Image splicing method for random texture scene and application thereof

An image mosaic and image technology, which is applied in image analysis, image enhancement, graphics and image conversion, etc., can solve the problems of large amount of calculation, low stitching accuracy, and poor real-time stitching, so as to improve robustness, improve image stitching accuracy, The effect of eliminating noise interference

CN114782435APending Publication Date: 2022-07-22WUHAN JINGLI ELECTRONICS TECH +1
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2022-07-22

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Abstract

The invention discloses an image splicing method for a random texture scene, and the method comprises the steps: obtaining a current frame image, carrying out the position marking, so as to determine an image group which needs to be spliced with the current frame image, and enabling the to-be-spliced frame images in the image group to be combined with the current frame image, and carrying out the combination marking of the to-be-spliced frame images and the current frame image as calculation pairs; selecting a plurality of target pixel points according to the overlapped part of the current frame image and the to-be-spliced frame image in each group of calculation pairs to independently calculate offset values; calculating a similarity value according to the overlapped part, and selecting a group of target pixel points with the highest similarity value to calculate an offset value as an accurate offset value of the corresponding calculation pair; and according to the accurate deviation value, carrying out fusion processing on the overlapping region of the calculation pair so as to splice the current frame image into a complete image. The problems that an existing image splicing method of a random texture scene is low in splicing precision, large in calculated amount and poor in splicing real-time performance due to the fact that operation such as coordinate transformation needs to be carried out can be solved.
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Description

technical field

[0001] The present application relates to the technical field of wafer defect detection, and more particularly, to an image stitching method for random texture scenes, an image stitching device for random texture scenes, an electronic device, and a computer-readable storage medium. Background technique

[0002] In recent years, with the rapid development of semiconductor integrated circuits, the performance of integrated circuit devices is also rapidly improving, and the manufacturing process thereof has also become more and more complicated. In the manufacturing process of semiconductor integrated circuits, it is particularly important to timely discover the problems existing in the product manufacturing process. In the process of semiconductor wafer inspection, the field of view of the camera is limited, and it is a feasible way to construct a multi-camera array. Therefore, the rapid and accurate stitching of array industrial images has become a key step in...

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Embodiment Construction

[0032] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0033] The terms "first", "second", "third" and the like in the description and claims of the present application and the above drawings are used to distinguish different objects, rather than to describe a specific order. Furthermore, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or devic...