Method, device, storage medium and equipment for simulating reflection performance of optical coding chip

Abstract

The present invention provides a method, device, storage medium and equipment for simulating the reflective performance of an optical coding chip, the method comprising: obtaining the size parameters and material information of a photoelectric coding chip to be simulated, and the corresponding three-dimensional structure of a code disk; obtaining the structural parameters of the components of the photoelectric coding chip to be simulated, and the image information of the photoelectric components; simulating the 3D structural parts of the photoelectric coding chip to be simulated according to the size parameters of the photoelectric coding chip to be simulated, the three-dimensional structure of the code disk and the structural parameters of the components; then performing optical simulation to obtain a light intensity distribution diagram of the photoelectric coding chip to be simulated; performing joint simulation according to the light intensity distribution diagram and the image information of the photoelectric components to obtain the light intensity simulation distribution relationship of the photoelectric components; comparing the light intensity simulation distribution relationship with the light intensity ideal distribution relationship to obtain the reflection performance simulation result of the photoelectric coding chip to be simulated. The present invention can help users improve the design efficiency of reflective photoelectric coding chips.

Description

Technical Field

[0001] The present invention relates to the technical field of simulation of optical coding chips, and in particular to a method, device, storage medium and equipment for simulating the reflection performance of an optical coding chip. Background Art

[0002] Previous studies on the size, position and size of photoelectric tubes on reflective photoelectric encoding chips were mainly based on mathematical formula calculations. However, in actual applications, due to the complexity of the application environment and the different results of the chip installation position, it is inefficient to design reflective photoelectric encoding chips simply through mathematical formula calculations, and the performance of the reflective photoelectric encoding chips obtained is uneven. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings and deficiencies in the prior art and to provide a method, device, storage medium and equipment for simulating the reflective performance of an optical encoding chip, which can help users improve the design efficiency of reflective photoelectric encoding chips, and also help to obtain the spatial setting relationship of components corresponding to the simulation values ​​when using photoelectric encoding chips.

[0004] An embodiment of the present invention provides a method for simulating the reflection performance of an optical coding chip, comprising:

[0005] Acquire the size parameters and material information of the photoelectric encoding chip to be simulated, and the three-dimensional structure of the code disk corresponding to the photoelectric encoding chip to be simulated;

[0006] Acquire structural parameters of components of the optoelectronic encoding chip to be simulated, and image information of optoelectronic components among the components;

[0007] Simulating a 3D structural component of the photoelectric encoding chip to be simulated according to the size parameters of the photoelectric encoding chip to be simulated, the three-dimensional structure of the code disk and the structural parameters of the components;

[0008] Perform optical simulation according to the 3D structural parts of the photoelectric encoding chip to be simulated, the material information of the photoelectric encoding chip to be simulated, and the structural parameters of the components to obtain a light intensity distribution diagram of the photoelectric encoding chip to be simulated;

[0009] Perform joint simulation based on the light intensity distribution diagram and the image information of the optoelectronic component to obtain a light intensity simulation distribution relationship of the optoelectronic component;

[0010] Obtaining an ideal distribution relationship of light intensity of optoelectronic components of the optoelectronic encoding chip to be simulated;

[0011] The light intensity simulation distribution relationship is compared with the light intensity ideal distribution relationship to obtain the reflection performance simulation result of the photoelectric encoding chip to be simulated.

[0012] Compared with the prior art, the simulation method of the reflective performance of the optical encoding chip of the present invention obtains a 3D structural part with high accuracy by simulating the structural parts of the photoelectric encoding chip to be simulated, and then obtains the light intensity distribution diagram of the photoelectric encoding chip to be simulated based on the optical simulation, and then obtains the light intensity simulation distribution relationship of the photoelectric components by jointly simulating the light intensity distribution diagram and the image information of the photoelectric components on the photoelectric encoding chip to be simulated, and then compares it with the ideal light intensity distribution relationship to obtain the reflection performance simulation result of the photoelectric encoding chip to be simulated. Compared with simply relying on mathematical formulas for calculation, the simulation method of the reflective performance of the optical encoding chip of the present invention can obtain the reflection performance simulation result of the photoelectric encoding chip to be simulated with high accuracy, which helps users improve the design efficiency of reflective photoelectric encoding chips, and also helps to obtain the spatial setting relationship of components corresponding to the simulation values ​​when using photoelectric encoding chips.

[0013] In one embodiment, when the light intensity distribution diagram and the image information of the optoelectronic components are jointly simulated, the response data of the optical radiation power of the optoelectronic encoding chip to be simulated for several cycles are also obtained. Combining the response data of the optical radiation power of the optoelectronic encoding chip to be simulated for several cycles is helpful for users to further analyze the simulation results of the reflection performance of the optoelectronic encoding chip to be simulated.

[0014] In one embodiment, the step of performing optical simulation according to the 3D structural parts of the photoelectric encoding chip to be simulated, the material information of the photoelectric encoding chip to be simulated and the structural parameters of the components to obtain the light intensity distribution diagram of the photoelectric encoding chip to be simulated includes:

[0015] Obtaining the material type of the code disc;

[0016] Acquiring characteristic light parameters according to the material type of the code disk and the material information of the photoelectric encoding chip to be simulated;

[0017] Importing the 3D structural parts of the photoelectric encoding chip to be simulated, the material information of the photoelectric encoding chip to be simulated and the structural parameters of the components into Zemax;

[0018] Importing the characteristic light parameters into Zemax;

[0019] The light intensity distribution diagram output by Zemax is obtained.

[0020] Optical simulation is performed by using optical simulation software Zemax to obtain the required light intensity distribution diagram.

[0021] In one embodiment, performing joint simulation based on the light intensity distribution diagram and the image information of the optoelectronic component to obtain the light intensity simulation distribution relationship of the optoelectronic component includes:

[0022] Through the calling interface of Matlab and Zemax, the light intensity distribution diagram output by Zemax is imported into Matlab, and the image information of the optoelectronic components is imported into Matlab to obtain the light intensity simulation distribution relationship output by Matlab.

[0023] Through the interface call, Matlab can obtain the light intensity distribution diagram output by Zemax and perform light intensity simulation analysis.

[0024] In one embodiment, the structural parameters of the components include structural parameters of the light emitting diode of the photoelectric encoding chip to be simulated and structural parameters of the photoelectric tube.

[0025] In one embodiment, the step of obtaining the ideal light intensity distribution relationship of the optoelectronic components of the optoelectronic encoding chip to be simulated includes: directly irradiating an ideal light beam onto a target surface of the optoelectronic components to obtain the ideal light intensity distribution relationship. The corresponding ideal light intensity distribution relationship is obtained according to the ideal light beam.

[0026] An embodiment of the present invention further provides a device for simulating the reflection performance of an optical coding chip, comprising:

[0027] A structural parameter acquisition module, used to acquire the size parameters and material information of the photoelectric encoding chip to be simulated, and the three-dimensional structure of the code disk corresponding to the photoelectric encoding chip to be simulated;

[0028] A component parameter acquisition module, used to acquire structural parameters of the components of the optoelectronic encoding chip to be simulated, and image information of optoelectronic components among the components;

[0029] A structural component simulation module, used to simulate the 3D structural components of the photoelectric encoding chip to be simulated according to the size parameters of the photoelectric encoding chip to be simulated, the three-dimensional structure of the code disk and the structural parameters of the components;

[0030] An optical simulation module, used to perform optical simulation according to the 3D structural parts of the photoelectric encoding chip to be simulated, the material information of the photoelectric encoding chip to be simulated and the structural parameters of the components, to obtain a light intensity distribution diagram of the photoelectric encoding chip to be simulated;

[0031] A joint simulation module, used for performing joint simulation according to the light intensity distribution diagram and the image information of the optoelectronic components to obtain a light intensity simulation distribution relationship of the optoelectronic components;

[0032] A light intensity ideal distribution relationship acquisition module, used to acquire the light intensity ideal distribution relationship of the optoelectronic components of the optoelectronic encoding chip to be simulated;

[0033] The simulation result acquisition module compares the photoelectric simulation distribution relationship with the ideal light intensity distribution relationship to obtain the reflection performance simulation result of the photoelectric encoding chip to be simulated.

[0034] Compared with the prior art, the simulation device for the reflection performance of the optical encoding chip of the present invention obtains a 3D structural part with high accuracy by simulating the structural parts of the photoelectric encoding chip to be simulated, and then obtains the light intensity distribution diagram of the photoelectric encoding chip to be simulated based on the optical simulation, and then obtains the light intensity simulation distribution relationship of the photoelectric components by jointly simulating the light intensity distribution diagram and the image information of the photoelectric components on the photoelectric encoding chip to be simulated, and then compares it with the ideal light intensity distribution relationship to obtain the reflection performance simulation result of the photoelectric encoding chip to be simulated. Compared with simply relying on mathematical formulas for calculation, the simulation method for the reflection performance of the optical encoding chip of the present invention can obtain the reflection performance simulation result of the photoelectric encoding chip to be simulated with high accuracy, which helps users improve the design efficiency of reflective photoelectric encoding chips, and also helps to obtain the spatial setting relationship of components corresponding to the simulation values ​​when using photoelectric encoding chips.

[0035] In one embodiment, when the joint simulation module performs joint simulation, it also obtains the response data of the optical radiation power of the photoelectric encoding chip to be simulated for several cycles. Combining the response data of the optical radiation power of the photoelectric encoding chip to be simulated for several cycles is helpful for users to further analyze the reflection performance simulation results of the photoelectric encoding chip to be simulated.

[0036] An embodiment of the present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, characterized in that when the computer program is executed by a processor, the steps of the method for simulating the reflection performance of an optical coding chip as described above are implemented.

[0037] An embodiment of the present invention also provides a computer device, characterized in that it includes a memory, a processor, and a computer program stored in the memory and executable by the processor, and when the processor executes the computer program, the steps of the method for simulating the reflection performance of the optical encoding chip as described above are implemented.

[0038] In order to more clearly understand the present invention, the specific implementation of the present invention will be described below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 The flowchart is a method for simulating the reflection performance of an optical encoder chip according to an embodiment of the present invention.

[0040] Figure 2 This is a flow chart of steps S41 to S45 of a method for simulating the reflection performance of an optical encoder chip according to an embodiment of the present invention.

[0041] Figure 3 A module connection diagram of a device for simulating the reflection performance of an optical encoder chip according to an embodiment of the present invention.

[0042] 1. Structural parameter acquisition module; 2. Component parameter acquisition module; 3. Structural part simulation module; 4. Optical simulation module; 5. Joint simulation module; 6. Light intensity ideal distribution relationship acquisition module; 7. Simulation result acquisition module. DETAILED DESCRIPTION

[0043] In order to make the objectives, technical solutions and advantages of the present application more clear, the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

[0044] It should be clear that the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the embodiments of the present application.

[0045] When the following description relates to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. In the description of the present application, it should be understood that the terms "first", "second", "third", etc. are only used to distinguish similar objects, and do not have to be used to describe a specific order or sequence, nor can they be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances. The singular forms of "a", "said" and "the" used in the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. The words "if" / "if" used herein can be interpreted as "at the time of" or "when" or "in response to determination".

[0046] In addition, in the description of this application, unless otherwise specified, "plurality" means two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0047] See also Figure 1 , which is a flow chart of a method for simulating the reflection performance of an optical coding chip according to an embodiment of the present invention, comprising:

[0048] S1: Acquire the size parameters and material information of the photoelectric encoding chip to be simulated, and the three-dimensional structure of the code disk corresponding to the photoelectric encoding chip to be simulated.

[0049] The reflective optical encoding chip is provided with a blue light LED (light emitting diode), a PD tube (photoelectric tube) array and a code disk, wherein the LED emits blue light, which is then reflected by the code disk to the PD tube to obtain a relative motion relationship.

[0050] The code disc is a digital encoder for measuring angular displacement. It has the advantages of strong resolution, high measurement accuracy and reliable operation, and is the most commonly used displacement sensor for measuring the angular position of a shaft.

[0051] S2: Acquire structural parameters of components of the optoelectronic encoding chip to be simulated, and image information of optoelectronic components among the components.

[0052] The image information of the optoelectronic components is pre-designed based on the optoelectronic encoding chip to be simulated, and can be designed and generated by PS software (Adobe Photoshop, which mainly processes digital images composed of pixels. Using its numerous editing and drawing tools, image editing can be effectively performed. PS has many functions, involving images, graphics, text, video, publishing, etc.), or it can be obtained by photographing and image processing an existing optoelectronic encoding chip with a high-definition camera.

[0053] S3: simulating a 3D structural component of the photoelectric encoding chip to be simulated according to the size parameters of the photoelectric encoding chip to be simulated, the three-dimensional structure of the code disk and the structural parameters of the components.

[0054] The simulation of the 3D structural parts of the photoelectric encoding chip to be simulated can be achieved by using three-dimensional structure image design software, such as Soildworks.

[0055] S4: performing optical simulation according to the 3D structural components of the photoelectric encoding chip to be simulated, the material information of the photoelectric encoding chip to be simulated, and the structural parameters of the components to obtain a light intensity distribution diagram of the photoelectric encoding chip to be simulated.

[0056] Among them, optical simulation can be achieved through optical simulation software, such as Zemax.

[0057] Preferably, based on the blue light LED used on the photoelectric encoding chip, the characteristic light parameter used in the optical simulation process corresponds to the wavelength of blue light or the frequency of blue light. For example, the characteristic light parameter may be 428 nm blue light.

[0058] S5: performing a joint simulation based on the light intensity distribution diagram and the image information of the optoelectronic component to obtain a light intensity simulation distribution relationship of the optoelectronic component.

[0059] Among them, joint simulation can be achieved through Matlab.

[0060] S6: Obtaining the ideal distribution relationship of light intensity of the optoelectronic components of the optoelectronic encoding chip to be simulated.

[0061] The ideal light intensity distribution relationship represents the most ideal light intensity distribution relationship corresponding to the photoelectric encoding chip to be simulated, or the light intensity distribution relationship marked in accordance with user requirements.

[0062] S7: Compare the light intensity simulation distribution relationship with the light intensity ideal distribution relationship to obtain a reflection performance simulation result of the photoelectric encoding chip to be simulated.

[0063] Compared with the prior art, the simulation method of the reflective performance of the optical encoding chip of the present invention obtains a 3D structural part with high accuracy by simulating the structural parts of the photoelectric encoding chip to be simulated, and then obtains the light intensity distribution diagram of the photoelectric encoding chip to be simulated based on the optical simulation, and then obtains the light intensity simulation distribution relationship of the photoelectric components by jointly simulating the light intensity distribution diagram and the image information of the photoelectric components on the photoelectric encoding chip to be simulated, and then compares it with the ideal light intensity distribution relationship to obtain the reflection performance simulation result of the photoelectric encoding chip to be simulated. Compared with simply relying on mathematical formulas for calculation, the simulation method of the reflective performance of the optical encoding chip of the present invention can obtain the reflection performance simulation result of the photoelectric encoding chip to be simulated with high accuracy, which helps users improve the design efficiency of reflective photoelectric encoding chips, and also helps to obtain the spatial setting relationship of components corresponding to the simulation values ​​when using photoelectric encoding chips.

[0064] In a feasible embodiment, when performing joint simulation based on the light intensity distribution diagram and the image information of the optoelectronic components, the response data of the optical radiation power of several cycles of the optoelectronic encoding chip to be simulated are also obtained. Combining the response data of the optical radiation power of several cycles of the optoelectronic encoding chip to be simulated is conducive to further analyzing the reflection performance simulation results of the optoelectronic encoding chip to be simulated.

[0065] See also Figure 2 In a feasible embodiment, the step of performing optical simulation according to the 3D structural parts of the photoelectric encoding chip to be simulated, the material information of the photoelectric encoding chip to be simulated and the structural parameters of the components to obtain the light intensity distribution diagram of the photoelectric encoding chip to be simulated includes:

[0066] S41: Obtain the material type of the code disc;

[0067] S42: Acquire characteristic light parameters according to the material type of the code disk and the material information of the photoelectric encoding chip to be simulated;

[0068] S43: importing the 3D structural parts of the photoelectric encoding chip to be simulated, the material information of the photoelectric encoding chip to be simulated, and the structural parameters of the components into Zemax;

[0069] S44: importing the characteristic light parameters into Zemax;

[0070] S45: Obtain the light intensity distribution diagram output by Zemax.

[0071] In this embodiment, through the steps S41-S44, optical simulation can be performed by using optical simulation software Zemax to obtain the required light intensity distribution diagram.

[0072] In a feasible embodiment, performing joint simulation based on the light intensity distribution diagram and the image information of the optoelectronic component to obtain the light intensity simulation distribution relationship of the optoelectronic component includes:

[0073] Through the calling interface of Matlab and Zemax, the light intensity distribution diagram output by Zemax is imported into Matlab, and the image information of the optoelectronic components is imported into Matlab to obtain the light intensity simulation distribution relationship output by Matlab.

[0074] In this embodiment, through the interface call, Matlab can obtain the light intensity distribution diagram output by Zemax and perform light intensity simulation analysis.

[0075] In a feasible embodiment, the structural parameters of the components include the structural parameters of the light-emitting diode of the photoelectric encoding chip to be simulated, and the structural parameters of the photoelectric tube. The light-emitting diode includes an LED lamp bead, and the structural parameters of the light-emitting diode include the corresponding wavelength parameters, radiation intensity and light-emitting angle; the structural parameters of the light-emitting diode and the structural parameters of the photoelectric tube can be obtained through experimental measurement, or can be obtained from the corresponding manufacturer.

[0076] In a feasible embodiment, the step of obtaining the ideal light intensity distribution relationship of the optoelectronic components of the optoelectronic encoding chip to be simulated includes: directly irradiating an ideal light beam onto a target surface of the optoelectronic components to obtain the ideal light intensity distribution relationship. The corresponding ideal light intensity distribution relationship is obtained according to the ideal light beam.

[0077] Specifically, the simulation subject of the present invention is based on Matlab. Since the light-emitting characteristics of the LED on the photoelectric encoding chip belong to the existence of a Gaussian spot, the simulation is performed in Soildworks by means of structural parts, and the accurate 3D structural parts are obtained by designing the corresponding height of the chip and the corresponding code disk is designed. Then, through Zemax, a professional optical simulation software, the light-emitting characteristics of the LED and the estimated material properties of the chip surface shell are imported, and according to the relative positions of the designed components, Non-sequential (non-sequential light simulation) is used to obtain the light intensity distribution diagram representing the Gaussian spot of the LED, and then according to the interface between Matlab and Zemax, the image information of the photoelectric components is used to scan the light intensity distribution diagram obtained by Zemax, so as to obtain the light intensity simulation distribution relationship and the response data of the light radiation power of several cycles of the photoelectric encoding chip to be simulated.

[0078] See also Figure 3 One embodiment of the present invention further provides a device for simulating the reflection performance of an optical coding chip, comprising:

[0079] The structural parameter acquisition module 1 is used to acquire the size parameters and material information of the photoelectric encoding chip to be simulated, and the three-dimensional structure of the code disk corresponding to the photoelectric encoding chip to be simulated;

[0080] Component parameter acquisition module 2, used to acquire structural parameters of components of the photoelectric encoding chip to be simulated, and image information of photoelectric components among the components;

[0081] A structural component simulation module 3 is used to simulate the 3D structural components of the photoelectric encoding chip to be simulated according to the size parameters of the photoelectric encoding chip to be simulated, the three-dimensional structure of the code disk and the structural parameters of the components;

[0082] The optical simulation module 4 is used to perform optical simulation according to the 3D structural parts of the photoelectric encoding chip to be simulated, the material information of the photoelectric encoding chip to be simulated and the structural parameters of the components to obtain the light intensity distribution diagram of the photoelectric encoding chip to be simulated;

[0083] A joint simulation module 5, configured to perform a joint simulation based on the light intensity distribution diagram and the image information of the optoelectronic component to obtain a light intensity simulation distribution relationship of the optoelectronic component;

[0084] The light intensity ideal distribution relationship acquisition module 6 is used to acquire the light intensity ideal distribution relationship of the optoelectronic components of the optoelectronic encoding chip to be simulated;

[0085] The simulation result acquisition module 7 compares the photoelectric simulation distribution relationship with the ideal light intensity distribution relationship to obtain the reflection performance simulation result of the photoelectric encoding chip to be simulated.

[0086] Compared with the prior art, the simulation device for the reflection performance of the optical encoding chip of the present invention obtains a 3D structural part with high accuracy by simulating the structural parts of the photoelectric encoding chip to be simulated, and then obtains the light intensity distribution diagram of the photoelectric encoding chip to be simulated based on the optical simulation, and then obtains the light intensity simulation distribution relationship of the photoelectric components by jointly simulating the light intensity distribution diagram and the image information of the photoelectric components on the photoelectric encoding chip to be simulated, and then compares it with the ideal light intensity distribution relationship to obtain the reflection performance simulation result of the photoelectric encoding chip to be simulated. Compared with simply relying on mathematical formulas for calculation, the simulation method for the reflection performance of the optical encoding chip of the present invention can obtain the reflection performance simulation result of the photoelectric encoding chip to be simulated with high accuracy, which helps users improve the design efficiency of reflective photoelectric encoding chips, and also helps to obtain the spatial setting relationship of components corresponding to the simulation values ​​when using photoelectric encoding chips.

[0087] In a feasible embodiment, when the joint simulation module 5 performs joint simulation, it also obtains the response data of the optical radiation power of the photoelectric encoding chip to be simulated for several cycles. Combining the response data of the optical radiation power of the photoelectric encoding chip to be simulated for several cycles is helpful for users to further analyze the reflection performance simulation results of the photoelectric encoding chip to be simulated.

[0088] An embodiment of the present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, characterized in that when the computer program is executed by a processor, the steps of the method for simulating the reflection performance of an optical coding chip as described above are implemented.

[0089] An embodiment of the present invention also provides a computer device, characterized in that it includes a memory, a processor, and a computer program stored in the memory and executable by the processor, and when the processor executes the computer program, the steps of the method for simulating the reflection performance of the optical encoding chip as described above are implemented.

[0090] The device embodiments described above are merely illustrative, wherein the components described as separate parts may or may not be physically separated, and the parts displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present application. Ordinary technicians in this field can understand and implement it without creative work.

[0091] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented in one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that include computer-usable program code.

[0092] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 These computer program instructions can also be stored in a computer-readable memory that can guide a computer or other programmable data processing device to work in a specific way, so that the instructions stored in the computer-readable memory produce a product including an instruction device, which implements the function selected in the process. Figure 1 A process or multiple processes and / or boxes Figure 1 function selected in a box or multiple boxes.

[0093] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process in the computer or other programmable device. Figure 1 A process or multiple processes and / or boxes Figure 1 steps for the function selected in a box or multiple boxes.

[0094] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0095] The memory may include non-permanent memory in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.

[0096] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.

[0097] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0098] The above are only embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included within the scope of the claims of the present application.

Claims

1. A method for simulating the reflection performance of an optical coding chip, characterized in that: include: Acquire the size parameters and material information of the photoelectric encoding chip to be simulated, and the three-dimensional structure of the code disk corresponding to the photoelectric encoding chip to be simulated; Acquire structural parameters of components of the optoelectronic encoding chip to be simulated, and image information of optoelectronic components among the components; Simulating a 3D structural component of the photoelectric encoding chip to be simulated according to the size parameters of the photoelectric encoding chip to be simulated, the three-dimensional structure of the code disk and the structural parameters of the components; Perform optical simulation according to the 3D structural parts of the photoelectric encoding chip to be simulated, the material information of the photoelectric encoding chip to be simulated, and the structural parameters of the components to obtain a light intensity distribution diagram of the photoelectric encoding chip to be simulated; Perform joint simulation based on the light intensity distribution diagram and the image information of the optoelectronic component to obtain a light intensity simulation distribution relationship of the optoelectronic component; Obtaining an ideal distribution relationship of light intensity of optoelectronic components of the optoelectronic encoding chip to be simulated; Comparing the light intensity simulation distribution relationship with the light intensity ideal distribution relationship to obtain a reflection performance simulation result of the photoelectric encoding chip to be simulated; The step of performing optical simulation according to the 3D structural parts of the photoelectric encoding chip to be simulated, the material information of the photoelectric encoding chip to be simulated and the structural parameters of the components to obtain the light intensity distribution diagram of the photoelectric encoding chip to be simulated includes: Obtaining the material type of the code disc; Acquiring characteristic light parameters according to the material type of the code disk and the material information of the photoelectric encoding chip to be simulated; Importing the 3D structural parts of the photoelectric encoding chip to be simulated, the material information of the photoelectric encoding chip to be simulated and the structural parameters of the components into Zemax; Importing the characteristic light parameters into Zemax; The light intensity distribution diagram output by Zemax is obtained.

2. The method for simulating the reflection performance of an optical coding chip according to claim 1, characterized in that: When joint simulation is performed based on the light intensity distribution diagram and the image information of the optoelectronic component, response data of the optical radiation power of several cycles of the optoelectronic encoding chip to be simulated are also obtained.

3. The method for simulating the reflection performance of an optical chip according to claim 1, characterized in that: The performing joint simulation according to the light intensity distribution diagram and the image information of the optoelectronic component to obtain the light intensity simulation distribution relationship of the optoelectronic component includes: Through the calling interface of Matlab and Zemax, the light intensity distribution diagram output by Zemax is imported into Matlab, and the image information of the optoelectronic components is imported into Matlab to obtain the light intensity simulation distribution relationship output by Matlab.

4. The method for simulating the reflection performance of an optical chip according to claim 1, characterized in that: The structural parameters of the components include the structural parameters of the light emitting diode of the photoelectric encoding chip to be simulated and the structural parameters of the photoelectric tube.

5. The method for simulating the reflection performance of an optical chip according to claim 1, characterized in that: The step of obtaining the ideal light intensity distribution relationship of the optoelectronic components of the optoelectronic encoding chip to be simulated includes: directly irradiating ideal light onto the target surface of the optoelectronic components to obtain the ideal light intensity distribution relationship.

6. A device for simulating the reflection performance of an optical coding chip, characterized in that: include: A structural parameter acquisition module, used to acquire the size parameters and material information of the photoelectric encoding chip to be simulated, and the three-dimensional structure of the code disk corresponding to the photoelectric encoding chip to be simulated; A component parameter acquisition module, used to acquire structural parameters of the components of the optoelectronic encoding chip to be simulated, and image information of optoelectronic components among the components; A structural component simulation module, used to simulate the 3D structural components of the photoelectric encoding chip to be simulated according to the size parameters of the photoelectric encoding chip to be simulated, the three-dimensional structure of the code disk and the structural parameters of the components; An optical simulation module is used to perform optical simulation according to the 3D structural parts of the photoelectric encoding chip to be simulated, the material information of the photoelectric encoding chip to be simulated and the structural parameters of the components to obtain a light intensity distribution diagram of the photoelectric encoding chip to be simulated, including: Obtaining the material type of the code disc; Acquiring characteristic light parameters according to the material type of the code disk and the material information of the photoelectric encoding chip to be simulated; Importing the 3D structural parts of the photoelectric encoding chip to be simulated, the material information of the photoelectric encoding chip to be simulated and the structural parameters of the components into Zemax; Importing the characteristic light parameters into Zemax; Obtaining the light intensity distribution diagram output by Zemax; A joint simulation module, used for performing joint simulation according to the light intensity distribution diagram and the image information of the optoelectronic components to obtain a light intensity simulation distribution relationship of the optoelectronic components; A light intensity ideal distribution relationship acquisition module, used to acquire the light intensity ideal distribution relationship of the optoelectronic components of the optoelectronic encoding chip to be simulated; The simulation result acquisition module compares the photoelectric simulation distribution relationship with the ideal light intensity distribution relationship to obtain the reflection performance simulation result of the photoelectric encoding chip to be simulated.

7. The device for simulating the reflection performance of an optical coding chip according to claim 6, characterized in that: When the joint simulation module performs joint simulation, it also obtains response data of the optical radiation power of the photoelectric encoding chip to be simulated for several cycles.

8. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of the method for simulating the reflection performance of an optical coding chip as claimed in any one of claims 1 to 4 are implemented.

9. A computer device, characterized in that: The method comprises a memory, a processor and a computer program stored in the memory and executable by the processor, wherein the processor implements the steps of the method for simulating the reflection performance of an optical coding chip as described in any one of claims 1 to 4 when executing the computer program.

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