Fingerprint sensor, method for manufacturing fingerprint sensor, and display device

Abstract

This invention relates to a fingerprint sensor, a method for manufacturing a fingerprint sensor, and a display device including the fingerprint sensor. The fingerprint sensor includes: a photosensitive layer including a photosensitive element; and an optical layer including a plurality of light-transmitting regions, a light-blocking region, a light-transmitting member disposed in the plurality of light-transmitting regions, a light-blocking member disposed in the light-blocking regions, and a planarization member disposed on the light-blocking member, wherein the light-blocking region surrounds the plurality of light-transmitting regions, wherein the light-transmitting member includes a first organic material, wherein the light-blocking member includes a second organic material, and wherein the planarization member includes a third organic material and a positive photosensitive material.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2020-0136675, filed on October 21, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] The present invention relates to a fingerprint sensor, a method for manufacturing a fingerprint sensor, and a display device including a fingerprint sensor. Background Technology

[0004] Display devices have been incorporated into various electronic devices such as smartphones, tablets, laptops, monitors, and TVs. In recent years, with the development of mobile communication technology, the use of portable electronic devices such as smartphones, tablet PCs, and laptops has greatly increased.

[0005] Portable electronic devices typically store private information such as contact information, call logs, messages, photos, memos, user web browsing information, location information, financial information, and biometric information. To protect personal information stored on portable electronic devices, fingerprint authentication can be used to authenticate a user's fingerprint as biometric information, and access to personal information is granted upon successful matching. In this case, the display device may include a fingerprint sensor for fingerprint authentication. For example, the fingerprint sensor can be implemented using optical, ultrasonic, or capacitive methods. For instance, an optical fingerprint sensor may typically include a collimator having a light-sensing unit for sensing light, an opening for providing light to the light-sensing unit, and a light-blocking unit for blocking light.

[0006] Furthermore, when the fingerprint sensor is located in the bezel area or non-display area of ​​the display device, there may be limitations in widening the display area of ​​the display device. Therefore, the fingerprint sensor can be located in the display area of ​​the display device. Summary of the Invention

[0007] According to an embodiment of the present invention, a fingerprint sensor includes: a light-sensing layer including a light-sensing element; and an optical layer including a plurality of light-transmitting regions, a light-blocking region, a light-transmitting member disposed in the plurality of light-transmitting regions, a light-blocking member disposed in the light-blocking region, and a planarization member disposed on the light-blocking member, wherein the light-blocking region surrounds the plurality of light-transmitting regions, wherein the light-transmitting member includes a first organic material, wherein the light-blocking member includes a second organic material, and wherein the planarization member includes a third organic material and a positive photosensitive material.

[0008] In an embodiment of the present invention, the planarization member overlaps with the light-blocking member in the thickness direction and exposes a portion of the light-blocking member.

[0009] In an embodiment of the present invention, the portion of the light-blocking member exposed by the planarization member is disposed between the light-transmitting member and the planarization member.

[0010] In an embodiment of the invention, the light-blocking member at least partially surrounds the light-transmitting member.

[0011] In an embodiment of the present invention, the light-blocking member further includes a recess, and the planarization member is disposed on the recess.

[0012] In an embodiment of the invention, the planarization member exposes a portion of the light-blocking member, and the first surface of the planarization member and the first surface of the portion of the light-blocking member exposed by the planarization member are positioned at the same first height relative to the first surface of the photosensitive layer.

[0013] In an embodiment of the present invention, the first surface of the light-transmitting member is positioned at a second height above the first height relative to the first surface of the light-sensing layer.

[0014] In an embodiment of the present invention, the light transmittance of the light transmission component is greater than the light transmittance of the planarization component, and the light transmittance of the planarization component is greater than the light transmittance of the light blocking component.

[0015] In embodiments of the present invention, the transmittance of the light-transmitting member is in the range of approximately 90% to approximately 100%, wherein the transmittance of the planarizing member is in the range of approximately 50% to approximately 70%, and wherein the transmittance of the light-blocking member is in the range of approximately 0% to approximately 10%.

[0016] In embodiments of the present invention, the light-blocking component further includes a black pigment or dye.

[0017] According to an embodiment of the present invention, a display device includes: a display panel; and a fingerprint sensor disposed on the display panel, wherein the fingerprint sensor includes: a light-sensing layer including a light-sensing element; and an optical layer including a plurality of light-transmitting regions, a light-blocking region, a light-transmitting member disposed in the plurality of light-transmitting regions, a light-blocking member disposed in the light-blocking region, and a planarization member disposed on the light-blocking member, wherein the light-blocking region surrounds the plurality of light-transmitting regions, wherein the light transmittance of the light-transmitting member is greater than the light transmittance of the planarization member, and the light transmittance of the planarization member is greater than the light transmittance of the light-blocking member, and wherein the planarization member overlaps with the light-blocking member in the thickness direction and exposes a portion of the light-blocking member.

[0018] In an embodiment of the invention, the portion of the light-blocking member exposed by the planarization member is disposed between the light-transmitting member and the planarization member, and surrounds the light-transmitting member.

[0019] In an embodiment of the present invention, the first surface of the planarization member and the first surface of the portion of the light blocking member exposed by the planarization member are positioned at the same height relative to the first surface of the photosensitive layer.

[0020] In an embodiment of the present invention, the light-transmitting component comprises a first organic material, the light-blocking component comprises a second organic material, and the planarization component comprises a third organic material and a positive photosensitive material.

[0021] In an embodiment of the present invention, the light-blocking member includes a recess, and the planarization member is disposed on the recess.

[0022] According to an embodiment of the present invention, a method of manufacturing a fingerprint sensor includes: forming a first organic material layer on a photosensitive layer; patterning the first organic material layer using an etching mask to form a light-transmitting member; forming a second organic material layer on the light-transmitting member; forming a third organic material layer on the second organic material layer and including a positive photosensitive material; and etching the second organic material layer and the third organic material layer to form a light-blocking member and a planarization member, wherein the light-transmitting member is disposed in each of a plurality of light-transmitting regions spaced apart from each other, wherein the light-blocking member is disposed in a light-blocking region surrounding the plurality of light-transmitting regions, and wherein the planarization member is disposed on the light-blocking member.

[0023] In an embodiment of the present invention, the etching of the second organic material layer and the third organic material layer is performed by dry etching.

[0024] In an embodiment of the present invention, the method further includes: removing the etching mask after etching the second organic material layer and the third organic material layer, wherein the removal of the etching mask is performed by wet etching.

[0025] In an embodiment of the present invention, the method further includes: after forming the second organic material layer and the third organic material layer, exposing and developing the third organic material layer.

[0026] In an embodiment of the present invention, the light-blocking member includes a recess, and the planarization member is disposed on the recess. Attached Figure Description

[0027] The above and other features of the present invention will become more apparent from a detailed description of embodiments of the invention with reference to the accompanying drawings, in which:

[0028] Figure 1 This is a perspective view of a display device according to an embodiment of the present invention;

[0029] Figure 2 This is a perspective view of a fingerprint sensor according to an embodiment of the present invention;

[0030] Figure 3 This is a plan view of a fingerprint sensor according to an embodiment of the present invention;

[0031] Figure 4 This is a cross-sectional view of a display device according to an embodiment of the present invention;

[0032] Figure 5 yes Figure 4 A magnified view of region A;

[0033] Figure 6 yes Figure 5 A magnified view of region B;

[0034] Figure 7 This is a cross-sectional view of a display panel according to an embodiment of the present invention;

[0035] Figure 8 , Figure 9 , Figure 10 , Figure 11 and Figure 12 This is a cross-sectional view illustrating a method for manufacturing a display device according to an embodiment of the present invention;

[0036] Figure 13 This is a cross-sectional view of a display device according to an embodiment of the present invention;

[0037] Figure 14 This is a cross-sectional view of the fingerprint sensor of a display device according to an embodiment of the present invention;

[0038] Figure 15 This is a cross-sectional view of the fingerprint sensor of a display device according to an embodiment of the present invention; and

[0039] Figure 16 This is a cross-sectional view of the fingerprint sensor of a display device according to an embodiment of the present invention. Detailed Implementation

[0040] The invention will now be described more fully with reference to the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein.

[0041] It will also be understood that when a layer is referred to as being "on" another layer or substrate, the layer may be directly on the other layer or substrate, or an intervening layer may be present. Throughout the specification, the same reference numerals denote the same components, and therefore, repeated descriptions may be omitted. In the drawings, the thickness of layers and regions is exaggerated for clarity. In other words, since the dimensions and thicknesses of the components in the drawings may be exaggerated for clarity, the following embodiments of the invention are not limited thereto.

[0042] While the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms may be used to distinguish one element from another. For example, a first element discussed below may be referred to as a second element without departing from the spirit and scope of the invention. Describing an element as a “first” element may not require or imply the presence of a second element or other elements. The terms “first,” “second,” etc., may also be used herein to distinguish different categories or groups of elements. For example, for the sake of brevity, the terms “first,” “second,” etc., may respectively represent “first category (or first group),” “second category (or second group),” etc.

[0043] In the following description, embodiments of the invention will be illustrated with reference to the accompanying drawings.

[0044] Figure 1 This is a perspective view of a display device according to an embodiment of the present invention.

[0045] refer to Figure 1 The display device 10, which is used to display moving or still images, can be used as a display screen for various products such as televisions, laptops, monitors, billboards, Internet of Things (IoT) devices, and portable electronic devices such as mobile phones, smartphones, tablet PCs, smartwatches, watch phones, mobile communication terminals, e-notebooks, e-books, portable multimedia players (PMPs), navigators, and ultra-mobile personal computers (UMPCs).

[0046] The display device 10 includes a display panel 100, a display driving circuit 200, a circuit board 300, and a fingerprint sensor 400.

[0047] Display panel 100 can be a light-emitting display panel, such as an organic light-emitting display panel using organic light-emitting diodes, a quantum dot light-emitting display panel including a quantum dot light-emitting layer, an inorganic light-emitting display panel including inorganic semiconductors, or a micro light-emitting display panel using micro light-emitting diodes (LEDs). Hereinafter, display panel 100 will be primarily described as an organic light-emitting display panel, but the invention is not limited thereto. For example, in embodiments of the invention, other types of display panels, such as liquid crystal display panels, quantum dot liquid crystal display panels, quantum nano-light-emitting display panels (nano-NEDs), and micro LEDs, can be used as display panel 100.

[0048] The display panel 100 may include a display area DA for displaying images and a non-display area NDA for not displaying images. The non-display area NDA may be configured to at least partially surround the display area DA. The non-display area NDA may form a border.

[0049] The display area DA can have a polygonal shape. For example, on a plane, the display area DA can have a rectangular shape, which has right-angled corners or rounded corners. However, the planar shape of the display area DA is not limited to a rectangular shape, and can be formed, for example, into a circular shape, an elliptical shape, and various other shapes.

[0050] In the accompanying drawings, for example, the shorter side of the rectangle of the display area DA extends in the first direction DR1, and the longer side of the rectangle of the display area DA extends in the second direction DR2, which is perpendicular to the first direction DR1. The third direction DR3 is substantially perpendicular to the first direction DR1 and the second direction DR2, and may be substantially the same as the thickness direction of the display device 10.

[0051] The display area DA may include multiple pixels. These pixels may be arranged in a matrix. Each of the pixels may include a light-emitting layer and a circuit layer that controls the amount of light emitted from the light-emitting layer. The circuit layer may include, for example, wiring, electrodes, and at least one transistor. The light-emitting layer may include an organic light-emitting material. For example, the light-emitting layer may be sealed with an encapsulation film.

[0052] The display area DA may include a fingerprint sensing area FSA. The fingerprint sensing area FSA may be disposed within the display area DA. A user's fingerprint can be sensed within the fingerprint sensing area FSA. A fingerprint sensor 400 for sensing the user's fingerprint may be disposed within the fingerprint sensing area FSA. The fingerprint sensing area FSA may be located within a portion of the display area DA, but the invention is not limited thereto. For example, the fingerprint sensing area FSA may be substantially identical to the display area DA and may overlap with the entire display area DA.

[0053] For example, the non-display area NDA can surround all the edges of the display area DA and can form the border of the display area DA. However, the invention is not limited thereto.

[0054] The display panel 100 may be flexible, such that it may be, for example, warped, bent, folded, or rolled up. However, the invention is not limited thereto.

[0055] The display panel 100 may include a main area MA and a sub-area SBA.

[0056] The display area DA, the non-display area NDA, and the fingerprint sensing area FSA can be located within the main area MA. For example, the main area MA can have a shape similar to the planar shape of the display device 10. For example, the main area MA can be a flat area located on a plane. However, the invention is not limited to this, and for example, at least one edge other than the edge (edge) connected to the bent area in the main area MA can be bent to form a curved surface or can be bent in the vertical direction.

[0057] The sub-region SBA may protrude from one side of the main region MA in the second direction DR2. The length of the sub-region SBA in the first direction DR1 may be less than the length of the main region MA in the first direction DR1, and the length of the sub-region SBA in the second direction DR2 may be less than the length of the main region MA in the second direction DR2, but the present invention is not limited thereto.

[0058] Although the sub-region SBA is shown unfolded in the accompanying drawings, the sub-region SBA can be bent. For example, the sub-region SBA can be bent with curvature in a direction opposite to the display surface to overlap, for example, the lower surface of the main region MA. In this case, the surface of the sub-region SBA is reversed, and at least a portion of the sub-region SBA can be disposed on the lower surface of the display panel 100. For example, when the sub-region SBA is bent, the sub-region SBA can overlap with the main region MA in the thickness direction. The display driving circuit 200 can be disposed in the sub-region SBA.

[0059] The display driving circuit 200 can generate signals and voltages for driving the display panel 100. The display driving circuit 200 can be formed as an integrated circuit (IC) and can be attached to the display panel 100 by, for example, a glass-on-chip (COG) method, a plastic-on-chip (COP) method, or an ultrasonic bonding method, but the invention is not limited thereto. For example, the display driving circuit 200 can be attached to the circuit board 300 by a thin-film-on-chip (COF) method.

[0060] The circuit board 300 can be attached to one end of a sub-region SBA of the display panel 100 using an anisotropic conductive film or ultrasonic bonding. In this way, the circuit board 300 can be electrically connected to the display panel 100 and the display driving circuit 200. The display panel 100 and the display driving circuit 200 can receive digital video data, timing signals, and driving voltages through the circuit board 300. For example, the circuit board 300 can be a flexible printed circuit board, a printed circuit board, or a flexible film such as a thin-film laminate.

[0061] The fingerprint sensor 400 can be disposed on the lower surface of the display panel 100. The fingerprint sensor 400 can be disposed within the display area DA. For example, the fingerprint sensor 400 can be disposed in the fingerprint sensing area FSA, which is disposed within the display area DA. The fingerprint sensor 400 can utilize an adhesive bonding member (STM, reference...). Figure 4 It is attached to the lower surface of the display panel 100.

[0062] Figure 2 This is a perspective view of a fingerprint sensor according to an embodiment of the present invention.

[0063] refer to Figure 2 The fingerprint sensor 400 may include a fingerprint sensor substrate FSUB, a photosensitive layer 410, an optical layer 420, a flexible film 430, a sensor circuit board 440, and a sensor driving circuit 450.

[0064] Components can be disposed on the fingerprint sensor substrate FSUB. For example, the fingerprint sensor substrate FSUB can support components disposed on the fingerprint sensor substrate FSUB. For example, the fingerprint sensor substrate FSUB can include an insulating material such as glass or polymer resin. For example, the fingerprint sensor substrate FSUB can include polyimide. The fingerprint sensor substrate FSUB can be a flexible substrate that can be bent, folded, or rolled up.

[0065] The photosensitive layer 410 can be disposed on the fingerprint sensor substrate FSUB. The photosensitive layer 410 may include multiple sensor pixels SP (reference). Figure 4 Multiple sensor pixels SP are arranged on the first direction DR1 and the second direction DR2. Multiple sensor pixels SP (reference) Figure 4Each of the following may include a light sensing element and at least one transistor connected to the light sensing element, wherein a sensing current flows through the light sensing element according to incident light. The light sensing element may include a photodiode or a phototransistor.

[0066] The optical layer 420 can be disposed on the photosensing layer 410. The infrared filter layer can be disposed on the optical layer 420, or the infrared filter layer can be disposed between the optical layer 420 and the photosensing layer 410.

[0067] Optical layer 420 may include a first region and a second region having different transmittances from each other. The transmittance of the first region may be greater than that of the second region. In embodiments of the invention, the first region (hereinafter referred to as the light-transmitting region OA) may be a light-transmitting region OA that transmits light, and the second region (hereinafter referred to as the light-blocking region LSA) may be a light-blocking region LSA that blocks light. The following illustration shows the application of the light-transmitting region OA and the light-blocking region LSA to the first and second regions having different transmittances from each other, respectively, as an example; however, the embodiments are not limited thereto. For example, both the first and second regions may be light-transmitting regions through which approximately 50% or more of the incident light is transmitted, but the transmittance of the second region is approximately 10% or less lower than that of the first region.

[0068] The light transmission region OA can be divided into multiple unit light transmission regions OA by the light blocking region LSA. n The light transmission region OA of each unit n They can be separated and spaced apart from each other. In a planar diagram, multiple unit light transmission regions OA n Each of them can have a hexagonal shape, but multiple unit light transmission regions OA n The shape of each of them is not limited to this. For example, multiple unit light transmission regions OA n Each of these can have a rectangular, square, or pentagonal shape, or it can have a shape such as a circle or an ellipse. Multiple unit light transmission regions OA n The dimensions of each element and the unit light transmission area OA n The intervals between them can be basically consistent.

[0069] Unit light transmission region OA n They can be set to be spaced apart from each other, with the light-blocking region LSA located between the unit light-transmitting region OA. n Between. On a plane, the light-blocking region LSA can surround multiple unit light-transmitting regions OA. n Each of these. Furthermore, the light-blocking region LSA can be integrally connected to multiple unit light-transmitting regions OA. nBetween them. Details of the light-transmitting region OA and the light-blocking region LSA will be described later.

[0070] One side of the flexible film 430 can be disposed on the portion of the fingerprint sensor substrate FSUB not covered by the photosensitive layer 410. The flexible film 430 can be attached to one end of the fingerprint sensor substrate FSUB, for example, using an anisotropic conductive film or ultrasonic bonding. The flexible film 430 can be electrically connected to the fingerprint pad of the fingerprint sensor substrate FSUB. The flexible film 430 can be a flexible printed circuit board, a printed circuit board, or a flexible film such as a thin-film flip-chip.

[0071] The other side of the flexible film 430 can be disposed on the sensor circuit board 440. The other side of the flexible film 430 can be attached to the sensor circuit board 440 via a conductive adhesive member such as an anisotropic conductive film. Therefore, the flexible film 430 can be electrically connected to the sensor circuit board 440. However, the invention is not limited thereto, and for example, the flexible film 430 can be connected to the sensor circuit board 440 in the form of a thin-film flip-chip. The sensor circuit board 440 can be a flexible printed circuit board or a printed circuit board.

[0072] The sensor driving circuit 450 can be disposed on the sensor circuit board 440. However, the invention is not limited thereto, and for example, the sensor driving circuit 450 can be disposed on the flexible film 430. The sensor driving circuit 450 can receive multiple sensor pixels SP (reference) of the photosensitive layer 410 through the flexible film 430 and the sensor circuit board 440. Figure 4 The sensor driving circuit 450 can identify the fingerprint pattern of a finger based on the sensing voltage of each of the multiple sensor pixels SP.

[0073] Figure 3 This is a plan view of a fingerprint sensor according to an embodiment of the present invention. Figure 4 This is a cross-sectional view of a display device according to an embodiment of the present invention. Figure 5 yes Figure 4 A magnified view of region A. Figure 6 yes Figure 5 A magnified view of region B. Figure 3 An enlarged view of a portion of the plane of the optical layer 420 of the fingerprint sensor 400 is shown. Figure 4 A partial cross-sectional view of the display panel 100 and the fingerprint sensor 400 is shown. Figure 4 The image shows a user's finger touching the display device 10 for fingerprint recognition.

[0074] refer to Figures 3 to 6The display device 10 may further include a cover window CW and an adhesive member STM. The cover window CW is disposed on the upper surface of the display panel 100, and the adhesive member STM is used to attach the display panel 100 and the fingerprint sensor 400 to each other. The cover window CW may be disposed on the display panel 100 to cover the upper surface of the display panel 100. The cover window CW may be used to protect the display panel 100 and the lower components. For example, the cover window CW may be attached to the upper surface of the display panel 100 using a transparent adhesive member.

[0075] Cover window CWs can be made of transparent materials and can be glass or plastic. For example, when the cover window CW is glass, it can be ultra-thin glass (UTG) with a thickness of about 0.1 mm or less. When the cover window CW is made of plastic, it can include a transparent polyimide film.

[0076] The adhesive component STM can be located between the fingerprint sensor 400 and the display panel 100, and can attach the fingerprint sensor 400 and the display panel 100 to each other. The adhesive component STM can be optically transparent. Although not limited to this, the adhesive component STM can be, for example, a transparent adhesive film such as an optically clear adhesive (OCA) film or a transparent adhesive resin such as an optically clear resin (OCR).

[0077] The adhesive member STM can compensate for the step GP between the light-transmitting region OA and the light-blocking region LSA of the optical layer 420. For example, as described later, the step GP can be provided between a surface 421a of the light-transmitting member 421 disposed in the light-transmitting region OA and a surface 422a of the light-blocking member 422 disposed in the light-blocking region LSA, and between a surface 421a of the light-transmitting member 421 disposed in the light-transmitting region OA and a surface 423a of the planarization member 423. Even when the step GP is provided, the adhesive member STM can be positioned between the fingerprint sensor 400 and the display panel 100 to compensate for the step GP. Therefore, the fingerprint sensor 400 and the display panel 100 can be attached to each other.

[0078] The photosensitive layer 410 can identify fingerprints by recognizing light incident through the optical layer 420. Although not shown, the photosensitive layer 410 may include a photosensitive element and at least one transistor. While not limited to this, for example, each of the plurality of sensor pixels SP of the photosensitive layer 410 may include a photosensitive element and at least one transistor. The photosensitive element can convert light energy into electrical energy and may have a photovoltaic power source in which the current flowing varies according to the intensity of light. For example, the photosensitive element may be a photodiode. When a drive signal is supplied, the transistor of the photosensitive layer 410 can be turned on to transmit the current flowing through the photosensitive element. Based on the current converted by the photosensitive element and transmitted by the transistor of the photosensitive layer 410, fingerprints can be detected.

[0079] For example, each of the plurality of sensor pixels SP in the photosensitive layer 410 may be associated with at least one unit light-transmitting region OA in the thickness direction (e.g., the third direction DR3). n Overlap. For example, each of a plurality of sensor pixels SP may overlap with at least one light-transmitting member 421. Although the figures show one sensor pixel SP overlapping with two unit light-transmitting regions OA in the thickness direction (e.g., the third direction DR3). n The unit light transmission region OA overlaps with the sensor pixel SP in the thickness direction (e.g., third-direction DR3). n The number is not limited to this. For example, the unit light transmission area OA overlapping with a sensor pixel SP. n The number can range from approximately 100 to approximately 1000, or from approximately 10 to approximately 10000. For example, sensor pixels SP can be connected to a single unit light-transmitting region OA in the thickness direction (e.g., the third direction DR3). n overlapping.

[0080] The fingerprint of a user's finger F can be formed by protruding ridges (RID) and valleys (VAL) pressed down from the ridges. When the user's finger F touches the cover window CW, the ridges of the fingerprint directly contact the cover window CW, and the valleys (VAL) can be spaced apart from the cover window CW by a predetermined distance. Light traveling toward the user's finger F can be reflected from each of the ridges (RID) and valleys (VAL) of the user's finger F to be guided toward the photosensitive layer 410. The light traveling toward the user's finger F can be light emitted from the display panel 100, but the invention is not limited thereto.

[0081] In this scenario, the light reflected from the ridge RID and valley VAL of the user's finger F can have different optical properties. For example, the light reflected from the ridge RID and the light reflected from the valley VAL can have different frequencies, wavelengths, and intensities. Therefore, each sensor pixel SP of the photosensitive layer 410 can output a sensing signal with different electrical properties corresponding to the optical properties of the light reflected from each of the ridge RID and valley VAL. The sensing signal output by each sensor pixel SP can be converted into image data, thereby enabling the identification of the user's fingerprint.

[0082] The light transmission region OA of the optical layer 420 can be the path through which light reflected from the ridge RID and valley VAL of the user's finger F is incident. For example, when the user's finger F touches the cover window CW, the light reflected from the user's finger F can be incident on multiple sensor pixels SP of the photosensitive layer 410 through the light transmission region OA of the display panel 100 and the optical layer 420.

[0083] The light-blocking region LSA of the optical layer 420 can block a portion of the light incident on the photosensitive layer 410. The light-blocking region LSA can control the range LR of light incident on the multiple sensor pixels SP through the light-transmitting region OA. For example, in the light-blocking region LSA, each of the multiple sensor pixels SP of the photosensitive layer 410 can allow light reflected within a specific range LR to reach the photosensitive layer 410, and can block incident light reflected from areas other than the range LR.

[0084] The range LR of light incident on the multiple sensor pixels SP through the light transmission region OA of the optical layer 420 can be shorter than the distance FP between the ridge RID and valley VAL of the user's fingerprint F. The distance FP between the ridge RID and valley VAL of the user's fingerprint F can be approximately 500 μm. Therefore, each of the multiple sensor pixels SP can distinguish the light reflected from the ridge RID and / or valley VAL of the user's fingerprint F.

[0085] The optical layer 420 may also include a light-transmitting member 421, a light-blocking member 422, and a planarization member 423. The light-transmitting member 421 may be disposed in the light-transmitting region OA, and the light-blocking member 422 and the planarization member 423 may be disposed in the light-blocking region LSA.

[0086] The light-transmitting member 421, the light-blocking member 422, and the planarization member 423 can be disposed on the photosensitive layer 410. For example, the light-transmitting member 421, the light-blocking member 422, and the planarization member 423 can be directly disposed on the photosensitive layer 410. However, the present invention is not limited thereto, and for example, the optical layer 420 may also include a substrate between the photosensitive layer 410 and the light-transmitting member 421, the light-blocking member 422, and the planarization member 423, and in this case, for example, the light-transmitting member 421, the light-blocking member 422, and the planarization member 423 can be disposed on the substrate.

[0087] Multiple light-transmitting members 421 may be provided, and the multiple light-transmitting members 421 may be separated and spaced apart from each other. For example, in a planar view, each light-transmitting member 421 may have an island shape. For example, each light-transmitting member 421 may have a polygonal shape. A light-blocking member 422 may be disposed between the multiple light-transmitting members 421 and may fill the space between adjacent light-transmitting members 421. A planarization member 423 may be disposed on the light-blocking member 422. The planarization member 423 may overlap with the light-blocking member 422 in the thickness direction (e.g., the third direction DR3) and may cover at least a portion of the light-blocking member 422. The planarization member 423 may be disposed on the light-blocking member 422.

[0088] The light-transmitting member 421, the light-blocking member 422, and the planarization member 423 may each include a (e.g., a first) surface, such as the first surface 421a of the light-transmitting member 421, the first surface 422a of the light-blocking member 422, and the first surface 423a of the planarization member 423. The first surface 421a of the light-transmitting member 421, the first surface 422a of the light-blocking member 422, and the first surface 423a of the planarization member 423 may refer to the upper surfaces of the light-transmitting member 421, the light-blocking member 422, and the planarization member 423, respectively. When the fingerprint sensor 400 is positioned below the display panel 100, the first surface 421a of the light-transmitting member 421, the first surface 422a of the light-blocking member 422, and the first surface 423a of the planarization member 423 may face the display panel 100.

[0089] The light-blocking member 422 may be integrally formed, but the invention is not limited thereto. The light-blocking member 422 may fill the space between the light-transmitting members 421. For example, the light-transmitting members 421 may be separated by the light-blocking member 422. The light-blocking member 422 may include a recess 422b. For example, the light-blocking member 422 may provide a recess 422b. The recess 422b may be connected to the first surface 422a of the light-blocking member 422. For example, the recess 422b may have a concave shape facing the lower portion of the optical layer 420. For example, the depth of the recess 422b relative to the first surface 422a of the light-blocking member 422 may decrease towards the light-transmitting member 421 and may increase towards the vicinity of the center between adjacent light-transmitting members 421, but the invention is not limited thereto. For example, the depth of the recess 422b may be greatest in the region of the light-blocking member 422 at the center between adjacent light-transmitting members 421.

[0090] Planarization member 423 may be disposed on light-blocking member 422 and may expose a portion of light-blocking member 422, but the invention is not limited thereto. Planarization member 423 may be positioned on recess 422b of light-blocking member 422, and in this case, planarization member 423 may expose first surface 422a of light-blocking member 422. Planarization member 423 may be integrally formed, but the invention is not limited thereto. For example, the thickness of planarization member 423 may decrease toward light-transmitting member 421 and may increase toward the vicinity of the center between adjacent light-transmitting members 421, but the invention is not limited thereto. First surface 422a of light-blocking member 422 may be exposed by planarization member 423. First surface 422a of light-blocking member 422 exposed by planarization member 423 and first surface 423a of planarization member 423 may be positioned at substantially the same height (e.g., a second height h2). For example, first surface 422a of light-blocking member 422 and first surface 423a of planarization member 423 may be positioned substantially on the same plane. However, the present invention is not limited thereto.

[0091] The first surface 421a of the light-transmitting member 421, the first surface 422a of the light-blocking member 422, and the first surface 423a of the planarization member 423 can be positioned at different heights relative to one or the other surface of the photosensitive layer 410. For example, the first surface 421a of the light-transmitting member 421 can be positioned at a first height h1, and the first surface 422a of the light-blocking member 422 and the first surface 423a of the planarization member 423 can be positioned at a second height h2. Based on one or the other surface of the photosensitive layer 410, the first height h1 can be positioned higher than the second height h2. For example, a step GP can be provided by the first surface 421a of the light-transmitting member 421, the first surface 422a of the light-blocking member 422, and the first surface 423a of the planarization member 423. While not limited thereto, for example, the size of the step GP can be in the range of about 50 nm to about 60 nm, in the range of about 30 nm to about 80 nm, or in the range of about 10 nm to about 100 nm.

[0092] Furthermore, the light-transmitting region OA and the light-blocking region LSA can have different thicknesses. For example, the light-transmitting region OA can have a first thickness d1, and the light-blocking region LSA can have a second thickness d2. In this case, the first thickness d1 can be greater than the second thickness d2, and the difference between the first thickness d1 and the second thickness d2 can be substantially the same as the dimension of the step GP.

[0093] In the planar view, the planarization member 423 may at least partially surround the light-transmitting member 421, and the light-blocking member 422 may be positioned between the planarization member 423 and the light-transmitting member 421. In this case, the light-blocking member 422 may surround the light-transmitting member 421, and the planarization member 423 may surround both the light-transmitting member 421 and the light-blocking member 422. The light-transmitting member 421 and the planarization member 423 may be spaced apart from each other and may not be in direct contact with each other, but the invention is not limited thereto.

[0094] The light-transmitting member 421, the light-blocking member 422, and the planarization member 423 can have different transmittances from each other. The transmittance of the light-transmitting member 421 can be greater than that of the light-blocking member 422. The transmittance of the planarization member 423 can be less than that of the light-transmitting member 421, but greater than that of the light-blocking member 422. Here, transmittance can refer to the degree to which external light is transmitted through the light-transmitting member 421, the light-blocking member 422, and the planarization member 423 in the thickness direction (e.g., the third direction DR3). The transmittance of the light-transmitting member 421, the light-blocking member 422, and the planarization member 423 can be measured with substantially the same thickness.

[0095] While not limited to these, for example, the light transmittance of the light-transmitting member 421 can be in the range of greater than about 90% to less than about 100%, or in the range of greater than about 80% to less than about 100%. The light transmittance of the light-blocking member 422 can be in the range of greater than about 0% to less than about 1%, or in the range of greater than about 0% to less than about 10%. The light transmittance of the planarization member 423 can be in the range of greater than about 50% to less than about 70%, or in the range of greater than about 40% to less than about 80%.

[0096] The light-transmitting component 421 may include a first organic material. The first organic material may have high light transmittance. While not limited thereto, the first organic material may include, for example, at least one of acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0097] The light-blocking member 422 may include a second organic material and a light-absorbing material. While not limited thereto, the second organic material may, for example, include at least one of acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. For example, the second organic material may be substantially the same as the first organic material of the light-transmitting member 421, but the invention is not limited thereto.

[0098] While not limited to these, light-absorbing materials may, for example, include inorganic or organic black pigments such as carbon black. Furthermore, light-absorbing materials may include black dyes, or pigments or dyes of colors other than black. The light-blocking member 422 may also include a negative photosensitive material (or, for example, a sensitizer).

[0099] The planarization member 423 may include a third organic material and a positive photosensitive material (or, for example, a sensitizer). For example, the third organic material may include at least one of acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. The third organic material may be substantially the same as the first organic material of the light-transmitting member 421, but the invention is not limited thereto.

[0100] Since the planarization member 423 is disposed on the light-blocking member 422, the etching of the light-blocking member 422 disposed in the light-blocking region LSA can be minimized during the etching process of the light-blocking member 422, thereby increasing the reliability of the fingerprint sensor 400 and minimizing contamination inside the cavity where the etching process is performed. Furthermore, since the light-blocking member 422 (or the light-blocking member material layer 422m for the light-blocking member 422) is positioned on the light-transmitting member 421, referencing... Figure 10The mask pattern MS used for patterning the light-transmitting component 421 can be more easily etched by planarizing the component 423 and can be more easily removed (or, for example, stripped) (see reference). Figure 8 Furthermore, it can suppress or prevent over-etching of the light transmission component 421, thereby further increasing the reliability of the fingerprint sensor 400.

[0101] In the following text, reference will be made to Figure 7 The stacked structure of the display panel 100 according to an embodiment of the present invention is described.

[0102] Figure 7 This is a cross-sectional view of a display panel according to an embodiment of the present invention. Figure 7 The cross-sectional structure of one pixel of the display panel 100 is shown.

[0103] refer to Figure 7 According to an embodiment of the present invention, a display panel 100 includes a plurality of pixels, and each of the pixels may include at least one thin-film transistor (e.g., a second transistor ST2). The display panel 100 may include a display substrate SUB, a barrier layer 110, a buffer layer 120, a semiconductor layer 130, a first insulating layer IL1, a first gate conductive layer 140, a second insulating layer IL2, a second gate conductive layer 150, a third insulating layer IL3, a data conductive layer 160, a fourth insulating layer IL4, an anode electrode ANO, a pixel defining layer PDL, a light-emitting layer EML, a cathode electrode CAT disposed on the light-emitting layer EML and the pixel defining layer PDL, and a thin-film encapsulation layer EN disposed on the cathode electrode CAT. The pixel defining layer PDL includes an opening exposing the anode electrode ANO, and the light-emitting layer EML is disposed in the opening of the pixel defining layer PDL. Each of the above layers may be formed as a single layer, but may also be formed as a stack of multiple layers. Another layer may be disposed between the individual layers.

[0104] The display substrate SUB supports various layers disposed on the display substrate SUB. The display substrate SUB can be made of an insulating material such as a polymer resin, or it can be made of an inorganic material such as glass or quartz. However, the invention is not limited thereto, and the display substrate SUB can be a transparent plate or a transparent film.

[0105] For example, the display substrate SUB can be a flexible substrate that can be bent, folded, or rolled up, but the present invention is not limited thereto. For example, the display substrate SUB can be a rigid substrate.

[0106] A barrier layer 110 is disposed on the display substrate SUB. The barrier layer 110 prevents the diffusion of impurity ions and the penetration of moisture or external air. Furthermore, the barrier layer 110 can perform surface planarization. For example, the barrier layer 110 may comprise silicon oxide (SiO2). x ), silicon nitride (SiN) x ) and silicon oxynitride (SiO) x N y At least one of the following. However, the present invention is not limited thereto, and the barrier layer 110 may be omitted depending on the type of substrate SUB or the process conditions.

[0107] A buffer layer 120 is disposed on the barrier layer 110. For example, the buffer layer 120 may include silicon nitride (SiN). x ), silicon dioxide (SiO) x ) and / or silicon oxynitride (SiO2) x N y ).

[0108] A semiconductor layer 130 is disposed on the buffer layer 120. The semiconductor layer 130 forms the channel of the second transistor ST2 of the pixel. The semiconductor layer 130 may include polycrystalline silicon. However, the invention is not limited thereto, and for example, the semiconductor layer 130 may include at least one of monocrystalline silicon, low-temperature polycrystalline silicon, amorphous silicon, and oxide semiconductor.

[0109] A first insulating layer IL1 is disposed on the semiconductor layer 130. The first insulating layer IL1 may be a first gate insulating layer with gate insulation function. The first insulating layer IL1 may include at least one of silicon compound and metal oxide.

[0110] A first gate conductive layer 140 is disposed on a first insulating layer IL1. The first gate conductive layer 140 may include the gate electrode GAT of the second transistor ST2 of the pixel, a scan line connected to the gate electrode GAT, and a first electrode CE1 of the storage capacitor.

[0111] The first gate conductive layer 140 may include at least one of molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu).

[0112] The second insulating layer IL2 can be disposed on the first gate conductive layer 140. The second insulating layer IL2 can be an interlayer insulating layer or a second gate insulating layer. The second insulating layer IL2 can include materials such as silicon oxide (SiO2). x ), silicon nitride (SiN) x ), silicon oxynitride (SiO)x N y ), hafnium oxide (H f O2), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), or zinc oxide (ZnO) x Inorganic insulating materials, such as zinc oxide (ZnO). x It can be ZnO and / or ZnO2.

[0113] The second gate conductive layer 150 is disposed on the second insulating layer IL2. The second gate conductive layer 150 may include the second electrode CE2 of the storage capacitor. The second gate conductive layer 150 may include at least one of molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). The second gate conductive layer 150 may be made of the same material as the first gate conductive layer 140, but the present invention is not limited thereto.

[0114] A third insulating layer IL3 is disposed on the second gate conductive layer 150. The third insulating layer IL3 may be an interlayer insulating layer. The third insulating layer IL3 may include, for example, silicon oxide (SiO2). x ), silicon nitride (SiN) x ), silicon oxynitride (SiO) x N y ), hafnium oxide (H f O2), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), or zinc oxide (ZnO) x Inorganic insulating materials, such as zinc oxide (ZnO). x It can be ZnO and / or ZnO2.

[0115] A data conductive layer 160 is disposed on the third insulating layer IL3. The data conductive layer 160 may include a first electrode SD1 and a second electrode SD2 of a second transistor ST2 of a pixel in the display panel, as well as a first power supply voltage electrode ELVDDE. The first electrode SD1 and the second electrode SD2 of the second transistor ST2 can be electrically connected to the source and drain regions of the semiconductor layer 130 through corresponding contact holes penetrating the third insulating layer IL3, the second insulating layer IL2, and the first insulating layer IL1. The first power supply voltage electrode ELVDDE can be electrically connected to the second electrode CE2 of the storage capacitor through a contact hole penetrating the third insulating layer IL3.

[0116] The data conductive layer 160 may include at least one of aluminum (Al), molybdenum (Mo), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). The data conductive layer 160 may be a single layer or multiple layers. For example, the data conductive layer 160 may be formed as a stacked structure of titanium (Ti) / aluminum (Al) / titanium (Ti), molybdenum (Mo) / aluminum (Al) / molybdenum (Mo), molybdenum (Mo) / aluminum germanium (AlGe) / molybdenum (Mo), or titanium (Ti) / copper (Cu).

[0117] A fourth insulating layer IL4 is disposed on the data conductive layer 160. The fourth insulating layer IL4 covers the data conductive layer 160. The fourth insulating layer IL4 may be a via layer. The fourth insulating layer IL4 may include an organic insulating material. When the fourth insulating layer IL4 includes an organic material, the upper surface of the fourth insulating layer IL4 may be substantially flat, despite the presence of a lower step.

[0118] The anode electrode ANO is disposed on the fourth insulating layer IL4. The anode electrode ANO can be a pixel electrode provided for each pixel. The anode electrode ANO can be connected to the second electrode SD2 of the second transistor ST2 through a contact hole penetrating the fourth insulating layer IL4. The anode electrode ANO can at least partially overlap with the light-emitting area EMA of the pixel.

[0119] The anode electrode (ANO) can have, but is not limited to, a multilayer film structure with a high work function material layer and a reflective material layer. The high work function material layer can include, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and / or indium oxide (In₂O₃). For example, the reflective material layer can include silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), lead (Pb), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or mixtures thereof. For example, the high work function material layer can be disposed above the reflective material layer and can thus be positioned closer to the light-emitting layer (EML). For example, the anode electrode (ANO) can have a multilayer structure of indium tin oxide (ITO) / magnesium (Mg), indium tin oxide (ITO) / magnesium fluoride (MgF), indium tin oxide (ITO) / silver (Ag), or indium tin oxide (ITO) / silver (Ag) / indium tin oxide (ITO), but the invention is not limited thereto.

[0120] A pixel-defining layer (PDL) may be disposed on a portion of the anode electrode (ANO). The PDL may be disposed on the anode electrode (ANO) and may include an opening exposing at least a portion of the anode electrode (ANO). The emitting region (EMA) and the non-emitting region (NEM) may be defined by the PDL and the opening in the PDL. The PDL may comprise an organic insulating material. However, the invention is not limited thereto, and the PDL may comprise an inorganic material.

[0121] Spacers SC can be disposed on the pixel defining layer PDL. Spacers SC can be used to maintain gaps with structures disposed on them. Similar to the pixel defining layer PDL, spacers SC can include organic insulating material.

[0122] The light-emitting layer (EML) is disposed on the portion of the anode electrode (ANO) exposed by the pixel-defined layer (PDL). The EML may include an organic material layer. The organic material layer of the EML includes an organic light-emitting layer, and may also include a hole injection / transport layer and / or an electron injection / transport layer.

[0123] The cathode electrode (CAT) can be disposed on the emissive layer (EML). The cathode electrode (CAT) can be a common electrode disposed on the pixel, without distinguishing between pixels. For example, the cathode electrode (CAT) can be disposed entirely on the pixel. The anode electrode (ANO), the emissive layer (EML), and the cathode electrode (CAT) can each constitute an organic light-emitting element.

[0124] The cathode electrode CAT may include a low work function material layer, including, for example, lithium (Li), calcium (Ca), LiF, aluminum (Al), magnesium (Mg), silver (Ag), platinum (Pt), lead (Pd), nickel (Ni), gold (Au), neodymium (Nd), iridium (Ir), chromium (Cr), barium fluorine (BaF), barium (Ba), or compounds or mixtures thereof, or materials with a multilayer structure such as LiF / Ca or LiF / Al (e.g., mixtures of silver (Ag) and magnesium (Mg)). The cathode electrode CAT may also include a transparent metal oxide layer disposed on the low work function material layer.

[0125] A thin-film encapsulation layer EN, comprising a first inorganic layer EN1, a first organic layer EN2, and a second inorganic layer EN3, is disposed on the cathode electrode CAT. For example, at one end of the thin-film encapsulation layer EN, the first inorganic layer EN1 and the second inorganic layer EN3 can be in contact with each other. For example, the first organic layer EN2 can be sealed by the first inorganic layer EN1 and the second inorganic layer EN3.

[0126] Each of the first inorganic layer EN1 and the second inorganic layer EN3 may include, for example, silicon nitride (SiN). x ), silicon dioxide (SiO) x) or silicon oxynitride (SiO) x N y The first organic layer EN2 may include organic insulating materials.

[0127] Hereinafter, a method for manufacturing a display device 10 according to an embodiment of the present invention will be described.

[0128] Figures 8 to 12 This is a cross-sectional view illustrating a method for manufacturing a display device according to an embodiment of the present invention. Figures 8 to 12 This is a cross-sectional view of the optical layer 420 of the fingerprint sensor 400 of the display device 10 according to an embodiment of the present invention for each manufacturing process.

[0129] First, refer to Figure 8 A light-transmitting component material layer is formed on the photosensitive layer 410, and a mask pattern MS is used for etching to form the light-transmitting component 421. For example, the light-transmitting component material layer is formed on the entire upper surface of the photosensitive layer 410.

[0130] For example, a light-transmitting component material layer can be formed over the entire area of ​​the photosensitive layer 410. The light-transmitting component material layer can comprise substantially the same material as the aforementioned light-transmitting component 421. Subsequently, a mask pattern MS is patterned on the light-transmitting component material layer. The mask pattern MS can comprise substantially the same planar pattern as the light-transmitting component 421, and multiple mask patterns can be provided. The mask pattern MS can comprise at least one of a transparent conductive oxide (TCO) and an inorganic layer. While not limited thereto, for example, the transparent conductive oxide (TCO) can comprise at least one of indium tin oxide (ITO) and indium zinc oxide (IZO), and the inorganic layer includes aluminum (Al), etc.

[0131] The light-transmitting component material layer can be patterned to form the light-transmitting component 421 by etching the light-transmitting component material layer using a patterned mask pattern MS as an etching mask. For example, the etching process of the light-transmitting component material layer can be performed by dry etching, but the present invention is not limited thereto, and the etching process of the light-transmitting component material layer can also be performed by wet etching. A portion of the light-transmitting component material layer not covered by the mask pattern MS can be removed, and only the portion covered by the mask pattern MS can be retained.

[0132] Subsequently, reference Figure 9 A light-blocking component material layer 422m is formed on a light-sensing layer 410 on which a light-transmitting component 421 is disposed, and a planarization component material layer 423m is formed on the light-blocking component material layer 422m.

[0133] For example, a light-blocking component material layer 422m is formed on a photosensitive layer 410 on which a light-transmitting component material layer 421m is disposed. The light-blocking component material layer 422m may comprise substantially the same material as the light-blocking component 422. The light-blocking component material layer 422m may cover the light-transmitting component 421 and the mask pattern MS, and may be formed on the photosensitive layer 410. For example, the light-blocking component material layer 422m may be formed over the entire area of ​​the photosensitive layer 410. For example, the light-blocking component material layer 422m may cover the entire area of ​​the side surface of the light-transmitting component 421. The light-blocking component material layer 422m may cover the side and top surfaces of the mask pattern MS.

[0134] The thickness of the light-blocking member material layer 422m disposed on the upper surface of each mask pattern MS can be different from each other. For example, the first thickness TH1 of the light-blocking member material layer 422m disposed on the upper surface of one mask pattern MS can be greater than the second thickness TH2 of the light-blocking member material layer 422m disposed on the upper surface of another mask pattern MS adjacent to the one mask pattern MS.

[0135] The planarization component material layer 423m can be disposed on the light-blocking component material layer 422m. For example, the planarization component material layer 423m can be disposed over the entire area of ​​the light-blocking component material layer 422m. The light-blocking component material layer 422m can be provided with steps, and the steps in the light-blocking component material layer 422m are disposed in adjacent unit light transmission areas OA. n The upper surface of the portion in the light-blocking region LSA is between the upper surface of the portion of the light-blocking component material layer 422m and the portion of the light-blocking component material layer 422m in the unit light-transmitting region OA. n Between the upper surfaces of the parts in the middle. In this case, since the planarization component material layer 423m can be provided on the light transmission component 421, the mask pattern MS and the light blocking component material layer 422m, the step can be compensated, and the upper surface of the planarization component material layer 423m can be substantially flat.

[0136] The planarization component material layer 423m may comprise substantially the same material as the planarization component 423 described above. While not limited thereto, the thickness of the planarization component material layer 423m may, for example, be in the range of approximately 5 μm to approximately 15 μm or in the range of approximately 1 μm to approximately 20 μm. Here, the thickness of the planarization component material layer 423m may refer to the average thickness of the entire area of ​​the planarization component material layer 423m.

[0137] After the light-blocking component material layer 422m and the planarization component material layer 423m are formed, the entire area of ​​the planarization component material layer 423m is exposed. For example, the upper surface of the planarization component material layer 423m can be exposed.

[0138] Subsequently, reference Figure 10 The exposed planarization component material layer 423m can be developed, thereby reducing the thickness of the planarization component material layer 423m.

[0139] For example, the planarization component material layer 423m may include a positive photosensitive material, and in this case, the exposed portion of the planarization component material layer 423m does not remain in a cured state and has the property of being soluble in the developer. Therefore, the thickness of the planarization component material layer 423m can be reduced by developing the exposed portion with the developer. After development, the remaining portion can be cured.

[0140] Subsequently, reference Figure 11 After etching and development, the remaining light-blocking component material layer 422m and planarization component material layer 423m are used to form light-blocking component 422 and planarization component 423.

[0141] For example, the remaining light-blocking component material layer 422m and planarization component material layer 423m after etching and development are used to pattern the remaining light-blocking component material layer 422m and planarization component material layer 423m to form light-blocking component 422 and planarization component 423. For example, the process of forming light-blocking component 422m and planarization component 423m by the remaining light-blocking component material layer 422m and planarization component material layer 423m after etching and development can be performed by dry etching, but the present invention is not limited thereto.

[0142] Through an etching process, the height of one surface of the light-blocking member 422 is substantially the same as the height of one surface of the planarization member 423, and the upper surface 422a of the light-blocking member 422 (reference) Figure 6 The light-blocking member 422 and the planarization member 423 can be exposed. For example, the upper surface of the light-blocking member 422 and the upper surface of the planarization member 423 can be coplanar. In addition, the height of one surface of the light-blocking member 422 and the height of one surface of the planarization member 423 can be positioned at a height lower than the height of one surface of the light-transmitting member 421.

[0143] Since the planarization component material layer 423m is disposed on the light-blocking component material layer 422m, even if the thickness of the light-blocking component material layer 422m disposed on each mask pattern MS is different, the light-blocking component material layer 422m disposed on each mask pattern MS can be removed simultaneously from each mask pattern MS. For example, since the planarization component material layer 423m is disposed on the light-blocking component material layer 422m, the thickness of the organic layer disposed on each mask pattern MS can be substantially the same as each other.

[0144] Both the photoblocking component material layer 422m and the planarization component material layer 423m can each comprise an organic material, and in this case, the two material layers can be etched to substantially the same degree. After development, the remaining photoblocking component material layer 422m and planarization component material layer 423m can be etched simultaneously, and therefore, even if the thickness of the photoblocking component material layer 422m disposed on each mask pattern MS is different, the photoblocking component material layer 422m disposed on each mask pattern MS can be removed simultaneously from each mask pattern MS. Therefore, it can suppress or prevent the photoblocking component material layer 422m from remaining on the mask pattern MS, and subsequently, the removal of the mask pattern MS can be easier.

[0145] Furthermore, over-etching to remove all light-blocking member material layers 422m, which are disposed on each mask pattern MS and have different thicknesses, can be unnecessary. Therefore, damage to the light-transmitting member 421 due to over-etching of the light-blocking member material layer 422m can be suppressed or prevented, and in addition, the reliability degradation of the fingerprint sensor 400 can be suppressed or prevented.

[0146] Furthermore, since the light-blocking component material layer 422m is covered by the planarization component material layer 423m, the upper surfaces of the light-blocking component 422 and the planarization component 423 can be substantially flat, and the etching of the light-blocking component material layer 422m disposed in the light-blocking region LSA can be minimized. Therefore, since the additional configuration for planarization can be unnecessary, the manufacturing process can be simplified, the process cost can be reduced, and contamination inside the chamber where the etching process is performed can be minimized.

[0147] Subsequently, reference Figure 12 After forming the light-blocking member 422 and the planarization member 423, the mask pattern MS is removed. The mask pattern MS can be removed by wet etching, but the present invention is not limited thereto.

[0148] Even though the thickness of the light-blocking component material layer 422m disposed on each mask pattern MS is different, the light-blocking component material layer 422m disposed on each mask pattern MS can be removed simultaneously because the planarization component material layer 423m is further disposed. Therefore, each mask pattern MS can be exposed without being covered by the light-blocking component material layer 422m and can be easily removed by wet etching. Since the mask patterns MS can be easily removed, the reliability of the fingerprint sensor 400 can be increased.

[0149] In the following description, embodiments of the display device will be described. In the following embodiments, the description of components that are the same as those in the previously described embodiments will be omitted or simplified, and the differences will be mainly described.

[0150] Figure 13 This is a cross-sectional view of a display device according to an embodiment of the present invention.

[0151] refer to Figure 13 According to this embodiment, the display device 10_1 and Figure 4 The difference in the embodiment of the display device 10 is that the display device 10_1 further includes an outer coating OC_1. According to this embodiment, the outer coating OC_1 can cover the light-transmitting member 421, the light-blocking member 422, and the planarization member 423, and can overlap with the photosensitive layer 410. For example, the outer coating OC_1 can overlap the entire upper surface of the photosensitive layer 410. An adhesive member STM can be disposed on the outer coating OC_1. While not limited thereto, the outer coating OC_1 can include organic materials, but it can also include inorganic materials.

[0152] Even in this case, the mask pattern is set at MS (reference). Figure 11 ) light-blocking component material layer 422m (reference) Figure 10 It can also be easily etched, and the mask pattern MS (reference) Figure 11 The light-transmitting member 421 can be easily removed, preventing damage to the light-transmitting member 421 and minimizing etching of the light-blocking member 422 in the light-blocking region LSA. Furthermore, since the outer coating OC_1 covers the light-transmitting member 421, the light-blocking member 422, and the planarization member 423, the upper portions of these members can be planarized and attached to the display panel 100 more easily.

[0153] Figure 14 This is a cross-sectional view of the fingerprint sensor of a display device according to an embodiment of the present invention.

[0154] refer to Figure 14 According to the fingerprint sensor 400_2 in this embodiment and Figure 5The difference in the embodiment of the fingerprint sensor 400 is that the height h1 of one surface of the light-transmitting member 421_2 of the fingerprint sensor 400_2 is substantially the same as the height h2 of one surface of each of the light-blocking member 422_2 and the planarization member 423_2 of the fingerprint sensor 400_2. For example, the height h1 of one surface of the light-transmitting member 421_2 and the height h2 of one surface of each of the light-blocking member 422_2 and the planarization member 423_2 of the fingerprint sensor 400_2 may be relative to the photosensitive layer 410 (reference). Figure 4 One or the other surface of the light-transmitting member 421_2, the light-blocking member 422_2, and the planarization member 423_2 may be coplanar.

[0155] Even in this case, the mask pattern is set at MS (reference). Figure 11 ) light-blocking component material layer 422m (reference) Figure 10 It can also be easily etched, and the mask pattern MS (reference) Figure 11 The light-transmitting member 421_2 can be easily removed, preventing damage to the light-transmitting member 421_2 and minimizing etching of the light-blocking member 422_2 in the light-blocking region LSA. Furthermore, since the height h1 of one surface of the light-transmitting member 421_2 of the fingerprint sensor 400_2 and the height h2 of one surface of each of the light-blocking member 422_2 and the planarization member 423_2 are positioned at the same height, the upper portion of the fingerprint sensor 400_2 can be substantially flat and can be more easily attached to the display panel 100.

[0156] Figure 15 This is a cross-sectional view of the fingerprint sensor of a display device according to an embodiment of the present invention.

[0157] refer to Figure 15 According to the fingerprint sensor 400_3 in this embodiment and Figure 5 The difference between the fingerprint sensor 400 in this embodiment is that the height h1 of one surface of the light-transmitting member 421_3 of the fingerprint sensor 400_3 is relative to the light-sensing layer 410 (see [link]). Figure 4 One or the other surface of the fingerprint sensor 400_3 is positioned at a height lower than the height h2 of one surface of each of the light blocking member 422_3 and the planarization member 423_3.

[0158] Even in this case, the mask pattern is set at MS (reference). Figure 11 ) light-blocking component material layer 422m (reference) Figure 10 It can also be easily etched, and the mask pattern MS (reference) Figure 11 The light blocking member 422_2 can be easily removed, preventing damage to the light-transmitting member 421_2 and minimizing etching of the light blocking member 422_2 in the light-blocking region LSA. Furthermore, since the height h2 of one surface of each of the light blocking member 422_3 and the planarization member 423_3 in the fingerprint sensor 400_3 is positioned at a height higher than the height h1 of one surface of the light-transmitting member 421_3 in the fingerprint sensor 400_3, the light blocking region LSA can more easily block external light from entering the light-transmitting member 421_3 and increase the reliability of fingerprint sensing.

[0159] Figure 16 This is a cross-sectional view of the fingerprint sensor of a display device according to an embodiment of the present invention.

[0160] refer to Figure 16 According to this embodiment, the fingerprint sensor 400_4 and Figure 5 The fingerprint sensor 400 of the embodiment differs in that the planarization member 423_4 of the fingerprint sensor 400_4 covers the light-blocking member 422_4. For example, the planarization member 423_4 may completely cover the upper surface of the light-blocking member 422_4. In other words, in a planar view, the planarization member 423_4 may be formed with substantially the same pattern as the light-blocking member 422_4, and the planarization member 423_4 may overlap with the light-blocking member 422_4 in the thickness direction. For example, the light-blocking member 422_4 and the planarization member 423_4 may completely overlap each other in the thickness direction. Therefore, the entire area of ​​the light-blocking member 422_4 can be covered by the planarization member 423_4 and may not be exposed.

[0161] Even in this case, the mask pattern is set at MS (reference). Figure 11 ) light-blocking component material layer 422m (reference) Figure 10 It can also be easily etched, and the mask pattern MS (reference) Figure 11 The light-blocking member 422_4 can be easily removed, preventing damage to the light-transmitting member 421_4 and minimizing etching of the light-blocking member 422_4 in the light-blocking region LSA. Furthermore, the light-blocking member 422_4 and the planarization member 423_4 can be configured with various arrangements, allowing the arrangement of the components to be changed as desired.

[0162] Although the present invention has been described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and detail may be made to the invention without departing from the spirit and scope thereof.

Claims

1. A fingerprint sensor, wherein, The fingerprint sensor includes: a light sensing layer including light sensing elements; and an optical layer including a plurality of light transmission regions, a light blocking region, a light transmission member disposed in the plurality of light transmission regions, a light blocking member disposed in the light blocking region, and a planarization member disposed on the light blocking member, wherein the light blocking region surrounds the plurality of light transmission regions, wherein the light transmission member includes a first organic material, wherein the light blocking member includes a second organic material, wherein the planarization member includes a third organic material, and wherein the light blocking member further includes a recess, and the planarization member is disposed on the recess. 2.The fingerprint sensor of claim 1, wherein, the planarization member overlaps the light blocking member in a thickness direction, and exposes a portion of the light blocking member. 3.The fingerprint sensor of claim 2, wherein, the portion of the light blocking member exposed by the planarization member is disposed between the light transmission member and the planarization member, and wherein the light blocking member at least partially surrounds the light transmission member. 4.The fingerprint sensor of claim 1, wherein, the planarization member further includes a positive photosensitive material. 5.The fingerprint sensor of claim 1, wherein, the planarization member exposes a portion of the light blocking member, and a first surface of the planarization member and a first surface of the portion of the light blocking member exposed by the planarization member are positioned at a same first height relative to a first surface of the light sensing layer, and wherein a first surface of the light transmission member is positioned at a second height higher than the first height relative to the first surface of the light sensing layer.

6. A display device, wherein, The display device includes: a display panel; and a fingerprint sensor disposed on the display panel, wherein the fingerprint sensor includes: a light sensing layer including light sensing elements; and an optical layer including a plurality of light transmission regions, a light blocking region, a light transmission member disposed in the plurality of light transmission regions, a light blocking member disposed in the light blocking region, and a planarization member disposed on the light blocking member, wherein the light blocking region surrounds the plurality of light transmission regions, wherein a light transmittance of the light transmission member is greater than a light transmittance of the planarization member, and the light transmittance of the planarization member is greater than a light transmittance of the light blocking member, wherein the planarization member overlaps the light blocking member in a thickness direction, and exposes a portion of the light blocking member, and wherein the light blocking member further includes a recess, and the planarization member is disposed on the recess. 7.The display device of claim 6, wherein, the portion of the light blocking member exposed by the planarization member is disposed between the light transmission member and the planarization member, and surrounds the light transmission member. 8.The display device of claim 6, wherein, The light transmitting member includes a first organic material, wherein the light blocking member includes a second organic material, and wherein the planarization member includes a third organic material and a positive type photosensitive material.

9. A method of manufacturing a fingerprint sensor, wherein, The method includes: forming a first organic material layer on a light sensing layer; patterning the first organic material layer using an etch mask to form a light transmitting member; forming a second organic material layer on the light transmitting member; forming a third organic material layer on the second organic material layer and including a positive type photosensitive material; and etching the second organic material layer and the third organic material layer to form a light blocking member and a planarization member, wherein the light transmitting member is disposed in each of a plurality of light transmitting regions spaced apart from one another, wherein the light blocking member is disposed in a light blocking region surrounding the plurality of light transmitting regions, wherein the planarization member is disposed on the light blocking member, and wherein the light blocking member further includes a recess and the planarization member is disposed on the recess.

10. The method of claim 9, wherein, The method further includes: after forming the second organic material layer and the third organic material layer, exposing and developing the third organic material layer.

Images