Method and apparatus for manufacturing a plastic component, and plastic component

Abstract

The present invention relates to a method for manufacturing at least one plastic component (1), in which the following steps are preferably carried out in the following order, preferably cyclically: a) providing at least one film (2) and at least one sensor film (3), wherein the at least one film (2) and / or the at least one sensor film (3) has at least one thermoplastic material or at least one thermoplastic plastic; b) applying the at least one sensor film (3) to at least one first region of the surface of the at least one film (2); c) shaping the at least one film (2) including the at least one sensor film (3), thereby forming one or more shaped film bodies (4); d) punching out one or more film elements (4a), the film elements being formed from at least one second region of the one or more shaped film bodies (4). The present invention also relates to a device (10) and a plastic component (1).

Description

Field of the Invention

[0001] The present invention relates to a method for manufacturing a plastic component, an apparatus for manufacturing a plastic component, and a plastic component. Background Art

[0002] In industry, there is a need for 3D-shaped touch-sensitive surfaces in which strong deformations (very deep / high and / or small radii) are desired. So far, however, it has hardly been possible to deform, for example, a touch sensor. This is because the PET carrier (PET = polyethylene terephthalate) of the conductor tracks of such a touch sensor and / or the conductor tracks of the touch sensor do not have sufficient flexibility. It is known here to solve this technical problem by printing very thick and / or wide conductor tracks onto a flexible substrate. However, the disadvantage here is that the resulting sensor, for example, cannot be illuminated without restriction because the observer will see the thick and / or wide conductor tracks.

[0003] Generally speaking, PET carriers are very suitable as production carriers because they have, for example, a low elongation under the influence of temperature and are thus very stable during processing, especially when applying layers onto the PET carrier. In addition, very fine conductor tracks and conductor paths and other conductive structures can be realized on the PET carrier with very small tolerances. Accordingly, a touch sensor manufactured in this way can also be backlit very well because the conductor tracks can be made correspondingly thin and / or narrow.

[0004] However, PET carriers - for example, also in combination with decorative films - are not sufficiently suitable for further processing by means of an injection molding method. Only a small deformation depth and a very large radius of the resulting product can be achieved here. Summary of the Invention

[0005] Therefore, the object of the present invention is to provide an improved method for manufacturing a plastic component, an improved apparatus for manufacturing a plastic component, and an improved plastic component.

[0006] This object is achieved by a method for manufacturing at least one plastic component, in which the following steps are preferably carried out in the following order, preferably cyclically in the following order:

[0007] a) providing at least one film and at least one sensor film, wherein the at least one film (2) and / or the at least one sensor film (3) has at least one thermoplastic material or at least one thermoplastic plastic,

[0008] b) applying the at least one sensor film to at least one first region of the surface of the at least one film,

[0009] c) Shaping the at least one membrane including the at least one sensor membrane, thereby forming one or more shaped membrane bodies.

[0010] d) Punching out one or more membrane elements, which are formed from at least one second region of the one or more shaped membrane bodies.

[0011] Furthermore, the method is solved by a device for manufacturing at least one plastic component, in particular for implementing the above method.

[0012] The device has at least one supply station, which is designed such that the at least one supply station provides at least one membrane and provides at least one sensor membrane, and the at least one membrane and / or the at least one sensor membrane has at least one thermoplastic material or at least one thermoplastic plastic.

[0013] The device has at least one application station, which is designed such that the at least one application station applies the at least one sensor membrane onto at least one first region of the surface of the at least one membrane.

[0014] The device has at least one shaping station, which is designed such that the at least one shaping station shapes the at least one membrane including the at least one sensor membrane to form at least one shaped membrane body.

[0015] The device has at least one punching station, which is designed such that the at least one punching station punches out at least one membrane element from at least one second region of the at least one shaped membrane body.

[0016] The task is also solved by a plastic component, in particular manufactured according to the above method and preferably manufactured by the above device. The plastic component includes a punched and back-injected membrane element, which includes at least one shaped membrane and at least one shaped sensor membrane. The at least one shaped membrane and / or the at least one shaped sensor membrane has at least one thermoplastic material or at least one thermoplastic plastic, and the radius of curvature of the plastic component is at least locally less than 1000 mm, in particular less than 200 mm, further preferably less than 100 mm, and / or the elongation rate of the plastic component is greater than or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, in particular preferably greater than or equal to 300%.

[0017] This method and this device are characterized in that, for example, a finely structured, in particular directly backlight-illuminated touch sensor can be deformed better during the manufacturing process than before, preferably deformed three-dimensionally.

[0018] Studies have shown that deep drawing or forming, for example, laminates including a PET film with sensors and a flexible PC film, for example - where the flexible PC film preferably has higher flexibility than the PET film - result in better outcomes in terms of the deformability of the laminate, especially in three dimensions. Thereby, for example, very large deformation depths and very small radii can be achieved in the deep-drawn laminate, which cannot be achieved by conventional methods.

[0019] The PET film has a high tensile strength. However, the plastic deformability or formability of this PET film alone is low, which leads to the above-mentioned drawbacks during forming. Due to the low plastic deformability, the PET film has low flexibility during forming. The above-mentioned advantages of the PET film - namely high strength, high temperature stability, and a very low elongation rate under temperature fluctuations - therefore cannot be used for three-dimensional designed products that require a higher degree of forming during the manufacturing process. The connection of the PET film with another film having a lower tensile strength than the PET but a higher plastic formability or flexibility for this purpose surprisingly results in that the composite of these two films can be formed significantly better and at the same time has almost the same desired mechanical properties as the individual PET film after the forming process. PC has proven to be particularly suitable as the material for the said other film, which is connected to the PET film in the thickness direction. Compared with PET, PC has a significantly lower tensile strength and significantly better plastic formability. However, the film or the other film connected to the PET sensor film is not limited to the PC material. In principle, thermoplastics can be used as the material for the said film or the other film, which have a lower tensile strength and higher plastic deformability compared with PET. Therefore, materials based on thermoplastic materials suitable for the said film are, for example, also TPU, ABS, ABS-PC, or PMMA. The flexible film and the sensor film with a higher tensile strength are fixedly connected to each other before forming. For this purpose, the sensor film and the said film are arranged one above the other. A suitable method for connecting the film with the sensor film is heat stamping, because a particularly firm connection can be achieved in this way, which can also be maintained during the forming process. Of course, other connection methods are also suitable for connecting the film with the sensor film.

[0020] Studies have also shown that the flexible PC film can, for example, simultaneously be used as a connecting layer for the injection molding material. Thereby, it is achieved that the film forms a good adhesion with the material to be injection molded.

[0021] Furthermore, the tests have surprisingly shown that the flexible PC film in combination with the PET film serves as a deformation aid and greatly increases the deformability of the PET film. Thereby, for example, the resulting touch sensor can be deformed significantly more strongly than previously known, even when there is a PET film combined with the flexible PC film. In this composite of the PET film and the PC film, the plastic formability is greatly improved compared with the individual PET film. At the same time, the tensile strength and temperature stability of this composite are significantly better than those of the individual PC film.

[0022] In particular, this property of the composite of the flexible PC film and the PET film can be explained by the movement of the "earlier" breaking point of the PET film towards the "later" breaking point.

[0023] "Curvature" is in particular understood as the local deviation of a curve with respect to a straight line. The curvature of a curve preferably refers to a sufficiently short curve segment or, stated otherwise, the change in direction per unit length and / or distance along which the curve extends. The curvature of a straight line preferably equals zero at any position. A circle with a radius r has in particular the same curvature at any position, namely 1 / r. For most curves, the curvature preferably varies between different curve points, in particular the curvature varies continuously between different curve points, so that the curve preferably does not have inflection points and / or discontinuity points. Thus, the curvature of a curve at point P represents in particular the degree to which the curve deviates from a straight line in the immediate surrounding area of point P. The value of the curvature is in particular referred to as the radius of curvature and preferably equals the reciprocal or absolute value of the value of the local radius vector. The radius of curvature is preferably the radius of the circle that provides the best approximation in the local surrounding area of the contact point and / or tangent point P of the curve.

[0024] "Elongation rate" is in particular understood as the ratio between the elongated length and the non-elongated length. For example, it is preferably the case that if the non-elongated length of a component and / or a film and / or a sensor film is 40 m and the elongated length of the component and / or the film and / or the sensor film is 70 m, then the elongation rate of the component and / or the film and / or the sensor film is 75%. Generally speaking, the elongation rate is in particular obtained from the quotient (elongated length - non-elongated length) / (non-elongated length) or, in the above example, from the quotient (elongated length - non-elongated length) / (non-elongated length) = (70 m - 40 m) / 40 m, which is equal to 75%.

[0025] Preferred embodiments of the methods mentioned below are described.

[0026] Preferably, in step a), at least one of the films and / or at least one of the sensor films has polycarbonate (PC) as at least one thermoplastic material or as at least one thermoplastic plastic.

[0027] More preferably, in step a), at least one of the sensor films and / or at least one of the films has polyethylene terephthalate (PET) as at least one thermoplastic material or as at least one thermoplastic plastic.

[0028] In step a), at least one of the films may have a thickness of 50 μm to 3000 μm, in particular 300 μm to 2000 μm. For example, at least one of the films in particular has a thickness of 375 μm.

[0029] Furthermore, at least one of the membranes described in step a) has a tensile strength between 20 MPa and 100 MPa, in particular between 20 MPa and 80 MPa.

[0030] "Tensile strength" is preferably understood here as one of the possible strength characteristic values of a material, in particular the maximum mechanical tensile stress that the material can withstand. The tensile strength is preferably calculated from the results of a tensile test preferably according to the ISO 527 standard, in particular as the maximum tensile force reached relative to the original cross-section of a standardized tensile specimen. In such a tensile test, so-called ductile materials, such as steel, will in particular be further stretched after exceeding the tensile strength, but the cross-section will in particular decrease. In contrast, brittle materials, such as cast iron, will in particular break when the tensile strength is exceeded. The tensile strength is preferably given in the dimension of "force per unit area", and in particular the commonly used unit of measurement is N / mm 2 or MPa (megapascal). In the stress-strain diagram, the tensile strength can be directly read out, preferably as the Y-axis value at the highest point of the corresponding curve in the stress-strain diagram.

[0031] Preferably, at least one of the membranes described in step a) is at least partially or entirely flexible.

[0032] Preferably, at least one of the membranes described in step a) is provided as a membrane composite that is at least partially or entirely flexible and / or includes one or more membranes, in particular one or more membranes that are at least partially or entirely flexible.

[0033] "Die-cutting" (Ausstanzen) is preferably understood here as trimming or cutting to size or finishing the outer edge or external dimensions of the membrane body, in particular by means of a method selected from the group consisting of: mechanical cutting, laser processing, waterjet machining, milling, mechanical stamping.

[0034] The membrane may also include one or more decorative layers and / or one or more functional layers. For example, the decorative layer and / or the functional layer can be applied to one or both surfaces of the membrane entirely or locally by means of one or more methods, which are selected from the group consisting of: gravure printing, flexographic printing, screen printing, inkjet printing, pad printing, hot stamping, cold embossing and evaporation plating, either alone or in combination. Such decorative and / or functional layers are in particular selected from the group consisting of: protective layers, color paint layers, metal layers, reflective layers, reproduction paint layers, transparent layers, carrier layers and / or layers that produce optically variable effects.

[0035] Preferably, the one or more decorative layers and / or functional layers include, for example, especially printing layers made of opaque and / or colored inks, which form a frame around the functional area. The one or more decorative layers and / or functional layers can cover the sensor film and especially the functional area entirely or partially and / or be applied in a grid pattern. The one or more decorative and / or functional layers can present a uniform surface and / or a continuous pattern and / or a single image theme. The one or more decorative and / or functional layers can be entirely or partially opaque and / or translucent and / or transparent, especially transparently dyed.

[0036] For example, if one or more decorative layers are applied to both sides of the film, these layers can together form an overall decoration. In particular, the film can be used as an optical spacer for an optical depth effect. For example, two overlapping one or more decorative layers can complement each other to form an overall design and / or produce a moiré effect and / or one decorative layer serves as the background for another decorative layer. In particular, these two decorative layers can be applied in register with respect to each other.

[0037] Furthermore, in step a), the at least one sensor film can have a thickness of 25 μm to 500 μm, especially 25 μm to 125 μm. In particular, the at least one sensor film includes a carrier film with a preferred thickness of 50 μm to 75 μm, a layer group (Schichtpaket) preferably including multiple layers, and especially a cover film including PET and / or having a layer thickness of 12 μm to 20 μm.

[0038] Preferably, in step a), the at least one sensor film has a tensile strength between 150 MPa and 500 MPa, especially between 200 MPa and 500 MPa.

[0039] The tensile strength of the at least one film in step a) and / or b) can be at most two-thirds of the tensile strength of the at least one sensor film in step a) and / or b) multiplied by a factor.

[0040] Preferably, the thickness of the at least one film in step a) and / or b) is at least half of the thickness of the at least one sensor film in step a) and / or b) multiplied by a factor. According to this definition, the thickness of the film is at least half of the thickness of the sensor film. However, the thickness of the film can also be thicker, for example, the same as the thickness of the sensor film. It is particularly advantageous if the thickness of the flexible film is greater than the thickness of the sensor film. In this case, the sensor film is thinner than the film. Such an embodiment can be found, for example, in the appendix described in detail below Figure 2 、 3, can be seen in FIGS. 4 and 5. As shown above, the thickness of the film can be selected, for example, in the range between 300 μm and 2000 μm, and advantageously the thickness of the sensor film can be selected in the range between 50 μm and 125 μm. Thus, the thickness of the film can be designed to be 2, 3, 4 or 5 times thicker than the sensor film. Of course, a coefficient other than the above coefficients can also be selected between the thicknesses of the film and the sensor film. By combining a thicker film, for example made of PC, with a thinner sensor film, especially made of PET, the flexibility of the composite or the plastic formability of the composite can be significantly improved.

[0041] Furthermore, at least one of the films described in step a) is at least partially or fully transparent, translucent or opaque and / or at least one of the sensor films described in step b) is at least partially transparent, translucent or opaque.

[0042] Preferably, "opaque" is understood to mean a transparency of less than 25%, especially less than 15%, preferably less than 5% in the wavelength range visible to humans.

[0043] Preferably, "translucent" is understood to mean a transparency of from 25% to 75%, especially from 15% to 85%, preferably from 5% to 95% in the wavelength range visible to humans.

[0044] Preferably, "transparent" is understood to mean a transparency of at least 75%, especially greater than 85%, preferably greater than 95% in the wavelength range visible to humans.

[0045] At least one of the sensor films described in step b) can be applied to at least one of the films by thermal lamination and / or by heat stamping and / or by cold lamination and / or by gluing, especially cold gluing.

[0046] In particular, step b) includes one or more of the following further steps, which are especially for manufacturing at least one of the sensor films and / or for applying at least one of the sensor films to at least one of the films, preferably the following further steps are carried out in the following order, more preferably the following further steps are carried out in a cyclic order:

[0047] b1) Providing at least one carrier substrate;

[0048] b2) Applying at least one conductive layer to the carrier substrate, the at least one conductive layer forming an electrical functional structure in at least one functional area, the at least one conductive layer forming at least one contact structure for contacting the electrical functional structure in at least one contact area;

[0049] b3) At least one adhesion promoter layer is applied in such a way for applying the at least one sensor film to the at least one film that, when viewed perpendicular to the plane formed by the at least one carrier substrate, the adhesion promoter layer at least partially does not cover the at least one contact-making area, or the at least one adhesion promoter layer is applied over the entire surface when viewed perpendicular to the plane formed by the at least one carrier substrate.

[0050] It has proven suitable for the at least one conductive layer to be arranged between the carrier substrate and the at least one adhesion promoter layer. Thus, the adhesion promoter layer can be arranged on the side of the at least one conductive layer facing away from the carrier substrate. Thus, the adhesion promoter layer can be applied in step b3) in such a way that the at least one conductive layer is arranged between the carrier substrate and the adhesion promoter layer. Since the adhesion promoter layer is arranged on the surface of the sensor film, the sensor film can be applied directly to the film, also ensuring reliable contact-making with the electrical functional structure here.

[0051] The adhesion promoter layer can also be arranged on the side of the carrier substrate facing away from the at least one conductive layer. Thus, the adhesion promoter layer can be arranged on the side of the carrier substrate facing away from the at least one conductive layer in step b3).

[0052] Preferably, the adhesion promoter layer is applied over the entire surface when viewed perpendicular to the plane formed by the carrier substrate. The adhesion promoter layer is thus advantageously arranged in the functional area and the contact-making area. The adhesion promoter layer can also be applied over the entire surface on the carrier substrate in such a way that no other layer is arranged between the carrier substrate and the adhesion promoter layer.

[0053] It is further preferred for the adhesion promoter layer to at least partially cover the functional area. Thus, the adhesion promoter layer can be applied in step b3) in such a way that the adhesion promoter layer at least partially covers the functional area. This can ensure that the functional area adheres to the film.

[0054] "Adhere" is understood here to mean that the sensor film adheres to the film in such a way that a predefined minimum adhesion force is achieved, which enables the sensor film to adhere reliably to the film. The adhesion force is at least so strong that the sensor film cannot be separated from the intermediate product or final product including the applied sensor film and the film during intended use. However, the adhesion force does not have to be so strong that the sensor film cannot be separated from the film even under great force, for example when (it is) torn off. Thus, the adhesion force can be such that the sensor film can be mechanically separated from the film without damaging the film or the sensor film.

[0055] Preferably, the adhesion is given as a tensile force in newtons per centimeter, in particular the centimeter here represents the width of the film and / or the sensor film. Preferably, the adhesion is greater than 3 N / cm, in particular greater than 10 N / cm, preferably greater than 30 N / cm. For example, the tearing (Abreiβen) of the at least one sensor film preferably indicates that the adhesion is in particular greater than the strength of the at least one film.

[0056] Advantageously, the adhesion promoter layer covers at least 30%, preferably at least 50%, more preferably at least 70% of the functional area.

[0057] Furthermore, the adhesion promoter layer may not cover the at least one contact area over the entire surface. Thus, when viewed perpendicular to the plane formed by the carrier substrate, the adhesion promoter layer may not cover the entire at least one contact area. This enables, for example, the reliable and robust contacting of an electrical functional structure that provides a touch area function. of the electrical functional structure.

[0058] Advantageously, when viewed perpendicular to the plane formed by the carrier substrate, the adhesion promoter layer does not cover the area adjacent to the at least one contact area.

[0059] Furthermore advantageously, the area adjacent to the at least one contact area has a width of at least 0.2 mm, preferably at least 0.5 mm, more preferably at least 1 mm, even more preferably at least 2 mm. The width here in particular refers to the distance between the interface formed by the at least one contact area and the area adjacent to the at least one contact area and the interface formed by the adhesion promoter layer and the area adjacent to the at least one contact area.

[0060] This promotes the contacting of the electrical functional structure because the area where the sensor film is not adhered to the film increases. Since this area is directly adjacent to the contact area, for example, the sensor film in the contact area can be lifted during the contacting process, thereby making the contact structure more accessible and thus further promoting the contacting. Therefore, the area adjacent to the at least one contact area can be moved such that the at least one contact area can be lifted.

[0061] Preferably, the total length of the non - adhered contact area or tail is generally at least 10 millimeters long, in particular several centimeters long.

[0062] Furthermore, the adhesion promoter layer can be a layer comprising a polymer and / or copolymer, in particular poly(methyl)methacrylate (PMMA), polyester, polyurethane (PU) or polyvinyl chloride (PVC).

[0063] Less preferably, the adhesion promoter layer has a natural resin, preferably rosin, phenolic resin, isocyanate (NCO) crosslinked binder, such as melamine-formaldehyde condensation resin (MF), melamine-phenol-formaldehyde resin (MPF), melamine polyester, melamine-urea formaldehyde resin (UMF), poly(organo)siloxane or radiation curable binder.

[0064] A "binder" is understood here as a substance by means of which solids, in particular solids with a fine degree of fragmentation, can be connected to one another or to a substrate. Thus, the binder can be added in liquid form to the solids to be bonded.

[0065] Advantageously, the adhesion promoter layer has a layer thickness between 0.1 μm and 50 μm, preferably between 0.25 μm and 25 μm, more preferably between 0.5 μm and 7 μm.

[0066] Furthermore, it is advantageous if the adhesion promoter layer comprises one or more layers. Thus, the adhesion promoter layer can comprise two layers, in particular a first adhesion promoter layer and a second adhesion promoter layer. Thereby, the adhesion of the sensor film to the membrane can be optimized. Thus, for example, the second adhesion promoter layer arranged in particular between the first adhesion promoter layer and the membrane can be coordinated with the material of the membrane, and the first adhesion promoter layer can be coordinated with the layer adjacent to the sensor film of the first adhesion promoter layer, such as the material of a protective lacquer layer. Thus, by appropriately selecting the first and second adhesion promoter layers, the adhesion of the sensor film to the membrane can be optimized.

[0067] Advantageously, the adhesion promoter layer is made of a material that is highly transparent after applying the sensor film to the membrane, in particular the adhesion promoter layer is made of a material that has a transmittance of more than 85%, preferably more than 90%, for light in the wavelength range between 380 nm and 780 nm after applying the sensor film to the membrane. Thereby, for example, it can be achieved that the intensity of the light in the wavelength range between 380 nm and 780 nm emitted by the membrane is not significantly reduced by the adhesion promoter layer. Furthermore, the visual information of the membrane can be clearly seen through the sensor film applied to the membrane. Thereby, for example, it can be achieved that the resolution and color reproduction of a display screen or monitor on which the sensor film is applied are not changed for a human observer.

[0068] The primer layer, especially in the state before being applied to the film, can have a cloudy visual appearance and thus (also) is not highly transparent. The cloudy appearance can be caused, for example, by the refractive index difference between the primer layer and the surrounding air and / or by the surface roughness of the primer layer, especially the surface roughness on the side of the primer layer facing away from the at least one conductive layer. The surface roughness can especially scatter the incident light and thereby create a cloudy impression. Such surface roughness can especially be generated based on the coating method used when applying the primer layer. For example, the surface roughness can be formed by the printing pattern of a gravure anilox roll or a screen printing tool. In contrast, after the sensor film is applied to the film, the primer layer is highly transparent because the primer layer is melted especially by thermal lamination and / or is flattened by pressure in such a way that the surface roughness of the primer layer no longer appears disturbingly. Thus, if the refractive index difference between the film material and the primer layer material is especially less than 0.1, the optical interface between the primer layer and the film is no longer visible.

[0069] "Transparent" is understood here as the property of a substance that allows light in the wavelength range visible to the human eye, especially light in the wavelength range between 380 nm and 780 nm, to pass through. The term "highly transparent" thus describes the property of a substance that allows light in the wavelength range visible to the human eye, especially light in the wavelength range between 380 nm and 780 nm, to pass through with little attenuation and essentially without hindrance. For a human observer, a highly transparent layer thus has basically no recognizable light absorption, so that the decrease in light intensity when light passes through the layer is hardly recognizable to the human observer.

[0070] "Cloudy" means here the property of a substance such that light in the wavelength range visible to the human eye, especially light in the wavelength range between 380 nm and 780 nm, cannot pass through the substance without hindrance. A cloudy layer, for example, prevents light from passing through it unhindered through its scattering properties. Light can also be absorbed and / or reflected in the cloudy layer. A cloudy layer can, for example, create a milky visual impression for a human observer, so that other layers arranged below the cloudy layer are perceived as, for example, blurred and / or obscured.

[0071] Furthermore, it is advantageous that the adhesion promoter layer is made of a material that is optically clear after the sensor film has been applied to the film. In particular, the adhesion promoter layer is made of a material that deflects less than 8%, preferably less than 4%, of the light in the wavelength range between 380 nm and 780 nm by scattering after the sensor film has been applied to the film. Thereby, for example, it can be achieved that the image and / or film generated by the film, such as a display screen or a monitor, is substantially not affected by the sensor film applied to the film for a human observer. Therefore, the low scattering of the material of the adhesion promoter layer and thus of the adhesion promoter layer itself ensures that when the sensor film is applied to a display screen or a monitor, the image generated by the display screen or the monitor is not perceived as unclear or blurred for a human observer. Thus, thereby, especially in the case of a high-resolution display screen or monitor with a pixel density exceeding 200 ppi (ppi = pixels per inch), a brilliant and true-to-original visual impression of the image generated by the display screen or the monitor can be achieved by the sensor film.

[0072] As described above, the adhesion promoter layer, in the state before it has been applied to the film, especially due to the surface roughness of the adhesion promoter layer, can have the property of light scattering and thus have a cloudy visual appearance. Especially when the sensor film is applied to the film and the adhesion promoter layer is melted and / or smoothed, for example, by the heat and / or pressure input during thermal lamination, so that the surface roughness of the adhesion promoter layer no longer appears disturbingly, the adhesion promoter layer especially then becomes transparent. That is to say, through the physical and / or chemical changes of the adhesion promoter layer during or after the sensor film is applied to the film, the adhesion promoter layer becomes highly transparent and / or optically clear.

[0073] The adhesion promoter layer can be made of a hot melt adhesive, a cold adhesive or a radiation-curable adhesive, especially an adhesive that can be cured by means of electromagnetic radiation and / or electron radiation.

[0074] Furthermore, the adhesion promoter layer can be designed in a patterned manner, especially in the form of a rectangle, a rounded rectangle or a motif. Therefore, the pattern of the patterned adhesion promoter layer can be adapted to the structure of the film.

[0075] The adhesion promoter layer can also be applied in a grid, especially a one-dimensional or two-dimensional grid. Therefore, the adhesion promoter layer can be applied according to a dot grid or a line grid. During the application of the sensor film to the film, the grid formed by the adhesion promoter layer is smoothed, so that the transparency of the sensor film is not negatively affected by the adhesion promoter layer applied in a grid.

[0076] Advantageously, the sensor film has a transmittance of more than 75%, preferably more than 80%, further preferably more than 85%, even more preferably more than 90% for light in the wavelength range between 380 nm and 780 nm at least in the functional region of the at least one conductive layer after being applied to the film.

[0077] This transmittance describes the transmissibility of the sensor film for light in the wavelength range between 380 nm and 780 nm. The light incident on the sensor film is partially reflected at the air-sensor film interface and at the interfaces of the layers of the sensor film. In addition, the light incident on the sensor film is partially absorbed as it traverses the sensor film. The remaining part of the light passes through the sensor film and exits again on the opposite side of the sensor film. To determine the transmittance τ, the quotient of the light intensity I behind the sensor film and the light intensity in front of the sensor film is determined. The transmittance τ is a measure of the "transmitted" intensity and has a value between 0 and 1. The transmittance is usually wavelength-dependent for the incident light. Therefore, in addition to the transmittance value, the wavelength range is also given.

[0078] As described above, before the sensor film is applied to the film, the adhesion promoter layer may have a cloudy visual appearance, for example based on surface roughness. In particular, the surface roughness is leveled during the application process, so that the adhesion promoter layer is highly transparent and / or clear after being applied to the film, so that the cloudy visual impression of the adhesion promoter layer disappears and the sensor film generally has a transmittance of more than 75%, preferably more than 80%, further preferably more than 85%, and even more preferably more than 90% for light in the wavelength range between 380 nm and 780 nm, at least in the functional region of the at least one conductive layer. As will be further explained later, it is advantageous to apply the sensor film to a film with a known transmittance and then determine the total transmittance of the electrical functional element formed by the film and the sensor film.

[0079] In particular, the sensor film includes a release layer that at least partially covers the at least one contact area when viewed perpendicular to the plane formed by the carrier substrate. Therefore, the method may further include the step of: b6) applying the release layer such that the release layer at least partially covers the at least one contact area when viewed perpendicular to the plane formed by the carrier substrate. Thus, the release layer can prevent the adhesion of the at least one contact area.

[0080] Furthermore, it is advantageous that the carrier substrate and / or the at least one conductive layer and / or the release layer and / or the protective lacquer layer are configured to be transparent.

[0081] The release layer may also completely cover the at least one contact area.

[0082] In addition, the release layer may cover the area adjacent to the at least one contact area.

[0083] The release layer also ensures that the sensor film does not adhere to the film in the area with the release layer. Therefore, the release layer can prevent the at least one contact connection area from adhering to the film, especially from adhering to the film due to thermally laminating the sensor film onto the target substrate.

[0084] The release layer is preferably made of wax, polyethylene (PE), polypropylene (PP), cellulose derivatives or poly(organo)siloxanes. The aforementioned wax can be natural wax, synthetic wax or a combination thereof. The aforementioned wax is, for example, palm wax. The aforementioned cellulose derivatives are, for example, cellulose acetate (CA), cellulose nitrate (CN), cellulose acetate butyrate (CAB) or a mixture thereof. The aforementioned poly(organo)siloxanes are, for example, silicone adhesives, polysiloxane adhesives or a mixture thereof.

[0085] Less preferably, the release layer has natural resins, preferably rosin, phenolic resins, halogen-containing fluoropolymers, such as polyvinyl chloride (PVC), polyvinyl fluoride (PVF), polytetrafluoroethane (PTFE), polyvinylidene fluoride (PVDF) or polyvinylidene chloride (PVDC), polyesters, such as polybutylene terephthalate (PBT), polycyclohexylene terephthalate (PCT), polyethylene terephthalate (PET), polytrimethylene terephthalate (PTT), polyethylene naphthalate (PEN), polycarbonate (PC), polyester carbonate (PEC), polyacrylate (PAC) or unsaturated polyester resins (UP), polymeric carboxylates, such as poly(methyl)methacrylate (PMMA), isocyanate (NCO)-crosslinked adhesives, such as melamine-formaldehyde condensation resins (MF), melamine-phenol-formaldehyde resins (MPF), melamine-polyesters, melamine-urea formaldehyde resins (UMF), polyolefins other than PP or PE, such as polymethylpentene (PMP), polyisobutylene (PIB) or polybutene (PB), copolymers including PVC, PMMA, PU, poly(organo)siloxanes and polyolefins other than PP or PE.

[0086] Less preferably, the release layer also has radiation-curable adhesives.

[0087] Preferably, the release layer has a layer thickness between 0.1 μm and 10 μm, preferably between 0.1 μm and 5 μm. This small layer thickness is advantageous, whereby in particular by means of an adapter element and / or a connecting element and / or a contact element, such as by means of a contact spring, a ZIF plug (ZIF = Zero-Insertion-Force), a press contact point, a press-fit flexible contact, an ACF bond (Anisotrope-Conductive-Film), or a conductive rubber connection (ZEBRA), electrical contact can be established for the at least one contact area covered by the release layer. Advantageously, the release layer is locally penetrated by the adapter element and / or the connecting element and / or the contact element during electrical contact, such that the release layer no longer has a locally obstructive, in particular electrically insulating, effect on electrical contact. Advantageously, the electrically insulating release layer is mechanically and physically damaged, in particular by the adapter element and / or the connecting element and / or the contact element, during contact establishment, such that conductivity is established, in particular between the at least one contact area and the adapter element and / or the connecting element and / or the contact element. This is achieved, for example, by a contact spring or by press-fitting. In addition, ZIF contact establishment is also mechanically "cutting", such that electrical contact can also be established for the at least one contact area covered by the release layer. In an ACF bond, the metal pigments in the adhesive layer can penetrate the release layer during the pressing / embossing process of the sensor film, so that electrical contact can also be established by means of an ACF bond.

[0088] In addition, electrical contact establishment does not necessarily have to be effected by a current connection between the at least one contact area and the adapter element and / or the connecting element and / or the contact element and / or the contact layer, in particular the film. Electrical contact can also be achieved by capacitive coupling between two contact surfaces - for example between the at least one contact area and a target contact area, in particular the contact layer of the film - preferably by means of at least one insulating layer arranged therebetween, or by inductive coupling between two contact surfaces - for example between the at least one contact area and a target contact area, in particular the contact layer of the film.

[0089] Preferably, the sensor film includes a protective lacquer layer.

[0090] Advantageously, when viewed perpendicular to the plane formed by the carrier substrate, the protective lacquer layer at least partially covers the at least one conductive layer. Additionally advantageously, the following step is also carried out between step b2) and step b3): - The protective lacquer layer is applied in such a way that, when viewed perpendicular to the plane formed by the carrier substrate, the protective lacquer layer at least partially covers the at least one conductive layer. Thus, the protective lacquer layer can protect the at least one conductive layer from mechanical, physical, and / or chemical environmental influences.

[0091] When viewed perpendicular to the plane formed by the carrier substrate, the protective lacquer layer may also entirely cover the at least one conductive layer over the entire surface in the functional region.

[0092] The sensor film may also include one or more protective lacquer layers.

[0093] In particular, the protective lacquer layer protects other layers of the sensor film from mechanical, physical, and / or chemical environmental influences or further process steps, and the protective lacquer layer forms the outermost layer of the sensor film or an intermediate product or a final product, in particular an electrical functional element to which the sensor film is applied.

[0094] Advantageously, the protective lacquer layer has a layer thickness between 0.1 μm and 50 μm, preferably between 0.25 μm and 25 μm, and more preferably between 0.5 μm and 15 μm.

[0095] Preferably, the protective lacquer layer is a transparent protective lacquer layer, which is made of PMMA, polyester, PU, or PVC in particular.

[0096] Less preferably, the protective lacquer layer has natural resins, preferably rosin, phenolic resin, isocyanate (NCO)-crosslinked binders, such as MF, MPF, melamine-polyester, UMF, polyolefins other than PP or PE, such as PMP, PIB, or PB.

[0097] It is also advantageous that the protective lacquer layer is provided between the at least one conductive layer and the adhesion promoter layer.

[0098] The protective lacquer layer may also be applied such that the protective lacquer layer is provided between the at least one conductive layer and the adhesion promoter layer. Thus, the protective lacquer layer may be provided on the side of the at least one conductive layer facing away from the carrier substrate.

[0099] In addition, the sensor film may have a structure in the following order:

[0100] - Carrier substrate

[0101] - At least one conductive layer

[0102] - Protective lacquer layer

[0103] - Adhesion promoter layer.

[0104] In addition, a protective paint layer can be provided between the at least one conductive layer and the carrier substrate. Here, the conductive layer is embedded between the protective paint layer and the adhesion promoter layer and is protected. The protective paint layer and the adhesion promoter layer are preferably made of paints having similar physical properties, which particularly relate to mechanical deformability and stretchability. Thereby, the embedded conductive layer can be prevented from being damaged, such as torn, in the case of strong deformation of the sensor film, thus maintaining its electrical functionality. In addition, the embedding of the above-mentioned conductive layer also prevents delamination of these layers.

[0105] The sensor film can also include a primer layer, especially a primer layer that can be vapor-deposited for metallization. Advantageously, the primer layer is provided between the protective paint layer and the at least one conductive layer.

[0106] Advantageously, the primer layer is a layer made of a polymer and / or copolymer, and the copolymer especially includes poly(methyl) methacrylate (PMMA), polyester, polyurethane (PU), or polyvinyl chloride (PVC).

[0107] Less preferably, the primer layer has a natural resin, preferably rosin, phenolic resin, isocyanate (NCO)-crosslinked binder, such as melamine-formaldehyde condensation resin (MF), melamine-phenol-formaldehyde resin (MPF), melamine-polyester, melamine-urea formaldehyde resin (UMF), poly(organo)siloxane, or radiation-curable binder.

[0108] Preferably, the primer layer has a layer thickness between 0.1 μm and 5 μm, preferably between 0.1 μm and 2 μm.

[0109] The sensor film can also have a structure in the following order:

[0110] - Carrier substrate

[0111] - Protective paint layer

[0112] - Primer layer

[0113] - At least one conductive layer

[0114] - Adhesion promoter layer.

[0115] In addition, the sensor film can be a transfer film.

[0116] Advantageously, the transfer film has a carrier layer, especially a carrier substrate, and a transfer layer that can be peeled off from the carrier layer, especially the carrier substrate.

[0117] Advantageously, a separation layer is provided between the carrier layer, especially the carrier substrate, and the transfer layer, and this separation layer enables the transfer layer to be separated from the carrier layer, especially the carrier substrate.

[0118] Therefore, only the transfer layer can be applied to the film, especially by hot stamping.

[0119] However, the carrier layer, especially the carrier substrate, may also not be peeled off after being applied to the film, so that the carrier layer, especially the carrier substrate, also remains on the film.

[0120] In addition, the sensor film may include a separation layer. The separation layer may be one or more layers. Preferably, the separation layer is provided between the carrier substrate and the protective lacquer layer. Thus, for example, it can be achieved that the carrier substrate can be peeled off after the sensor film is applied to the film. Thereby, better deformability and / or stretchability of the applied sensor film can be achieved, because the thicker carrier substrate with lower deformability and / or stretchability is removed. The protective lacquer layer undertakes the function of protecting the sensor film.

[0121] Preferably, the separation layer is a wax layer and / or a polymer layer made of, for example, acrylate and / or melamine formaldehyde resin-crosslinked lacquer. Preferably, the separation layer has a layer thickness of less than 1 μm.

[0122] Advantageously, it can be specified that the adhesion between the carrier substrate and the protective lacquer layer is 20% to 80%, preferably 30% to 70% lower based on the separation layer provided between the carrier substrate and the protective lacquer layer than the adhesion between the protective lacquer layer and the primer layer and / or the at least one conductive layer and / or the adhesion promoter layer.

[0123] Therefore, the adhesion between the carrier substrate 2 and the protective lacquer layer 6 can be 20% to 80%, preferably 30% to 70% smaller based on the separation layer provided between the carrier substrate 2 and the protective lacquer layer 6 than the adhesion between the layers of the transfer layer, and the layers are especially selected from the group consisting of: protective lacquer layer, primer layer, at least one conductive layer, one or more decorative layers, adhesion promoter layer, intermediate adhesion layer, dielectric layer, darkening layer and contact strengthening layer. The adhesion is measured by a tensile testing machine Zwick Z005 of Zwick GmbH&Co.KG in Ulm, Germany. For this purpose, the transfer film is flatly adhered to the lower support. Then, the layer to be peeled off is peeled off at a right angle by a tensile test. The peeling force is determined by a dynamometer.

[0124] Therefore, the sensor film may have a structure in the following order:

[0125] - Carrier substrate

[0126] - Separation layer

[0127] - Protective lacquer layer

[0128] - Primer layer

[0129] - At least one conductive layer

[0130] - Adhesion promoter layer.

[0131] In an implementation variant where the sensor film serves as the transfer film, since the adhesion promoter layer does not cover the at least one contact area, the electrical functional structure can also be contacted after the sensor film is applied to the film. Thus, for example, an electrical connection can be established by the above-mentioned contact method. The optional separation layer also enables the carrier substrate to be at least partially peeled off, thereby further improving the subsequent contact possibility because in this implementation variant the sensor film is not adhered to the edge of the carrier substrate.

[0132] In addition, in particular, a reinforcing element can be applied after removing the carrier substrate in order to improve the mechanical stability of the applied transfer layer.

[0133] According to another implementation variant, the film has a contact layer which is in particular used for electrically contacting the at least one contact area of the sensor film.

[0134] Preferably, the contact layer is directly applied to the film.

[0135] In addition, the contact layer can have at least one connecting element.

[0136] In addition, the contact layer can have at least one adapter element and / or contact element.

[0137] Preferably, the film itself already has at least one connecting element and / or adapter element and / or contact element which are in particular used for electrically contacting the at least one contact area of the sensor film.

[0138] Advantageously, the contact layer is arranged in at least one target contact area of the film. Preferably, the at least one target contact area of the film forms a mating part with respect to the at least one contact area of the sensor film. Thus, advantageously, the at least one target contact area of the film and the at least one contact area of the sensor film preferably coincide congruently (deckungsgleich) after the sensor film is applied to the film, in particular the at least one target contact area of the film and the at least one contact area of the sensor film overlap at least partially after the sensor film is applied.

[0139] In addition, the film can have at least one third conductive layer. Preferably, the at least one third conductive layer has a plurality of conductor lines. Thus, the at least one third conductive layer can have a conductive structure, in particular conductor lines, which are preferably arranged in a grid. The grid can be regular or irregular. The grid can in particular be composed of grid elements such as lines and / or surface elements.

[0140] In addition, the at least one third conductive layer can also have other electrical components.

[0141] Other electrical components may in particular be passive electrical components, preferably resistors or capacitors, and / or active components, preferably transistors, diodes, light-emitting diodes, integrated circuits, processors and / or connection components, more preferably conductor tracks, cables, plugs, sockets.

[0142] Advantageously, the at least one third conductive layer of the film is electrically connected to the at least one contact layer.

[0143] Thus, the film can be equipped, for example, with conductor tracks and / or other electrical components. Advantageously, these conductor tracks are electrically connected to the other electrical components in a known manner by means of plug contacts or other known contact-making methods. Preferably, this can be done by means of laser direct structuring (LDS) or by means of printed contacts, in particular contacts printed by screen printing or also by means of a contact layer, which is applied, for example, by lamination and / or heat stamping or cold embossing. Thus, the film can be, for example, a printed circuit board.

[0144] Thus, by means of the contact layer, the at least one third conductive layer of the film can be electrically connected to the functional region of the conductive layer of the sensor film through the contact-making region of the contacts of the sensor film. The contact layer on the film thus forms a mating contact with respect to the contact-making region of the sensor film.

[0145] It is furthermore advantageous if the contact layer, in particular the at least one connecting element and / or adapter element and / or contact element and / or the at least one third conductive layer are produced and / or applied by means of laser direct structuring (LDS) and / or by means of printing, in particular by screen printing and / or inkjet printing.

[0146] Furthermore, the contact layer, in particular the at least one connecting element and / or adapter element and / or contact element, can also be applied by means of lamination and / or heat stamping or cold embossing.

[0147] Furthermore, the contact layer, in particular the at least one connecting element and / or adapter element and / or contact element on the film, is made of a conductive paste, in particular a carbon paste, which comprises silver (Ag), gold (Au), aluminium (Al), copper (Cu), chromium (Cr) and / or other conductive metals. Furthermore, the conductive paste, in particular the carbon paste, can also comprise an adhesive, which in particular comprises rosin resin and / or phenolic resin, polymers and copolymers. The adhesive of the conductive paste, in particular the carbon paste, is a natural resin, preferably rosin, phenolic resin, polymers and copolymers, the copolymers comprising PVC, PMMA, PU, polyester, isocyanate (NCO)-crosslinked adhesives, such as MF, MPF, melamine polyester, UMF. Less preferred are adhesives of conductive pastes comprising poly(organo)siloxanes and their copolymers and / or radiation-cured adhesives.

[0148] Furthermore, the sensor film can be printed in a full-surface or partial pattern in the at least one contact area, for example, in a grid with a Haftlack. Thus, the sensor film can have a Haftlack in the at least one contact area.

[0149] As an alternative, the sensor film can also not have a Haftlack in the at least one contact area or the Haftlack can be completely omitted locally in the contact area.

[0150] Therefore, when the sensor film is applied to the film provided with a contact layer, it is preferably to generate an electrical (pressure) contact (by heat and pressure) between the sensor film and the film, especially in the at least one contact area and / or the target contact area. Here, the electrical (pressure) contact can act permanently through bonding, especially through a Haftlack.

[0151] Furthermore, an ACF bonding tape can be introduced between the at least one contact area of the sensor film and the at least one target contact area of the film. Thus, the electrical connection in the contact area can be further improved. Advantageously, the application process (heat and pressure) also largely corresponds to the usual ACF bonding process.

[0152] Furthermore, it is advantageous to design the contact layer of the film such that two or more sensor films can be applied to the film. Thus, the contact layer of the film can have connection elements and / or adapter elements and / or contact elements for electrical contact with at least two sensor films.

[0153] Therefore, the film can also have a contact layer for contacting the first sensor film in the first target contact area and a contact layer for contacting the second sensor film in the second target contact area.

[0154] Advantageously, the film on which at least two sensor films should be applied already has a contact layer, and this contact layer is designed such that a double-layer sensor including a sensor film for the x layer and a sensor film for the y layer can be applied.

[0155] Therefore, as described above, the electrical contacts and contact leads for the double-layer sensor including the x layer and the y layer can also already be located on the film on which the at least two sensor films should be applied. Preferably, the x layer and the y layer are each formed by a sensor film. First, preferably, the first sensor layer, such as the x layer, is applied to the film with a sensor film and an electrical contact is established. Advantageously, the first sensor layer is applied to the film with precise registration (Passergenau) relative to the contact layer, especially relative to the at least one connection element and / or adapter element and / or contact element of the film, in order to electrically contact especially the first sensor layer.

[0156] Thus, in the first step, the first sensor film can be applied to the film such that at least one contact area of the first sensor film at least partially overlaps with a target contact area of the contact layer to establish electrical contact with the first sensor film.

[0157] Preferably, in a separate step thereafter, the second sensor layer, such as the y-layer, is applied to the film with high precision registration relative to the first sensor layer or relative to the contact layer, in particular with respect to at least one connecting element and / or adapter element and / or contact element of the film, so as to establish electrical contact with, in particular, the second sensor layer. Bonding between the sensor layers, for example by means of OCA, can be omitted here. The registration accuracy, i.e., the positional accuracy of the second sensor layer relative to the first sensor layer in the x-direction and y-direction, is preferably ±350 μm, more preferably ±150 μm, in order to achieve the desired sensor function.

[0158] Thus, in the second step, the second sensor film can be applied to the film such that at least one contact area of the second sensor film at least partially overlaps with a target contact area of the contact layer to establish electrical contact with the second sensor film.

[0159] The preferred design of the at least one contact area and / or the at least one contact structure is described below.

[0160] The at least one contact structure preferably used for establishing electrical contact with an electrical functional structure is an electrical connector, in particular a plug.

[0161] Advantageously, the at least one conductive layer has a contact strengthening layer.

[0162] Furthermore advantageously, the at least one conductive layer at least partially has a contact strengthening layer in the at least one contact area, and the contact strengthening layer protects the at least one contact area from mechanical, physical and / or chemical environmental influences.

[0163] Therefore, the following step can be performed between step b2) and step b3):

[0164] - The contact strengthening layer is applied such that the at least one conductive layer has a contact strengthening layer, in particular the at least one conductive layer at least partially has a contact strengthening layer in the at least one contact area.

[0165] The durability / persistence of the at least one contact area is improved by the contact strengthening layer because the contact area is protected by the contact strengthening layer from, for example, corrosion or scratching. In addition, the mechanical stability of the contact area, in particular the bending stability and / or the folding stability, can also be improved.

[0166] Furthermore, the contact enhancement layer can cover the at least one contact area over the entire surface.

[0167] The at least one contact area can also have one or more separate contact areas. "Separate" is understood here to mean that the contact areas are spaced apart from each other, in particular the contact areas have a distance of at least 0.1 mm, preferably at least 0.2 mm, more preferably at least 0.5 mm from each other.

[0168] Furthermore, it is advantageous if the contact enhancement layer has a layer thickness between 0.1 μm and 100 μm, preferably between 0.25 μm and 25 μm, more preferably between 0.5 μm and 10 μm.

[0169] The contact enhancement layer can be made of a conductive paste, in particular a carbon paste, which includes silver (Ag), gold (Au), aluminum (Al), copper (Cu), chromium (Cr) and / or other conductive metals. Furthermore, the conductive paste, in particular the carbon paste, can include an adhesive, which in particular includes rosin resin and / or phenolic resin, polymers and copolymers.

[0170] The adhesive of the conductive paste, in particular the carbon paste, is a natural resin, preferably rosin, phenolic resin, polymers and copolymers, and the copolymer includes PVC, PMMA, PU, polyester, isocyanate (NCO)-crosslinked adhesives such as MF, MPF, melamine polyester, UMF. Less preferred are adhesives of conductive pastes that include poly(organo)siloxanes and their copolymers and / or radiation-cured adhesives.

[0171] Advantageously, the adhesion promoter layer, the protective lacquer layer, the release layer and / or the contact enhancement layer are applied by gravure printing, screen printing, letterpress printing or casting techniques.

[0172] The following describes the preferred design of the at least one conductive layer and / or the electrofunctional structure:

[0173] Preferably, the electrofunctional structure forms a touch sensor area, in particular a capacitive sensor area, which provides a touch area function. The electrofunctional structure can also form a resistive or inductive sensor area.

[0174] A touch sensor area is understood here to mean a contact-sensitive sensor that can control electrofunctional elements, such as a PDA. A touch sensor area is also understood to mean a multi-touch sensor area that can process multiple simultaneous contacts, for example for zooming and rotating an image that is displayed on a display, in particular arranged below the touch sensor area.

[0175] The sensor film can have at least two conductive layers, in particular a first conductive layer and a second conductive layer.

[0176] Advantageously, when viewed perpendicular to the plane formed by the carrier substrate, the at least two conductive layers are arranged at least partially overlapping.

[0177] Thereby, in particular, a multi-layer touch sensor can be manufactured, which can also process multiple simultaneous contacts, for example for zooming and rotating images. For example, a second conductive layer can be provided on a second carrier film, which is applied, in particular, by means of an adhesion promoter layer and / or an intermediate adhesion layer and / or by means of a primer layer and / or an adhesive layer, in particular adhered to the first conductive layer. The primer layer and / or the adhesive layer can be made of a hot melt adhesive, a cold adhesive or a radiation-curable adhesive, in particular an adhesive curable by electromagnetic radiation and / or electron radiation.

[0178] When applying the second conductive layer to the first conductive layer, it is advisable that the two conductive layers are positioned relative to each other with precise registration, in particular with a tolerance of less than 0.25 mm, preferably less than 0.1 mm, in order to provide an undisturbed touch function. Thus, the at least two conductive layers can be arranged with precise registration relative to each other, in particular the at least two conductive layers are arranged relative to each other with a tolerance of less than 0.25 mm, preferably less than 0.1 mm. The conductive layers particularly have a conductive structure, in particular conductor tracks, which are preferably arranged in a grid. The grid can be regular or irregular. The grid can in particular be composed of grid elements such as lines and / or surface elements. The grid elements can form so-called sensor cells here.

[0179] Registration or alignment or registration accuracy or alignment accuracy or positional accuracy should in particular be understood as the positional accuracy of two or more elements and / or layers relative to each other. Here, the registration accuracy should preferably move within a predetermined tolerance and should preferably be as high as possible. At the same time, the registration accuracy of multiple elements and / or layers relative to each other is in particular an important feature for improving process reliability. The precisely positioned alignment is carried out here in particular by means of sensing, preferably optically detectable, registration marks or position marks. In particular, these registration marks or position marks represent special individual elements or regions or layers or they are themselves part of the element or region or layer to be positioned.

[0180] In particular, the at least one conductive layer and / or the two conductive layers have a plurality of conductor tracks.

[0181] The conductor line is herein understood to be preferably a structured conductive layer and the conductive regions of the at least one conductive layer and / or the two conductive layers. In particular, the conductor line is applied in such a way that sufficient transparency for the human eye is retained, i.e., the conductor line is designed in such a way that it is not perceived by a human observer, since the conductor line is below the resolution of the human eye. Despite the use of narrow conductor lines, sufficient conductivity is achieved, which is in particular comparable to that of a layer of indium tin oxide (ITO). Indium tin oxide (ITO) preferably forms a transparent conductive layer, which is used in particular over the entire surface, but can also be structured. Another example of such a transparent conductive layer is PEDOT (poly-3,4-ethylenedioxythiophene). Different from vapor-deposited indium tin oxide (ITO), PEDOT can in particular be applied by means of printing methods and can preferably be simply structured or applied locally. Preferably, the coverage of the at least one conductive layer, in particular the conductor line, on the carrier substrate is less than 30%, preferably less than 20%, more preferably less than 10%, and even more preferably less than 5%.

[0182] Advantageously, the conductor lines are spaced apart from one another. In particular, the conductor lines have a width between 0.2 μm and 20 μm, preferably between 4 μm and 15 μm, and a distance from one another greater than 10 μm, preferably greater than 20 μm, so that the conductor lines are below the resolution of the human eye.

[0183] Advantageously, the conductor lines of the first conductive layer and the second conductive layer are each arranged in a line grid, in particular the line grids are rotated 90° relative to one another. Thus, the first conductive layer and the second conductive layer each have a line grid formed by conductor lines spaced apart from one another. The first conductive layer and the second conductive layer are preferably arranged one above the other in such a way that the two line grids are at right angles, i.e., rotated 90° relative to one another. Preferably, power supply lines and / or contact elements are provided in the edge regions of the two line grids. Preferably, these edge regions are arranged in precise registration with respect to one another with a tolerance of less than 0.25 mm, preferably less than 0.1 mm, in particular in the directions of the coordinate axes x and y, the plane formed by the coordinate axes x and y being parallel to the plane formed by the carrier substrate.

[0184] It is further preferred that the conductor lines of the first conductive layer and the second conductive layer are structured, in particular in such a way that the conductor lines of the first conductive layer and the second conductive layer form a plurality of surface elements, preferably rhomboid or diamond-shaped surface elements. Thus, for example, the first conductive layer and the second conductive layer may each have a so-called diamond structure. This diamond structure is formed by a plurality of, in particular rhomboid (rombus) surface elements along the linear conductor lines. Here, the first conductive layer and the second conductive layer each have a plurality of diamond structures spaced apart from one another. The first conductive layer and the second layer are arranged one above the other in such a way that the two diamond structures are arranged at a right angle, i.e., rotated 90° relative to one another. Here, the surface elements of the first conductive layer are arranged in the "notches" in the free gaps between the surface elements of the second conductive layer. Here, the linear conductor lines of the conductive layers cross in the gaps between the surface elements. In this preferred embodiment variant, the exact position of the surface elements relative to one another is particularly important and it is advantageous that the surface elements are arranged relative to one another with a registration accuracy of less than 0.25 mm, preferably less than 0.1 mm, especially in the directions of the x and y coordinates.

[0185] Here, the conductor lines can be shaped in the area of the surface elements in accordance with the shape of the surface elements, so that the material of the conductive layer fills the surface elements over the entire surface. In addition, the conductor lines can extend along the surface elements in such a way that the conductor lines at least partially surround the surface elements. Thus, the surface elements can be formed by a conductive layer over the entire surface or by a conductive layer that is only locally present, in particular a rasterized conductive layer, which includes conductive raster elements and in particular transparent non-conductive surface areas between the raster elements. The raster forming the raster elements can be regular or irregular. Here, regular and irregular raster surfaces can in particular also be arranged adjacent to one another or otherwise jointly form an overall raster. In particular, the surface elements can be translucent based on the rasterization and the raster elements cover less than 50% of the surface.

[0186] In addition, the conductive structures formed by the structured conductive layers and / or the conductive regions of the conductive layers of the first conductive layer and the second conductive layer can also each have different geometries and / or dimensions.

[0187] Advantageously, the contact regions of the at least two conductive layers, in particular the contact structures, meet in a common contact region. Thereby, it can contribute to external contacting.

[0188] Furthermore, the common contact area can be electrically contacted by means of the electrical contacts of the adapter element. Thus, for example, a particularly flexible adapter element can be fixed to the common contact area, which electrically contacts the contact points in the common contact area and is conductively connected to another contact element on the outside. The electrical contact between the common contact area and the adapter element is preferably achieved by means of a conductive adhesive, in particular by means of ACF bonding (ACF = anisotropic conductive film). Here, the conductive adhesive can form the connecting element. The said another contact element can in particular be, for example, a standardized plug connector, such as a ZIF connector (ZIF = zero insertion force).

[0189] Advantageously, the conductor line is made of a metal, in particular silver (Ag), gold (Au), aluminum (Al), copper (Cu) or chromium (Cr), with a layer thickness between 1 nm and 100 nm, preferably between 2.5 nm and 75 nm, more preferably between 5 nm and 50 nm. However, the conductor line can also have a layer thickness between 100 nm and 5 μm.

[0190] The conductor line can also be made of a conductive paste comprising silver (Ag), in particular conductive silver paste, gold (Au), copper (Cu) and / or carbon and in particular a binder.

[0191] Furthermore or additionally, the at least one conductive layer can also have at least one layer made of ITO (InSnOx = indium-tin-oxide = In2O3:SnO2) and / or PEDOT (PEDOT = poly-3,4-ethylenedioxythiophene) and / or AZO (AlZnOx = aluminum-zinc-oxide = Al:ZnO). The ITO and / or PEDOT and / or AZO layer is preferably applied over the entire surface by magnetron sputtering, sputtering or (vacuum) evaporation and less preferably by CVD and PVD methods and preferably has a layer thickness between 1 nm and 100 μm, more preferably between 10 nm and 10 μm.

[0192] Preferably, the ITO and / or PEDOT and / or AZO layer is arranged directly adjacent to the conductive layer made of a metallic substance.

[0193] Preferably, in step b2) and / or b3), the at least one conductive layer comprises at least one metal layer and / or a layer made of ITO and / or AZO and / or PEDOT and / or conductive paint, in particular step b) comprises one or more of the following further steps, in particular the following further steps are carried out in the following order, preferably in a cyclic order:

[0194] b4a) applying the at least one conductive layer in one or more sub-steps;

[0195] b4b) Structuring the at least one conductive layer by at least locally removing the at least one conductive layer in one or more sub-steps; and / or

[0196] b5) Applying the at least one conductive layer in a structured form in one or more sub-steps.

[0197] Preferably, in order to form the at least one conductive layer, the carrier substrate is preferably provided with a conductive layer over its entire surface, for example by vapor deposition or sputtering of a metal layer, and then the conductive layer is removed locally again accordingly by positive etching or negative etching or by means of a washing method to form an electrical functional structure and a contact structure. In addition, by means of an evaporation mask, by printing a conductive material and / or by post-current strengthening of the printed structure, the at least one conductive layer can already be applied to the carrier substrate in the form of a functional structure and / or a contact structure.

[0198] Preferably, the sensor film has a dielectric layer and / or a semiconductor layer, which is arranged between a first conductive layer of the at least one conductive layer and a second conductive layer of the at least one conductive layer.

[0199] In addition, the at least one conductive layer can have, in particular, a force sensor for measuring pressure. Thereby, in addition to the x and y coordinates of the position of a contact on a plane defined by the x and y coordinates, which are generated, for example, by a touch sensor area, in particular a capacitive sensor area, the touch intensity can also be determined in the form of a z coordinate (the z coordinate is perpendicular to the x and y coordinates). Thereby, x, y, and z information of the contact can be generated. The z information can be used, for example, to control an electrical functional element to which the sensor film is applied, depending on whether the z information exceeds a predefined threshold. In particular, the force sensor for measuring pressure is preferably a piezoelectric thin layer. The force sensor can also be a piezoresistive pressure sensor and / or a piezoelectric pressure sensor. In addition, the force sensor can be an actuator, in particular a key, and each actuator has at least two electrical states depending on the force acting on the actuator.

[0200] In addition, the at least one conductive layer can also at least locally have a surface relief structure, in particular a matte structure. Thereby, light incident on the at least one conductive layer can be deflected by diffraction, scattering, and / or reflection, so as to avoid the impression that the conductive layer reflects light, especially in direct specular reflection. Thus, for example, a display to which the sensor film is applied appears uniformly black in the off state.

[0201] When viewed in a plane perpendicular to the plane formed by the carrier substrate, one or more optically active layers, in particular a darkening layer and / or a layer having light-scattering properties, may also at least partially cover the at least one conductive layer. Thereby, the possible visibility of the at least one conductive layer, especially in direct specular reflection, can be further reduced. For example, the darkening layer absorbs incident light, thereby reducing the proportion of light reflected by the at least one conductive layer or completely avoiding reflection. The layer having light-scattering properties also reduces the proportion of light reflected by the at least one conductive layer. The layer having light-scattering properties is, for example, a layer having a matte structure with randomly selected relief parameters.

[0202] Furthermore, it is advantageous if the carrier substrate has a layer thickness between 2 μm and 250 μm, preferably between 23 μm and 125 μm. However, the carrier substrate may also have a layer thickness of less than 2 μm.

[0203] Advantageously, the sensor film has a maximum thickness of 150 μm, preferably 100 μm, more preferably 75 μm, overall perpendicular to the plane formed by the underside of the carrier substrate.

[0204] Preferably, the carrier substrate is a transparent carrier substrate, which is especially made of PET, PMMA, PC, acrylonitrile-butadiene-styrene (ABS), PU or glass.

[0205] The carrier substrate may be made of a hybrid material including a plastic layer and a fiber material layer.

[0206] The carrier substrate may also be made of a fabric or a knitted fabric, for example, made of a woven or non-woven fabric. The textile fabric may especially contain fibers made of natural fibers and / or plastics and / or carbon fibers or be made thereof.

[0207] Furthermore, the film may be another single-layer or multi-layer sensor film. Here, an intermediate product for further processing is produced by applying the sensor film to a film in the form of the other single-layer or multi-layer sensor film.

[0208] In particular, the sensor film includes at least one intermediate adhesion layer. Thereby, one or more additional layers can be applied to the sensor film, and the adhesion of the one or more additional layers is achieved through the intermediate adhesion layer.

[0209] Preferably, the at least one conductive layer is arranged between the carrier substrate and the at least one intermediate adhesion layer.

[0210] Furthermore, the at least one intermediate adhesion layer may be provided on the side of the carrier substrate facing away from the at least one conductive layer. Thus, the method may further include the following step: f) applying the intermediate adhesion layer, in particular, such that the at least one conductive layer is disposed between the carrier substrate and the at least one intermediate adhesion layer and / or when viewed perpendicular to the plane formed by the carrier substrate, the at least one intermediate adhesion layer at least partially does not cover the at least one contact area.

[0211] It is also advantageous if the at least one intermediate adhesion layer at least partially does not cover the at least one contact area when viewed perpendicular to the plane formed by the carrier substrate. By ensuring that the intermediate adhesion layer at least partially does not cover the at least one contact area, reliable and stable electrical contact with the functional structure can be achieved after applying the sensor film to the film.

[0212] It is also suitable if the intermediate adhesion layer completely does not cover the at least one contact area.

[0213] Furthermore, it is advantageous if the intermediate adhesion layer at least partially covers the functional area.

[0214] The at least one intermediate adhesion layer is substantially disposed in the same region as the adhesion promoter layer when viewed perpendicular to the plane formed by the carrier substrate, in particular, the at least one intermediate adhesion layer is disposed substantially congruently with the adhesion promoter layer when viewed perpendicular to the plane formed by the carrier substrate.

[0215] Advantageously, the intermediate adhesion layer has a layer thickness between 0.1 μm and 50 μm, preferably between 0.25 μm and 25 μm, and more preferably between 0.5 μm and 7 μm. Preferably, the intermediate adhesion layer is a primer layer and / or an adhesive layer made of a hot melt adhesive, a cold adhesive, or a radiation-curable adhesive, in particular, an adhesive curable by electromagnetic radiation and / or electron radiation. Preferably, the intermediate adhesion layer is applied by gravure printing, screen printing, relief printing, or casting techniques.

[0216] The at least one sensor film and / or the at least one film may also include one or more decorative layers.

[0217] The one or more decorative layers on the sensor film may form an integral decoration with the one or more decorative and / or functional layers on the film and / or complement each other to form an integral decoration and / or these layers overlap. The integral decoration may in particular be formed by adjacent decoration areas on the sensor film and / or on the film, and these decoration areas are preferably directly adjacent to each other or preferably adjacent to each other at a certain distance. These decorations may in particular be continuous patterns or individual images. The integral decoration may in particular be a continuous pattern or an individual image or a combination thereof.

[0218] Preferably, the one or more decorative layers are arranged on the side of the carrier substrate facing away from the at least one conductive layer. To this end, the sensor film may in particular have an intermediate adhesion layer to improve the adhesion of the one or more decorative layers. Thus, for example, the intermediate adhesion layer can be applied to the carrier substrate and / or the at least one conductive layer, and the one or more decorative layers are applied to the carrier substrate by means of this intermediate adhesion layer. The decorative layer can be applied to the intermediate adhesion layer or directly to the carrier substrate by different methods. Particularly advantageously, the decorative layer has a protective layer as the final layer on the side of the carrier substrate facing away from the at least one conductive layer, and this protective layer protects the decorative layer, in particular, from strong pressure and thermal effects acting, for example, during the injection molding and / or lamination process. In addition, the protective layer can prevent mechanical damage that may occur during the processing, such as scratches and the like. The protective layer can also comprise a polymer and in particular a self-supporting film, which is preferably made of PET, PC or PMMA or also of glass or fabric, and which remains on the decoration and forms part of the intermediate or final product.

[0219] Advantageously, the one or more decorative layers are arranged substantially in the same area as the adhesion promoter layer and / or the intermediate adhesion layer, in particular, the one or more decorative layers are arranged substantially congruently with the adhesion promoter layer and / or the intermediate adhesion layer when viewed perpendicular to the plane formed by the carrier substrate.

[0220] Thus, the one or more decorative layers can be applied locally on the side of the carrier substrate facing away from the at least one conductive layer such that the decorative layer substantially covers the same area as the adhesion promoter layer on the other side of the carrier substrate. This ensures that the contact-making area on the side of the carrier substrate facing away from the at least one conductive layer and not covered by the adhesion promoter layer is exposed in the same (projected) surface area and thus the sensor film can form a so-called tail including the contact-making area, and in the subsequent processing steps, the contact-making area can be electrically contacted in a particularly simple manner, for example, by means of a plug connection.

[0221] The one or more decorative layers can also be arranged on the side of the adhesion promoter layer and / or the intermediate adhesion layer facing away from the carrier substrate.

[0222] In addition, the one or more decorative layers can also be arranged on the side of the at least one conductive layer facing away from the carrier substrate.

[0223] The one or more decorative layers are preferably applied here substantially congruently with the adhesion promoter layer and in particular also do not cover the at least one contact connection area here. It may also be advantageous here if the decorative layer has a protective layer as the final layer on the side facing away from the carrier substrate of the at least one conductive layer and / or intermediate adhesion layer, which protective layer protects the decorative layer in particular from strong pressure and thermal effects that occur, for example, during injection molding and / or lamination processes. In addition, the protective layer can prevent mechanical damage that may occur during processing, such as scratches, etc. The protective layer can also comprise polymers and in particular self-supporting films, which are preferably made of PET, PC or PMMA or also of glass or fabric, and which remain on the decoration and form part of the intermediate or final product.

[0224] Advantageously, the at least one intermediate adhesion layer is arranged between the carrier substrate and the one or more decorative layers.

[0225] Preferably, the one or more decorative layers have at least one layer selected from the group consisting of: protective layer, color paint layer, metal layer, reflective layer, replication paint layer, transparent layer, carrier layer and / or layer producing an optically variable effect.

[0226] Preferably, the one or more decorative layers, for example, have a printed layer made in particular of opaque and / or colored ink, which printed layer forms a frame around the functional area. The decorative layer can also cover the sensor film and in particular the functional area entirely or partially and / or be applied in a grid pattern. The decorative layer can form a uniform surface and / or a continuous pattern and / or a single image motif. The decorative layer can be entirely or partially opaque and / or translucent and / or transparent, in particular transparently dyed.

[0227] Thus, for example, the one or more decorative layers can be applied, in particular embossed and / or printed, onto the adhesion promoter layer and / or the intermediate adhesion layer. The one or more decorative layers can be applied, for example, by means of hot stamping and / or by means of cold embossing and / or by means of heat transfer and / or by means of different lamination methods and / or other known methods onto the side facing away from the carrier substrate of the adhesion promoter layer and / or the intermediate adhesion layer. Thereby, for example, a decorative layer or decoration can be provided for the sensor film such that the sensor film has not only a function in the form of a touch sensor area provided by the electrical functional structure but also a decoration. The one or more decorative layers can comprise additional layers, such as a protective paint layer and / or a color layer and / or a metal layer and / or a transparent reflective layer and / or a replication paint layer and / or various types of layer structures producing an optically variable effect.

[0228] In addition, the one or more decorative layers have at least two decorative layers, in particular a first decorative layer and a second decorative layer.

[0229] The one or more decorative layers may also be provided on the side of the carrier substrate facing away from the at least one conductive layer and may also be provided on the side of the at least one conductive layer facing away from the carrier substrate. Thus, for example, a first decorative layer may be provided on a first side of the carrier substrate and a second decorative layer may be provided on the side of the carrier substrate opposite the first side, so that the one or more decorative layers are provided on both sides of the carrier substrate.

[0230] Furthermore, it is also advantageous if at least two decorative layers interact with each other such that a special optical effect is produced, such as an optical depth effect and / or a special optical superposition effect. For example, the first decorative layer facing the observer may form a color filter layer of the second decorative layer facing away from the observer, i.e., located below it in the viewing direction, and the second decorative layer is, for example, a color layer. It is also possible to have a superposition effect or a combined effect of two patterns, and these two patterns complement each other to form a moiré pattern or superpose to produce other complementary combined patterns.

[0231] Furthermore, an optically variable combined effect is also possible, which is produced only by the superposition of the at least two decorative layers. It may be advantageous here that the decorative layers are spaced apart from each other, for example because the carrier substrate and the conductive layer and possibly other layers, especially transparent layers, are provided between the decorative layers in particular. Such a distance is especially conducive to producing a depth effect and / or an optically variable effect. For example, a depth effect can be produced by inserting an optically transparent layer before and / or after and / or as a component of the decorative layer in the viewing direction. The optically transparent layer preferably has the same layer thickness as the corresponding decorative layer or has a layer thickness many times thicker than the corresponding decorative layer, and the layer thickness of the optically transparent layer is especially between 0.5 μm and 500 μm, preferably between 10 μm and 100 μm. The optically transparent layer is preferably made of an optically transparent paint and / or an optically transparent film, and the film is preferably made of PET, PMMA or PC.

[0232] The optically variable effect can be achieved, for example, by arranging the above-mentioned optically transparent layer as a spacer layer between a reflective layer and a semi-transparent reflective layer and an interference effect occurs within this layer structure, and this interference effect can be recognized by a color change effect related to the viewing angle and / or the illumination angle. Such an interference layer structure is already known as a Fabry - Perot thin film structure.

[0233] Furthermore, it is also advantageous if at least one of the one or more decorative layers at least partially has a surface relief structure, especially a tactile and / or haptically detectable surface relief structure.

[0234] Thus, surface morphology, especially surface relief structures, are generated by structuring the optically transparent layer and / or the protective layer and / or the one or more decorative layers, which can especially achieve tactile and / or haptically detectable effects. In addition, the surface relief structures can also generate diffraction and / or refraction optical effects. These surface relief structures can be generated by additional locally printed lacquers or by mechanical or optical structuring of the layer surface. Mechanical structuring can be replication using a correspondingly shaped embossing tool. Optical structuring can be laser ablation. In addition, lithography methods can also be used to produce these structures. The structure depth for such tactile effects is especially 1 μm to 2000 μm, preferably 50 μm to 2000 μm. The structure depth for diffraction or refraction effects is especially 0.1 μm to 20 μm, preferably 0.1 μm to 5 μm.

[0235] It is also possible to only simulate such tactile surface relief structures, because real tactile structures are usually mechanically sensitive, especially to scratching and / or abrasion and also get dirtier more easily than smooth surfaces. For this purpose, it makes sense to introduce the tactile structure into the corresponding surface and / or apply it thereto as described above. Then a transparent cover layer can be applied to this surface, which seals the tactile structure and has a smooth surface on the outside. The cover layer is preferably highly transparent and thicker than the height of the tactile structure, preferably at least twice as thick. In addition, the cover layer preferably has a refractive index that differs from that of the underlying layer with the tactile structure by at least 0.2, so as to generate an optical interface therefrom, thereby improving the visibility of the tactile structure. For this purpose, the cover layer can contain nanoscale particles for adjusting the refractive index, which are composed of one or more components selected from TiO2, SiO2, Sn or metal chalcogenides (oxides, sulfides), and the cover layer can also include metals Au, Ag, Cu.

[0236] The haptically perceivable and / or only optically simulated tactile surface relief structures can here correspond to functional touch sensor areas, i.e., emphasize or mark their functional areas, so that the "blind" feeling of the touch function can be achieved. However, the haptically perceivable and / or only optically simulated tactile structures can also be provided over the entire surface in order to achieve specific surface properties of the film, especially matching the other visual appearance of the film. Both possibilities can also exist in combination. Thus, for example, a wood decoration can be combined with a tactile wood grain, which is modified in the touch function area, especially in the functional area, structure depth and / or other structure parameters, so that the user can perceive the touch sensor area within the texture.

[0237] The sensor film can also have a structure in the following order:

[0238] - Carrier substrate

[0239] - Release layer

[0240] - Protective lacquer layer

[0241] - Primer layer

[0242] - At least one conductive layer

[0243] - Intermediate adhesion layer

[0244] - One or more decorative layers

[0245] - Adhesion promoter layer.

[0246] The sensor film may also have an adhesive layer on the side of the carrier substrate facing away from the at least one conductive layer.

[0247] The sensor film can thus have an adhesion promoter layer on one side of the carrier substrate and an adhesive layer on the other side of the carrier substrate, so that the sensor film can be applied to another substrate by means of the adhesive layer. The sensor film can be applied to the other substrate, for example, by thermal lamination or by back injection molding. Especially when back injection molding the sensor film, the at least one conductive layer and / or the one or more decorative layers are protected by the carrier substrate from the injected injection material and especially from the harsh process conditions with high pressure and high temperature during the injection molding process.

[0248] Furthermore, it is advantageous if the sensor film has at least one registration mark for determining the relative position of the functional area of the sensor film, especially the at least one conductive layer, and / or the at least one contact connection area.

[0249] Registration or registration accuracy is preferably understood here as the precisely positioned arrangement between layers that are stacked on top of each other or adjacent to each other while maintaining the desired positional tolerance. In particular, the sensor film can be applied to the film with precise position by means of the registration mark and the desired positional tolerance can be maintained. Preferably, the registration mark is formed by a printing material and / or a magnetic or conductive material. The marks can be, for example, optically readable registration marks that are different from the background by their color value, opacity or their reflection characteristics. But the registration mark can also be a registration mark that can be detected by a magnetic sensor or a sensor for detecting conductivity. The registration mark is detected, for example, by an optical sensor, especially a camera, a magnetic sensor or a mechanical sensor, a capacitive sensor or a sensor for detecting conductivity, and then the application of the sensor film can be controlled by means of the registration mark. Thus, the sensor film can be precisely positioned on the film by means of the registration mark. Thereby, the same manufacturing quality of, for example, a touch screen can be improved while further reducing the waste products caused by the mispositioning of the sensor film on the film.

[0250] Preferably, the sensor film is a thermally laminated film.

[0251] The following describes a method for manufacturing an electro-functional element and a preferred design of the electro-functional element:

[0252] Furthermore, it is advantageous that in step b2), the sensor film from the web is applied to the film by means of thermal lamination, in particular at a web speed of the sensor film between 1.5 m / min and 3.5 m / min. Here, the web may include a web of sensor films having a plurality or a large number of sensor films as a useful part (Nutzen). Thereby, industrial mass production can be further improved, in particular. Thus, for example, the sensor film can be applied to the film over its entire surface by means of a thermal laminator, thereby further reducing the time, manpower, and logistics costs and at the same time ensuring the same manufacturing quality.

[0253] Furthermore, it is advantageous that in step b2), the sensor film from the sheet or web is applied to the film by means of thermal lamination. Here, the sheet may include a plurality or a large number of sensor films as a useful part. Thereby, industrial mass production can be further improved, in particular. Thus, for example, the sensor film can be applied to the film over its entire surface by means of a thermal laminator, thereby further reducing the time, manpower, and logistics costs and at the same time ensuring the same manufacturing quality.

[0254] The sheet or web may also have only one sensor film as a useful part. A plurality of such sheets each including one sensor film may in particular be present as a stack in a magazine and be supplied to a thermal laminator and / or an injection molding machine operating by a lifting method (Hubverfahren) or a rolling method (Abrollverfahren) one by one, respectively, in order to be applied to the film. Subsequently, as described above, the sensor film is precisely applied to the film by means of registration marks on the sensor film.

[0255] Furthermore, it is advantageous that one or more sensor films are detachably provided separately on an intermediate substrate which may be present as a web or a sheet before being applied to the film. The intermediate substrate may here be, for example, silicon-coated paper or a web of sensor films provided with a glass layer. In a subsequent thermal transfer step and / or in a subsequent injection molding process, one or more sensor films may be transferred to the film from the intermediate substrate jointly or separately individually by the action of heat and / or pressure. Then the intermediate substrate can in particular be peeled off from the sensor film firmly adhered to the film.

[0256] Furthermore, the thermal lamination can be carried out at a temperature in the range between 80 °C and 300 °C, preferably between 200 °C and 290 °C, more preferably between 240 °C and 270 °C and / or at an imprinting pressure in the range between 10 bar and 2000 bar, preferably between 500 bar and 1500 bar.

[0257] Instead of the thermal lamination in step b2), the sensor film can also be applied to the film by injecting injection molding material, where the injection molding material in particular forms the film. Thus, the sensor film can be fixedly connected to the injection molding material by an adhesion promoter layer.

[0258] The sensor film can also be connected to another substrate by injecting an injection molding material.

[0259] Furthermore, especially when the sensor film is designed as a transfer film, it is advantageous that in step b2), the sensor film is applied to the film by means of heat stamping. Here, the sensor film from a roll or a sheet or a web can be applied to the film by means of heat stamping.

[0260] Here, the roll can include a sensor film web having a plurality or a large number of sensor films as a usable part, and / or the sheet can include a plurality or a large number of sensor films as a usable part. Thereby, industrial mass production can be further improved, in particular. Thus, for example, the sensor film can be applied to the film over the entire surface by means of a heat stamping machine, thereby further reducing the time, labor, and logistics costs and at the same time ensuring the achievement of the same manufacturing quality.

[0261] If the stamping temperature is in the range of 80 °C to 250 °C, preferably in the range of 100 °C to 200 °C, and / or the stamping pressure is in the range of 0.5 kN / cm 2 to 10 kN / cm 2 then it is suitable. Furthermore, if the stamping time is in the range of 1 ms to 20,000 ms, preferably in the range of 100 ms and 10,000 ms, then it is also suitable. The stamping is carried out, for example, by a lifting process, and the stamping time is in particular 2 seconds to 5 seconds.

[0262] Furthermore, the other substrate and / or the film can be flat and / or have a one-dimensional curvature and / or a two-dimensional curvature and / or a three-dimensional curvature.

[0263] The sensor film and / or the electrical functional element, in particular the electrical functional element formed by the film and the sensor film, can also be shaped, in particular three-dimensionally shaped. Advantageously, the shaping is carried out by a shaping process, preferably by deep drawing, thermoforming, high-pressure forming, and / or by an injection molding process. Preferably, the film and / or the intermediate substrate have a layer thickness of at most 1 mm, preferably 500 μm, so that the electrical functional element formed by the sensor film and the film can be shaped.

[0264] The following describes a preferred shaping process for shaping the sensor film and / or the electrical functional element, in particular the electrical functional element is formed by a sensor film arranged, in particular applied, on a film:

[0265] Preferably, the sensor film and / or the electrical functional element are shaped by deep drawing. Advantageously, the shaping of the sensor film and / or the electrical functional element is carried out in a shaping die corresponding to the desired shaping geometry by vacuum, in particular under a negative pressure of at most 1 bar, and / or by overpressure assistance, in particular under an overpressure between 1 bar and 20 bar, preferably between 1 bar and 10 bar.

[0266] In addition, the sensor film and / or the electro-functional element can be formed by thermoforming. Advantageously, the forming process or the process parameters of the forming process of the sensor film and / or the electro-functional element correspond to those of a deep drawing process, for example, in the case of using an ABS material, the forming is assisted by additional temperature, especially at a temperature between 120 °C and 300 °C, preferably at a temperature between 190 °C and 250 °C. Here, the carrier substrate and / or the film contain an ABS material.

[0267] The sensor film and / or the electro-functional element can also be formed by high-pressure forming. Advantageously, the forming of the sensor film and / or the electro-functional element is assisted by overpressure in a forming die or a forming station corresponding to the desired forming geometry, especially at an overpressure between 1 bar and 300 bar, preferably between 10 bar and 150 bar. Here, it is appropriate that the forming is assisted by additional temperature, preferably at a temperature within the glass transition temperature range of the used sensor film. Advantageously, for example, in the case of using a PC material, the temperature is between 80 °C and 300 °C, preferably between 140 °C and 250 °C.

[0268] Through the above-mentioned forming process, a preferably three-dimensional stretching ratio of up to 200% can be achieved. Especially when the parameters of the corresponding system are optimized, a stretching ratio of up to 300% can also be achieved. In many application cases, a stretching ratio between 20% and 50% is sufficient.

[0269] In addition, the sensor film and / or the electro-functional element formed or pre-formed by the above-mentioned forming process can also be front-injected (vorspritzen) and / or back-injected in a subsequent injection molding process.

[0270] The sensor film and / or the electro-functional element formed or pre-formed by the above-mentioned forming process can especially be used directly, that is, without a further injection molding process.

[0271] In addition, the sensor film and / or the electro-functional element can also be shaped and / or deformed by an injection molding process. Advantageously, the sensor film and / or the electro-functional element in a flat state are introduced into the injection mold by means of a roll or by sheets or films or by individual labels and deformed by means of an injection molding method, in particular by closing the mold and also by injecting the molding compound for shaping. The injection pressure depends in particular on the component geometry and / or the component dimensions. For example, the injection pressure can be 500 bar and the injection temperature can be between 180 °C and 380 °C, with the injection pressure and the injection temperature depending on the injection molding material. In addition, it is also expedient to heat the sensor film and / or the electro-functional element introduced into the injection mold by heating the sensor film and / or the electro-functional element, for example, at a temperature between 30 °C and 300 °C, preferably between 80 °C and 150 °C, before the closing process of the injection mold. The sensor film and / or the electro-functional element can also be assembled or fixed to the mold cavity by means of a clamping frame and / or vacuum and / or overpressure.

[0272] It is also advantageous to shape the sensor film and / or the electro-functional element by "slipping" the sensor film and / or the electro-functional element onto a three-dimensionally preformed component. Advantageously, the "slipping on" of the sensor film and / or the electro-functional element is achieved by controlling the vacuum suction of the sensor film and / or the electro-functional element onto the three-dimensionally preformed component during the process and simultaneously applying overpressure. It is preferred to load the three-dimensionally preformed component to be slipped on with temperature beforehand. Here, it is expedient that the overpressure is between 1 bar and 50 bar, preferably between 3 bar and 15 bar, and / or the temperature is between 30 °C and 300 °C, preferably between 100 °C and 180 °C.

[0273] Preferably, the sensor film and / or the electro-functional element have a stretch rate of more than 20%. In the case of conventional functional films, such a high stretch rate cannot be achieved, for example, by means of the above-mentioned shaping and / or deformation processes, especially because, for example, the carrier film made of PET does not have sufficient deformability and / or the conductive structure breaks after small deformations, especially at a stretch rate of more than 20%. It has been shown here that the stretch rate is improved by the sensor film. Thus, as described above, the mechanical stretch rate and / or deformation can be targeted by the multi-layer structure of the sensor film, in particular by the at least one conductive layer embedded between a plurality of paint layers according to a sandwich system. For example, certain regions of the sensor film can be designed to be more flexible or less flexible by adjusting the layer thickness and / or the paint formulation. Thus, it is preferably possible to achieve the desired stretch rate of more than 20%.

[0274] In the case of the above-described three-dimensional deformation, it is advantageous that the electrical functional structure of the sensor film and / or the electrical functional element can also be electrically contacted, in particular current-conductively contacted, from the outside. For this purpose, the electrical contacts must be accessible for contacting. As an alternative, inductive and / or capacitive coupling can be achieved, in particular by means of an antenna. As described above, a robust and reliable contacting of the electrical functional structure is achieved by means of the sensor film. For example, other electrical components, such as LEDs (LED = light-emitting diode), can be integrated in particular in this way.

[0275] Furthermore, the adhesion promoter layer can be made of a material whose visual appearance changes from cloudy to highly transparent and / or clear during and / or after step b2). Thus, during the application of the sensor film to the film, the adhesion promoter layer melts based on the input heat and / or the adhesion promoter layer is levelled by pressure, so that the surface roughness of the adhesion promoter layer present in the non-applied state of the sensor film is levelled during and / or after the application. Thereby, the visual appearance of the adhesion promoter layer changes from cloudy to highly transparent and / or clear.

[0276] After the sensor film has been applied to the film, the sensor film and the film form in particular an electrical functional element. It is advantageous that after the sensor film has been applied to the film, the adhesion promoter layer of the sensor film is highly transparent, in particular the adhesion promoter layer of the sensor film has a transmittance of more than 85%, preferably more than 90%, for light in the wavelength range between 380 nm and 780 nm, and / or the adhesion promoter layer of the sensor film is a clear adhesion promoter layer, in particular the scattering deflection of light in the wavelength range between 380 nm and 780 nm through the adhesion promoter layer of the sensor film is less than 8%, preferably less than 4%. The sensor film has a transmittance of more than 75%, preferably more than 80%, further preferably more than 85%, even more preferably more than 90%, for light in the wavelength range between 380 nm and 780 nm at least in the functional region of the at least one conductive layer. Thereby, for example, a brilliant and true-to-life impression of the image generated by the display to which the sensor film is applied can be achieved.

[0277] Furthermore, the electrical functional element can be a functional element for information processing, in particular a mobile phone, such as a smartphone or a PDA, a tablet computer, an ATM, a ticket vending machine, an arcade game machine, a gaming machine, an operating part of a household appliance or a motor vehicle, or for example a touch screen. The electrical functional element can also be an input device, in particular a touch panel. However, the electrical functional element can also be an intermediate product which is assembled into a final product or installed in a final product in a further processing step. Thus, for example, the sensor film can be applied to a glass layer and the electrical functional element formed by the glass layer and the sensor film can be installed, for example, in a ticket vending machine.

[0278] In step b), at least one of the at least one sensor film preferably has one or more sensors and / or electrical components, in particular LEDs, in particular one or more touch sensors and / or has one or more displays.

[0279] In step b), at least one of the at least one sensor film may have one or more contact areas, in particular one or more of the one or more contact areas are at least partially not covered by a film or layer, preferably one or more of the one or more contact areas are provided on the surface of the at least one sensor film of the at least one sensor film facing away from the at least one film.

[0280] In the case of insert molding, the transfer film is preferably applied to a flat substrate, in particular a flat substrate. Then the carrier film is peeled off. Preferably, the applied transfer layer absorbs the tensile force of deformation when the substrate coated with the transfer layer is deep-drawn or formed between the two mold halves of a deep-drawing or forming die. In particular, cracks and the like often occur within a narrow radius in the protective layer area.

[0281] Furthermore, the at least one film in step a) and / or the at least one sensor film in step b) and / or the at least one film and / or the at least one sensor film in further steps may at least partially have at least one decoration and / or at least one decorative film.

[0282] In particular, the at least one film including the at least one sensor film is formed in step c) by one or more forming methods selected from the following forming methods: deep drawing, thermoforming, high-pressure forming, injection molding method.

[0283] After step c), the radius of curvature of the at least one film and / or the at least one sensor film is preferably at least partially less than 1000 mm, in particular less than 200 mm, further preferably less than 100 mm and / or the elongation rate of the at least one film and / or the at least one sensor film is greater than or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, particularly preferably greater than or equal to 300%.

[0284] The method may include the following further step: e) injection molding of the one or more blanked film elements.

[0285] In particular, in step d), one or more holes or punchings are introduced into the one or more film elements, in particular one or more of the one or more holes function as injection channels for the plastic mold plastic during the injection molding in step e).

[0286] Step e) may include one or more of the following further steps, in particular performing the following further steps in the following order, preferably performing the following further steps in a cyclic order:

[0287] e1) Providing at least one decorative film which, in particular, has at least one opaque coating at least locally;

[0288] e2) Introducing at least one decorative element of at least one decoration into the at least one decorative film by machining at at least one machining station;

[0289] e3) Placing the one or more blanked film elements and the at least one decorative film into an injection molding station which includes a first mold half and a second mold half, the first mold half and the second mold half forming, in particular in the closed state, an injection molding cavity for molding at least one plastic body, the at least one blanked film element being mounted on a first wall of the injection molding cavity and / or the at least one decorative film being mounted on a second wall of the injection molding cavity, in particular the second wall being arranged opposite the first wall;

[0290] e4) Injection molding the one or more blanked film elements and the at least one decorative film with plastic to form a plastic component including the at least one plastic body such that the one or more blanked film elements form a first surface of the plastic component and the at least one decorative film forms a second surface of the plastic component, in particular the first surface being opposite the second surface;

[0291] e5) Opening the injection molding station, in particular after the cooling time of the at least one plastic body comprised in the plastic component, by moving the first mold half and the second mold half away from each other;

[0292] e6) Removing the plastic component.

[0293] In addition, step e) may include one or more of the following further steps, in particular performing the following further steps in the following order, preferably performing the following further steps in a cyclic order:

[0294] e7) Placing a first blanked film element of the one or more blanked film elements and / or a second blanked film element of the one or more blanked film elements into an injection molding station which includes a first mold half and a second mold half, the first mold half and the second mold half forming, in particular in the closed state, an injection molding cavity for molding at least one plastic body, the first blanked film element being mounted on a first wall of the injection molding cavity and / or the second blanked film element being mounted on a second wall of the injection molding cavity, in particular the second wall being arranged opposite the first wall;

[0295] e8) Injection molding the first blanked membrane element and / or the second blanked membrane element with plastic such as plastic to form a plastic component including the at least one plastic body, such that the first blanked membrane element forms the first surface of the plastic component and / or the second blanked membrane element forms the second surface of the plastic component, in particular the first surface is opposite to the second surface;

[0296] e9) Opening the injection molding station by moving the first mold half and the second mold half away from each other, especially after the cooling time of the at least one plastic body contained in the plastic component;

[0297] e10) Removing the plastic component.

[0298] By steps e1) to e6) and / or e7) to e10), in particular, a plastic component can be manufactured, which includes at least one decorative film, the decorative film at least partially has an opaque coating, a decoration is introduced into the opaque coating, and the plastic component includes one or more blanked membrane elements, the at least one decorative film forms the first surface of the plastic component and the one or more membrane elements preferably form at least one second surface of the plastic component opposite to the first surface.

[0299] In step e2) and / or e7), in particular, the at least one decorative element of the decoration can be introduced into the at least one decorative film by laser radiation and / or by milling and / or by stamping. Therefore, the processing tool is preferably a laser and / or a milling tool and / or a stamping tool.

[0300] The at least one decorative film and the one or more membrane elements preferably form a protection for the first surface of the plastic component and the at least one second surface, so that the plastic component is particularly durable.

[0301] Preferably, the at least one decoration and / or the at least one decorative element are introduced into the at least one decorative film by laser radiation and / or by milling and / or by stamping after back injection molding. Thereby, the decoration and / or the at least one decorative element can be placed or positioned particularly precisely, because important processing steps (especially the positioning of the decorative film in the injection mold and back injection molding) that interfere with or adversely affect the placement and / or positioning of the decoration and / or the at least one decorative element have been carried out.

[0302] But as an alternative, the at least one decoration and / or the at least one decorative element can also be introduced into the at least one decorative film by laser radiation and / or by milling and / or by stamping before injection molding, especially before placing the at least one decorative film into the injection molding station.

[0303] Preferably, when introducing the at least one decoration and / or the at least one decoration element into the at least one decorative film, the at least one opaque coating in the region machined with a processing tool is at least partially removed by laser radiation, water jet cutting, milling or stamping and / or the opacity of the at least one opaque coating in the region machined with a processing tool is at least partially reduced.

[0304] The at least one opaque coating can be precisely structured by laser radiation, water jet cutting, milling or stamping, in particular ablated, in order to introduce symbols or other decorative elements which can preferably be backlit. Here, the material of the opaque coating is heated and evaporated, and thus removed, in particular at the points where it is irradiated by the laser beam. In the case of milling or stamping, the material of the opaque coating is preferably removed mechanically.

[0305] In particular, after introducing the at least one decoration and / or the at least one decoration element into the at least one decorative film, the region machined with a processing tool and the region not machined with a processing tool preferably have such a difference in transparency that it can be seen by a human observer, preferably without observing by transmitted light. Here, the difference in transparency is in particular at least 5%, preferably at least 10% to 75%. Thereby, it is preferably ensured that there is sufficient contrast in the at least one decoration, so that in particular at least one clear and easily recognizable decoration is produced.

[0306] Preferably, the at least one opaque coating is applied by printing, in particular screen printing or gravure printing. The printing can be carried out over the entire surface or locally. In addition, a plurality of printing processes can also be carried out in sequence in order to in particular achieve the desired degree of coverage or the desired opacity. Thus, additional layers, such as colored transparent or translucent layers, protective lacquers or the like, can also be printed together over the entire surface or locally.

[0307] As an alternative, the at least one opaque coating can also be applied by means of at least one transfer film. Here, it can also be applied over the entire surface or locally. Such a transfer film generally comprises at least one carrier layer, at least one optional release layer and one or more decorative layers as at least one transfer layer, the decorative layers in particular having different degrees of opacity, and / or at least one adhesive layer. After applying the at least one transfer film, the at least one carrier layer is peeled off, and here the at least one transfer layer remains on the at least one decorative film together with the other layers. Then the at least one opaque coating is formed by at least one decorative layer of the at least one decorative layer.

[0308] Preferably, the at least one opaque coating has a thickness of less than 100 μm, in particular a thickness between 5 μm and 50 μm. In particular, on the one hand, the required opacity is ensured and, on the other hand, a thin and, if necessary, flexible plastic component is also produced.

[0309] Furthermore, preferably, the at least one decorative film has at least one further at least partial coating, in particular a transparent or translucent colored coating, a protective paint coating and / or an adhesive coating. As described above, for example, such a coating is preferably applied by printing or by means of a transfer film. A combination of these techniques is also possible. Thereby, preferably, additional visual effects are achieved or additional functions are integrated into the decorative film.

[0310] Preferably, the at least one decoration and / or the at least one decorative element is or comprises a logo, a symbol and / or at least one alphanumeric character. These elements are in particular also combined with abstract graphic design elements as decorative elements. The at least one decoration preferably has a purely decorative function. Furthermore, the at least one decoration may preferably also be or only be functional and, for example, fulfill the function of a display and / or control element of a device and / or be configured as a display and / or operating element, such as a status display, a control surface or the like.

[0311] Preferably, at least one further decorative element is introduced into the at least one decorative film by stamping. Thereby, large-area cutouts can be provided for display elements, backlighting or the like, in particular without long-time laser or milling treatment of these areas.

[0312] Furthermore, preferably, the at least one decorative film and / or the one or more film elements are shaped before being placed in an injection mold. Thereby, so-called inserts can be manufactured, which can be deformed three-dimensionally to a large extent, in particular, before injection molding, which is usually not possible during injection molding.

[0313] Conventionally, shaping methods are preferably used here. Generally, the at least one decorative film is provided as a sheet product and placed in a shaping mold having the desired final contour. By heating, preferably at a temperature of 80 °C to 200 °C, the at least one decorative film is brought into a deformable state. Here, the film, in particular the at least one decorative film and / or the one or more film elements, can be adapted to the shape of the first mold half and / or the second mold half at the shaping station by applying a vacuum and / or by applying a shaping punch and / or an air overpressure and, in particular, into the desired final contour. During cooling, the material of the at least one decorative film and / or the one or more film elements is age-hardened again, so that the final contour is maintained.

[0314] After forming, mechanical post-treatment may also be carried out if necessary, for example by trimming (mechanically or by laser or by water jet), milling, stamping, etc.

[0315] Preferably, the at least one decorative film has a thickness of 50 μm to 2000 μm, in particular to ensure good mechanical stability on the one hand and problem-free forming on the other hand.

[0316] Preferably, the at least one decorative film has at least one layer made of a colorless or colored transparent or translucent thermoplastic material, in particular made of ABS, ABS / PC, PC / ABS, PC, PP or PMMA. This layer serves as a carrier for the opaque coating and any other layers that may be present, in particular this layer is backlit itself. The thermoplasticity of the above materials enables problem-free forming.

[0317] Preferably, the at least one decorative film and / or the one or more film elements are placed in the injection molding station at a spacing of 0.5 mm to 10 mm, preferably 0.8 mm to 5 mm, and this spacing in particular determines the wall thickness of the finished plastic component.

[0318] In addition, at least one core element can be introduced between the at least one decorative film and / or the one or more film elements in the injection molding station. Thereby, preferably a cavity or void is introduced into the plastic component, which is in particular used to accommodate functional elements, such as separate components, such as displays, switches, controllers or separate backlighting devices and / or touch sensors or the like. The at least one core element is preferably introduced into the gap between the at least one decorative film and / or the one or more film elements through at least one punching in the at least one decorative film and / or the one or more film elements.

[0319] Preferably, the plastic molding compound is transparent or translucent, in particular having a transparency of 5% to 98%, and preferably comprises one of the following materials: ABS (acrylonitrile-butadiene-styrene copolymer), PC (polycarbonate), ABS / PC, PC / ABS, PMMA (polymethyl methacrylate), PP (polypropylene), PA (polyamide), TPU (thermoplastic polyurethane). Thereby, good backlighting of the plastic component can be achieved. Injection molding is preferably suitable for processing the above materials, in particular at a temperature of 200 °C to 300 °C. The required injection pressure depends in particular on the part size, part geometry and wall thickness and can vary over a wide range.

[0320] Furthermore, an injection molding station can be used to perform step d) and / or e). The injection molding station includes a first mold half and a second mold half having a first mold recess. The first mold half and / or the second mold half has at least one injection channel. The first mold half and the second mold half form an injection mold cavity for molding at least one plastic body, especially in the closed state.

[0321] Step d) and / or e) includes one or more of the following further steps, especially performing the following further steps in the following order, preferably in a cyclic order:

[0322] e11) Provide the one or more blanked film elements and / or at least one section of at least one decorative film on the first mold half and / or the second mold half such that when the first mold half and the second mold half are closed, the one or more blanked film elements and / or the at least one decorative film abut against the end faces of the raised edge region that defines and surrounds the first mold recess;

[0323] e12) Close the first mold half and the second mold half to such an extent that in the end face region of the raised edge region between the first mold half and the second mold half, a gap is at least locally formed between the end face of the raised edge region of the first mold half and the corresponding end face of the second mold half, and the gap is sealed by the one or more blanked film elements squeezed in the gap region and / or the at least one decorative film sandwiched in the gap region and squeezed;

[0324] e13) Inject plastic molding compound through the injection channel into the injection mold cavity formed by the closed first and second mold halves, and perform back injection on the at least one decorative film and / or the one or more film elements in the region surrounded by the raised edge region with the plastic molding compound, especially without the plastic molding compound passing through the sealed gap, thereby forming a plastic component including the at least one plastic body;

[0325] e14) Open the first and second mold halves by moving the first and / or second mold half relative to each other and remove the plastic component including the at least one plastic body from the injection molding station;

[0326] e15) Remove the remaining section of the at least one decorative film and provide at least one additional section of the at least one decorative film.

[0327] Steps e11) to e15) are preferably characterized in that the mold wear of the injection mold integrated into the injection molding station for cutting off the at least one decorative film by extrusion is significantly reduced, and the time required to produce the plastic component is thereby reduced.

[0328] When extruding the one or more film elements and / or the at least one decorative film and optionally cutting the one or more film elements and / or the at least one decorative film, especially in step e12), the one or more film elements and / or the at least one decorative film can be compressed to less than 50% of its thickness, preferably compressed to 20% to 10% of its thickness. In method step e12), in addition to compressing the one or more film elements and / or the at least one decorative film, the one or more film elements and / or the at least one decorative film can especially be torn (Einreiβen) and especially this can result in partial cutting, the degree of cutting preferably depending on the material.

[0329] Furthermore, in step e12), when the raised edge region of the first die recess of the first die half interacts with the corresponding end face of the second die half, the decorative film is at least partially cut by extrusion and / or cutting.

[0330] Especially, the raised edge region of the first die half can be at least locally configured as a stamping edge.

[0331] Especially, the at least one decorative film and / or the one or more film elements are attached to the plastic body and / or plastic component manufactured by injection molding in step e13), and if not completely cut especially on the edge side, they are preferably completely cut in step e13). Basically, the complete cutting of the at least one decorative film and / or the one or more film elements in step e13) can be described as a tearing process.

[0332] In step e11), the at least one decorative film and / or the one or more film elements can be arranged such that at least one decoration of the at least one decorative film faces away from the plastic injection molding plastic injected in step e13). The advantage of such an arrangement is that the at least one decoration is especially made of such a material that reacts with the plastic injection molding plastic in step e13), for example, partially dissolves or dissolves. Especially, the relatively thick material layer of the at least one decorative film protects the decoration during the injection molding of the plastic injection molding plastic in step e13).

[0333] Especially, the at least one decorative film can be configured as a single-layer or multi-layer laminated film.

[0334] Here, the single-layer or multi-layer laminated film can be a plastic film, preferably a PET film or a film made of polystyrene, ABS or PMMA. Preferably, the plastic film is configured as a smooth or structured film, which especially includes structures. For example, the plastic film can imitate a leather surface with a typical leather grain, which is tactilely perceptible. In addition, such structures can also exist in an imperceptible order of magnitude (microscopic, sub-microscopic), such as optical diffraction or refraction structures.

[0335] In addition, the single-layer or multi-layer laminated film can also be made of other materials, especially natural materials such as leather, parchment or wood veneer.

[0336] Preferably, the single-layer or multi-layer laminated film has a ductility in the range of 12% to 20%, especially in the range of 15% to 20%. Preferably, the ductility required for good processability is determined by the surface geometry of the plastic component.

[0337] In addition, it has been proven effective that the single-layer or multi-layer laminated film has a thickness in the range of 20 μm to 500 μm.

[0338] In particular, the distance between the end faces of the raised edge region of the first molding die part and the corresponding end faces of the second molding die part is in the range of 20% to 10% of the thickness of the at least one decorative film and / or the one or more film elements.

[0339] Preferably, the plastic mold plastic injected in step e13) contains polystyrene. Other thermoplastics such as ABS, ABS-PC, PMMA, PET, PET-PC can also be used here.

[0340] In addition, in particular, one injection molding station can be used to perform step e). The injection molding station includes a first mold half having a first mold recess and a second mold half having a second mold recess. The first mold half is movable and the second mold half is immovably configured.

[0341] Step e) includes one or more of the following further steps. In particular, the following further steps are performed in the following order, preferably in a cyclic order:

[0342] e16) Place the one or more blanked film elements and / or the at least one decorative film into the first mold recess of the first mold half and fix the one or more blanked film elements and / or the at least one decorative film;

[0343] e17) Place the in-mold labeling molded part, i.e., the IML molded part, into the second mold recess of the second mold half and fix the IML molded part. The IML molded part includes an insert decorative layer and a back film;

[0344] e18) Close the injection molding station by lowering the first mold half onto the second mold half. An injection molding cavity for molding at least one plastic body is formed here.

[0345] e19) Inject the plastic molding compound into the second mold recess of the second mold half, where the plastic molding compound separates the IML molded part from the second mold half and presses it onto the one or more punched film elements and / or the at least one decorative film in the first mold recess of the first mold half, thereby forming a plastic component including the at least one plastic body;

[0346] e20) Open the injection molding station by moving the first mold half away from the second mold half, especially after the cooling time of the at least one plastic body contained in the plastic component;

[0347] e21) Remove the plastic component.

[0348] For example, the "movement" of the mold halves is preferably understood here as a change in the position and / or orientation of at least one element, preferably along at least one direction in space, especially relative to a predetermined reference system, and / or relative to the position and / or orientation of at least another element, preferably along at least another direction and / or the at least one direction, and the at least one element and / or the at least another element are especially selected and / or combined from the following: upper mold base, lower mold base, upper mold module, lower mold module. For example, the one or more elements can be translated and / or rotated, especially around a point and / or axis or multiple points and / or axes in space.

[0349] Steps e16) to e21) are especially characterized in that they combine the advantages of decoration by an in-mold decoration film or IMD decoration film or decoration film and / or one or more punched film elements with the advantages of decoration by an in-mold labeling molded part or IML molded part and thereby preferably open up new design possibilities. Preferably, in the IMD method (IMD = in-mold decoration), the transfer film is placed in the injection mold and back-injected. Here, especially the carrier film absorbs the tensile forces that can occur due to the high pressure and high temperature during the injection molding process when the transfer film deforms, especially when it is pressed against the contour of the mold surface at high speed, and preferably protects the transfer layer configured as a paint layer from cracks and other damages during deformation. Especially the surface quality of the transfer layer is also defined by this carrier film. The carrier film is preferably used here as a deformation aid for the transfer layer.

[0350] Especially in steps e16) to e21), the in-mold labeling molded part or IML molded part can also be multiple in-mold labeling molded parts or IML molded parts.

[0351] The at least one decorative film in steps e16) to e21) is preferably at least one IMD decorative film.

[0352] In processing step e16), the at least one decorative film and / or the one or more die-cut film elements are positioned on the die recesses of the first die half over their entire surface. The at least one decorative film and / or the one or more die-cut film elements, which preferably exist as a web or strip, are guided, for example, by a film feeding device through the injection molding station, in particular the film feeding device comprising a supply roller for the at least one decorative film and / or the one or more die-cut film elements, a take-up roller for the residual film, a transport device for transporting the at least one decorative film and / or the one or more die-cut film elements step by step, and a fixing device for fixing the supplied at least one decorative film and / or the one or more die-cut film elements to the first die half.

[0353] Furthermore, the at least one decorative film and / or the one or more die-cut film elements preferably have registration marks on their outer edges, which are detected, in particular, by at least one, preferably optical, position sensor at the injection molding station, in particular the position sensor controlling the film feeding device in such a way that the at least one decorative film and / or the one or more die-cut film elements are positioned precisely, i.e., in register, relative to the injection molding station. The positional accuracy has a tolerance of approximately 0 mm to 1 mm, preferably 0.25 mm to 0.75 mm, in particular in the feed direction, in particular the at least one decorative film and / or the one or more die-cut film elements having at least one single-image decoration - which single-image decoration is in particular to be applied position-precisely to the molded part - can be positioned in the injection molding device in a position-precise manner corresponding to the registration marks.

[0354] Furthermore, the at least one decorative film and / or the one or more die-cut film elements can have at least one continuous decoration, such as a continuous pattern and / or wood grain and / or monochromatic coloring, in particular for such a continuous decoration, no or substantially no position-precise positioning of the at least one decorative film and / or the one or more die-cut film elements is required.

[0355] In particular, the IML molded part is trimmed at the edge before method step e17) and / or thermally deformed or shaped before or after trimming.

[0356] In processing step e17), the IML molded part can be fixed by means of positioning pins arranged in the mold recesses of the second mold half. In particular, the positioning pins are configured such that they engage in recesses provided on the rear side of the IML molded part, preferably in the back film, and in particular fix the IML molded part in this way to prevent lateral movement. When preferably liquid thermoplastic material is injected below the IML molded part, the IML molded part preferably lifts off the positioning pins and is preferably pressed by the pressure of the plastic molding compound onto the at least one decorative film and / or the one or more die-cut film elements in the mold recess of the first mold half. In practice, it has been shown in particular that the disturbing lateral movement of the IML molded part has no significant influence here, preferably because such movement of the IML molded part is very quickly effected by the inflowing plastic molding compound without the guidance of the positioning pins.

[0357] Furthermore, in method step e17), the IML molded part can also be fixed in the mold recess of the second mold half by means of electrostatic forces and / or vacuum forces.

[0358] Furthermore, the plastic molding compound can be acrylonitrile-butadiene-styrene copolymer (ABS = acrylonitrile-butadiene-styrene) or a mixture of acrylonitrile-butadiene-styrene copolymer and polycarbonate (PC), or a mixture of polycarbonate and acrylonitrile-butadiene-styrene copolymer, while the back film is acrylonitrile-butadiene-styrene copolymer.

[0359] Preferably, the plastic molding compound and / or the back film comprise polycarbonate, in particular polypropylene (PP) and / or polymethyl methacrylate (PMMA).

[0360] In addition to the above material pairings of the plastic molding compound and the back film, in particular other combinations are possible, preferably if the back film liquefies at least in the surface region during the injection molding process and preferably thereby forms a material-locking connection with the plastic molding compound, which material-locking connection is preferably durable after cooling.

[0361] The insert decorative layer of the IML molded part can be radiation-cured, in particular UV light-cured. Preferably, curing ensures that the insert decorative layer does not form a connection with the at least one decorative layer of the at least one decorative film, in particular not with the adhesive layer of the at least one decorative layer of the at least one decorative film. For example, such an insert decorative layer can be made of an isocyanate-crosslinked acrylate protective paint.

[0362] Furthermore, the IML molded part can have a protective paint coating as the outer layer of the insert decoration layer, in particular such that the outer layer is constructed in such a way that it does not adhere to the at least one decorative layer of the at least one decorative film in method step e19), in particular not to the adhesive layer of the at least one decorative layer of the at least one decorative film. For example, such a protective paint coating can be made of or have as components polyurethane (PU), polyvinylidene fluoride (PVDF), polyamide or polyester.

[0363] Furthermore, in particular in combination with the above-mentioned position-accurate positioning, the at least one decorative film and / or the one or more die-cut film elements can be arranged in the injection molding station such that, preferably, the at least one decorative film and / or the one or more die-cut film elements have an adhesivelayer that is at least locally provided and that is left blank, in particular, in the surface area where the at least one decorative film and / or the one or more die-cut film elements overlap with the IML molded part. Thereby, in particular, the unwanted adhesive connection between the at least one decorative film and / or the one or more die-cut film elements, in particular the adhesive layer of the at least one decorative film and / or the one or more die-cut film elements, and the surface of the IML molded part can be reduced.

[0364] Furthermore, in particular in combination with the above-mentioned position-accurate positioning, the at least one decorative film and / or the one or more die-cut film elements can be arranged in the injection molding station such that the at least one decorative film and / or the one or more die-cut film elements have an adhesivelayer with a full-surface structure that is deactivated, in particular, in the surface area where the at least one decorative film and / or the one or more die-cut film elements overlap with the IML molded part. For deactivation, for example, a local coating can be provided that is preferably constructed in such a way that it preferably does not adhere or only slightly adheres to the surface of the IML molded part during the injection molding process. The coating can be, for example, a radiation-curable paint, a paint with a high pigment content or a powder coating. The coating can be applied in liquid form or in solid form by hot stamping. The coating can be applied, for example, by means of an inkjet printer that is, in particular, arranged in the area where the film is supplied to the injection molding station and that preferably applies the coating to the at least one decorative film and / or the one or more die-cut film elements in a position-accurate manner relative to the injection molding station, preferably in combination with the above-mentioned position-accurate positioning of the at least one decorative film and / or the one or more die-cut film elements. The coating can also be a self-adhesive label or tag, in which case, in particular, the likelihood of an unwanted adhesive connection between the at least one decorative film and / or the one or more die-cut film elements, in particular the adhesive layer of the at least one decorative film and / or the one or more die-cut film elements, and the surface of the IML molded part is further reduced.

[0365] In particular, the at least one decorative film and / or the one or more punched film elements can be combined with the IML molded part in such a way that the adhesion force between the mutually facing layers of the at least one decorative film and / or the one or more punched film elements and the IML molded part (adhesion force = the adhesive force generated between two substances through molecular interactions) and the cohesion within the mutually facing layers of the at least one decorative film and / or the one or more punched film elements and the IML molded part (cohesion = the internal binding force between atoms or molecules within a substance) are preferably matched to each other in such a way that, in particular, the at least one decorative film and / or the one or more punched film elements adhere so weakly to the surface of the IML molded part that the at least one decorative film and / or the one or more punched film elements are removed from the IML molded part, in particular after injection molding and / or step e18), preferably without any components of the at least one decorative film and / or the one or more punched film elements adhering or sticking to the surface of the IML molded part.

[0366] As a further step e22), it can also be provided to clean the decorated plastic part.

[0367] Preferably, in method step e22), contact and / or non-contact cleaning is provided, for example in combination with ionized brush cleaning. In addition, in method step e22), a combination including cleaning by ionization, blowing with turbulent compressed air, and optional suction can be provided.

[0368] The injection molding station in particular has more than one injection channel, which is particularly advantageous for preferably pressing the at least one decorative film and / or the one or more punched film elements, which have large dimensions, evenly onto the IML molded part on the first mold half.

[0369] In addition, the molding surface on the decorative side can also have molding elements for forming design grooves around the IML molded part. In particular, the design grooves visually conceal the inaccuracies in the position and / or shape of the IML molded part relative to the decorative layer of the at least one decorative film and / or the one or more punched film elements. Depending on the tolerance of approximately 0 mm to 1 mm, preferably 0.25 mm to 0.75 mm, of the position accuracy of the at least one decorative film and / or the one or more punched film elements relative to the injection molding station and the IML molded part, and depending on the tolerance of approximately 0 mm to 1 mm, preferably 0.25 mm to 0.75 mm, of the position accuracy of the IML molded part in the injection molding station, it is advantageous if the width of the design grooves is between 0 mm and 2 mm, preferably between 0.5 mm and 1.5 mm.

[0370] Preferably, after step e), the radius of curvature of the plastic component is at least locally less than 1000 mm, in particular less than 200 mm, more preferably less than 100 mm and / or the elongation rate of the plastic component is greater than or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, and particularly preferably greater than or equal to 300%.

[0371] The 3DHS method (3DHS = 3D heat stamping) can also be used in steps c), d) and / or e).

[0372] Preferably, in the so-called 3DHS method, a transfer film, such as the at least one film including the at least one sensor film, is placed on the already deformed component, in particular a 3D or 2.5D deformed component, and heat stamping is performed. In particular, before heat stamping, the transfer film is made to abut and adapt to the contour of the deformed component by means of vacuum suction and preheating, and then heat stamping is performed by means of a correspondingly shaped and heated embossing die. The carrier film in particular absorbs tensile force as in the IMD method and preferably protects the paint layer to be transferred from cracks and other damages during the deformation process.

[0373] In addition, the TOM method can also be used in steps c), d) and / or e).

[0374] Preferably, in the so-called TOM method (TOM = three-dimensional covering method), a transfer film, such as the at least one film including the at least one sensor film, is applied to a flat substrate, in particular a flat substrate, and in particular the carrier film is then peeled off. When the substrate coated with the transfer layer is then placed on the already deformed component and the substrate is then deformed according to the shape of the component, the applied transfer layer preferably absorbs the tensile force of the deformation.

[0375] The at least one film and / or the at least one sensor film or the at least one film including the at least one sensor film can have at least one carrier film and / or at least one transfer layer in steps a), b), c), d) and / or e), in particular preferably in steps b), c) and / or e), at least one deep-drawing film is provided between the at least one carrier film and the at least one transfer layer, and in particular the at least one deep-drawing film is preferably manufactured or applied by a casting method and / or by applying with a slot nozzle and / or by screen printing, gravure printing, flexographic printing or inkjet printing.

[0376] Preferably, the at least one deep-drawing film is designed to absorb tensile force and thus serves as a deformation aid for the transfer layer. In particular, the deep-drawing film protects the transfer layer from cracks and other damages during the deformation process. A three-dimensional component is in particular understood as a component that is deformed in three dimensions, i.e., in terms of length, width and height extension, such as the housing of an appliance.

[0377] Furthermore, the deep-drawing film can be configured as a lacquer layer with a layer thickness between 10 μm and 200 μm, preferably between 20 μm and 100 μm, and more preferably between 25 μm and 75 μm.

[0378] Furthermore, it is preferred that the deep-drawing film is made of polyurethane, in particular polyurethane is solvent-based or a water dispersion and / or is sufficiently deformable and / or consists of different polymers, which polymers are in particular selected from the following: polyurethanes, such as polyester polyols, polyether polyols, polycarbonate polyols, polyacrylate polyols, polyester polyols and combinations of these polymers.

[0379] The deep-drawing film can be configured to be transparent, translucent or opaque and is preferably colorless or colored here. In particular, at least partial opacity and / or coloration is advantageous for detecting the presence of the deep-drawing film on a decorated substrate or component.

[0380] Furthermore, the deep-drawing film can have a decoration, such as a pattern or motif, such as a logo or lettering. The lettering can for example include manufacturer information or instructions for use of the deep-drawing film and / or the substrate or component.

[0381] In particular, the decoration or motif can be printed onto the deep-drawing film. For example, the deep-drawing film can be cast in a first casting process, then the decoration or motif can be printed and subsequently the decoration or motif can be embedded in the deep-drawing film in a second casting process. It is preferred that the decoration or motif is made of the same material as the deep-drawing film or also of a material different from the deep-drawing film, for example made of PVC or another polyurethane.

[0382] The deep-drawing film can be provided over the entire surface, in particular over the entire surface of the transfer film, or as an alternative can be provided locally. For example, the deep-drawing film can only be provided in the surface areas where particularly strong deformation occurs during the processing of the transfer film and for example not be provided in the surface areas where only slight deformation or no deformation occurs during the processing of the transfer film. For example, the deep-drawing film can also not be provided only in the particularly narrow edge regions of the transfer film in order to be able to remove the deep-drawing film at this edge more easily, which edge is now optically recognizable and haptically accessible. For this purpose, the deep-drawing film can also have operating aids facilitating removal on its edge, such as at least one tab or the like.

[0383] Furthermore, the deep-drawing film can be configured to be stretchable by 200%, preferably 500% up to more than 1500% at a deep-drawing temperature in the range of 130 °C to 160 °C. These values are in particular determined using a Zwick Z005 test device from Zwick GmbH & Co. KG in Ulm in a standardized tensile test (DIN 53504, ISO 37).

[0384] Furthermore, a first release layer can be provided between the carrier film and the deep-drawing film and a second release layer can be provided between the deep-drawing film and the transfer layer.

[0385] Furthermore, it is preferred that the first and / or second release layer is made of wax, especially selected from: carnauba wax, montanate esters, polyethylene wax, polyamide wax or PTFE wax (PTFE = polytetrafluoroethylene). In addition, surface-active substances such as silicon are particularly suitable as the release layer. A thin layer made of a crosslinked melamine-formaldehyde resin paint can also be used as the release layer.

[0386] The first and / or second release layer can have a layer thickness of less than 1 μm, especially less than 0.1 μm.

[0387] Furthermore, the peeling force of the carrier film from the deep-drawing film based on the first release layer provided between the carrier film and the deep-drawing film can be 5 to 10 times smaller than the peeling force of the deep-drawing film from the transfer layer, especially based on the second release layer provided between the deep-drawing film and the transfer layer. The peeling value is especially determined by means of a tensile testing machine (Zwick Z005 from Zwick GmbH & Co. KG, Ulm), and preferably the transfer film is flat-bonded to the lower support here and then the layer to be peeled is peeled off at a right angle by a tensile test. It is further preferred to determine the peeling force by means of a dynamometer.

[0388] The transfer layer can be constructed as a multi-layer body formed by a plurality of transfer layers.

[0389] Furthermore, the peeling force of the deep-drawing film from the transfer layer based on the second release layer provided between the deep-drawing film and the transfer layer is 30% to 70% smaller than the adhesion between adjacent transfer layers.

[0390] Furthermore, the transfer layer includes a first transfer layer, a second transfer layer and a third transfer layer facing the deep-drawing film, and especially the first and / or third transfer layer can be omitted.

[0391] Especially, the first transfer layer is constructed as a protective layer.

[0392] Furthermore, it is preferred that the protective layer is constructed as a protective lacquer made of a PMMA-based lacquer, which preferably has a layer thickness in the range of 2 μm to 5 μm. The protective lacquer can also be made of a radiation-curable dual-curing lacquer, in particular such a dual-curing lacquer is thermally pre-crosslinked during and / or after being applied in liquid form in the first step and in the second step after processing the transfer film, in particular by high-energy radiation, preferably UV radiation, for free-radical post-crosslinking. This type of dual-curing lacquer in particular has different polymers or oligomers, which preferably include unsaturated acrylate or methacrylate groups, in particular these functional groups can be free-radically crosslinked with each other in the above-mentioned second step. For the thermal pre-crosslinking in the first step, it is advantageous that these polymers or oligomers also include at least two or more alcohol groups. It is further preferred that the alcohol groups can be crosslinked with polyfunctional isocyanates or melamine-formaldehyde resins. As unsaturated oligomers or polymers, various UV raw materials are particularly considered, such as epoxy acrylate, polyether acrylate, polyester acrylate and in particular acrylate acrylate. As isocyanates, blocked and unblocked representatives based on TDI (TDI = toluene-2,4-diisocyanate), HDI (HDI = hexamethylene diisocyanate) or IPDI (IPDI = isophorone diisocyanate) are particularly considered. The melamine crosslinker can in particular be in fully etherified form and / or can be of the imino type and / or constitute benzoguanamine representatives. Without the deep-drawing film, many of these protective lacquers will not be able to deform sufficiently, especially not be deep-drawn sufficiently.

[0393] The protective layer can be a protective lacquer made of a lacquer based on PMMA (PMMA = polymethyl methacrylate) or a mixture of PVDF (PVDF = polyvinylidene fluoride) and PMMA, preferably with a layer thickness in the range of 2 μm to 50 μm, preferably in the range of 5 μm to 30 μm. These lacquers preferably provide the necessary mechanical brittleness for the transfer film and its sufficiently precise and neat stamping or separability at the desired outer boundary of the transfer surface area of the transfer layer.

[0394] Furthermore, the second transfer layer can be configured as a single-layer or multi-layer decorative layer. In particular, such a decorative layer preferably comprises one or more layers. The decorative layer preferably has one or more color layers, in particular color paint layers. Furthermore, these color layers can also be dyed differently, designed to be transparent and / or opaque and / or separated from each other by one or more additional layers, in particular transparent layers. The color layers can here be made of an adhesive and a colorant and / or pigment, in particular an optically variable pigment and / or a metallic pigment. Furthermore, the decorative layer can also comprise one or more reflective layers, which are preferably configured to be opaque, translucent and / or partial. In particular, the reflective layer can be made of a metal and / or an HRI layer (HRI = high refractive index), i.e., a layer having a high refractive index, in particular a refractive index higher than 1.5. As metals, for example, aluminum, chromium or copper or their alloys are considered. As an HRI layer, for example, ZnS or SiO2 is considered. Furthermore, the decorative layer can also have one or more optically active relief structures, in particular diffraction structures and / or holograms and / or refraction structures and / or matte structures. Here, at least one reflective layer is at least partially directly disposed on the relief structure.

[0395] The transfer film is especially manufactured in such a way that a deep-drawing film is manufactured from multiple layers in multiple successive passes. Thereby, in particular, a sufficient layer thickness can be achieved. The individual layers of the deep-drawing film can preferably be manufactured by a casting method, for example, by applying with a slot nozzle or by screen printing, gravure printing, flexographic printing or inkjet printing.

[0396] Between successive passes, the layer applied first for manufacturing the deep-drawing film, in particular the paint layer, can be at least partially dried. In particular, this layer is dried in such a way that the layer is at least surface-dried. However, this layer can also be thoroughly dried. After drying, then preferably the next layer is applied. The next layer is preferably applied in such a way that it preferably at least partially dissolves the surface of the previously applied layer. Advantageously, these two layers together form a uniform integral layer by partial dissolution.

[0397] In the case where more than two successive layers are used for manufacturing the deep-drawing film, the process is especially repeated accordingly multiple times, in particular all successive layers together form a uniform integral layer.

[0398] Preferably, a layer, in particular a paint layer having a thickness in the range of about 0.1 μm to 50 μm, preferably in the range of 0.1 μm to 35 μm, and further preferably in the range of 1 μm to 25 μm, is applied in one pass. By means of such relatively thin sub-layers, in particular an integral layer having a preferably larger layer thickness as described above can be achieved.

[0399] The following especially describes a method for coating at least one plastic body by means of the at least one film and / or the at least one sensor film and / or the one or more film elements.

[0400] It may be stipulated that the method is designed as an IMD method, in which the at least one film and / or the at least one sensor film and / or the one or more film elements are placed in an injection molding station and the at least one film and / or the at least one sensor film and / or the one or more film elements are back-injected or injected with plastic molding compound.

[0401] After back-injection or spray injection, preferably the carrier film contained in the at least one film and / or the at least one sensor film and / or the one or more film elements is peeled off from the transfer film contained in the at least one film and / or the at least one sensor film and / or the one or more film elements. The deep-drawn film contained in the at least one film and / or the at least one sensor film and / or the one or more film elements can also be peeled off together with the transfer film. However, it is advantageous that the deep-drawn film remains at least temporarily on the transfer layer. The deep-drawn film is especially used here as a protective layer for the transfer layer. In particular, the protective layer of the transfer layer itself can be omitted here. In addition, the deep-drawn film can be peeled off shortly before using the coated component or when using the component. Thereby, the component can be prevented from being damaged in any way at an early stage, even before use. Here, it is advantageous that the transfer layer has its own protective layer, which protects the transfer layer from external influences when using the component.

[0402] The method can be designed as an insert molding method, which includes covering (Kaschieren) a substrate, deep-drawing or forming the covered substrate, and back-injecting or injecting the deep-drawn or formed substrate with thermoplastic molding compound, peeling off the carrier layer of the transfer film from the substrate after covering the substrate, and peeling off the deep-drawn film from the back-injected or injected substrate after back-injection or injection.

[0403] The preferred embodiments of the equipment mentioned below are described.

[0404] Preferably, the at least one film and / or the at least one sensor film has polycarbonate (PC) as at least one thermoplastic material or as at least one thermoplastic plastic.

[0405] Further preferably, the at least one sensor film and / or the at least one film has polyethylene terephthalate (PET) as at least one thermoplastic material or as at least one thermoplastic plastic.

[0406] The at least one film can have a thickness of 250 μm to 3000 μm, especially 300 μm to 2000 μm.

[0407] In addition, the at least one film can have a tensile strength between 20 MPa and 100 MPa, especially between 20 MPa and 80 MPa.

[0408] Furthermore, the at least one membrane may be flexible at least locally or over the entire surface.

[0409] Preferably, the at least one membrane is provided as a membrane composite that is flexible at least locally or over the entire surface and / or comprises one or more membranes, in particular one or more membranes that are flexible at least locally or over the entire surface.

[0410] The at least one sensor membrane may have a thickness of 25 μm to 150 μm, in particular 25 μm to 125 μm.

[0411] Furthermore, the at least one sensor membrane may have a tensile strength between 150 MPa and 500 MPa, in particular between 200 MPa and 500 MPa.

[0412] Furthermore, the tensile strength of the at least one membrane may be at most two-thirds times the tensile strength of the at least one sensor membrane.

[0413] In particular, the thickness of the at least one membrane is at least half times the thickness of the at least one sensor membrane.

[0414] Preferably, the at least one membrane is transparent, translucent or opaque at least locally or over the entire surface and / or the at least one sensor membrane is transparent, translucent or opaque at least locally.

[0415] However, the thickness of the membrane may also be greater, for example the same as the thickness of the sensor membrane. Particularly advantageously, the thickness of the flexible membrane is greater than the thickness of the sensor membrane. In this case, the sensor membrane is thinner than the membrane. For example, the membrane may be designed to be 2, 3, 4 or 5 times thicker than the sensor membrane.

[0416] In particular, it is preferred that the at least one sensor membrane is applied to the at least one membrane by thermal lamination in at least one thermal lamination station and / or by heat stamping and / or cold lamination and / or gluing, in particular cold gluing, in particular in at least one heat stamping station and / or cold lamination station and / or gluing station, in particular preferably in a cold embossing station.

[0417] The device may comprise one or more of the following additional stations, which are in particular for performing one or more of the steps of steps b1) to b3):

[0418] - A supply station for providing at least one carrier substrate;

[0419] - An application station for applying at least one conductive layer to the carrier substrate such that the at least one conductive layer forms an electrical functional structure in at least one functional region and the at least one conductive layer forms at least one contact structure for contacting the electrical functional structure in at least one contact region;

[0420] - An application station for applying at least one adhesion promoter layer for applying the at least one sensor film to the at least one film such that the adhesion promoter layer at least partially does not cover the at least one contact area when viewed perpendicular to the plane formed by the at least one carrier substrate or the at least one adhesion promoter layer is applied over the entire surface when viewed perpendicular to the plane formed by the at least one carrier substrate.

[0421] Furthermore, the at least one conductive layer may include at least one metal layer and / or a layer made of ITO and / or AZO and / or PEDOT and / or conductive paint. In particular, the device includes one or more of the following additional stations, which are preferably used to perform one or more steps of steps b4a), b4b) and / or b5):

[0422] - An application station for applying the at least one conductive layer;

[0423] - A structuring station for structuring the at least one conductive layer by at least partially removing the at least one conductive layer;

[0424] - An application station for applying the at least one conductive layer in a structured form.

[0425] Preferably, at least one of the at least one sensor films has one or more sensors and / or electrical components, in particular LEDs, and in particular has one or more touch sensors and / or one or more displays.

[0426] In particular, at least one of the at least one sensor films has one or more contact areas, and in particular one or more of the one or more contact areas are at least partially not covered by a film or layer. Preferably, one or more of the one or more contact areas are provided on the surface of the at least one sensor film of the at least one sensor film facing away from the at least one film.

[0427] Preferably, the at least one film and / or the at least one sensor film at least partially has at least one decoration and / or at least one decorative film.

[0428] The forming station and / or the device for forming the at least one film including the at least one sensor film may have in particular one or more of the following forming stations, which are in particular selected from: a deep drawing station, a thermoforming station, a high-pressure forming station, an injection molding station.

[0429] Preferably, the at least one film and / or the at least one sensor film is formed at the forming station such that the radius of curvature of the at least one film and / or the at least one sensor film and / or the formed film body is at least locally less than 1000 mm, in particular less than 200 mm, more preferably less than 100 mm, and / or the elongation rate of the at least one film and / or the at least one sensor film and / or the formed film body is greater than or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, and particularly preferably greater than or equal to 300%.

[0430] Preferably, the at least one stamping station is designed such that the at least one stamping station introduces one or more holes or punches into the one or more film elements, in particular such that one or more of the one or more holes serve as injection channels for the plastic mold plastic when injection molding is performed at the at least one injection molding station.

[0431] The device may include one or more of the following additional stations, which are in particular for performing one or more of steps e1) to e6):

[0432] - A supply station for providing at least one decorative film, which at least locally has at least one opaque coating;

[0433] - A processing station for introducing at least one decorative element for at least one decoration into the at least one decorative film;

[0434] - A loading station for loading the one or more blanked film elements and the at least one decorative film into an injection molding station, which injection molding station includes a first mold half and a second mold half, and the first mold half and the second mold half in the closed state form an injection mold cavity for molding at least one plastic body, and the one or more blanked film elements are mounted on a first wall of the injection mold cavity and / or the at least one decorative film is mounted on a second wall of the injection mold cavity, in particular the second wall is arranged opposite to the first wall;

[0435] - An injection molding station for injection molding the one or more blanked film elements and the at least one decorative film with plastic mold plastic to form a plastic component including the at least one plastic body, such that the one or more blanked film elements form a first surface of the plastic component and the at least one decorative film forms a second surface of the plastic component, in particular the first surface is opposite to the second surface;

[0436] - A demolding station for removing the plastic component.

[0437] In addition, the device may include the following additional station, which is in particular for performing step e7):

[0438] - A processing station for placing the first blanked membrane element of the one or more blanked membrane elements and / or the second blanked membrane element of the one or more blanked membrane elements into an injection molding station.

[0439] In addition, the device may include one or more of the following additional stations, which are especially for performing one or more steps of steps e8) to e10):

[0440] - An injection molding station for injection molding the first blanked membrane element and / or the second blanked membrane element with plastic molding compound to form a plastic component including the at least one plastic body, such that the first blanked membrane element forms a first surface of the plastic component and / or the second blanked membrane element forms a second surface of the plastic component. The injection molding station includes a first mold half and a second mold half, and the first mold half and the second mold half especially form an injection mold cavity for molding at least one plastic body in a closed state. The first blanked membrane element is mounted on a first wall of the injection mold cavity and / or the second blanked membrane element is mounted on a second wall of the injection mold cavity, especially the second wall is disposed opposite to the first wall, especially the first surface is disposed opposite to the second surface;

[0441] - A demolding station for removing the plastic component.

[0442] Especially, the device may include one or more of the following additional stations, which are especially for performing one or more steps of steps e11) to e15):

[0443] - A supply station for providing the one or more blanked membrane elements and / or at least one section of at least one decorative film on the first mold half and / or the second mold half such that when the first mold half and the second mold half are closed, the one or more blanked membrane elements and / or the at least one decorative film abut against an end face of a raised edge region that defines and surrounds a first mold recess;

[0444] - An injection molding station for injecting plastic molding compound through an injection channel into an injection mold cavity formed by the closed first and second mold halves, and back-injecting the at least one decorative film and / or the one or more membrane elements with plastic molding compound in a region surrounded by the raised edge region, especially without plastic molding compound passing through a sealing gap, thereby forming a plastic component including the at least one plastic body. The injection molding station includes a first mold half and a second mold half having a first mold recess, and the first mold half and / or the second mold half has at least one injection channel. The first mold half and the second mold half especially form an injection mold cavity for molding at least one plastic body in a closed state;

[0445] - Demolding station for removing the plastic component.

[0446] Preferably, the device may include one or more of the following additional stations, which are especially for performing one or more steps of steps e16) to e21):

[0447] - Loading station for placing the one or more blanked film elements and / or at least one decorative film into the first mold recess of the first mold half of the injection molding station and for fixing the one or more blanked film elements and / or the at least one decorative film;

[0448] - Another loading station for placing an in-mold labeling molded part, i.e., an IML molded part, into the second mold recess of the second mold half of the injection molding station and for fixing the IML molded part;

[0449] - Injection molding station, which includes a first mold half having a first mold recess and a second mold half having a second mold recess, the first mold half being movably constructed and the second mold half being immovably constructed;

[0450] - Demolding station for removing the plastic component.

[0451] Preferably, after being removed from the demolding station, the plastic component has a radius of curvature and / or a stretch ratio, the radius of curvature being at least locally less than 1000 mm, especially less than 200 mm, further preferably less than 100 mm, and / or the stretch ratio being greater than or equal to 1%, especially greater than or equal to 20%, preferably greater than or equal to 50%, especially preferably greater than or equal to 300%.

[0452] In addition, the device may include one or more of the following additional stations:

[0453] - At least one laminating station, especially for connecting the formed and blanked film elements to the final substrate, the laminating station preferably being arranged after the stamping station and further preferably including at least one heating element and one pressing element,

[0454] - At least one film covering station, especially for connecting the formed and blanked film elements to the final substrate, the film covering station preferably being arranged after the stamping station and further preferably including at least one heating element and one pressing element.

[0455] The device may also include a lamination station and / or a film coating station. These stations are used to connect the formed and blanked film elements to the final substrate. The final substrate may be formed, for example, by the housing of an appliance, to which the plastic component or film element is to be applied. The lamination station and / or the film coating station can further process the formed and blanked film elements by lamination or film coating. The lamination station and / or the film coating station thus constitute equipment stations that replace the injection molding station. However, the lamination station and / or the film coating station can also be arranged in combination with the injection molding station.

[0456] The following preferred embodiments of the plastic component are mentioned.

[0457] Preferably, the at least one formed film and / or the at least one formed sensor film has polycarbonate (PC) as at least one thermoplastic material or as at least one thermoplastic plastic.

[0458] More preferably, the at least one formed sensor film and / or the at least one formed film has polyethylene terephthalate (PET) as at least one thermoplastic material or at least one thermoplastic plastic.

[0459] In particular, the at least one formed film has a thickness of 250 μm to 3000 μm, especially 300 μm to 2000 μm.

[0460] Preferably, the at least one formed film has a tensile strength between 20 MPa and 100 MPa, especially between 20 MPa and 80 MPa.

[0461] More preferably, the at least one formed sensor film has a thickness of 25 μm to 150 μm, especially 25 μm to 125 μm.

[0462] In particular, it is preferred that the at least one formed sensor film has a tensile strength between 150 MPa and 500 MPa, especially between 200 MPa and 500 MPa.

[0463] The tensile strength of the at least one formed film can be at most two-thirds of the tensile strength of the at least one formed sensor film multiplied by a coefficient.

[0464] In addition, the thickness of the at least one formed film can be at least half of the thickness of the at least one formed sensor film multiplied by a coefficient.

[0465] However, the thickness of the film can also be thicker, for example, the same as the thickness of the sensor film. Particularly advantageously, the thickness of the flexible film is greater than the thickness of the sensor film. In this case, the sensor film is thinner than the film. For example, the film can be designed to be 2, 3, 4, or 5 times thicker than the sensor film.

[0466] In addition, the plastic component and / or the at least one forming film and / or the at least one forming sensor film locally have at least one decoration and / or at least one decorative film.

[0467] In addition, the at least one decorative film and / or the one or more film elements have at least one decorative layer and / or at least one functional layer, in particular a layer with an electrical function, which layer in particular comprises one or more elements selected from touch sensors, antennas, capacitors, coils, electromagnetic shielding, in particular a non-conductive metal layer for avoiding electrostatic charging, displays, LEDs, circuits, solar cells, at least one protective layer which is in particular post-curable and / or at least one barrier layer and / or at least one adhesion promoter layer.

[0468] At least one of the at least one decorative layer preferably comprises one or more of the following decorative layers or a combination of one or more decorative layers:

[0469] - A transparent, translucent or opaque paint layer containing dyes and / or pigments, in particular organic / inorganic pigments, luminescent and / or fluorescent pigments and / or dyes, optically variable pigments, thermochromic pigments and / or dyes, metallic pigments, magnetically orientable pigments,

[0470] - A volume holographic layer,

[0471] - A layer having an optically active surface relief, in particular a diffractive and / or refractive surface relief, a holographic surface relief, a surface relief comprising refractive structures, diffractive structures, in particular lens structures, microlens arrays, microprisms, micromirrors, matte structures, in particular isotropic and / or anisotropic matte structures and / or any combination of such structures;

[0472] - A reflective layer, in particular a metallic or dielectric reflective layer;

[0473] - A high refractive index or low refractive index layer, in particular a layer whose refractive index differs from a refractive index of 1.5 by more than + / - 0.2;

[0474] - A liquid crystal layer, in particular a cholesteric and / or nematic liquid crystal layer;

[0475] - A thin film layer showing an optically variable color-changing effect, which in particular comprises an absorption layer, a dielectric spacer layer and an optional reflective layer or alternatively a multiple sequence of alternating high refractive index and low refractive index transparent layers.

[0476] In addition, these decorative layers can be applied on top of each other and / or adjacent to each other in any order here. In particular, each individual decorative layer is designed in the form of a pattern on a partial surface here in order to preferably achieve the desired graphic decoration. The decorative layers are preferably arranged in registration with respect to each other.

[0477] At least one functional layer of the at least one functional layer preferably comprises one or more of the functional layers listed below or a combination of one or more functional layers:

[0478] A layer having an electrical function, in particular comprising one or more elements selected from the following: touch sensors, antennas, electromagnetic shielding, a non-conductive metal layer for avoiding electrostatic charging, displays, LEDs (light-emitting diodes), circuits, solar cells, a layer having a magnetic function, such as a magnetic barcode, a layer having a mechanical function, such as a reinforcing element or a strengthening element made of metal and / or plastic and / or woven and / or non-woven fiber layers and / or fiber additives and / or fiber additional layers, a layer having an optical function, such as an anti-reflection layer or a reflective layer, a layer having a tactile function, such as a soft-touch surface coating. Description of the Drawings

[0479] The present invention will be described below with reference to the accompanying drawings by way of various embodiments. The drawings are as follows:

[0480] Figure 1 A schematic diagram showing a method;

[0481] Figure 2 A schematic diagram showing a method step, as well as a film and a sensor film;

[0482] Figure 3 A schematic diagram showing a method step, as well as a film and a sensor film;

[0483] Figure 4 A schematic diagram showing a method step, as well as a film and a sensor film;

[0484] Figure 5 A schematic diagram showing a method step and a station of a device, as well as a film and a sensor film;

[0485] Figure 6 A schematic diagram showing a method step and a station of a device, as well as a film and a sensor film;

[0486] Figure 7 A schematic diagram showing a plastic member;

[0487] Figure 8 A schematic diagram showing a method step and a station of a device, as well as a film and a sensor film;

[0488] Figure 9 A schematic diagram showing a plastic member. Detailed Description of the Invention

[0489] Figure 1 A method for manufacturing at least one plastic member 1 is shown, in which the following steps a, b, c and d are preferably carried out in the following order, preferably cyclically in the following order:

[0490] a provides at least one film 2 and at least one sensor film 3, wherein the at least one film 2 and / or the at least one sensor film 3 has at least one thermoplastic material or at least one thermoplastic plastic.

[0491] b applies the at least one sensor film 3 onto at least one first region of the surface of the at least one film 2.

[0492] c shapes the at least one film 2 including the at least one sensor film 3, thereby forming one or more shaped film bodies 4.

[0493] d punches out one or more film elements 4a constituted by at least one second region of the one or more shaped film bodies 4.

[0494] Preferably, in step a, the at least one film 2 and / or the at least one sensor film 3 has polycarbonate (PC) as at least one thermoplastic material or as at least one thermoplastic plastic.

[0495] More preferably, in step a, the at least one sensor film 3 and / or the at least one film 2 has polyethylene terephthalate (PET) as at least one thermoplastic material or as at least one thermoplastic plastic.

[0496] Figure 2 The film 2 shown, especially the film provided according to step a, preferably has a thickness of 50 μm to 3000 μm, especially 300 μm to 2000 μm, and / or has a tensile strength between 20 MPa and 100 MPa, especially between 20 MPa and 80 MPa. Preferably, the film 2 is flexible at least locally or over the entire surface.

[0497] The film 2 can be provided as a film composite, which is flexible at least locally or over the entire surface and / or includes one or more films, especially one or more films that are flexible at least locally or over the entire surface.

[0498] Figure 2 The sensor film 3 shown, especially the sensor film provided according to step a, preferably has a thickness of 25 μm to 150 μm, especially 25 μm to 125 μm, and / or has a tensile strength between 150 MPa and 500 MPa, especially between 200 MPa and 500 MPa.

[0499] Figure 3 The film 2 and the sensor film 3 are shown, especially after the sensor film 3 is applied to a region of the surface of the film 2 according to step b.

[0500] Preferably, in step a, the at least one film 2 has a thickness of 50 μm to 3000 μm, in particular 300 μm to 2000 μm, and / or a tensile strength between 20 MPa and 100 MPa, in particular between 20 MPa and 80 MPa. Preferably, in step a, the at least one film 2 is at least partially or entirely flexible. In particular, in step a, the at least one film 2 is provided as a film composite that is at least partially or entirely flexible and / or includes one or more films, in particular one or more films that are at least partially or entirely flexible.

[0501] In step a, the at least one sensor film 3 may have a thickness of 25 μm to 150 μm, in particular 25 μm to 125 μm, and / or in step a, the at least one sensor film 3 has a tensile strength between 150 MPa and 500 MPa, in particular between 200 MPa and 500 MPa.

[0502] Furthermore, the tensile strength of the at least one film 2 in step a and / or b is at most two-thirds of the tensile strength of the at least one sensor film 3 in step a and / or b and / or the thickness of the at least one film 2 in step a and / or b is at least half of the thickness of the at least one sensor film 3 in step a and / or b multiplied by a factor.

[0503] In the illustrated embodiment, the thickness of the film 2 is greater than the thickness of the sensor film 3. In the illustrated embodiment, the thickness of the at least one film 2 in step a and / or b is at least approximately three times the thickness of the at least one sensor film 3 in step a and / or b multiplied by a factor.

[0504] Furthermore, in step a, the at least one film 2 may be at least partially or entirely transparent, translucent or opaque, and / or in step b, the at least one sensor film 3 may be at least partially transparent, translucent or opaque.

[0505] Preferably, the at least one sensor film 3 is applied to the at least one film 2 in step b by thermal lamination and / or by heat stamping and / or cold lamination and / or gluing, in particular cold gluing.

[0506] Step b may include one or more of the following further steps, which are in particular for manufacturing the at least one sensor film 3 and / or for applying the at least one sensor film 3 to the at least one film 2, in particular performing the following further steps in the following order, preferably performing the following further steps in a cyclic order:

[0507] b1 Providing at least one carrier substrate 30;

[0508] b2 Apply at least one conductive layer 31 to the carrier substrate 30, the at least one conductive layer 31 forming an electrical functional structure in at least one functional region 32 and forming at least one contact structure for contacting the electrical functional structure in at least one contact region 34;

[0509] b3 Apply at least one adhesion layer 35 to apply the at least one sensor film 3 to the at least one film 2 such that when viewed perpendicular to the plane formed by the at least one carrier substrate 30, the adhesion layer 35 at least partially does not cover the at least one contact region 34 or the at least one adhesion layer 35 is applied over the entire surface when viewed perpendicular to the plane formed by the at least one carrier substrate 30.

[0510] Furthermore, in step b2 and / or b3, the at least one conductive layer 31 may have at least one metal layer and / or a layer made of ITO and / or AZO and / or PEDOT and / or conductive paint. In particular, step b includes one or more of the following further steps, and in particular the following further steps are performed in the following order, preferably the following further steps are performed in a cyclic order:

[0511] b4a Apply the at least one conductive layer in one or more sub-steps;

[0512] b4b Structure the at least one conductive layer by at least partially removing the at least one conductive layer in one or more sub-steps; and / or

[0513] b5 Apply the at least one conductive layer in a structured form in one or more sub-steps.

[0514] In particular, the at least one sensor film of the at least one sensor film 3 has one or more sensors and / or electrical components in step b, in particular an LED, in particular one or more touch sensors and / or one or more displays.

[0515] Preferably, the at least one sensor film of the at least one sensor film 3 has one or more contact regions in step b, in particular one or more of the one or more contact regions are at least partially not covered by a film or layer, and preferably one or more of the one or more contact regions are provided on the surface of the at least one sensor film of the at least one sensor film 3 facing away from the at least one film 2.

[0516] It is further preferred that the at least one film 2 has at least one decoration and / or at least one decorative film 5 at least locally in step a and / or the at least one sensor film 3 in step b and / or the at least one film 2 and / or the at least one sensor film 3 in a further step.

[0517] In step c, the shaping of the at least one film 2 including the at least one sensor film 3 is preferably carried out by one or more shaping methods, especially selected from the following shaping methods: deep drawing, thermoforming, high-pressure forming, injection molding methods.

[0518] Preferably, the radius of curvature of the at least one film 2 and / or the at least one sensor film 3 is at least locally less than 1000 mm, especially less than 200 mm, further preferably less than 100 mm, after step c, and / or the elongation rate of the at least one film 2 and / or the at least one sensor film 3 is greater than or equal to 1%, especially greater than or equal to 20%, preferably greater than or equal to 50%, especially preferably greater than or equal to 300% after step c.

[0519] The method and / or step d may include the following further steps:

[0520] e Injection molding of the one or more blanked film elements 4a.

[0521] Especially in step d, one or more holes or punched holes are introduced into the one or more film elements 4a, and especially one or more of the holes have the function of an injection channel for the injection of plastic mold plastic when injection molding is carried out in step e.

[0522] Step e may include one or more of the following further steps, especially the following further steps are carried out in the following order, preferably in a cyclic order:

[0523] e1 Providing at least one decorative film 5a, which especially has at least one opaque coating 50 at least locally;

[0524] e2 Introducing at least one decorative element of at least one decoration into the at least one decorative film 5a by processing at at least one processing station;

[0525] e3 Place the one or more blanked film elements 4a and the at least one decorative film 5a into an injection molding station 15, which includes a first mold half 15a and a second mold half 15b. The first mold half 15a and the second mold half 15b form an injection molding cavity 15c for molding at least one plastic body 7a, especially in the closed state. The at least one blanked film element 4a is mounted on a first wall 15aa of the injection molding cavity 15c and / or the at least one decorative film 5a is mounted on a second wall 15bb of the injection molding cavity 15c. In particular, the second wall 15bb is arranged opposite the first wall 15aa;

[0526] e4 Inject the one or more blanked film elements 4a and the at least one decorative film 5a with plastic to form a plastic component 1 including the at least one plastic body 7a, such that the one or more blanked film elements 4a form a first surface of the plastic component 1 and the at least one decorative film 5a forms a second surface of the plastic component 1. In particular, the first surface is arranged opposite the second surface;

[0527] e5 Open the injection molding station 15 by moving the first mold half 15a and the second mold half 15b away from each other, especially after a cooling time of the at least one plastic body 7a contained in the plastic component 1;

[0528] e6 Remove the plastic component 1.

[0529] In addition, step e may include one or more of the following further steps, especially performing the following further steps in the following order, preferably in a cyclic order:

[0530] e7 Place a first blanked film element 4aa of the one or more blanked film elements 4a and / or a second blanked film element 4ab of the one or more blanked film elements 4a into an injection molding station 16, which includes a first mold half 16a and a second mold half 16b. The first mold half 16a and the second mold half 16b form an injection molding cavity 16c for molding at least one plastic body 7b, especially in the closed state. The first blanked film element 4aa is mounted on a first wall 16aa of the injection molding cavity 16c and / or the second blanked film element 4ab is mounted on a second wall 16bb of the injection molding cavity 16c. In particular, the second wall 16bb is arranged opposite the first wall 16aa;

[0531] Injection molding the first blanked membrane element 4aa and / or the second blanked membrane element 4ab with plastic in the e8 plastic mold to form the plastic component 1 including the at least one plastic body 7b, such that the first blanked membrane element 4aa forms the first surface of the plastic component 1 and / or the second blanked membrane element 4ab forms the second surface of the plastic component 1, especially with the first surface and the second surface being opposite to each other;

[0532] e9 Opening the injection molding station 16 by moving the first mold half 16a and the second mold half 16b away from each other, especially after the cooling time of the at least one plastic body 7b contained in the plastic component 1;

[0533] e10 Removing the plastic component 1.

[0534] In addition, an injection molding station 17 can be used to perform step d and / or e. The injection molding station 17 includes a first mold half 17a having a first mold recess 170a and a second mold half 17b. The first mold half 17a and / or the second mold half 17b has at least one injection channel 17d. The first mold half 17a and the second mold half 17b form an injection mold cavity 17c for molding at least one plastic body 7c especially in the closed state.

[0535] Step d and / or e includes one or more of the following further steps, especially performing the following further steps in the following order, preferably performing the following further steps in a cyclic order:

[0536] e11 Providing at least one section of the one or more blanked membrane elements 4a and / or at least one decorative film 5b on the first mold half 17a and / or the second mold half 17b such that when the first mold half 17a and the second mold half 17b are closed, the one or more blanked membrane elements 4a and / or the at least one decorative film 5b abut against the end face 17aa of the raised edge region 170b, which defines the first mold recess 170a and surrounds the first mold recess 170a;

[0537] e12 Closing the first mold half 17a and the second mold half 17b to such an extent that in the region of the end face 17aa of the raised edge region 170b between the first mold half 17a and the second mold half 17b, a gap is formed at least in a partial region between the end face 17aa of the raised edge region 170b of the first mold half 17a and the corresponding end face 17bb of the second mold half 17b, and the gap is sealed by the one or more blanked membrane elements 4a squeezed in the gap region and / or the at least one decorative film 5b arranged in the middle and squeezed in the gap region;

[0538] e13 injects the plastic molding compound through the injection channel 17d into the injection mold cavity 17c formed by the closed first and second mold halves 17a, 17b, and back-injects the at least one decorative film 5b and / or the one or more film elements 4a with the plastic molding compound in the region surrounded by the raised edge region 170b, in particular without the plastic molding compound passing through the sealing gap, and hereby forms the plastic component 1 including the at least one plastic body 7c;

[0539] e14 opens the first and second mold halves 17a, 17b by moving the first and / or second mold halves 17a, 17b relative to each other and removes the plastic component 1 including the at least one plastic body 7c from the injection station 17;

[0540] e15 removes the remaining sections of the at least one decorative film 5b and provides at least one further section of the at least one decorative film 5b.

[0541] Furthermore, an injection station 18 can be used to carry out step e, which injection station 18 includes a first mold half 18a having a first mold recess 180a and a second mold half 18b having a second mold recess 180b, the first mold half 18a being movably and the second mold half 18b being immovably constructed,

[0542] Step e includes one or more of the following further steps, in particular the following further steps are carried out in the following order, preferably in a cyclic order:

[0543] e16 places the one or more blanked film elements 4a and / or the at least one decorative film 5c into the first mold recess 180a of the first mold half 18a and secures the one or more blanked film elements 4a and / or the at least one decorative film 5c;

[0544] e17 places the in-mold labeling molding 6 or the IML molding 6 into the second mold recess of the second mold half 18b and secures the IML molding 6, which IML molding 6 includes an insert decorative layer 50b and a back film 50c;

[0545] e18 closes the injection station 18 by lowering the first mold half 18a onto the second mold half 18b, hereby forming an injection mold cavity 18c for molding at least one plastic body 7d;

[0546] e19 injects plastic molding compound into the second mold recess 180b of the second mold half 18b, and the plastic molding compound separates the IML molded part 6 from the second mold half 18b and presses it onto one or more punched film elements 4a and / or the at least one decorative film 5c in the first mold recess 180a of the first mold half 18a, where a plastic component 1 including the at least one plastic body 7d is formed;

[0547] e20 opens the injection molding station 18 by moving the first mold half 15a away from the second mold half 18b, especially after a cooling time of the at least one plastic body 7d contained in the plastic component 1;

[0548] e21 removes the plastic component 1.

[0549] Preferably, the radius of curvature of the plastic component 1 is at least locally less than 1000 mm, especially less than 200 mm, more preferably less than 100 mm, after step e, and / or the elongation rate of the plastic component 1 is greater than or equal to 1%, especially greater than or equal to 20%, preferably greater than or equal to 50%, especially preferably greater than or equal to 300%, after step e.

[0550] The apparatus 10, preferably for manufacturing at least one plastic component 1, especially for implementing one of the above methods, has one or more of the following stations:

[0551] - A supply station 11, which is designed such that the at least one supply station 11 supplies at least one film 2 and supplies at least one sensor film 3, and the at least one film 2 and / or the at least one sensor film 3 has at least one thermoplastic material or at least one thermoplastic plastic;

[0552] - An application station 12, which is designed such that the at least one application station 12 applies the at least one sensor film 3 onto at least one first region of the surface of the at least one film 2;

[0553] - A forming station 13, which is designed such that the at least one forming station 13 forms the at least one film 2 including the at least one sensor film 3 to form at least one formed film body 4;

[0554] - A punching station 14, which is designed such that the at least one punching station 14 punches out at least one film element 4a from at least one second region of the at least one formed film body 4.

[0555] Preferably, the at least one film 2 and / or the at least one sensor film 3 has polycarbonate (PC) as at least one thermoplastic material or as at least one thermoplastic plastic.

[0556] More preferably, the at least one sensor film 3 and / or the at least one film 2 has polyethylene terephthalate (PET) as at least one thermoplastic material or as at least one thermoplastic plastic.

[0557] Preferably, the sensor film 3 has one or more sensors, in particular one or more touch sensors and / or one or more display screens or displays.

[0558] Preferably, the sensor film 3 has one or more contact areas, in particular one or more of the one or more contact areas are at least partially not covered by a film or layer, and preferably one or more of the one or more contact areas are provided on the surface of the at least one sensor film of the sensor film 3 facing away from the film 2.

[0559] The tensile strength of the film 2 can be at most two-thirds times the tensile strength of the sensor film 3 and / or the thickness of the film 2 can be at least half times the thickness of the sensor film 3.

[0560] In particular, the film 2 is at least partially or entirely transparent, translucent or opaque and / or the sensor film 3 is at least partially transparent, translucent or opaque.

[0561] The sensor film 3 can be applied to the film 2 by thermal lamination in at least one thermal lamination station and / or by thermal lamination and / or by heat stamping and / or cold lamination and / or gluing, in particular cold gluing, in particular in at least one heat stamping station and / or cold lamination station and / or gluing station.

[0562] The device 10 can include one or more of the following additional stations, which are in particular for forming the sensor film 3:

[0563] - A supply station for providing at least one carrier substrate 30;

[0564] - An application station for applying at least one conductive layer 31 to the carrier substrate 30 such that the at least one conductive layer 31 forms an electrical functional structure in at least one functional area 32 and the at least one conductive layer 31 forms at least one contact structure for a contact-connected electrical functional structure in at least one contact connection area 34;

[0565] - An application station for applying at least one adhesion promoter layer 35 for attaching the at least one sensor film 3 to the at least one film 2 such that when viewed perpendicular to the plane formed by the at least one carrier substrate 30, the adhesion promoter layer 35 at least partially does not cover the at least one contact area 34 or such that the at least one adhesion promoter layer 35 is applied over the entire surface when viewed perpendicular to the plane formed by the at least one carrier substrate 30.

[0566] Furthermore, the at least one conductive layer 31 may also include at least one metal layer and / or a layer made of ITO and / or AZO and / or PEDOT and / or conductive paint. In particular, the device 10 includes one or more of the following additional stations, which are preferably used to perform one or more steps of steps b4a, b4b, and / or b5:

[0567] - An application station for applying the at least one conductive layer;

[0568] - A structuring station for structuring the at least one conductive layer by at least partially removing the at least one conductive layer;

[0569] - An application station for applying the at least one conductive layer in a structured form.

[0570] The film 2 and / or the sensor film 3 may at least partially have at least one decoration and / or at least one decorative film 5.

[0571] Preferably, the forming station 13 and / or the device 10 for forming the at least one film 2 including the at least one sensor film 3 has one or more forming stations selected in particular from the following forming stations: a deep drawing station, a thermoforming station, a high-pressure forming station, an injection molding station.

[0572] The film 2 and / or the sensor film 3 may be formed in the forming station 13 such that the radius of curvature of the film 2 and / or the sensor film 3 and / or the formed film body 4 is at least partially less than 1000 mm, in particular less than 200 mm, further preferably less than 100 mm, and / or the elongation rate of the film 2 and / or the sensor film 3 is greater than or equal to 1%, in particular greater than or equal to 20%, preferably greater than or equal to 50%, and in particular preferably greater than or equal to 300%.

[0573] Figure 4 There is shown a formed film body 4, which is formed in particular according to step c and which includes Figure 2 and 3 the film shown in as the formed film 2 and Figure 2 and Figure 3 the sensor film shown in as the formed sensor film.

[0574] Figure 5 shows Figure 4 the formed film body 4 shown therein, from which film elements 4a are punched out, in particular from a second region 141 of the formed film body 4, in particular using a punching tool 14a of a punching station 14.

[0575] Preferably, the device 10 has at least one injection molding station 15, which is designed such that the at least one injection molding station 15 performs back injection on the at least one punched film element 4a.

[0576] Preferably, the at least one punching station 14 is designed such that the at least one punching station 14 introduces one or more holes or perforations into the one or more film elements 4a, and in particular, when injection molding is performed in the at least one injection molding station 15, one or more of the one or more holes function as injection channels for the plastic molding compound.

[0577] Figure 6 shows Figure 5 the punched film body 4a shown therein, which is located in a second mold half 15b of the injection molding station 15. The injection molding station 15 also includes a first mold half 15a. In the injection molding station 15, a plastic body 7 is injection molded according to step e.

[0578] Figure 8 shows Figure 5 the punched film body 4a shown therein, which is located in a second mold half 15b of the injection molding station 15. The injection molding station 15 also includes a first mold half 15a. In the injection molding station 15, a plastic body 7 is injection molded according to step e.

[0579] The device 10 may include one or more of the following additional stations:

[0580] - a supply station for providing at least one decorative film 5a, the at least one decorative film in particular having at least one opaque coating 50 at least partially;

[0581] - a processing station for introducing at least one decorative element for decorating the at least one decorative film 5a;

[0582] - A placing station for placing the one or more blanked film elements 4a and the at least one decorative film 5a into an injection molding station 15, which injection molding station 15 includes a first mold half 15a and a second mold half 15b. The first mold half 15a and the second mold half 15b form an injection molding cavity 15c for molding at least one plastic body 7a, especially in a closed state. The at least one blanked film element 4a is mounted on a first wall 15aa of the injection molding cavity 15c and / or the at least one decorative film 5a is mounted on a second wall 15bb of the injection molding cavity 15c. Especially, the second wall 15bb is arranged opposite to the first wall 15aa;

[0583] - An injection molding station for injection molding the one or more blanked film elements 4a and the at least one decorative film 5a with plastic to form a plastic component 1 including the at least one plastic body 7a, such that the one or more blanked film elements 4a form a first surface of the plastic component 1 and the at least one decorative film 5a forms a second surface of the plastic component 1. Especially, the first surface is arranged opposite to the second surface;

[0584] - A demolding station for removing the plastic component 1.

[0585] In addition, the device 10 may include the following additional stations:

[0586] - A processing station for placing the first blanked film element 4aa of the one or more blanked film elements 4a and / or the second blanked film element 4ab of the one or more blanked film elements 4a into the injection molding station.

[0587] In addition, the device 10 may include the following additional stations:

[0588] - An injection molding station 16 for injection molding the first blanked film element 4aa and / or the second blanked film element 4ab with plastic to form a plastic component 1 including the at least one plastic body 7b, such that the first blanked film element 4aa forms a first surface of the plastic component 1 and / or the second blanked film element 4ab forms a second surface of the plastic component 1. The injection molding station 16 includes a first mold half 16a and a second mold half 16b. The first mold half 16a and the second mold half 16b form an injection molding cavity 16c for molding at least one plastic body 7b, especially in a closed state. The first blanked film element 4aa is mounted on a first wall 16aa of the injection molding cavity 16c and / or the second blanked film element 4ab is mounted on a second wall 16bb of the injection molding cavity 16c. Especially, the second wall 16bb is arranged opposite to the first wall 16aa. Especially, the first surface is arranged opposite to the second surface;

[0589] - A demolding station for removing the plastic component 1.

[0590] In particular, the device 10 may include one or more of the following additional stations:

[0591] - A supply station for providing at least one section of the one or more blanked film elements 4a and / or at least one decorative film 5b on the first die half 17a and / or the second die half 17b such that when the first die half 17a and the second die half 17b are closed, the one or more blanked film elements 4a and / or the at least one decorative film 5b abut against the end face 17aa of the raised edge region 170b that defines and surrounds the first die recess 170a;

[0592] - An injection molding station for injecting plastic molding compound through an injection channel 17d into an injection molding cavity 17c formed by the closed first and second die halves 17a, 17b, and for back-injecting the at least one decorative film 5b with the plastic molding compound in the region surrounded by the raised edge region 170b, in particular without plastic molding compound passing through the sealing gap, thereby forming a plastic component 1 including the at least one plastic body 7c. The injection molding station 17 includes a first die half 17a having a first die recess 170a and a second die half 17b. The first die half 17a and / or the second die half 17b has at least one injection channel 17d. The first die half 17a and the second die half 17b in particular form an injection molding cavity 17c for molding at least one plastic body 7c in the closed state;

[0593] - A demolding station for removing the plastic component 1.

[0594] In addition, the device 10 may include one or more of the following additional stations:

[0595] - A loading station for placing the one or more blanked film elements 4a and / or at least one decorative film 5c into the first die recess 180a of the first die half 18a of the injection molding station 18 and for fixing the one or more blanked film elements 4a and / or the at least one decorative film 5c;

[0596] - Another loading station for placing the in-mold labeling molded part 6, i.e., the IML molded part 6, into the second die recess of the second die half 18b of the injection molding station 18 and for fixing the IML molded part 6;

[0597] - An injection molding station 18 that includes a first die half 18a having a first die recess 180a and a second die half 18b having a second die recess 180b, wherein the first die half 18a is configured to be movable and the second die half 18b is configured to be immovable;

[0598] - Demolding station for removing the plastic component 1.

[0599] Preferably, after being removed from the demolding station, the plastic component 1 has a radius of curvature and / or a stretch ratio. The radius of curvature is at least locally less than 1000 mm, especially less than 200 mm, more preferably less than 100 mm, and / or the stretch ratio is greater than or equal to 1%, especially greater than or equal to 20%, preferably greater than or equal to 50%, and especially preferably greater than or equal to 300%.

[0600] Figure 7 The plastic component 1 is shown in cross-section. This plastic component is especially manufactured by a method according to the above method, preferably by a device according to the above device. The plastic component 1 includes a punched-out (for example, see Figure 4 ) and back-injected (for example, see Figure 6 and / or Figure 8 ) film element 4b. This film element includes a formed film 2a and a formed sensor film 3a. The at least one formed film 2a and / or the at least one formed sensor film 3a has at least one thermoplastic material or at least one thermoplastic plastic. In addition, Figure 7 the plastic component 1 shown in

[0601] also has a plastic body 7 on the surface facing away from the formed sensor film 3a. This plastic body 7 is especially formed by injection molding at the injection molding station in method step e. Preferably, the at least one formed film 2a and / or the at least one formed sensor film 3a has polycarbonate (PC) as at least one thermoplastic material or as at least one thermoplastic plastic.

[0602] Figure 7 The plastic body 1 shown in

[0603] Preferably Figure 7 has a radius of curvature of less than 1000 mm, especially less than 200 mm, more preferably less than 100 mm, and / or a stretch ratio of greater than or equal to 1%, especially greater than or equal to 20%, preferably greater than or equal to 50%, and especially preferably greater than or equal to 300% in at least four regions.

[0604] More preferably Figure 7The formed sensor film 3a shown in [description] has a thickness of 25 μm to 150 μm, in particular 25 μm to 125 μm, and / or a tensile strength between 150 MPa and 500 MPa, in particular between 200 MPa and 500 MPa.

[0605] Figure 7 The tensile strength of the formed film 2a shown in [description] is in particular Figure 7 two-thirds of the tensile strength of the formed sensor film 3a shown in [description].

[0606] In addition, Figure 7 the thickness of the formed film 2a shown in [description] is preferably at least Figure 7 half of the thickness of the formed sensor film 3a shown in [description].

[0607] In the illustrated embodiment, the thickness of the film 2 is greater than the thickness of the sensor film 3. In the illustrated embodiment, the thickness of at least one of the films 2 in steps a and / or b is at least approximately three times the thickness of at least one of the sensor films 3 in steps a and / or b.

[0608] Figure 9 shows Figure 7 the plastic component 1 shown in [description], which, in addition to including the film element 4c, also has a decorative film 5 on the surface of the plastic body 7 facing away from the formed sensor film 3a.

[0609] The plastic component 1 and / or the formed film 2a and / or the formed sensor film 3a may locally have at least one decoration and / or at least one decorative film 5.

[0610] List of reference numerals

[0611] 1 Plastic component

[0612] 2 Film

[0613] 2a Formed film

[0614] 3 Sensor film

[0615] 30 Carrier substrate

[0616] 31 Conductive layer

[0617] 32 Functional area

[0618] 34 Contact area

[0619] 35 Adhesion promoter layer

[0620] 3a Formed film

[0621] 4 Formed film body

[0622] 4a Die-cut film element

[0623] 4b Die-cut and back-injected film element

[0624] 4c Die-cut, back-injected and decorated film element

[0625] 5, 5a, 5b, 5c Decorative film

[0626] 50a Opaque coating

[0627] 50b Insert decoration layer

[0628] 50c Back film

[0629] 6 In-mold labeling or IML molded part

[0630] 7, 7a, 7b, 7c, 7d Plastic body

[0631] 10 Equipment

[0632] 11 Supply station

[0633] 12 Application station

[0634] 13 Forming station

[0635] 14 Stamping station

[0636] 14a Stamping tool

[0637] 141 Stamping area

[0638] 15, 16, 17, 18 Injection molding stations

[0639] 15a, 16a, 17a, 18a First mold half

[0640] 15b, 16b, 17b, 18b Second mold half

[0641] 15c, 16c, 17c, 18c Injection molding cavities

[0642] 15aa First wall

[0643] 15bb Second wall

[0644] 17aa, 17bb End faces

[0645] 17d Injection channel

[0646] 170a, 180a First mold recesses

[0647] 170b Edge area

[0648] 180b Second mold recess

[0649] Method steps a, b, c, d, e

[0650] Method steps b1, b2, b3, b4a, b4b, b5

[0651] Method steps e1, e2, e3, e4, e5, e6

[0652] Method steps e7, e8, e9, e10, e11

[0653] Method steps e12, e13, e14, e15

[0654] Method steps e16, e17, e18, e19

[0655] Method steps e20, e21

Claims

1. A method for manufacturing at least one plastic component (1), in which the following steps are carried out: a) Providing at least one film (2) and at least one sensor film (3), wherein the at least one film (2) and / or the at least one sensor film (3) has at least one thermoplastic material, b) Applying the at least one sensor film (3) to at least one first region of the surface of the at least one film (2), c) Shaping the at least one film (2) comprising the at least one sensor film (3), thereby forming one or more shaped film bodies (4), d) Punching out one or more film elements, the film elements being formed from at least one second region of the one or more shaped film bodies (4), It is characterized in that The at least one sensor film (3) in step a) has polyethylene terephthalate (PET) as at least one thermoplastic material, the tensile strength of the at least one film (2) in step a) and / or b) is at most the tensile strength of the at least one sensor film (3) in step a) and / or b) multiplied by a factor of 2 / 3, and the thickness of the at least one film (2) in step a) and / or b) is at least the thickness of the at least one sensor film (3) in step a) and / or b) multiplied by a factor of 1 / 2.

2. The method according to claim 1, wherein The at least one film (2) in step a) has polycarbonate (PC) as at least one thermoplastic material.

3. The method according to claim 1, characterized in that, The at least one film (2) in step a) has a thickness of 250 μm to 3000 μm.

4. The method according to any one of claims 1 to 3, characterized in that, The at least one film (2) in step a) has a tensile strength between 20 MPa and 100 MPa.

5. The method according to any one of claims 1 to 3, characterized in that, The at least one film (2) in step a) is locally or entirely flexible.

6. The method according to any one of claims 1 to 3, characterized in that, The at least one film (2) in step a) is provided as a film composite, which is locally or entirely flexible and / or the film composite comprises one or more films.

7. The method according to any one of claims 1 to 3, characterized in that, The at least one sensor film (3) in step a) has a thickness of 25 μm to 150 μm.

8. The method according to any one of claims 1 to 3, characterized in that, The at least one sensor film (3) in step a) has a tensile strength between 150 MPa and 500 MPa.

9. The method according to any one of claims 1 to 3, characterized in that, The thickness of the at least one film (2) in step a) and / or b) is at least the thickness of the at least one sensor film (3) in step a) and / or b) multiplied by a factor of 2, 3, 4 or 5.

10. The method according to any one of claims 1 to 3, characterized in that The at least one film (2) in step a) is locally or entirely transparent, translucent or opaque, and / or the at least one sensor film (3) in step b) is at least locally transparent, translucent or opaque.

11. The method according to any one of claims 1 to 3, characterized in that, The at least one sensor film (3) in step b) is applied to the at least one film (2) by thermal lamination and / or by heat stamping and / or cold lamination and / or gluing.

12. The method according to any one of claims 1 to 3, characterized in that, Step b) comprises one or more of the following further steps: b1) Providing at least one carrier substrate (30); b2) Apply at least one conductive layer (31) to a carrier substrate (30), wherein the at least one conductive layer (31) forms an electrical functional structure in at least one functional region (32), and the at least one conductive layer (31) forms at least one contact structure for contacting the electrical functional structure in at least one contact area (34); b3) Apply at least one adhesion promoter layer (35) for applying the at least one sensor film (3) to the at least one film (2) such that, when viewed perpendicular to the plane formed by the at least one carrier substrate (30), the adhesion promoter layer (35) at least partially does not cover the at least one contact area (34), or when viewed perpendicular to the plane formed by the at least one carrier substrate (30), the at least one adhesion promoter layer (35) is applied over the entire surface.

13. The method according to claim 12, wherein The at least one conductive layer (31) in step b2) and / or b3) comprises at least one metal layer and / or a layer made of ITO and / or AZO and / or PEDOT and / or conductive paint.

14. The method according to any one of claims 1 to 3, characterized in that At least one of the at least one sensor film (3) in step b) has one or more sensors and / or electrical components.

15. The method according to any one of claims 1 to 3, characterized in that At least one of the at least one sensor film (3) in step b) has one or more contact areas.

16. The method according to any one of claims 1 to 3, characterized in that The at least one film (2) in step a) and / or the at least one sensor film (3) in step b) and / or the at least one film (2) and / or the at least one sensor film (3) in further steps at least partially has at least one decoration and / or at least one decorative film.

17. The method according to any one of claims 1 to 3, characterized in that, The at least one film (2) including the at least one sensor film (3) is shaped in step c) by one or more shaping methods.

18. The method according to any one of claims 1 to 3, characterized in that The radius of curvature of the at least one film (2) and / or the at least one sensor film (3) is at least partially less than 1000 mm after step c), and / or the elongation rate of the at least one film (2) and / or the at least one sensor film (3) is greater than or equal to 1% after step c).

19. The method according to any one of claims 1 to 3, characterized in that, The method comprises the following further steps: e) Injection-mold the one or more blanked film elements.

20. The method according to claim 19, wherein In step d), one or more holes are machined in the one or more film elements.

21. The method according to claim 19, wherein In step d), one or more punched holes are machined in the one or more film elements.

22. The method according to claim 19, wherein Step e) comprises one or more of the following further steps: e1) Provide at least one decorative film; e2) Introduce at least one decorative element of at least one decoration into the at least one decorative film by machining in at least one processing station; e3) Place the one or more blanked membrane elements and the at least one decorative film into an injection molding station, which includes a first mold half and a second mold half. The first mold half and the second mold half form an injection mold cavity for molding at least one plastic body. The at least one blanked membrane element is mounted on the first wall of the injection mold cavity and / or the at least one decorative film is mounted on the second wall of the injection mold cavity; e4) Inject mold plastic into the one or more blanked membrane elements and the at least one decorative film to form a plastic component (1) including the at least one plastic body, such that the one or more blanked membrane elements form the first surface of the plastic component (1) and the at least one decorative film forms the second surface of the plastic component (1); e5) Open the injection molding station by moving the first mold half and the second mold half away from each other; e6) Remove the plastic component (1).

23. The method according to claim 19, wherein Step e) includes one or more of the following further steps: e7) Place the first blanked membrane element of the one or more blanked membrane elements and / or the second blanked membrane element of the one or more blanked membrane elements into an injection molding station, which includes a first mold half and a second mold half. The first mold half and the second mold half form an injection mold cavity for molding at least one plastic body. The first blanked membrane element is mounted on the first wall of the injection mold cavity and / or the second blanked membrane element is mounted on the second wall of the injection mold cavity; e8) Inject mold plastic into the first blanked membrane element and / or the second blanked membrane element to form a plastic component (1) including the at least one plastic body, such that the first blanked membrane element forms the first surface of the plastic component (1) and / or the second blanked membrane element forms the second surface of the plastic component (1); e9) Open the injection molding station by moving the first mold half and the second mold half away from each other; e10) Remove the plastic component (1).

24. The method according to claim 19, characterized in that, Use one injection molding station to perform step d) and / or e). The injection molding station includes a first mold half having a first mold recess and a second mold half. The first mold half and / or the second mold half has at least one injection channel (17d). The first mold half and the second mold half form an injection mold cavity for molding at least one plastic body. Step d) and / or e) includes one or more of the following further steps: e11) Provide at least one section of the one or more blanked membrane elements and / or the at least one decorative film on the first mold half and / or the second mold half, such that when the first mold half and the second mold half are closed, the one or more blanked membrane elements and / or the at least one decorative film abut against the end face (17aa) of the raised edge region (170b) that defines and surrounds the first mold recess; e12) Close the first mold half and the second mold half to such an extent that in the end face (17aa) region of the raised edge region (170b) between the first mold half and the second mold half, a gap is at least locally formed between the end face (17aa) of the raised edge region (170b) of the first mold half and the corresponding end face (17bb) of the second mold half, and this gap is sealed by the one or more membrane elements of the blanked and extruded in the gap region and / or at least one decorative film provided in the middle and extruded in the gap region; e13) Inject plastic molding compound through the injection channel (17d) into the injection mold cavity formed by the closed first and second mold halves, and back-inject the at least one decorative film and / or the one or more membrane elements with the plastic molding compound in the region surrounded by the raised edge region (170b), thereby forming a plastic component (1) including the at least one plastic body; e14) Open the first and second mold halves by moving the first and / or second mold half relative to each other and remove the plastic component (1) including the at least one plastic body from the injection station; e15) Remove the remaining section of the at least one decorative film and provide at least one additional section of the at least one decorative film.

25. The method according to claim 19, wherein Use one injection station to perform step (e), the injection station including a first mold half having a first mold recess and a second mold half having a second mold recess (180b), the first mold half being configured to be movable and the second mold half being configured to be immovable; Step (e) includes one or more of the following further steps: e16) Place the one or more membrane elements of the blanked and the at least one decorative film into the first mold recess of the first mold half and fix the one or more membrane elements of the blanked and the at least one decorative film; e17) Place the in-mold labeling molded part (6) or the IML molded part (6) into the second mold recess of the second mold half and fix the IML molded part (6), the IML molded part (6) including an insert decorative layer (50b) and a back film (50c); e18) Close the injection station by lowering the first mold half onto the second mold half, thereby forming an injection mold cavity for molding at least one plastic body; e19) Inject plastic molding compound into the second mold recess (180b) of the second mold half, the plastic molding compound separating the IML molded part (6) from the second mold half and pressing it onto the one or more membrane elements of the blanked and the at least one decorative film in the first mold recess of the first mold half, thereby forming a plastic component (1) including the at least one plastic body; e20) Open the injection station by moving the first mold half away from the second mold half; e21) Remove the plastic component (1).

26. The method according to claim 19, wherein The radius of curvature of the plastic component (1) is at least locally less than 1000 mm after step (e), and / or the elongation rate of the plastic component is greater than or equal to 1% after step (e).

27. The method according to any one of claims 1 to 3, characterized in that, The thermoplastic material is a thermoplastic.

28. Plastic component (1), characterized in that, The plastic component (1) is manufactured by the method according to any one of claims 1 to 27. The plastic component (1) comprises a blanked and back-injected film element, which film element comprises at least one formed film (2a) and at least one formed sensor film (3a). The at least one formed film (2a) and / or the at least one formed sensor film (3a) has at least one thermoplastic material. The radius of curvature of the plastic component (1) is at least locally less than 1000 mm, and / or the elongation rate of the plastic component (1) is greater than or equal to 1%. The at least one formed sensor film (3a) has polyethylene terephthalate (PET) as at least one thermoplastic material. The tensile strength of the at least one formed film (2a) is at most the tensile strength of the at least one formed sensor film (3a) multiplied by the factor 2 / 3, and the thickness of the at least one formed film is at least the thickness of the at least one formed sensor film multiplied by the factor 1 / 2.

29. The plastic member according to claim 28, wherein, The at least one formed film (2a) has polycarbonate (PC) as at least one thermoplastic material.

30. The plastic component (1) according to claim 28, characterized in that, The at least one formed film (2a) has a thickness of 250 μm to 3000 μm.

31. The plastic component (1) according to any one of claims 28 to 30, characterized in that, The at least one formed film (2a) has a tensile strength between 20 MPa and 100 MPa.

32. The plastic component (1) according to any one of claims 28 to 30, characterized in that, The at least one formed sensor film (3a) has a thickness of 25 μm to 150 μm.

33. The plastic component (1) according to any one of claims 28 to 30, characterized in that, The at least one formed sensor film (3a) has a tensile strength between 150 MPa and 500 MPa.

34. The plastic component (1) according to claim 28, characterized in that, The thickness of the at least one film (2) in step a) and / or b) is at least the thickness of the at least one sensor film (3) in step a) and / or b) multiplied by the factors 2, 3, 4 or 5.

35. The plastic component (1) according to any one of claims 28 to 30, characterized in that, The plastic component (1) and / or the at least one formed film (2a) and / or the at least one formed sensor film (3a) locally has at least one decoration and / or at least one decorative film.

36. The plastic component (1) according to any one of claims 28 to 30, characterized in that, The thermoplastic material is a thermoplastic.

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