A rack-mounted electronic equipment chassis with a contact heat dissipation interface

Abstract

The present invention provides a rack-type electronic equipment chassis with a contact heat dissipation interface, which relates to the technical field of computer room chassis, including a chassis body and a rack. The side of the chassis body is provided with a chassis side panel, and the chassis side panel is provided with a heat dissipation joint. The heat dissipation joint is slidably connected to the heat transfer slide rail on the rack, and the rack guide rails are respectively provided on both sides of the rack. In the present invention, the chassis body adopts a closed design and has dust-proof and spray-proof functions. Since the heat dissipation in the present invention is all contact-type, the chassis body can adopt a completely closed chassis, which ensures the airtightness of the chassis and thus prevents water from entering the chassis and causing damage to internal components. Dust blockage no longer occurs on the surface of fans, heat dissipation fins, circuit boards and components. The computer room fire protection system no longer needs to worry about water mist entering the chassis, and can adopt an environmentally friendly and economical spray fire protection system. The data center built with the electronic equipment chassis using the present invention will be energy-saving, environmentally friendly, quiet, and have a PUE close to 1.

Description

Technical Field

[0001] The present invention relates to the technical field of computer room chassis, in particular to a rack-type electronic equipment chassis with a contact heat dissipation interface. Background Art

[0002] The network equipment chassis in data centers are basically standard 19-inch rack-mounted structures. These rack-mounted electronic devices are densely distributed and generate high heat. Their heat dissipation method is usually to set heat dissipation holes or airflow channels on the chassis to dissipate heat through air exchange inside and outside the chassis. To ensure the normal operation of equipment, each data center basically adopts the method of first cooling the air and then introducing the cold air into the electronic equipment chassis through the cabinet to dissipate heat for the equipment.

[0003] This traditional chassis has heat dissipation holes, through which dust and water can easily enter the interior of the chassis. Therefore, after the computer room is built, the fire protection system in the computer room cannot adopt a more environmentally friendly spray system. Therefore, the present invention proposes a rack-mounted electronic equipment chassis with a contact heat dissipation interface. Summary of the Invention

[0004] The purpose of the present invention is to solve the shortcomings of the prior art and to provide a rack-type electronic equipment chassis with a contact heat dissipation interface.

[0005] In order to achieve the above-mentioned object, the present invention adopts the following technical solution: a rack-type electronic equipment chassis with a contact heat dissipation interface, comprising a chassis body and a rack, wherein the side of the chassis body is provided with a chassis side panel, and the chassis side panel is provided with a guide pulley, and the guide pulley is slidably connected to the rack guide rail on the rack; the upper part of the rack guide rail is a heat transfer slide rail, and the rack guide rails are respectively provided on both sides of the rack.

[0006] The distance between the heat dissipation joint and the chassis mounting hole of the chassis body is consistent across multiple chassis. The corresponding distance between the heat transfer rail and the rack is also consistent across multiple racks, and the contact groove structure between the heat dissipation joint and the heat transfer rail is also consistent across multiple chassis. In this way, the mounting position of the chassis body on the rack is interchangeable and universal.

[0007] As a preferred embodiment, the heat dissipation joint is connected to a heat transfer slide rail on the rack guide rail, and one end of the heat transfer slide rail away from the heat dissipation joint is connected to a cold source pipe.

[0008] As a preferred embodiment, a support groove is provided on the other side of the chassis body away from the heat dissipation joint, and the support groove is slidably connected to the rack guide rail.

[0009] The technical effect of adopting the above-mentioned further solution is that the design of the support groove facilitates the connection between the chassis body and the rack rails. Since a pair of rack rails are provided, a common support groove can be opened on the other side of the chassis body where the heat generation is less, thereby reducing the production cost of the chassis body.

[0010] As a preferred embodiment, heat dissipation joints are provided on both sides of the chassis body, and the heat dissipation joints are slidably connected to the heat transfer slide rails on the rack guide rails.

[0011] The technical effect of adopting the above further solution is: since a pair of rack rails are provided, when the heat dissipation effect needs to be improved, the same heat dissipation joints can be opened on both sides of the chassis body with high heat generation, thereby improving the heat dissipation efficiency of the chassis body.

[0012] As a preferred embodiment, the chassis side panel is connected to the heat dissipation joint through a heat dissipation joint bracket, the other side of the heat dissipation joint bracket is in contact with the heat absorption plate, and the heat dissipation joint bracket is fixed to the chassis side panel through the bracket fixing hole.

[0013] As a preferred embodiment, a heat pipe interface is provided on the heat dissipation joint bracket, and the heat pipe interface is connected to the CPU heat collecting heat conductor through a heat pipe, and the CPU heat collecting heat conductor is in contact with the server main circuit board in the chassis body.

[0014] The technical effect of adopting the above further solution is: the heat generated by the CPU is collected by the CPU heat collector and heat conductor, and is conducted to the heat dissipation joint bracket through the heat pipe. The heat absorbing fins are in contact with the heat dissipation joint bracket, and the circulating fan in the chassis runs. The air inside the chassis body circulates through the heat absorbing fins to cool the air in the box.

[0015] As a preferred embodiment, a circulation fan in the chassis is installed on the heat-absorbing fin.

[0016] The technical effect of adopting the above further solution is that the design of the internal circulation fan of the chassis can ensure the circulation of air inside the chassis body.

[0017] Compared with the prior art, the advantages and positive effects of the present invention are:

[0018] The chassis body of the present invention does not rely on air exchange for heat dissipation, so that the chassis body can adopt a completely closed chassis. Dust will no longer clog the fan, heat dissipation fins, circuit boards and component surfaces, thereby avoiding damage to internal components caused by accidental water spraying into the chassis. The computer room fire protection system no longer needs to worry about water mist entering the chassis and can adopt an environmentally friendly and economical spray fire protection system. The data center built with the electronic equipment chassis using the present invention will be energy-saving, environmentally friendly and quiet. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the overall assembly of a rack-mounted electronic equipment chassis with a contact heat dissipation interface provided by the present invention;

[0020] Figure 2 A schematic diagram of a chassis side panel in a rack-mounted electronic equipment chassis with a contact heat dissipation interface provided by the present invention;

[0021] Figure 3 for Figure 1 AA section view;

[0022] Figure 4 A schematic diagram of a chassis body of a rack-mounted electronic equipment chassis with a contact heat dissipation interface provided by the present invention installed on a rack;

[0023] Figure 5 for Figure 4 AA section view;

[0024] Legend:

[0025] 1. Heat dissipation connector; 2. Heat dissipation connector bracket; 3. Heat absorption fins; 4. Internal circulation fan in the chassis; 5. Heat pipe interface; 6. Bracket fixing holes; 7. CPU heat collector and heat conductor; 8. Heat pipe; 9. Server main circuit board; 10. Support slot; 11. Chassis side panel; 12. Guide pulley; 13. Chassis body; 14. Cold source pipe; 15. Rack rail; 16. Heat transfer rail; 17. Rack; 18. Chassis mounting holes. DETAILED DESCRIPTION

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] Example

[0028] like Figure 1-5As shown, the present invention provides a technical solution: a rack-type electronic equipment chassis with a contact heat dissipation interface, comprising a chassis body 13 and a rack 17, a chassis side panel 11 is provided on the side of the chassis body 13, a guide pulley 12 is provided on the chassis side panel 11, and the guide pulley 12 is slidably connected to the rack guide rail 15 on the rack 17, the upper part of the rack guide rail 15 is a heat transfer slide rail 16, and the rack guide rails 15 are respectively arranged on both sides of the rack, the heat generated by the CPU is collected by the CPU heat collector 7, and conducted to the heat dissipation joint bracket 2 through the heat pipe 8, the heat absorption flap 3 is in contact with the heat dissipation joint bracket 2, the circulating fan 4 in the chassis is running, the air inside the chassis body 13 circulates through the heat absorption flap 3 to cool the air in the box, the heat dissipation joint bracket 2 conducts the absorbed heat to the heat dissipation joint 1, and the heat dissipation joint 1 also serves as a support for the chassis. When the chassis body 13 is put on the shelf, the guide pulley 12 is first The quasi-rack guide rail 15, with the sliding and auxiliary support of the guide pulley 12, inserts the chassis body 13 into the rack 17 with the heat transfer slide rail 16. After letting go, the heat dissipation joint 1 is connected to the rack heat transfer slide rail 16, and the end of the heat transfer slide rail 16 away from the heat dissipation joint 1 is connected to the cold source pipe 14, so that continuous heat dissipation is achieved inside the chassis. In order to reduce thermal resistance, thermal conductive paint or thermal conductive film can be added to the heat transfer contact surface of the heat dissipation joint 1 when the chassis body 13 is put on the rack; for electronic equipment with generally low heat generation, only the heat dissipation joint 1 needs to be used on one side. The support groove 10 in the present invention is an ordinary supporting member, which only plays the role of supporting the chassis body 13. When the electronic equipment generates a large amount of heat, the same heat dissipation joint 1 assembly can be installed on both sides to dissipate heat from the chassis, thereby doubling the heat dissipation capacity; after the chassis is completed on the rack, screws are screwed into the chassis mounting holes 18 to fix the chassis body 13 on the rack 17.

[0029] Among them, the heat pipe interface 5 is connected to one end of the heat pipe 8, and the other end of the heat pipe 8 is connected to the CPU heat collector 7. The CPU heat collector 7 is installed on the server main circuit board 9 inside the chassis body 13. The CPU heat collector 7 is connected to the heat dissipation joint bracket 2 through the heat pipe 8. The heat generated by the main heat-generating component CPU is collected by the CPU heat collector 7 and transferred to the heat dissipation joint bracket 2 through the heat pipe 8. The internal circulation fan 4 of the chassis is running, and the air inside the chassis body 13 is circulated through the heat-absorbing fins 3. The heat-absorbing fins 3 absorb heat from the airflow, cooling the air inside the chassis, thereby effectively dissipating heat from the electronic components inside the chassis body 13. This design can greatly improve the heat dissipation capacity of the chassis body 13.

[0030] The heat transfer rail 16 on the rack guide rail 15 installed on the rack 17 is connected to the cold source pipe 14 at one end away from the heat dissipation joint 1 , thereby ensuring that the chassis body 13 achieves continuous heat dissipation.

[0031] Among them, the lower contact surface of the heat dissipation joint 1 and the heat transfer slide rail 16 adopts an inverted V-shaped structure. The heat dissipation joint 1 and the heat transfer slide rail 16 are clamped together through the inverted V-shaped structure. The above-mentioned special structure is used for clamping. After the chassis body 13 is put on the shelf, the gravity of the chassis body 13 itself will cause the heat dissipation joint 1 and the heat transfer slide rail 16 to be clamped, so that the opposite side surfaces are also in close contact with each other for heat transfer. Gravity will not disappear due to fatigue, and the heat conduction surface can maintain long-lasting and reliable contact. When the chassis body 13 needs to be unloaded, the heat dissipation joint 1 and the heat transfer slide rail 16 can be separated by only slightly lifting the chassis body 13.

[0032] The heat transfer contact surface of the heat dissipation joint 1 is coated with thermal conductive paint. Adding thermal conductive paint to the heat transfer contact surface of the heat dissipation joint 1 can effectively reduce thermal resistance and improve the overall heat dissipation and thermal conductivity performance of the device.

[0033] When the electronic device generates a large amount of heat, the same heat dissipation connectors 1 can be provided on both sides of the chassis body 13 to improve the heat dissipation efficiency of the chassis body 13 and double the heat dissipation capacity.

[0034] Working principle: The present invention is provided with a heat dissipation joint 1 on one side or both sides of the chassis body 13. The heat dissipation joint 1 and the heat dissipation joint bracket 2 can be directly cast into a whole to reduce thermal resistance. The heat absorbing flap 3 can be set separately and then inserted into the heat pipe interface 5 on the heat dissipation joint bracket 2 in the form of a heat pipe 8. The heat absorbing flap 3 and the heat dissipation joint bracket 2 can also be cast or bonded into a whole. The heat absorbing flap 3 is used to absorb heat from the air in the chassis. The circulating airflow inside the chassis body 13 can be the heat dissipation airflow discharged from the power module in the box, which can pass through the heat absorbing flap 3, or it can be placed on the heat absorbing flap 3. A fan is installed on the chip 3 to circulate the air flow in the box. The high-power heating components (such as CPU, GPU) inside the chassis body 13 are thermally connected to the heat dissipation joint bracket 2 by direct connection of the heat pipe 8, that is, one end of the heat pipe 8 is connected to the heat collecting heat conductor of the high-power heating component, and the other end is connected to the heat pipe interface 5 on the heat dissipation joint bracket 2. The number of heat pipe interfaces 5 can be set as needed. For electronic equipment without high-power heating components, the heat dissipation joint bracket 2 can also be not provided with a heat pipe interface 5. The heat dissipation joint bracket 2 is fixed to the chassis side panel 11 by the bracket fixing hole 6, which is simple and convenient to install.

[0035] The end of the heat transfer rail 16 away from the heat dissipation joint 1 is connected to the cold source pipe 14, and the chassis body 13 is mounted on the rack 17. The heat dissipation joint 1 will be connected to the heat transfer rail 16. In order to reduce thermal resistance, a thermal conductive coating such as thermal grease, thermal conductive silica gel, etc. can be added to the heat transfer contact surface of the heat dissipation joint 1 to ensure that the heat dissipation inside the server chassis is achieved to the outside. For general electronic equipment with low heat generation, only a single-side heat dissipation joint 1 is needed. The support groove 10 of the chassis body 13 is an ordinary supporting member and only plays the role of supporting the chassis. When the chassis body 13 is inside, the heat dissipation joint 1 is heated. When the heat generated in the chassis is large, the same heat dissipation joints 1 and components can be installed on both sides to dissipate heat for the chassis, thereby doubling the heat dissipation capacity. With this design, the heat dissipation of the chassis body 13 is completely conducted through the heat dissipation joints 1, so that the chassis body 13 can adopt a closed design as a whole, thereby directly preventing dust and water droplets from entering the interior of the chassis body 13, so that the chassis has dustproof and spray-proof functions. In a computer room composed of such a chassis, in the event of a fire, a spray-type fire-fighting system can be directly used without worrying about water entering the chassis.

[0036] The above description is merely a preferred embodiment of the present invention and does not constitute any other form of limitation to the present invention. Any person skilled in the art may utilize the technical contents disclosed above to change or modify them into equivalent embodiments with equivalent changes for application in other fields. However, any simple modification, equivalent change, and modification of the above embodiments made in accordance with the technical essence of the present invention without departing from the technical solution of the present invention shall still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A rack-mounted electronic equipment chassis with a contact heat dissipation interface, comprising a chassis body (13), a heat dissipation joint (1), and a heat dissipation joint bracket (2), characterized in that: A heat dissipation joint bracket (2) is provided on the chassis side panel (11) of the chassis body (13), the heat dissipation joint (1) is connected to the heat dissipation joint bracket (2), the heat dissipation joint (1) is placed on the outside of the chassis body (13), the horizontal distance between the heat dissipation joint (1) and the chassis mounting hole (18) of the chassis body (13) has the same characteristics as multiple chassis, the contact groove surface of the heat dissipation joint (1) and the heat transfer slide rail (16) has the same characteristics as multiple chassis, the lower contact surface of the heat dissipation joint (1) and the heat transfer slide rail (16) adopts an inverted V-shaped structure, the heat dissipation joint (1) and the heat transfer slide rail (16) are connected by the inverted V-shaped structure, the heat dissipation joint (1) contacts the heat transfer slide rail (16) on the rack guide rail (15) on the rack (17), and the heat transfer slide rail (16) is away from the heat dissipation joint. One end of the joint (1) is connected to the cold source pipe (14), the chassis side panel (11) is connected to the heat dissipation joint (1) through the heat dissipation joint bracket (2), the other side of the heat dissipation joint bracket (2) is in contact with the heat absorption flap (3), the heat dissipation joint bracket (2) is fixed to the chassis side panel (11) through the bracket fixing hole (6), a heat pipe interface (5) is provided on the heat dissipation joint bracket (2), the heat pipe interface (5) is connected to the CPU heat collection heat conductor (7) through the heat pipe (8), the CPU heat collection heat conductor (7) is in contact with the server main circuit board (9) in the chassis body (13), the heat absorption flap (3) and the heat dissipation joint bracket (2) are cast into a whole, and the chassis side panel (11) of the chassis body (13) and the heat dissipation joint bracket (2) are cast into a whole.

2. A rack-mounted electronic equipment chassis with a contact heat dissipation interface according to claim 1, characterized in that: A guide pulley (12) is provided at the rear of the chassis side plate (11) of the chassis body (13).

3. The rack-mounted electronic equipment chassis with a contact heat dissipation interface according to claim 1, characterized in that: An internal circulation fan (4) is installed on the heat-absorbing fin (3).

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