Flat plate-shaped molded body and multilayer body

By using a bisphenol AP type polycarbonate flat molded body with a low photoelasticity coefficient, the optical problem of the resin film substrate during bending was solved, achieving high bending resistance and low optical defects.

CN114746487BActive Publication Date: 2025-11-28MITSUBISHI GAS CHEM CO INC
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Patent Information

Application Number
CN202080083194.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2019-12-04
Filing Date
2020-12-01
Publication Date
2025-11-28
Estimated Expiration
2040-12-01

AI Technical Summary

Technical Problem

Existing resin film substrates are prone to image blurring and ghosting problems in foldable or bendable displays, mainly due to the birefringence of light path generated during bending.

Method used

It adopts a bisphenol AP type polycarbonate flat molded body with low photoelasticity and thin thickness, with a glass transition temperature above 180℃, a thickness below 75μm, and a haze of below 2.0%. Antioxidants and release agents can be added to form a multi-layer structure to enhance bending resistance.

Benefits of technology

It effectively reduces optical defects during bending, improves bending resistance, and ensures transparency and heat resistance of the film.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a flat plate-shaped molded body and a multilayer body, which have less optical defects when bent and have excellent bending resistance. The flat plate-shaped molded body of the present invention is a flat plate-shaped molded body containing a bisphenol AP-type polycarbonate having a glass transition temperature of 180°C or higher, and has an optical elasticity coefficient of 85 x 10 ‑12 m 2 -6 or lower, a thickness of 75 μm or less, and a haze of 2.0% or less.
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Description

TECHNICAL FIELD

[0001] The present application relates to a flat molded body and a multilayer body. In particular, it relates to a flat molded body using polycarbonate suitable for a substrate of a transparent conductive film. BACKGROUND

[0002] Polycarbonate is used in various fields as a general-purpose engineering plastic because of its excellent transparency, impact resistance, heat resistance, dimensional stability, and the like. One of its uses is application in the optical field that utilizes the excellent transparency. A general polycarbonate is a resin derived from bisphenol A, and is being investigated for use in optical lenses because it has a relatively high refractive index. For example, Patent Literature 1 describes that a polycarbonate obtained by copolymerizing a specific structural unit has excellent optical properties and impact resistance, and can be used for eyeglass lenses, camera lenses. In addition, Patent Literature 2 discloses an optical member composed of an aromatic polycarbonate, and as specific examples of optical members, optical disc substrates, camera lenses, and the like are cited.

[0003] Furthermore, polycarbonate is also being investigated for use in various films. For example, films for electronic-electrical equipment parts, optical films, heat-resistant films, electrically insulating films, and the like can be cited (Patent Literature 3). Patent Literature 3 describes a polycarbonate film molded from a polycarbonate copolymer having a specific structural unit, and describes that it is particularly excellent in mechanical strength, heat resistance, and the like. Furthermore, research and development for applying the excellent properties of polycarbonate to various technical fields are very active, but at present, none of them are mature, and there is a large room for improvement in their properties and the like. Since it is expected that polycarbonate will be investigated for use in more film applications in the future, it is desirable to develop a polycarbonate film having properties suitable for each application.

[0004] PRIOR ART DOCUMENTS

[0005] PATENT LITERATURE

[0006] Patent Literature 1: Japanese Patent Application Laid-Open No. 2017-210569

[0007] Patent Literature 2: Japanese Patent Application Laid-Open No. Hei 10-109950

[0008] Patent Literature 3: Japanese Patent Application Laid-Open No. Hei 05-339390 SUMMARY

[0009] PROBLEMS TO BE SOLVED BY THE INVENTION

[0010] In this regard, in recent years, displays and touch screens of image and communication devices have been developed as foldable or bendable devices, and the bendable properties have been increasingly valued. As a substrate for these displays and touch screens, a resin film material is considered to be the most suitable, rather than glass. However, when such a display is bent, image blurring, ghosting, and the like can occur. These problems are caused by birefringence generated in the optical path when the resin film substrate is bent. In addition, in the above-described foldable display and the like, the resin film substrate is sometimes required to have bend resistance.

[0011] The present application has been made to solve the above-described problems, and an object thereof is to provide a flat plate-shaped molded body having less optical problems when bent and excellent bend resistance, and a multilayer body including the above-described flat plate-shaped molded body.

[0012] Technical solution for solving the problem

[0013] To solve the above-described problems, the present inventors have conducted investigations, and as a result, have found that the above-described problems can be solved by forming a flat plate-shaped molded body having a low photoelastic coefficient and a small thickness. Specifically, the above-described problems are solved by the following means.

[0014] <1> A flat plate-shaped molded body, which is a flat plate-shaped molded body containing a bisphenol AP polycarbonate having a glass transition temperature of 180°C or higher, and has a photoelastic coefficient of 85 x 10 -12 m 2 75 μm or less, and a haze of 2.0% or less.

[0015] <2> The flat plate-shaped molded body according to <1>, wherein a bisphenol A polycarbonate is further contained, and the proportion of the bisphenol AP polycarbonate in the polycarbonates contained in the flat plate-shaped molded body is 15 mass% or more and 90 mass% or less.

[0016] <3> The flat plate-shaped molded body according to <1> or <2>, wherein the flat plate-shaped molded body has a glass transition temperature of 154°C or higher.

[0017] <4> The flat plate-shaped molded body according to any one of <1> to <3>, wherein an antioxidant is further contained.

[0018] <5> The flat plate-shaped molded body according to any one of <1> to <4>, wherein a release agent is further contained.

[0019] <6> The flat plate-shaped molded body according to any one of <1> to <5>, wherein no breakage occurs when a bend resistance test is performed, in which the flat plate-shaped molded body is cut to a size of 75 x 25 mm, and is bent using an FPC bending tester according to JIS C5016, with a curvature radius of 1.5 mm on the bending surface, for 200,000 times.

[0020] <7> The flat plate-shaped molded body according to any one of <1> to <6>, which is used as a substrate for a transparent conductive film.

[0021] <8> A multilayer body having the flat plate-shaped molded body according to any one of <1> to <7>.

[0022] <9> The multilayer body according to <8>, wherein a cured resin layer is provided on one face or both faces of the flat plate-shaped molded body.

[0023] <10> The multilayer body according to <8> or <9>, wherein a refractive index adjusting layer is provided on one face or both faces of the flat plate-shaped molded body.

[0024] <11> The multilayer body according to any one of <8> to <10>, wherein a protective film is provided on one face or both faces of the flat plate-shaped molded body.

[0025] <12> The multilayer body according to any one of <8> to <11>, wherein a transparent conductive layer is provided on the flat plate-shaped molded body.

[0026] <13> The multilayer body according to <12>, wherein the transparent conductive layer contains one or more of ATO (antimony-doped indium oxide), FTO (fluorine-doped tin oxide), AZO (aluminum-doped zinc oxide), GZO (gallium-doped zinc oxide), ITO (indium tin composite oxide), Ag, Cu, Au, and carbon nanotube.

[0027] <14> The multilayer body according to <12> or <13>, which is a transparent conductive film.

[0028] A flat plate-shaped molded body, which is any of the flat plate-shaped molded bodies described above, further having a thickness of 50 μm or less (preferably 49 μm or less).

[0029] A flat plate-shaped molded body, which is any of the flat plate-shaped molded bodies described above, further having a thickness-direction optical path difference (Rth, retardation) of 38 nm or less.

[0030] <C> A transparent conductive film, which is a transparent conductive film sequentially having a transparent conductive layer, a cured resin layer, and a flat plate-shaped molded body, wherein the flat plate-shaped molded body is any of the flat plate-shaped molded bodies described above.

[0031] <D> A transparent conductive film, which is a transparent conductive film sequentially having a transparent conductive layer, a refractive index adjusting layer, a cured resin layer, and a flat plate-shaped molded body, wherein the flat plate-shaped molded body is any of the flat plate-shaped molded bodies described above.

[0032] A transparent conductive film, which is a transparent conductive film having, in order, a transparent conductive layer, a refractive index adjusting layer, a curable resin layer, a flat plate-shaped molded body, and a protective film, the flat plate-shaped molded body being any one of the flat plate-shaped molded bodies.

[0033] Effects of the Invention

[0034] The present application can provide a flat plate-shaped molded body having less optical (defect) problems at the time of bending and excellent bending resistance, and a multilayer body containing the flat plate-shaped molded body. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 is a schematic view showing an example of a layer structure of a multilayer body of the present application.

[0036] Figure 2 is a schematic view showing a measuring method of light leakage in the example. DETAILED DESCRIPTION

[0037] Hereinafter, the content of the present application will be described in detail. Note that in the present specification, "~" is used in the meaning that the numerical value recited before and after it is included as a lower limit value and an upper limit value.

[0038] In the present specification, various physical property values and characteristic values are values at 23°C unless otherwise noted.

[0039] The flat plate-shaped molded body and the multilayer body in the present specification each include a case where it is in the shape of a film or a sheet. The "film" and the "sheet" mean molded bodies that are relatively thin in thickness and substantially flat with respect to length and width, respectively. In addition, the "film" in the present specification can be single-layer or multilayer.

[0040] Note that the "mass parts" in the present specification means the relative amount of a component, and the "mass%" means the absolute amount of a component.

[0041] The flat plate-shaped molded body of the present application is characterized in that it is a flat plate-shaped molded body containing a bisphenol AP type polycarbonate having a glass transition temperature of 180°C or higher, and has an optical elasticity coefficient of 85 x 10 -12 m 2 of 2.0% or less.

[0042] In the present application, by using a bisphenol AP type polycarbonate having a glass transition temperature of 180°C or higher, the thickness is made thinner, and the photoelastic coefficient is reduced, whereby a flat plate shaped molded body having low transparency with a haze of 2.0% or less and excellent bending resistance with less optical defects at the time of bending can be obtained. Also, the heating shrinkage of the flat plate shaped molded body can be reduced. The mechanism is that the photoelastic coefficient is reduced, whereby the resin is less likely to cause birefringence due to external force. Therefore, it is presumed that birefringence caused by the application of external force by a molding roll at the time of film molding can be reduced, and the optical defects at the time of bending can be suppressed. It is presumed that the bending resistance is reduced because the stress generated on the surface of the film at the time of bending can be reduced by making the film thickness thinner.

[0043] Hereinafter, the present application will be described in detail.

[0044] "Bisphenol AP type polycarbonate having a glass transition temperature of 180°C or higher"

[0045] The flat plate shaped molded body of the present application contains a bisphenol AP type polycarbonate having a glass transition temperature of 180°C or higher. By using a bisphenol AP type polycarbonate having a high glass transition temperature, high heat resistance and low photoelastic coefficient can be achieved while maintaining the film processability. That is, by replacing the methyl group of the side chain of the bisphenol A type polycarbonate with a phenyl group, the heat resistance can be improved while reducing the optical anisotropy.

[0046] The bisphenol AP type polycarbonate refers to a resin having a carbonate unit derived from bisphenol AP (1,1-bis(4-hydroxyphenyl)-1-phenylethane) and derivatives thereof, and preferably has a structural unit represented by the following formula (A-1).

[0047]

[0048] In formula (A-1), R 1 ~R 4 independently represent a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, an alkyl group having 1 to 9 carbon atoms (preferably 1 to 3), an aryl group having 6 to 12 carbon atoms (preferably 6 to 10), an alkoxy group having 1 to 5 carbon atoms (preferably 1 to 3), an alkenyl group having 2 to 5 carbon atoms (preferably 2 or 3), or an aralkyl group having 7 to 17 carbon atoms (preferably 7 to 11). 1 represents an integer of 0 to 5. m and n independently represent an integer of 0 to 4. * in the formula indicates the bonding position to other sites (other structural units or terminal groups).

[0049] The structural unit represented by formula (A-1) is preferably a structural unit represented by the following formula (A-2).

[0050]

[0051] R1 R 2 R 3 R 4 l, m, and n are the same as those defined in equation (A-1). The asterisk (*) in the equation indicates the junction with other parts (other structural units or end bases).

[0052] The structural unit represented by equation (A-2) is preferably the structural unit represented by equation (A-3) described later. The asterisk (*) in the equation indicates the junction with other parts (other structural units or end bases).

[0053]

[0054] In all structural units excluding end groups, the content of the structural unit represented by formula (A-1) in the bisphenol AP type polycarbonate is preferably 70 mol% or more, more preferably 80 mol% or more, and more preferably 90 mol% or more. There is no particular upper limit, and 100 mol% of the structural unit represented by formula (A-1) can be used. The structural unit derived from bisphenol AP can be only one type or can consist of two or more types. Resins in which substantially all the structural units represented by formula (A-1) are included as bisphenol AP type polycarbonates are particularly preferred. Here, substantially all the structural units refer to, specifically, 99.0 mol% or more of all structural units excluding end groups, preferably 99.5 mol% or more, and more preferably 99.9 mol% or more.

[0055] Bisphenol AP type polycarbonates may have other structural units that are different from the carbonate units derived from bisphenol AP and its derivatives. As dihydroxy compounds constituting such other structural units, examples include the aromatic dihydroxy compounds described in paragraph 0014 of Japanese Patent Application Publication No. 2018-154819, the contents of which are included in this specification.

[0056] The method for manufacturing bisphenol AP type polycarbonate used in this invention is not particularly limited, and any method can be used. Examples include interfacial polymerization, melt transesterification, pyridine method, ring-opening polymerization of cyclic carbonate compounds, and solid-phase transesterification of prepolymers.

[0057] In this invention, the lower limit of the glass transition temperature (Tg) of bisphenol AP type polycarbonate is 180°C or higher, preferably 181°C or higher, more preferably 182°C or higher, and more preferably 183°C or higher. By setting it above the above lower limit value, the heating shrinkage rate of the flat molded article can be further reduced. The upper limit is, for example, 210°C or lower, preferably 200°C or lower, and more preferably 190°C or lower. By setting it below the above upper limit value, good film formability can be maintained more effectively.

[0058] Note that in the case where the flat-shaped molded body contains two or more bisphenol AP type polycarbonates, the measured value of the mixture is treated as the glass transition temperature of the bisphenol AP type polycarbonates.

[0059] The glass transition temperature (Tg) can be measured by the method described in the Examples below.

[0060] In the present application, the lower limit of the viscosity average molecular weight of the bisphenol AP type polycarbonates is preferably 15,000 or more, more preferably 17,500 or more, and even more preferably 20,000 or more. By being above the lower limit value described above, the bending resistance can be further improved. The upper limit is preferably 25,000 or less, more preferably 22,000 or less, and even more preferably 21,500 or less. By being below the upper limit value described above, the film moldability can be effectively maintained.

[0061] Note that in the case where the flat-shaped molded body contains two or more bisphenol AP type polycarbonates, the measured value of the mixture is treated as the viscosity average molecular weight of the bisphenol AP type polycarbonates.

[0062] Here, the viscosity average molecular weight [Mv] of the polycarbonates in the present application refers to the intrinsic viscosity [η] (unit: dL / g) measured at a temperature of 25°C using a Ubbelohde viscometer using dichloromethane as the solvent, and the value calculated by the viscosity formula of Schnell, i.e., η = 1.23 x 10 -4 Mv 0.83 The value calculated by the formula described below. In addition, the intrinsic viscosity [η] refers to the specific viscosity [η] measured at each solution concentration [C] (g / dL), and the value calculated by the formula described below. sp

[0063]

[0064] The content of the bisphenol AP type polycarbonates in the polycarbonates contained in the flat-shaped molded body is preferably 15% by mass or more, more preferably 27% by mass or more, even more preferably 40% by mass or more, further preferably 50% by mass or more, even further preferably 55% by mass or more, and still further preferably 60% by mass or more, and can be 65% by mass or more. The upper limit is preferably 90% by mass or less, more preferably 85% by mass or less, even more preferably 78% by mass or less, further preferably 75% by mass or less, and still further preferably 72% by mass or less. By being within such a range, high heat resistance and a low photoelastic coefficient can be achieved while maintaining the film processability.

[0065] The bisphenol AP type polycarbonates can be used singly or two or more kinds can be used. In the case where two or more kinds are used, the total amount is within the range described above.

[0066]

[0067] The flat molded body of the present application preferably further contains a bisphenol A type polycarbonate. By containing a bisphenol A type polycarbonate, film moldability can be effectively maintained.

[0068] The bisphenol A type polycarbonate refers to a resin having carbonate units derived from bisphenol A (2,2-bis(4-hydroxyphenyl)propane) and derivatives thereof, and preferably has a structural unit represented by the following formula (B-1). In the formula, * indicates a bonding position.

[0069]

[0070] In formula (B-1), X 1 represents the following structure.

[0071]

[0072] R 5 and R 6 each independently represent a hydrogen atom or a methyl group, and preferably at least one of them is a methyl group, and more preferably both of them are methyl groups.

[0073] Formula (B-1) is preferably represented by the following formula (B-2).

[0074]

[0075] In the bisphenol A type polycarbonate, the content of the structural unit represented by formula (B-1) is preferably 70 mol% or more, more preferably 80 mol% or more, and even more preferably 90 mol% or more, in the total structural units excluding terminal groups. The upper limit is not particularly limited, and can be 100 mol% of the structural unit represented by formula (B-1) excluding terminal groups. As the bisphenol A type polycarbonate, it is particularly preferable that the total amount of the structural units excluding terminal groups consists essentially of the structural unit of formula (B-1). The total amount herein means, specifically, 99.0 mol% or more, preferably 99.5 mol% or more, and more preferably 99.9 mol% or more, of the total structural units excluding terminal groups.

[0076] The bisphenol A type polycarbonate can have other structural units in addition to the carbonate units derived from bisphenol A and derivatives thereof. As a dihydroxy compound constituting such other structural units, for example, the aromatic dihydroxy compound described in paragraph 0014 of Japanese Patent Application Publication No. 2018-154819 can be mentioned, and these contents are incorporated herein.

[0077] ​The method for producing the bisphenol A type polycarbonate is not particularly limited, and any method can be employed. Examples thereof include interfacial polymerization, melt transesterification, pyridine method, ring-opening polymerization of cyclic carbonate compound, solid phase transesterification of prepolymer, and the like.

[0078] In the present application, the lower limit of the viscosity average molecular weight of the bisphenol A type polycarbonate is preferably 8,000 or more, more preferably 10,000 or more, and still more preferably 12,000 or more. By being above the above lower limit, there is a tendency that the bending resistance is more excellent. The upper limit is preferably 30,000 or less, more preferably 20,000 or less, and still more preferably 18,000 or less. By being below the above upper limit, there is a tendency that the moldability into a flat plate-shaped molded article is further improved.

[0079] Note that, in the case where two or more kinds of bisphenol A type polycarbonates are contained in the flat plate-shaped molded article, the measured value of the mixture is treated as the viscosity average molecular weight of the bisphenol A type polycarbonate.

[0080] The glass transition temperature (Tg) of the bisphenol A type polycarbonate is preferably 135°C or more, more preferably 138°C or more, and still more preferably 140°C or more. By being above the above lower limit, there is a tendency that the heating shrinkage of the flat plate-shaped molded article is further reduced. As the upper limit, it is preferably 160°C or less, and can be 150°C or less, and further can be 145°C or less.

[0081] Note that, in the case where two or more kinds of bisphenol A type polycarbonates are contained in the flat plate-shaped molded article, the measured value of the glass transition temperature of the mixture is treated as the glass transition temperature of the bisphenol A type polycarbonate.

[0082] The glass transition temperature (Tg) is measured by the method described in the Examples below.

[0083] The content of the bisphenol A type polycarbonate in the polycarbonate contained in the flat plate-shaped molded article is preferably 10% by mass or more, more preferably 15% by mass or more, still more preferably 23% by mass or more, further preferably 25% by mass or more, and still further preferably 28% by mass or more. As the upper limit, it is preferably 85% by mass or less, more preferably 73% by mass or less, still more preferably 60% by mass or less, further preferably 50% by mass or less, still further preferably 45% by mass or less, and still further preferably 40% by mass or less, and can be 35% by mass or less. By being within such a range, it is possible to achieve high heat resistance and low photoelastic coefficient while maintaining the film processability.

[0084] The bisphenol A type polycarbonate can be used singly, or two or more kinds thereof can be used. In the case where two or more kinds thereof are used, the total amount thereof is within the above range.

[0085] In the flat molded article of the present application, preferably 90% by mass or more is polycarbonate, more preferably 95% by mass or more is polycarbonate, further more preferably 97% by mass or more is polycarbonate, still further more preferably 98% by mass or more is polycarbonate, and also 99% by mass or more can be polycarbonate.

[0086] The polycarbonate contained in the flat molded article of the present application can contain only bisphenol AP type polycarbonate, can contain only bisphenol AP type polycarbonate and bisphenol A type polycarbonate, can contain other polycarbonate in addition to bisphenol AP type polycarbonate, and can contain other polycarbonate in addition to bisphenol AP type polycarbonate and bisphenol A type polycarbonate. In the present application, preferably 99% by mass or more of the total of the polycarbonate contained in the flat molded article is composed of bisphenol AP type polycarbonate and bisphenol A type polycarbonate. By using a blend of bisphenol AP type polycarbonate and bisphenol A type polycarbonate, it is possible to more effectively maintain good film moldability.

[0087] <Antioxidant>

[0088] The flat molded article of the present application preferably contains an antioxidant.

[0089] As the antioxidant, amine-based antioxidants, phosphorus-based antioxidants, phenol-based antioxidants, sulfide-based antioxidants, and the like can be exemplified, and phosphorus-based antioxidants and phenol-based antioxidants (more preferably hindered phenol-based antioxidants and / or semi-hindered phenol-based antioxidants) are preferred.

[0090] The phosphorus-based antioxidant is preferably a phosphite compound represented by the following formula (1) or formula (2).

[0091]

[0092] (In formula (1), R 11 and R 12 each independently represent an alkyl group having 1 to 30 carbon atoms or an aryl group having 6 to 30 carbon atoms.)

[0093]

[0094] (In formula (2), R 13 to R 17 each independently represent a hydrogen atom, an aryl group having 6 to 20 carbon atoms, or an alkyl group having 1 to 20 carbon atoms.)

[0095] In the above formula (1), R 11 and / or R 12 each independently represent a linear or branched alkyl group having 1 to 10 carbon atoms. R 11 and / or R 12In the case of an aryl group, an aryl group represented by the following formula (1-a), formula (1-b) or formula (1-c) is preferable. The * in the formula indicates a bonding position.

[0096]

[0097] (In formula (1-a), R A each independently represents an alkyl group having 1 to 10 carbon atoms. In formula (1-b), R B each independently represents an alkyl group having 1 to 10 carbon atoms.)

[0098] As the phenol-based antioxidant, for example, a hindered phenol-based antioxidant and a semi-hindered phenol-based antioxidant can be exemplified. As the phenol-based antioxidant, the phenol-based antioxidant described in paragraph 0041 of Japanese Patent Application Publication No. 2019-002023 and the phenol-based antioxidant described in paragraphs 0033 to 0034 of Japanese Patent Application Publication No. 2019-056035 can be preferably used, and these contents are incorporated into the present specification.

[0099] The details of the antioxidant can be referred to the description in paragraphs 0057 to 0061 of Japanese Patent Application Publication No. 2017-031313, and this content is incorporated into the present specification.

[0100] The content of the antioxidant is preferably 0.005 parts by mass or more, more preferably 0.007 parts by mass or more, and even more preferably 0.01 parts by mass or more, with respect to 100 parts by mass of the polycarbonate. In addition, the upper limit of the content of the antioxidant is preferably 0.4 parts by mass or less, more preferably 0.3 parts by mass or less, even more preferably 0.2 parts by mass or less, and further preferably 0.1 parts by mass or less, with respect to 100 parts by mass of the polycarbonate.

[0101] By making the content of the antioxidant 0.005 parts by mass or more, a flat plate-shaped molded body having more excellent color phase and heat discoloration resistance can be obtained. In addition, by making the content of the antioxidant 0.4 parts by mass or less, a flat plate-shaped molded body having excellent hygrothermal stability without deteriorating the heat discoloration resistance can be obtained.

[0102] In addition, in the case where a phosphorus-based antioxidant and a phenol-based antioxidant (preferably a hindered phenol-based antioxidant and / or a semi-hindered phenol-based antioxidant) are used in combination as the antioxidant, with respect to 100 parts by mass of the polycarbonate, the phosphorus-based antioxidant can be contained in a range of 0.001 to 0.2 parts by mass, and the phenol-based antioxidant can be contained in a range of 0.001 to 0.2 parts by mass.

[0103] The antioxidant can be used in only one kind, or two or more kinds can be used. In the case where two or more kinds are used, the total amount is preferably in the above range.

[0104] <Releasing agent>

[0105] The flat molded article of the present application can contain a releasing agent.

[0106] By containing a releasing agent, the coiling property when the flat molded article is coiled up can be improved, and the releasing property when molding is performed using a mold can be further improved.

[0107] The kind of the releasing agent is not particularly limited, and at least one compound selected from the group consisting of aliphatic carboxylic acids, esters of aliphatic carboxylic acids and alcohols, aliphatic hydrocarbon compounds having a number average molecular weight of 200 to 15000, polyethers having a number average molecular weight of 100 to 5000, and polysiloxane-based silicone oils can be exemplified as the releasing agent.

[0108] The details of the releasing agent can be referred to the description of paragraphs 0035 to 0039 of WO2015 / 190162, which is incorporated into the present specification.

[0109] The content of the releasing agent is preferably 0.001 parts by mass or more, more preferably 0.005 parts by mass or more, and even more preferably 0.007 parts by mass or more, with respect to 100 parts by mass of the polycarbonate. In addition, the upper limit of the content of the releasing agent is preferably 1.0 parts by mass or less, more preferably 0.5 parts by mass or less, even more preferably 0.1 parts by mass or less, and further preferably 0.05 parts by mass or less, with respect to 100 parts by mass of the polycarbonate.

[0110] The releasing agent can be used only one kind, or two or more kinds can be used. In the case of using two or more kinds, the total amount is preferably within the above range.

[0111] <Other components>

[0112] The flat molded article of the present application can contain, in addition to the above components, an ultraviolet protection agent, a heat stabilizer, a flame retardant, a flame retardant aid, a colorant, an antistatic agent, an optical brightener, an antifog agent, a flowability improver, a plasticizer, a dispersant, an antibacterial agent, an antiblocking agent, an impact improver, a sliding improver, a hue improver, an acid trapping agent, and the like. One kind of these components can be used, or two or more kinds can be used at the same time.

[0113] <Manufacturing method of flat molded article>

[0114] The flat molded article of the present application can be produced by appropriately using a publicly known method, and extrusion molding, casting molding, or the like is preferably used.

[0115] As an example of the extrusion molding, the following method can be cited: a pellet, a flake or a powder to which an arbitrary additive is added in a polycarbonate component is melted by an extruder, kneaded, and then a semi-molten sheet is extruded from a T die or the like, and the sheet is cooled and solidified while being pressed with a polishing roll or the like to produce a flat plate-shaped molded body. The extruder can be a single screw extruder or a twin screw extruder, and a vented or a non-vented one can be used.

[0116] As an example of the casting molding, the following method can be cited: a component constituting a flat plate-shaped molded body is sufficiently dissolved in a solvent, the obtained solution is cast on a support to form a film-shaped cast film, and the cast film is dried by heating or the like to obtain a flat plate-shaped molded body. Note that, as the solvent, any one that can be cast into a film can be used without limitation, but, for example, dichloromethane, dioxolane or the like is preferably used.

[0117] <Properties of the flat plate-shaped molded body>

[0118] Next, the properties of the flat plate-shaped molded body of the present application will be described.

[0119] The thickness of the flat plate-shaped molded body of the present application is 75 μm or less, preferably 70 μm or less, more preferably 65 μm or less, further preferably 60 μm or less, and still further preferably 55 μm or less, and can be less than 50 μm or 49 μm or less. By making the thickness 75 μm or less, a flat plate-shaped molded body excellent in bending resistance and excellent in transparency can be obtained. The lower limit of the thickness of the flat plate-shaped molded body of the present application is preferably 20 μm or more, and more preferably 25 μm or more, and can be 30 μm or more. By being equal to or more than the above lower limit, the strength of the film can be maintained, and the breakage during molding can be suppressed.

[0120] In the flat plate-shaped molded body of the present application, the glass transition temperature is preferably 154°C or more, more preferably 155°C or more, and further preferably 160°C or more, and can be 165°C or more or 170°C or more. By being equal to or more than the above lower limit, there is a tendency that the heat shrinkage of the film becomes smaller. The upper limit of the glass transition temperature of the flat plate-shaped molded body of the present application is not particularly limited, but 190°C or less is practical. As a method for increasing the glass transition temperature of the flat plate-shaped molded body, a method of increasing the proportion of the bisphenol AP type polycarbonate in the flat plate-shaped molded body or the like can be cited.

[0121] The glass transition temperature was measured in accordance with the description of the Examples described later.

[0122] The haze of the flat plate-shaped molded body of the present application is 2.0% or less, preferably 1.5% or less, more preferably 1.0% or less, further preferably 0.8% or less, still further preferably 0.5% or less, yet further preferably less than 0.3%, and further preferably 0.25% or less. In addition, the haze of the flat plate-shaped molded body of the present application is preferably low, but a lower limit of 0.01% or more is practical. The haze of the flat plate-shaped molded body can be reduced by, for example, making the main component of the flat plate-shaped molded body polycarbonate and making the thickness of the flat plate-shaped molded body thin.

[0123] The photoelastic coefficient of the flat plate-shaped molded body of the present application is 85 x 10 -12 m 2 / N or less. By having such a configuration, optical defects at the time of bending can be effectively suppressed. In addition, the optical path difference (Rth) in the thickness direction can also be reduced.

[0124] The photoelastic coefficient is preferably 70 x 10 -12 m 2 / N or less, more preferably 65 x 10 -12 m 2 / N or less, further preferably 60 x 10 -12 m 2 / N or less, and further preferably 58 x 10 -12 m 2 / N or less. By being below the above upper limit, there is a tendency that optical defects at the time of bending can be more effectively suppressed. The photoelastic coefficient is preferably low, but for example, 45 x 10 -12 m 2 / N or more is practical.

[0125] As a method of making the photoelastic coefficient a desired value, a method of using bisphenol AP type polycarbonate or the like as the polycarbonate can be exemplified.

[0126] The photoelastic coefficient is measured in accordance with the method described in the following examples.

[0127] The flat plate-shaped molded body of the present application preferably does not break when subjected to the following bend resistance test, in which the flat plate-shaped molded body is cut to a size of 75 x 25 mm, and a bend resistance test machine is used in accordance with JIS C5016, with a curvature radius of the bending surface of 1.5 mm and a number of bending times of 200,000 times. Note that FPC is an abbreviation for flexible printed wiring board or flexible printed board.

[0128] The details of the bend resistance test are in accordance with the method described in the following examples.

[0129] The flat plate-shaped molded body of the present application can reduce the optical path difference in the thickness direction (Rth). Specifically, it can be 38 nm or less, further 35 nm or less, and particularly 30 nm or less. The lower the lower limit of Rth of the flat plate-shaped molded body of the present application is, the better, but for example, 3 nm or more is practical.

[0130] Rth is measured by, for example, the following method.

[0131] [Method for measuring optical path difference in thickness direction]

[0132] The refractive index n of the direction in which the largest refractive index is generated in the in-plane direction of each layer of the flat plate-shaped molded body is measured using an ellipsometer (for example, "M-220" manufactured by Japan Spectroscopic Co., Ltd.). x , the refractive index n x of the direction perpendicular to the direction of n y in the in-plane direction, and the refractive index n z in the thickness direction. From these n x , n y , n z and the thickness of the flat plate-shaped molded body, the optical path difference in the thickness direction Rth (nm) is calculated.

[0133] [Measurement conditions]

[0134] Spectroscopic method: double monochromatic method

[0135] Measurement wavelength: 550 nm

[0136] Incident angle: 90°

[0137] Bandwidth: 0.5 mm

[0138] Response: 2 sec

[0139] Start and end tilt angles of anisotropy analysis stage: -50°, 50°

[0140] Measurement interval: 5°

[0141] <Usage>

[0142] The flat plate-shaped molded body of the present application can be used as a single layer body (single layer film, single layer sheet) or as a multi-layer body.

[0143] The flat plate-shaped molded body as a single layer body is useful as an optical film, a substrate, a protective film, and the like. In particular, the single layer body of the present application is suitable for a substrate for a transparent conductive film (particularly, a substrate for a transparent conductive layer).

[0144] Hereinafter, a multi-layer body using the flat plate-shaped molded body of the present application will be described.

[0145] The multilayer body of the present application has the flat plate-shaped molded body of the present application. The multilayer body of the present application preferably has a curable resin layer on one face or both faces of the flat plate-shaped molded body. In addition, the multilayer body of the present application preferably has a refractive index adjusting layer on one face or both faces of the flat plate-shaped molded body (preferably on one face). In addition, the multilayer body of the present application preferably has a protective film on one face or both faces of the flat plate-shaped molded body (preferably on one face). In addition, the multilayer body of the present application preferably has a transparent conductive layer on the flat plate-shaped molded body.

[0146] The multilayer body of the present application is preferably used for a transparent conductive film.

[0147] Figure 1 is an example of a transparent conductive film, 1 indicates a transparent conductive layer, 2 indicates a refractive index adjusting layer, 3 indicates a curable resin layer, 4 indicates a flat plate-shaped molded body, and 5 indicates a protective film.

[0148] The material of the transparent conductive layer is not particularly limited as long as it has conductivity, but preferably contains one or more of ATO (antimony-doped indium oxide), FTO (fluorine-doped tin oxide), AZO (aluminum-doped zinc oxide), GZO (gallium-doped zinc oxide), ITO (indium tin composite oxide), Ag, Cu, Au, and carbon nanotubes.

[0149] The thickness of the transparent conductive layer is preferably 1 to 30 nm.

[0150] The transparent conductive layer can be used as, for example, a transparent electrode layer.

[0151] The refractive index adjusting layer is a layer that adjusts the refractive index and also makes it difficult to see the pattern after etching and the like. The refractive index adjusting layer can be a layer having a refractive index close to that of the transparent conductive layer (high refractive index layer), and in addition, can be composed of both a high refractive index layer and a low refractive index layer. Particularly preferably, the structure is such that the high refractive index layer and the low refractive index layer are sequentially arranged from the side closer to the transparent conductive layer. The details of the high refractive index layer and the low refractive index layer can be found in the description of paragraphs 0071 to 0095 of Japanese Patent Application Publication No. 2019-124913, which is incorporated herein.

[0152] The curable resin layer can impart hardness, chemical resistance, scratch resistance, and the like to the multilayer body. The curable resin layer can use, for example, a thermosetting resin having a pencil hardness of H or more, an energy ray-curable resin. As the energy ray-curable resin, ultraviolet-curable resins can be exemplified. Specifically, various resins such as acrylic, polyester, polyurethane, silicone, amide, and epoxy resins, including monomers, oligomers, and polymers that are ultraviolet-curable, can be exemplified. The thickness of the curable resin layer is not particularly limited, and is preferably 0.5 to 10 μm.

[0153] As the protective film, a resin film is preferable. As the resin constituting the resin film, polypropylene, polyethylene, polyethylene terephthalate, polycarbonate, cyclic olefin, polyarylate, polysulfone, polyamide, polyimide, and the like can be exemplified. The thickness of the protective film is not particularly limited, and is preferably 10 to 100 μm.

[0154] The above transparent conductive film is not limited to Figure 1 the structure. For example, in Figure 1 between the flat-shaped molded body and the protective film, a curable resin layer can be further provided. Also, Figure 1 a bonding layer, an adhesive layer, or the like can be provided between each of the structures shown in

[0155] Also, Figure 1 The transparent conductive film of the present application can further have a functional layer such as a hard coat layer, an anti-glare layer, an anti-reflection layer, a low reflection layer, a conductive layer, an anti-blocking layer, an anti-static layer, a colored layer, an ultraviolet absorbing layer, a stain-proof layer, and the like. The details of the hard coat layer can be referred to the description of paragraphs 0096 to 0102 of Japanese Patent Application Publication No. 2019-124913, which is incorporated herein.

[0156] The above transparent conductive film is preferably used for a film sensor of a touch screen, electronic paper, a dye-sensitized solar cell, a touch sensor, and the like. It is particularly preferable to be used for a use requiring bend resistance such as a foldable display, a curved display, and the like.

[0157] The flat-shaped molded body and the multilayer body of the present application can be used in, for example, components of electrical and electronic equipment, OA equipment, information terminal equipment, mechanical parts, home electric appliances, vehicle parts, architectural parts, various containers, entertainment goods- sundry, lighting equipment, components of various household electrical appliances, housings of electrical appliances, containers, cover members, storage parts, boxes, cover members or box bodies of lighting appliances, and the like. As the electrical and electronic equipment, for example, a personal computer, a game machine, a television receiver, a display device such as a liquid crystal display device, a plasma display device, and the like, a printer, a copier, a scanner, a facsimile machine, an electronic notebook and a PDA, an electronic desk calculator, an electronic dictionary, a camera, a video camera, a portable telephone, a smartphone, a tablet, a battery pack, a drive or a reading device of a storage medium, a mouse, a keyboard, a CD player, an MD player, a portable broadcast-audio player, and the like can be exemplified. Also, it can be preferably used in the field of light decoration billboards, liquid crystal backlights, illuminated displays, traffic signs, signal boards, screens, reflection plates, or instrument parts of automobiles, toys, ornaments, and the like.

[0158] Examples

[0159] The present application will be described more specifically by the following examples. The materials, amounts, ratios, processing contents, processing operations, etc. shown in the following examples can be changed as appropriate without departing from the gist of the present application. Therefore, the scope of the present application is not limited to the specific examples shown below.

[0160] [Raw materials]

[0161] • Bisphenol AP type polycarbonate

[0162] (A1) aromatic polycarbonate obtained by interfacial polymerization method using bisphenol AP as a starting material (manufactured by Mitsubishi Gas Chemical Company, Inc., FPC-0220, viscosity average molecular weight 20,200, glass transition temperature 184°C)

[0163] • Bisphenol A type polycarbonate

[0164] (B1) aromatic polycarbonate obtained by interfacial polymerization method using bisphenol A as a starting material (manufactured by Mitsubishi Engineering-Plastics Corporation, H-4000F, viscosity average molecular weight 16,000, glass transition temperature 143°C)

[0165] (B2) aromatic polycarbonate obtained by interfacial polymerization method using bisphenol A as a starting material (manufactured by Mitsubishi Engineering-Plastics Corporation, H-7000F, viscosity average molecular weight 14,000, glass transition temperature 141°C)

[0166] (B3) aromatic polycarbonate obtained by interfacial polymerization method using bisphenol A as a starting material (manufactured by Mitsubishi Engineering-Plastics Corporation, E-2000F, viscosity average molecular weight 27,000, glass transition temperature 151°C)

[0167] (B4) aromatic polycarbonate obtained by interfacial polymerization method using bisphenol A as a starting material (manufactured by Mitsubishi Engineering-Plastics Corporation, K-4000F, viscosity average molecular weight 40,000, glass transition temperature 154°C)

[0168] (B5) aromatic polycarbonate obtained by interfacial polymerization method using bisphenol A as a starting material (manufactured by Mitsubishi Engineering-Plastics Corporation, S-3000F, viscosity average molecular weight 21,000, glass transition temperature 148°C)

[0169] • Antioxidant

[0170] (C1) 3,9-bis{2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-l,l-dimethylethyl}-2,4,8,10-tetraoxaspiro[5.5]undecane (semi-hindered phenol-based antioxidant, manufactured by ADEKA Corporation, ADKSTAB AO-80)

[0171] (C2) Bis(2,6-di-t-butyl-4-methylphenyl) pentaerythritol diphosphite (phosphorus-based antioxidant, manufactured by ADEKA, ADK STAB PEP-36)

[0172] • Release agent

[0173] (D1) Glycerin monostearate (manufactured by RIKEN VITAMIN Co., Ltd., RIKEMAL S-100A)

[0174] Example 1

[0175] <Manufacture of pellets>

[0176] Each component described above was measured so as to become the amount of addition described in Table 1 or Table 2. The compounding amount of each component described in Table 1 or Table 2 is shown in parts by mass. Thereafter, after mixing for 15 minutes using a tumbler, a twin-screw extruder with a vent (TEX 30α manufactured by NIPPON STEEL & STAINLESS SC Co., Ltd.) was used to melt-knead at a cylinder temperature of 300°C, and a pellet was obtained by strand cutting.

[0177] <Manufacture of film (flat plate-like molded body)>

[0178] A film (flat plate-like molded body) was manufactured using the pellet obtained above by the following method.

[0179] The pellet obtained above was extruded into a molten state using a T-die extruder of a twin-screw extruder with a cylinder diameter of 32 mm and an L / D of the screw of 31.5 (TEX 30α manufactured by NIPPON STEEL & STAINLESS SC Co., Ltd.) at an extrusion rate of 10 Kg / h and a screw rotation number of 150 rpm, and a film (flat plate-like molded body) was manufactured by pressing using a first roll and a second roll and then cooling and solidifying. The cylinder and the T-die were set to a temperature of 300°C.

[0180] Adjustment of the thickness (unit: μm) of the finally obtained film (flat plate-like molded body) was performed by adjusting the roll speed of the first roll and the second roll so as to become the value described in Table 1 or Table 2.

[0181] Details of the first roll and the second roll used are as follows.

[0182] • First roll: silicone rubber roll (IT68S-MCG) manufactured by KITAMURA CASTING CO., LTD.

[0183] Dimensions: outer diameter 260 mm x width 600 mm

[0184] Roll temperature: 50°C

[0185] • Second roll: mirror-finished metal rigid roll (surface: hard chrome treatment)

[0186] Core metal (core gold) size: outer diameter 250 mm x width 600 mm

[0187] Roll temperature: 140°C

[0188] Measurement of glass transition temperature

[0189] The glass transition temperature of the above-obtained film (flat plate-shaped molded body) or polycarbonate as a raw material was measured by the following method. The film (flat plate-shaped molded body) was cut with scissors and then measured.

[0190] The above sample of about 10 mg was subjected to two cycles of temperature increase and decrease as shown in the measurement conditions of DSC (differential scanning calorimetry) described later, and the glass transition temperature at the temperature increase of the second cycle was measured. The intersection of the straight line in which the baseline on the low temperature side was extended to the high temperature side and the tangent line of the inflection point was taken as the glass transition start temperature, the intersection of the straight line in which the baseline on the high temperature side was extended to the low temperature side and the tangent line of the inflection point was taken as the glass transition end temperature, and the midpoint between the glass transition start temperature and the glass transition end temperature was taken as the glass transition temperature (unit: °C) in the present invention.

[0191] Measurement start temperature: 30°C

[0192] Temperature increase rate: 10°C / min

[0193] Temperature to be reached: 250°C

[0194] Temperature decrease rate: 20°C / min

[0195] A differential scanning calorimeter (DSC, Hitachi High-Technologies Corporation, "DSC 7020") was used as the measurement device.

[0196] <Membrane processability>

[0197] A film (flat plate-shaped molded body) was manufactured from the pellets. At this time, "A" was indicated in the case where extrusion was possible, and "B" was indicated in the case where the melt viscosity was too high to be extruded.

[0198] Measurement of photoelastic coefficient

[0199] The above-obtained film (flat plate-shaped molded body) was subjected to measurement of the optical path difference (Re) value in the film (flat plate-shaped molded body) in the plane at a wavelength of 633 nm while applying a stress load (0 to 720 gf) in the flow direction at the time of film molding using an ellipsometer in an environment of 23°C and a relative humidity of 50%. Thereafter, the photoelastic coefficient was calculated from the slope of the stress and Re. In the table, the values for 10 -12 times are shown in the unit of m 2 / N.

[0200] The ellipsometer used was an ellipsometer M-220 manufactured by Japan Spectroscopic Co., Ltd.

[0201] <Measurement of Haze>

[0202] The haze (unit: %) was measured using a haze meter under conditions of a D65 light source and a 10° field of view for the film (flat plate-shaped molded body) obtained above.

[0203] The haze meter used was "HM-150" manufactured by Murakami Color Research Laboratory Co., Ltd.

[0204] <Light Leakage>

[0205] In order to more clearly reproduce optical defects that occur when the flat plate-shaped molded body is bent, evaluation was performed in the form of "light leakage" below.

[0206] The film (flat plate-shaped molded body) obtained above was cut into A4 size, and wound into a cylindrical shape having a diameter of 30 mm with the short side as the axis to obtain a sample. As shown in Figure 2 the front of a surface light source 21, two polarizing plates 22 and 24 were disposed so that the respective polarizing axes were orthogonal. Thereafter, the cylindrical sample 23 was interposed between the polarizing plates 22 and 24, and light leakage was confirmed visually. In the case where the cylindrical sample 23 did not exhibit birefringence, the light deflected in a specific direction by the polarizing plate 22 was blocked by the polarizing plate 24, and thus no light was transmitted to the observation side. On the other hand, in the case where the cylindrical sample 23 exhibited birefringence, the light deflected in a specific direction by the polarizing plate 22 returned to a non-polarized state, and thus a portion of the light was transmitted through the polarizing plate 24. That is, light leakage was observed.

[0207] The test was determined by five experts in a majority decision.

[0208] A: No light leakage occurred

[0209] B: Slight light leakage occurred (neither A nor C)

[0210] C: Light leakage occurred

[0211] <Resistance to Bending>

[0212] The film (flat plate-shaped molded body) obtained above was cut into a size of 75 x 25 mm, and a resistance to bending test was performed using an FPC bending tester at a bending face curvature radius of 1.5 mm in accordance with JIS C5016. In the resistance to bending test, whether or not the test sample was broken after 200,000 times of bending test was visually confirmed, and evaluation was performed in accordance with the criteria described below.

[0213] As the FPC bending tester, "No. 306 FPC Bending Tester" (trade name) manufactured by Seiko Instruments & Electronics Co., Ltd. was used.

[0214] The test was judged by five experts in a majority decision.

[0215] A: No breakage

[0216] B: Breakage

[0217] <Shrinkage on heating>

[0218] Three arbitrary points of the above obtained film (flat plate shaped molded body) were cut into square samples of 150 mm in width direction and 150 mm in flow direction. On the above samples, mark points were marked at intervals of about 100 mm in the width direction and the flow direction of the film (flat plate shaped molded body) in an atmosphere of 23°C and 50% relative humidity, and after the interval was measured using a vernier caliper, heat treatment was performed in a constant temperature bath at 160°C for 30 minutes. After being taken out of the constant temperature bath, after being left to stand for 60 minutes in an atmosphere of 23°C and 50% relative humidity, the interval of the above mark points was measured using a vernier caliper in an atmosphere of 23°C and 50% relative humidity, and the shrinkage on heating was calculated from the following equation, and the average of three points was taken as the shrinkage on heating in the width direction and the flow direction of the film (flat plate shaped molded body).

[0219] Shrinkage on heating (%) = [{(size before heat treatment) - (size after heat treatment)} / (size before heat treatment)] x 100

[0220] Note that the flow direction refers to the extrusion direction in the case of extrusion molding, and the casting direction in the case of casting. The width direction refers to the direction perpendicular to the flow direction.

[0221] Examples 2 to 5, Comparative Examples 1 to 4

[0222] Example 1 was performed with the same other than that the formulation of each component of the flat plate shaped molded body was changed as shown in Table 1 or Table 2.

[0223] Comparative Example 5

[0224] Example 1 was performed with the same other than that the formulation of each component of the flat plate shaped molded body was changed as shown in Table 1 or Table 2, and the following changes were made at the time of manufacturing the film (flat plate shaped molded body).

[0225] • Second roll: embossing roll with arithmetic average roughness of 2.4 μm

[0226] Core metal size: outer diameter 250 mm x width 600 mm

[0227] Roll temperature: 140°C

[0228] Comparative Example 5 was not subjected to evaluation of light leakage, bending resistance, and heat shrinkage because the film (flat molded body) had high haze due to use of an embossing roll and could not be used as an optical film.

[0229] Comparative Example 6

[0230] Example 1 was performed with the same procedure except that the formulation of each component of the flat molded body was changed as shown in Table 1 or Table 2. Comparative Example 6 could not be processed into a film because the melt viscosity was too high.

[0231] [Table 1]

[0232]

[0233] [Table 2]

[0234]

[0235] Explanation of Symbols

[0236] 1 Transparent conductive layer

[0237] 2 Refractive index adjusting layer

[0238] 3 Curing resin layer

[0239] 4 Flat molded body

[0240] 5 Protective film

[0241] 21 Surface light source

[0242] 22 Polarizing plate

[0243] 23 Cylindrical sample

[0244] 24 Polarizing plate

Claims

1. A flat, molded body, characterized in that: It is a flat molded body containing bisphenol AP type polycarbonate and bisphenol A type polycarbonate with a glass transition temperature of 180℃ or higher. Of the polycarbonate contained in the flat molded body, the proportion of bisphenol AP type polycarbonate is 27% to 90% by mass, and the proportion of bisphenol A type polycarbonate is 10% to 73% by mass. The photoelastic modulus is 85×10 -12 m 2 The temperature range is as follows: / N below, thickness below 75μm, haze below 2.0%, and glass transition temperature above 154℃.

2. The flat molded body as described in claim 1, characterized in that: It also contains antioxidants.

3. The flat molded body as described in claim 1 or 2, characterized in that: It also contains a mold release agent.

4. The flat molded body as described in claim 1 or 2, characterized in that: The material does not break during the following bending resistance test, in which the flat molded body is cut into 75×25mm pieces, and the bending test is performed using an FPC bending tester according to JIS C5016, with a bending radius of 1.5mm and 200,000 bending cycles.

5. The flat molded body as described in claim 1 or 2, characterized in that: Substrate for transparent conductive films.

6. A multilayer body, characterized in that: A flat molded body having any one of claims 1 to 5.

7. The multilayer body as described in claim 6, characterized in that: A curable resin layer is present on one or both sides of the flat molded body.

8. The multilayer body as described in claim 6 or 7, characterized in that: The plate-shaped molded body has a refractive index adjustment layer on one or both sides.

9. The multilayer body as described in claim 6 or 7, characterized in that: A protective film is provided on one or both sides of the flat molded body.

10. The multilayer body as described in claim 6 or 7, characterized in that: The plate-shaped molded body has a transparent conductive layer.

11. The multilayer body as described in claim 10, characterized in that: The transparent conductive layer contains one or more of the following: antimony-doped indium oxide (ATO), fluorine-doped tin oxide (FTO), aluminum-doped zinc oxide (AZO), gallium-doped zinc oxide (GZO), indium tin oxide (ITO), Ag, Cu, Au, and carbon nanotubes.

12. The multilayer body as described in claim 10, characterized in that: It is a transparent conductive film.

Citation Information

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