A three-dimensional integrated package structure based on a dielectric integrated suspended line

Abstract

The application discloses a three-dimensional integrated packaging structure based on a dielectric integrated suspended line, which comprises N layers of dielectric plates covered with metal on both sides; the N layers of dielectric plates are stacked from bottom to top; the dielectric plates of any one or any multiple adjacent layers from the 2nd layer to the N-1th layer are patterned and hollowed to form at least one air cavity; metalized through holes are formed on the 1st layer to the Nth layer to form an electric wall around the air cavity; the 1st layer and the Nth layer together with the formed electric wall constitute an electromagnetic shielding cavity; the 2nd layer to the N-1th layer are electrically connected through a three-dimensional vertical interconnection technology; and one or more functional devices are arranged in each air cavity. The application can realize the collaborative design of functional devices, system circuits and packaging, reduce the influence of packaging on the performance of circuits, reduce the mutual interference between functional devices, facilitate individual debugging, reduce transmission loss, be favorable for realizing high-speed data transmission and improve system reliability.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of radio frequency microwave circuit packaging, and particularly relates to a three-dimensional integrated packaging structure based on a dielectric integrated suspended line. BACKGROUND

[0002] With the rapid development of wireless communication technologies such as 5G, millimeter wave radar detection, terahertz communication, and the continuous diversification of application scenarios such as self-driving cars, the Internet of Things, and artificial intelligence, people have higher requirements for wireless radio frequency systems in terms of high power, low power consumption, low cost, lightweight, and high integration. SUMMARY

[0003] In order to solve the above problems existing in the prior art, the application provides a three-dimensional integrated packaging structure based on a dielectric integrated suspended line.

[0004] The technical problem to be solved by the application is solved by the following technical scheme:

[0005] The application provides a three-dimensional integrated packaging structure based on a dielectric integrated suspended line, comprising: N layers of dielectric plates each covered with metal on both upper and lower surfaces;

[0006] Wherein, the N layers of dielectric plates are arranged in a stack from bottom to top, any one or any multiple of adjacent layers of the second layer to the N-1 layer of dielectric plates are patterned and hollowed out to form at least one air cavity, a metalized via hole is formed on each of the first layer to the N layer of dielectric plates to penetrate the first layer to the N layer of dielectric plates to form an electric wall around the air cavity, the first layer and the N layer of dielectric plates together with the formed electric wall constitute an electromagnetic shielding cavity, the second layer to the N-1 layer of dielectric plates are electrically connected by a three-dimensional vertical interconnection technology, and one or more functional devices are placed in each air cavity; N is a positive integer greater than or equal to 3.

[0007] In some embodiments, the shape and size of each air cavity match the shape and size of the functional device placed in the air cavity.

[0008] In some embodiments, when multiple air cavities are formed, the sizes of any two air cavities are the same or different, and the functional devices placed in the two different air cavities are electrically connected by a three-dimensional vertical interconnection technology.

[0009] In some embodiments, the types of the three-dimensional vertical interconnection technology include: direct interconnection of the same layer of metal, interconnection of the same layer of metal through parallel coupling, interconnection of the upper and lower layers of metal through a metalized via hole, interconnection of the upper and lower layers of metal through a wide edge coupling, interconnection of different layers of metal through a cavity coupling, and interconnection of different layers of metal through a slot coupling.

[0010] In some embodiments, when N is greater than or equal to 5, the placement of the functional device in one air cavity comprises: suspending the functional device in the air cavity.

[0011] In some embodiments, when the functional device in one air cavity is suspended in the air cavity, the functional device in the air cavity is placed on a patterned dielectric plate in the air cavity, and the patterned dielectric plate is connected to the inner wall of the air cavity to support the patterned dielectric plate, the pattern of the patterned dielectric plate being determined by the projected shape of the functional device placed in the air cavity.

[0012] In some embodiments, each layer of dielectric plate is a standard PCB or LTCC.

[0013] In some embodiments, the functional device in each air cavity is a packaged functional device or a functional device that needs to be packaged.

[0014] In some embodiments, the functions of the functional devices placed in different air cavities are different.

[0015] In some embodiments, the functional device comprises: a filter, a switch, a low noise amplifier, a power amplifier, and a mixer, wherein the filter, the switch, the low noise amplifier, and the power amplifier are placed in different air cavities.

[0016] Compared with the prior art, the beneficial effects of the present application are:

[0017] The three-dimensional integrated packaging structure based on the medium integrated suspended line provided by the present application can realize the collaborative design of functional devices, system circuits, and packaging by forming air cavities and placing functional devices in different air cavities, thereby reducing the influence of packaging on circuit performance. By packaging different functional devices in different air cavities with good electromagnetic shielding effect, the mutual interference between functional devices is reduced, and individual debugging is facilitated. The three-dimensional integrated packaging structure based on the medium integrated suspended line provided by the present application expands the functional device from two-dimensional planar interconnection to three-dimensional interconnection between different dielectric layers in the vertical direction, further improving the circuit integration degree. Through three-dimensional vertical interconnection, the length of the interconnection line is shortened, the transmission loss is reduced, high-speed data transmission is facilitated, and system reliability is improved.

[0018] The present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1is a schematic diagram of a three-dimensional structure of an exemplary three-dimensional integrated package structure based on a medium integrated suspended line provided by an embodiment of the present application;

[0020] Figure 2 is a schematic diagram of a three-dimensional structure of a three-dimensional integrated package structure based on a medium integrated suspended line provided by an embodiment of the present application; Figure 1 is a schematic diagram of a cross-section of the three-dimensional integrated package structure based on a medium integrated suspended line in the direction of A-A provided by an embodiment of the present application;

[0021] Figure 3 is a schematic diagram of a principle of a three-dimensional vertical interconnection technology based on a medium integrated suspended line provided by an embodiment of the present application. DETAILED DESCRIPTION

[0022] The present application will be further described in conjunction with specific embodiments, but the embodiments of the present application are not limited thereto.

[0023] The present application provides a three-dimensional integrated package structure based on a medium integrated suspended line (SISL), comprising: functional devices and N layers of medium plates each of which is covered with metal on both upper and lower surfaces, and the metal on each upper or lower surface of the medium plate forms a metal layer. The N layers of medium plates are arranged in a stack from bottom to top, any one or any multiple of adjacent layers of the second layer to the N-1th layer of medium plates are patterned and hollowed to form at least one air cavity, and a metalized via is formed on each of the first layer to the Nth layer of medium plates to penetrate the first layer to the Nth layer of medium plates to form an electric wall around the air cavity, the electric wall together with the first layer and the Nth layer of medium plates forms an electromagnetic shielding cavity, so that the air cavity has a good electromagnetic shielding effect, the second layer to the N-1th layer of medium plates are electrically connected by a three-dimensional vertical interconnection technology, and one or more functional devices are placed in each air cavity; N is a positive integer greater than or equal to 3.

[0024] It should be noted that the medium plate is patterned and hollowed, which means that the medium plate used to form the air cavity is hollowed according to the shape of the projection of the functional device to be placed in the air cavity.

[0025] In some embodiments, the shape and size of each air cavity match the shape and size of the functional device placed in the air cavity; in this way, the integration degree of the three-dimensional integrated package structure can be further improved.

[0026] In some embodiments, when N is greater than or equal to 5, the placement mode of the functional device in the air cavity includes: suspending the functional device in the air cavity.

[0027] In some embodiments, when a functional device in an air cavity is suspended in the air cavity, the functional device in the air cavity is placed on a patterned dielectric board in the air cavity, and the patterned dielectric board is connected to the inner wall of the air cavity to support the patterned dielectric board, and the pattern of the patterned dielectric board is determined by the projected shape of the functional device placed in the air cavity.

[0028] It should be noted that the patterned dielectric board refers to the dielectric board after being patterned and hollowed out.

[0029] In some embodiments, each layer of dielectric board is a standard PCB board or LTCC.

[0030] In some embodiments, the functional device in each air cavity is a packaged functional device or a functional device that needs to be packaged; thus, when the functional device in each air cavity is a functional device that needs to be packaged, the air cavity used to accommodate the functional device can serve as packaging for the functional device, thereby reducing the impact of packaging on circuit performance.

[0031] It should be noted that the functional device placed in each air cavity can be a circuit device or a circuit module, and the present application does not limit this.

[0032] In some embodiments, the functional devices placed in different air cavities have different functions. For example, the functional devices include one or more of the following radio frequency functional devices: filters, switches, low-noise amplifiers, power amplifiers, and mixers, wherein the filters, switches, low-noise amplifiers, and power amplifiers are placed in different air cavities.

[0033] In some embodiments, when multiple air cavities are formed, the sizes of any two air cavities are the same or different, and the electrical connection between the functional devices placed in two different air cavities is achieved through a three-dimensional vertical interconnection technology.

[0034] In some embodiments, the types of three-dimensional vertical interconnection technology include: direct interconnection of metal in the same layer, interconnection of metal in the same layer through parallel coupling, interconnection of metal in upper and lower layers through metallized via, interconnection of metal in upper and lower layers through wide edge coupling, interconnection of different layer metals through cavity coupling, and interconnection of different layer metals through slot coupling.

[0035] For example, Figure 1 is an exemplary three-dimensional structure schematic diagram of a three-dimensional integrated packaging structure based on a dielectric integrated suspended line provided by an embodiment of the present application; Figure 2 is a cross-sectional schematic diagram of the three-dimensional integrated packaging structure based on a dielectric integrated suspended line in Figure 1 ; Figure 3 is a principle schematic diagram of a three-dimensional vertical interconnection technology based on a dielectric integrated suspended line.Figure 1 、 Figure 2 and Figure 3 In the figure, 1 represents the first dielectric layer, 2 represents the second dielectric layer, 3 represents the third dielectric layer, 4 represents the fourth dielectric layer, 5 represents the fifth dielectric layer, 6 represents the sixth dielectric layer, 7 represents the seventh dielectric layer, 8 represents the eighth dielectric layer, 9 represents the ninth dielectric layer, 10 represents the tenth dielectric layer, 11 represents the eleventh dielectric layer, 12 represents the twelfth dielectric layer, 13 represents metallized through-holes, 14 represents metallized through-hole interconnections between different layers, 15 represents metallized broadside coupling interconnections between different layers, 16 represents metallized flat holes on the same layer, Row coupling interconnection, 17 represents the coupling interconnection of metal gaps of different layers, 18 represents the coupling interconnection of different cavities, 19 represents patch probes, 20 to 28 represent different functional devices (for example, filters, switches, low noise amplifiers, power amplifiers, etc.), specifically, 20 represents functional device A, 21 represents functional device B, 22 represents functional device C, 23 represents functional device D, 24 represents functional device E, 25 represents functional device F, 26 represents functional device G, 27 represents functional device H, and 28 represents functional device I.

[0036] Combine Figure 1 、 Figure 2 As shown, the three-dimensional integrated packaging structure includes: a first dielectric plate 1, a second dielectric plate 2, a third dielectric plate 3, a fourth dielectric plate 4, a fifth dielectric plate 5, a sixth dielectric plate 6, a seventh dielectric plate 7, an eighth dielectric plate 8, a ninth dielectric plate 9, a tenth dielectric plate 10, an eleventh dielectric plate 11, a twelfth dielectric plate 12, and functional devices A, B, C, D, E, F, G, H, and I. The first and twelfth dielectric plates serve as the base plate and cover plate, respectively; the sixth, eighth, and tenth dielectric plates serve as support plates and partition plates, respectively (some of the functional devices A to I are directly designed or placed on these dielectric plates); and the second to fifth dielectric plates, the seventh dielectric plate, the ninth dielectric plate, and the eleventh dielectric plate are partially hollowed out to form multiple air cavities based on the shapes and sizes of the functional devices to accommodate the functional devices. The air cavity is surrounded by closely spaced metallized vias that act as electrical walls, forming air cavities of different sizes, isolated from each other, and having good electromagnetic shielding effects together with the first, sixth, eighth, tenth, and twelfth dielectric boards. 20 (i.e., functional device A) is designed or mounted on a portion of the patterned dielectric board 3, such as Figure 2As shown, the patterned dielectric plate is connected with the partial metal layer of the dielectric plate 3, thereby supporting the patterned dielectric plate, 21 (i.e. functional device B) is designed or installed on a part of the patterned dielectric plate of the dielectric plate 4, the patterned dielectric plate is connected with the partial metal layer of the dielectric plate 4, thereby supporting the patterned dielectric plate, and 20 and 21 are suspended in different air cavities, respectively, and 20 and 21 also realize the cavity coupling interconnection as shown in the middle 18 through the respective patch probe 19. 22 (i.e. functional device C) is designed or installed on the dielectric plate 6, which is located on a different dielectric plate from 21, and realizes vertical interconnection through gap coupling between different cavities. Figure 3 As shown, the patterned dielectric plate is connected with the partial metal layer of the dielectric plate 3, thereby supporting the patterned dielectric plate, 21 (i.e. functional device B) is designed or installed on a part of the patterned dielectric plate of the dielectric plate 4, the patterned dielectric plate is connected with the partial metal layer of the dielectric plate 4, thereby supporting the patterned dielectric plate, and 20 and 21 are suspended in different air cavities, respectively, and 20 and 21 also realize the cavity coupling interconnection as shown in the middle 18 through the respective patch probe 19. 22 (i.e. functional device C) is designed or installed on the dielectric plate 6, which is located on a different dielectric plate from 21, and realizes vertical interconnection through gap coupling between different cavities. Figure 3 As shown, the patterned dielectric plate is connected with the partial metal layer of the dielectric plate 3, thereby supporting the patterned dielectric plate, 21 (i.e. functional device B) is designed or installed on a part of the patterned dielectric plate of the dielectric plate 4, the patterned dielectric plate is connected with the partial metal layer of the dielectric plate 4, thereby supporting the patterned dielectric plate, and 20 and 21 are suspended in different air cavities, respectively, and 20 and 21 also realize the cavity coupling interconnection as shown in the middle 18 through the respective patch probe 19. 22 (i.e. functional device C) is designed or installed on the dielectric plate 6, which is located on a different dielectric plate from 21, and realizes vertical interconnection through gap coupling between different cavities. Figure 3 As shown, the patterned dielectric plate is connected with the partial metal layer of the dielectric plate 3, thereby supporting the patterned dielectric plate, 21 (i.e. functional device B) is designed or installed on a part of the patterned dielectric plate of the dielectric plate 4, the patterned dielectric plate is connected with the partial metal layer of the dielectric plate 4, thereby supporting the patterned dielectric plate, and 20 and 21 are suspended in different air cavities, respectively, and 20 and 21 also realize the cavity coupling interconnection as shown in the middle 18 through the respective patch probe 19. 22 (i.e. functional device C) is designed or installed on the dielectric plate 6, which is located on a different dielectric plate from 21, and realizes vertical interconnection through gap coupling between different cavities. Figure 3 As shown, the patterned dielectric plate is connected with the partial metal layer of the dielectric plate 3, thereby supporting the patterned dielectric plate, 21 (i.e. functional device B) is designed or installed on a part of the patterned dielectric plate of the dielectric plate 4, the patterned dielectric plate is connected with the partial metal layer of the dielectric plate 4, thereby supporting the patterned dielectric plate, and 20 and 21 are suspended in different air cavities, respectively, and 20 and 21 also realize the cavity coupling interconnection as shown in the middle 18 through the respective patch probe 19. 22 (i.e. functional device C) is designed or installed on the dielectric plate 6, which is located on a different dielectric plate from 21, and realizes vertical interconnection through gap coupling between different cavities. Figure 3 As shown, the patterned dielectric plate is connected with the partial metal layer of the dielectric plate 3, thereby supporting the patterned dielectric plate, 21 (i.e. functional device B) is designed or installed on a part of the patterned dielectric plate of the dielectric plate 4, the patterned dielectric plate is connected with the partial metal layer of the dielectric plate 4, thereby supporting the patterned dielectric plate, and 20 and 21 are suspended in different air cavities, respectively, and 20 and 21 also realize the cavity coupling interconnection as shown in the middle 18 through the respective patch probe 19. 22 (i.e. functional device C) is designed or installed on the dielectric plate 6, which is located on a different dielectric plate from 21, and realizes vertical interconnection through gap coupling between different cavities.

[0037] The three-dimensional integrated packaging structure based on the dielectric integrated suspended line provided by the present application can realize the collaborative design of functional devices and system circuit and packaging by forming air cavities and placing functional devices in different air cavities, thereby reducing the influence of packaging on circuit performance; and by packaging different functional devices in different air cavities with good electromagnetic shielding effect, the mutual interference between functional devices is reduced, and individual debugging is facilitated.

[0038] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features or characteristics described can be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples described in the specification.

[0039] In the specification, the word "comprising" does not exclude other components or steps, and "one" or "an" does not exclude a plurality. Some measures are described in mutually different embodiments, but this does not mean that these measures cannot be combined to produce good results.

[0040] The above is a further detailed description of the present application in combination with specific preferred embodiments, and cannot be considered as limiting the specific implementation of the present application to these descriptions. For those skilled in the art, without departing from the concept of the present application, a number of simple deductions or substitutions can be made, which should be considered as belonging to the protection scope of the present application.

Claims

1. A three-dimensional integrated package structure based on a dielectrically integrated suspended line, characterized by, The application relates to a multi-layer electromagnetic shielding cavity, comprising: N layers of dielectric plates, each of which is covered with metal on both sides; Wherein, the N layers of dielectric plates are arranged in a stack from bottom to top, any one or any multiple of adjacent layers of the second layer to the N-1th layer of dielectric plates are patterned and hollowed out to form at least one air cavity, a metalized through hole is formed on each of the first layer to the Nth layer of dielectric plates to penetrate the first layer to the Nth layer of dielectric plates to form an electric wall around the air cavity, the first layer and the Nth layer of dielectric plates together with the formed electric wall constitute an electromagnetic shielding cavity, the second layer to the N-1th layer of dielectric plates are electrically connected through a three-dimensional vertical interconnection technology, and one or more functional devices are placed in each air cavity; N is a positive integer greater than or equal to 3; When N is greater than or equal to 5, the placement mode of the functional devices in one air cavity comprises: suspending the functional devices in the air cavity; When the functional devices in one air cavity are suspended in the air cavity, the functional devices in the air cavity are arranged on a patterned dielectric plate in the air cavity, and the patterned dielectric plate is connected with the inner wall of the air cavity to support the patterned dielectric plate, and the pattern of the patterned dielectric plate is determined by the projection shape of the functional devices placed in the air cavity; the patterned dielectric plate refers to a dielectric plate that is patterned and hollowed out.

2. The 3D integrated package structure based on the medium integrated suspended lines according to claim 1, characterized in that, The shape and size of each air cavity are matched with the shape and size of the functional devices placed in the air cavity.

3. The 3D integrated package structure based on the medium integrated suspended lines according to claim 1, characterized in that, When a plurality of air cavities are formed, the sizes of any two air cavities are the same or different, and the functional devices placed in the two different air cavities are electrically connected through a three-dimensional vertical interconnection technology.

4. The 3D integrated package structure based on the medium integrated suspended lines according to claim 3, characterized in that, The types of the three-dimensional vertical interconnection technology include: direct interconnection of the same layer of metal, interconnection of the same layer of metal through parallel coupling, interconnection of the upper and lower layers of metal through a metalized via, interconnection of the upper and lower layers of metal through a wide edge coupling, interconnection of different layers of metal through cavity coupling, and interconnection of different layers of metal through a gap coupling.

5. The 3D integrated package structure based on the medium integrated suspended lines according to claim 1, characterized in that, Each layer of dielectric plate is a standard PCB or LTCC.

6. The 3D integrated package structure based on the medium integrated suspended lines according to claim 1, characterized in that, The functional devices in each air cavity are packaged functional devices or functional devices that need to be packaged.

7. The 3D integrated package structure based on the medium integrated suspended lines according to claim 1, characterized in that, The functional devices placed in different air cavities have different functions.

8. The 3D integrated package structure based on the medium integrated suspended lines according to claim 1, characterized in that, The functional devices include filters, switches, low-noise amplifiers, power amplifiers and mixers, wherein the filters, switches, low-noise amplifiers and power amplifiers are arranged in different air cavities.

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