A device suitable for continuous gold plating of connector terminals

Abstract

The utility model provides an apparatus suitable for the continuous gold plating of connector terminals, and belongs to the technical field of the continuous electroplating of connectors. Technical scheme: including base, is equipped with gold plating device main body, back cover, front baffle, limiting mechanism above it, gold plating device main body one side is connected with back cover, the other side is detachable, movable connection with front baffle, be equipped with titanium anode net between gold plating device main body and back cover, be equipped with gold plating liquid inlet on back cover, gold plating device main body and front baffle all are equipped with a plurality of gold plating liquid outlet. Advantageous effects: the utility model can effectively improve the gold plating film thickness distribution and gold plating range, the operator can realize product switching through simple adjustment according to the solidified process condition, greatly reduces the switching time, also reduces the unit consumption of gold of immersion gold plating product, simultaneously improves the adjustment difficulty when product switching and the product waste caused thereby, finally realizes the reduction of cost, the improvement of production efficiency, the promotion of product yield.

Description

Technical Field

[0001] This invention belongs to the field of continuous electroplating technology for connectors, and particularly relates to an apparatus suitable for continuous gold plating of connector terminals. Background Technology

[0002] In the gold plating process of connector terminals, different products will choose different gold plating methods to achieve high production efficiency and low manufacturing costs. Generally, for thin products that can recover after bending and deformation, roller plating is used, while for thick products that are not easy to recover after bending and deformation, immersion plating is usually used. Immersion plating involves immersing the entire area to be plated in the gold plating solution. Its advantages are simple process and uniform plating thickness. The disadvantages are that it will also plate areas that do not need to be plated, and the actual gold consumption is more than 4 times the theoretical consumption, meaning that about 80% of the gold is wasted. In addition, this plating method requires operators to readjust when changing products, which also leads to waste of product time and money, and requires a high level of operator skill. Summary of the Invention

[0003] To address the problems existing in the prior art, the present invention provides an apparatus suitable for continuous gold plating of connector terminals. This apparatus can effectively improve the gold plating film thickness distribution and plating range, thereby reducing the unit gold consumption of immersion gold-plated products. At the same time, it improves the difficulty of adjustment during product switching and the resulting product waste, ultimately achieving cost reduction, increased production efficiency, and improved product yield.

[0004] The technical solution is as follows:

[0005] An apparatus for continuous gold plating of connector terminals, comprising:

[0006] The base has a gold-plated main body, a back cover, a front baffle, and a limiting mechanism on top of it.

[0007] The main body of the gold plating device is detachably and movablely connected to the rear cover on one side and to the front baffle on the other side.

[0008] A titanium anode mesh is provided between the main body and the rear cover of the gold plating device;

[0009] The rear cover is provided with a gold plating solution inlet, and the main body of the gold plating device and the front baffle are provided with several gold plating solution outlets.

[0010] Furthermore, the gold plating device body and the rear cover are connected to form a cavity, and the titanium anode mesh is built into the cavity.

[0011] Furthermore, it also includes a leak-proof soft rubber strip, which is provided at the connection between the gold-plating device body and the back cover.

[0012] Furthermore, the front baffle is connected to the main body of the gold plating device via a front baffle height adjustment screw, and both the main body of the gold plating device and the front baffle are provided with several gold plating solution outlets of corresponding positions and sizes to adjust the amount of liquid discharged.

[0013] Furthermore, it also includes a gold plating solution inlet pipe and an anode wire, wherein the gold plating solution inlet pipe is connected to the gold plating solution inlet, and the anode wire is connected to the titanium anode mesh.

[0014] Furthermore, the main body of the gold plating device is movably connected to the base via a gold plating device height adjustment screw.

[0015] Furthermore, the limiting mechanism includes:

[0016] The outer stop bar base is detachably and movably connected to the base, with a stop bar A horizontally and a stop bar B vertically arranged above it.

[0017] Furthermore, it also includes a spring-loaded sliding rod disposed on the main body of the gold plating device; and a stop bar C for limiting the main body of the gold plating device, which is located on the base.

[0018] Furthermore, it also includes a base leveling screw for adjusting the overall height of the device, the base leveling screw being connected to the base.

[0019] Furthermore, the stop lever A and / or stop lever B are zirconium oxide stop levers or silicon carbide stop levers.

[0020] The beneficial effects of this invention are:

[0021] The device for continuous gold plating of connector terminals described in this invention can effectively improve the gold plating film thickness distribution and plating range. Operators can easily switch products by making simple adjustments according to the fixed process conditions, which greatly reduces the switching time and the unit consumption of gold in immersion gold-plated products. At the same time, it improves the difficulty of adjustment during product switching and reduces the product waste caused by it, ultimately achieving cost reduction, increased production efficiency, and improved product yield. Attached Figure Description

[0022] Figure 1 This is an exploded structural diagram of the present invention;

[0023] Figure 2 This is a schematic diagram of the overall structure of the present invention;

[0024] The following labels are used in the attached diagram: 1-Gold plating device body, 2-Rear cover, 3-Front baffle, 4-Base, 5-Titanium anode mesh, 6-Gold plating solution inlet pipe, 7-Bar A, 8-Outer bar base, 9-Leak-proof soft rubber strip, 10-Anode wire, 11-Spring-loaded sliding rod, 12-Gold plating device height adjustment screw, 13-Front baffle height adjustment screw, 14-Base level adjustment screw, 15-Bar B, 16-Bar C, 17-Oval hole, 18-Fixing screw. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. The following description, in conjunction with the accompanying drawings... Figure 1-2 Further explanation is provided regarding the apparatus suitable for continuous gold plating of connector terminals.

[0026] Example 1

[0027] An apparatus for continuous gold plating of connector terminals, comprising:

[0028] The base 4 has a gold plating device body 1, a rear cover 2, a front baffle 3, and a limiting mechanism on its top. The gold plating device body 1 is connected to the rear cover 2 on one side and to the front baffle 3 on the other side in a detachable and movable manner. A titanium anode mesh 5 is provided between the gold plating device body 1 and the rear cover 2. The rear cover 2 is provided with a gold plating liquid inlet, and the gold plating device body 1 and the front baffle 3 are each provided with several gold plating liquid outlets.

[0029] The gold plating device body 1 and the rear cover 2 form a cavity after connection, and the titanium anode mesh 5 is built into the cavity. It also includes a leak-proof soft rubber strip 9, which is installed at the connection between the gold plating device body 1 and the rear cover 2. The front baffle 3 is connected to the gold plating device body 1 via a front baffle height adjustment screw 13, and both the gold plating device body 1 and the front baffle 3 have several gold plating solution outlets of corresponding positions and sizes to adjust the liquid output. It also includes a gold plating solution inlet pipe 6 and an anode wire 10. The gold plating solution inlet pipe 6 is connected to the gold plating solution inlet, and the anode wire 10 is connected to the titanium anode mesh 5. The gold plating device body 1 is movably connected to the base 4 via a gold plating device height adjustment screw 12. It also includes a spring-loaded sliding rod 11, which is mounted on the gold plating device body 1; and a stop bar C16 for limiting the movement of the gold plating device body 1, which is located on the base 4.

[0030] The main body of this device is made of acrylic material and consists of two parts: a front baffle 3, a base 4, and a built-in titanium anodizing mesh 5. All components are fixed together with hexagonal screws. The relative height of the main body can be adjusted by adjusting the height adjustment screw 12 on the gold plating device. The fixing screw 18 is connected to the gold plating device body 1 through the oval hole 17, so the size of the spray nozzle can also be changed by adjusting the fixing screw 18 on the front baffle 3.

[0031] When using this device, first install it on the gold plating tank of the production line, then connect the gold plating solution inflow pipeline, and then connect the wire to the positive terminal of the rectifier. Depending on the product being produced, adjust the front baffle height by adjusting screw 13 to change the front baffle height and adjust the spray nozzle size accordingly. Then turn on the circulation pump, observe the spraying status of the device, and adjust the frequency converter to optimize the spraying status. Next, adjust the gold plating device height adjustment screw 12 to change the main body height, ensuring that the sprayed solution directly hits the film thickness measurement point on the product. Finally, turn on the rectifier and adjust it to a suitable current.

[0032] Example 2

[0033] An apparatus for continuous gold plating of connector terminals, comprising:

[0034] The base 4 has a gold-plated device body 1, a rear cover 2, a front baffle 3, and a limiting mechanism on top of it;

[0035] The gold plating device body 1 is connected to the rear cover 2 on one side and to the front baffle 3 on the other side in a detachable and movable manner.

[0036] A titanium anode mesh 5 is provided between the main body 1 and the rear cover 2 of the gold plating device;

[0037] The rear cover 2 is provided with a gold plating solution inlet, and the main body 1 and the front baffle 3 of the gold plating device are each provided with a number of gold plating solution outlets.

[0038] The gold plating device body 1 and the rear cover 2 form a cavity after connection, and the titanium anode mesh 5 is built into the cavity. It also includes a leak-proof soft rubber strip 9, which is installed at the connection between the gold plating device body 1 and the rear cover 2. The front baffle 3 is connected to the gold plating device body 1 via a front baffle height adjustment screw 13, and both the gold plating device body 1 and the front baffle 3 have several gold plating solution outlets of corresponding positions and sizes to adjust the liquid output. It also includes a gold plating solution inlet pipe 6 and an anode wire 10. The gold plating solution inlet pipe 6 is connected to the gold plating solution inlet, and the anode wire 10 is connected to the titanium anode mesh 5. The gold plating device body 1 is movably connected to the base 4 via a gold plating device height adjustment screw 12.

[0039] Preferably, the limiting mechanism includes:

[0040] The outer stop bar base 8 is detachably and movably connected to the base 4, and a stop bar A7 is provided horizontally above it and a stop bar B15 is provided vertically. The stop bar A7 and / or the stop bar B15 are zirconium oxide stop bars or silicon carbide stop bars.

[0041] Furthermore, it also includes a spring-loaded sliding rod 11, which is disposed on the gold plating device body 1; and a stop bar C16 for limiting the gold plating device body 1, which is located on the base 4.

[0042] Furthermore, it also includes a base leveling screw 14 for adjusting the height of the overall device, the base leveling screw 14 being connected to the base 4.

[0043] The main body of this device is made of acrylic material and consists of two parts: a front baffle 3, a base 4, and a built-in titanium anodizing mesh 5. All components are fixed together with hexagonal screws. The overall height and level of the device can be adjusted by adjusting the base leveling screw 14 on the base 4. The relative height of the main body can be adjusted by adjusting the gold plating device height adjusting screw 12 on the main body. The fixing screw 18 connects to the gold plating device body 1 through the oval hole 17. Therefore, the size of the spray nozzle can also be changed by adjusting the fixing screw 18 on the front baffle 3.

[0044] When using this device, first install it on the gold plating tank of the production line, then connect the gold plating solution inflow pipeline, and then connect the wire to the positive terminal of the rectifier. Depending on the product being produced, adjust the front baffle height by adjusting screw 13 to change the front baffle height and adjust the spray nozzle size accordingly. Then turn on the circulation pump, observe the spraying status of the device, and adjust the frequency converter to optimize the spraying status. Next, adjust the gold plating device height adjustment screw 12 to change the main body height, ensuring that the sprayed solution directly hits the film thickness measurement point on the product. Finally, turn on the rectifier and adjust it to a suitable current.

[0045] The gold-plated products produced by this device show film thickness within the specified range at the thickness measurement point, while the film thickness in other spreading areas is very thin, resulting in a reduction of approximately 70% in unit gold consumption. Operators can easily switch products by making simple adjustments based on the curing process conditions, reducing switchover time by approximately 80% and product waste due to adjustments by approximately 90%.

[0046] The initial adjustment steps for the device are as follows:

[0047] 1. According to Figure 1 Assemble the gold plating device;

[0048] 2. Connect the gold plating solution inlet pipe 6 and the anode wire 10;

[0049] 3. Twist the base leveling screw 14 to adjust the entire device to a level position. A miniature level can be placed on the device.

[0050] 4. Adjust the front baffle height adjustment screw 13 according to the product. When the baffle is at the lowest end, the spray hole is the smallest with a diameter of only 1.5mm. When adjusted to the highest end, the spray hole diameter is the largest of 7.0mm.

[0051] 5. Adjust the outer stop lever base 8 to ensure that the product and each stop lever are in contact;

[0052] 6. Adjust the height adjustment screw 12 of the gold plating device according to the position of the conductive part of the product to ensure that the center of the nozzle is directly aligned with the measuring point of the conductive part.

[0053] The product switching steps are as follows:

[0054] 1. Adjust the height of the front baffle 3 by adjusting the front baffle height adjustment screw 13 according to the process conditions;

[0055] 2. Adjust the outer stop lever base 8 to ensure that the product and each stop lever are in contact;

[0056] 3. Adjust the height adjustment screw 12 of the gold plating device according to the process conditions, thereby adjusting the height of the main body 1 of the gold plating device.

[0057] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An apparatus for continuous gold plating of connector terminals, characterized in that, include: The base (4) has a gold-plated device body (1), a back cover (2), a front baffle (3), and a limiting mechanism on its top. The main body (1) of the gold plating device is connected to the rear cover (2) on one side and to the front baffle (3) on the other side in a detachable and movable manner. A titanium anode mesh (5) is provided between the main body (1) and the back cover (2) of the gold plating device. The rear cover (2) is provided with a gold plating solution inlet, and the main body (1) and the front baffle (3) of the gold plating device are provided with several gold plating solution outlets; The gold plating device body (1) is connected to the back cover (2) to form a cavity, and the titanium anode mesh (5) is built into the cavity; It also includes a leak-proof soft rubber strip (9), which is provided at the connection between the gold-plating device body (1) and the rear cover (2). The front baffle (3) is connected to the gold plating device body (1) by the front baffle height adjustment screw (13), and the gold plating device body (1) and the front baffle (3) are provided with several gold plating liquid outlets of corresponding positions and sizes to adjust the liquid output.

2. The apparatus for continuous gold plating of connector terminals as described in claim 1, characterized in that, It also includes a gold plating solution inlet pipe (6) and an anode wire (10), wherein the gold plating solution inlet pipe (6) is connected to the gold plating solution inlet, and the anode wire (10) is connected to the titanium anode mesh (5).

3. The apparatus for continuous gold plating of connector terminals as described in claim 1, characterized in that, The main body (1) of the gold plating device is movably connected to the base (4) via the gold plating device height adjustment screw (12).

4. The apparatus for continuous gold plating of connector terminals as described in claim 1, characterized in that, The limiting mechanism includes: The outer stop bar base (8) is detachably and movably connected to the base (4), with a stop bar A (7) arranged horizontally above it and a stop bar B (15) arranged vertically.

5. The apparatus for continuous gold plating of connector terminals as described in claim 1, characterized in that, It also includes a spring-loaded sliding rod (11) disposed on the gold plating device body (1); and a stop bar C (16) for limiting the gold plating device body (1) disposed on the base (4).

6. The apparatus for continuous gold plating of connector terminals as described in claim 1, characterized in that, It also includes a base leveling screw (14) for adjusting the height of the overall device, the base leveling screw (14) being connected to the base (4).

7. The apparatus for continuous gold plating of connector terminals as described in claim 4, characterized in that, The stop lever A (7) and / or stop lever B (15) are zirconia stop levers or silicon carbide stop levers.

Images