Pin structure of module power supply and module power supply

By employing an interlocking design that integrates plastic and metal pins in the pin structure of the modular power supply, the problems of pin thickness and soldering difficulties are solved, achieving reliable connection, vibration resistance, and size optimization.

CN114420648BActive Publication Date: 2026-06-05MORNSUN GUANGZHOU SCI & TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
MORNSUN GUANGZHOU SCI & TECH
Filing Date
2021-11-30
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

Existing modular power supplies have thick pins and are difficult to assemble by soldering metal pins, which affects the product appearance and component layout space.

Method used

The interlocking structure, which integrates the plastic body and metal pins, achieves interlocking through the design of protrusions and recesses, reducing the number of assembly steps, improving connection reliability and resistance to mechanical vibration, and optimizing pin thickness to reduce product size.

Benefits of technology

It achieves reliable pin connections, reduces assembly steps, improves heat dissipation and connection reliability, while reducing product size and increasing PCB layout space.

✦ Generated by Eureka AI based on patent content.

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    Figure CN114420648B_ABST
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Abstract

The application provides a pin structure of a module power supply and the module power supply. The pin structure of the module power supply comprises: a plastic body, the plastic body has a containing area; a metal pin, the metal pin is integrally connected with the plastic body and is located at the containing area, a first surface of the metal pin is attached to the plastic body, and a second surface of the metal pin opposite to the first surface is exposed to the plastic body; and an interlocking structure, the interlocking structure comprises a protrusion and a recess, one of the protrusion and the recess is located on the plastic body, and the other is located on the metal pin, the protrusion is inserted into the recess to form interlocking, and the interlocking prevents the metal pin from being pulled out of the plastic body. The application solves the problem that the pin thickness of the module power supply in the prior art is relatively thick and the metal pin is difficult to assemble by welding.
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Description

Technical Field

[0001] This invention relates to the field of modular power supply technology, and more specifically, to a pin structure and a modular power supply. Background Technology

[0002] In the field of existing modular power supply products with double-sided molding process, when the size of the molding body and the PCB are the same, the pins are led out from the side of the power supply product. The pin structure is generally divided into the following two types.

[0003] One type involves separating the metal leads and the plastic body. The metal leads must first be soldered to the product before the plastic body is attached as a cover. This lead structure has a complex assembly process, requiring at least two steps, resulting in numerous steps and a long assembly time. This structure also has requirements regarding the thickness and dimensions of the metal leads. When the metal leads are thin (e.g., 0.25mm) and long, they are prone to deformation, increasing the difficulty of soldering and assembly and affecting the product's appearance.

[0004] Another method involves integral injection molding / compression molding of the metal leads and plastic body. While this reduces assembly steps due to the integrated molding process, the metal leads are typically encased in plastic on both sides along their thickness. Due to the integrity requirements of injection molding, the metal leads are often thicker, generally exceeding the metal lead thickness plus twice the plastic body thickness. This increased lead thickness leads to an increase in product size. Furthermore, when there are specific requirements for the overall product size, this lead structure necessitates a reduction in PCB size, thereby minimizing component placement space. Summary of the Invention

[0005] The main objective of this invention is to provide a pin structure and a modular power supply to solve the problems of thick pins and difficult metal pin soldering assembly in the prior art.

[0006] To achieve the above objectives, according to one aspect of the present invention, a pin structure for a modular power supply is provided, comprising: a plastic body having a receiving region; a metal pin integrally formed and connected to the plastic body and located at the receiving region, a first surface of the metal pin being attached to the plastic body, and a second surface of the metal pin opposite to the first surface being exposed in the plastic body; and an interlocking structure including a protrusion and a recess, one of the protrusion and the recess being located on the plastic body and the other being located on the metal pin, the protrusion extending into the recess to form an interlock and preventing the metal pin from dislodging from the plastic body.

[0007] Furthermore, the metal pin has a protrusion located at the peripheral edge of the metal pin and extending along the first surface. The thickness of the protrusion is less than the thickness of the metal pin. The plastic body has a recess. The protrusion is continuously arranged along the peripheral side of the metal pin, or there are multiple protrusions, which are spaced apart along the peripheral side of the metal pin.

[0008] Furthermore, the difference between the thickness of the protrusion and the thickness of the metal pin is ≥0.4mm.

[0009] Furthermore, the metal pins have through holes, and a portion of the plastic body is located within the through holes.

[0010] Furthermore, the metal pin includes a bonding portion and a connecting portion, with at least a portion of the connecting portion and the bonding portion both disposed within the receiving area, and the surface of the bonding portion and a portion of the surface of the connecting portion serving as a first surface.

[0011] Furthermore, a portion of the metal lead bends and protrudes towards the center of the plastic body, with the side of the bent and protruding part of the metal lead away from the center of the plastic body serving as a recess, and the plastic body having a protrusion.

[0012] Furthermore, the recess is located on the second surface, and both the recess and the protrusion extend along the width direction of the metal pin, with the protrusion connected to the two sides opposite to the receiving area.

[0013] Furthermore, the protrusion of the metal pin is provided with a through hole, a portion of the protrusion is located in the through hole and connected to the side of the receiving area facing the first surface.

[0014] Furthermore, the metal pin includes a first segment and a second segment that are bent in sequence. The second segment is bent toward the center of the plastic body. The first segment has a first surface and a second surface. Both surfaces of the second segment are in contact with the plastic body. The side of the second segment away from the center of the plastic body is a recess.

[0015] Furthermore, the thickness of the plastic body at the location corresponding to the bent protrusion of the metal pin is ≥0.40mm.

[0016] Furthermore, the metal pin has a protrusion located on the first surface and protruding into the plastic body, the plastic body having a recess, the protrusion being integrally formed with the metal pin, or the protrusion being separately processed and connected to the metal pin.

[0017] Furthermore, the size of the end of the protrusion closer to the first surface is smaller than the size of the end farther from the first surface; and / or the protrusion is bent and hooked into the recess.

[0018] Furthermore, the protrusion has a connecting hole, the axis of which is not perpendicular to the first surface, and a portion of the plastic body is located within the connecting hole.

[0019] Furthermore, the metal pins have mating holes, which are recessed and gradually decrease in diameter along the direction close to the plastic body, while the plastic body has protrusions.

[0020] According to another aspect of the present invention, a modular power supply is provided, including a product body and a plurality of pin structures of the above-described modular power supply, wherein pin structures are provided on both opposite sides of the product body.

[0021] By employing the technical solution of this invention, an interlocking structure is provided. The protrusions and recesses of the interlocking structure can be respectively positioned on the plastic body and the metal pin as needed. When the plastic body and the metal pin are integrally injection molded or integrally molded, the protrusion extends into the recess, thereby forming an interlocking relationship between the protrusion and the recess. This interlocking relationship reliably connects the plastic body and the metal pin together. This process reduces the number of pin assembly steps, is convenient and quick, and prevents the metal pin from detaching from the plastic body, improving the mechanical vibration resistance after pin assembly. Simultaneously, the first surface of the metal pin is in contact with the plastic body, while the second surface is exposed, allowing the metal pin to directly contact the product. This ensures both good heat dissipation performance and reliable connection between the metal pin and the plastic body. Furthermore, the thickness of the pin structure is the thickness of the metal pin plus the thickness of the plastic body on one side of the metal pin. With a fixed product size, increasing the PCB layout size and reducing the pin thickness reduces the overall product size. Attached Figure Description

[0022] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0023] Figure 1 A schematic diagram of the pin structure of Embodiment 1 of the present invention is shown;

[0024] Figure 2 It shows Figure 1 Side view of the metal pins in the image;

[0025] Figure 3 It shows Figure 1 A schematic diagram of the structure of the metal pins in the diagram;

[0026] Figure 4 A schematic diagram of the module power supply of the present invention is shown when the pin structure of Embodiment 1 is adopted;

[0027] Figure 5 A schematic diagram of the metal pin structure of the pin structure according to Embodiment 2 of the present invention is shown;

[0028] Figure 6A schematic diagram of the pin structure of Embodiment 4 of the present invention is shown;

[0029] Figure 7 It shows Figure 6 Side view;

[0030] Figure 8 It shows Figure 6 Side view at the through hole;

[0031] Figure 9 A schematic diagram of the module power supply of the present invention is shown when the pin structure of Embodiment 5 is adopted;

[0032] Figure 10 A schematic diagram of the pin structure of Embodiment Six of the present invention is shown;

[0033] Figure 11 This diagram illustrates the pin structure of Embodiment 7 of the present invention with the protrusion located at a non-edge location on the first surface;

[0034] Figure 12 This diagram illustrates the pin structure of Embodiment 7 of the present invention with the protrusion located at the edge of the first surface.

[0035] Figure 13 A schematic diagram of the pin structure of Embodiment 8 of the present invention is shown;

[0036] Figure 14 A schematic diagram of the pin structure of Embodiment 9 of the present invention is shown;

[0037] Figure 15 It shows Figure 14 Side view.

[0038] The above figures include the following reference numerals:

[0039] 10. Plastic body; 20. Metal pin; 21. First surface; 22. Second surface; 23. Through hole; 24. Via hole; 25. Adhesive part; 26. Connecting part; 31. Protrusion; 311. Connecting hole; 32. Recess; 40. Product body; 41. PCB circuit board; 42. Molded body. Detailed Implementation

[0040] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0041] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0042] In this invention, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not intended to limit this invention.

[0043] To address the problems of thick pins and difficult metal pin soldering assembly in existing modular power supplies, this invention provides a pin structure and a modular power supply.

[0044] Example 1

[0045] like Figures 1 to 3 The illustrated pin structure of a modular power supply includes a plastic body 10, a metal pin 20, and an interlocking structure. The plastic body 10 has a receiving area. The metal pin 20 is integrally formed and connected to the plastic body 10 and is located in the receiving area. The first surface 21 of the metal pin 20 is attached to the plastic body 10, and the second surface 22 of the metal pin 20 opposite to the first surface 21 is exposed outside the plastic body 10. The interlocking structure includes a protrusion 31 and a recess 32. One of the protrusion 31 and the recess 32 is located on the plastic body 10, and the other is located on the metal pin 20. The protrusion 31 extends into the recess 32 to form an interlock and prevent the metal pin 20 from coming out of the plastic body 10.

[0046] This embodiment incorporates an interlocking structure. The protrusions 31 and recesses 32 of the interlocking structure can be respectively positioned on the plastic body 10 and the metal pin 20 as needed. When the plastic body 10 and the metal pin 20 are integrally injection molded or integrally molded, the protrusions 31 extend into the recesses 32, thereby forming an interlocking relationship between the protrusions 31 and the recesses 32. This interlocking relationship ensures a reliable connection between the plastic body 10 and the metal pin 20. This process reduces the number of pin assembly steps, is convenient and quick, and prevents the metal pin 20 from detaching from the plastic body 10, improving the pin assembly's resistance to mechanical vibration. Simultaneously, the first surface 21 of the metal pin 20 is in contact with the plastic body 10, while the second surface 22 is exposed outside the plastic body 10, allowing the metal pin 20 to directly contact the product. This ensures good heat dissipation while guaranteeing the reliability of the connection between the metal pin 20 and the plastic body 10. Furthermore, the thickness of the pin structure is the thickness of the metal pin 20 plus the thickness of the plastic body 10 on one side of the metal pin 20. When the product size is fixed, the PCB layout size is increased and the pin thickness is reduced, thereby reducing the product size.

[0047] Generally speaking, the metal lead 20 is in the form of a sheet with a certain thickness, such as Figure 2As shown, the assembly comprises two parts: a bonding portion 25 and a connecting portion 26. The bonding portion 25 has a larger area, while the connecting portion 26 has a smaller area. The bonding portion 25 is mainly used for bonding with the plastic body 10, while the connecting portion 26 is mainly used for mating with external components such as the product. During integral molding, the bonding portion 25 is located within the receiving area. The two opposing surfaces of the bonding portion 25 are a first surface 21 and a second surface 22, which are parallel to each other. The second surface 22 is coplanar with the outer surface of the plastic body 10. The portion of the interlocking structure located on the metal pin 20 is provided on the bonding portion 25, facilitating interlocking with the plastic body 10. The connecting portion 26 does not mat with the plastic body 10 and is therefore located outside the receiving area, exposed outside the plastic body 10, to facilitate mating with external components.

[0048] To facilitate the subsequent explanation of the restricted direction, this embodiment uses... Figure 1 For reference, from the perspective of a person, the direction perpendicular to the first surface 21 is defined as the front-back direction, the direction parallel to the first surface 21 and extending laterally is defined as the left-right direction, and the direction parallel to the first surface 21 and extending longitudinally is defined as the up-down direction.

[0049] In this embodiment, the metal lead 20 has a protrusion 31, and the plastic body 10 has a recess 32. Specifically, the protrusion 31 is located at the peripheral edge of the metal lead 20 and extends along the first surface 21, being parallel to the first surface 21, thereby forming a stepped structure at the edge of the metal lead 20. Correspondingly, the side of the receiving area is provided with a recess 32, and the protrusion 31 is received within the recess 32. Thus, the recess 32 stops the protrusion 31, preventing the metal lead 20 from exiting the plastic body 10. The peripheral edge referred to here is the side surface of the metal lead 20 in the thickness direction, that is, the side surface adjacent to the first surface 21.

[0050] Preferably, the thickness of the protrusion 31 is less than the thickness of the metal pin 20, thus forming a stepped structure at the protrusion 31. The recess 32 surrounds the periphery of the protrusion 31, and the outer edge of the recess 32 abuts against the stepped structure to ensure an interlocking effect between the protrusions 31. More preferably, in this embodiment, the surface of the protrusion 31 that faces the same direction as the first surface 21 coincides with the first surface 21, while the opposite surface is parallel to and does not coincide with the second surface 22, thereby forming the aforementioned stepped structure between the opposite surface and the second surface 22. Of course, the specific positional relationship between the protrusion 31 and the first surface 21 and the second surface 22 can also be adjusted accordingly as needed.

[0051] Preferably, the difference between the thickness of the protrusion 31 and the thickness of the metal pin 20 is ≥0.4mm, thereby improving the interlocking effect between the protrusion 31 and the recess 32.

[0052] In this embodiment, the protrusions 31 are continuously arranged along the periphery of the metal pin 20. Specifically, one edge of the mating portion 25 is connected to the connecting portion 26, and protrusions 31 are formed on the other three sides. This results in a large contact range between the protrusions 31 and the recesses 32, leading to a more reliable interlocking effect. However, the interlocking between the protrusions 31 and the recesses 32 only locks movement in the forward and backward, left and right directions, while the locking effect for movement in the up and down directions is poor. Therefore, this embodiment also provides through holes 23 on the mating portion 25 of the metal pin 20. Figure 3 As shown, the through hole 23 extends through both sides of the metal pin 20 in the thickness direction. Thus, when the plastic body 10 and the metal pin 20 are integrally formed, a part of the plastic body 10 is located inside the through hole 23. Through the stop engagement between this part and the through hole 23, the vertical movement of the metal pin 20 is restricted. Combined with the interlocking effect between the protrusion 31 and the recess 32, the metal pin 20 cannot come out of the plastic body 10 in the vertical, front-back, and left-right directions, ensuring the reliability of the connection with the plastic body 10.

[0053] The protrusion 31 in this embodiment can be formed using either a stamping or etching process as needed. Specifically, when using a stamping process, the periphery of the metal lead 20 is flattened by stamping, thereby forming a thinner protrusion 31. When using an etching process, a portion of the thickness of the periphery of the metal lead 20 is etched away, thereby forming a thinner protrusion 31. In comparison, the protrusion 31 produced by the etching process has higher precision and can be fabricated on a thinner metal lead 20.

[0054] like Figure 4 As shown, this embodiment also provides a modular power supply, including a product body 40 and a plurality of the above-mentioned modular power supply pin structures. The product body 40 of this embodiment includes a PCB circuit board 41 and a plastic package 42. The plastic package 42 is basically the same as the plastic body 10 of the pin structure. The PCB circuit board 41 is disposed in the plastic package 42 to form the product body 40. Pin structures are provided on both opposite sides of the product body 40.

[0055] Example 2

[0056] The difference from Embodiment 1 is that the specific arrangement of the protrusion 31 is different.

[0057] like Figure 5As shown, in this embodiment, the protrusions 31 are not continuously arranged along the circumference of the metal pin 20, but are discontinuously arranged, resulting in multiple protrusions 31 with gaps between them along the circumference of the metal pin 20. Correspondingly, there are also multiple recesses 32 on the plastic body 10, which are spaced apart along the circumference of the receiving area, so that the recesses 32 and protrusions 31 correspond one-to-one. During processing, each protrusion 31 naturally forms a matching recess 32. In this way, the gaps between each protrusion 31 are also filled by the plastic body 10. The interlocking fit between the protrusions 31 and the recesses 32 can not only restrict the movement of the metal pin 20 in the front-back and left-right directions, but also restrict it in the up-down direction. Thus, the interlocking fit between the protrusions 31 and the recesses 32 can achieve the effect that the metal pin 20 cannot come out of the plastic body 10 in the up-down, front-back, and left-right directions. In this case, the through hole 23 in Embodiment 1 is not necessary.

[0058] Example 3

[0059] The difference from Embodiment 1 lies in the different way the vertical movement is restricted.

[0060] In this embodiment, the receiving area not only accommodates the fitting portion 25 but also the connecting portion 26. Specifically, a portion of the connecting portion 26 near the fitting portion 25 and the fitting portion 25 are both located within the receiving area. Thus, a portion of the connecting portion 26 and the entire fitting portion 25 are both within the plastic body 10. Since the size of the fitting portion 25 is larger than the size of the connecting portion 26, the transition portion between them naturally creates a stop effect with the plastic body 10, preventing the metal pin 20 from moving vertically. This is similar to the function of the through hole 23 in Embodiment 1, both effectively restricting the vertical movement of the metal pin 20. At this time, one surface of the fitting portion 25 and one surface of the portion of the connecting portion 26 located within the receiving area together constitute the first surface 21. Correspondingly, the portion on the other side opposite to the first surface 21 is the second surface 22.

[0061] Example 4

[0062] The difference from Embodiment 1 lies in the specific configuration of the interlocking structure.

[0063] like Figures 6 to 8As shown, in this embodiment, the metal lead 20 has a recess 32, and the plastic body 10 has a protrusion 31. Specifically, a portion of the metal lead 20 is bent and protrudes towards the plastic body 10, thereby forming a protruding portion on the first surface 21 and a recess 32 on the second surface 22. When the metal lead 20 and the plastic body 10 are integrally molded, a portion of the plastic body 10 extends into the recess 32, which is the protrusion 31. The protrusion 31 and the recess 32 form an interlocking relationship through a stop engagement, thereby preventing the metal lead 20 from coming out of the plastic body 10 in the up-down, front-back, and left-right directions.

[0064] In this embodiment, the recess 32 extends along the width direction of the metal pin 20, that is, the left and right direction, and is connected to the left and right edges of the metal pin 20. In this way, the protrusion 31 also extends along the width direction of the metal pin 20, and the protrusion 31 is connected to the left and right sides opposite to the receiving area, ensuring an effective connection between the protrusion 31 and the plastic body 10 itself.

[0065] Optionally, a through hole 24 is provided at the protrusion of the metal pin 20, that is, in the recess 32. The through hole 24 penetrates both sides of the metal pin 20 in the thickness direction. In this way, when the metal pin 20 and the plastic body 10 are integrally molded, a part of the protrusion 31 is located in the through hole 24 and connected to the side of the receiving area facing the first surface 21. This part of the structure is also interlocked with the through hole 24, thereby enhancing the interlocking effect and ensuring the reliability of the connection between the metal pin 20 and the plastic body 10.

[0066] Preferably, the thickness of the plastic body 10 at the position corresponding to the protrusion of the metal pin 20 is ≥0.40mm.

[0067] Compared with Embodiment 1, this embodiment makes it easier to manufacture the interlocking structure by ensuring that one side of the metal pin 20 is parallel to one side of the plastic body 10 and is in the same plane. The interlocking structure can be formed by die stamping, and the manufacturing quality is generally better.

[0068] Example 5

[0069] The difference from Embodiment 4 is that the specific bending method of the metal pin 20 is different.

[0070] In this embodiment, the bending of the metal pin 20 is not in the form of a recess as in Embodiment 4, but rather a complete bending, such as... Figure 9As shown. Specifically, the metal lead 20 is bent into a first segment and a second segment. The second segment is bent towards the center of the plastic body 10 compared to the first segment. In this case, the two surfaces of the first segment become the first surface 21 and the second surface 22. The side of the second surface away from the center of the plastic body 10 is a certain distance away from the second surface 22 of the first segment, and thus this part becomes a recess 32. Correspondingly, the plastic body 10 still has a protrusion 31, which covers the surface of the second segment away from the center of the plastic body 10. In this way, both surfaces of the second segment are in contact with the plastic body 10, thereby restricting the metal lead 20 to the plastic body 10, preventing it from coming out of the plastic body 10 in the up-down, front-back, and left-right directions.

[0071] Preferably, the thickness of the plastic body 10 on both sides of the second section is ≥0.40mm.

[0072] Compared to Embodiment 5, the metal pin 20 in Embodiment 4 fits more closely to the side of the product body 40 in actual use, which is beneficial for heat dissipation. Compared to Embodiment 5, the straight metal pin 20 in Embodiment 1 can be thinner than the integrally bent metal pin 20 in Embodiment 5.

[0073] Example 6

[0074] The difference from Embodiment 1 is that the specific arrangement of the protrusion 31 and the recess 32 is different.

[0075] like Figure 10 As shown, in this embodiment, similar to Embodiment 1, the metal pin 20 has a protrusion 31, and the plastic body 10 has a recess 32. However, unlike Embodiment 1, the protrusion 31 in this embodiment is not located on the peripheral edge of the metal pin 20, but rather on the first surface 21. Specifically, the protrusion 31 is located on the first surface 21 and protrudes into the plastic body 10. A corresponding recess 32 is provided on the plastic body 10. When the metal pin 20 and the plastic body 10 are integrally formed, the protrusion 31 is located within the recess 32, thus forming an interlocking relationship with the recess 32.

[0076] In this embodiment, the size of the end of the protrusion 31 near the first surface 21 is smaller than the size of the end away from the first surface 21. Correspondingly, the shape of the recess 32 matches the protrusion 31. In this way, the side of the protrusion 31 matches the side of the recess 32, preventing the protrusion 31 from coming out of the recess 32, thus achieving the effect that the metal pin 20 cannot come out of the plastic body 10 in the up-down, front-back, and left-right directions.

[0077] In this embodiment, the cross-section of the protrusion 31 is trapezoidal. The short side of the trapezoid is connected to the first surface 21 and serves as the end closest to the first surface 21. The long side of the trapezoid serves as the end furthest from the first surface 21. The inclined surface of the trapezoid cooperates with the inclined surface of the recess 32, thereby preventing the protrusion 31 from coming out of the recess 32 and realizing a reliable connection between the metal pin 20 and the plastic body 10.

[0078] Optionally, the number of protrusions 31 can be set to one or more as needed. When multiple protrusions 31 are set, each protrusion 31 is arranged on the first surface 21. The specific setting position can also be selected as needed, and can be set at the edge or non-edge of the first surface 21.

[0079] The interlocking structure in this embodiment is achieved by first fabricating a metal protrusion 31, and then soldering the metal protrusion 31 onto the metal pin 20. Because the metal protrusion 31 is very small, precision etching equipment and high-level process control are required.

[0080] Example 7

[0081] The difference from Embodiment Six lies in the specific arrangement of the protrusion 31.

[0082] In this embodiment, the cross-section of the protrusion 31 is not trapezoidal, but bent to form an approximately L-shaped structure. Correspondingly, the shape of the recess 32 matches the shape of the protrusion 31. In this way, one end of the L-shaped structure is connected to the first surface 21, and the other end is hooked into the recess 32 of the plastic body 10, thereby preventing the protrusion 31 from coming out of the recess 32, thus preventing the metal pin 20 from coming out of the plastic body 10, and achieving the interlocking effect between the metal pin 20 and the plastic body 10.

[0083] Similar to Embodiment 4, the number of protrusions 31 and their specific positions on the first surface 21 in this embodiment can be selected as needed. They can be placed at the edge or non-edge of the first surface 21, such as... Figure 11 and Figure 12 As shown.

[0084] When the protrusion 31 is disposed on the edge of the first surface 21 and is integrally disposed thereon, that is, when... Figure 12 In the setup shown, a stamping process can be used to stamp the metal pin 20 around its perimeter into a thin sheet. Then, this thin sheet can be bent and rolled backward to form an L-shaped protrusion 31.

[0085] Optionally, the specific connection relationship between the protrusion 31 and the metal pin 20 can be set as needed. Specifically, the protrusion 31 can be formed by bending or other means of a part of the metal pin 20, or it can be an additional component connected to the metal pin 20 by welding or other means.

[0086] Example 8

[0087] The difference from embodiments six and seven is that the specific structure of the protrusion 31 is different.

[0088] like Figure 13 As shown, in this embodiment, the protrusion 31 also has a connecting hole 311. The axis of the connecting hole 311 is not perpendicular to the first surface 21, and the connecting hole 311 extends through the opposite sides of the protrusion 31. When the metal pin 20 is integrally formed with the plastic body 10, a part of the plastic body 10 is located in the connecting hole 311. This part cooperates with the connecting hole 311, thereby further enhancing the interlocking effect and ensuring the reliability of the interlocking.

[0089] Example 9

[0090] The difference from Embodiment 1 is that the specific arrangement of the protrusion 31 and the recess 32 is different.

[0091] like Figure 14 and Figure 15 As shown, in this embodiment, the metal pin 20 has a mating hole, which is a recess 32, and the diameter of the mating hole gradually decreases along the direction close to the plastic body 10. Correspondingly, the plastic body 10 has a protrusion 31, the shape of which matches the shape of the mating hole. In this way, the mating hole and the protrusion 31 fit together so that the metal pin 20 cannot come out of the plastic body 10 in the up-down or left-right directions, and the shape of the mating hole prevents the protrusion 31 from coming out of the mating hole in the front-back direction, thus preventing the metal pin 20 from coming out of the plastic body 10 in the front-back direction, achieving a reliable connection between the two.

[0092] This configuration method in this embodiment is suitable for use when the metal pin 20 is thick. Therefore, it is not necessary to perform winding, etching or other processing on the metal pin 20. The interlocking structure can be manufactured simply by stamping.

[0093] It should be noted that the fit between the protrusion 31 and the recess 32 is formed during the integral molding process of the metal pin 20 and the plastic body 10. The arrangement of the above embodiments can be combined or replaced as needed.

[0094] It should be noted that "multiple" in the above embodiments refers to at least two.

[0095] As can be seen from the above description, the embodiments of the present invention achieve the following technical effects:

[0096] 1. This solves the problem of thick pins and difficult metal pin soldering assembly in existing technologies for modular power supplies;

[0097] 2. The interlocking relationship ensures a reliable connection between the plastic body and the metal pins. This process reduces the number of pin assembly steps, is convenient and quick, prevents the metal pins from falling off the plastic body, and improves the resistance to mechanical vibration after pin assembly.

[0098] 3. The metal pins can directly contact the product, ensuring good heat dissipation while guaranteeing the reliability of the connection between the metal pins and the plastic body;

[0099] 4. The thickness of the pin structure is the thickness of the metal pin plus the thickness of the plastic body on one side of the metal pin. When the product size is fixed, increasing the PCB layout size and reducing the pin thickness will reduce the product size.

[0100] Obviously, the embodiments described above are merely some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention.

[0101] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0102] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0103] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A pin structure for a modular power supply, characterized in that, include: A plastic body (10) having a receiving area; Metal pin (20) is integrally formed and connected to the plastic body (10) and located in the receiving area. The first surface (21) of the metal pin (20) is attached to the receiving area of ​​the plastic body (10), and the second surface (22) of the metal pin (20) opposite to the first surface (21) is exposed in the plastic body (10). An interlocking structure is provided, comprising a protrusion (31) and a recess (32), one of which is located on the plastic body (10) and the other on the metal pin (20). The protrusion (31) extends into the recess (32) to form an interlock and prevent the metal pin (20) from coming out of the plastic body (10). The total thickness of the pin structure is only the sum of the thickness of the metal pin (20) and the thickness of the plastic body (10) on the first surface (21) side of the metal pin (20).

2. The pin structure of the module power supply according to claim 1, characterized in that, The metal pin (20) has the protrusion (31), the protrusion (31) is located at the peripheral edge of the metal pin (20) and extends along the first surface (21), the thickness of the protrusion (31) is less than the thickness of the metal pin (20), the plastic body (10) has the recess (32), the protrusion (31) is continuously arranged along the peripheral side of the metal pin (20), or there are multiple protrusions (31) and they are spaced apart along the peripheral side of the metal pin (20).

3. The pin structure of the module power supply according to claim 2, characterized in that, The difference between the thickness of the protrusion (31) and the thickness of the metal pin (20) is ≥0.4mm.

4. The pin structure of the module power supply according to claim 2, characterized in that, The metal pin (20) has a through hole (23), and a portion of the plastic body (10) is located within the through hole (23).

5. The pin structure of the module power supply according to claim 2, characterized in that, The metal pin (20) includes a bonding portion (25) and a connecting portion (26), at least a portion of the connecting portion (26) and the bonding portion (25) are disposed in the receiving area, and the surface of the bonding portion (25) and a portion of the surface of the connecting portion (26) serve as the first surface (21).

6. The pin structure of the module power supply according to claim 1, characterized in that, A portion of the metal pin (20) bends and protrudes toward the center of the plastic body (10), and the side of the bent and protruding part of the metal pin (20) away from the center of the plastic body (10) serves as the recess (32), and the plastic body (10) has the protrusion (31).

7. The pin structure of the module power supply according to claim 6, characterized in that, The recess (32) is located on the second surface (22), and both the recess (32) and the protrusion (31) extend along the width direction of the metal pin (20), and the protrusion (31) is connected to the two sides opposite to the receiving area.

8. The pin structure of the module power supply according to claim 6, characterized in that, The protrusion of the metal pin (20) is provided with a through hole (24), a portion of the protrusion (31) is located in the through hole (24) and connected to the side of the receiving area facing the first surface (21).

9. The pin structure of the module power supply according to claim 6, characterized in that, The metal pin (20) includes a first segment and a second segment that are bent in sequence. The second segment is bent toward the center of the plastic body (10). The first segment has a first surface (21) and a second surface (22). Both surfaces of the second segment are in contact with the plastic body (10). The side of the second segment away from the center of the plastic body (10) serves as the recess (32).

10. The pin structure of the module power supply according to claim 6, characterized in that, The thickness of the plastic body (10) at the position corresponding to the bent protrusion of the metal pin (20) is ≥0.40mm.

11. The pin structure of the module power supply according to claim 1, characterized in that, The metal pin (20) has the protrusion (31) located on the first surface (21) and protruding into the plastic body (10). The plastic body (10) has the recess (32). The protrusion (31) is integrally formed with the metal pin (20), or the protrusion (31) and the metal pin (20) are separately processed and connected together.

12. The pin structure of the module power supply according to claim 11, characterized in that, The size of the protrusion (31) at the end closer to the first surface (21) is smaller than the size of the end farther from the first surface (21); and / or The protrusion (31) is bent and hooked into the recess (32).

13. The pin structure of the module power supply according to claim 11, characterized in that, The protrusion (31) has a connecting hole (311), the axis of which is not perpendicular to the first surface (21), and a portion of the plastic body (10) is located inside the connecting hole (311).

14. The pin structure of the module power supply according to claim 1, characterized in that, The metal pin (20) has a mating hole, which serves as the recess (32), and the diameter of the mating hole gradually decreases along the direction close to the plastic body (10), and the plastic body (10) has the protrusion (31).

15. A modular power supply, characterized in that, The product body (40) includes a product body (40) and a pin structure of a module power supply according to any one of claims 1 to 14, wherein the pin structure is provided on both opposite sides of the product body (40).