A method for preparing a multi-lead arrangement package bracket

Abstract

The present invention provides a method for preparing a multi-lead arrangement package bracket, comprising a ceramic substrate having a conductive wire fixedly connected to the upper end surface of the ceramic substrate, at least one group of light-emitting semiconductors die-bonded to the upper end surface of the conductive wire, and a sealing cap disposed on the upper end surface of the ceramic substrate. The preparation method comprises preparing a ceramic substrate, providing at least one group of irregular slots on one side of the ceramic substrate; fixing the conductive wire to the other side of the ceramic substrate, and fixing a sealing frame to the side of the ceramic substrate where the conductive wire is fixed using a fixing glue; injecting paraffin wax into the sealing frame, the paraffin wax having a thickness of no more than 3 mm; forming a placement groove for the light-emitting semiconductor in the paraffin wax according to the horizontal lines on the conductive wire, the paraffin wax being lower than the depth of the sealing frame, and then placing the light-emitting semiconductor in the placement groove; and injecting resin into the sealing frame so that the resin completely fills the sealing frame. The present invention can package LEDs that can be used in different arrangement methods, while achieving high packaging efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, in particular to a method for preparing a multi-lead arrangement packaging bracket. Background Art

[0002] LED chips require packaging. This process involves encapsulating integrated circuits with insulating plastic or ceramic materials. This makes encapsulated chips easier to install and transport. The quality of packaging technology is crucial, as it directly impacts both the performance of the chip itself and the design and manufacture of the printed circuit boards (PCBs) it connects to.

[0003] The existing LED packaging bracket has a simple structure. Different types of brackets are required for different LED arrangements. In addition, the substrate of the existing arrangement-type packaging bracket is relatively thick to ensure stability, has a large gravity, and is inconvenient to use. Moreover, when packaging multiple LEDs at the same time, the existing solution is to wire-bond the core particles one by one, which has extremely low packaging efficiency. Summary of the Invention

[0004] (1) Technical problems solved

[0005] In view of the deficiencies in the prior art, the present invention provides a method for preparing a multi-lead arrangement package bracket to solve the problems raised in the above background technology.

[0006] (2) Technical solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: a multi-lead arrangement packaging bracket, including a ceramic substrate, the upper end surface of the ceramic substrate is fixedly connected to a conductive wire, the upper end surface of the conductive wire is solidified with at least one group of light-emitting semiconductors, and the upper end surface of the ceramic substrate is provided with a sealing cover.

[0008] As a preference of this embodiment, there are two groups of conductive lines symmetrically arranged on the upper end surface of the ceramic substrate, the conductive lines include vertical lines and at least one group of horizontal lines, the at least one group of horizontal lines are spaced apart on one side of the vertical lines, and the horizontal lines of the two groups of conductive lines are spaced apart on the upper end surface of the ceramic substrate.

[0009] As a preference of this embodiment, at least one group of irregular empty grooves is provided on the lower end surface of the ceramic substrate, the thickness of the ceramic substrate is 5-8 mm, and the depth of the empty grooves is 3-6 mm.

[0010] As a preferred embodiment of the present invention, the present invention also provides a method for preparing a multi-lead arrangement package bracket, comprising the following steps:

[0011] S1: preparing a ceramic substrate, and setting at least one set of irregular grooves on one side of the ceramic substrate;

[0012] S2: Fix the conductive wire on the other side of the ceramic substrate, and then fix the sealing frame on the side of the ceramic substrate where the conductive wire is fixed using a fixing glue;

[0013] S3: Inject paraffin wax into the sealing frame, with the thickness of the paraffin wax not exceeding 3 mm;

[0014] S4: A placement groove for the light-emitting semiconductor is opened on the paraffin wax according to the horizontal lines on the conductive line, where the height of the paraffin wax is lower than the depth of the sealing frame, and then the light-emitting semiconductor is placed in the placement groove;

[0015] S5: injecting resin into the sealing frame so that the resin fills the sealing frame completely;

[0016] S6: After the resin is solidified, the light-emitting semiconductor is fixed on the resin, and the solidified resin and the light-emitting semiconductor are taken out together;

[0017] S7: Remove the paraffin wax and the sealing frame on the upper end surface of the ceramic substrate, apply a layer of solder paste on the horizontal line of the conductive wire, and laminate the ceramic substrate with the resin fixed with the light-emitting semiconductor and heat it, so that the light-emitting semiconductor is fixed on the horizontal line of the conductive wire through the solder paste;

[0018] S8: Place the light-emitting semiconductor fixed on the horizontal line in S7 together with the ceramic substrate into the mold, and inject resin into the gap between the resin and the ceramic substrate again. After the resin is cured, take out the ceramic substrate and polish it clean to obtain the packaging bracket.

[0019] As a preference of this embodiment, in S2, the conductive wire is embedded in one side of the ceramic substrate, and the embedding surface of the conductive wire and the ceramic substrate is flush.

[0020] As a preference of this embodiment, the sealing frame is fixed around the upper end surface of the ceramic substrate, and the sealing frame completely covers the vertical lines on the conductive wires. The inner area of ​​the sealing frame gradually decreases from top to bottom and then remains consistent.

[0021] As a preference of this embodiment, the two sides of the placement groove in S4 are respectively on the horizontal lines of two groups of conductive lines symmetrically arranged on the ceramic substrate, and the size of the placement groove is adapted to the light-emitting semiconductor, and the depth of the placement groove is lower than the thickness of the light-emitting semiconductor.

[0022] As a preferred embodiment of the present invention, the method of removing the paraffin and the sealing frame in S7 is specifically to first remove the sealing frame and then remove the paraffin by heating, with the surface on which the conductive wire is set being placed vertically during heating.

[0023] As a preference of this embodiment, in S7 , the position where the light emitting semiconductor is fixed on the conductive wire is the same as the position where the light emitting semiconductor is placed in the groove.

[0024] (3) Beneficial effects

[0025] The present invention provides a method for preparing a multi-lead arrangement packaging bracket, which has the following beneficial effects: two groups of conductive wires are arranged on the upper end surface of a ceramic substrate, wherein the horizontal lines on the two groups of conductive wires are interspersed with each other, and at least one group of horizontal lines are arranged on the conductive lines, so that the light-emitting semiconductors can be arranged in combination according to the positions of the horizontal lines, thereby designing different position patterns, and a highly integrated packaging bracket can also be designed. At the same time, by selecting ceramic as the substrate, at least one group of irregular empty grooves is also provided on the lower end surface of the ceramic substrate. While ensuring the strength of the substrate, the heat dissipation and lightness effects are taken into account. The present invention adopts a secondary resin injection process, through a process of one-time fixing and one-time connection packaging, and uses paraffin as a substrate for semiconductor positioning, so that semiconductor packages of different integration methods can all use this method. It is only necessary to design the position of the semiconductor in advance, and then multiple semiconductors can be packaged at one time, which effectively improves the efficiency of semiconductor packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic structural diagram of a concrete interception device for a concrete construction joint according to the present invention;

[0027] Figure 2 This is a schematic diagram of the use of the concrete intercepting device for concrete construction joints of the present invention;

[0028] Figure 3 It is a schematic structural diagram of the expansion mechanism of the present invention;

[0029] Figure 4 It is a schematic structural diagram of the regulating mechanism of the present invention;

[0030] Figure 5 This is a schematic structural diagram of the second injection of resin into a mold for the packaging bracket of the present invention.

[0031] In the figure: 1 ceramic substrate, 2 sealing cover, 3 conductive wire, 4 light-emitting semiconductor, 5 sealing frame. DETAILED DESCRIPTION

[0032] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and are not to be construed as limiting the present invention.

[0033] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0034] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections, or mutual communication; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0035] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0036] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0037] Example 1

[0038] An embodiment of the present invention provides a multi-lead arrangement package bracket, including a ceramic substrate 1, characterized in that: a conductive wire 3 is fixedly connected to the upper end surface of the ceramic substrate 1, at least one group of light-emitting semiconductors 4 is fixed to the upper end surface of the conductive wire 3, and a sealing cover 2 is provided on the upper end surface of the ceramic substrate 1.

[0039] In this embodiment, if Figure 2 As shown, there are two groups of conductive wires 3 symmetrically arranged on the upper end surface of the ceramic substrate 1. The conductive wires 3 include vertical lines and at least one group of horizontal lines. At least one group of horizontal lines is spaced apart on one side of the vertical lines. The horizontal lines on the two groups of conductive wires 3 are spaced apart on the upper end surface of the ceramic substrate 1. The horizontal lines on the two groups of conductive wires 3 are used as leads of the light-emitting semiconductors 4, and the horizontal lines on the two groups of conductive wires 3 are interspersed with each other, so that the light-emitting semiconductors 4 can be arranged according to the positions of the horizontal lines, and the number and positions of the light-emitting semiconductors 4 can be adjusted by the positions of the horizontal lines, and the packaging styles are more diversified.

[0040] Specifically, at least one group of irregular empty grooves is provided on the lower end surface of the ceramic substrate 1 . The thickness of the ceramic substrate 1 is 5-8 mm, and the depth of the empty grooves is 3-6 mm.

[0041] Among them, the ceramic substrate 1 is made of ceramic material. If the thickness is too thin, the substrate will be insufficient in strength and easy to break, while if the thickness is too thick, the base material will be too heavy. At the same time, the heat dissipation effect of the ceramic itself is relatively poor, and thicker thickness will also lead to poor heat dissipation effect. By setting irregular empty grooves, the weight of the packaging substrate can be reduced without affecting the structural strength of the packaging substrate. At the same time, the heat dissipation effect of the empty groove area on the packaging substrate will be stronger.

[0042] This embodiment also provides a method for preparing a multi-lead arrangement package bracket, comprising the following steps:

[0043] S1: preparing a ceramic substrate, and setting at least one set of irregular grooves on one side of the ceramic substrate;

[0044] S2: Fix the conductive wire 3 on the other side of the ceramic substrate, and then fix the sealing frame 5 on the side of the ceramic substrate where the conductive wire 3 is fixed using a fixing glue;

[0045] S3: Inject paraffin wax into the sealing frame 5, with the thickness of the paraffin wax not exceeding 3 mm;

[0046] S4: A placement groove for the light-emitting semiconductor 4 is opened on the paraffin wax according to the horizontal lines on the conductive wire 3, where the height of the paraffin wax is lower than the depth of the sealing frame 5, and then the light-emitting semiconductor 4 is placed in the placement groove;

[0047] S5: injecting resin into the sealing frame 5 so that the resin completely fills the sealing frame 5;

[0048] S6: After the resin is solidified, the light-emitting semiconductor 4 is fixed on the resin, and the solidified resin and the light-emitting semiconductor 4 are taken out together;

[0049] S7: Remove the paraffin wax and the sealing frame 5 on the upper end surface of the ceramic substrate 1, apply a layer of solder paste on the horizontal lines of the conductive wires 3, and laminate the ceramic substrate 1 to the resin with the light-emitting semiconductor 4 fixed thereon and heat them, so that the light-emitting semiconductor 4 is fixed to the horizontal lines of the conductive wires 3 through the solder paste;

[0050] S8: Place the light-emitting semiconductor 4 fixed on the horizontal line in S7 together with the ceramic substrate 1 into the mold, and inject resin into the gap between the resin and the ceramic substrate 1 again. After the resin is cured, take out the ceramic substrate 1 and polish it clean to obtain the packaging bracket.

[0051] Among them, the conductive wire 3 in S2 is embedded in one side of the ceramic substrate, and the conductive wire 3 is flush with the embedding surface of the ceramic substrate. The sealing frame 5 is fixed around the upper end surface of the ceramic substrate. At the same time, the sealing frame 5 will completely cover the vertical line on the conductive wire 3. The internal area of ​​the sealing frame 5 gradually decreases from top to bottom and then remains consistent.

[0052] By doing so, the conductive wire 3 is flush with the upper end surface of the ceramic, and compared with a protruding conductive wire 3 , the adhesion effect between the light emitting semiconductor 4 and the package substrate is better.

[0053] In this embodiment, the two sides of the placement groove in S4 are not located on the horizontal lines of the two groups of conductive wires 3 symmetrically arranged on the ceramic substrate 1, and the size of the placement groove is adapted to the light-emitting semiconductor 4. The depth of the placement groove is lower than the thickness of the light-emitting semiconductor 4. The placement groove makes it easier to place the light-emitting semiconductor 4, and the depth of the placement groove is lower than the thickness of the light-emitting semiconductor 4, which will cause part of the area of ​​the light-emitting semiconductor 4 to be exposed to the outside, so that after the resin is injected, the area of ​​the light-emitting semiconductor 4 exposed to the outside will be fixed vertically.

[0054] Among them, the thickness of the paraffin in S3 is lower than the thickness of the light-emitting semiconductor 4, and the area of ​​the light-emitting semiconductor 4 exposed outside the placement groove is no higher than 1 / 3 of the thickness of the light-emitting semiconductor 4, nor less than 1 / 4. Excessive exposure of the light-emitting semiconductor 4 will cause the resin to enter the placement groove too deeply, and then reduce the conductivity of the motor of the light-emitting semiconductor 4 and the conductive wire 3, while too little exposure will result in poor fixing effect between the light-emitting semiconductor 4 and the resin.

[0055] In this embodiment, the method of removing the paraffin and the sealing frame 5 in S7 is specifically to first remove the sealing frame 5, and then remove the paraffin by heating. During heating, the surface on which the conductive wire 3 is set is placed vertically, and the ceramic substrate 1 is placed vertically, and the conductive wire 3 is flush with the surface of the ceramic substrate 1, so that the paraffin will flow away naturally after heating. When necessary, a cleaning brush can be used to clean the piece of ceramic substrate 1 where the conductive wire 3 is set, and the flowing paraffin can be collected and reused.

[0056] The brush used to clean the surface of the ceramic substrate 1 must have bristles that are soft enough and strong enough, and when applying solder paste to the surface of the conductive wire 3 , the position of the solder paste is the position of the original placement groove.

[0057] In this embodiment, the position where the light-emitting semiconductor 4 is fixed on the conductive wire 3 in S7 is the same as the position of the light-emitting semiconductor 4 in the placement groove, so that when the light-emitting semiconductor 4 is fixed to the ceramic substrate 1, the two electrodes of the light-emitting semiconductor 4 are respectively placed on the horizontal lines of the two groups of conductive wires 3.

[0058] As shown in FIG8 , the second injection of resin into the package bracket through the mold in S8 is as follows: a placement groove for the package bracket is provided on the mold, and a removal port is provided on the top of the inner walls on both sides of the placement groove for facilitating removal of the mold.

[0059] Example 2

[0060] This embodiment provides a multi-lead arrangement package bracket, including a ceramic substrate 1, characterized in that: a conductive wire 3 is fixedly connected to the upper end surface of the ceramic substrate 1, at least one group of light-emitting semiconductors 4 is fixed to the upper end surface of the conductive wire 3, and a sealing cover 2 is provided on the upper end surface of the ceramic substrate 1.

[0061] In this embodiment, if Figure 2 As shown, there are two groups of conductive wires 3 symmetrically arranged on the upper end surface of the ceramic substrate 1. The conductive wires 3 include vertical lines and at least one group of horizontal lines. At least one group of horizontal lines is spaced apart on one side of the vertical lines. The horizontal lines on the two groups of conductive wires 3 are spaced apart on the upper end surface of the ceramic substrate 1. The horizontal lines on the two groups of conductive wires 3 are used as leads of the light-emitting semiconductors 4, and the horizontal lines on the two groups of conductive wires 3 are interspersed with each other, so that the light-emitting semiconductors 4 can be arranged according to the positions of the horizontal lines, and the number and positions of the light-emitting semiconductors 4 can be adjusted by the positions of the horizontal lines, and the packaging styles are more diversified.

[0062] Specifically, at least one group of irregular empty grooves is provided on the lower end surface of the ceramic substrate 1 . The thickness of the ceramic substrate 1 is 5-8 mm, and the depth of the empty grooves is 3-6 mm.

[0063] Among them, the ceramic substrate 1 is made of ceramic material. If the thickness is too thin, the substrate will be insufficient in strength and easy to break, while if the thickness is too thick, the base material will be too heavy. At the same time, the heat dissipation effect of the ceramic itself is relatively poor, and thicker thickness will also lead to poor heat dissipation effect. By setting irregular empty grooves, the weight of the packaging substrate can be reduced without affecting the structural strength of the packaging substrate. At the same time, the heat dissipation effect of the empty groove area on the packaging substrate will be stronger.

[0064] This embodiment also provides a method for preparing a multi-lead arrangement package bracket, comprising the following steps:

[0065] S1: preparing a ceramic substrate, and setting at least one set of irregular grooves on one side of the ceramic substrate;

[0066] S2: Fix the conductive wire 3 on the other side of the ceramic substrate, and then fix the sealing frame 5 on the side of the ceramic substrate where the conductive wire 3 is fixed using a fixing glue;

[0067] S3: Inject paraffin wax into the sealing frame 5, with the thickness of the paraffin wax not exceeding 3 mm;

[0068] S4: A placement groove for the light-emitting semiconductor 4 is opened on the paraffin wax according to the horizontal lines on the conductive wire 3, where the height of the paraffin wax is lower than the depth of the sealing frame 5, and then the light-emitting semiconductor 4 is placed in the placement groove;

[0069] S5: injecting resin into the sealing frame 5 so that the resin completely fills the sealing frame 5;

[0070] S6: After the resin is solidified, the light-emitting semiconductor 4 is fixed on the resin, and the solidified resin and the light-emitting semiconductor 4 are taken out together;

[0071] S7: Remove the paraffin wax and the sealing frame 5 on the upper end surface of the ceramic substrate 1, apply a layer of solder paste on the horizontal lines of the conductive wires 3, and laminate the ceramic substrate 1 to the resin with the light-emitting semiconductor 4 fixed thereon and heat them, so that the light-emitting semiconductor 4 is fixed to the horizontal lines of the conductive wires 3 through the solder paste;

[0072] S8: Place the light-emitting semiconductor 4 fixed on the horizontal line in S7 together with the ceramic substrate 1 into the mold, and inject resin into the gap between the resin and the ceramic substrate 1 again. After the resin is cured, take out the ceramic substrate 1 and polish it clean to obtain the packaging bracket.

[0073] Among them, the conductive wire 3 in S2 is embedded in one side of the ceramic substrate, and a layer of solder resist ink is coated on the other side of the ceramic except the conductive wire 3, and the conductive wire 3 is flush with the surface of the solder resist ink. The sealing frame 5 is fixed around the upper end surface of the ceramic substrate. At the same time, the sealing frame 5 will completely cover the vertical line on the conductive wire 3. The internal area of ​​the sealing frame 5 gradually decreases from top to bottom and then remains consistent.

[0074] By doing so, the conductive wires 3 are flush with the surface of the solder resist ink, and compared with protruding conductive wires 3 , the light emitting semiconductor 4 has a better adhesion effect with the package substrate.

[0075] In this embodiment, the two sides of the placement groove in S4 are not located on the horizontal lines of the two groups of conductive wires 3 symmetrically arranged on the ceramic substrate 1, and the size of the placement groove is adapted to the light-emitting semiconductor 4. The depth of the placement groove is lower than the thickness of the light-emitting semiconductor 4. The placement groove makes it easier to place the light-emitting semiconductor 4, and the depth of the placement groove is lower than the thickness of the light-emitting semiconductor 4, which will cause part of the area of ​​the light-emitting semiconductor 4 to be exposed to the outside, so that after the resin is injected, the area of ​​the light-emitting semiconductor 4 exposed to the outside will be fixed vertically.

[0076] Among them, the thickness of the paraffin in S3 is lower than the thickness of the light-emitting semiconductor 4, and the area of ​​the light-emitting semiconductor 4 exposed outside the placement groove is no higher than 1 / 3 of the thickness of the light-emitting semiconductor 4, nor less than 1 / 4. Excessive exposure of the light-emitting semiconductor 4 will cause the resin to enter the placement groove too deeply, and then reduce the conductivity of the motor of the light-emitting semiconductor 4 and the conductive wire 3, while too little exposure will result in poor fixing effect between the light-emitting semiconductor 4 and the resin.

[0077] In this embodiment, the method of removing the paraffin and the sealing frame 5 in S7 is specifically to first remove the sealing frame 5, and then remove the paraffin by heating. During heating, the surface on which the conductive wire 3 is set is placed vertically. By vertically placing the ceramic substrate 1, the conductive wire 3 is flush with the surface of the ceramic substrate 1, so that the paraffin will flow away naturally after heating. When necessary, a cleaning brush can be used to clean the piece of the ceramic substrate 1 where the conductive wire 3 is set.

[0078] The brush used to clean the surface of the ceramic substrate 1 must have bristles that are soft enough and strong enough, and when applying solder paste to the surface of the conductive wire 3 , the position of the solder paste is the position of the original placement groove.

[0079] In this embodiment, the position where the light-emitting semiconductor 4 is fixed on the conductive wire 3 in S7 is the same as the position of the light-emitting semiconductor 4 in the placement groove, so that when the light-emitting semiconductor 4 is fixed to the ceramic substrate 1, the two electrodes of the light-emitting semiconductor 4 are respectively placed on the horizontal lines of the two groups of conductive wires 3.

[0080] As shown in FIG8 , the second injection of resin into the package bracket through the mold in S8 is as follows: a placement groove for the package bracket is provided on the mold, and a removal port is provided on the top of the inner walls on both sides of the placement groove for facilitating removal of the mold.

[0081] In summary, the present invention provides a multi-lead arrangement type packaging bracket, which arranges two groups of conductive wires 3 on the upper end surface of a ceramic substrate 1, wherein the horizontal lines on the two groups of conductive wires 3 are interspersed with each other, and at least one group of horizontal lines is arranged on the conductive wires 3, so that the light-emitting semiconductors 4 can be arranged in combination according to the positions of the horizontal lines, thereby designing different position patterns, and a highly integrated packaging bracket can also be designed. At the same time, by selecting ceramic as the substrate, at least one group of irregular empty grooves is also provided on the lower end surface of the ceramic substrate 1. While ensuring the strength of the substrate wall, the heat dissipation and lightness effects are taken into account. In addition, the present invention adopts a secondary resin injection process, through a one-time fixing and one-time connection packaging process, and uses paraffin as a substrate for semiconductor positioning, so that semiconductor packages of different integration methods can all use this method. It is only necessary to design the position of the semiconductor in advance, and multiple semiconductors can be packaged at one time, which effectively improves the efficiency of semiconductor packaging.

[0082] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A method for preparing a multi-lead arrangement package bracket, comprising a ceramic substrate (1), characterized in that: The upper end surface of the ceramic substrate (1) is fixedly connected to a conductive wire (3), the upper end surface of the conductive wire (3) is fixed with at least one group of light-emitting semiconductors (4), and the upper end surface of the ceramic substrate (1) is provided with a sealing cover (2); The method for preparing the multi-lead arrangement package bracket comprises the following steps: S1: preparing a ceramic substrate, and setting at least one set of irregular grooves on one side of the ceramic substrate; S2: fixing the conductive wire (3) on the other side of the ceramic substrate, and then fixing the sealing frame (5) on the side of the ceramic substrate where the conductive wire (3) is fixed by means of a fixing glue; S3: Inject paraffin wax into the sealing frame (5), the thickness of the paraffin wax is not more than 3mm; S4: through the paraffin wax according to the horizontal line on the conductive line (3), the height of the paraffin wax is lower than the depth of the sealing frame (5), and a placement groove for the light-emitting semiconductor (4) is opened on the paraffin wax, and then the light-emitting semiconductor (4) is placed in the placement groove; S5: injecting resin into the interior of the sealing frame (5) so that the resin completely fills the interior of the sealing frame (5); S6: After the resin is solidified, the light-emitting semiconductor (4) is fixed on the resin, and the solidified resin and the light-emitting semiconductor (4) are taken out together; S7: removing the paraffin wax and the sealing frame (5) on the upper end surface of the ceramic substrate (1), applying a layer of solder paste on the horizontal line of the conductive wire (3), laminating the ceramic substrate (1) with the resin on which the light-emitting semiconductor (4) is fixed, and heating the resin so that the light-emitting semiconductor (4) is fixed on the horizontal line of the conductive wire (3) through the solder paste; S8: Place the light-emitting semiconductor (4) fixed on the horizontal line in S7 together with the ceramic substrate (1) into the mold, and inject resin into the gap between the resin and the ceramic substrate (1) again. After the resin is solidified, take out the ceramic substrate (1) and polish it clean to obtain the packaging bracket.

2. The method for preparing a multi-lead arrangement package bracket according to claim 1, characterized in that: There are two groups of conductive lines (3) symmetrically arranged on the upper end surface of the ceramic substrate (1), the conductive lines (3) comprising vertical lines and at least one group of horizontal lines, the at least one group of horizontal lines being spaced apart on one side of the vertical lines, and the horizontal lines on the two groups of conductive lines (3) being spaced apart on the upper end surface of the ceramic substrate (1).

3. The method for preparing a multi-lead arrangement package bracket according to claim 1, characterized in that: The lower end surface of the ceramic substrate (1) is provided with at least one group of irregular empty grooves, the thickness of the ceramic substrate (1) is 5-8 mm, and the depth of the empty grooves is 3-6 mm.

4. The method for preparing a multi-lead arrangement package bracket according to claim 1, characterized in that: The conductive wire (3) in S2 is embedded in one side of the ceramic substrate, and the conductive wire (3) is flush with the embedding surface of the ceramic substrate.

5. The method for preparing a multi-lead arrangement package bracket according to claim 4, characterized in that: The sealing frame (5) is fixed around the upper end surface of the ceramic substrate. At the same time, the sealing frame (5) completely covers the vertical lines on the conductive lines (3). The internal area of ​​the sealing frame (5) gradually decreases from top to bottom and then remains consistent.

6. The method for preparing a multi-lead arrangement package bracket according to claim 1, characterized in that: The two sides of the placement groove in S4 are respectively on the horizontal lines of two groups of conductive lines (3) symmetrically arranged on the ceramic substrate (1), and the size of the placement groove is adapted to the light-emitting semiconductor (4), and the depth of the placement groove is lower than the thickness of the light-emitting semiconductor (4).

7. The method for preparing a multi-lead arrangement package bracket according to claim 1, characterized in that: The method of removing the paraffin and the sealing frame (5) in S7 is specifically to first remove the sealing frame (5), and then remove the paraffin by heating, and during heating, the surface on which the conductive wire (3) is set is placed vertically.

8. The method for preparing a multi-lead arrangement package bracket according to claim 1, characterized in that: In the aforementioned S7, the position where the light-emitting semiconductor (4) is fixed on the conductive wire (3) is the same as the position where the light-emitting semiconductor (4) is placed in the groove.

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