Developing device for manufacturing semiconductor lead frame etching product

A lead frame and product manufacturing technology, which is applied in the processing of photosensitive materials, etc., can solve the problems that the subsequent process cannot be carried out normally, and the small film particles remain, and achieve the effect of improving movement stability and good jet cleaning.

CN114721234APending Publication Date: 2022-07-08KUNSHAN YIDING IND TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2022-07-08

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Abstract

The invention belongs to the technical field of semiconductor integrated circuit lead frame etching manufacturing, and particularly relates to a developing device for manufacturing a semiconductor lead frame etching product, which comprises an upper developing tank and a lower developing tank, a plurality of upper nozzles are arranged at the lower part of the upper developing tank, a plurality of lower nozzles are arranged at the upper part of the lower developing tank, the upper nozzles and the lower nozzles are opposite in a staggered manner, the plurality of upper nozzles are distributed in an array manner, the upper nozzles in one column are distributed in a W manner, the plurality of lower nozzles are distributed in an array manner, and the lower nozzles in one column are distributed in a W manner; the upper developing tank and the lower developing tank are provided with an up-and-down moving mechanism; the up-and-down moving mechanism comprises a vertical sliding rod, and an upper connecting block and a lower connecting block which are arranged on the vertical sliding rod. The developing device for manufacturing the semiconductor lead frame etching product has the effects that tiny particle residues on the surface of the product can be removed from multiple angles, subsequent processing is facilitated, and the product quality is improved.
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Description

technical field

[0001] The invention belongs to the technical field of etching and manufacturing of semiconductor integrated circuit lead frames, and in particular relates to a developing device for manufacturing etching products of semiconductor lead frames. Background technique

[0002] In the field of semiconductor lead frame manufacturing technology, using etching technology to manufacture and process metal materials into precision semiconductor electronic products required in various high-tech fields has become a very important issue. For example, the important technical core of semiconductor integrated circuits, chip manufacturing technology is an important foundation and core component of the development of advanced science and technology; semiconductor lead frames, as chip carriers of integrated circuits, are important basic raw materials in the electronic information industry; therefore, semiconductor lead frames Frame manufacturing technology is an important basic ...

Examples

Embodiment

[0039] like figure 1 As shown, the developing device manufactured by the etched product of the semiconductor lead frame includes: an upper developing tank 1 and a lower developing tank 2 arranged oppositely; The lower nozzles 21, the upper nozzles 11 and the lower nozzles 21 are staggered relative to each other, a plurality of upper nozzles 11 are arranged in an array, the upper nozzles 11 on a row are distributed in a W, a number of lower nozzles 21 are distributed in an array, and the lower nozzles 21 on a row are distributed in a W. With the W-distributed upper nozzles 11 and the lower nozzles 21 , the cleaning efficiency of the spray can be improved.

[0040] like figure 1 As shown, the upper developing tank 1 and the lower developing tank 2 are provided with an up and down moving mechanism 3, and the up and down moving mechanism 3 includes a vertical sliding rod 31, an upper connecting block 32 and a lower connecting block 33 arranged on the vertical sliding rod 31. The...