A method of manufacturing a carrier plate, a carrier plate, and a semiconductor packaging method

Abstract

The application provides a manufacturing method of a carrier plate, the carrier plate and a semiconductor packaging method. The manufacturing method of the carrier plate comprises the following steps: providing a plate body; grinding the surface of the plate body to form a grinding surface; arranging a positioning hole on the grinding surface according to a preset position; and processing the grinding surface to improve the contrast between the positioning hole and the grinding surface outside the positioning hole, thereby forming a carrier plate with the positioning hole. The above embodiment improves the contrast between the positioning hole and the grinding surface outside the positioning hole by processing the grinding surface, thereby improving the identification of the positioning hole, improving the accuracy of positioning and improving the utilization rate of the carrier plate.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly to a method for manufacturing a substrate, the substrate, and a semiconductor packaging method. Background Technology

[0002] In semiconductor packaging processes, it is common to mount die onto a substrate for encapsulation. During mounting, the substrate typically has positioning devices to facilitate the placement machine's identification and placement of the die at the corresponding position. However, in some technologies, the placement machine fails to recognize certain positioning devices, preventing die placement at these locations and impacting the substrate's utilization rate. Summary of the Invention

[0003] One aspect of this application provides a method for manufacturing a carrier plate, comprising:

[0004] Provide the board body;

[0005] The surface of the plate is ground to form a grinding surface;

[0006] Positioning holes are set at preset positions on the grinding surface, and the grinding surface is processed to improve the contrast between the positioning holes and the grinding surface outside the positioning holes, forming a carrier plate with positioning holes.

[0007] Optionally, the process of grinding the surface includes:

[0008] A protective film layer is attached to the grinding surface.

[0009] Optionally, the step of setting positioning holes at preset positions on the grinding surface and processing the grinding surface includes:

[0010] Positioning holes are provided on the grinding surface at preset positions;

[0011] A first protective film layer is attached to the surface of the plate with positioning holes, and the first protective film layer is attached to the surface where the grinding surface is located.

[0012] Optionally, the first protective film layer is a transparent film layer.

[0013] Optionally, the step of setting positioning holes at preset positions on the grinding surface and processing the grinding surface includes:

[0014] A second protective film layer is applied to the grinding surface;

[0015] Positioning holes are set at preset positions on the grinding surface where the second protective film layer is applied.

[0016] Optionally, the second protective film layer is an opaque film layer.

[0017] Optionally, applying a protective film layer to the polishing surface includes:

[0018] The protective film layer is pressed onto the polishing surface;

[0019] The protective film is heated to solidify it onto the polishing surface.

[0020] Optionally, the step of setting positioning holes at preset positions on the grinding surface and processing the grinding surface includes:

[0021] The grinding surface is then polished.

[0022] Positioning holes are set at preset positions on the polished grinding surface.

[0023] Another aspect of this application provides a carrier plate, the carrier plate comprising:

[0024] The plate has a grinding surface, and the grinding surface is provided with multiple positioning holes;

[0025] A protective film layer is affixed to the polished surface of the board; wherein the protective film layer includes a first protective film layer, which is a transparent film layer, or the protective film layer includes a second protective film layer, which is an opaque film layer.

[0026] Another aspect of this application provides a semiconductor packaging method, comprising:

[0027] A carrier plate is provided; the carrier plate is as described above;

[0028] Identify the positioning holes and attach the bare film using the positioning holes as a reference;

[0029] The bare die is then packaged.

[0030] The carrier board manufacturing method, carrier board, and semiconductor packaging method provided in this application embodiment involve grinding the surface of the board to form a grinding surface; setting positioning holes at preset positions on the grinding surface; and processing the grinding surface to improve the contrast between the positioning holes and the grinding surface outside the positioning holes, thereby improving the recognition of the positioning holes, improving the accuracy of chip positioning, and improving the utilization rate of the carrier board. Attached Figure Description

[0031] Figure 1 This is a flowchart of a method for manufacturing a carrier plate according to an exemplary embodiment of this application.

[0032] Figure 2This is a flowchart illustrating a method for setting positioning holes and processing grinding surfaces according to an exemplary embodiment of this application.

[0033] Figure 3(a) is based on Figure 2 A positioning recognition view of a positioning device for a carrier plate formed by the manufacturing method of the carrier plate shown.

[0034] Figure 3(b) is the binarized view corresponding to the positioning and recognition view shown in Figure 3(a).

[0035] Figure 4 This is a flowchart illustrating another method for setting positioning holes and processing grinding surfaces according to an exemplary embodiment of this application.

[0036] Figure 5(a) is based on Figure 4 A positioning recognition view of a positioning device for a carrier plate formed by the manufacturing method of the carrier plate shown.

[0037] Figure 5(b) is the binarized view corresponding to the positioning and recognition view shown in Figure 5(a).

[0038] Figure 6 This is a flowchart illustrating another method for setting positioning holes and processing grinding surfaces according to an exemplary embodiment of this application.

[0039] Figure 7 This is a flowchart of a semiconductor packaging method according to an exemplary embodiment of this application. Detailed Implementation

[0040] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0041] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless otherwise defined, the technical or scientific terms used in this application should be understood in their ordinary sense by one of ordinary skill in the art to which this application pertains. The words “a” or “one” and similar terms used in this application specification and claims do not indicate a limitation of quantity, but rather indicate the presence of at least one. “A plurality” means two or more. The words “comprising” or “including” and similar terms mean that the element or object preceding “comprising” or “including” covers the element or object listed following “comprising” or “including” and its equivalents, and do not exclude other elements or objects. The words “connected” or “linked” and similar terms are not limited to physical or mechanical connections and can include electrical connections, whether direct or indirect. The words “above” and / or “below” and similar terms are for ease of description only and are not limited to a location or spatial orientation. The singular forms “a,” “the,” and “the” used in this application specification and appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0042] In semiconductor packaging processes, it is common to mount die-on components onto a substrate for encapsulation. During mounting, the substrate typically has positioning devices to facilitate identification by the mounting device, allowing the die to be placed at the corresponding position. However, in related technologies, the mounting device sometimes fails to recognize certain positioning devices (such as positioning holes), preventing die placement at these locations and affecting the utilization rate of the substrate. Stainless steel and other metal materials are chosen as substrates due to their low coefficient of thermal expansion, resistance to deformation during high-temperature processes, and the durability and long service life of structures formed from these materials. The inventors discovered that grinding marks are easily left on the surface of metal substrates after surface treatment. For substrates using positioning holes as positioning devices, some positioning holes are affected by these grinding marks on the substrate surface, leading to positioning failures and preventing die placement at these holes.

[0043] To address the aforementioned problems of the carrier board, this application provides a method such as... Figure 1 The method for manufacturing the carrier plate shown. Figure 1 This is a flowchart of a carrier board manufacturing method 100 according to an exemplary embodiment of this application. Please refer to... Figure 1 and combine when necessary Figures 2 to 6 As shown, the method 100 for manufacturing the carrier plate includes the following steps S10 to S30:

[0044] In step S10, a plate is provided.

[0045] In step S20, the surface of the plate is ground to form a grinding surface.

[0046] In some embodiments, the plate material can be stainless steel. Of course, other metal materials can also be used.

[0047] In this embodiment, a grinding device can be used to grind the surface of the plate.

[0048] In some embodiments, the grinding equipment may be equipped with a grinding wheel with a grit size of less than 100 mesh. Specifically, this grinding wheel can be used to grind the surface of the plate.

[0049] In step S30, positioning holes are set at preset positions on the grinding surface, and the grinding surface is processed to improve the contrast between the positioning holes and the grinding surface outside the positioning holes, thereby forming a carrier plate with positioning holes.

[0050] In the above embodiment, during the carrier board manufacturing process, the surface of the board is first ground to form a ground surface. Then, positioning holes are formed on the ground surface at predetermined positions, and the ground surface is further processed to improve the contrast between the positioning holes and the ground surface outside the positioning holes, thus forming a carrier board with positioning holes. The carrier board formed using this manufacturing method helps to reduce the impact of grinding marks on the carrier board surface on the positioning holes, improves the recognizability of the positioning holes on the carrier board, thereby improving the accuracy of patch positioning and increasing the utilization rate of the carrier board.

[0051] In specific implementation, step 30 above can be achieved by setting positioning holes at preset positions on the grinding surface in various ways, and by processing the grinding surface to improve the contrast between the positioning holes and the grinding surface outside the positioning holes. For example, a protective film layer can be set on the grinding surface to partially cover the grinding marks. Alternatively, the grinding surface can be polished to reduce or diminish the grinding marks.

[0052] Please combine Figures 2 to 3(b) In some embodiments, step S30 described above can be specifically implemented through methods such as... Figure 2 The method 300 for setting positioning holes and processing the grinding surface shown includes the following steps S301 and S302:

[0053] In step S301, positioning holes are set on the grinding surface at preset positions.

[0054] In some embodiments, laser drilling can be used to create positioning holes at preset positions on the polished surface. Of course, in other embodiments, other drilling methods, such as mechanical drilling, can also be used to create the positioning holes.

[0055] In step S302, a first protective film layer is applied to the surface of the plate with positioning holes. The first protective film layer is applied to the surface where the grinding surface is located.

[0056] This step S302 can be specifically implemented through the following steps S3021 and S3022.

[0057] In step S3021, the first protective film layer is pressed onto the polishing surface.

[0058] In step S3022, the first protective film layer is heated to solidify the first protective film layer material onto the grinding surface.

[0059] It should be noted that the curing temperature of the first protective film layer is higher than the molding temperature used in the subsequent molding process. The molding temperature referred to here can be understood as the highest heating temperature provided during the molding process. Preferably, the curing temperature of the first protective film layer is at least 10 degrees Celsius higher than the molding temperature used in the subsequent molding process to avoid delamination or cracking of the first protective film layer during molding.

[0060] In some embodiments, the first protective film layer is a transparent film layer. The material of the first protective film layer may include resin-based materials. Accordingly, the first protective film layer is a transparent resin film.

[0061] The inventors discovered through research that a first protective film layer, when its thickness meets certain conditions, can effectively improve the recognition rate of positioning holes by the patch panel. Experiments showed that when the thickness of the first protective film layer is approximately the same as or less than the depth of the positioning hole, the first protective film layer effectively improves the recognition rate. For example, in some embodiments, the depth of the positioning hole can be approximately 25 μm. Accordingly, the thickness of the first protective film layer can be set to be less than or equal to 25 μm to improve the recognition rate of the positioning hole by the patch panel. Of course, in other embodiments, the depth of the positioning hole can be set to other heights, such as 20 μm, 28 μm, 30 μm, etc. Accordingly, the thickness of the first protective film layer can be set according to the depth of the positioning hole. With a first protective film layer meeting the thickness condition, in the view recognized by the patch panel, the first protective film layer can effectively reduce the grinding marks on the carrier surface, resulting in a higher contrast between the positioning hole and the grinding surface outside the positioning hole, and a clearer boundary of the positioning hole, thereby improving the recognition of the positioning hole.

[0062] In some embodiments, based on the rheological characteristics of the first protective film layer during the curing process, in the initial stage of heating the first protective film layer to the curing temperature, the viscosity of the first protective film layer decreases as the temperature increases, and a portion of the first protective film layer above the positioning hole can move into the positioning hole. During the continued heating process, this portion of the first protective film layer can be cured in the positioning hole, so that a portion of the first protective film layer is formed in the positioning hole.

[0063] The first protective film layer in the positioning hole can reduce the impact of the carrier plate itself on the positioning hole and prevent the black material inside the hole from being carried out during subsequent cleaning, thereby improving the recognition rate of the positioning hole by the pick and place machine. At the same time, it can also protect the positioning hole and reduce the occurrence of positioning hole recognition failure due to the fading of the positioning hole color.

[0064] Furthermore, after step S301 and before step S302, the method for manufacturing the carrier board also includes step S303.

[0065] In step 303, the surface of the board with positioning holes is cleaned to remove debris and impurities generated during the grinding and drilling process, which facilitates the application of the first protective film layer and improves the adhesion between the first protective film layer and the board surface.

[0066] For adopting such Figure 2 The carrier plate formed by the method shown can be identified in a patch device when performing positioning hole identification, as shown in Figure 3(a). The view shown in Figure 3(a) is... Figure 2 After value-based processing, a binarized view as shown in Figure 3(b) can be obtained. In this embodiment, the first protective film layer has a reflective effect, and the brightness of the image corresponding to the board surface identified by the patching device is higher than the brightness of the image corresponding to the positioning hole. The views shown in Figures 3(a) and 3(b) are obtained by the patching device reading the black target (positioning hole). As shown in Figures 3(a) and 3(b), it can be seen that the contrast between the positioning hole 2000 and the board surface 1000 outside the positioning hole is high, the boundary of the positioning hole 2000 is relatively clear, and the positioning hole 1000 can be effectively identified by the patching device.

[0067] Please combine Figure 4 In other embodiments, step S30 described above can be specifically implemented as follows: Figure 4 The method 310 for setting positioning holes and processing the grinding surface shown includes the following steps S311 and S312:

[0068] In step S311, a second protective film layer is applied to the grinding surface.

[0069] In some embodiments, the second protective film layer is an opaque film layer. The material of the second protective film layer may include resin-based materials. Accordingly, the second protective film layer is an opaque resin film.

[0070] Step S311 can be specifically implemented through the following steps S3111 and S3112.

[0071] In step S3111, the second protective film layer is pressed onto the polishing surface.

[0072] In step S3112, the second protective film layer is heated to solidify the second protective film layer material onto the grinding surface.

[0073] It should be noted that the curing temperature of the second protective film layer is higher than the molding temperature used in the subsequent molding process. The molding temperature referred to here can be understood as the highest heating temperature provided during the molding process. Preferably, the curing temperature of the second protective film layer is at least 10 degrees Celsius higher than the molding temperature used in the subsequent molding process to avoid delamination or cracking of the second protective film layer during molding.

[0074] In step S312, positioning holes are set at preset positions on the grinding surface on which the second protective film layer is attached.

[0075] In some embodiments, laser drilling can be used to create positioning holes at preset positions on the polished surface. Of course, in other embodiments, other drilling methods, such as mechanical drilling, can also be used to create the positioning holes.

[0076] It should be noted that when setting the positioning holes in step S312, the corresponding area on the second protective film layer is also opened up to form an opening in the second protective film layer at the location corresponding to the positioning holes, allowing the positioning holes to be exposed through this opening. Of course, this opening can also be formed before setting the positioning holes, and it can also be formed in other ways. This results in a carrier plate with positioning holes and a second protective film layer on the polished surface outside the positioning holes. This implementation method, which involves first applying the second protective film layer and then setting the positioning holes, can reduce or eliminate the impact of poor surface treatment of the board on the quality of the positioning holes.

[0077] For adopting such Figure 4 The carrier plate formed by the method shown can be identified in a patch device when performing positioning hole identification, as shown in Figure 5(a). The view shown in Figure 5(a) is... Figure 2After value-based processing, a binarized view as shown in Figure 5(b) can be obtained. In this embodiment, the second protective film layer has a light-absorbing effect, and the brightness of the image corresponding to the board surface identified by the patching device is lower than the brightness of the image corresponding to the positioning hole. The views shown in Figures 5(a) and 5(b) are obtained by the patching device reading the white target (positioning hole). As shown in Figures 5(a) and 5(b), it can be seen that the contrast between the positioning hole 2000' and the board surface 1000' outside the positioning hole is high, the boundary of the positioning hole 1000' is relatively clear, and the positioning hole 1000' can be effectively identified by the patching device.

[0078] Furthermore, prior to step S311 above, the method for manufacturing the carrier board also includes step S313.

[0079] In step 313, the grinding surface is cleaned to remove debris, impurities, etc. generated during the grinding process, which facilitates the application of the second protective film layer and improves the adhesion between the second protective film layer and the board surface (i.e., the grinding surface).

[0080] Please combine Figure 6 As shown, step S30 above can be specifically achieved through, as follows: Figure 4 The method 320 for setting positioning holes and processing the grinding surface shown includes the following steps S321 and S322:

[0081] In step S321, the grinding surface is polished.

[0082] In step S322, positioning holes are set at preset positions on the polished grinding surface to form a carrier plate.

[0083] In some embodiments, the grinding surface is polished using a grinding wheel or sandpaper.

[0084] Furthermore, in some embodiments, the grinding wheel or sandpaper used has a grit size greater than 400 mesh to improve the polishing effect of the grinding surface. The polished grinding surface has reduced or faded grinding marks, thereby increasing the contrast between the positioning hole and the outer grinding surface, resulting in a higher recognition rate for the positioning hole.

[0085] In some embodiments, laser drilling can be used to create positioning holes at preset positions on the polished surface. Of course, in other embodiments, other drilling methods, such as mechanical drilling, can also be used to create the positioning holes.

[0086] Furthermore, after step S322 above, the method for manufacturing the carrier board also includes step S323 below.

[0087] In step 323, the carrier plate formed in step S322 is cleaned to remove debris, impurities, etc. generated during the polishing process.

[0088] In addition, this application provides a carrier plate, which may include a plate body and a protective layer attached to the plate body.

[0089] Specifically, the board has a polished surface, and the polished surface has multiple positioning holes. The polished surface is formed by polishing the surface of the board using polishing equipment.

[0090] The protective film layer is applied to the polished surface of the board.

[0091] In some embodiments, the protective film layer includes a first protective film layer. The first protective film layer is a transparent film layer.

[0092] The inventors discovered through research that a first protective film layer, when its thickness meets certain conditions, can effectively improve the recognition rate of the positioning hole by the patch device. Through experiments, the inventors found that when the thickness of the first protective film layer is approximately the same as the depth of the positioning hole, or when the thickness of the first protective film layer is less than the depth of the positioning hole, the setting of the first protective film layer can effectively improve the recognition rate of the positioning hole by the patch device. For example, in some embodiments, the depth of the positioning hole can be approximately 25 μm. Correspondingly, the thickness of the first protective film layer is less than 25 μm to improve the recognition rate of the positioning hole by the patch device. Of course, in other embodiments, the depth of the positioning hole can also be set to other heights, such as 20 μm, 28 μm, 30 μm, etc. Accordingly, the thickness of the first protective film layer can be set according to the depth of the positioning hole.

[0093] In other embodiments, the protective film layer includes a second protective film layer. The second protective film layer is an opaque film layer. The second protective film layer has an opening corresponding to the positioning hole, through which the positioning hole can be exposed.

[0094] The specific structure of the carrier plate, the first protective film layer, and other specific features of the second protective film layer can be referred to the relevant descriptions in the other embodiments above, and will not be repeated here.

[0095] This application also provides a semiconductor packaging method. Please refer to... Figure 7 As shown, Figure 7 This is a flowchart of a semiconductor packaging method 1 according to an exemplary embodiment of this application. The semiconductor packaging method includes the following steps S11 to S13.

[0096] In step S11, a carrier plate is provided. The carrier plate referred to here can be understood as the carrier plate described in the above embodiments. The specific structure of the carrier plate can be referred to in the relevant descriptions above, and will not be repeated here.

[0097] In step S12, the positioning hole is identified and the bare film is attached using the positioning hole as a reference.

[0098] The placement device can identify positioning holes on a carrier plate under a certain light source and place the bare die at the position corresponding to the identified positioning hole. For embodiments where a protective film is applied to the carrier plate, the color of the protective film should be different from the color of the light source used by the placement device to identify the positioning hole.

[0099] In step S13, the bare die is packaged.

[0100] After step S12, an encapsulation structure layer can be formed on the carrier board on which the bare die is attached to encapsulate at least a portion of the bare die. Specifically, it can be formed by laminating an epoxy resin film or ABF (Ajinomoto buildup film), or by injection molding, compression molding, or transfer molding of an epoxy resin compound. This application does not limit the encapsulation method of the bare die and can be set according to the specific application environment.

[0101] In this application, the structural embodiments and method embodiments can complement each other without conflict.

[0102] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A method for manufacturing a carrier plate, the carrier plate being used to mount bare dies and form a packaging structure layer in a semiconductor packaging process, characterized in that, The application relates to a manufacturing method of a carrier plate. Providing a plate body; The material of the plate body is a metal material; Grinding the surface of the plate body to form a grinding surface; Setting a positioning hole on the grinding surface according to a preset position, and processing the grinding surface to improve the contrast between the positioning hole and the grinding surface outside the positioning hole, thereby forming a carrier plate with the positioning hole; The processing of the grinding surface comprises: Pasting a protective film layer on the grinding surface; the protective film layer is a resin material film; the thickness of the protective film layer is the same as the depth of the positioning hole or the thickness of the protective film layer is smaller than the depth of the positioning hole.

2. The method of manufacturing a carrier plate according to claim 1, wherein The setting of the positioning hole on the grinding surface according to the preset position and the processing of the grinding surface comprise: Setting the positioning hole on the grinding surface according to the preset position; Pasting a first protective film layer on the surface of the plate body with the positioning hole; the first protective film layer is pasted on the surface with the grinding surface.

3. The method of manufacturing a carrier plate according to claim 2, wherein The first protective film layer is a transparent film layer.

4. The method of manufacturing a carrier plate according to claim 1, wherein The setting of the positioning hole on the grinding surface according to the preset position and the processing of the grinding surface comprise: Pasting a second protective film layer on the grinding surface; Setting the positioning hole on the grinding surface with the pasted second protective film layer according to the preset position.

5. The method of manufacturing a carrier plate according to claim 4, wherein The second protective film layer is an opaque film layer.

6. The method of manufacturing a carrier plate according to claim 1, wherein The pasting of the protective film layer on the grinding surface comprises: Pressing the protective film layer on the grinding surface; Heating the protective film layer to solidify the protective film layer on the grinding surface; the solidification temperature of the protective film layer is higher than the plastic sealing temperature adopted in the subsequent plastic sealing process; the plastic sealing temperature is the highest heating temperature provided in the plastic sealing process.

7. The method of manufacturing a carrier plate according to claim 1, wherein The setting of the positioning hole on the grinding surface according to the preset position and the processing of the grinding surface comprise: Carrying out polishing treatment on the grinding surface; Setting the positioning hole on the grinding surface after the polishing treatment according to the preset position.

8. A carrier plate, characterized by The carrier plate is prepared by the manufacturing method of the carrier plate in any one of claims 1 to 7, and the carrier plate comprises: A plate body with a grinding surface provided with a plurality of positioning holes; A protective film layer pasted on the grinding surface of the plate body; wherein the protective film layer comprises a first protective film layer which is a transparent film layer, or the protective film layer comprises a second protective film layer which is an opaque film layer.

9. A semiconductor packaging method, characterized by, The application relates to a manufacturing method of a carrier plate. Providing a carrier plate; The carrier plate is the carrier plate in any one of claims 1 to 7; Identifying the positioning hole and pasting a die on the basis of the positioning hole; Packaging the die.

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