An automated software system and design method for wiring diagram design

Abstract

The present invention discloses an automated software system and design method for wiring drawing design. The automated software system for wiring drawing design includes a drawing object definition tool, a text tool, a drawing inspection tool, a drawing report output tool, a chip tool, a layer tool, a soldering tool, and a drawing distribution tool; the design method includes: S1, starting the AutoCAD program loaded with the automated software system for wiring drawing design; S2, obtaining the coordinate information of the chip to be drawn; S3, importing the coordinate information into AutoCAD to generate a wireframe chip; S4, automatically wiring and paging according to the coordinate information; S5, automatically inspecting the drawing; S6, completing the drawing design. The automated software system and design method provided by the present invention reduce the time-consuming of drawing design, improve the efficiency of wiring drawing design, and reduce situations such as manual input coordinate errors, wire pulling errors, etc., and reduce the situations of missing wires and wrong wires when identifying multiple wires.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor package design, and more particularly to an automated software system and design method for wiring diagram design. Background Art

[0002] With the continuous development of the integration of packaging technology, the number of pins and bonding wires in traditional packaging wiring diagrams is increasing. Therefore, the complexity and design risks of product design drawings are getting higher and higher.

[0003] The existing design drawing mode is to take physical chip photos on the production line, or manually draw a wireframe chip in CAD according to the chip coordinates provided by the customer, and then manually draw wires according to the materials provided by the customer, and manually check whether each item of the drawing is correct. Taking photos online consumes a lot of manpower, and improper operation during the process of taking chips is likely to damage the chips. Manual drawing of wireframe chips and manual wire drawing and other drawing operations, including drawing review, take a long time, have low efficiency, and are prone to situations such as incorrect manual input of coordinates when drawing chips and incorrect wire drawing. Manual review of drawings cannot prevent mistakes either. Summary of the Invention

[0004] To solve the above problems, the present invention provides an automated software system and design method for wiring diagram design, which reduces the time consumed in drawing design, improves the efficiency of wiring diagram design, and reduces situations such as incorrect manual input of coordinates and incorrect wire drawing, and reduces the situations of missing wires and incorrect wires when identifying multiple wires.

[0005] According to one aspect of the present invention, an automated software system for wiring diagram design is provided, including:

[0006] A drawing object definition tool for defining the block attributes of drawing objects;

[0007] A text tool for marking the pressing areas of drawing objects and chips;

[0008] A drawing inspection tool for pitch dimension detection, quantity statistics, pressing area wire bonding signal detection, detection of repetition and overlap of objects, leads and texts, and lead crossing detection;

[0009] A drawing report output tool for outputting the coordinates of each object, the coordinates of the pressing area, the lead lengths of the chip and the pins, and outputting an inspection or comparison report for the changed design drawing;

[0010] A chip tool for determining a chip according to coordinate information and editing the chip or the pressing area;

[0011] A layer tool for quickly editing layers and controlling layers;

[0012] A soldering tool for editing the leads of the chip or the pins;

[0013] Drawing distribution tool, used to create standard drawing pagination, merge pagination, and add pagination;

[0014] Start the automated wiring drawing design software system, import the coordinate information of the chip to be drawn into AutoCAD, and generate a wireframe chip.

[0015] In some embodiments, the editing of the chip or the pressing area by the chip tool includes: in the current drawing document interface, adding, moving, rotating, scaling, and changing the graphic attributes of the chip or the pressing area, where the graphic attributes indicate the shape or size of the chip or the pressing area;

[0016] When the graphic attributes of the chip or the pressing area are determined, update the coordinate information of the chip or the pressing area;

[0017] Assign identification information to each chip or pressing area, where the identification information includes the number of the chip or pressing area and the text information corresponding to the number, and perform symmetrical inspection, position inspection and update of the pressing area according to the identification information.

[0018] In some embodiments, the editing of the leads by the soldering tool includes but is not limited to: automatic wire drawing, automatic lead layer differentiation, lead separation adjustment, automatic lead non-crossing adjustment, lead length adjustment, drawing lead features, and wire bonding marking.

[0019] In some embodiments, the drawing distribution tool can perform masking operations on multiple chips, and can achieve but is not limited to: creating standard drawing pagination, merging pagination, adding pagination, and editing the drawing order.

[0020] According to another aspect of the present invention, there is provided a method for automated design of wiring drawings, including the following steps:

[0021] S1: Start the automated wiring drawing design software system;

[0022] S2: Obtain the coordinate information of the chip to be drawn;

[0023] S3: Import the coordinate information into AutoCAD to generate a wireframe chip;

[0024] S4: Import wire bonding information and the connection relationship between the chip and the pins, and automatically perform wire bonding and pagination according to the coordinate information;

[0025] S5: Automated drawing inspection;

[0026] S6: Complete the drawing design.

[0027] In some embodiments, the coordinate information in step S2 includes the pressing area coordinates of the chip to be drawn, the pressing area size, the chip outer frame size, the connection relationship between the pressing area coordinates and the frame carrier or pins, the connection relationship between the frame pins and the frame carrier directly, and the connection relationship coordinates between chips in a multi-chip design.

[0028] In some embodiments, step S2 may include the following steps, and when performing the following steps, the chip or the pressing area can be edited through a chip tool:

[0029] S2-1: If the original input information is not in the system-fixed Excel format, the coordinate content needs to be converted into a document in the fixed Excel format;

[0030] S2-2: If the original input information is a CAD chip drawing document, the chip needs to be defined first, and the action of adding a new chip is performed through the chip tool to initially define the pressing area and the chip;

[0031] S2-3: Then, the chip or the pressing area is edited through the chip tool, including but not limited to: moving, rotating, scaling, replacing graphics, generating text in the pressing area, checking the symmetry of the pressing area arrangement, checking and updating the pressing area position;

[0032] S2-4: The defined chip can be directly used in the same way as the wireframe chip obtained from the coordinates.

[0033] In some embodiments, in step S3, the coordinate information is imported into AutoCAD, the chip is determined according to the pressing area coordinates, the pressing area size, and the chip outer frame size of the chip to be drawn, and a wireframe chip is automatically generated. After the wireframe chip is generated, the chip can be edited and adjusted through the chip tool.

[0034] In some embodiments, in step S4, according to the connection relationship between the pressing area coordinates and the frame carrier or pins, the connection lead between the chip and the pins is obtained; according to the connection relationship coordinates between the frame pins and the frame carrier, the connection lead between the frame pins and the frame carrier is obtained; according to the connection relationship coordinates between chips, the connection lead between chips is obtained; and the welding tool is used to automatically draw the leads, automatically distinguish the lead layers, adjust the lead separation, automatically adjust the leads so that they do not cross, and adjust the lead length.

[0035] The advantages of the present invention are as follows: The wiring drawing design automation software system proposed by the present invention is based on the mature AutoCAD drawing software. The coordinate information of the chip to be drawn is obtained through the wiring drawing design automation software system. After importing the coordinate information, a wireframe chip is generated. The connection leads between the chip and the pins and the connection leads between chips are completed through the soldering tool to achieve automatic wire bonding. Then, a standard drawing pagination is established according to the layer and drawing release tool. After the pagination is completed, the distance dimensions between various objects, quantity statistics, press area wire bonding signal detection, lead crossing detection, etc. can be detected again through the drawing inspection tool, and finally the drawing design is completed. During the drawing design process, the accuracy of the drawing steps can be detected in real time through the drawing inspection tool and the source of errors can be traced, which greatly improves the efficiency and correctness of the drawing design and reduces the labor intensity. The wiring drawing design automation software system is applied to the production line machine platform. The production line machine platform can read the AutoCAD drawing, compare it with the wire bonding program, and output a detection result document according to requirements to confirm the correctness of the production line operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 is a schematic flow chart of a wiring drawing automation design method of the present invention;

[0037] Figure 2 is a schematic diagram of a wireframe chip generated after performing step S3 in a wiring drawing automation design method of an embodiment;

[0038] Figure 3 is a schematic diagram after wire bonding is completed in performing step S4 in a wiring drawing automation design method of an embodiment. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0039] The present invention will be further described below in conjunction with the detailed embodiments.

[0040] A wiring drawing design automation software system according to an embodiment of the present invention includes a drawing object definition tool, a text tool, a drawing inspection tool, a drawing report output tool, a chip tool, a layer tool, a soldering tool, and a drawing release tool.

[0041] The drawing object definition tool is used to define the block attributes of the drawing objects, including chip definition, press area definition, pin definition, and ground coil definition, so as to obtain the leads between the chip and the pins.

[0042] The drawing objects include chips, the press areas of the chips, the pins of the frame carrier, and ground coils. The block attributes are used to indicate the areas where the wire bonding points fall and the connection relationships between various drawing objects.

[0043] The definition of the block attributes will be described below by taking the press area of the chip as an example.

[0044] Table 1. Example of block attributes in the pressing area

[0045]

[0046] Table 1 is an example of block attributes in the pressing area. Among them, the window opening coordinates in the pressing area indicate the coordinates of a specific point in the pressing area. Taking this specific point as the origin and spreading to the area that meets the pressing area size is the area in the pressing area that can be used for the landing point of wire bonding. It can be seen from this that the block attributes are used to indicate the areas in each drawing object that can be used for the landing point of wire bonding.

[0047] In addition, in practical applications, wire bonding is carried out according to the corresponding relationship between the pressing area serial number and the package pin serial number in the block attributes. It can be seen from this that the block attributes are also used to indicate the connection relationship between each drawing object.

[0048] It should be noted that Table 1 is only an example and does not serve as a limitation of the scope of block attributes in this application.

[0049] In this application, the block attributes of the pins and ground coils on the frame are defined according to the frame itself and have nothing to do with the coordinates. For example, since wire bonding can only be carried out on the plated area of the pins and not on the non-plated area, the enclosed area of the pins is determined according to the plating range on the pins / base islands, and this enclosed area is the area that can be used for the landing point of wire bonding.

[0050] Text tool, used to mark drawing objects such as chips and frame carriers, number the pins, number the pressing areas of the chips, and mark the function names of the pressing areas.

[0051] Drawing inspection tool, which can be used for pitch size detection, can perform 2D and 3D length measurements, such as the detection of chip size, the detection of the pressing area size of the chip, the detection of the pitch between each pressing area, and the detection of the shortest distance between each object. The drawing inspection tool can count the number of each object, detect the wire bonding signal of the pressing area, perform detection on the repetition and overlap of objects, leads and texts, and detect the intersection of leads.

[0052] Drawing sheet report output tool, used for outputting the coordinates of each object, the coordinates of the pressing area, and the lead length between the chip and the pins. The drawing sheet report output tool can also check the changed design drawing and output the comparison report.

[0053] Chip tool, used to determine the chip according to the coordinate information, and perform editing such as moving, rotating, and scaling on the chip or pressing area. If it is necessary to replace the object, the graphics can also be replaced.

[0054] Layer tool, used for quickly editing layers and controlling layers.

[0055] In this application, layers are divided according to the names of the drawing objects or the lead connection relationships. For example, the ground wires of the same chip are divided into one layer, the bonding wires from pad to pad of the same chip are divided into one layer, and the bonding wires of the pins of the same chip are divided into one layer. If there are multiple loops in the pads of the same chip, the bonding wires will be separately layered according to the outer and inner loops of the pads. If it is automatic wire bonding for multiple chips, the bonding wires between one chip and another chip will also be separately layered.

[0056] In practical applications, only one or more selected layers can be displayed on the current drawing document interface, making it more convenient to confirm and modify.

[0057] A soldering tool is used to edit the leads of the chip or pins, perform automatic wire pulling, automatically distinguish lead layers, adjust lead separation, automatically adjust to prevent lead crossing, and adjust the lead length.

[0058] A drawing release tool is used to create standard drawing pages, merge pages, and add new pages. In the case of multiple chips, this drawing release tool can perform masking operations on multiple chips and change the drawing order.

[0059] As Figures 1 to 3 shown, using the above wiring drawing design automation software system, the wiring drawing automation design method specifically includes the following steps:

[0060] S1: Start the AutoCAD software loaded with the above wiring drawing design automation software system.

[0061] S2: Obtain the coordinate information of the chip to be drawn.

[0062] Table 2. Example of the fixed Excel format in the system

[0063]

[0064] There are two ways to obtain the coordinate information of the chip to be drawn: One is that if the customer's coordinate information file conforms to the "standard", it is directly imported into the software, that is, the coordinate information of the chip is obtained; the other is that if the customer's coordinate information file does not conform to the "standard", the customer's coordinate information needs to be converted into a file in the "standard" fixed format in the system (that is, integrate and edit the coordinate information), and then imported into the software, that is, the coordinate information of the chip is obtained.

[0065] If the original input information is in document formats such as Word, Excel, Pdf, etc., then the coordinate content needs to be converted into a document in the fixed Excel format.

[0066] If the original input information is a chip drawing file in CAD, then the chip needs to be defined first. Through the chip tool, perform the action of adding a new chip to initially define the pressing area and the chip.

[0067] Then, through the chip tool, edit the chip or the pressing area, including moving, rotating, scaling, replacing the graphics, generating text in the pressing area, checking the symmetry of the pressing area arrangement, checking and updating the position of the pressing area, etc. The defined chip can be directly used in the same way as the wireframe chip obtained from the coordinates.

[0068] The coordinate information in step S2 includes the pressing area coordinates of the chip to be drawn, the pressing area size, the outer frame size of the chip, the connection relationship between the pressing area coordinates and the frame carrier or pins, the connection relationship between the frame pins and the frame carrier directly, and the connection relationship coordinates between chips in a multi-chip design.

[0069] S3: Import the integrated coordinate information of the chip to be drawn into AutoCAD. The designer can edit and adjust the chip through the chip tool, such as replacing the graphics; determine the chip based on the pressing area coordinates, pressing area size, and outer frame size of the chip to be drawn, and generate a wireframe chip.

[0070] Editing process: Each object in the drawing can be defined through the drawing object definition tool, such as chip definition, pressing area definition, pin definition, ground coil definition, etc. During the definition of each object, use the chip tool to assign identification information to each chip or pressing area. The identification information includes the number of the chip or pressing area and the text information corresponding to the number. Adjust the chip or pressing area through the chip tool to determine the graphic attributes of the chip or pressing area. The graphic attributes indicate the shape or size of the chip or pressing area; when the graphic attributes of the chip or pressing area are determined, update the coordinate information of the chip or pressing area, and the updated coordinate information can be used in the subsequent editing process. Edit the block attributes for each drawing object. The block attributes are used to indicate the area where the bonding wire lands and the connection relationship between each drawing object. Use the text tool to number and mark each defined object, such as chips, frame carriers, etc., number the pins, number the pressing areas of the chip, and mark the function names of each pressing area of the chip; then, use the layer tool and coordinate information to divide the drawing into multiple layer information.

[0071] S4: According to the coordinate information, automatic wire bonding is achieved through a soldering tool, and standard drawing pagination is established through a drawing issuance tool. Specifically, based on the connection relationship between the pressing area coordinates and the frame carrier or pins, the connection leads between the chip and the pins are obtained; based on the connection relationship coordinates between the frame pins and the frame carrier, the connection leads between the frame pins and the frame carrier are obtained; based on the connection relationship coordinates between chips, the connection leads between chips are obtained. The soldering tool is used to automatically draw the leads, automatically distinguish the lead layers, adjust the lead separation, automatically adjust the leads to avoid crossing, and adjust the lead lengths, thus achieving automatic simulation wire bonding. After wire bonding is completed, standard drawing pagination is established through the drawing issuance tool.

[0072] S5: Automatic drawing inspection. After pagination is completed, the distance dimensions between various objects, quantity statistics, pressing area wire bonding signal detection, lead crossing detection, etc. can be rechecked through the drawing inspection tool. If an error occurs, the software system will prompt where the error content is. The automatic drawing inspection can export the coordinates of the completed drawing to excel, and then it can be compared with the original imported excel document. Therefore, the source of the error can be traced and modified.

[0073] Specifically, the quantity of each object is counted through the drawing inspection tool; 2D and 3D length measurements are performed, and the distance dimensions between various objects are detected, such as the detection of chip size, the pressing area size of the chip, the distance between each pressing area, and the shortest distance between various objects; the detection of repetition and overlap of objects and text.

[0074] S6: Complete the drawing design.

[0075] Through the drawing report output tool, the coordinates of each object and the coordinates of the pressing area are output to obtain the pressing area size, the outer frame size of the chip, the connection relationship between the pressing area coordinates and the frame carrier or pins, and the connection relationship coordinates between chips in a multi-chip design, forming the coordinate information of the chip and exporting it.

[0076] When performing the operation steps of S2 - S6, the accuracy of the drawing steps can be detected in real time through the drawing inspection tool and the source of the error can be traced, greatly improving the efficiency and correctness of the drawing design and reducing the labor intensity.

[0077] On the machines on the production line, AutoCAD core software loaded with this automated software system for wiring drawing design is installed to read AutoCAD drawings and compare them with the wire bonding program, so as to understand in real time whether the production line operations are correct.

[0078] The automated software system for wiring diagram design proposed by the present invention is based on the mature AutoCAD drawing software. The automated software system for wiring diagram design obtains the coordinate information of the chip to be drawn, imports the integrated coordinate information, and automatically generates a wireframe chip. The connection leads between the chip and the pins and the connection leads between chips are completed through the soldering tool to achieve automatic wire bonding. Then, standard drawing pagination is established according to the layer and drawing release tool. After pagination is completed, the distance dimensions between various objects, quantity statistics, pressing area wire bonding signal detection, lead intersection detection, etc. can be detected again through the drawing inspection tool, and finally the drawing design is completed. During the drawing design process, the accuracy of the drawing steps can be detected in real time through the drawing inspection tool and the source of errors can be traced, greatly improving the efficiency and correctness of the drawing design and reducing the labor intensity. The automated software system for wiring diagram design is applied to the production line machine platform. The machine platform on the production line can read the AutoCAD drawing, compare it with the wire bonding program, and output a detection result document according to requirements to confirm the correctness of the production line operation.

[0079] The above are only some embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the creative concept of the present invention, other deformations and improvements can be made, and these all belong to the protection scope of the present invention.

Claims

1. An automated software system for wiring diagram design, characterized in that, it includes: A drawing object definition tool for defining the block attributes of drawing objects; Including chip definition, press area definition, pin definition, and ground coil definition to obtain the leads between the chip and the pins; The drawing objects include chips, the press areas of the chips, the pins of the frame carrier, and ground coils, and the block attributes are used to indicate the area where the wire bonding landing points and the connection relationships between various drawing objects; A text tool for marking drawing objects and the press areas of chips; A drawing inspection tool for pitch dimension detection, quantity statistics, press area wire bonding signal detection, detection of repetition and overlap of objects, leads, and text, and lead crossing detection; A drawing report output tool for outputting the coordinates of each object, the coordinates of the press area, the lead lengths between the chip and the pins, and outputting inspection or comparison reports for the modified design drawings; A chip tool for determining chips based on coordinate information and editing the chips or press areas; A layer tool for quickly editing and controlling layers; A welding tool for editing the leads of chips or pins; A drawing release tool for creating standard drawing pagination, merging pagination, and adding pagination; Start the automated software system for wiring diagram design, import the coordinate information of the chip to be drawn into AutoCAD, and generate a wireframe chip.

2. The automated software system for wiring diagram design according to claim 1, characterized in that, The editing of the chips or press areas by the chip tool includes: In the current drawing document interface, adding, moving, rotating, scaling, and changing the graphic attributes of the chips or press areas, where the graphic attributes indicate the shape or size of the chips or press areas; When the graphic attributes of the chips or press areas are determined, update the coordinate information of the chips or press areas; Assign identification information to each chip or press area, where the identification information includes the number of the chip or press area and the corresponding text information, and perform symmetric inspection, position inspection, and update of the press area arrangement according to the identification information.

3. The automated software system for wiring diagram design according to claim 2, characterized in that, The editing of the leads by the welding tool includes: automatic wire pulling, automatic lead layer differentiation, lead separation adjustment, automatic lead non-crossing adjustment, lead length adjustment, drawing lead features, and wire bonding marking.

4. The automated software system for wiring diagram design according to claim 3, characterized in that, The drawing release tool performs masking operations on multiple chips to achieve: creating standard drawing pagination, merging pagination, adding pagination, and editing the drawing order.

5. A method for automated wiring diagram design, characterized in that, it includes the following steps: S1: Start the automated software system for wiring diagram design according to claim 4 above; S2: Obtain the coordinate information of the chip to be drawn; S3: Import the coordinate information into AutoCAD to generate a wireframe chip; S4: Import the wire bonding information and the connection relationship between the chip and the pins, and automatically perform wire bonding and pagination according to the coordinate information; S5: Automated drawing inspection; S6: Complete the drawing design.

6. The method for automated wiring diagram design according to claim 5, characterized in that, The coordinate information described in step S2 includes the pressing area coordinates of the chip to be drawn, the pressing area size, the outer frame size of the chip, the connection relationship between the pressing area coordinates and the frame carrier or pins, the connection relationship between the frame pins and the frame carrier directly, and the connection relationship coordinates between chips in a multi-chip design.

7. The automated wiring drawing design method according to claim 6, wherein, step S2 includes the following steps, and when performing the following steps, the chip or the pressing area is edited through a chip tool: S2-1: If the original input information is not in the Excel format fixed by the system, the coordinate content needs to be converted into a document in the fixed Excel format; S2-2: If the original input information is a CAD chip drawing, the chip needs to be defined first, and the action of adding a new chip is performed through the chip tool to initially define the pressing area and the chip; S2-3: Then, editing the chip or the pressing area through the chip tool includes: moving, rotating, scaling, replacing the graphics, generating text in the pressing area, checking the symmetry of the pressing area arrangement, checking and updating the pressing area position; S2-4: The defined chip is directly the same as the wireframe chip obtained from the coordinates.

8. The automated wiring drawing design method according to claim 6, wherein, in step S3, the coordinate information is imported into AutoCAD, the chip is determined according to the pressing area coordinates, the pressing area size, and the outer frame size of the chip to be drawn, and a wireframe chip is generated. After the wireframe chip is generated, the chip is edited and adjusted through a chip tool.

9. The automated wiring drawing design method according to claim 8, wherein, in step S4, according to the connection relationship between the pressing area coordinates and the frame carrier or pins, the connection lead between the chip and the pins is obtained; according to the connection relationship coordinates between the frame pins and the frame carrier, the connection lead between the frame pins and the frame carrier is obtained; according to the connection relationship coordinates between chips, the connection lead between chips is obtained; and the soldering tool is used to automatically draw the leads, automatically distinguish the lead layers, adjust the lead separation, automatically adjust the leads so that they do not cross, and adjust the lead length.

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