Infrared calibration device and testing equipment

Abstract

The present invention relates to an infrared calibration device and a testing equipment. The device comprises a frame, wherein the frame has a plurality of accommodating cavities with a first opening, wherein the accommodating cavities are arranged in a checkerboard pattern; a plurality of semiconductor refrigerators, wherein the semiconductor refrigerators are arranged in the corresponding accommodating cavities, and the first ends of the semiconductor refrigerators are exposed at the first openings; and a temperature control component, wherein the temperature control component is electrically connected to each of the semiconductor refrigerators and is used to control the currents in opposite directions connected to adjacent semiconductor refrigerators. The device effectively solves the technical problem that heating through overall heat conduction will cause uneven heating of the checkerboard, resulting in large temperature differences in target grids of the same color.

Description

Technical Field

[0001] The present invention relates to the technical field of optical equipment, and in particular to an infrared calibration device and a testing device. Background Art

[0002] Infrared thermal imaging technology has been increasingly used in recent years and has high military and civilian application value. Infrared thermal imagers are cameras used to detect infrared radiation from target objects and convert target temperature images into video images through photoelectric conversion, electrical signal processing, and other means. It is difficult for infrared detection cameras to obtain the boundaries and corners of ordinary chessboards, so a calibration device containing infrared characteristic images is needed to calibrate the infrared thermal imager.

[0003] In the calibration device of the related technology, white metal aluminum partitions (aluminum oxide on the surface) and black metal aluminum grids (chromium oxide or tungsten carbide on the surface) are arranged in a checkerboard. There are thermal conductive layers and heating layers on the back of the checkerboard. This method heats through overall heat conduction, which will cause uneven heating of the checkerboard and lead to large temperature differences in target grids of the same color. Summary of the invention

[0004] In order to solve the above problems, the purpose of the present invention is to provide an infrared calibration device, which is used to solve the technical problem that heating through overall heat conduction will cause uneven heating of the chessboard grids, resulting in large temperature differences in target grids of the same color.

[0005] The embodiment of the present invention adopts the following technical solution:

[0006] An embodiment of the present invention provides an infrared calibration device, the device comprising:

[0007] A frame, wherein the frame has a plurality of accommodating grooves, and the accommodating cavities are arranged in a checkerboard pattern;

[0008] A plurality of semiconductor refrigerators, wherein the semiconductor refrigerators are arranged in the corresponding accommodating chambers;

[0009] A temperature control component is electrically connected to each of the semiconductor refrigerators, and is used to control adjacent semiconductor refrigerators to access currents in opposite directions.

[0010] In some embodiments of the present application, the device further comprises:

[0011] A plurality of temperature measuring elements are provided in the corresponding accommodating chambers, and the temperature measuring elements are used to detect the temperature of the semiconductor refrigerator.

[0012] In some embodiments of the present application, the temperature measuring element is electrically connected to the temperature control component, and the temperature measuring element feeds back the measured temperature of the semiconductor refrigerator to the temperature control component.

[0013] In some embodiments of the present application, the device further comprises:

[0014] A communication module, the communication module is electrically connected to the temperature control component and is used for information interaction with a host computer to send the temperature information of the semiconductor refrigerator to the host computer and receive information from the host computer.

[0015] In some embodiments of the present application, the communication module includes an Internet port and a Bluetooth interface.

[0016] In some embodiments of the present application, the accommodating cavity is a through cavity with openings at both ends, the semiconductor refrigerator is embedded in the accommodating cavity, and both ends of the semiconductor refrigerator are exposed from the openings at both ends of the accommodating cavity.

[0017] In some embodiments of the present application, an isolation portion is formed between the adjacent accommodating cavities, and the isolation portion is provided with a circuit groove, and the circuit groove is used for arranging the circuit.

[0018] In some embodiments of the present application, the device further comprises:

[0019] A display component is electrically connected to the temperature control component, and is used to display the temperature of each of the semiconductor refrigerators.

[0020] In some embodiments of the present application, the end faces of the semiconductor refrigerator are respectively set to white and black, wherein the end faces of the semiconductor refrigerators adjacent to the semiconductor refrigerator with the white end face are all black.

[0021] An embodiment of the present invention further provides a testing device, which includes:

[0022] Such as the infrared calibration device mentioned above.

[0023] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0024] The infrared calibration device of this embodiment comprises a frame, a semiconductor refrigerator and a temperature control component. The accommodating cavities are arranged in a checkerboard pattern. Adjacent accommodating cavities are separated by the frame. The semiconductor refrigerator is arranged in the accommodating cavity, and the first end of the semiconductor refrigerator is exposed at the first opening. The temperature control component is electrically connected to each semiconductor refrigerator. Under the action of the Peltier effect, the first end of the semiconductor refrigerator inputting a forward current generates heat, and the second end generates cooling. The first end of the semiconductor refrigerator inputting a reverse current generates cooling, and the second end generates heating. By controlling the adjacent semiconductor refrigerators to connect currents in opposite directions, when the first end of any semiconductor refrigerator is cooled to form a cold surface target grid, the first end of the adjacent semiconductor refrigerator forms a hot surface target grid, so that a checkerboard pattern with cold surface target grids and hot surface target grids arranged alternately is formed on the frame.

[0025] Each target grid unit in the present embodiment is formed by an independent semiconductor refrigerator, which is an active heating device. Compared with the passive heat absorption mode through heat conduction in the existing solution, each target grid unit is adjusted and temperature controlled by a separate semiconductor refrigerator, which can achieve better temperature uniformity and less mutual influence. Each target grid is independently temperature-controlled, and there will be no problem of large temperature difference between target grids of the same color. Moreover, the target grid units are independently controlled, and the controllable temperature difference range can be 0℃~75℃. At the same time, the temperature control component can achieve precise control of the target temperature difference by adjusting the current size. This effectively solves the technical problem that heating through overall heat conduction will cause uneven heating of the chessboard grids, resulting in large temperature differences in target grids of the same color.

[0026] The test equipment of this embodiment, through the infrared calibration device, effectively solves the technical problem that heating through overall heat conduction will cause uneven heating of the chessboard grids, resulting in large temperature differences in the same color target grids. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0028] Figure 1 It is a structural schematic diagram of an infrared calibration device provided by the present invention;

[0029] Figure 2 It is a structural schematic diagram of a framework of an infrared calibration device provided by the present invention;

[0030] Figure 3 It is a partial structural schematic diagram of an infrared calibration device provided by the present invention.

[0031] in:

[0032] 100, frame; 101, accommodating cavity; 102, isolating portion; 200, semiconductor refrigerator; 300, temperature control component; 400, communication module; 500, display component; 600, temperature measuring element. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0034] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0035] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a replaceable connection, or an integral connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection through an intermediate medium, or the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0036] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0037] like Figure 1-3 As shown; the present invention provides an infrared calibration device, the device comprising:

[0038] A frame 100, wherein the frame 100 is provided with a plurality of accommodating cavities 101 having a first opening, and the accommodating cavities 101 are arranged in a checkerboard pattern;

[0039] A plurality of semiconductor refrigerators 200, wherein the semiconductor refrigerators 200 are disposed in the corresponding accommodating chambers 101, and the first ends of the semiconductor refrigerators 200 are exposed at the first openings; and

[0040] The temperature control component 300 is electrically connected to each of the semiconductor refrigerators 200 , and the temperature control component 300 is used to control the adjacent semiconductor refrigerators 200 to access currents in opposite directions.

[0041] In the infrared calibration device of this embodiment, the accommodating cavities 101 are arranged in a checkerboard pattern, and adjacent accommodating cavities 101 are separated by a frame 100. The semiconductor refrigerator 200 is arranged in the accommodating cavity 101, and the first end of the semiconductor refrigerator 200 is exposed at the first opening. The temperature control component 300 is electrically connected to each semiconductor refrigerator 200. Under the action of the Peltier effect, the first end of the semiconductor refrigerator 200 inputting a forward current is heated, and the second end is cooled, while the first end of the semiconductor refrigerator 200 inputting a reverse current is cooled, and the second end is heated. By controlling the adjacent semiconductor refrigerators 200 to access currents in opposite directions, when the first end of any semiconductor refrigerator 200 is cooled to form a cold surface target grid, the first end of the semiconductor refrigerator 200 adjacent to it forms a hot surface target grid, so that a checkerboard pattern with cold surface target grids and hot surface target grids arranged alternately is formed on the frame 100.

[0042] Each target grid unit in this embodiment is formed by an independent semiconductor refrigerator 200, which is an active heat-generating device. Compared with the passive heat absorption mode through heat conduction in the existing solution, each target grid unit is regulated and controlled by a separate semiconductor refrigerator 200, which can achieve better temperature uniformity and less mutual influence.

[0043] Each target grid is independently temperature controlled, and there will be no problem of large temperature differences among target grids of the same color. Moreover, the target grid units are independently controlled, and the controllable temperature difference range can be 0°C to 75°C. At the same time, the temperature control component 300 adjusts the current to achieve precise control of the target temperature difference. This effectively solves the technical problem that heating through overall heat conduction will cause uneven heating of the chessboard grids, resulting in large temperature differences among target grids of the same color.

[0044] The infrared calibration device of this embodiment, since each semiconductor refrigerator 200 is controlled by the temperature control component 300, can achieve fast temperature control response, each target grid unit can quickly reach the target temperature, and the temperature control is precise, with a temperature control accuracy of ±0.01°C, which is greatly improved compared to the temperature control accuracy of ±1°C of the existing solution.

[0045] The target grid unit is formed by the semiconductor refrigerator 200, so that the infrared calibration device can be modularly designed. Due to the need to upgrade the application scenario or damage to a target grid unit, maintenance such as recombination or replacement can be easily performed.

[0046] The infrared calibration device of this embodiment can also reduce the occupied equipment space exponentially, which is more conducive to the miniaturization of infrared calibration test equipment and further reduces equipment costs and plant area occupation costs.

[0047] The frame 100 is a chessboard-shaped frame 100 having M*N equally spaced hollow grooves, wherein the hollow grooves are accommodating cavities 101, and M and N are both natural numbers greater than or equal to 2; the hollow grooves have at least one opening, namely, a first opening, and of course, may also have two openings including a first opening and a second opening to form a through groove;

[0048] The semiconductor cooler 200 is a device based on the Peltier effect; it usually transfers heat from one end of the device to the other end while forcing a direct current to pass through; the end where the heat is dissipated becomes cold; the end where the heat is moved becomes hot; when the current is reversed, the previously cold end becomes hot and the previously hot end becomes cold.

[0049] Among them, the temperature control component 300 can be a temperature control circuit board or a controller. The temperature control component 300 is connected to each of the semiconductor refrigerators 200 through a wire. When an external power supply inputs current, the output temperature direction of the semiconductor refrigerator 200 is adjusted by controlling the forward and reverse directions of the current input into the semiconductor refrigerator 200. The temperature control component 300 can be installed on the frame 100 or be set separately.

[0050] The semiconductor refrigerator 200 can be arranged in the accommodating cavity 101 by placement, snap connection, embedding connection, etc.

[0051] In some embodiments of the present application, the device further comprises:

[0052] A plurality of temperature measuring elements 600 are disposed in the corresponding accommodating chamber 101 , and the temperature measuring elements 600 are used to detect the temperature of the semiconductor refrigerator 200 .

[0053] The temperature measuring element 600 is a temperature sensor, which is installed in the accommodating cavity 101 and can measure the temperature of each semiconductor refrigerator 200. The current is adjusted according to the measured temperature of the semiconductor refrigerator 200 to achieve the temperature difference between adjacent semiconductor refrigerators 200 and achieve precise control of the target temperature difference. At the same time, the current temperature of each semiconductor refrigerator 200 can also be displayed to facilitate management and adjustment. When a fault occurs, it is possible to promptly know which semiconductor refrigerator 200 has failed through the temperature measuring unit, so as to carry out maintenance and replacement.

[0054] In some embodiments of the present application, the temperature measuring element 600 is electrically connected to the temperature control component 300 , and the temperature measuring element 600 feeds back the measured temperature of the semiconductor refrigerator 200 to the temperature control component 300 .

[0055] The temperature measuring element 600 feeds back the measured temperature of the semiconductor refrigerator 200 to the temperature control component 300. The temperature control component 300 detects the real-time temperatures of the cold surface of the semiconductor refrigerator 200 and the hot surface of the adjacent semiconductor cooling plate through the temperature measuring element 600, and adjusts the current to achieve precise control of the target temperature difference. In addition, the target temperature difference can be set on the temperature control component 300. Through the combination of the temperature measuring element 600 and the temperature control component 300, an automated temperature control process can be achieved to achieve a preset target temperature difference. This is convenient and fast, and has a high degree of automation and intelligence.

[0056] In some embodiments of the present application, the device further comprises:

[0057] The communication module 400 is electrically connected to the temperature control component 300 and is used for information interaction with a host computer to send the temperature information of the semiconductor refrigerator 200 to the host computer and receive information from the host computer.

[0058] The communication module 400 can be a communication network terminal, which can be a router or Bluetooth adapter through a local area network, 2G, 3G, 4G, 5G, 6G, or a wired network port or a wireless Bluetooth interface to achieve communication connection with an external host computer, thereby realizing information exchange with the host computer. The information exchange process includes sending the temperature information of the semiconductor refrigerator 200 measured by the temperature measuring element 600 to the host computer, storing and displaying it on the host computer for management by the operator of the host computer. At the same time, it can also receive information from the host computer. According to the information sent by the host computer, the temperature difference of adjacent semiconductor refrigerators 200 can be set in the temperature control component 300.

[0059] In some embodiments of the present application, the frame 100 further has a second opening communicating with the accommodating cavity 101 , the semiconductor refrigerator 200 is embedded in the accommodating cavity 101 , and the second end of the semiconductor refrigerator 200 is exposed from the second opening of the accommodating cavity 101 .

[0060] The semiconductor refrigerator 200 is embedded in the accommodating cavity 101, and the first end of the semiconductor refrigerator 200 is exposed from the first opening, and the second end of the semiconductor refrigerator 200 is exposed from the second opening, so that the double-sided chessboard setting can be realized, and opposite chessboards can be formed on both sides. Both sides can form a temperature difference between adjacent target grid units. One infrared calibration device can be used as two infrared calibration scenes, which can reduce the production cost by half, and can perform tests at the same time, reduce power consumption, and facilitate control.

[0061] In some embodiments of the present application, an isolation portion 102 is formed between adjacent accommodating cavities 101 , and the isolation portion 102 is provided with a line groove communicating with the accommodating cavity 101 , and the line groove is used for arranging a line.

[0062] The checkerboard-shaped frame 100 is provided with line grooves and a receiving cavity 101. When the semiconductor cooler 200 of a target grid unit is damaged or malfunctions, it can be conveniently replaced and repaired, thus avoiding the problem of scrapping and waste of the entire checkerboard-shaped infrared calibration device and the increase in cost.

[0063] In some embodiments of the present application, the device further comprises:

[0064] A display component 500 , wherein the display component 500 is electrically connected to the temperature control component 300 , and the display component 500 is used to display the temperature of each of the semiconductor refrigerators 200 .

[0065] The display can display the temperature of the semiconductor refrigerator 200 measured by the temperature measuring element 600, as well as the temperature difference between adjacent semiconductor refrigerators 200, so that the staff can timely understand the status of the semiconductor refrigerator 200 and adjust the temperature difference as needed at any time.

[0066] The display component 500 may be a display screen or a touch screen. The touch screen may also be used as an input module to input information to set the temperature difference information in the temperature control component 300.

[0067] In some embodiments of the present application, the first end of the semiconductor refrigerator 200 is set to white or black, wherein the first ends of the semiconductor refrigerators 200 adjacent to any semiconductor refrigerator 200 whose first ends are white are all black.

[0068] By setting the first end of the semiconductor refrigerator 200 to white or black, it is easy to distinguish adjacent semiconductor refrigerators 200, so that the infrared calibration device presents a black and white alternating checkerboard, which is convenient for calibration.

[0069] An embodiment of the present invention further provides a testing device, which includes:

[0070] Infrared calibration device as described above.

[0071] The test equipment of this embodiment, through the infrared calibration device, effectively solves the technical problem that heating through overall heat conduction will cause uneven heating of the chessboard grids, resulting in large temperature differences in the same color target grids.

[0072] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the welding equipment described above can refer to the corresponding process in an embodiment of an infrared calibration device, which will not be repeated here.

[0073] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0074] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An infrared calibration device, characterized in that: The device comprises: A frame, wherein the frame is provided with a plurality of accommodating cavities having first openings, and the accommodating cavities are arranged in a checkerboard pattern; a plurality of semiconductor refrigerators, wherein the semiconductor refrigerators are disposed in the corresponding accommodating chambers, and the first ends of the semiconductor refrigerators are exposed at the first openings; and A temperature control component, the temperature control component is electrically connected to each of the semiconductor refrigerators, and the temperature control component is used to control the adjacent semiconductor refrigerators to access currents in opposite directions; The frame also has a second opening communicating with the accommodating cavity, the semiconductor refrigerator is embedded in the accommodating cavity, and the second end of the semiconductor refrigerator is exposed from the second opening of the accommodating cavity; The first end of any semiconductor refrigerator inputting reverse current is cooled to form a cold surface target grid, and the first end of the semiconductor refrigerator adjacent to it forms a hot surface target grid.

2. The infrared calibration device according to claim 1, characterized in that: The device also includes: A plurality of temperature measuring elements are provided in the corresponding accommodating chambers, and the temperature measuring elements are used to detect the temperature of the semiconductor refrigerator.

3. The infrared calibration device according to claim 2, characterized in that: The temperature measuring element is electrically connected to the temperature control component, and the temperature measuring element feeds back the measured temperature of the semiconductor refrigerator to the temperature control component.

4. The infrared calibration device according to claim 3, characterized in that: The device also includes: A communication module, the communication module is electrically connected to the temperature control component and is used for information interaction with a host computer to send the temperature information of the semiconductor refrigerator to the host computer and receive information from the host computer.

5. The infrared calibration device according to claim 4, characterized in that: The communication module includes an Internet port and a Bluetooth interface.

6. The infrared calibration device according to claim 1, characterized in that: An isolation portion is formed between the adjacent accommodating cavities, and the isolation portion is provided with a line groove communicated with the accommodating cavity, and the line groove is used for arranging the line.

7. The infrared calibration device according to claim 3, characterized in that: The device also includes: A display component is electrically connected to the temperature control component, and is used to display the temperature of each of the semiconductor refrigerators.

8. The infrared calibration device according to claim 1, characterized in that: The first end of the semiconductor refrigerator is set to be white or black, wherein the first ends of the semiconductor refrigerators adjacent to any semiconductor refrigerator whose first end is white are all black.

9. A testing device, characterized in that: The device comprises: An infrared calibration device as described in any one of claims 1 to 8.

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