AC adapter assembly structure and assembly method thereof

Abstract

The present invention relates to an AC adapter assembly structure and an assembly method thereof. The AC adapter assembly structure comprises a first shell, an electronic component, a second shell and a filling body. The first shell has a containing space and an outer side wall. The electronic component is arranged in the containing space, and is assembled to convert alternating current into direct current and generate heat. The second shell has an inner side wall. The inner side wall is spatially relative to the outer side wall of the first shell, and the outer side wall and the inner side wall are assembled together to form a filling space, which is located between the first shell and the second shell. The filling space and the containing space do not intersect with each other. The filling body is arranged in the filling space, and connects the outer side wall of the first shell and the inner side wall of the second shell. The heat generated by the electronic component dissipates outward through the outer side wall of the first shell, the filling body and the inner side wall of the second shell.

Description

Technical Field

[0001] The invention relates to an AC adapter, and more particularly to an AC adapter assembly structure and an assembly method thereof, which are used to optimize the heat dissipation performance of the AC adapter. Background Art

[0002] An AC adapter is an electronic device used to convert AC power to DC power. Since the energy loss in the process of converting AC power to DC power is large, a large amount of heat is generated, causing the temperature of the AC adapter to rise. On the other hand, the power density of AC adapters required in the market is getting higher and higher, and with the demand for customization, in order to provide end users with a better user experience and extend the product life, it is even more necessary to reduce the temperature rise of the AC adapter as much as possible.

[0003] There are two main solutions for improving the temperature rise of the high power density AC adapter case in the current market. The first is to use a special-shaped heat sink to fill the gap. This method has an assembly gap between the heat sink and the case and internal components, resulting in increased thermal resistance, and the heat dissipation efficiency of the AC adapter components is not ideal. The second is to use a heat dissipation glue with good fluidity to completely or mostly fill the cavity of the AC adapter. However, the colloid material with good fluidity will flow to the inside due to gravity, and it is difficult to control the efficiency of the colloid filling. The stress generated when the colloid material solidifies will have an adverse effect on the internal electronic components. In addition, this method has a complex process and is difficult to control.

[0004] Therefore, how to develop an AC adapter assembly structure and an assembly method thereof to solve the problems faced by the prior art and achieve the purpose of optimizing the heat dissipation performance of the AC adapter is indeed a topic that needs to be addressed in this field. Summary of the invention

[0005] The purpose of the present invention is to provide an AC adapter assembly structure and an assembly method thereof. By providing a low-fluidity heat dissipation material as a filling body, it can be filled into a filling space of any shape, such as between an outer shell and an internal electronic component, by using pressure, so that the internal electronic component that generates heat is fully in contact with the outer shell, thereby improving the heat dissipation performance of the product. In addition, the heat dissipation material used as the filling body has low fluidity, which makes the manufacturing process easy to control. Since the filling space corresponding to the filling body and the accommodating space for accommodating the electronic component do not intersect with each other, the filling body will not be affected by gravity and flow to the accommodating space, so it will not affect the electrical performance of the electronic component. Furthermore, by using a heat dissipation material that can be cured under natural conditions as the filling body, there is no need to use a traditional baking process, which not only simplifies the manufacturing process, achieves the purpose of reducing manufacturing costs and significantly shortening the production cycle, but also eliminates the negative impact of high temperature on electronic components, thereby improving the reliability of the product.

[0006] To achieve the aforementioned purpose, the present invention provides an AC adapter assembly structure, comprising: a first shell, an electronic component, a second shell and a filling body. The first shell has a containing space and at least one outer wall. The electronic component is disposed in the containing space, and is assembled to convert an alternating current into a direct current and generate heat. The second shell has at least one inner wall. The inner wall is spatially relative to the outer wall of the first shell, and the outer wall of the first shell and the inner wall of the second shell are assembled together to form at least one filling space, which is located between the first shell and the second shell, wherein the filling space and the containing space do not intersect with each other. The filling body is disposed in the filling space, and connects the outer wall of the first shell and the inner wall of the second shell, wherein the heat generated by the electronic component is dissipated outward through the outer wall of the first shell, the filling body and the inner wall of the second shell.

[0007] In one embodiment, the outer side wall of the first shell is a plane, and the inner side wall of the second shell is a curved surface.

[0008] In one embodiment, the first housing further includes a first cover and a second cover, wherein the first cover and the second cover are assembled to form an accommodating space.

[0009] In one embodiment, the first shell has two outer side walls, which are respectively located at two opposite sides where the first cover body and the second cover body are assembled.

[0010] In one embodiment, the second shell has two inner walls, a first connecting plate body, and a second connecting plate body, the two inner walls are connected by the first connecting plate body and the second connecting plate body, wherein the two inner walls spatially correspond to the two outer walls of the first shell respectively, the first connecting plate body spatially corresponds to the first cover body, and the second connecting plate body spatially corresponds to the second cover body.

[0011] In one embodiment, the AC adapter assembly structure further includes two heat conducting sheets, which are respectively disposed between the first cover and the first connecting plate, and between the second cover and the second connecting plate.

[0012] In one embodiment, the filler is a low-fluidity colloid having a viscosity ranging from 100,000 centipoise·second (cps) to 160,000 centipoise·second (cps) at room temperature.

[0013] In one embodiment, the filling body is a silica gel.

[0014] In one embodiment, the filler has a dry-to-touch time of less than 10 minutes at room temperature.

[0015] In one embodiment, the filling body is a colloid that can be cured under natural conditions, and the curing is completed in seven days at room temperature and a relative humidity of 50%.

[0016] In one embodiment, the first shell is made of a metal material, and the second shell is made of a thermally conductive insulating material.

[0017] To achieve the aforementioned object, the present invention further provides an AC adapter assembly method, comprising the following steps: (a) providing a first shell and an electronic component, wherein the first shell has a containing space and at least one outer side wall, wherein the electronic component is disposed in the containing space, assembled to convert an alternating current into a direct current, and generate heat; (b) providing a second shell, which is sleeved outside the first shell, wherein the second shell has at least one inner side wall, the inner side wall is spatially relative to the outer side wall of the first shell, and the outer side wall of the first shell and the inner side wall of the second shell are assembled together to form at least one filling space, which is located between the first shell and the second shell, wherein the filling space and the containing space do not intersect with each other; (c) providing a filling body, which is filled into the filling space by pushing, and is connected to the outer side wall of the first shell and the inner side wall of the second shell, wherein the heat generated by the electronic component is dissipated outward through the outer side wall of the first shell, the filling body and the inner side wall of the second shell.

[0018] In one embodiment, the outer side wall of the first shell is a plane, and the inner side wall of the second shell is a curved surface.

[0019] In one embodiment, the first housing further includes a first cover and a second cover, wherein the first cover and the second cover are assembled to form an accommodating space.

[0020] In one embodiment, the first shell has two outer side walls, which are respectively located at two opposite sides where the first cover body and the second cover body are assembled.

[0021] In one embodiment, the second shell has two inner walls, a first connecting plate body, and a second connecting plate body, the two inner walls are connected by the first connecting plate body and the second connecting plate body, wherein the two inner walls spatially correspond to the two outer walls of the first shell respectively, the first connecting plate body spatially corresponds to the first cover body, and the second connecting plate body spatially corresponds to the second cover body.

[0022] In one embodiment, the AC adapter assembly structure further includes two heat conducting sheets, which are respectively disposed between the first cover and the first connecting plate, and between the second cover and the second connecting plate.

[0023] In one embodiment, the filler is a low-fluidity colloid having a viscosity ranging from 100,000 centipoise·second (cps) to 160,000 centipoise·second (cps) at room temperature.

[0024] In one embodiment, the filling body is a silica gel.

[0025] In one embodiment, the filler has a dry-to-touch time of less than 10 minutes at room temperature.

[0026] In one embodiment, the filling body is a colloid that can be cured under natural conditions, and the curing is completed in seven days at room temperature and a relative humidity of 50%.

[0027] In one embodiment, the first shell is made of a metal material, and the second shell is made of a thermally conductive insulating material.

[0028] In one embodiment, the thermal conductivity of the filler is greater than 0.4 W / m·K. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 The figure is a schematic structural diagram of an AC adapter assembly structure according to a first embodiment of the present invention.

[0030] Figure 2 The exploded view of the AC adapter assembly structure not including the second housing is disclosed in the first embodiment of the present invention.

[0031] Figure 3A A cross-sectional view of an AC adapter assembly structure according to a first embodiment of the present invention is disclosed.

[0032] Figure 3B For public Figure 3A Magnified view of region P in the middle.

[0033] Figure 4 The present invention discloses a flowchart of the steps of assembling the AC adapter according to the first embodiment of the present invention.

[0034] Figures 5 to 7 The figure is a schematic structural diagram of the first assembly stage of the AC adapter assembly structure according to the first embodiment of the present invention.

[0035] Figure 8 as well as Fig. 9 The figure is a schematic structural diagram of the second assembly stage of the AC adapter assembly structure according to the first embodiment of the present invention.

[0036] Fig.10 as well as Fig.11 The present invention discloses a structural schematic diagram of the third assembly stage of the AC adapter assembly structure of the first embodiment of the present invention.

[0037] Fig.12 as well as Fig.13 The figure is a schematic structural diagram of the fourth assembly stage of the AC adapter assembly structure according to the first embodiment of the present invention.

[0038] [List of Reference Numerals]

[0039] 1: AC adapter assembly structure

[0040] 10: First shell

[0041] 10a: Outer wall

[0042] 10b: Accommodation Space

[0043] 11: First cover

[0044] 11a: First engaging member

[0045] 12: Second cover

[0046] 12a: Second engaging member

[0047] 20: Second shell

[0048] 20a: Inner wall

[0049] 21: First connecting plate

[0050] 22: Second connecting plate

[0051] 30: Electronic components

[0052] 40: Filling space

[0053] 50: Filling

[0054] 60: Thermal conductive sheet

[0055] X, Y, Z: Axis DETAILED DESCRIPTION

[0056] Some typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different implementations without departing from the scope of the present invention, and the descriptions and drawings therein are essentially for illustrative purposes rather than for limiting the present invention.

[0057] Figure 1 The figure is a schematic structural diagram of an AC adapter assembly structure according to a first embodiment of the present invention. Figure 2 The exploded view of the AC adapter assembly structure not including the second housing is disclosed in the first embodiment of the present invention. Figure 3A A cross-sectional view of an AC adapter assembly structure according to a first embodiment of the present invention is disclosed. Figure 3B For public Figure 3A1 is an enlarged view of the area P in the middle. In this embodiment, the AC adapter assembly structure 1 includes a first shell 10, an electronic component 30, a second shell 20 and a filling body 50. The first shell 10 has a containing space 10b and at least one outer wall 10a. The electronic component 30 is disposed in the containing space 10b, and is assembled to convert an alternating current into a direct current, accompanied by the generation of heat. The second shell 20 has at least one inner wall 20a. The inner wall 20a is spatially relative to the outer wall 10a of the first shell 10, and the outer wall 10a of the first shell 10 and the inner wall 20a of the second shell 20 are assembled together to form at least one filling space 40, which is located between the first shell 10 and the second shell 20, wherein the filling space 40 and the containing space 10b are disjoint with each other. In the present embodiment, the filling body 50 is disposed in the filling space 40 and connects the outer side wall 10a of the first shell 10 and the inner side wall 20a of the second shell 20, so that the filling body 50 fully contacts the outer side wall 10a of the first shell 10 and the inner side wall 20a of the second shell 20, and there is no assembly gap that affects the heat dissipation efficiency. Since the filling space 40 and the accommodating space 10b do not intersect with each other, the filling body 50 will be excluded from being disposed in the accommodating space 10b. In other words, the filling body 50 will not be affected by gravity and flow to the accommodating space 10b where the electronic component 30 is located, nor will it directly contact the electronic component 30 and affect its electrical performance. In the present embodiment, the heat generated by the electronic component 30 can be dissipated outward, for example, along a Y-axis direction through the outer side wall 10a of the first shell 10, the filling body 50 and the inner side wall 20b of the second shell 20.

[0058] In the present embodiment, the outer side wall 10a of the first shell 10 is, for example but not limited to, a plane, and the inner side wall 20a of the second shell 20 is, for example but not limited to, a curved surface. In the present embodiment, the first shell 10 further includes a first cover 11 and a second cover 12, wherein the first cover 11 and the second cover 12 are assembled with each other to form a receiving space 10b. The first cover 11 has, for example, at least two first engaging members 11a, which are respectively disposed on two opposite sides of the first cover 11. The second cover 12 has, for example, at least two second engaging members 12a, which are respectively disposed on two opposite sides of the second cover 12. In the present embodiment, a plurality of first engaging members 11a and a plurality of second engaging members 12a are spatially opposite to each other and correspondingly engaged, so as to connect the first cover 11 and the second cover 12 to form the first shell 10. In this embodiment, a plurality of corresponding groups of first fasteners 11a and second fasteners 12a are further arranged in different directions, such as along the X-axis direction and the Z-axis direction, to enhance the stability of the fastening between the first cover body 11 and the second cover body 12. However, this is not a necessary feature to limit the technology of the present invention. Any number and different types of locking components, such as screws or rivets, may be applicable to the present invention and will not be described in detail herein.

[0059] In this embodiment, the first housing 10 has, for example, two outer side walls 10a, respectively located at two opposite sides where the first cover 11 and the second cover 12 are assembled. The second housing 20 has, for example, two inner side walls 20a, a first connecting plate 21 and a second connecting plate 22. The two inner side walls 20a are connected by the first connecting plate 21 and the second connecting plate 22, wherein the two inner side walls 20a spatially correspond to the two outer side walls 10a of the first housing 10, respectively. The first connecting plate 21 spatially corresponds to the first cover 11, and the second connecting plate 22 spatially corresponds to the second cover 12. In this embodiment, the two outer side walls 10a of the first housing 10 and the two inner side walls 20a of the second housing 20 are further assembled to form two filling spaces 40, which are located between the first housing 10 and the second housing 20. The two filling spaces 40 are respectively arranged at two opposite sides of the accommodating space 10b, and the two filling spaces 40 are disjoint with the accommodating space 10b. In the present embodiment, the heat generated by the electronic component 30 disposed in the accommodating space 10b can be dissipated outwardly, for example, from two opposite sides of the accommodating space 10b, respectively through the two outer side walls 10a of the first shell 10, the two filling bodies 50, and the two inner side walls 20b of the second shell 20. In one embodiment, one of the two filling spaces 40 can be omitted. In other embodiments, the first shell 10 and the second shell 20 are further assembled to form a plurality of filling spaces 40, which are located between the first shell 10 and the second shell 20. The plurality of filling spaces 40 are all filled with the filling bodies 50, and are not intersected (disjoint) with the accommodating space 10b. Therefore, the heat generated by the electronic component 30 in the accommodating space 10b can be dissipated outwardly, for example, through the first shell 10, the filling body 50, and the second shell 20 in different directions. Of course, the present invention is not limited thereto.

[0060] In this embodiment, the AC adapter assembly structure 1 further includes, for example, two heat conducting sheets 60, which are respectively disposed between the first cover 11 and the first connecting plate 21, and between the second cover 12 and the second connecting plate 22, so as to facilitate the heat generated by the electronic component 30 to be conducted from the inside to the outside along, for example, a Z-axis direction, thereby improving the heat dissipation performance of the AC adapter assembly structure 1. In other examples, the two heat conducting sheets 60 can be omitted. Of course, the present invention is not limited thereto.

[0061] In the present embodiment, the filler 50 may be, for example, a low-fluidity colloid, the viscosity of which at room temperature ranges from 100,000 centipoise seconds (cps) to 160,000 centipoise seconds (cps). The low fluidity characteristic makes the filler 50 easy to control during the manufacturing process, and is not easily affected by gravity and flows into the interior of the electronic component 30, thereby affecting the electrical performance of the electronic component 30. It should be noted that the filler 50 can still completely fill the interior of the filling space 40 at this time, and excludes the space 10b. Therefore, the filler 50 can fully contact the outer wall 10a of the first shell 10 and the inner wall 20a of the second shell 20, thereby facilitating the heat generated by the electronic component 30 to be conducted from the inside to the outside, thereby improving the heat dissipation performance of the AC adapter assembly structure 1. In other embodiments, the filler 50 may be a silica gel. In the present embodiment, the touch drying time of the filler 50 at room temperature is less than 10 minutes, so that the surface of the filler 50 dries quickly after the filling is completed, avoiding the adhesion of dust or foreign matter and affecting the heat dissipation performance of the AC adapter assembly structure 1. In the present embodiment, the filler is, for example, a colloid that can be cured under natural conditions, and it takes seven days to cure at room temperature and a relative humidity of 50%. Therefore, the AC adapter assembly structure 1 of the present invention does not need to adopt a traditional baking process for curing, which can reduce production costs and avoid affecting the electrical performance of the internal electronic components 30 due to the high temperature during the baking process, thereby achieving the purpose of improving the reliability of the AC adapter assembly structure 1. In other embodiments, the thermal conductivity of the filler 50 can be, for example, greater than 0.4W / m·K, and has good thermal conductivity.

[0062] In this embodiment, the first housing 10 may be made of a metal material, for example, and the second housing 20 may be made of a heat-conducting insulating material, for example. The metal material of the first housing 10 has a high thermal conductivity, which helps the heat generated by the electronic component 30 to be efficiently conducted from the inside to the outside through the first housing 10. In addition, the heat-conducting insulating material of the second housing 20 can further provide an insulating effect while maintaining heat dissipation performance, preventing the internal current from being conducted to the outer shell and causing accidents such as electric shock.

[0063] According to the aforementioned AC adapter assembly structure 1, the present invention further provides an assembly method of an AC adapter. Figure 4 The present invention discloses a flowchart of the steps of assembling the AC adapter according to the first embodiment of the present invention. Figures 5 to 7 The figure is a schematic structural diagram of the first assembly stage of the AC adapter assembly structure according to the first embodiment of the present invention. Figure 8 as well as Fig. 9 The figure is a schematic structural diagram of the second assembly stage of the AC adapter assembly structure according to the first embodiment of the present invention. Fig.10 as well as Fig.11The present invention discloses a structural schematic diagram of the third assembly stage of the AC adapter assembly structure of the first embodiment of the present invention. Fig.12 as well as Fig.13 This is a schematic structural diagram of the fourth assembly stage of the AC adapter assembly structure of the first embodiment of the present invention. Figures 4 to 13 First, in this embodiment, Figure 4 Step S1 and Figures 5 to 7 As shown, the present invention provides a first shell 10 and an electronic component 30, wherein the first shell 10 has a containing space 10b and, for example, two outer side walls 10a. The electronic component 30 is disposed in the containing space 10b, and is assembled to convert an alternating current into a direct current and generate heat. In this embodiment, the first shell 10 also includes a first cover 11 and a second cover 12, and the first cover 11 and the second cover 12 are assembled with each other along, for example, a Z-axis direction to form the containing space 10b. The first cover 11 has, for example, two first engaging members 11a, which are respectively disposed on two opposite sides of the first cover 11; the second cover 12 has, for example, two second engaging members 12a, which are respectively disposed on two opposite sides of the second cover 12. The first engaging member 11a and the second engaging member 12a are opposite to each other in space and correspondingly engaged, connecting the first cover 11 and the second cover 12 to form the first shell 10. In this embodiment, a plurality of corresponding first buckle members 11a and second buckle members 12a are arranged in different directions such as the X-axis direction and the Z-axis direction to enhance the buckling stability between the first cover 11 and the second cover 12. The first housing 10 has two outer side walls 10a, respectively located at two opposite sides where the first cover 11 and the second cover 12 are assembled.

[0064] In this embodiment, if Figure 8 as well as Fig. 9 As shown, the present invention further provides, for example, two heat conducting sheets 60, which are respectively attached to the first cover 11 and the second cover 12 along, for example, a Z-axis direction, so as to facilitate the heat generated by the electronic component 30 to be conducted from the inside to the outside along, for example, a Z-axis direction, thereby improving the heat dissipation performance of the AC adapter assembly structure 1. In other examples, the two heat conducting sheets 60 can be omitted. Of course, the present invention is not limited to this.

[0065] Then, if Figure 4 Step S2: Fig.10 as well as Fig.11As shown, the present invention provides a second shell 20, which is sleeved outside the first shell 10, wherein the second shell 20 has, for example, two inner side walls 20a, a first connecting plate body 21, and a second connecting plate body 22. The inner side wall 20a is spatially opposite to the outer side wall 10a of the first shell 10, and the outer side wall 10a of the first shell 10 and the inner side wall 20a of the second shell 20 are assembled together to form at least one filling space 40, which is located between the first shell 10 and the second shell 20. The inner side wall 20a of the second shell 20 and the outer side wall 10a of the first shell 10 are assembled together to form, for example, two filling spaces 40. The first connecting plate 21 and the second connecting plate 22 are respectively connected to the first cover 11 and the second cover 12 through the heat conducting sheet 60, so that the heat generated by the electronic component 30 can be conducted outwardly through the first cover 11, the heat conducting sheet 60, the first connecting plate 21, and the second cover 12, the heat conducting sheet 60, and the second connecting plate 22 along, for example, a Z-axis direction, thereby improving the heat dissipation performance of the AC adapter assembly structure 1.

[0066] Finally, if Figure 4 Step S3: Fig.12 as well as Fig.13 As shown, a low-fluidity filler 50 is provided, for example, and is filled into the filling space 40 by pushing, so that it fully contacts and connects the outer wall 10a of the first shell 10 and the inner wall 20a of the second shell 20. The assembled AC adapter assembly structure 1 is as shown in FIG. Fig.13 As shown. In the present embodiment, two filling spaces 40 are assembled between the first shell 10 and the second shell 20, and are adjacent to two opposite sides of the accommodating space 10b. The two filling spaces 40 are respectively filled with a filling body 50, and both are disjoint with the accommodating space 10b. Therefore, the heat generated by the electronic component 30 in the accommodating space 10b can be dissipated outwardly, for example, along a Y-axis direction through the outer wall 10a of the first shell 10, the filling body 50, and the inner wall 20a of the second shell 20. In the present embodiment, the first shell 10 is made of, for example, a metal material, and the second shell 20 is made of, for example, a thermally conductive insulating material, but this is not a necessary feature to limit the technology of the present invention and will not be repeated here. In other embodiments, the thermal conductivity of the filling body 50 may be, for example, greater than 0.4W / m·K.

[0067] It is worth noting that the filler 50 filled into the filling space 40 is, for example, a low-fluidity colloid, and the viscosity range at room temperature is between 100,000 centipoise seconds (cps) and 160,000 centipoise seconds (cps). The low fluidity makes the filler 50 easy to control during the manufacturing process, and is not easily affected by gravity and flows into the interior of the electronic component 30, thereby affecting the electrical performance of the electronic component 30. On the other hand, the filler 50, for example, completely fills the filling space 40 and excludes the space 10b. Therefore, the filler 50 can fully contact the outer wall 10a of the first shell 10 and the inner wall 20a of the second shell 20, thereby facilitating the heat generated by the electronic component 30 from the inside to the outside, thereby improving the heat dissipation performance of the AC adapter assembly structure 1. In addition, the filler 50 is, for example, a silica gel, and the finger-touch drying time at room temperature is less than 10 minutes. After step S3, the surface of the filler 50 can be dried quickly to prevent dust or foreign matter from sticking and affecting the heat dissipation performance of the AC adapter assembly structure 1. Furthermore, in this embodiment, the filler is, for example, a silicone that can be cured under natural conditions, and the curing is completed in seven days under room temperature and 50% relative humidity. Therefore, the AC adapter assembly structure 1 of the present invention does not need to use a traditional baking process for curing, which can reduce production costs and avoid affecting the electrical performance of the internal electronic components 30 due to the high temperature during the baking process, thereby achieving the purpose of improving the reliability of the AC adapter assembly structure 1.

[0068] In summary, the present invention provides an AC adapter assembly structure and an assembly method thereof. By providing a low-fluidity heat dissipation material as a filling body, it can be filled into a filling space of any shape, such as between an outer shell and an internal electronic component, by using pressure, so that the internal electronic component that generates heat is in full contact with the outer shell, thereby improving the heat dissipation performance of the product. In addition, the heat dissipation material used as the filling body has low fluidity, which makes the manufacturing process easy to control. Since the filling space of the filling body and the accommodating space for accommodating the electronic component do not intersect with each other, and the filling body will not be affected by gravity and flow to the accommodating space, it will not affect the electrical performance of the electronic component. Furthermore, by using a heat dissipation material that can be cured under natural conditions as the filling body, there is no need to use a traditional baking process, which not only simplifies the manufacturing process, achieves the purpose of reducing manufacturing costs and significantly shortening the production cycle, but also eliminates the negative impact of high temperature on electronic components, thereby improving product reliability.

[0069] Various modifications and variations may be made to the present disclosure by those skilled in the art without departing from the scope of the appended claims.

Claims

1. An AC adapter assembly structure, comprising: A first shell having a containing space and at least one outer side wall; An electronic component is disposed in the accommodation space and is configured to convert an alternating current into a direct current and generate heat; A second shell having at least one inner side wall, the at least one inner side wall is spatially opposite to the at least one outer side wall of the first shell, and the at least one outer side wall of the first shell and the at least one inner side wall of the second shell are assembled together to form at least one filling space, which is located between the first shell and the second shell, wherein the filling space and the accommodating space do not intersect with each other, wherein the first shell further includes a first cover body and a second cover body, wherein the first cover body and the second cover body are assembled with each other to form the accommodating space, wherein the first shell has two outer side walls, The first cover body and the second cover body are respectively located at two opposite sides where the first cover body and the second cover body are assembled, wherein the second shell body has two inner side walls, a first connecting plate body, and a second connecting plate body, and the two inner side walls are connected by the first connecting plate body and the second connecting plate body, wherein the two outer side walls of the first shell body are in a plane, and the two inner side walls of the second shell body are in a curved surface, wherein the two inner side walls respectively correspond to the two outer side walls of the first shell body in space, the first connecting plate body corresponds to the first cover body in space, and the second connecting plate body corresponds to the second cover body in space; and A filling body is disposed in the at least one filling space and connects the at least one outer wall of the first shell and the at least one inner wall of the second shell, wherein the heat generated by the electronic component is dissipated outward through the at least one outer wall of the first shell, the filling body and the at least one inner wall of the second shell, wherein the filling body is a colloid that can be cured under natural conditions.

2. The AC adapter assembly structure as claimed in claim 1, further comprising two heat conducting sheets, respectively disposed between the first cover and the first connecting plate, and between the second cover and the second connecting plate.

3. The AC adapter assembly structure as claimed in claim 1, wherein the filler is a low-fluidity colloid having a viscosity ranging from 100,000 centipoise·second (cps) to 160,000 centipoise·second (cps) at room temperature. 4 . The AC adapter assembly structure as claimed in claim 1 , wherein the filling body is a silica gel. 5 . The AC adapter assembly structure as claimed in claim 1 , wherein the filler has a dry-to-touch time of less than 10 minutes at room temperature.

6. The AC adapter assembly structure as claimed in claim 1, wherein the filling body is cured within seven days at room temperature and a relative humidity of 50%.

7. The AC adapter assembly structure as claimed in claim 1, wherein the first shell is made of a metal material, and wherein the second shell is made of a thermally conductive insulating material.

8. A method for assembling an AC adapter, comprising the steps of: (a) providing a first housing and an electronic component, wherein the first housing has a containing space and at least one outer side wall, wherein the electronic component is disposed in the containing space, and is configured to convert an alternating current into a direct current and generate heat; (b) providing a second shell, which is sleeved on the outside of the first shell, wherein the second shell has at least one inner side wall, the at least one inner side wall is spatially relative to the at least one outer side wall of the first shell, and the at least one outer side wall of the first shell and the at least one inner side wall of the second shell are assembled together to form at least one filling space, which is located between the first shell and the second shell, wherein the filling space and the accommodating space do not intersect with each other, wherein the first shell also includes a first cover body and a second cover body, wherein the first cover body and the second cover body are assembled together to form the accommodating space, wherein the first A shell has two outer side walls, respectively located at two opposite sides where the first cover and the second cover are assembled, wherein the second shell has two inner side walls, a first connecting plate, and a second connecting plate, the two inner side walls are connected by the first connecting plate and the second connecting plate, wherein the two outer side walls of the first shell are planes, and the two inner side walls of the second shell are curved, wherein the two inner side walls spatially correspond to the two outer side walls of the first shell, respectively, the first connecting plate spatially corresponds to the first cover, and the second connecting plate spatially corresponds to the second cover; and (c) providing a filling body, which is filled into the at least one filling space by pushing, and connects the at least one outer wall of the first shell and the at least one inner wall of the second shell, wherein the heat generated by the electronic component is dissipated outward through the at least one outer wall of the first shell, the filling body and the at least one inner wall of the second shell, wherein the filling body is a colloid that can be cured under natural conditions. 9 . The AC adapter assembly method according to claim 8 , further comprising two heat conducting sheets, respectively disposed between the first cover and the first connecting plate, and between the second cover and the second connecting plate.

10. The AC adapter assembly method as claimed in claim 8, wherein the filler is a low-fluidity colloid having a viscosity ranging from 100,000 centipoise·second (cps) to 160,000 centipoise·second (cps) at room temperature.

11. The AC adapter assembly method as claimed in claim 8, wherein the filling body is a silica gel. 12 . The AC adapter assembly method as claimed in claim 8 , wherein the filler has a dry-to-touch time of less than 10 minutes at room temperature.

13. The AC adapter assembly method as claimed in claim 8, wherein the filling body is cured within seven days at room temperature and a relative humidity of 50%.

14. The AC adapter assembly method as claimed in claim 8, wherein the first shell is made of a metal material, and wherein the second shell is made of a thermally conductive insulating material. 15 . The AC adapter assembly method as claimed in claim 8 , wherein the thermal conductivity of the filler is greater than 0.4 W / m·K.

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