Apparatus for processing a substrate

Abstract

An embodiment of the present invention provides an apparatus for processing a substrate. The apparatus includes: a processing container having an internal space; a support unit configured to support and rotate the substrate within the internal space; a liquid supply unit configured to supply processing liquid to the substrate supported by the support unit; and an exhaust unit configured to exhaust airflow from the internal space, wherein the exhaust unit includes an airflow guide pipe having an inlet configured to introduce airflow into the airflow guide pipe in a tangential direction to the rotational direction of the substrate supported on the support unit.

Description

Technical Field

[0001] The embodiments of the inventive concept described herein relate to an apparatus for processing a substrate, and more specifically, to an apparatus for processing a substrate by supplying liquid onto a rotating substrate. Background Technology

[0002] Various processes, such as photolithography, etching, ashing, thin film deposition, and cleaning, are performed to manufacture semiconductor devices or flat panel display panels. Among these processes, photolithography includes supplying photoresist to a semiconductor substrate to form a photoresist film on the substrate surface, exposing the photoresist film using a photomask, and then supplying a developer to selectively remove portions of the photoresist film. These processes are carried out in a processing chamber.

[0003] Figure 1 This is a schematic diagram illustrating a substrate processing apparatus 1 used to apply photoresist onto a substrate. (Reference) Figure 1 The substrate processing apparatus 1 includes a processing container 10 having an internal space, a support unit 20 for supporting the substrate W in the internal space, and a processing liquid 82 (see [reference]). Figure 3 The air is supplied to nozzles 30 on the substrate W placed on the support unit 20. The processing container 10 has an outer cup 12 and an inner cup 14. In addition, a fan filter unit (not shown) for supplying downward airflow into the internal space is provided above the processing container 10, and a drain pipe 60 for discharging the processing liquid and an exhaust pipe 70 for discharging the atmosphere are connected to the lower region of the internal space.

[0004] When have Figure 1 The substrate processing apparatus 1 with the structure shown processes the substrate W by simultaneously supplying processing liquid to the rotating substrate W. Under the action of centrifugal force, the airflow on the surface of the substrate W flows from the center to the edge of the substrate W along the rotation direction of the substrate W. Figure 2 As shown. Afterwards, as... Figure 3 As shown, the airflow flows downwards after colliding with the outer cup 12 and is discharged from the internal space to the outside through the exhaust pipe 70. As the airflow direction changes from horizontal to vertical, the airflow collides with the outer cup 12, generating vortices at the point of collision. The airflow stagnates at the point where the vortex is generated, thus preventing smooth discharge from the internal space. This problem is further exacerbated as the rotational speed of the substrate W increases.

[0005] When a film of the processing liquid is formed on substrate W, eddies and stagnant airflow at the collision point impede airflow above the edge region of substrate W. Therefore, the film thickness at the edge region of substrate W is greater than the film thickness in the central region of substrate W. Furthermore, due to the eddies at the collision point, contaminants such as fumes flow back onto substrate W, thus contaminating it. Summary of the Invention

[0006] The present invention provides a substrate processing apparatus for improving the efficiency of substrate processing.

[0007] An embodiment of the present invention provides a substrate processing apparatus for smoothly discharging airflow in a processing space while processing a substrate by supplying a processing liquid to a rotating substrate in a processing space.

[0008] An embodiment of the present invention provides a substrate processing apparatus for forming a liquid film of uniform thickness over a whole area of ​​a substrate by supplying a processing liquid onto a rotating substrate.

[0009] Embodiments of the present invention provide a substrate processing apparatus for preventing contaminants from re-adsorbing onto a substrate when processing the substrate by supplying a processing liquid onto a rotating substrate.

[0010] The technical problems to be solved by the present invention are not limited to those described above. Those skilled in the art will clearly understand from the following description any other technical problems not mentioned herein.

[0011] An embodiment of the present invention provides a substrate processing apparatus.

[0012] The apparatus includes: a processing container having an internal space; a support unit configured to support and rotate a substrate within the internal space; a liquid supply unit configured to supply processing liquid to the substrate supported by the support unit; and an exhaust unit configured to exhaust airflow from the internal space, wherein the exhaust unit includes an airflow guide pipe having an inlet configured to introduce airflow into the airflow guide pipe in a tangential direction to the rotational direction of the substrate supported on the support unit.

[0013] In one embodiment, multiple airflow guides are provided, spaced apart from each other along the circumferential direction of the substrate supported by the support unit.

[0014] In one embodiment, the processing container includes an outer cup surrounding a substrate supported by a support unit, and an airflow guide tube is mounted on the inner wall of the outer cup.

[0015] In one embodiment, the support unit includes: a support plate configured to support a base plate; a rotation shaft configured to rotate the support plate; and an actuator coupled to the rotation shaft and configured to provide torque to the rotation shaft, wherein the processing container includes: an outer cup configured to provide an internal space; and an inner cup disposed in the internal space, spaced apart from the outer cup and configured to surround the rotation shaft or the actuator, and wherein an airflow guide is disposed between the outer cup and the inner cup.

[0016] In one embodiment, the length of the airflow guide tube extends vertically.

[0017] In one embodiment, the length of the airflow guide tube includes an upper wall and a side wall, wherein the upper wall serves as a blocking surface, and in the side wall, the inlet is located in a wall facing a direction parallel to the tangent of the substrate supported by the support unit, and the remaining surface can serve as a blocking surface.

[0018] In one embodiment, the inner cup defines an exhaust space below the support plate, and the exhaust unit also includes a separate exhaust pipe for discharging the airflow introduced into the exhaust space to the outside of the inner space.

[0019] In one embodiment, the exhaust unit further includes an integrated exhaust pipe located outside the processing container and equipped with pressure control elements, and separate exhaust pipes and airflow guide pipes connected to the integrated exhaust pipe.

[0020] In one embodiment, the airflow guide tube includes an upper wall and a side wall, and the side wall includes: a first side surface adjacent to the inner surface of the outer cup; a second side surface adjacent to the substrate placed on the support unit; and a third side surface in a tangential direction toward the rotation direction of the substrate, with an inlet formed on the third side surface.

[0021] In one embodiment, as the second side moves away from the inlet, the distance between the second side and the axis of rotation of the support unit increases.

[0022] In one embodiment, the substrate processing apparatus further includes a liquid supply nozzle for supplying photoresist to the substrate supported by the support unit.

[0023] A substrate processing apparatus according to another aspect of the present invention is provided.

[0024] The apparatus includes: a processing container having an internal space; a support unit configured to support and rotate a substrate within the internal space; a liquid supply unit configured to supply processing liquid to the substrate supported by the support unit; and an exhaust unit configured to exhaust airflow from the internal space, wherein the exhaust unit includes: an exhaust pipe for discharging airflow along a first path through a space between the inner wall of the processing container and the substrate supported on the support plate to the outside of the processing container, the first path being a path flowing into an exhaust space located below the support plate within the internal space; and an airflow guide pipe located within the internal space and guiding the airflow to a second path, the second path being a path tangential to the rotational direction of the substrate supported by the support unit.

[0025] In one embodiment, the support unit includes: a rotating shaft configured to rotate a support plate; and an actuator coupled to the rotating shaft and configured to provide torque to the rotating shaft, wherein the processing container includes: an outer cup configured to provide an internal space; and an inner cup disposed in the internal space, spaced apart from the outer cup and configured to surround the rotating shaft or the actuator, and wherein an airflow guide is disposed between the outer cup and the inner cup.

[0026] In one embodiment, the exhaust unit further includes an integrated exhaust pipe located outside the processing container and equipped with a pressure control element, and an airflow guide pipe connected to the integrated exhaust pipe.

[0027] In one embodiment, the integrated exhaust pipe includes: an airflow inlet through which airflow released from an airflow guide pipe is introduced; an airflow outlet through which the airflow introduced into the airflow inlet is discharged to the outside; and a gas-liquid separator for separating airflow and processing liquid from the airflow introduced into the airflow inlet, wherein the gas-liquid separator is configured to protrude from the bottom surface of the airflow inlet and spaced apart from the upper surface of the airflow inlet.

[0028] In one embodiment, the airflow guide tube includes an upper wall and a side wall, and an inlet formed in the side wall to introduce airflow in a tangential direction to the rotational direction of the substrate supported by the support unit, and the side wall includes: a first side surface adjacent to the inner surface of the outer cup; a second side surface adjacent to the substrate placed on the support unit; and a third side surface between the first and second side surfaces, the third side surface defining a generally flat plane oriented in the radial direction of the substrate placed on the support unit, and the inlet is formed in the third side surface.

[0029] In one embodiment, as the second side moves away from the inlet, the distance between the second side and the axis of rotation of the support unit increases.

[0030] A substrate processing apparatus according to another aspect of the present invention is provided.

[0031] The device includes: a processing container having an internal space; a support unit configured to support and rotate a substrate within the internal space; a liquid supply unit configured to supply processing liquid to the substrate supported by the support unit; and an exhaust unit configured to exhaust airflow from the internal space, wherein the exhaust unit includes an airflow guide pipe having an inlet configured to introduce airflow in a tangential direction to the direction of rotation of the substrate supported on the support unit, and the support unit includes: a rotation shaft for rotating a support plate; an actuator coupled to the rotation shaft and configured to provide torque to the rotation shaft, and the processing container includes: an outer cup configured to provide the internal space; and an inner cup disposed within the internal space space spaced apart from the outer cup and configured to surround the rotation shaft or the actuator, wherein the airflow guide pipe is disposed between the outer cup and the inner cup.

[0032] In one embodiment, the exhaust unit further includes an exhaust pipe for guiding and releasing airflow in a path different from the path in the tangential direction of the substrate, and the exhaust pipe is positioned closer to the inner cup than the airflow guide pipe. The exhaust pipe releases the airflow flowing into the exhaust space located below the support plate in the internal space to the outside of the processing container through the space between the inner wall of the processing container and the substrate supported on the support plate.

[0033] In one embodiment, the airflow guide tube includes an upper wall and a plurality of side walls, and an inlet through which an airflow is directed to flow in a tangential direction in the rotational direction of the substrate is formed on the side surfaces of the plurality of side walls in the tangential direction in the rotational direction of the substrate.

[0034] According to an embodiment of the present invention, a processing liquid is supplied to a substrate rotating within the internal space of a processing container to smoothly expel airflow from the internal space during substrate processing.

[0035] Furthermore, according to embodiments of the present invention, when a processing liquid is supplied to a rotating substrate to form a liquid film on the substrate, the thickness of the liquid film can be uniformly formed over the entire area of ​​the substrate.

[0036] Furthermore, according to embodiments of the present invention, when a substrate is processed by supplying a processing liquid to a rotating substrate, contaminants can be prevented from re-adhering to the substrate.

[0037] The effects of this invention are not limited to those described above; those skilled in the art will clearly understand any effects not mentioned based on this specification and the accompanying drawings. Attached Figure Description

[0038] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, wherein, unless otherwise stated, the same reference numerals in the various drawings refer to the same parts, and wherein:

[0039] Figure 1 This is a cross-sectional view showing a substrate processing apparatus having an overall structure that performs liquid processing on a substrate while rotating it.

[0040] Figure 2 It is shown Figure 1 A plan view of the airflow direction on the substrate surface in a substrate processing apparatus.

[0041] Figure 3 It is shown Figure 1 A cross-sectional view of the airflow in the substrate processing apparatus;

[0042] Figure 4 This is a schematic perspective view illustrating a substrate processing apparatus according to an embodiment of the concept of the present invention;

[0043] Figure 5 It is shown Figure 4 A cross-sectional view of the substrate processing apparatus for the coating block and the developing block;

[0044] Figure 6 yes Figure 1 A plan view of the substrate processing apparatus;

[0045] Figure 7 It is shown Figure 6 A schematic plan view of the conveying robot arm;

[0046] Figure 8 It is shown Figure 6 A schematic floor plan of an example heat treatment chamber;

[0047] Figure 9 yes Figure 6 Front view of the heat treatment chamber;

[0048] Figure 10 This is a schematic cross-sectional view illustrating the structure of a substrate processing apparatus for processing a substrate by supplying liquid onto a rotating substrate, according to an embodiment of the present invention.

[0049] Figure 11 yes Figure 10 A perspective view of the substrate processing apparatus;

[0050] Figure 12 yes Figure 10 A schematic three-dimensional diagram of the structure of the exhaust unit;

[0051] Figure 13 and Figure 14 It shows when passing Figure 11 Cross-sectional view and three-dimensional view of the flow path of airflow and processing liquid when the device performs liquid processing on the substrate;

[0052] Figure 15This is a schematic cross-sectional view showing the structure of a substrate processing apparatus that processes a substrate by supplying liquid to a rotating substrate according to a second embodiment of the present invention.

[0053] Figure 16 yes Figure 15 A three-dimensional cross-sectional view of the device;

[0054] Figure 17 It is shown Figure 15 A schematic perspective view of the structure of the exhaust unit in the device;

[0055] Figure 18 and Figure 19 It shows when passing Figure 15 A cross-sectional view of the flow path of the airflow and the processing liquid when the device performs liquid processing on the substrate. Detailed Implementation

[0056] The inventive concept can be modified in various ways and can take many forms, and its specific embodiments will be shown and described in detail in the accompanying drawings. However, the embodiments according to the inventive concept are not intended to limit the specific forms disclosed, and it should be understood that the inventive concept includes all variations, equivalents, and substitutions contained within the spirit and technical scope of the inventive concept. In the description of the inventive concept, detailed descriptions of relevant known technologies may be omitted where such descriptions may obscure the essence of the inventive concept.

[0057] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the inventive concept. As used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It will be further understood that, when used in this specification, the terms “comprising” and / or “including” specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Furthermore, the term “exemplary” is intended to refer to an example or illustration.

[0058] It should be understood that although the terms "first," "second," "third," etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or portion from another region, layer, or portion. Therefore, without departing from the teachings of the inventive concept, the first element, component, region, layer, or portion discussed below may be referred to as the second element, component, region, layer, or portion.

[0059] The apparatus of the exemplary embodiments can be used to perform photolithography processes on a circular substrate. In particular, the apparatus of the exemplary embodiments can be connected to an exposure apparatus and can be used to perform coating and developing processes on the substrate. However, the spirit and scope of the inventive concept are not limited thereto, and the apparatus can be used to perform various types of processes of supplying processing liquid to the substrate while rotating the substrate. In the following description, the use of a wafer as a substrate will be illustrated by way of example.

[0060] In the following text, reference will be made to Figures 4 to 14 Description of embodiments of the present invention.

[0061] Figure 4 This is a schematic perspective view illustrating a substrate processing apparatus according to an embodiment of the present invention. Figure 5 It is shown Figure 4 A cross-sectional view of a substrate processing apparatus for coating blocks and developing blocks. Figure 6 yes Figure 5 A plan view of the substrate processing apparatus.

[0062] refer to Figures 4 to 6 According to an embodiment of the present invention, a substrate processing apparatus 10 includes a transposition module 100, a processing module 300, and an interface module 500. According to one embodiment, the transposition module 100, the processing module 300, and the interface module 500 are arranged in a row. Hereinafter, the arrangement direction of the transposition module 100, the processing module 300, and the interface module 500 will be referred to as a first direction 12, the direction perpendicular to the first direction 12 when viewed from above will be referred to as a second direction 14, and the direction perpendicular to both the first direction 12 and the second direction 14 will be referred to as a third direction 16.

[0063] The transposition module 100 transfers the substrate W from the container F containing the substrate W to the processing module 300, and retrieves the processed substrate W from the processing module 300 and stores it in the container F. The transposition module 100 is configured to extend its length along a second direction 14. The transposition module 100 has a loading port 110 and a transposition frame 130. The transposition frame 130 is positioned between the loading port 110 and the processing module 300. The container F containing the substrate is positioned at the loading port 110. Multiple loading ports 110 can be provided, and multiple loading ports 110 can be positioned along the second direction 14.

[0064] For container F, a closed container such as a front-opening unified pod (FOUP) can be used. Container F can be placed on loading port 110 by a conveying device (not shown) such as an overhead conveyor, overhead conveyor or automated guided vehicle, or container F can be placed on loading port 110 by an operator.

[0065] A sorting robot 132 is disposed inside a sorting frame 130. Within the sorting frame 130, a guide rail 136 extends along a second direction 14, and the sorting robot 132 is configured to move 136 along the guide rail. The sorting robot 132 includes a hand on which a substrate W is placed, and the hand is configured to move forward and backward, rotate about a third direction, and move along a third direction 16.

[0066] The processing module 300 can perform coating and developing processes on the substrate W. The processing module 300 can receive the substrate W stored in the container F and perform substrate processing processes. The processing module 300 has coating blocks 300a and developing blocks 300b. The coating blocks 300a perform the coating process on the substrate W, and the developing blocks 300b perform the developing process on the substrate W. Multiple coating blocks 300a are provided, and the multiple coating blocks 300a are stacked on top of each other. Multiple developing blocks 300b are provided, and the multiple developing blocks 300b are stacked on top of each other. Figure 4 In one embodiment, two coating blocks 300a and two developing blocks 300b are provided. The coating blocks 300a may be positioned below the developing blocks 300b. In one embodiment, the two coating blocks 300a may perform the same process and may have the same structural arrangement. Furthermore, the two developing blocks 300b may perform the same process and may have the same structure.

[0067] refer to Figure 6 Each coating block 300a includes a heat treatment chamber 320, a transfer chamber 350, a liquid treatment chamber 360, and buffer chambers 312 and 316. The heat treatment chamber 320 may be a cavity for performing heat treatment processes on the substrate W. The heat treatment processes may include cooling and heating processes. The liquid treatment chamber 360 supplies liquid onto the substrate W to form a liquid layer. The liquid layer may be a photoresist film or an anti-reflective film. The transfer chamber 350 transfers the substrate W between the heat treatment chamber 320 and the liquid treatment chamber 360 within the coating block 300a.

[0068] A transfer chamber 350 is configured such that its length is parallel to the first direction 12. A transfer robot 352 is disposed within the transfer chamber 350. The transfer robot 352 transfers substrates in a heat treatment chamber 320, a liquid treatment chamber 360, and buffer chambers 312 and 316. In one embodiment, the transfer robot 352 has a hand on which a substrate W is placed, and the hand may be configured to be movable forward and backward, rotatable about a third direction 16 as an axis, and movable along the third direction 16. A guide rail 356 is disposed within the transfer chamber 350, its length being parallel to the first direction 12, and the transfer robot 352 may be configured to be movable on the guide rail 356.

[0069] Figure 7 This is a view showing an example of the hand of a transfer robot. (Reference) Figure 7 The hand portion of the conveying robot 352 has a base 352a and support protrusions 352b. The base 352a may have an annular shape, with its circumference partially cut off. The inner diameter of the base 352a is larger than the diameter of the substrate W. The support protrusions 352b extend inward from the base 352a. The support protrusions 352 support the edge region of the substrate W. According to one embodiment, the four support protrusions 352 may be configured as equally spaced portions.

[0070] Multiple heat treatment chambers 320 are provided. The heat treatment chambers 320 are arranged along the first direction 12. The heat treatment chambers 320 are placed on one side of the transfer chamber 350.

[0071] Figure 8 It is shown Figure 6 A schematic floor plan of an example heat treatment chamber, and Figure 9 yes Figure 8 Front view of the heat treatment chamber.

[0072] refer to Figure 8 and Figure 9 The heat treatment chamber 320 has an outer shell 321, a cooling unit 322, a heating unit 323, and a conveyor plate 324.

[0073] The outer casing 321 is configured in a generally cuboid shape. An entrance (not shown) is provided on the side wall of the outer casing 321, through which the substrate W enters and exits. The entrance may remain open. Alternatively, a door (not shown) may be provided to open and close the entrance. A cooling unit 322, a heating unit 323, and a conveyor plate 324 are disposed within the casing 321. The cooling unit 322 and the heating unit 323 are arranged side by side along the second direction 14. In one embodiment, the cooling unit 322 may be placed closer to the conveyor chamber 350 than the heating unit 323.

[0074] The cooling unit 322 has a cooling plate 322a. When viewed from above, the cooling plate 322a may have a generally circular shape. The cooling plate 322a is provided with a cooling member 322b. In one embodiment, the cooling member 322b is formed inside the cooling plate 322a and may be configured as a path through which the cooling fluid flows.

[0075] The heating unit 323 includes a heating plate 323a, a cover 323c, and a heater 323b. When viewed from above, the heating plate 323a has a generally circular shape. The heating plate 323a has a diameter larger than that of the substrate W. The heating plate 323a is equipped with the heater 323b. The heater 323b can be implemented using a resistance heating element to which current is applied. The heating plate 323a is provided with lifting pins 323e that can move vertically along a third direction 16. The lifting pins 323e receive the substrate W from a conveying device outside the heating unit 323 and place the substrate W downwards onto the heating plate 323a, or lift the substrate W away from the heating plate 323a and convey the substrate W to the conveying device outside the heating unit 323. In one embodiment, three lifting pins 323e may be provided. The cover 323c has a space therein, which is open at the bottom. The cover 323c is located above the heating plate 323a and is moved vertically by a drive 323d. The space formed by moving the cover 323c together with the heating plate 323a serves as the heating space for the heating substrate W.

[0076] The transfer plate 324 has a generally circular shape and a diameter corresponding to the diameter of the substrate W. A notch 324b is formed at the edge of the transfer plate 324. The notch 324b may have a shape corresponding to the protrusion 352b formed on the hand of the transfer robot 352. Furthermore, as many notches 324b as the protrusion 352b formed on the hand are formed at positions corresponding to the protrusion 352b. When the vertical position of the hand and the transfer plate 324, which are aligned with each other in the vertical direction, changes, the substrate W is transferred between the hand and the transfer plate 324. The transfer plate 324 can be mounted on a guide rail 324b and is movable along the guide rail 324b by a driver 324c. A plurality of slit-shaped guide grooves 324a are provided in the transfer plate 324. The guide grooves 324a extend inward from the edge of the transfer plate 324. The length of the guide grooves 324a extends along a second direction 14, and the guide grooves 324a are positioned spaced apart from each other along the second direction 14. When the substrate W is transferred between the conveyor plate 324 and the heating unit 323, the guide groove 324a prevents the conveyor plate 324 and the lifting pin 323e from interfering with each other.

[0077] The substrate W is cooled while in contact with the cooling plate 322a via a transfer plate 324 on which it is placed. To facilitate effective heat transfer between the cooling plate 322a and the substrate W, the transfer plate 324 is formed of a material with high thermal conductivity. In one embodiment, the transfer plate 324 may be formed of a metallic material.

[0078] Heating units 320 disposed in some heat treatment chambers 320 can supply gas while heating the substrate W to improve the adhesion of photoresist to the substrate W. In one embodiment, the gas may be hexamethylsilane (HMDS) gas.

[0079] Multiple liquid handling chambers 360 are provided. Some liquid handling chambers 360 can be stacked on top of each other. Liquid handling chambers 360 are located on one side of transfer chamber 350. Liquid handling chambers 360 are arranged side by side along a first direction 12. Some liquid handling chambers 360 are located near the indexing module 100. Hereinafter, these liquid handling chambers 360 are referred to as front liquid handling chambers 362. Some other liquid handling chambers 360 are located near interface module 500. Hereinafter, these liquid handling chambers 360 are referred to as rear liquid handling chambers 364.

[0080] Each front liquid processing chamber 362 applies a first liquid to the substrate W, and each rear liquid processing chamber 364 applies a second liquid to the substrate W. The first liquid and the second liquid can be different types of liquids. In one embodiment, the first liquid can be a liquid used to form an anti-reflective layer, and the second liquid can be a liquid used to form a photoresist layer. The photoresist liquid can be applied to the substrate W coated with an anti-reflective film. Alternatively, the first liquid can be a photoresist liquid, and the second liquid can be a liquid used to form an anti-reflective layer. In this case, the liquid used to form the anti-reflective layer can be applied to the substrate W coated with a photoresist layer. Alternatively, the first liquid and the second liquid can be the same liquid, and both the first liquid and the second liquid can be liquids used to form photoresist layers.

[0081] The structure of the substrate processing apparatus of the present invention for processing a substrate by supplying a processing liquid to a rotating substrate will be described in detail below. An example of the substrate processing apparatus is an apparatus for applying photoresist. However, the substrate processing apparatus can also be an apparatus for forming a film, such as a protective film or an anti-reflective film, on a rotating substrate W. Alternatively, the substrate processing apparatus can be an apparatus for supplying a processing liquid 82, such as a developer, to the substrate W.

[0082] Figures 10 to 12 This is a view showing a substrate processing apparatus 2000 provided with an airflow guide pipe 2700 according to a first embodiment of the present invention. Figure 10 This is a cross-sectional view showing a first embodiment of the substrate processing apparatus. Figure 11 yes Figure 10 A perspective view of the substrate processing device, and Figure 12 yes Figure 10 A three-dimensional schematic diagram of the structure of the exhaust unit.

[0083] refer to Figure 10 and Figure 11 The substrate processing apparatus includes a housing 1100, a processing container 1200, a support unit 1400, a liquid supply unit 1600, and an exhaust unit 2900.

[0084] The housing 1100 is configured as a rectangular container shape with an internal space 1120. An opening 1102 may be formed in the side wall of the housing 1100. The opening 1102 may serve as an inlet / outlet for the substrate W to enter or exit the internal space 1120. A door (not shown) may be provided on the side wall of the housing 1100 to selectively open or close the opening 1102.

[0085] The processing container 1200 can be disposed within the internal space 1120 of the housing 1100. The processing container 1200 has an internal space 1280. The internal space 1280 has an opening at the top.

[0086] A substrate support unit 1400 supports a substrate W within the internal space 1280 of a processing container 1200. The substrate support unit 1400 includes a support plate 1420, a rotation shaft 1440, and an actuator 1460. The support plate 1420 has a circular upper surface. The support plate 1420 has a diameter smaller than that of the substrate W. The support plate 1420 supports the substrate W under vacuum pressure. Optionally, the support plate 1420 may have a mechanical clamping structure for supporting the substrate W. The rotation shaft 1440 is coupled to the center of the bottom surface of the support plate 1420, and the actuator 1460, which provides torque to the rotation shaft 1440, is coupled to the rotation shaft 1440. The actuator 1460 may be a motor.

[0087] Liquid supply unit 1600 supplies processing liquid 82 to substrate W. The processing liquid 82 supplied to substrate W by liquid supply unit 1600 can be a coating liquid such as photoresist. Liquid supply unit 1600 has a nozzle 1620, a nozzle moving member 1640, and a liquid supply source (not shown). Nozzle 1620 may include one or more nozzles. Nozzle 1620 dispenses processing liquid 82 onto substrate W. Nozzle 1620 is supported on nozzle moving member 1640. Nozzle moving member 1640 moves nozzle 1620 between a processing position and a standby position. In the processing position, nozzle 1620 supplies processing liquid 82 to substrate W placed on support plate 1420. After the processing liquid 82 is fully supplied, nozzle 1620 is in standby position. In standby position, nozzle 1620 is in standby position in a main port (not shown). The main port is located outside processing container 1200 in housing 1100.

[0088] The fan filter unit 1260 is disposed inside the upper wall of the housing 1100 and supplies downward airflow 84 into the interior space 1120. The fan filter unit 1260 has a fan that introduces outside air into the interior space 1120 and a filter that filters the outside air.

[0089] The exhaust pipe 1140 is connected to the housing 1100 to be located outside the processing container 1200 and exhausts the airflow 84 supplied to the space between the processing container 1200 and the housing 1100 to the outside.

[0090] The processing container 1200 has an outer cup 1220 and an inner cup 1240.

[0091] The outer cup 1220 surrounds the substrate support unit 1400 and the substrate W supported on the substrate support unit 1400. The outer cup 1220 has a bottom wall 1222, a side wall 1224, and a top wall 1226. The inner cup 1220 of the outer cup is configured as the aforementioned internal space 1280. The internal space 1280 includes a processing space and an exhaust space 1248 located at a lower position than the processing space.

[0092] The bottom wall 1222 has a circular shape and an opening at its center. A side wall 1224 extends upward from the outer end of the bottom wall 1222. The side wall 1224 is annular and perpendicular to the bottom wall 1222. According to one embodiment, the side wall 1224 extends to a height equal to or slightly below the upper surface of the support plate 1420. The upper wall 1226 has an annular shape and an opening at its center. The upper wall 1226 extends obliquely upward from the upper end of the side wall 1224 toward the central axis of the outer cup 1220.

[0093] The inner cup 1240 is located inside the outer cup 1220. The inner cup 1240 has an inner wall 1242, an outer wall 1244, and a top wall. The inner wall 1242 has a through-hole formed in the up / down direction. The inner wall 1242 surrounds the actuator 1460. The inner wall 1242 minimizes the airflow 84 exposed to the actuator 1460 in the processing space. The rotation axis 1440 of the substrate support unit 1400 and / or the actuator 1460 extend in the up / down direction through the through-hole. The lower end of the inner wall 1242 may be located at a position corresponding to the position of the bottom wall 1222 of the outer cup 1220. The outer wall 1244 is spaced apart from and surrounds the inner wall 1242. The outer wall 1244 is positioned to be spaced apart from the side wall 1224 of the outer cup 1220. The upper wall connects the upper end of the outer wall 1244 and the upper end of the inner wall 1242. The upper wall has an annular shape and is configured to surround the support plate 1420. According to one embodiment, the upper wall has an upwardly convex shape. The upper wall has an outer upper wall 1246a extending upwardly at an angle from the upper end of the outer wall 1244 toward the rotation axis 1440 and an inner upper wall 1246b extending downwardly at an angle to the upper end of the inner wall 1242. The support plate 1420 may be located in the space surrounded by the inner upper wall 1246b. According to one embodiment, the highest point of the upper wall 1226 may be located outside the support plate 1420 and inside the edge of the substrate W supported on the substrate support unit 1400.

[0094] A portion of the processing space below the support plate 1420 may be configured as an exhaust space 1248. According to one embodiment, the exhaust space 1248 may be defined by the inner cup 1240. The space surrounded by the outer wall 1244, upper wall, and inner wall 1242 of the inner cup 1240, and / or the space below it, may be configured as the exhaust space 1248.

[0095] A gas-liquid separator 1230 can be disposed within the internal space 1280 of the processing container 1200. The gas-liquid separator 1230 extends upward from the bottom wall 1222 of the outer cup 1220. The gas-liquid separator 1230 can have an annular shape. When viewed from above, the gas-liquid separator 1230 can be located between the side wall 1244 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240. Optionally, when viewed from above, the gas-liquid separator 1230 can be positioned to overlap with the outer wall 1244 of the inner cup 1240, or it can be located inside the outer wall 1244 of the inner cup 1240. According to one embodiment, the upper end of the gas-liquid separator 1230 can be located below the lower end of the outer wall 1244 of the inner cup 1240. Furthermore, the upper end of the gas-liquid separator 1230 can horizontally overlap with the bottom portion of the outer wall 1244 of the inner cup 1240.

[0096] A drain pipe 1250 for discharging the treated liquid 82 is connected to the bottom wall 1222 of the outer cup 1220. The drain pipe 1250 discharges the treated liquid 82 introduced from the space between the side wall 1224 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240 to the outside of the treatment container 1200. The airflow 84 flowing into the space between the side wall 1224 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240 is introduced into the space surrounded by the side wall 1224 and bottom wall 1222 of the outer cup 1220 and the gas-liquid separator 2846, and is introduced into the exhaust space 1248. In this process, the treated liquid 82 contained in the flow 84 is discharged to the outside of the treatment container 1200 through the drain pipe 1250, and the airflow 84 is introduced into the exhaust space 1248 of the treatment container 1200.

[0097] One or more drain pipes 1250 can be provided. When multiple drain pipes 1250 are provided, the drain pipes 1250 can be arranged along the circumferential direction of the inner cup 1240.

[0098] Although not shown, a lifting actuator may be provided for adjusting the height of the outer cup 1220 relative to the support plate 1420. According to one embodiment, the lifting actuator can move the outer cup 1220 upwards and downwards. For example, the support plate 1420 is positioned higher than the upper end of the outer cup 1220 to prevent interference between the conveying member for transporting the substrate W and the outer cup 1220 when the substrate W is loaded onto or unloaded from the support plate 1420. Furthermore, during processing, the support plate 1420 is positioned lower than the upper end of the outer cup 1220, such that the substrate W is located within the processing space.

[0099] The exhaust unit 2900 discharges airflow 84 from the processing space. The exhaust unit 2900 has a separate exhaust pipe 2820 and an airflow guide pipe 2700.

[0100] A separate exhaust pipe 2820 is connected to the exhaust space 1248 in the substrate processing apparatus 2000. One or more separate exhaust pipes 2820 may be provided. According to one embodiment, the separate exhaust pipe 2820 is connected to the bottom wall 1222 of the outer cup 1220, and the inlet of the separate exhaust pipe 2820 is positioned at a predetermined height upwardly spaced from the bottom wall 1222 of the outer cup 1220.

[0101] The airflow guide 2700 guides the airflow 84 at a height equal to or substantially equal to the height of the upper surface of the substrate W supported on the substrate support unit 1400, or at a height adjacent to the height of the upper surface of the substrate W. When the substrate W rotates, the downward airflow 84 supplied to the upper region of the substrate W flows from the central region of the substrate W to the edge region of the substrate W by centrifugal force. Furthermore, on and near the surface of the substrate W, the airflow 84 bends in the same direction as the rotation direction of the substrate W while flowing outwards. When the airflow 84 deviates from the upper surface of the substrate W, the direction of the airflow 84 is tangential to the rotation direction of the substrate W.

[0102] The airflow guide 2700 is configured such that airflow 84 deviating from the upper surface of the substrate W is introduced into the airflow guide 2700 in a tangential direction relative to the rotation direction of the substrate W.

[0103] An airflow guide duct 2700 may be disposed between the outer cup 1220 and the inner cup 1240. The airflow guide duct 2700 may be positioned closer to the outer cup 1220 than the inner cup 1240. The airflow guide duct 2700 may be disposed on the inner wall 1224 of the outer cup 1220. The path through which the airflow 84 flows is disposed between the airflow guide duct 2700 and the outer wall 1244 of the inner cup 1240, and a portion of the airflow 84 may flow through this path. The airflow guide duct 2700 has an inlet 2746a and an outlet 2746b. The inlet 2746a is disposed at the same location as the substrate W supported on the substrate support unit 1400, or at a location adjacent to the substrate W supported on the substrate support unit 1400. The outlet 2746b may be connected to an integrated exhaust pipe 2840, as described below.

[0104] According to one embodiment, the airflow guide 2700 has a tubular shape. The length direction of the airflow guide 2700 may be perpendicular to the bottom wall 1222 of the outer cup 1220. The airflow guide 2700 has an upper wall 2720 and a side wall 2740. The side wall 2740 has a first side surface 2742 facing the inner surface of the outer cup 1220, a second side surface 2744 facing the substrate W placed on the substrate support unit 1400, and a third side surface 2746 facing the tangential direction relative to the rotation direction of the substrate W. The upper wall 2720 of the airflow guide 2700 serves as a blocking surface. The first side surface 2742 and the second side surface 2744 of the side wall 2740 of the airflow guide 2700 serve as blocking surfaces. The inlet 2746a of the airflow guide 2700 is formed in the third side surface 2746, and the portion of the third side surface 2746 other than the inlet 2746a serves as a blocking surface. The airflow guide 2700 may have a constant cross-section along a direction perpendicular to its length direction. Furthermore, the distance between the second side surface 2744 of the sidewall 2740 of the airflow guide duct 2700 and the rotation axis 1440 of the substrate support unit 1400 can increase as it moves away from the inlet 2746a. Therefore, when viewed from above, the airflow guide duct 2700 has a gradually decreasing area as it moves away from the inlet 2746a. The inlet 2746a can be formed on the upper part of the first side surface 2742. The inlet 2746a can have a rectangular shape.

[0105] One or more airflow guide pipes 2700 may be provided. According to one embodiment, four airflow guide pipes 2700 may be provided. The four airflow guide pipes 2700 may be provided at equal intervals relative to the rotation center of the substrate W. The airflow guide pipes 2700 may be spaced apart from each other while defining a circle.

[0106] An integrated exhaust pipe 2840 is disposed outside the outer cup 1220. According to one embodiment, the integrated exhaust pipe 2840 may be disposed outside the housing 1100. The integrated exhaust pipe 2840 has an airflow inlet 2842 and an airflow outlet 2844.

[0107] The airflow inlet 2842 has an annular shape. A separate exhaust pipe 2820 and an airflow guide pipe 2700 are connected to the airflow inlet 2842, and gas exiting the separate exhaust pipe 2820 and airflow guide pipe 2700 is introduced into the airflow inlet 2842 of the integrated exhaust pipe 2848. The airflow outlet 2844 is located in the space surrounded by the airflow inlet 2842. The integrated exhaust pipe 2840 has an external pipe 2849 connected to the airflow outlet 2844 and a pressure control component (not shown), such as a pump, that can be connected to the external pipe 2849.

[0108] A separate exhaust pipe 2820 is connected to the airflow inlet 2842 at a location closer to the airflow outlet 2844 than the airflow guide pipe 2700. A gas-liquid separator 2846 may be provided between the point where the separate exhaust pipe 2820 connects to the airflow inlet 2842 and the airflow outlet 2844. According to one embodiment, the gas-liquid separator 2846 may be provided within the airflow inlet 2842. The gas-liquid separator 2846 has an annular shape and protrudes upward from the bottom surface of the airflow inlet 2842. Furthermore, the gas-liquid separator 2846 is spaced apart from the upper surface of the airflow inlet 2842.

[0109] A drain pipe 2848 is located on the side opposite to the airflow discharge section 2844, relative to the point where the gas-liquid separator 2846 is installed in the airflow inlet 2842. The drain pipe 2848 discharges liquid separated from the airflow 84 introduced into the airflow inlet 2842 to the outside of the integrated drain pipe 2848. According to one embodiment, the exhaust pipe 2848 is located adjacent to the gas-liquid separator 2846.

[0110] Figure 13 and Figure 14 This shows when the substrate W passes through Figure 10 The cross-sectional view and three-dimensional view of the flow paths of the gas flow 84 and the treatment liquid 82 during liquid treatment by the device.

[0111] refer to Figure 13 and Figure 14During the coating process, the substrate W is supported on and rotated by the support plate 1420. At this time, the substrate support unit 1400 rotates the substrate W, causing the airflow 84 generated by the rotation to flow from the substrate W to the inlet 2746a of the airflow guide pipe 2700. External air is supplied to the substrate W as a downward airflow 84 from the fan filter unit 1260. Furthermore, the processing liquid 82 is dispensed onto the substrate W from the nozzle 1620. Due to the rotation of the substrate W, the airflow 84 on the upper surface of the substrate W bends along the rotation direction of the substrate W and flows outwards towards the substrate W. As the airflow 84 flows outwards towards the substrate W, a portion of the airflow 84 is introduced into the airflow guide pipe 2700 and then released to the outside of the processing container 1200. Furthermore, the remaining airflow 84 flows downwards through the gap between the inner cup 1240 and the outer cup 1220. Subsequently, the remaining airflow 84 is introduced into the exhaust space 1248 in the processing container 1200 and released to the outside of the processing container 1200 through a separate exhaust pipe 2820. In addition, the processing liquid 82 for processing the substrate W is introduced into the space between the inner cup 1240 and the outer cup 1220, and then discharged to the outside of the processing container 1200 through the drain pipe 1250.

[0112] The airflow 84 released from the airflow guide pipe 2700 and the separate exhaust pipe 2820 is introduced into the airflow inlet 2842 of the integrated exhaust pipe 2840. Thereafter, the treatment fluid 82 is separated by the gas-liquid separator 1230, and the airflow 84 is released to the outside through the airflow outlet 2844.

[0113] according to Figure 10 In this embodiment, a portion of the airflow 84 is introduced into the airflow guide pipe 2700. At this time, the airflow 84 flowing towards the outside of the substrate W by centrifugal force can be smoothly introduced into the airflow guide pipe 2700 without colliding with or interfering with the processing container 1200 or its components, because the airflow guide pipe 2700 is configured such that the airflow 84 is introduced into the airflow guide pipe 2700 in a tangential direction relative to the rotation direction of the substrate W.

[0114] Furthermore, a portion of the airflow 84 is introduced into the exhaust space 1248 within the processing container 1200. However, the amount of airflow 84 introduced into the exhaust space 1248 is very small compared to when the airflow guide 2700 is not provided. Therefore, the airflow 84 can be smoothly released through the exhaust space 1248 without turbulence or large impacts.

[0115] In the above embodiment, it has been described that the airflow 84 supplied to the substrate W flows along a first path into the exhaust space 1248 located below the support plate 1420 and along a second path into the airflow guide pipe 2700. However, the substrate processing apparatus 2000 may be configured such that all the airflow 84 supplied to the substrate W flows only along the second path.

[0116] In the following, the substrate processing apparatus 3000 according to a second embodiment of the present invention will be described in more detail with reference to the accompanying drawings.

[0117] Figure 15 This is a schematic cross-sectional view illustrating the structure of a substrate processing apparatus according to a second embodiment of the present invention for processing a substrate by supplying liquid to a rotating substrate. Figure 16 It is shown Figure 15 A three-dimensional view of a partial cross-section of the device, and Figure 17 It is shown schematically. Figure 15 A three-dimensional view of the structure of the discharge unit.

[0118] In the first embodiment, it is described that the airflow 84 supplied to the substrate W flows into a first path along the exhaust space 1248 located below the support plate 1420 in the processing space, and flows into a second path along the airflow guide pipe 2700. Alternatively, in the substrate processing apparatus 2000 according to the second embodiment, all the airflow 84 supplied to the substrate W is configured to flow only through the second path.

[0119] Specifically, the substrate processing apparatus 3000 according to the second embodiment differs from the substrate processing apparatus 2000 according to the first embodiment in terms of the exhaust unit 2700, but all other configurations are the same. Specifically, the substrate processing apparatus 3000 according to the second embodiment removes the separate exhaust pipe 2820 from the exhaust unit 2700 of the substrate processing apparatus 2000 according to the first embodiment, and includes only the airflow guide pipe 2700 and the integrated exhaust pipe 2840 for discharging the airflow 84 in the processing space. In the following text, structures identical to those in the substrate processing apparatus 2000 of the first embodiment are labeled with the same reference numerals and descriptions are omitted.

[0120] refer to Figure 15 The substrate processing apparatus 3000 according to the second embodiment includes an exhaust unit 3900. The exhaust unit 3900 exhausts airflow 84 from the processing space. The exhaust unit 3900 includes an airflow guide pipe 2700 and an integrated exhaust pipe 2840.

[0121] The airflow guide duct 2700 guides airflow 84 at a height equal to or substantially equal to the upper surface of the substrate W supported on the substrate support unit 1400, or at a height adjacent to the upper surface of the substrate support unit 1400. When the substrate W rotates, the downward airflow 84 supplied to the upper region of the substrate W flows from the central region of the substrate W to the edge region of the substrate W by centrifugal force. Furthermore, on and near the surface of the substrate W, the airflow 84 bends in the same direction as the rotation direction of the substrate W while flowing outwards. When the airflow 84 deviates from the upper surface of the substrate W, the direction of the airflow 84 is tangential to the rotation direction of the substrate W.

[0122] The airflow guide 2700 is configured such that the airflow 84 deviating from the upper surface of the substrate W is introduced in the tangential direction of the rotation direction of the substrate W.

[0123] An airflow guide duct 2700 may be disposed between the outer cup 1220 and the inner cup 1240. The airflow guide duct 2700 may be positioned closer to the outer cup 1220 than the inner cup 1240. The airflow guide duct 2700 may be mounted on the inner wall 1224 of the outer cup 1220. The airflow guide duct 2700 has an inlet 2746a and an outlet 2746b. The inlet 2746a is located at the same or adjacent position as the substrate W supported by the support unit 1400. The outlet 2746b may be configured to connect to the integrated exhaust pipe 2840, which will be described later.

[0124] In one embodiment, the airflow guide 2700 has a tubular shape. The length of the airflow guide 2700 can be set along a direction perpendicular to the bottom wall 1222 of the outer cup 1220. The airflow guide 2700 has an upper wall 2720 and a side wall 2740. The side wall 2740 has a first side surface 2742 facing the inner surface of the outer cup 1220, a second side surface 2744 facing the substrate W placed on the support unit 1400, and a third side surface 2746 tangential to the rotation direction of the substrate W. The upper wall 2720 of the airflow guide 2700 serves as a blocking surface. The first side surface 2742 and the second side surface 2744 of the side wall 2740 of the airflow guide 2700 serve as blocking surfaces. The inlet 2746a of the airflow guide 2700 is formed on the third side surface 2746, and the portion of the third side surface 2746 other than the inlet 2746a serves as a blocking surface. The airflow guide duct 2700 can be configured to have a cross-sectional area perpendicular to its length. Furthermore, the second side 2744 of the sidewall 2740 of the airflow guide duct 2700 can be further configured to move further away from the rotation axis 1440 of the support unit 1400 as the distance from the inlet 2746a increases. Therefore, when viewed from above, the airflow guide duct 2700 can be configured to have a narrower area as it moves further away from the inlet 2746a. The inlet 2746a can be located above the first side 2742. The inlet 2746a can be rectangular in shape.

[0125] One or more airflow guide pipes 2700 may be provided. According to one embodiment, four airflow guide pipes 2700 may be provided. The four airflow guide pipes 2700 may be spaced apart from each other at equal intervals relative to the rotation center of the substrate W.

[0126] An integrated exhaust pipe 2840 is disposed outside the outer cup 1220. According to one embodiment, the integrated exhaust pipe 2840 may be disposed outside the housing 1100. The integrated exhaust pipe 2840 has an airflow inlet 2842 and an airflow outlet 2844.

[0127] The airflow inlet 2842 has an annular shape. An airflow guide pipe 2700 is connected to the airflow inlet 2842, and gas discharged from the separate exhaust pipe 2820 and the airflow guide pipe 2700 flows into the airflow inlet 2842 of the integrated exhaust pipe 2840. The airflow discharge unit 2844 is located in the space surrounded by the airflow inlet 2842. The integrated exhaust pipe 2840 has an external pipe 2849 connected to the airflow discharge unit 2844, and a pressure control component (not shown), such as a pump, can be coupled to the external pipe 2849.

[0128] A gas-liquid separator 2846 may be disposed between the point where the airflow guide pipe 2700 connects to the airflow inlet 2842 and the airflow outlet 2844. According to one embodiment, the gas-liquid separator 2846 may be installed in the airflow inlet 2842. The gas-liquid separator 2846 is configured to be annular and protrude upward from the bottom surface of the airflow inlet 2842. Furthermore, the gas-liquid separator 2846 is configured to be spaced apart from the upper surface of the airflow inlet 2842.

[0129] The drain pipe 2848 is configured to face the airflow discharge section 2844 relative to the point where the gas-liquid separator 2846 is installed in the airflow inlet section 2842. The drain pipe 2848 discharges liquid separated from the airflow 84 introduced into the airflow inlet section 2842 to the outside of the integrated exhaust pipe 2840. According to one embodiment, the drain pipe 2848 is located adjacent to the gas-liquid separator 2846.

[0130] Figure 18 and Figure 19 This shows when the substrate passes through Figure 15 A cross-sectional view of the flow paths of the airflow and the processed liquid during liquid processing in the device.

[0131] Reference Figure 17 In the coating process, substrate W is supported on support plate 1420 and rotated by support plate 1420. At this time, substrate support unit 1400 rotates substrate W so that airflow 84 generated by the rotation of substrate W flows toward inlet 2746a of airflow guide pipe 2700. External air is supplied to substrate W as downward airflow 84 from fan filter unit 1260. In addition, processing liquid 82 is dispensed onto substrate W from nozzle 1620. Due to the rotation of substrate W, airflow 84 on the upper surface of substrate W flows toward the outside of substrate W while changing the direction of rotation of substrate W. When airflow 84 flows toward the outside of substrate W, most of airflow 84 is introduced into airflow guide pipe 2700 and then released to the outside of processing container 1200.

[0132] The airflow 84 released from the airflow guide pipe 2700 is introduced into the airflow inlet 2842 of the integrated exhaust pipe 2840. Thereafter, the treatment liquid 82 is separated by the gas-liquid separator 2846, and the airflow 84 is released to the outside through the airflow outlet 2844.

[0133] Most of the airflow 84 is introduced into the airflow guide tube 2700. At this time, the airflow 84 flowing to the outside of the substrate W by centrifugal force can be smoothly introduced into the airflow guide tube 2700 without colliding with or interfering with the processing container 1200 or its components, because the airflow guide tube 2700 is configured such that the airflow 84 is introduced into the airflow guide tube 2700 in a tangential direction relative to the rotation direction of the substrate W.

[0134] The effects of this invention are not limited to those described above. Those skilled in the art can clearly understand any other effects not mentioned herein from this specification and the accompanying drawings.

[0135] The above description illustrates the inventive concept by example. Furthermore, while the foregoing describes embodiments of the inventive concept, it can be used in various other combinations, variations, and environments. That is, variations or modifications can be made to the inventive concept without departing from the scope of the inventive concept disclosed herein, the equivalent scope of the written disclosure, and / or the technical or knowledge scope of those skilled in the art. The written embodiments describe the optimal state for realizing the technical spirit of the inventive concept, and various changes can be made as needed for specific applications and purposes of the inventive concept. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept in the disclosed embodiments. Furthermore, it should be understood that the appended claims include other embodiments.

[0136] While the inventive concept has been described with reference to embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the inventive concept. Therefore, it should be understood that the above embodiments are not restrictive but exemplary.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: A processing container that has internal space; A support unit configured to support and rotate the substrate within the internal space; A liquid supply unit configured to supply processing liquid to the substrate supported by the support unit; as well as An exhaust unit configured to discharge airflow from the internal space. The support unit includes: A support plate configured to support the substrate; A rotating shaft configured to rotate the support plate; and An actuator, which is coupled to the rotating shaft and configured to provide torque to the rotating shaft, The exhaust unit includes an airflow guide pipe with an inlet, the inlet being configured to introduce the airflow into the airflow guide pipe in a tangential direction to the rotational direction of the substrate supported on the support unit. The processing container includes: An outer cup, configured to provide the internal space; and An inner cup, disposed within the internal space to be spaced apart from the outer cup, and configured to surround the rotation axis or the actuator, and The airflow guide tube is disposed between the outer cup and the inner cup, and has an upper wall and a side wall, with the inlet formed on the side wall.

2. The apparatus according to claim 1, wherein, The airflow guide pipes are configured as a plurality of those spaced apart from each other along the circumferential direction of the substrate supported by the support unit.

3. The apparatus according to claim 1, wherein, The airflow guide tube is installed on the inner wall of the outer cup.

4. The apparatus according to claim 1, wherein, The length of the airflow guide tube extends vertically.

5. The apparatus according to claim 1, wherein, The upper wall serves as a blocking surface, and in the side wall, the inlet is located in a wall in a direction parallel to the tangent of the substrate supported by the support unit, and the remaining surfaces can serve as blocking surfaces.

6. The apparatus according to claim 1, wherein, The inner cup defines an exhaust space below the support plate, and the exhaust unit further includes a separate exhaust pipe for discharging the airflow introduced into the exhaust space to the outside of the inner space.

7. The apparatus according to claim 6, wherein, The exhaust unit also includes an integrated exhaust pipe located outside the processing container and equipped with a pressure control element, and the separate exhaust pipe and the airflow guide pipe are connected to the integrated exhaust pipe.

8. The apparatus according to claim 3, wherein, The sidewall includes: The first side surface adjacent to the inner surface of the outer cup; The second side adjacent to the substrate placed on the support unit; and The third side surface facing the tangential direction of the rotational direction of the substrate, and The entrance is formed on the third side.

9. The apparatus according to claim 8, wherein, As the second side moves away from the inlet, the distance between the second side and the axis of rotation of the support unit increases.

10. The apparatus according to claim 1, wherein, The substrate processing apparatus further includes a liquid supply nozzle for supplying photoresist to the substrate supported by the support unit.

11. An apparatus for processing a substrate, the apparatus comprising: A processing container that has internal space; A support unit configured to support and rotate the substrate within the internal space; A liquid supply unit configured to supply processing liquid to the substrate supported by the support unit; as well as An exhaust unit configured to exhaust airflow from the internal space. The support unit includes: A support plate configured to support the substrate; A rotating shaft configured to rotate the support plate; and An actuator, which is coupled to the rotating shaft and configured to provide torque to the rotating shaft, The exhaust unit includes: An exhaust pipe for discharging airflow along a first path through the space between the inner wall of the processing container and the substrate supported on the support plate to the outside of the processing container, the first path being the path into an exhaust space located below the support plate within the internal space; and An airflow guide tube, located within the internal space, guides the airflow to a second path, the second path being a path tangential to the rotational direction of the substrate supported by the support unit. The processing container includes: An outer cup, configured to provide the internal space; and An inner cup, disposed within the internal space and spaced apart from the outer cup. The airflow guide tube is disposed between the outer cup and the inner cup, and The airflow guide tube includes an upper wall and a side wall, and an inlet formed on the side wall, to introduce the airflow in a tangential direction to the rotational direction of the substrate supported by the support unit.

12. The apparatus according to claim 11, wherein, The exhaust unit also includes an integrated exhaust pipe located outside the processing container and equipped with a pressure control element, and the airflow guide pipe is connected to the integrated exhaust pipe.

13. The apparatus according to claim 12, wherein, The integrated exhaust pipe includes: An airflow inlet is provided through which airflow released from the airflow guide pipe is introduced; An airflow discharge section is provided, through which the airflow introduced into the airflow inlet is discharged to the outside; and A gas-liquid separator for separating the gas stream and the processing liquid from the gas stream introduced into the gas stream inlet. The gas-liquid separator is configured to protrude from the bottom surface of the airflow inlet and be spaced apart from the upper surface of the airflow inlet.

14. The apparatus according to claim 11, wherein, The sidewall includes: The first side surface adjacent to the inner surface of the outer cup; The second side adjacent to the substrate placed on the support unit; A third side between the first side and the second side defines a generally flat plane oriented in the radial direction of the substrate placed on the support unit, and the entrance is formed in the third side.

15. The apparatus according to claim 14, wherein, As the second side moves away from the inlet, the distance between the second side and the axis of rotation of the support unit increases.

16. An apparatus for processing a substrate, the apparatus comprising: A processing container that has internal space; A support unit configured to support and rotate the substrate within the internal space; A liquid supply unit configured to supply processing liquid to the substrate supported by the support unit; as well as An exhaust unit configured to exhaust airflow from the internal space. The support unit includes: A support plate configured to support the substrate; A rotating shaft configured to rotate the support plate; and An actuator, which is coupled to the rotating shaft and configured to provide torque to the rotating shaft, The exhaust unit includes an airflow guide pipe with an inlet, the inlet being configured to introduce the airflow into the airflow guide pipe in a tangential direction to the rotational direction of the substrate supported on the support unit. The processing container includes: An outer cup, configured to provide the internal space; and An inner cup, disposed within the internal space to be spaced apart from the outer cup, and configured to surround the rotation axis or the actuator, and The airflow guide tube is disposed between the outer cup and the inner cup, and The airflow guide pipe has an upper wall and multiple side walls. An inlet is formed on one of the multiple side walls in the tangential direction toward the rotation direction of the substrate, through which airflow flows in the tangential direction of the rotation direction of the substrate.

17. The apparatus according to claim 16, wherein, The exhaust unit further includes an exhaust pipe for guiding and releasing the airflow in a path different from the path in the tangential direction of the substrate, and the exhaust pipe is located closer to the inner cup than the airflow guide pipe. The exhaust pipe releases the airflow flowing into the exhaust space below the support plate in the internal space to the outside of the processing container through the space between the inner wall of the processing container and the substrate supported on the support plate.

Images