A full-automatic cleaning and drying device for silicon wafer

Abstract

The application discloses a kind of full-automatic cleaning spin-drying equipment of silicon wafer, it is related to the field of silicon wafer production, including cleaning tank, the inside of the cleaning tank is provided with multiple groups of cleaning bin, the inside of each group of cleaning bin is equipped with water spraying mechanism, the top of the cleaning tank is connected with slide rail, the lower portion of the slide rail is provided with moving mechanism, the bottom end of the moving mechanism is hung with hanging basket.The application is provided with hanging basket, motor and mounting column, after the silicon wafer in the hanging basket is cleaned, the hanging basket is moved to the vicinity of mounting column by moving mechanism, the hanging basket is clamped with mounting column through fixing rod, the motor is started, the motor drives the hanging basket to rotate through mounting column, the moisture in the hanging basket is discharged through drainage bevel under the action of centrifugal force, and when the hanging basket rotates, the air outside is brought into the air groove in the hanging basket through the first air inlet and the second air inlet opened on both sides, and the airflow is discharged through the interception net to dry the outside of silicon wafer.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer production, specifically to a fully automatic silicon wafer cleaning and drying equipment. Background Technology

[0002] Silicon is a semiconductor material, but its conductivity is not very good. However, its resistivity can be precisely controlled by adding appropriate dopants. Before manufacturing semiconductors, silicon must be converted into silicon wafers. In the production of silicon wafers, polycrystalline silicon is usually mixed with multiple other raw materials and melted in a crucible. After cooling, it forms a silicon ingot, which is then cut into multiple silicon wafer blanks. After polishing, the desired silicon wafers are formed.

[0003] After production, silicon wafers typically have a lot of dust and damage on their surface, requiring cleaning. Current cleaning methods usually involve placing the silicon wafers in a basket and then immersing them in multiple cleaning tanks. However, to secure the wafers, the baskets often use internal clamps, making it difficult to clean the connection between the clamps and the wafer. Furthermore, after cleaning, the wafers need to be spun dry. To prevent the wafers from falling off during this process, the entire basket is usually placed inside a brush dryer, which is inconvenient and inefficient. Summary of the Invention

[0004] Based on this, the purpose of the present invention is to provide a fully automatic silicon wafer cleaning and drying device to solve the technical problems of incomplete cleaning and inconvenience in drying silicon wafers.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a fully automatic silicon wafer cleaning and drying device, comprising a cleaning tank, wherein the cleaning tank has multiple cleaning chambers inside, each of which is equipped with a water spraying mechanism; a slide rail is connected to the top of the cleaning tank, and a moving mechanism is provided below the slide rail; a basket is suspended from the bottom of the moving mechanism; a partition is installed in the middle of the basket, and a drainage groove is provided at the bottom of the partition; multiple sets of fixing plates are installed on both sides of the drainage groove inside the basket, and a groove for placing silicon wafers is provided between each pair of adjacent fixing plates; the basket has a bottom plate. The base plate has multiple sets of drainage sloping openings located below the fixed plate. The outer sides of the two side walls of the suspended basket are respectively provided with a first air inlet and a second air inlet, with the opening directions of the first air inlet and the second air inlet being upward and downward, respectively. Air grooves are provided inside the two side walls of the suspended basket, and each set of air grooves is connected to the air inlet of the corresponding side wall. One-way bearings are provided at both ends of the suspended basket, and rectangular fixing rods are sleeved on the outer side of the one-way bearings. A sealing plate is provided on one side of the cleaning tank, and a motor is installed inside the sealing plate. The output end of the motor is connected to a mounting column, and the inside of the mounting column is provided with a groove that matches the fixing rod.

[0006] By adopting the above technical solution, silicon wafers can be easily moved into the cleaning chamber for cleaning using a basket. After cleaning, the silicon wafers are moved between the sealing plates, and the basket is rotated by a motor and mounting columns to spin-dry the silicon wafers, thus improving efficiency.

[0007] The invention is further configured such that a moving wheel is installed at the top of the moving mechanism, the moving mechanism is slidably connected to the slide rail through the moving wheel, a cylinder is connected to each end of the moving mechanism, a connecting plate is connected to the output end of each set of cylinders, and a lifting hole is installed inside the connecting plate, and the basket is movably connected to the lifting hole of the connecting plate through a fixing rod.

[0008] By adopting the above technical solution, the position of the suspended basket can be easily moved and controlled, allowing the suspended basket to move above the cleaning tank.

[0009] The invention is further configured such that a locking groove is provided at the bottom end of the suspended basket, the suspended basket is connected to the top end of the water spraying mechanism through the locking groove, and the bottom plate can fit against the bottom end of the water spraying mechanism. The cross-section of the drainage outlet is a trumpet shape with a larger opening at the top and a smaller opening at the bottom.

[0010] By adopting the above technical solution, water can be sprayed into the basket through a water spraying mechanism during cleaning. The water flow passes through the drainage inlet to rinse the silicon wafers. During the spin-drying process, the water droplets can be discharged from the basket through the drainage inlet.

[0011] The invention is further configured such that an intercepting net is connected to one side of the air trough, the intercepting net is connected to the side of the fixing plate, and a filter screen is also provided on the side wall of the drainage trough, and the drainage trough is attached to the side of the fixing plate through the filter screen.

[0012] By adopting the above technical solution, silicon wafers can be intercepted by the interception net, thereby limiting and fixing the silicon wafers.

[0013] The present invention is further configured such that a baffle is installed at the bottom end of the sealing plate, the baffle is a retractable folding plate, a slot is provided between the sealing plate and the cleaning chamber, and the baffle extends to the space between the sealing plate and the cleaning chamber through the slot.

[0014] By adopting the above technical solution, the baffle can intercept the water splashed during spin drying, preventing water from falling into the washing chamber and causing pollution.

[0015] The present invention is further configured such that the top of the water spraying mechanism has multiple sets of nozzles, and each set of nozzles is aligned with the gap between the fixed plate; the bottom of the water spraying mechanism is equipped with multiple sets of support columns; the water spraying mechanism is fixed to the bottom of the cleaning chamber by the support columns; and a water pump is installed between the multiple sets of support columns, wherein the input end of the water pump does not contact the bottom of the cleaning chamber.

[0016] By adopting the above technical solution, water can be supplied to the basket through a water spraying mechanism to clean the edge of the silicon wafer.

[0017] The invention is further configured such that multiple sets of limiting mechanisms are installed inside the partition, and the number of limiting mechanisms matches the number of intervals between the fixed plates. Each set of limiting mechanisms consists of steel balls and protruding rods. The inside of the basket is provided with a vertical sliding groove that matches the steel balls. The end of the protruding rod is fixed to the top of the sliding groove, and the end of the protruding rod located in the sliding groove has a downward-facing inclined surface. A return spring is sleeved on the outside of the protruding rod, and the protruding rod is movably connected to the partition through the return spring. The end of the protruding rod extends above the gap between the fixed plates.

[0018] By adopting the above technical solution, when the silicon wafer is spun dry, the steel ball moves under the action of centrifugation and squeezes the inclined surface at the end of the protruding rod, so that the protruding rod extends and limits the top of the silicon wafer, preventing the silicon wafer from falling out of the basket.

[0019] In summary, the present invention has the following main beneficial effects:

[0020] 1. This invention, through the design of a cleaning chamber, a hanging basket, a drainage inlet, and a water spraying mechanism, enables the water pump within the water spraying mechanism to drive the cleaning fluid in the cleaning chamber during silicon wafer cleaning. The cleaning fluid enters the hanging basket from below, specifically through the drainage inlet and drainage channel, thereby rinsing the contact area between the silicon wafer and the substrate, as well as the outer surface of the silicon wafer. This improves cleaning efficiency and effectively solves the problem of incomplete silicon wafer cleaning.

[0021] 2. This invention, through the installation of a basket, motor, and mounting column, allows the basket to be moved to the vicinity of the mounting column after the silicon wafers inside are cleaned. The basket is then engaged with the mounting column via a fixing rod. The motor is started, and it drives the basket to rotate via the mounting column. The moisture inside the basket is discharged through the drainage outlet under the action of centrifugal force. As the basket rotates, it draws outside air into the air grooves inside the basket through the first and second air inlets on both sides. The airflow passes through the interception net and dries the outside of the silicon wafers. The airflow carrying moisture is discharged from the basket through the drainage grooves, thereby accelerating the drying effect of the silicon wafers, improving efficiency, and effectively solving the problem of inconvenient drying of silicon wafers.

[0022] 3. The present invention, through the setting of the basket and the limiting mechanism, enables the steel ball in the limiting mechanism to move under the action of centrifugal force when the silicon wafer is rotated and dried. The steel ball moves to the inclined surface at the end of the protruding rod, and pushes the protruding rod to the top of the silicon wafer through the inclined surface, thereby limiting and fixing the silicon wafer and preventing the silicon wafer from falling out of the basket during spin drying, thus improving the efficiency of use. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the present invention;

[0024] Figure 2 This is a cross-sectional structural diagram of the present invention;

[0025] Figure 3 This is a schematic diagram of the cross-sectional structure of the suspended basket of the present invention;

[0026] Figure 4 This is a schematic diagram of the cross-sectional structure of the drainage channel of the present invention;

[0027] Figure 5 This is a schematic cross-sectional view of the limiting mechanism of the present invention;

[0028] Figure 6 This is a schematic diagram of the water spray mechanism of the present invention;

[0029] Figure 7 This is a schematic diagram of the mounting structure of the fixing plate of the present invention;

[0030] Figure 8This is a schematic diagram of the motor mounting structure of the present invention;

[0031] Figure 9 This is a schematic diagram of the engagement structure between the mounting column and the fixing rod of the present invention.

[0032] In the diagram: 1. Cleaning tank; 101. Cleaning chamber; 102. Sealing plate; 2. Slide rail; 3. Moving mechanism; 301. Moving wheel; 302. Cylinder; 303. Connecting plate; 4. Suspended basket; 401. Fixing plate; 402. Partition; 403. Drainage trough; 404. Base plate; 405. Drainage inlet; 406. Engaging groove; 407. First air inlet; 408. Second air inlet; 409. Air trough; 410. Interception net; 411. One-way bearing; 412. Fixing rod; 5. Motor; 501. Mounting column; 6. Baffle; 7. Water spraying mechanism; 701. Nozzle; 702. Water pump; 703. Support column; 8. Limiting mechanism; 801. Steel ball; 802. Protruding rod; 803. Return spring. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0034] The embodiments of the present invention will now be described.

[0035] A fully automated silicon wafer cleaning and drying device, such as Figures 1 to 9As shown, the system includes a cleaning tank 1, inside which are multiple cleaning chambers 101. Each cleaning chamber 101 is equipped with a water spraying mechanism 7. The top of the water spraying mechanism 7 has multiple nozzles 701, and the bottom of the water spraying mechanism 7 is equipped with multiple support columns 703. The water spraying mechanism 7 is fixed to the bottom of the cleaning chamber 101 via the support columns 703. A water pump 702 is installed between the support columns 703, and the input end of the water pump 702 does not contact the bottom of the cleaning chamber 101. A slide rail 2 is connected to the top of the cleaning tank 1, and a moving mechanism 3 is located below the slide rail 2. A moving wheel 301 is installed at the top of the moving mechanism 3, and the moving mechanism 3 is slidably connected to the slide rail 2 via the moving wheel 301. A hanging basket 4 is suspended from the bottom of the moving mechanism 3. The structure 3 can easily move the basket 4 within the cleaning tank 1. A partition 402 is installed in the middle of the basket 4, with a drainage groove 403 at the bottom. Multiple sets of fixing plates 401 are installed on both sides of the drainage groove 403 inside the basket 4. A groove for placing silicon wafers is formed between each pair of adjacent fixing plates 401. During cleaning, the silicon wafers are sequentially placed into the grooves before the fixing plates 401, with each set of nozzles 701 aligned with the gaps between the fixing plates 401. The basket 4 has a base plate 404, with multiple sets of drainage slant outlets 405 below the fixing plates 401 inside the base plate 404. A first air inlet 407 and a second air inlet 408 are respectively provided on the outer sides of the two side walls of the basket 4. The first air inlet 407 and the second air inlet 408 open upwards and downwards respectively. Air grooves 409 are provided on both sides of the suspended basket 4, and each set of air grooves 409 is connected to the corresponding air inlet on the side wall. One-way bearings 411 are provided at both ends of the suspended basket 4, and rectangular fixing rods 412 are sleeved on the outer side of the one-way bearings 411. Cylinders 302 are connected to both ends of the moving mechanism 3, and a connecting plate 303 is connected to the output end of each set of cylinders 302. A lifting hole is installed inside the connecting plate 303. The suspended basket 4 is movably connected to the lifting hole of the connecting plate 303 via the fixing rods 412. The connecting plate 303 can drive the suspended basket 4 to move, and the cylinders 302 can allow the suspended basket 4 to enter the cleaning chamber 101 for cleaning. During the cleaning process, water... Pump 702 draws the cleaning fluid from the cleaning chamber 101 into the spray mechanism 7 and sprays it out through nozzle 701. The sprayed water enters the basket 4 and is sprayed out through the drainage outlet 405 on the bottom plate 404. The water cleans the silicon wafers, and the water is sprayed from below the silicon wafers, thus cleaning the bottom edge of the silicon wafers. The sprayed water also enters the basket 4 through the drainage channel 403 and is sprayed onto the side of the silicon wafers through the filter screen, thereby improving the cleanliness of the silicon wafers. A sealing plate 102 is provided on one side of the cleaning tank 1. A motor 5 is installed inside the sealing plate 102. The output end of the motor 5 is connected to a mounting post 501. The mounting post 501 has a groove inside that matches the fixing rod 412. After cleaning is completed...The lifting basket 4 is moved between the sealing plates 102 by the moving mechanism 3, and is engaged with the fixed rod 412 by the mounting column 501, so that the motor 5 can drive the lifting basket 4 to rotate, thereby drying the silicon wafers inside the lifting basket 4. During the drying process, the first air inlet 407 and the second air inlet 408 can draw outside air into the lifting basket 4 to air dry the silicon wafers and improve the drying efficiency. In addition, multiple sets of limiting mechanisms 8 are installed inside the partition plate 402, and the number of limiting mechanisms 8 matches the number of intervals of the fixed plate 401. Each set of limiting mechanisms 8 has steel balls 801. The protruding rod 802 forms a vertical groove inside the basket 4 that matches the steel ball 801. The end of the protruding rod 802 is fixed to the top of the groove, and the end of the protruding rod 802 inside the groove has a downward-facing slope. A return spring 803 is sleeved on the outside of the protruding rod 802, and the protruding rod 802 is movably connected to the partition plate 402 through the return spring 803. The end of the protruding rod 802 also extends above the gap between the fixed plates 401. The limiting mechanism 8 can limit the silicon wafer and prevent the silicon wafer from separating from the basket 4 during rotation.

[0036] Please see Figure 3 The bottom of the basket 4 is provided with a locking groove 406. The basket 4 is connected to the top of the water spraying mechanism 7 through the locking groove 406. The bottom plate 404 can fit with the bottom of the water spraying mechanism 7. The cross-section of the drainage outlet 405 is a funnel shape with a larger opening at the top and a smaller opening at the bottom, which can conveniently reduce the pressure of the water flow and reduce damage to the silicon wafer.

[0037] Please see Figure 3 One side of the air trough 409 is connected to an intercepting net 410, which is connected to the side of the fixing plate 401. A filter screen is also provided on the side wall of the drainage trough 403. The drainage trough 403 is attached to the side of the fixing plate 401 through the filter screen. The silicon wafer can be limited by the intercepting nets 410 and the filter screen.

[0038] Please see Figure 1 and Figure 2 A baffle 6 is installed at the bottom of the sealing plate 102. The baffle 6 is a retractable folding plate. A slot is provided between the sealing plate 102 and the cleaning chamber 101. The baffle 6 extends through the slot to the space between the sealing plate 102 and the cleaning chamber 101. The baffle 6 can prevent the water from falling into the cleaning chamber 101 and contaminating the cleaning solution when the silicon wafer is spun dry.

[0039] The working principle of this invention is as follows: After the silicon wafers are cut and polished, they are placed into the basket 4 in sequence. Each group of silicon wafers is installed by the fixing plate 401, and the top of the fixing plate 401 has a groove to facilitate the installation or removal of the silicon wafers. After the silicon wafers are installed, the basket 4 is engaged with the connecting plate 303 at the bottom of the moving mechanism 3. The moving wheel 301 at the top of the moving mechanism 3 is activated, thereby driving the basket 4 to move above the cleaning chamber 1. When the basket 4 reaches the top of each group of cleaning chambers 101, the moving wheel 301 is stopped, and the cylinder 302 is activated. The cylinder 302 pushes the basket 4 into the cleaning chamber 101 until the basket 4 engages with the water spraying mechanism 7 of the cleaning chamber 101. The engaging groove 406 at the bottom of the basket 4 aligns with the nozzle 701 at the top of the water spraying mechanism 7. Then, the water pump 702 is activated. The cleaning solution in the cleaning chamber 101 is drawn into the water spraying mechanism 7 and sprayed out through the nozzle 701. The sprayed water enters the basket 4 and is sprayed out through the drainage outlet 405 on the base plate 404. The water cleans the silicon wafer, and the water is sprayed out from below the silicon wafer, so as to clean the bottom edge of the silicon wafer. The sprayed water also enters the basket 4 through the drainage channel 403 and is sprayed onto the side of the silicon wafer through the filter screen, thereby improving the cleanliness of the silicon wafer. The drainage outlet 405 is a funnel shape with a larger top and a smaller bottom, which can effectively reduce the impact of the water flow, thereby reducing the impact of the water flow on the silicon wafer and avoiding damage to the silicon wafer during cleaning. After cleaning, the basket 4 is removed from the cleaning chamber 101 and moved to other cleaning chambers 101 for cleaning until the silicon wafer is cleaned.

[0040] After the silicon wafers are cleaned, the moving mechanism 3 moves the basket 4 between the sealing plates 102, so that the fixing rod 412 at the end of the basket 4 is inserted into the groove in the mounting column 501. Then, the baffle 6 is raised to isolate the basket 4 from the cleaning chamber 101. The motor 5 is started, and the output end of the motor 5 drives the mounting column 501 to rotate. The mounting column 501 rotates through the fixing rod 412 and the one-way bearing 411, thereby driving the basket 4 to rotate as a whole. When the basket 4 rotates, the centrifugal force cleans the water droplets attached to the outside of the silicon wafers and throws the water droplets out of the basket 4 through the drainage outlet 405. At the same time as the basket 4 rotates, a first air inlet 407 and a second air inlet 408 are opened on both sides of the basket 4, and the opening directions of the two sets of air inlets are opposite. When the basket rotates, it can draw in outside air through the air inlet into the basket 4, and blow the airflow onto the outside of the silicon wafer through the air groove 409 and the intercepting net 410. The air carrying moisture is discharged through the drain groove 403, which can quickly dry the silicon wafer and improve the efficiency of use. When the basket rotates, the baffle 6 can prevent the water from falling into the cleaning chamber 101 and prevent the cleaning chamber 101 from being contaminated. When the basket rotates, the centrifugal force can fix the silicon wafer, making the silicon wafer stick tightly to the base plate 404. When the basket rotates, the centrifugal force will drive the steel ball 801 to move, so that the steel ball 801 squeezes the inclined surface at the end of the protruding rod 802, and pushes the protruding rod 802 to extend to the top of the silicon wafer, thereby further limiting the silicon wafer.

[0041] After spin drying, motor 5 drives the mounting column 501 to rotate until the basket 4 returns to a vertically upward angle and remains stable. Then, motor 5 is started in reverse, causing the mounting column 501 to rotate in the opposite direction. The mounting column 501 drives the fixing rod 412 to rotate in the opposite direction around the one-way bearing 411. The fixing rod 412 pushes the outer teeth of the one-way bearing 411 to move inward through the internal toothed plate, so that the fixing rod 412 cannot drive the one-way bearing 411 to rotate synchronously, keeping the angle of the basket 4 from changing significantly. After the mounting column 501 drives the fixing rod 412 to rotate half a turn, the moving mechanism 3 is started again. The moving mechanism 3 drives the basket 4 to move, causing the fixing rod 412 to separate from the mounting column 501. The basket 4 is then removed from above the cleaning tank 1, and the silicon wafers in the basket 4 are then recovered for further processing.

[0042] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the invention and are not intended to limit it. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the invention, but such modifications, substitutions, and variations are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A fully automatic silicon wafer cleaning and drying device, comprising a cleaning tank (1), wherein the cleaning tank (1) has multiple cleaning chambers (101) inside, each cleaning chamber (101) is equipped with a water spraying mechanism (7), a slide rail (2) is connected to the top of the cleaning tank (1), a moving mechanism (3) is provided below the slide rail (2), and a basket (4) is suspended at the bottom of the moving mechanism (3), characterized in that: A partition (402) is installed in the middle of the interior of the suspended basket (4). A drainage groove (403) is provided at the bottom of the partition (402). Multiple sets of fixing plates (401) are installed on both sides of the drainage groove (403) inside the suspended basket (4). A groove for placing silicon wafers is provided between each pair of adjacent fixing plates (401). The suspended basket (4) has a bottom plate (404). Multiple sets of drainage sloping openings (405) are provided inside the bottom plate (404) below the fixing plates (401). A first air inlet (407) and a second air inlet (408) are provided on the outer sides of the two side walls of the suspended basket (4). The first air inlet (407) The opening directions of the second air inlet (408) are upward and downward respectively. Air grooves (409) are provided in the inner side walls of the basket (4). Each set of air grooves (409) is connected to the air inlet of the corresponding side wall. One-way bearings (411) are provided at both ends of the basket (4). A rectangular fixing rod (412) is sleeved on the outer side of the one-way bearing (411). A sealing plate (102) is provided on one side of the cleaning box (1). A motor (5) is installed inside the sealing plate (102). The output end of the motor (5) is connected to a mounting column (501). A groove matching the fixing rod (412) is provided inside the mounting column (501).

2. The fully automatic silicon wafer cleaning and drying equipment according to claim 1, characterized in that: The top of the moving mechanism (3) is equipped with a moving wheel (301). The moving mechanism (3) is slidably connected to the slide rail (2) through the moving wheel (301). The two ends of the moving mechanism (3) are respectively connected to cylinders (302). The output end of each set of cylinders (302) is connected to a connecting plate (303). The connecting plate (303) has a lifting hole installed inside. The basket (4) is movably connected to the lifting hole of the connecting plate (303) through a fixing rod (412).

3. The fully automatic silicon wafer cleaning and drying equipment according to claim 1, characterized in that: The bottom end of the suspended basket (4) is provided with a locking groove (406). The suspended basket (4) is connected to the top of the water spraying mechanism (7) through the locking groove (406). The bottom plate (404) can fit with the bottom end of the water spraying mechanism (7). The cross-section of the drainage oblique opening (405) is a trumpet shape with a larger opening at the top and a smaller opening at the bottom.

4. The fully automatic silicon wafer cleaning and drying equipment according to claim 1, characterized in that: One side of the air trough (409) is connected to an intercepting net (410), the intercepting net (410) is connected to the side of the fixing plate (401), and the side wall of the drainage trough (403) is also provided with a filter screen, and the drainage trough (403) is attached to the side of the fixing plate (401) through the filter screen.

5. The fully automatic silicon wafer cleaning and drying equipment according to claim 1, characterized in that: A baffle (6) is installed at the bottom of the sealing plate (102). The baffle (6) is a retractable folding plate. A slot is provided between the sealing plate (102) and the cleaning chamber (101). The baffle (6) extends through the slot to the space between the sealing plate (102) and the cleaning chamber (101).

6. The fully automatic silicon wafer cleaning and drying equipment according to claim 1, characterized in that: The top of the water spraying mechanism (7) has multiple sets of nozzles (701), and each set of nozzles (701) is aligned with the gap between the fixed plate (401). Multiple sets of support columns (703) are installed at the bottom of the water spraying mechanism (7). The water spraying mechanism (7) is fixed to the bottom of the cleaning chamber (101) by the support columns (703). A water pump (702) is installed between the multiple sets of support columns (703). The input end of the water pump (702) does not contact the bottom of the cleaning chamber (101).

7. The fully automatic silicon wafer cleaning and drying equipment according to claim 1, characterized in that: Multiple sets of limiting mechanisms (8) are installed inside the partition (402), and the number of limiting mechanisms (8) matches the number of intervals between the fixed plates (401). Each set of limiting mechanisms (8) consists of a steel ball (801) and a protruding rod (802). The inside of the hanging basket (4) is provided with a vertical sliding groove that matches the steel ball (801). The end of the protruding rod (802) is fixed to the top of the sliding groove, and the end of the protruding rod (802) located in the sliding groove has a downward inclined surface. A return spring (803) is sleeved on the outside of the protruding rod (802), and the protruding rod (802) is movably connected to the partition (402) through the return spring (803). The end of the protruding rod (802) extends above the gap between the fixed plates (401).

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