Display device

Abstract

A display device is provided. The display device includes a display panel and a touch sensing member. The display panel includes a substrate layer, a circuit layer disposed on the substrate layer, a display device layer disposed on the circuit layer, and an encapsulation layer disposed on the display device layer. The touch sensing member is directly disposed on the encapsulation layer and includes a conductive pattern and a first insulating layer. The first insulating layer is stacked with the conductive pattern and disposed on the encapsulation layer. Wherein, the circuit layer includes: a first lower pad electrically connected to the display device layer and disposed on the substrate layer; a second lower pad spaced apart from the first lower pad in a plan view and disposed on the substrate layer; a first upper pad disposed on the first lower pad; a second upper pad electrically connected to the conductive pattern and disposed on the second lower pad; and a second insulating layer disposed between the first lower pad and the first upper pad and between the second lower pad and the second upper pad. Wherein, the first upper pad is electrically connected to the first lower pad.

Description

[0001] This application is a divisional application of the invention patent application with the application number 201710638744.X and the invention name "organic light-emitting display module" submitted by the applicant to the State Intellectual Property Office of China on July 31, 2017. Technical Field

[0002] Here, the present disclosure relates to a display device, and more particularly, to a display device integrated with a touch sensing unit. Background Art

[0003] Various display devices used in multimedia devices such as televisions, mobile phones, desktop computers, navigation devices, and game consoles are being developed. Such display devices include a keyboard or a mouse as an input unit. In addition, in recent years, display devices include a touch sensing member as an input unit. Summary of the Invention

[0004] The present disclosure provides a display device that removes a stepped portion between a pad unit of a display panel and a pad unit of a touch sensing member to reduce defects occurring in a manufacturing process.

[0005] The present disclosure also provides a display device having improved reliability when a boundary region between an active region and a pad region on a display panel is bent.

[0006] Embodiments of the inventive concept provide an organic light-emitting display module including a substrate layer, a first circuit layer, a device layer, a encapsulation layer, a plurality of touch electrodes, a second circuit layer, and a boundary layer. The substrate layer includes an active region, a pad region, and a boundary region between the active region and the pad region. The first circuit layer is disposed on the active region of the substrate layer and includes a plurality of inorganic layers and a first conductive pattern. The device layer is disposed on the first circuit layer and includes an organic light-emitting device configured to generate light by using an electrical signal provided from the first conductive pattern. The encapsulation layer is disposed on the device layer. The plurality of touch electrodes are disposed on the encapsulation layer. The second circuit layer is disposed on the pad region of the substrate layer and includes a plurality of inorganic layers and a second conductive pattern. The boundary layer is disposed on the boundary region of the substrate layer and includes an organic layer and a third conductive pattern configured to electrically connect the first conductive pattern to the second conductive pattern. The boundary layer may not include an inorganic layer disposed on the substrate layer.

[0007] In an embodiment, the plurality of inorganic layers of the first circuit layer may include a first functional layer contacting the substrate layer, and the plurality of inorganic layers of the second circuit layer may include a second functional layer directly contacting the substrate layer.

[0008] In an embodiment, the second conductive pattern may include a display panel pad and a touch sensing member pad. The display panel pad may be disposed on the second functional layer and electrically connected to the first conductive pattern. The touch sensing member pad may be disposed adjacent to the display panel pad on the second functional layer, electrically connected to the plurality of touch electrodes, and insulated from the first conductive pattern.

[0009] In an embodiment, the display panel pad may include: a lower display panel pad; and an upper display panel pad disposed on the lower display panel pad and electrically connected to the lower display panel pad.

[0010] In an embodiment, the touch sensing member pad may include: a lower touch sensing member pad; and an upper touch sensing member pad disposed on the lower touch sensing member pad.

[0011] In an embodiment, the first conductive pattern may include a transistor including a control electrode, an input electrode, and an output electrode, and the input electrode, the output electrode, the lower display panel pad, and the lower touch sensing member pad may be disposed on the same layer.

[0012] In an embodiment, the second conductive pattern may further include a dummy electrode disposed on the same layer as the control electrode.

[0013] In an embodiment, the organic light emitting display module may further include a touch signal line extending from at least one of the plurality of touch electrodes to contact the upper touch sensing member pad.

[0014] In an embodiment, the second circuit layer may further include a plurality of insulating layers disposed between the upper display panel pad and the lower display panel pad, and the plurality of insulating layers may be disposed between the upper touch sensing member pad and the lower touch sensing member pad.

[0015] In an embodiment, the lower touch sensing member pad may be electrically insulated from the upper touch sensing member pad.

[0016] In an embodiment, the lower touch sensing member pad may be electrically connected to the upper touch sensing member pad.

[0017] In an embodiment, the upper display panel pad may contact the lower display panel pad, and the upper touch sensing member pad may contact the lower touch sensing member pad.

[0018] In an embodiment, the first functional layer and the second functional layer may include a barrier layer and a buffer layer, respectively.

[0019] In an embodiment, the organic light emitting display module may further include a driving circuit that is stacked with the pad region and configured to control an electrical signal flowing between the display panel pad and the first conductive pattern.

[0020] In an embodiment, the first circuit layer may further include an organic layer disposed on the first conductive pattern, and the boundary layer may further include an organic layer disposed on the third conductive pattern.

[0021] In an embodiment, the boundary region of the substrate layer and the boundary layer may be bendable.

[0022] In an embodiment of the inventive concept, an organic light emitting display device includes an organic light emitting display panel and a touch sensing member disposed on the organic light emitting display panel.

[0023] In an embodiment, the organic light emitting display panel may include a substrate layer, a conductive pattern, a device layer, and an encapsulation layer. The substrate layer may include an active region, a pad region, and a boundary region between the active region and the pad region. The conductive pattern may be stacked with the active region, disposed on the substrate layer, formed by a low temperature polycrystalline Si (LTPS) process, and include a display panel pad and a touch sensing member pad disposed adjacent to the display panel pad, wherein the touch sensing member pad and the display panel pad may receive an electrical signal from the outside. The device layer may be disposed on the conductive pattern and include an organic light emitting device configured to generate light by using the electrical signal provided from the conductive pattern. The encapsulation layer may be disposed on the device layer.

[0024] In an embodiment, the touch sensing member may include a plurality of touch electrodes and a plurality of touch signal lines. The plurality of touch electrodes may be disposed on the encapsulation layer. The plurality of touch signal lines may extend from the plurality of touch electrodes and be electrically connected to the conductive pattern, wherein a portion of the touch signal line that overlaps with the boundary region may be disposed between two organic layers.

[0025] In an embodiment, the organic light emitting display device may further include a printed circuit board electrically connected to the touch sensing member pad and the display panel pad, wherein a portion of the organic light emitting display panel and the touch sensing member that overlaps with the boundary region may be bent.

[0026] In an embodiment of the inventive concept, an organic light emitting display module includes a substrate layer, a first functional layer, a plurality of transistors, a device layer, an encapsulation layer, a plurality of touch electrodes, a second functional layer, a first display panel pad, a first touch sensing member pad, a second display panel pad, a second touch sensing member pad, and a boundary layer.

[0027] In an embodiment, the substrate layer may include an active region, a pad region, and a boundary region between the active region and the pad region. The first functional layer may be disposed on the active region of the substrate layer and include an inorganic material. The plurality of transistors may be disposed on the first functional layer. The device layer may include an organic light-emitting device configured to generate light by using an electrical signal provided from at least one of the plurality of transistors. The encapsulation layer may be disposed on the device layer and include an organic material and an inorganic material. The plurality of touch electrodes may be disposed on the encapsulation layer. The second functional layer may be disposed on the pad region of the substrate layer and include an inorganic material. The first display panel pad may be disposed on the second functional layer and electrically connected to at least one of the plurality of transistors. The first touch sensing member pad may be disposed adjacent to the first display panel pad on the second functional layer and insulated from the plurality of transistors. The second display panel pad may be disposed on the first display panel pad and electrically connected to the first display panel pad. The second touch sensing member pad may be disposed on the first touch sensing member pad and electrically connected to at least one of the plurality of touch electrodes. The boundary layer may be disposed on the boundary region of the substrate layer and include an organic material. The boundary layer does not include an inorganic layer disposed on the substrate layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept. In the drawings:

[0029] Figure 1A is a perspective view showing a first operation mode of a display device according to an embodiment of the inventive concept;

[0030] Figure 1B is a perspective view showing a second operation mode of a display device according to an embodiment of the inventive concept;

[0031] Figure 1C is a perspective view showing a third operation mode of a display device according to an embodiment of the inventive concept;

[0032] Figure 2A is a perspective view showing a first operation mode of a display device according to an embodiment of the inventive concept;

[0033] Figure 2B is a perspective view showing a second operation mode of a display device according to an embodiment of the inventive concept;

[0034] Figure 3 is a cross-sectional view of a display device according to an embodiment of the inventive concept;

[0035] Figure 4A cross-sectional view of a display module according to an embodiment of the inventive concept;

[0036] Figure 5 A plan view of an organic light emitting display panel according to an embodiment of the inventive concept;

[0037] Figure 6 An equivalent circuit diagram of a pixel according to an embodiment of the inventive concept;

[0038] Figure 7 and Figure 8 A partial cross-sectional view of an organic light emitting display panel according to an embodiment of the inventive concept;

[0039] Figure 9 A plan view of a touch sensing member according to an embodiment of the inventive concept;

[0040] Figure 10 Yes Figure 9 An enlarged view of part AA;

[0041] Figure 11 is a cross-sectional view taken along Figure 10 line I-I';

[0042] Figure 12 is Figure 5 and Figure 9 a view of a display panel pad and a touch sensing member pad;

[0043] Figure 13A is a cross-sectional view taken along Figure 12 line II-II';

[0044] Figure 13B is a cross-sectional view taken along Figure 12 line III-III';

[0045] Figure 13C is a cross-sectional view taken along Figure 12 line IV-IV';

[0046] Figure 14A is a cross-sectional view taken along Figure 12 line II-II';

[0047] Figure 14B is a cross-sectional view taken along Figure 12 line III-III';

[0048] Figure 14C and Figure 14D is a cross-sectional view taken along Figure 12 line IV-IV';

[0049] Figure 15A is a cross-sectional view taken along Figure 12The sectional view taken along line II-II';

[0050] Figure 15B is the sectional view taken along Figure 12 line III-III';

[0051] Figure 15C is the sectional view taken along Figure 12 line IV-IV';

[0052] Figure 16A is the sectional view taken along Figure 12 line II-II';

[0053] Figure 16B is the sectional view taken along Figure 12 line III-III';

[0054] Figure 16C is the sectional view taken along Figure 12 line IV-IV';

[0055] Figure 17A is the sectional view taken along Figure 12 line II-II';

[0056] Figure 17B is the sectional view taken along Figure 12 line III-III';

[0057] Figure 17C and Figure 17D is the sectional view taken along Figure 12 line IV-IV';

[0058] Figure 18A is the sectional view taken along Figure 12 line II-II';

[0059] Figure 18B is the sectional view taken along Figure 12 line III-III';

[0060] Figure 18C is the sectional view taken along Figure 12 line IV-IV';

[0061] Figure 19A is the sectional view taken along Figure 12 line II-II';

[0062] Figure 19B is the sectional view taken along Figure 12 line III-III';

[0063] Figure 19C is the sectional view taken along Figure 12Cross-sectional view taken along line IV-IV';

[0064] Figure 20A is a cross-sectional view taken along Figure 12 line II-II';

[0065] Figure 20B is a cross-sectional view taken along Figure 12 line III-III';

[0066] Figure 20C is a cross-sectional view taken along Figure 12 line IV-IV';

[0067] Figure 21A is a cross-sectional view taken along Figure 12 line II-II';

[0068] Figure 21B is a cross-sectional view taken along Figure 12 line III-III';

[0069] Figure 21C is a cross-sectional view taken along Figure 12 line IV-IV';

[0070] Figure 22 and Figure 23 is a plan view of a display module and a printed circuit board according to an embodiment of the inventive concept; and

[0071] Figure 24 is a view showing a bent shape of a display module according to an embodiment of the inventive concept. DETAILED DESCRIPTION

[0072] Hereinafter, embodiments of the inventive concept will be described with reference to the accompanying drawings. In this specification, it will also be understood that when a component (or region, layer, part) is referred to as being "on," "connected to," or "coupled to" another component, the component may be directly disposed on / connected / coupled to the other component, or there may also be an intervening third component.

[0073] Like reference numerals always denote like elements. Also, in the drawings, the thickness, ratio, and dimensions of components are exaggerated for clarity. The term "and / or" includes any combination and all combinations of one or more of the associated listed items.

[0074] It will be understood that although terms such as "first" and "second" are used herein to describe various elements, these elements should not be limited by these terms. The terms are only used to separate one component from other component regions. For example, without departing from the scope of the appended claims, an element referred to as the first element in one embodiment may be referred to as the second element in another embodiment. Unless indicated to the contrary, terms in the singular form may include the plural form.

[0075] In addition, in order to explain the relationship associations of the components shown in the drawings, terms such as "under", "below", "above", "upper", etc. are used. The terms may be relative concepts and are described based on the directions expressed in the drawings.

[0076] The meaning of "comprising" or "including" indicates properties, fixed quantities, steps, operations, elements, components, or combinations thereof, but does not exclude other properties, fixed quantities, steps, operations, elements, components, or combinations thereof.

[0077] Figure 1A is a perspective view showing a first operation mode of a display device DD according to an embodiment of the inventive concept. Figure 1B is a perspective view showing a second operation mode of a display device DD according to an embodiment of the inventive concept. Figure 1C is a perspective view showing a third operation mode of a display device DD according to an embodiment of the inventive concept.

[0078] As Figure 1A shown, in the first operation mode, a display surface IS on which an image IM is displayed is parallel to a surface defined by a first direction axis DR1 and a second direction axis DR2. The normal direction of the display surface IS (i.e., the thickness direction of the display device DD) is indicated as a third direction axis DR3. The front surface (or top surface) and the rear surface (or bottom surface) of each member are distinguished by the third direction axis DR3. However, the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 may be relative concepts, and thus, may become different directions. Hereinafter, the first direction to the third direction may be the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3, respectively, and may be represented by the same reference numerals. Although a flexible display device is shown in the current embodiment, the embodiments of the inventive concept are not limited thereto. The display device DD according to the current embodiment may be a rigid display device.

[0079] Figures 1A to 1C shows a foldable display device as an example of the flexible display device DD. Figure 2A and Figure 2BAn example of a foldable display device is shown as a flexible display device DD. Alternatively, the display device DD may be a rollable flexible display device, but is not particularly limited. The flexible display device DD according to an embodiment of the inventive concept may be used in large electronic devices such as televisions and monitors, as well as small and medium-sized electronic devices such as mobile phones, desktop PCs, navigation units for vehicles, game consoles, and smart watches.

[0080] As Figure 1A shown, the display surface IS of the flexible display device DD may include a plurality of regions. The flexible display device DD includes a display region DD-DA on which an image IM is displayed and a non-display region DD-NDA adjacent to the display region DD-DA. The non-display region DD-NDA may be a region on which no image is displayed. Figure 1A A vase is shown as an example of the image IM. For example, the display region DD-DA may have a rectangular shape. The non-display region DD-NDA may surround the display region DD-DA. However, embodiments of the inventive concept are not limited thereto. For example, the shapes of the display region DD-DA and the non-display region DD-NDA may be designed relatively.

[0081] The flexible display device DD may include a housing HS. The housing HS may be disposed outside the flexible display device DD to accommodate internal components. Hereinafter, for convenience of description, the housing HS may be shown separately or not described.

[0082] As Figures 1A to 1C shown, the display device DD may include a plurality of regions defined according to the form of operation. The display device DD may include a bending region BA that bends about a bending axis BX, a first non-bending region NBA1 that does not bend, and a second non-bending region NBA2 that does not bend. As Figure 1B shown, the display device DD may bend inward so that the display surfaces IS of the first non-bending region NBA1 and the second non-bending region NBA2 face each other. As Figure 1C shown, the display device DD may bend outward so that the display surface IS is exposed to the outside.

[0083] In an embodiment of the inventive concept, the display device DD may include a plurality of bending regions BA. Additionally, the bending region BA may be formed to correspond to the operation of a user who manipulates the display device DD. For example, different from Figure 1B and Figure 1C , the bending region BA may be formed parallel to the first direction axis DR1 or in a diagonal direction. The bending region BA may have a variable surface area determined according to its radius of curvature. In an embodiment of the inventive concept, the display device DD may have a shape that only repeats the operation modes of Figure 1A and Figure 1B .

[0084] Figure 2A is a perspective view showing a first operation mode of a display device according to an embodiment of the inventive concept. Figure 2B is a perspective view showing a second operation mode of a display device according to an embodiment of the inventive concept. Figure 2A and Figure 2B show a display device in which a non-display area DD-NDA is folded as an example of a foldable display device DD. As described above, the display device DD according to an embodiment of the inventive concept does not limit the number of bending areas BA and non-bending areas NBA and the positions of the bending areas.

[0085] Figure 3 is a cross-sectional view of a display device DD according to an embodiment of the inventive concept. Figure 4 is a cross-sectional view of a display module DM according to an embodiment of the inventive concept. Figure 3 shows a cross-sectional view defined by a second direction axis DR2 and a third direction axis DR3, Figure 4 shows a cross-sectional view defined by a first direction axis DR1 and a third direction axis DR3.

[0086] As Figure 3 shown, the display device DD includes a protective film PM, a window WM, a display module DM, a first adhesive member AM1, and a second adhesive member AM2. The display module DM is disposed between the protective film PM and the window WM. The first adhesive member AM1 is bonded to the display module DM and the protective film PM, and the second adhesive member AM2 is bonded to the display module DM and the window WM. In an embodiment of the inventive concept, the first adhesive member AM1 and the second adhesive member AM2 may be omitted. The protective film PM and the window WM may be continuously manufactured by a coating process.

[0087] The protective film PM protects the display module DM. The protective film PM provides a first outer surface OS-L exposed to the outside and an adhesive surface AS1 bonded to the first adhesive member AM1. The protective film PM prevents external moisture from penetrating into the display module DM and absorbs external shocks.

[0088] The protective film PM may include a plastic film. The protective film PM may include one selected from the group consisting of polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), poly(arylene ether sulfone), and combinations thereof.

[0089] The material for forming the protective film PM is not limited to plastic resins. For example, the protective film PM may include an organic / inorganic composite material. The protective film PM may include a porous organic layer and an inorganic material filled into the pores of the porous organic layer. The protective film PM may further include a functional layer provided on the plastic film. The functional layer may include a resin layer. The functional layer may be formed by a coating process.

[0090] The window WM protects the display module DM from external impacts and provides an input surface to the user. The window WM provides a second outer surface OS-U exposed to the outside and an adhesive surface AS2 bonded to the second adhesive member AM2. Figures 1A to 1C The display surface IS may be the second outer surface OS-U.

[0091] In Figure 2A and Figure 2B In the display device DD of

[0092] The display module DM includes an organic light-emitting display panel DP and a touch sensing unit TS integrally formed by a continuous process. The organic light-emitting display panel DP generates an image corresponding to the input image data (see Figure 1A the reference numeral IM). The organic light-emitting display panel DP provides a first display panel surface BS1-L and a second display panel surface BS1-U facing each other in the thickness direction DR3.

[0093] The touch sensing unit TS acquires coordinate information of an external input. The touch sensing unit TS may be directly provided on the second display panel surface BS1-U. In the current embodiment, the touch sensing unit TS may be manufactured together with the organic light-emitting display panel DP by a continuous process.

[0094] Although not shown separately, the display module DM according to an embodiment of the inventive concept may further include an anti-reflection layer. The anti-reflection layer may include a color filter, a stack structure of a conductive layer / dielectric layer / conductive layer, or an optical member. The anti-reflection layer may absorb, cancel out the interference of light incident from the outside, or polarize the light incident from the outside to reduce the reflectance of external light.

[0095] Each of the first adhesive member AM1 and the second adhesive member AM2 may be an optically clear adhesive film (OCA), an optically clear resin (OCR), or a pressure-sensitive adhesive film (PSA). Each of the first adhesive member AM1 and the second adhesive member AM2 may include a photocurable adhesive material or a thermocurable adhesive material. However, the embodiments of the inventive concept are not particularly limited thereto.

[0096] Although not specifically shown, the display device DD may further include a frame structure that supports the functional layer to maintain the Figures 1A to 2B state shown in. The frame structure may include a hinge structure or a hinge structure.

[0097] As Figure 4 shown, the organic light emitting display panel DP includes a substrate layer SUB, a first circuit layer CL1 disposed on the substrate layer SUB, a light emitting device layer ELL, and a thin film encapsulation layer TFE. The substrate layer SUB may include at least one plastic film. The substrate layer SUB may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite substrate as a flexible substrate.

[0098] The first circuit layer CL1 may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the first circuit layer CL1 may constitute signal lines or circuit portions of pixels. The light emitting device layer ELL may include an organic light emitting diode OLED. The thin film encapsulation layer TFE seals the light emitting device layer ELL. The thin film encapsulation layer TFE may include at least two inorganic thin films and an organic thin film disposed between the at least two inorganic thin films. The thin film encapsulation layer TFE may protect the light emitting device layer ELL from external substances such as moisture and dust particles.

[0099] In the current embodiment of the inventive concept, the touch sensing unit TS may be a single layer type. That is, the touch sensing unit TS may include a single conductive layer. Here, the single conductive layer means that "the conductive layer is not divided by an insulating layer". The stacked structure of the first metal layer / second metal layer / metal oxide layer may correspond to the single conductive layer since the first metal layer and the second metal layer are not insulated by the metal oxide layer, while the stacked structure of the first metal layer / insulating layer / metal oxide layer may correspond to the double conductive layer.

[0100] The single conductive layer may be patterned to form a plurality of touch electrodes and a plurality of touch signal lines. That is, the sensors of the touch sensing unit TS may be disposed on the same layer. The sensors may be directly disposed on the thin film encapsulation layer TFE. In addition, a part of each of the touch signal lines may be disposed on the same layer as the sensors. A part of each of the touch signal lines may be disposed on the first circuit layer CL1. The structure of the touch sensing unit TS will be described in detail later.

[0101] Each of the touch signal lines and the sensors may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO), PEDOT, metal nanowires, and graphene. Each of the touch signal lines and the sensors may include a metal layer such as molybdenum, silver, titanium, copper, aluminum, and alloys thereof. The touch signal lines and the sensors may include the same material as each other or different materials from each other.

[0102] When compared with the structure of the display module DM including a multi-layered touch sensing member, the display module DM according to an embodiment of the inventive concept may include a single-layered touch sensing member to simplify its structure. Although the display module DM is bent as Figure 1B and Figure 1C shown, since the touch sensing unit TS is slender, stress generated in the touch sensing unit TS can be reduced.

[0103] Figure 5 is a plan view of the organic light emitting display panel DP according to an embodiment of the inventive concept. Figure 6 is an equivalent circuit diagram of the pixel PX according to an embodiment of the inventive concept. Figure 7 and Figure 8 are partial cross-sectional views of the organic light emitting display panel DP according to an embodiment of the inventive concept.

[0104] As Figure 5 shown, the organic light emitting display panel DP includes a display area DA and a non-display area NDA. The display area DA and the non-display area NDA of the organic light emitting display panel DP may correspond to the display area DD-DA and the non-display area DD-NDA of the display device DD, respectively. The display area DA and the non-display area NDA of the organic light emitting display panel DP do not necessarily correspond to the display area DD-DA and the non-display area DD-NDA of the display device DD, respectively. For example, the display area DA and the non-display area NDA of the organic light emitting display panel DP may vary according to the structure / design of the organic light emitting display panel DP.

[0105] The organic light emitting display panel DP may include a plurality of signal lines SGL and a plurality of pixels PX. The area on which a plurality of pixels PX are disposed may be defined as the display area DA. In the current embodiment, the non-display area NDA may be defined along the edge of the display area DA and surround the display area DA.

[0106] The plurality of signal lines SGL include gate lines GL, data lines DL, power lines PL, and control signal lines CSL. The gate lines GL are connected to corresponding pixels among the plurality of pixels PX, and the data lines DL are respectively connected to corresponding pixels PX among the plurality of pixels PX. The power lines PL are connected to the plurality of pixels PX. A gate driving circuit DCV to which the gate lines GL are connected may be disposed on one side of the non-display area NDA. The control signal lines CSL may provide control signals to the gate driving circuit DCV.

[0107] A part of the gate line GL, data line DL, power line PL, and control signal line CSL may be disposed on the same layer, and other parts may be disposed on different layers from each other. When the signal lines disposed on one layer among the gate line GL, data line DL, power line PL, and control signal line CSL are defined as first signal lines, the signal lines disposed on a different layer may be defined as second signal lines. The signal lines disposed on yet another layer may be defined as third signal lines.

[0108] Each of the gate line GL, data line DL, power line PL, and control signal line CSL may include a signal line unit and a lower pad PD-D connected to an end of the signal line unit. The signal line unit may be defined as a part other than the lower pad PD-D of each of the gate line GL, data line DL, power line PL, and control signal line CSL.

[0109] In an embodiment of the inventive concept, the lower pad PD-D may include a lower display panel pad PD-DPD and a lower touch sensing member pad PD-TSD. The lower pad PD-D may be formed by the same process as the process for driving the transistor of the pixel PX. For example, the transistor for driving the pixel PX and the lower pad PD-D may be formed by the same low temperature polycrystalline silicon (LTPS) process or low temperature polycrystalline oxide (LTPO) process.

[0110] In an embodiment of the inventive concept, the lower display panel pad PD-DPD may include a control pad CSL-P, a data pad DL-P, and a power pad PL-P. Although a gate pad unit is not shown, the gate pad unit may be stacked with the gate driving circuit DCV and connected to the gate driving circuit DCV. Although not specifically shown, a part of the non-display area NDA on which the control pad CSL-P, data pad DL-P, and power pad PL-P are aligned is defined as a pad area. As described below, the pads of the touch sensing unit TS may be disposed adjacent to the pads of the organic light emitting display panel DP described above.

[0111] Figure 6 An example of the pixel PX connected to one gate line GL, one data line DL, and the power line PL is shown. However, the embodiment of the inventive concept is not limited to the configuration of the pixel PX. For example, the pixel PX may have various configurations.

[0112] The pixel PX includes an organic light-emitting diode OLED as a display device. The organic light-emitting diode OLED can be a top-emission diode or a bottom-emission diode. The pixel PX includes a first transistor TFT1 (or switching transistor), a second transistor TFT2 (or driving transistor), and a capacitor CP as circuit units for driving the organic light-emitting diode OLED. The organic light-emitting diode OLED generates light in response to electrical signals provided from the transistors TFT1 and TFT2. The cathode of the organic light-emitting diode OLED is connected to a second power supply voltage (ELVSS).

[0113] The gate line GL can be used to receive a first power supply voltage (ELVDD). The first transistor TFT1 outputs a data signal applied to the data line DL in response to a scan signal applied to the gate line GL. The capacitor CP is charged with a voltage corresponding to the data signal received from the first transistor TFT1.

[0114] The second transistor TFT2 is connected to the organic light-emitting diode OLED. The second transistor TFT2 controls the driving current flowing through the organic light-emitting diode OLED to correspond to the amount of electric charge stored in the capacitor CP. The organic light-emitting diode OLED emits light during the on period of the second transistor TFT2.

[0115] Figure 7 is a cross-sectional view of a portion corresponding to the first transistor TFT1 and the capacitor CP of the equivalent circuit of Figure 6 Figure 8 is a cross-sectional view of a portion corresponding to the second transistor TFT2 and the organic light-emitting diode OLED of the equivalent circuit of Figure 6

[0116] As shown in Figure 7 and Figure 8 The first circuit layer CL1 is disposed on the substrate layer SUB. The semiconductor pattern AL1 of the first transistor TFT1 (hereinafter referred to as the first semiconductor pattern) and the semiconductor pattern AL2 of the second transistor TFT2 (hereinafter referred to as the second semiconductor pattern) are disposed on the substrate layer SUB. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 can be selected from amorphous silicon, polysilicon, and metal oxide semiconductors. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 can be formed of the same material. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 can be formed of different materials.

[0117] The first circuit layer CL1 includes a first conductive pattern (see the reference numeral CDP1 in Figure 12 ), and organic / inorganic layers BR, BF, 12, 14, and 16. The first conductive pattern (see Figure 12The reference numeral CDP1) may include a first transistor TFT1, a second transistor TFT2, and electrodes E1 and E2. The organic / inorganic layers BR, BF, 12, 14, and 16 may include a first functional layer BR and BF, a first insulating layer 12, a second insulating layer 14, and a third insulating layer 16.

[0118] The first functional layer BR and BF may be disposed on one surface of the substrate layer SUB. The first functional layer BR and BF may include at least one of a barrier layer BR and a buffer layer BF. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 may be disposed on the barrier layer BR or the buffer layer BF.

[0119] The first insulating layer 12 covering the first semiconductor pattern AL1 and the second semiconductor pattern AL2 is disposed on the substrate layer SUB. The first insulating layer 12 includes an organic layer and / or an inorganic layer. Specifically, the first insulating layer 12 may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer and a silicon oxide layer.

[0120] The control electrode GE1 of the first transistor TFT1 (hereinafter referred to as the first control electrode) and the control electrode GE2 of the second transistor TFT2 (hereinafter referred to as the second control electrode) are disposed on the first insulating layer 12. The first electrode E1 of the capacitor CP is disposed on the first insulating layer 12. The first control electrode GE1, the second control electrode GE2, and the first electrode E1 may be manufactured by a photolithography process identical to that of the gate line GL (see Figure 5 )). That is, the first control electrode GE1, the second control electrode GE2, and the first electrode E1 may be formed of the same material as that of the gate line GL, have the same stack structure as that of the gate line GL, and be disposed on the same layer as the gate line GL.

[0121] The second insulating layer 14 covering the first control electrode GE1 and the second control electrode GE2 and the first electrode E1 is disposed on the first insulating layer 12. The second insulating layer 14 includes an organic layer and / or an inorganic layer. Specifically, the second insulating layer 14 may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer and a silicon oxide layer.

[0122] The data line DL (see Figure 5) may be disposed on the second insulating layer 14. The input electrode SE1 (hereinafter, referred to as the first input electrode) and the output electrode DE1 (hereinafter, referred to as the first output electrode) of the first transistor TFT1 are disposed on the second insulating layer 14. The input electrode SE2 (hereinafter, referred to as the second input electrode) and the output electrode DE2 (hereinafter, referred to as the second output electrode) of the second transistor TFT2 are disposed on the second insulating layer 14. The first input electrode SE1 branches from the corresponding data line of the data line DL. The power line PL (see Figure 5 ) may be disposed on the same layer as the data line DL. The second input electrode SE2 may branch from the power line PL.

[0123] The second electrode E2 of the capacitor CP is disposed on the second insulating layer 14. The second electrode E2 may be fabricated by the same photolithography process as each of the data line DL and the power line PL. Additionally, the second electrode E2 may be formed of the same material as each of the data line DL and the power line PL, have the same structure as each of the data line DL and the power line PL, and be disposed on the same layer as each of the data line DL and the power line PL.

[0124] The first input electrode SE1 and the first output electrode DE1 are connected to the first semiconductor pattern AL1 through a first through hole CH1 and a second through hole CH2 passing through the first insulating layer 12 and the second insulating layer 14, respectively. The first output electrode DE1 may be electrically connected to the first electrode E1. For example, the first output electrode DE1 may be connected to the first electrode E1 through a through hole (not shown) passing through the second insulating layer 14. The second input electrode SE2 and the second output electrode DE2 are connected to the second semiconductor pattern AL2 through a third through hole CH3 and a fourth through hole CH4 passing through the first insulating layer 12 and the second insulating layer 14, respectively. According to another embodiment of the inventive concept, each of the first transistor TFT1 and the second transistor TFT2 may have a bottom gate structure.

[0125] A third insulating layer 16 covering the first input electrode SE1, the first output electrode DE1, the second input electrode SE2, and the second output electrode DE2 is disposed on the second insulating layer 14. The third insulating layer 16 includes an organic layer and / or an inorganic layer. Specifically, the third insulating layer 16 may include an organic material to provide a flat surface.

[0126] One of the first insulating layer 12, the second insulating layer 14, and the third insulating layer 16 may be omitted according to the circuit structure of the pixel. Each of the second insulating layer 14 and the third insulating layer 16 may be defined as an interlayer dielectric layer. The interlayer dielectric layer may be disposed between the lower conductive pattern and the upper conductive pattern to insulate the conductive patterns from each other, the lower conductive pattern being disposed below the interlayer dielectric layer and the upper conductive pattern being disposed above the interlayer dielectric layer.

[0127] The first circuit layer CL1 includes dummy conductive patterns. The dummy conductive patterns are disposed on the same layer as the semiconductor patterns AL1 and AL2, the control electrodes GE1 and GE2, or the output electrodes DE1 and DE2. The dummy conductive patterns may be disposed on the non-display area NDA (see Figure 5 ). The dummy conductive patterns will be described in detail later.

[0128] The light-emitting device layer ELL is disposed on the third insulating layer 16. The pixel defining layer PXL and the organic light-emitting diode OLED are disposed on the third insulating layer 16. The anode AE is disposed on the third insulating layer 16. The anode AE is connected to the second output electrode DE2 through a fifth through hole CH5 passing through the third insulating layer 16. An opening OP is defined in the pixel defining layer PXL. At least a part of the anode AE is exposed through the opening OP of the pixel defining layer PXL.

[0129] The light-emitting device layer ELL may include a light-emitting region PXA and a non-light-emitting region NPXA adjacent to the light-emitting region PXA. The non-light-emitting region NPXA may surround the light-emitting region PXA. In the current embodiment, the light-emitting region PXA is defined to correspond to the anode AE. However, embodiments of the inventive concept are not limited to the light-emitting region PXA described above. That is, if light is emitted from a region, the region may be defined as the light-emitting region PXA. The light-emitting region PXA may be defined to correspond to a part of the anode AE exposed through the opening OP.

[0130] The hole control layer HCL may be commonly disposed on the light-emitting region PXA and the non-light-emitting region NPXA. Although not specifically shown, a common layer such as the hole control layer HCL may be commonly disposed on a plurality of pixels PX (see Figure 5 ).

[0131] The organic light-emitting layer EML is disposed on the hole control layer HCL. The organic light-emitting layer EML may be disposed to cover the opening OP. The adjacent organic light-emitting layers EML are electrically separated from each other.

[0132] The electron control layer ECL is disposed on the organic light-emitting layer EML. The cathode CE is disposed on the electron control layer ECL. The cathode CE is commonly disposed on a plurality of pixels PX.

[0133] Although the patterned organic light-emitting layer EML is shown as an example in the current embodiment, the organic light-emitting layer EML may be commonly disposed on a plurality of pixels PX. Here, the organic light-emitting layer EML may emit white light. In addition, the organic light-emitting layer EML may have a multi-layer structure.

[0134] In the present embodiment, the thin film encapsulation layer TFE directly covers the cathode CE. In the present embodiment, a cladding layer covering the cathode CE may also be provided. Here, the thin film encapsulation layer TFE directly covers the cladding layer. The thin film encapsulation layer TFE may include an organic layer including an organic material and an inorganic layer including an inorganic material.

[0135] Figure 9 is a plan view of the touch sensing unit TS according to an embodiment of the inventive concept.

[0136] In the present embodiment, a one-layer capacitive touch sensing member TS is shown as an example. The one-layer capacitive touch sensing member TS may be driven in a self-capacitance manner or a mutual-capacitance manner. However, the embodiments of the inventive concept are not limited to the driving method for obtaining coordinate information. In addition, the touch sensing member TS may not be limited to a one-layer structure. For example, the touch sensing member TS may have a two-layer structure.

[0137] The touch sensing member TS may include first touch patterns TE1-1 to TE-3, a first touch signal line SL1, second touch patterns TE2-1 to TE2-3, a second touch signal line SL2, and an upper pad PD-U on the touch sensing member pad.

[0138] Each of the first touch patterns TE1-1 to TE1-3 extends in a first direction DR1 and is arranged in a second direction DR2. Each of the first touch patterns TE1-1 to TE1-3 may have a grid shape defining a plurality of touch openings OP-TC.

[0139] Each of the first touch patterns TE1-1 to TE1-3 includes a plurality of first sensing patterns SP1 and a plurality of first connection patterns CP1. The first sensing patterns SP1 are arranged in the first direction DR1. Each of the first connection patterns CP1 connects two adjacent first sensing patterns SP1 arranged along the first direction DR1.

[0140] Each of the first touch signal lines SL1 may be connected to one end of the first touch patterns TE1-1 to TE1-3 and connected to a pad in the pad area. The first touch signal line SL1 may have the same layer structure as that of the first touch patterns TE1-1 to TE1-3.

[0141] The second touch patterns TE2-1 to TE2-3 are insulated from the first touch patterns TE1-1 to TE1-3 and cross the first touch patterns TE1-1 to TE1-3. The second touch patterns TE2-1 to TE2-3 are insulated from the first touch patterns TE1-1 to TE1-3 by an insulating pattern IL-P. The insulating pattern IL-P may include an inorganic material or an organic material. The inorganic material may include silicon oxide or silicon nitride. The organic material may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, and perylene resin.

[0142] Each of the second touch patterns TE2-1 to TE2-3 may have a grid shape defining a plurality of touch openings OP-TC.

[0143] Each of the second touch patterns TE2-1 to TE2-3 includes a plurality of second sensing patterns SP2 and a plurality of second connection patterns CP2. The second sensing patterns SP2 are arranged in a second direction DR2. Each of the second connection patterns CP2 connects two adjacent second sensing patterns SP2 arranged along the second direction DR2.

[0144] Each of the second connection patterns CP2 may have a bridging function. The insulating pattern IL-P is provided on the first connection pattern CP1, and the second connection pattern CP2 is provided on the insulating pattern IL-P.

[0145] Each of the second touch signal lines SL2 may also be connected to one end of the second touch patterns TE2-1 to TE2-3 and to a pad in the pad region. The second touch signal lines SL2 may have the same layer structure as the layer structure of the second touch patterns TE2-1 to TE2-3.

[0146] The first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 are capacitively coupled to each other. Since a touch sensing signal is applied to the first touch patterns TE1-1 to TE1-3, a capacitor is provided between the first sensing pattern SP1 and the second sensing pattern SP2.

[0147] The shapes of the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 may be merely examples, and thus, embodiments of the inventive concept are not limited thereto. For example, the connection patterns CP1 and CP2 may be defined as portions where the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 cross each other, and the sensing patterns SP1 and SP2 may be defined as portions where the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 do not overlap each other. For example, each of the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 may have a bar shape having a predetermined width.

[0148] The pad PD-U on the touch sensing member pad may be disposed at ends of the first touch signal line SL1 and the second touch signal line SL2. The pad PD-U on the touch sensing member pad may include an upper display panel pad PD-PDU and an upper touch sensing member pad PD-TSU. The pad PD-U on the touch sensing member pad may be formed by the same process as the processes of the first touch patterns TE1-1 to TE-3, the first touch signal line SL1, the second touch patterns TE2-1 to TE2-3, and the second touch signal line SL2.

[0149] Figure 10 Is Figure 9 An enlarged view of part AA. Figure 11 Is along Figure 10 A cross-sectional view taken along line I-I'.

[0150] The display area DA includes a plurality of emission areas PXA and a non-emission area NPXA surrounding the plurality of emission areas PXA. The first sensing pattern SP1 may have a grid shape overlapping with the non-emission area NPXA. Although not specifically shown, the second sensing pattern SP2 and the touch signal lines SL1 and SL2 may also have a grid shape overlapping with the non-emission area NPXA.

[0151] The first sensing pattern SP1 includes a plurality of vertical portions SP1-C extending in a first direction DR1 and a plurality of horizontal portions SP1-L extending in a second direction DR2. The plurality of vertical portions SP1-C and the plurality of horizontal portions SP1-L may be defined as grid lines. The grid lines may have a line width of several micrometers.

[0152] The plurality of vertical portions SP1-C and the plurality of horizontal portions SP1-L may be connected to each other to define a plurality of touch openings TS-OP. Although a structure in which the touch openings TS-OP correspond to the emission areas PXA one by one is shown, embodiments of the inventive concept are not limited thereto. One touch opening TS-OP may correspond to two or more emission areas PXA. AlthoughFigure 10 and Figure 11 shows grid lines exposed to the outside, but the display module DM (see Figure 4 ) may also include an insulating layer provided on the thin film encapsulation layer TFE to cover the grid lines.

[0153] Figure 12 is Figure 5 and Figure 9 views of the display panel pad PD-DP and the touch sensing member pad PD-TS. The display module DM may include an active area AR-ACV, a pad area AR-PD, and a boundary area AR-BD provided between the active area AR-ACV and the pad area AR-PD.

[0154] In the active area AR-ACV, the display module DM includes a first conductive pattern CDP1. In the pad area AR-PD, the display module DM includes a second conductive pattern CDP2. In the boundary area AR-BD, the display module DM includes a third conductive pattern CDP3. Each of the first conductive pattern CDP1 to the third conductive pattern CDP3 may include a metal as a pattern for conducting an electrical signal for driving the display panel DP or the touch sensing member TS.

[0155] The display panel pad PD-DP and the touch sensing member pad PD-TS may be provided adjacent to each other. Additionally, the display panel pad PD-DP and the touch sensing member pad PD-TS may be provided parallel to each other. However, embodiments of the inventive concept are not limited thereto. For example, if necessary, the display panel pad PD-DP and the touch sensing member pad PD-TS may be separated from each other but not provided parallel to each other.

[0156] Figure 13A is a cross-sectional view taken along line Figure 12 II-II'. Figure 13B is a cross-sectional view taken along line Figure 12 III-III'. Figure 13C is a cross-sectional view taken along line Figure 12 IV-IV'. Figures 13A to 13C shows an embodiment of the inventive concept.

[0157] Referring to Figure 13A showing the touch sensing member pad, the substrate layer SUB includes an active area AR-ACV, a pad area AR-PD, and a boundary area AR-BD provided between the active area AR-ACV and the pad area AR-PD.

[0158] In an active region AR-ACV, a pad region AR-PD, and a boundary region AR-BD according to an embodiment of the inventive concept, the active region AR-ACV may be a region including a light-emitting device layer ELL, the pad region AR-PD may be a region including a display panel pad PD-DP and a touch sensing member pad PD-TS to which signals are applied from a printed circuit board, and the boundary region AR-BD may be a region between the active region AR-ACV and the pad region AR-PD.

[0159] Circuit layers CL1 and CL2 are disposed on a substrate layer SUB. The circuit layers CL1 and CL2 include a first circuit layer CL1 and a second circuit layer CL2. The first circuit layer CL1 is disposed on the active region AR-ACV of the substrate layer SUB. The second circuit layer CL2 is disposed on the pad region AR-PD of the substrate layer SUB.

[0160] The light-emitting device layer ELL and a thin film encapsulation layer TFE are disposed on the first circuit layer CL1. The first circuit layer CL1 and the second circuit layer CL2 may each include a functional layer BR and BF. For convenience, among the functional layers BR and BF, the functional layer of the first circuit layer CL1 may be referred to as a first functional layer, and the functional layer of the second circuit layer CL2 may be referred to as a second functional layer.

[0161] Because Figure 7 and Figure 8 the first circuit layer CL1, the light-emitting device layer ELL, and the thin film encapsulation layer TFE are shown in

[0162] a touch sensing member TS may be disposed on the thin film encapsulation layer TFE. The touch sensing member TS includes a touch inorganic layer IL-T, an insulating pattern IL-P, a plurality of touch electrodes, and a touch protection layer PVX in a cross-section. Each of the touch inorganic layer IL-T and the insulating pattern IL-P may include an inorganic material. The touch protection layer PVX may include an organic material.

[0163] Referring to Figure 9 , the plurality of touch electrodes may form first touch patterns TE1-1 to TE1-3, a first touch signal line SL1, second touch patterns TE2-1 to TE2-3, and a second touch signal line SL2.

[0164] The second circuit layer CL2 may include a second conductive pattern CDP2 (see Figure 12 ) and organic / inorganic layers BR, BF, 12, 14, and 16. The second conductive pattern CDP2 may include the display panel pad PD-DP and the touch sensing member pad PD-TS. The organic / inorganic layers BR, BF, 12, 14, and 16 may include the second functional layers BR and BF, a first insulating layer 12, a second insulating layer 14, and a third insulating layer 16.

[0165] The display panel pad PD-DP can be disposed on the second functional layer and electrically connected to the first circuit layer CL1. At least one of the first insulating layer 12 and the second insulating layer 14 can be disposed between the display panel pad PD-DP and the second functional layer.

[0166] The display panel pad PD-DP can include a lower display panel pad PD-DPD and an upper display panel pad PD-DPU. The lower display panel pad PD-DPD is electrically connected to the first conductive pattern CDP1 through the third conductive pattern CDP3. The upper display panel pad PD-DPU is disposed on the lower display panel pad PD-DPD and electrically connected to the lower display panel pad PD-DPD. Accordingly, an electrical signal applied to the upper display panel pad PD-DPU is applied to the first conductive pattern CDP1 of the first circuit layer CL1 via the lower display panel pad PD-DPD.

[0167] The boundary layer BDL is disposed on the boundary region AR-BD of the substrate layer SUB. The boundary layer BDL can include an organic layer OG and a third conductive pattern CDP3. The organic layer OG can contact the top surface of the substrate layer SUB and is disposed between the first circuit layer CL1 and the second circuit layer CL2. More specifically, the organic layer OG can be disposed between the first functional layer and the second functional layer.

[0168] Different from the first circuit layer CL1 and the second circuit layer CL2, the boundary layer BDL may not include an inorganic layer containing an inorganic material. Accordingly, the flexibility of the boundary layer BDL can be improved, and a part of the display panel DP that overlaps with the boundary region AR-BD can be easily bent.

[0169] The organic layer OG can also be disposed on the third conductive pattern CDP3. The organic layer disposed on the third conductive pattern CDP3 can be formed by the same process as that of the third insulating layer 16 or the pixel defining layer PXL.

[0170] The third conductive pattern CDP3 can be formed by the same process as that of the lower display panel pad PD-DPD. However, embodiments of the inventive concept are not limited thereto. For example, the third conductive pattern CDP3 can be formed by a separate process to contact the lower display panel pad PD-DPD and then electrically connected to the lower display panel pad PD-DPD.

[0171] Refer to Figure 13B, the touch signal lines SL2 of the touch sensing member TS are electrically connected to the third conductive pattern CDP3 on the active region AR-ACV. The third conductive pattern CDP3 is electrically connected to the upper touch sensing member pad PD-TSU on the pad region AR-PD. Here, the third conductive pattern CDP3 may be electrically insulated from the lower touch sensing member pad PD-TSD.

[0172] Referring to Figure 9 and Figure 13B , the touch sensing member TS includes first touch patterns TE1-1 to TE1-3 and second touch patterns TE2-1 to TE2-3 provided on the active region AR-ACV, a touch sensing member pad PD-TS provided on the pad region AR-PD, and touch signal lines SL1 and SL2 that electrically connect the touch patterns TE1-1 to TE1-3 and TE2-1 to TE2-3 to the touch sensing member pad PD-TS.

[0173] The touch sensing member pad PD-TS may include a lower touch sensing member pad PD-TSD and an upper touch sensing member pad PD-TSU. The upper touch sensing member pad PD-TSU is electrically connected to the touch patterns TE1-1 to TE1-3 and TE2-1 to TE2-3 through the touch signal lines SL1 and SL2 and the third conductive pattern CDP3. That is, the upper touch sensing member pad PD-TSU is electrically connected to the sensing patterns SP1 and SP2 through the touch signal lines SL1 and SL2 and the third conductive pattern CDP3.

[0174] The lower touch sensing member pad PD-TSD may be electrically insulated from the upper touch sensing member pad PD-TSU. However, embodiments of the inventive concept are not limited thereto. According to another embodiment of the inventive concept, the lower touch sensing member pad PD-TSD may be electrically connected to the upper touch sensing member pad PD-TSU.

[0175] The upper touch sensing member pad PD-TSU is disposed on the lower touch sensing member pad PD-TSD. The upper touch sensing member pad PD-TSU may be disposed at a height increased by the thickness of the lower touch sensing member pad PD-TSD.

[0176] In Figure 13B , different from the third conductive pattern CDP3 of Figure 13A , the third conductive pattern CDP3 is not electrically connected to the first conductive pattern CDP1. However, embodiments of the inventive concept are not limited thereto. For example, if necessary, Figure 13B the third conductive pattern CDP3 and the first conductive pattern CDP1 of

[0177] In Figure 13B , because other components are the same as those of Figure 13AThe components are basically the same, so the description of the other components will be omitted.

[0178] The measured length HH1 from the substrate layer SUB to the upper display panel pad PD-DPU is substantially the same as the measured length HH2 from the substrate layer SUB to the upper touch sensing member pad PD-TSU.

[0179] Although not shown, in another embodiment of the inventive concept, at least one of the touch inorganic layer IL-T and the insulating pattern IL-P may be disposed on the boundary region AR-BD. That is, in this case, at least one of the touch inorganic layer IL-T and the insulating pattern IL-P may be disposed on the entire surface of the active region AR-ACV, the pad region AR-PD, and the boundary region AR-BD.

[0180] Referring to Figure 13C , the upper display panel pad PD-DPU and the upper touch sensing member pad PD-TSU may be disposed on the same layer. The upper display panel pad PD-DPU may be electrically connected to the lower display panel pad PD-DPD through the sixth through hole CH6. Although not shown, dummy electrodes may be disposed on the first insulating layer 12.

[0181] Therefore, in the process of attaching the printed circuit board to the display panel pad PD-DP and the touch sensing member pad PD-TS, since the display panel pad PD-DP and the touch sensing member pad PD-TS have the same height, the pressure applied to the pads PD-DP and PD-TS may be the same. Therefore, defects that occur in the process of attaching the printed circuit board can be prevented. In addition, the durability against stress applied from the outside can be improved according to the manipulation operation of the flexible display device DD.

[0182] Figure 14A is a cross-sectional view taken along the line II-II' of Figure 12 . Figure 14B is a cross-sectional view taken along the line III-III' of Figure 12 . Figure 14C and Figure 14D are cross-sectional views taken along the line IV-IV' of Figure 12 respectively. Figures 14A to 14C shows an embodiment of the inventive concept.

[0183] Referring to Figure 14A is substantially the same as the description referring to Figure 13A , so its description will be omitted.

[0184] Referring to Figure 14B and Figure 14C, the upper touch sensing member pad PD-TSU can be electrically connected to the lower touch sensing member pad PD-TSD through the seventh through hole CH7.

[0185] Figure 14D shows a state in which each of the sixth through hole CH6 and the seventh through hole CH7 has a width larger than the width of each of the through holes of Figure 14C .

[0186] The description of other components is substantially the same as that of the components of Figures 13A to 13C , so the description thereof will be omitted.

[0187] Figure 15A is a cross-sectional view taken along the line II-II' of Figure 12 . Figure 15B is a cross-sectional view taken along the line III-III' of Figure 12 . Figure 15C is a cross-sectional view taken along the line IV-IV' of Figure 12 . Figures 15A to 15C shows an embodiment of the inventive concept.

[0188] Referring to Figure 15A and Figure 15C , the upper display panel pad PD-DPU contacts the lower display panel pad PD-DPD. Referring to Figure 15B and Figure 15C , the upper touch sensing member pad PD-TSU contacts the lower touch sensing member pad PD-TSD.

[0189] The description of other components is substantially the same as that of the components of Figures 13A to 13C , so the description thereof will be omitted.

[0190] Figure 16A is a cross-sectional view taken along the line II-II' of Figure 12 . Figure 16B is a cross-sectional view taken along the line III-III' of Figure 12 . Figure 16C is a cross-sectional view taken along the line IV-IV' of Figure 12 . Figures 16A to 16C shows an embodiment of the inventive concept.

[0191] Different from the third conductive pattern CDP3 described above, Figure 16A and Figure 16B The third conductive pattern CDP3 is electrically connected to the first conductive pattern CDP1 through the electrode GE3, and the electrode GE3 is formed by the same process as the control electrodes GE1 and GE2.

[0192] Regarding Figure 16A and Figure 16B The description of other components is the same as that ofFigure 13A and Figure 13B The description of the components is substantially the same, so its description will be omitted. Refer to Figure 16C The description of Figure 13C is substantially the same as the description referred to

[0193] Figure 17A is a cross-sectional view taken along line II-II' of Figure 12 . Figure 17B is a cross-sectional view taken along line III-III' of Figure 12 . Figure 17C and Figure 17D are cross-sectional views taken along line IV-IV' of Figure 12 . Figures 17A to 17D shows an embodiment of the inventive concept.

[0194] Figure 17A and Figure 17B The third conductive pattern CDP3 of

[0195] Regarding Figure 17A and Figure 17B The description of the other components is substantially the same as that of the components of Figure 14A and Figure 14B so its description will be omitted. Refer to Figure 17C and Figure 17D The description of Figure 14C and 14D is substantially the same as the description referred to

[0196] Figure 18A is a cross-sectional view taken along line II-II' of Figure 12 . Figure 18B is a cross-sectional view taken along line III-III' of Figure 12 . Figure 18C is a cross-sectional view taken along line IV-IV' of Figure 12 . Figures 18A to 18C shows an embodiment of the inventive concept.

[0197] Figure 18A and Figure 18B The third conductive pattern CDP3 of

[0198] Regarding Figure 18A and Figure 18B The description of the other components is substantially the same as that of the components of Figure 15A and Figure 15BThe descriptions of the components are substantially the same, so their descriptions will be omitted. Regarding Figure 18C The description of Figure 15C is substantially the same as the description of

[0199] Figure 19A is a cross-sectional view taken along line II-II' of Figure 12 . Figure 19B is a cross-sectional view taken along line III-III' of Figure 12 . Figure 19C is a cross-sectional view taken along line IV-IV' of Figure 12 . Figures 19A to 19C shows an embodiment of the inventive concept.

[0200] Referring to Figure 19A and Figure 19C , the display panel pad PD-DP has a single-layer structure. Referring to Figure 19B and 19C , the touch sensing member pad PD-TS has a single-layer structure.

[0201] The descriptions of the other components are substantially the same as the descriptions of the components of Figures 13A to 13C , so their descriptions will be omitted.

[0202] Figure 20A is a cross-sectional view taken along line II-II' of Figure 12 . Figure 20B is a cross-sectional view taken along line III-III' of Figure 12 . Figure 20C is a cross-sectional view taken along line IV-IV' of Figure 12 . Figures 20A to 20C shows an embodiment of the inventive concept.

[0203] Referring to Figure 20A and Figure 20C , the display panel pad PD-DP has a single-layer structure. Referring to Figure 20B and Figure 20C , the touch sensing member pad PD-TS has a single-layer structure.

[0204] The descriptions of the other components are substantially the same as the descriptions of the components of Figures 13A to 13C , so their descriptions will be omitted.

[0205] As shown in Figures 19A to 19C and Figures 20A to 20C according to an embodiment of the inventive concept, since the display panel pad PD-DP and the touch sensing member pad PD-TS are provided at the same height and have a single-layer structure, defects that may occur in the manufacturing process can be reduced.

[0206] Figure 21A is a cross-sectional view taken alongFigure 12 A cross-sectional view taken along line II-II'. Figure 21B is a cross-sectional view taken along Figure 12 line III-III'. Figure 21C is a cross-sectional view taken along ​ line IV-IV'. ​ illustrates an embodiment of the inventive concept.

[0207] The second conductive pattern CDP2 may include dummy electrodes ET-D, display panel pads PD-DP, and touch sensing member pads PD-TS.

[0208] The dummy electrode ET-D may include the same material as that of the control electrode GE2 of the first circuit layer CL1. The dummy electrode ET-D may be formed by the same process as that of the control electrode GE2. The dummy electrode ET-D may be insulated from other electrodes and perform a function of adjusting the height of the display panel pad PD-DP on the pad area AR-PD.

[0209] The description of other components is substantially the same as that of the components in ​ and thus the description thereof will be omitted.

[0210] ​ and ​ illustrate a display module DM, a printed circuit board PCB, and a PCB-1 according to an embodiment of the inventive concept.

[0211] Referring to ​ , the pads PD-TS and PD-DP of the display module DM are electrically connected to the pad PD-PCB of the printed circuit board PCB. An integrated circuit DIC may be disposed on the printed circuit board PCB. The integrated circuit DIC may be formed in a chip on flexible printed circuit (COF) manner. The integrated circuit DIC may transmit data information to / from the display module DM through the pads PD-PCB, PD-TS, and PD-DP.

[0212] Referring to ​ , the integrated circuit DIC-1 may be disposed on the pad area AR-PD of the display module DM. Here, the integrated circuit DIC-1 may be formed in a chip on plastic (COP) manner.

[0213] Although the touch signal lines SL1 and SL2 are not connected to the integrated circuit DIC-1 in Figure 23 , the embodiment of the inventive concept is not limited thereto. In the embodiment of the inventive concept, each of the touch signal lines SL1 and SL2 may have a structure connected to the integrated circuit DIC-1.

[0214] Figure 24Shows the bent shape of the display module DM according to an embodiment of the inventive concept. Referring to Figure 24 , the display module DM may be bent in the boundary region AR-BD. As described above, the boundary region AR-BD of the display module DM may not include an inorganic material layer, but may include only an organic material layer. Accordingly, the boundary region AR-BD may have sufficient flexibility to be bent.

[0215] According to an embodiment of the inventive concept, the pad unit of the display panel and the pad unit of the touch sensing member may be disposed at the same height.

[0216] According to an embodiment of the inventive concept, the bent portion of the display panel may have improved flexibility.

[0217] It will be apparent to those skilled in the art that various modifications and variations can be made to the inventive concept. Accordingly, the present disclosure is intended to cover modifications and variations of the present invention provided that they fall within the scope of the appended claims and their equivalents. Thus, to the fullest extent permitted by law, the scope of the present invention will be determined by the broadest permissible interpretation of the claims and their equivalents and shall not be restricted or limited by the foregoing detailed description.

Claims

1. A display device, the display device comprising: A display panel, comprising a substrate layer, a circuit layer disposed on the substrate layer, a display device layer disposed on the circuit layer, and an encapsulation layer disposed on the display device layer; And A touch sensing member, directly disposed on the encapsulation layer, and comprising a conductive pattern and a first insulating layer, the first insulating layer being stacked with the conductive pattern and disposed on the encapsulation layer, Wherein, the circuit layer comprises: a first lower pad, electrically connected to the display device layer, and disposed on the substrate layer; a second lower pad, spaced apart from the first lower pad in a plan view and disposed on the substrate layer; a first upper pad, disposed on the first lower pad; a second upper pad, electrically connected to the conductive pattern, and disposed on the second lower pad; and a second insulating layer, disposed between the first lower pad and the first upper pad and between the second lower pad and the second upper pad, Wherein, the first upper pad is electrically connected to the first lower pad.

2. The display device according to claim 1, wherein, The first lower pad is electrically connected to the first upper pad through a first contact hole defined in the second insulating layer, and Wherein, the second lower pad is electrically connected to the second upper pad through a second contact hole defined in the second insulating layer.

3. The display device according to claim 1, wherein, The first lower pad and the second lower pad are disposed on the same layer, and the first upper pad and the second upper pad are disposed on the same layer.

4. The display device according to claim 1, wherein, The second lower pad is electrically insulated from the second upper pad.

5. The display device according to claim 1, wherein, The first insulating layer and the second insulating layer are directly disposed on the encapsulation layer and the substrate layer through the same process.

6. The display device according to claim 5, wherein, The first insulating layer and the second insulating layer form a single integral body.

7. The display device according to claim 5, wherein, The first upper pad and the second upper pad are disposed on the second insulating layer through the same process as the process of the conductive pattern.

8. The display device according to claim 1, wherein, The distance between the substrate layer and the first upper pad in the thickness direction of the display panel is equal to the distance between the substrate layer and the second upper pad in the thickness direction.

9. The display device according to claim 1, wherein, A display area and a pad area are defined in the display panel, and Wherein, the first lower pad, the second lower pad, the first upper pad and the second upper pad are stacked with the pad area.

10. The display device according to claim 9, wherein, A bending area is further defined in the substrate layer, Wherein, the bending area is stacked with the area between the display area and the pad area and is bent about a bending axis, and Wherein, the first insulating layer and the second insulating layer are not stacked with the bending area.

11. The display device according to claim 10, wherein, The circuit layer further comprises an organic layer stacked with the bending area and disposed on the substrate layer, and Wherein, the organic layer is directly disposed on the substrate layer.

12. The display device according to claim 1, wherein, The display panel further comprises an integrated circuit electrically connected to the circuit layer and disposed on the substrate layer, and Wherein, the integrated circuit is not stacked with the first lower pad, the second lower pad, the first upper pad and the second upper pad.

13. The display device according to claim 1, wherein, The conductive pattern comprises a touch pattern, wherein, the first insulating layer comprises an insulating pattern and a touch inorganic layer, and Among them, the second insulating layer is disposed on the substrate layer by the same process as that of one of the insulating pattern and the touch inorganic layer.

14. The display device according to claim 1, wherein, The circuit layer further includes a transistor, the transistor is disposed on the substrate layer and includes a first electrode, a second electrode and a control electrode, and Among them, the first electrode, the second electrode, the first lower pad and the second lower pad are disposed on the same layer.

15. The display device according to claim 1, wherein, The touch sensing member further includes a sensing signal line electrically connecting the second upper pad and the conductive pattern.

16. A display device, the display device comprising: A display panel, including a substrate layer, a plurality of pads disposed on the substrate layer, an integrated circuit disposed on the substrate layer, a light emitting device disposed on the substrate layer, and an encapsulation layer encapsulating the light emitting device; And A touch sensing member, directly disposed on the encapsulation layer, and including a conductive pattern and an insulating layer, the insulating layer being stacked with the conductive pattern and disposed on the encapsulation layer, Among them, the plurality of pads are arranged in one direction and include display panel pads and touch sensing member pads, the touch sensing member pads are spaced apart from each other in the one direction and the display panel pads are disposed between the touch sensing member pads, Among them, each of the display panel pads includes a first lower pad disposed on the substrate layer and a first upper pad disposed on the first lower pad, Among them, each of the touch sensing member pads includes a second lower pad spaced apart from the first lower pad in a plan view and a second upper pad disposed on the second lower pad, and Among them, the insulating layer is disposed between the first lower pad and the first upper pad and between the second lower pad and the second upper pad, and the first upper pad is electrically connected to the first lower pad.

17. The display device according to claim 16, the display device further includes a circuit board electrically connected to the plurality of pads, Among them, The circuit board is connected to the display panel pads and the sensing member pads by the same process.

18. The display device according to claim 16, wherein, A display area and a pad area are defined in the display panel, the display area is stacked with the light emitting device, and the pad area is stacked with the integrated circuit, and Among them, the integrated circuit is closer to the display area than the plurality of pads.

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