranded wafer in the target chamber module can be transferred to another parallel module for processing first, and then a new scheduling action sequence can be generated for the stranded wafer.

[0067] Step 304: Continue executing the process task according to the newly generated scheduling action sequence.

[0068] In this embodiment of the invention, the process task can continue to be executed according to the newly generated sequence of scheduling actions, instead of directly terminating the execution of the process task, which can avoid the process task from not being completed.

[0069] In summary, in this embodiment of the invention, if a serial module malfunctions during the execution of a process task, the task can continue to be executed without terminating it by adjusting the transmission path information of the associated wafer. If a parallel module malfunctions, the stranded wafer can be transferred to another parallel module for reprocessing before the process task continues. This method provides a way to recover from process task anomalies without terminating the process task if a serial module malfunctions; and ensures that stranded wafers can be promptly transferred to another parallel module for reprocessing if a parallel module malfunctions, reducing the risk of wafer scrap. The above fault handling methods are automatically completed by the semiconductor process equipment, improving the automation level of the equipment and reducing the complexity of manual fault handling.

[0070] Reference Figure 4 This diagram illustrates a flowchart of another process fault handling method according to an embodiment of the present invention. The method is applied to semiconductor process equipment, which includes multiple chamber modules for performing process tasks on wafers. These chamber modules are divided into serial modules and parallel modules. Specifically, the method may include the following steps:

[0071] Step 401: When executing the process task, determine whether the target chamber module that failed is a serial module or a parallel module.

[0072] Chamber modules in semiconductor process equipment can include processing chambers, transfer chambers, and loadlock chambers. During the execution of a process task, if a process failure occurs, the target chamber module can be identified, and it can be determined whether the target chamber module is a serial or parallel module. A serial module represents the modules that the wafer must traverse to complete the processing step according to the process path defined by the process task. A parallel module represents the modules that the wafer may traverse to complete the processing step according to the process path defined by the process task.

[0073] Furthermore, the fault type can be unrecoverable, meaning the target chamber module that failed cannot be automatically repaired. This solution primarily addresses scenarios where process chamber modules cannot be recovered after a fault. By optimizing the scheduling of semiconductor process equipment, it automates the process of handling job anomalies.

[0074] Step 402: If the target chamber module is a serial module, then determine the current transmission position of the associated wafer.

[0075] If the target chamber module that malfunctions is a serial module, then the affected associated wafers that must undergo process processing through that target chamber module can be identified, as well as the current transmission position of those associated wafers. In this embodiment, the transmission path information is adjusted based on the current transmission position of the associated wafers.

[0076] In an optional embodiment, each chamber module has a corresponding step number in the transmission path corresponding to each wafer. For step 402, the following steps can be performed:

[0077] Sub-step S11: Obtain the current step number information of the associated wafer.

[0078] Sub-step S12: Determine the current transmission position of the associated wafer based on the current step number information.

[0079] In the semiconductor process equipment of this invention, each chamber module in each transport path (i.e., process path) has a corresponding step number. The transport position of the wafer can be determined by the step number.

[0080] In one example, step numbers can be represented by StepIDs. StepIDs can start from 0 and increment by 1 sequentially according to the order of each module in the sequence; parallel modules have the same StepID. For example, in the following sequence, the StepIDs of each module are:

[0081]

[0082] By obtaining the current step number information of the associated wafer, it is possible to determine which chamber module the wafer is currently being transferred to.

[0083] Step 403: Adjust the transmission path information of the associated wafer according to the current transmission location.

[0084] In this embodiment of the invention, after determining the current transmission position of the associated wafer, the transmission path information defined in the process task can be adjusted according to the current transmission position.

[0085] Semiconductor process equipment includes a wafer cassette. Specifically, for step 403, the following steps can be performed:

[0086] Sub-step S21: If the current transmission position is the starting position of the associated wafer, then delete the information of the associated wafer from the process task and set the calling status of the associated wafer to an uncallable state.

[0087] In sub-step S22, if the current transmission position is before the target chamber module, the information of the associated wafer is deleted from the process task, and the calling status of the associated wafer is set to an uncallable state; a transmission path is created to transmit the associated wafer from the current transmission position to the wafer cassette, and the adjusted transmission path information is obtained.

[0088] In sub-step S23, if the current transmission position is after the target chamber module, the transmission path information of the associated wafer is not adjusted.

[0089] The information about the associated wafers includes the transmission path information of the associated wafers.

[0090] In practical implementation, the scheduling system for semiconductor process equipment has the following functional attributes:

[0091] 1. OrigJob: Used to record information about the original job associated with the Wafer;

[0092] 2. StepID: Records the step number in the corresponding Sequence of the chamber module where the Wafer is located.

[0093] 3. NeedSchedule: Records whether the Wafer can be scheduled by the Job. A value of "True" indicates that the Wafer can be scheduled, and a value of "False" indicates that the Wafer cannot be scheduled.

[0094] 4. Station: Records information such as module name and module location for each chamber module (processing module, transmission module, LoadLock module, etc. in the equipment).

[0095] If the fault occurs in the serial module, the transmission path information of the affected associated wafers can be adjusted as follows:

[0096] a. If the current step ID of the associated wafer is 0, it means that the associated wafer has not yet left the wafer cassette, is at the starting point of the transport path, and has not performed any process. In this case, the scheduling system can automatically remove the associated wafer's information from the Job, that is, delete the associated wafer's Sequence information, and set the NeedSchedule attribute to "False", and will not schedule the associated wafer again thereafter.

[0097] b. If the current step number StepID of the associated wafer is less than or equal to "N" (where N represents the step number of the target chamber module where the fault occurred), it indicates that the wafer has not (normally) executed the process of the faulty module. Since the faulty module is no longer available, the associated wafer must be sent back to the wafer cassette.

[0098] At this point, the first step is to remove the associated wafer information from the Job, that is, delete the associated wafer Sequence information in the schedule, and set the NeedSchedule attribute to "False".

[0099] Then create a wafer transfer task from Station (the current chamber module) to wafer cassette (the associated wafer no longer participates in the job execution, and is transferred to the wafer cassette through the newly created wafer transfer task).

[0100] c. If the current step number (StepID) of the associated wafer is greater than "N" and not equal to the total number of steps in the transmission path, it indicates that the associated wafer has completed the process of the faulty module and can continue executing the Job. In this case, the scheduling system does not change the Sequence information of the associated wafer. If the current step number (StepID) of the associated wafer is equal to the total number of steps in the transmission path, it indicates that the associated wafer has completed all processing steps and returned to the wafer cassette. In this case, the scheduling system will no longer process the associated wafer.

[0101] Step 404: Generate a new sequence of scheduling actions based on the adjusted transmission path information.

[0102] For associated wafers located at different transmission positions, the transmission path is adjusted according to the above method, and a new scheduling action sequence is regenerated.

[0103] In one example, when a user performs a "Resume" operation on the machine, the scheduling system will recalculate the wafer transmission sequence according to the newly set transmission path and schedule the wafers in order.

[0104] Step 405: If the target chamber module is a parallel module, the stranded wafer in the target chamber module is transferred to another parallel module corresponding to the target chamber module, and a new scheduling action sequence is generated for the stranded wafer.

[0105] If the target chamber module that malfunctions is a parallel module, the stranded wafer can be transferred to another parallel module that has not malfunctioned, the stranded wafer can be reprocessed, and then a new scheduling action sequence can be generated for the stranded wafer.

[0106] In an alternative embodiment, the process can also be performed as follows:

[0107] If the target chamber module is a parallel module, and the robotic arm associated with the target chamber module and another parallel module corresponding to the target chamber module meet the conditions for transferring the stranded wafer from the target chamber module to another parallel module corresponding to the target chamber module, then the execution of the process task is paused.

[0108] In one example, the Job can be paused when both the robotic arm associated with the target chamber module and another parallel module have available positions (meeting the condition for transferring the stranded wafer from the faulty module to the parallel module).

[0109] In another alternative embodiment, the process can also be performed as follows:

[0110] If the target chamber module is a parallel module, the information of the stranded wafer is deleted from the process task, and the calling status of the stranded wafer is set to an uncallable state; the deletion information is recorded.

[0111] The information on the stranded wafers includes the transport path information of the stranded wafers.

[0112] In practice, users can remove the information of the stranded wafer from the Job through the software interface. This involves deleting the Sequence information associated with the stranded wafer in the schedule and setting the NeedSchedule attribute to "False" to record the OrigJob information (i.e., the deletion information). Afterward, the stranded wafer can be manually transferred to a parallel module that has not experienced a failure.

[0113] In another optional embodiment, the detained wafer in the target chamber module is transferred to another parallel module corresponding to the target chamber module, and a new scheduling action sequence is generated for the detained wafer, including:

[0114] After transferring the stranded wafer to another parallel module for process processing, the information of the stranded wafer is added back to the process task based on the deletion information; the calling status of the stranded wafer is set to the callable status; and a new scheduling action sequence is generated for the stranded wafer.

[0115] After transferring the stranded wafer to another parallel module for reprocessing, the user can add the stranded wafer's information back to the Job through the software interface. At this time, the scheduling system restores the job information of the stranded wafer (including the transfer path information) based on the OrigJob information of the stranded wafer and sets the NeedSchedule attribute of the stranded wafer to "True". When the user executes the "Resume" operation of the machine, the scheduling system will recalculate a new sequence of transfer actions according to the current transfer position of the stranded wafer and the restored transfer path information to ensure the continued execution of the Job.

[0116] Step 406: Continue executing the process task according to the newly generated scheduling action sequence.

[0117] Continuing to execute process tasks according to the newly generated sequence of scheduled actions, without terminating the process tasks for manual recovery, can improve the automated repair capability of the equipment.

[0118] To enable those skilled in the art to better understand steps 401 to 406 of the embodiments of the present invention, an example is provided below:

[0119] Reference Figure 5 The diagram shown is a flowchart of a process fault handling method according to an embodiment of the present invention. The specific process includes:

[0120] When a chamber module fails, determine if the total number of steps containing the failed module is greater than 1. If yes, the failed module is a parallel module; otherwise, the failed module is a serial module.

[0121] 1. When the faulty chamber module is a serial module:

[0122] 1) The scheduling system will set the module to an "unavailable" state and record the StepID in the Sequence where the module is located, which is marked as "N" here;

[0123] 2) The scheduling system throws an alarm message “SerialModuleUnavailable”. The optional handling strategy for this alarm is “Retry” and “Abort” with the addition of the “Continue” option.

[0124] 3) At this point, the job will be suspended by an alarm;

[0125] 4) When the faulty chamber module is unrecoverable, the user should first pause the machine job and clear the hardware alarm information;

[0126] 5) If the user needs to automatically recover the Job, then execute the "Continue" operation on the alarm message "SerialModuleUnavailable". In this case, the Job will not be aborted and will still be recorded in the scheduling system.

[0127] 6) The scheduling system traverses each wafer in the Job, identifies the affected associated wafers (which need to be processed by the fault module), and confirms the StepID of the module where the currently associated wafer is located.

[0128] a. If the StepID of the associated Wafer is equal to the total number of Sequence Steps, it means that the Wafer has completed all processes and returned to the wafer cassette. In this case, the associated Wafer will no longer be processed.

[0129] b. If the StepID of the associated Wafer is equal to 0, it means that the Wafer has not been ejected from the Foup cassette and no process has been performed. At this time, the scheduler will automatically remove the information of the associated Wafer from the Job, that is, delete the Sequence information of the associated Wafer in the scheduler, and set the NeedSchedule attribute to "False". The associated Wafer will not be scheduled again after this.

[0130] c. If the StepID of the associated Wafer is less than or equal to "N", it indicates that the associated Wafer has not (normally) executed the process of the faulty module. Since the faulty module is no longer available, these associated Wafers can only be transferred back to the Foup wafer box. In this case, firstly, the information of the associated Wafer is removed from the Job, that is, the Sequence information of the associated Wafer is deleted from the schedule, and the NeedSchedule attribute is set to "False". Then, a wafer transfer task is created from Station (current module) -> wafer box Foup (the associated Wafer no longer participates in the Job execution, and is transferred back to the wafer box through the newly created wafer transfer task);

[0131] d. If the StepID of the associated Wafer is greater than "N" and not equal to the total number of Steps in the Sequence, it means that the associated Wafer has completed the process of the faulty module and can continue to execute the Job. In this case, the scheduling system does not change the Sequence information of the associated Wafer.

[0132] 7) When the user performs the “Resume” operation on the machine, the scheduler will recalculate the Wafer transmission sequence according to the settings in step 6 above and schedule the Wafers in order.

[0133] 2. When the faulty chamber module is a parallel module:

[0134] 1) The scheduling system will set the module to an "unavailable" state and remove it from the sequence;

[0135] 2) The scheduling system throws an alarm message “ParallelModuleUnavailable”, and the optional handling strategy for this alarm is “Clear”;

[0136] 3) The “ParallelModuleUnavailable” alarm is only for notification purposes; the job will not be paused by the alarm during this time.

[0137] 4) When a faulty chamber module is unrecoverable, the Wafer will remain in the faulty module and will not be scheduled by the Job.

[0138] 5) When there are idle positions in both the robotic arm associated with the faulty module and the corresponding parallel module (meeting the conditions for transferring the stranded Wafer from the faulty module to the parallel module), the user executes the pause job and clears the hardware alarm information.

[0139] 6) The user executes the "Clear" operation for the alarm "ParallelModuleUnavailable";

[0140] 7) Users can remove the information of the delayed Wafer from the Job through the software interface, that is, delete the Sequence information of the delayed Wafer in the schedule, and set the NeedSchedule attribute to "False" to record the OrigJob information. Afterwards, the delayed Wafer can be manually transferred;

[0141] 8) Manually transfer the stranded wafer to a parallel module that has not experienced a failure;

[0142] 9) To rework the stranded wafer;

[0143] 10) The information of the stranded Wafer is added back to the Job through the software interface. At this time, the scheduling system restores the Job information of the stranded Wafer according to the OrigJob information of the stranded Wafer and sets its NeedSchedule attribute to "True".

[0144] 11) When the user executes the “Resume” operation on the machine, the scheduler will recalculate the sequence of Wafer transmission to ensure the continued execution of the Job.

[0145] In summary, in this embodiment of the invention, if a serial module malfunctions during the execution of a process task, the task can continue to be executed without terminating it by adjusting the transmission path information of the associated wafer. If a parallel module malfunctions, the stranded wafer can be transferred to another parallel module for reprocessing before the process task continues. This method provides a way to recover from process task anomalies without terminating the process task if a serial module malfunctions; and ensures that stranded wafers can be promptly transferred to another parallel module for reprocessing if a parallel module malfunctions, reducing the risk of wafer scrap. The above fault handling methods are automatically completed by the semiconductor process equipment, improving the automation level of the equipment and reducing the complexity of manual fault handling.

[0146] This invention aims to provide a scheduling mechanism for rapid job exception handling when a device alarms and the corresponding processing module cannot be restored. When a serial module fails, for wafers that have already been ejected from the machine, if the wafer has completed the process of the faulty module, the job can continue to be executed according to the original sequence. For wafers that have not completed the process of the faulty module, the device can automatically remove them from the job and directly transfer them back to the Foup by creating a wafer transfer task. Wafers that have been returned to the Foup or have not been ejected from the Foup will no longer be scheduled. When a parallel module fails, the user can pause the machine task, remove the stranded wafer from the job, transfer it to the parallel module to complete the process, and then add it back to the job. In this way, the wafer can continue to be scheduled by the job, avoiding the problem of wafers being stranded for a long time.

[0147] The technical solution of this invention is mainly aimed at the scenario where the module cannot be recovered after failure. It realizes the automated process of handling job anomalies by optimizing the scheduling. For the scenario where the module can be recovered after troubleshooting, the original implementation is maintained. Users can choose the "Retry" operation of the scheduling alarm or the "Resume" of the machine to continue the execution of the job.

[0148] It should be noted that, for the sake of simplicity, the method embodiments are all described as a series of actions. However, those skilled in the art should understand that the embodiments of the present invention are not limited to the described order of actions, because according to the embodiments of the present invention, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions involved are not necessarily essential to the embodiments of the present invention.

[0149] Reference Figure 6The diagram illustrates a structural block diagram of a semiconductor process apparatus according to an embodiment of the present invention. The semiconductor process apparatus 601 includes multiple chamber modules for performing process tasks on a wafer, and these chamber modules are divided into serial modules and parallel modules. It also includes:

[0150] The controller 6011, when executing a process task, determines whether the faulty target chamber module is a serial module or a parallel module. If the target chamber module is a serial module, it adjusts the transmission path information of the associated wafers that need to pass through the target chamber module and generates a new scheduling action sequence based on the adjusted transmission path information. If the target chamber module is a parallel module, it transfers the stranded wafers in the target chamber module to another parallel module corresponding to the target chamber module and generates a new scheduling action sequence for the stranded wafers. The process task continues to be executed according to the newly generated scheduling action sequence.

[0151] In an optional embodiment of the present invention, the controller is configured to determine the current transmission position of the associated wafer and adjust the transmission path information of the associated wafer according to the current transmission position.

[0152] In an optional embodiment of the present invention, each of the chamber modules has a corresponding step number in the transmission path corresponding to each wafer, and the controller is used to obtain the current step number information of the associated wafer; and determine the current transmission position of the associated wafer based on the current step number information.

[0153] In an optional embodiment of the present invention, the controller is configured to, if the current transmission position is the starting position of the associated wafer, delete the information of the associated wafer from the process task and set the calling status of the associated wafer to an uncallable state; the information of the associated wafer includes the transmission path information of the associated wafer.

[0154] In an optional embodiment of the present invention, the semiconductor process equipment includes a wafer cassette, and the controller is configured to, if the current transmission position is before the target chamber module, delete the information of the associated wafer from the process task and set the call status of the associated wafer to an uncallable state; the information of the associated wafer includes transmission path information of the associated wafer; create a transmission path to transmit the associated wafer from the current transmission position to the wafer cassette, and obtain the adjusted transmission path information.

[0155] In an optional embodiment of the invention, the controller is configured not to adjust the transmission path information of the associated wafer if the current transmission position is after the target chamber module.

[0156] In an optional embodiment of the present invention, the controller is further configured to suspend the execution of the process task if the target chamber module is a parallel module and the robotic arm associated with the target chamber module and the other parallel module corresponding to the target chamber module satisfy the condition of transferring the stranded wafer from the target chamber module to the other parallel module corresponding to the target chamber module.

[0157] In an optional embodiment of the present invention, the controller is further configured to, if the target chamber module is a parallel module, delete the information of the stranded wafer from the process task and set the calling status of the stranded wafer to an uncallable state; the information of the stranded wafer includes the transmission path information of the stranded wafer; and record deletion information.

[0158] In an optional embodiment of the present invention, the controller is further configured to transfer the stranded wafer to the other parallel module for process processing, and then, according to the deletion information, re-add the information of the stranded wafer to the process task; set the calling status of the stranded wafer to a callable state; and generate a new scheduling action sequence for the stranded wafer.

[0159] In summary, in this embodiment of the invention, if a serial module malfunctions during the execution of a process task, the task can continue to be executed without terminating it by adjusting the transmission path information of the associated wafer. If a parallel module malfunctions, the stranded wafer can be transferred to another parallel module for reprocessing before the process task continues. This method provides a way to recover from process task anomalies without terminating the process task if a serial module malfunctions; and ensures that stranded wafers can be promptly transferred to another parallel module for reprocessing if a parallel module malfunctions, reducing the risk of wafer scrap. The above fault handling methods are automatically completed by the semiconductor process equipment, improving the automation level of the equipment and reducing the complexity of manual fault handling.

[0160] As the device embodiment is basically similar to the method embodiment, the description is relatively simple, and relevant parts can be found in the description of the method embodiment.

[0161] This invention also provides an electronic device, including: a processor, a memory, and a computer program stored in the memory and capable of running on the processor. When the computer program is executed by the processor, it implements the various processes of the above-described process fault handling method embodiment and achieves the same technical effect. To avoid repetition, it will not be described again here.

[0162] This invention also provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it implements the various processes of the above-described process fault handling method embodiment and achieves the same technical effect. To avoid repetition, it will not be described again here.

[0163] As the device embodiment is basically similar to the method embodiment, the description is relatively simple, and relevant parts can be found in the description of the method embodiment.

[0164] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0165] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, apparatus, or computer program products. Therefore, embodiments of the present invention can take the form of entirely hardware embodiments, entirely software embodiments, or embodiments combining software and hardware aspects. Furthermore, embodiments of the present invention can take the form of computer program products implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0166] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing terminal device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal device, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0167] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing terminal device to operate in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0168] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal equipment, causing a series of operational steps to be performed on the computer or other programmable terminal equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable terminal equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0169] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present invention.

[0170] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0171] The present invention has provided a detailed description of a process fault handling method and a semiconductor process equipment. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A method for handling process failures, characterized in that, The method is applied to semiconductor process equipment, which includes multiple chamber modules for performing process tasks on wafers, and these chamber modules are divided into serial modules and parallel modules. The process task refers to a complete wafer fabrication scheme automatically executed by the semiconductor process equipment. The method includes: When executing the process task, determine whether the target chamber module that failed is a serial module or a parallel module; If the target chamber module is a serial module, the transmission path information of the associated wafers that need to pass through the target chamber module is adjusted, and a new scheduling action sequence is generated based on the adjusted transmission path information. If the target chamber module is a parallel module, the wafers held in the target chamber module are transferred to another parallel module corresponding to the target chamber module, and a new scheduling action sequence is generated for the held wafers. Continue executing all the process tasks according to the newly generated sequence of scheduling actions; The semiconductor process equipment includes a wafer cassette, and the adjustment requires the transport path information of the associated wafer through the target chamber module, including: Determine the current transmission location of the associated wafer; If the current transmission position is before the target chamber module, the information of the associated wafer is deleted from the process task, and the calling status of the associated wafer is set to an uncallable state; the information of the associated wafer includes the transmission path information of the associated wafer; a transmission path is created to transmit the associated wafer from the current transmission position to the wafer cassette, and the adjusted transmission path information is obtained; If the current transmission position is after the target chamber module, the transmission path information of the associated wafer will not be adjusted.

2. The method according to claim 1, characterized in that, Each of the chamber modules has a corresponding step number in the transmission path corresponding to each wafer. Determining the current transmission position of the associated wafer includes: Obtain the current step number information of the associated wafer; The current transmission position of the associated wafer is determined based on the current step number information.

3. The method according to claim 1, characterized in that, Adjusting the transmission path information of the associated wafer based on the current transmission location further includes: If the current transmission position is the starting position of the associated wafer, then the information of the associated wafer is deleted from the process task, and the calling status of the associated wafer is set to an uncallable state; the information of the associated wafer includes the transmission path information of the associated wafer.

4. The method according to claim 1, characterized in that, Also includes: If the target chamber module is a parallel module, and the robotic arm associated with the target chamber module and the other parallel module corresponding to the target chamber module satisfy the condition of transferring the stranded wafer from the target chamber module to the other parallel module corresponding to the target chamber module, then the execution of the process task is paused.

5. The method according to claim 1, characterized in that, Also includes: If the target chamber module is a parallel module, the information of the stranded wafer is deleted from the process task, and the calling status of the stranded wafer is set to an uncallable state; the information of the stranded wafer includes the transmission path information of the stranded wafer; Record deletion information.

6. The method according to claim 5, characterized in that, The step of transferring the stranded wafer in the target chamber module to another parallel module corresponding to the target chamber module, and generating a new scheduling action sequence for the stranded wafer, includes: After the stranded wafer is transferred to the other parallel module for process processing, the information of the stranded wafer is added back to the process task according to the deletion information; Set the call status of the stranded wafer to a callable state; A new sequence of scheduling actions is generated for the stranded wafer.

7. A semiconductor process apparatus, characterized in that, The equipment includes a wafer cassette, multiple chamber modules for performing process tasks on the wafer, and the multiple chamber modules are divided into serial modules and parallel modules. The process task refers to a complete wafer processing scheme automatically executed by the semiconductor process equipment. The semiconductor process equipment also includes: The controller, when executing the process task, determines whether the faulty target chamber module is a serial module or a parallel module; if the target chamber module is a serial module, it adjusts the transmission path information of the associated wafers that need to pass through the target chamber module, and generates a new scheduling action sequence based on the adjusted transmission path information; if the target chamber module is a parallel module, it transfers the stranded wafers in the target chamber module to another parallel module corresponding to the target chamber module, and generates a new scheduling action sequence for the stranded wafers; and continues to execute all the process tasks according to the newly generated scheduling action sequence. The controller is further configured to determine the current transmission position of the associated wafer; if the current transmission position is before the target chamber module, the associated wafer information is deleted from the process task, and the calling status of the associated wafer is set to an uncallable state. The associated wafer information includes the transmission path information of the associated wafer. A transmission path is created to transmit the associated wafer from the current transmission position to the wafer cassette, and the adjusted transmission path information is obtained; if the current transmission position is after the target chamber module, the transmission path information of the associated wafer is not adjusted.

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