Integrated circuit devices for smart image sensor stacking and solid-state drivers including integrated circuit devices
By integrating image sensors and artificial intelligence engines through integrated circuit devices, local image processing and inference are performed, solving the problem of high bandwidth for image data transmission in autonomous driving systems and achieving efficient transmission of image analysis and inference results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- MICRON TECHNOLOGY INC
- Filing Date
- 2020-11-03
- Publication Date
- 2026-05-26
AI Technical Summary
Existing autonomous driving systems require a large amount of image data to be transmitted to the host system for processing, resulting in high communication bandwidth requirements and increased computational load, which affects system efficiency.
The system employs integrated circuit devices to integrate image sensors, image signal processing circuits, and artificial intelligence engines. These are connected via high-bandwidth interconnects to perform local image processing and inference. After generating the inference results, only a small amount of data is transmitted to the host system.
It reduces the communication bandwidth requirements of the host system, improves processing efficiency, reduces computational load, and supports highly accurate and efficient image analysis.
Smart Images

Figure CN114730493B_ABST