Light emitting device

Abstract

The present application relates to a light emitting device, comprising: a circuit board; a plurality of substrates, comprising a first substrate and a second substrate, wherein the first substrate is disposed on the circuit board and the second substrate is disposed on the circuit board and overlaps the first substrate; a plurality of light emitting units disposed on the first substrate; a plurality of pixel driving circuits electrically connected to the plurality of light emitting units; and a plurality of gate driving circuits electrically connected to the plurality of pixel driving circuits, wherein at least part of the plurality of pixel driving circuits or at least part of the plurality of gate driving circuits are disposed on the second substrate.

Description

Technical Field

[0001] This invention relates to a light-emitting device, and more particularly to a light-emitting device in which the light-emitting unit, pixel driving circuit and / or gate driving circuit can be disposed on different substrates. Background Technology

[0002] In typical light-emitting devices, such as large-size public information displays (PIDs), the light-emitting units, pixel driving circuits, and gate driving circuits are all mounted on the same substrate, and then assembled with a circuit board. After packaging and cutting, they are then spliced ​​together to obtain the large-size public information display.

[0003] When a substrate containing light-emitting units, pixel driving circuits, and gate driving circuits is cut, if other components are present at the cut point, moisture can easily enter between the layers after cutting, resulting in a deterioration in the color rendering of the display device. Alternatively, as resolution increases, the spacing between light-emitting units decreases, reducing the space available for pixel driving circuits and gate driving circuits; therefore, cutting may damage the pixel driving circuits or gate driving circuits at the edges.

[0004] In view of this, there is an urgent need to develop a light-emitting device to solve the aforementioned problems. Summary of the Invention

[0005] The present invention relates to a light-emitting device, comprising: a circuit board; a plurality of substrates, including a first substrate and a second substrate, wherein the first substrate is disposed on the circuit board and the second substrate is disposed on the circuit board and overlaps with the first substrate; a plurality of light-emitting units disposed on the first substrate; a plurality of pixel driving circuits electrically connected to the plurality of light-emitting units; and a plurality of gate driving circuits electrically connected to the plurality of pixel driving circuits, wherein at least a portion of the plurality of pixel driving circuits or at least a portion of the plurality of gate driving circuits are disposed on the second substrate.

[0006] The following detailed description, accompanied by illustrations, will make other novel features of the invention more apparent. Attached Figure Description

[0007] Figure 1A This is a top view of the first substrate before cutting and the light-emitting unit above it, according to an embodiment of the present invention.

[0008] Figure 1B This is a top view of a first substrate after it has been cut and the light-emitting unit on top of it, according to an embodiment of the present invention.

[0009] Figure 2A This is a top view of the second substrate before cutting and the pixel driving circuit and gate driving circuit above it, according to an embodiment of the present invention.

[0010] Figure 2B This is a top view of the second substrate after it has been cut, and the pixel driving circuit and gate driving circuit on top of it, according to an embodiment of the present invention.

[0011] Figure 3 This is a cross-sectional schematic diagram of a light-emitting device according to an embodiment of the present invention.

[0012] Figure 4 This is a cross-sectional schematic diagram of a light-emitting device according to an embodiment of the present invention.

[0013] Figure 5 This is a top view of a large-size public display device according to an embodiment of the present invention.

[0014] Figures 6 to 13 These are cross-sectional schematic diagrams of the light-emitting devices according to different embodiments of the present invention.

[0015] Symbol Explanation

[0016] 11 First mother substrate

[0017] 11' First substrate

[0018] 11a, 12a Edge

[0019] 111 Light-emitting units

[0020] 112 Connecting Pad

[0021] 113, 123 jumper wires

[0022] 12 Second Mother Substrate

[0023] 12' Second substrate

[0024] 121-pixel driving circuit

[0025] 122 Gate Drive Circuit

[0026] 124 contact pad

[0027] 125 test pad

[0028] 13 Circuit Boards

[0029] 131 First Surface

[0030] 132 Second Surface

[0031] 14' Third substrate

[0032] A reserved area

[0033] C1, C2, C3 Cutting Lines

[0034] D Data Line

[0035] G2, G3 spacing

[0036] Distance between G1, G4, G4'G5

[0037] Width of L1, L2

[0038] P,P' pixel regions

[0039] S scan line Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0041] The following provides different embodiments of the present invention. These embodiments are used to illustrate the technical content of the present invention and are not intended to limit the scope of the invention. A feature of one embodiment can be applied to other embodiments through suitable modifications, substitutions, combinations, and separations.

[0042] It should be noted that, unless otherwise specified, having “one” component is not limited to having a single component, but may include one or more of the component.

[0043] Furthermore, unless otherwise specified, the ordinal numbers such as "first," "second," etc., used in this document are merely for distinguishing multiple components with the same name and do not indicate any hierarchy, order of execution, or process sequence among them. A "first" component and a "second" component may appear together in the same component or separately in different components. The presence of a component with a higher ordinal number does not necessarily indicate the presence of another component with a lower ordinal number.

[0044] In this document, unless otherwise specified, the term "characteristic A" or "and / or" and "characteristic B" means that A exists alone, B exists alone, or A and B exist simultaneously; the term "characteristic A" and "and" or "and" and "and" and "characteristic B" means that A and B exist simultaneously; the terms "including", "containing", "having", and "containing" refer to, but are not limited to, these.

[0045] Furthermore, in this paper, terms such as "above," "below," or "between" are used only to describe the relative positions between multiple components, and can be extended to include translation, rotation, or mirroring.

[0046] Furthermore, unless otherwise specified herein, the location mentioned in the specification and claims, such as "above," "over," or "above," may refer to direct contact with another component or indirect contact with another component. Moreover, the location mentioned in the specification and claims, such as "below," "under," or "below," may refer to direct contact with another component or indirect contact with another component.

[0047] Furthermore, the word "adjacent" in the specification and claims is used to describe mutual proximity and does not necessarily mean mutual contact.

[0048] Furthermore, in this document, the term "about" generally refers to within 20%, 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range. The quantities given here are approximate, meaning that the term "about" may be implied even without specific explanation.

[0049] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It is understood that these terms, for example, as defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant art and this invention, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of this invention.

[0050] Furthermore, the light-emitting device disclosed in this invention may include a display device, a touch display device, a curved display device, or a free-shape display device, but is not limited thereto. The light-emitting device may be a bendable or flexible light-emitting device. The light-emitting unit of the light-emitting device may include, for example, a light-emitting diode (LED), a quantum dot (QD), fluorescence, phosphorescence, other suitable display media, or combinations thereof, but is not limited thereto. In this invention, the light-emitting diode may, for example, include an organic light-emitting diode (OLED), a light-emitting diode (LED), a sub-millimeter light-emitting diode (mini LED), a micro LED, or a quantum dot light-emitting diode (e.g., QLED, QDLED) or other suitable materials or any arrangement and combination of the above materials, but is not limited thereto. The light-emitting device may, for example, include a spliced ​​light-emitting device, but is not limited thereto. It should be noted that the light-emitting device may be any arrangement and combination of the foregoing, but is not limited thereto. Furthermore, the shape of the light-emitting device can be rectangular, circular, polygonal, with curved edges, or other suitable shapes. The light-emitting device may have a driving system, a control system, a light source system, a shelving system, or other peripheral systems to support the light-emitting device or to connect multiple light-emitting devices. The present invention will be described below using a display device as the light-emitting device, but this invention is not limited thereto.

[0051] Figure 1A and Figure 1B These are top views of the first substrate and the light-emitting unit above it before and after cutting, respectively, according to an embodiment of the present invention. First, as... Figure 1A As shown, a first mother substrate 11 is provided, wherein the first mother substrate 11 includes a predetermined region A, the predetermined region A (as shown in the thick frame) includes a plurality of pixel regions P (as shown in the thin frame), and each pixel region P is correspondingly provided with a light-emitting unit 111. Then, the first mother substrate 11 is cut along the cutting line C1 to obtain the following... Figure 1B The first substrate 11' includes a plurality of pixel regions P, and each pixel region P is correspondingly provided with a light-emitting unit 111. Here, the cutting line C1 and the outermost light-emitting unit 111 may be separated by a distance G1 in the X direction. Here, the distance G1 between the cutting line C1 and the outermost light-emitting unit 111 in the X direction should be such that the cutting does not cut into the light-emitting unit 111 and / or the trace under the light-emitting unit 111. In one embodiment of the present invention, the distance G1 may conform to the following formula (I):

[0052] 0μm≦G1≦(L1-L2-(G4)x2) / 2 (I)

[0053] Wherein, L1 is the width of the predetermined region A in the X direction, L2 is the width of the outermost edges of the two outermost light-emitting units 111 in the X direction, and G4 is the distance by which the cutting line C1 needs to be recessed from the predetermined region A. In another embodiment of the present invention, the distance G1 may conform to the following formula (I'):

[0054] 0μm <G1<(L1-L2-(G4)x2) / 2 (I’)。

[0055] Figure 2A and Figure 2B These are top views of the second substrate before and after cutting, and the pixel driving circuit and gate driving circuit above it, respectively, according to an embodiment of the present invention. First, as Figure 2A As shown, a second mother substrate 12 is provided, on which a plurality of scan lines S, a plurality of data lines D, and a plurality of pixel driving circuits 121 are disposed. Here, the scan lines S intersect with the data lines D. Each pixel driving circuit 121 includes a transistor, and the scan lines S are electrically connected to the gate of the transistor, while the data lines D are electrically connected to one end of the transistor. Furthermore, a plurality of gate driving circuits 122 are also disposed on the second mother substrate 12, which are electrically connected to the scan lines S; thereby, a signal is provided to the pixel driving circuits 121. Moreover, a detection pad 125 is also disposed on the second mother substrate 12, electrically connected to the data lines D; the detection pad 125 can be connected to an optical inspection device (not shown) for circuit inspection. Then, the second mother substrate 12 is cut along the cutting line C2 to obtain the following... Figure 2B The second substrate 12' includes a plurality of pixel regions P', and each pixel region P' is provided with a pixel driving circuit 121.

[0056] In this embodiment, the first substrate 11' and the second substrate 12' can be flexible substrates or non-flexible substrates, respectively. Their materials may include, for example, glass, quartz, wafer, sapphire, polycarbonate (PC), polyimide (PI), polypropylene (PP), polyethylene terephthalate (PET), other suitable materials, or combinations thereof; however, the present invention is not limited thereto. The materials of the first substrate 11' and the second substrate 12' may be the same or different, depending on the design. In one embodiment of the present invention, the materials of the first substrate 11' and the second substrate 12' are PI; however, the present invention is not limited thereto.

[0057] Figure 3This is a cross-sectional schematic diagram of a light-emitting device according to an embodiment of the present invention. After cutting the first mother substrate 11 and the second mother substrate 12 to obtain the first substrate 11' and the second substrate 12' ( Figures 1A to 2B As shown, by placing the first substrate 11' and the second substrate 12' on both sides of the circuit board 13, the light-emitting device of this embodiment can be obtained.

[0058] like Figure 3 As shown, the light-emitting device of this embodiment includes: a circuit board 13; a plurality of substrates, including a first substrate 11' and a second substrate 12', wherein the first substrate 11' is disposed on the circuit board 13 and the second substrate 12' is disposed on the circuit board 13 and overlaps with the first substrate 11'; a plurality of light-emitting units 111 disposed on the first substrate 11'; a plurality of pixel driving circuits 121 electrically connected to the plurality of light-emitting units 111; and a plurality of gate driving circuits 122 electrically connected to the plurality of pixel driving circuits 121, wherein at least a portion of the plurality of pixel driving circuits 121 or at least a portion of the plurality of gate driving circuits 122 are disposed on the second substrate 12'.

[0059] like Figure 3 As shown, in the light-emitting device of this embodiment, the circuit board 13 has a first surface 131 and a second surface 132, wherein the first surface 131 and the second surface 132 are opposite to each other, and the first substrate 11' and the second substrate 12' are respectively disposed on the first surface 131 and the second surface 132 of the circuit board 13. In addition, the light-emitting unit 111 is disposed on the first substrate 11'; while the pixel driving circuit 121 and the gate driving circuit 122 are disposed on the second substrate 12'.

[0060] Here, the second substrate 12' is disposed on the second surface 132 of the circuit board 13, and the pixel driving circuit 121 is electrically connected to the light-emitting unit 111 through the circuit board 13. More specifically, as Figure 2B and Figure 3 As shown, one end of the pixel driving circuit 121 is electrically connected to the data line D, and the other end of the pixel driving circuit 121 can be electrically connected to the light-emitting unit 111 through the circuit board 13. Therefore, the purpose of electrically connecting the pixel driving circuit 121 to the light-emitting unit 111 through the circuit board 13 can be achieved.

[0061] like Figure 3As shown, since the components on the first substrate 11' (e.g., light-emitting unit 111) are located on the opposite side of the surface of the first substrate 11' facing the circuit board 13, they can be electrically connected to the circuit board 13 through a jumper wire 113 penetrating the first substrate 11'. Since the components on the second substrate 12' (e.g., pixel driving circuit 121 or gate driving circuit 122) are also located on the opposite side of the surface of the second substrate 12' facing the circuit board 13, they can also be electrically connected to the circuit board 13 through a jumper wire 123 penetrating the second substrate 12'. More specifically, the light-emitting device of this embodiment may further include a jumper wire 123 penetrating the second substrate 12', allowing at least a portion of the pixel driving circuit 121 to be electrically connected to the light-emitting unit 111 via the jumper wire 123. Similarly, the light-emitting device of this embodiment may further include another jumper wire 113 penetrating the first substrate 11', allowing each light-emitting unit 111 to be electrically connected to the pixel driving circuit 121 via the jumper wire 113 and the circuit board 13, respectively.

[0062] In conventional light-emitting devices where the light-emitting unit, pixel driving circuit, and gate driving circuit are all located on the same substrate, stacking the substrate containing these components onto a circuit board, encapsulating it, and then cutting it requires simultaneous cutting of both the substrate and the circuit board. This makes it difficult to meet current precision requirements and results in larger cutting tolerances. Furthermore, since all the components are located on the same substrate, the wiring area on the substrate is large. During cutting, it is easy to cut the wiring at the edge of the substrate, or if other components are present at the cut point, moisture can enter between the layers, causing deterioration of the light-emitting device.

[0063] Therefore, in the light-emitting device of this embodiment, the light-emitting unit 111 and at least a portion of the pixel driving circuit 121 and / or at least a portion of the gate driving circuit 122 are disposed on different substrates, and are then stacked on the circuit board 13 after the substrates are cut. In this way, the wiring range on a single substrate can be effectively reduced, the tolerance range during cutting can be increased, the problem of damaging the substrate wiring during cutting can be avoided, and / or the problem of moisture intrusion caused by damage between layers can be avoided.

[0064] In another embodiment of the invention, such as Figure 4 As shown, the components (e.g., pixel driving circuit 121 or gate driving circuit 122) on the second substrate 12' are disposed on the surface of the second substrate 12' facing the circuit board 13, and can be electrically connected to the circuit board 13 through the contact pad 124, and then electrically connected to the light-emitting unit 111 which is electrically connected to the circuit board 13.

[0065] exist Figure 3 or Figure 4In the process, after the first substrate 11' and the second substrate 12' are respectively disposed on the first surface 131 and the second surface 132 of the circuit board 13, the circuit board 13 is cut along the cutting line C3. Finally, as... Figure 5 As shown, multiple Figure 3 or Figure 4 By splicing together the cut light-emitting devices, the spliced ​​light-emitting device of this embodiment can be obtained. The spliced ​​light-emitting device of this embodiment can be used in large-size public display devices, but the present invention is not limited thereto.

[0066] like Figure 5 As shown, in the splicing light-emitting device of this embodiment, the spacing G2 between adjacent light-emitting units 111 on adjacent first substrates 11' after splicing is substantially equal to the spacing G3 between adjacent light-emitting units 111 on the same first substrate 11', in order to avoid inconsistencies in the displayed image. To ensure that spacing G2 is substantially equal to spacing G3, and to avoid inconsistencies in the display image when cutting the circuit board 13 (such as... Figure 3 or Figure 4 (As shown) there is a risk of cutting onto the first substrate 11', therefore, when cutting the first mother substrate 11, if Figure 1A As shown, the cutting line C1 needs to be recessed by a distance G4 from the predetermined area A. At this time, the cutting line C1 and the outermost light-emitting unit 111 can be separated by a distance G1.

[0067] In addition, such as Figure 3 or Figure 4 As shown, when cutting the circuit board 13, the position of the cutting line C3 can be referenced to the position of the predetermined area A. More specifically, in the direction perpendicular to the normal direction (Z direction) of the substrate (X direction), the position of the cutting line C3 can be a distance G4' from the edge 11a of the first substrate 11', and the distance G4' can be substantially equivalent to the distance G4. Thus, after splicing the light-emitting device, as Figure 5 As shown, this achieves the goal that spacing G2 is essentially equal to spacing G3.

[0068] like Figure 1A and Figure 5 As shown, when the cutting line C1 is recessed from the predetermined area A, the distance G5 between two adjacent first substrates 11' can meet the tolerance required for splicing. This tolerance can compensate for errors caused by the cutting machine, cutting steps, or other processes. Here, the distance G5 between two adjacent first substrates 11' can be twice the distance G4' (e.g., Figure 3 (As shown). In this embodiment, the distance G5 between two adjacent first substrates 11' can conform to the following formula (II):

[0069] 0μm≦G5≦(L1-L2) / 2 (II)

[0070] Wherein, L1 is the width of the predetermined region A in the X direction, and L2 is the width of the edges of the two outermost light-emitting units 111 in the X direction. In another embodiment of the present invention, the distance G5 may conform to the following formula (II'):

[0071] 0μm <G5≦(L1-L2) / 2 (II)

[0072] In conventional light-emitting devices where the light-emitting unit, pixel driving circuit, and gate driving circuit are all located on the same substrate, if the substrate containing these components is stacked on a circuit board and then cut, the circuit lines on the edges of the substrate occupy a certain amount of space. To maintain the same pixel spacing after splicing, the splicing tolerance between two adjacent substrates is quite small. That is, the alignment must be very precise during splicing to avoid inconsistencies in the displayed image. However, in the light-emitting device of this embodiment, the light-emitting unit 111 and at least part of the pixel driving circuit 121 and / or at least part of the gate driving circuit 122 are located on different substrates. Therefore, the distance G5 between two adjacent first substrates 11' can be increased to increase the tolerance value required for splicing, and the problem of inconsistencies in the displayed image due to inaccurate alignment of the two substrates is less likely to occur.

[0073] exist Figure 1A , Figure 1B , Figure 2A , Figure 2B , Figures 3 to 5 In the example, the distances G1, G4, G4'G5, the spacing G2, G3, and the widths L1, L2 are given in one direction (X direction) that is perpendicular to the normal direction (Z direction) of the substrate. The design of the corresponding distances and spacings in the other direction (Y direction) that is perpendicular to the normal direction (Z direction) of the substrate is the same as described above and will not be repeated.

[0074] Figures 6 to 13 These are cross-sectional schematic diagrams of light-emitting devices according to different embodiments of the present invention. Figures 6 to 13 In the embodiments described, for ease of explanation, details such as... are omitted. Figure 3 The jumper wires 113, 123 shown are or as follows Figure 4 The contact pad 124 is shown. Furthermore, in... Figures 6 to 11 and Figure 13 In the process, the second substrate 12' and / or the third substrate 14' may be adopted as follows: Figure 3 It can be electrically connected to circuit board 13 in one manner, or it can be connected in another manner, such as... Figure 4 It is electrically connected to circuit board 13 in a manner that allows it to do so.

[0075] Figure 6 The illustrated embodiments and Figure 3 The illustrated embodiments are similar, except as follows. Figure 6In one embodiment, at least a portion of the gate drive circuit 122 is disposed on the first substrate 11'.

[0076] Figure 7 The illustrated embodiments and Figure 6 The illustrated embodiments are similar, except as follows. Figure 7 In one embodiment, another portion of the pixel driving circuit 121 is disposed on the first substrate 11', and the data line (not shown) electrically connected to the pixel driving circuit 121 disposed on the first substrate 11' is also disposed on the first substrate 11'. Furthermore, the pixel driving circuit 121 disposed on the first substrate 11' is also electrically connected to the light-emitting unit 111 through a connecting pad 112. In this embodiment, the pixel driving circuit 121 electrically connected to the light-emitting unit 111 closest to the edge 11a of the first substrate 11' is still disposed on the second substrate 12', while the pixel driving circuit 121 disposed on the first substrate 11' is the pixel driving circuit 121 electrically connected to the light-emitting unit 111 not closest to the edge 11a of the first substrate 11'. The reason is that when the pixel driving circuit 121, which is electrically connected to the light-emitting unit 111 closest to the edge 11a of the first substrate 11', is still located on the second substrate 12', the distance of the inward cutting of the first mother substrate can be increased, and the distance G4' between the position of the cutting line C3 and the edge 11a of the first substrate 11' can be increased. This increases the tolerance required when splicing two adjacent first substrates 11' (such as...). Figure 5 Distance G5).

[0077] Figure 8 The illustrated embodiments and Figure 3 The illustrated embodiments are similar, except as follows. Figure 8 In this embodiment, all pixel driving circuits 121 are disposed on the first substrate 11', and data lines (not shown) electrically connected to the pixel driving circuits 121 disposed on the first substrate 11' are also disposed on the first substrate 11'. Furthermore, the pixel driving circuits 121 disposed on the first substrate 11' are also electrically connected to the light-emitting unit 111 through a connecting pad 112. Therefore, in this embodiment, the second substrate 12' does not have pixel driving circuits 121 but only gate driving circuits 122.

[0078] Figure 9 The illustrated embodiments and Figure 3 The illustrated embodiments are similar, except as follows. Figure 9In one embodiment, at least a portion of the pixel driving circuit 121 is disposed on the first substrate 11', and a data line (not shown) electrically connected to the pixel driving circuit 121 disposed on the first substrate 11' is also disposed on the first substrate 11'. Furthermore, the pixel driving circuit 121 disposed on the first substrate 11' is electrically connected to the light-emitting unit 111 through a connecting pad 112. In this embodiment, the pixel driving circuit 121 disposed on the first substrate 11' is the pixel driving circuit 121 electrically connected to the light-emitting unit 111 that is not closest to the edge 11a of the first substrate 11'; the reason for this is as described above and will not be repeated. Furthermore, in this embodiment, the gate driving circuit 122 is adjacent to the edge 12a of the second substrate 12'; however, the invention is not limited to this. In another embodiment of the invention, the pixel driving circuit 121 is adjacent to the edge 12a of the second substrate 12'. In another embodiment of the invention, a portion of the gate driving circuit 122 is adjacent to the edge 12a of the second substrate 12', and a portion of the pixel driving circuit 121 is adjacent to the edge 12a of the second substrate 12'.

[0079] Figure 10 The illustrated embodiments and Figure 9 The illustrated embodiments are similar, except as follows. Figure 10 In one embodiment, the plurality of substrates further includes a third substrate 14', and another portion of the gate driving circuit 122 is disposed on the third substrate 14'. More specifically, in this embodiment, the second substrate 12' is provided with a portion of the pixel driving circuit 121 and a portion of the gate driving circuit 122; and the third substrate 14' is also provided with a portion of the pixel driving circuit 121 and a portion of the gate driving circuit 122.

[0080] Figure 11 The illustrated embodiments and Figure 9 The illustrated embodiments are similar, except as follows. Figure 11 In one embodiment, a portion of the pixel driving circuit 121 is provided on the second substrate 12', while a portion of the gate driving circuit 122 is provided on the third substrate 14'.

[0081] In addition to Figure 10 and Figure 11 In addition to the embodiments shown, the present invention has other similarities. Figure 10 and Figure 11Similar embodiments are shown. In one embodiment of the invention, the pixel driving circuit 121 may be disposed on the first substrate 11', while the gate driving circuit 122 may be disposed on one or more third substrates 14'. In another embodiment of the invention, the pixel driving circuit 121 may be disposed on one or more second substrates 12', and the gate driving circuit 122 may be disposed on one or more third substrates 14'. In yet another embodiment of the invention, the light-emitting unit 111 and the gate driving circuit 122 may be disposed on the first substrate 11', while the pixel driving circuit 121 may be disposed on one or more second substrates 12'. In yet another embodiment of the invention, the light-emitting unit 111, a portion of the pixel driving circuit 121, and a portion of the gate driving circuit 122 may be disposed on the first substrate 11', while the remaining pixel driving circuit 121 and the remaining gate driving circuit 122 may be disposed on one or more second substrates 12' or one or more third substrates 14'.

[0082] Figure 12 The illustrated embodiments and Figure 3 The illustrated embodiments are similar, except as follows. Figure 12 In one embodiment, the second substrate 12' is disposed on the first surface 131 of the circuit board 13 and is located between the first substrate 11' and the circuit board 13. In another embodiment of the present invention, a portion of the pixel driving circuit 121 may be disposed on the first substrate 11'. In yet another embodiment of the present invention, a portion of the gate driving circuit 122 may be disposed on the first substrate 11'. In another embodiment of the present invention, a portion of the pixel driving circuit 121 and a portion of the gate driving circuit 122 may be disposed on the first substrate 11'.

[0083] Figure 13 The illustrated embodiments and Figure 12 The illustrated embodiments are similar, except as follows. Figure 13 In one embodiment, the plurality of substrates further includes a third substrate 14', and a portion of the gate driving circuit 122 is disposed on the third substrate 14'. In another embodiment of the invention, a portion of the pixel driving circuit 121 may be disposed on the first substrate 11'. In another embodiment of the invention, the plurality of substrates may include one or more third substrates 14', and the gate driving circuit 122 may be disposed on one or more third substrates 14'.

[0084] exist Figure 3 and Figure 4 In the embodiment shown, the pixel driving circuit 121 and the gate driving circuit 122 are disposed on the second surface 132 of the circuit board 13; therefore, the pixel driving circuit 121 and the gate driving circuit 122 need to be electrically connected to the light-emitting unit 111 through the wiring inside the circuit board 13.

[0085] exist Figures 6 to 13In this embodiment, at least a portion of the pixel driving circuit 121 and / or at least a portion of the gate driving circuit 122 are disposed on the first surface 132 of the circuit board 13. Therefore, at least a portion of the pixel driving circuit 121 and / or at least a portion of the gate driving circuit 122 disposed on the first surface 132 of the circuit board 13 can be electrically connected to the light-emitting unit 111 without needing to pass through the internal wiring of the circuit board 13. Thus, the wiring design inside the circuit board 13 can be simplified.

[0086] In the foregoing embodiments of the present invention, a light-emitting device having a 6x6 array of light-emitting units was used as an example; however, the number of light-emitting units in the light-emitting device of the present invention is not limited to this and can be adjusted according to design and requirements. Furthermore, in the foregoing embodiments of the present invention, a spliced ​​light-emitting device formed by a 2x4 array of light-emitting units was used as an example; similarly, the number of light-emitting units in the spliced ​​light-emitting device of the present invention is not limited to this and can be adjusted according to design and requirements.

[0087] In this invention, features of each embodiment can be arbitrarily mixed and matched as long as they do not violate the spirit of the invention or conflict with it.

[0088] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A light-emitting device, characterized in that, include: A circuit board; Multiple substrates, including a first substrate and a second substrate, wherein the first substrate is disposed on the circuit board and the second substrate is disposed on the circuit board and overlaps with the first substrate; Multiple light-emitting units are disposed on the first substrate; Multiple pixel driving circuits are electrically connected to the multiple light-emitting units; as well as Multiple gate driving circuits are electrically connected to the multiple pixel driving circuits, wherein at least a portion of the multiple pixel driving circuits or at least a portion of the multiple gate driving circuits are disposed on the second substrate. The circuit board is electrically connected via a jumper wire that passes through the first substrate or the second substrate.

2. The light-emitting device as described in claim 1, characterized in that, At least a portion of the plurality of pixel driving circuits are disposed on the second substrate.

3. The light-emitting device as described in claim 2, characterized in that, Another portion of the multiple pixel driving circuits is disposed on the first substrate.

4. The light-emitting device as described in claim 1, characterized in that, At least a portion of the plurality of gate drive circuits are disposed on the first substrate.

5. The light-emitting device as described in claim 1, characterized in that, At least a portion of the plurality of gate drive circuits are disposed on the second substrate.

6. The light-emitting device as described in claim 5, characterized in that, Another portion of the multiple pixel driving circuits is disposed on the first substrate.

7. The light-emitting device as claimed in claim 1, characterized in that, The plurality of substrates also includes a third substrate, and another portion of the plurality of gate drive circuits is disposed on the third substrate.

8. The light-emitting device as claimed in claim 7, characterized in that, Another portion of the multiple pixel driving circuits is disposed on the first substrate.

9. The light-emitting device as claimed in claim 1, characterized in that, At least a portion of the plurality of pixel driving circuits are electrically connected to the plurality of light-emitting units via the jumper wire.

10. The light-emitting device as claimed in claim 1, characterized in that, The light-emitting device also includes a contact pad disposed on the second substrate, and at least a portion of the plurality of pixel driving circuits are electrically connected to the plurality of light-emitting units through the contact pad.

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