Display panel and display device

Abstract

The application discloses a display panel and a display device. The display panel has a first area and a second area arranged around at least part of the first area. The display panel comprises a substrate, an active layer arranged on one side of the substrate, and the active layer comprises an isolation portion arranged in the second area and around at least part of the first area. A first metal layer is arranged on the side of the active layer away from the substrate, and the first metal layer comprises a shielding portion. The orthogonal projection of the isolation portion on the substrate and the orthogonal projection of the shielding portion on the substrate are arranged in an overlapping manner. The application can reduce the electrostatic adsorption on the isolation portion, thereby improving the display panel defects caused by excessive static electricity on the isolation portion, and improving the yield of the display panel.

Description

TECHNICAL FIELD

[0001] The present application relates to the display field, and in particular to a display panel and a display device. BACKGROUND

[0002] Traditional electronic devices such as mobile phones, tablet computers and the like need to integrate front cameras, receivers and infrared sensing elements and the like. In the prior art, external light can enter the light sensing element located below the screen through the notch or hole on the screen. However, this will cause the layer structure around the hole area or the notch area to be different from the layer structure at other positions, resulting in display panel defects. SUMMARY

[0003] Embodiments of the present application provide a display panel and a display device, aiming to improve the yield of the display panel.

[0004] Embodiments of the first aspect of the present application provide a display panel, the display panel having a first area and a second area arranged around at least part of the first area, the display panel comprising: a substrate, an active layer located on one side of the substrate, the active layer comprising an isolation portion located in the second area and arranged around at least part of the first area; a first metal layer located on a side of the active layer away from the substrate, the first metal layer comprising a shielding portion, the orthogonal projection of the isolation portion on the substrate and the orthogonal projection of the shielding portion on the substrate being arranged in overlap.

[0005] According to the implementation of the first aspect of the present application, further comprising a plurality of signal lines, at least part of the signal lines being connected to the shielding portion.

[0006] According to any one of the preceding implementation forms of the first aspect of the present application, the width of the shielding portion is 3-5 μm.

[0007] According to any one of the preceding implementation forms of the first aspect of the present application, the width of the isolation portion is 2.5-3 μm.

[0008] According to any one of the preceding implementation forms of the first aspect of the present application, further comprising: a second metal layer located on a side of the active layer away from the substrate and arranged in stack with the first metal layer, the plurality of signal lines comprising power lines located in the second metal layer, at least part of the power lines being connected to the shielding portion.

[0009] According to any one of the preceding implementation forms of the first aspect of the present application, the shielding portion comprises:

[0010] a first shielding portion extending along the extension path of the isolation portion and covering at least part of the isolation portion; and / or

[0011] a second shielding portion arranged in intersection with the isolation portion.

[0012] According to any one of the foregoing embodiments of the first aspect of the present application, the power supply line comprises a surface power supply arranged around the first area, and the shielding portion comprises a first shielding portion connected to the surface power supply.

[0013] According to any one of the foregoing embodiments of the first aspect of the present application, the power supply line comprises a first power supply line and a second power supply line spaced apart along the first direction.

[0014] The first metal layer further comprises a power supply connection line extending along the first direction and connected to the first power supply line and the second power supply line via the first power supply line and the second power supply line, so that the first power supply line and the second power supply line are conductive to each other through the power supply connection line, and the shielding portion comprises a second shielding portion to which at least part of the power supply connection line is connected, and the second shielding portion is formed to extend along the second direction.

[0015] According to any one of the foregoing embodiments of the first aspect of the present application, the shielding portion comprises a first shielding portion and a second shielding portion, and the first shielding portion is connected to the power supply connection line through the second shielding portion.

[0016] According to any one of the foregoing embodiments of the first aspect of the present application, the isolation portion comprises a first isolation portion and a second isolation portion successively arranged and intersecting in the extension direction thereof, the first isolation portion is formed to extend along the first direction, the second isolation portion is formed to extend along the second direction, and a projection of the first isolation portion on the substrate and a projection of the second shielding portion on the substrate at least partially overlap.

[0017] According to any one of the foregoing embodiments of the first aspect of the present application, the second area further comprises a transition area and a main display area, the transition area is located between the main display area and the first area, and the isolation portion, the shielding portion, and the power supply connection line are located in the transition area.

[0018] According to any one of the foregoing embodiments of the first aspect of the present application, the first power supply line is located in the transition area, the second power supply line comprises a second main body portion and a second connection end for connecting the power supply connection line, the second main body portion is located in the second area and on a side of the isolation portion away from the first area, and the second connection end extends from the second main body portion toward the first power supply line.

[0019] According to any one of the foregoing embodiments of the first aspect of the present application, the first power supply line is located on a side of the isolation portion facing the first area, the second connection end is located on a side of the isolation portion away from the first area, the power supply connection line connects the second connection end and the first power supply line, and a projection of the power supply connection line on the substrate and a projection of the isolation portion on the substrate at least partially overlap.

[0020] According to any one of the foregoing embodiments of the first aspect of the present application, the first metal layer comprises a scan signal line and a data connection line, the scan signal line is located in the main display area, and the data connection line is located in the transition area.

[0021] According to any one of the foregoing embodiments of the first aspect of the present application, the second metal layer further comprises a plurality of data lines, at least two data lines are located on both sides of the first region in the first direction, and the data connection line is connected with the data line via holes located on both sides thereof in the first direction to enable the data lines located on both sides of the first region in the first direction to communicate with each other through the data connection line.

[0022] According to any one of the foregoing embodiments of the first aspect of the present application, the plurality of data connection lines are spaced apart in the transition region.

[0023] According to any one of the foregoing embodiments of the first aspect of the present application, the data connection line is located on the side of the isolation portion facing the first region.

[0024] According to any one of the foregoing embodiments of the first aspect of the present application, at least part of the first power supply line is provided with two second power supply lines on both sides in the first direction, and the two second power supply lines are connected with each other through the power supply connection line.

[0025] The first metal layer further comprises a bridge line located in the transition region, and at least part of the two power supply connection lines located on both ends of the first power supply line in the first direction are connected with the bridge line.

[0026] According to any one of the foregoing embodiments of the first aspect of the present application, the shielding portion and the bridge line are connected to the same power supply connection line; or

[0027] The power supply connection line comprises a first power supply connection line and a second power supply connection line, at least part of the first power supply connection line is connected to the shielding portion, and at least part of the second power supply connection line is connected to the bridge line.

[0028] According to any one of the foregoing embodiments of the first aspect of the present application, the active layer comprises a first semiconductor portion and a second semiconductor portion, the first semiconductor portion and the second semiconductor portion are located on both sides of the first region in the first direction, a plurality of first semiconductor portions are spaced apart along the second direction, and a plurality of second semiconductor portions are spaced apart along the second direction,

[0029] At least one group of at least two first semiconductor portions, at least two second semiconductor portions, at least one first semiconductor, and at least one second semiconductor are connected with each other through the isolation portion.

[0030] The embodiment of the second aspect of the present application provides a display device comprising the display panel of any one of the foregoing embodiments.

[0031] In the display panel provided by the embodiment of the present application, the display panel includes a first area and a second area, a photosensitive component such as a camera can be arranged in the first area, and normal display of the display panel can be realized in the second area. The display panel includes an active layer and a first metal layer, the active layer includes an isolation portion, the first metal layer includes a shielding portion, and the orthogonal projection of the isolation portion on a substrate and the orthogonal projection of the shielding portion on the substrate are arranged in an overlapping manner, so that the shielding portion can shield at least part of the isolation portion. In the preparation process of the display panel, because of the existence of the shielding portion, the part of the isolation portion that is shielded by the shielding portion is not doped when the active layer is doped, so that the resistance value of the part of the isolation portion is large, the electrostatic adsorption on the isolation portion can be reduced, and then the display panel defect caused by too much static electricity on the isolation portion can be improved, and the yield of the display panel can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0032] Other features, objects, and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments thereof as taken in conjunction with the accompanying drawings, in which like references denote like features, and in which:

[0033] Figure 1 FIG. 1 shows a top view of a display panel according to an embodiment of the present application;

[0034] Figure 2 is Figure 1 FIG. 2 shows a partial enlarged view of the Q region in FIG. 1;

[0035] Figure 3 is Figure 1 FIG. 3 shows an enlarged structural schematic view of a partial layer structure in FIG. 2;

[0036] Figure 4 is Figure 2 FIG. 4 shows a sectional view at B-B in FIG. 3;

[0037] Figure 5 is Figure 1 FIG. 5 shows an enlarged structural schematic view of a partial layer structure in another embodiment of the present application;

[0038] Figure 6 is Figure 1 FIG. 6 shows an enlarged structural schematic view of a partial layer structure in yet another embodiment of the present application;

[0039] Figure 7 is Figure 1 FIG. 7 shows an enlarged structural schematic view of a partial layer structure in still another embodiment of the present application;

[0040] Figure 8 is Figure 1 FIG. 8 shows an enlarged structural schematic view of a partial layer structure in yet another embodiment of the present application;

[0041] Figure 9 isFigure 2 A sectional view;

[0042] Figure 10 In another embodiment Figure 1 Enlarged schematic diagram of the middle layered structure;

[0043] Figure 11 This is a top view schematic diagram of a display device according to an embodiment of the present application;

[0044] Figure 12 Show Figure 11 Cross-sectional view along the DD direction.

[0045] Explanation of reference numerals in the attached figures:

[0046] 100. Display panel; 110. Subpixel;

[0047] 10. Substrate;

[0048] 20. Active layer; 210. Isolation section; 211. First isolation section; 212. Second isolation section; 220. First semiconductor section; 230. Second semiconductor section; 240. Third semiconductor section;

[0049] 30. First metal layer; 310. Shielding part; 311. First shielding part; 312. Second shielding part; 320. Power connection line; 330. Scan signal line; 340. Data connection line; 350. Bridging line;

[0050] 40. Second metal layer; 40a. Power line; 410. Surface power supply; 420. First power line; 430. Second power line; 440. Data line;

[0051] AA1, Zone 1; AA2, Zone 2; TA, Transition Zone; ZA, Main Display Zone; NA, Non-Display Zone;

[0052] Y, the first direction; X, the second direction. Detailed Implementation

[0053] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0054] It is to be understood that the terminology used herein such as first and second, and the like, is merely intended to differentiate one entity or operation from another entity or operation, without necessarily requiring or implying any actual such relationship or order between such entities or operations. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a", "comprises...", or "comprising", does not, without more constraints, preclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0055] It will be understood that, in the description of the structure of components, when one layer, one region is referred to as being "on" or "over" another layer, another region, it can be directly on the other layer, the other region, or there can also be another layer or region therebetween. Also, if the component is turned over, the layer, the region will be "under" or "underneath" the other layer, the other region.

[0056] On electronic devices such as mobile phones and tablets, it is necessary to integrate photosensitive components such as front cameras, infrared light sensors, proximity light sensors, etc. on the side where the display panel is arranged. In some embodiments, a light-transmitting area can be arranged on the electronic device, and the photosensitive components are arranged on the back of the light-transmitting area.

[0057] The light-transmitting area can be provided with sub-pixels to realize full-screen display of the display panel, or the light-transmitting area can not be provided with sub-pixels, that is, the light-transmitting area is a hole-punching area, and at this time, the light-transmitting area also does not provide a driving circuit for driving the display of the sub-pixels. When the light-transmitting area is provided with sub-pixels, the driving circuit for driving the display of the sub-pixels in the light-transmitting area can not be arranged in the light-transmitting area to further improve the light transmittance of the light-transmitting area. When the light-transmitting area is not provided with the driving circuit, there is a large difference between the layer structure of the light-transmitting area and the layer structure of other display areas, which can cause problems such as accumulation of static electricity on the side of the light-transmitting area, and thus cause the display panel to have defects.

[0058] The driving circuit includes a semiconductor part, and the semiconductor parts of the driving circuits in the same column are usually connected to each other. When the display panel includes a light-transmitting area and the light-transmitting area is not provided with a driving circuit, the semiconductor parts located on both sides of the light-transmitting area in the column direction are separated by the light-transmitting area, resulting in a size difference between the semiconductor parts located on both sides of the light-transmitting area and the semiconductor parts at other positions, and thus causing display differences.

[0059] In some embodiments, in order to improve the display effect, an isolation ring is arranged on the active layer at the side of the light transmission area, and the semiconductor part on both sides of the light transmission area in the column direction is connected through the isolation ring, so as to reduce the size difference between the semiconductor part on both sides of the light transmission area and the semiconductor part at other positions, and improve the display effect of the display panel.

[0060] The isolation ring is a semiconductor material layer. When the semiconductor part at other positions is heavily doped, the isolation ring can also be caused to be conductive by plasma injection. The inventor finds that the isolation ring with certain conductivity is easy to attract process static charges. The isolation ring is usually connected with other semiconductor parts to form a thin film transistor. This causes the charges to move to the semiconductor part through the isolation ring, and then be coupled to the gate of the thin film transistor, and finally cause the characteristics of the thin film transistor to deviate, causing the thin film transistors in the entire row of the driving circuit to fail, and then causing the display panel to be defective.

[0061] To solve the above problems, embodiments of the present application provide a display panel and a display device. The embodiments of the display panel and the display device will be described below with reference to the accompanying drawings.

[0062] Embodiments of the present application provide a display panel, which can be an organic light emitting diode (OLED) display panel.

[0063] Figure 1 FIG. 1 shows a top view of a display panel 100 according to an embodiment of the present application, Figure 2 FIG. 2 shows a top view of a display panel 100 according to an embodiment of the present application, Figure 1 FIG. 3 shows a partial enlarged view of a Q region in the display panel 100.

[0064] The display panel 100 has a first area AA1, a second area AA2, and a non-display area NA surrounding the first area AA1 and the second area AA2. The second area AA2 surrounds at least part of the first area AA1, and the light transmittance of the first area AA1 is greater than that of the second area AA2. In other embodiments, the display panel 100 can also not include the non-display area NA.

[0065] In this document, the light transmittance of the first area AA1 is preferably greater than or equal to 15%. In order to ensure that the light transmittance of the first area AA1 is greater than 15%, even greater than 40%, or even has a higher light transmittance, the light transmittance of each functional film layer of the display panel 100 in this embodiment is greater than 80%, and the light transmittance of at least part of the functional film layers is greater than 90%.

[0066] According to the display panel 100 of the embodiments of the present application, the light transmittance of the first area AA1 is greater than that of the second area AA2, so that the display panel 100 can integrate a photosensitive component on the back of the first area AA1, and realize the under-screen integration of the photosensitive component of the camera, for example.

[0067] The first area AA1 can be configured in various manners. Optionally, the first area AA1 can display a picture, increase the display area of the display panel 100, and realize a full-screen design of the display device. Alternatively, the first area AA1 is an opening area, no sub-pixel 110 is arranged in the first area AA1, and the first area AA1 cannot display. When the first area AA1 can display a picture, optionally, the first area AA1 includes a first sub-pixel 110, and a first driving circuit for driving the first sub-pixel 110 to display is located in the second area AA2, so as to further increase the light transmittance of the first area AA1.

[0068] Embodiments of the present application take the first area AA1 as an example, in which no sub-pixel 110 is arranged, and the first area AA1 cannot display. Optionally, the display panel 100 includes a sub-pixel 110 and a driving circuit located in the second area AA2, and the driving circuit is used to drive the sub-pixel 110 to emit light.

[0069] The sub-pixel 110 can include a first electrode, a second electrode, and a light-emitting structure located between the first electrode and the second electrode. The light-emitting structure can include a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer, etc. The first electrode can be a pixel electrode and is connected with the driving circuit. The second electrode can be a common electrode.

[0070] Please refer to Figures 2 to 4 , Figure 3 is Figure 1 an enlarged structural schematic view of some layer structures in Figure 4 is Figure 2 a partial cross-sectional view of B-B in

[0071] As shown in Figure 2 and Figure 4 , the display panel 100 provided by the embodiments of the present application includes a substrate 10 and an active layer 20 and a first metal layer 30 arranged on the substrate 10. The active layer 20 is located on one side of the substrate 10, and the active layer 20 includes an isolation portion 210 arranged in the second area AA2 and surrounding at least part of the first area AA1. The first metal layer 30 is located on the side of the active layer 20 away from the substrate 10, and the first metal layer 30 includes a shielding portion 310. The orthogonal projection of the isolation portion 210 on the substrate 10 is arranged in overlapping with the orthogonal projection of the shielding portion 310 on the substrate 10.

[0072] Optionally, the active layer 20 includes a semiconductor material, so that when a part of the active layer 20 is subjected to plasma injection, the part of the active layer 20 can conduct electricity.

[0073] In the display panel 100 provided in the embodiments of the present application, the display panel 100 comprises an active layer 20 and a first metal layer 30, the active layer 20 comprises an isolation portion 210, the first metal layer 30 comprises a shielding portion 310, and the orthogonal projection of the isolation portion 210 on the substrate 10 is arranged to overlap the orthogonal projection of the shielding portion 310 on the substrate 10, so that the shielding portion 310 can shield at least part of the isolation portion 210. In the preparation process of the display panel 100, because of the existence of the shielding portion 310, when the active layer 20 is doped, the part of the isolation portion 210 shielded by the shielding portion 310 is not doped, so that the resistance value of the part of the isolation portion 210 is larger, the amount of static electricity adsorbed on the isolation portion 210 can be reduced, and then the display panel 100 defects caused by too much static electricity on the isolation portion 210 can be improved, and the yield of the display panel 100 can be improved.

[0074] The substrate 10 can be arranged in various ways. Optionally, the substrate 10 comprises a substrate, and the substrate can be made of a light-transmitting material such as glass, polyimide (PI), etc. The substrate 10 can further comprise a support layer on the side of the substrate away from the active layer 20, and the support layer can comprise a steel plate layer and / or a foam layer. A buffer layer or other layer structure can be arranged between the substrate and the active layer 20.

[0075] The active layer 20 can be arranged in various ways. In some optional embodiments, please continue to refer to Figure 3 The active layer 20 comprises a first semiconductor portion 220 and a second semiconductor portion 230, the first semiconductor portion 220 and the second semiconductor portion 230 are located on both sides of the first area AA1 in the first direction Y, a plurality of first semiconductor portions 220 are arranged at intervals along the second direction X, and a plurality of second semiconductor portions 230 are arranged at intervals along the second direction X. The first direction Y is the column direction. Figure 3 Only part of the first semiconductor portion 220 and the second semiconductor portion 230 are shown in the figure, and in other embodiments, the first semiconductor portion 220 and the second semiconductor portion 230 can also be arranged in other ways.

[0076] Optionally, the active layer 20 further comprises a third semiconductor portion 240 located in the second area AA2, the third semiconductor portion 240 is located on at least one side of the first area AA1 in the second direction X, and the second direction X is the row direction. Then the third semiconductor portion 240 can be arranged to extend along the first direction Y, and the third semiconductor portion 240 can fill an entire column, and the extension size of the first semiconductor portion and the second semiconductor portion 230 in the first direction Y is smaller than that of the third semiconductor portion 240. Figure 3 Only the position of one of the third semiconductor portions 240 is shown in the figure, and in other embodiments, the third semiconductor portion 240 can also be multiple, and the third semiconductor portion 240 can also be in other shapes, as long as the third semiconductor portion 240 is located on one side of the first area AA1 in the second direction X.

[0077] In some embodiments, the at least two first semiconductor portions 220 are connected to each other by the isolation portion 210, which can increase the extension size of the first semiconductor portion 220, and further reduce the size difference between the first semiconductor portion 220 and the third semiconductor portion 240, and improve the display effect of the display panel 100. Optionally, multiple first semiconductor portions 220 are connected to each other by the same isolation portion 210, so as to further improve the display difference of the display panel 100.

[0078] In some embodiments, the at least two second semiconductor portions 230 are connected to each other by the isolation portion 210, which can increase the extension size of the second semiconductor portion 230, and further reduce the size difference between the second semiconductor portion 230 and the third semiconductor portion 240, and improve the display effect of the display panel 100. Optionally, multiple second semiconductor portions 230 are connected to each other by the same isolation portion 210, so as to further improve the display difference of the display panel 100.

[0079] In yet some embodiments, the at least one first semiconductor portion 220 and the at least one second semiconductor portion 230 are connected to each other by the isolation portion 210, so as to improve the display difference.

[0080] In some embodiments, the isolation portion 210 is arranged in a closed ring around the first area AA1, and the first semiconductor portion 220 and the second semiconductor portion 230 located on both sides of the first area AA1 in the first direction Y are connected to each other by the isolation portion 210. On the one hand, the structure of the active layer 20 can be simplified, and on the other hand, the display difference of the display panel 100 can be improved.

[0081] In some optional embodiments, the display panel 100 further comprises a plurality of signal lines, and at least part of the signal lines are connected to the shielding portion 310. In this way, the shielding portion 310 is no longer a separate metal component, and the shielding portion 310 can release static electricity through the signal lines, so as to avoid the accumulation of static electricity on the shielding portion 310 and affect the yield of the display panel 100. These signal lines can be located in the first metal layer 30 or other metal layers, as long as these signal lines can transmit signals.

[0082] Optionally, the number of the shielding portion 310 can be multiple, and multiple shielding portions 310 are arranged at intervals around the first area AA1. The corresponding relationship between the signal lines and the shielding portion 310 can be various, for example, multiple shielding portions 310 can be arranged on the same signal line, multiple shielding portions 310 are distributed at intervals along the extension direction of the signal line, or one shielding portion 310 is arranged on the same signal line. In yet some embodiments, part of the signal lines can be connected with the shielding portion 310, and another part of the signal lines can be not connected with the shielding portion 310.

[0083] The signal lines can include a data signal line for transmitting a data signal, a power signal line for transmitting a power signal, a voltage reference line for transmitting a voltage reference signal, a scan signal line for transmitting a scan signal, and the like.

[0084] In some alternative embodiments, please refer to Figure 4 , the display panel 100 further includes a second metal layer 40 located on the side of the active layer 20 away from the substrate 10 and stacked with the first metal layer 30, and the plurality of signal lines include a power line 40a located on the second metal layer 40, and at least part of the power line 40a is connected to the shielding part 310.

[0085] In these alternative embodiments, the power line 40a is used to transmit a power signal, and the power signal has a signal stability characteristic, so that the signal on the shielding part 310 is stable, and the disturbance caused by the unstable signal on the shielding part 310 can be avoided, further improving the yield of the display panel 100.

[0086] Alternatively, the second metal layer 40 can be disposed on the side of the first metal layer 30 facing the substrate 10, or the second metal layer 40 can be disposed on the side of the first metal layer 30 away from the substrate 10. Alternatively, an insulating layer is provided between the first metal layer 30 and the second metal layer 40, and the insulating layer is provided with an opening to connect the first power line 420, the second power line 430 and the power connection line 320 through the via.

[0087] In this embodiment, the second metal layer 40 is located on the side of the first metal layer 30 away from the substrate 10, so that the distance between the first metal layer 30 and the isolation part 210 is closer, and the distance between the shielding part 310 and the isolation part 210 is closer, so that the off-state transistor can be formed between the shielding part 310 and the isolation part 210.

[0088] Alternatively, the shielding part 310 can be consistent with the extension direction of the isolation part 210, that is, the shielding part 310 surrounds the first area AA1 and covers the isolation part 210, which can increase the overlapping area of the shielding part 310 and the isolation part 210, and further improve the resistance of the isolation part 210. Alternatively, the shielding part 310 can intersect with the extension direction of the isolation part 210, which facilitates the preparation and formation of the shielding part 310.

[0089] In some embodiments, please refer to Figure 5 , the shielding part 310 includes a first shielding part 311, which is arranged along the extension path of the isolation part 210 and covers at least part of the isolation part 210. For example, the first shielding part 311 is arranged around the first area AA1, which can increase the overlapping area of the shielding part 310 and the isolation part 210, and further improve the resistance of the isolation part 210.

[0090] Optionally, the first shielding part 311 is in a closed ring shape, and the first shielding part 311 can disperse process charges, thereby reducing the static electricity of the isolation part 210.

[0091] In some other embodiments, referring to Figure 2 and Figure 3 , the shielding part 310 includes a second shielding part 312, and the second shielding part 312 is arranged to cross the isolation part 210, thereby facilitating the preparation and molding of the second shielding part 312. Since the second shielding part 312 is arranged to cross the isolation part 210, at least part of the isolation part 210 is not shielded by the second shielding part 312, and this part of the isolation part 210 is heavily doped during the preparation process to have a conductive property, thereby forming a thin film transistor with the second shielding part 312, forming a large resistance at the part shielded by the second shielding part 312, avoiding the flow of charges on the isolation part 210, and inhibiting the conduction of static electricity.

[0092] In still some other embodiments, the shielding part 310 can include both the first shielding part 311 and the second shielding part 312.

[0093] The power line 40a of the second metal layer 40 can be arranged in various ways, and in some optional embodiments, referring to Figure 6 , the power line 40a includes a surface power supply 410 arranged around the first area AA1, and the first shielding part 311 is connected to the surface power supply 410.

[0094] In the present application, the surface power supply 410 refers to a power line 40a with a large width, and is not a power supply arranged on the entire surface of the second area AA2. The surface power supply 410 is arranged around the first area AA1, thereby facilitating the connection of other power lines located adjacent to the first area AA1 to the surface power supply 410. Since the surface power supply 410 is arranged around the first area AA1, when the first shielding part 311 extends along the extension path of the isolation part 210 and the first shielding part 311 is arranged around the first area AA1, the first shielding part 311 can extend to the surface power supply 410, thereby enabling the second shielding part 312 to be connected to the surface power supply 410 through a via, and facilitating the mutual connection of the first shielding part 311 and the surface power supply 410. The connection of the first shielding part 311 to the surface power supply 410 also enables the first shielding part 311 to have a stable electrical signal, thereby avoiding the interference of the first shielding part 311 in a suspended state with the signal.

[0095] Optionally, an insulating layer is arranged between the first metal layer 30 and the second metal layer 40, and the first shielding part 311 and the surface power supply 410 are connected through a via. That is, a via is formed on the insulating layer between the first metal layer 30 and the second metal layer 40, and the first shielding part 311 and the surface power supply 410 are connected through the via on the insulating layer.

[0096] In some optional embodiments, referring to Figure 7The power line 40a includes the first power line 420 and the second power line 430 which are spaced apart along the first direction Y, and the first metal layer 30 includes the power connection line 320 which extends along the first direction Y and is connected to the first power line 420 and the second power line 430 through a via hole, so that the first power line 420 and the second power line 430 are conductive to each other through the power connection line 320. At least part of the power connection line 320 is connected to the second shielding portion 312 which extends along the second direction X.

[0097] In these optional embodiments, the first power line 420 and the second power line 430 of the second metal layer 40 are switched through the power connection line 320 of the first metal layer 30. Generally, the first power line 420 and the second power line 430 are switched near the isolation portion 210, so that part of the power connection line 320 is close to the isolation portion 210. Connecting the first shielding portion 311 to the power connection line 320 can simplify the layer structure of the first metal layer 30. The power connection line 320 and the first shielding portion 311 extend along different directions, so that the second shielding portion 312 does not affect the connection between the power connection line 320 and the first power line 420 and / or the second power line 430.

[0098] Optionally, referring to Figure 8 When the shielding portion 310 includes both the first shielding portion 311 and the second shielding portion 312, the first shielding portion 311 can be connected to the power connection line 320 through the second shielding portion 312, so that the first shielding portion 311 is connected to the first power line 420 and / or the second power line 430 through the power connection line 320.

[0099] The first shielding portion 311 can also be connected to the surface power supply 410 and connected to the second shielding portion 312 and the power connection line 320 through the second shielding portion 312.

[0100] In some optional embodiments, referring to Figure 7 and Figure 8 The isolation portion 210 includes the first isolation portion 211 and the second isolation portion 212 which are arranged in sequence and intersected along the extending direction of the isolation portion 210. The first isolation portion 211 extends along the first direction Y, and the second isolation portion 212 extends along the second direction X. The first isolation portion 211 and the second isolation portion 212 are arranged in intersection, so that the distance between the isolation portion 210 and the first area AA1 is reduced, and the shape of the isolation portion 210 is more suitable for the shape of the edge of the first area AA1.

[0101] Optionally, the first isolation portion 211 and the second shielding portion 312 are arranged at least partially overlapping on the substrate 10. The first isolation portion 211 and the second shielding portion 312 are arranged in different directions, which facilitates the second shielding portion 312 extending towards the first isolation portion 211 and shielding the first isolation portion 211, and the second shielding portion 312 does not need to be bent, which can simplify the shape of the second shielding portion 312. Optionally, the second isolation portion 212 and the second shielding portion 312 are arranged staggered on the substrate 10. Further, the second isolation portion 212 and the second shielding portion 312 are arranged parallel on the substrate 10.

[0102] In some other embodiments, referring to Figure 5 and Figure 9 When the isolation portion 210 includes the first isolation portion 211 and the second isolation portion 212, the first shielding portion 311 includes a first extension section extending along the first direction Y, and the first shielding portion 311 also includes a second extension section extending along the second direction X, and at least part of the first isolation portion 211 is located within the projection of the first extension section on the substrate 10, and at least part of the second isolation portion 212 is located within the projection of the second extension section on the substrate 10. This can further increase the overlapping area of the first shielding portion 311 and the isolation portion 210, and increase the resistance of the isolation portion 210.

[0103] Optionally, the width of the shielding portion 310 is 3 μm to 5 μm. For example, when the shielding portion 310 is formed extending along the second direction X, the width direction of the shielding portion 310 is the first direction Y, and the width of the shielding portion 310 is the extension size of the shielding portion 310 in the first direction Y. When the shielding portion 310 extends along the first direction Y, the width direction of the shielding portion 310 is the second direction X. When the shielding portion 310 includes the first shielding portion 311, the width direction of the first shielding portion 311 is perpendicular to the extension direction of the first shielding portion 311.

[0104] Optionally, the width of the isolation portion 210 is 2.5 μm to 3 μm. For example, the width of the first isolation portion 211 is 2.5 μm to 3 μm. The first isolation portion 211 is formed extending along the first direction Y, and the width direction of the first isolation portion 211 is the second direction X, and the extension size of the first isolation portion 211 in the second direction X is 2.5 μm to 3 μm. The width of the second isolation portion 212 is 2.5 μm to 3 μm. The second isolation portion 212 is formed extending along the second direction X, and the width direction of the second isolation portion 212 is the first direction Y, and the extension size of the second isolation portion 212 in the first direction Y is 2.5 μm to 3 μm.

[0105] In some optional embodiments, referring to Figure 1 , Figures 7 to 9The second area AA2 further includes a transition area TA and a main display area ZA. The transition area TA is located between the main display area ZA and the first area AA1. The isolation portion 210, the shielding portion 310, and the power connection line 320 are located in the transition area TA. The main display area ZA is used to realize the display of the display panel 100. The isolation portion 210, the shielding portion 310, and the power connection line 320 are arranged in the transition area TA, which can improve the influence of the transition area TA on the display effect of the main display area ZA.

[0106] Optionally, when the first area AA1 is circular, the transition area TA can surround the first area AA1 in a circular ring shape. When the first area AA1 is polygonal, the transition area TA can surround the first area AA1 in a polygonal ring structure, as long as the transition area TA is located between the main display area ZA and the first area AA1.

[0107] Since the main display area ZA is used to realize the display of the display panel 100, the sub-pixel 110 and the driving circuit are located in the main display area ZA. That is, the main display area ZA is arranged with the driving circuit, and the transition area TA does not need to be arranged with the driving circuit, which can cause the density of the metal wiring in the transition area TA to be low and unable to release process static electricity. The shielding portion 310 is arranged in the transition area TA, the overall resistance of the isolation portion 210 is improved, the amount of static electricity adsorbed by the isolation portion 210 is reduced, and the yield of the display panel 100 is improved.

[0108] When the display panel 100 includes the transition area TA and the main display area ZA, the first power line 420 is in the transition area TA, and the second power line 430 includes a second main portion and a second connection end for connecting the power connection line 320. The second main portion is in the second area AA2 and located on the side of the isolation portion 210 away from the first area AA1. The second connection end extends from the second main portion toward the first power line 420.

[0109] In these optional embodiments, the second main portion is connected to the driving circuit in the main display area ZA to provide power to the driving circuit. The end of the second connection end can be located on the side of the isolation portion 210 facing the first area AA1, or the end of the second connection end can be located on the side of the isolation portion 210 away from the first area AA1, as long as the power connection line 320 can be connected to the second power line 430 through the second connection end.

[0110] Optionally, the first power line 420 is located on the side of the isolation portion 210 facing the first area AA1, and at least part of the second connection end of the second power line 430 is located on the side of the isolation portion 210 away from the first area AA1. The power connection line 320 connects the second connection end and the first power line 420, and at least part of the orthogonal projection of the power connection line 320 on the substrate 10 and the orthogonal projection of the isolation portion 210 on the substrate 10 at least partially overlap.

[0111] In these alternative embodiments, the partial power connection line 320 connects the first power line 420 and the second connection end of the second power line 430 across the isolation portion 210, i.e., the orthographic projection of the partial power connection line 320 on the substrate 10 and the orthographic projection of the isolation portion 210 on the substrate 10 are at least partially overlapped, so that the power connection line 320 can shield a part of the isolation portion 210, further improving the electrical resistance of the isolation portion 210.

[0112] In other embodiments, the first power line 420 is located on the side of the isolation portion 210 facing the first area AA1, the second connection end extends to the side of the isolation portion 210 facing the first area AA1 from the second main portion, and the power connection line 320 connects the first power line 420 and the second connection end on the side of the isolation portion 210 facing the first area AA1.

[0113] In these alternative embodiments, the second connection end extends to the side of the isolation portion 210 facing the first area AA1 and is connected to the via of the power connection line 320, which can increase the distance between the power connection line 320 and the second main portion, avoiding the influence of the power connection line 320 on the connection between the second main portion and the driving circuit.

[0114] Applicants have found that, since there is a large area of blank in the first area AA1, i.e., there is no metal layer in the first area AA1 to disperse static electricity, it is more likely to cause failure of the thin film transistor, the scan line cannot be effectively discharged, and the display defect caused by the scan line defect may occur.

[0115] In some alternative embodiments, please refer to Figures 7 to 10 , the first metal layer 30 further includes scan signal lines 330 and data connection lines 340, the data connection lines 340 are located in the transition area TA, and the scan signal lines 330 are located in the main display area ZA. In these alternative embodiments, by arranging the data connection lines 340 in the transition area TA, the metal material distribution area of the first metal layer 30 in the transition area TA can be increased, and these data connection lines 340 can assist in discharging static electricity of the scan signal lines 330 in the first metal layer 30, thereby improving the display defect caused by the scan signal line 330 defect.

[0116] In some alternative embodiments, the second metal layer 40 further includes a plurality of data lines 440, at least two data lines 440 are located on both sides of the first area AA1 in the first direction Y, and the data connection lines 340 are connected to the data lines 440 located on both sides thereof in the first direction Y through the via, so that the data lines 440 located on both sides of the first area AA1 in the first direction Y are connected to each other through the data connection lines 340.

[0117] In the alternative embodiments, the data lines 440 located on both sides of the first area AA1 in the first direction Y are switched by the data connection lines 340 located in the transition area TA. That is, the switching of the data lines 440 is located in the transition area TA, which can increase the metal material distribution area of the first metal layer 30 in the transition area TA and improve the static electricity on the scan signal line 330 in the first metal layer 30. Alternatively, the two data lines 440 connected by the data connection line 340 are used to connect a plurality of driving circuits located in the same column to realize column driving of the display panel 100.

[0118] The first area AA1 can be provided with a plurality of data lines 440 on both sides in the first direction Y, and the data lines 440 located in the same column are connected by a data connection line 340. This makes the transition area TA provided with a plurality of data connection lines 340, and the plurality of data connection lines 340 are arranged at intervals in the transition area TA to ensure the insulation of the data connection lines 340.

[0119] In addition, in the display panel 100 provided in the embodiments of the present application, the data lines 440 located on both sides of the first area AA1 in the first direction are switched by the data connection lines 340 located in the first metal layer 30, that is, the plurality of data connection lines 340 arranged side by side in the second direction X are all located in the first metal layer 30. Compared with the plurality of data connection lines 340 arranged side by side in the second direction X which are alternatively located in the first metal layer 30 and the second metal layer 40, the metal material distribution area of the first metal layer 30 can be further increased, and the ability of the data connection line 340 to disperse the static electricity on the scan signal line 330 can be improved.

[0120] Alternatively, at least part of the data connection lines 340 are arranged to be bent around the first area AA1 to reduce the distance between the data connection lines 340 and the first area AA1, reduce the distribution area of the transition area TA, and reduce the area ratio of the non-display area.

[0121] Alternatively, the data connection lines 340 are located on the side of the isolation portion 210 facing the first area AA1, which on the one hand reduces the distribution area of the data connection lines 340 in the main display area ZA and on the other hand avoids the influence of the data connection lines 340 on the wiring in the main display area ZA.

[0122] Alternatively, at least part of the data connection lines 340 and the first power lines 420 are arranged to at least partially overlap in the orthographic projection on the substrate 10 to reduce the total metal material distribution area of the transition area TA, reduce the size of the transition area TA, and reduce the area ratio of the non-display area in the display panel 100.

[0123] In some alternative embodiments, please refer to Figure 10The two second power lines 430 are arranged on both sides of at least part of the first power line 420 in the first direction Y, and the two second power lines 430 are in communication with the first power line 420 through the power connection lines 320. The first metal layer 30 further comprises a bridge line 350 located in the transition area TA, and the bridge line 350 is connected between the two power connection lines 320 located at both ends of the first power line 420 in the first direction Y.

[0124] In these optional embodiments, two second power lines 430 are arranged on both sides of at least part of the first power line 420, and the first power line 420 is in communication with the two second power lines 430 through the two power connection lines 320. The bridge line 350 is connected between the two power connection lines 320 located at both ends of the first power line 420, that is, the bridge line 350 is connected in parallel with the first power line 420 through the two power connection lines 320. By adding the bridge line 350, the signal line density of the transition area TA in the first metal layer 30 can be further improved, the metal material distribution area and the electrostatic discharge capability of the transition area TA in the first metal layer 30 can be improved, and the yield of the display panel 100 can be better improved.

[0125] Optionally, at least part of the bridge line 350 extends in the first direction Y to simplify the wiring shape of the bridge line 350.

[0126] When the first metal layer 30 comprises both the shielding part 310 and the bridge line 350, the shielding part 310 and the bridge line 350 can be connected to the same power connection line 320, or the shielding part 310 and the bridge line 350 can be connected to different power connection lines 320. For example, the power connection line 320 comprises a first power connection line and a second power connection line, at least part of the first power connection line is connected to the shielding part 310, and at least part of the second power connection line is connected to the bridge line 350.

[0127] Optionally, the shielding part 310 and / or the bridge line 350 can be connected to part of the power connection lines 320, and the other part of the power connection lines 320 is neither connected to the shielding part 310 nor connected to the bridge line 350. The shielding part 310 can be connected to part of the power connection lines 320 close to the isolation part 210 in the second direction X, and the bridge line 350 can be connected to part of the power connection lines 320 far from the isolation part 210 in the second direction X. The shielding part 310 can also be connected to part of the power connection lines 320 close to the first isolation part 211 in the second direction X.

[0128] The display device can include the display panel 100 of any of the above embodiments. The display device of one embodiment is described below as an example. In this embodiment, the display device includes the display panel 100 of the above embodiment.

[0129] Figure 11 FIG. 1 shows a top view of a display device according to one embodiment of the present application, Figure 12 FIG. 1 shows a top view of a display device according to one embodiment of the present application, Figure 11 FIG. 1 shows a top view of a display device according to one embodiment of the present application,

[0130] The display panel 100 includes a first surface S1 and a second surface S2 opposite to each other, wherein the first surface S1 is a display surface. The display device further includes a photosensitive component 200 located on the side of the second surface S2 of the display panel 100, and the photosensitive component 200 corresponds to the first area in position.

[0131] The photosensitive component 200 can be an image acquisition device for acquiring external image information. In this embodiment, the photosensitive component 200 is a complementary metal oxide semiconductor (CMOS) image acquisition device, and in other embodiments, the photosensitive component 200 can also be a charge-coupled device (CCD) image acquisition device or other forms of image acquisition devices. It can be understood that the photosensitive component 200 can not be limited to an image acquisition device. For example, in some embodiments, the photosensitive component 200 can also be an infrared sensor, a proximity sensor, an infrared lens, a floodlight sensing element, an ambient light sensor, a dot matrix projector, and other light sensors. In addition, the display device can also integrate other components on the second surface S2 of the display panel 100, such as an earpiece, a speaker, and the like.

[0132] The embodiments of the present application described above are not exhaustive in describing all details, nor are they limited to the specific embodiments. It is obvious that many modifications and changes can be made according to the above description. The embodiments are selected and described in detail in order to better explain the principles and practical applications of the present application, so that those skilled in the art can well utilize the present application and make modifications and uses based on the present application. The present application is limited by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that, The display panel has a first area and a second area disposed around at least a portion of the first area, the display panel comprising: substrate, An active layer is located on one side of the substrate, the active layer including an isolation portion located in the second region and surrounding at least a portion of the first region; A first metal layer is located on the side of the active layer away from the substrate. The first metal layer includes a shielding portion, and the orthographic projection of the isolation portion on the substrate and the orthographic projection of the shielding portion on the substrate overlap. Multiple signal lines, at least some of which are connected to the shielding portion; The second metal layer is located on the side of the active layer away from the substrate and is stacked with the first metal layer. The multiple signal lines include power lines located on the second metal layer, and at least a portion of the power lines are connected to the shielding portion. The shielding portion includes: a first shielding portion extending along the extension path of the isolation portion and covering at least a portion of the isolation portion; and / or a second shielding portion intersecting with the isolation portion, wherein the active layer is configured to be doped after the shielding portion is prepared.

2. The display panel according to claim 1, characterized in that, The width of the shielding part is 3μm to 5μm; And / or, the width of the isolation portion is 2.5μm to 3μm.

3. The display panel according to claim 1, characterized in that, The second metal layer is located on the side of the first metal layer that is away from the active layer.

4. The display panel according to claim 1, characterized in that, The power line includes a surface power supply arranged around the first area, and the shielding part includes a first shielding part, which is connected to the surface power supply via a through hole.

5. The display panel according to claim 1, characterized in that, The power line includes a first power line and a second power line that are spaced apart along a first direction. The first metal layer further includes a power connection line, which extends along the first direction and is connected to the first power line and the second power line via a hole, so that the first power line and the second power line are interconnected through the power connection line. The shielding portion includes a second shielding portion, at least a portion of the power connection line is connected to the shielding portion, and the second shielding portion extends along the second direction.

6. The display panel according to claim 5, characterized in that, The shielding part includes a first shielding part and a second shielding part, and the first shielding part is connected to the power connection line through the second shielding part.

7. The display panel according to claim 6, characterized in that, The isolation portion includes a first isolation portion and a second isolation portion that are successively distributed and intersecting in their extending direction. The first isolation portion extends and is formed along the first direction, and the second isolation portion extends and is formed along the second direction. The orthographic projection of the first isolation portion on the substrate and the orthographic projection of the second shielding portion on the substrate at least partially overlap.

8. The display panel according to claim 5, characterized in that, The second area also includes a transition area and a main display area. The transition area is located between the main display area and the first area. The isolation part, the shielding part, and the power connection line are located in the transition area.

9. The display panel according to claim 8, characterized in that, The first power line is located in the transition zone, and the second power line includes a second body portion and a second connection end for connecting the power connection line. The second body portion is in the second zone and located on the side of the isolation portion away from the first zone, and the second connection end extends from the second body portion toward the first power line.

10. The display panel according to claim 8, characterized in that, The first power line is located on the side of the isolation portion facing the first region, and at least a portion of the second connection end of the second power line is located on the side of the isolation portion away from the first region. The power connection line connects the second connection end and the first power line, and at least a portion of the orthographic projection of the power connection line on the substrate and the orthographic projection of the isolation portion on the substrate are at least partially overlapped.

11. The display panel according to claim 8, characterized in that, The first metal layer includes scan signal lines and data connection lines, the scan signal lines being located in the main display area and the data connection lines being located in the transition area.

12. The display panel according to claim 11, characterized in that, The second metal layer also includes multiple data lines, at least two of which are located on both sides of the first region in the first direction. The data connection lines are connected to data line vias located on both sides of the first region in the first direction, so that the data lines located on both sides of the first region in the first direction are interconnected through the data connection lines.

13. The display panel according to claim 12, characterized in that, Multiple data connection lines are spaced apart in the transition zone.

14. The display panel according to claim 12, characterized in that, The data connection line is located on the side of the isolation section facing the first area.

15. The display panel according to claim 8, characterized in that, At least a portion of the first power line has two second power lines on both sides in the first direction, and both second power lines are interconnected with the first power line through the power connection line; The first metal layer also includes a bridging wire located in the transition region, and the bridging wire is at least partially located between the two power connection lines at both ends of the first power line in the first direction.

16. The display panel according to claim 15, characterized in that, The shielding part and the bridging wire are connected to the same power connection line; or The power connection cable includes a first power connection cable and a second power connection cable, at least a portion of the first power connection cable is connected to the shielding part, and at least a portion of the second power connection cable is connected to the bridging cable.

17. The display panel according to claim 1, characterized in that, The active layer includes a first semiconductor portion and a second semiconductor portion, which are located on opposite sides of the first region in a first direction. A plurality of first semiconductor portions and a plurality of second semiconductor portions are spaced apart along a second direction. At least two of the first semiconductor units, at least two of the second semiconductor units, at least one of the first semiconductor and at least one of the second semiconductors are interconnected through the isolation unit.

18. A display device, characterized in that, Includes the display panel according to any one of claims 1 to 17.

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