LED driving device and detection device

Abstract

This application provides a light-emitting diode (LED) driving device and a detection device, which achieves the driving and detection of a large number of LEDs on a wafer in a non-contact manner. This not only improves the efficiency and accuracy of driving and detection but also avoids damage to the pads or surface of the LEDs. The driving device may include a power supply, a first electrode plate, and a second electrode plate. The first terminal of the power supply is connected to the first electrode plate, and the second terminal of the power supply is connected to the second electrode plate. The first and second electrode plates are arranged in parallel. The first electrode plate has a preset distance from the wafer, and the second electrode plate is in contact with the wafer for placing the wafer.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more specifically, to a light-emitting diode driving device and a detection device. Background Technology

[0002] With the rapid development of technology, light-emitting diodes (LEDs) have been widely used in the display screens of electronic devices such as mobile phones and tablets. Massive numbers (e.g., millions) of LEDs can be integrated onto a single wafer; prior to mass transfer, mass testing of the LEDs is required.

[0003] Related technologies typically involve using probes to contact the electrodes (i.e., the positive and negative terminals) of a light-emitting diode (LED) and supplying direct current to drive and detect the LED. However, driving and detecting via probe contact is often very inefficient, and if the probe is damaged, it will not only affect the driving and detection accuracy but also damage the LED's pads or surface.

[0004] Therefore, a technical solution is needed that can improve efficiency and accuracy without damaging the pads or surface of the light-emitting diode. Summary of the Invention

[0005] This application provides a light-emitting diode driving device and a detection device. A wafer integrating light-emitting diodes is placed on a second electrode plate and is at a preset distance from the first electrode plate (i.e., the wafer does not contact the first electrode plate). The driving and detection of a large number of light-emitting diodes on the wafer is achieved in a non-contact manner, which not only improves the efficiency and accuracy of driving and detection, but also avoids damage to the pads or surface of the light-emitting diodes.

[0006] In a first aspect, this application provides a light-emitting diode driving device, wherein the light-emitting diode can be integrated on a wafer, and the driving device may include a power supply, a first electrode plate, and a second electrode plate.

[0007] The first end of the power supply (which can be the positive terminal) can be connected to the first electrode plate, and the second end of the power supply (which can be the negative terminal) can be connected to the second electrode plate. The first electrode plate and the second electrode plate can be arranged in parallel. The first electrode plate and the wafer can have a preset distance (i.e., the first electrode plate and the wafer do not contact each other), while the second electrode plate can contact the wafer. The second electrode plate is used to place the wafer.

[0008] It is conceivable that the power supply can provide high-voltage (such as 20 kV) direct current (which can be high-voltage pulses, etc.) through the positive terminal and the negative terminal. The direct current applied to the first electrode plate and the second electrode plate can form an ionization field between the first electrode plate and the second electrode plate. The electrons excited by the ionization field can be injected into the active light-emitting layer of each light-emitting diode on the wafer, causing each light-emitting diode on the wafer to emit light (i.e., lighting each light-emitting diode), which realizes the driving of each light-emitting diode.

[0009] It can be seen that the driving device provided in this application forms an ionization field through the direct current applied to the two electrode plates, and excites electro-luminescence (EL), and finally realizes the driving of the light-emitting diode.

[0010] In the technical solution provided in this application, the second electrode plate contacts the wafer, and the first electrode plate does not contact the wafer. The driving of a huge number of light-emitting diodes on the wafer is realized in a non-contact manner, which not only improves the driving efficiency and driving accuracy (that is, improves the reliable driving of a huge number of light-emitting diodes), but also the non-contact driving avoids damaging the pads or surfaces of the light-emitting diodes and protects the light-emitting diodes.

[0011] In a possible implementation manner, the first electrode plate can be a hollow flat structure in a shape of a figure-eight.

[0012] Optionally, the hollow part of the first electrode plate can be located at the center position of the first electrode plate. The hollow part can make the first electrode plate as a figure-eight window structure as a whole.

[0013] Exemplarily, the cross-section of the first electrode plate in the direction parallel to the second electrode plate can be a rectangle, a square, etc., and this application does not make any limitation.

[0014] Furthermore, chamfers are provided at the joints of two adjacent edges among the multiple edges of the first electrode plate. It is conceivable that the chamfers can prevent the first electrode plate from generating tip discharge and improve the safety of the driving device.

[0015] In a possible implementation manner, the shape of the second electrode plate can be the same as the shape of the wafer.

[0016] Optionally, both the second electrode plate and the wafer can be circular. Of course, the second electrode plate and the wafer can be other shapes except circular respectively, and this application does not make any limitation.

[0017] Furthermore, in order to realize the reliable driving of all the light-emitting diodes on the wafer, the size of the second electrode plate can be larger than the size of the wafer.

[0018] It can be understood that the shape of the second electrode plate and the shape of the wafer may not be exactly the same.

[0019] For example, both the second electrode plate and the wafer can be square, as long as the size of the second electrode plate is larger than the size of the wafer.

[0020] For example, the second electrode plate can be square, and the wafer can be circular, as long as the side length of the second electrode plate is greater than the diameter of the wafer.

[0021] In one possible implementation, the first surface of the second electrode (the surface used to indicate that the second electrode is in contact with the wafer) is electroplated with a metal layer (which may be made of metals such as copper, gold, or silver).

[0022] Alternatively, in order to increase the number of electrons emitted, that is, to allow more electrons to escape, the metal layer can cover the entire area of ​​the first surface.

[0023] Furthermore, the metal layer is covered by an insulating layer, and the insulating layer covers the entire area of ​​the metal layer.

[0024] Understandably, the insulating layer can reduce the escape velocity of electrons, prevent air breakdown and arcing, improve safety, and increase the insulation of the upper surface of the second electrode plate to prevent tip discharge of the second electrode plate.

[0025] It can be seen that by setting a metal layer and an insulating layer on the upper surface of the second electrode, not only can the number of electrons escaped be guaranteed and the reliable escape of electrons be achieved, but the stability and uniformity of the ionization field between the first electrode and the second electrode can also be improved.

[0026] Furthermore, the second surface of the second electrode (the surface of the second electrode facing away from the wafer) can be connected to the second terminal of the power supply, realizing back-side routing of the second electrode. Back-side routing can improve the insulation of the second electrode and increase the uniformity of the ionization field.

[0027] In one possible implementation, the first electrode and the second electrode can be made of metal (such as copper, aluminum, etc.). Of course, the first electrode and the second electrode can also be made of other metals besides copper and aluminum, and this application does not limit them.

[0028] It should be noted that the metal materials used for the first and second electrodes can be the same or different.

[0029] In one possible implementation, the driving device provided in this application may further include a first fixing member, which can be used to fix the first electrode plate.

[0030] It should be noted that, in order to ensure that a stable and uniform ionization field is formed between the first electrode plate and the second electrode plate, the side of the first fixing member that fixes the first electrode plate needs to be close to the second electrode plate, while the other side of the first fixing member can be away from the second electrode plate.

[0031] In another possible implementation, the driving device provided in this application may further include a second fixing member, which can be used to fix the second electrode plate.

[0032] Optionally, the first and second fasteners can be made of insulating materials (such as fiberglass or acetal alloy).

[0033] In one possible implementation, the power supply can be a pulse generator. The pulse generator can control the rising edge of the high-voltage pulse to prevent arcing caused by air breakdown, thus improving the reliability of the drive device.

[0034] Secondly, this application provides a light-emitting diode (LED) detection device, which may include a detection platform, a capture device, and a driving device provided in the first aspect and its possible implementations. The capture device and the detection device may be connected to the detection platform respectively.

[0035] Alternatively, the detection platform can be used to: fix the capture equipment and the drive unit.

[0036] Understandably, the testing platform achieves overall fixation of the drive device by fixing the first and second fixing components.

[0037] The driving device can be used to drive each light-emitting diode on the wafer.

[0038] The capture device can be used to: acquire information about light-emitting diodes.

[0039] The detection device provided in this application can reliably drive each light-emitting diode on the wafer through a driving device, which improves detection efficiency and accuracy. Moreover, the non-contact driving and detection method can avoid damage to the pads or surface of the light-emitting diodes, thus protecting the light-emitting diodes.

[0040] Optionally, the information of the light-emitting diode includes at least one of the following: position information (which can be indicated by coordinate information), brightness information, and spectral information (which may include wavelength and full width at half maximum, etc.).

[0041] It is conceivable that, in a scenario where each LED on a wafer is driven, the brightness and wavelength of each LED can be used to determine whether the LED is damaged.

[0042] Furthermore, based on brightness and wavelength information, the location of a damaged LED can be determined by combining coordinate information, thus achieving high-precision detection of LEDs.

[0043] For example, the capture device may be a pushbroom spectral camera (such as a pushbroom linear spectral camera or a pushbroom area spectral camera).

[0044] It should be understood that the second aspect of this application is consistent with the technical solution of the first aspect of this application, and the beneficial effects achieved by each aspect and the corresponding feasible implementation are similar, so they will not be repeated here. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 This is a schematic structural diagram of the light-emitting diode in the embodiments of this application;

[0047] Figure 2 This is a schematic structural diagram of the driving device in the embodiments of this application;

[0048] Figure 3 This is a schematic structural diagram of the first electrode plate in an embodiment of this application;

[0049] Figure 4 This is a schematic structural diagram of the first electrode plate and the first fixing member in an embodiment of this application;

[0050] Figure 5 This is a schematic structural diagram of the second electrode plate and the second fixing member in an embodiment of this application;

[0051] Figure 6 This is a schematic structural diagram of the detection device in the embodiments of this application. Detailed Implementation

[0052] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0053] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0054] The terms "first," "second," etc., used in the specification, embodiments, claims, and drawings of this application are for distinguishing purposes only and should not be construed as indicating or implying relative importance or order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, such as including a series of steps or units. A method, system, product, or apparatus is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products, or apparatuses.

[0055] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0056] "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or multiple items. For example, at least one of a, b, or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0057] With the rapid development of technology, light-emitting diodes (LEDs) have been widely used in the display screens of electronic devices such as mobile phones and tablets. Depending on their size, LEDs can be categorized into microLEDs (micro-scale) and nanoLEDs (nano-scale). Both microLEDs and nanoLEDs can be referred to as miniature LEDs (hereinafter simply LEDs).

[0058] Because of their small size, light-emitting diodes (LEDs) can have more pixels on a display screen of the same size (resulting in a more detailed display). Therefore, to accurately perform mass testing of LEDs and meet extremely high unit-per-hour (UPH) requirements, a massive number (e.g., millions) of LEDs are typically integrated onto a single wafer. Figure 1 As shown. Figure 1 The following explanation uses two LEDs, LED1 and LED2, integrated on a wafer W as an example.

[0059] refer to Figure 1LED1 and LED2 are respectively attached to the wafer W through adhesive layer 27. LED1 and LED2 may each include an N-type doped substrate (such as GaN) 21, an N-type electrode (i.e., the cathode of the LED, which can be made of metal such as copper or gold) 22, a P-type electrode (i.e., the anode of the LED, which can be made of metal such as copper or gold) 23, a P-type doped substrate (such as GaN) 24, an active light-emitting layer 25, and an insulating layer (such as silicon dioxide) 26.

[0060] In this structure, the N-type electrode 22 is located on the upper surface of the N-type doped layer 21. The active light-emitting layer 25 is located on the upper surface of the N-type doped layer 21, the P-type doped substrate 24 is located on the upper surface of the active light-emitting layer 25, and the P-type electrode 13 is located on the upper surface of the P-type doped substrate 24. The insulating layer 26 provides insulation between the N-type doped substrate 21, the P-type doped substrate 24, and the active light-emitting layer 25 and the outside environment.

[0061] Optionally, an ohmic contact can be formed between the N-type electrode 22 and the N-type doped layer 21. Similarly, an ohmic contact can be formed between the P-type electrode 23 and the P-type doped substrate 24.

[0062] For example, the active light-emitting layer 25 can be made of different materials such as GaN. It is conceivable that the material used for the active light-emitting layer 25 can determine the color of the light-emitting diode.

[0063] It is conceivable that, since the active light-emitting layer 25 is located between the N-type doped layer 21 and the P-type doped substrate 24, the active light-emitting layer 25 can form an NP channel. Electrons are excited in the NP channel and recombine with holes, thereby causing the light-emitting diode to emit light, thus driving the light-emitting diode (or, in other words, lighting the light-emitting diode).

[0064] If the LEDs are damaged before mass transfer, it will cause defects (such as dot or line defects) in the display module (used to manufacture display screens for electronic products) after mass transfer. Therefore, mass transfer testing of LEDs is necessary before mass transfer.

[0065] Related technologies typically involve using probes to contact the electrodes (i.e., the positive and negative terminals) of a light-emitting diode (LED) and supplying direct current to drive and detect the LED. However, this probe-based contact method is often very inefficient, and damage to the probe can affect not only the accuracy of driving and detection but also damage the LED's pads or surface.

[0066] To improve the efficiency and accuracy of driving and detecting LEDs, and to avoid damage to the LED pads or surface, LEDs can be driven quickly and reliably using a driving device, thereby enabling mass detection of LEDs.

[0067] An embodiment of the present application provides a driving device, as Figure 2 shown. The driving device 10 may include a power supply (PS), a plate (i.e., the first plate) 11, and a plate (i.e., the second plate) 12.

[0068] Referring to Figure 2 , the first end of the power supply PS (which may be the positive terminal DC+) may be connected to the plate 11, the second end of the power supply PS (which may be the negative terminal DC-) is connected to the plate 12. The plates 11 and 12 may be arranged in parallel. There is a preset distance between the plate 11 and the wafer W (that is, the plate 11 does not contact the wafer W), the plate 12 contacts the wafer W, and the wafer W may be placed on the plate 12.

[0069] It can be conceived that the power supply PS can provide high-voltage (such as 20 kV) direct current (which may be high-voltage pulses, etc.) through the positive terminal DC+ and the negative terminal DC-. The direct current applied to the plates 11 and 12 can form an ionization field between the plates 11 and 12, and the electrons excited by the ionization field can be injected into the active light-emitting layer of each light-emitting diode on the wafer, causing each light-emitting diode on the wafer to emit light (that is, lighting each light-emitting diode), which realizes the driving of each light-emitting diode.

[0070] It can be seen that the driving device provided by the embodiment of the present application forms an ionization field through the direct current applied to the two plates, and excites electroluminescence, and finally realizes the driving of the light-emitting diode.

[0071] In the embodiment of the present application, the plate 22 contacts the wafer, and the plate 21 does not contact the wafer. The driving of a huge number of light-emitting diodes on the wafer is realized in a non-contact manner, which not only improves the driving efficiency and driving accuracy (that is, improves the reliable driving of a huge number of light-emitting diodes), but also the non-contact driving avoids damaging the pads or surfaces of the light-emitting diodes, protecting the light-emitting diodes.

[0072] In a possible implementation manner, as Figure 3 shown, the plate 11 may be a hollow flat structure in a shape of a rectangle with a hole in the middle. Figure 3 In, the hollow part 110 of the plate 11 may be located at the center position of the plate 11. The hollow part 110 may make the whole plate 11 present a structure of a rectangle with a hole in the middle.

[0073] It can be conceived that the thickness of the plate 11 is relatively thin (such as 1 mm or 2 mm, etc.), so the plate 11 is a flat structure.

[0074] Exemplarily, the cross-section of the plate 11 in the direction parallel to the plate 12 may be a rectangle, a square, etc., which is not limited in the embodiment of the present application.

[0075] Furthermore, a chamfer is provided at the junction of two adjacent edges among the multiple edges of the electrode plate 11. It is conceivable that the chamfer can prevent the electrode plate 11 from generating tip discharge, thereby improving the safety of the drive device.

[0076] Optionally, the electrode 11 can be made of metals such as copper or aluminum. Since metals are less prone to oxidation, metal electrode 11 not only increases the number of electrons emitted and reduces air ionization, but also offers high reliability. Of course, the electrode 11 can also be made of other metals besides copper and aluminum; this embodiment does not limit its use.

[0077] It is conceivable that if the electrode 11 were made of transparent indium tin oxide (ITO) glass, although driving the light-emitting diode (LED) could be achieved, ITO glass is prone to oxidation, leading to discoloration (severe discoloration can cause the ITO glass to lose its light transmittance) and impaired conductivity. Furthermore, the conductivity of ITO glass is inversely proportional to its light transmittance; therefore, as the oxidation of the ITO glass intensifies, the LED may become undetectable. Therefore, compared to ITO glass, the embodiment of this application uses a metal electrode 11, which not only ensures the conductivity of the electrode 11 but also provides conditions for further detection after the LED has been driven, thanks to its U-shaped structure.

[0078] In one example, the driving device 10 provided in this application embodiment may further include a fixing member (i.e., a first fixing member) 13, which can be used to fix the electrode plate 11, such as... Figure 4 As shown.

[0079] Optionally, refer to Figure 4 Multiple through holes 130 can be provided on the fixing member 13. The fixing member 13 can be installed on the detection device of the light-emitting diode (see the description below) through the through holes 130 (and insulating screws (such as plastic screws, acetal screws, etc.)).

[0080] It should be noted that the embodiments of this application only provide one possible structure of the fastener 13. The fastener 13 can also be other fasteners that can fix the electrode plate 11. The embodiments of this application do not limit the structure of the fastener 13.

[0081] It should also be noted that, in order to ensure that a stable and uniform ionization field is formed between the electrode 11 and the electrode 12, the side of the fixing member 13 that fixes the electrode 11 needs to be close to the electrode 12, and the other side of the fixing member 13 can be away from the electrode 12.

[0082] For example, the fastener 13 can be made of fiberglass or acetal alloy. Of course, the fastener 13 can also be made of other insulating materials besides fiberglass, and this application embodiment does not limit the application.

[0083] In one possible implementation, the shape of the electrode 12 can be the same as the shape of the wafer W; for example, both can be [missing information]. Figure 5 The shape shown is circular. Of course, the electrode plate 12 and the wafer W can be other shapes besides circular, and this application embodiment does not limit them.

[0084] Furthermore, in order to reliably drive all the light-emitting diodes on wafer W, the size of electrode plate 12 can be larger than the size of wafer W.

[0085] It is understandable that the shape of the electrode plate 12 may not be exactly the same as the shape of the wafer W.

[0086] For example, both the electrode plate 12 and the wafer W can be square, as long as the size of the electrode plate 12 is larger than the size of the wafer W.

[0087] For example, the electrode plate 12 can be square, and the wafer W can be circular, as long as the side length of the electrode plate 12 is greater than the diameter of the wafer W.

[0088] Furthermore, the first surface of the electrode 12 (used to indicate the surface of the electrode 12 in contact with the wafer W, i.e.) Figure 5 The upper surface of the middle electrode plate 12 can be electroplated with a metal layer ( Figure 5 (Not shown in the image).

[0089] To increase the number of electrons released, that is, to allow more electrons to escape, the metal layer can cover the entire area of ​​the upper surface of the electrode 12.

[0090] For example, the metal layer can be made of metals such as copper, gold, or silver, but this application does not limit the specific materials used in the embodiments.

[0091] Furthermore, such as Figure 5 As shown, the upper surface of the metal layer (i.e., the surface of the metal layer facing away from the electrode 12) can be covered with an insulating layer 121, which can cover the entire area of ​​the metal layer. The insulating layer 121 can reduce the escape velocity of electrons, prevent air breakdown and arcing, improve safety, and increase the insulation of the upper surface of the electrode 12, preventing tip discharge of the electrode 12.

[0092] It can be seen that by setting a metal layer and an insulating layer 121 on the upper surface of the electrode 12, not only can the number of electrons escaped be guaranteed and the reliable escape of electrons be achieved, but the stability and uniformity of the ionization field between the electrode 11 and the electrode 12 can also be improved.

[0093] Similar to electrode 11, electrode 12 can also be made of metals such as copper and aluminum. Of course, electrode 12 can also be made of other metals besides copper and aluminum, and this embodiment does not limit the use of any metal.

[0094] It should be noted that the metal material used for electrode 12 can be the same as the metal material used for electrode 11.

[0095] The embodiments may differ, and this application does not limit them.

[0096] In one example, the driving device 10 provided in this application embodiment may further include a fixing member (i.e., a second fixing member) 14, which can be used to fix the electrode plate 12, such as... Figure 5 As shown.

[0097] For example, the fixing member 14 may include fixing member 141 and fixing member 142 located in a stacked arrangement. The upper surface of fixing member 141 contacts the lower surface of electrode plate 12, and the lower surface of fixing member 141 contacts the upper surface of fixing member 142. The lower surface of electrode plate 12 (which may be the center position of the second surface of electrode plate 12 (used to indicate the surface of electrode plate 12 facing away from wafer W)) can be connected to the negative terminal of power supply PS through fixing member 141 and fixing member 142, realizing the back-side wiring of electrode plate 12. The wiring outlet 143 is as follows... Figure 5 As shown. The back-side wiring can improve the insulation of the electrode 12 and increase the uniformity of the ionization field.

[0098] Optionally, fasteners 141 and 142 may be made of fiberglass, or they may be made of other insulating materials such as P-type steel. This application does not limit the specific materials used in the embodiments.

[0099] Similar to fastener 13, fastener 14 may have multiple through holes 140, such as Figure 5 As shown. The mounting member 14 can be mounted on the LED detection device (see description below) through the through hole 140 (and insulating screws (such as plastic screws, acetal screws, etc.)).

[0100] It should be noted that the embodiments of this application only provide one possible structure of the fastener 14. The fastener 14 can also be other fasteners that can fix the electrode plate 12. The embodiments of this application do not limit the structure of the fastener 14.

[0101] In one possible implementation, the power supply PS can be a pulse generator. The pulse generator can control the rising edge of the high-voltage pulse to prevent arcing caused by air breakdown, thus improving the reliability of the drive device. Of course, the power supply PS can also be other power supplies capable of providing DC power; this application does not limit the specific implementation.

[0102] This application also provides a light-emitting diode detection device, such as... Figure 6 As shown. It should be noted that, Figure 6 The power supply PS of the drive unit 10 is not shown. Meanwhile... Figure 6The fixing member 13, fixing member 14, and electrode plate 12 in the drive device 10 are marked. The electrode plate 11 is blocked by the fixing member 13, so the electrode plate 11 is not marked.

[0103] refer to Figure 6 The detection device 20 may include a detection platform 21, a capture device 22, and a drive device 10. The capture device 22 and the detection device 10 may be connected to the detection platform 21 respectively.

[0104] Optionally, the detection platform 21 can be used to fix the capture device 22 and the drive unit 10.

[0105] Understandably, the testing platform achieves overall fixation of the drive device 10 by fixing fasteners 13 and 14.

[0106] The driving device 10 can be used to drive each light-emitting diode on the wafer W.

[0107] The capturing device 22 can be used to: acquire information about the light-emitting diode.

[0108] The detection device provided in this application embodiment can reliably drive each light-emitting diode on the wafer through the driving device, which improves the detection efficiency and detection accuracy. Moreover, the non-contact driving and detection method can avoid damage to the pads or surface of the light-emitting diode, thus protecting the light-emitting diode.

[0109] Further, refer to Figure 6 The detection platform 21 may include a frame part A and a displacement part B.

[0110] The frame section A can be used to fix the capture device 22 and the fixing member 13 in the drive device 10. The displacement section B is used to fix the fixing member 14 and also to adjust the position of the electrode plate 12 so that the capture device 22 can pass through the hollow part of the electrode plate 11 to obtain image information of each light-emitting diode on the wafer W.

[0111] Optionally, the information of the light-emitting diode includes at least one of position information (which can be indicated by coordinate information), brightness information, and spectral information (which may include wavelength and full width at half maximum, etc.). This application embodiment will be used as an example to illustrate obtaining the coordinate information, brightness information, and wavelength of each light-emitting diode.

[0112] It is conceivable that, in a scenario where each LED on a wafer is driven, the brightness and wavelength of each LED can be used to determine whether the LED is damaged.

[0113] In one example, if the brightness of the LED is lower than a preset brightness threshold (including the case of no brightness), it can be indicated that the LED is damaged.

[0114] In another example, the wavelength of the LED acquired by the capture device 22 can be compared with the wavelength corresponding to the preset color of the LED to determine whether the LED is damaged.

[0115] For example, if the LED being detected is a red LED, then the preset wavelength corresponding to the LED color is 650nm-700nm. If the wavelength of the LED acquired by the capturing device 22 is within the 650nm-700nm range, it indicates that the red LED is not damaged; otherwise, it indicates that the red LED is damaged.

[0116] Furthermore, based on brightness and wavelength information, the location of a damaged LED can be determined by combining coordinate information, thus achieving high-precision detection of LEDs.

[0117] Optionally, the capture device 22 can be a pushbroom spectral camera (such as a pushbroom linear spectral array camera or a pushbroom area spectral array camera). Of course, the capture device 22 can also be other devices capable of acquiring information about each light-emitting diode, and this application embodiment does not limit it.

[0118] It is conceivable that the capturing device 22 can acquire image information of each light-emitting diode on the wafer through the hollow portion 110 of the electrode plate 11. Furthermore, the capturing device 22 processes the image information to obtain information such as the wavelength and brightness of each light-emitting diode.

[0119] Furthermore, since light-emitting diodes exhibit metamerism, the wavelength of each light-emitting diode can be obtained by the capture device 22, and light-emitting diodes with similar wavelengths can be arranged in the same area, thereby improving the yield of the display module after mass transfer and reducing the manufacturing cost of the display module.

[0120] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A light-emitting diode driving device, characterized in that, The light-emitting diodes are integrated on the wafer; the driving device includes a power source, a first electrode plate, and a second electrode plate; The first end of the power source is connected to the first electrode plate, the second end of the power source is connected to the second electrode plate, the first electrode plate and the second electrode plate are arranged in parallel, a preset distance is provided between the first electrode plate and the wafer, and the second electrode plate contacts the wafer and is used for placing the wafer.

2. The driving device according to claim 1, characterized in that, The first electrode plate is a hollow flat structure in a shape of a Chinese character 'hui'.

3. The driving device according to claim 2, characterized in that, Chamfers are provided at the joints of two adjacent edges among the multiple edges of the first electrode plate.

4. The driving device according to any one of claims 1 to 3, characterized in that, The shape of the second electrode plate is the same as that of the wafer, and the size of the second electrode plate is larger than that of the wafer.

5. The driving device according to any one of claims 1 to 3, characterized in that, A metal layer is electroplated on the first surface of the second electrode plate, and the metal layer covers all areas of the first surface; the first surface is used to indicate the surface of the second electrode plate that contacts the wafer.

6. The driving device according to claim 5, characterized in that, An insulating layer covers the metal layer, and the insulating layer covers all areas of the metal layer.

7. The driving device according to claim 5, characterized in that, The second surface of the second electrode plate is connected to the second end of the power source, and the second surface is used to indicate the surface of the second electrode plate that faces away from the wafer.

8. The driving device according to any one of claims 1 to 3, 6 to 7, characterized in that, The first electrode plate and the second electrode plate are respectively made of a metal material.

9. The driving device according to any one of claims 1 to 3, 6 to 7, characterized in that, The driving device further includes a first fixing member installed on the detection device and used for fixing the first electrode plate.

10. The driving device according to claim 9, characterized in that, The driving device further includes a second fixing member installed on the detection device and used for fixing the second electrode plate.

11. The driving device according to claim 10, characterized in that, The first fixing member and the second fixing member are respectively made of an insulating material.

12. The driving device according to any one of claims 1 to 3, 6 to 7, and 10 to 11, characterized in that, The power source is a pulse generator.

13. A light-emitting diode detection device, characterized in that: It includes a detection platform, a capture device, and the driving device according to any one of claims 1 to 12, and the capture device and the detection device are respectively connected to the detection platform; The detection platform is used for: fixing the capture device and the driving device; The driving device is used for: driving the light-emitting diodes; [[ID=十六]]The capture device is used for: obtaining information of the light-emitting diodes.

14. The detection device according to claim 13, characterized in that: The information of the light-emitting diodes includes at least one of position information, brightness information, and spectral information.

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