A CPO device integrating wavelength division

Abstract

This invention provides an integrated wavelength division multiplexing (WDM) CPO device, which can improve the space utilization of the product, while improving heat dissipation performance and ensuring that the product performance is not affected. The PCB circuit board has mounting bases arranged on it, with linearly arranged optical receiver mounting slots and optical transmitter mounting slots, which are inclined. The optical receiver and optical transmitter are respectively placed in the optical receiver mounting slots and optical transmitter mounting slots. After being connected to LC connectors, the optical receiver and optical transmitter are optically connected to a multiplexer and a demultiplexer via optical fibers. The multiplexer and demultiplexer are connected to optical ports via optical fibers. The optical receiver and optical transmitter are also electrically connected to electrical chips on the PCB circuit board via a flexible circuit board. The PCB circuit board is connected to electrical ports and power supply interfaces. The mounting base is connected to a heat sink, allowing the optical receiver and optical transmitter to conduct heat to the housing for heat dissipation through the heat sink and / or the mounting base.

Description

Technical Field

[0001] This invention relates to the field of optical communication technology for data centers, and more specifically to a CPO device with integrated wavelength division multiplexing (WDM). Background Technology

[0002] Currently, major equipment manufacturers and large data center users in the data center market are actively developing CPO (Co-Packaged Optics) products based on silicon photonics engines. According to authoritative predictions, CPO will become the dominant enabling technology for cloud providers' data centers in the future, bringing with it a huge application market.

[0003] In the context of increasingly stringent energy consumption requirements in data centers and supercomputing centers, traditional optical modules, limited by board panel space, can no longer increase bandwidth by increasing the number of optical modules. To address this, the CPO product based on silicon photonics technology adopts a co-packaging concept of the core switching chip and optical engine on the same high-speed motherboard, shortening the distance from the photoelectric conversion function to the core switching chip, thereby shortening the high-speed electrical channel link, reducing redundant components, and improving system power consumption.

[0004] Compared to independently packaged optical modules, although it improves space utilization to some extent, the improvement in space utilization is still limited due to the current technology's use of a flat arrangement for board layout. The overall package size is still relatively large, and as its integration level increases, the compact layout also increases the heat dissipation pressure on the product. Summary of the Invention

[0005] To address the aforementioned issues, this invention provides an integrated wavelength division multiplexing (WDM) CPO device, which can improve the space utilization of the product while enhancing heat dissipation performance, ensuring that the product's performance is not affected.

[0006] The technical solution is as follows: An integrated wavelength division multiplexing (WDM) CPO device includes a PCB circuit board and a housing capable of accommodating the PCB circuit board. The housing includes a base and a top cover that can be assembled together. The PCB circuit board is placed on the base. The PCB circuit board is characterized by having mounting bases arranged on it. Each mounting base has linearly arranged optical receiver mounting slots and optical transmitter mounting slots. The optical receiver mounting slots and optical transmitter mounting slots are inclined on the mounting bases. The optical receiver and optical transmitter are respectively placed in the optical receiver mounting slots and optical transmitter mounting slots. The optical receiver and optical transmitter are connected to LC connectors and then optically connected to a multiplexer and a demultiplexer via optical fibers. The multiplexer and demultiplexer are connected to optical ports via optical fibers. The optical receiver and optical transmitter are also electrically connected to electrical chips on the PCB circuit board via a flexible circuit board. The PCB circuit board is connected to an electrical port and a power supply interface. The mounting base is connected to a heat sink. The optical receiver and optical transmitter can dissipate heat by transferring heat from the heat sink and / or the mounting base to the housing.

[0007] Furthermore, at least two mounting bases are arranged in a front-to-back pattern on the PCB circuit board.

[0008] Furthermore, one of the two mounting bases is provided with the optical receiver mounting slot, and the other mounting base is provided with the optical transmitter mounting slot.

[0009] Furthermore, the optical receiver mounting slot and the optical transmitter mounting slot are arranged at intervals on the mounting base.

[0010] Furthermore, an optical port adapter mounting slot is provided on the mounting base and located behind the optical receiver mounting slot and the optical transmitter mounting slot. The optical port adapter is fixed in the optical port adapter mounting slot, and the LC connector is engaged in the optical port adapter by a connector snap-fit.

[0011] Furthermore, the optical port adapter is fixed in the optical port adapter mounting slot by means of adhesive or screw fastening.

[0012] Furthermore, a first heat sink is installed on one of the mounting bases. The lower end of the first heat sink is provided with a heat dissipation groove adapted to the light receiver and the light transmitter. The upper surface of the first heat sink is disposed close to the upper cover, and a thermal pad is provided between the upper surface of the first heat sink and the upper cover.

[0013] Furthermore, a second heat sink is installed on one of the mounting bases. The lower end of the second heat sink is provided with a heat dissipation groove adapted to the optical receiver and the optical transmitter. The upper surface of the second heat sink is provided with heat dissipation fins. The PCB circuit board at the lower end of the mounting base on which the second heat sink is installed has an avoidance notch. A thermal pad is provided in the avoidance notch. The thermal pad contacts the lower surface of the mounting base and the base respectively.

[0014] Furthermore, the optical receiver mounting slot, the optical transmitter mounting slot, and the heat dissipation slot are provided with flange fixing slots corresponding to the flange portions of the optical receiver and the optical transmitter, and the first heat sink and the second heat sink are respectively installed and limited by the flange fixing slots.

[0015] Furthermore, electrical chips are respectively provided on the front and back of the PCB circuit board, and the flexible circuit board passes through the clearance notch to connect to the electrical chips provided on the back of the PCB circuit board. The base is provided with a clearance groove corresponding to the flexible circuit board.

[0016] Furthermore, the base is provided with a base mounting groove, and the multiplexer and the splitter are placed overlappingly in the base mounting groove, with the multiplexer positioned above the splitter, and the optical port positioned at the upper end of the multiplexer.

[0017] Furthermore, heat dissipation fins are provided on the upper surface of the cover.

[0018] This invention provides an integrated wavelength division multiplexing (WDM) CPO device, which improves the space utilization of products. It integrates more optical and electrical transmission devices without changing the PCB layout size, while ensuring unaffected heat dissipation. The WDM CPO device of this invention expands the PCB layout space from a planar plane to a three-dimensional space by arranging multiple rows of mounting bases on the PCB and placing light transmitters and receivers on the mounting bases at a certain tilt angle. This allows for the integration of more optical transmission devices within a fixed PCB area. Furthermore, the device incorporates point chips on both the front and back surfaces of the PCB to accommodate the additional optical transmission devices, significantly improving space utilization. Simultaneously, the WDM CPO device of this invention improves heat dissipation while increasing integration, fully utilizing the housing for heat dissipation. The device employs a two-sided heat dissipation method, using a thermally conductive medium to transfer the heat generated by the light transmitters and receivers on the mounting bases to the top cover and base for cooling, resulting in excellent heat dissipation performance. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the CPO device with integrated wavelength division multiplexing (WDM) after the housing and internal components have been separated in one embodiment.

[0020] Figure 2 This is a schematic diagram from a first perspective of the internal components within the housing of an integrated wavelength division multiplexing (WDM) CPO device according to an embodiment.

[0021] Figure 3 This is a schematic diagram from a second perspective of the internal components within the housing of an integrated wavelength division multiplexing (WDM) CPO device according to an embodiment.

[0022] Figure 4 This is a schematic diagram showing the internal components of an integrated wavelength division multiplexing (WDM) CPO device in one embodiment after the heat sink is hidden inside the housing.

[0023] Figure 5 This is a schematic diagram of the mounting base in the embodiment;

[0024] Figure 6 This is a schematic diagram of the first heat sink in the embodiment;

[0025] Figure 7 This is a top view schematic diagram of the internal components of an integrated wavelength division multiplexing (WDM) CPO device in an embodiment.

[0026] Figure 8 for Figure 7 A sectional view along the AA direction. Detailed Implementation

[0027] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0028] See Figures 1 to 8An integrated wavelength division multiplexing (WDM) CPO device of the present invention includes a PCB circuit board 1 and a housing capable of accommodating the PCB circuit board 1. The housing includes a base 2 and a top cover 3 that can be assembled together. The PCB circuit board 1 is placed on the base, and mounting bases 4 are arranged on the PCB circuit board 1. In this embodiment, two mounting bases 4 are arranged one in front of the other on the PCB circuit board 1. The mounting bases 4 are provided with linearly arranged optical receiver mounting slots 5 and optical transmitter mounting slots 6. The optical receiver mounting slots 5 and optical transmitter mounting slots 6 are inclined upward at a certain angle on the mounting bases 4. Optical receivers 7 and optical transmitters 8 are respectively placed in the optical receiver mounting slots 5 and optical transmitter mounting slots 6. The optical receivers 7 and optical transmitters 8 are respectively connected to LC connectors 9 and then connected to the multiplexer via optical fiber 10. Optical connection is achieved by multiplexer 11 and demultiplexer 12. Multiplexer 11 and demultiplexer 12 are connected to optical port 13 via optical fiber 10. Optical transmitter 8 transmits multiple optical signals of different wavelengths to multiplexer 11 via LC connector 9 and then combines them into a single optical fiber for transmission. Demultiplexer 12 separates optical signals of different wavelengths received from a single optical fiber and transmits them to optical receiver 7. Optical receiver 7 and optical transmitter 8 are also electrically connected to electrical chip 15 on PCB circuit board 1 via flexible circuit board 14. High-speed electrical port 16 and power supply interface 17 are connected to the front side of electrical chip 15 on PCB circuit board 1, thereby realizing photoelectric conversion and transmission. Heat sink is connected to mounting base 4. Optical receiver 7 and optical transmitter 8 can conduct heat to the housing for heat dissipation through heat sink and / or mounting base.

[0029] Because the optical receiver and optical transmitter are tilted on the mounting base, the front end of the optical transmission device in the next row can extend to the bottom of the optical transmission device in the previous row, shortening the distance between the two rows of mounting bases and improving space utilization.

[0030] In one specific embodiment, the optical receiver mounting slot 5 and the optical transmitter mounting slot 6 are arranged at intervals on each mounting base 4, and the corresponding optical receiver 7 and optical transmitter 8 are arranged at intervals on each mounting base 4.

[0031] In one embodiment, the optical emitting device and the optical receiving device are arranged in two separate rows on the mounting base. Specifically, one of the two mounting bases 4 is provided with only an optical receiver mounting slot 5, which is used only to arrange the optical receiver 7, while the other is provided with only an optical emitting device mounting slot 6, which is used only to arrange the optical emitting device 8.

[0032] Specifically, an optical adapter mounting slot 18 is provided on the mounting base 4, located behind the optical receiver mounting slot 5 and the optical transmitter mounting slot 6. The optical adapter mounting slot 18 is inclined to correspond to the optical receiver mounting slot 5 and the optical transmitter mounting slot 6. The optical adapter 19 is fixed in the optical adapter mounting slot 6, and the LC connector 9 is engaged in the optical adapter 19 by the connector clip 28. The optical adapter 19 is used to install the LC connector 9. The optical adapter 19 can be fixed in the optical adapter mounting slot 18 by adhesive or screws.

[0033] In one specific embodiment, a first heat sink 20 is installed on the mounting base 4 on the front side. The lower end of the first heat sink 20 is provided with a heat dissipation groove 21 adapted to the light receiver 7 and the light emitter 8. The upper end surface of the first heat sink 21 is close to the upper cover 2. A thermal pad 22 is provided between the upper end surface of the first heat sink 20 and the upper cover 2. Through the thermal pad 22 and the first heat sink 20, the heat emitted by the light receiver 7 and the light emitter 8 on the mounting base 4 on the front side can be conducted to the upper cover for heat dissipation. In addition, in this embodiment, heat dissipation fins 30 are provided on the upper surface of the upper cover to further improve the heat dissipation capacity.

[0034] Correspondingly, a second heat sink 23 is installed on the mounting base 5 on the rear side. The lower end of the second heat sink 23 is provided with a heat dissipation groove 21 adapted to the optical receiver 7 and the optical transmitter 8. The upper end surface of the second heat sink 23 is provided with heat dissipation fins 30. The PCB circuit board 1 at the lower end of the mounting base on which the second heat sink 23 is installed has an avoidance notch 24. The size of the avoidance notch 24 is large enough to accommodate a thermal pad 22. The thermal pad 22 contacts the lower surface of the mounting base 5 and the base 3 respectively. Through the thermal pad 22, the heat emitted by the optical receiver 7 and the optical transmitter 8 on the rear mounting base 4 can be conducted to the base 3 for heat dissipation. At the same time, the second heat sink 20 can also dissipate heat, resulting in good heat dissipation capability.

[0035] Correspondingly, the base 2, the top cover 3, the mounting base 4, the first heat sink, and the second heat sink can all be made of materials with good heat dissipation capabilities to ensure heat dissipation, such as aluminum with good heat dissipation performance.

[0036] The integrated wavelength division CPO device in the embodiment improves heat dissipation while increasing integration, making full use of the housing for heat dissipation. The integrated wavelength division CPO device of the present invention adopts heat dissipation on both sides of the housing, and transfers the heat generated by the optical transmitter and optical receiver on the mounting base to the top cover and the base for heat dissipation through the heat conduction medium, which has a good heat dissipation effect.

[0037] In addition, the optical receiver mounting slot 5, the optical transmitter mounting slot 6, and the heat dissipation slot 21 are provided with flange fixing slots 26 corresponding to the flange portions 25 of the optical receiver and the optical transmitter. The first heat sink 20 and the second heat sink 23 are respectively installed and limited by the flange fixing slots 26, which can facilitate the installation and positioning of the heat sinks and ensure the heat dissipation effect.

[0038] In one embodiment, electrical chips 15 are respectively provided on the front and back of the PCB circuit board. A flexible circuit board 14 passes through a clearance notch 24 to connect to the electrical chips 15 provided on the back of the PCB circuit board 1. A clearance groove 27 is provided on the base 3 corresponding to the flexible circuit board. The flexible circuit board can be connected to the pads on the PCB circuit board by soldering. The light emitter and the light receiver are electrically connected to the PCB circuit board through the flexible circuit board. The electrical chips 15 arranged on the front and back can be used to set more light transmission devices, further improving the integration. Setting electrical chips on both sides meets the requirements of high integration and is also more conducive to heat dissipation. If the electrical chips are set on the same side, the board space is insufficient. If the PCB circuit board is lengthened, the overall package size will also increase, and the space utilization will naturally be low.

[0039] In one embodiment, the base 3 is provided with a base mounting groove 29, and the multiplexer 11 and the splitter 12 are stacked vertically in the base mounting groove 29. The multiplexer 11 is located above the splitter 12, and the optical port 13 is located at the upper end of the multiplexer 11. The stacked multiplexer 11 and splitter 12 can save space and reduce the size of the product.

[0040] The integrated wavelength division multiplexing (WDM) CPO device provided in the above embodiments is a form of on-board optical interconnect, mainly used in data centers. Unlike pluggable optoelectronic conversion modules with fixed packaging structures specified by the MSA protocol, optical modules have higher space utilization than independently packaged optical modules, which can improve the space utilization of the product. More optical and electrical transmission devices can be integrated without changing the board size. By arranging two rows of mounting bases on the PCB board and setting the optical transmitter and optical receiver on the mounting bases at a certain tilt angle, the board space is expanded from a plane to a three-dimensional space, so that more optical transmission devices can be integrated within a fixed board area. At the same time, the design of placing chips on the front and back surfaces of the PCB board to accommodate more optical transmission devices greatly improves the space utilization.

[0041] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within the present invention.

[0042] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An integrated wavelength division multiplexing (WDM) CPO device, comprising a PCB circuit board and a housing capable of accommodating the PCB circuit board, the housing comprising a base and a top cover capable of being assembled together, the PCB circuit board being placed on the base, characterized in that: The PCB circuit board has mounting bases arranged on it. Each mounting base has linearly arranged optical receiver mounting slots and optical transmitter mounting slots. The optical receiver and optical transmitter mounting slots are inclined on the mounting bases. The optical receiver and optical transmitter are respectively placed in the optical receiver mounting slots and optical transmitter mounting slots. The optical receiver and optical transmitter are connected to LC connectors and then optically connected to a multiplexer and a demultiplexer via optical fibers. The multiplexer and demultiplexer are connected to optical ports via optical fibers. The optical receiver and optical transmitter are also electrically connected to electrical chips on the PCB circuit board via a flexible circuit board. The PCB circuit board is connected to electrical ports and a power supply interface. The mounting base is connected to a heat sink. The optical receiver and optical transmitter can dissipate heat by conducting heat to the housing through the heat sink and / or the mounting base. The PCB circuit board has at least two mounting bases arranged in a front-to-back pattern. A second heat sink is installed on one of the mounting bases. The lower end of the second heat sink is provided with a heat dissipation groove adapted to the optical receiver and the optical transmitter. The upper surface of the second heat sink is provided with heat dissipation fins. The PCB circuit board at the lower end of the mounting base on which the second heat sink is installed has a clearance notch. A thermal pad is provided in the clearance notch. The thermal pad contacts the lower surface of the mounting base and the base respectively. The PCB circuit board has electrical chips on its front and back sides respectively. The flexible circuit board passes through the clearance notch and connects to the electrical chips on the back side of the PCB circuit board. The base has a clearance groove corresponding to the flexible circuit board. The base is provided with a base mounting groove. The multiplexer and the splitter are placed overlappingly in the base mounting groove. The multiplexer is located above the splitter, and the optical port is located at the upper end of the multiplexer.

2. The integrated wavelength division multiplexing (WDM) CPO device according to claim 1, characterized in that: One of the two mounting bases is provided with the optical receiver mounting slot, and the other mounting base is provided with the optical transmitter mounting slot.

3. The CPO device with integrated wavelength division multiplexing according to claim 1, characterized in that: The optical receiver mounting slot and the optical transmitter mounting slot are arranged at intervals on the mounting base.

4. A CPO device with integrated wavelength division multiplexing according to claim 2 or 3, characterized in that: An optical port adapter mounting slot is provided on the mounting base and located behind the optical receiver mounting slot and the optical transmitter mounting slot. The optical port adapter is fixed in the optical port adapter mounting slot, and the LC connector is engaged in the optical port adapter by a connector snap-fit.

5. A CPO device with integrated wavelength division multiplexing according to claim 2 or 3, characterized in that: One of the mounting bases is equipped with a first heat sink. The lower end of the first heat sink is provided with a heat dissipation groove adapted to the light receiver and the light transmitter. The upper surface of the first heat sink is close to the top cover. A thermal pad is provided between the upper surface of the first heat sink and the top cover. Heat dissipation fins are provided on the upper surface of the top cover.

6. The integrated wavelength division multiplexing (WDM) CPO device according to claim 5, characterized in that: The optical receiver mounting slot, the optical transmitter mounting slot, and the heat dissipation slots at the lower ends of the first and second heat sinks are provided with flange fixing slots corresponding to the flange portions of the optical receiver and the optical transmitter. The first and second heat sinks are respectively installed and limited by the flange fixing slots.

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