Miniature pressure touch switch and manufacturing method

Abstract

The present invention discloses a miniature pressure-touch switch and a manufacturing method, wherein the miniature pressure-touch switch includes: a base, an electrode, and a pad conductor. Two pad conductors are provided on the back of the base, and the base is provided with a through hole. A through-hole conductor is provided in the through hole, and the through-hole conductor connects the electrode and the pad conductor to each other. An upper pressure-touch membrane is provided above the base, and a conductor layer is provided on the back of the upper pressure-touch membrane. When the upper pressure-touch membrane is squeezed by an external force, it deforms toward the base so that the conductor layer of the upper pressure-touch membrane contacts the electrode on the front of the base, and the positive electrode and the negative electrode are connected to form an electrical path. When the external force is removed from the upper pressure-touch membrane, the upper pressure-touch membrane returns to its original state, so that the conductor layer of the upper pressure-touch membrane is separated from the electrode on the front of the base, and the positive electrode and the negative electrode are restored to a disconnected state. The miniature pressure-touch switch of the present invention has a compact structure, is easy to trigger, and has the function of preventing accidental touches.

Description

Technical Field

[0001] The present invention relates to the technical field of miniature pressure touch switches, and in particular to a miniature pressure touch switch with a compact structure, easy triggering, and accidental touch prevention, and a manufacturing method thereof. Background Art

[0002] To smoke with current HNB electronic cigarettes, users first insert a cigarette pod (i.e., a cigarette) into the device and then press the power button to activate the preheating function for approximately 15 seconds. After the preheating period, normal smoking can begin. However, users often accidentally press the power button while the device is in their pocket, causing the preheating function to start without a cigarette pod inserted, resulting in a waste of battery power. Therefore, a small, miniature pressure-activated switch was considered, installed at the bottom of the device's inner cavity, where the cigarette pod is located. When the user inserts the cigarette pod, the top of the pod activates the miniature pressure-activated switch, closing its electrodes and activating the preheating function. Normally, when no cigarette pod (i.e., a cigarette) is inserted, the miniature pressure-activated switch will not be induced by pressure and malfunction.

[0003] There are also some touch switches on the market, their appearance and electrical principles are as follows Figure 1 、 Figure 2 These touch switch products commonly have the following issues: 1. High actuation pressure, typically exceeding 3.0N; 2. The operating portion is a small cylindrical shape, with a cross-sectional diameter typically less than 3mm; 3. The product height (thickness) is excessive; even SMD models are over 3mm tall (thick); 4. The operating portion and main body of these products are typically made of engineering plastics, typically withstanding a maximum operating temperature of less than 200°C; 5. The structural construction of these products generally utilizes riveting, which typically restricts their design to a square shape.

[0004] Because the tobacco in an e-cigarette (or cigarette) is typically loose, the top section of the cigarette is very soft. This makes it difficult to quickly and effectively trigger the current touch switch technology products on the market, which have a trigger pressure of over 3.0N. Furthermore, during operation, the temperature inside the e-cigarette cavity is generally above 260°C. Current touch switch technology products on the market cannot meet the operating temperature requirements of e-cigarettes. Furthermore, their height (thickness) and square structure make them difficult to assemble with the circular tubular cavity of an e-cigarette.

[0005] Therefore, there is an urgent need for a compact, easy-to-trigger, and accidentally-touch-proof miniature pressure-touch switch and a manufacturing method thereof. Summary of the Invention

[0006] The purpose of the present invention is to provide a compact, easy-to-trigger, and accidentally-touch-proof miniature pressure-activated switch and a manufacturing method thereof.

[0007] In order to achieve the above-mentioned object, the technical solution provided by the present invention is to provide a miniature pressure touch switch, comprising:

[0008] A base, wherein the base is made of insulating material;

[0009] Electrodes, the electrodes are arranged on the front side of the base, wherein the electrodes are positive electrodes and negative electrodes;

[0010] Pad conductors, two pad conductors are provided on the back of the base, through holes are provided through the upper and lower surfaces of the base, and through-hole conductors are provided in the through holes, and the through-hole conductors connect the electrodes on the front of the base with the pad conductors on the back of the base;

[0011] An upper pressure-touch membrane is provided above the base, and a conductor layer is provided on the back side of the upper pressure-touch membrane. When the upper pressure-touch membrane is squeezed by an external force, it deforms toward the base so that the conductor layer of the upper pressure-touch membrane contacts the electrode on the front side of the base, and the positive electrode and the negative electrode are connected to form an electrical path; when the external force is removed from the upper pressure-touch membrane, the upper pressure-touch membrane returns to its original state, so that the conductor layer of the upper pressure-touch membrane is separated from the electrode on the front side of the base, and the positive electrode and the negative electrode are restored to a disconnected state.

[0012] The base is made of alumina ceramics; the electrode is made of silver, silver palladium, silver platinum, or a silver-platinum-palladium alloy.

[0013] The positive electrode and the negative electrode are both in a fork-shaped structure, and are arranged on the front side of the base in a manner of crossing each other.

[0014] The upper pressure-touch film can be a metal foil or an insulating film. If an insulating film is used as the pressure-touch film, the conductor layer is provided on the insulating film. The insulating film is a polyimide film, and the conductor layer is silver or copper metal.

[0015] In order to achieve the above object, the present invention further provides a method for manufacturing a pressure-activated switch, comprising:

[0016] a. Steps for making the upper pressure-activated membrane:

[0017] When the upper pressure-touch membrane is made of metal foil, a molding process is used to stamp the metal foil into a strip with a central protrusion in the shape of a pot lid and a flat edge in the shape of a hat brim;

[0018] Using a die cutting or laser cutting process, the metal foil strip that has been punched out into the upper pressure-touch membrane unit pieces;

[0019] When the upper pressure-touch film is made of an insulating film, a conductor pattern is printed on the strip or sheet insulating film;

[0020] Using a die cutting or laser cutting process, the insulating film with the conductor pattern formed thereon is cut into the upper pressure-touch film of the unit chip;

[0021] b. Steps for making the base:

[0022] The base is made of an insulating ceramic substrate, and through holes are provided through the upper and lower surfaces of the base;

[0023] c. Electrode production steps:

[0024] Using thick film forming technology or thin film forming technology, the front printed electrodes and through-hole conductors of the base are manufactured on the insulating ceramic substrate;

[0025] d. Steps for making pad conductor:

[0026] A pad conductor is formed on the back surface of the base, and the through-hole conductor connects the electrode on the front surface of the base to the pad conductor accordingly.

[0027] e. Steps for making the insulating mucous membrane layer:

[0028] Using a screen printing process, a resin slurry or a dielectric slurry is printed on the front surface of the insulating ceramic substrate to form an insulating adhesive film layer;

[0029] f. Bonding steps:

[0030] On the basis of the semi-finished product formed after the above steps ae, the upper pressure-trigger membrane is attached to the base, and the upper pressure-trigger membrane and the base are adhered and fixed by the insulating adhesive film layer.

[0031] g. baking step;

[0032] Baking the semi-finished product formed in step g at 150-250° C. for 3-30 minutes;

[0033] h. Cutting steps:

[0034] According to the pre-set unit longitudinal cutting grooves, transverse cutting grooves and circular cutting grooves on the insulating ceramic substrate, the semi-finished product processed by the above process is broken apart to form a single pressure touch switch product.

[0035] Also includes:

[0036] i. Lead welding steps:

[0037] The lead pins are soldered to the pad conductors.

[0038] In the step of manufacturing the upper pressure-touch film, a conductor pattern is printed on a strip or sheet of insulating film. Specifically, the conductor material of the conductor pattern can be a silver conductor paste or a copper conductor paste, and is baked at a temperature of 150-250°C for 3-30 minutes, or a copper foil is laminated on the insulating film using an FPC process, and nickel-tin can be plated on the copper foil.

[0039] The electrode production steps are as follows:

[0040] When using thick film forming technology, a screen printing process is used to print a conductive paste of precious metals such as silver, gold, palladium, platinum, or their alloys on the insulating ceramic substrate to form the electrodes, through-hole conductors, and pad conductors; the semi-finished product is then placed in a high-temperature furnace at 850°C and fired to form a conductive functional film layer.

[0041] The electrode production steps are as follows:

[0042] When thin film forming technology is used, gold, palladium, platinum, silver or their alloys, or nickel, chromium base metals or their alloys are deposited on the ceramic substrate using a thin film deposition process, and the electrodes, through-hole conductors and pad conductors are made using a semiconductor process photolithography mask wet etching method.

[0043] The photolithography mask wet etching method specifically forms a photosensitive film on the electrode layer for photolithography patterning, and removes the redundant parts outside the electrode pattern by wet etching.

[0044] The technical solution of the present invention effectively solves these shortcomings and meets the requirements of HNB electronic cigarettes and similar applications.

[0045] Compared with existing touch switch products, the present invention has the following obvious advantages:

[0046] 1. Low actuation pressure and high sensitivity. Compared to the actuation pressure of current tact switches, which are mostly over 3.0N, the actuation pressure of the miniature pressure-touch switch of the present invention is only within 0.5N. Using the top cross-section of a cigarette, the upper pressure-touch membrane can be quickly and effectively pressed and deformed, turning the switch on.

[0047] 2. Thin thickness and small size, the maximum product thickness is only 1.5mm and the minimum is only 0.6mm, easy to install.

[0048] 3. The upper limit of the operating temperature range is high and can withstand operating temperatures above 280°C.

[0049] 4. It can be designed to be round, square or polygonal to meet the matching assembly of the circular tubular inner cavity of the electronic cigarette device.

[0050] The present invention will become more apparent from the following description taken in conjunction with the accompanying drawings, which are used to illustrate embodiments of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 Shown is a structural diagram of a touch switch in the prior art.

[0052] Figure 2 Shown is an electrical schematic diagram of a touch switch in the prior art.

[0053] Figure 3 FIG. 1 is a schematic structural diagram of an embodiment of a miniature pressure-touch switch according to the present invention.

[0054] Figure 4 Shown is an electrical schematic diagram of the present invention.

[0055] Figure 5a Shown is a view of a working state of the miniature pressure touch switch of the present invention.

[0056] Figure 5b Shown is an electrical schematic diagram of a working state of the miniature pressure touch switch of the present invention.

[0057] Figure 6a FIG. 1 is a view showing another working state of the miniature pressure touch switch of the present invention.

[0058] Figure 6b Shown is an electrical schematic diagram of another working state of the miniature pressure touch switch of the present invention.

[0059] Figure 7a Shown is a view of the upper pressure-activated membrane.

[0060] Figure 7b Another view of the upper pressure-activated membrane.

[0061] Figure 8 The figure shows a schematic diagram of printing a conductor pattern on a tape or sheet insulating film.

[0062] Figure 9 Shown is a schematic diagram of the upper pressure-activated membrane of a unit chip.

[0063] Figure 10 Shown is a plan view of an insulating ceramic substrate.

[0064] Figure 11The figure shows a schematic diagram of forming a front fork-shaped electrode by printing on an insulating ceramic substrate.

[0065] Figure 12 The figure shows a schematic diagram of fabricating a backside pad conductor on an insulating ceramic substrate.

[0066] Figure 13 The figure shows a schematic diagram of forming an insulating adhesive film layer on the front surface of an insulating ceramic substrate.

[0067] Figure 14 The diagram shows a case where no through-hole is provided in each base unit.

[0068] Figure 15 The figure shows a schematic diagram of the side conductor connecting the fork-shaped electrode on the front side of the base to the pad on the back side of the base.

[0069] Figure 16 、 17 The diagram shows a side-coated conductor connecting the front-side electrode of the base to the pad on the back of the base.

[0070] Figure 18 、 19 The diagram shows a schematic diagram of the front electrodes of the base being two sets of electrodes in a cross shape, or being designed in a symmetrical shape. DETAILED DESCRIPTION

[0071] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0072] The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the figures is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by those skilled in the art based on the embodiments of the present invention without inventive effort are intended to be within the scope of protection of the present invention.

[0073] Hereinafter, when the terms "including", "having" and their cognates are used in various embodiments of the present invention, they are intended only to indicate specific features, numbers, steps, operations, elements, components or combinations of the foregoing items, and should not be understood as first excluding the existence of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing items or the possibility of adding one or more features, numbers, steps, operations, elements, components or combinations of the foregoing items.

[0074] In addition, when the present invention involves terms such as “first”, “second”, and “third”, they are only used for description and distinction, and cannot be understood as indicating or implying relative importance.

[0075] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which the various embodiments of the present invention pertain. The terms (such as those defined in generally used dictionaries) will be interpreted as having the same meaning as in the context of the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning unless clearly defined in the various embodiments of the present invention.

[0076] 1. First, the product structure of the miniature pressure touch switch of the present invention is introduced:

[0077] like Figure 3 As shown, the miniature pressure-touch switch of the present invention comprises a base 200, an upper pressure-touch membrane 100, and lead pins 300. The front of the base 200 is provided with two intersecting forked electrodes 205, and the back of the base is provided with two solder pad conductors 207. The base 200 is provided with a through-hole 204, and a through-hole conductor 206 is disposed within the through-hole 204, electrically connecting the forked electrodes 205 on the front of the base 200 to the solder pad conductors 207 on the back of the base 200. The material of the base 200 is preferably alumina ceramic with high insulation properties and mechanical strength. The electrode material of the two sets of forked electrodes 205 is preferably silver, silver-palladium, silver-platinum, or a silver-platinum-palladium alloy. It should be noted that the two sets of forked electrodes 205 are respectively the positive and negative electrodes.

[0078] The upper pressure-touch membrane 100 can be made of either metal foil or insulating film. If an insulating film is used as the pressure-touch membrane, a conductive layer must be formed on top of it. The insulating film is preferably a polyimide (PI) film. The conductive layer is preferably silver or copper metal, and is bonded to the upper pressure-touch membrane using a resin slurry or dielectric slurry.

[0079] It should be noted that the front electrodes of the base 200 can be designed as two sets of electrodes in a cross shape; or they can be designed as two sets of electrodes in a symmetrical shape. The design of two sets of electrodes in a cross shape is preferred. Compared with the two sets of electrodes in a symmetrical shape, the design of two sets of electrodes in a cross shape has a higher touch sensitivity. Figure 18 、 Figure 19 Reference Figure 18 , the base 200 is provided with a through hole 204, the fork-shaped electrode 205 on the front of the base 200 is correspondingly connected to the pad conductor 207 on the back of the base 200; Figure 19 The base 200 is provided with a through hole 204 , and the symmetrical electrodes on the front side of the base 200 are correspondingly connected to the pad conductor 207 on the back side of the base 200 .

[0080] It should be noted that the connection between the front electrode of the base 200 and the pad conductor 207 on the back can be achieved by providing a through hole 204 on the base 200 and providing a through hole conductor 206 in the through hole 204, so that the through hole conductor 206 in the through hole 204 connects the front electrode of the base 200 to the pad conductor 207 on the back of the base; or by coating a conductor on the side of the base 200, so that the conductor 208 coated on the side connects the fork-shaped electrode 205 on the front of the base to the pad conductor 207 on the back of the base. Figure 16 、 Figure 17 As shown, Figure 16 It is a schematic diagram before the side surface of the base 200 is coated with a conductor. Figure 17 FIG. 2 is a schematic diagram showing the side of the base 200 after the conductor is coated.

[0081] In addition, the product can be connected to the external circuit by connecting two leads to the pad conductor on the back of the base and then connecting to the external circuit board through the leads; or the surface mounting process can be used to directly solder the pad conductor on the back of the base to the external circuit board.

[0082] The structure, construction, working principle and manufacturing method of the miniature pressure touch switch of the present invention will be described in detail below with reference to the accompanying drawings:

[0083] 2. Explain the working principle of the present invention:

[0084] Referring to Figures 5a-6b, the operating principle of the miniature pressure-touch switch of the present invention is as follows: Referring to Figure 5a, when the upper pressure-touch membrane is squeezed by an external force, it deforms toward the base, causing the upper pressure-touch membrane to contact the two sets of forked electrodes on the front of the base, thereby establishing electrical conduction between the two sets of forked electrodes on the front of the base.

[0085] refer to Figure 6a When the external force is removed from the upper pressure-touch membrane, the upper pressure-touch membrane returns to its original state, causing the upper pressure-touch membrane to separate from the forked electrodes on the front of the base, thereby restoring the disconnected state between the two sets of intersecting forked electrodes on the base, cutting off the electrical connection. Figure 6b shown.

[0086] 3. The following is a detailed description of the method for manufacturing the invented miniature pressure touch switch:

[0087] The manufacturing method and steps of the miniature pressure touch switch of the present invention are as follows:

[0088] 3.1 Preparation method of upper pressure-activated membrane:

[0089] 3.1.1 The manufacturing method of the upper pressure-activated membrane is a metal foil technical solution:

[0090] 3.1.1.1 Using the die-stamping process, stamp out a strip of metal foil with a raised center in the shape of a pot lid and a flat edge in the shape of a hat brim.

[0091] 3.1.2 The upper pressure-activated film is an insulating film.

[0092] 3.1.2.1 As Figure 8 As shown, a conductor pattern 101B is printed on a strip or sheet of insulating film 100B. The conductive material can be silver or copper conductive paste, and the paste is baked at 150-250°C for 3-30 minutes. Alternatively, an FPC process can be used to laminate copper foil onto the insulating film and, if desired, nickel-tin plate the copper foil.

[0093] 3.1.2.2 Use die cutting or laser cutting technology to punch out the outer shape of the insulating film with conductor pattern made in step 3.1.2.1 and cut it into the upper pressure-touch film 100B of the unit chip for later use. Figure 9 As shown, the upper portion of the unit chip is pressed against a film 100B, and a conductor pattern 101B is printed on the insulating film 100B.

[0094] 3.2 Base production method:

[0095] 3.2.1 Plan view of base 200 Figure 10 As shown, the base 200 is an insulating ceramic substrate, and the unit longitudinal cutting grooves 201, transverse cutting grooves 202, and circular cutting grooves 203 are pre-set. These cutting grooves help to divide it into small rectangular units in the subsequent process; each base unit is provided with a through hole 204, which is set through the front and back of the insulating ceramic substrate.

[0096] 3.2.2 Reference Figure 3 、 11 12. Using thick film or thin film forming technology, fork-shaped electrodes 205 and through-hole conductors 206 are printed on the front surface of the base on an insulating ceramic substrate, and pad conductors 207 are formed on the back surface of the base. Through-hole conductors 206 connect the fork-shaped electrodes 205 on the front surface of the base to the pad conductors 207 on the back surface of the base.

[0097] It should be noted that the advantage of configuring the electrode as a forked electrode 205 is that the upper pressure-activated membrane can contact the forked electrode 205 with minimal deformation, thereby connecting the positive and negative electrodes of the forked electrode 205 .

[0098] 3.2.3 When using thick film forming technology, a screen printing process is used to print a conductive paste of precious metals such as silver, gold, palladium, platinum, or their alloys on an insulating ceramic substrate to form the front fork electrode 205, through-hole conductor 206, and back pad conductor 207; the semi-finished product is then placed in a high-temperature furnace at 850°C and fired to form a conductive functional film layer.

[0099] 3.2.4 When using thin film forming technology, a thin film deposition process is used, such as thermal evaporation, sputtering, chemical vapor deposition, plasma enhanced chemical vapor deposition and other deposition processes, which will not be described in detail here. Through this thin film forming technology, precious metals such as gold, palladium, platinum, silver or their alloys, or base metals such as nickel, chromium or their alloys, are deposited on the ceramic substrate. The forked electrode 205, through-hole conductor 206 and back pad conductor 207 on the front of the base can be made using the semiconductor process's photolithography mask wet etching method, that is, a layer of photosensitive film is formed on the bottom electrode layer for photolithography patterning, and the excess part outside the electrode pattern is removed by wet etching. In addition, it can also be any of the printing mask sputtering method and the mechanical mask sputtering method, and the present invention does not limit this.

[0100] 3.2.5 Reference Figure 13 Based on the semi-finished product of steps 3.2.1 to 3.2.4, a resin slurry or a dielectric slurry is printed on the front surface of the insulating ceramic substrate using a screen printing process to form an insulating adhesive film layer 209 .

[0101] 3.2.6 Reference Figure 7a 、 7b The upper pressure-touch film 100B of the unit chip manufactured in step 2.1 is attached to the base 200 , and the upper pressure-touch film 100B and the base 200 are adhered and fixed by an insulating adhesive film layer 209 .

[0102] 3.2.7 Bake the semi-finished product from step 3.2.6 at 150-250°C for 3-30 minutes.

[0103] 3.2.8 According to the pre-set unit longitudinal cutting grooves 201, transverse cutting grooves 202, and circular cutting grooves 203 on the insulating ceramic substrate, the semi-finished product processed by the above process is broken apart to form individual pressure touch switch products.

[0104] S1: The above-mentioned manufacturing steps 3.2.1 to 3.2.8 are a technical solution for connecting the front electrode of the base and the pad conductor on the back of the base by providing a through hole in the base and providing a through hole conductor 206 in the through hole.

[0105] If the technical solution is to use a conductor coated on the side of the base and connect the base front electrode to the base back pad conductor through the side coated conductor, then:

[0106] In the original step 3.2.1, each base unit is no longer provided with a through hole 204, such as Figure 14 As shown, Figure 14 There is no through hole 204 in the embodiment. Figure 14 A base 200 , pre-set unit longitudinal cutting grooves 201 , transverse cutting grooves 202 , and circular cutting grooves 203 are shown.

[0107] In the original step 3.2.2, refer to Figure 15 , there is no need to make through-hole conductors 206. Instead, after the multiple connected pieces of the panel are separated to form a single pressure-touch switch product in step 3.2.8, side conductors 208 are applied to the side surfaces. The side conductors 208 connect the forked electrodes 205 on the front of the base to the pad conductors 207 on the back of the base.

[0108] It should be noted that the reference Figure 15 By way of example, the upper pressure-touch film 100 , the conductor pattern 101 printed on the upper pressure-touch film 100 , the substrate 200 , the fork-shaped electrode 205 , the through-hole conductor 206 , the side conductor 208 , the insulating adhesive film layer 209 , and the lead pin 300 are shown.

[0109] 3.3 Solder the lead pin 300 to the pad conductor on the back of the base.

[0110] S2: Reference Figure 16 、 17 Step 3.3 involves soldering two leads to the pad conductor on the back of the base, which is then connected to the external circuit board. If a surface mount process is used to solder the pad conductor directly to the external circuit board, step 3.3 can be omitted.

[0111] It should be noted that the reference Figure 16 By way of example, the upper pressure-touch film 100 , the conductor pattern 101 printed on the upper pressure-touch film 100 , the substrate 200 , the fork-shaped electrode 205 , the through-hole conductor 206 , the side conductor 208 , and the insulating adhesive film layer 209 are shown.

[0112] Among them, reference Figure 17 ,and Figure 16 The difference is that the pupil conductor 206 is not provided, but the side conductor 208 is additionally provided.

[0113] 3.4Perform performance testing, sorting, packaging and storage of finished pressure-touch switches.

[0114] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention are still within the scope of the present invention.

Claims

1. A miniature pressure-activated switch for an electronic cigarette, characterized in that: include: A base, wherein the base is made of insulating material; Electrodes, the electrodes are arranged on the front side of the base, wherein the electrodes are positive electrodes and negative electrodes; Pad conductors, two pad conductors are provided on the back of the base, through holes are provided through the upper and lower surfaces of the base, and through-hole conductors are provided in the through holes, and the through-hole conductors connect the electrodes on the front of the base with the pad conductors on the back of the base; an upper pressure-touch membrane, the upper pressure-touch membrane being disposed above the base, with a conductor layer disposed on a rear surface thereof. When the upper pressure-touch membrane is squeezed by an external force, the upper pressure-touch membrane deforms toward the base, so that the conductor layer of the upper pressure-touch membrane contacts the electrode on the front surface of the base, thereby forming an electrical path between the positive electrode and the negative electrode; When the external force is removed from the upper pressure-touch membrane, the upper pressure-touch membrane returns to its original state, so that the conductor layer of the upper pressure-touch membrane is separated from the electrode on the front surface of the base, and the positive electrode and the negative electrode are restored to a disconnected state; The upper pressure-touch film is a conductive layer provided on an insulating film, wherein the insulating film is a polyimide film, and the conductive layer is silver or copper metal; The positive electrode and the negative electrode are both in a fork-shaped structure, and are arranged on the front side of the base in a manner of crossing each other.

2. The pressure-activated switch according to claim 1, wherein: The base is made of alumina ceramics; the electrode is made of silver, silver palladium, silver platinum, or a silver-platinum-palladium alloy.

3. A method for manufacturing a pressure-activated switch according to claim 1, characterized in that: include: a. Steps for making the upper pressure-activated membrane: Printing conductor patterns on strip or sheet insulating films; Using a die cutting or laser cutting process, the insulating film with the conductor pattern formed thereon is cut into the upper pressure-touch film of the unit chip; b. Steps for making the base: The base is made of an insulating ceramic substrate, and through holes are provided through the upper and lower surfaces of the base; c. Electrode production steps: Using thick film forming technology or thin film forming technology, the front printed electrodes and through-hole conductors of the base are manufactured on the insulating ceramic substrate; d. Steps for making pad conductor: A pad conductor is formed on the back of the base, and the through-hole conductor connects the electrode on the front of the base to the pad conductor; e. Steps for making the insulating mucous membrane layer: Using a screen printing process, a resin slurry or a dielectric slurry is printed on the front surface of the insulating ceramic substrate to form an insulating adhesive film layer; f. Bonding steps: On the basis of the semi-finished product formed after the above steps ae, the upper pressure-trigger membrane is attached to the base, and the upper pressure-trigger membrane and the base are adhered and fixed by the insulating adhesive film layer; g. baking step; Baking the semi-finished product formed in step f at 150-250° C. for 3-30 minutes; h. Cutting steps: According to the pre-set unit longitudinal cutting grooves, transverse cutting grooves and circular cutting grooves on the insulating ceramic substrate, the semi-finished product processed in the baking step g is broken apart to form a single pressure touch switch product.

4. The method for manufacturing a pressure-activated switch according to claim 3, wherein: Also includes: i. Lead welding steps: The lead pins are soldered to the pad conductors.

5. The method for manufacturing a pressure-activated switch according to claim 3, wherein: In the step of manufacturing the upper pressure-touch film, a conductor pattern is printed on a strip or sheet of insulating film. Specifically, the conductor material of the conductor pattern is silver conductor paste or copper conductor paste, and the conductor is baked at a temperature of 150-250°C for 3-30 minutes, or a copper foil is laminated on the insulating film using an FPC process, and nickel-tin is plated on the copper foil.

6. The method for manufacturing a pressure-activated switch according to claim 3, wherein: The electrode production steps are as follows: When thick film forming technology is used, a screen printing process is used to print a conductive paste of silver, gold, palladium, platinum or their alloys on the insulating ceramic substrate to form the electrodes and through-hole conductors; the semi-finished product is then placed in a high-temperature furnace at 850°C and fired to form a conductive functional film layer.

7. The method for manufacturing a pressure-activated switch according to claim 3, wherein: The electrode production steps are as follows: When thin film forming technology is used, gold, palladium, platinum, silver or their alloys, or nickel, chromium or their alloys are deposited on the ceramic substrate using a thin film deposition process, and the electrodes and through-hole conductors are made using a semiconductor process photolithography mask wet etching method.

8. The method for manufacturing a pressure-activated switch according to claim 7, wherein: The photolithography mask wet etching method specifically forms a photosensitive film on the electrode layer for photolithography patterning, and removes the redundant parts outside the electrode pattern by wet etching.

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