Flexible display panel and manufacturing method thereof

Abstract

The present application provides a flexible display panel and a method for manufacturing the same. The flexible display panel includes a flexible substrate, a TFT layer, a flat layer, a first electrode, a pixel definition layer, an OLED functional layer, a second electrode, and an encapsulation layer. The TFT layer is disposed on the flexible substrate. The flat layer is disposed on the TFT layer, and the flat layer has a plurality of first through holes located in the border area. The first electrode is disposed on the flat layer. The pixel definition layer is disposed on the flat layer and the TFT layer, and the pixel definition layer has a plurality of second through holes located in the border area, and the plurality of second through holes are respectively connected to the plurality of first through holes to form a plurality of receiving grooves. The OLED functional layer is disposed in the pixel definition layer. The second electrode is disposed on the pixel definition layer and in the plurality of receiving grooves. The encapsulation layer is disposed on the second electrode and in the plurality of receiving grooves. That is, the encapsulation layer has a plurality of protrusions located in the plurality of receiving grooves, and the plurality of protrusions can prevent water and oxygen that penetrate into the flat layer and the pixel definition layer from entering the OLED functional layer, thereby improving reliability and service life.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a flexible display panel and a manufacturing method thereof. Background Art

[0002] Electroluminescent diodes (OLEDs) have the advantages of simple preparation process, low cost, high luminous efficiency, easy formation of flexible structure, low power consumption, high color saturation and wide viewing angle. Display technology using electroluminescent diodes has become an important display technology.

[0003] OLEDs are current-mode light-emitting devices, primarily consisting of an anode, cathode, and OLED functional layers. The primary operating principle of OLEDs is that the OLED functional layers emit light through carrier injection and recombination, driven by the electric field formed by the anode and cathode.

[0004] In the pursuit of narrow borders in flexible display panels of existing technology, the area of ​​the display area remains unchanged while the area of ​​the border area (i.e., the non-display area) is reduced. This poses a great challenge to the packaging technology of flexible display panels, causing external water and oxygen to easily enter the display area, thereby affecting the efficiency and service life of OLED devices. Summary of the Invention

[0005] The present application provides a flexible display panel and a manufacturing method thereof, so as to solve the problem that external water and oxygen easily enter the display area due to the narrow frame technology of the flexible display panel in the prior art.

[0006] In one aspect, the present application provides a flexible display panel having a display area and a frame area surrounding the display area, including:

[0007] Flexible substrate;

[0008] A TFT layer, the TFT layer being provided on the flexible substrate;

[0009] a planar layer, the planar layer being disposed on the TFT layer and having a plurality of first through holes located in the frame area;

[0010] a first electrode, the first electrode being disposed on the planar layer and connected to the TFT layer;

[0011] a pixel definition layer, the pixel definition layer being disposed on the planar layer and the TFT layer, and the pixel definition layer having a plurality of second through holes located in the frame area, the plurality of second through holes being respectively connected to the plurality of first through holes to form a plurality of receiving grooves;

[0012] an OLED functional layer, the OLED functional layer being disposed in the pixel definition layer and connected to the first electrode;

[0013] a second electrode, the second electrode being disposed on the pixel definition layer and in the plurality of receiving grooves and connected to the OLED functional layer;

[0014] The packaging layer is disposed on the second electrode and in the plurality of receiving grooves.

[0015] In some possible implementations, the border area includes a Dummy area surrounding the display area, and a GOA area surrounding the Dummy area;

[0016] A plurality of the receiving slots are located in the Dummy area.

[0017] In some possible implementations, the border area further includes a peripheral area surrounding the GOA area; and the plurality of receiving grooves are further located in the peripheral area.

[0018] In some possible implementations, the TFT layer includes peripheral traces located in the peripheral area;

[0019] The planar layer and the pixel definition layer extend above the peripheral wiring, and the packaging layer surrounds the planar layer and the pixel definition layer.

[0020] In some possible implementations, the encapsulation layer includes a first inorganic barrier layer, an organic buffer layer disposed on the first inorganic barrier layer, and a second inorganic barrier layer disposed on the organic buffer layer; the first inorganic barrier layer is disposed on the second electrode and in the plurality of the receiving grooves.

[0021] On the other hand, the present application also provides a method for manufacturing a flexible display panel, comprising:

[0022] Providing a flexible substrate, wherein the flexible substrate has a display area and a frame area surrounding the display area, and manufacturing a TFT layer on the flexible substrate;

[0023] Fabricating a planar layer on the TFT layer, and patterning the planar layer to form a plurality of first through holes located in the frame area;

[0024] forming a first electrode on the planar layer, wherein the first electrode is connected to the TFT layer;

[0025] A pixel definition layer is formed on the planar layer and the TFT layer, and the pixel definition layer is patterned to form a plurality of second through holes located in the border area; the plurality of second through holes are respectively connected to the plurality of first through holes to form a plurality of receiving grooves;

[0026] Fabricating an OLED functional layer in the pixel definition layer, wherein the OLED functional layer is connected to the first electrode;

[0027] Fabricating a second electrode on the pixel definition layer and in the plurality of receiving grooves, wherein the second electrode is connected to the OLED functional layer;

[0028] A packaging layer is formed on the second electrode and in the plurality of receiving grooves.

[0029] In some possible implementations, the border area includes a Dummy area surrounding the display area, and a GOA area surrounding the Dummy area;

[0030] A plurality of the receiving slots are located in the Dummy area.

[0031] In some possible implementations, the border area further includes a peripheral area surrounding the GOA area; and the plurality of receiving grooves are further located in the peripheral area.

[0032] In some possible implementations, the TFT layer includes peripheral traces located in the peripheral area;

[0033] The planar layer and the pixel definition layer extend above the peripheral wiring, and the packaging layer surrounds the planar layer and the pixel definition layer.

[0034] In some possible implementations, the encapsulation layer includes a first inorganic barrier layer, an organic buffer layer disposed on the first inorganic barrier layer, and a second inorganic barrier layer disposed on the organic buffer layer; the first inorganic barrier layer is disposed on the second electrode and in the plurality of the receiving grooves.

[0035] The flexible display panel provided in the present application includes a flexible substrate, a TFT layer, a flat layer, a first electrode, a pixel definition layer, an OLED functional layer, a second electrode and an encapsulation layer. The TFT layer is arranged on the flexible substrate. The flat layer is arranged on the TFT layer, and the flat layer has a plurality of first through holes located in the border area. The first electrode is arranged on the flat layer and connected to the TFT layer. The pixel definition layer is arranged on the flat layer and the TFT layer, and the pixel definition layer has a plurality of second through holes located in the border area, and the plurality of second through holes are respectively connected to the plurality of first through holes to form a plurality of receiving grooves. The OLED functional layer is arranged in the pixel definition layer and connected to the first electrode. The second electrode is arranged on the pixel definition layer and in the plurality of receiving grooves, and is connected to the OLED functional layer. The encapsulation layer is arranged on the second electrode and in the plurality of receiving grooves. That is, the present application forms multiple receiving grooves located in the frame area in the flat layer and the pixel definition layer, and the encapsulation layer is arranged in the multiple receiving grooves. The encapsulation layer has multiple protrusions located in the multiple receiving grooves. The multiple protrusions are located in the flat layer and the pixel definition layer, which can block the water and oxygen that penetrate into the flat layer and the pixel definition layer from entering the OLED functional layer, thereby preventing the water and oxygen from affecting the efficacy of the OLED functional layer and improving reliability and service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0037] Figure 1 is a schematic diagram of a flexible display panel provided in one embodiment of the present application;

[0038] Figure 2 is a top view of a flexible display panel provided in one embodiment of the present application;

[0039] Figure 3 is a schematic diagram of a flexible substrate of a flexible display panel provided in one embodiment of the present application;

[0040] Figure 4 This is a flow chart of a method for manufacturing a flexible display panel provided in one embodiment of the present application;

[0041] Figure 5 Schematic diagram of a method for manufacturing a flexible display panel provided in one embodiment of the present application. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0043] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0044] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0045] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0046] The disclosure below provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments discussed - and / or settings. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0047] See also Figures 1 to 3 The embodiment of the present application provides a flexible display panel having a display area 100 and a frame area 200 surrounding the display area 100. The flexible display panel includes:

[0048] Flexible substrate 1;

[0049] A TFT (thin film transistor) layer 2, the TFT layer 2 being provided on the flexible substrate 1;

[0050] A planar layer 3 is provided on the TFT layer 2 and has a plurality of first through holes 31 located in the border area 200 ;

[0051] A first electrode 4 is provided on the planar layer 3 and connected to the TFT layer 2;

[0052] A pixel definition layer 5 is provided on the planar layer 3 and the TFT layer 2. The pixel definition layer 5 has a plurality of second through holes 51 located in the border region 200. The plurality of second through holes 51 are respectively connected to the plurality of first through holes 31 to form a plurality of receiving grooves 501.

[0053] an OLED functional layer 6, the OLED functional layer 6 being disposed in the pixel definition layer 5 and connected to the first electrode 4;

[0054] The second electrode 7 is provided on the pixel definition layer 5 and in the plurality of receiving grooves 501 and is connected to the OLED functional layer 6;

[0055] The encapsulation layer 8 is disposed on the second electrode 7 and in the plurality of receiving grooves 501 .

[0056] It should be noted that since the planar layer 3 and the pixel definition layer 5 are generally made of organic materials, water and oxygen from the outside can easily enter the display area 100 along the planar layer 3 and the pixel definition layer 5. In the present application, multiple receiving grooves 501 are formed in the planar layer 3 and the pixel definition layer 5, located in the frame area 200. The encapsulation layer 8 is disposed in the multiple receiving grooves 501. The encapsulation layer 8 then has multiple protrusions 801 located in the multiple receiving grooves 501. The multiple protrusions 801 are located in the planar layer 3 and the pixel definition layer 5. These can block water and oxygen that have infiltrated the planar layer 3 and the pixel definition layer 5 from entering the OLED functional layer 6, thereby preventing the water and oxygen from affecting the efficacy of the OLED functional layer 6 and improving reliability and service life.

[0057] In addition, since multiple accommodating grooves 501 are formed in the flat layer 3 and the pixel definition layer 5, there is a column 502 between two adjacent accommodating grooves 501, which is equivalent to having multiple columns 502 in the flat layer 3 and the pixel definition layer 5, and each column 502 is composed of part of the flat layer 3 and part of the pixel definition layer 5. Then, the multiple protrusions 801 of the encapsulation layer 8 and the multiple columns 502 are alternately arranged in the horizontal direction. When the flexible display panel is bent, the multiple columns 502 can retain elasticity, relieve bending stress, and prevent the signal lines in the TFT layer 2 from breaking or failing when the flexible display panel is bent.

[0058] The embodiments of the present application do not impose any specific restrictions on the applicability of the flexible display panel. It can be any product or component with display function, such as televisions, laptops, tablets, wearable display devices (such as smart bracelets, smart watches, etc.), mobile phones, virtual reality devices, augmented reality devices, car displays, advertising light boxes, etc.

[0059] In some embodiments, the shape of the receiving groove 501 can be specifically set according to actual conditions, and the cross-sectional shape of the pillars 502 in the flat layer 3 and the pixel definition layer 5 can also be specifically set according to actual conditions, for example, it can be a trapezoidal, circular, rectangular or elliptical shape, etc., and this application does not impose any restrictions here.

[0060] In some embodiments, the light emission direction of the flexible display panel can be the direction in which the encapsulation layer 8 is away from the flexible substrate 1. In this case, the first electrode 4 can be an anode and the second electrode 7 can be a cathode. The OLED functional layer 6 includes a hole injection layer, a hole transport layer, a light-emitting layer, and an electron transport layer, which are stacked in sequence along the direction from the first electrode 4 to the second electrode 7.

[0061] In some embodiments, see Figure 1 and Figure 2The border area 200 includes a Dummy (blank) area 201 surrounding the display area 100, and a GOA (Gate Driver on Array) area 202 surrounding the Dummy area 201, and a plurality of receiving grooves 501 are located in the Dummy area 201. The Dummy area 201 refers to a blank area without a TFT (thin film transistor) structure, and the GOA area 202 refers to an area where a gate driver circuit is fabricated on the array substrate. The plurality of receiving grooves 501 are arranged in the Dummy area 201, that is, the plurality of protrusions 801 of the encapsulation layer 8, the plurality of columns 502 in the flat layer 3 and the pixel definition layer 5 are all arranged in the Dummy area 201, which can prevent water and oxygen infiltrated from the flat layer 3 and the pixel definition layer 5 from entering the OLED functional layer 6, thereby preventing water and oxygen from affecting the efficacy of the OLED functional layer 6, improving reliability and service life, and retaining elasticity and relieving bending stress when the flexible display panel is bent.

[0062] In addition, multiple accommodating grooves 501 are located in the Dummy area 201, and the flat layer 3 and the pixel definition layer 5 extend into the Dummy area 201. The flat layer 3 and the pixel definition layer 5 can raise the second electrode 7 located in the Dummy area 201, increase the distance between the second electrode 7 located in the Dummy area 201 and the signal line in the TFT layer 2 located in the Dummy area 201, and reduce the coupling capacitance between the second electrode 7 in the Dummy area 201 and the signal line in the Dummy area 201, thereby improving the working efficiency of the flexible display panel.

[0063] Similarly, the planarization layer 3 and the pixel definition layer 5 can also extend to the GOA area 202, increasing the distance between the second electrode 7 located in the GOA area 202 and the signal line in the TFT layer 2 located in the GOA area 202, and reducing the coupling capacitance between the second electrode 7 in the GOA area 202 and the signal line in the GOA area 202, thereby improving the working efficiency of the flexible display panel.

[0064] In this example, see Figure 1 and Figure 2, the border area 200 also includes a peripheral area 203 surrounding the GOA area 202, and a plurality of receiving grooves 501 are also located in the peripheral area 203. The peripheral area 203 refers to the outermost area of ​​the flexible display panel, that is, the area close to the edge of the flexible display panel. The plurality of receiving grooves 501 are also arranged in the peripheral area 203, that is, the plurality of protrusions 801 of the encapsulation layer 8, the plurality of columns 502 in the flat layer 3 and the pixel definition layer 5 are also arranged in the peripheral area 203, then the peripheral area 203 and the Dummy area 201 both have a plurality of protrusions 801 and a plurality of columns 502, which can further block the water and oxygen infiltrated in the flat layer 3 and the pixel definition layer 5 from entering the OLED functional layer 6, thereby preventing water and oxygen from affecting the efficacy of the OLED functional layer 6, improving reliability and service life, and retaining elasticity when the flexible display panel is bent, further alleviating bending stress.

[0065] In this example, see Figure 1 The TFT layer 2 includes a peripheral trace 212 located in the peripheral region 203. The planar layer 3 and the pixel definition layer 5 extend above the peripheral trace 212. The encapsulation layer 8 surrounds the planar layer 3 and the pixel definition layer 5. Specifically, the encapsulation layer 8 surrounds the planar layer 3, the pixel definition layer 5, and the peripheral trace 212, further preventing water and oxygen that have infiltrated the planar layer 3 and the pixel definition layer 5 from entering the OLED functional layer 6, thereby preventing the water and oxygen from affecting the efficacy of the OLED functional layer 6 and improving reliability and service life.

[0066] In addition, the planarization layer 3 and the pixel definition layer 5 can raise the second electrode 7 located in the peripheral area 203, increase the distance between the second electrode 7 located in the peripheral area 203 and the peripheral wiring 212, and reduce the coupling capacitance between the second electrode 7 in the peripheral area 203 and the peripheral wiring 212, thereby improving the working efficiency of the flexible display panel.

[0067] In addition, the peripheral trace 212 may be a bus line.

[0068] In this embodiment, the flat layer 3 and the pixel definition layer 5 extend into the Dummy area 201 , the GOA area 202 and the peripheral area 203 , which can also increase the flatness of the flexible display panel and increase the luminous uniformity and luminous efficiency of the flexible display panel.

[0069] In some embodiments, see Figure 1The encapsulation layer 8 includes a first inorganic barrier layer 81, an organic buffer layer 82 disposed on the first inorganic barrier layer 81, and a second inorganic barrier layer 83 disposed on the organic buffer layer 82. The first inorganic barrier layer 81 is disposed on the second electrode 7 and within the plurality of receiving grooves 501. The first inorganic barrier layer 81 blocks water and oxygen that infiltrate the planarization layer 3 and the pixel definition layer 5, while the second inorganic barrier layer 83 blocks water and oxygen from the outside, thereby enhancing the water and oxygen blocking effect. The organic buffer layer 82 relieves the bending stress of the first and second inorganic barrier layers 81, 83, preventing them from breaking when bent.

[0070] In this embodiment, the material of the first inorganic barrier layer 81 and the second inorganic barrier layer 83 can be a combination of one or more of silicon nitride, silicon oxide, or silicon oxynitride. The material of the organic buffer layer 82 can be polyimide (PI), polyethylene terephthalate (PET), or polydimethylsiloxane (PDMS).

[0071] In some embodiments, see Figure 1 , the TFT layer 2 includes a first metal layer 21, a first insulating layer 22, a semiconductor layer 23, a gate insulating layer 24, a second metal layer 25, a second insulating layer 26, a third metal layer 27 and a passivation layer 28;

[0072] The first metal layer 21 includes a plurality of light shielding layers 211 and peripheral traces 212 provided on the flexible substrate 1. The plurality of light shielding layers 211 are respectively located in the display area 100, the dummy area 201 and the GOA area 202, and the peripheral traces 212 are located in the peripheral area 203.

[0073] The first insulating layer 22 is provided on the first metal layer 21 and the flexible substrate 1;

[0074] The semiconductor layer 23 includes a first active layer 231 and a second active layer 232 disposed on the first insulating layer 22 , wherein the first active layer 231 is located in the display area 100 , and the second active layer 232 is located in the GOA area 202 ;

[0075] The gate insulating layer 24 is disposed on the first active layer 231 and the second active layer 232 ;

[0076] The second metal layer 25 includes a first gate 251 and a second gate 252 disposed on the gate insulating layer 24 . The first gate 251 and the second gate 252 are located directly above the first active layer 231 and the second active layer 232 , respectively.

[0077] The second insulating layer 26 is provided on the first insulating layer 22 , the semiconductor layer 23 and the second metal layer 25 ;

[0078] The third metal layer 27 includes a first source electrode 271, a first drain electrode 272, a second source electrode 273, and a second drain electrode 274 provided on the second insulating layer 26; the first source electrode 271 and the first drain electrode 272 are located in the display area 100 and connected to the first active layer 231, so that the first active layer 231, the first gate electrode 251, the first source electrode 271, and the first drain electrode 272 constitute a pixel TFT; the second source electrode 273 and the second drain electrode 274 are located in the GOA area 202 and connected to the second active layer 232, so that the second active layer 232, the second gate electrode 252, the second source electrode 273 and the second drain electrode 274 constitute a driving TFT;

[0079] The passivation layer 28 is disposed on the second insulating layer 26 and the third metal layer 27 .

[0080] In this embodiment, the planar layer 3 and the passivation layer 28 further have via holes exposing the first drain electrode 272 , and the first electrode 4 is connected to the first drain electrode 272 through the via holes.

[0081] In this example, see Figure 1 , multiple shading layers 211 can be used as signal routing, then the first drain 272 can be connected to the shading layer 211 located in the display area 100, the second source 273 can be connected to the shading layer 211 located in the GOA area 202, and the second drain 274 can be connected to the shading layer 211 located in the Dummy area 201.

[0082] In this embodiment, the second metal layer 25 may further include a first electrode plate disposed on the first insulating layer 22, and the third metal layer 27 may further include a second electrode plate 275 disposed on the second insulating layer 26. The first electrode plate and the second electrode plate 275 constitute a storage capacitor. In addition, the second electrode plate 275 may also be connected to the light shielding layer 211 located in the display area 100.

[0083] In some embodiments, see Figure 3 The flexible substrate 1 includes a first buffer layer 11, a first barrier layer 12 disposed on the first buffer layer 11, a second buffer layer 13 disposed on the first barrier layer 12, and a second barrier layer 14 disposed on the second buffer layer 13. The first barrier layer 12 and the second barrier layer 14 are inorganic materials that can block the intrusion of water and oxygen from the lower side of the flexible display panel. The first buffer layer 11 and the second buffer layer 13 are organic materials that can relieve the bending stress of the first barrier layer 12 and the second barrier layer 14, preventing the flexible substrate 1 from breaking when bent.

[0084] See also Figure 4 and Figure 5 Based on the above-mentioned flexible display panel, an embodiment of the present application further provides a method for manufacturing a flexible display panel, including:

[0085] Step S1, providing a flexible substrate 1, wherein the flexible substrate 1 has a display area 100 and a frame area 200 surrounding the display area 100, and forming a TFT layer 2 on the flexible substrate 1;

[0086] Step S2: forming a planar layer 3 on the TFT layer 2 and patterning the planar layer 3 to form a plurality of first through holes 31 located in the border area 200;

[0087] Step S3: forming a first electrode 4 on the planar layer 3, wherein the first electrode 4 is connected to the TFT layer 2;

[0088] Step S4: forming a pixel definition layer 5 on the planar layer 3 and the TFT layer 2, and patterning the pixel definition layer 5 to form a plurality of second through holes 51 located in the border area 200; the plurality of second through holes 51 are respectively connected to the plurality of first through holes 31 to form a plurality of receiving grooves 501;

[0089] Step S5: forming an OLED functional layer 6 in the pixel definition layer 5, wherein the OLED functional layer 6 is connected to the first electrode 4;

[0090] Step S6: forming a second electrode 7 on the pixel definition layer 5 and in the plurality of receiving grooves 501 , wherein the second electrode 7 is connected to the OLED functional layer 6 ;

[0091] Step S7 : forming an encapsulation layer 8 on the second electrode 7 and in the plurality of receiving grooves 501 .

[0092] It should be noted that since the planar layer 3 and the pixel definition layer 5 are generally made of organic materials, water and oxygen from the outside can easily enter the display area 100 along the planar layer 3 and the pixel definition layer 5. In the present application, multiple receiving grooves 501 are formed in the planar layer 3 and the pixel definition layer 5, located in the frame area 200. The encapsulation layer 8 is disposed in the multiple receiving grooves 501. The encapsulation layer 8 then has multiple protrusions 801 located in the multiple receiving grooves 501. The multiple protrusions 801 are located in the planar layer 3 and the pixel definition layer 5. These can block water and oxygen that have infiltrated the planar layer 3 and the pixel definition layer 5 from entering the OLED functional layer 6, thereby preventing the water and oxygen from affecting the efficacy of the OLED functional layer 6 and improving reliability and service life.

[0093] In addition, since multiple accommodating grooves 501 are formed in the flat layer 3 and the pixel definition layer 5, there is a pillar 502 between two adjacent accommodating grooves 501, which is equivalent to having multiple pillars 502 in the flat layer 3 and the pixel definition layer 5. The multiple protrusions 801 of the encapsulation layer 8 and the multiple pillars 502 are alternately arranged in the horizontal direction. When the flexible display panel is bent, the multiple pillars 502 can retain elasticity, relieve bending stress, and prevent the signal lines in the TFT layer 2 from breaking or failing when the flexible display panel is bent.

[0094] In some embodiments, see Figure 5The frame area 200 includes a Dummy (blank) area surrounding the display area 100 and a GOA (Gate Driver on Array) area surrounding the Dummy area 201, and a plurality of receiving grooves 501 are located in the Dummy area 201. The Dummy area 201 refers to a blank area without a TFT (thin film transistor) structure, and the GOA area 202 refers to an area where a gate driver circuit is fabricated on the array substrate. The plurality of receiving grooves 501 are arranged in the Dummy area 201, that is, the plurality of protrusions 801 of the encapsulation layer 8, the plurality of columns 502 in the flat layer 3 and the pixel definition layer 5 are all arranged in the Dummy area 201, which can prevent water and oxygen infiltrated from the flat layer 3 and the pixel definition layer 5 from entering the OLED functional layer 6, thereby preventing water and oxygen from affecting the efficacy of the OLED functional layer 6, improving reliability and service life, and retaining elasticity and relieving bending stress when the flexible display panel is bent.

[0095] In addition, multiple accommodating grooves 501 are located in the Dummy area 201, and the flat layer 3 and the pixel definition layer 5 extend into the Dummy area 201. The flat layer 3 and the pixel definition layer 5 can raise the second electrode 7 located in the Dummy area 201, increase the distance between the second electrode 7 located in the Dummy area 201 and the signal line in the TFT layer 2 located in the Dummy area 201, and reduce the coupling capacitance between the second electrode 7 in the Dummy area 201 and the signal line in the Dummy area 201, thereby improving the working efficiency of the flexible display panel.

[0096] Similarly, the planarization layer 3 and the pixel definition layer 5 can also extend to the GOA area 202, increasing the distance between the second electrode 7 located in the GOA area 202 and the signal line in the TFT layer 2 located in the GOA area 202, and reducing the coupling capacitance between the second electrode 7 in the GOA area 202 and the signal line in the GOA area 202, thereby improving the working efficiency of the flexible display panel.

[0097] In this example, see Figure 5, the border area 200 also includes a peripheral area 203 surrounding the GOA area 202, and a plurality of receiving grooves 501 are also located in the peripheral area 203. The peripheral area 203 refers to the outermost area of ​​the flexible display panel, that is, the area close to the edge of the flexible display panel. The plurality of receiving grooves 501 are also arranged in the peripheral area 203, that is, the plurality of protrusions 801 of the encapsulation layer 8, the plurality of columns 502 in the flat layer 3 and the pixel definition layer 5 are also arranged in the peripheral area 203, then the peripheral area 203 and the Dummy area 201 both have a plurality of protrusions 801 and a plurality of columns 502, which can further block the water and oxygen infiltrated in the flat layer 3 and the pixel definition layer 5 from entering the OLED functional layer 6, thereby preventing water and oxygen from affecting the efficacy of the OLED functional layer 6, improving reliability and service life, and retaining elasticity when the flexible display panel is bent, further alleviating bending stress.

[0098] In this example, see Figure 5 The TFT layer 2 includes a peripheral trace 212 located in the peripheral region 203. The planar layer 3 and the pixel definition layer 5 extend above the peripheral trace 212. The encapsulation layer 8 surrounds the planar layer 3 and the pixel definition layer 5. Specifically, the encapsulation layer 8 surrounds the planar layer 3, the pixel definition layer 5, and the peripheral trace 212, further preventing water and oxygen that have infiltrated the planar layer 3 and the pixel definition layer 5 from entering the OLED functional layer 6, thereby preventing the water and oxygen from affecting the efficacy of the OLED functional layer 6 and improving reliability and service life.

[0099] In addition, the planarization layer 3 and the pixel definition layer 5 can raise the second electrode 7 located in the peripheral area 203, increase the distance between the second electrode 7 located in the peripheral area 203 and the peripheral wiring 212, and reduce the coupling capacitance between the second electrode 7 in the peripheral area 203 and the peripheral wiring 212, thereby improving the working efficiency of the flexible display panel.

[0100] In some embodiments, see Figure 5 The encapsulation layer 8 includes a first inorganic barrier layer 81, an organic buffer layer 82 disposed on the first inorganic barrier layer 81, and a second inorganic barrier layer 83 disposed on the organic buffer layer 82. The first inorganic barrier layer 81 is disposed on the second electrode 7 and within the plurality of receiving grooves 501. The first inorganic barrier layer 81 blocks water and oxygen that infiltrate the planarization layer 3 and the pixel definition layer 5, while the second inorganic barrier layer 83 blocks water and oxygen from the outside, thereby enhancing the water and oxygen blocking effect. The organic buffer layer 82 relieves the bending stress of the first and second inorganic barrier layers 81, 83, preventing them from breaking when bent.

[0101] In some embodiments, the flexible substrate 1 includes a first buffer layer 11, a first barrier layer 12 disposed on the first buffer layer 11, a second buffer layer 13 disposed on the first barrier layer 12, and a second barrier layer 14 disposed on the second buffer layer 13. The first barrier layer 12 and the second barrier layer 14 are inorganic materials that can block the intrusion of water and oxygen from the bottom side of the flexible display panel. The first buffer layer 11 and the second buffer layer 13 are organic materials that can relieve the bending stress of the first barrier layer 12 and the second barrier layer 14, thereby preventing the flexible substrate 1 from breaking when bent.

[0102] In this embodiment, the flexible substrate 1 and TFT layer 2 can be fabricated on a carrier plate having a sacrificial layer. After the flexible display panel is fabricated, the carrier plate having the sacrificial layer can be peeled off. The sacrificial layer can be made of amorphous silicon (A-Si), and the carrier plate can be made of glass.

[0103] In some embodiments, see Figure 5 In step S1, a TFT layer 2 is formed on a flexible substrate 1, comprising:

[0104] A first metal layer 21 is formed on the flexible substrate 1 by physical vapor sputtering and etching. The first metal layer 21 includes multiple light-shielding layers 211 and peripheral traces 212 provided on the flexible substrate 1. The multiple light-shielding layers 211 are respectively located in the display area 100, the dummy area 201, and the GOA area 202, and the peripheral traces 212 are located in the peripheral area 203. The material of the first metal layer 21 can be molybdenum titanium (MoTi), molybdenum (Mo), copper (Cu), silver (Ag), aluminum (Al), and other metals and their alloys.

[0105] The first insulating layer 22 is formed on the first metal layer 21 and the flexible substrate 1 by chemical vapor deposition. The material of the first insulating layer 22 can be silicon nitride, silicon oxide or silicon oxynitride.

[0106] A semiconductor layer 23 is formed on the first insulating layer 22 by physical vapor sputtering and etching methods. The semiconductor layer 23 includes a first active layer 231 and a second active layer 232 provided on the first insulating layer 22. The first active layer 231 is located in the display area 100, and the second active layer 232 is located in the GOA area 202. The material of the semiconductor layer 23 can be indium gallium zinc oxide.

[0107] The gate insulating layer 24 is formed on the first active layer 231 and the second active layer 232 by chemical vapor deposition and etching methods; the material of the gate insulating layer 24 can be silicon nitride, silicon oxide or silicon oxynitride.

[0108] A second metal layer 25 is formed on the gate insulating layer 24 by physical vapor sputtering and etching. The second metal layer 25 includes a first gate electrode 251 and a second gate electrode 252 provided on the gate insulating layer 24. The first gate electrode 251 and the second gate electrode 252 are respectively located directly above the first active layer 231 and the second active layer 232. The material of the second metal layer 25 can be titanium, molybdenum, copper, silver, aluminum and other metals and their alloys.

[0109] A second insulating layer 26 is formed on the first insulating layer 22, the semiconductor layer 23 and the second metal layer 25 by chemical vapor deposition, and the second insulating layer 26 is patterned (such as photoresist coating, exposure, development, etching and stripping) to form vias exposing the first active layer 231 and the second active layer 232; the material of the second insulating layer 26 can be silicon nitride, silicon oxide or silicon oxynitride.

[0110] A third metal layer 27 is formed on the second insulating layer 26 by physical vapor sputtering and etching methods. The third metal layer 27 includes a first source electrode 271, a first drain electrode 272, a second source electrode 273, and a second drain electrode 274, which are arranged on the second insulating layer 26. The first source electrode 271 and the first drain electrode 272 are located in the display area 100 and are connected to the first active layer 231. Then, the first active layer 231, the first gate electrode 251, the first source electrode 271, and the first drain electrode 272 constitute a pixel TFT. The second source electrode 273 and the second drain electrode 274 are located in the GOA area 202 and are connected to the second active layer 232. Then, the second active layer 232, the second gate electrode 252, the second source electrode 273, and the second drain electrode 274 constitute a driving TFT. The material of the third metal layer 27 can be molybdenum titanium, molybdenum, copper, silver, aluminum, and other metals and their alloys.

[0111] A passivation layer 28 is formed on the second insulating layer 26 and the third metal layer 27, and the passivation layer 28 is patterned (such as photoresist coating, exposure, development, etching and stripping) to form a via hole exposing the first drain 272, and the first electrode 4 is connected to the first drain 272 through the via hole.

[0112] In some embodiments, the material of the planar layer 3 may be an organic photoresist. In step S2 , the planar layer 3 may be exposed and developed to form a plurality of first through holes 31 located in the border region 200 and a via hole exposing the first drain electrode 272 .

[0113] In step S3, physical vapor sputtering and etching can be used to form the first electrode 4 on the flat layer 3. The material of the first electrode 4 can be a stacked structure of indium zinc oxide / silver / indium zinc oxide (IZO / Ag / IZO) or indium tin oxide / silver / indium tin oxide (ITO / Ag / ITO).

[0114] The pixel definition layer 5 may be an organic photoresist. In step S4 , the pixel definition layer 5 may be exposed and developed to form a plurality of second through holes 51 located in the frame area 200 .

[0115] In the above embodiments, the description of each embodiment has its own focus. For parts not described in detail in a particular embodiment, please refer to the relevant description of other embodiments. In specific implementation, the above units or structures can be implemented as independent entities, or they can be arbitrarily combined and implemented as the same or multiple entities. The specific implementation of the above units or structures can be referred to the previous method embodiments and will not be repeated here.

[0116] The above is a detailed introduction to a flexible display panel and a manufacturing method thereof provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the embodiments of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the embodiments of the present application; ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A flexible display panel comprising a display area and a frame area surrounding the display area, characterized in that: include: Flexible substrate; A TFT layer, wherein the TFT layer is provided on the flexible substrate; a planar layer, the planar layer being disposed on the TFT layer and having a plurality of first through holes located in the frame area; a first electrode, the first electrode being disposed on the planar layer and connected to the TFT layer; a pixel definition layer, the pixel definition layer being disposed on the planar layer and the TFT layer, and the pixel definition layer having a plurality of second through holes located in the frame area, the plurality of second through holes being respectively connected to the plurality of first through holes to form a plurality of receiving grooves; an OLED functional layer, the OLED functional layer being disposed in the pixel definition layer and connected to the first electrode; a second electrode, the second electrode being disposed on the pixel definition layer and in the plurality of receiving grooves and connected to the OLED functional layer; an encapsulation layer, the encapsulation layer being disposed on the second electrode and in the plurality of receiving grooves; The frame area includes a Dummy area surrounding the display area and a GOA area surrounding the Dummy area; the plurality of receiving grooves are located in the Dummy area, the planar layer and the pixel definition layer extend to the GOA area, and the receiving grooves are not located in the GOA area; The border area further includes a peripheral area surrounding the GOA area; the plurality of receiving grooves are further located in the peripheral area; The TFT layer includes a pixel TFT located in the display area and a driving TFT located in the GOA area.

2. The flexible display panel according to claim 1, wherein: The TFT layer includes peripheral traces located in the peripheral region; The planar layer and the pixel definition layer extend above the peripheral wiring, and the packaging layer surrounds the planar layer and the pixel definition layer.

3. The flexible display panel according to claim 1, wherein: The encapsulation layer includes a first inorganic barrier layer, an organic buffer layer disposed on the first inorganic barrier layer, and a second inorganic barrier layer disposed on the organic buffer layer; the first inorganic barrier layer is disposed on the second electrode and in the plurality of receiving grooves.

4. A method for manufacturing a flexible display panel, characterized in that: include: Providing a flexible substrate, the flexible substrate having a display area and a frame area surrounding the display area, the frame area including a dummy area surrounding the display area and a GOA area surrounding the dummy area; the frame area also including a peripheral area surrounding the GOA area; fabricating a TFT layer on the flexible substrate, the TFT layer including a pixel TFT located in the display area and a driving TFT located in the GOA area; Fabricating a planar layer on the TFT layer, and patterning the planar layer to form a plurality of first through holes located in the frame area; forming a first electrode on the planar layer, wherein the first electrode is connected to the TFT layer; A pixel definition layer is formed on the planar layer and the TFT layer, and the pixel definition layer is patterned to form a plurality of second through holes located in the border area; the plurality of second through holes are respectively connected to the plurality of first through holes to form a plurality of receiving grooves, wherein the plurality of receiving grooves are located in the dummy area, and the plurality of receiving grooves are also located in the peripheral area; the planar layer and the pixel definition layer extend to the GOA area, and the receiving grooves are not located in the GOA area; Fabricating an OLED functional layer in the pixel definition layer, wherein the OLED functional layer is connected to the first electrode; Fabricating a second electrode on the pixel definition layer and in the plurality of receiving grooves, wherein the second electrode is connected to the OLED functional layer; A packaging layer is formed on the second electrode and in the plurality of receiving grooves.

5. The method for manufacturing a flexible display panel according to claim 4, wherein: The TFT layer includes peripheral traces located in the peripheral region; The planar layer and the pixel definition layer extend above the peripheral wiring, and the packaging layer surrounds the planar layer and the pixel definition layer.

6. The method for manufacturing a flexible display panel according to claim 4, wherein: The encapsulation layer includes a first inorganic barrier layer, an organic buffer layer disposed on the first inorganic barrier layer, and a second inorganic barrier layer disposed on the organic buffer layer; the first inorganic barrier layer is disposed on the second electrode and in the plurality of receiving grooves.

Images