Systems and methods for manufacturing an electronic device housing

Abstract

A method of manufacturing an electronic device housing, comprising: obtaining a monolithic body of an RF transparent material; and coating a surface of the monolithic body with a nanocrystalline coating to increase the structural rigidity of the monolithic body. Thereafter, a portion of the nanocrystalline coating is removed to create an RF window.

Description

Background Art

[0001] High-stiffness materials, such as metals and plastics reinforced with high glass fiber and / or carbon fiber loading, are used to fabricate conventional housings for consumer electronic products. However, these materials are conductive or have undesirable dielectric properties and / or poor radio frequency (RF) transparency. To achieve desired RF performance, plastics with low dielectric constant and low dissipation factor are used to mold antenna windows. These plastics are conventionally pure resins or have low fiber content, which results in low stiffness of these components. These plastics do not have sufficient strength, modulus, and other mechanical properties to be used for molding the main housing of consumer electronic products. The high-stiffness metal or plastic main housing and the low-stiffness but RF-transparent antenna window are connected by nano-molding, insert molding, or gluing, which are complex and expensive processes and result in lower mechanical and appearance quality. Summary of the Invention

[0002] In some embodiments, an electronic device includes a radio frequency (RF) wireless communication device. The RF communication device transmits and receives RF signals through a portion of the electronic device housing. The RF transparent material lacks the structural rigidity to support and protect the electronic components of the electronic device. Cutting or molding holes in the housing to allow RF signals to enter and exit the housing is structurally and aesthetically undesirable.

[0003] In some embodiments, a method of manufacturing an electronic device housing includes: obtaining a monolithic body of RF transparent material; and coating a surface of the monolithic body with a nanocrystalline coating to increase the structural rigidity of the monolithic body. Thereafter, a portion of the nanocrystalline coating is removed to create an RF window.

[0004] In some embodiments, an electronic device includes: a monolithic body of RF transparent material and a nanocrystalline coating positioned on an outer surface of the monolithic body. The monolithic body at least partially defines an interior volume of the electronic device, and the RF wireless communication device is positioned within the interior volume. An RF window of the monolithic body is positioned near the communication device. The RF window is a portion of the monolithic body where the nanocrystalline coating does not exist on the outer surface of the RF transparent material.

[0005] This disclosure is provided to introduce a selected group of concepts that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to help determine the scope of the claimed subject matter.

[0006] Additional features and advantages will be set forth in the following description, and in part will be obvious from the description, or may be learned by practice of the teachings herein. The features and advantages of the present disclosure may be realized and obtained by means of the instrumentalities and combinations particularly pointed out hereinafter. The features of the present disclosure will become more fully apparent from the following description or may be learned by the practice of the present disclosure as set forth hereinafter. Brief Description of the Drawings

[0008] To describe the manner in which the above-recited and other features of the present disclosure can be obtained, a more particular description will be presented by reference to the specific embodiments thereof illustrated in the accompanying drawings. For better understanding, throughout the drawings, like elements have been designated by like reference numerals. Although some of the drawings may be schematic or exaggerated representations of concepts, at least some of the drawings may be drawn to scale. It is understood that the drawings depict some example embodiments, which will be described and explained with additional features and details by using the drawings, in which:

[0009] Figure 1 is a perspective view of an electronic device according to at least one embodiment of the present disclosure;

[0010] Figure 2 is a flowchart of a method of manufacturing an electronic device housing according to at least one embodiment of the present disclosure;

[0011] Figure 3 is a schematic illustration of a plating process according to at least one embodiment of the present disclosure;

[0012] Figure 4 is a graph illustrating the rigidity comparison of coated and uncoated panels according to at least one embodiment of the present disclosure;

[0013] Figure 5 is a flowchart of another method of manufacturing an electronic device housing according to at least one embodiment of the present disclosure;

[0014] Figure 6-1 is a top view of a laser-etched nanocrystalline coating on an electronic device housing according to at least one embodiment of the present disclosure;

[0015] Figure 6-2 is according to at least one embodiment of the present disclosure Figure 6-1 is a bottom view of an uncoated connection point of an electronic device housing;

[0016] Figure 6-3 is a perspective view of a plurality of monoliths having a conductive coating material thereon according to at least one embodiment of the present disclosure;

[0017] Figure 7 is a flowchart illustrating yet another method of manufacturing an electronic device housing according to at least one embodiment of the present disclosure; and

[0018] Figure 8 is a top view of masking an RF window by a nanograin coating on an electronic device housing according to at least one embodiment of the present disclosure. Detailed Description

[0019] The present disclosure generally relates to apparatuses, systems, and methods for manufacturing an electronic device having a radio frequency (RF) transparent window in a housing of the electronic device. More specifically, the present disclosure relates to systems and methods for manufacturing an electronic device housing having an RF window without cutting, ablating, or otherwise penetrating a structural panel of the housing.

[0020] In some embodiments, an electronic device has a housing including one or more body panels. Each body panel partially defines an interior volume of the electronic device, and when the body panels are assembled, the interior volume can contain various electronic components of the electronic device. In some embodiments, the electronic components can be damaged by exposure to an electromagnetic (EM) field and / or the operation of the electronic components can be adversely affected by exposure to the EM field. In some embodiments, the body panels provide EM shielding to the electronic components. In other embodiments, the body panels include an RF transparent material, and a coating is applied to a surface of the RF transparent material to provide EM shielding to the electronic components.

[0021] In some embodiments, a communication device of the electronic device is configured to wirelessly communicate with other communication devices via RF signals broadcast and received by the communication device through a portion of the electronic device housing. The communication device is located within the interior volume, and the RF signals broadcast and received by the communication device pass through the RF window in the housing. In some embodiments, the RF window in the housing is a part of the body panel where the RF transparent material is continuous to provide structural support and strength to the electronic device, while there is no coating adjacent to the RF window of the communication device to allow the RF signals to pass through the body panel.

[0022] Figure 1 is a perspective view of an embodiment of a computing device according to the present disclosure. In some embodiments, the computing device 100 has a plurality of hardware components in communication with a thermal module. In some embodiments, the computing device 100 is a laptop device as Figure 1 illustrated. In some embodiments, the computing device is a tablet computing device, a hybrid computing device, a desktop computing device, a server computing device, a wearable computing device (e.g., a smart watch, a head-mounted device, or other wearable device), a smart appliance (e.g., a smart TV, a digital personal assistant or hub, an audio system, a home entertainment system, a home automation system, an in-vehicle infotainment system), or other computer device.

[0023] In some embodiments, computing device 100 has a first portion 102 and a second portion 104 that are movably connected to each other. Computing device 100 includes various components located in one or more portions of computing device 100 that are in data communication via one or more buses and interfaces. In some embodiments, a thermal module establishes and uses two-way communication with one or more components. Examples of components include processors 106, input devices 108, displays 110, hardware storage devices 112, communication devices 114, and other components.

[0024] In some embodiments, processors 106 are central processing units (CPUs) that perform general computing tasks for computing device 100. In some embodiments, processors 106 are system-on-a-chip (SoC) or a part of a system-on-a-chip (SoC) dedicated to controlling or communicating with one or more subsystems of computing device 100.

[0025] In some embodiments, displays 110 are liquid crystal displays (LCDs), light-emitting diode (LED) displays, thin film transistor (TFT) displays, cathode ray tube (CRT) displays, or other displays. In some embodiments, display 110 is integrated into computing device 100, such as Figure 1 illustrated in the embodiments of. In some embodiments, display 110 is a separate monitor or other display in wired or wireless data communication with computing device 100.

[0026] In some embodiments, input devices 108 are mice, styli, touchpads, touch-sensitive devices, touch-sensitive displays, keyboards, or other input human-machine interface devices. In some embodiments, input devices 108 are part of computing device 100, such as a touchpad or a keyboard. In some embodiments, input devices 108 are separate devices in data communication with computing device 100, such as a stylus in wireless data communication with computing device 100.

[0027] In some embodiments, hardware storage devices 112 are non-transitory storage devices, including RAM, ROM, EEPROM, CD-ROM, or other optical disk memories (such as CDs, DVDs, etc.), magnetic disk memories, or other magnetic storage devices, or any other medium that can be used to store desired program code means in the form of computer-executable instructions or data structures and can be accessed by a general or special-purpose computer.

[0028] Processor 106, hardware storage device 112, control hardware for input device 108 and / or display 110, and other electronic components of electronic device 100 may be adversely affected by exposure to an EM field. In some embodiments, the structural panels of the first portion 102 and / or the second portion 104 have an EM shielding coating positioned thereon that provides EM shielding to the components located within the interior volume of the first portion 102 and / or the second portion 104.

[0029] In some embodiments, the communication device(s) 114 is in data communication with the processor(s) 106 to permit communication with one or more external computing devices, networks, or components. In some embodiments, the communication device is a network communication device, such as a wireless (e.g., WiFi) antenna. In some embodiments, the communication device is a short-range wireless communication that permits data communication between computing device 100 and an electronic device in the vicinity of computing device 100, such as a Bluetooth connection or a WiFi direct connection. In some embodiments, the communication device is a near field communication (NFC) device for wireless charging of data communication, other components, and / or accessory devices, or both. In some embodiments, an RF window 116 in the first portion 102 and / or the second portion 104 permits the communication device 114 to broadcast and receive RF signals through the housing of the electronic device 100.

[0030] Now referring Figure 2 , in some embodiments, a method 218 of manufacturing an electronic device includes obtaining (220) a monolithic body. In some embodiments, the monolithic body is a main panel of an electronic device housing. In some embodiments, the monolithic body is the entire electronic device housing. In some embodiments, the monolithic body is a continuous sheet of RF transparent material. The RF transparent material is continuous throughout the monolithic body. In some embodiments, the monolithic body has at least one hole extending from a first surface through the monolithic body to an opposing second surface. In some embodiments, the monolithic body is a first main panel of an electronic device housing and has at least one structural post thereon to permit connection to a second main panel of the electronic device housing.

[0031] In some embodiments, obtaining the monolithic body includes injection molding the monolithic body. The RF transparent material may be a polymer that is plastic at an elevated temperature and facilitates injection molding. In some embodiments, obtaining the monolithic body includes machining the monolithic body from a blank or other precursor of the RF transparent material. In some embodiments, obtaining the monolithic body includes forming, stamping, or forging the monolithic body from a sheet or panel of the RF transparent material. In at least some embodiments, obtaining the monolithic body includes injection molding the RF transparent material to a near-finished state and subsequently machining a portion of the RF transparent material from the near-finished state to produce the monolithic body.

[0032] In some embodiments, the RF transparent material is a thermoplastic polymer. In some embodiments, the RF transparent material is acrylonitrile butadiene styrene (ABS). In some embodiments, the ABS is fiber - loaded ABS. In some embodiments, the RF transparent material is not directly electro - plateable but can be metallized by electroless plating or other chemical seeding methods to make the substrate electro - plateable.

[0033] The method further includes plating (222) the surface of the monolith with a conductive coating. In some embodiments, the conductive coating is a nanocrystalline coating, wherein the average grain size of the coating material is less than 1 micrometer, less than 100 nanometers (nm), or less than 10 nm. In some embodiments, the conductive coating is a metal coating including grains of a metal or a metal alloy. In some embodiments, the conductive coating includes cobalt, nickel, or a combination thereof.

[0034] In some embodiments, compared to a coating with a larger grain size and equivalent thickness, the nanocrystalline coating provides a smoother outer surface with less surface undulation and / or texture. In some embodiments, the nanocrystalline coating provides an outer surface with surface undulation and / or texture equivalent to a coating with a larger grain size and a smaller coating thickness. In some embodiments, compared to a coating with a larger grain size, the nanocrystalline coating exhibits a more random grain orientation in a thin coating. The more random grain orientation allows for more isotropic material properties for the coating, and the nanocrystalline coating can exhibit less warping compared to a coating with a larger grain size.

[0035] In some embodiments, the nanocrystalline coating exhibits improved durability and stability relative to conventional plating of similar or the same materials. In some embodiments, relative to a coating with a larger grain size, the nanocrystalline coating exhibits improved thermal stability, improved solar radiation stability, lower porosity, improved tensile strength, lower thermal expansion, and other improved bulk material properties.

[0036] Nickel coatings can trigger allergic reactions in some people. In some embodiments, the nanocrystalline coating according to the present disclosure includes cobalt. The cobalt nanocrystalline coating maintains the mechanical properties disclosed herein while avoiding allergic reactions of users to nickel.

[0037] In some embodiments, it is aesthetically and / or functionally desirable for the monolithic body to be continuous through the RF window. For example, the region of the monolithic body adjacent to the communication device can be structurally important for the rigidity of the electronic device housing. In other examples, the region of the monolithic body adjacent to the communication device can be a visually prominent part of the electronic device, such as the bezel of a display cover, the surface near an input device, or other regions that are conspicuous when using the device and would distract the user with an obvious gap, seam, or other discontinuity in the electronic device housing.

[0038] To allow the communication device to transmit and receive RF signals through the RF window, the coating is removed (224) from the RF window while maintaining the integrity of the monolithic body and the RF-transparent material beneath the coating in the monolithic body. In some embodiments, the coating is removed by ablating or mechanically removing the coating from the monolithic body. For example, the coating can be ablated by a laser, an ion beam, or other energy particle streams. In at least one example, the coating is removed by laser etching the coating from the monolithic body. In some examples, the coating is mechanically removed by friction or erosion of the coating. For example, the coating can be removed by a grinding wheel or belt (such as sandpaper), or the coating can be removed by a stream of abrasive material (such as sandblasting).

[0039] In some embodiments, a masking material is applied to the RF window region of the monolithic body before the coating is applied. After the coating is applied to the surface of the monolithic body and the masking material, the masking material is removed from the surface of the monolithic body. Thus, removing the masking material removes the portion of the coating that was applied over the masking material. In some embodiments, a combination of removal methods is used. In at least one embodiment, the coating at the perimeter edge of the masking material is etched or ablated to create a precise discontinuity (e.g., a boundary) around the masking material, and the masking material is then lifted from the surface of the monolithic body. The initial etching or ablation of the coating allows the removal of the masking material and the coating on the masking material without inadvertently removing the adjacent coating outside the RF window region. In some cases, masking can be accomplished using a metal fixture. The fixture can be plated for conductive purposes. In some embodiments, one or more metal masks are used as auxiliary electrodes or electrical shields, which reduce or shield the electric field and prevent metal ions from depositing or plating on the RF window region. After plating, the fixture can be removed to leave the RF window region unplated.

[0040] In some embodiments, the application of the coating includes shaping the RF-transparent material into a near-final shape of the monolithic body. For example, Figure 3An embodiment of a plating method for an RF transparent material 326 is described. The surface of the monolithic body is then chemically etched to provide a surface texture and / or location 328 to which a first material 330 can be applied. In some embodiments, the first material 330 is a metal. In at least one example, the first material 330 is cobalt or a cobalt alloy. The first material 330 is applied in an electroless application that allows the first material 330 to bond to the RF transparent material 326. In some embodiments, the RF transparent material 326 is a non-conductive polymer that is incompatible with electrodeposition. In some embodiments, the RF transparent material 326 is a non-conductive polymer, but the polymer can be plated. For example, ABS has polybutadiene double bonds that allow electroplating.

[0041] In some embodiments, the plating method further includes using electrodeposition to deposit a second material 332 on the first material 330. For example, the second material 332 can be a second metal electrodeposited on the first material. In some embodiments, the second material 332 has a thickness of approximately 5 - 10 micrometers (μm). In some embodiments, the second material 332 has a thickness greater than 10 μm or less than 5 μm. The second material 332 provides a substantially flat and continuous surface, on which a nanocrystalline coating material 334 is then applied.

[0042] In some embodiments, the nanocrystalline coating material 334 has a thickness within a range having an upper limit value, a lower limit value, or both an upper limit value and a lower limit value, where the upper limit value or lower limit value includes any one of 2 μm, 5 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm or any value therebetween. In some examples, the nanocrystalline coating material 334 has a thickness greater than 2 μm. In some examples, the nanocrystalline coating material 334 has a thickness less than 100 μm. In some examples, the nanocrystalline coating material 334 has a thickness between 2 μm and 100 μm.

[0043] In some embodiments, the nanocrystalline coating material 334 has an average grain size less than 50 nanometers (nm). In some embodiments, the nanocrystalline coating material 334 has an average grain size less than 25 nm. In some embodiments, the nanocrystalline coating material 334 has an average grain size less than 15 nm. In some embodiments, the nanocrystalline coating material 334 has an average grain size less than 10 nm. In some embodiments, the nanocrystalline coating material 334 has an average grain size less than 5 nm.

[0044] In some embodiments, the nanocrystalline coating is applied by physical vapor deposition (PVD). In some embodiments, the nanocrystalline coating is applied by chemical vapor deposition (CVD). In some embodiments, the nanocrystalline coating is applied by plasma enhanced deposition. In some embodiments, the nanocrystalline coating is applied by electroplating in a fluid.

[0045] The nanocrystalline coating increases the strength of the monolith by supporting the structure and reducing the deformation of the main panel under force. In some embodiments, when coated with a nanocrystalline coating between 30 μm and 50 μm, the panel of the RF transparent material is 5-10 times stronger (e.g., resistant to deformation under force). Thus, the monolithic panel can be molded or formed from the RF transparent material into a near-finished state and then reinforced by applying the nanocrystalline coating. As Figure 4 illustrated in the graph of, in at least one test example, the deformation exhibited by the ABS monolith with the nanocrystalline coating at 4.9 Newtons of force is half of the deformation exhibited by the uncoated ABS monolith at less than 1.0 Newton of force.

[0046] In some embodiments, method 418 of manufacturing an electronic device housing includes injection molding (436) a monolith including an RF transparent material. The surface of the injection molded monolith is then coated (438) with a nanocrystalline metal coating. In some embodiments, the method further includes etching (440) a portion of the nanocrystalline coating at the RF window with a laser or other excitation beam.

[0047] Now referring to Figure 6-1 , in some embodiments, the nanocrystalline coating material 534 is etched using a laser 542 to remove the nanocrystalline coating material 534 in the RF window region 544 from the RF transparent material 526 without penetrating the RF transparent material 526. In this way, the monolith 546 remains structurally continuous throughout the RF window 516, thus providing strength and aesthetic improvements to the conventional holes through the RF transparent material 526.

[0048] In some embodiments, the nanocrystalline coating material 534 is conductive. The conductivity can provide a ground path for electronic components in the internal volume of the monolith 546. In some examples, different panels of the electronic device housing can be electrically insulated from each other. As Figure 6-2As explained in [[ID=]], in such embodiments, one or more connection points 548 of the monolithic body 546 (e.g., the points where the monolithic body 546 is connected to other body panels and / or electronic components such as a motherboard or a power supply) have had the nanocrystalline coating material 534 removed. In some embodiments, the nanocrystalline coating material 534 on the posts applied to the inner surface of the monolithic body 546 is etched or masked to remove the nanocrystalline coating from the posts, thereby electrically insulating the coated monolithic body 546 through the posts. In other embodiments, other connection points 548 of the monolithic body 546 are etched or masked to remove the nanocrystalline coating material 534 and electrically insulate the attached electronic components from the coated monolithic body 546.

[0049] In some embodiments, the nanocrystalline coating material 534 can provide electrical conductivity between the panels of the electronic device housing. Figure 6-3 is a perspective view of the base of the electronic device 500. In some embodiments, the electronic device 500 includes at least a first monolithic body 546-1 (e.g., the monolithic body 546 described with respect to Figure 6-1 and 6-2 and a second monolithic body 546-2. The nanocrystalline coating material 534 is positioned on the surfaces of the first monolithic body 546-1 and the second monolithic body 546-2. In some embodiments, the nanocrystalline coating material 534 provides electrical conductivity between the first monolithic body 546-1 and the second monolithic body 546-2 (e.g., for RF shielding and / or electrical grounding).

[0050] In some embodiments, the first monolithic body 546-1 and the second monolithic body 546-2 are plated separately, and subsequent contact of the nanocrystalline coating material 534 allows electrical conductivity therebetween. In some embodiments, the first monolithic body 546-1 and the second monolithic body 546-2 are positioned adjacent to and in contact with each other before the nanocrystalline coating material 534 is plated on the surfaces of the first monolithic body 546-1 and the second monolithic body 546-2 to create a continuous surface of the nanocrystalline coating material 534 that is electrically conductive as a whole.

[0051] Now referring to Figure 7 , in some embodiments, a method 618 of manufacturing an electronic device housing includes: injection molding (636) a monolithic body of an RF transparent material; and masking (648) the RF window of the monolithic body with a masking material. In some embodiments, the masking material is masking tape or other solid material. In some embodiments, the masking material is masking oil or other fluid.

[0052] The method further includes plating (638) the monolithic body with at least a portion of a nanocrystalline metallic coating and a masking material. The method then includes removing (650) the masking material from the RF window region to create an RF window through the nanocrystalline metallic coating without penetrating the RF transparent material.

[0053] Figure 8 FIG. 4 is a top view of an embodiment of a monolithic body 746 having a masked RF window region 744. A nanocrystalline coating material 734 is applied to at least a portion of an RF transparent material 726 and a masking material 752. The masking material 752 is lifted from the RF transparent material 726 to create an RF window 716. In some embodiments, the monolithic body 746 has a single RF window 716. In other embodiments, the monolithic body 746 has multiple RF windows 716. In some embodiments, the perimeter 754 of the RF window 716 is etched to facilitate removal of the masking material 752. Removal of the masking material 752 can have a lesser chance of damaging the coating material 734 adjacent to the masking material 752 and outside of the RF window 716 by etching or ablating through the coating material 734 or through a portion of the thickness of the coating material 734 around the perimeter 754 of the masking material 752.

[0054] Industrial Applicability

[0055] The present disclosure generally relates to systems and methods for manufacturing an electronic device housing that is stronger and more aesthetically pleasing to a user than a conventional housing. A body panel of a housing according to the present disclosure includes a monolithic body having RF windows that do not have holes through the RF transparent material of the monolithic body. By providing an RF window through a coating material, RF signals can pass through the RF transparent material while the body panel remains continuous throughout the RF window and adjacent regions for strength and appearance.

[0056] In some embodiments, a method of manufacturing an electronic device includes obtaining a monolithic body. In some embodiments, the monolithic body is a body panel of an electronic device housing. In some embodiments, the monolithic body is the entire electronic device housing. In some embodiments, the monolithic body is a continuous sheet of RF transparent material. The RF transparent material is continuous throughout the monolithic body. In some embodiments, the monolithic body has at least one hole extending through the monolithic body from a first surface to an opposite second surface. In some embodiments, the monolithic body is a first body panel of an electronic device housing and has at least one structural post thereon to allow connection to a second body panel of the electronic device housing.

[0057] In some embodiments, obtaining the monolithic body includes injection molding the monolithic body. The RF transparent material can be a polymer that is plastic at elevated temperatures and facilitates injection molding. In some embodiments, obtaining the monolithic body includes machining the monolithic body from a blank or other precursor of the RF transparent material. In at least some embodiments, obtaining the monolithic body includes injection molding the RF transparent material to a near - finished state and then machining a portion of the RF transparent material from the near - finished state to produce the monolithic body.

[0058] In some embodiments, the RF transparent material is a thermoplastic polymer. In some embodiments, the RF transparent material is acrylonitrile butadiene styrene (ABS). In some embodiments, the ABS is fiber - loaded ABS.

[0059] The method further includes plating the surface of the monolithic body with a conductive coating. In some embodiments, the conductive coating is a nanocrystalline coating, where the average grain size of the coating material is less than 1 micron. In some embodiments, the conductive coating is a metal coating including metal or metal alloy grains. In some embodiments, the conductive coating includes cobalt, nickel, or a combination thereof.

[0060] In some embodiments, compared to a coating with a larger grain size and equivalent thickness, the nanocrystalline coating provides a smoother outer surface with less surface undulation and / or texture. In some embodiments, the nanocrystalline coating provides an outer surface with surface undulation and / or texture equivalent to a coating with a larger grain size and a smaller coating thickness. In some embodiments, compared to a coating with a larger grain size, the nanocrystalline coating exhibits a more random grain orientation in thin coatings. The more random grain orientation allows for more isotropic material properties for the coating, and the nanocrystalline coating may exhibit less warping compared to a coating with a larger grain size.

[0061] In some embodiments, the nanocrystalline coating exhibits improved durability and stability compared to conventional plating of similar or the same materials. In some embodiments, compared to a coating with a larger grain size, the nanocrystalline coating exhibits improved thermal stability, improved solar radiation stability, lower porosity, improved tensile strength, lower thermal expansion, and other improved bulk material properties.

[0062] Nickel coatings can trigger allergic reactions in some people. In some embodiments, the nanocrystalline coating according to the present disclosure includes cobalt. The cobalt nanocrystalline coating maintains the mechanical properties disclosed herein while avoiding allergic reactions of users to nickel.

[0063] In some embodiments, it is aesthetically and / or functionally desirable for the monolithic body to be continuous through the RF window. For example, the area of the monolithic body adjacent to the communication device may be structurally important for the rigidity of the electronic device housing. In other examples, the area of the monolithic body adjacent to the communication device may be a visually prominent part of the electronic device, such as the bezel of a display cover, the surface near an input device, or other areas that are prominent when using the device and would distract the user with an obvious gap, seam, or other discontinuity in the electronic device housing.

[0064] To allow the communication device to transmit and receive RF signals through the RF window, the coating is removed from the RF window while maintaining the integrity of the monolithic body and the RF-transparent material beneath the coating. In some embodiments, the coating is removed by ablating or mechanically removing the coating from the monolithic body. For example, the coating can be ablated by a laser, an ion beam, or other energy particle stream. In at least one example, the coating is removed by laser etching the coating from the monolithic body. In some examples, the coating is mechanically removed by friction or erosion of the coating. For example, the coating can be removed by a grinding wheel or belt (such as sandpaper), or the coating can be removed by a stream of abrasive material (such as sandblasting).

[0065] In some embodiments, a masking material is applied to the RF window area of the monolithic body before the coating is applied. After the coating is applied to the surface of the monolithic body and the masking material, the masking material is removed from the surface of the monolithic body. Thus, removal of the masking material removes the portion of the coating that was applied over the masking material. In some embodiments, a combination of removal methods is used. In at least one embodiment, the coating at the perimeter edge of the masking material is etched or ablated to create a precise discontinuity (e.g., a boundary) around the masking material, and the masking material is then lifted from the surface of the monolithic body. The initial etching or ablation of the coating allows removal of the masking material and the coating on the masking material without inadvertently removing the adjacent coating outside the RF area. In some cases, masking can be accomplished using a metal fixture. The fixture can be plated for conductive purposes. In some embodiments, one or more metal masks are used as auxiliary electrodes or electrical shields, which reduces or shields the electric field and prevents metal ions from depositing or plating on the RF window area. After plating, the fixture can be removed to leave the RF window area unplated.

[0066] In some embodiments, the application of the coating includes shaping an RF transparent material into a near - finished shape of a monolithic body. The surface of the monolithic body is then chemically etched to provide a surface texture and / or location to which a first material can be applied. In some embodiments, the first material is a metal. In at least one example, the first material is cobalt or a cobalt alloy. The first material is applied in an electroless application that allows the first material to bond to the RF transparent material. In some embodiments, the RF transparent material is a polymer that is non - conductive and incompatible with electrodeposition. In some embodiments, the RF transparent material 326 is a non - conductive polymer, but the polymer can be plated. For example, ABS has polybutadiene double bonds that allow electroplating.

[0067] In some embodiments, the plating method further includes using electrodeposition to deposit a second material on the first material. For example, the second material can be a second metal electrodeposited on the first material. In some embodiments, the second material has a thickness of approximately 5 - 10 micrometers (μm). In some embodiments, the second material has a thickness greater than 10μm or less than 5μm. The second material provides a substantially flat and continuous surface, on which a nanocrystalline coating is then applied.

[0068] In some embodiments, the nanocrystalline coating has a thickness within a range having an upper limit value, a lower limit value, or both an upper limit value and a lower limit value, where the upper limit value or lower limit value includes any one of 2μm, 5μm, 10μm, 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, 100μm or any value therebetween. In some examples, the nanocrystalline coating has a thickness greater than 2μm. In some examples, the nanocrystalline coating has a thickness less than 100μm. In some examples, the nanocrystalline coating has a thickness between 2μm and 100μm.

[0069] In some embodiments, the nanocrystalline coating has an average grain size less than 50 nanometers (nm). In some embodiments, the nanocrystalline coating has an average grain size less than 25nm. In some embodiments, the nanocrystalline coating has an average grain size less than 15nm. In some embodiments, the nanocrystalline coating has an average grain size less than 10nm. In some embodiments, the nanocrystalline coating has an average grain size less than 5nm.

[0070] In some embodiments, the nanocrystalline coating is applied by physical vapor deposition (PVD). In some embodiments, the nanocrystalline coating is applied by chemical vapor deposition (CVD). In some embodiments, the nanocrystalline coating is applied by plasma - enhanced deposition. In some embodiments, the nanocrystalline coating is applied by electroplating in a fluid.

[0071] The nanocrystalline coating increases the strength of the monolith by supporting the structure and reducing the deformation of the main panel under force. In some embodiments, when coated with a nanocrystalline coating between 30 μm and 50 μm, the panel of the RF transparent material is 5-10 times stronger (e.g., resistant to deformation under force). Thus, the monolithic panel can be molded or formed from the RF transparent material into a near-complete state and then reinforced by applying a nanocrystalline coating. In at least one example, an ABS monolith with a nanocrystalline coating exhibits half the deformation at 4.9 Newtons of force as an uncoated ABS monolith exhibits at less than 1.0 Newton of force.

[0072] In some embodiments, a method of manufacturing an electronic device housing includes injection molding a monolith including an RF transparent material. The surface of the injection molded monolith is subsequently coated with a nanocrystalline metal coating. In some embodiments, the method further includes etching a portion of the nanocrystalline coating at the RF window with a laser or other excitation beam.

[0073] In some embodiments, the coating is etched using a laser to remove the nanocrystalline coating in the RF window from the RF transparent material without penetrating the RF transparent material. In this way, the monolith remains structurally continuous throughout the RF window, thus providing strength and aesthetic improvements over conventional holes through the RF transparent material.

[0074] In some embodiments, the nanocrystalline coating is conductive. The conductivity can provide a ground path for electronic components in the internal volume of the monolith. In some examples, different panels of the electronic device housing can be electrically insulated from each other. In such embodiments, the nanocrystalline coating has been removed from one or more connection points of the monolith (e.g., the points where the monolith is connected to other main panels and / or electronic components such as a motherboard or power supply). In some embodiments, the coating on the posts applied to the inner surface of the monolith is etched or masked to remove the nanocrystalline coating from the posts, thus electrically insulating the coated monolith through the posts. In other embodiments, other connection points of the monolith are etched or masked to remove the nanocrystalline coating and electrically insulate the attached electronic components from the coated monolith.

[0075] In some embodiments, the nanocrystalline coating material can provide conductivity between the panels of the electronic device housing. In some embodiments, the electronic device includes at least a first monolith and a second monolith. The coating material is positioned on the surface of the first monolith and the surface of the second monolith. In some embodiments, the nanocrystalline coating material provides conductivity between the first monolith and the second monolith (e.g., for RF shielding and / or electrical grounding).

[0076] In some embodiments, the first and second monolithic bodies are separately coated, and subsequent contact of the nanocrystalline grain coating material permits conductivity therebetween. In some embodiments, the first and second monolithic bodies are positioned adjacent to and in contact with each other before the nanocrystalline grain coating material is coated on the surfaces of the first and second monolithic bodies to create a continuous surface of the nanocrystalline grain coating material, the continuous surface being conductive as a whole.

[0077] In some embodiments, a method of manufacturing an electronic device housing includes: injection molding a monolithic body of an RF transparent material; and masking an RF window region of the monolithic body with a masking material. In some embodiments, the masking material is masking tape or other solid material. In some embodiments, the masking material is masking oil or other fluid.

[0078] The method further includes coating the monolithic body with at least a portion of a nanocrystalline grain metal coating and the masking material. The method then includes removing the masking material from the RF window region to create an RF window through the nanocrystalline grain metal coating without penetrating the RF transparent material.

[0079] In some embodiments, the monolithic body has a single RF window. In other embodiments, the monolithic body has multiple RF windows. In some embodiments, the perimeter of the RF window is etched to facilitate removal of the masking material. Removal of the masking material can have a lesser chance of damaging the coating adjacent to the masking material and outside the RF window by etching or ablating through the coating or a portion of the thickness of the coating around the perimeter of the masking material.

[0080] The systems and methods according to the present disclosure allow for the manufacture of an electronic device housing that is stronger than a polymer housing without a coating, while also providing EM shielding for electronic components and an RF window for an antenna of a communication device. The monolithic body is stronger than a body panel with a cutout RF window and is more aesthetically pleasing to a user compared to having holes through the body panel.

[0081] The present disclosure relates to systems and methods for manufacturing an electronic device housing according to examples provided in at least the following sections:

[0082] 1. A method of manufacturing an electronic device housing, the method comprising:

[0083] obtaining a monolithic body of a radio frequency (RF) transparent material (e.g., Figure 3 326 in

[0084] coating a surface of the monolithic body with a nanocrystalline grain coating material (e.g., Figure 3 334 in

[0085] removing the nanocrystalline grain coating at an RF window (e.g.,Figure 6-1 a portion at 516) in

[0086] 2. The method of section 1, wherein obtaining a monolithic body includes injection molding the monolithic body.

[0087] 3. The method of section 1 or 2, wherein the RF transparent material is a thermoplastic polymer.

[0088] 4. The method of section 1 or 2, wherein the RF transparent material is acrylonitrile butadiene styrene (ABS).

[0089] 5. The method of section 4, wherein the ABS is fiber - loaded.

[0090] 6. The method of any one of sections 1 - 5, wherein coating the surface includes etching the RF transparent material before applying a coating material.

[0091] 7. The method of any one of sections 1 - 6, wherein the nanocrystalline grain coating includes a metal.

[0092] 8. The method of any one of sections 1 - 7, wherein the nanocrystalline grain coating is cobalt or includes cobalt.

[0093] 9. The method of any one of sections 1 - 8, wherein removing a portion of the nanocrystalline grain coating includes laser - etching the nanocrystalline grain coating.

[0094] 10. The method of any one of sections 1 - 9, wherein removing a portion of the nanocrystalline grain coating includes removing masking material from the surface of the monolithic body.

[0095] 11. The method of section 10, wherein coating the surface of the monolithic body includes coating the masking material with the nanocrystalline grain coating.

[0096] 12. The method of any one of sections 1 - 11, wherein removing a portion of the nanocrystalline grain coating includes not removing or penetrating the RF transparent material.

[0097] 13. An electronic device, comprising:

[0098] a monolithic body of RF transparent material (e.g., Figure 6-1 at 546) in

[0099] that at least partially defines an internal volume of the device; Figure 6-1 a nanocrystalline grain coating material (e.g.,

[0100] at 534) in Figure 1 positioned on an outer surface of the monolithic body;

[0101] An RF window (e.g., 516 in Figure 6-1 ) positioned adjacent to the communication device in the monolithic body, where the RF window is a portion of the monolithic body where the nanocrystalline coating does not exist on the outer surface of the RF transparent material. Figure 6-1 The RF window is a part of the monolithic body where the nanocrystalline coating does not exist on the outer surface of the RF transparent material.

[0102] 14. The electronic device of section 13, wherein the RF transparent material is a polymer.

[0103] 15. The electronic device of section 13 or 14, wherein the RF transparent material is at least 1 millimeter thick.

[0104] 16. The electronic device of any one of sections 13 - 15, wherein the nanocrystalline coating is a metal coating.

[0105] 17. The electronic device of any one of sections 13 - 16, wherein the monolithic body is a first monolithic body, and the nanocrystalline coating provides electrical conductivity to a second monolithic body.

[0106] 18. The electronic device of any one of sections 13 - 17, wherein the structural rigidity of the monolithic body and the nanocrystalline coating is at least twice the structural rigidity of a single monolithic body.

[0107] 19. A method of manufacturing an electronic device housing, the method comprising:

[0108] Injection molding (e.g., 636, Figure 7 ) a monolithic body comprising a radio frequency (RF) transparent material; Figure 7 Masking (e.g., 648, Figure 7 ) the RF window region of the monolithic body with a masking material;

[0109] Coating (e.g., 638, Figure 7 ) the surfaces of the monolithic body and the masking material with a nanocrystalline metal coating; and Figure 7 Removing (e.g., 650, Figure 7 ) the masking material from the RF window region to create an RF window through the nanocrystalline metal coating.

[0110] Figure 7 The surfaces of the monolithic body and the masking material are coated with a nanocrystalline metal coating; and

[0111] Figure 7 Removing (e.g., 650, Figure 7 ) the masking material from the RF window region to create an RF window through the nanocrystalline metal coating. Figure 7 The masking material is removed from the RF window region to create an RF window through the nanocrystalline metal coating.

[0112] 20. The method of section 19, further comprising:

[0113] Masking at least one structural post of the monolithic body with a post masking material;

[0114] Coating the surfaces of the structural post and the post masking material with the nanocrystalline metal coating; and

[0115] Removing the post masking material from the structural post to create a non - conductive portion of the structural post.

[0116] The articles "a", "an", and "the" are intended to denote the presence of one or more of the elements in the foregoing description. The terms "comprising", "including", and "having" are intended to be inclusive and mean that there may be additional elements in addition to the listed elements. Additionally, it will be understood that references to "one embodiment" or "an embodiment" of the present disclosure are not intended to be construed as excluding the existence of additional embodiments that also incorporate the recited features. For example, any element described with respect to an embodiment herein may be combined with any element of any other embodiment described herein. The numbers, percentages, ratios, or other values set forth herein are intended to include that value, as well as other values that are "about" or "approximate" the recited value, as would be appreciated by one of ordinary skill in the art as being covered by embodiments of the present disclosure. Accordingly, the recited values should be construed broadly enough to encompass at least values that are sufficiently close to the recited values to perform the desired function or achieve the desired result. The recited values include at least variations that would be expected in a suitable manufacturing or production process, and may include values within 5%, 1%, 0.1%, or 0.01% of the recited value.

[0117] Given the present disclosure, one of ordinary skill in the art will recognize that equivalent structures do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and alterations can be made to the embodiments disclosed herein without departing from the spirit and scope of the present disclosure. Equivalent structures that include the functional "means plus function" limitations are intended to cover structures described herein as performing the recited function, including both structural equivalents that operate in the same manner and equivalent structures that provide the same function.

[0118] It should be understood that any direction or frame of reference in the foregoing description is merely a relative direction or movement. For example, any reference to "front" and "back" or "top" and "bottom" or "left" and "right" merely describes the relative position or movement of the relevant elements.

[0119] The present disclosure may be embodied in other specific forms without departing from its spirit or characteristics. The described embodiments are to be considered illustrative and not restrictive.

Claims

1. A method of manufacturing a housing for an electronic device, the method comprises: obtaining a monolithic body of a radio frequency (RF) transparent material; coating the surface of the monolithic body with a nanocrystalline grain coating to increase the structural rigidity of the monolithic body, the nanocrystalline grain coating having an average grain size of less than 1 micron; and removing a portion of the nanocrystalline grain coating at the RF window.

2. The method according to claim 1, wherein obtaining the monolithic body comprises injection molding the monolithic body.

3. The method according to claim 1, wherein the radio frequency (RF) transparent material is a thermoplastic polymer.

4. The method according to claim 1, wherein the radio frequency (RF) transparent material is acrylonitrile butadiene styrene (ABS).

5. The method according to claim 4, wherein the ABS is fiber - loaded.

6. The method according to claim 1, wherein coating the surface comprises etching the radio frequency (RF) transparent material before applying the coating material.

7. The method according to claim 1, wherein the nanocrystalline grain coating comprises a metal.

8. The method according to claim 1, wherein the nanocrystalline grain coating comprises cobalt.

9. The method according to claim 1, wherein removing the portion of the nanocrystalline grain coating comprises laser - etching the nanocrystalline grain coating.

10. The method according to claim 1, wherein removing the portion of the nanocrystalline grain coating comprises removing a masking material from the surface of the monolithic body.

11. The method according to claim 10, wherein coating the surface of the monolithic body comprises coating the masking material with the nanocrystalline grain coating.

12. The method according to claim 1, wherein removing the portion of the nanocrystalline grain coating comprises not removing or penetrating the radio frequency (RF) transparent material.

13. An electronic device having a housing for an electronic device produced by the method according to claim 1, wherein: the monolithic body at least partially defines an internal volume; a communication device positioned within the internal volume, the communication device being configured to communicate wirelessly via RF signals; and the RF window positioned in the monolithic body adjacent to the communication device, wherein the RF window is a portion of the monolithic body where the nanocrystalline grain coating does not exist on the outer surface of the radio frequency (RF) transparent material.

14. A method of manufacturing a housing for an electronic device, the method comprises: injection molding a monolithic body comprising a radio frequency (RF) transparent material; masking the RF window region of the monolithic body with a masking material; coating the surface of the monolithic body and the masking material with a nanocrystalline grain metal coating, the nanocrystalline grain metal coating having an average grain size of less than 1 micron; and removing the masking material from the RF window region so as to create an RF window through the nanocrystalline grain metal coating.

15. The method according to claim 14, further comprises: masking at least one structural post of the monolithic body with a post - masking material; coating the surface of the structural post and the post - masking material with the nanocrystalline grain metal coating; and removing the post - masking material from the structural post so as to create a non - conductive portion of the structural post.

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