3D Printing System

Abstract

The present invention provides a 3D printing system. The 3D printing system comprises a printing box and an anode back plate for 3D printing; the printing box contains an electrolyte; the printing box comprises a first cover plate and a second cover plate arranged opposite to each other; the anode back plate is arranged on the side of the first cover plate facing the second cover plate, so that each anode of the anode back plate faces the electrolyte; a cathode for printing is arranged on the side of the second cover plate facing the first cover plate. The 3D printing system of the present invention can conveniently control the position of the metal ions to be printed in the electrolyte deposited on the cathode back plate, and can achieve high-precision printing.

Description

Technical Field

[0001] The present invention relates to the technical field of 3D printing, and in particular to a 3D printing system. Background Art

[0002] Electrochemical metal printing technology is a type of rapid prototyping technology, also known as additive manufacturing. It is a technology that uses powdered metal or plastic materials to construct objects by printing layer by layer based on digital model files. However, the existing electrochemical metal printing technology cannot easily control the position of the metal ions to be printed in the electrolyte on the cathode backplane, and cannot achieve high-precision printing. Summary of the invention

[0003] The main purpose of the present invention is to provide a 3D printing system to solve the problem that the existing electrochemical metal printing technology cannot conveniently control the position of the metal ions to be printed in the electrolyte deposited on the cathode back plate and cannot achieve high-precision printing.

[0004] In order to achieve the above-mentioned object, the present invention provides a 3D printing system, comprising a printing box and an anode back plate for 3D printing; the printing box contains an electrolyte; the printing box comprises a first cover plate and a second cover plate arranged opposite to each other;

[0005] The anode back plate is arranged on the side of the first cover plate facing the second cover plate, so that each anode of the anode back plate faces the electrolyte;

[0006] A cathode for printing is arranged on one side of the second cover plate facing the first cover plate;

[0007] The anode backplane for 3D printing includes a base substrate and an array-distributed pixel structure arranged on the base substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a circuit diagram of an embodiment of a pixel structure in an anode backplane according to at least one embodiment of the present invention;

[0009] Figure 2 is a schematic diagram of a layout of an anode back plate according to at least one embodiment of the present invention;

[0010] Figure 3 is another schematic diagram of the layout of the anode back plate according to at least one embodiment of the present invention;

[0011] Figure 4 and Figure 5 yes Figure 2 A top view of a gate metal layer in FIG.

[0012] Figure 6 yes Figure 2A top view of the active layer in FIG.

[0013] Figure 7 yes Figure 2 A top view of the source and drain metal layers in FIG.

[0014] Figure 8 yes Figure 3 A top view of the conductive layer in FIG.

[0015] Fig. 9 is a top view of an embodiment of the conductive layer;

[0016] Fig.10 yes Figure 2 A top view of the capacitor electrode layer in FIG.

[0017] Fig.11 yes Figure 2 A top view of the anode layer in FIG.

[0018] Fig.12 is Figure 3 A schematic diagram showing the embodiment of the anode back plate shown in the figure with the labels of the via holes added;

[0019] Fig.13 is Figure 3 On the basis of the above, a schematic diagram of the A-A' section line is added;

[0020] Fig.14 yes Fig.13 A cross-sectional view of the anode back plate for 3D printing in the direction of A-A' is shown;

[0021] Fig.15A is a schematic diagram of a layout of an anode back plate according to at least one embodiment of the present invention;

[0022] Fig. 15B yes Fig.15A A cross-sectional view of the anode back plate for 3D printing in the BB' direction shown;

[0023] Fig.16 yes Figure 3 A top view of another conductive layer used in the embodiment of the anode back plate shown;

[0024] Fig.17 is a structural diagram of a specific embodiment of a plurality of pixel structures in an anode back plate in a 3D printing system according to an embodiment of the present invention;

[0025] Fig.18 is a schematic diagram of multiple rows and columns of anodes included in the anode back plate;

[0026] Fig.19 is a working timing diagram of the specific embodiment of the multiple pixel structures;

[0027] Fig. 20 is a structural diagram of a 3D printing system according to an embodiment of the present invention;

[0028] Fig.21 is a structural diagram of a cathode back plate in a 3D printing system according to an embodiment of the present invention;

[0029] Fig. 22 It is a schematic diagram of the connection relationship of various components in the 3D printing system described in an embodiment of the present invention. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] The anode backplane for 3D printing described in the embodiment of the present invention may include a pixel structure disposed on a substrate; Figure 1 As shown, the pixel structure may include a driving transistor T1, a switching transistor T2, a storage capacitor C1 and an anode 10;

[0032] The gate electrode G1 of the driving transistor T1 is electrically connected to the first electrode plate C1a of the storage capacitor C1, the source electrode S1 of the driving transistor T1 is electrically connected to the power line V1, and the drain electrode D1 of the driving transistor T1 is electrically connected to the anode 10;

[0033] The gate G2 of the switch transistor T2 is electrically connected to the gate line G0, the source S2 of the switch transistor T2 is electrically connected to the data line D0, and the drain D2 of the switch transistor T2 is electrically connected to the first electrode plate C1a of the storage capacitor C1;

[0034] The second electrode plate C1 b of the storage capacitor C1 is electrically connected to the anode 10 .

[0035] like Figure 2 As shown, the anode backplane for 3D printing described in the embodiment of the present invention includes a base substrate and an array-distributed pixel structure arranged on the base substrate;

[0036] The left pixel structure (the left pixel structure is Figure 2 The first pixel structure 21 on the left side in the figure comprises a power line, a first gate line G01 and a first data line D01 staggered in rows and columns, an anode 10 of the anode back plate on the substrate, a driving transistor electrically connected to the anode 10, and a switching transistor electrically connected to the driving transistor;

[0037] The first gate line G01 extends along the row direction of the array and is located at a side of the pixel structure close to the next row of pixel structures; the power line includes a power line V1 extending along the column direction; the first data line D01 and the power line V1 extending along the column direction are located at opposite sides of the first pixel structure 21; D01 is located on the left side of the first pixel structure 21, and V1 is located on the right side of the first pixel structure 21;

[0038] In the pixel area where the first pixel structure 21 is located, the driving transistor and the switching transistor are sequentially arranged along a column direction;

[0039] like Figure 2 and Figure 4 As shown, the gate G1 of the driving transistor in the first pixel structure 21 extends from the first data line D01 to the power line V1 in the row direction, and the gate G1 of the driving transistor extends from the gate line of the pixel structure in the previous row (in the column direction) to the gate line of the pixel structure in the previous row (in the column direction). Figure 2 In the embodiment, the gate line of the upper row of pixel structures is a second gate line (G02) extending in the direction of the switch transistor;

[0040] like Figure 2 and Figure 6 As shown, the width direction of the channel 511 in the active layer pattern of the driving transistor is the row direction, and the channel 511 extends from the first data line D01 to the power line V1 in the row direction;

[0041] like Figure 2 and Figure 7 As shown, the source S1 of the driving transistor and the drain D1 of the driving transistor extend in the row direction respectively, and the source S1 of the driving transistor and the drain D1 of the driving transistor are arranged in sequence in the column direction; the source S1 of the driving transistor and the drain D1 of the driving transistor are both located in the source-drain metal layer, and the source-drain metal layer is arranged on the side of the active layer away from the substrate.

[0042] like Figure 2 and Figure 4 As shown, the first gate line G01 has a first protrusion, the main body of the first gate line G01 extends along the row direction, the first protrusion protrudes from the main body of G01, and the gate G2 of the switch transistor is the first protrusion;

[0043] like Figure 2 and Figure 7 As shown, the first data line D01 has a second protrusion, the main body of the first data line D01 extends along the column direction, the second protrusion protrudes from the main body of D01, and the source S2 of the switch transistor is the second protrusion;

[0044] like Figure 2 , Figure 4 and Figure 7 As shown, the gate G2 of the switch transistor is the first protrusion, and the source S2 of the switch transistor is the second protrusion, so that the space occupied by the switch transistor is small.

[0045] like Figure 2 As shown, the first pixel structure 21 and the second pixel structure 22 are mirror-imaged on both sides of the power line V1; the first pixel structure 21 and the second pixel structure 22 share the power line V1; the power line is located between the driving transistor included in the first pixel structure 21 and the driving transistor included in the second pixel structure 22; the first pixel structure 21 includes a first data line D01, and the second pixel structure 22 includes a second data line D02, the first data line D01 is located on the side of the first pixel structure 21 away from the power line V1, and the second data line D02 is located on the side of the second pixel structure 22 away from the power line V1.

[0046] like Figure 2 and Figure 7 As shown, the source S1 of the driving transistor in the first pixel structure 21 is connected to the source of the driving transistor in the second pixel structure 22, and the source S1 of the driving transistor in the first pixel structure 21 and the source of the driving transistor in the second pixel structure 22 are an integrated structure.

[0047] like Figure 2 , Figure 4 , Figure 5 , Figure 6 and Fig.10 As shown, the length of the gate G1 of the driving transistor in the column direction is greater than the length of the active layer pattern 51 of the driving transistor in the column direction, so that the gate G1 of the driving transistor extends in the direction of the switching transistor relative to the active layer, and the extended portion 40 of the gate G1 and the projection of the active layer pattern 51 of the driving transistor on the substrate have no overlapping area; the drain D1 of the driving transistor is electrically connected to the anode 10 through the capacitor electrode layer;

[0048] like Figure 2 , Figure 4 , Figure 5 and Fig.10 As shown, the capacitor electrode layer and the extension portion 40 of the gate G1 have an overlapping area on the substrate, and the capacitor electrode layer at least forms a capacitor with the extension portion 40 of the gate.

[0049] Optionally, the capacitor electrode layer is located between the drain of the driving transistor and the anode, a first insulating layer is provided between the capacitor electrode layer and the drain of the driving transistor, and a second insulating layer is provided between the capacitor electrode layer and the anode;

[0050] The capacitor electrode layer is electrically connected to the drain of the driving transistor through a via hole provided in the first insulating layer, and the capacitor electrode layer is electrically connected to the anode through a via hole provided in the second insulating layer;

[0051] The orthographic projection of the capacitor electrode layer on the base substrate and the orthographic projection of the gate of the driving transistor on the base substrate have an overlapping area to form a capacitor.

[0052] Optionally, the drain of the driving transistor is located in the source-drain metal layer, the anode is located in the anode layer, the capacitor electrode layer A9 is located between the source-drain metal layer A4 and the anode layer A11, a first insulating layer A5 is provided between the capacitor electrode layer A9 and the source-drain metal layer A4, a second insulating layer A10 is provided between the capacitor electrode layer A9 and the anode layer A11, the capacitor electrode layer A9 is electrically connected to the drain of the driving transistor through a via, the capacitor electrode layer A9 is electrically connected to the anode through a via, and the orthographic projection of the capacitor electrode layer A9 on the substrate has an overlapping area with the orthographic projection of the gate of the driving transistor on the substrate to form a capacitor.

[0053] In an embodiment of the present invention, the power line is in the same layer and is formed of the same material as the capacitor electrode layer, so that there is enough space in the source-drain metal layer to set the source and drain of the driving transistor, thereby being able to set the width-to-length ratio of the driving transistor to be larger to enhance the driving capability of the driving transistor.

[0054] like Figure 3 and Fig.14 As shown, the drain electrode D1 of the driving transistor is located at the source-drain metal layer A4, and the anode backplane for 3D printing described in the embodiment of the present invention further includes the first insulating layer A5, the organic resin layer A6, the conductive layer A7 and the third insulating layer A8 which are sequentially arranged between the source-drain metal layer A4 and the capacitor electrode layer A9;

[0055] The organic resin layer A6 and the conductive layer A7 are used to block hydrogen; the orthographic projection of the organic resin layer A6 on the base substrate covers the orthographic projection of the active layer pattern on the base substrate, and the orthographic projection of the conductive layer A7 on the base substrate covers the orthographic projection of the active layer pattern on the base substrate;

[0056] The drain electrode of the driving transistor is electrically connected to the conductive layer A7 through a via hole penetrating the first insulating layer A5 and the organic resin layer A6, and the conductive layer A7 is electrically connected to the capacitor electrode layer A9 through a via hole penetrating the third insulating layer A8.

[0057] In the embodiment of the present invention, Figure 2 , Figure 3 , Figure 4 and Fig.14 As shown, the gate G1 of the driving transistor, the gate G2 of the switching transistor, the first gate line G01 and the second gate line G02 may be disposed on the gate metal layer A1; Figure 2 , Figure 3 , Figure 6 and Fig.14 As shown, the active layer pattern 51 of the driving transistor and the active layer pattern of the switching transistor are arranged on the active layer A3; Figure 2 , Figure 3 , Figure 7 and Fig.14 As shown, the source S1 of the driving transistor, the drain D1 of the driving transistor, the source S2 of the switching transistor and the drain D2 of the switching transistor are all arranged on the source-drain metal layer A4; Figure 2 , Figure 3 , Fig.10 and Fig.14 As shown, the power line V1 and the capacitor electrode layer A9 are provided in the same layer and with the same material; Figure 2 , Figure 3 , Fig.11 and Fig.14 As shown, the anode is located at the anode layer A11;

[0058] The gate metal layer A1, the active layer A3, the source-drain metal layer A4, the capacitor electrode layer A9 and the anode layer A11 may be sequentially arranged on the base substrate.

[0059] The drain electrode of the driving transistor located in the source-drain metal layer A4 is electrically connected to the anode located in the anode layer A11 through the capacitor electrode layer A9. Figure 2 , Figure 4 , Figure 5 and Fig.10 As shown, the orthographic projection of the capacitor electrode layer on the base substrate and the orthographic projection of the gate G1 of the driving transistor relative to the extension portion 40 of the active layer on the base substrate have an overlapping area, forming a capacitor.

[0060] like Figure 2 and Figure 3 As shown, the first pixel structure 21 and the second pixel structure 22 are mirror-imaged and arranged on both sides of the power line V1;

[0061] The first pixel structure 21 and the second pixel structure 22 share a power line V1, and the power line V1 is located between the driving transistor of the first pixel structure 21 and the driving transistor of the second pixel structure 22; the source S1 of the driving transistor of the first pixel structure 21 extends from the first pixel structure 21 to the second pixel structure 22 along the row direction, and the driving transistor of the first pixel structure 21 and the driving transistor of the second pixel structure 22 are integrated with the power line V1;

[0062] like Figure 7 As shown, the source electrode S1 of the driving transistor of the first pixel structure 21 and the source electrode of the driving transistor of the second pixel structure 22 are electrically connected via the second conductive connection portion L2;

[0063] The power line also includes a first conductive connection part L1, the orthographic projection of the first conductive connection part L1 on the base substrate at least partially overlaps with the orthographic projection of the second conductive connection part L2 on the base substrate, and the first conductive connection part L1 is electrically connected to the second conductive connection part L2 through a via, so that the source S1 of the driving transistor is electrically connected to the power line V1.

[0064] In an embodiment of the present invention, the anode back plate for 3D printing may further include:

[0065] An isolation layer is arranged above the active layer pattern of the driving transistor, and the isolation layer is used to isolate the influence of impurities on the active layer pattern of the driving transistor; the isolation layer is a single-layer isolation layer or a multi-layer isolation layer, and the single-layer isolation layer or the multi-layer isolation layer includes at least one of an organic resin layer, a metal layer or a metal oxide active layer.

[0066] exist Fig.12 In the figure, the ones marked with numbers H01, H02, and H03 are the first via hole, the second via hole, and the third via hole, respectively.

[0067] like Fig.14 As shown, the orthographic projection of the first via hole H01 on the base substrate and the orthographic projection of the third via hole on the base substrate are within the orthographic projection of the second via hole H02 on the base substrate.

[0068] like Fig.14As shown, the anode back plate may include a conductive layer A7 and an organic resin layer A6; the conductive layer A7 is arranged on a side of the capacitor electrode layer A9 away from the base substrate 20; the organic resin layer A6 is arranged between the conductive layer A7 and the source-drain metal layer A4; the anode back plate also includes a first insulating layer A5 arranged between the source-drain metal layer A4 and the organic resin layer A6 and a third insulating layer A8 arranged between the conductive layer A7 and the capacitor electrode layer A9; the vias include a first via H01, a second via H02 and a third via H03.

[0069] exist Fig.14 In the figure, A1 is a gate metal layer, A2 is a gate insulating layer, A3 is an active layer, A10 is a second insulating layer, and A11 is an anode layer.

[0070] Optionally, both the first insulating layer and the third insulating layer may be passivation layers, but the present invention is not limited thereto.

[0071] like Fig.12 and Fig.14 As shown, the orthographic projection of the first via hole H01 on the base substrate 20 is within the orthographic projection of the second via hole H02 on the base substrate 20 , and the orthographic projection of the third via hole H03 on the base substrate 20 is within the orthographic projection of the second via hole H02 on the base substrate 20 .

[0072] In the embodiment of the present invention, due to process limitations, the area of ​​the orthographic projection of H02 on the substrate is set to be larger than the area of ​​the orthographic projection of H01 on the substrate, and the area of ​​the orthographic projection of H02 on the substrate is set to be larger than the area of ​​the orthographic projection of H03 on the substrate, so as to ensure that H01 can be fully presented and can be completely etched.

[0073] In specific implementation, Figure 8 As shown, the conductive layer may include a plurality of mutually independent conductive patterns 30; the orthographic projection of the conductive patterns 30 on the substrate covers the pixel region where the pixel structure is arranged. In addition, the openings between the conductive patterns 30 may expose the first conductive connection portion L1 and the second conductive connection portion L2 to avoid short circuit.

[0074] In a specific implementation, the active layer may be a metal oxide active layer, but is not limited thereto.

[0075] Optionally, the active layer may be an IGZO layer, wherein the atomic ratio of indium, gallium, zinc and oxygen may be 1:1:1:4, but is not limited thereto.

[0076] like Figure 2 and Figure 3As shown, the first pixel structure 21 and the second pixel structure 22 are mirror-imaged and arranged on both sides of the power line V1 extending along the column direction; the first pixel structure 21 and the second pixel structure 22 are arranged in the same row; the first pixel structure 21 includes a driving transistor, a switching transistor and a first data line D01; the second pixel structure 22 includes a driving transistor, a switching transistor and a second data line D02;

[0077] The first pixel structure 21 and the second pixel structure 22 share the first gate line G01 and the power line V1; pixel structures in the same column may share the same data line.

[0078] like Figure 2 As shown, the anode back plate includes a gate metal layer A1, an active layer A3, a source-drain metal layer A4, a capacitor electrode layer A9 and an anode layer A11 which are sequentially arranged on the base substrate 20;

[0079] Figure 4 and Figure 5 yes Figure 2 A top view of the gate metal layer in FIG. Figure 6 yes Figure 2 Top view of the active layer in Figure 7 yes Figure 2 A top view of the source and drain metal layers in FIG. Fig.10 yes Figure 2 A top view of the capacitor electrode layer in FIG. Fig.11 yes Figure 2 Top view of the anode layer in FIG.

[0080] Figure 3 The embodiment of the anode back plate shown is similar to Figure 2 The difference of the embodiment of the anode back plate shown is that a conductive layer and an organic resin layer are added, and a second via hole and a second connecting via hole are added.

[0081] exist Figure 4 and Figure 5 In the figure, the first gate line is labeled G01, the second gate line is labeled G02, and the gate of the driving transistor in the first pixel structure 21 is labeled G1. The gate G1 of the driving transistor in the first pixel structure 21 is multiplexed as the first plate of the storage capacitor; Figure 4 and Figure 5 In the figure, the gate of the switch transistor in the first pixel structure 21 is marked with G2, and the gate G2 of the switch transistor in the first pixel structure 21 is the protrusion of G01; Figure 6 In the figure, the active layer pattern of the driving transistor in the first pixel structure 21 is marked with 51; the active layer pattern of the switching transistor in the first pixel structure 21 is marked with 52; Figure 7In the figure, the source of the driving transistor in the first pixel structure 21 is marked with S1, the drain of the driving transistor in the first pixel structure 21 is marked with D1, the source of the switching transistor in the first pixel structure 21 is marked with S2, the drain of the switching transistor in the first pixel structure 21 is marked with D2, and the extension portion is marked with L3, and the extension portion L3 is electrically connected to D2; Figure 7 In the figure, S2 is the protrusion of D01. Figure 8 In the figure, the reference numeral 30 indicates a conductive pattern included in the conductive layer. Fig.10 In FIG. 1 , the first conductive connection portion is labeled L1, and the power line is labeled V1 and arranged along the column direction. Fig.11 Among them, the one marked with 10 is the anode.

[0082] like Figure 4 and Figure 5 As shown in FIG. 1 , the main part of G01 is a linear part extending along the row direction, and G2 is an integral structure with the main part of G01 and protrudes from the main part of G01. Figure 7 As shown, the main body of D01 is a linear portion extending along the column direction, and S2 is an integral structure with the main body of D01 and protrudes from the main body of D01.

[0083] In the embodiment of the present invention, the column direction may be a vertical direction, the row direction may be a horizontal direction, the first side may be a left side, and the second side may be a right side, but the present invention is not limited thereto.

[0084] like Figure 2 and Figure 3 As shown, the first pixel structure 21 and the second pixel structure are mirror-imaged on opposite sides of the power line V1, and a symmetrical pixel structure is used to save pixel area. In the embodiment of the present invention, the power line is arranged in the capacitor electrode layer to further save pixel area and achieve better resolution. In addition, the embodiment of the present invention uses low-resistance metal to make the power line and expands the line width of the power line as much as possible to reduce the IR voltage drop under large current (IR voltage drop refers to a phenomenon in which the voltage drops or increases on the power supply and ground networks in an integrated circuit) and improve the uniformity of large-size anode backplanes.

[0085] like Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, the active layer pattern of the driving transistor includes a first channel portion 511, a first electrode contact portion 512 and a second electrode contact portion 513;

[0086] The orthographic projection of the source S1 of the driving transistor on the substrate at least partially overlaps with the orthographic projection of the first electrode contact portion 512 on the substrate, and the orthographic projection of the drain D1 of the driving transistor on the substrate at least partially overlaps with the orthographic projection of the second electrode contact portion 513 on the substrate;

[0087] The source S1 of the driving transistor is in direct contact with the first electrode contact portion 512, and the drain D1 of the driving transistor is in direct contact with the second electrode contact portion 513;

[0088] The first channel portion 511 is disposed between the first electrode contact portion 512 and the second electrode contact portion 513;

[0089] The first channel portion 511 extends along a row direction.

[0090] like Figure 6 As shown, a ratio between a width of the first channel portion 511 in the row direction and a length of the first channel portion 511 in the column direction (the ratio is also the width-to-length ratio of the driving transistor) is greater than a predetermined ratio.

[0091] In an embodiment of the present invention, the power line and the capacitor electrode layer are arranged in the same layer and with the same material, so that there is enough space in the source-drain metal layer to arrange the source and drain of the driving transistor, thereby being able to set the width-to-length ratio of the driving transistor to be larger to improve the driving capability.

[0092] exist Figure 2 and Figure 3 In the illustrated embodiment, the width-to-length ratio of the driving transistor may be greater than or equal to 4 and less than or equal to 8. For example, the width-to-length ratio of the driving transistor may be equal to 5, but is not limited thereto.

[0093] In the embodiment of the present invention, the predetermined ratio may be greater than or equal to 1 and less than or equal to 12.5, but is not limited thereto.

[0094] like Figure 7 As shown, the drain electrode D1 of the driving transistor and the second electrode plate portion C1b2 are an integrated structure;

[0095] like Figure 2 , Figure 3 , Figure 7 and Fig.10 As shown, there is a first overlapping area between the orthographic projection of the first electrode portion C1b1 on the substrate and the orthographic projection of the second electrode portion C1b2 on the substrate; the first electrode portion C1b1 and the power line V1 are independent of each other;

[0096] The first electrode portion C1b1 is electrically connected to the second electrode portion C1b2 through a connecting via; the connecting via is provided in the first overlapping region;

[0097] like Figure 2 , Figure 3 , Fig.10 , Fig.11 and Fig.12 As shown, there is a second overlapping area between the orthographic projection of the first electrode portion C1b1 on the substrate and the orthographic projection of the anode 10 on the substrate;

[0098] The first electrode portion C1b1 is electrically connected to the anode 10 through a fourth via hole H04 disposed in the second overlapping region.

[0099] exist Fig.14 Among them, the via hole labeled H04 is a fourth via hole, and the fourth via hole H04 is a via hole penetrating the second insulating layer A10.

[0100] like Figure 3 , Figure 7 , Figure 8 and Fig.10 As shown, the second electrode portion C1b2 is electrically connected to the conductive pattern 30 through the first connection via H1 and the second connection via H2; the conductive pattern 30 is electrically connected to the first electrode portion C1a through the third connection via H3.

[0101] like Fig.12 As shown, the connecting vias may include a first connecting via H1, a second connecting via H2 and a third connecting via; the orthographic projection of the first connecting via H1 on the base substrate is within the orthographic projection of the second connecting via H2 on the base substrate, and the orthographic projection of the third connecting via on the base substrate is within the orthographic projection of the second connecting via H2 on the base substrate.

[0102] exist Fig.12 In the corresponding embodiment, the orthographic projection of the first connecting via H1 on the base substrate overlaps with the orthographic projection of the third connecting via on the base substrate, but the invention is not limited thereto. In actual operation, the orthographic projection of the first connecting via on the base substrate may also at least partially overlap with the orthographic projection of the third connecting via on the base substrate.

[0103] like Fig.14 As shown, the first connection via hole H1 is a via hole penetrating the first insulating layer A5, the second connection via hole H2 is a via hole penetrating the organic resin layer A6, and the third connection via hole H3 is a via hole penetrating the third insulating layer A8;

[0104] The orthographic projection of the first connecting via H1 on the base substrate is within the orthographic projection of the second connecting via H2 on the base substrate, and the orthographic projection of the third connecting via H3 on the base substrate is within the orthographic projection of the second connecting via H2 on the base substrate.

[0105] In an embodiment of the present invention, due to process limitations, the area of ​​the orthographic projection of H2 on the substrate is set to be larger than the area of ​​the orthographic projection of H1 on the substrate, and the area of ​​the orthographic projection of H2 on the substrate is set to be larger than the area of ​​the orthographic projection of H3 on the substrate, so as to ensure that H1 can be fully presented and can be completely etched.

[0106] like Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 7 As shown, the gate G1 of the driving transistor is reused as the first plate of the storage capacitor; the second plate portion C1b2 and the second electrode D1 of the driving transistor are an integrated structure;

[0107] exist Fig.10 Among them, the portion labeled C1b1 is the first electrode portion;

[0108] like Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 7 and Fig.10 As shown, the orthographic projection of the first electrode plate C1a on the base substrate, the orthographic projection of the first electrode plate portion C1b1 on the base substrate, and the orthographic projection of the second electrode plate portion C1b2 on the base substrate at least partially overlap to form a storage capacitor.

[0109] like Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, the active layer pattern of the switch transistor includes a second channel portion 521 (i.e., a channel of the active layer pattern of the switch transistor), a third electrode contact portion 522 and a fourth electrode contact portion 523;

[0110] exist Fig.14 In the embodiment of the present invention, the via hole marked H4 is a fourth connection via hole, and the fourth connection via hole H4 is a via hole penetrating the gate insulating layer A2. Fig. 9 As shown, the conductive layer includes a plurality of independent conductive patterns 30, and the orthographic projection of the conductive patterns 30 on the base substrate covers the pixel area where the pixel structure is arranged; and Fig. 9 As shown, the conductive layer has openings between the plurality of independent conductive patterns 30 to expose the first conductive connection portion and the second conductive connection portion to prevent short circuit.

[0111] like Fig.15A and Fig. 15B As shown, the first electrode via hole H11, the second electrode via hole H12, the third electrode via hole H13 and the fourth electrode via hole H14 are via holes penetrating the etching stop layer.

[0112] like Fig.15A In the figure, L1 is a first conductive connection portion included in the power line, such as Fig.15A and Fig. 15B As shown, L1 is electrically connected to the second conductive connection portion (the second conductive connection portion is provided in the source-drain metal layer) through a first via hole H01 penetrating the first insulating layer A6;

[0113] exist Fig.15A and Fig. 15B In the embodiment shown, the gate of the driving transistor is reused as the first plate of the storage capacitor; the drain of the driving transistor and the second plate portion are an integrated structure; the second plate portion is electrically connected to the first plate portion through a second via H02; the first plate portion is electrically connected to the anode 10 through a third via H03.

[0114] like Fig.15A and Fig. 15B As shown, the orthographic projection of the second via hole H02 on the base substrate does not overlap with the orthographic projection of the third via hole H03 on the base substrate, so as to avoid line breakage, but the present invention is not limited thereto.

[0115] When manufacturing the anode back plate described in the embodiment of the present invention, when depositing the capacitor electrode layer, it will sink at the position of the second via H02. If the orthographic projection of H03 on the base substrate overlaps with the orthographic projection of H02 on the base substrate, the first electrode portion C1b1 may not be electrically connected to the anode 10 through the third via H03 provided in the third overlapping area. Therefore, in actual operation, the orthographic projection of the second via H02 on the base substrate and the orthographic projection of the third via H03 on the base substrate are set to not overlap.

[0116] exist Fig.15A and Fig. 15BIn the embodiment shown, the drain of the switching transistor is electrically connected to the extension portion, and the gate of the driving transistor (i.e., the first plate of the storage capacitor) is electrically connected to the extension portion through a fourth via H04 (H04 is a via that passes through the gate insulation layer and the etching barrier layer), so that the first plate of the storage capacitor is electrically connected to the drain of the switching transistor.

[0117] exist Figure 3 In the embodiment of the anode back plate shown in FIG. 1 , the structure of the conductive layer can be replaced by Fig.16 The structure shown.

[0118] like Fig.16 As shown, the conductive layer may include a plurality of first openings K1 and a plurality of second openings K2 , and the third connection vias H3 pass through the first openings K1 ; the first openings K1 expose the first conductive connection portions L1 and the second conductive connection portions L2 to avoid short circuit.

[0119] use Fig.16 According to the structure of the conductive layer shown, the second electrode portion can be directly electrically connected to the first electrode portion through the first connecting via, the second connecting via and the third connecting via, without the need for switching through the conductive layer. Therefore, when manufacturing the substrate described in the embodiment of the present invention, the first insulating layer and the organic resin layer can be manufactured in sequence on the side of the source and drain metal layer away from the base substrate, and then the second connecting via is manufactured through the organic resin layer, and then the third insulating layer is manufactured on the side of the organic resin layer away from the first insulating layer. Then, the same dry etching process is used to manufacture the first connecting via that penetrates the first insulating layer and the third connecting via that penetrates the third insulating layer. In this way, one mask can be saved, thereby saving production costs.

[0120] like Fig.16 As shown, the conductive patterns 30 included in the conductive layer can be connected to each other, which can improve pixel uniformity.

[0121] In actual operation, in order to avoid ESD (Electro-Static discharge) problems, the conductive pattern may be connected to a suitable potential. For example, the conductive pattern may be grounded, but the present invention is not limited thereto.

[0122] The 3D printing system described in the embodiment of the present invention comprises a printing box and the above-mentioned anode back plate for 3D printing; the printing box contains electrolyte; the printing box comprises a first cover plate and a second cover plate arranged opposite to each other;

[0123] The anode back plate is arranged on the side of the first cover plate facing the second cover plate, so that each anode of the anode back plate faces the electrolyte;

[0124] A cathode for printing is arranged on a side of the second cover plate facing the first cover plate.

[0125] In a specific implementation, the anode backplane for 3D printing includes a pixel structure and an anode arranged on a base substrate; the pixel structure is used to control the data voltage on the corresponding column data line under the control of the gate drive signal on the corresponding row gate line, and control the connection or disconnection between the power line and the anode, so as to control the position of the metal ions to be printed in the electrolyte to be deposited on the second cover plate, and finally form a 3D pattern to achieve high-precision printing.

[0126] In an embodiment of the present invention, the 3D printing system may further include a cathode back plate; the anode back plate and the cathode back plate are arranged opposite to each other;

[0127] The cathode back plate is arranged on a side of the second cover plate facing the first cover plate, and the cathode is arranged on a side of the cathode back plate facing the anode back plate.

[0128] In an embodiment of the present invention, the anode may be an electrochemical anode, and the anode backplane may be a TFT (thin film transistor) array substrate. By controlling the opening and closing of the driving transistor in the pixel structure in the anode backplane, the current conduction path is controlled, thereby controlling the position of the metal ions to be printed in the electrolyte deposited on the cathode backplane, thereby ultimately forming a 3D pattern.

[0129] The 3D printing system described in the embodiment of the present invention can be an electrochemical metal 3D printing system. The 3D printing system described in the embodiment of the present invention is small in size, light in weight, portable, does not require laser and high-temperature processes, does not require powder processing, has low cost, and uses FPD (flat panel display) semiconductor technology to manufacture high-precision anode array substrates with small pixel size, large current, high printing accuracy and fast speed.

[0130] In the embodiment of the present invention, the power line may be electrically connected to the positive electrode of the electrochemical DC power supply, but the present invention is not limited thereto.

[0131] The anode backplane for 3D printing described in the embodiment of the present invention may include an array-distributed pixel structure disposed on a substrate. The pixel structure may be as follows: Figure 1 shown.

[0132] like Figure 1 When the embodiment of the pixel structure shown is in operation, under the control of the gate driving signal provided by the gate line G0, T2 is turned on to provide the data voltage on the data line D0 to the gate of T1, and T1 controls the connection or disconnection between the power line V1 and the anode 10 under the control of the potential of its gate; C1 is used to maintain the potential of the gate of T1.

[0133] In an embodiment of the present invention, the anode and the cathode can be arranged in the same closed cavity structure, and the closed cavity structure contains an electrolyte, which is a metal salt solution to be printed. For example, when the printed metal is copper, the electrolyte can be a copper sulfate solution, or other copper metal salt solution; and, in the closed cavity structure, the anode back plate and the cathode back plate (a cathode is provided on the cathode back plate) are arranged opposite to each other, and the electrolyte, the anode and the cathode constitute an electrochemical circuit; a voltage is applied between the anode and the cathode, and the copper ions move to the vicinity of the cathode and are deposited on the cathode back plate to form a 3D stereoscopic figure.

[0134] In the embodiment of the present invention, the pixel structure is not a pixel structure in a display module, but a pixel structure in an electrochemical anode array, but the present invention is not limited thereto.

[0135] exist Fig.17 In the figure, the power line labeled V0 is extended along the row direction. In actual operation, all pixel structures in the anode backplane are electrically connected to the same power line.

[0136] exist Fig.17 Among them, the pixel structure labeled P11 is the first row and first column, the pixel structure labeled P12 is the first row and second column, the pixel structure labeled P13 is the first row and third column, the pixel structure labeled P14 is the first row and fourth column, the pixel structure labeled P21 is the second row and first column, the pixel structure labeled P22 is the second row and second column, the pixel structure labeled P23 is the second row and third column, the pixel structure labeled P24 is the second row and fourth column, the pixel structure labeled P31 is the third row and first column, the pixel structure labeled P32 is the third row and second column, the pixel structure labeled P33 is the third row and third column, and the pixel structure labeled P34 is the third row and fourth column.

[0137] like Fig.18 As shown, the anode backplane includes multiple rows and columns of anodes 10 that are independent of each other. The pixel structure in the anode backplane controls the connection or disconnection between the power line and the anode, thereby controlling the position where the metal ions to be printed in the electrolyte are deposited on the second cover plate, ultimately forming a 3D pattern.

[0138] In an embodiment of the present invention, the cathode may be an electrochemical cathode, the cathode may be electrically connected to a negative electrode of an electrochemical DC power source, and the cathode may be made of a metal to be printed, but is not limited thereto.

[0139] Optionally, the printing box can be any three-dimensional structure such as a cylinder, a cube or a cuboid, and the printing box has side walls, an upper cover and a lower cover, and the upper cover and the lower cover can be removed to install a back plate, and the printing box can be made of insulating materials such as plastic and glass.

[0140] In the embodiment of the present invention, the first cover plate may be an upper cover plate, and the second cover plate may be a lower cover plate, but the present invention is not limited thereto.

[0141] like Fig. 20 As shown, the 3D printing system according to the embodiment of the present invention comprises a printing box 30; the printing box 30 contains electrolyte; the printing box 30 comprises a first cover plate 31 and a second cover plate 32 arranged opposite to each other;

[0142] The anode back plate 301 is disposed on a side opposite to the first cover plate 31 and the second cover plate 32, and the cathode back plate 302 is disposed on a side opposite to the second cover plate 32 and the first cover plate 31;

[0143] The electrolyte is a metal salt solution to be printed.

[0144] exist Fig. 20 In the illustrated embodiment, the first cover plate 31 is a lower cover plate, and the second cover plate 32 is an upper cover plate, but the present invention is not limited thereto.

[0145] In a specific implementation, the 3D printing system described in the embodiment of the present invention may further include a controller, a cathode backplane control circuit and a deposited metal height sensor, wherein:

[0146] The deposited metal height sensor is used to detect the height of the metal deposited on the cathode back plate and send the height to the controller;

[0147] The controller is used to move the cathode back plate according to the height control so that the shortest distance between the anode and the cathode is within a predetermined distance range.

[0148] During the electrochemical metal 3D printing process, the metal ions to be printed are continuously deposited on the cathode surface included in the cathode back plate, and the thickness becomes thicker and thicker. Therefore, the deposited metal height sensor is required to detect the height of the metal deposited on the cathode back plate, and the cathode back plate is moved according to the height control by the controller so that the shortest distance between the anode and the cathode is within a predetermined distance range.

[0149] Optionally, the controller may be a single chip microcomputer, but is not limited thereto.

[0150] In the embodiment of the present invention, the predetermined distance range may be selected according to actual conditions.

[0151] Optionally, the 3D printing system further includes a controller, a backplane movement control circuit, and a deposited metal height sensor;

[0152] The deposited metal height sensor is disposed on the inner side wall of the printing box, and the deposited metal height sensor is configured to detect the height of the metal deposited on the second cover plate and send the height to the controller;

[0153] The controller is electrically connected to the deposited metal height sensor and is configured to provide a movement control signal to the backplane movement control circuit according to the height;

[0154] The back panel movement control circuit is electrically connected to the second cover panel, and is configured to move the second cover panel accordingly under the control of the movement control signal.

[0155] In a specific implementation, the backplane movement control circuit includes a cathode backplane control circuit, a first suction cup and a second suction cup; the cathode backplane control circuit includes a transmission shaft, a stepper motor and a stepper motor control circuit; the anode backplane is connected to the first cover plate through the first suction cup, and the cathode backplane is connected to the transmission shaft through the second suction cup; the stepper motor is connected to the transmission shaft;

[0156] The controller is configured to provide a movement control signal to the stepper motor control circuit according to the height;

[0157] The stepper motor control circuit is electrically connected to the stepper motor, and is configured to control the stepper motor to correspondingly move the second cover plate via the transmission shaft under the control of the movement control signal.

[0158] like Fig. 20 As shown, the 3D printing system described in the embodiment of the present invention may further include a deposited metal height sensor 51, a first suction cup 33 and a second suction cup 34; the cathode backplane control circuit includes a transmission shaft 35, a stepper motor 36 and a stepper motor control circuit;

[0159] The deposited metal height sensor 51 is disposed on the inner side wall of the printing box, and is used to detect the height of the metal deposited on the cathode back plate 302, and send the height to the controller;

[0160] The anode back plate 301 is connected to the first cover plate 31 through the first suction cup 33, and the cathode back plate 302 is connected to the transmission shaft 35 through the second suction cup 34; the stepping motor 36 is connected to the transmission shaft 35;

[0161] The controller is electrically connected to the stepper motor control circuit and is used to provide a movement control signal to the stepper motor control circuit;

[0162] The stepper motor control circuit is electrically connected to the stepper motor 36 , and is used to control the stepper motor 36 to correspondingly move the anode back plate 302 via the transmission shaft 35 under the control of the movement control signal.

[0163] In specific implementation, the stepper motor 36 is connected to the second suction cup 34 through the transmission shaft 35, and a driving signal can be given to the stepper motor 36 through the stepper motor control circuit to control the cathode back plate 302 to move up and down, thereby controlling the cathode to move up and down.

[0164] According to Faraday's first law, F = I × t / 96487, F is the amount of charge, I is the current, and t is the electroplating time;

[0165] According to Faraday's second law, E = W × N / M, where E is the charge of the substance, W is the mass of the metal to be printed, N is the charge number of the metal ions to be printed, and M is the atomic weight of the metal to be printed;

[0166] From F=E, we get: I×t / 96487=W×N / M, so W=I×t×M / (96487×N);

[0167] W = B × Z × D, B is the area, Z is the thickness of the metal to be printed, and D is the density of the metal to be printed, and we get:

[0168] Z=I×t×M / (96487×N×B×D);

[0169] According to Faraday's law, Z = 2.448C×T×M / (N×D), C is the current density, and T is the printing time.

[0170] For example, the metal to be printed is copper, the current of one electrode is 10uA, the electroplating time is 1 minute, the atomic weight is 63.546, the charge number is 2, the electrode side length is 50um, and the electrode area is 2500um. 2 , the density of metal copper is 8.9g / cm3, so the printing thickness is 0.9um. The actual printing will also be affected by the printing efficiency, resulting in a difference between the printing thickness and the theoretical calculation.

[0171] In an embodiment of the present invention, the 3D printing system may further include a solution concentration monitoring sensor, a controller, a drive valve control circuit, a liquid inlet drive valve, a liquid outlet drive valve, a cooler and an agitator; a liquid inlet and a liquid outlet are provided on the side wall of the printing box;

[0172] The liquid inlet drive valve is arranged at the liquid inlet, and the liquid outlet drive valve is arranged at the liquid outlet;

[0173] The solution concentration monitoring sensor is disposed on a side wall of the printing box and is in direct contact with the electrolyte, and is configured to detect the concentration of the electrolyte and transmit the concentration to the controller;

[0174] The controller is electrically connected to the solution concentration monitoring sensor and is configured to provide a liquid outlet control signal or a liquid inlet control signal according to the concentration;

[0175] The drive valve control circuit is electrically connected to the liquid outlet drive valve and the liquid inlet drive valve respectively, and is configured to control the liquid outlet drive valve to control the liquid outlet to open or close according to the liquid outlet control signal, or to control the liquid inlet valve to open or close according to the liquid inlet control signal;

[0176] The agitator is arranged on the side wall of the printing box;

[0177] The stirrer is used to stir the electrolyte to make the concentration of the electrolyte uniform.

[0178] Optionally, the controller may be configured to first provide a liquid outlet control signal to the drive valve control circuit when the concentration of the electrolyte is less than a predetermined concentration, and to provide a liquid inlet control signal to the drive valve control circuit after a first predetermined time;

[0179] The driving valve control circuit is used to control the liquid outlet driving valve to open the liquid outlet to release the electrolyte after receiving the liquid outlet control signal, and control the liquid outlet driving valve to close the liquid outlet after a second predetermined time, and is also used to control the liquid inlet driving valve to open the liquid inlet to increase the electrolyte after receiving the liquid inlet control signal, and control the liquid inlet driving valve to close the liquid inlet after a third predetermined time;

[0180] The first predetermined time is greater than or equal to the second predetermined time.

[0181] In a specific implementation, the first predetermined time, the second predetermined time and the third predetermined time can be selected according to actual conditions. The first predetermined time and the second predetermined time can be selected according to the liquid outlet speed, and the third predetermined time can be selected according to the liquid inlet speed.

[0182] In the embodiment of the present invention, the predetermined concentration can be selected according to actual conditions.

[0183] Optionally, the controller may be configured to simultaneously provide a liquid outlet control signal and a liquid inlet control signal to the drive valve control circuit when the electrolyte concentration is less than a predetermined concentration;

[0184] The driving valve control circuit is used to control the liquid outlet driving valve so that the liquid outlet is opened to release the electrolyte after receiving the liquid outlet control signal, and to control the liquid inlet driving valve so that the liquid inlet is opened to increase the electrolyte after receiving the liquid inlet control signal, and to control the liquid outlet driving valve so that the liquid outlet is closed after a predetermined time, and to control the liquid inlet driving valve so that the liquid inlet is closed.

[0185] In a specific implementation, the solution concentration monitoring sensor monitors the concentration of the electrolyte in real time. If the concentration of the electrolyte drops to less than a predetermined concentration, the liquid outlet and the liquid inlet can be opened at the same time. The liquid outlet is controlled to open by the liquid outlet drive valve to discharge the electrolyte waste liquid. At the same time, the liquid inlet is controlled to open by the liquid inlet drive valve to replenish the electrolyte. The predetermined time can be selected according to actual conditions.

[0186] In the embodiment of the present invention, a liquid inlet and a liquid outlet are provided on the side wall of the printing box. The metal ions to be printed in the electrolyte are continuously deposited on the surface of the second conductive electrode included in the cathode back plate, and the electrolyte concentration will continue to decrease. Electrolyte is added to the printing box through the liquid inlet to replenish the metal ions to be printed, and the liquid outlet is used to discharge the electrolyte waste liquid. There are a liquid inlet drive valve and a liquid outlet drive valve near the liquid inlet and the liquid outlet, respectively. The liquid inlet drive valve controls the opening or closing of the liquid inlet, and the liquid outlet drive valve controls the opening or closing of the liquid outlet.

[0187] A solution concentration monitoring sensor is also provided on the side wall of the printing box. During the electrochemical metal 3D printing process, the metal ions to be printed in the electrolyte are continuously deposited on the surface of the second conductive electrode included in the cathode back plate, and the metal ions to be printed in the electrolyte will continue to decrease. The solution concentration monitoring sensor monitors the concentration of the electrolyte in real time. If the concentration of the electrolyte drops to less than a predetermined concentration, the outlet is first controlled to open by the outlet drive valve to discharge the low-concentration electrolyte (that is, the electrolyte waste), and then the inlet is controlled to open by the inlet drive valve to replenish the electrolyte; or, if the solution concentration monitoring sensor monitors the concentration of the electrolyte in real time, if the concentration of the electrolyte drops to less than a predetermined concentration, the outlet and the inlet can be opened at the same time, the outlet is controlled to open by the outlet drive valve to discharge the electrolyte waste, and the inlet is controlled to open by the inlet drive valve to replenish the electrolyte.

[0188] like Fig. 20 As shown, the 3D printing system may further include a solution concentration monitoring sensor 37, a controller, a drive valve control circuit, a liquid inlet drive valve 38 and a liquid outlet drive valve 39; a liquid inlet 41 and a liquid outlet 42 are provided on the side wall of the printing box;

[0189] The solution concentration monitoring sensor 37 is disposed on the inner side wall of the 3D printing system and is in direct contact with the electrolyte, and is used to detect the concentration of the electrolyte and transmit the concentration to the controller;

[0190] The controller is used for providing a liquid outlet control signal to the drive valve control circuit when the concentration is less than a predetermined concentration, and providing a liquid inlet control signal to the drive valve control circuit after a first predetermined time;

[0191] The driving valve control circuit is used to control the liquid outlet driving valve 38 to open the liquid outlet 42 to release the electrolyte after receiving the liquid outlet control signal, and control the liquid outlet driving valve 39 to close the liquid outlet 42 after a second predetermined time, and is also used to control the liquid inlet driving valve 38 to open the liquid inlet 41 to increase the electrolyte after receiving the liquid inlet control signal, and control the liquid inlet driving valve 38 to close the liquid inlet 41 after a third predetermined time;

[0192] The first predetermined time is greater than or equal to the second predetermined time.

[0193] exist Fig. 20 In the illustrated embodiment, the liquid inlet 41 is opened on the left side wall of the printing box 30, and the liquid outlet 42 is opened on the right side wall of the printing box 30;

[0194] The liquid inlet drive valve 38 is disposed on the left side wall of the printing box 30, and the liquid outlet drive valve 39 is disposed on the right side wall of the printing box 30;

[0195] The solution concentration monitoring sensor 37 is disposed on the right side wall of the printing box 30 .

[0196] In an embodiment of the present invention, the 3D printing system may further include a controller, a solution temperature monitoring sensor, and a solution cooling control circuit, wherein:

[0197] The solution concentration monitoring sensor is disposed on a side wall of the printing box and is in direct contact with the electrolyte, and the solution temperature monitoring sensor is electrically connected to the controller and configured to detect the temperature of the electrolyte and provide the temperature to the controller;

[0198] The controller is electrically connected to the solution cooling control circuit and is configured to provide a cooling control signal to the solution cooling control circuit when it is detected that the temperature is greater than a predetermined temperature;

[0199] The solution cooling control circuit is electrically connected to the cooler and is configured to control the cooler to cool the electrolyte when receiving the cooling control signal.

[0200] During specific implementation, the predetermined temperature can be selected according to actual conditions.

[0201] In an embodiment of the present invention, the 3D printing system may further include a controller, a solution temperature monitoring sensor, a solution cooling control circuit and a cooler. During the electrochemical metal 3D printing process, current passes through the electrolyte, the electrolyte temperature will rise, and the solution temperature monitoring sensor monitors the electrolyte temperature in real time. If the electrolyte temperature rises, the electrolyte temperature can be lowered by the cooler.

[0202] like Fig. 20 As shown, the 3D printing system may further include a controller, a solution temperature monitoring sensor 310, a solution cooling control circuit and a cooler 311, wherein:

[0203] The solution temperature monitoring sensor 310 is electrically connected to the controller, and is used to detect the temperature of the electrolyte and provide the temperature to the controller;

[0204] The controller is electrically connected to the solution cooling control circuit, and is used to provide a cooling control signal to the solution cooling control circuit when it is detected that the temperature is greater than a predetermined temperature;

[0205] The solution cooling control circuit is electrically connected to the cooler 311 and is used to control the cooler 311 to cool the electrolyte when receiving the cooling control signal.

[0206] exist Fig. 20 In the illustrated embodiment, the solution temperature monitoring sensor 310 is disposed on the left side wall of the printing box 30 , the solution temperature monitoring sensor 310 is in direct contact with the electrolyte, and the cooler 311 is disposed on the right side wall of the printing box 30 , but not limited thereto.

[0207] In specific implementation, Fig. 20 As shown, the 3D printing system according to the embodiment of the present invention may further include an agitator 312; the agitator 312 is disposed on the inner wall of the printing box 30;

[0208] The stirrer 312 is used to stir the electrolyte to make the concentration of the electrolyte uniform.

[0209] exist Fig. 20 In the illustrated embodiment, the stirrer 312 is disposed on the left side wall of the printing box 30 , and the stirrer 312 is disposed close to the anode back plate 301 , but the present invention is not limited thereto.

[0210] In the electrochemical metal 3D printing process, the metal to be printed is not deposited on the entire surface of the cathode included in the cathode back plate 302. Near the cathode where the metal to be printed is deposited, the metal ions to be printed in the electrolyte are reduced and the concentration of the electrolyte is reduced. Near the cathode where the metal to be printed is not deposited, the concentration of the metal ions to be printed in the electrolyte is higher, resulting in uneven electrolyte concentration. Stirring with the agitator 312 can make the electrolyte concentration uniform and increase the printing speed.

[0211] Optionally, all pixel structures included in the anode backplane are electrically connected to the same power line; the 3D printing system further includes a circuit board, a drive circuit, a current detection sensor, a controller, a voltage control circuit and an anode backplane drive circuit;

[0212] The circuit board is arranged on the side of the anode back plate, and the current detection sensor, controller, voltage control circuit and anode back plate driving circuit are arranged on the circuit board;

[0213] The driving circuit is electrically connected to the gate line in the anode back plate and the data line in the anode back plate respectively, and is configured to provide a gate driving signal to the gate line and provide a data voltage to the data line;

[0214] The current detection sensor is electrically connected to the power line and is configured to detect a current signal flowing through the power line and provide the current signal to the control;

[0215] The controller is electrically connected to the current detection sensor and is configured to provide a voltage regulation control signal to the voltage control circuit according to the current signal;

[0216] The voltage control circuit is electrically connected to the controller and the anode backplane driving circuit respectively, and is used to control the voltage provided by the power line to be increased through the anode backplane driving circuit after receiving the voltage regulation control signal.

[0217] Optionally, the circuit board may be a flexible circuit board, and the circuit board may be attached to the side of the anode back plate. The driving circuit may include a gate driving circuit for providing a gate driving signal and a data circuit for providing a data voltage, but is not limited thereto.

[0218] In a specific implementation, all pixel structures included in the anode backplane are electrically connected to the same power line. When the driving transistor in the pixel structure is turned on, the current flowing through the driving transistor also flows through the power line. Therefore, after determining the number of driving transistors that are turned on by providing gate driving signals and data voltages to each pixel structure, the current signal flowing through the power line is detected by a current detection sensor, and when the ratio of the current value of the current signal to the number is less than a predetermined current value, the controller provides a voltage adjustment control signal to the voltage control circuit; when receiving the voltage adjustment control signal, the voltage control circuit controls the voltage provided by the power line to be increased through the anode backplane driving circuit to increase the current flowing through the anode and thereby increase the printing speed.

[0219] like Fig. 20 As shown, the 3D printing system described in the embodiment of the present invention may also include a current detection sensor, a controller, a voltage control circuit and an anode backplane driving circuit 313;

[0220] The anode back plate driving circuit 313 is disposed on the left side wall of the printing box, but the present invention is not limited thereto.

[0221] In the embodiment of the present invention, Fig.21 As shown, the cathode back plate may include a cathode 43 disposed on a second substrate 40;

[0222] The cathode 43 may be a whole electrode, and the cathode 43 may be made of metal to be printed, but is not limited thereto.

[0223] In the embodiment of the present invention, the metal on the surface of the anode back plate is the metal to be printed, which means that: when manufacturing the anode back plate, after manufacturing the anode on the first substrate, an electrode insulating layer and a metal electrode layer are sequentially arranged on the surface of the anode away from the first substrate, and the metal electrode layer can be made of the metal to be printed; the metal electrode layer includes mutually independent metal electrodes;

[0224] The metal electrode is electrically connected to the anode through a via hole penetrating the electrode insulating layer.

[0225] In the embodiment of the present invention, the metal on the surface of the anode back plate is the metal to be printed, which means that: when manufacturing the anode back plate, after manufacturing the anode on the substrate, an electrode insulating layer and a metal electrode layer are sequentially arranged on the surface of the anode away from the substrate, and the metal electrode layer can be made of the metal to be printed; the metal electrode layer includes metal electrodes that are independent of each other;

[0226] The metal electrode is electrically connected to the anode through a via hole penetrating the electrode insulating layer.

[0227] In a specific implementation, the metal on the surface of the anode back plate can be the metal to be printed, or other inert metals. When the metal on the surface of the anode back plate is the metal to be printed, the anode (i.e., the anode) included in the anode back plate undergoes an oxidation reaction, and the metal to be printed is oxidized into metal ions to be printed and added to the electrolyte.

[0228] For example, when the metal to be printed is copper, the electrolyte is generally a mixed solution of CuSO4, H2SO4 and H2O. A thin copper layer (the thin copper layer is the cathode) is provided on the surface of the cathode back plate as a seed layer for the electrochemical reaction. The metal on the surface of the anode back plate is also metallic copper as a supplement to the copper ions in the electrolyte. The electrochemical reactions of the cathode and the anode are as follows:

[0229] Oxidation reaction occurs at the anode: Cu-2e-=Cu 2+；

[0230] Reduction reaction occurs at the cathode: Cu 2+ +2e-=Cu.

[0231] The 3D printing system described in the embodiment of the present invention includes a main structure, an auxiliary structure, a control system, a controller and a host computer;

[0232] The main structure includes an anode back plate, a cathode back plate and an electrolyte; the auxiliary structure includes a stepping motor, a deposited metal height sensor, a liquid inlet drive valve, a liquid outlet drive valve, a solution concentration monitoring sensor, a solution temperature monitoring sensor, a cooler, a stirrer and a current detection sensor;

[0233] The control system includes a stepper motor control circuit, a drive valve control circuit, a solution cooling control circuit, an anode back plate drive circuit, a voltage control circuit and an anode back plate drive circuit.

[0234] like Fig. 22 As shown, the cathode back plate is labeled 302, the anode back plate is labeled 301, and the electrolyte is labeled 50. The anode back plate 301, the cathode back plate 302 and the electrolyte 50 constitute the main structure of the 3D printing system described in the embodiment of the present invention; the stepper motor 36, the deposited metal height sensor 51, the liquid inlet drive valve 38, the liquid outlet drive valve 39, the solution concentration monitoring sensor 37, the solution temperature monitoring sensor 310, the cooler 311, etc. are the auxiliary structures of the 3D printing system described in the embodiment of the present invention; the stepper motor control circuit 52, the drive valve control circuit 53, the solution cooling control circuit 54, the anode back plate drive circuit 313, the voltage control circuit 55 and the current detection sensor 56 constitute the control system of the 3D printing system described in the embodiment of the present invention; all the control circuits are controlled by the controller 60 and interact through the host computer 61.

[0235] In the embodiment of the present invention, the controller 60 may be a single chip microcomputer, but is not limited thereto.

[0236] When the 3D printing system according to the embodiment of the present invention is working,

[0237] The deposited metal height sensor 51 detects the height change of the metal to be printed deposited on the cathode back plate 302 and feeds back to the controller 60, the controller 60 controls the stepper motor control circuit 52, the stepper motor control circuit 52 controls the stepper motor, and the stepper motor 52 controls the movement of the cathode back plate 302;

[0238] The solution concentration monitoring sensor 37 detects that the concentration of the electrolyte 50 decreases, and feeds back to the controller 60. The controller 60 controls the drive valve control circuit 53. The drive valve control circuit 53 controls the liquid outlet drive valve 38 and the liquid inlet drive valve 39. The liquid outlet of the liquid outlet drive valve 38 is opened to discharge the electrolyte waste liquid. After that, the liquid outlet of the liquid outlet drive valve 38 is closed, and the liquid inlet drive valve 39 controls the liquid inlet to open to increase the electrolyte.

[0239] The solution temperature monitoring sensor 310 detects the temperature increase of the electrolyte 50 and feeds back to the controller 60, the controller 30 controls the solution cooling control circuit 54, the solution cooling control circuit 54 controls the cooler 311, and the cooler 311 cools down;

[0240] The controller 60 controls the anode backplane driving circuit 313, the anode backplane driving circuit 313 controls the anode backplane 301, the current detection sensor 56 detects the current change and feeds back to the controller 60, the controller 60 controls the voltage control circuit 55, the voltage control circuit 55 controls the anode backplane driving circuit 313 to change the voltage provided by the power line (the voltage provided by the power line is the driving voltage).

[0241] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect", "couple" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0242] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0243] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0244] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A 3D printing system, characterized in that: It comprises a printing box and an anode back plate for 3D printing; the printing box contains electrolyte; the printing box comprises a first cover plate and a second cover plate arranged opposite to each other; The anode back plate is arranged on the side of the first cover plate facing the second cover plate, so that each anode of the anode back plate faces the electrolyte; A cathode for printing is arranged on one side of the second cover plate facing the first cover plate; The anode backplane for 3D printing includes a substrate substrate and an array-distributed pixel structure disposed on the substrate substrate; The 3D printing system further includes a cathode back plate; the anode back plate and the cathode back plate are arranged opposite to each other; The cathode back plate is disposed on the side of the second cover plate facing the first cover plate, and the cathode is disposed on the side of the cathode back plate facing the anode back plate; All pixel structures included in the anode backplane are electrically connected to the same power line; the 3D printing system also includes a circuit board, a drive circuit, a current detection sensor, a controller, a voltage control circuit and an anode backplane drive circuit; The circuit board is arranged on the side of the anode back plate, and the current detection sensor, the voltage control circuit and the anode back plate driving circuit are arranged on the circuit board; The driving circuit is electrically connected to the gate line in the anode back plate and the data line in the anode back plate respectively, and is configured to provide a gate driving signal to the gate line and provide a data voltage to the data line; The current detection sensor is electrically connected to the power line and is configured to detect a current signal flowing through the power line and provide the current signal to the controller; The controller is electrically connected to the current detection sensor and is configured to provide a voltage regulation control signal to the voltage control circuit according to the current signal; The voltage control circuit is electrically connected to the controller and the anode backplane driving circuit respectively, and is used to control the voltage provided by the power line to be increased through the anode backplane driving circuit after receiving the voltage regulation control signal.

2. The 3D printing system according to claim 1, characterized in that: Also included are backplane movement control circuitry and a deposited metal height sensor; The deposited metal height sensor is disposed on the inner side wall of the printing box, and the deposited metal height sensor is configured to detect the height of the metal deposited on the second cover plate and send the height to the controller; The controller is electrically connected to the deposited metal height sensor and is configured to provide a movement control signal to the backplane movement control circuit according to the height; The back panel movement control circuit is connected to the second cover panel and is configured to move the second cover panel accordingly under the control of the movement control signal.

3. The 3D printing system according to claim 2, characterized in that: The back plate movement control circuit includes a cathode back plate control circuit, a first suction cup and a second suction cup; the cathode back plate control circuit includes a transmission shaft, a stepper motor and a stepper motor control circuit; the anode back plate is connected to the first cover plate through the first suction cup, and the cathode back plate is connected to the transmission shaft through the second suction cup; the stepper motor is connected to the transmission shaft; The controller is configured to provide a movement control signal to the stepper motor control circuit according to the height; The stepper motor control circuit is electrically connected to the stepper motor, and is configured to control the stepper motor to correspondingly move the second cover plate via the transmission shaft under the control of the movement control signal.

4. The 3D printing system according to claim 1, characterized in that: It also includes a solution concentration monitoring sensor, a drive valve control circuit, a liquid inlet drive valve, a liquid outlet drive valve and a cooler; the side wall of the printing box is provided with a liquid inlet and a liquid outlet; The liquid inlet drive valve is arranged at the liquid inlet, and the liquid outlet drive valve is arranged at the liquid outlet; The solution concentration monitoring sensor is disposed on a side wall of the printing box and is in direct contact with the electrolyte, and is configured to detect the concentration of the electrolyte and transmit the concentration to the controller; The controller is electrically connected to the solution concentration monitoring sensor and is configured to provide a liquid outlet control signal or a liquid inlet control signal according to the concentration; The drive valve control circuit is electrically connected to the liquid outlet drive valve and the liquid inlet drive valve, respectively, and is configured to control the liquid outlet drive valve to control the liquid outlet to open or close according to the liquid outlet control signal, or to control the liquid inlet drive valve to open or close according to the liquid inlet control signal.

5. The 3D printing system according to claim 1, characterized in that: Also includes a blender; The agitator is disposed on the side wall of the printing box, and the agitator is in direct contact with the electrolyte; The stirrer is used to stir the electrolyte to make the concentration of the electrolyte uniform.

6. The 3D printing system according to claim 4, characterized in that: It also includes a solution temperature monitoring sensor and a solution cooling control circuit, wherein: The solution temperature monitoring sensor is disposed on a side wall of the printing box and is in direct contact with the electrolyte, the solution temperature monitoring sensor is electrically connected to the controller, and is configured to detect the temperature of the electrolyte and provide the temperature to the controller; The controller is electrically connected to the solution cooling control circuit and is configured to provide a cooling control signal to the solution cooling control circuit when it is detected that the temperature is greater than a predetermined temperature; The solution cooling control circuit is electrically connected to the cooler and is configured to control the cooler to cool the electrolyte when receiving the cooling control signal.

7. The 3D printing system according to claim 1, characterized in that: The pixel structure includes a power line, gate lines and data lines staggered in rows and columns, an anode of the anode backplane located on the substrate, a driving transistor electrically connected to the anode, and a switching transistor electrically connected to the driving transistor; The gate line extends along the row direction of the array and is located on a side of the pixel structure close to the pixel structure of the next row; the data line extends along the column direction of the array, and the power line includes a power line extending along the column direction; the data line and the power line extending along the column direction are located on opposite sides of the pixel structure; In a pixel area where the pixel structure is located, the driving transistor and the switching transistor are sequentially arranged along a column direction; The gate of the driving transistor extends from the data line to the power line in the row direction, and the gate of the driving transistor extends from the gate line of the pixel structure in the previous row to the switch transistor in the column direction; The width direction of the channel in the active layer pattern of the driving transistor is the row direction, and the channel extends from the data line located on one side of the pixel structure to the power line located on the other side of the pixel structure in the row direction; The source electrode of the driving transistor and the drain electrode of the driving transistor extend in the row direction respectively, and the source electrode of the driving transistor and the drain electrode of the driving transistor are arranged in sequence in the column direction; the source electrode of the driving transistor and the drain electrode of the driving transistor are arranged between the active layer pattern of the driving transistor and the substrate, or the source electrode of the driving transistor and the drain electrode of the driving transistor are arranged on a side of the active layer pattern away from the substrate; The gate of the driving transistor is connected to the drain of the switching transistor, the source of the driving transistor is electrically connected to the power line, and the drain of the driving transistor is electrically connected to the anode; The source of the switch transistor is electrically connected to the data line, and the gate of the switch transistor is electrically connected to the gate line.

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