Self-diagnostic methods for inspection devices and inspection devices

Abstract

The self-diagnostic method of the inspection device (80) disclosed herein includes a configuration step, an irradiation step, a light reception step, and a light quantity determination step. The configuration step involves moving a holding part (400) that holds the outer periphery of the overlapping substrate (T) and is provided with an attenuation member (720) for attenuating light, thereby positioning the attenuation member between an illumination unit (610, 620) that irradiates light onto the overlapping substrate and an imaging unit (51, 520) that captures images of the overlapping substrate. The irradiation step involves irradiating light from the illumination unit at a set light quantity after the configuration step. The light reception step involves receiving light emitted from the illumination unit and transmitted through the attenuation member using the imaging unit after the irradiation step. The light quantity determination step involves determining an abnormality in the light quantity emitted from the illumination unit based on the amount of light received by the imaging unit after the light reception step.

Description

Technical Field

[0001] This disclosure relates to a self-diagnostic method for an inspection device and an inspection device. Background Technology

[0002] A bonding system is known, comprising a bonding apparatus for forming an overlapping substrate by bonding substrates such as semiconductor wafers together, and an inspection apparatus for inspecting the overlapping substrate formed by the bonding apparatus (see Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2011-187716 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] This disclosure provides a technique that can easily maintain the measurement accuracy of the inspection device.

[0008] Solution for solving the problem

[0009] One aspect of the self-diagnostic method of the inspection apparatus disclosed herein is a method for inspecting an overlapping substrate formed by bonding a first substrate and a second substrate. The self-diagnostic method includes a configuration step, an illumination step, a light reception step, and a step for determining an abnormality in the light intensity. The configuration step involves moving a holding portion that holds the outer periphery of the overlapping substrate and is provided with a diagnostic portion having an attenuation member that attenuates light. This movement positions the attenuation member between an illumination portion and an imaging portion. The illumination portion is positioned above and below the holding portion to illuminate the overlapping substrate held thereon. The imaging portion is positioned above and below the holding portion, facing the illumination portion, to capture images of the overlapping substrate held thereon. The illumination step involves illuminating light from the illumination portion at a set intensity after the configuration step. The light reception step involves receiving light emitted from the illumination portion and transmitted through the attenuation member using the imaging portion after the illumination step. The process for determining abnormal light intensity occurs after the light receiving process. It determines the abnormality of the light intensity emitted from the illumination unit based on the amount of light received by the camera unit.

[0010] The effects of the invention

[0011] According to this disclosure, the measurement accuracy of the inspection device can be easily maintained. Attached Figure Description

[0012] Figure 1 This is a schematic diagram showing the structure of the joining system involved in the implementation method.

[0013] Figure 2 This is a schematic diagram showing the state of the first substrate and the second substrate before they are joined together, according to the embodiment.

[0014] Figure 3 This is a schematic diagram showing the structure of the coupling device involved in the embodiment.

[0015] Figure 4 This is a schematic diagram showing the structure of the inspection device involved in the embodiment.

[0016] Figure 5 This is a schematic diagram showing the structure of the holding part of the inspection device according to the embodiment.

[0017] Figure 6 This is a diagram illustrating an example of a photographic method for measuring markers.

[0018] Figure 7 This is a diagram illustrating an example of a measurement marker.

[0019] Figure 8 This is a diagram showing the structure of the attenuation member involved in the implementation method.

[0020] Figure 9 This is a diagram showing an example of a calibration mark formed on an attenuation component.

[0021] Figure 10 This is a block diagram illustrating the structure of the control device involved in the implementation method.

[0022] Figure 11 This is a flowchart illustrating an example of the process performed by the bonding system before the overlapping substrate is formed by the bonding device.

[0023] Figure 12 This is a flowchart illustrating an example of the process of light quantity inspection.

[0024] Figure 13 This is a flowchart illustrating an example of the optical axis inspection process. Detailed Implementation

[0025] The self-diagnostic method and the manner of the inspection apparatus for implementing the present disclosure will now be described in detail with reference to the accompanying drawings (hereinafter referred to as "Employment"). However, the self-diagnostic method and the inspection apparatus of the present disclosure are not limited by these embodiments. Furthermore, the various embodiments can be appropriately combined without contradicting the processing content. In the following embodiments, the same reference numerals are used to refer to the same parts, and repeated descriptions are omitted.

[0026] Furthermore, in the embodiments shown below, expressions such as "fixed," "orthogonal," "perpendicular," or "parallel" are sometimes used, but these expressions do not need to be strictly "fixed," "orthogonal," "perpendicular," or "parallel." That is, each of the above expressions is set to allow for deviations in manufacturing precision, setting precision, etc.

[0027] Furthermore, in the accompanying figures provided below, for ease of understanding, an orthogonal coordinate system is sometimes shown, defining the X-axis, Y-axis, and Z-axis directions as mutually orthogonal, with the positive Z-axis direction set as the vertically upward direction. Additionally, the direction of rotation about the vertical axis is sometimes referred to as the θ direction.

[0028] <Structure of the Joining System>

[0029] First, refer to Figure 1 and Figure 2 The structure of the joining system involved in the implementation method will be explained. Figure 1 This is a schematic diagram illustrating the structure of the joining system according to the embodiment. Additionally, Figure 2 This is a schematic diagram showing the state of the first substrate and the second substrate before they are joined together, according to the embodiment.

[0030] Figure 1 The bonding system 1 shown forms an overlapping substrate T by bonding a first substrate W1 and a second substrate W2 (see reference). Figure 2 ).

[0031] The first substrate W1 and the second substrate W2 are substrates on which multiple electronic circuits are formed, for example, on a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer. The diameters of the first substrate W1 and the second substrate W2 are approximately the same. Furthermore, one of the first substrate W1 and the second substrate W2 may be, for example, a substrate on which no electronic circuits are formed.

[0032] Below, as Figure 2 As shown, the side of the first substrate W1 that is joined to the second substrate W2 is designated as "joint surface W1j", and the side opposite to the joint surface W1j is designated as "non-joint surface W1n". Similarly, the side of the second substrate W2 that is joined to the first substrate W1 is designated as "joint surface W2j", and the side opposite to the joint surface W2j is designated as "non-joint surface W2n".

[0033] like Figure 1 As shown, the joining system 1 includes an inlet / outlet station 2, a processing station 3, and an inspection station 4. The inlet / outlet station 2 is located on the negative X-axis side of the processing station 3 and is integrated with the processing station 3. The inspection station 4 is located on the positive X-axis side of the processing station 3 and is integrated with the processing station 3.

[0034] The loading / unloading station 2 includes a loading platform 10 and a transport area 20. The loading platform 10 has multiple loading plates 11. Each loading plate 11 holds boxes C1 to C4, which hold multiple (e.g., 25) substrates in a horizontal position. Box C1 can hold multiple first substrates W1, box C2 can hold multiple second substrates W2, and box C3 can hold multiple overlapping substrates T. Box C4 is, for example, a box for recycling defective substrates. Furthermore, the number of boxes C1 to C4 placed on the loading plate 11 is not limited to that shown in the figure.

[0035] The transfer area 20 is arranged adjacent to the positive X-axis side of the mounting table 10. A transfer path 21 extending along the Y-axis and a transfer device 22 capable of moving along the transfer path 21 are provided in this transfer area 20. The transfer device 22 can move not only along the Y-axis but also along the X-axis and can rotate about the Z-axis. The transfer device 22 transfers the first substrate W1, the second substrate W2, and the overlapping substrate T between the boxes C1 to C4 placed on the mounting plate 11 and the third processing block G3 of the processing station 3 (described later).

[0036] For example, three processing blocks G1, G2, and G3 are set in processing station 3. The first processing block G1 is located on the back side of processing station 3. Figure 1 (On the positive Y-axis side). Additionally, the second processing block G2 is positioned on the front side of processing station 3 (on the positive Y-axis side). Figure 1 The third processing block G3 is located on the side of the transfer in / out station 2 of the processing station 3 (on the negative Y-axis side). Figure 1 (the negative X-axis side).

[0037] A surface modification device 30 is provided in the first processing block G1 for modifying the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2. The surface modification device 30 modifies the bonding surfaces W1j and W2j by cutting the SiO2 bonds in the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2 to make them single-bonded SiO, so that they are easy to hydrophilize later.

[0038] Specifically, in the surface modification apparatus 30, oxygen or nitrogen, used as a treatment gas, is excited under a reduced pressure atmosphere to plasmaize and ionize it. Then, the bonding surfaces W1j and W2j are modified by irradiating the oxygen or nitrogen ions onto the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2 with plasma treatment.

[0039] Furthermore, a surface hydrophilization device 40 is disposed in the first processing block G1. The surface hydrophilization device 40, for example, uses pure water to hydrophilize the bonding surfaces W1j and W2j of the first substrate W1 and the second substrate W2, and cleans the bonding surfaces W1j and W2j. Specifically, the surface hydrophilization device 40 supplies pure water to the first substrate W1 or the second substrate W2 while rotating the first substrate W1 or the second substrate W2 held by the rotating chuck. As a result, the pure water supplied to the first substrate W1 or the second substrate W2 diffuses on the bonding surfaces W1j and W2j of the first substrate W1 or the second substrate W2, thereby hydrophilizing the bonding surfaces W1j and W2j.

[0040] Here, an example is shown in which the surface modification device 30 and the surface hydrophilization device 40 are arranged in a horizontal manner, but the surface hydrophilization device 40 may also be stacked on top of the surface modification device 30.

[0041] A bonding device 41 is disposed in the second processing block G2. The bonding device 41 bonds the hydrophilized first substrate W1 and the second substrate W2 by intermolecular forces. The structure of the bonding device 41 will be described later.

[0042] A transport region 60 is formed in the area enclosed by the first processing block G1, the second processing block G2, and the third processing block G3. A transport device 61 is disposed in the transport region 60. The transport device 61 has a transport arm that is movable, for example, in the vertical direction, in the horizontal direction, and about the vertical axis. The transport device 61 moves within the transport region 60 to transport the first substrate W1, the second substrate W2, and the overlapping substrate T to designated devices in the first processing block G1, the second processing block G2, and the third processing block G3 adjacent to the transport region 60.

[0043] An inspection device 80 is installed at inspection station 4. The inspection device 80 inspects the overlapping substrate T formed by the bonding device 41.

[0044] In addition, the engagement system 1 includes a control device 70. The control device 70 controls the operation of the engagement system 1. The structure of the control device 70 will be described later.

[0045] <Structure of the Joining Device>

[0046] Next, refer to Figure 3 To explain the structure of the coupling device 41. Figure 3 This is a schematic diagram showing the structure of the coupling device 41 according to the embodiment.

[0047] like Figure 3 As shown, the engagement device 41 includes a first holding part 140, a second holding part 141, and an impactor 190.

[0048] The first holding portion 140 has a main body portion 170. The main body portion 170 is supported by a support member 180. A through hole 176 is formed in the support member 180 and the main body portion 170, extending vertically through both. The position of the through hole 176 corresponds to the center of the first substrate W1 held in the first holding portion 140. A pressing pin 191 of an impactor 190 passes through the through hole 176.

[0049] The impactor 190 is disposed on the upper surface of the support member 180 and includes a pressing pin 191, an actuator part 192, and a linear motion mechanism 193. The pressing pin 191 is a cylindrical member extending in the vertical direction and is supported by the actuator part 192.

[0050] The actuator section 192 generates a fixed pressure in a fixed direction (here, vertically downward) by air supplied from an electro-pneumatic regulator (not shown). The actuator section 192 can control the pressing load applied to the center of the first substrate W1 by the air supplied from the electro-pneumatic regulator, allowing the pressing pin 191 to abut against the center of the first substrate W1. In addition, the front end of the pressing pin 191 passes through the through hole 176 by air from the electro-pneumatic regulator and can move freely up and down in the vertical direction.

[0051] The actuator section 192 is supported by the linear motion mechanism 193. The linear motion mechanism 193 moves the actuator section 192 in the vertical direction by, for example, a drive section with a built-in motor.

[0052] The impactor 190 controls the movement of the actuator section 192 via the linear motion mechanism 193, thereby controlling the pressing load of the pressing pin 191 on the first substrate W1 via the actuator section 192. As a result, the impactor 190 presses and holds the center of the first substrate W1 held in the first holding section 140 to bring the first substrate W1 into contact with the second substrate W2.

[0053] A plurality of pins 171 are provided on the lower surface of the main body 170, which contact the upper surface (non-joining surface W1n) of the first substrate W1. The plurality of pins 171 have, for example, a diameter of 0.1 mm to 1 mm and a height of tens to hundreds of μm. The plurality of pins 171 are arranged evenly at intervals of 2 mm, for example.

[0054] The first holding portion 140 has multiple adsorption portions for adsorbing the first substrate W1 in a portion of the area where the multiple pins 171 are provided. Specifically, the lower surface of the main body portion 170 of the first holding portion 140 has multiple outer adsorption portions 301 and multiple inner adsorption portions 302 for adsorbing the first substrate W1 by evacuating the vacuum. The multiple outer adsorption portions 301 and multiple inner adsorption portions 302 have arc-shaped adsorption areas when viewed from above. The multiple outer adsorption portions 301 and multiple inner adsorption portions 302 have the same height as the pins 171.

[0055] Multiple outer adsorption portions 301 are disposed on the outer periphery of the main body portion 170. The multiple outer adsorption portions 301 are connected to an attraction device (not shown) such as a vacuum pump, and adsorption is performed on the outer periphery of the first substrate W1 by evacuation.

[0056] Multiple inner adsorption portions 302 are arranged circumferentially on the radially inner side of the main body portion 170, closer to the multiple outer adsorption portions 301. The multiple inner adsorption portions 302 are connected to an attraction device (not shown) such as a vacuum pump, and adsorption is performed on the region between the outer periphery and the center of the first substrate W1 by evacuation.

[0057] The second holding portion 141 will be described. The second holding portion 141 has a main body portion 200, which has a diameter that is the same as or larger than that of the second substrate W2. Here, the second holding portion 141 with a diameter larger than that of the second substrate W2 is shown. The upper surface of the main body portion 200 is an opposing surface facing the lower surface (non-jointing surface W2n) of the second substrate W2.

[0058] A plurality of pins 201 are provided on the upper surface of the main body 200, which contact the lower surface (non-joining surface Wn2) of the second substrate W2. The plurality of pins 201 have, for example, a diameter of 0.1 mm to 1 mm and a height of tens to hundreds of μm. The plurality of pins 201 are arranged evenly at intervals of 2 mm, for example.

[0059] Furthermore, on the upper surface of the main body 200, a lower side rib 202 is provided in a ring shape on the outer side of the plurality of pins 201. The lower side rib 202 is formed in a ring shape and supports the outer periphery of the second substrate W2 throughout the entire circumference.

[0060] In addition, the main body 200 has a plurality of lower suction ports 203. The plurality of lower suction ports 203 are provided in the adsorption area surrounded by the lower ribs 202. The plurality of lower suction ports 203 are connected to a suction device (not shown) such as a vacuum pump via suction tubes (not shown).

[0061] The second holding part 141 depressurizes the adsorption region by drawing a vacuum from the multiple lower suction ports 203 to the adsorption region surrounded by the lower ribs 202. As a result, the second substrate W2 placed in the adsorption region is adsorbed and held by the second holding part 141.

[0062] Since the lower rib 202 supports the outer periphery of the lower surface of the second substrate W2 throughout its entire circumference, a vacuum can be appropriately applied up to the outer periphery of the second substrate W2. This allows the entire surface of the second substrate W2 to be held in place. Furthermore, since the lower surface of the second substrate W2 is supported by multiple pins 201, the second substrate W2 can be easily detached from the second holding portion 141 when the vacuum is released.

[0063] Furthermore, although the diagram is omitted here, the coupling device 41 is... Figure 3 The front sections of the first holding section 140, the second holding section 141, etc., shown include a conveying section, a flipping mechanism, and a position adjustment mechanism. The conveying section temporarily holds the first substrate W1, the second substrate W2, and the overlapping substrate T. The position adjustment mechanism adjusts the horizontal orientation of the first substrate W1 and the second substrate W2. The flipping mechanism flips the surface and back surface of the first substrate W1.

[0064] <Structure of the inspection device>

[0065] Next, refer to Figure 4 and Figure 5 To explain the structure of the inspection device. Figure 4 This is a schematic diagram illustrating the structure of the inspection device according to the embodiment. Additionally, Figure 5 This is a schematic diagram showing the structure of the holding part of the inspection device according to the embodiment. Furthermore, Figure 4 This is a schematic diagram showing the inspection device when viewed from the side. Figure 5 This is a schematic diagram showing the holding part of the inspection device viewed from above.

[0066] like Figure 4 As shown, the inspection device 80 includes a holding unit 400, a camera unit 500, and a lighting unit 600. Additionally, as... Figure 5 As shown, the inspection device 80 includes a diagnostic unit 700.

[0067] like Figure 4 and Figure 5 As shown, the holding part 400 holds the overlapping substrate T horizontally. The holding part 400 includes a main body 410 and a plurality of support members 420.

[0068] The main body 410 is a flat frame-shaped component with an opening 411 having a diameter larger than that of the overlapping substrate T. The main body 410 is connected to the moving mechanism 440 and can move in the horizontal direction (X-axis and Y-axis directions) and rotate about the vertical axis via the moving mechanism 440.

[0069] Multiple support members 420 are provided on the main body 410 such that they extend toward the center of the opening 411. The outer periphery of the overlapping substrate T is supported by the front ends of the multiple support members 420. The front ends of the multiple support members 420 are connected to a suction device 480 such as a vacuum pump via suction tubes 460, and the lower outer periphery of the overlapping substrate T is adsorbed by evacuation.

[0070] The camera unit 500 includes a macro camera unit 510, a microscope camera unit 520, a fixed unit 530, and a lifting mechanism 540.

[0071] The macro imaging unit 510 and the microscopic imaging unit 520 are disposed above the holding unit 400. The macro imaging unit 510 includes a camera lens 511 for macro imaging and imaging elements 512 such as a CCD image sensor and a CMOS image sensor. The microscopic imaging unit 520 includes a camera lens 521 for microscopic imaging and imaging elements 522 such as a CCD image sensor and a CMOS image sensor. The magnification of the camera lens 511 in the macro imaging unit 510 is, for example, 10x. The magnification of the camera lens 521 in the microscopic imaging unit 520 is, for example, 50x.

[0072] The macro imaging unit 510 and the microscope imaging unit 520 are fixed to the fixing unit 530 with the camera lenses 511 and 521 facing vertically downwards. The fixing unit 530 is connected to the lifting mechanism 540 and moves (lifts) vertically via the lifting mechanism 540. The imaging unit 500 can adjust the distance between the macro imaging unit 510 and the microscope imaging unit 520 and the superimposed substrate T by lifting the fixing unit 530 using the lifting mechanism 540.

[0073] The lighting unit 600 includes a macro lighting section 610, a microscopic lighting section 620, a fixing section 630, and a lifting mechanism 640.

[0074] The macro illumination unit 610 and the microscopic illumination unit 620 are disposed below the holding unit 400. Specifically, the macro illumination unit 610 is disposed at a position facing the macro imaging unit 510, separated from the superimposed substrate T held in the holding unit 400. Similarly, the microscopic illumination unit 620 is disposed at a position facing the microscopic imaging unit 520, separated from the superimposed substrate T held in the holding unit 400.

[0075] The macro illumination unit 610 includes a light source 611 and a focusing unit 612. The light source 611 illuminates, for example, near-infrared light in the range of 1000–1200 nm. The focusing unit 612 is, for example, a focusing lens, used to converge the light emitted from the light source 611 to a single point. The microscopic illumination unit 620 has the same structure as the macro illumination unit 610. That is, the microscopic illumination unit 620 includes a light source 621 and a focusing unit 622, and these structures are the same as those of the light source 611 and focusing unit 612 in the macro illumination unit 610.

[0076] Furthermore, light sources 611 and 621 can also be disposed outside the macro illumination unit 610 and the microscopic illumination unit 620. In this case, light sources 611 and 621 can also supply light to the interior of the macro illumination unit 610 and the microscopic illumination unit 620 via optical fibers or the like.

[0077] The macro illumination unit 610 and the micro illumination unit 620 are fixed to the fixing unit 630 with their optical axes oriented vertically. The fixing unit 630 is connected to the lifting mechanism 640 and moves (lifts) vertically via the lifting mechanism 640. The illumination unit 600 can adjust the distance between the macro illumination unit 610 and the micro illumination unit 620 and the superimposed substrate T by lifting the fixing unit 630 using the lifting mechanism 640.

[0078] The inspection device 80 uses a microscope imaging unit 520 and a microscope illumination unit 620 to photograph the measurement marks formed on the first substrate W1 and the second substrate W2, respectively. Figure 6 This is a diagram illustrating an example of a photographic method for measuring markers. Additionally, Figure 7 This diagram shows an example of a measurement mark. Furthermore, the macro imaging unit 510 and the macro illumination unit 610 are used in the process of determining the location of the measurement mark, but this will be described later.

[0079] like Figure 6 As shown, the microscopic illumination unit 620 is fixed to the fixing unit 630 such that the optical axis Ax of the light emitted from the light source 621 is oriented in the vertical direction (see reference). Figure 4 Furthermore, the microscope imaging unit 520 is fixed to the fixing part 530 with its optical axis Ax passing through the center of the camera lens 521 and intersecting the camera lens 521 and the imaging element 522 perpendicularly (see reference). Figure 4 Furthermore, here we illustrate a case where the camera unit 500 is arranged above the overlapping substrate T and the lighting unit 600 is arranged below the overlapping substrate T, but the lighting unit 600 can be arranged above the overlapping substrate T and the camera unit 500 can be arranged below the overlapping substrate T.

[0080] The distance between the microscope imaging unit 520 and the microscope illumination unit 620 is set, for example, by manually adjusting the distance beforehand so that the focal point of the camera lens 521 coincides with the focal point of the condenser unit 622. The inspection device 80 raises and lowers the microscope imaging unit 520 and the microscope illumination unit 620 by linking the lifting mechanisms 540 and 640 to ensure that the focal point of the camera lens 521 coincides with the focal point of the condenser unit 622.

[0081] The inspection device 80 uses a fixing part 530 and a lifting mechanism 540 to raise and lower the microscope imaging unit 520 and the microscope illumination unit 620 as a single unit, so that the focal point of the camera lens 521 and the light-gathering part 622 is located on the measurement marks M1 and M2 formed on the superimposed substrate T. Furthermore, the inspection device 80 captures images of the measurement marks M1 and M2. Specifically, light emitted vertically upward from the microscope illumination unit 620 reaches the imaging element 522 of the microscope imaging unit 520 via the second substrate W2 and the first substrate W1. That is, the microscope imaging unit 520 captures images of the measurement marks M1 and M2 using light transmitted through the superimposed substrate T. The image data captured by the microscope imaging unit 520 is output to the control device 70.

[0082] like Figure 7 As shown, the image data includes images of measurement mark M1 formed on the first substrate W1 and measurement mark M2 formed on the second substrate W2. The control device 70 performs image recognition processing such as edge detection on the image data to obtain measurement results such as the coordinates of the centroid points G1 and G2 of the measurement marks M1 and M2 and the offset of the centroid points G1 and G2, and checks the bonding state of the overlapping substrates T based on the obtained measurement results.

[0083] Furthermore, when the amount of light emitted from the light source 621 of the microscope illumination unit 620 changes, the thickness of the outlines of measurement marks M1 and M2 contained in the image data may change, and the position of the edges detected by edge detection may also change. In this case, the measurement results such as the coordinates of the centroids G1 and G2, and the offset of the centroids G1 and G2 may deviate. Therefore, in order to maintain the measurement accuracy of the inspection device 80, it is desirable that the amount of light emitted from the light source 621 of the microscope illumination unit 620 is always constant.

[0084] However, the light source 621 of the microscope illumination unit 620 gradually deteriorates with use, and as a result, the actual amount of light obtained is lower than the set amount of light. That is, the amount of light from the light source 621 of the microscope illumination unit 620 changes (decreases) with use.

[0085] Furthermore, even if the optical axis of the microscope illumination section 620 deviates from the vertical direction, the measurement results of the inspection device 80 may still be biased.

[0086] Therefore, in the bonding system 1, a diagnostic unit 700 is provided in the inspection device 80, and the diagnostic unit 700 is used to perform light quantity inspection and optical axis inspection of the microscopic illumination unit 620.

[0087] like Figure 5 As shown, the diagnostic unit 700 includes a mounting portion 710 provided on the main body portion 410 of the holding portion 400 and extending toward the center of the opening 411, and an attenuation member 720 mounted on the front end of the mounting portion 710. The mounting portion 710 is disposed between two adjacent support members 420. The mounting portion 710 is shorter than the support members 420, and the attenuation member 720 is disposed at a position exposed from the overlapping substrate T supported by the multiple support members 420 when viewed from above. Thus, the inspection device 80 can perform light quantity inspection and optical axis inspection using the diagnostic unit 700 even when the overlapping substrate T is held in the holding portion 400.

[0088] Figure 8 This is a diagram showing the structure of the attenuation member 720 according to the embodiment. Additionally, Figure 9 This is a diagram showing an example of a calibration mark formed on the attenuation member 720.

[0089] like Figure 8 As shown, the attenuation member 720 includes a glass plate 721 and a plurality of (two in this case) silicon plates 722. The glass plate 721 and the two silicon plates 722 are stacked in the order of silicon plate 722, glass plate 721 and silicon plate 722 stacked from bottom to top.

[0090] Light intensity inspection is performed by using a microscope imaging unit 520 to receive light emitted from a light source 621 and transmitted through an attenuation member 720, and then inspecting the amount of light received. The light intensity of the light source 621 is set to a relatively high value to allow transmission through the superimposed substrate T. Therefore, during light intensity inspection, if the light emitted from the light source 621 is directly captured by the microscope imaging unit 520, excessive light intensity may prevent the acquisition of a suitable image. Therefore, in the inspection apparatus 80, a silicon plate 722 is used to attenuate the light emitted from the light source 621 in the same manner as the superimposed substrate T. This allows for proper light intensity inspection. Furthermore, the attenuation member 720 may include at least one silicon plate 722.

[0091] The inspection device 80 can also perform light intensity checks at predetermined times (e.g., 24:00 daily). Additionally, the inspection device 80 can perform light intensity checks whenever the number of overlapping substrates T processed or the batch number processed reaches a predetermined quantity. Furthermore, the inspection device 80 can perform light intensity checks at predetermined time intervals (e.g., every 12 hours). As described above, the inspection device 80 can perform light intensity checks even when the overlapping substrates T are held in the holding section 400, thus enabling easy and regular light intensity checks regardless of whether overlapping substrates T are present.

[0092] A calibration mark M3 is formed on the glass plate 721. The calibration mark M3 is formed on the glass plate 721, for example, by vapor deposition. In this way, by forming the calibration mark M3 on the glass plate 721, the attenuation member 720 can be formed at a lower cost compared to, for example, forming the calibration mark M3 on the silicon plate 722. Furthermore, the attenuation member 720 does not necessarily require a glass plate 721; the calibration mark M3 can also be formed on the silicon plate 722.

[0093] like Figure 9 As shown, the calibration mark M3 includes, for example, a first quadrilateral M3a and a second quadrilateral M3b. Both the first and second quadrilaterals M3a and M3b have a uniform thickness and are in the shape of a quadrilateral frame. The second quadrilateral M3b is smaller than the first quadrilateral M3a and is disposed inside the first quadrilateral M3a. Furthermore, the position of the centroid G3a of the first quadrilateral M3a coincides with the position of the centroid G3b of the second quadrilateral M3b.

[0094] The optical axis is checked by examining the degree of offset between the coordinates of the centroid G3a of the first quadrilateral M3a and the coordinates of the centroid G3b of the second quadrilateral M3b, calculated based on image data captured by the microscope imaging unit 520. That is, assuming the optical axis of the microscope illumination unit 620 is tilted, the coordinates of the centroids G3a and G3b are inconsistent due to the uneven thickness of the frames of the first and second quadrilaterals M3a and M3b contained in the image data. The inspection device 80 can determine whether the optical axis is tilted by checking the offset of these centroids G3a and G3b coordinates.

[0095] Unlike the gradual decrease in light intensity caused by the degradation of the light source 621, which occurs over time, optical axis deviation mostly occurs suddenly, such as when a person comes into contact with the light source during maintenance. Therefore, the inspection device 80 can reduce the frequency of optical axis checks compared to the frequency of light intensity checks. For example, the inspection device 80 can perform an optical axis check once every few light intensity checks. Alternatively, the inspection device 80 can perform an optical axis check when the power is on.

[0096] <Structure of the Control Device>

[0097] Next, refer to Figure 10 To explain the structure of the control device 70. Figure 10 This is a block diagram illustrating the structure of the control device 70 according to the embodiment. Furthermore, in Figure 10 The diagram shows the structure of the control device 70 related to the inspection device 80.

[0098] like Figure 10 As shown, the control device 70 includes a control unit 71 and a storage unit 72. The control unit 71 includes a measurement control unit 71a and a diagnostic control unit 71b. In addition, the storage unit 72 stores initial light quantity information 72a.

[0099] In addition, the control device 70 may include, for example, a computer or various circuits having a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), HDD (Hard Disk Drive), input / output ports, etc.

[0100] The computer's CPU functions as the measurement control unit 71a and the diagnostic control unit 71b of the control unit 71, for example, by reading and executing programs stored in ROM. Furthermore, at least one or both of the measurement control unit 71a and the diagnostic control unit 71b are constructed from hardware such as ASIC (Application Specific Integrated Circuit), GPU (Graphics Processing Unit), or FPGA (Field Programmable Gate Array).

[0101] Additionally, the storage unit 72 corresponds to, for example, RAM or HDD. RAM or HDD can store initial light quantity information 72a. Furthermore, the control device 70 can obtain the aforementioned programs or various information via other computers or portable recording media connected through wired or wireless networks.

[0102] (Regarding the Measurement and Control Department)

[0103] The measurement control unit 71a sets multiple (e.g., 5 to 13) measurement points on the surface of the overlapping substrate T, so that the inspection device 80 performs measurement on the overlapping substrate T at each measurement point.

[0104] Specifically, in the inspection apparatus 80, firstly, a process is performed to transfer the overlapping substrate T. The overlapping substrate T is transferred by the transport device 61 (see reference 61). Figure 1The substrate T is transported to the interior of the inspection device 80. The inspection device 80 uses a lift (not shown) to receive the overlapping substrate T from the transport device 61 and moves the lift to place the overlapping substrate T on a plurality of support members 420. Then, the overlapping substrate T is vacuumed by the suction device 480 through the suction tube 460 to adsorb and hold the overlapping substrate T in the holding part 400.

[0105] Next, an θ alignment process is performed in the inspection apparatus 80. The θ alignment process is a process of adjusting the position of the overlapping substrate T in the rotational direction. Specifically, the inspection apparatus 80 uses a macro camera unit 510 to capture images of multiple reference points (e.g., a reference point located at the center of the overlapping substrate T and reference points located nearby) existing on the overlapping substrate T. Then, the inspection apparatus 80 calculates the rotation angle of the overlapping substrate T based on the obtained images and uses a moving mechanism 440 to rotate the overlapping substrate T so that the rotation angle is 0 degrees. These reference points are formed, for example, along with the pattern in each exposure area (shot) on the first substrate W1 or the second substrate W2 during the pattern formation process on the first substrate W1 or the second substrate W2. That is, the inspection apparatus 80 rotates the overlapping substrate T so that the arrangement direction of the pattern in each exposure area is always the same.

[0106] Next, the measurement process is performed in the inspection device 80. Specifically, the inspection device 80 moves the holding unit 400 horizontally using the moving mechanism 440, so that the microscope imaging unit 520 and the microscope illumination unit 620 are positioned on the vertical line of the first measurement point. Afterwards, based on focusing of the microscope imaging unit 520 and position correction of the holding unit 400, the inspection device 80 uses the microscope imaging unit 520 and the microscope illumination unit 620 to capture images of the measurement marks M1 and M2 located at the first measurement point.

[0107] The inspection device 80 performs the same process on the remaining measurement points. That is, the inspection device 80 repeats the above process according to the number of measurement points.

[0108] The measurement control unit 71a acquires image data as measurement results from the inspection device 80. Then, based on the acquired image data, the measurement control unit 71a derives inspection results including the offset between the first substrate W1 and the second substrate W2 in the overlapping substrate T. Specifically, the measurement control unit 71a calculates the X-coordinate (x1) and Y-coordinate (y1) of the measurement mark M1, and the X-coordinate (x2) and Y-coordinate (y2) of the measurement mark M2 at each measurement point by analyzing the image data. Furthermore, the measurement control unit 71a calculates the offset (Δx) of the X-coordinate of the measurement marks M1 and M2, and the offset (Δy) of the Y-coordinate of the measurement marks M1 and M2. Then, the measurement control unit 71a substitutes the calculation results (x1, y1, x2, y2, Δx, Δy) of the first number of measurement points (in this case, 5) into a pre-prepared calculation model.

[0109] The calculation model decomposes the offset of the first substrate W1 relative to the second substrate W2 into components such as offset in the X-axis direction (X displacement), offset in the Y-axis direction (Y displacement), offset in the rotational direction centered on the vertical axis (rotation), and offset due to stretching (scaling). The measurement control unit 71a uses the calculation model to obtain the inspection result of each of the above components and stores the obtained inspection result in the storage unit 72.

[0110] (Regarding the Diagnostic Control Department)

[0111] The diagnostic control unit 71b controls the operation of the light quantity inspection and optical axis inspection performed by the inspection device 80.

[0112] The initial light quantity information 72a stored in the storage unit 72 is used in light quantity checks. The initial light quantity information 72a indicates the relationship between the set light quantity of the light source 621 provided in the microscope illumination unit 620 and the amount of light received by the microscope imaging unit 520 when it receives light emitted from the light source 621 at that set light quantity via the attenuation member 720. The set light quantity is a command value for the amount of light output from the light source 621. For example, the initial light quantity information 72a may be configured to associate the set light quantity "100" of the light source 621 with the amount of light received by the microscope imaging unit 520 "80".

[0113] The initial light quantity information 72a indicates the initial relationship between the set light quantity of the light source 621 and the amount of light received by the microscope imaging unit 520 before the light source 621 deteriorates. This initial light quantity information 72a is generated, for example, when the bonding system 1 is started or used for the first time. If the light source 621 deteriorates due to use, even if the light source 621 is instructed to emit light at the set light quantity "100", the actual amount of light received, i.e., the amount of light received by the microscope imaging unit 520, is less than "80".

[0114] In addition, using Figure 12 and Figure 13 The specific processes for optical quantity inspection and optical axis inspection will be described later.

[0115] <Specific Operations of the Joining System>

[0116] Next, the specific operation of the engagement system 1 will be explained. First, refer to... Figure 11 This describes the processing steps before the overlapping substrate T is formed by the bonding device 41. Figure 11 This is a flowchart illustrating an example of the process performed by the bonding system 1 before the overlapping substrate T is formed by the bonding device 41. Figure 11 The various processes shown are performed based on control by the control device 70.

[0117] First, a box C1 containing multiple first substrates W1, a box C2 containing multiple second substrates W2, and an empty box C3 are placed on a designated mounting plate 11 in the transfer station 2. Then, the first substrates W1 in the box C1 are removed by the transfer device 22 and transferred to the conveying device configured in the third processing block G3.

[0118] Next, the first substrate W1 is transported to the surface modification apparatus 30 of the first processing block G1 via the conveying device 61. In the surface modification apparatus 30, oxygen, which is used as a processing gas, is excited under a specified reduced pressure atmosphere to plasmaize and ionize it. The bonding surface of the first substrate W1 is irradiated with the oxygen ions to perform plasma treatment on the bonding surface. As a result, the bonding surface of the first substrate W1 is modified (step S101).

[0119] Next, the first substrate W1 is transported to the surface hydrophilization apparatus 40 of the first processing block G1 via the conveying device 61. In the surface hydrophilization apparatus 40, pure water is supplied to the first substrate W1 while it is being rotated on a rotating suction cup. This hydrophilizes the bonding surface of the first substrate W1. In addition, the bonding surface of the first substrate W1 is cleaned with the pure water (step S102).

[0120] Next, the first substrate W1 is transported to the bonding device 41 of the second processing block G2 via the conveying device 61. The first substrate W1, which has been moved into the bonding device 41, is then transported to the position adjustment mechanism via the transfer unit, and the horizontal orientation is adjusted by the position adjustment mechanism (step S103).

[0121] Next, the first substrate W1 is transferred from the position adjustment mechanism to the flipping mechanism, and the surface and back of the first substrate W1 are flipped by the flipping mechanism (step S104). Specifically, the bonding surface W1j of the first substrate W1 is turned downward.

[0122] Then, the first substrate W1 is transferred from the flipping mechanism to the first holding part 140. The first substrate W1 is held in the first holding part 140 with its groove facing a predetermined direction (step S105).

[0123] The processing of the second substrate W2 is repeated in steps S101 to S105 of the processing of the first substrate W1. First, the second substrate W2 is taken out of the box C2 by the transfer device 22 and transferred to the transfer device arranged in the third processing block G3.

[0124] Next, the second substrate W2 is transported to the surface modification device 30 by the conveying device 61 to modify the bonding surface W2j of the second substrate W2 (step S106). After that, the second substrate W2 is transported to the surface hydrophilization device 40 by the conveying device 61 to hydrophilize the bonding surface W2j of the second substrate W2 and clean the bonding surface (step S107).

[0125] Next, the second substrate W2 is transported to the bonding device 41 via the conveying device 61. The second substrate W2, which has been moved into the bonding device 41, is then transported to the position adjustment mechanism via the transfer unit. Then, the horizontal orientation of the second substrate W2 is adjusted by the position adjustment mechanism (step S108).

[0126] Next, the second substrate W2 is transferred to the second holding part 141, and the second substrate W2 is held in the second holding part 141 with the groove portion of the second substrate W2 facing a predetermined direction (step S109).

[0127] Next, the horizontal positions of the first substrate W1 held in the first holding portion 140 and the second substrate W2 held in the second holding portion 141 are adjusted (step S110).

[0128] Next, the vertical positions of the first substrate W1 held in the first holding portion 140 and the second substrate W2 held in the second holding portion 141 are adjusted (step S111). Specifically, the second holding portion 141 is moved vertically upward by the first moving portion 160, so that the second substrate W2 is brought closer to the first substrate W1.

[0129] Next, after releasing the adsorption and holding of the first substrate W1 by the multiple inner adsorption parts 302 (step S112), the center of the first substrate W1 is pressed down by lowering the pressing pin 191 of the impactor 190 (step S113).

[0130] When the center portion of the first substrate W1 contacts the center portion of the second substrate W2 and the center portions of the first substrate W1 and the second substrate W2 are pressed by the impactor 190 with a predetermined force, bonding begins between the pressed center portions of the first substrate W1 and the second substrate W2. That is, since the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2 are modified in steps S101 and S109 respectively, van der Waals forces (intermolecular forces) are first generated between the bonding surfaces W1j and W2j, and the bonding surfaces W1j and W2j bond to each other. Furthermore, since the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2 are hydrophilized in steps S102 and S110 respectively, the hydrophilic groups between the bonding surfaces W1j and W2j are bonded by hydrogen bonds, and the bonding surfaces W1j and W2j are firmly bonded together. In this way, a bonding region is formed.

[0131] Subsequently, a bonding wave is generated between the first substrate W1 and the second substrate W2, extending from the center of the first substrate W1 and the second substrate W2 towards the outer periphery. Then, the adsorption and holding of the first substrate W1 by the multiple outer adsorption portions 301 is released (step S114). As a result, the outer periphery of the first substrate W1, held by the outer adsorption portions 301, falls off. Consequently, the bonding surface W1j of the first substrate W1 and the bonding surface W2j of the second substrate W2 come into full contact, forming an overlapping substrate T.

[0132] Next, the pressing pin 191 is raised to the first holding part 140, and the adsorption and holding of the second substrate W2 by the second holding part 141 is released. Then, the overlapping substrate T is removed from the bonding device 41 by the conveying device 61. In this way, a series of bonding processes are completed.

[0133] Next, refer to Figure 12 This will explain the process of light quantity inspection and processing using the inspection device 80. Figure 12 This is a flowchart illustrating an example of the light quantity inspection process. Furthermore, this example illustrates the process for inspecting the light quantity of the microscope illumination unit 620, but the same process can also be used to inspect the light quantity of the macro illumination unit 610. The light quantity inspection process can be performed under the control of the diagnostic control unit 71b.

[0134] like Figure 12 As shown, in the inspection device 80, firstly, the moving mechanism 440 (see reference) Figure 4 Move the diagnostic unit 700 so that the attenuation member 720 of the diagnostic unit 700 is positioned above the microscope illumination unit 620 (below the microscope imaging unit 520) (step S201).

[0135] Next, in the inspection apparatus 80, based on focusing of the microscope imaging unit 520, the light source 621 of the microscope illumination unit 620 emits light at a set amount (step S202). The light emitted from the light source 621 is received by the imaging element 522 of the microscope imaging unit 520 after passing through the attenuation member 720.

[0136] Next, the diagnostic control unit 71b calculates the amount of light received by the microscope imaging unit 520 (hereinafter referred to as "measured amount of light received") based on the image data captured by the microscope imaging unit 520 (step S203). Additionally, the diagnostic control unit 71b calculates the difference between the calculated measured amount of light received and the amount of light received contained in the initial light information 72a (hereinafter referred to as "initial amount of light received") (step S204). Then, the diagnostic control unit 71b determines whether the difference between the measured amount of light received and the initial amount of light received is less than a threshold (hereinafter referred to as "light threshold") (step S205).

[0137] In step S205, if the difference between the measured light received amount and the initial light received amount is greater than or equal to the light quantity threshold (step S205, "No"), i.e., the light quantity of the light source 621 is abnormal, the diagnostic control unit 71b determines whether the current mode is an automatic adjustment mode (step S206). In step S206, if it is determined that the mode is in automatic adjustment mode (step S206, "Yes"), the diagnostic control unit 71b changes the set light quantity of the light source 621 (step S207). Specifically, the diagnostic control unit 71b increases the set light quantity of the light source 621. For example, the diagnostic control unit 71b may also increase the set light quantity only by increasing the difference between the measured light received amount and the initial light received amount. Alternatively, the diagnostic control unit 71b may increase the set light quantity only by a predetermined amount. When the processing of step S206 ends, the diagnostic control unit 71b returns to step S202 and causes the light source 621 to emit light at the changed set light quantity.

[0138] On the other hand, in step S206, if the system is not in automatic adjustment mode (step S206, "No"), the diagnostic control unit 71b performs notification processing (step S208). For example, the diagnostic control unit 71b may also send information to a host device connected to the connection system 1 via a network indicating that the light intensity of the light source 621 has decreased as a notification. Alternatively, the diagnostic control unit 71b may also activate an alarm device (alarm, light, etc.) installed in the connection system 1 (not shown) as a notification.

[0139] If the processing of step S208 is completed, or if the difference between the measured light received amount in step S205 and the initial light received amount is less than the light amount threshold (step S205, "Yes"), that is, if the light amount of the light source 621 is normal, the diagnostic control unit 71b ends the light amount check process.

[0140] Next, refer to Figure 13 This will explain the optical axis inspection process in the inspection device 80. Figure 13 This is a flowchart illustrating an example of the optical axis inspection process.

[0141] like Figure 13 As shown, in the inspection device 80, firstly, the moving mechanism 440 (see reference) Figure 4 The diagnostic unit 700 is moved so that the attenuation member 720 of the diagnostic unit 700 is positioned above the microscope illumination unit 620 (below the microscope imaging unit 520) (step S301).

[0142] Next, in the inspection apparatus 80, after focusing the microscope imaging unit 520, the light source 621 of the microscope illumination unit 620 emits light at a set amount (step S302). Then, in the inspection apparatus 80, the microscope imaging unit 520 captures the calibration mark M3 formed on the attenuation member 720 (step S303).

[0143] Next, the diagnostic control unit 71b calculates the distance between the centroid G3a of the first quadrilateral M3a and the centroid G3b of the second quadrilateral M3b based on the image data captured by the microscope imaging unit 520, as a marker measurement value (step S304). Furthermore, the diagnostic control unit 71b calculates the difference between the calculated marker measurement value and the normal value of the distance between the centroids G3a and G3b (hereinafter referred to as the "Ref value") (step S305). In this embodiment, the case where the Ref value is 0, i.e., the centroids G3a and G3b are the same, is used as an example, but the Ref value does not necessarily have to be 0.

[0144] Next, the diagnostic control unit 71b determines whether the difference between the measured value of the marker and the Ref value is less than a threshold (hereinafter referred to as the "optical axis threshold") (step S306). In this process, if the difference between the measured value of the marker and the Ref value is greater than the optical axis threshold (step S306, "No"), the diagnostic control unit 71b performs a notification process (step S307). For example, the diagnostic control unit 71b may also send information indicating that the optical axis of the light source 621 is tilted to a host device connected to the bonding system 1 via a network as a notification process. In addition, the diagnostic control unit 71b may also activate an alarm device (alarm, light, etc.) installed in the bonding system 1 (not shown) as a notification process.

[0145] If the process in step S307 is completed, or if the difference between the marker measurement value and the Ref value in step S306 is less than the optical axis threshold (step S306, "Yes"), the diagnostic control unit 71b ends the optical axis inspection process.

[0146] As described above, the self-diagnostic method of the inspection device (e.g., inspection device 80) involved in the embodiment is a self-diagnostic method of an inspection device for inspecting an overlapping substrate (e.g., overlapping substrate T) formed by bonding a first substrate (e.g., first substrate W1) and a second substrate (e.g., second substrate W2). The self-diagnostic method of the inspection device includes a configuration step, an irradiation step, a light receiving step, and a step of determining an abnormality in the amount of light. The configuration process involves moving a holding portion (e.g., holding portion 400) that holds the outer periphery of the overlapping substrate and is provided with a diagnostic portion (e.g., diagnostic portion 700) having an attenuation member (e.g., attenuation member 720) for light attenuation. This positions the attenuation member between an illumination portion (e.g., macro illumination portion 610 or microscopic illumination portion 620) and an imaging portion (e.g., macro imaging portion 510 or microscopic imaging portion 520). The illumination portion is positioned above or below the holding portion to irradiate the overlapping substrate held thereon. The imaging portion is positioned above or below the holding portion, facing the illumination portion, to photograph the overlapping substrate held thereon. The irradiation process follows the configuration process, where light is irradiated from the illumination portion at a set intensity. The light reception process follows the irradiation process, where the imaging portion receives the light emitted from the illumination portion and transmitted through the attenuation member. The process for determining abnormal light intensity occurs after the light receiving process. It determines the abnormality of the light intensity emitted from the illumination unit based on the amount of light received by the camera unit.

[0147] According to the self-diagnostic method of the inspection device according to the embodiment, the light intensity of the illumination unit can be easily checked using the diagnostic unit built into the inspection device. Therefore, the measurement accuracy of the inspection device can be easily maintained.

[0148] Alternatively, in the process of determining abnormal light intensity, the difference between the initial light intensity (e.g., the initial light intensity contained in the initial light intensity information 72a) and the light intensity received by the camera unit during the light reception process (e.g., the light intensity measured) is calculated. If the difference is greater than or equal to a light intensity threshold, the light intensity emitted from the illumination unit is determined to be abnormal. The initial light intensity is a pre-stored amount of light intensity as the light intensity received by the camera unit after being emitted from the illumination unit at a set light intensity and passing through the attenuation member. This allows for easy detection of degradation caused by the use of the light source in the illumination unit.

[0149] Regarding the self-diagnostic method of the inspection device according to the embodiment, it is also possible to include, in the process of determining the abnormality of light intensity, a process of changing the set light intensity when it is determined that the light intensity emitted from the illumination unit is abnormal. This makes it easy to maintain a constant light intensity emitted from the illumination unit.

[0150] The attenuation component may also have calibration marks. In this case, the self-diagnostic method of the inspection device according to the embodiment may also include a step of taking an image and a step of determining the tilt of the optical axis. The step of taking an image is performed after the illumination step, using the camera unit to capture the calibration marks. The step of determining the tilt of the optical axis is performed after the image taking step, based on the calibration marks captured by the camera unit to determine the tilt of the optical axis of the illumination unit. Thus, the diagnostic unit used for light intensity inspection can also be used to check the tilt of the optical axis.

[0151] Furthermore, the inspection apparatus (e.g., inspection apparatus 80) according to the embodiments is used to inspect an overlapping substrate (e.g., overlapping substrate T) formed by bonding a first substrate (e.g., first substrate W1) and a second substrate (e.g., second substrate W2). The inspection apparatus includes a holding portion (e.g., holding portion 400), an illumination portion (e.g., macro illumination portion 610 or microscopic illumination portion 620), an imaging portion (e.g., macro imaging portion 510 or microscopic imaging portion 520), a moving mechanism (e.g., moving mechanism 440), and a diagnostic portion (e.g., diagnostic portion 700). The holding portion holds the outer periphery of the overlapping substrate. The illumination portion is disposed above and below the holding portion and is used to irradiate light onto the overlapping substrate held in the holding portion. The imaging portion is disposed above and below the other portion of the holding portion, facing the illumination portion, and is used to photograph the overlapping substrate held in the holding portion. The moving mechanism moves the holding portion. The diagnostic portion is provided in the holding portion and has an attenuation member (e.g., attenuation member 720) that attenuates light emitted from the illumination portion.

[0152] According to the inspection apparatus of the embodiment, the light intensity of the illumination unit can be easily checked using the diagnostic unit built into the inspection apparatus. Therefore, the measurement accuracy of the inspection apparatus can be easily maintained.

[0153] The attenuation component may also include silicon (e.g., silicon substrate 722). By using silicon to attenuate the light emitted from the illumination unit in the same way as the overlapping substrate, the light quantity can be appropriately checked.

[0154] The attenuation component may also include silicon, glass laminated on silicon (e.g., glass plate 721), and calibration marks formed on the glass (e.g., calibration mark M3). By forming the calibration marks on the glass, the attenuation component can be formed at a lower cost compared to, for example, forming the calibration marks on silicon.

[0155] The holding part may also include a main body (e.g., main body 410) and multiple support members (e.g., support members 420). The main body has an opening (e.g., opening 411) with a diameter larger than that of the overlapping substrate. Multiple support members are disposed on the main body and extend toward the center of the opening, supporting the outer periphery of the overlapping substrate at the front ends of the multiple support members. In this case, the diagnostic part may also be disposed between two adjacent support members. As a result, it is possible to suppress the enlargement of the inspection device 80.

[0156] The diagnostic unit may also include a mounting portion (e.g., mounting portion 710) and an attenuation member (e.g., attenuation member 720). The mounting portion is provided in the holding portion and extends toward the center of the opening. The attenuation member is mounted on the front end of the mounting portion. In this case, the attenuation member is positioned for viewing the inspection device from a top view in a direction perpendicular to the surface of the overlapping substrate (e.g., ...). Figure 5 The position exposed from the overlapping substrate. Therefore, even when the overlapping substrate is held in the holding part, self-diagnosis can be performed using the diagnostic unit.

[0157] Furthermore, in the above embodiments, an example of a bonding device is described where the center of the first substrate is pressed by an impactor to bring it into contact with the second substrate, and the first substrate and the second substrate are bonded together using intermolecular forces generated between the bonding surfaces of the first substrate and the second substrate after surface modification. However, it is not limited to this, and the bonding device may also be a bonding device of the type that bonds the first substrate and the second substrate via an adhesive.

[0158] It should be considered that the embodiments disclosed herein are illustrative in all respects and not restrictive. In fact, the above-described embodiments can be implemented in various ways. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the appended claims and their spirit.

[0159] Explanation of reference numerals in the attached figures

[0160] W1: First substrate; W2: Second substrate; T: Overlapping substrate; 1: Bonding system; 2: Loading / unloading station; 3: Processing station; 4: Inspection station; 41: Bonding device; 70: Control device; 71: Control unit; 71a: Measurement control unit; 71b: Diagnostic control unit; 72: Storage unit; 72a: Initial light intensity information; 80: Inspection device; 400: Holding unit; 410: Main body; 420: Support member; 460: Suction tube; 500: Imaging unit; 510: Macro imaging unit; 520: Microscopic imaging unit; 600: Illumination unit; 610: Macro illumination unit; 620: Microscopic illumination unit; 700: Diagnostic unit; 710: Mounting unit; 720: Attenuation member.

Claims

1. A self-diagnostic method for an inspection device, the inspection device being used to inspect an overlapping substrate formed by bonding a first substrate and a second substrate, the self-diagnostic method comprising the following steps: In the configuration process, the attenuation member is positioned between the illumination unit and the imaging unit by moving a holding unit that holds the outer periphery of the overlapping substrate and is provided with an attenuation member having light attenuation capabilities. The illumination unit is positioned above or below the holding unit to irradiate light onto the overlapping substrate held on the holding unit. The imaging unit is positioned above or below the holding unit, facing the illumination unit, to capture images of the overlapping substrate held on the holding unit. The illumination process involves irradiating light from the illumination unit with a set light intensity after the configuration process. The process of receiving light involves, after the illumination process, using the camera unit to receive light emitted from the illumination unit and transmitted through the attenuation member; and The process for determining abnormal light intensity involves, after the light receiving process, determining an abnormality in the amount of light emitted from the illumination unit based on the amount of light received by the imaging unit. The attenuation component has calibration marks. The self-diagnostic method of the inspection device also includes the following steps: The process of taking a photograph involves, after the illumination process, using the camera unit to photograph the calibration mark; and The process of determining the tilt of the optical axis is carried out after the imaging process, based on the calibration mark captured by the imaging unit to determine the tilt of the optical axis of the illumination unit.

2. The self-diagnostic method of the inspection device according to claim 1, characterized in that, In the process of determining the abnormality of light quantity, the difference between the initial light quantity and the light quantity received by the camera unit in the process of receiving light is calculated. If the difference is above the light quantity threshold, it is determined that the light quantity of the light emitted from the illumination unit is abnormal. The initial light quantity is a light quantity that is pre-stored as the light quantity received by the camera unit after being emitted from the illumination unit at the set light quantity and passing through the attenuation member.

3. The self-diagnostic method of the inspection device according to claim 1 or 2, characterized in that, The process of determining the abnormality of light quantity also includes a process of changing the set light quantity when it is determined that the light quantity of light emitted from the illumination unit is abnormal.

4. An inspection apparatus for inspecting an overlapping substrate formed by bonding a first substrate and a second substrate, the inspection apparatus comprising: A holding portion that holds the outer periphery of the overlapping substrate; An illumination section, which is disposed above and below the holding section, is used to irradiate light onto the overlapping substrate held in the holding section; A camera unit is disposed above and below the holding unit, facing the illumination unit, for capturing images of the overlapping substrate held in the holding unit; A moving mechanism that moves the retaining part; and The diagnostic section, disposed within the holding section, has an attenuation member that reduces the light emitted from the illumination section. The attenuation component contains silicon.

5. The inspection device according to claim 4, characterized in that, The attenuation component includes: The silicon; Glass, which is laminated on the silicon; and Calibration marks are formed on the glass.

6. An inspection apparatus for inspecting an overlapping substrate formed by bonding a first substrate and a second substrate, the inspection apparatus comprising: A holding portion that holds the outer periphery of the overlapping substrate; An illumination section, which is disposed above and below the holding section, is used to irradiate light onto the overlapping substrate held in the holding section; A camera unit is disposed above and below the holding unit, facing the illumination unit, for capturing images of the overlapping substrate held in the holding unit; A moving mechanism that moves the retaining part; and The diagnostic section, disposed within the holding section, has an attenuation member that reduces the light emitted from the illumination section. The retaining part includes: The main body has an opening with a diameter larger than that of the overlapping substrate; as well as Multiple support members are disposed on the main body and extend toward the center of the opening, and the front ends of the multiple support members support the outer periphery of the overlapping substrate. The diagnostic section is positioned between two adjacent support members.

7. The inspection device according to claim 6, characterized in that, The diagnostic unit includes: A mounting portion, disposed on the retaining portion, extends toward the center of the opening; and The attenuation member is mounted on the front end of the mounting portion. The attenuation member is positioned to be exposed from the superimposed substrate when the inspection device is viewed from above from a direction perpendicular to the surface of the superimposed substrate.

Images