Switchgear arrangement with at least one IT rack or switchgear cabinet housing and at least one cooling device and corresponding method

Abstract

The invention relates to a switchgear device having at least one IT rack or switchgear housing (1) and at least one cooling device (2) having an air-liquid heat exchanger (3) for cooling components (4) accommodated in the IT rack or switchgear housing (1) using cooling air, wherein the air-liquid heat exchanger (3) has a first supply line (5) for cooling liquid and a first return line (6) for heating liquid, characterized in that the cooling device (2) has a liquid-liquid heat exchanger (7) to which the first return line (6) of the air-liquid heat exchanger (3) is connected on a second supply line (8) thereof. A corresponding method is also described.

Description

Technical Field

[0001] This invention is based on a switchgear assembly having at least one IT rack or switchgear housing and at least one cooling device having an air-liquid heat exchanger for cooling components housed in the IT rack or switchgear housing using cooling air, wherein the air-liquid heat exchanger has a first supply line for cooling liquid and a first return line for heating liquid. Such a switchgear assembly is known, for example, from DE 10 2015 101 022B3. Background Technology

[0002] Components housed in switchgear enclosures or IT racks typically exhibit power losses highly dependent on their construction and correspondingly, significantly different cooling capacity requirements. Conversely, in typical switchgear installations, cooling capacity is provided independently of the components using cooling air at the same temperature, which flows around the components requiring cooling. Therefore, the cooling air temperature and its flow rate are always set in a way that provides sufficient cooling for the components with the highest cooling capacity requirements. However, this can lead to overcooling of components with lower cooling needs, resulting in an overall inefficient cooling scheme for the switchgear installation. Summary of the Invention

[0003] Therefore, the object of the present invention is to further improve the switchgear device of the above type, so as to enable energy-saving cooling of components with different cooling capacity requirements in the same switchgear device.

[0004] This objective is achieved by a switch cabinet device having the features of claim 1. The dependent claims all relate to advantageous embodiments of the invention.

[0005] According to this regulation, the cooling equipment has a liquid-liquid-heat exchanger, and the first loop line of the air-liquid-heat exchanger is connected to its second supply line.

[0006] Therefore, the concept of this invention is to provide a second heat transfer between two liquids in addition to the standard air-liquid-heat transfer by means of an additional liquid-liquid-heat exchanger. Since liquids have better thermal conductivity than air, a cooling liquid can be provided for cooling components requiring higher cooling capacity. Furthermore, the improved thermal conductivity of liquids compared to air allows for liquid cooling of components by selecting a liquid supply temperature higher than the temperature of the cooling air. Therefore, the heated liquid flowing from the loop line of the air-liquid-heat exchanger is still sufficient to provide adequate cooling to the second liquid when fed into the supply line of the liquid-liquid-heat exchanger for direct cooling of the components. Thus, the switchgear device according to the invention can achieve cooling to at least two different temperature levels: one is the temperature level of the cooling air flowing from the air-liquid-heat exchanger, and the other is the temperature level of the cooling liquid provided by the liquid-liquid-heat exchanger, wherein the cooling liquid provided by the liquid-liquid-heat exchanger can be significantly hotter than the cooling air, for example, at least 20 K higher.

[0007] According to the principles of the present invention, adjustments can be made arbitrarily. Instead of a liquid-liquid-heat exchanger, multiple liquid-liquid-heat exchangers can be fed by a loop line from an air-liquid-heat exchanger. By appropriately selecting the second liquid for directly cooling the components, by appropriately selecting the flow rate of the corresponding liquid flowing through the liquid-liquid-heat exchanger, and by further changing the operating parameters if necessary, the temperature of the separately supplied second liquid can be adjusted, thereby providing a large number of different cooling liquid supply temperatures for the switchgear device according to the principles of the present invention, for directly cooling components with different cooling capacity requirements.

[0008] An air-liquid heat exchanger may be a component of a first cooling circuit, and a liquid-liquid heat exchanger may be a component of a second cooling circuit separate from the first cooling circuit. The first and / or second cooling circuits may have at least one coolant or refrigerant or another cooling medium, which is at least partially liquid, and circulate in the respective circuit. These two cooling media may differ, particularly in their condensation temperatures, at which they transform from at least partially a gaseous phase to a liquid phase.

[0009] The liquid guided through the air-liquid-heat exchanger can be water, or a liquid that is mostly water.

[0010] The first liquid of the two liquids guided through the liquid-liquid-heat exchanger may, under standard conditions, have a boiling point lower than that of the second liquid guided through the liquid-liquid-heat exchanger, preferably at least 20 K, particularly preferably at least 30 K, and even more particularly preferably at least 40 K below the boiling point of the second liquid.

[0011] The second of the two liquids guided through the liquid-liquid-heat exchanger can be or has a perfluorinated compound, preferably a compound derived from ethyl isopropyl ketone, and particularly preferably perfluorinated (2-methyl-3-pentanone), C6F... 12 O.

[0012] The second of the two liquids guided through the liquid-liquid-heat exchanger can be introduced from the third loop line of the liquid-liquid-heat exchanger into the heat conductor guiding the liquid for conduction cooling.

[0013] The second of the two liquids guided through the liquid-liquid-heat exchanger can be introduced from the heat conductor guiding the liquid into the third supply line of the liquid-liquid-heat exchanger.

[0014] A liquid-liquid heat exchanger can be a cooling zone of a heat pipe or a distribution pipe. A liquid-liquid heat exchanger can be constructed as a single unit or composed of multiple liquid-liquid heat exchangers connected in series or parallel.

[0015] Heat pipes or distribution pipes can have downpipes and risers, which are designed as vertical lines fluidly separated from each other, or are fluidly connected to each other in the lowest region of the heat pipe or distribution pipe via a siphon and / or a coolant collection container. Liquid coolant can be pumped from the coolant collection container into the supply line of the heat conductor for conductive cooling of the semiconductor components.

[0016] The heat pipe or distribution pipe may have a downcomer into which a second liquid cooled from the liquid-liquid heat exchanger is introduced.

[0017] The heat pipe or distribution pipe may have a riser into which a heated second liquid is introduced.

[0018] From a recooler, such as an ice machine, the cooled liquid can be introduced into an air-liquid-heat exchanger through a first supply line for the cooled liquid.

[0019] The cooled liquid can be introduced into the recooler as the heating liquid from the liquid-liquid-heat exchanger.

[0020] Cooling equipment can be arranged in a series of IT racks or switch cabinet housings, through which hot air is drawn in from the hot aisle and blown out as cold air along the side opposite to the rear or front into the cold aisle.

[0021] The cooling equipment can be housed within the switchgear enclosure and has a lateral cooling air outlet and a warm air inlet opening on the same side, with multiple heating elements disposed between them. Within the switchgear enclosure, cooling air discharged from the cooling air outlet can pass through the elements, or pass through these elements as hot air into the warm air inlet.

[0022] The air-liquid heat exchanger for the first circuit and the liquid-liquid heat exchanger for the second circuit can be arranged in the rear or front door of a single-wall or double-wall design of the IT rack or switch cabinet housing. Here, air can flow through the air-liquid heat exchanger and the liquid-liquid heat exchanger, the air entering the IT rack or switch cabinet housing on the side opposite the rear or front door. For air supply, at least one fan can be provided, preferably multiple fans.

[0023] According to another aspect of the invention, the switchgear assembly is provided with at least one IT rack or switchgear housing, wherein air is guided through the IT rack or switchgear housing for cooling components housed within the IT rack or switchgear housing. In this case, a second air-liquid heat exchanger of the second cooling circuit is loaded by air, and liquid guided through the air-liquid heat exchanger is supplied to at least one component for heat transfer from the component to the liquid, and is guided back from the component to the air-liquid heat exchanger.

[0024] Air can be partially introduced from outside the switchgear assembly into at least one IT rack or switchgear housing, and partially into a cooling equipment housing allocated to and fluidly separated from the IT rack or switchgear housing, which houses an air-liquid heat exchanger. For this purpose, the air-liquid heat exchanger can be arranged within the cooling equipment housing allocated to the IT rack or switchgear housing. Another air-liquid heat exchanger with a refrigerant circuit, such as a water circuit, can also be provided within the cooling equipment housing, where cooling water is supplied via a recooler, such as an ice machine, to provide cooling air via the other air-liquid heat exchanger. One of the two air-liquid heat exchangers—through which the cooling liquid for direct cooling of the components is supplied—can be arranged downstream of the air-liquid heat exchanger in the airflow, providing cooled air for air cooling of the components. Specifically, in the above manner, direct liquid cooling of the components can be achieved using a refrigerant with a higher boiling point than air, which is typically used for air cooling of components in, for example, IT environments. For example, the cooling air loaded onto the components may have a temperature of 25°C, while the refrigerant has a boiling point above 50°C.

[0025] Air can be introduced from outside the switchgear unit into at least one IT rack or switchgear housing, wherein the switchgear unit has an air guide section, in which air flows in its direction and loads the components upon entering the IT rack or switchgear housing, and then loads the air-liquid-heat exchanger as air partially heated by the components. As mentioned earlier, since the refrigerant used for liquid cooling of the components has a high boiling point, the preheated air after passing through the components can still be used to condense the refrigerant. For example, the cooling air may have a temperature of 25°C when entering the IT rack or switchgear housing. After passing through the components, the cooling air may have a temperature of 35°C. After passing through the air-liquid-heat exchanger, the air may have a temperature of over 50°C.

[0026] The air-liquid-heat exchanger for the second loop can be arranged in the rear or front door of a single-wall or double-wall design of the IT rack or switch cabinet housing, through which air flows, entering the IT rack or switch cabinet housing on the side opposite to the rear or front door.

[0027] IT racks or switch cabinet housings may have air guides, wherein air flows in its direction and, after entering the IT rack or switch cabinet housing, loads the components, then enters the rear or front door as partially heated air by the components, and loads the air-liquid-heat exchanger of the second circuit.

[0028] The second air-liquid heat exchanger may have a housing with an annular gap formed between an outer wall and a tubular inner wall, through which the liquid is guided in at least thermal contact with the inner wall. In this case, the inner wall may surround a fan designed to guide air through the inner wall and across the housing.

[0029] A method for air conditioning a switchgear unit may include the following steps:

[0030] - Applying air to components housed in the IT rack or switch cabinet enclosure of the switchgear unit, wherein the air is heated to a first temperature; and

[0031] - Air heated to a first temperature is guided through an air-liquid-heat exchanger, where the liquid is cooled for liquid cooling of the components, and the air is heated to a second temperature greater than the first temperature.

[0032] In this case, the air can be discharged into the surrounding environment of the switchgear unit at a second temperature after being guided through a heat exchanger, or it can be cooled by another heat exchanger and recirculated in order to reapply air to the components.

[0033] Air can be guided through the heat exchanger and then discharged from the switchgear unit at a second temperature via a chimney. The chimney can lead to another air-liquid heat exchanger, for example, one to which a cooled liquid cooling medium is supplied via a water cooler or an ice machine.

[0034] An alternative method for air conditioning switchgear may include the following steps:

[0035] - Apply air to components housed in the IT rack or switch cabinet enclosure of the switch cabinet unit, wherein the air is heated;

[0036] - Heated air is guided through an air-liquid heat exchanger, wherein the air is cooled and a first liquid is heated as it is guided through the air-liquid heat exchanger;

[0037] - A heated first liquid is guided through a liquid-liquid heat exchanger, wherein a second liquid guided through the liquid-liquid heat exchanger is cooled for liquid cooling of the components, and the heated first liquid is further heated.

[0038] The first liquid, which is further heated, can be drawn from the liquid-liquid heat exchanger, cooled outside the switchgear unit, and then recycled as a cooling liquid back to the air-liquid heat exchanger.

[0039] To facilitate heat transfer from the component to be cooled to the coolant, a cooling device can be provided for directly cooling the component, such as a cooling device for directly cooling a semiconductor element like a CPU. The coolant can be designed to be a cooling liquid. The device can have at least one cooling body with a cavity through which the coolant flows and is designed to make thermally conductive contact with the semiconductor element using its bottom surface. Here, the cooling body can have a coolant inlet line leading into the cavity and a coolant return line leading into the cavity. The coolant inlet line can advantageously be arranged above the coolant return line.

[0040] The coolant inlet line may have an adjustable closure member, which allows adjustment of the vertical opening cross-section of the coolant inlet line. The closure member may have a linearly adjustable slider, wherein the slider is preferably vertically adjustable, and the opening cross-section is open at the lowest position and at least partially closed at the highest position.

[0041] Coolant can be supplied to the coolant inlet line via a coolant pump. This pump draws coolant as liquid from the coolant collection container and supplies it along the coolant supply line to the coolant inlet line.

[0042] Multiple coolers can be fluidly connected in parallel, such that each cooler is connected to the same coolant supply line via its respective coolant inlet line. At least one cooler can be connected to a condensation zone via its coolant circuit line, where the coolant flowing out of the coolant circuit line and at least partially evaporated is cooled. The condensation zone may have a liquid-liquid heat exchanger through which the coolant guided through the at least one cooler is guided along the first coolant circuit line. The liquid in the second coolant circuit guided through the liquid-liquid heat exchanger may be water, or a liquid consisting mostly of water. Under standard conditions, the coolant guided through the at least one cooler may have a boiling point lower than that of the liquid in the second coolant circuit guided through the liquid-liquid heat exchanger, preferably at least 20 K, particularly preferably at least 30 K, and even more particularly preferably at least 40 K below the liquid boiling point.

[0043] At least one coolant loop line leads into a condensation zone, which may have a drop, wherein a coolant collection container is arranged below all the cooling bodies, and coolant is supplied from the coolant collection container to the coolant inlet line via a coolant supply line.

[0044] The coolant may be or has a perfluorinated compound, preferably a compound derived from ethyl isopropyl ketone, and particularly preferably perfluorinated (2-methyl-3-pentanone) or C6F. 12 O.

[0045] The coolant circuit line may have a vertical opening cross-section that is larger than the maximum opening cross-section of the coolant inlet line.

[0046] The coolant return line can be unpressurized, allowing coolant to flow out unimpeded through the coolant return line.

[0047] The coolant circuit line can be arranged at a certain distance from the lower boundary wall of the cavity, wherein the filling height of the coolant in the cavity above the lower boundary wall is set by this distance, and wherein the evaporation volume of the cavity is determined by another distance between the coolant circuit line and the upper boundary wall arranged opposite to the lower boundary wall. Attached Figure Description

[0048] Further details of the invention are explained with reference to the following accompanying drawings. These drawings illustrate only exemplary embodiments and should not be construed as limiting the invention. Hereinafter:

[0049] Figure 1 A switch cabinet device according to the prior art is shown;

[0050] Figure 2 An exemplary embodiment of the switch cabinet device according to the present invention is shown;

[0051] Figure 3 Another embodiment of the switch cabinet device according to the present invention is shown;

[0052] Figures 4a-4c Three exemplary embodiments of the switchgear device according to the present invention are shown, wherein the relative arrangement of the cooling equipment with respect to the switchgear housing is different;

[0053] Figure 5 The diagram illustrates different variations of the interconnection between air-liquid heat exchangers and liquid-liquid heat exchangers.

[0054] Figure 6 A schematic diagram of heat transfer between the component to be cooled and the heat conductor according to the first embodiment is shown;

[0055] Figure 7 A schematic diagram of heat transfer between the component to be cooled and the heat conductor according to the second embodiment is shown;

[0056] Figure 8 A schematic diagram of heat transfer between the component to be cooled and the heat conductor according to a third embodiment is shown;

[0057] Figure 9 Another embodiment of the switch cabinet device according to the present invention is illustrated in schematic diagram;

[0058] Figure 10 Another embodiment of the switchgear device according to the present invention is illustrated in schematic diagram;

[0059] Figure 11 An exemplary embodiment of the collection tube is illustrated in the schematic diagram;

[0060] Figure 12 Other embodiments of the collection tube are illustrated in schematic diagrams;

[0061] Figure 13 Another embodiment of the collection tube is illustrated in the schematic diagram;

[0062] Figure 14 Another embodiment of the collection tube is illustrated in the schematic diagram;

[0063] Figure 15 Another embodiment of the collection tube is illustrated in the schematic diagram;

[0064] Figure 16 Another embodiment of the collection tube is illustrated in the schematic diagram;

[0065] Figure 17 An exemplary embodiment of a liquid-liquid-heat exchanger is shown in a perspective view;

[0066] Figure 18 A three-dimensional diagram is shown based on Figure 17 The heat exchanger as viewed from section C;

[0067] Figure 19 It shows that according to Figure 17 The heat exchanger viewed from section B; and

[0068] Figure 20 It shows that according to Figure 17 The heat exchanger as viewed from section A;

[0069] Figure 21 The diagram illustrates the following: Figure 3 A view of the fluid flow in the implementation method;

[0070] Figure 22 Another embodiment of the switch cabinet device according to the present invention is shown;

[0071] Figure 23 The diagram illustrates the following: Figure 23 A view of the fluid flow in the implementation method;

[0072] Figure 24 Another embodiment of the switch cabinet device according to the present invention is shown;

[0073] Figure 25 The diagram illustrates the following: Figure 24 A view of the fluid flow in the implementation method;

[0074] Figure 26 Another embodiment of the switch cabinet device according to the present invention is shown; and

[0075] Figure 27 The diagram illustrates the following: Figure 26 A view of the fluid flow in the implementation method; Detailed Implementation

[0076] Figure 1A switch cabinet arrangement according to the prior art is shown. A first cooling liquid, in this case water, is supplied via a recooler 15 located outside a building, such as a computing center—which may be designed as an ice machine—and is used by cooling equipment 2 located inside the computing center. Cooling equipment 2 has an air-liquid heat exchanger 3 through which cooling air is supplied and blown into the double floor of the computing center. The cooling air is blown from the double floor to the front of the switch cabinet housing or IT rack 1, so that it can be drawn in by components arranged therein, such as server racks. Alternatively or additionally, the switch cabinet 1 may form a row of switch cabinets that separate the hot aisle from the cold aisle of the computing center, wherein a cold air overpressure is provided in the cold aisle by fans arranged in the double floor, which delivers the cold air through the cabinet 1 into the hot aisle as heated air, and here cools the components arranged in the cabinet 1.

[0077] In addition to air cooling, liquid cooling, such as CPU liquid cooling, is also provided, including an additional recooler 15, whose liquefaction can be, for example, a refrigerant with a boiling point temperature close to the preferred operating temperature of the component to be cooled. Therefore, if the refrigerant is supplied to the component to be cooled, the power losses generated by these components cause the refrigerant to evaporate, resulting in a particularly high heat transfer from the component to the refrigerant due to the phase change from liquid to gas, thus achieving effective cooling. Heat transfer from the refrigerant to the component is facilitated by heat conductors 10, which are in direct contact with the component to be cooled. The heat conductor 10 can be made of a material with very good thermal conductivity, such as a metal, which forms a cooling body through which the refrigerant is guided, and the refrigerant undergoes, if necessary, a phase change from liquid to gas as described in the heat conductor 10, wherein the refrigerant is preferably provided with a through velocity or through flow rate and temperature in such a manner that only a portion of the volumetric flow rate of the refrigerant being guided through evaporates, while the other portion remains liquid, so that the evaporated portion can be discharged from the liquid portion of the subsequently flowing refrigerant for reliquefaction in the recooler 15.

[0078] on the contrary, Figures 3 to 5 An exemplary embodiment of a switchgear device according to the present invention is shown. For this switchgear device, a first cooling liquid, such as water, is directed to a cooling device 2 via a first supply line 5 and flows through a heat exchanger 3. For this purpose, the heat exchanger 3 has a first loop line 6, which, according to the present invention, is connected to the switchgear according to... Figure 1 Conversely, in this solution, the first loop line does not lead directly into the recooler 15, but is connected to the supply line 8 of the liquid-liquid-heat exchanger 7. The heat exchanger 7 has a second loop line 16, similar to... Figure 1In this embodiment, the second loop line is led to the recooler 15. Heat transfer occurs via the liquid-liquid heat exchanger 7 between the liquid loop of the air-liquid heat exchanger and the second refrigerant loop, which is fluidly separated from it. This second refrigerant loop can, for example, contain refrigerants with different boiling points, as already referenced. Figure 1 The description is as follows. Since the second refrigerant circuit can operate at a higher temperature level than the first refrigerant circuit with the air-liquid-heat exchanger 3, the heated liquid supplied through the first circuit line 6 can be used as a coolant, which is introduced into the liquid-liquid-heat exchanger 7.

[0079] Figures 4a to 4c Three different relative arrangements of the cooling equipment housing 2 to the switch cabinet housing 1 are shown. Different airflows are generated by the different relative arrangements of the two components 1 and 2. In particular, according to the invention, it is thus conceivable that the air cooled by the air-refrigerant-heat exchanger 3 and flowing through the component 4 requiring cooling circulates only between the cooling equipment and the switch cabinet housing, forming a closed air circuit isolated from the ambient fluid of the switch cabinet assembly. On the other hand, there are arrangements where fundamentally different airflows flow through both the switch cabinet housing 1 and the cooling equipment 2, wherein these arrangements are particularly suitable for so-called cold aisle-hot aisle layouts, etc., within a calculation center.

[0080] In detail, Figure 4a The arrangement is shown as follows: air circulates only between the housings of the cooling device 2 and the switchgear 1, which are directly adjacent to each other and fluidly interconnected. Air cooled by the air-refrigerant-heat exchanger 3 is drawn through the heat exchanger 3 by the fan 19 and forced into the switchgear housing 1, for which the air is laterally blown into the switchgear housing 1 from the rear side. The cooling air flows through the switchgear housing 1 in a generally horizontal direction and, in this case, flows around the component 10 that needs to be cooled. Then, the cooling air, as heated air, enters the cooling device 2 from the front side of the switchgear housing 1 through a lateral fluid air transition section, so as to flow through the air-refrigerant-heat exchanger 3 again.

[0081] In the manner already described, the refrigerant loop line of the air-refrigerant-heat exchanger 3 is connected to the supply line 8 of the refrigerant-refrigerant-heat exchanger 7, wherein the refrigerant KM1, which leaves the air-refrigerant-heat exchanger 3 as partially heated refrigerant, exits the liquid-liquid-heat exchanger 7 via loop line 16, so as to pass, for example, through an external recooler (see...). Figure 2 It is then recooled. The refrigerant KM1 can be, for example, water.

[0082] and Figure 4aThe implementation methods shown are different, in Figure 4b In the illustrated embodiment, there is no transition section for airflow between the housing of the switchgear 1 and the cooling device 2, wherein the two housings are traversed parallel to each other by ambient air. The ambient air can, for example, be air contained in a cold aisle-hot aisle-device between multiple rows of switchgear. Thus, for example, cold air drawn in from the rear can be used as heated air and exit the switchgear housing from the front, in a manner known in the prior art. According to... Figure 4b In the device according to the invention, it can now be specified that hot air from the hot aisle enters the cooling device through the front side of the cooling device housing 2, where the hot air passes through the liquid-air-heat exchanger 3 and enters the cold aisle as cooling air at the rear side of the device. The cooling air in the cold aisle can repeatedly enter the switch cabinet housing through the rear side of the switch cabinet housing so as to flow over the components 4 that need to be cooled.

[0083] according to Figure 4c Implementation methods and basis Figure 4b The difference in the implementation is that the housings of the cooling device 2 and the switch cabinet 1 are horizontally offset, wherein cooling air laterally discharged from the rear side of the cooling device housing 2 enters the switch cabinet 1 along the rear side. In the manner already described, the cooling air flows over the components 4 that need cooling and is heated in the process. At the front side of the switch cabinet housing, the heated air again flows laterally from the switch cabinet 1 so as to be blown directly to the front side of the cooling device housing 2, where it can be drawn back into the housing 2 by the fan 19 and delivered through the air-refrigerant-heat exchanger 3 so that the air is then laterally blown directly from the rear side of the cooling device housing 2 to the rear side of the switch cabinet housing 1 as cooling air.

[0084] In another Figures 5 to 20 The diagram exemplifies the cooling of a heated electrical component within a substantially enclosed enclosure, wherein a medium G1 is cooled via an air or gas cooler Wü1 and a cooling medium KM1, passing through component A1, and G1 is cooled primarily by flowing back and forth between electrical objects located within the enclosure. Here, G1 is cooled in devices or components (A1) adjacent to and / or within the enclosure and / or connected via conduits (plate conduits, hoses, or even brushes) that are substantially enclosed by the enclosure. One or more enclosures, such as IT racks or switch cabinet housings, can be used for cooling using A1.

[0085] KM1 may be composed of a cooler material that is solid, liquid, gaseous, or multiphase, or whose phase has been completely or partially altered, and that material is composed of one or more substances. KM1 may preferably be water, or water with additives, or a refrigerant that has a lower condensation temperature compared to water.

[0086] In addition to the cooling of G1, a second cooling medium KM2 passing through component A1 provides further cooling. KM2 can be composed of a relatively cool, substantially dielectric material that is solid, liquid, gaseous, multiphase, or whose phase has been completely or partially altered, and which consists of one or more substances. It can preferably be 1,1,1,2,2,4,5,5,5-nonafluoro-4-(trifluoromethyl)-3-pentanone or 1,1,1,2,2,3,3-heptafluoro-3-methoxypropane with varying possible purities (high purity or impurity). Cooling of KM2 is achieved by KM1 using a heat exchanger. The process can be carried out with or without mixing KM1 and KM2. KM1 can first cool the component or equipment G1, and then cool the cooling medium KM2, or vice versa or in parallel.

[0087] In another design, G1 or KM2 may also be cooled by a cooling medium KM3 in a separate circuit. KM3 may be composed of a relatively cool, substantially dielectric material that is solid, liquid, gaseous, multiphase, or whose phase has been completely or partially altered, and that consists of one or more substances. KM3 may preferably be water or water with additives or a refrigerant.

[0088] KM2 is then supplied as a cooled substance to at least one electric device or such component, which can become even hotter than KM2 (especially semiconductor elements, such as CPUs) through suitable channels, particularly at least one tube and / or hose.

[0089] Here, at least one electrical device or component to be cooled is located in a housing and is cooled using KM2, while other electrical devices or components may be located in the same or another housing and are cooled using G1.

[0090] The cooling medium is supplied, in particular, via hydraulically connected pipes, wire mesh, or pumps, especially electrically or pneumatically driven pumps or thermally driven airbag pumps, or combinations thereof. In this case, in a specific design, the cooling temperature of KM2 is matched to the maximum permissible or economically optimal cooling temperature of the component to be cooled. The cooling temperature can be adjusted, in particular, by changing the pressure to alter the condensation temperature, or by selecting the cooling medium KM2.

[0091] Cooling medium KM2 is heated or unheated by at least one object to be cooled. The phase of KM2 is completely or partially altered (partially by complete or partial evaporation) and then discharged through the same channel or one or more other channels. If the component is not heating, the supply of KM2 can be completely or partially stopped or continued by any means of control. KM2 can be running in the channel, stationary, or the line can be emptied. The supply of KM2 can be uncontrolled; specifically, KM2 always flows through the cooler and evaporates, or flows over the overflow edge.

[0092] A hollow body with good thermal conductivity is placed on a semiconductor device, and this hollow body is filled with a non-conductive liquid with a suitable evaporation temperature. To ensure that there is always a sufficient liquid level above the chip surface used for heat dissipation, the hollow body can be designed as follows:

[0093] The hollow body has an inlet and an outlet, wherein the outlet is designed to maintain a volume of unfilled coolant above the outlet opening during normal operation. To this end, the inlet is restricted by a suitable baffle in the pipe, ensuring that the amount of coolant entering the hollow body is always greater than the amount of coolant that would evaporate under maximum heat input. The outlet is designed to be so large that there is always more coolant available to exit in both liquid and gas phases compared to the coolant introduced through the inlet.

[0094] The inlet and outlet pipes of the cooling body are designed to always have a vertical drop to ensure that evaporation in the hollow body is not hindered by coolant accumulation in the outlet.

[0095] This invention is primarily used for indirectly or directly cooling heat-generating components within a casing, particularly one or more servers (especially in server clusters), such that some components are cooled by a corresponding KM2, while other components (especially those with higher temperature resistance) are cooled by a cooling G1. Due to this separation of cooling, G1 can be used at a higher inlet temperature than previously required, particularly to achieve higher inlet and outlet temperatures for KM1.

[0096] In another variant, for the indirect or direct cooling of heat-generating objects within the enclosure, particularly one or more servers (especially in server clusters), some components are cooled by the corresponding KM2, while other components are cooled by cooled air. Due to this separation of cooling, air with an inlet temperature higher than previously typical or common inlet temperature can be used, particularly to achieve a higher outlet temperature for the KM1.

[0097] Another variant is used for indirect or direct cooling of heat-generating objects within a casing, particularly one or more servers (especially in server clusters), where some components are cooled by a corresponding KM2 while others are cooled by cooled air. In this separation, air with an inlet temperature higher than previously normal or common can be used, particularly to achieve exceptionally high heat transfer performance through the high temperature difference between the condensation temperature of KM2 and the previously normally cold KM1, thereby achieving exceptionally high cooling capacity for each semiconductor element or each component A1, or reducing the volume of component A1.

[0098] The described solution offers new possibilities due to its cooling method, particularly for selectively increasing heat flux density where necessary, or for reducing the size of heat-generating objects. For other heat-generating objects, the invention enables selectively increasing the cooling temperature to save costs, or to more easily release the energy absorbed in KM1 into the environment at higher temperature levels, or to continue using the energy, particularly for heating and / or drying purposes and / or for heating refrigeration units operating hot.

[0099] In contrast, when returning from the object to be cooled to the heat exchanger, KM2 may contain a liquid and / or gaseous phase, a portion of which condenses en route. Here, due to gravity, the liquid phase collects at the bottom of the collector. The liquid phase can be transported from the collector to a liquid line or... In, without the need for a motor-driven regulating pump:

[0100] Discharge can be achieved through capillary action using appropriate fabrics, by thermal evaporation, or by using a bubble pump or venturi pump. A liquid column can be formed that actuates a (float) valve, allowing liquid to drain into the liquid line.

[0101] It can be stipulated that the heated and partially evaporated liquid portion of KM2 is transported through a collection pipe carrying gas, and the gas is accelerated (by narrowing the pipe) so that the gas overcomes gravity and also carries liquid.

[0102] It can be stipulated that the heated KM2 flows directly into In this process, KM1 cools KM2, thus eliminating the need for a collector and the need to overcome gravity to transport the liquid components. Specifically, this can be achieved using a tube bundle or coil heat exchanger, or a tube and finned heat exchanger, or even a plate heat exchanger where the inflow of KM2 is distributed onto the plate channels.

[0103] Today, computers, servers, and IT equipment are being built smaller and smaller. However, the heat generated in CPUs / GPUs has not decreased to the same extent; in some cases, it may even increase. For compute center operators, a significant potential for cost savings lies in the possibility of server overclocking. In this operating mode, server computing power can be increased, thereby reducing the number of servers that must run, but this also further increases the thermal load on each CPU / GPU. Therefore, cooling solutions must dissipate a higher load per unit area while remaining compact. Active air cooling cannot achieve sufficient heat transfer coefficients, as can water-liquid cooling or refrigerant-evaporative cooling. Furthermore, air-to-heat exchangers require large heat transfer surfaces and additional fans, increasing space requirements, power consumption, and noise generation. When using conductive liquids such as water for cooling, there is a risk of leakage that could severely damage servers, making this type of cooling undesirable to many users. Therefore, using dielectric fluids for cooling makes sense. In addition to the high air velocity of fans passing through large heat transfer surfaces, air cooling requires a large temperature difference to dissipate heat. This temperature difference can be reduced by refrigerant cooling because of its much higher heat transfer coefficient. However, servers and other components in server racks still must be air-cooled because refrigerant cooling is too expensive and the heat load per unit area is not very high. However, these components can also be cooled using warmer air (e.g., 40-50°C), or are designed for this purpose, rather than the approximately 24-28°C typically required for CPU / GPU cooling.

[0104] This significantly increases the overall cooling temperature level. Heat from the dielectric refrigerant 2 (KM2) and from the air can then dissipate at much higher temperature levels. This occurs in air-water-server rack air conditioning systems or air-refrigerant-server rack air conditioning systems, which utilize cooling water or refrigerant (typically KM2) to also condense or cool the dielectric refrigerant (KM1), which cools the CPU / GPU. All the heat is then supplied to KM1 in the system at very high temperature levels, such as a supply line temperature of 38°C and a return line temperature of 45°C (instead of roughly, for example, a supply line temperature of 18°C ​​and a return line temperature of 25°C). At this temperature level, heat can be dissipated into the environment even in the summer in many countries, and can also be used to heat buildings or bathrooms in winter. Therefore, for many applications, purchasing a chiller may be unnecessary.

[0105] Alternatively, heat can be transferred directly to the ambient air via KM2. However, special wiring must be laid for this, because dielectric refrigerants such as 1,1,1,2,2,4,5,5,5-nonafluoro-4-(trifluoromethyl)-3-pentanone or 1,1,1,2,2,3,3-heptafluoro-3-methoxypropane have lower vapor densities compared to other refrigerants, and their evaporation temperatures are highly pressure-sensitive compared to other refrigerants. Therefore, water or another refrigerant with higher vapor densities and lower pressure sensitivity at evaporation temperatures is more suitable for transferring heat over longer distances. By raising the temperature level of the supply air, heat from the cooling air can also be transferred to KM1 at this higher temperature level. Since neither KM2 nor the cooling air needs to be cooled below 40-50°C, a refrigeration unit is typically unnecessary. Because the hot air remains within the cabinets, working conditions in the computing center are more comfortable for employees.

[0106] Figure 21 It shows that according to Figure 3 The fluid guidance of the implementation method is described. Therefore, a closed air guidance system is described, in which air circulates only between the switch cabinet housing 1 and the cooling device 2. In particular, it is not specified that air is supplied from outside the switch cabinet device. In contrast, cooling liquid, such as cooling water supplied by an ice machine, is supplied to the device from the outside via supply line 5. Heated liquid is then supplied to a recooler, such as the aforementioned ice machine, via loop line 16.

[0107] After leaving the air-liquid-heat exchanger 3, the cooling air supplied by the air-liquid-heat exchanger 3 is first supplied to components 4 in its flow direction. These components may be, for example, components of a server unit. The air acts on the server component 4, where heat is transferred from the component 4 to the air, thus heating the air. After the air has passed through the component 4, it is then supplied to the air-refrigerant-heat exchanger 3 for further cooling.

[0108] The liquid supplied and cooled via supply line 5 is heated by air passing through air-liquid heat exchanger 3 and introduced as heated liquid from heat exchanger 3 into supply line 8 of liquid-liquid heat exchanger 7 via return line 6 of heat exchanger 3. The refrigerant circuit is recooled via liquid-liquid heat exchanger 7, and at least partially liquid refrigerant is supplied via this refrigerant circuit to components 4 that require special cooling, thus supplying components with high heat flux. These components 4 may be, for example, CPUs. For cooling these components, it may be sufficient for the liquid guided in the refrigerant circuit to have a temperature significantly higher than that of the air circulating in the switch cabinet housing 1. For example, the liquid may have a temperature of approximately 50°C. Since the return temperature of the air-liquid heat exchanger may be, for example, 35°C, this partially heated liquid is still cold enough to recool the liquid for direct cooling of the components.

[0109] Therefore, the liquid introduced from heat exchanger 3 into heat exchanger 7 via supply line 8 is further heated as it passes through heat exchanger 7, and can be heated to, for example, 50°C. At this temperature, the liquid then leaves device 1 via loop line 16 to be supplied, for example, to an ice machine for recooling and feeding back into supply line 5.

[0110] According to Figure 3 and 21 The implementation methods are different, in Figure 22 and 23 One embodiment is shown in which the air in the device is not circulated, but is guided through the device from the rear and exits from the front. Here, the airflow entering the device from the rear is divided into a first part flow and a second part flow, wherein the first part flow acts on the cooling device 2, and the second part flow acts on the switch cabinet device, particularly on the components 4 housed therein that do not require liquid cooling, in order to cool these components.

[0111] Another air-liquid heat exchanger 18 is provided in the cooling device 2, which is loaded with air passing through the cooling device 2. A fan 19 can be configured to drive air through the heat exchanger 18 at an adjustable flow rate. The liquid circuit to which the liquid-air heat exchanger 18 is connected is designed for direct liquid cooling of the components, as has been described in principle with reference to the foregoing embodiments.

[0112] Unlike the aforementioned embodiments, there is no direct air-liquid heat exchanger for cooling air installed in the cooling device 2 or switch cabinet housing 1. Instead, the air is used to load, for example, another air-liquid heat exchanger 18 and component 4. Specifically, it can be located outside the device, for example, in a double-layer floor in a computing center where the switch cabinet device is located.

[0113] Another implementation is in Figure 24 and 25 As shown in the diagram. In this embodiment, air is further specified to be guided through the switch cabinet housing 1 for cooling the components 4 housed in the IT rack or switch cabinet housing 1. The air guided through the housing now continues to act on the air-liquid-heat exchanger 18, wherein the liquid guided through the air-liquid-heat exchanger 18 is supplied to at least one of the components 4 for transferring heat from the components 4 to the liquid, and is transferred from the components 4 back to the air-liquid-heat exchanger 18.

[0114] Therefore, air is introduced into the switch cabinet housing 1 from outside the switch cabinet unit, for example, through its rear side. Again, the air first passes through components 4, where, particularly those without excessively high heat flux, it has already been sufficiently cooled. The heated air, after leaving components 4, for example, after leaving the server housing containing components 4, passes through a liquid-air heat exchanger 18 now housed in the door 20 of the switch cabinet housing 1. A fan 19 is also provided in the double-walled door 20, which draws air into the housing 1 through the rear side, through components 4, and then into the door 20, passing through the heat exchanger 18. Downstream, the heat exchanger 18 has a fluid transition section extending to a passage through the front side of the switch cabinet door, through which further heated air can exit the switch cabinet housing 1 or the door 20. Alternatively, the passage may also be constructed, for example, on the upper side of the door 20.

[0115] Optionally, but not necessarily, heated air may be supplied via chimney 27 to an additional air-liquid-heat exchanger 26 for recooling. The air exiting housing 2 may, for example, have a temperature of 50°C, because, as explained with reference to the foregoing embodiments, the air is correspondingly heated further away due to the higher temperature level of the liquid used for direct cooling of component 4.

[0116] Figure 26 and 27 Described and based on Figure 3 and 21A similar implementation is designed, wherein the cooling device 2 is now arranged in the door 20 instead of in the side housing. Specifically, both the liquid-air heat exchanger 3 and the liquid-liquid heat exchanger 7 fluidly connected thereto are arranged in the door 20. Furthermore, unlike the implementation according to... Figure 3 and 21 The implementation method, in which similarity is based on Figure 24 and 25 The implementation method specifies that the air does not circulate in a closed system, but is discharged from the switch cabinet housing 1 through the front side of the switch cabinet housing, in particular through the door 20.

[0117] The additional liquid-air-heat exchanger 26 may be designed, for example, as a heat exchanger arranged in the wall of the computing center, and the heat exchanger may separate the space of the computing center from the environment of the computing center, or from another space in which a hot passage or hot aisle for the computing center's air conditioning system is provided.

[0118] The features disclosed in the foregoing description, drawings and claims, whether individually or in any combination, are essential for carrying out the invention.

[0119] List of reference numerals

[0120] 1. Switch cabinet enclosure

[0121] 2 Cooling equipment

[0122] 3. Air-Liquid-Heat Exchanger

[0123] 4 components

[0124] 5 First Supply Pipeline

[0125] 6 First circuit pipeline

[0126] 7 Liquid-Liquid Heat Exchanger

[0127] 8 Second Supply Line

[0128] 9. Third circuit pipeline

[0129] 10. Heat conductor

[0130] 11 Third Supply Pipeline

[0131] 12 heat pipes

[0132] 13. Downcomer

[0133] 14 Ascending pipe

[0134] 15 Recooler

[0135] 16 Second Circuit Pipeline

[0136] 17. Warm air inlet

[0137] 18 Second Air-Liquid-Heat Exchanger

[0138] 19 fans

[0139] 20. Back door or front door

[0140] 21 Cooling equipment casing

[0141] 22. Shell

[0142] 23 outer wall

[0143] 24 Inner Wall

[0144] 25 Annular gap

[0145] 26 Other heat exchangers

[0146] 27 Chimneys

Claims

1. A switch cabinet assembly having at least one IT rack or switch cabinet housing (1) and at least one cooling device (2), the cooling device having an air-liquid heat exchanger (3) for cooling components (4) housed in the IT rack or switch cabinet housing (1) using cooling air, wherein, The air-liquid heat exchanger (3) has a first supply line (5) for cooling the liquid and a first return line (6) for heating the liquid. The cooling device (2) has a liquid-liquid heat exchanger (7) for liquid cooling of the component (4), with the first return line (6) of the air-liquid heat exchanger (3) connected to its second supply line (8). The first liquid, under standard conditions, has a lower boiling point than the second liquid, which is the liquid being cooled by the air-liquid heat exchanger (3). Wherein, the boiling point of the first liquid is at least 20 K below the boiling point of the second liquid.

2. The switchgear device according to claim 1, wherein, The air-liquid-heat exchanger (3) is a component of the first cooling circuit, and the liquid-liquid-heat exchanger (7) is a component of the second cooling circuit, which is separate from the first cooling circuit.

3. The switchgear device according to claim 1 or 2, wherein, The liquid being guided through the air-liquid-heat exchanger (3) is water, or a liquid with a majority of water content.

4. The switchgear device according to claim 1 or 2, wherein, The boiling point of the first liquid is at least 30 K below the boiling point of the second liquid.

5. The switchgear device according to claim 4, wherein, The boiling point of the first liquid is at least 40 K below the boiling point of the second liquid.

6. The switchgear device according to claim 1 or 2, wherein, The first liquid of the two liquids guided through the liquid-liquid-heat exchanger (7) is or has a perfluorinated compound.

7. The switchgear device according to claim 6, wherein, The first of the two liquids guided through the liquid-liquid-heat exchanger (7) is or has a compound derived from ethyl isopropyl ketone.

8. The switchgear device according to claim 6, wherein, The first of the two liquids guided through the liquid-liquid-heat exchanger (7) is or has perfluorinated (2-methyl-3-pentanone).

9. The switchgear device according to claim 1 or 2, wherein, The first liquid of the two liquids guided through the liquid-liquid-heat exchanger (7) is introduced from the third loop line (9) of the liquid-liquid-heat exchanger (7) into the heat conductor (10) that guides the liquid for conduction cooling.

10. The switchgear device according to claim 9, wherein, The first liquid of the two liquids guided through the liquid-liquid-heat exchanger (7) is introduced from the heat conductor (10) that guides the liquid into the third supply line (11) of the liquid-liquid-heat exchanger (7).

11. The switchgear device according to claim 1 or 2, wherein, The liquid-liquid heat exchanger (7) is the cooling zone of the heat pipe (12) or distribution pipe.

12. The switchgear device according to claim 11, wherein, The heat pipe (12) or distribution pipe has a downpipe (13) and an uppipe (14), which are designed as vertical lines fluidly separated from each other, or fluidly connected to each other by a siphon in the lowest region of the heat pipe.

13. The switchgear device according to claim 11, wherein, The heat pipe (12) has a downcomer (13) into which a first liquid cooled from the liquid-liquid heat exchanger (7) is introduced.

14. The switchgear device according to claim 11, wherein, The heat pipe (12) has a riser (14) into which a first liquid to be heated is introduced.

15. The switchgear device according to claim 1 or 2, wherein, Cooled liquid is introduced into the air-liquid-heat exchanger (3) from a recooler (15), such as an ice machine, through the first supply line (5) for cooling the liquid.

16. The switchgear device according to claim 15, wherein, The cooled liquid is introduced from the liquid-liquid-heat exchanger (7) into the recooler (15) as a heated liquid.

17. The switchgear device according to claim 1 or 2, wherein, The cooling device (2) is a cooling device (2) arranged in a series of IT racks or switch cabinet housings (1). Hot air is drawn in from the hot channel through its rear or front side and blown out as cold air along the side opposite to the rear or front side into the cold channel.

18. The switchgear device according to claim 1 or 2, wherein, The air-liquid heat exchanger (3) of the first circuit and the liquid-liquid heat exchanger (7) of the second circuit are housed in the rear door or front door (20) of the IT rack or the switch cabinet housing (1), wherein the air-liquid heat exchanger (3) and the liquid-liquid heat exchanger (7) are circulated by air, which enters the IT rack or the switch cabinet housing (1) on the side opposite to the rear door or the front door (20).

19. A method for cooling a switchgear assembly, comprising the following steps: - Air is applied to the components (4) housed in the IT rack or switch cabinet housing (1) of the switch cabinet assembly, wherein, Heat the air; - The heated air is guided through an air-liquid heat exchanger (3), wherein the air is cooled and a second liquid is heated as it is guided through the air-liquid heat exchanger (3); - The heated second liquid is guided through a liquid-liquid heat exchanger (7), wherein the first liquid guided through the liquid-liquid heat exchanger (7) is cooled for liquid cooling of the assembly (4), and the heated second liquid, which has a boiling point lower than that of the second liquid under standard conditions, is further heated. Wherein, the boiling point of the first liquid is at least 20 K below the boiling point of the second liquid.

20. The method according to claim 19, wherein, The second liquid, which has been further heated, is discharged from the liquid-liquid-heat exchanger (7), cooled outside the switch cabinet device, and then recycled as a cooling liquid back into the air-liquid-heat exchanger (3).

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