Adhesive composition and display device including the same

Abstract

A display device is provided. The display device includes a substrate including a plurality of pixels, an adhesive layer on the substrate, a light-emitting diode on the adhesive layer, a planarization layer surrounding the light-emitting diode, a connection electrode on the planarization layer; and a transparent protective layer on the connection electrode. At least one of the adhesive layer, the planarization layer, and the transparent protective layer includes a plurality of particles having a multi-shell structure. The particles having the multi-shell structure are included in the display device such that the adhesion and adhesion retention force between the light-emitting diode and the driving panel are improved to increase the product yield and improve the brightness of the light-emitting diode, thereby providing a display device with low power consumption.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority of Korean Patent Application No. 10 - 2020 - 0179895, filed on December 21, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical field

[0003] The present disclosure relates to an adhesive composition and a display device including the adhesive composition, and more particularly, to a display device using a light - emitting diode (LED) having improved yield and improved light extraction efficiency. Background art

[0004] With the advent of the information age, the display field for visualizing electrical information signals has developed rapidly. For this purpose, various display devices having excellent properties such as thin thickness, light weight, and low power consumption have been developed. Specific examples of such display devices include liquid crystal display (LCD) devices, plasma display panel (PDP) devices, field emission display (FED) devices, organic light - emitting display (OLED) devices, and the like.

[0005] As a representative display device, a liquid crystal display device does not use a self - emissive method, but has a backlight unit disposed below the liquid crystal display device, which increases the thickness of the liquid crystal display device. In addition, the backlight unit limits the realization of display devices with various designs, and the brightness and response speed may be reduced.

[0006] In contrast, a display device including a self - emissive element can be realized to be thinner than a display device embedded with a light source, and thus allows the realization of flexible and foldable display devices.

[0007] As one of the display devices including a self - emissive element, an organic light - emitting display device uses an organic light - emitting diode as a pixel, and thus does not require a separate light source. However, in an organic light - emitting display device, black dots may be easily generated due to the penetration of moisture or oxygen, and thus various technical structures are additionally required to block the penetration of oxygen and moisture.

[0008] In recent years, light-emitting diode (LED) display devices using micro-LEDs with a tiny size as light-emitting diodes have been researched and developed. Such LED display devices with high imaging quality and high reliability have received attention as next-generation display devices.

[0009] However, with the existing technology, it is difficult to fix ultra-small micro-LEDs to a large-sized substrate, and it takes a longer time to fix the micro-LEDs. Therefore, the existing technology is not suitable for applying micro-LEDs to large-sized display devices. Specifically, when transferring micro-LEDs onto a current planarization layer or insulating layer, the adhesion between the micro-LEDs and the planarization layer is caused by residual solvents in the planarization layer. However, when the planarization layer hardens, the content of the residual solvents decreases, causing the surface adhesion to disappear, which results in film tearing. In addition, the adhesion retention time is shortened, leading to a reduction in product yield.

[0010] Therefore, in order to realize a display device with micro-LEDs as light-emitting diodes, a transfer technology for moving the micro-LEDs to a driving panel needs to be developed. SUMMARY OF THE INVENTION

[0011] The adhesive composition according to the present disclosure can be used to improve the adhesion retention property and light extraction property of a display device.

[0012] The display device according to the present disclosure includes a transfer-type planarization layer with excellent adhesion to increase the transfer rate of the light-emitting diodes.

[0013] According to the present disclosure, the manufacturing processes for manufacturing the respective layers constituting the display device can be simplified through a single transfer process.

[0014] The benefits and advantages of the present disclosure are not limited to the above non-limiting examples, and those skilled in the art can clearly understand other benefits and advantages not mentioned above from the following description.

[0015] According to one aspect of the present disclosure, a display device includes: a substrate including a plurality of pixels; an adhesive layer disposed on the substrate; a light-emitting diode disposed on the adhesive layer; a planarization layer disposed on the substrate so as to surround the light-emitting diode; a connection electrode disposed on the planarization layer; and a transparent protective layer disposed on the connection electrode. At least one layer selected from the group consisting of the adhesive layer, the planarization layer, and the transparent protective layer includes a plurality of particles having a multi-shell structure. The particles having the multi-shell structure included in the display device can be used to improve the adhesion and adhesion retention force between the light-emitting diode and the driving panel, thereby increasing the product yield and improving the brightness of the light-emitting diode, and thus a display device with low power consumption can be obtained.

[0016] According to another aspect of the present disclosure, an adhesive composition includes: a plurality of particles having a multi-shell structure, a photosensitive material, and an adhesive. Each of the plurality of particles having a multi-shell structure includes: a central portion containing a tackifier material; a first outer portion surrounding the central portion and including a molecular sieve; and a second outer portion surrounding the first outer portion and including a fullerene. The adhesive composition exhibits excellent adhesion and adhesion retention properties. Due to the presence of the mesoporous molecular sieve, the adhesive composition also exhibits good light extraction properties.

[0017] According to still another aspect of the present disclosure, a method for forming a display device includes: forming an adhesive layer on a substrate; attaching a light-emitting diode to the adhesive layer; depositing a first planarization layer on the adhesive layer to surround the light-emitting diode; depositing a second planarization layer on the first planarization layer and the light-emitting diode; forming a connection electrode on the second planarization layer; and depositing a transparent protective layer on the connection electrode. At least one of the adhesive layer, the first planarization layer, the second planarization layer, and the transparent protective layer includes a plurality of particles having a multi-shell structure. Each of the plurality of particles having a multi-shell structure includes: a central portion including a tackifier material; a first outer portion surrounding the central portion, the first outer portion including a molecular sieve; and a second outer portion surrounding the first outer portion, the second outer portion including a fullerene.

[0018] Other details of the embodiments of the present disclosure are included in the detailed description and the accompanying drawings.

[0019] According to the present disclosure, an adhesive composition having improved adhesion retention and improved light extraction efficiency includes a plurality of particles utilizing a multi-shell structure formed by a tackifier material, a molecular sieve, and a fullerene.

[0020] According to the present disclosure, a display device includes a plurality of particles having a multi-shell structure in at least one of an adhesive layer, a planarization layer, and a transparent protective layer to improve the transfer rate and product yield of a light-emitting diode.

[0021] According to the present disclosure, the linearity and scattering of light generated from a light-emitting diode are enhanced by the particles having a multi-shell structure, thereby providing a display device with low power consumption and high brightness.

[0022] According to the present disclosure, a photosensitive material and an adhesive are included, so that an adhesive layer, a planarization layer, and a transparent protective layer can be manufactured through one transfer process. Therefore, a display device can be manufactured through a simplified manufacturing process.

[0023] The effects according to the present disclosure are not limited to the above - illustrated contents, and more various effects are included in this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and other aspects, features, and other advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0025] Figure 1 is a plan view of a display device according to an embodiment of the present disclosure;

[0026] Figure 2 is according to an embodiment of the present disclosure Figure 1 cross - sectional view of the display device;

[0027] Figure 3A is a cross - sectional view illustrating particles of a multi - shell structure according to an embodiment of the present disclosure; and

[0028] Figure 3B is according to an embodiment of the present disclosure Figure 3A magnified perspective views of the first exterior and the second exterior of particles of the multi - shell structure. DETAILED DESCRIPTION

[0029] The advantages and characteristics of the present disclosure and the methods for achieving these advantages and characteristics will become clearer by referring to the embodiments described in detail below in conjunction with the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed herein, but will be implemented in various forms. The embodiments are provided only by way of example so that those skilled in the art can fully understand the disclosure of the present disclosure and the scope of the present disclosure. Figure 1 The shapes, sizes, ratios, angles, quantities, etc. shown in the accompanying drawings for describing the embodiments of the present disclosure are only examples, and the present disclosure is not limited thereto. Throughout the specification, like reference numerals generally denote like elements. In addition, in the following description of the present disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "comprising", "having", and "consisting of" used herein are generally intended to allow the addition of other components, unless these terms are used with the term "only". Any singular reference may include the plural form, unless otherwise clearly stated.

[0030] Even if not explicitly stated, components are still interpreted as including the usual error ranges.

[0031]

[0032] ​When terms such as "on", "above", "below", and "adjacent to" are used to describe the positional relationship between two parts, one or more parts may be located between these two parts, unless the terms use the terms "immediately" or "directly".

[0033] When an element or layer is disposed "on" another element or layer, another layer or another element may be directly interposed on the other element or between them.

[0034] Although terms such as "first", "second", etc. are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from other components. Thus, within the technical concept of the present disclosure, the first component mentioned below may be the second component.

[0035] Throughout the specification, like reference numerals generally denote like elements.

[0036] For the sake of convenience in description, the dimensions and thicknesses of each component shown in the drawings are shown, and the present disclosure is not limited to the dimensions and thicknesses of the components shown.

[0037] The features of the various embodiments of the present disclosure may be partially or wholly combined or combined with each other and may be interrelated and operated in various ways technically, and these embodiments may be implemented independently of each other or in combination with each other.

[0038] Hereinafter, a display device and an adhesive composition according to an embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.

[0039] Figure 1 and Figure 2 are views of a display device 100 according to an embodiment of the present disclosure.

[0040] Figure 1 is a plan view of a display device 100 according to an embodiment of the present disclosure.

[0041] Referring to Figure 1 , in a display device 100 according to an embodiment of the present disclosure, a display area DA in which an image is displayed and a non-display area NDA surrounding the display area DA may be defined. In the display area DA, light-emitting diodes (e.g., micro light-emitting diodes) and driving elements (e.g., thin-film transistors) for driving the light-emitting diodes may be provided. The non-display area NDA is an area in which no image is displayed and various lines and control circuits connected to the elements provided in the display area DA may be provided.

[0042] Although the display device 100 is illustrated as being defined by a display area DA and a non-display area NDA, the present disclosure is not limited thereto, and the display device 100 may be defined such that the non-display area NDA may not be provided.

[0043] In the display area DA, a plurality of unit pixels UP are provided. Each of the plurality of unit pixels UP may include a plurality of sub-pixels SP1, SP2, SP3, but is not limited thereto. In each of the plurality of sub-pixels SP1, SP2, SP3, a thin film transistor and a light emitting diode may be respectively provided as a driving element and a light emitting diode. The light emitting diode and the thin film transistor may be connected to drivers such as a gate control circuit and a data control circuit through lines such as a gate line GL and a data line DL. When the size of the light emitting diode is 100 μm or less, the display device may be referred to as a micro LED display device. When the size of the light emitting diode is several hundred micrometers, the display device may be referred to as a mini LED display device.

[0044] Figure 2 is a cross-sectional view of a display device 100 according to an embodiment of the present disclosure.

[0045] A display device 100 according to an embodiment of the present disclosure includes a substrate 110, an adhesive layer 114, a reflective layer 143, a thin film transistor 120, a light emitting diode 130, a first planarization layer 115, a second planarization layer 116, a first connection electrode 141, a second connection electrode 142, and a common line CL.

[0046] The substrate 110 is a basic component that supports various elements of the display device and can be formed of an insulating material. For example, the substrate 110 may be a glass substrate or a plastic substrate. For example, the plastic substrate may be selected from polyimide, polyethersulfone, polyethylene terephthalate, and polycarbonate, but is not limited thereto. When a flexible plastic substrate is used to achieve flexibility and foldability, a support member such as a backplane may be provided under the substrate 110. The flexible plastic substrate is thinner and has weaker rigidity than the glass substrate, so that when various elements are provided, the plastic substrate may sag. The backplane supports the substrate 110 formed of a plastic material to prevent sagging of the substrate 110 and protect the display panel from moisture, heat, and impact. For example, the backplane may be a metal material such as stainless steel (SUS) or a plastic material such as polymethylmethacrylate, polycarbonate, polyvinylalcohol, acrylonitryl-butadiene-styrene, or polyethylene terephthalate.

[0047] Although the thickness of the substrate 110 is illustrated as being very small in Figure 2 , the thickness of the substrate 110 may be much greater than the total thickness of the layered structure provided on the substrate 110. The substrate may be configured by multiple layers, or may be a substrate in which multiple substrates are combined.

[0048] The thin film transistor 120 is formed on the substrate 110. The thin film transistor 120 includes a gate 121, a semiconductor layer 122, a source 123, and a drain 124.

[0049] The gate 121 is provided on the substrate 110 together with the gate line GL. The gate 121 is covered with the gate insulating layer 112. The gate insulating layer 112 may be configured by a single layer or multiple layers formed of an inorganic material, and may be formed of silicon oxide (SiOx), silicon nitride (SiNx), or the like. The gate line GL may be formed on the same layer as the gate 121. The gate line GL may be formed of the same material as the gate 121. The data line DL may also be formed for the same purpose as the gate line GL.

[0050] The semiconductor layer 122 is provided in a predetermined pattern (or island) shape on the gate insulating layer 112 so as to overlap with the gate 121. The semiconductor layer 122 can be configured of a semiconductor material formed of one or more of amorphous silicon, polycrystalline silicon, oxide, and organic material, but is not limited thereto.

[0051] The source electrode 123 is provided so as to overlap with one side of the semiconductor layer 122. The source electrode 123 is provided together with the data line DL and the driving power supply line.

[0052] The drain electrode 124 is provided to be spaced apart from the source electrode 123 while overlapping with the other side of the semiconductor layer 122. The drain electrode 124 is provided together with the source electrode 123 so as to branch out or protrude from an adjacent driving power supply line.

[0053] The interlayer insulating layer 113 is provided on the source electrode 123 and the drain electrode 124 to protect the thin film transistor 120. In the interlayer insulating layer 113, a hole exposing a part of the source electrode 123 of the thin film transistor 120 may be formed. However, the interlayer insulating layer 113 may be omitted in some embodiments.

[0054] The common line CL is provided on the gate insulating layer 112. The common line CL is a line for applying a common voltage to the light emitting diode 130 and may be provided to be spaced apart from the gate line GL or the data line DL. In addition, the common line CL may extend in the same direction as the gate line GL or the data line DL or in the same direction as the data line DL. The common line CL may be formed of the same material as the source electrode 123 and the drain electrode 124, but is not limited thereto. In some embodiments, the common line CL may be formed of the same material as the gate 121. The interlayer insulating layer 113 is formed on the common line CL, and a hole exposing a part of the common line CL may be formed in the interlayer insulating layer 113.

[0055] The reflective layer 143 is provided on the interlayer insulating layer 113. The reflective layer 143 may be provided at positions corresponding to the light emitting regions of the plurality of sub-pixels SP1, SP2, SP3. The reflective layer 143 is a layer configured to reflect a part of the light emitted from the light emitting diode 130 that is emitted to the substrate 110 to the upper part of the display device 100, thereby outputting the light to the outside of the display device 100. The reflective layer 143 may be formed of a metal material having a high reflectivity.

[0056] The adhesive layer 114 is disposed on the reflective layer 143. The adhesive layer 114 is a layer for bonding the light-emitting diode 130 to the reflective layer 143, and is also a layer for insulating the reflective layer 143 formed of a metal material from the light-emitting diode 130. The adhesive layer 114 may be formed of a thermosetting material or a photocuring material, but is not limited thereto. The adhesive layer 114 may be provided to overlap with the reflective layer 143 provided in each sub-pixel. As shown in Figure 2 For the plurality of sub-pixels SP1, SP2, SP3, the adhesive layer 114 may be separate to overlap with the reflective layer 143, but is not limited thereto. The adhesive layer 114 may be disposed on the entire interlayer insulating layer 113.

[0057] Meanwhile, in the display device 100 according to an embodiment of the present disclosure, the adhesive layer 114 may be formed of an adhesive composition including particles 190 having a plurality of multi-shell structures according to an embodiment of the present disclosure. That is, the adhesive layer 114 may include a plurality of particles 190 having a multi-shell structure, and may further include a photosensitive material and an adhesive. The particles 190 having a multi-shell structure, the photosensitive material, and the adhesive will be described in detail below.

[0058] The light-emitting diode 130 is disposed on the adhesive layer 114 to overlap with the reflective layer 143. The light-emitting diode 130 includes an n-type layer 131, an active layer 132, a p-type layer 133, an n electrode 135, and a p electrode 134. Hereinafter, although a lateral structure light-emitting diode 130 is described as being used as the light-emitting diode 130, the structure of the light-emitting diode 130 is not limited thereto, and a vertical or flip structure is also feasible. The light-emitting diode 130 may have a micro size (i.e., the chip size may be 100 μm or less) or a mini size (i.e., the chip size may be several hundred micrometers (μm)).

[0059] The lamination structure of the light-emitting diode 130 according to an embodiment of the present disclosure is as follows: The n-type layer 131 may be formed by implanting an n-type impurity into gallium nitride (GaN). The active layer 132 is disposed on the n-type layer 131. The active layer 132 is a light-emitting layer that emits light in the light-emitting diode 130, and may be formed of a nitride semiconductor, such as indium gallium nitride (InGaN). The p-type layer 133 is disposed on the active layer 132. The p-type layer 133 may be formed by implanting a p-type impurity into gallium nitride. However, the constituent materials of the n-type layer 131, the active layer 132, and the p-type layer 133 are not limited thereto.

[0060] As described above, the light-emitting diode 130 may be manufactured by sequentially laminating an n-type layer 131, an active layer 132, and a p-type layer 133, and then etching a predetermined portion to form an n electrode 135 and a p electrode 134. In this case, the predetermined portion serving as a gap separating the n electrode 135 and the p electrode 134 from each other may be etched to expose a part of the n-type layer 131. That is, the surfaces of the light-emitting diode 130 on which the n electrode 135 and the p electrode 134 will be disposed are not at the same height level but have different height levels.

[0061] As described above, the n electrode 135 may be disposed on the exposed n-type layer 131. The n electrode 135 may be formed of a conductive material, for example, formed of a transparent conductive oxide. Meanwhile, in an unetched region, that is, on the p-type layer 133, the p electrode 134 may be disposed. The p electrode 134 may also be formed of a conductive material, for example, formed of a transparent conductive oxide. In addition, the p electrode 134 may be formed of the same material as the n electrode 135.

[0062] As described above, in a state where the n-type layer 131, the active layer 132, the p-type layer 133, the n electrode 135, and the p electrode 134 are formed, the light-emitting diode 130 may be disposed such that the n-type layer 131 is closer to the reflective layer 143 than the n electrode 135 and the p electrode 134.

[0063] The first planarization layer 115 and the second planarization layer 116 are formed on the interlayer insulating layer 113 to cover the light-emitting diode 130. The first planarization layer 115 and the second planarization layer 116 are formed on the interlayer insulating layer 113, and their thickness is sufficient to cover the entire interlayer insulating layer 113 including the portion where the light-emitting diode 130 is disposed and the remaining portion. In Figure 2 , although two planarization layers 115 and 116 are illustrated for manufacturing the display device 110, the number of planarization layers is not limited thereto. In some embodiments, a single planarization layer may be used. In addition, three or more planarization layers may also be used.

[0064] Referring to Figure 2 , the first planarization layer 115 of the display device 100 according to an embodiment of the present disclosure planarizes the upper portion of the thin film transistor 120. The first planarization layer 115 may planarize the upper portion of the thin film transistor 120 in a region where the light-emitting diode 130 is disposed and a region not including the contact structure. The second planarization layer 116 may be disposed on the first planarization layer 115. The second planarization layer 116 may be disposed above the thin film transistor 120 and the light-emitting diode 130 in a region not including the contact structure. At this time, the second planarization layer 116 may be formed to expose partial regions of each of the p electrode 134 and the n electrode 135 of the light-emitting diode 130.

[0065] The first planarization layer 115 and the second planarization layer 116 are formed of an organic insulating material and can be used to fix the position of the light-emitting diode 130. That is, the first planarization layer 115 and the second planarization layer 116 are provided after the light-emitting diode 130 is provided, such that the first planarization layer 115 and the second planarization layer 116 are completely attached to the light-emitting diode 130. Different from the conventional method of first forming a receiving space such as a cup or a hole in the planarization layer and then transferring the light-emitting diode to the cup or the hole, in the present disclosure, by providing the planarization layer after placing the light-emitting diode 130, the light-emitting diode 130 is fixed to its position more stably.

[0066] The first planarization layer 115 and the second planarization layer 116 can be formed simultaneously or separately in two times. When forming a single planarization layer, the processing time will increase excessively, so the planarization layer can be separately formed in two times. When the first planarization layer 115 and the second planarization layer 116 are separately formed in two times, the contact structures formed in the planarization layer can also be formed at different times.

[0067] Meanwhile, in the display device 100 according to an embodiment of the present disclosure, at least one of the first planarization layer 115 and the second planarization layer 116 can be formed of an adhesive composition including particles 190 having a plurality of multi-shell structures according to an embodiment of the present disclosure. That is, the first planarization layer 115 and / or the second planarization layer 116 can include the particles 190 having a plurality of multi-shell structures, and can further include a photosensitive material and an adhesive. The particles 190 having a multi-shell structure, the photosensitive material, and the adhesive will be described in detail below.

[0068] The connection electrodes 141 and 142 are in contact with the p electrode 135 or the n electrode 134 of the light-emitting diode 130, respectively, and are referred to as the first connection electrode 141 and the second connection electrode 142.

[0069] The first connection electrode 141 connects the thin-film transistor 120 and the p electrode 134 of the light-emitting diode 130. The first connection electrode 141 can be in contact with the source electrode 123 of the thin-film transistor 120 through the contact structures formed in the first planarization layer 116, the second planarization layer 116, and the interlayer insulating layer 113. In addition, the first connection electrode 141 can be in contact with the p electrode 134 of the light-emitting diode 130 through the contact structure formed in the second planarization layer 116. However, the present disclosure is not limited thereto, such that depending on the type of the thin-film transistor 120, the first connection electrode 141 can be defined to be in contact with the drain electrode 124 of the thin-film transistor 120. The first connection electrode 141 can be defined as an anode.

[0070] The second connection electrode 142 connects the common line CL and the n electrode 135 of the light-emitting diode 130. The second connection electrode 142 is in contact with the common line CL through a contact structure formed in the first planarization layer 115, the second planarization layer 116, the interlayer insulating layer 113, and the adhesive layer 114. In addition, the second connection electrode 142 is in contact with the n electrode 135 of the light-emitting diode 130 through a contact structure formed in the second planarization layer 116. The second connection electrode 142 may be defined as a cathode.

[0071] Accordingly, when the display device 100 is turned on, different voltage levels applied to the source 123 of the thin-film transistor 120 and the common line CL are transmitted to the p electrode 135 and the n electrode 134 through the first connection electrode 141 and the second connection electrode 142, respectively. By doing so, the light-emitting diode 130 emits light. In Figure 2 FIG., the thin-film transistor 120 is illustrated as being electrically connected to the p electrode 134 while the common line CL is electrically connected to the n electrode 135, but the present disclosure is not limited thereto. In some embodiments, the thin-film transistor 120 may be electrically connected to the n electrode 135, while the common line CL may be electrically connected to the p electrode 134.

[0072] The bank 118 is an insulating layer that defines a light-emitting region and is formed on the second planarization layer 116. The bank 118 is formed of an organic insulating material and may be formed of the same material as the first planarization layer 115 and / or the second planarization layer 116. In some embodiments, in order to suppress color mixing caused by light emitted from the light-emitting diode 130 being transmitted to adjacent sub-pixels SP1, SP2, and SP3, the bank 118 may include a black material configured to absorb light. Here, the bank 118 may be selectively provided as needed and may be omitted.

[0073] The transparent protective layer 119 covers the light-emitting diode 130 and the planarization layers 115 and 116 to protect the light-emitting diode 130. In addition, as shown in Figure 2 FIG., the transparent protective layer 119 may be provided in the opening region defined by the bank 118 and above the region where the second planarization layer 116 and the bank 118 overlap. The transparent protective layer 119 may be an optical clear adhesive (OCA) or an optical clear resin (OCR), but is not limited thereto.

[0074] In some embodiments, in the display device 100 according to an embodiment of the present disclosure, the transparent protective layer 119 may be formed of an adhesive composition including particles 190 having a plurality of multi-shell structures. That is, the transparent protective layer 119 may include the particles 190 having a plurality of multi-shell structures, and may further include a photosensitive material and an adhesive. The particles 190 having a multi-shell structure, the photosensitive material, and the adhesive will be described in detail below.

[0075] Figure 3A is a cross-sectional view illustrating an example of the particles 190 having a multi-shell structure of the present disclosure.

[0076] At least one of the above-described adhesive layer 114, first planarization layer 115, second planarization layer 116, and transparent protective layer 119 in the display device 100 according to an embodiment of the present disclosure may include the particles 190 having a multi-shell structure, and may further include a photosensitive material and an adhesive. Although Figure 2 illustrates that the particles 190 having a multi-shell structure are included in all of the adhesive layer 114, first planarization layer 115, second planarization layer 116, and transparent protective layer 119, this is merely an example, and thus the particles 190 having a multi-shell structure may be selectively provided as needed. For example, the particles 190 having a multi-shell structure may be included only in the adhesive layer 114 or may be included in the adhesive layer 114, first planarization layer 115, and second planarization layer 116. The particles 190 having a multi-shell structure may supplement the adhesion performance, light extraction performance, optical performance, and film hardness of the adhesive layer 114, first planarization layer 115, second planarization layer 116, or transparent protective layer 119.

[0077] Referring to Figure 3A , the particles 190 having a multi-shell structure are formed of a central portion M1, a first outer portion M2 surrounding the central portion M1, and a second outer portion M3 surrounding the first outer portion M2.

[0078] The central portion M1 of the particles 190 having a multi-shell structure is a layer that provides adhesion performance and is formed of a tackifier material. Specifically, the tackifier material includes a rosin-based resin or a terpene-based resin. In addition, the tackifier material may include at least one derivative of a compound selected from the group consisting of phenols, phosphorus, and ethers. For example, the central portion M1 may include rosin and Butylated Hydroxy Anisole (BHA).

[0079] The first outer layer M2 is a layer configured to provide hardness and light extraction performance and is formed of a molecular sieve. The molecular sieve can be a porous molecular sieve having a pore diameter of about 1.5 nm to 50 nm, and specifically, can be at least one selected from the group consisting of SBA-1 (Santa Barbara Amorphous-1), SBA-3 (Santa Barbara Amorphous-3), SBA-6 (Santa Barbara Amorphous-6), SBA-15 (Santa Barbara Amorphous-15), MCM-41 (Mobil Composition of Matter-41), and MCM-48 (Mobil Composition of Matter-48), but is not limited thereto. For example, the first outer layer M2 may include SBA-15. SBA is an abbreviation for Santa Barbara Amorphous and is a highly stable mesoporous silica molecular sieve developed by researchers at the University of California, Santa Barbara. MCM is an abbreviation for Mobil Composition of Matter and is a mesoporous material having a hierarchical structure.

[0080] The second outer layer M3 is a layer used together with the first outer layer M2 to improve hardness and light extraction characteristics and may include fullerenes. The diameter of the fullerenes can range from 0.5 nm to 1 nm. When this range is satisfied, the appropriate size of the multi-shell structured particle 190 can be maintained without reducing the adhesion performance and light extraction performance of the central part M1 and the first outer layer M2 of the multi-shell structured particle 190. The fullerenes can be at least one selected from the group consisting of C60, C70, C72, C76, C78, C82, C84, C90, C94, and C96, but is not limited thereto.

[0081] The diameter of the multi-shell structured particle 190 can range from 0.2 μm to 1.8 μm, and specifically from 0.3 μm to 1.5 μm. The diameter of the multi-shell structured particle 190 can be determined by the diameter of the fullerenes. This is because the adhesion and light characteristics of the multi-shell structured particle 190 are given by the fullerenes configured in a spherical shape and disposed on the outer wall of the first outer layer M2. Therefore, when the multi-shell structured particle 190 has a size within the above range, the effect of the second outer layer M3 can be maximized without reducing the hardness and light extraction effect of the first outer layer M2.

[0082] In a layer including particles 190 having a multi-shell structure, a central portion M1 of the particles 190 having the multi-shell structure is formed of a tackifier material, so that the adhesiveness and adhesion retention of the layer including the particles 190 having the multi-shell structure can be improved. When the particles 190 having the multi-shell structure are included not only in the adhesive layer 114 but also in the planarization layers 115 and 116 and the transparent protective layer 119, if the planarization layers 115 and 116 are formed after transferring the light emitting diode 130 onto the adhesive layer 114, the planarization layers 115 and 116 can provide additional adhesiveness, so that the light emitting diode 130 can be stably disposed. Accordingly, the product yield of the display device 100 can be improved. In addition, the light extraction efficiency of the layer including the particles 190 having the multi-shell structure is improved by a first outer portion M2 and a second outer portion M3, which will be described in detail with reference to Figure 3B will be described in detail.

[0083] Figure 3B is a Figure 3A magnified perspective view of a first outer portion M2 and a second outer portion M3 of the particles 190 having the multi-shell structure of the present disclosure.

[0084] For example, as shown in Figure 3B , the first outer portion M2 of the particles 190 having the multi-shell structure includes SBA-15. SBA-15 has a three-dimensionally coupled cubic structure, so that the three-dimensional pores of SBA-15 form a hexagonal arrangement. The linearity of light emitted from the light emitting diode 130 can be enhanced by the porous morphology of SBA-15. The enhancement of the linearity of light makes it possible to manufacture a display device with high light extraction efficiency and improves the brightness of the light emitting diode 130, thereby reducing the power consumption of the display device.

[0085] In order to maximize the effect of increasing the light extraction efficiency and reducing the power consumption of the first outer portion M2, the first outer portion M2 may occupy 50% to 90% of the total volume of the particles 190 having the multi-shell structure, and specifically 60% to 80%.

[0086] The second outer portion M3 of the particles 190 having the multi-shell structure includes fullerene. Fullerene can increase the light extraction efficiency together with the first outer portion M2. Compared with the first outer portion M2 that enhances the linearity of light, the second outer portion M3 can enhance the light scattering property. Similar to the first outer portion M2, the second outer portion M3 can increase the light extraction efficiency and reduce the power consumption.

[0087] The display device 100 according to an embodiment of the present disclosure may further include a photosensitive material and an adhesive not only in the adhesive composition but also in at least one layer selected from the group consisting of the adhesive layer 114, the planarization layers 115 and 116, and the transparent protective layer 119.

[0088] According to the present disclosure, at least one layer selected from the group consisting of the adhesive layer 114, the planarization layers 115 and 116, and the transparent protective layer 119 may include a photosensitive material and an adhesive.

[0089] The photosensitive material imparts optical properties to at least one layer selected from the group consisting of the adhesive layer 114, the planarization layers 115 and 116, and the transparent protective layer 119 to provide a layer that can be processed by photolithography. The photosensitive material may include an oxime-based compound or a benzophenone-based compound. For example, 4,4'-bis(dimethylamino)benzophenone may be used, but is not limited thereto.

[0090] The adhesive can improve adhesion. The adhesive may include at least one of an alkali-developable adhesive or a silicone-based adhesive. For example, 1,4-butanediol dimethacrylate, triethylene glycol dimethacrylate, and a siloxane-based adhesive may be used, but are not limited thereto.

[0091] Therefore, in the display device 100 including the photosensitive material and the adhesive, adhesion and light transmittance are further improved. In addition, when manufacturing the display device 100, at least one layer selected from the group consisting of the adhesive layer 114, the planarization layers 115 and 116, and the transparent protective layer 119 can be processed by photolithography.

[0092] Therefore, the adhesive composition according to an embodiment of the present disclosure improves the adhesion performance of the adhesive layer 114, the planarization layers 115 and 116, and the transparent protective layer 119 through the particles 190 having a multi-shell structure and the adhesive. In this way, the transfer rate of the light-emitting diode 130 can be improved, which results in a reduction in manufacturing cost. In addition, the hardness of each layer is improved by the particles 190 having a multi-shell structure, and the light extraction efficiency of the light-emitting diode 130 is enhanced by the first outer part M2 and the second outer part M3 of the particles 190 having a multi-shell structure. Therefore, a display device 100 that exhibits high brightness even at low power can be provided. In addition, when the photosensitive material is included in all of the adhesive layer 114, the planarization layers 115 and 116, and the transparent protective layer 119, the optical properties are improved, so that these layers can be sequentially processed by photolithography during the transfer process. In this case, the manufacturing process of the display device can be simplified.

[0093] The adhesive composition according to an embodiment of the present disclosure includes a photosensitive material, an adhesive, and a plurality of particles 190 having a multi-shell structure. The particles 190 having a multi-shell structure are configured by a central part M1 formed of a tackifier material, a first outer part M2 including a molecular sieve surrounding the central part M1, and a second outer part M3 including a fullerene surrounding the first outer part. The configuration of the photosensitive material, the adhesive, and the particles 190 having a multi-shell structure is as described with reference toFigures 1 to 3B The above configurations are substantially the same, and thus repeated descriptions will be omitted.

[0094] The adhesive composition according to an embodiment of the present disclosure has excellent adhesiveness and also has excellent light transmittance from the first outer part M2 and the second outer part M3 of the particles 190 having a multi-shell structure. In addition, the adhesive composition according to an embodiment of the present disclosure has photosensitivity. Accordingly, the adhesive layer 114, the planarization layers 115 and 116, and the transparent protective layer 119 of the display device 100 according to an embodiment of the present disclosure can be formed using the adhesive composition according to an embodiment of the present disclosure.

[0095] Specifically, the adhesive composition according to an embodiment of the present disclosure has excellent adhesiveness such that the adhesive composition can be used to form the adhesive layer 114. In addition, the adhesive composition according to an embodiment of the present disclosure has a high light extraction efficiency. Accordingly, when the planarization layers 115 and 116 and the transparent protective layer 119 are formed using the adhesive composition, a display device having high brightness even at low power can be provided. In addition, the present disclosure satisfies all of the above-mentioned characteristics such that all of the adhesive layer 114, the planarization layers 115 and 116, and the transparent protective layer 119 can be processed by photolithography, thereby simplifying the manufacturing process of the display device.

[0096] Hereinafter, the effects of the present disclosure will be described in more detail with reference to Examples and Comparative Examples. However, the following Examples are set forth to illustrate the present disclosure, but the scope of the present disclosure is not limited thereto.

[0097] Example

[0098] Example 1

[0099] An adhesive composition according to an embodiment of the present disclosure including a plurality of particles having a multi-shell structure, an adhesive, a photosensitive material, and a solvent was prepared. The central part of the particles having a multi-shell structure was formed of rosin and butylated hydroxyanisole (BHA) as an antioxidant, the first outer part was formed of SBA-15, and the second outer part was formed of C60 fullerene having a diameter of about 0.9 nm. 20 parts by weight of 1,4-butanediol dimethacrylate as an adhesive, 1 part by weight of 4,4'-bis(dimethylamino)benzophenone as a photosensitive material, and 64 parts by weight of propylene glycol monomethyl ether acetate (PGMEA) as a solvent were mixed in 5 parts by weight of the particles having a multi-shell structure for about 24 hours to prepare a liquid adhesive.

[0100] Comparative Example 1

[0101] A composition for preparing an adhesive layer commonly used for preparing a display device is prepared. 80 parts by weight of a polyurethane acrylate having a polystyrene conversion weight average molecular weight (M w ) of 50,000, 18 parts by weight of isobornyl acrylate as an acrylic monomer, 0.5 parts by weight of dipentaerythritol triacrylate as a crosslinking monomer, 1 part by weight of 4,4'-bis(dimethylamino)benzophenone as a photoinitiator, and 0.5 parts by weight of 3-glycidoxypropyltriethoxysilane as an additive are uniformly mixed at room temperature for more than 24 hours to prepare the composition.

[0102] Comparative Example 2

[0103] A composition for preparing a planarization layer commonly used for a display device is prepared. 20 parts by weight of a siloxane-based adhesive, 10 parts by weight of 1,4-butanediol dimethacrylate as a crosslinking monomer, 5 parts by weight of 2,4,5-trihydroxybenzophenone as a tackifier material, 64 parts by weight of propylene glycol monomethyl ether acetate as a solvent, and 1 part by weight of 4,4'-bis(dimethylamino)benzophenone as a photoinitiator are uniformly mixed at room temperature for more than 24 hours to prepare the composition.

[0104] Comparative Example 3

[0105] A composition including a tackifier material, an adhesive, a photosensitive material, and a solvent is prepared. 20 parts by weight of a siloxane-based adhesive, 10 parts by weight of 1,4-butanediol dimethacrylate as a crosslinking monomer, 5 parts by weight of 2,4,5-trihydroxybenzophenone as a tackifier material, 64 parts by weight of propylene glycol monomethyl ether acetate as a solvent, and 1 part by weight of 4,4'-bis(dimethylamino)benzophenone as a photoinitiator are uniformly mixed at room temperature for more than 24 hours to prepare the composition.

[0106] Comparative Example 4

[0107] A composition including a molecular sieve, an adhesive, a photosensitive material, and a solvent is prepared. 20 parts by weight of a siloxane-based adhesive, 10 parts by weight of 1,4-butanediol dimethacrylate as a crosslinking monomer, 5 parts by weight of MCM-41 as a molecular sieve, 64 parts by weight of propylene glycol monomethyl ether acetate as a solvent, and 1 part by weight of 4,4'-bis(dimethylamino)benzophenone as a photoinitiator are uniformly mixed at room temperature for more than 24 hours to prepare the composition.

[0108] Comparative Example 5

[0109] Prepare a composition comprising a fullerene, an adhesive, a photosensitive material, and a solvent. 20 parts by weight of a siloxane-based adhesive, 10 parts by weight of 1,4-butanediol dimethacrylate as a crosslinking monomer, 3 parts by weight of a fullerene material, 66 parts by weight of propylene glycol monomethyl ether acetate as a solvent, and 1 part by weight of 4,4'-bis(dimethylamino)benzophenone as a photoinitiator are uniformly mixed at room temperature for more than 24 hours to prepare the composition.

[0110] Comparative Example 6

[0111] Prepare a composition comprising a tackifier material, a molecular sieve, a fullerene, an adhesive, a photosensitive material, and a solvent. 20 parts by weight of a siloxane-based adhesive, 10 parts by weight of 1,4-butanediol dimethacrylate as a crosslinking monomer, 5 parts by weight of 2,4,5-trihydroxybenzophenone as a tackifier material, 5 parts by weight of MCM-41 as a molecular sieve, 3 parts by weight of a fullerene material, 56 parts by weight of propylene glycol monomethyl ether acetate as a solvent, and 1 part by weight of 4,4'-bis(dimethylamino)benzophenone as a photoinitiator are uniformly mixed at room temperature for more than 24 hours to prepare the composition.

[0112] Test Example

[0113] Performance Comparative Evaluation

[0114] The results obtained by comparing the adhesion, hardness, and optical properties of the protective layers formed using the compositions prepared in the examples and comparative examples 1 to 6 are summarized in Table 1.

[0115] Table 1

[0116] Example 1 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 Adhesion (%) 100 100 5 70 5 40 50 Adhesion Retention Force (%) 100 100 3 100 3 10 70 Hardness of Protective Layer 3H 3B 3H H 3H 3H 3H Adhesiveness 3 - 3 3 3 3 - <![CDATA[Sensitivity (mJ / cm 2 )]]> 100 - 100 100 100 100 100 Resolution (μm) 10 - 10 10 10 10 - Transmittance (%) 95 85 90 95 95 95 90

[0117] In Table 1, "-" represents a value below the measurable value.

[0118] Referring to Table 1, Comparative Example 1 is an acrylic resin composition for an existing adhesive layer. It can be confirmed that the hardness of the protective layer manufactured using this acrylic resin composition is lower than that of the protective layer of Example 1. In addition, in Comparative Example 1, the sensitivity, resolution, and transmittance involved in the optical properties of the material for the existing adhesive layer are all lower than those of Example 1. This result shows that the presence of multi-shell structured particles and the photosensitive material improves the optical properties of the protective layer.

[0119] When it is considered that the existing planarization layer material of Comparative Example 2 has comparable optical properties compared to Example 1, the optical property parameters of Comparative Example 2 are at a similar level to those of Example 1. However, the transmittance of Example 1 is approximately 5% higher than that of Comparative Example 2. This indicates that the transmittance also increases with the linearity of light, and the light scattering is improved by the porous molecular sieve and fullerene in the particles of the multi-shell structure.

[0120] In addition, the adhesion and adhesion retention of the existing planarization layer of Comparative Example 2 are very low, but the adhesion and adhesion retention of the planarization layer of Example 1 are very high. Therefore, it can be understood that the liquid material including the particles of the multi-shell structure and the adhesive exhibits excellent adhesion and adhesion retention.

[0121] When considering that the planarization layer not only planarizes the upper part of the thin film transistor but also fixes the position of the light-emitting diode, if the planarization layer has excellent adhesion and adhesion retention, the transfer rate of the light-emitting diode can be improved. Therefore, when including the liquid material of Example 1 in the planarization layer instead of the existing planarization layer material of Comparative Example 2, it can be inferred that the transfer rate and product yield of the display device including the light-emitting diode can be improved.

[0122] Each of Comparative Examples 3 to 6 is a composition of a material including one or more layers of particles configured with a multi-shell structure other than the particles of the multi-shell structure of Example 1 or a composition obtained by simply mixing the constituent materials of each layer. When comparing the adhesion, adhesion retention, and hardness of the protective layer formed using the liquid material manufactured in Example 1 with the properties of the protective layer manufactured using each of the compositions of Comparative Examples 3 to 6, the effect of the particles of the multi-shell structure can be confirmed by comparing with a composition including only the constituent materials of the layers other than the particles of the multi-shell structure or a composition obtained by simply mixing all the constituent materials of the layers.

[0123] In Comparative Example 3, the particles of the multi-shell structure of Example 1 were replaced with a tackifier material, so the adhesion and strength of the protective layer decreased compared to Example 1. By doing so, it can be understood that SBA-15, which is a porous molecular sieve, and fullerene in the particles of the multi-shell structure participate in improving adhesion and film hardness.

[0124] In Comparative Example 4, the particles of the multi-shell structure of Example 1 were replaced with a molecular sieve, so the adhesion and adhesion retention decreased significantly compared to Example 1, which was caused by the lack of a tackifier material. However, the hardness is comparable to that of Example 1, so it can be understood that the porous molecular sieve directly participates in improving the film hardness.

[0125] In Comparative Example 5, the particles of the multi-shell structure of Example 1 were replaced with fullerenes, such that the adhesiveness and adhesion retention were significantly higher than those of Comparative Example 2. Accordingly, it can be inferred that fullerenes have improved adhesion properties greater than those of the porous molecular sieve. However, when compared with Example 1, the adhesiveness and adhesion retention were significantly reduced. Accordingly, it can be understood that the adhesion properties of the protective layer are significantly improved when a display device is manufactured using the particles of the multi-shell structure rather than using only fullerenes.

[0126] In Comparative Example 6, compared with Example 1, particles of the multi-shell structure were not formed; rather, a composition was formed by simply mixing a tackifier material, a molecular sieve, fullerenes, an adhesive, and a photosensitive material in a solvent, and thus both the adhesiveness and attachment were lower than those of Example 1. In addition, the resolution and transmittance were also reduced. Accordingly, the results obtained from Comparative Example 6 show that the adhesiveness and optical properties of the particles of the multi-shell structure of Example 1 are significantly improved by the multi-shell configuration.

[0127] The embodiments of the present disclosure can also be described as follows:

[0128] According to one aspect of the present disclosure, a display device is provided.

[0129] In some embodiments, the display device includes a substrate including a plurality of pixels. The display device includes an adhesive layer disposed on the substrate. The display device further includes a light-emitting diode disposed on the adhesive layer. The display device further includes a planarization layer disposed to surround the light-emitting diode. The display device further includes a connection electrode disposed on the planarization layer. The display device further includes a transparent protective layer disposed on the connection electrode. At least one layer selected from the group consisting of the adhesive layer, the planarization layer, and the transparent protective layer includes a plurality of particles of a multi-shell structure. The particles of the multi-shell structure include: a central portion including a tackifier material; a first outer portion surrounding the central portion and including a molecular sieve; and a second outer portion surrounding the first outer portion and including fullerenes.

[0130] At least one layer selected from the group consisting of the adhesive layer, the planarization layer, and the transparent protective layer may further include an adhesive and a photosensitive material.

[0131] The planarization layer may be a single layer covering at least a part of the light-emitting diode, or a multi-layer including a first planarization layer and a second planarization layer. The first planarization layer planarizes the upper part of the substrate and surrounds the light-emitting diode, and the second planarization layer is disposed on the first planarization layer and covers at least a part of the light-emitting diode.

[0132] The diameter of the light-emitting diode may be 100 μm or less.

[0133] The tackifier material may include a rosin-based resin or a terpene-based resin.

[0134] The molecular sieve may have a plurality of pores and the diameter of the pores may be from 1.5 nm to 50 nm.

[0135] The molecular sieve may be at least one selected from the group consisting of SBA-1 (Santa Barbara Amorphous-1), SBA-3 (Santa Barbara Amorphous-3), SBA-6 (Santa Barbara Amorphous-6), SBA-15 (Santa Barbara Amorphous-15), MCM-41 (Mobil Composition of Matter-41), and MCM-48 (Mobil Composition of Matter-48).

[0136] The first exterior may occupy 50% to 90% of the total volume of the particles of the multi-shell structure.

[0137] The diameter of the fullerene may be from 0.5 nm to 1 nm.

[0138] The diameter of the particles of the multi-shell structure may be from 0.2 μm to 1.8 μm.

[0139] The adhesive may be an alkali-developable adhesive or a silicon-based adhesive, and the photosensitive material may be an oxime-based compound or a benzophenone-based compound.

[0140] According to another aspect of the present disclosure, an adhesive composition is provided.

[0141] In some embodiments, the adhesive composition includes a photosensitive material, an adhesive, and a plurality of particles of a multi-shell structure. The particles of the multi-shell structure include: a central portion formed of a tackifier material; a first exterior surrounding the central portion and including a molecular sieve; and a second exterior surrounding the first exterior and including a fullerene.

[0142] The tackifier material may include a rosin-based resin or a terpene-based resin.

[0143] The molecular sieve may have a plurality of pores and the diameter of the pores may be from 1.5 nm to 50 nm.

[0144] The diameter of the fullerene may be from 0.5 nm to 1 nm.

[0145] According to still another aspect of the present disclosure, a method for forming a display device includes: forming an adhesive layer on a substrate; attaching a light-emitting diode to the adhesive layer; depositing a first planarization layer on the adhesive layer, the first planarization layer surrounding the light-emitting diode; depositing a second planarization layer on the first planarization layer and the light-emitting diode; forming a connection electrode on the second planarization layer; and depositing a transparent protective layer on the connection electrode. At least one of the adhesive layer, the first planarization layer, the second planarization layer, and the transparent protective layer includes a plurality of particles having a multi-shell structure. Each of the plurality of particles having a multi-shell structure includes: a central portion including a tackifier material; a first outer portion surrounding the central portion, the first outer portion including a molecular sieve; and a second outer portion surrounding the first outer portion, the second outer portion including a fullerene.

[0146] At least one of the adhesive layer, the first planarization layer, the second planarization layer, and the transparent protective layer further includes an adhesive and a photosensitive material.

[0147] The adhesive includes an alkali-developable adhesive or a silicon-based adhesive, and the photosensitive material includes an oxime-based compound or a benzophenone-based compound.

[0148] Forming the connection electrode includes patterning the second planarization layer and the first planarization layer by lithography.

[0149] Forming the adhesive layer includes patterning the adhesive layer by lithography.

[0150] The above various embodiments may be combined to provide further embodiments. All U.S. patents, U.S. patent application publications, U.S. patent applications, foreign patents, foreign patent applications, and non-patent publications mentioned in this specification and / or listed in the application data sheet are hereby incorporated by reference in their entirety. If concepts from various patents, applications, and publications are needed to provide additional embodiments, various aspects of the embodiments may be modified.

[0151] Based on the foregoing detailed description, these and other changes may be made to the embodiments. In general, in the following claims, the terms used should not be construed as limiting the claims to the specific embodiments disclosed in the specification and claims, but should be construed to include all possible embodiments and the full scope of equivalents to which such claims are entitled. Accordingly, the claims are not limited by the present disclosure.

Claims

1. A display device, comprising: a substrate including a plurality of pixels; an adhesive layer on the substrate; a light-emitting diode on the adhesive layer; a planarization layer on the adhesive layer, the planarization layer surrounding the light-emitting diode; a connection electrode on the planarization layer; and a transparent protective layer on the connection electrode, wherein at least one of the adhesive layer, the planarization layer, and the transparent protective layer includes a plurality of particles having a multi-shell structure, and the particles having the multi-shell structure include: a central portion including a tackifier material; a first outer portion including a molecular sieve and surrounding the central portion; and a second outer portion including a fullerene and surrounding the first outer portion, wherein the diameter of the fullerene is from 0.5 nm to 1 nm.

2. The display device according to claim 1, wherein at least one of the adhesive layer, the planarization layer, and the transparent protective layer further includes an adhesive and a photosensitive material.

3. The display device according to claim 1, wherein the planarization layer is a single layer covering at least a part of the light-emitting diode, or a multi-layer including a first planarization layer surrounding the light-emitting diode and a second planarization layer on the first planarization layer, and the second planarization layer covers at least a part of the light-emitting diode.

4. The display device according to claim 1, wherein the diameter of the light-emitting diode is 100 μm or less.

5. The display device according to claim 1, wherein the tackifier material includes a rosin-based resin or a terpene-based resin.

6. The display device according to claim 1, wherein the molecular sieve has a plurality of pores and the diameter of the pores is from 1.5 nm to 50 nm.

7. The display device according to claim 1, wherein the molecular sieve is at least one selected from the group consisting of SBA-1, SBA-3, SBA-6, SBA-15, MCM-41, and MCM-48.

8. The display device according to claim 1, wherein the first outer portion occupies 50% to 90% of the total volume of the particles having the multi-shell structure.

9. The display device according to claim 1, wherein the diameter of the particles having the multi-shell structure is from 0.2 μm to 1.8 μm.

10. The display device according to claim 2, wherein the adhesive includes an alkali-developable adhesive or a silicon-based adhesive, and the photosensitive material includes an oxime-based compound or a benzophenone-based compound.

11. An adhesive composition, comprising: a photosensitive material; an adhesive; and a plurality of particles having a multi-shell structure; wherein each of the plurality of particles having the multi-shell structure includes: a central portion including a tackifier material; a first outer portion including a molecular sieve and surrounding the central portion; and a second outer portion including a fullerene and surrounding the first outer portion, wherein the diameter of the fullerene is from 0.5 nm to 1 nm.

12. The adhesive composition according to claim 11, wherein the tackifier material includes a rosin-based resin or a terpene-based resin.

13. The adhesive composition according to claim 11, wherein the molecular sieve has a plurality of pores, and the diameter of the pores is from 1.5 nm to 50 nm.

14. A method for forming a display device, comprising: forming an adhesive layer on a substrate; attaching a light-emitting diode to the adhesive layer; depositing a first planarization layer on the adhesive layer, the first planarization layer surrounding the light-emitting diode; depositing a second planarization layer on the first planarization layer and the light-emitting diode; forming a connection electrode on the second planarization layer; and depositing a transparent protective layer on the connection electrode, wherein at least one of the adhesive layer, the first planarization layer, the second planarization layer, and the transparent protective layer comprises a plurality of particles having a multi-shell structure, and each of the plurality of particles having a multi-shell structure comprises: a central portion including a tackifier material; a first outer portion surrounding the central portion, the first outer portion including a molecular sieve; and a second outer portion surrounding the first outer portion, the second outer portion including fullerene, and the diameter of the fullerene is from 0.5 nm to 1 nm.

15. The method according to claim 14, wherein at least one of the adhesive layer, the first planarization layer, the second planarization layer, and the transparent protective layer further comprises an adhesive and a photosensitive material.

16. The method according to claim 15, wherein the adhesive comprises an alkali-developable adhesive or a silicon-based adhesive, and the photosensitive material comprises an oxime-based compound or a benzophenone-based compound.

17. The method according to claim 15, wherein forming the connection electrode comprises patterning the second planarization layer and the first planarization layer by lithography.

18. The method according to claim 16, wherein forming the adhesive layer comprises patterning the adhesive layer by lithography.

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