A computer heat dissipation cooling system

Abstract

The present invention relates to the technical field related to computer heat dissipation, and discloses a computer heat dissipation cooling system, including a chassis, wherein the chassis is provided with an inner recess, a motherboard mounting device is installed in the chassis, the motherboard mounting device includes a motherboard mounting plate, the motherboard mounting plate is provided with a raised plane portion, the raised plane portion array is provided with a hollow heat dissipation groove, the raised plane portion array is provided with a heat-conducting metal block, the inner side of the raised plane portion is provided with a functional heat dissipation groove, and the raised plane portion passes through the motherboard mounting plate; a computer heat dissipation cooling system of the present invention can achieve a certain space between the motherboard mounting position and the inner wall of the chassis through the setting of efficient heat dissipation cooling function through the setting of the raised plane portion and the internal structure of the functional heat dissipation groove, thereby greatly improving the air flow efficiency around the motherboard, and achieving heat conduction by fitting to the motherboard through the heat-conducting metal block, thereby achieving solid conduction heat dissipation of the motherboard temperature.

Description

Technical Field

[0001] The present invention relates to the technical field related to computer heat dissipation, and in particular to a computer heat dissipation cooling system. Background Art

[0002] Integrated circuits are widely used in computer components. As we all know, the heat that causes high temperature does not come from outside the computer, but from inside the computer, or inside the integrated circuit. Most radiators absorb heat by contacting the surface of the heat-generating components, and then transfer the heat to a distant place through various methods, such as the air inside the chassis, and then the chassis transfers the hot air to the outside of the chassis to complete the heat dissipation of the computer.

[0003] The most common way to dissipate heat in computers is by air cooling, and the most common device for air cooling is the cooling fan. The existing traditional technology is not comprehensive and has the following disadvantages:

[0004] The cooling fan is usually fixed by clips on the four corners. The clips must be aligned with the fixing holes of the CPU motherboard. If a CPU with an exposed core is not used, in order to ensure that the radiator is installed tightly enough, manual pressure is used from top to bottom to increase the tightness of the radiator. Since manual force is difficult to control, it is easy to crush the CPU or damage components and circuits near the CPU socket due to excessive force.

[0005] CN107918471A discloses a computer radiator, which includes a heat-conducting insulating silicone sheet and a plurality of heat-conducting sheet layers arranged on the heat-conducting insulating silicone sheet, each heat-conducting sheet layer includes a heat-conducting shell and a heat-conducting medium filled in the heat-conducting shell, and the specific heat capacity of the heat-conducting medium filled in the heat-conducting sheet layers gradually increases according to the distance from the heat-conducting insulating silicone sheet, and the specific heat capacity of the heat-conducting medium is greater than the specific heat capacity of the heat-conducting insulating silicone sheet. The radiator of the present invention has a simple structure, adopts multiple layers of heat-conducting sheet layers, forms a fixed heat conduction direction, and improves the thermal conductivity of the radiator. The radiator of the present invention can avoid the influence of dust on the circuit, has low manufacturing cost, and the heat conduction component is small in size. It can be directly assembled on the surface of all heating elements, and has strong scalability. It can be used for heat dissipation of desktop computers and notebook computers, and has a wider range of applications.

[0006] CN1716155A discloses a computer CPU radiator, including a heat absorbing plate and a fan, the heat absorbing plate is connected to the edge of the cover of the container cover, the container cover is connected and communicated with one end of the heat conducting pipe, the other end of the heat conducting pipe is sealed, the heat conducting pipe is installed in the radiator, and they are in close contact with each other, and the fan is connected and corresponds to the radiator. It injects liquid heat conducting medium into the container cover, which can solve the problems of the existing technology that the heat absorbing plate has low natural heat absorption capacity, slow instantaneous heat transfer speed, complex structure, high cost, high noise, and cumbersome maintenance.

[0007] CN112987889A discloses a computer self-dust removal radiator, which relates to the field of computer heat dissipation technology. It includes a heat-conducting base, on which heat pipes are evenly distributed in the circumferential direction, and above the heat-conducting base, heat-dissipating fins are evenly distributed from top to bottom, and the heat-dissipating fins are in a circular ring shape; the upper part of the heat pipes sequentially penetrates the outer side of the heat-dissipating fins and is fixed to the heat-dissipating fins; a driving motor is installed on the upper end of the heat-conducting base; the output end of the driving motor is vertically upward and coaxially connected to the central axis through an elastic support seat; the heat-dissipating fins are coaxially arranged outside the central axis; a heat-dissipating and dust-removing device is arranged between each two adjacent heat-dissipating fins; the heat-dissipating and dust-removing device includes a radial impeller arranged in the middle of two adjacent heat-dissipating fins; the radial impeller includes a mounting ring coaxially arranged outside the central axis; and radial blades are evenly distributed on the outer side of the mounting ring in the circumferential direction. The beneficial effects of the present invention are: it does not need to be removed for dust removal, and the dust removal operation is convenient and quick.

[0008] CN110806790A discloses a computer radiator, which comprises a cooling fan, a heat fin and a clip device. The cooling fan is fixed to the upper end of the heat fin by the clip device. The clip device is mainly composed of a rotary handle and a clip. The rotary handle and the clip are engaged with each other. The clip is mainly provided with a thread groove, a threaded shaft, a connecting seat, an inner clip and a telescopic shaft. The left and right sides of the threaded shaft are provided with thread grooves and are engaged with each other. The connecting seat is arranged at the lower end of the threaded shaft. The inner clip is connected to the threaded shaft through the connecting seat. The telescopic shaft is located below the inner clip. In the cooling fan, the present invention uses the rotary handle to install the clip in a left and right spiral manner. The inner clip continuously presses the telescopic shaft downward with the cooperation of the threaded shaft. Only when the telescopic shaft stops rotating downward, the clamp is engaged with the engaging hole and the installation is completed. The traditional press-type fixation is changed, and the cooling fan can be effectively prevented from being crushed or components and circuits near the socket due to excessive force during the installation process.

[0009] With the development of science and technology and the application of semiconductor materials, computer chips are now smaller and higher in performance. The computer motherboard is the component that carries the main new performance structure of the computer. During the high-power operation of the computer, the temperature of the computer motherboard equipped with a graphics card and CPU will increase significantly. It may not be possible to achieve a better heat dissipation effect in the computer case just by installing a radiator. Summary of the invention

[0010] The object of the present invention is to provide a computer heat dissipation cooling system to overcome the above-mentioned defects in the prior art.

[0011] The present invention is achieved through the following technical solutions.

[0012] A computer heat dissipation cooling system of the present invention comprises a case, the case is provided with an inner concave portion, a motherboard mounting device is installed in the case, the motherboard mounting device comprises a motherboard mounting plate, the motherboard mounting plate is provided with a raised plane portion, the raised plane portion array is provided with a hollow heat dissipation groove, the raised plane portion array is provided with a heat-conducting metal block, the raised plane portion inner side is provided with a functional heat dissipation groove, the raised plane portion penetrates the motherboard mounting plate, the other side of the raised plane portion is placed in the functional heat dissipation groove, the inner concave portion is provided with a mounting groove, the motherboard mounting plate is provided with an external The heat dissipation part, the external heat dissipation part passes through the installation groove and is placed in the inner recessed part, the external heat dissipation part array is provided with two air intake fans, the external heat dissipation part is provided with an air flow channel, the air flow channel is placed in the functional heat dissipation groove, the inner wall of the external heat dissipation part is installed with a cooling circulation part, the cooling circulation part includes a cooling circulation plate, a cooling circulation cavity is provided in the cooling circulation plate, the cooling circulation cavity array is connected with a telescopic elastic cylinder, a docking heat conductive sheet is installed at the end of the telescopic elastic cylinder, and the position of the docking heat conductive sheet coincides with the vertical projection of the corresponding position of the heat conductive metal block.

[0013] According to a further technical solution, a water tank is installed in the inner recess.

[0014] According to a further technical solution, a water pump is installed in the water tank, and the water pump is provided with a circulation pipeline, and the circulation pipeline is connected to the cooling circulation chamber.

[0015] According to a further technical solution, the air flow channel is configured to be in an inclined triangular shape.

[0016] According to a further technical solution, the array of raised planar portions is provided with raised docking holes, and the raised docking holes are used for docking, installation and fixation with a mainboard.

[0017] According to a further technical solution, a filter is installed on the outside of the air intake fan.

[0018] According to a further technical solution, a transparent plate is installed on the outer wall of the chassis, a power supply placement portion is provided inside the chassis, and a rear wiring board is provided on the rear wall of the chassis.

[0019] According to a further technical solution, the mainboard mounting plate is provided with a fixed plane portion.

[0020] Beneficial effects of the present invention:

[0021] A computer heat dissipation cooling system of the present invention can realize a certain space between the mainboard installation position and the inner wall of the chassis through the setting of the high-efficiency heat dissipation cooling function and the setting of the raised plane part and the internal structure of the functional heat dissipation groove, so as to greatly improve the air flow efficiency around the mainboard, and can realize heat conduction by fitting the mainboard through the heat-conducting metal block, so as to realize solid conduction heat dissipation of the mainboard temperature, and at the same time, cooperate with the setting of the air flow channel that can output airflow in the functional heat dissipation groove, and the air flow channel is set to an inclined triangle shape to save vertical space and increase the size of the air outlet, and at the same time, the blown airflow has both longitudinal and lateral movement trends, so that it can not only flow into the chassis through the functional heat dissipation groove to realize the airflow blowing effect on the functional heat dissipation groove and the mainboard mounting plate, but also can pass through the hollow heat dissipation groove to directly blow and cool the rear side of the mainboard, so as to realize the three-dimensional cooling effect of cooperating with the cooling of the front side of the mainboard radiator to accelerate the air flow in the chassis;

[0022] The computer heat dissipation cooling system of the present invention is provided with a high-efficiency heat dissipation cooling function. The air flow blowing can form a cooling acceleration heat dissipation function for the heat-conducting metal block to improve the solid conduction heat dissipation efficiency. The setting of the inner concave part can achieve the improvement of the appearance without affecting the normal placement of the chassis, and cooperate with the external heat dissipation part to be set up on the inner side of the inner concave part to achieve the effect of guiding the airflow on the side of the chassis into the chassis, thereby achieving the functional effect of greatly improving the air flow in the chassis. At the same time, the air intake direction of the drainage will not coincide with the air intake path of the radiator, thereby ensuring that the introduced air is an external low-temperature airflow. Through the cooling circulation part structure setting, a cooling circulation cavity for water circulation is provided in the cooling circulation plate, and the water flow rate is controlled to achieve the effect of controlling the bulging height of the telescopic elastic cylinder, so that the water circulation in the cooling circulation cavity accelerates the reduction of the temperature around the mainboard. At the same time, by adjusting the water flow rate, the telescopic elastic cylinder is raised to promote the mutual adhesion of the docking heat conductive plate and the rear side of the heat conductive metal block, thereby achieving the effect of accelerating the heat dissipation of the heat conductive metal block and further improving the bonding heat dissipation efficiency of the mainboard.

[0023] A computer heat dissipation cooling system of the present invention is provided with an efficient heat dissipation cooling function. The cooling circulation structure is arranged in the functional heat dissipation slot to cooperate with the airflow effect in the functional heat dissipation slot, so that the airflow flowing into the chassis from the air flow channel through the functional heat dissipation slot first passes through the cooling circulation plate and the telescopic elastic cylinder structure, thereby cooperating with the low temperature effect brought by the water flow circulation to ensure the temperature of the blown air flow, thereby further improving the overall cooling and heat dissipation effect of the chassis, avoiding the problem that the temperature in the chassis has gradually increased due to the heat dissipation only through the radiator, resulting in a gradual decrease in the heat dissipation efficiency. The water tank is arranged on the outer wall of the inner recessed part to avoid the problem of slow water temperature circulation caused by the temperature in the chassis. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0026] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 yes Figure 1 A rear view structural diagram of ;

[0028] Figure 3 yes Figure 1 A schematic diagram of the structure of the middle mainboard mounting device 20;

[0029] Figure 4 yes Figure 3 A side view structural schematic diagram of;

[0030] Figure 5 yes Figure 4 A schematic diagram of the structure of the cooling circulation unit 35;

[0031] Figure 6 yes Figure 5 A schematic diagram of a side cross-sectional structure;

[0032] Figure 7 yes Figure 4 A schematic diagram of the top view of the middle airflow channel 41; DETAILED DESCRIPTION

[0033] Combine the following Figure 1-7 The present invention is described in detail. For the convenience of description, the directions mentioned below are defined as follows: the up, down, left, right, front, and back directions mentioned below are the same as Figure 1 The up-down, left-right, front-back directions of the projection relationship itself are consistent.

[0034] Combined with Figure 1-7The computer heat dissipation cooling system comprises a case 11, the case 11 is provided with an inner concave portion 12, a motherboard mounting device 20 is installed in the case 11, the motherboard mounting device 20 comprises a motherboard mounting plate 30, the motherboard mounting plate 30 is provided with a raised plane portion 25, the raised plane portion 25 array is provided with a hollow heat dissipation groove 28, the raised plane portion 25 array is provided with a heat-conducting metal block 27, the raised plane portion 25 is provided with a functional heat dissipation groove 31 on the inner side, the raised plane portion 25 penetrates the motherboard mounting plate 30, the other side of the raised plane portion 25 is placed in the functional heat dissipation groove 31, the inner concave portion 12 is provided with a mounting groove 24, the motherboard mounting plate 30 is provided with an outer The external heat dissipation part 22 is placed in the inner recess 12 through the installation groove 24. The external heat dissipation part 22 array is provided with two air intake fans 23. The external heat dissipation part 22 is provided with an air flow channel 41. The air flow channel 41 is placed in the functional heat dissipation groove 31. A cooling circulation part 35 is installed on the inner wall of the external heat dissipation part 22. The cooling circulation part 35 includes a cooling circulation plate 36. A cooling circulation cavity 39 is arranged in the cooling circulation plate 36. The cooling circulation cavity 39 array is connected with a telescopic elastic cylinder 38. A docking heat conductive sheet 37 is installed at the end of the telescopic elastic cylinder 38. The position of the docking heat conductive sheet 37 coincides with the vertical projection of the corresponding position of the heat conductive metal block 27.

[0035] During installation, the mainboard is installed on the raised flat portion 25 so that the heat-conducting metal block 27 fits against the rear wall of the mainboard. Through the arrangement of the raised flat portion 25 and the internal structure of the functional heat dissipation slot 31, a certain space can be left between the mainboard installation position and the inner wall of the chassis, thereby greatly improving the air flow efficiency around the mainboard. The heat-conducting metal block 27 can fit against the mainboard for heat conduction, thereby achieving solid conduction heat dissipation of the mainboard temperature. At the same time, in conjunction with the arrangement of the airflow channel 41 that can output airflow in the functional heat dissipation slot 31, air can be discharged from the functional heat dissipation slot 31 and the mainboard mounting plate 30. The airflow can pass through the hollow heat dissipation slot 28 to blow and cool the mainboard from the back, realizing a three-dimensional cooling effect in conjunction with the cooling of the front side of the mainboard radiator to accelerate the air flow in the chassis. At the same time, the airflow can cool the heat-conducting metal block 27 to accelerate the heat dissipation function and improve the solid conduction heat dissipation efficiency. The arrangement of the inner recess 12 can achieve the effect of not affecting the normal placement of the chassis, while improving the aesthetic appearance of the shape, and cooperate with the external heat dissipation part 22 to be set up on the inner side of the inner recess 12 to achieve the effect of guiding the airflow on the side of the chassis into the chassis, thereby achieving the functional effect of greatly improving the air flow in the chassis. At the same time, the air inlet direction will not coincide with the air inlet path of the radiator, thereby ensuring that the introduced air is an external low-temperature airflow, and through the cooling circulation part 35 structure, a cooling circulation chamber 39 for water circulation is provided in the cooling circulation plate 36, and the effect of controlling the bulging height of the telescopic elastic cylinder 38 is achieved by controlling the water flow rate, so that the water flow circulation in the cooling circulation chamber 39 accelerates the reduction of the temperature around the mainboard, and at the same time, by adjusting the water flow rate, the telescopic elastic cylinder 38 is raised to promote the docking heat conductive sheet 37 and the rear side of the heat conductive metal block 27 to fit each other, thereby accelerating the heat of the heat conductive metal block 27 The heat removal effect further improves the heat dissipation efficiency of the motherboard, and the cooling circulation part 35 structure is arranged in the functional heat dissipation groove 31 to cooperate with the airflow effect in the functional heat dissipation groove 31, so that the airflow flowing into the chassis from the airflow channel 41 through the functional heat dissipation groove 31 first passes through the cooling circulation plate 36 and the telescopic elastic tube 38 structure, thereby cooperating with the low temperature effect brought by the water circulation to ensure the temperature of the blown air flow, thereby further improving the overall cooling and heat dissipation effect of the chassis to avoid the problem of only dissipating heat through the radiator while the temperature in the chassis has gradually increased, thereby causing the heat dissipation efficiency to gradually decrease.

[0036] Preferably, a water tank 18 is installed in the inner recess 12 .

[0037] The circulation cooling effect is achieved by adding water into the water tank 18. Meanwhile, the water tank 18 is arranged outside the chassis to avoid the problem of slow water temperature circulation due to the influence of the temperature inside the chassis.

[0038] Preferably, a water pump 19 is installed in the water tank 18 , and the water pump 19 is provided with a circulation pipeline 21 , and the circulation pipeline 21 is connected to the cooling circulation chamber 39 .

[0039] The water pump 19 cooperates with the circulation pipeline 21 to communicate with the cooling circulation chamber 39 to achieve water circulation heat dissipation and water flow control effects.

[0040] Preferably, the air flow channel 41 is configured to be in an inclined triangular shape.

[0041] By setting the airflow channel 41 to an inclined triangle shape, it is possible to save vertical space and increase the size of the air outlet, while making the blown airflow have both longitudinal and lateral movement tendencies, so that it can not only flow into the chassis through the functional heat dissipation slots 31, but also pass through the hollow heat dissipation slots 28 to directly blow to the back side of the motherboard for a cooling effect.

[0042] Preferably, the raised plane portion 25 is provided with an array of raised docking holes 29, and the raised docking holes 29 are used for docking, installation and fixation with the mainboard.

[0043] By coordinating the protruding features of the protruding docking hole 29 with the protruding features of the heat-conducting metal block 27, the mainboard can be installed on the protruding plane portion 25, so that the mainboard fits the heat-conducting metal block 27. At the same time, there is a gap on the back side of the mainboard, thereby improving the airflow efficiency and thus improving its heat dissipation effect.

[0044] Preferably, a filter screen 32 is installed on the outside of the suction fan 23 .

[0045] The filter 32 can achieve a certain filtering effect and prevent the material outside the chassis from being affected by the airflow and being drawn into the interior.

[0046] Preferably, a transparent plate 14 is installed on the outer wall of the chassis 11 , a power supply placement portion 15 is provided inside the chassis 11 , and a rear wiring board 16 is provided on the rear wall of the chassis 11 .

[0047] The transparent plate 14 improves the appearance and facilitates observation of the operation inside the chassis. The power supply placement portion 15 is used to place the power supply, and the rear wiring board 16 is used to connect with the socket wires of the computer motherboard, hardware, etc.

[0048] Preferably, the mainboard mounting plate 30 is provided with a fixing plane portion 26 .

[0049] The mainboard mounting plate 30 is fixedly mounted on the inner wall of the chassis through the fixing plane portion 26 .

[0050] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology in this field to understand the content of the present invention and implement it, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A computer heat dissipation cooling system, comprising a chassis, characterized in that: The chassis is provided with an inner recess, a motherboard mounting device is installed in the chassis, the motherboard mounting device includes a motherboard mounting plate, the motherboard mounting plate is provided with a raised plane portion, the raised plane portion array is provided with a hollow heat dissipation groove, the raised plane portion array is provided with a heat-conducting metal block, the inner side of the raised plane portion is provided with a functional heat dissipation groove, the raised plane portion penetrates the motherboard mounting plate, the other side of the raised plane portion is placed in the functional heat dissipation groove, the inner recess is provided with a mounting groove, the motherboard mounting plate is provided with an external heat dissipation portion, the external heat dissipation portion passes through the mounting groove and is placed in the inner recess, the external heat dissipation portion array is provided with two air intake fans, the external heat dissipation portion is provided with an air flow channel, the air flow channel is placed in the functional heat dissipation groove, a cooling circulation portion is installed on the inner wall of the external heat dissipation portion, the cooling circulation portion includes a cooling circulation plate, a cooling circulation cavity is provided in the cooling circulation plate, the cooling circulation cavity array is connected with a telescopic elastic cylinder, a docking heat conductive sheet is installed at the end of the telescopic elastic cylinder, and the position of the docking heat conductive sheet coincides with the vertical projection of the corresponding position of the heat conductive metal block; The bulging height of the telescopic elastic tube is controlled by controlling the water flow rate, so that the water circulation in the cooling circulation cavity accelerates the reduction of the temperature around the mainboard. At the same time, the water flow rate is adjusted to raise the telescopic elastic tube so that the docking heat conductive plate and the rear side of the heat conductive metal block are fitted together, thereby accelerating the heat dissipation of the heat conductive metal block and further improving the heat dissipation efficiency of the mainboard. The cooling circulation structure is arranged in the functional heat dissipation groove to cooperate with the air flow effect in the functional heat dissipation groove, so that the airflow flowing into the chassis from the air flow channel through the functional heat dissipation groove first passes through the cooling circulation plate and the telescopic elastic tube structure, so that the low temperature effect brought by the water circulation ensures the temperature of the blown air flow, thereby further improving the overall cooling and heat dissipation effect of the chassis, avoiding the problem of heat dissipation only through the radiator while the temperature in the chassis has gradually increased, resulting in a gradual decrease in heat dissipation efficiency.

2. A computer heat dissipation cooling system according to claim 1, characterized in that: The inner recessed portion is provided with a water tank, and the water tank being arranged outside the chassis can avoid the problem of slow water temperature circulation drop due to the influence of the temperature inside the chassis.

3. A computer heat dissipation cooling system according to claim 2, characterized in that: A water pump is installed in the water tank. The water pump is provided with a circulation pipeline, and the circulation pipeline is communicated with the cooling circulation chamber.

4. A computer heat dissipation cooling system according to claim 1, characterized in that: The airflow channel is configured as an inclined triangle shape, which can increase the size of the air outlet and allow the blown airflow to have both longitudinal and lateral movement tendencies.

5. A computer heat dissipation cooling system according to claim 1, characterized in that: The array of raised planar portions is provided with raised docking holes, which are used for docking and fixing with the mainboard. The raised features can create a gap at the rear side of the mainboard, thereby improving the airflow efficiency and thus improving its heat dissipation effect.

6. A computer heat dissipation cooling system according to claim 1, characterized in that: A filter is installed on the outside of the air intake fan.

7. A computer heat dissipation cooling system according to claim 1, characterized in that: A transparent plate is installed on the outer wall of the chassis, a power supply placement portion is arranged inside the chassis, and a rear wiring board is arranged on the rear wall of the chassis.

8. A computer heat dissipation cooling system according to claim 1, characterized in that: The mainboard mounting plate is provided with a fixed plane portion.

Images