A method for heat dissipation mode selection and evaluation for electronic devices

Abstract

The present application provides a method for selecting and evaluating heat dissipation methods for electronic devices, belonging to the technical field of heat dissipation design of electronic devices, and specifically including the following steps: dividing a two-level heat dissipation method architecture, dividing a typical internal module structure, and dividing the composition of link temperature rise; establishing a heat dissipation data framework with device sizes and device power consumptions that change proportionally in a matrix distribution, forming a unified heat dissipation database model with the total power consumption of the module and the device heat flux density as independent variables and the device temperature rise as the dependent variable, and obtaining the heat dissipation database for each link; designing the structure of the electronic device to be tested and determining the link composition corresponding to the current electronic device structure; according to the link composition in step three, and combining with the database to obtain the temperature values of each component and then summing them up to obtain the temperature of the current electronic device components. Through the processing solution of the present application, it is possible to accurately complete the heat dissipation scheme design of electronic devices in the initial stage of product development.

Description

Technical Field

[0001] This application relates to the field of heat dissipation design of electronic devices, and particularly to a method for selecting and evaluating heat dissipation methods for electronic devices. Background Art

[0002] In the initial stage of the development of electronic devices, it is often necessary to select and evaluate the heat dissipation solutions of electronic devices according to the application environment of the product and the structural design requirements of the product.

[0003] At present, regarding the selection and evaluation of heat dissipation solutions for electronic devices, the available design materials are not detailed enough. They only roughly describe the allowable power consumption range. For example, GJBZ27 "Reliability Thermal Design Manual for Electronic Equipment" can only simply give the heat dissipation capacity of the outer surface of the chassis, and cannot select and evaluate specific heat dissipation methods for the structural solutions of electronic devices. In addition, in the initial stage of product development, problems such as unclear design inputs of many product parameters and insufficient details of the structural form often make it impossible to complete this work, and only rely on the product development experience of designers for a rough judgment. Therefore, the heat dissipation design work of electronic devices urgently needs a method that can select and evaluate the heat dissipation methods of the electronic device structure, which should be both accurate and able to quickly give reference suggestions to meet the work requirements of the heat dissipation design of electronic devices. Summary of the Invention

[0004] In view of this, this application provides a method for selecting and evaluating heat dissipation methods for electronic devices, which solves the problems in the prior art and meets the requirement of accurately completing the heat dissipation solution design of electronic devices in the initial stage of product development.

[0005] The method for selecting and evaluating heat dissipation methods for electronic devices provided by this application adopts the following technical solutions:

[0006] A method for selecting and evaluating heat dissipation methods for electronic devices includes the following steps:

[0007] Step 1, divide the two-level heat dissipation method architecture, divide the typical internal module structure, and divide the link temperature rise composition;

[0008] Step 2, establish a heat dissipation data framework with device sizes and device power consumptions that change proportionally in a matrix distribution, form a unified heat dissipation database model with the total power consumption of the module and the device heat flux density as independent variables and the device temperature rise as the dependent variable, and obtain the heat dissipation database for each link;

[0009] Step 3, design the structure of the electronic device to be tested, and determine the link composition corresponding to the current electronic device structure;

[0010] Step 4: Based on the link composition in Step 3, and combined with the database, add up the temperature values of each component to obtain the temperature of the current electronic device component.

[0011] Optionally, the two - level heat dissipation method architecture is divided as follows. Specifically, it is divided into two levels by combining the structural form of the electronic device and the heat dissipation method. At the first level, it is divided into a closed - type electronic device structure and an open - type electronic device structure. At the second level, for the closed - type electronic device structure, it is divided into natural heat dissipation, side - wall air cooling, and side - wall liquid cooling; for the open - type electronic device structure, it is divided into natural heat dissipation, surrounding air cooling, and through - type liquid cooling.

[0012] Optionally, the typical internal module structures of the closed - type electronic device structure include a single printed circuit board, a printed circuit board + bonded cold plate, and a printed circuit board + thermal pad + metal housing.

[0013] Optionally, the typical internal module structures of the open - type electronic device structure include a single printed circuit board, a printed circuit board + thermal pad + metal housing.

[0014] Optionally, the link temperature rise composition division of the closed - type electronic device structure includes device - locking position, locking contact temperature rise, locking - chassis structure, chassis - cooling medium, and cooling medium.

[0015] Optionally, the link temperature rise composition division of the open - type electronic device structure includes device - heat transfer structure, heat transfer structure - cooling medium, and cooling medium.

[0016] In summary, the present application has the following beneficial technical effects:

[0017] A method for selecting and evaluating the heat dissipation method of an electronic device provided by the present application can not only accurately evaluate the working performance of each heat dissipation structure and heat dissipation method, but also meet the requirements for the selection and evaluation of the product heat dissipation structure in the initial stage of product development. This method is scientific, rigorous, easy to use, and accurate in analysis. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0019] Figure 1 It is the architecture division and data composition of the heat dissipation method of the present application;

[0020] Figure 2 It is the device size and power consumption analysis model with matrix distribution and equal - ratio change of the present application. Detailed Embodiments

[0021] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0022] The following uses specific specific examples to illustrate the implementation manners of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0023] It should be noted that the following describes various aspects of the embodiments within the scope of the appended claims. It should be obvious that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is illustrative only. Based on the present application, those skilled in the art should understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects described herein can be used to implement the device and / or practice the method. In addition, this device and / or this method can be implemented using other structures and / or functions in addition to one or more of the aspects described herein.

[0024] It should also be noted that the drawings provided in the following embodiments only schematically illustrate the basic concept of the present application. The drawings only show the components related to the present application, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and ratio of each component in its actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0025] In addition, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0026] The embodiments of the present application provide a method for selecting and evaluating heat dissipation methods for electronic devices.

[0027] As Figure 1 and Figure 2 shown, a method for selecting and evaluating heat dissipation methods for electronic devices includes the following steps:

[0028] Step 1: Divide the two - level heat dissipation method architecture, divide the typical internal module structure, and divide the link temperature rise composition.

[0029] Step 2: Establish a heat dissipation data framework with device sizes and device power consumptions that change proportionally in a matrix distribution, forming a unified heat dissipation database model with the total power consumption of the module and the device heat flux density as independent variables and the device temperature rise as the dependent variable, and obtain the heat dissipation database for each link.

[0030] Step 3: Design the structure of the electronic device to be tested and determine the link composition corresponding to the current electronic device structure.

[0031] Step 4: According to the link composition in Step 3, and combined with the database, add up the temperature values of each component to obtain the temperature of the current electronic device components.

[0032] Step 1 specifically includes: Dividing the two - level heat dissipation method architecture specifically includes making a two - level division by combining the electronic device structure form and the heat dissipation method. The first level is divided into a closed - type electronic device structure and an open - type electronic device structure. In the second level, the closed - type electronic device structure is divided into natural heat dissipation, side - wall air cooling, and side - wall liquid cooling, and the open - type electronic device structure is divided into natural heat dissipation, surrounding air cooling, and through - type liquid cooling.

[0033] The typical internal module structure of the closed - type electronic device structure includes a single printed circuit board, printed circuit board + bonded cold plate, and printed circuit board + thermal pad + metal housing.

[0034] The typical internal module structure of the open - type electronic device structure includes a single printed circuit board, printed circuit board + thermal pad + metal housing.

[0035] The link temperature rise composition division of the closed - type electronic device structure includes device - locking position, locking contact temperature rise, locking - chassis structure, chassis - cooling medium, and cooling medium.

[0036] The link temperature rise composition division of the open - type electronic device structure includes device - heat transfer structure, heat transfer structure - cooling medium, and cooling medium.

[0037] Step 2 specifically includes: Arrange the devices in a matrix according to the area size of the devices that can be arranged in the module, and change proportionally with the area and device power consumption to construct a heat dissipation data framework for thermal analysis, record the device temperature data under different power consumptions and different heat flux densities, and form a unified heat dissipation database model. For example, establish a heat dissipation data framework with a 5X7 matrix distribution, a 0.7 proportional change in area and device power consumption as shown in the following table, and form a unified heat dissipation database model with the total power consumption of the module and the device heat flux density as independent variables and the device temperature rise as the dependent variable.

[0038] Heat Dissipation Data Framework Table

[0039]

[0040] Steps three and four specifically include designing a structure of the electronic device, determining the link composition corresponding to the current structure according to the two-stage heat dissipation method and the internal structure, finding the temperature of each link in the current link composition from the database model, obtaining the temperature of the components in the current electronic device structure after summation, and then comparing the heat dissipation requirements of the electronic device's working environment to determine whether the component temperature meets the heat dissipation requirements. If not, replace the design structure of the electronic device, repeat the calculation and comparison until the component temperature meets the requirements of the working environment. Thus, the evaluation of the heat dissipation method of the electronic device is realized, providing a judgment basis for selecting the heat dissipation method for the electronic device.

[0041] As described above, it is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed in the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A method for selecting and evaluating heat dissipation methods for electronic devices, characterized in that, it includes the following steps: Step 1, divide the two-level heat dissipation method architecture, divide the typical internal module structure, and divide the link temperature rise composition; Step 2, establish a heat dissipation data framework with device sizes and device power consumptions that change in equal proportion in matrix distribution, form a unified heat dissipation database model with the total power consumption of the module and the device heat flux density as independent variables and the device temperature rise as the dependent variable, and obtain the heat dissipation database for each link; Step 3, design the structure of the electronic device to be tested, and determine the link composition corresponding to the current electronic device structure; Step 4, according to the link composition in Step 3, and combine with the database to add up the temperature values of each component to obtain the temperature of the current electronic device components.

2. The method for selecting and evaluating heat dissipation methods for electronic devices according to claim 1, characterized in that, The division of the two-level heat dissipation method architecture specifically includes making a two-level division in combination with the electronic device structure form and the heat dissipation method. The first level is divided into a closed electronic device structure and an open electronic device structure. In the second level, the closed electronic device structure is divided into natural heat dissipation, sidewall air cooling, and sidewall liquid cooling, and the open electronic device structure is divided into natural heat dissipation, surrounding air cooling, and through-flow liquid cooling.

3. The method for selecting and evaluating heat dissipation methods for electronic devices according to claim 2, characterized in that, The typical internal module structure of the closed electronic device structure includes a single printed circuit board, a printed circuit board + bonded cold plate, and a printed circuit board + thermal pad + metal housing.

4. The method for selecting and evaluating heat dissipation methods for electronic devices according to claim 2, characterized in that, The typical internal module structure of the open electronic device structure includes a single printed circuit board, a printed circuit board + thermal pad + metal housing.

5. The method for selecting and evaluating heat dissipation methods for electronic devices according to claim 2, characterized in that, The division of the link temperature rise composition of the closed electronic device structure includes device - locking position, locking contact temperature rise, locking - chassis structure, chassis - cooling medium, and cooling medium.

6. The method for selecting and evaluating heat dissipation methods for electronic devices according to claim 2, characterized in that, The division of the link temperature rise composition of the open electronic device structure includes device - heat transfer structure, heat transfer structure - cooling medium, and cooling medium.

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